Server cooling racks

Abstract

The present application discloses a server cooling rack, which relates to the technical field of servers and includes a rack body, a bracket, an infusion pump and a condensing device. The server is arranged in the bracket, and the bracket is arranged in the rack body and is at least partially immersed in a cooling medium. The bracket can be directly cooled and cooled by the cooling medium, so that the server can operate at an appropriate temperature. When the server runs at high speed and generates a large amount of heat, the cooling medium can be drawn into the bracket under the action of the infusion pump to directly cool the server. The cooling medium entering the bracket through the medium inlet absorbs heat and vaporizes, and can be discharged to the outside of the bracket through the medium outlet, that is, the gaseous cooling medium can be discharged into the first cavity, thereby condensing at the condensing device and falling into the first cavity. Through the provision of the infusion pump, it can be ensured that the cooling medium forms a stable and continuous circulation flow between the infusion pump and the bracket, avoiding local stagnation of the cooling medium.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a server cooling rack. Background Art

[0002] With the rapid development of technologies like cloud computing and artificial intelligence, and the continued increase in the number of cores and computing performance of server processors, the power consumption and heat generation of servers are also increasing exponentially. In densely deployed server clusters, particularly in data centers, the heat generated by these centralized servers accumulates. Traditional air cooling, limited by the specific heat capacity and thermal conductivity of air, struggles to maintain equipment operating within a safe temperature range. Furthermore, immersion liquid cooling can also suffer from poor localized heat dissipation when the coolant is not flowing smoothly, making it impossible to meet the cooling requirements of fully loaded servers. Summary of the Invention

[0003] The present application provides a server cooling rack to at least solve the problem of poor heat dissipation when the server is fully loaded in the related art.

[0004] The present application provides a server cooling rack, comprising:

[0005] A frame body, wherein a first cavity is formed in the frame body and the first cavity is filled with a cooling medium;

[0006] a bracket disposed in the first cavity and at least partially immersed in the cooling medium, wherein a second cavity for accommodating a server is formed in the bracket, and a medium inlet and a medium outlet are formed on the bracket, wherein the medium inlet and the medium outlet are both in communication with the second cavity;

[0007] an infusion pump having an infusion inlet and an infusion outlet, wherein the infusion inlet is immersed in the cooling medium, and the infusion outlet is connected to the medium inlet, so as to provide the liquid cooling medium to the second cavity through the infusion pump;

[0008] The condensing device is provided in the first cavity and is located above the bracket. The gaseous cooling medium discharged into the first cavity through the medium outlet is condensed into liquid at the condensing device and falls into the first cavity.

[0009] Through the present application, the server is arranged in the bracket, the bracket is arranged in the rack body, and is at least partially immersed in the cooling medium. The cooling medium can directly cool the bracket, so that the server can work at an appropriate temperature. When the server runs at high speed and generates a large amount of heat, under the action of the infusion pump, the cooling medium can be drawn into the bracket to directly cool the server. The cooling medium entering the bracket through the medium inlet absorbs heat and vaporizes, and can be discharged to the outside of the bracket through the medium outlet, that is, the gaseous cooling medium can be discharged into the first cavity, and then condensed at the condensing device to fall into the first cavity. In this way, the recycling of the cooling medium can be achieved. Through the setting of the infusion pump, it can ensure that the cooling medium forms a stable and continuous circulation flow between the infusion pump and the bracket, avoiding local stagnation of the cooling medium, and solving the problem of poor cooling medium flow in high-density server environments. The continuous flow of the cooling medium allows heat to be taken away in time to avoid local overheating, especially in high-density server environments, ensuring that all heat-generating components on the server can be effectively cooled, so that the server can continue to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 A schematic structural diagram of a server cooling rack provided in an embodiment of the present application;

[0012] Figure 2 A front view of a server cooling rack provided in an embodiment of the present application;

[0013] Figure 3 A side view of a server cooling rack provided in an embodiment of the present application;

[0014] Figure 4 A top view of a server cooling rack provided in an embodiment of the present application;

[0015] Figure 5 A cross-sectional view of a server cooling rack provided in an embodiment of the present application;

[0016] Figure 6 A schematic diagram of the installation of the bracket provided in an embodiment of the present application inside the rack body;

[0017] Figure 7 A cross-sectional view of the bracket provided in an embodiment of the present application.

