Rotating cathode hydrostatic electrodeposition method and device

Abstract

The invention discloses a rotating cathode hydrostatic electro-deposition method and device. The method comprises the steps that a substrate to be subjected to electro-deposition is pretreated; keeping the substrate to be connected with a cathode, enabling the substrate to be in a rotating state, and enabling the substrate to be immersed in the electrolyte for deposition; and after electro-deposition is completed, the substrate is taken out and dried after ultrasonic cleaning, and electro-deposition operation is completed. A cathode rotation technology is adopted, so that the substrate continuously rotates in the electro-deposition process, the concentration gradient of metal ions is improved, clusters of nano particles are reduced, and the metal ions and reinforced phase particles are uniformly distributed and deposited on the surface of the substrate. The problem that in traditional electrodeposition, the thickness of a coating is not uniform is effectively solved, nano particles or ceramic particles are added into the electrolyte, the synergistic effect of magnetic stirring and cathode rotation is utilized, the particles are evenly dispersed and jointly deposited on the surface of a substrate, the metal-based composite coating is formed, the performance of the composite coating is greatly enhanced, and the service life of the metal-based composite coating is prolonged. The service life of workpieces is prolonged and the maintenance cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of metal electrodeposition, and in particular to a rotating cathode hydrostatic electrodeposition method and device. Background Art

[0002] Electrodeposition is a technology that uses electrochemical principles to deposit metals or alloys on a conductive substrate. In this process, the substrate (such as nickel plate, copper plate, etc.) is usually used as the anode in the electrolytic cell, and the workpiece to be deposited is used as the cathode. Under the action of an external current, the anode metal dissolves into ions and is then reduced to a metal deposit on the cathode. Electrodeposition is widely used in industrial production due to its simple process, wide range of applications, easy control of microstructure and performance, and its advantages of not being restricted by the structure and shape of the workpiece. However, in actual industrial applications, the cathode surface is often in a relatively static state, resulting in uneven thickness of the electrodeposited coating and difficulty in controlling the surface quality, which affects the performance of the coating.

[0003] Composite co-deposition is a process that uses electrodeposition or chemical deposition to co-deposit metal with solid particles or fibers to create a composite coating. Compared to single coatings, reinforcing particles such as ceramics and nanoparticles are added to the plating solution. Under magnetic stirring, the reinforcing particles, enveloped by metal ions, are co-deposited on the workpiece surface, forming a metal-based composite coating. This coating exhibits enhanced hardness, wear resistance, and corrosion resistance. However, nanoparticle agglomeration causes concentrated precipitation of metal ions, leading to poor surface quality.

[0004] For example, publication number CN 116905079 A discloses a rotary centrifugal electroplating method for electronic products. This method achieves uniform electroplating on electronic products, precisely controls the temperature of the plating solution, and achieves high-quality plating. However, this method also suffers from the following issues: It requires a complex rotary centrifugal device to achieve uniform plating, increasing the complexity and cost of the equipment; and the stability of the plating solution is significantly affected during the rotary centrifugal process, making it prone to particle agglomeration and other issues, which in turn affect the quality of the coating.

[0005] Therefore, it is necessary to develop a device with adjustable cathode rotation function, which can not only improve the uneven thickness of the coating during cathode electrodeposition, but also make full use of the performance enhancement characteristics of nanoparticle deposition on the coating, and obtain a surface coating with better performance by adjusting the process parameters. Summary of the Invention

[0006] In response to the above-mentioned problems, the purpose of the present invention is to provide a rotating cathode hydrostatic electrodeposition method and device to improve the uneven thickness of the coating during cathode electrodeposition and fully utilize the performance enhancement characteristics of nanoparticle deposition on the coating.

[0007] The object of the present invention can be achieved by the following technical solution: A rotating cathode hydrostatic electrodeposition method comprising:

[0008] S1. Pre-treating the substrate to be electrodeposited;

[0009] S2, keeping the substrate connected to the cathode, rotating the substrate and immersing the substrate in the electrolyte for deposition;

[0010] S3. After the electrodeposition is completed, the substrate is taken out, ultrasonically cleaned and then dried to complete the electrodeposition operation.

