A size optimization method and system for a power supply device

Abstract

The present invention relates to the field of electrical digital data processing technology, and discloses a size optimization method and system for a power transfer device. By obtaining the initial connection lines and heat flux density of each sub-area of ​​the power transfer device, high heat flux areas and circuits to be switched are accurately located, thereby achieving balanced current distribution and improved heat dissipation performance, thereby optimizing the size of the power transfer device, and effectively solving the problem in the prior art of redundant heat dissipation area of ​​the device due to unreasonable current distribution, which in turn leads to excessive device size.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical digital data processing, and in particular to a size optimization method and system for a power supply device. Background Art

[0002] With the rapid development of smart grids and the continuous growth of electricity demand, higher requirements are placed on the performance and size of power transfer devices. The existing size optimization method of power transfer devices is achieved by performing electromagnetic analysis on the lines.

[0003] In the current existing technology, the power supply device exists as an emergency power supply or compensation power supply. Its installation environment is diverse, the operating tasks are uncertain, and some on-site environments have obvious space constraints. In addition, the device will generate a large amount of heat during operation. To ensure heat dissipation safety, the equipment needs to reserve a large cavity space, resulting in the overall size of the equipment being large and poor flexibility. Therefore, there is a problem of redundant heat dissipation area of ​​the equipment due to unreasonable current distribution, which in turn leads to the problem of excessive device size. Summary of the Invention

[0004] The present invention provides a size optimization method and system for a power transfer device, which solves the technical problem in the prior art of redundant heat dissipation area of ​​the device due to unreasonable current distribution, thereby causing the device to be too large in size, and realizes the optimization of the device size of the power transfer device.

[0005] A first aspect of the present invention provides a size optimization method for a power transfer device, comprising:

[0006] When the power supply device receives the working signal, it performs line connection according to the preset line connection method to obtain each initial connection line;

[0007] Acquire thermal energy of the power supply device in different zones, and determine the circuits to be switched from the initial connection lines according to the acquisition results of the thermal energy of the different zones;

[0008] Calculating the circuit movement analysis value of each of the circuits to be switched, and selecting the circuit to be switched corresponding to the maximum circuit movement analysis value as the circuit to be moved;

[0009] Acquiring each convertible circuit of the circuit to be moved, calculating a circuit conversion feasible value of each of the convertible circuits, and performing circuit conversion adjustment according to the circuit conversion feasible value;

[0010] Conduct heat flux improvement analysis on the high heat flux area after circuit conversion adjustment, and determine whether to perform secondary circuit conversion adjustment based on the heat flux improvement judgment result;

[0011] When the heat flux improvement determination result is to perform secondary circuit conversion adjustment, calculating the effective heat flux density adjustment ratio of the high heat flux area after the secondary circuit conversion adjustment;

[0012] When the heat flux improvement determination result is that the secondary circuit conversion adjustment is not performed, calculating the effective heat flux density adjustment ratio of the high heat flux area after the circuit conversion adjustment;

[0013] The size of the power supply device is optimized according to the effective heat flux density adjustment ratio.

[0014] Optionally, the performing partitioned thermal energy acquisition on the power transfer device and determining each circuit to be switched from each of the initial connection lines according to the partitioned thermal energy acquisition result includes:

[0015] Dividing the power supply device into regions to obtain sub-regions;

[0016] Obtaining the heat flux density of the sub-region;

[0017] Sorting the heat flux densities in descending order to obtain a descending order of heat flux density;

[0018] Marking the subregion corresponding to the maximum heat flux density in the descending order of the heat flux density as a high heat flux region;

[0019] A plurality of initially connected circuits corresponding to the high heat flux area are obtained and marked as circuits to be switched.

[0020] Optionally, calculating the circuit movement analysis value of each of the circuits to be switched, and selecting the circuit to be switched corresponding to the maximum circuit movement analysis value as the circuit to be moved, includes:

[0021] Obtaining circuit movement analysis parameters of each circuit to be switched;

[0022] Obtaining a circuit movement analysis lower limit set preset in a database, and performing proportional analysis on the circuit movement analysis parameters of each circuit to be switched to obtain a proportional analysis result;

[0023] Based on the proportional analysis results, corresponding weighting factors are introduced to perform coupling processing to obtain circuit movement analysis values ​​of each circuit to be switched;

[0024] Based on the comparison of the circuit movement analysis values ​​of the circuits to be switched, the circuit to be switched corresponding to the maximum circuit movement analysis value is selected as the circuit to be moved.

[0025] Optionally, the acquiring of each convertible circuit of the circuit to be moved, calculating a circuit conversion feasible value of each convertible circuit, and performing circuit conversion adjustment according to the circuit conversion feasible value includes:

[0026] Acquire each convertible circuit of the circuit to be moved;

[0027] Obtaining feasibility parameters of each of the convertible circuits;

[0028] Obtaining a feasibility reference set preset in a database, and performing a proportional analysis with the feasibility parameters of each of the convertible circuits to obtain a proportional analysis result;

[0029] Based on the ratio analysis result, corresponding weighting factors are introduced to perform coupling processing to obtain a circuit conversion feasible value of each of the convertible circuits;

[0030] Based on the comparison of the circuit conversion feasible values ​​of the convertible circuits, the convertible circuit corresponding to the maximum circuit conversion feasible value is marked as the conversion circuit;

[0031] The current of the circuit to be moved is transferred to the conversion circuit.

[0032] Optionally, performing heat flux improvement determination analysis on the high heat flux area after the circuit conversion adjustment, and determining whether to perform secondary circuit conversion adjustment according to the heat flux improvement determination result, includes:

[0033] Obtaining heat flux density change parameters of the high heat flux area after circuit conversion adjustment;

[0034] Wherein, the heat flux density change parameter includes the heat flux density change amount and the heat flux density change ratio;

[0035] Obtaining a preset lower limit set of heat flux density changes in a database, and performing a proportional analysis with the heat flux density change parameter to obtain a change ratio analysis result;

[0036] Based on the change ratio analysis result, a corresponding weighting factor is introduced to perform coupling processing to obtain a heat flux density change adjustment effect value;

[0037] Obtaining a heat flux density change threshold and a heat flux density change adjustment effect threshold preset in a database;

[0038] obtaining a heat flux improvement determination result based on a comparison between the heat flux density change amount and the heat flux density change threshold, and based on a comparison between the heat flux density change adjustment effect value and the heat flux density change adjustment effect threshold;

[0039] If the heat flux density change is greater than the heat flux density change threshold, and the heat flux density change adjustment effect value is greater than the heat flux density change adjustment effect threshold, then the heat flux improvement judgment result is that the heat flux improvement judgment is qualified, and the corresponding secondary circuit conversion adjustment is not performed; otherwise, the corresponding secondary circuit conversion adjustment is performed.

[0040] Optionally, the secondary circuit conversion adjustment includes:

[0041] Sorting the circuit conversion feasible values ​​of the convertible circuits in descending order to obtain a descending order of feasible values;

[0042] The secondary circuits of the convertible circuits are adjusted in sequence according to the descending order of the feasible values ​​until the heat flux improvement determination result is that the heat flux improvement determination is qualified.

[0043] Optionally, the process of calculating the effective heat flux density adjustment ratio includes:

[0044] Obtaining a change in line current in a high heat flux area within a preset period after circuit conversion adjustment or secondary circuit conversion adjustment, and analyzing to obtain a theoretical change in heat flux density in the high heat flux area within the preset period after circuit conversion adjustment or secondary circuit conversion adjustment;

[0045] Obtaining an actual change in heat flux density in a high heat flux area within a preset time period after a circuit conversion adjustment or a secondary circuit conversion adjustment;

[0046] The effective heat flux density adjustment ratio is obtained by performing a ratio operation on the theoretical change in heat flux density and the actual change in heat flux density.

[0047] Optionally, optimizing the size of the power supply device according to the effective heat flux density adjustment ratio includes:

[0048] Obtaining each effective heat flux density adjustment ratio interval preset in the database and a reference power supply device size scaling factor corresponding to each effective heat flux density adjustment ratio interval, and comparing them with the effective heat flux density adjustment ratio;

[0049] If the effective heat flux density adjustment ratio is within a certain interval, obtaining a reference power supply device size scaling factor corresponding to the interval as a first size reduction ratio of the power supply device;

[0050] Obtain the electromagnetic interference intensity change amount and electromagnetic interference intensity change ratio in the high heat flux area after the circuit conversion adjustment or the secondary circuit conversion adjustment, and analyze and obtain the electromagnetic interference influence coefficient;

[0051] Obtaining a second size reduction ratio of the power supply device based on matching the electromagnetic interference influence coefficient with a database;

[0052] Performing a coupling analysis based on the first size reduction ratio of the power transfer device and the second size reduction ratio of the power transfer device to obtain a size reduction ratio of the power transfer device;

[0053] Obtaining initial size parameters of the power supply device;

[0054] Reducing the initial size parameters of the transfer power supply device based on the size reduction ratio of the transfer power supply device to obtain new size parameters of the transfer power supply device;

[0055] The size of the power supply device is optimized using the newly set size parameters.

[0056] Optionally, it also includes:

[0057] Obtain the wind speed of the heat dissipation device in the power supply device before the circuit conversion adjustment or the secondary circuit conversion adjustment, and mark it as the initial wind speed;

[0058] Obtaining an initial volume change of the power transfer device;

[0059] Based on the initial volume change of the power transfer device and the size reduction ratio of the power transfer device, an impact value of the size of the power transfer device is analyzed and obtained;

[0060] Obtaining the size impact value intervals of each power supply device preset in the database and the reference wind speed adjustment ratio corresponding to each size impact value interval of the power supply device, and comparing them with the size impact value of the power supply device;

[0061] If the size impact value of the power supply device is within a certain interval, obtaining a reference wind speed adjustment ratio corresponding to the interval as the wind speed adjustment ratio;

[0062] The initial wind speed is enhanced and adjusted based on the wind speed adjustment ratio to obtain the adjusted execution wind speed of the heat dissipation device in the power supply device.

[0063] A second aspect of the present invention provides a size optimization system for a power transfer device, comprising:

[0064] An initial connection line acquisition module is used to perform line connection according to a preset line connection method after the power supply device receives a working signal, and obtain each initial connection line;

[0065] A regional analysis module, configured to obtain thermal energy of the power supply device in a zoned manner, and determine each circuit to be switched from each of the initial connection lines according to the zoned thermal energy acquisition result;

[0066] a circuit-to-be-moved judging module, configured to calculate a circuit movement analysis value of each circuit to be switched, and select a circuit to be switched corresponding to a maximum circuit movement analysis value as the circuit to be switched;

[0067] a circuit conversion adjustment module, configured to obtain each convertible circuit of the circuit to be moved, calculate a circuit conversion feasible value of each of the convertible circuits, and perform circuit conversion adjustment according to the circuit conversion feasible value;

[0068] An improvement result determination module is used to perform heat flux improvement determination analysis on the high heat flux area after the circuit conversion adjustment, and determine whether to perform secondary circuit conversion adjustment based on the heat flux improvement determination result;

[0069] a first processing module, configured to calculate an effective heat flux density adjustment ratio of the high heat flux area after the secondary circuit conversion adjustment when the heat flux improvement determination result is to perform a secondary circuit conversion adjustment;

[0070] a second processing module, configured to calculate an effective heat flux density adjustment ratio of the high heat flux area after the circuit conversion adjustment when the heat flux improvement determination result is that the secondary circuit conversion adjustment is not performed;

[0071] The size optimization module is used to calculate the effective heat flux density adjustment ratio of the high heat flux area after circuit conversion adjustment, and optimize the size of the power supply device according to the effective heat flux density adjustment ratio.