[0018] The above drawings include the following reference numerals:

[0019] 0. Server;

[0020] 1. Frame body; 11. First cavity; 12. Cooling medium; 13. Housing; 131. Buckle; 132. Fixing seat; 14. Cover; 141. Buckle fitting; 15. Liquid inlet connector; 16. Liquid outlet connector; 17. Support frame;

[0021] 2. Bracket; 21. Second cavity; 22. Medium inlet; 23. Medium outlet; 24. Support boss; 241. Gap;

[0022] 3. Infusion pump;

[0023] 4. Condensing device; 41. Heat transfer cavity; 42. Cold end; 43. Hot end;

[0024] 5. Heat dissipation fins;

[0025] 6. Cooling fan; 61. Fan seat;

[0026] 7. Infusion pipeline; 71. Nozzle; 72. Outlet pipeline; 73. Branch line; 74. Control valve. DETAILED DESCRIPTION

[0027] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0028] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0029] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0030] Reference Figures 1 to 7 As shown, an embodiment of the present application provides a server cooling rack, including a rack body 1, a bracket 2, an infusion pump 3 and a condensing device 4.

[0031] A first cavity 11 is formed in the rack body 1 , and the first cavity 11 is filled with a cooling medium 12 , so as to achieve liquid cooling of the server 0 through the cooling medium 12 .

[0032] Specifically, the bracket 2 is disposed in the first cavity 11 and is at least partially immersed in the cooling medium 12 , so that the bracket 2 and the interior of the bracket 2 are cooled by the cooling medium 12 .

[0033] A second cavity 21 for accommodating the server 0 is formed within the bracket 2. A medium inlet 22 and a medium outlet 23 are provided on the bracket 2. Both the medium inlet 22 and the medium outlet 23 are connected to the second cavity 21, thereby connecting the second cavity 21 with the first cavity 11 through the medium inlet 22 and the medium outlet 23. The infusion pump 3 has an infusion inlet and an infusion outlet. The infusion inlet is immersed in the cooling medium 12, and the infusion outlet is connected to the medium inlet 22 to provide liquid cooling medium 12 to the second cavity 21 through the infusion pump 3. Driven by the infusion pump 3, the cooling medium 12 has sufficient flow power. When the cooling medium 12 flows through the server 0, it can remove the heat generated by the server 0 during operation.

[0034] The condensing device 4 is disposed within the first cavity 11 and is located above the bracket 2. The gaseous cooling medium 12 discharged into the first cavity 11 through the medium outlet 23 is condensed into liquid form at the condensing device 4 and falls into the first cavity 11. In other words, the heat from the server 0 absorbed by the cooling medium 12 can be released at the condensing device 4, thereby achieving heat dissipation and cooling of the server 0.

[0035] Through the present application, the server 0 is arranged in the bracket 2, the bracket 2 is arranged in the rack body 1, and is at least partially immersed in the cooling medium 12. The cooling medium 12 can directly cool the bracket 2, so that the server 0 can work at a suitable temperature. When the server 0 runs at high speed and generates a large amount of heat, under the action of the infusion pump 3, the cooling medium 12 can be sucked into the bracket 2 to directly cool the server 0. The cooling medium 12 entering the bracket 2 through the medium inlet 22 absorbs heat and vaporizes, and can be discharged to the outside of the bracket 2 through the medium outlet 23, that is, the gaseous cooling medium 12 can be discharged to the first cavity 11, thereby condensing at the condensing device 4 to fall into the first cavity 11, so that the recycling of the cooling medium 12 can be achieved. Through the setting of the infusion pump 3, it can be ensured that the cooling medium 12 forms a stable and continuous circulation flow between the infusion pump 3 and the bracket 2, avoiding local stagnation of the cooling medium 12, and solving the problem of poor flow of the cooling medium 12 in the high-density server 0 environment. The continuous flow of the cooling medium 12 allows the heat to be taken away in time to avoid local overheating, especially in the high-density server 0 environment, ensuring that all heat-generating components on the server 0 can be effectively cooled, so that the server 0 can continue to operate.