[0011] Furthermore, the pretreatment in S1 includes: sanding, pickling, alkali washing and surface activation treatment of the substrate.

[0012] Furthermore, reinforcing phase particles are added to the electrolyte, and the reinforcing phase particles include ceramic microparticles and nanoparticles.

[0013] Furthermore, when the nanoparticles added to the electrolyte are Ta powder, the adding step includes:

[0014] S11. Using a Watt nickel solution as an electrolyte, wherein the Watt nickel solution comprises:

[0015] 260g / L NiSO4·6H2O; 40g / L NiCl2·6H2O; 40g / L H3BO3; 5g / L C7H4NNaO3S;

[0016] S12, dispersing Ta powder in 50 ml of deionized water at a ratio of 3 g / L of Ta powder, and ultrasonically oscillating the water for 60 min to obtain a mixed solution;

[0017] S13, adding the mixed solution to the electrolyte, and performing ultrasonic oscillation treatment for 60 minutes to obtain a composite solution;

[0018] S14, adding the composite solution to the electrolyte tank, and controlling the electrolyte temperature at 50±1°C;

[0019] S15. Set the cathode current density and cathode rotation speed to perform deposition operation.

[0020] A rotating cathode hydrostatic electrodeposition device, comprising:

[0021] an electrolyte tank, for containing electrolyte;

[0022] a driving assembly for driving the substrate in the electrolyte to rotate;

[0023] a cathode connection assembly, used to maintain the connection between the substrate and the cathode when the substrate rotates;

[0024] The plating source assembly is in the electrolyte, connected to the anode, and provides a metal source for electrodeposition.

[0025] Furthermore, the driving assembly includes:

[0026] A driving gear connected to the motor drive shaft through a coupling;

[0027] The driven gear is engaged with the driving gear. The end face of the driven gear is provided with an end face slot for inserting the base, and the base rotates following the driven gear.

[0028] Furthermore, the cathode connection assembly:

[0029] The conductive spring is located in a cavity opened inside the driven gear. The conductive spring rotates with the driven gear. When the base is inserted into the end face slot, the conductive spring abuts against the base.

[0030] The conductive slip ring is electrically connected to the negative pole of the power supply, the fixed end of the conductive slip ring is connected to the electrolyte tank wall, the movable end of the conductive slip ring is connected to the conductive spring through a cable, and the movable end of the conductive slip ring rotates with the driven gear.

[0031] Furthermore, the cathode connection assembly: rotating cathode hydrostatic electrodeposition device, further comprises:

[0032] A temperature controller is provided at the bottom of the electrolyte tank and is used to control the temperature of the electrolyte;

[0033] The stirrer is arranged at the bottom of the electrolyte tank and is used to stir the electrolyte.

[0034] Furthermore, during the electrodeposition operation, the stirring of the stirrer and the rotation of the substrate are carried out simultaneously, and the action time is not less than 15 minutes.

[0035] Beneficial effects of the present invention:

[0036] 1. The present invention uses a cathode rotation method and device to enable the substrate to rotate continuously during the electrodeposition process. This rotational motion can break the concentration gradient of metal ions in the electrolyte under the traditional static cathode state, so that the metal ions and reinforcing phase particles are evenly distributed and deposited on the substrate surface, thereby effectively solving the problem of uneven coating thickness in traditional electrodeposition and improving the overall performance and appearance quality of the coating; at the same time, reinforcing phase particles such as nanoparticles (such as Ta powder) or ceramic particles are added to the electrolyte, and through the synergistic effect of magnetic stirring and cathode rotation, these particles are evenly dispersed and deposited together on the substrate surface to form a metal-based composite coating. The high hardness characteristics of nanoparticles or ceramic particles can significantly improve the hardness and wear resistance of the coating. The hardness and wear resistance of the composite coating are greatly improved, which extends the service life of the workpiece and reduces maintenance costs.