[0072] It can be seen from the above technical solutions that the present invention has the following advantages:

[0073] In the present invention, firstly, by obtaining the initial connection lines of the power transfer device and the heat flux density of each sub-region, the high heat flux area and the circuit to be switched are accurately located, thereby achieving balanced current distribution and improved heat dissipation performance, thereby achieving optimization of the device size of the power transfer device, and effectively solving the problem of redundant heat dissipation area of ​​the equipment caused by unreasonable current distribution in the prior art, thereby causing the device size to be too large; secondly, by analyzing the circuit movement analysis parameters of each circuit to be switched, the circuit movement analysis value of each circuit to be switched is obtained, thereby accurately identifying the circuit to be moved in the high heat flux area, thereby achieving accurate migration of the high-load circuit, and effectively avoiding local overheating caused by current concentration; finally, By comprehensively evaluating the feasibility parameters of the convertible circuit, the feasible value of the circuit conversion is determined, and the current of the circuit to be moved is transferred to the conversion circuit to complete the circuit conversion adjustment, thereby achieving high efficiency and reliability of the circuit conversion, effectively preventing local circuit overheating caused by improper circuit conversion, and ensuring the stable operation of the power transfer device; at the same time, after the size of the power transfer device is optimized, the size impact value of the power transfer device is obtained by analyzing the initial volume change of the power transfer device and the size reduction ratio of the power transfer device, thereby dynamically adjusting the execution wind speed of the heat dissipation device in the power transfer device, thereby achieving effective heat dissipation of the power transfer device, and effectively solving the problem of limiting size reduction due to heat dissipation and electromagnetic interference problems in the existing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0074] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0075] Figure 1 A flowchart of the steps of a size optimization method for a power transfer device provided in the first embodiment of the present invention;

[0076] Figure 2 A macroscopic flow chart of a size optimization method for a power transfer device provided in the first embodiment of the present invention;

[0077] Figure 3 A flowchart of the steps of a size optimization method for a power transfer device provided in the second embodiment of the present invention;

[0078] Figure 4 A detailed flow chart of a size optimization method for a power transfer device provided in the second embodiment of the present invention;

[0079] Figure 5 This is a structural block diagram of a size optimization system for a power transfer device provided in Example 3 of the present invention. DETAILED DESCRIPTION

[0080] The embodiments of the present invention provide a size optimization method and system for a power supply device, which are used to solve the technical problem in the prior art of excessive device size caused by redundant heat dissipation area of ​​the device due to unreasonable current distribution.

[0081] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0082] See also Figure 1 , Figure 1 This is a flowchart of the steps of a size optimization method for a power transfer device provided in Example 1 of the present invention.

[0083] The present invention provides a size optimization method for a power supply device, comprising:

[0084] Step 101: After receiving a working signal, the power supply device performs line connection according to a preset line connection method to obtain initial connection lines.

[0085] A power transfer device refers to a collection of electrical equipment or components in a power system that is used to transfer electrical energy from the main power source to other loads or subsystems through specific lines.

[0086] The preset line connection method refers to the power transmission path rules or topology structure that are pre-set according to system design requirements before the power supply device is put into operation.

[0087] The initial connection line refers to the power transmission path formed when the power supply device completes the first connection according to the preset connection method after receiving the working signal. This line is the default working line during the system startup or initialization phase.

[0088] In an embodiment of the present invention, when the power transfer device receives a working signal, it obtains the current to be outputted, thereby performing line connection according to a preset line connection method, establishing each initial connection line, and forming a basic power supply path.

[0089] Step 102: Acquire thermal energy of each partition of the power supply device, and determine each circuit to be switched from each initial connection line according to the acquisition result of the thermal energy of each partition.

[0090] Partitioned thermal energy acquisition refers to the process of first dividing the power supply device into zones and then obtaining the heat flux density within each zone. Heat flux density refers to the amount of heat energy passing through a unit area per unit time, and is measured in W / m².

[0091] The partitioned thermal energy acquisition result refers to the heat flux density of each partitioned area obtained through the partitioned thermal energy acquisition operation.

[0092] The circuits to be switched refer to a set of circuits determined to require switching based on the partitioned thermal energy acquisition results. Specifically, based on the heat flux density of the partitioned areas, high heat flux areas and the associated circuits to be switched that require switching are screened from multiple partitioned areas.

[0093] In an embodiment of the present invention, the power supply device is divided into regions to obtain sub-regions, and the heat flux density of each sub-region is obtained. Subsequently, based on the heat flux density analysis, the heat load concentration area (i.e., the high heat flux area) is identified, and the circuits to be switched associated with it are determined.

[0094] Step 103 : Calculate the circuit movement analysis value of each circuit to be switched, and select the circuit to be switched corresponding to the maximum circuit movement analysis value as the circuit to be moved.

[0095] The circuit mobility analysis value is a comprehensive indicator that quantifies the priority of circuits to be switched, using multi-dimensional weighted calculations based on the circuit mobility analysis parameters of each circuit to be switched. This value measures the urgency of switching (moving to an alternate path) due to thermal anomalies or operational risks, and serves as the core basis for automated decision-making in power transfer devices.

[0096] In the embodiment of the present invention, the circuit movement analysis parameters of each circuit to be switched are acquired, and the circuit movement analysis values ​​of each circuit to be switched are obtained by analysis, thereby obtaining the circuit to be moved.

[0097] Step 104 : Acquire each convertible circuit of the circuit to be moved, calculate the circuit conversion feasible value of each convertible circuit, and perform circuit conversion adjustment according to the circuit conversion feasible value.

[0098] A convertible circuit refers to a backup line or redundant path in a power supply device that can serve as a switching target for the circuit to be moved.

[0099] The circuit conversion feasibility value refers to obtaining the feasibility parameters of each convertible circuit and quantitatively evaluating the comprehensive parameters of the convertible circuit adaptability through weighted calculation of multi-dimensional indicators. The circuit conversion feasibility value is used to measure the feasibility of switching the circuit to be moved to the target convertible circuit and is the core basis for circuit conversion decisions.

[0100] In an embodiment of the present invention, each convertible circuit of the circuit to be moved is obtained, a feasibility parameter of each convertible circuit is obtained, and a circuit conversion feasibility value of each convertible circuit is obtained by analysis, thereby performing circuit conversion adjustment.

[0101] Step 105 : performing heat flux improvement determination analysis on the high heat flux area after the circuit conversion adjustment, and determining whether to perform secondary circuit conversion adjustment based on the heat flux improvement determination result.

[0102] The high heat flux area refers to the local area with the highest heat flux density in the power supply device.

[0103] Heat flux improvement analysis refers to the systematic thermal management effectiveness evaluation process for high heat flux areas after circuit conversion adjustments. Its core purpose is to quantify the change in heat flux density parameters, combined with preset thresholds and weighted coupling analysis, to determine whether the current circuit adjustment has effectively improved the heat flux distribution, and then determine whether secondary circuit conversion adjustments are necessary.

[0104] Secondary circuit conversion adjustment refers to targeted circuit optimization based on the feasibility assessment results of the convertible circuit when the heat flux improvement analysis determines that the current circuit conversion adjustment has not achieved the expected results. Its core is to gradually adjust the circuit connection or layout by quantifying the feasible values ​​to achieve further improvement in heat flux distribution.

[0105] In an embodiment of the present invention, a heat flux density change parameter of a high heat flux area after circuit conversion adjustment is obtained, and a heat flux improvement determination result is obtained by analysis, thereby determining whether to perform corresponding secondary circuit conversion adjustment.

[0106] Step 106 : When the heat flux improvement determination result is to perform secondary circuit conversion adjustment, the effective heat flux density adjustment ratio of the high heat flux area after the secondary circuit conversion adjustment is calculated.

[0107] Step 107 : When the heat flux improvement judgment result is that the secondary circuit conversion adjustment is not performed, the effective heat flux density adjustment ratio of the high heat flux area after the circuit conversion adjustment is calculated.

[0108] Step 108: Optimize the size of the power supply device according to the effective heat flux density adjustment ratio.

[0109] The effective heat flux density adjustment ratio refers to a key parameter used to quantify the degree to which the actual improvement in heat flux density in the high heat flux area after circuit conversion adjustment matches the theoretically expected improvement.

[0110] In an embodiment of the present invention, the theoretical change in heat flux density and the actual change in heat flux density in the high heat flux area after circuit conversion adjustment or secondary circuit conversion adjustment are obtained, and the effective heat flux density adjustment ratio is analyzed to perform size optimization of the power supply device.

[0111] See also Figure 2 , Figure 2 This is a macroscopic flow chart of a size optimization method for a power transfer device provided in a first embodiment of the present invention. After receiving a working signal, each initial connection line is first established to form a basic power supply path. Subsequently, based on heat flux density analysis, the heat load concentration area is identified, and the circuits to be switched associated therewith are determined. The circuits to be moved are further screened out, thereby performing circuit conversion adjustment, and analyzing the heat flux improvement judgment result to determine whether it is qualified. If qualified, the corresponding secondary circuit conversion adjustment is not performed; if unqualified, the corresponding secondary circuit conversion adjustment is performed, and after the adjustment, the size optimization of the power transfer device is performed. After the size optimization adjustment is completed, the wind speed of the heat dissipation device in the power transfer device is adjusted to complete the adjustment.

[0112] In the present invention, firstly, by obtaining the initial connection lines of the power transfer device and the heat flux density of each sub-region, the high heat flux area and the circuit to be switched are accurately located, thereby achieving balanced current distribution and improved heat dissipation performance, thereby achieving optimization of the device size of the power transfer device, and effectively solving the problem of redundant heat dissipation area of ​​the equipment caused by unreasonable current distribution in the prior art, thereby causing the device size to be too large; secondly, by analyzing the circuit movement analysis parameters of each circuit to be switched, the circuit movement analysis value of each circuit to be switched is obtained, thereby accurately identifying the circuit to be moved in the high heat flux area, thereby achieving accurate migration of the high-load circuit, and effectively avoiding local overheating caused by current concentration; finally, By comprehensively evaluating the feasibility parameters of the convertible circuit, the feasible value of the circuit conversion is determined, and the current of the circuit to be moved is transferred to the conversion circuit to complete the circuit conversion adjustment, thereby achieving high efficiency and reliability of the circuit conversion, effectively preventing local circuit overheating caused by improper circuit conversion, and ensuring the stable operation of the power transfer device; at the same time, after the size of the power transfer device is optimized, the size impact value of the power transfer device is obtained by analyzing the initial volume change of the power transfer device and the size reduction ratio of the power transfer device, thereby dynamically adjusting the execution wind speed of the heat dissipation device in the power transfer device, thereby achieving effective heat dissipation of the power transfer device, and effectively solving the problem of limiting size reduction due to heat dissipation and electromagnetic interference problems in the existing technology.