[0036] It can be understood that the cooling medium 12 outside the bracket 2 can indirectly cool the server 0, and the cooling medium 12 inside the bracket 2, driven by the infusion pump 3, can directly flush the server 0 to directly cool the server 0. Under the dual cooling effect of the cooling medium 12, the heat dissipation requirements of the server 0 when running at full load can be met.

[0037] In specific implementation, the bracket 2 can be partially immersed in the cooling medium 12, and at least the medium outlet 23 can be exposed to the air in the first cavity 11, so that the cooling medium 12 that becomes gaseous after absorbing heat can directly rise to the condensation device 4 for liquefaction and heat release; it can also be completely immersed in the cooling medium 12. Under the power of the infusion pump 3, the gaseous cooling medium 12 can only flow from the medium outlet 23 to the first cavity 11. The gaseous cooling medium 12 can directly release heat to the liquid cooling medium 12, and can also achieve heat dissipation at the condensation device 4.

[0038] Reference Figure 7 As shown, the medium outlet 23 is provided above the bracket 2 to facilitate the discharge of the gaseous cooling medium 12 and increase the circulation rate.

[0039] In some embodiments, a heat transfer cavity 41 is formed in the condensing device 4, and the heat transfer cavity 41 is filled with an alcohol solution. The alcohol is easy to evaporate to absorb heat, thereby enabling condensation of the gaseous cooling medium 12 to reduce the overall temperature in the first cavity 11. The bottom wall of the heat transfer cavity 41 is formed as a cold end 42, and the cold end 42 is arranged toward the first cavity 11. The top wall of the heat transfer cavity 41 is formed as a hot end 43, which is used to exchange heat with the outside of the rack body 1.

[0040] It can be understood that the gaseous cooling medium 12 can condense at the cold end 42 of the condensing device 4, and the alcohol solution absorbs heat and releases it at the hot end 43, so that the heat in the first cavity 11 can be transferred to the outside of the rack body 1 through the condensing device 4.

[0041] Specifically, when the alcohol solution fills heat transfer cavity 41, the bottom wall of heat transfer cavity 41 directly forms a cold end 42, which contacts and transfers heat with first cavity 11. In other words, condenser 4 is formed above bracket 2. When gaseous cooling medium 12 rises, it can condense directly at cold end 42, releasing heat.

[0042] In practice, heat transfer chamber 41 maintains a low pressure environment. Under this low pressure, the alcohol solution has a low boiling point. After absorbing heat, it evaporates quickly, accelerating the absorption of heat at cold end 42 of condenser 4. The evaporated alcohol then liquefies and refluxes upon encountering the top wall of heat transfer chamber 41 (i.e., hot end 43). This creates a dynamic thermal equilibrium within heat transfer chamber 41, ensuring that condenser 4 can continuously and efficiently dissipate heat. Specifically, the internal pressure of heat transfer chamber 41 is set to 0.3 to 0.5 atmospheres, effectively lowering the boiling point of the alcohol solution within heat transfer chamber 41.

[0043] In some embodiments, a plurality of capillaries are evenly arranged inside the heat transfer cavity 41 , which can increase the specific surface area of ​​the alcohol solution, thereby accelerating the evaporation efficiency of the alcohol solution and improving the condensation rate of the condensation device 4 .

[0044] In some embodiments, reference Figure 1 、 Figure 2 and Figure 5 As shown, heat dissipation fins 5 are provided at the hot end 43 of the condensing device 4. The heat dissipation fins 5 penetrate the wall of the rack body 1 and extend to the outside of the rack body 1. It can be understood that the condensing device 4 is disposed within the first cavity 11, absorbs heat from the gaseous cooling medium 12, and transfers the heat to the outside of the rack body 1 through the heat dissipation fins 5 that penetrate the inside and outside of the rack body 1 for release. In this way, when the heat dissipation fins 5 are exposed to the air in the computer room, heat can be dissipated through natural convection.