[0037] 2. The nanoparticles or ceramic particles of the present invention can form a dense structure in the coating, and the rotating cathode can effectively improve the agglomeration and tip effect of the nanoparticles, reduce the porosity of the coating, and thus effectively block the penetration of the corrosive medium. In addition, the stable compounds formed by the reinforcing phase particles such as Ta powder in the coating can further improve the corrosion resistance of the coating, significantly enhance the corrosion resistance of the coating, make it suitable for harsh working environments, and reduce the problem of coating failure due to corrosion. At the same time, during the rotation of the cathode, metal ions and reinforcing phase particles are uniformly deposited on the surface of the substrate, and the bonding between the formed coating and the substrate is tighter. At the same time, the nanoparticles or ceramic particles can fill the tiny defects on the surface of the substrate, further enhance the bonding between the coating and the substrate, reduce the risk of the coating falling off, and improve the overall performance and reliability of the workpiece.

[0038] 3. The device of the present invention realizes the precise rotation of the cathode through the motor and gear transmission system, and is easy to operate and control. At the same time, the magnetic stirring and temperature control system in the electrolyte tank can ensure the uniformity and stability of the electrolyte, reduce the plating quality problems caused by the uneven electrolyte, and the precise control of the process parameters and the improvement of the degree of automation of the equipment make the electrodeposition process more stable, and the production efficiency is significantly improved, which is suitable for large-scale industrial production; it is suitable for a variety of base materials (such as stainless steel, copper, nickel, etc.) and a variety of plating materials (such as nickel, copper, zinc, etc.), and can adapt to the needs of different workpieces by adjusting the process parameters (such as current density, rotation speed, electrolyte temperature, etc.), and can meet the requirements of different industrial fields for plating performance, and has wide applicability and promotion value.

[0039] 4. The uniform distribution of the nanoparticles or ceramic microparticles in the coating can refine the grain structure of the coating, forming a dispersion-strengthened phase, thereby improving the strength and toughness of the coating. Simultaneously, the uniform flow of the electrolyte during cathode rotation can further optimize the microstructure of the coating, making it denser and more uniform, and significantly improving its overall performance. Through the synergistic effect of magnetic stirring and cathode rotation, the nanoparticles in the electrolyte can maintain a well-dispersed state, avoiding the problem of poor coating surface quality caused by nanoparticle agglomeration in traditional composite co-deposition. The coating surface is smoother and flatter, improving the coating's appearance quality and performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 Schematic diagram of the process of the rotating cathode hydrostatic electrodeposition method of the present invention;

[0041] Figure 2 This is a schematic diagram of the appearance and structure of the rotating cathode hydrostatic electrodeposition device of the present invention;

[0042] Figure 3 Schematic diagram of the cross-sectional structure of the rotating cathode hydrostatic electrodeposition device of the present invention;

[0043] Figure 4 Schematic diagram of the cross-sectional structure of the driving assembly and cathode connecting assembly of the present invention;

[0044] Figure 5 Schematic diagram of the exploded structure of the cathode connection assembly of the present invention;

[0045] Figure 6 This is a schematic diagram of the principle structure of the rotating cathode hydrostatic electrodeposition method of the present invention;

[0046] Figure 7 Comparative scanning electron micrographs of coatings prepared by electrodeposition;

[0047] Figure 8 Comparison chart of hardness values ​​of coatings prepared by electrodeposition.

[0048] 100, driving assembly; 110, driving gear; 120, supporting base; 130, motor; 140, driven gear; 150, coupling;

[0049] 200, cathode connection assembly; 210, conductive spring; 220, bearing; 230, shaft retaining spring; 240, hole retaining spring; 250, conductive slip ring; 260, slip ring fixing seat; 270, end face slot; 280, cable;

[0050] 300, plating source assembly; 310, anode plate; 320, anode slot;

[0051] 400, electrolyte tank; 410, electrolyte;

[0052] 500, temperature controller;

[0053] 600, agitator;

[0054] 700, base;

[0055] 800, power supply;

[0056] 900. Control system. DETAILED DESCRIPTION

[0057] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar symbols throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0058] like Figure 1 As shown, the present invention discloses a rotating cathode hydrostatic electrodeposition method, including.