[0113] See also Figure 3 , Figure 3 This is a flowchart of the steps of a size optimization method for a power transfer device provided in the second embodiment of the present invention.

[0114] The present invention provides a size optimization method for a power supply device, comprising:

[0115] Step 201: After receiving the working signal, the power supply device performs line connection according to a preset line connection method to obtain initial connection lines.

[0116] In the embodiment of the present invention, the specific implementation process of step 201 is similar to that of step 101 and will not be repeated here.

[0117] Step 202: Acquire thermal energy of each partition of the power supply device, and determine each circuit to be switched from each initial connection line according to the acquisition result of the thermal energy of each partition.

[0118] Furthermore, step 202 may include the following sub-steps:

[0119] S11. Divide the power supply device into regions to obtain sub-regions.

[0120] S12. Obtain the heat flux density of the sub-region.

[0121] S13. Sort the heat flux densities in descending order to obtain a descending order of the heat flux densities.

[0122] S14. Mark the sub-region corresponding to the maximum heat flux density in the descending order of heat flux density as a high heat flux region.

[0123] S15. Acquire multiple initial connection circuits corresponding to the high heat flux area and mark them as circuits to be switched.

[0124] In this embodiment of the present invention, the power supply device is divided into sub-regions. The heat flux density of each sub-region is obtained and sorted in descending order. The sub-region corresponding to the maximum heat flux density is marked as a high heat flux region, thereby accurately locating the heat dissipation bottleneck within the device. By obtaining the initial connection circuit corresponding to the high heat flux region and marking it as the circuit to be switched, a clear target is provided for subsequent current migration and heat dissipation optimization, thereby achieving precise management of key heat dissipation areas, effectively solving the problem of low heat dissipation efficiency caused by inaccurate heat dissipation region identification in the prior art.

[0125] Step 203 : Calculate the circuit movement analysis value of each circuit to be switched, and select the circuit to be switched corresponding to the maximum circuit movement analysis value as the circuit to be moved.

[0126] Furthermore, step 203 may include the following sub-steps:

[0127] S21. Obtain circuit movement analysis parameters of each circuit to be switched.

[0128] S22 , obtaining a circuit movement analysis lower limit set preset in a database, and performing proportional analysis on the circuit movement analysis parameters of each circuit to be switched to obtain a proportional analysis result.

[0129] S23. Based on the proportional analysis result, corresponding weighting factors are introduced to perform coupling processing to obtain circuit movement analysis values ​​of each circuit to be switched.

[0130] S24 , comparing the circuit movement analysis values ​​of the circuits to be switched, and selecting the circuit to be switched corresponding to the maximum circuit movement analysis value as the circuit to be moved.

[0131] In an embodiment of the present invention, circuit movement analysis parameters of each circuit to be switched are obtained, and the circuit movement analysis parameters include the number of programmable wires, current load rate, power utilization rate and power loss density; a circuit movement analysis lower limit set preset in a database is obtained, and a proportional analysis is performed with the circuit movement analysis parameters of each circuit to be switched to obtain a proportional analysis result, and a corresponding weighting factor is introduced based on the proportional analysis result for coupling processing to obtain a circuit movement analysis value of each circuit to be switched; based on the circuit movement analysis values ​​of each circuit to be switched, a comparison is made, and the circuit to be switched corresponding to the maximum circuit movement analysis value is used as the circuit to be moved; the circuit movement analysis lower limit set includes a lower limit value of the number of programmable wires, a lower limit value of the current load rate, a lower limit value of the power utilization rate and a lower limit value of the power loss density.

[0132] In practice, the number of programmable wires refers to the number of wires in a circuit that can be flexibly adjusted and reallocated (the number of alternative circuits to be switched). The current load factor represents the ratio of actual current to rated current. The power loss density refers to the power loss per unit volume, reflecting the heat generation of the circuit. Circuit movement analysis parameters (including the number of programmable wires, current load factor, power utilization, and power loss density) can be retrieved through a backend management system. This backend management system is connected to the actual terminal devices on the circuit, which can then measure these parameters.

[0133] The circuit mobility analysis values ​​for each circuit to be switched are obtained by analyzing the circuit mobility analysis parameters. These parameters influence each other. For example, a large number of programmable wires can redistribute current to more wires, reducing the current load factor of the existing wires. A high current load factor increases power utilization and power loss density because more current flows through the circuit, resulting in increased power consumption and heat generation. A high power loss density reduces power utilization because more power is converted into heat rather than used for useful work.

[0134] In a specific implementation, to facilitate the implementation of the method, the above process can be converted into a formula encapsulation form, wherein the circuit movement analysis value of each circuit to be switched can be calculated as follows:

[0135]

[0136] Where, Indicates the Circuit movement analysis value of the circuit to be switched, Indicates the number of the circuit to be switched, , represents the total number of circuits to be switched, Indicates the The number of programmed wires per circuit to be switched, Indicates the lower limit of the number of programmable wires, Indicates the The current load rate of the circuit to be switched, Indicates the lower limit of the current load rate, Indicates the The power utilization of the circuit to be switched, Indicates the lower limit of power utilization, Indicates the The power loss density of the circuit to be switched, Indicates the lower limit of power loss density, represents the weighting factor for the number of programmed wires, represents the current load rate weighting factor, represents the power utilization weighting factor, represents the power loss density weighting factor.

[0137] It should be noted that in the calculation formula of the circuit movement analysis value of the circuit to be switched, each indicator is dimensionless before being substituted into the calculation. Specifically, for the number of programming wires, the dimensionless processing method is: ,in, Indicates the lower limit of the programmable number of wires. This method converts the number of programmable wires with physical units (roots) into dimensionless values. Similarly, the current load rate, power utilization rate, and power loss density are all dimensionlessly processed and become dimensionless values.

[0138] The weighting factor is a dimensionless value determined based on the importance of each metric in circuit motion analysis. It is used to perform a weighted summation of the dimensionless metrics. Since each metric is dimensionless before being substituted into the formula, and the weighting factor itself is also dimensionless, both sides of the formula are dimensionless, meeting the dimensional consistency requirement.

[0139] It should be noted that the programming wire quantity weighting factor, current load rate weighting factor, power utilization rate weighting factor and power loss density weighting factor can be obtained from the database. For example, the programming wire quantity weighting factor can be obtained by obtaining the historical programming wire quantity stored in the database, and the programming wire quantity weighting factor corresponding to the historical programming wire quantity, thereby constructing a programming wire quantity mapping set, wherein there is a one-to-one or many-to-one correspondence in the mapping set. The programming wire quantity weighting factor can be obtained by inputting the required programming wire quantity data into the programming wire quantity mapping set. The acquisition method of other weighting factors is the same as the acquisition method of the programming wire quantity weighting factor, and can all be matched in the corresponding mapping set, wherein the current load rate weighting factor corresponds to the current load rate mapping set, the power utilization rate weighting factor corresponds to the power utilization mapping set, and the power loss density weighting factor corresponds to the power loss density mapping set.

[0140] By analyzing the circuit movement analysis parameters of each circuit to be switched, the circuit movement analysis value of each circuit to be switched is obtained, taking into account the mutual influence relationship between these parameters. For example, the number of programmable wires provides flexibility for current distribution, affecting the current load rate, and thus affecting the power utilization rate and power loss density. A large number of programmable wires and flexible current distribution can effectively reduce the current load rate, reduce the power loss density, and improve power utilization. A high current load rate also increases the power utilization rate and power loss density, increasing the risk of circuit heating. A high power loss density further exacerbates heating. The higher the current load rate, the lower the power utilization rate, and the greater the power loss density, the greater the risk of heating, and therefore the more necessary it is to perform circuit transfer.

[0141] By obtaining the circuit movement analysis parameters (including the number of programmable wires, current load factor, power utilization, and power loss density) for each circuit to be switched and sorting them in descending order, the initial connection circuits in high heat flux areas most in need of current migration—that is, the circuits with the greatest impact on heat flux—can be precisely identified and migrated. By comprehensively considering the impact of multiple parameters, the migration potential of each circuit can be more accurately assessed, avoiding misjudgments caused by the limitations of a single metric. Based on the comparison of the circuit movement analysis values ​​of each circuit to be switched, the circuit with the highest circuit movement analysis value is selected as the circuit to be migrated. The optimal circuit corresponding to the circuit to be migrated is then selected for migration, ensuring more balanced current distribution after migration and reducing the risk of local overload and overheating. Optimizing current distribution reduces energy loss and improves device operating efficiency. Furthermore, reducing heat flux density reduces equipment failures caused by overheating and improves device reliability.

[0142] Step 204 : Acquire each convertible circuit of the circuit to be moved, calculate the circuit conversion feasible value of each convertible circuit, and perform circuit conversion adjustment according to the circuit conversion feasible value.

[0143] Furthermore, step 204 may include the following sub-steps:

[0144] S31. Acquire each convertible circuit of the circuit to be moved.

[0145] S32. Obtain feasibility parameters of each convertible circuit.

[0146] S33. Obtain a feasibility reference set preset in a database, and perform a proportional analysis with the feasibility parameters of each convertible circuit to obtain a proportional analysis result.

[0147] S34. Based on the proportional analysis results, corresponding weighting factors are introduced to perform coupling processing to obtain circuit conversion feasible values ​​of each convertible circuit.

[0148] S35 . Compare the circuit conversion feasibility values ​​of the convertible circuits and mark the convertible circuit corresponding to the maximum circuit conversion feasibility value as the conversion circuit.

[0149] S36. Transfer the current of the circuit to be moved to the conversion circuit.

[0150] In an embodiment of the present invention, each convertible circuit of the circuit to be moved is obtained; the feasibility parameters of each convertible circuit are obtained, and the feasibility parameters include rated current, residual current capacity, resistance value and thermal impedance; a feasibility reference set preset in a database is obtained, and a proportional analysis is performed with the feasibility parameters of each convertible circuit to obtain a proportional analysis result, and a corresponding weighting factor is introduced based on the proportional analysis result for coupling processing to obtain a circuit conversion feasible value of each convertible circuit; the feasibility reference set includes a rated current lower limit value, a residual current capacity lower limit value, a resistance reference value and a thermal impedance reference value; based on the comparison of the circuit conversion feasible values ​​of each convertible circuit, the convertible circuit corresponding to the maximum circuit conversion feasible value is marked as a conversion circuit, thereby transferring the current of the circuit to be moved to the conversion circuit to complete the circuit conversion adjustment.

[0151] In practice, residual current capacity indicates the amount of additional current a circuit can carry. It's equal to the rated current minus the actual current, reflecting the circuit's remaining load capacity. Thermal impedance indicates the degree to which a material or component hinders heat transfer. A higher thermal impedance reduces heat dissipation efficiency, leading to higher circuit temperatures.

[0152] The feasibility parameters of each convertible circuit (including rated current, residual current capacity, resistance value and thermal impedance) can be obtained and analyzed through the background management system. The background management system is connected to the terminal equipment on the actual line, and the terminal equipment can measure and detect each line and conduct statistics.