[0045] That is to say, referring to Figure 5 As shown, one end of the heat dissipation fin 5 is located inside the first cavity 11 and is used to contact the condensing device 4 to achieve heat transfer, and the other end of the heat dissipation fin 5 is located outside the first cavity 11, that is, outside the rack body 1, to transfer heat with the external air, thereby transferring the heat inside the first cavity 11 to the air outside the rack body 1.

[0046] In a specific implementation, the heat dissipation fins 5 are integrally formed with the rack body 1 to avoid the formation of gaps between the heat dissipation fins 5 and the rack body 1, thereby ensuring the sealing performance inside the rack body 1. Furthermore, the heat dissipation fins 5 are integrally formed with the condensing device 4, which can effectively improve the heat conduction efficiency between the condensing device 4 and the heat dissipation fins 5.

[0047] Furthermore, a cooling fan 6 is provided at the end of the cooling fin 5 away from the condensing device 4 to blow air toward the cooling fin 5, thereby increasing the heat exchange on the cooling fin 5 through the cooling fan 6, improving the heat dissipation capacity, and increasing the condensing effect of the condensing device 4.

[0048] Specifically, a fan seat 61 is provided at the end of the heat dissipation fin 5 away from the condensing device 4 , and the heat dissipation fan 6 is arranged in the fan seat 61 to ensure that the heat dissipation fan 6 is installed stably.

[0049] Specifically, cooling fan 6 is installed within fan base 61 and works in conjunction with fins 5 to dissipate heat. Fan 6 accelerates air flow around fins 5, removing heat from them and lowering the temperature of condenser unit 4. The multi-stage heat dissipation mechanism, combined with cooling medium 12 and condenser unit 4, ensures efficient heat dissipation from the system. This is particularly true when server 0 is fully loaded, enabling rapid heat dissipation and ensuring stable system operation.

[0050] Specifically, there are multiple cooling fans 6 , and multiple cooling fans 6 can accelerate the heat dissipation at the cooling fins 5 , thereby effectively reducing the temperature of the condensing device 4 .

[0051] Reference Figure 5 As shown, the condensing device 4 includes a condensing plate, which is located above the bracket 2. A heat transfer cavity 41 is formed inside the condensing plate. The cross-section of the condensing plate is adapted to the cross-sectional shape of the first cavity 11. In this way, there is sufficient contact area between the gaseous cooling medium 12 and the condensing device 4 to ensure the condensation rate.

[0052] The bottom surface of the condensation plate is formed as a cold end 42 to contact the gaseous cooling medium 12 , and the top surface is formed as a hot end 43 to connect with the heat dissipation fins 5 and dissipate heat to the outside of the rack body 1 through the heat dissipation fins 5 .

[0053] In some embodiments, reference Figure 5 and Figure 6 As shown, the infusion outlet and the medium inlet 22 are connected via an infusion line 7, and a nozzle 71 connected to the infusion line 7 is provided on the side of the medium inlet 22 facing the second cavity 21. The nozzle 71 is used to spray the cooling medium 12 toward the server 0. The cooling medium 12 pumped into the infusion line 7 by the infusion pump 3 can be sprayed out through the nozzle 71 and sprayed onto the server 0 in a directionally directed manner to directly dissipate heat from the server 0.

[0054] In specific implementation, the nozzle 71 is an atomizing nozzle or a foam nozzle. After passing through the nozzle 71, the liquid cooling medium 12 can be changed into smaller particles or formed into a large number of fine bubbles, so that the cooling medium 12 can be easily vaporized, thereby improving the heat absorption efficiency of the coolant.

[0055] Continue to refer to Figure 5 and Figure 6 As shown, there are multiple racks 2, each of which can accommodate and install a server 0. An outlet pipe 72 is provided at the outlet of the infusion pump 3. The end of the outlet pipe 72 is provided with multiple branches 73, which are connected to the second cavities 21 inside the multiple racks 2 one by one to achieve independent heat dissipation within the multiple racks 2. Among them, each branch 73 is provided with a control valve 74 to individually control the heat dissipation of the rack 2.