[0059] S1. Pre-treating the substrate 700 to be electrodeposited.

[0060] Pre-treating the substrate 700 is one of the key steps to ensure the electrodeposition effect, which includes polishing, pickling, alkali washing, and finally surface activation with hydrochloric acid.

[0061] Take the base 700 material as 304 stainless steel as an example:

[0062] 304 stainless steel has good corrosion resistance, heat resistance and mechanical properties, making it suitable for electrodeposition processes. Its chemical composition mainly includes chromium (Cr) and nickel (Ni), which can provide excellent corrosion resistance.

[0063] First, the surface is polished to remove the oxide layer, rust, dirt and burrs on the surface of the substrate 700, making the surface smoother and increasing the bonding strength between the substrate 700 and the coating.

[0064] Grinding can be done by using sandpaper of different grits (such as 80 mesh, 120 mesh, 240 mesh, etc.) to grind the surface of 304 stainless steel in stages. Grind from coarse sandpaper to fine sandpaper in sequence to ensure a smooth surface without obvious scratches. Maintain uniform pressure during the grinding process to avoid over-grinding in some areas. After grinding, rinse the surface with deionized water to remove dust and impurities generated by grinding.

[0065] Then pickling is carried out to further remove residual oxides and impurities on the surface, and to remove tiny burrs that may have been generated during the grinding process.

[0066] The polished 304 stainless steel is immersed in an acid pickling solution. The acid pickling solution can be prepared from sulfuric acid (H2SO4) or hydrochloric acid (HCl). The pickling time depends on the acid concentration and the degree of oxidation on the surface of the substrate 700, and can be 10 to 30 minutes.

[0067] During the pickling process, the solution may be stirred appropriately to ensure that the acid solution evenly acts on the surface of the substrate 700. After the pickling is completed, the substrate 700 is removed and rinsed with a large amount of deionized water to remove residual acid solution.

[0068] This is followed by an alkaline wash to neutralize any acidic substances that may remain after the pickling, further cleaning the surface while removing organic contaminants.

[0069] Immerse the acid-washed substrate 700 in an alkaline cleaning solution. The alkaline cleaning solution can be prepared from sodium hydroxide (NaOH) or sodium carbonate (Na2CO3) at a concentration of 5% to 10%, and the cleaning time can be 10 to 20 minutes. During the alkaline cleaning process, the solution must be properly stirred to ensure that the alkaline solution is evenly applied to the surface of the substrate 700. After the alkaline cleaning is completed, rinse the substrate 700 with deionized water to ensure that no residual alkaline solution remains on the surface.

[0070] Then, surface activation is performed to form an active layer on the surface of the substrate 700 through chemical treatment, thereby enhancing the bonding force between the substrate 700 and the coating and removing any residual passivation film on the surface.

[0071] Immerse the alkaline-washed substrate 700 in an activation solution, which can be prepared from dilute hydrochloric acid (HCl), for 5 to 10 minutes. During the activation process, the solution temperature should be controlled around room temperature to avoid excessive corrosion of the substrate 700 surface caused by excessive temperatures. After activation, rinse the substrate 700 thoroughly with deionized water to ensure that no residual activation solution remains on the surface.

[0072] Place the cleaned substrate 700 in a drying oven at a temperature of 60-80° C. for 10-20 minutes. After drying, the surface of the substrate 700 should be dry and clean with no water stains remaining.

[0073] Through the above-mentioned refined pretreatment steps, the surface of the 304 stainless steel substrate 700 is ensured to be clean, flat and highly active, thereby providing ideal surface conditions for the subsequent electrodeposition process, improving the bonding strength between the coating and the substrate 700 and the uniformity of the coating.

[0074] S2. Keep the substrate 700 connected to the cathode, rotate the substrate 700, and immerse the substrate 700 in the electrolyte 410 for deposition.