[0153] In a specific implementation, to facilitate the implementation of the method, the above process can be converted into a formula encapsulation form, wherein the calculation method of the circuit conversion feasible value of each convertible circuit can be as follows:

[0154]

[0155] Where, Indicates the The circuit conversion feasible value of the convertible circuit, Indicates the number of the convertible circuit, , represents the total number of switchable circuits, Indicates the Rated current of a switchable circuit, Indicates the lower limit of rated current, Indicates the The residual current capacity of a convertible circuit, Indicates the lower limit of the residual current capacity. Indicates the The resistance value of a convertible circuit, Indicates the resistance reference value, Indicates the The thermal impedance of a switchable circuit, Indicates the thermal impedance reference value, represents the rated current weighting factor, represents the residual current capacity weighting factor, represents the resistance value weighting factor, Represents the thermal impedance weighting factor.

[0156] It should be noted that in the calculation formula of the circuit conversion feasible value of the convertible circuit, each indicator is dimensionless before being substituted into the calculation. Specifically, for the rated current, the dimensionless processing method is: ,in, Indicates the lower limit of the rated current. This converts the rated current in physical units (amperes) into dimensionless values. Similarly, the residual current capacity, resistance value, and thermal impedance are all dimensionlessly converted to dimensionless values.

[0157] The weighting factor is a dimensionless value determined based on the importance of each indicator in the circuit conversion feasibility analysis. It is used to perform a weighted summation of the dimensionless indicators. Since each indicator has been dimensionless before being substituted into the formula, and the weighting factor itself is also a dimensionless value, both sides of the formula are dimensionless, meeting the dimensional consistency requirement.

[0158] It should be noted that the rated current weighting factor, residual current capacity weighting factor, resistance value weighting factor and thermal impedance weighting factor can be obtained from the database. For example, the rated current weighting factor can be obtained by obtaining the historical rated current stored in the database, and the rated current weighting factor corresponding to the historical rated current, thereby constructing a rated current mapping set, wherein there is a one-to-one or many-to-one correspondence in the mapping set. The rated current weighting factor can be obtained by inputting the rated current data to be used into the rated current mapping set. The acquisition method of other weighting factors is the same as the acquisition method of the rated current weighting factor, and can all be matched in the corresponding mapping set, wherein the residual current capacity corresponds to the residual current capacity mapping set, the resistance value weighting factor corresponds to the resistance value mapping set, and the thermal impedance weighting factor corresponds to the thermal impedance mapping set.

[0159] By analyzing the feasibility parameters of each convertible circuit, the feasibility value of each circuit is determined. This takes into account the interplay between these parameters. For example, the rated current determines the circuit's maximum safe current-carrying capacity, while the residual current capacity reflects the available current margin under the circuit's current load. Its value is directly affected by the rated current and the actual current. The larger the residual current capacity, the greater the circuit's ability to withstand additional loads. The resistance value affects the current magnitude and power loss. Higher resistance limits current and increases heat generation, while lower resistance allows greater current flow while reducing energy loss. Thermal impedance determines the efficiency with which heat is transferred from the heating element to the heat sink, and together with the resistance value, it influences the thermal stability of the circuit. Higher resistance generates more heat, requiring more efficient heat dissipation (i.e., lower thermal impedance) to maintain temperature stability.

[0160] By comprehensively evaluating the feasibility parameters of the diverter circuit (rated current, residual current capacity, resistance, and thermal impedance), the optimal circuit for receiving the diverted current can be precisely identified. This approach avoids blind selection, which can lead to current overload or insufficient heat dissipation. For example, selecting the circuit with the highest diverter feasibility value ensures sufficient residual current capacity to accommodate the additional current. Its low resistance and thermal impedance reduce power loss and heat generation, thus ensuring safe operation of the circuit after current diversion and preventing excessive heat generation due to high current density in certain circuits. By diverting current to a circuit with higher performance and lower current load, the heat load on the original circuit is reduced, resulting in more uniform heat distribution, reducing the risk of overheating in the original circuit. This also improves the thermal management efficiency of the entire device and helps maintain stable operation. By selecting the most appropriate diverter circuit for current diversion, current distribution within the device is optimized, energy loss is reduced, and power transmission efficiency is improved.

[0161] Step 205 : performing heat flux improvement determination analysis on the high heat flux area after the circuit conversion adjustment, and determining whether to perform secondary circuit conversion adjustment based on the heat flux improvement determination result.

[0162] Furthermore, step 205 may include the following sub-steps:

[0163] S41, obtaining a heat flux density change parameter of the high heat flux area after circuit conversion adjustment;

[0164] The heat flux density change parameters include the heat flux density change amount and the heat flux density change ratio.

[0165] S42. Obtain a preset lower limit set of heat flux density changes in a database, and perform a proportional analysis with the heat flux density change parameter to obtain a change proportion analysis result.

[0166] S43. Based on the change ratio analysis results, corresponding weighting factors are introduced for coupling processing to obtain the heat flux density change adjustment effect value.

[0167] S44. Obtain a heat flux density change threshold and a heat flux density change adjustment effect threshold preset in a database.

[0168] S45. Compare the heat flux density change amount with the heat flux density change threshold, and compare the heat flux density change adjustment effect value with the heat flux density change adjustment effect threshold to obtain a heat flux improvement judgment result.

[0169] S46. If the heat flux density change is greater than the heat flux density change threshold, and the heat flux density change adjustment effect value is greater than the heat flux density change adjustment effect threshold, the heat flux improvement judgment result is that the heat flux improvement judgment is qualified, and the corresponding secondary circuit conversion adjustment is not performed; otherwise, the corresponding secondary circuit conversion adjustment is performed.

[0170] In an embodiment of the present invention, a heat flux density change parameter of a high heat flux area after circuit conversion adjustment is obtained, and the heat flux density change parameter includes a heat flux density change amount and a heat flux density change ratio; a heat flux density change lower limit set preset in a database is obtained, and a proportional analysis is performed with the heat flux density change parameter to obtain a change ratio analysis result, and a corresponding weighting factor is introduced based on the change ratio analysis result for coupling processing to obtain a heat flux density change adjustment effect value; a heat flux density change threshold value and a heat flux density change adjustment effect threshold value preset in the database are obtained, and based on the heat flux density change amount and the heat flux density change adjustment effect value, a weighting factor is introduced based on the change ratio analysis result to obtain a heat flux density change adjustment effect value; The heat flux density change threshold is compared, and the heat flux density change adjustment effect value is compared with the heat flux density change adjustment effect threshold to obtain a heat flux improvement judgment result; if the heat flux density change is above the heat flux density change threshold and the heat flux density change adjustment effect value is above the heat flux density change adjustment effect threshold, the heat flux improvement judgment result is that the heat flux improvement judgment is qualified, and the corresponding secondary circuit conversion adjustment is not performed, otherwise the corresponding secondary circuit conversion adjustment is performed; the heat flux density change lower limit set includes the heat flux density change lower limit value and the heat flux density change ratio lower limit value.

[0171] In a specific implementation, the heat flux density change and the heat flux density change ratio can be obtained and analyzed through the background management system. The background management system is connected to the terminal equipment on the actual line, and the terminal equipment can measure and detect each line and make statistics.

[0172] By obtaining the heat flux density change parameters (including the amount and percentage of heat flux density change) in high-heat flux areas after circuit conversion adjustments and performing a comprehensive analysis, the effectiveness of heat flux improvement can be accurately assessed, avoiding errors caused by relying solely on a single parameter and ensuring that the adjusted heat flux density has indeed improved effectively. For example, focusing solely on the amount of heat flux density change may overlook the importance of relative changes. For example, suppose the heat flux density of a circuit decreases from 1000 W / m² to 800 W / m², a change of 200 W / m². However, if the initial heat flux density is lower, from 200 W / m² to 180 W / m², the change is only 20 W / m², but the percentage change is as high as 10%. In this case, simply considering the amount of change may overestimate the improvement effect of the second circuit. However, considering both the amount of change and the percentage of change provides a more accurate assessment of the adjustment effect. Achieving optimal heat flux distribution minimizes heat accumulation, improving the device's heat dissipation efficiency and operational stability. Through comprehensive analysis and judgment, we can ensure that each adjustment can move towards the optimal solution, rather than simply satisfying local or short-term improvements.

[0173] In a specific implementation, in order to facilitate the implementation of the method, the above process can be converted into a formula encapsulation form, wherein the calculation method of the heat flux density change adjustment effect value can be as follows:

[0174]

[0175] Where, Indicates the heat flux density change adjustment effect value, represents the change in heat flux density, Indicates the lower limit of heat flux density change, represents the change ratio of heat flux density, Indicates the lower limit of the heat flux density change ratio, represents the weighting factor of heat flux density variation, Represents the weighting factor of the heat flux density change ratio.

[0176] It should be noted that in the calculation formula of the heat flux density change adjustment effect value, each indicator was dimensionless before being substituted into the calculation. Specifically, for the heat flux density change, its dimensionless processing method is: ,in, Indicates the lower limit of the heat flux density change, which has physical units (W / m 2 ) is converted into a dimensionless value. Similarly, the heat flux density change ratio becomes a dimensionless value after dimensionless processing.

[0177] The weighting factor is a dimensionless value determined based on the importance of each indicator in the analysis of the heat flux density change adjustment effect value. It is used to perform a weighted summation of the dimensionless indicators. Since each indicator has been dimensionless before being substituted into the formula, and the weighting factor itself is also a dimensionless value, both sides of the formula are dimensionless values, meeting the dimensional consistency requirement.

[0178] It should be noted that the heat flux density change weighting factor and the heat flux density change ratio weighting factor can be obtained from the database. For example, the heat flux density change weighting factor can be obtained by obtaining the historical heat flux density changes stored in the database, and the heat flux density change weighting factor corresponding to the historical heat flux density changes, thereby constructing a heat flux density change mapping set, wherein there is a one-to-one or many-to-one correspondence in the mapping set. The heat flux density change weighting factor can be obtained by inputting the heat flux density change data to be used into the heat flux density change mapping set. The method for obtaining the heat flux density change ratio weighting factor is the same as the method for obtaining the heat flux density change weighting factor, and can also be obtained by matching in the corresponding mapping set, wherein the heat flux density change ratio weighting factor corresponds to the heat flux density change ratio mapping set.

[0179] By comprehensively analyzing the amount and percentage of change in heat flux density, the effectiveness of adjustment measures can be accurately assessed. If the improvement is deemed satisfactory, the current adjustment has achieved the desired goal and no further action is required. Otherwise, continued adjustment is necessary until the optimal state is reached. If the initial adjustment fails to achieve the expected improvement, a secondary adjustment can help further optimize current distribution, reduce heat flux density, and minimize heat accumulation. By continuously optimizing heat flux distribution, the need for a larger heat dissipation area due to localized overheating can be reduced, which can lead to oversizing of the power supply unit.

[0180] Furthermore, S46 may include the following sub-steps:

[0181] S461 , sorting the circuit conversion feasible values ​​of the convertible circuits in descending order to obtain a descending order of the feasible values.

[0182] S462. Adjust the secondary circuits of the convertible circuits in descending order of feasible values ​​until the heat flux improvement determination result is that the heat flux improvement determination is qualified.