[0056] That is to say, when in use, the cooling medium 12 enters the first cavity 11 from the liquid inlet connector 15, and the infusion pump 3 transports the cooling medium 12 in the first cavity 11 through the outlet pipe 72 and the branch pipe to each bracket 2 on which the server 0 is installed. The cooling medium 12 is sprayed onto the hardware surface of the server 0 in the form of fine particles or foam through the nozzle 71 through the medium inlet 22. Through the setting of the nozzle 71, the cooling medium 12 can evenly cover the surface of the server 0. After absorbing the heat generated on the server 0, the cooling medium 12 becomes gaseous. The gaseous cooling medium 12 is discharged through the medium outlet 23 and rises to the condensing device 4. The higher temperature gaseous cooling medium 12 transfers heat to the condensing device 4 and releases heat before liquefying and dripping. In the heat transfer cavity 41 inside the condensing device 4, the alcohol solution absorbs heat and evaporates faster. After encountering the top wall of the heat transfer cavity, it liquefies and refluxes to further conduct and dissipate heat. The cooling fan 6 can accelerate the heat dissipation at the heat dissipation fins 5 to ensure efficient heat dissipation of the system.

[0057] Furthermore, a support frame 17 is provided in the rack body 1 , and the bracket 2 is provided on the support frame 17 , so that the server 0 and the inner wall of the first cavity 11 are spaced apart to improve the flowability of the cooling medium 12 in the first cavity 11 .

[0058] In some embodiments, a plurality of support bosses 24 are provided within the second cavity 21. The server 0 is mounted on the support bosses 24. Gaps 241 are formed between adjacent support bosses 24. The cooling medium 12 is sprayed onto the surface of the server 0 through the gaps 241. In other words, the support bosses 24 are formed as structures protruding from the inner sidewall surface of the second cavity 21 to support the server 0. The provision of multiple support bosses 24 ensures the support stability of the server 0 and also ensures smooth airflow at the bottom of the server 0.

[0059] In other embodiments, a support plate is provided in the second cavity 21, and the server 0 is mounted on the support plate. The support plate has through-holes, and the cooling medium 12 is sprayed onto the surface of the server 0 through the holes. It is understood that the support plate is formed as an entire plate structure, and the server 0 is supported and mounted on the support plate. By providing through-holes in the plate structure, the cooling medium 12 can be ensured to circulate in the second cavity 21.

[0060] It should be noted that the nozzle 71 can be set on the side wall or bottom wall of the second cavity 21, that is, the nozzle 71 is located below or to the side of the server 0, and the cooling medium 12 can be ensured to circulate in the second cavity 21 through the gap 241 between the support bosses 24 (or through the through holes on the support plate), so that when the nozzle 71 is set below the server 0, the cooling medium 12 can be sprayed toward the server 0 through the gap 241 (or through holes), or when the nozzle 71 is set on the side of the server 0, the cooling medium 12 can be sprayed directly toward the server 0, and at the same time, overheating of the bottom of the server 0 and uneven heat dissipation can be avoided.

[0061] Specifically, the number of the medium inlet 22 and the medium outlet 23 can be single or multiple, which is not limited in this application and can be specifically set according to actual needs. Among them, the medium inlet 22 is located below the medium outlet 23 to adapt to the flow direction of the gaseous cooling medium 12.

[0062] It should be noted that the server 0 is detachably connected to the support boss 24 or the support plate by screw fasteners, which facilitates the installation and removal of the server 0. The support boss 24 or the support plate is integrally formed on the inner wall of the second cavity 21.

[0063] Reference Figure 7 As shown, when the server 0 is set inside the bracket 2, the server 0 is supported on the support boss 24 or the support plate, and the server 0 is spaced from the inner wall of the second cavity 21 to improve the flow of the cooling medium 12 in the second cavity 21.