[0075] Add reinforcement phase particles to the electrolyte 410, the reinforcement phase particles include ceramic particles or nanoparticles, etc.

[0076] The hardness and wear resistance of the coating can be improved by adding reinforcing phase particles. For example, nanoparticles (such as Ta, SiC, Al2O3, TiC, etc.) and ceramic particles (such as WC, ZrO2, etc.) have high hardness and high strength, which can significantly improve the hardness and wear resistance of the coating. These particles form a dispersed distribution in the coating, hindering crack propagation and enhancing the fracture toughness of the material.

[0077] The corrosion resistance of the coating can be improved by adding reinforcing phase particles, such as nanoparticles or ceramic particles, to form a dense structure, reduce porosity, and thus improve the corrosion resistance of the coating.

[0078] The addition of reinforcing particles can optimize the coating's microstructure. For example, nanoparticles are smaller, have a higher specific surface area, and possess greater interfacial energy, forming a fine grain structure within the coating, thereby increasing its strength and toughness. Ceramic particles can be evenly distributed within the coating, improving its microstructure and making it denser.

[0079] The conductivity and stability of the electrolyte 410 can be improved by adding reinforcing phase particles. For example, nanoparticles or ceramic particles can improve the conductivity and stability of the electrolyte 410, thereby improving the current distribution during the electrodeposition process and making the coating more uniform.

[0080] Taking the case where the reinforcing phase particles are nanoparticles, where Ta powder (average particle size not exceeding 50 μm) is selected as the nanoparticles, the adding steps include:

[0081] Watts nickel solution is used as the electrolyte 410, wherein the components of the Watts nickel solution include: 260g / L NiSO4·6H2O; 40g / L NiCl2·6H2O; 40g / L H3BO3; 5g / L C7H4NNaO3S; etc.

[0082] Ta powder was dispersed in 50 ml of deionized water at a ratio of 3 g / L, and ultrasonically oscillated for 60 minutes to obtain a mixed solution. The mixed solution was added to the electrolyte 410 and ultrasonically oscillated for 60 minutes to obtain a composite solution. The composite solution was added to the electrolyte tank 400, and the temperature of the electrolyte 410 was controlled at 50±1°C. The cathode current density and cathode rotation speed were set to perform the deposition operation.

[0083] The electrodeposition process is further optimized by precisely controlling the composition and ratio of the electrolyte 410. The components of the Watt nickel solution play a key role in the electrolysis process. They not only provide the necessary nickel ions but also ensure the stability and efficiency of the electrodeposition process by regulating the pH value and conductivity of the electrolyte 410.

[0084] The addition of Ta powder, with an average particle size controlled below 50 μm, enables more effective dispersion in electrolyte 410, reduces agglomeration, and further improves the uniformity and stability of electrolyte 410. This optimized electrolyte 410 formulation and addition method makes the electrodeposition process more controllable and significantly improves the quality and performance of the coating.

[0085] The rotational speed of the rotating cathode plays a key role in the deposition process. A suitable rotational speed promotes uniform distribution of ions in the electrolyte 410, reduces concentration polarization, and results in a more uniform and fine coating. Furthermore, the cathode current density setting is crucial, directly influencing the electrodeposition rate and coating quality. By precisely controlling the cathode current density, the microstructure and properties of the coating can be optimized.

[0086] Furthermore, controlling the temperature of electrolyte 410 is crucial. At 50±1°C, the chemical reaction rate in electrolyte 410 is moderate, which is conducive to obtaining a high-quality coating. Excessively high or low temperatures can lead to reduced coating quality, so strict control of the electrolyte 410 temperature is essential.

[0087] By precisely controlling parameters such as the composition of the electrolyte 410, the dispersion and addition of Ta powder, the cathode current density, the cathode rotation speed, and the temperature of the electrolyte 410, the rotating cathode hydrostatic electrodeposition method can be optimized to obtain a coating with excellent performance.

[0088] S3. After the electrodeposition is completed, the substrate 700 is taken out, ultrasonically cleaned, and then dried to complete the electrodeposition operation.