[0183] In an embodiment of the present invention, the circuit conversion feasible values ​​of each convertible circuit are sorted in descending order to obtain a feasible value descending order, and each convertible circuit is adjusted for secondary circuits in turn according to the feasible value descending order until the heat flux improvement judgment result is that the heat flux improvement judgment is qualified.

[0184] In the specific implementation, by sorting the circuit conversion feasible values ​​of each convertible circuit in descending order and performing secondary circuit adjustments in sequence until the heat flux improvement is judged to be qualified, it can be ensured that each adjustment moves towards the optimal solution, and insufficient improvement caused by random or local adjustments can be avoided. It can ensure efficient use of resources, reduce unnecessary repeated operations, and ultimately achieve global optimization of the heat flux distribution.

[0185] Step 206 : When the heat flux improvement determination result is to perform secondary circuit conversion adjustment, the effective heat flux density adjustment ratio of the high heat flux area after the secondary circuit conversion adjustment is calculated.

[0186] In an embodiment of the present invention, through the process of steps S41-S46, when the heat flux density change is less than or equal to the heat flux density change threshold, or the heat flux density change adjustment effect value is less than or equal to the heat flux density change adjustment effect threshold, or the heat flux density change is less than or equal to the heat flux density change threshold and the heat flux density change adjustment effect value is less than or equal to the heat flux density change adjustment effect threshold, the heat flux improvement judgment result is that the heat flux improvement judgment is unqualified, and the corresponding secondary circuit conversion adjustment is performed.

[0187] Step 207 : When the heat flux improvement determination result is that the secondary circuit conversion adjustment is not performed, the effective heat flux density adjustment ratio of the high heat flux area after the circuit conversion adjustment is calculated.

[0188] In an embodiment of the present invention, when the heat flux density change is greater than the heat flux density change threshold, and the heat flux density change adjustment effect value is greater than the heat flux density change adjustment effect threshold, the heat flux improvement judgment result is that the heat flux improvement judgment is qualified, and the corresponding secondary circuit conversion adjustment is not performed, and the effective heat flux density adjustment ratio of the high heat flux area after the circuit conversion adjustment is calculated.

[0189] Furthermore, the process of calculating the effective heat flux density adjustment ratio includes:

[0190] A1. Obtain the line current change in the high heat flux area within a preset period after adjustment or secondary circuit conversion adjustment, and analyze to obtain the theoretical change in heat flux density in the high heat flux area within the preset period after adjustment or secondary circuit conversion adjustment.

[0191] A2. Obtaining an actual change in heat flux density in a high heat flux area within a preset time period after adjustment or secondary circuit conversion adjustment.

[0192] A3. Perform a ratio calculation between the theoretical change in heat flux density and the actual change in heat flux density to obtain the effective heat flux density adjustment ratio.

[0193] Step 208: Optimize the size of the power supply device according to the effective heat flux density adjustment ratio.

[0194] Furthermore, step 208 may include the following sub-steps:

[0195] S51. Obtain each effective heat flux density adjustment ratio interval preset in the database and a reference power supply device size scaling factor corresponding to each effective heat flux density adjustment ratio interval, and compare them with the effective heat flux density adjustment ratio.

[0196] S52: If the effective heat flux density adjustment ratio is within a certain interval, obtaining a reference power supply device size scaling factor corresponding to the interval as a first size reduction ratio of the power supply device.

[0197] S53 , obtaining the electromagnetic interference intensity change amount and the electromagnetic interference intensity change ratio of the high heat flux area after the circuit conversion adjustment or the secondary circuit conversion adjustment, and analyzing to obtain the electromagnetic interference influence coefficient.

[0198] S54: Matching the electromagnetic interference influence coefficient with the database to obtain a second size reduction ratio of the power supply device.

[0199] S55 , performing coupling analysis based on the first size reduction ratio of the power transfer device and the second size reduction ratio of the power transfer device to obtain the size reduction ratio of the power transfer device.

[0200] S56: Obtain initial size parameters of the power supply device.

[0201] S57 , reducing the initial size parameters of the power transfer device based on the size reduction ratio of the power transfer device to obtain new size parameters of the power transfer device.

[0202] S58. Optimize the size of the power supply device using the newly set size parameters.

[0203] In an embodiment of the present invention, a change in line current in a high heat flux area within a preset period after circuit conversion adjustment or secondary circuit conversion adjustment is obtained, and a theoretical change in heat flux density in the high heat flux area within a preset period after circuit conversion adjustment or secondary circuit conversion adjustment is obtained by analysis; an actual change in heat flux density in the high heat flux area within a preset period after circuit conversion adjustment or secondary circuit conversion adjustment is obtained; a comparison analysis is performed between the actual change in heat flux density in the high heat flux area within a preset period after circuit conversion adjustment or secondary circuit conversion adjustment and the theoretical change in heat flux density to obtain an effective heat flux adjustment ratio; each effective heat flux adjustment ratio interval preset in the database and a reference power supply device size scaling coefficient corresponding to each effective heat flux adjustment ratio interval are obtained, and compared with the effective heat flux adjustment ratio; if the effective heat flux adjustment ratio is within a certain interval, the reference power supply device size scaling coefficient corresponding to the interval is obtained. as the first size reduction ratio of the transfer power supply device; obtain the electromagnetic interference intensity change amount and the electromagnetic interference intensity change ratio of the high heat flux area after the circuit conversion adjustment or the secondary circuit conversion adjustment, and analyze to obtain the electromagnetic interference influence coefficient; match the electromagnetic interference influence coefficient with the database to obtain the second size reduction ratio of the transfer power supply device; perform coupling analysis based on the first size reduction ratio of the transfer power supply device and the second size reduction ratio of the transfer power supply device to obtain the size reduction ratio of the transfer power supply device; obtain the initial size parameters of the transfer power supply device, and the initial size parameters of the transfer power supply device include the initial length, initial width and initial height of the transfer power supply device; reduce the initial size parameters of the transfer power supply device based on the size reduction ratio of the transfer power supply device to obtain new size parameters of the transfer power supply device, thereby completing the size optimization of the transfer power supply device; the new size parameters of the transfer power supply device include the new length, new width and new height of the transfer power supply device.

[0204] See also Figure 4 When optimizing the size of the power transfer device, the effective heat flux adjustment ratio and the electromagnetic interference influence coefficient are first obtained. A first size reduction ratio for the power transfer device is determined based on the effective heat flux adjustment ratio, and a second size reduction ratio is determined based on the electromagnetic interference influence coefficient. Subsequently, the final size reduction ratio is analyzed based on the first and second size reduction ratios. Based on this, a size reduction operation is performed to obtain the new size parameters for the power transfer device, ultimately completing the size optimization of the power transfer device.

[0205] In a specific implementation, the line current change in the high heat flux area after circuit conversion adjustment or secondary circuit conversion adjustment can be obtained and analyzed through the background management system. The background management system is connected to the terminal equipment on the actual line, and the terminal equipment can measure and detect each line and conduct statistics.

[0206] Based on the comparative analysis of the actual change in heat flux density in the high heat flux area after circuit conversion adjustment or secondary circuit conversion adjustment and the theoretical change in heat flux density, the effective heat flux adjustment ratio is obtained. The specific method is to divide the actual change in heat flux density in the high heat flux area after circuit conversion adjustment or secondary circuit conversion adjustment by the theoretical change in heat flux density to obtain the effective heat flux adjustment ratio.

[0207] It should be noted that the theoretical change in heat flux density in the high heat flux area within a preset time period after the circuit conversion adjustment or the secondary circuit conversion adjustment can be calculated using the Joule's law formula.

[0208] The change in electromagnetic interference intensity and the ratio of electromagnetic interference intensity change in the high heat flux area after circuit conversion adjustment or secondary circuit conversion adjustment can be obtained and analyzed through the background management system. The background management system is connected to the terminal equipment on the actual line, and the terminal equipment can measure and detect each line and conduct statistics.

[0209] The electromagnetic interference intensity change amount and the electromagnetic interference intensity change ratio of the high heat flux area after the circuit conversion adjustment or the secondary circuit conversion adjustment are obtained, and the electromagnetic interference influence coefficient is obtained by analysis. The specific steps are: obtaining the electromagnetic interference intensity change amount and the electromagnetic interference intensity change ratio of the high heat flux area after the circuit conversion adjustment or the secondary circuit conversion adjustment, obtaining the electromagnetic interference intensity reference value and the electromagnetic interference intensity change reference ratio preset in the database, and comparing and analyzing them with the electromagnetic interference intensity change amount and the electromagnetic interference intensity change ratio of the high heat flux area after the circuit conversion adjustment or the secondary circuit conversion adjustment to obtain comparative analysis results, and then introducing corresponding weighting factors for coupling processing to obtain the electromagnetic interference influence coefficient.

[0210] In a specific implementation, to facilitate the implementation of the method, the above process can be converted into a formula encapsulation form, wherein the electromagnetic interference influence coefficient can be calculated as follows:

[0211]

[0212] Where, represents the electromagnetic interference influence coefficient, Indicates the change in electromagnetic interference intensity in the high heat flux area after circuit conversion adjustment or secondary circuit conversion adjustment. Indicates the reference value of electromagnetic interference intensity, Indicates the change ratio of electromagnetic interference intensity in high heat flux area after circuit conversion adjustment or secondary circuit conversion adjustment, Indicates the baseline ratio of electromagnetic interference intensity change, Represents the weighting factor of the change in electromagnetic interference intensity, Represents the weighting factor of the change ratio of electromagnetic interference intensity.

[0213] It should be noted that in the calculation formula of the electromagnetic interference influence coefficient, each indicator is dimensionless before being substituted into the calculation. Specifically, for the change in electromagnetic interference intensity, the dimensionless processing method is: ,in, Indicates the baseline value of electromagnetic interference intensity. This method converts the change in electromagnetic interference intensity with physical units (V / m) into a dimensionless value. Similarly, the change ratio of electromagnetic interference intensity becomes a dimensionless value after dimensionless processing.

[0214] The weighting factor is a dimensionless value determined based on the importance of each indicator in the electromagnetic interference impact coefficient analysis. It is used to perform a weighted summation of the dimensionless indicators. Since each indicator has been dimensionless before being substituted into the formula, and the weighting factor itself is also a dimensionless value, both sides of the formula are dimensionless values, meeting the dimensional consistency requirement.

[0215] It should be noted that the electromagnetic interference intensity change weighting factor and the electromagnetic interference intensity change ratio weighting factor can be obtained from the database. For example, the electromagnetic interference intensity change weighting factor can be obtained by obtaining the historical electromagnetic interference intensity change stored in the database, and the electromagnetic interference intensity change weighting factor corresponding to the historical electromagnetic interference intensity change, thereby constructing an electromagnetic interference intensity change mapping set, wherein there is a one-to-one or many-to-one correspondence in the mapping set. The electromagnetic interference intensity change weighting factor can be obtained by inputting the electromagnetic interference intensity change data to be used into the electromagnetic interference intensity change mapping set. The method for obtaining the electromagnetic interference intensity change ratio weighting factor is the same as the method for obtaining the electromagnetic interference intensity change weighting factor, and can also be obtained by matching in the corresponding mapping set, wherein the electromagnetic interference intensity change ratio weighting factor corresponds to the electromagnetic interference intensity change ratio mapping set.