[0064] In some embodiments, the cooling medium 12 includes at least 60%-75% of fluorinated liquid, 15%-25% of disinfectant, 2%-8% of nanoparticles, 0.5%-2% of corrosion inhibitor, and 0.5%-1.5% of defoaming agent.

[0065] Among them, fluorinated liquid includes fluorocarbons, which have excellent electrical insulation, good thermal conductivity, are non-flammable, and have good fluidity. The low-boiling point fluorinated liquid facilitates heat absorption and vaporization, and has high heat dissipation performance.

[0066] The disinfectant includes at least one of ethanol and isopropyl alcohol, which can kill a variety of bacteria, viruses and fungi, and ensure the safety of the cooling medium 12.

[0067] The nanoparticles include at least one of aluminum oxide nanoparticles or copper oxide nanoparticles, which can improve the overall thermal conductivity of the cooling medium 12 and enhance the heat dissipation effect.

[0068] Corrosion inhibitors include benzotriazole to slow down the corrosion rate of copper or aluminum and ensure service life.

[0069] Defoaming agents include polydimethylsiloxane, which can suppress the generation of foam in fluorinated fluids.

[0070] Exemplarily, the cooling medium 12 may include: fluorinated liquid accounting for 70% of the total mass, disinfectant accounting for 21% of the total mass, aluminum oxide nanoparticles accounting for 7% of the total mass, benzotriazole accounting for 1% of the total mass, and polydimethylsiloxane accounting for 1% of the total mass.

[0071] The cooling medium 12 may further include: fluorinated liquid accounting for 65% of the total mass, ethanol accounting for 20% of the total mass, aluminum oxide nanoparticles accounting for 10% of the total mass, benzotriazole accounting for 2% of the total mass, and polydimethylsiloxane accounting for 3% of the total mass.

[0072] The cooling medium 12 may also include: fluorinated liquid accounting for 75% of the total mass, isopropyl alcohol accounting for 15% of the total mass, copper oxide nanoparticles accounting for 6% of the total mass, benzotriazole accounting for 1.5% of the total mass, and polydimethylsiloxane accounting for 2.5% of the total mass.

[0073] Compared with traditional fluorinated liquid, the cooling medium 12 of the present application has the following advantages after experimental analysis:

[0074] 1. Comparison of heat conduction efficiency: The second cooling medium 12 has the highest heat conduction efficiency, reaching 0.19 W / m·K, which is 58.33% higher than the traditional fluorinated liquid. The heat conduction efficiencies of the first cooling medium 12 and the third cooling medium 12 are also 41.67% and 50% higher than the traditional fluorinated liquid, respectively. That is, the cooling medium 12 of the present application can absorb and conduct heat more quickly, effectively improving heat dissipation performance.

[0075] 2. Environmental impact assessment: The environmental impact assessments of the above three cooling media 12 are all low, which meet environmental protection requirements. In comparison, the environmental impact assessment of traditional fluorinated liquids is medium, which shows that the cooling medium 12 of this application has obvious advantages in environmental protection and reduces potential harm to the environment.

[0076] 3. Comparison of Heat Dissipation Efficiency Improvement: Under the same experimental conditions, the cooling medium 12 of this application significantly reduced the surface temperature of the server 0 hardware and significantly improved heat dissipation efficiency. The second cooling medium 12 achieved the highest heat dissipation efficiency improvement, reaching 25.0%. The first and third cooling media 12 achieved heat dissipation efficiency improvements of 21.0% and 23.5%, respectively. This indicates that the cooling medium 12 of this application can more effectively dissipate the heat generated by the server 0, ensuring stable operation of the device under high load.

[0077] Among them, the fluorinated liquid is a low-boiling-point fluorinated liquid.

[0078] Of course, it should be noted that the cooling medium 12 of the present application can also be various substances with other proportions. The present application does not limit this and can be adjusted according to actual needs.

[0079] In some embodiments, the rack body 1 includes a shell 13 and a cover 14 covering the shell 13. A snap 131 is provided on the shell 13, and a snap fitting 141 is provided on the cover 14. The snap 131 is snap-fitted with the snap fitting 141 to achieve installation between the shell 13 and the cover 14, and prevent the cover 14 from loosening relative to the shell 13.