[0089] During the deposition process of this method, the motor 130 and the gear meshing transmission are used, and the metal ions and reinforcement phase particles in the solution are uniformly deposited on the surface of the substrate 700 under the action of the rotation of the cathode, thereby significantly improving the uniformity and hardness of the coating surface.

[0090] Example 2:

[0091] like Figure 2 As shown, a rotating cathode hydrostatic electrodeposition device is used in the rotating cathode hydrostatic electrodeposition method of embodiment 1. The device includes: an electrolyte tank 400, a driving component 100, a cathode connecting component 200 and a plating source component 300, etc.

[0092] Among them: the electrolyte tank 400 is used to accommodate the electrolyte 410, the driving component 100 is used to drive the substrate 700 in the electrolyte 410 to rotate; the cathode connecting component 200 is used to keep the substrate 700 connected to the cathode when the substrate 700 rotates; the plating source component 300 is in the electrolyte 410, connected to the anode, and provides a metal source for electrodeposition.

[0093] The principle of electrodeposition using the above-mentioned device is as follows: in the electrolyte tank 400, metal ions move toward the cathode under the action of the electric field, and a reduction reaction occurs on the surface of the cathode to deposit and form a coating. Due to the drive of the drive component 100, the substrate 700 rotates in the electrolyte 410, forming cathode rotation. This rotation action not only promotes the uniform distribution of metal ions and reinforcing phase particles (such as nanoparticles) in the electrolyte 410, but also enables them to be more evenly deposited on the surface of the substrate 700. The cathode connection component 200 ensures that the substrate 700 always maintains a good connection with the cathode during the rotation of the substrate 700, thereby ensuring the continuity and stability of the electrodeposition process. The plating source component 300 is a component that provides a metal source, which is connected to the anode to ensure that there is a sufficient supply of metal ions during the electrodeposition process. The design of the entire device is intended to achieve an efficient and uniform rotation of the cathode static liquid electrodeposition process to improve the performance of the coating.

[0094] like Figure 3 As shown, the driving assembly 100 includes components such as a driving gear 110 and a driven gear 140 , wherein the driving gear 110 is connected to the driving shaft of the motor 130 through a coupling 150 ; the motor 130 is fixed to the wall of the electrolyte tank 400 through a support base 120 .

[0095] like Figure 4 As shown, the driven gear 140 meshes with the driving gear 110. The end face of the driven gear 140 is provided with an end face slot 270 for inserting the base 700. The base 700 can be inserted or clamped into the end face slot 270 to facilitate the replacement of the base 700. After clamping and inserting, the base 700 rotates with the driven gear 140.

[0096] The precise engagement of the driving gear 110 and the driven gear 140 ensures the smoothness and reliability of the rotational action, which is crucial to the uniformity and quality of the electrodeposition process. The motor 130 provides sufficient torque to drive the rotation of the substrate 700 in the electrolyte 410, while maintaining the appropriate rotation speed of the motor 130 through the control system 900 to achieve the best deposition effect. In addition, the design of the motor 130 being fixed to the wall of the electrolyte tank 400 by the support base 120 ensures the stability of the device. The design of the end face slot 270 makes the replacement of the substrate 700 simple and quick, and is applicable to various types of substrates 700, which greatly improves work efficiency and also provides users with more operational convenience.

[0097] like Figure 5 As shown, the cathode connection assembly 200 includes a conductive spring 210 and a conductive slip ring 250, among other components, wherein:

[0098] The conductive spring 210 is located in a cavity defined within the driven gear 140. The conductive spring 210 rotates along with the driven gear 140. When the base 700 is inserted into the end face slot 270, the conductive spring 210 abuts against the base 700. The conductive slip ring 250 is electrically connected to the negative pole of the power source 800. The fixed end of the conductive slip ring 250 is connected to the support base 120 or the wall of the electrolyte tank 400. The movable end of the conductive slip ring 250 is connected to the conductive spring 210 via a cable 280. The movable end of the conductive slip ring 250 rotates along with the driven gear 140.