[0216] Based on the matching of the electromagnetic interference influence coefficient with the database, the second size reduction ratio of the power transfer device is obtained. The specific method is: obtain each electromagnetic interference influence coefficient interval preset in the database and the reference second size reduction ratio of the power transfer device corresponding to each electromagnetic interference influence coefficient interval, and compare them with the electromagnetic interference influence coefficient. If the electromagnetic interference influence coefficient is within a certain preset electromagnetic interference influence coefficient interval, then obtain the reference second size reduction ratio of the power transfer device corresponding to the interval as the second size reduction ratio of the power transfer device.

[0217] It should be noted that the initial size parameters of the power transfer device can be obtained by looking up the device appearance parameters of the power transfer device through the background management system.

[0218] Based on the coupling analysis of the first size reduction ratio of the power transfer device and the second size reduction ratio of the power transfer device, the size reduction ratio of the power transfer device is obtained. The specific method is:

[0219]

[0220] Where, Indicates the reduction ratio of the power supply device size. Indicates the first size reduction ratio of the power supply device. Indicates the reduction ratio of the second size of the power supply device. represents the first size reduction ratio weighting factor, Represents the second size reduction ratio weighting factor.

[0221] It should be noted that in the calculation formula for the size reduction ratio of the power transfer device, each indicator was dimensionless before being substituted into the calculation. Specifically, the first size reduction ratio of the power transfer device and the second size reduction ratio of the power transfer device are both in the form of ratios and are dimensionless values, so no additional dimension conversion operation is required.

[0222] The weighting factor is a dimensionless value determined based on the importance of each size reduction ratio in the power supply unit size reduction analysis. It is used to weight the sum of the dimensionless indicators. Since each indicator has been dimensionless before being substituted into the formula, and the weighting factor itself is also a dimensionless value, both sides of the formula are dimensionless values, meeting the dimensional consistency requirement.

[0223] It should be noted that the first size reduction ratio weighting factor and the second size reduction ratio weighting factor can be obtained from a database. For example, the first size reduction ratio weighting factor can be obtained by obtaining the historical first size reduction ratio stored in the database, and the first size reduction ratio weighting factor corresponding to the historical first size reduction ratio, thereby constructing a first size reduction ratio mapping set, wherein there is a one-to-one or many-to-one correspondence in the mapping set. The first size reduction ratio weighting factor can be obtained by inputting the first size reduction ratio data to be used into the first size reduction ratio mapping set. The second size reduction ratio weighting factor is obtained in the same way as the first size reduction ratio weighting factor, and can also be obtained by matching in the corresponding mapping set, wherein the second size reduction ratio weighting factor corresponds to the second size reduction ratio mapping set.

[0224] The initial size parameters of the transfer power supply device are reduced in size based on the size reduction ratio of the transfer power supply device to obtain new size parameters of the transfer power supply device. The specific method is to multiply the initial size parameters of the transfer power supply device (including the initial length, initial width and initial height of the transfer power supply device) by the size reduction ratio of the transfer power supply device to obtain the new size parameters of the transfer power supply device. For example, the initial length of the transfer power supply device is multiplied by the size reduction ratio of the transfer power supply device to obtain the new length of the transfer power supply device.

[0225] Dimensional changes and electromagnetic interference (EMI) interact to determine the performance and reliability of power supply systems. Reducing dimensions reduces line spacing, increasing electromagnetic coupling and interference. This not only impacts signal transmission quality but also generates additional heat due to eddy current and hysteresis losses, increasing the heat dissipation burden. Furthermore, dimensional changes affect the heat dissipation area and wind speed distribution, altering heat dissipation conditions and requiring increased wind speeds to maintain efficient heat dissipation.

[0226] Comprehensive analysis of dimensional changes and electromagnetic interference can accurately determine the size reduction ratio and achieve a balance between effective heat dissipation and electromagnetic compatibility.

[0227] By calculating the effective heat flux adjustment ratio of the transfer power supply device, the first size reduction ratio of the transfer power supply device is obtained, the initial size scaling ratio is determined, and the heat dissipation demand is met. By analyzing the electromagnetic interference influence coefficient and matching the database, the second size reduction ratio of the transfer power supply device is obtained to ensure electromagnetic compatibility and avoid the influence of mutual interference between circuits, which affects the heat dissipation effect. Finally, the first size reduction ratio of the transfer power supply device and the second size reduction ratio of the transfer power supply device are coupled and analyzed to obtain the size reduction ratio of the transfer power supply device, thereby optimizing heat dissipation and electromagnetic performance and improving the stability and reliability of the device.

[0228] Step 209: Adjust the execution wind speed of the heat dissipation device in the power supply device after size optimization.

[0229] Furthermore, step 209 may include the following sub-steps:

[0230] S61. Obtain the wind speed of the heat dissipation device in the forward power supply device after the circuit conversion adjustment or the secondary circuit conversion adjustment, and mark it as the initial wind speed.

[0231] S62: Obtain the initial volume change of the power supply device.

[0232] S63. Analyze and obtain the size impact value of the power transfer device based on the initial volume change of the power transfer device and the size reduction ratio of the power transfer device.

[0233] S64: Obtain the size impact value intervals of each power supply device preset in the database and the reference wind speed adjustment ratio corresponding to each size impact value interval of the power supply device, and compare them with the size impact value of the power supply device.

[0234] S65: If the size impact value of the power supply device is within a certain interval, obtain a reference wind speed adjustment ratio corresponding to the interval as the wind speed adjustment ratio.

[0235] S66: Perform wind speed enhancement adjustment on the initial wind speed based on the wind speed adjustment ratio to obtain an adjusted execution wind speed of the heat dissipation device in the power supply device.

[0236] In an embodiment of the present invention, the wind speed of the heat dissipation device in the transfer power supply device before the circuit conversion adjustment or the secondary circuit conversion adjustment is obtained and marked as the initial wind speed; the initial volume change of the transfer power supply device is obtained; based on the initial volume change of the transfer power supply device and the size reduction ratio of the transfer power supply device, the size impact value of the transfer power supply device is analyzed and obtained; each size impact value interval of the transfer power supply device and the reference wind speed adjustment ratio corresponding to each size impact value interval of the transfer power supply device preset in the database are obtained, and compared with the size impact value of the transfer power supply device; if the size impact value of the transfer power supply device is within a certain interval, the reference wind speed adjustment ratio corresponding to the interval is obtained as the wind speed adjustment ratio; the initial wind speed is enhanced and adjusted based on the wind speed adjustment ratio to obtain the adjusted execution wind speed of the heat dissipation device in the transfer power supply device.

[0237] In a specific implementation, based on the initial volume change of the transfer power supply device and the size reduction ratio of the transfer power supply device, the size impact value of the transfer power supply device is analyzed and obtained, and the specific steps are: obtaining the initial volume change of the transfer power supply device and the size reduction ratio of the transfer power supply device; obtaining the initial volume change reference value and the size reduction ratio reference value of the transfer power supply device preset in the database; comparing and analyzing the initial volume change of the transfer power supply device with the initial volume change reference value to obtain a volume analysis comparison result, comparing and analyzing the size reduction ratio of the transfer power supply device with the size reduction ratio reference value of the transfer power supply device to obtain a size reduction comparison analysis result, and introducing corresponding weighting factors based on the volume analysis comparison result and the size reduction comparison analysis result for coupling processing to obtain the size impact value of the transfer power supply device.

[0238] In a specific implementation, to facilitate the implementation of the method, the above process can be converted into a formula encapsulation form, wherein the calculation method of the power supply device size impact value can be as follows:

[0239]

[0240] Where, Indicates the impact value of the power supply device size, Indicates the initial volume change of the power supply device, Indicates the initial volume change reference value, Indicates the reduction ratio of the power supply device size. Indicates the reference value of the reduction ratio of the power supply device size. represents the weighting factor of the initial volume change, It represents the weighting factor of the reduction ratio of the power supply device size.

[0241] It should be noted that in the calculation formula of the size influence value of the power supply device, each indicator is dimensionless before being substituted into the calculation. Specifically, the dimensionless processing method for the initial volume change of the power supply device is: ,in, Indicates the initial volume change reference value, which will have physical units (m 3 ) is converted into a dimensionless value. Similarly, the size reduction ratio of the power supply device becomes a dimensionless value after dimensionless processing.

[0242] The weighting factor is a dimensionless value determined based on the importance of each indicator in the analysis of the impact of power supply device size. It is used to perform a weighted summation of the dimensionless indicators. Since each indicator has been dimensionless before being substituted into the formula, and the weighting factor itself is also a dimensionless value, both sides of the formula are dimensionless values, meeting the dimensional consistency requirement.

[0243] The initial volume change weighting factor and the transfer power supply device size reduction ratio weighting factor can be obtained from the database. For example, the initial volume change weighting factor can be obtained by obtaining the historical initial volume change stored in the database, and the initial volume change weighting factor corresponding to the historical initial volume change, thereby constructing an initial volume change mapping set, wherein there is a one-to-one or many-to-one correspondence in the mapping set. The initial volume change weighting factor can be obtained by inputting the initial volume change data to be used into the initial volume change mapping set. The method for obtaining the transfer power supply device size reduction ratio weighting factor is the same as the method for obtaining the initial volume change weighting factor, and can also be obtained by matching in the corresponding mapping set, wherein the transfer power supply device size reduction ratio weighting factor corresponds to the transfer power supply device size reduction ratio mapping set.

[0244] When the size of the power transfer unit is reduced, properly adjusting the wind speed of the heat dissipation device can effectively enhance heat dissipation capacity and compensate for the reduced heat dissipation area caused by the size reduction. When the size of the power transfer unit changes, especially when it is reduced in size, heat dissipation conditions generally deteriorate. This reduces the heat dissipation space, shortens the heat dissipation path, and reduces heat dissipation efficiency. Failure to make appropriate adjustments can impair heat dissipation and cause excessive temperatures inside the power transfer unit. Adjusting the wind speed based on the size change can accurately address these changes and ensure that heat dissipation requirements are met.

[0245] Based on the wind speed adjustment ratio, the initial wind speed is enhanced and adjusted to obtain the adjusted execution wind speed of the heat dissipation device in the power supply device. The specific method is as follows:

[0246]

[0247] Where, Indicates the wind speed of the heat dissipation equipment in the power supply device. represents the initial wind speed, Indicates the wind speed adjustment ratio.

[0248] It should be noted that in the calculation formula for adjusting the execution wind speed, the wind speed adjustment ratio is dimensionless before being substituted into the formula calculation. Specifically, the wind speed adjustment ratio itself is a proportional value and is a dimensionless value, so no additional dimension conversion operation is required.

[0249] In engineering, the initial wind speed is multiplied by , can accurately enhance the initial wind speed according to the wind speed adjustment ratio, and obtain the adjustment execution wind speed of the heat dissipation equipment in the power supply device .because is a dimensionless value, Also a dimensionless value, the initial wind speed Has wind speed units (such as m / s), so adjust the execution wind speed With initial wind speed The dimensions are consistent and are all wind speed units, meeting the dimensional consistency requirements.