[0080] Specifically, the buckle 131 includes a clamping portion, and the buckle fitting 141 includes a clamping hole. The clamping portion is inserted into the clamping hole to achieve clamping, so as to assemble the shell 13 and the cover 14.

[0081] In other embodiments, the buckle 131 includes a rotating part and a limiting ring rotatably connected to the rotating part, wherein the rotating part is installed on the shell 13 through the fixed seat 132, and the rotating part is rotatably connected to the fixed seat 132; the mating part of the buckle 131 includes a clamping seat, a clamping slot is provided on the clamping seat, and the opening of the clamping slot is set upward. When the rotating part is rotated, the limiting ring can be driven to move synchronously. When the limiting ring is clamped in the clamping slot, pulling the rotating part downward can drive the limiting ring to gradually clamp in the clamping slot, thereby realizing the installation between the shell 13 and the cover body 14.

[0082] It should be noted that the snap 131 and the snap fitting 141 may also be other structures, and this application does not limit this, as long as the installation and fitting between the shell 13 and the cover 14 can be achieved to complete the connection.

[0083] A seal is provided between the cover 14 and the housing 13 , so that the first cavity 11 forms a sealed structure after the housing 13 and the cover 14 are assembled, thereby preventing the cooling medium 12 in the first cavity 11 from leaking out.

[0084] The condensing device 4 and the heat dissipating fins 5 are integrally formed on the cover 14 and can be installed on the housing 13 together with the cover 14. Furthermore, the condensing device 4 is fixedly connected to the inner side wall of the cover 14 facing the first cavity 11, and the upper side wall of the condensing device 4 is fixedly connected to a plurality of heat dissipating fins, and the upper side wall of the heat dissipating fins is fixedly connected to the fan base 61. In this way, the gap 241 between the condensing device 4, the heat dissipating fins 5, and the cover 14 can be avoided to affect the cooling effect.

[0085] In some embodiments, the cover 14 and the shell 13 are both made of stainless steel, which can provide mechanical strength and protection to prevent external physical damage and liquid leakage. The inner walls of the cover 14 and the shell 13 facing the first cavity 11 are coated with an epoxy resin coating to prevent the cooling medium 12 from directly contacting the metal cover 14 or shell 13 to avoid corrosion and chemical reactions. The seal is made of silicone material, which can improve the sealing effect between the cover 14 and the frame body 1.

[0086] In some embodiments, the rack body 1 is provided with a liquid inlet connector 15 and a liquid drain connector 16, both of which are in communication with the first cavity 11. In a specific implementation, new, low-temperature cooling medium 12 can enter the first cavity 11 through the liquid inlet connector 15, and old, high-temperature cooling medium 12 in the first cavity 11 can be discharged outside the rack body 1 through the liquid drain connector 16. By replacing the cooling medium 12 in the first cavity 11, the heat dissipation effect can be further improved.

[0087] Specifically, the drain joint 16 is arranged on a side wall of the rack body 1 and close to the upper side, so as to facilitate the discharge of the cooling medium 12 after absorbing heat. The liquid inlet joint 15 is arranged on a side wall of the rack body 1 opposite to the drain joint 16 and close to the lower side, so as to facilitate the entry of the cooled coolant, thereby facilitating subsequent heat absorption and vaporization.

[0088] For example, referring to Figure 1 and Figure 2 As shown, the liquid inlet connector 15 and the liquid discharge connector 16 are both arranged on the shell 13, which facilitates the liquid inlet connector 15 and the liquid discharge connector 16 to connect to the external pipeline to realize the liquid inlet and discharge of the cooling medium 12. The connection of the external pipeline will not be affected by the installation of the cover body 14.