[0099] The base 700 is snapped or inserted into the end face slot 270 of the driven gear 140. A conductive spring 210 is fixed in the end face slot 270, so that when the base 700 is installed, good contact between the base 700 and the conductive spring 210 is guaranteed. The driven gear 140 is fixed on the bearing 220, and the bearing 220 is installed in the hole of the support seat 120 and is fixed with a hole retaining ring 240.

[0100] The driven gear 140 is fixed in the bearing 220 and fixed by the shaft retaining ring 230. The movable end of the conductive slip ring 250 is fixed in the hole at the shaft end of the driven gear 140. The fixed end of the conductive slip ring 250 is connected to the slip ring fixing seat 260. The slip ring fixing seat 260 is fixed to the wall of the electrolyte tank 400. The negative pole connected to the power supply 800 is led out from the fixed end of the conductive slip ring 250. The conductive spring 210 is connected to the cable 280 at the movable end of the conductive slip ring 250 to ensure that the negative pole of the power supply 800 is connected to the circuit of the base 700. At the same time, the conductive spring 210 and the driven gear 140 are well insulated.

[0101] The plating source assembly 300 includes components such as an anode clamping slot 320 and an anode plate 310, wherein the anode plate 310 is fixed in the insulating anode clamping slot 320 and is suspended as a whole on the side of the electrolytic cell. The electrolyte tank 400 contains electrolyte 410, and the anode plate 310 is immersed in the electrolyte 410, so that the substrate 700 to be deposited is completely immersed in the electrolyte 410.

[0102] Further, such as Figure 6 As shown, the rotating cathode static liquid electrodeposition device further includes components such as a temperature controller 500 and a stirrer 600. Among them:

[0103] The temperature controller 500 is disposed at the bottom of the electrolyte tank 400 for regulating the temperature of the electrolyte 410 ; the stirrer 600 is disposed at the bottom of the electrolyte tank 400 for stirring the electrolyte 410 .

[0104] The stirrer 600 can be a magnetic stirrer. The electrolyte tank 400 is placed on the magnetic stirrer for heating and stirring. The stirring speed is 300 r / min, and the temperature of the electrolyte 410 is controlled at 50±1° C. to form magnetic stirring.

[0105] The temperature controller 500 can be integrated into the stirrer 600, and the real-time temperature information is fed back to the stirrer 600 through the temperature sensor to achieve dynamic adjustment and balance of the temperature heating system, thereby ensuring that the temperature of the electrolyte 410 is maintained within the set range.

[0106] In addition, the stirrer 600 keeps the electrolyte 410 containing the reinforcement phase particles in a uniform stirring state through the stirring bar, thereby improving the ion reaction stability of the electrolyte 410 and the uniformity of the distribution of the reinforcement phase particles.

[0107] Furthermore, the metal ions and reinforcing phase particles are evenly dispersed in the deposited layer under the combined action of magnetic stirring and rotation of the substrate 700 for 15 minutes. At this time, the power supply 800 is turned on, and after deposition for 30 minutes, the substrate 700 is taken out, cleaned and dried, and the bonding strength between the deposited layer and the substrate 700 and the surface morphology are observed.

[0108] Taking the substrate 700 as stainless steel 304 as an example, by setting a comparative example with the above embodiment, the static liquid electrodeposition with rotation and nanoparticles is compared respectively. Figure 7 As shown, the hardness values ​​of the surface of the static liquid electrodeposition coating with and without rotating cathode are compared, as shown in Figure 8 shown.

[0109] It can be seen that the rotating cathode hydrostatic electrodeposition method significantly improves the uniformity of the coating surface and significantly increases the hardness value. The role of the rotating cathode is not only to promote the uniform deposition of metal ions and reinforcement phase particles, but also to effectively reduce the porosity and defects in the coating through the shear force generated by its rotation, thereby improving the density and hardness of the coating.