[0250] In the present invention, firstly, by obtaining the initial connection lines of the power transfer device and the heat flux density of each sub-region, the high heat flux area and the circuit to be switched are accurately located, thereby achieving balanced current distribution and improved heat dissipation performance, thereby achieving optimization of the device size of the power transfer device, and effectively solving the problem of redundant heat dissipation area of ​​the equipment caused by unreasonable current distribution in the prior art, thereby causing the device size to be too large; secondly, by analyzing the circuit movement analysis parameters of each circuit to be switched, the circuit movement analysis value of each circuit to be switched is obtained, thereby accurately identifying the circuit to be moved in the high heat flux area, thereby achieving accurate migration of the high-load circuit, and effectively avoiding local overheating caused by current concentration; finally, By comprehensively evaluating the feasibility parameters of the convertible circuit, the feasible value of the circuit conversion is determined, and the current of the circuit to be moved is transferred to the conversion circuit to complete the circuit conversion adjustment, thereby achieving high efficiency and reliability of the circuit conversion, effectively preventing local circuit overheating caused by improper circuit conversion, and ensuring the stable operation of the power transfer device; at the same time, after the size of the power transfer device is optimized, the size impact value of the power transfer device is obtained by analyzing the initial volume change of the power transfer device and the size reduction ratio of the power transfer device, thereby dynamically adjusting the execution wind speed of the heat dissipation device in the power transfer device, thereby achieving effective heat dissipation of the power transfer device, and effectively solving the problem of limiting size reduction due to heat dissipation and electromagnetic interference problems in the existing technology.

[0251] See also Figure 5 , Figure 5 This is a structural block diagram of a size optimization system for a power transfer device provided in Example 3 of the present invention.

[0252] The present invention provides a size optimization system for a power supply device, comprising:

[0253] The initial connection line acquisition module 301 is used to perform line connection according to a preset line connection method after the power supply device receives the working signal, and obtain each initial connection line;

[0254] The regional analysis module 302 is used to obtain thermal energy of the power supply device in different zones and determine the circuits to be switched from the initial connection lines according to the thermal energy acquisition results of the different zones;

[0255] The circuit to be moved determination module 303 is configured to calculate the circuit movement analysis value of each circuit to be switched, and select the circuit to be switched corresponding to the maximum circuit movement analysis value as the circuit to be moved;

[0256] The circuit conversion adjustment module 304 is used to obtain each convertible circuit of the circuit to be moved, calculate the circuit conversion feasible value of each convertible circuit, and perform circuit conversion adjustment according to the circuit conversion feasible value;

[0257] Improvement result determination module 305, configured to perform heat flux improvement determination analysis on the high heat flux area after the circuit conversion adjustment, and determine whether to perform secondary circuit conversion adjustment based on the heat flux improvement determination result;

[0258] The first processing module 306 is configured to calculate an effective heat flux density adjustment ratio of the high heat flux area after the secondary circuit conversion adjustment when the heat flux improvement determination result is to perform secondary circuit conversion adjustment;

[0259] The second processing module 307 is used for calculating the effective heat flux density adjustment ratio of the high heat flux area after the circuit conversion adjustment when the heat flux improvement determination result is not to perform the secondary circuit conversion adjustment;

[0260] The size optimization module 308 is used to calculate the effective heat flux density adjustment ratio of the high heat flux area after the circuit conversion adjustment, and optimize the size of the power supply device according to the effective heat flux density adjustment ratio.

[0261] Furthermore, the regional analysis module 302 includes:

[0262] The area division submodule is used to divide the power supply device into areas to obtain sub-areas;

[0263] Heat flux density submodule, used to obtain the heat flux density of the sub-area;

[0264] The density sorting submodule is used to sort the heat flux densities in descending order to obtain the descending order of heat flux density;

[0265] The high heat flux area marking submodule is used to mark the subregion corresponding to the maximum heat flux density in the descending order of heat flux density as a high heat flux area;

[0266] The circuit to be switched submodule is used to obtain multiple initial connection circuits corresponding to the high heat flux area and mark them as circuits to be switched.

[0267] Furthermore, the circuit to be moved determination module 303 includes:

[0268] A circuit movement analysis parameter submodule is used to obtain circuit movement analysis parameters of each circuit to be switched;

[0269] A first proportional analysis result submodule is used to obtain a circuit movement analysis lower limit set preset in a database, and perform proportional analysis on the circuit movement analysis parameters of each circuit to be switched to obtain a proportional analysis result;

[0270] The circuit mobility analysis value submodule is used to introduce corresponding weighting factors based on the proportional analysis results to perform coupling processing and obtain the circuit mobility analysis value of each circuit to be switched;

[0271] The circuit to be moved submodule is used to compare the circuit movement analysis values ​​of the circuits to be switched and select the circuit to be switched corresponding to the maximum circuit movement analysis value as the circuit to be moved.

[0272] Furthermore, the circuit conversion adjustment module 304 includes:

[0273] The convertible circuit submodule is used to obtain each convertible circuit of the circuit to be moved;

[0274] A feasibility parameter submodule, used to obtain feasibility parameters of each convertible circuit;

[0275] The second proportional analysis result submodule is used to obtain a feasibility reference set preset in the database, and perform proportional analysis with the feasibility parameters of each convertible circuit to obtain a proportional analysis result;

[0276] The circuit conversion feasible value submodule is used to introduce the corresponding weighting factor based on the proportional analysis result to perform coupling processing and obtain the circuit conversion feasible value of each convertible circuit;

[0277] A conversion circuit submodule, configured to compare the circuit conversion feasible values ​​of the convertible circuits and mark the convertible circuit corresponding to the maximum circuit conversion feasible value as the conversion circuit;

[0278] The current transfer submodule is used to transfer the current of the circuit to be moved to the conversion circuit.

[0279] Furthermore, the improvement result determination module 305 includes:

[0280] The heat flux density variation parameter submodule is used to obtain the heat flux density variation parameters of the high heat flux area after circuit conversion adjustment;

[0281] Among them, the heat flux density change parameters include the heat flux density change amount and the heat flux density change ratio;

[0282] The change ratio analysis result submodule is used to obtain the lower limit set of heat flux density changes preset in the database, and perform a proportional analysis with the heat flux density change parameter to obtain the change ratio analysis result;

[0283] The heat flux density change adjustment effect value submodule is used to introduce the corresponding weighting factor based on the change ratio analysis results for coupling processing to obtain the heat flux density change adjustment effect value;

[0284] The threshold acquisition submodule is used to obtain the heat flux density change threshold and the heat flux density change adjustment effect threshold preset in the database;

[0285] The heat flux improvement determination result submodule is used to compare the heat flux density change amount with the heat flux density change threshold, and to compare the heat flux density change adjustment effect value with the heat flux density change adjustment effect threshold to obtain the heat flux improvement determination result;

[0286] The secondary circuit conversion adjustment submodule is used to determine that if the heat flux density change is greater than the heat flux density change threshold and the heat flux density change adjustment effect value is greater than the heat flux density change adjustment effect threshold, the heat flux improvement judgment result is qualified and the corresponding secondary circuit conversion adjustment is not performed; otherwise, the corresponding secondary circuit conversion adjustment is performed.

[0287] Furthermore, the secondary circuit conversion and adjustment submodule includes:

[0288] A feasible value descending order unit is used to perform descending sorting based on the circuit conversion feasible values ​​of each convertible circuit to obtain a feasible value descending order;

[0289] The secondary circuit adjustment unit is used to adjust the secondary circuits of each convertible circuit in descending order of feasible values ​​until the heat flux improvement judgment result is that the heat flux improvement judgment is qualified.

[0290] Furthermore, the process of calculating the effective heat flux density adjustment ratio includes:

[0291] Obtaining a change in line current in a high heat flux area within a preset period after circuit conversion adjustment or secondary circuit conversion adjustment, and analyzing to obtain a theoretical change in heat flux density in the high heat flux area within the preset period after circuit conversion adjustment or secondary circuit conversion adjustment;

[0292] Obtaining an actual change in heat flux density in a high heat flux area within a preset time period after a circuit conversion adjustment or a secondary circuit conversion adjustment;

[0293] The effective heat flux density adjustment ratio is obtained by performing a ratio calculation between the theoretical change in heat flux density and the actual change in heat flux density.

[0294] Furthermore, the size optimization module 308 includes:

[0295] An adjustment ratio comparison submodule is used to obtain each effective heat flux density adjustment ratio interval preset in the database and the reference power supply device size scaling factor corresponding to each effective heat flux density adjustment ratio interval, and compare them with the effective heat flux density adjustment ratio;

[0296] The first size reduction ratio submodule of the power supply device is configured to obtain, if the effective heat flux density adjustment ratio is within a certain interval, a reference power supply device size scaling factor corresponding to the interval as the first size reduction ratio of the power supply device;

[0297] The electromagnetic interference influence coefficient submodule is used to obtain the electromagnetic interference intensity change and the electromagnetic interference intensity change ratio in the high heat flux area after the circuit conversion adjustment or the secondary circuit conversion adjustment, and analyze and obtain the electromagnetic interference influence coefficient;

[0298] A second size reduction ratio submodule for the power supply device is used to match the electromagnetic interference influence coefficient with the database to obtain a second size reduction ratio for the power supply device;

[0299] A power transfer device size reduction ratio submodule, configured to perform a coupling analysis based on the first size reduction ratio of the power transfer device and the second size reduction ratio of the power transfer device to obtain the size reduction ratio of the power transfer device;

[0300] The initial size parameter submodule is used to obtain the initial size parameters of the power supply device;

[0301] A new size parameter submodule is used to reduce the size of the initial size parameters of the power supply device based on the size reduction ratio of the power supply device to obtain the new size parameters of the power supply device;

[0302] The size processing submodule is used to optimize the size of the power supply device using the newly set size parameters.

[0303] Furthermore, it also includes:

[0304] An initial wind speed module is used to obtain the wind speed of the heat dissipation device in the power supply device before the circuit conversion adjustment or the secondary circuit conversion adjustment, and mark it as the initial wind speed;

[0305] An initial volume change module is used to obtain an initial volume change of the power supply device;

[0306] A transfer power supply device size impact value module is used to analyze and obtain a transfer power supply device size impact value based on an initial volume change of the transfer power supply device and a size reduction ratio of the transfer power supply device;

[0307] An impact value comparison module is used to obtain the impact value intervals of each transfer power supply device size and the reference wind speed adjustment ratio corresponding to each transfer power supply device size impact value interval preset in the database, and compare them with the transfer power supply device size impact value;

[0308] A wind speed adjustment ratio module is used to obtain a reference wind speed adjustment ratio corresponding to a certain interval as the wind speed adjustment ratio if the size influence value of the power supply device is within a certain interval;

[0309] The wind speed adjustment execution module is used to perform wind speed enhancement adjustment on the initial wind speed based on the wind speed adjustment ratio to obtain the adjusted execution wind speed of the heat dissipation equipment in the power supply device.