[0089] The above is a detailed introduction to a server cooling rack provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core concept of the present application. It should be noted that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server cooling rack, characterized in that: include: A frame body (1), wherein a first cavity (11) is formed in the frame body (1), and the first cavity (11) is filled with a cooling medium (12); A bracket (2) is arranged in the first cavity (11) and is at least partially immersed in the cooling medium (12); a second cavity (21) for accommodating the server (0) is formed in the bracket (2); a medium inlet (22) and a medium outlet (23) are provided on the bracket (2); and both the medium inlet (22) and the medium outlet (23) are in communication with the second cavity (21); an infusion pump (3) having an infusion inlet and an infusion outlet, wherein the infusion inlet is immersed in the cooling medium (12), and the infusion outlet is connected to the medium inlet (22) to provide the liquid cooling medium (12) to the second cavity (21) through the infusion pump (3); A condensing device (4) is provided in the first cavity (11) and is located above the bracket (2). The gaseous cooling medium (12) discharged into the first cavity (11) through the medium outlet (23) is condensed into liquid at the condensing device (4) and falls into the first cavity (11).

2. The server cooling rack according to claim 1, wherein: A heat transfer cavity (41) is formed in the condensing device (4), and the heat transfer cavity (41) is filled with an alcohol solution. The bottom wall of the heat transfer cavity (41) is formed as a cold end (42), and the cold end (42) is arranged toward the first cavity (11). The top wall of the heat transfer cavity (41) is formed as a hot end (43) for performing heat exchange with the outside of the rack body (1).

3. The server cooling rack according to claim 2, wherein: The hot end (43) of the condensing device (4) is provided with a heat dissipation fin (5), and the heat dissipation fin (5) passes through the wall surface of the rack body (1) and extends to the outside of the rack body (1).

4. The server cooling rack according to claim 3, characterized in that: A cooling fan (6) is provided at the end of the cooling fin (5) away from the condensing device (4) to discharge air toward the cooling fin (5).

5. The server cooling rack according to claim 1, wherein: The infusion outlet is connected to the medium inlet (22) via an infusion pipeline (7), and a nozzle (71) connected to the infusion pipeline (7) is provided on the side of the medium inlet (22) facing the second cavity (21), and the nozzle (71) is used to spray the cooling medium (12) toward the server (0).

6. The server cooling rack according to claim 5, characterized in that: A plurality of supporting bosses (24) are provided in the second cavity (21), the server (0) is mounted on the supporting bosses (24), gaps (241) are formed between adjacent supporting bosses (24), and the cooling medium (12) is sprayed onto the surface of the server (0) through the gaps (241); Alternatively, a support plate is provided in the second cavity (21), the server (0) is mounted on the support plate, a through hole is provided on the support plate, and the cooling medium (12) is sprayed onto the surface of the server (0) through the through hole.

7. The server cooling rack according to any one of claims 1 to 6, characterized in that: The cooling medium (12) comprises at least 60%-75% of a fluorinated liquid, 15%-25% of a disinfectant, 2%-8% of a nanoparticle, 0.5%-2% of a corrosion inhibitor, and 0.5%-1.5% of a defoaming agent. The fluorinated liquid includes a fluorocarbon, the disinfectant includes at least one of ethanol or isopropyl alcohol, the nanoparticles include at least one of aluminum oxide nanoparticles or copper oxide nanoparticles, the corrosion inhibitor includes benzotriazole, and the defoaming agent includes polydimethylsiloxane.

8. The server cooling rack according to any one of claims 1 to 6, characterized in that: The frame body (1) comprises a shell (13) and a cover (14) arranged on the shell (13); a buckle (131) is provided on the shell (13); a buckle fitting piece (141) is provided on the cover (14); the buckle (131) is engaged with the buckle fitting piece (141); and a sealing piece is provided between the shell (13) and the cover (14).

9. The server cooling rack according to claim 8, wherein: The shell (13) and the cover (14) are both made of stainless steel, and the inner side walls of the shell (13) and the cover (14) facing the first cavity (11) are coated with an epoxy resin coating, and the sealing member is made of silicone material.

10. The server cooling rack according to any one of claims 1 to 6, characterized in that: A liquid inlet joint (15) and a liquid discharge joint (16) are provided on the frame body (1), and both the liquid inlet joint (15) and the liquid discharge joint (16) are in communication with the first cavity (11).

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