[0110] Furthermore, the addition of nanoparticles further enhances the coating's performance. Nanoparticles, with their high specific surface area and activity, form an effective dispersion-strengthening phase within the coating, hindering dislocation motion and improving the coating's hardness and wear resistance. Comparisons of hydrostatic electrodeposition coatings with and without a rotating cathode, and with and without nanoparticles, clearly demonstrate the significant advantages of the rotating cathode hydrostatic electrodeposition method in improving coating performance.

[0111] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

[0112] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0113] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

Claims

1. A rotating cathode hydrostatic electrodeposition method, characterized in that: include: S1, pre-treating the substrate (700) to be electrodeposited; S2, keeping the substrate (700) connected to the cathode, rotating the substrate (700) and immersing the substrate (700) in the electrolyte (410) for deposition; S3. After the electrodeposition is completed, the substrate (700) is taken out, ultrasonically cleaned and then dried to complete the electrodeposition operation.

2. The method according to claim 1, characterized in that The pretreatment in S1 includes: sanding, pickling, alkali washing and surface activation treatment of the substrate (700).

3. The method according to claim 1, characterized in that Reinforced phase particles are added to the electrolyte (410), and the reinforced phase particles include ceramic microparticles and nanoparticles.

4. The method according to claim 3, characterized in that When the nanoparticles added to the electrolyte (410) are Ta powder, the adding step includes: S11, using a Watt nickel solution as an electrolyte (410), wherein the Watt nickel solution comprises: 260g / L NiSO4·6H2O; 40g / L NiCl2·6H2O; 40g / L H3BO3; 5g / L C7H4NNaO3S; S12, dispersing Ta powder in 50 ml of deionized water at a ratio of 3 g / L of Ta powder, and ultrasonically oscillating the water for 60 min to obtain a mixed solution; S13, adding the mixed solution to the electrolyte (410), and subjecting the mixture to ultrasonic oscillation for 60 minutes to obtain a composite solution; S14, adding the composite solution into the electrolyte tank (400), and controlling the temperature of the electrolyte (410) at 50±1°C; S15. Set the cathode current density and cathode rotation speed to perform deposition operation.

5. The method according to any one of claims 1 to 4, characterized in that A rotating cathode hydrostatic electrodeposition device, comprising: an electrolyte tank (400) for containing an electrolyte (410); A driving assembly (100) for driving the substrate (700) in the electrolyte (410) to rotate; a cathode connection assembly (200) for maintaining the connection between the substrate (700) and the cathode when the substrate (700) rotates; The plating source assembly (300) is in the electrolyte (410), connected to the anode, and provides a metal source for electrodeposition.

6. The method according to claim 5, characterized in that The drive assembly (100) comprises: A driving gear (110) is connected to a drive shaft of a motor (130) via a coupling (150); The driven gear (140) is engaged with the driving gear (110). The end surface of the driven gear (140) is provided with an end surface slot (270) for inserting the base (700). The base (700) rotates following the driven gear (140).

7. The method according to claim 5, characterized in that The cathode connection assembly (200): The conductive spring piece (210) is located in a cavity opened inside the driven gear (140). The conductive spring piece (210) rotates along with the driven gear (140). When the base (700) is inserted into the end face slot (270), the conductive spring piece (210) abuts against the base (700). A conductive slip ring (250) is electrically connected to the negative electrode of a power source (800), a fixed end of the conductive slip ring (250) is connected to the wall of the electrolyte tank (400), a movable end of the conductive slip ring (250) is connected to the conductive spring (210) via a cable (280), and the movable end of the conductive slip ring (250) rotates following the driven gear (140).

8. The method according to claim 5, characterized in that The rotating cathode hydrostatic electrodeposition device further comprises: a temperature controller, disposed at the bottom of the electrolyte tank (400) and used to control the temperature of the electrolyte (410); The stirrer (600) is disposed at the bottom of the electrolyte tank (400) and is used to stir the electrolyte (410).

9. The method according to claim 8, characterized in that During the electrodeposition operation, the agitator (600) stirs and the substrate (700) rotates together, and the action time is not less than 15 minutes.

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