[0310] In the present invention, firstly, by obtaining the initial connection lines of the power transfer device and the heat flux density of each sub-region, the high heat flux area and the circuit to be switched are accurately located, thereby achieving balanced current distribution and improved heat dissipation performance, thereby achieving optimization of the device size of the power transfer device, and effectively solving the problem of redundant heat dissipation area of ​​the equipment caused by unreasonable current distribution in the prior art, thereby causing the device size to be too large; secondly, by analyzing the circuit movement analysis parameters of each circuit to be switched, the circuit movement analysis value of each circuit to be switched is obtained, thereby accurately identifying the circuit to be moved in the high heat flux area, thereby achieving accurate migration of the high-load circuit, and effectively avoiding local overheating caused by current concentration; finally, By comprehensively evaluating the feasibility parameters of the convertible circuit, the feasible value of the circuit conversion is determined, and the current of the circuit to be moved is transferred to the conversion circuit to complete the circuit conversion adjustment, thereby achieving high efficiency and reliability of the circuit conversion, effectively preventing local circuit overheating caused by improper circuit conversion, and ensuring the stable operation of the power transfer device; at the same time, after the size of the power transfer device is optimized, the size impact value of the power transfer device is obtained by analyzing the initial volume change of the power transfer device and the size reduction ratio of the power transfer device, thereby dynamically adjusting the execution wind speed of the heat dissipation device in the power transfer device, thereby achieving effective heat dissipation of the power transfer device, and effectively solving the problem of limiting size reduction due to heat dissipation and electromagnetic interference problems in the existing technology.

[0311] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0312] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interface, device or unit, which can be electrical, mechanical or other forms.

[0313] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0314] In addition, the functional units in the various embodiments of the present invention may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0315] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the portion that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the various embodiments of the method of the present invention. The aforementioned storage medium includes various media that can store program code, such as USB flash drives, mobile hard drives, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical disks.

[0316] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A method for optimizing the size of a power supply device, characterized in that: include: When the power supply device receives the working signal, it performs line connection according to the preset line connection method to obtain each initial connection line; Acquiring thermal energy in different zones on the power supply device, and determining each circuit to be switched from each of the initial connection lines according to the acquisition results of the thermal energy in different zones; The step of acquiring thermal energy of the power supply device by partition and determining each circuit to be switched from each of the initial connection lines according to the thermal energy acquisition result of the partition includes: Dividing the power supply device into regions to obtain sub-regions; Obtaining the heat flux density of the sub-region; Sorting the heat flux densities in descending order to obtain a descending order of heat flux density; Marking the subregion corresponding to the maximum heat flux density in the descending order of the heat flux density as a high heat flux region; Acquire multiple initial connection lines corresponding to the high heat flux area and mark them as circuits to be switched; Calculating the circuit movement analysis value of each of the circuits to be switched, and selecting the circuit to be switched corresponding to the maximum circuit movement analysis value as the circuit to be moved; Acquiring each convertible circuit of the circuit to be moved, calculating a circuit conversion feasible value of each of the convertible circuits, and performing circuit conversion adjustment according to the circuit conversion feasible value; Conduct heat flux improvement analysis on the high heat flux area after circuit conversion adjustment, and determine whether to perform secondary circuit conversion adjustment based on the heat flux improvement judgment result; When the heat flux improvement determination result is to perform secondary circuit conversion adjustment, calculating the effective heat flux density adjustment ratio of the high heat flux area after the secondary circuit conversion adjustment; When the heat flux improvement determination result is that the secondary circuit conversion adjustment is not performed, calculating the effective heat flux density adjustment ratio of the high heat flux area after the circuit conversion adjustment; The size of the power supply device is optimized according to the effective heat flux density adjustment ratio.

2. The size optimization method of the power supply device according to claim 1, characterized in that: The calculating of the circuit movement analysis values ​​of the circuits to be switched and selecting the circuit to be switched corresponding to the maximum circuit movement analysis value as the circuit to be moved includes: Obtaining circuit movement analysis parameters of each circuit to be switched; Obtaining a circuit movement analysis lower limit set preset in a database, and performing proportional analysis on the circuit movement analysis parameters of each circuit to be switched to obtain a proportional analysis result; Based on the proportional analysis results, corresponding weighting factors are introduced to perform coupling processing to obtain circuit movement analysis values ​​of each circuit to be switched; Based on the comparison of the circuit movement analysis values ​​of the circuits to be switched, the circuit to be switched corresponding to the maximum circuit movement analysis value is selected as the circuit to be moved.

3. The size optimization method of the power transfer device according to claim 1, characterized in that: The obtaining of each convertible circuit of the circuit to be moved, calculating a circuit conversion feasible value of each convertible circuit, and performing circuit conversion adjustment according to the circuit conversion feasible value includes: Acquire each convertible circuit of the circuit to be moved; Obtaining feasibility parameters of each of the convertible circuits; Obtaining a feasibility reference set preset in a database, and performing a proportional analysis with the feasibility parameters of each of the convertible circuits to obtain a proportional analysis result; Based on the ratio analysis result, corresponding weighting factors are introduced to perform coupling processing to obtain a circuit conversion feasible value of each of the convertible circuits; Based on the comparison of the circuit conversion feasible values ​​of the convertible circuits, the convertible circuit corresponding to the maximum circuit conversion feasible value is marked as the conversion circuit; The current of the circuit to be moved is transferred to the conversion circuit.

4. The size optimization method of the power supply device according to claim 1, characterized in that: The heat flux improvement determination analysis is performed on the high heat flux area after the circuit conversion adjustment, and determining whether to perform secondary circuit conversion adjustment according to the heat flux improvement determination result, including: Obtaining heat flux density change parameters of the high heat flux area after circuit conversion adjustment; Wherein, the heat flux density change parameter includes the heat flux density change amount and the heat flux density change ratio; Obtaining a preset lower limit set of heat flux density changes in a database, and performing a proportional analysis with the heat flux density change parameter to obtain a change ratio analysis result; Based on the change ratio analysis result, a corresponding weighting factor is introduced to perform coupling processing to obtain a heat flux density change adjustment effect value; Obtaining a heat flux density change threshold and a heat flux density change adjustment effect threshold preset in a database; obtaining a heat flux improvement determination result based on a comparison between the heat flux density change amount and the heat flux density change threshold, and based on a comparison between the heat flux density change adjustment effect value and the heat flux density change adjustment effect threshold; If the heat flux density change is greater than the heat flux density change threshold, and the heat flux density change adjustment effect value is greater than the heat flux density change adjustment effect threshold, then the heat flux improvement judgment result is that the heat flux improvement judgment is qualified, and the corresponding secondary circuit conversion adjustment is not performed; otherwise, the corresponding secondary circuit conversion adjustment is performed.

5. The size optimization method of the power supply device according to claim 1, characterized in that: The secondary circuit conversion adjustment includes: Sorting the circuit conversion feasible values ​​of the convertible circuits in descending order to obtain a descending order of feasible values; The secondary circuits of the convertible circuits are adjusted in sequence according to the descending order of the feasible values ​​until the heat flux improvement determination result is that the heat flux improvement determination is qualified.

6. The size optimization method of the power transfer device according to claim 1, characterized in that: The process of calculating the effective heat flux density adjustment ratio includes: Obtaining a change in line current in a high heat flux area within a preset period after circuit conversion adjustment or secondary circuit conversion adjustment, and analyzing to obtain a theoretical change in heat flux density in the high heat flux area within the preset period after circuit conversion adjustment or secondary circuit conversion adjustment; Obtaining an actual change in heat flux density in a high heat flux area within a preset time period after a circuit conversion adjustment or a secondary circuit conversion adjustment; The effective heat flux density adjustment ratio is obtained by performing a ratio operation between the theoretical change in heat flux density and the actual change in heat flux density.

7. The size optimization method of the power transfer device according to claim 1, characterized in that: The optimizing the size of the power supply device according to the effective heat flux density adjustment ratio includes: Obtaining each effective heat flux density adjustment ratio interval preset in the database and a reference power supply device size scaling factor corresponding to each effective heat flux density adjustment ratio interval, and comparing them with the effective heat flux density adjustment ratio; If the effective heat flux density adjustment ratio is within a certain interval, obtaining a reference power supply device size scaling factor corresponding to the interval as a first size reduction ratio of the power supply device; Obtain the electromagnetic interference intensity change amount and electromagnetic interference intensity change ratio in the high heat flux area after the circuit conversion adjustment or the secondary circuit conversion adjustment, and analyze and obtain the electromagnetic interference influence coefficient; Obtaining a second size reduction ratio of the power supply device based on matching the electromagnetic interference influence coefficient with a database; Performing a coupling analysis based on the first size reduction ratio of the power transfer device and the second size reduction ratio of the power transfer device to obtain a size reduction ratio of the power transfer device; Obtaining initial size parameters of the power supply device; Reducing the initial size parameters of the transfer power supply device based on the size reduction ratio of the transfer power supply device to obtain new size parameters of the transfer power supply device; The size of the power supply device is optimized using the newly set size parameters.

8. The size optimization method of the power transfer device according to claim 7, characterized in that: Also includes: Obtain the wind speed of the heat dissipation device in the power supply device before the circuit conversion adjustment or the secondary circuit conversion adjustment, and mark it as the initial wind speed; Obtaining an initial volume change of the power transfer device; Based on the initial volume change of the power transfer device and the size reduction ratio of the power transfer device, an impact value of the size of the power transfer device is analyzed and obtained; Obtaining the size impact value intervals of each power supply device preset in the database and the reference wind speed adjustment ratio corresponding to each size impact value interval of the power supply device, and comparing them with the size impact value of the power supply device; If the size impact value of the power supply device is within a certain interval, obtaining a reference wind speed adjustment ratio corresponding to the interval as the wind speed adjustment ratio; The initial wind speed is enhanced and adjusted based on the wind speed adjustment ratio to obtain the adjusted execution wind speed of the heat dissipation device in the power supply device.

9. A size optimization system for a power supply device, characterized in that: The size optimization system of the power transfer device is used to implement the size optimization method of the power transfer device according to any one of claims 1 to 8, and the size optimization system of the power transfer device includes: An initial connection line acquisition module is used to perform line connection according to a preset line connection method after the power supply device receives a working signal, and obtain each initial connection line; A regional analysis module, configured to obtain thermal energy of the power supply device in a zoned manner, and determine each circuit to be switched from each of the initial connection lines according to the zoned thermal energy acquisition result; a circuit-to-be-moved judging module, configured to calculate a circuit movement analysis value of each circuit to be switched, and select a circuit to be switched corresponding to a maximum circuit movement analysis value as the circuit to be switched; a circuit conversion adjustment module, configured to obtain each convertible circuit of the circuit to be moved, calculate a circuit conversion feasible value of each of the convertible circuits, and perform circuit conversion adjustment according to the circuit conversion feasible value; An improvement result determination module is used to perform heat flux improvement determination analysis on the high heat flux area after the circuit conversion adjustment, and determine whether to perform secondary circuit conversion adjustment based on the heat flux improvement determination result; a first processing module, configured to calculate an effective heat flux density adjustment ratio of the high heat flux area after the secondary circuit conversion adjustment when the heat flux improvement determination result is to perform a secondary circuit conversion adjustment; a second processing module, configured to calculate an effective heat flux density adjustment ratio of the high heat flux area after the circuit conversion adjustment when the heat flux improvement determination result is that the secondary circuit conversion adjustment is not performed; A size optimization module is used to optimize the size of the power supply device according to the effective heat flux density adjustment ratio.

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