Coil component

Abstract

The invention provides a coil component. The coil component includes: a main body; a support substrate embedded in the main body; a coil part disposed on at least one surface of the support substrate and having both ends exposed to the main body; a noise removal portion disposed on the at least one surface of the support substrate, spaced apart from the coil portion, and forming an open loop such that one end of the noise removal portion is exposed to the main body; an insulating layer provided between the coil portion and the noise removal portion; first and second external electrodes disposed on the main body and connected to the two ends of the coil portion, respectively; and a third external electrode disposed on the main body and connected to the one end of the noise removal portion.

Description

[0001] This application is a divisional application of the invention patent application with application number 202010309859.6 filed by the applicant on April 20, 2020, and the original application invention name is "Coil Assembly", and all its contents are incorporated into this application by reference. Technical Field

[0002] The present disclosure relates to a coil assembly. Background Art

[0003] An inductor, a type of coil component, is a representative passive electronic component used in electronic devices along with resistors and capacitors.

[0004] As electronic devices have been designed to have high performance and reduced size, the number of electronic components used in the electronic devices has increased, and the sizes of the electronic components have decreased.

[0005] Therefore, there is a growing demand for removing noise such as electromagnetic interference (EMI) from coil assemblies. Summary of the Invention

[0006] An aspect of the present disclosure is to provide a coil component that can easily remove noise.

[0007] According to one aspect of the present disclosure, a coil component includes: a main body; a support substrate buried in the main body; a coil portion, arranged on at least one surface of the support substrate and having two ends exposed to the main body; a noise removal portion, arranged on the at least one surface of the support substrate, spaced apart from the coil portion, and forming an open loop so that one end of the noise removal portion is exposed to the main body; an insulating layer, arranged between the coil portion and the noise removal portion; a first external electrode and a second external electrode, arranged on the main body and respectively connected to the two ends of the coil portion; and a third external electrode, arranged on the main body and connected to the one end of the noise removal portion.

[0008] According to one aspect of the present disclosure, a coil component includes: a main body and a supporting substrate buried in the main body; a coil portion, which is arranged on at least one surface of the supporting substrate and includes a coil pattern in a planar spiral shape; a noise removal portion, which is arranged on the at least one surface of the supporting substrate, is spaced apart from the coil portion, and is in a ring shape with a gap; an insulating layer, which is arranged between the coil portion and the noise removal portion; a first external electrode and a second external electrode, which are arranged on the surface of the main body and are respectively connected to both ends of the coil portion; and a third external electrode, which is arranged on the surface of the main body and connected to one end of the noise removal portion.

[0009] According to one aspect of the present disclosure, a coil component includes: a main body and a supporting substrate buried in the main body; a coil portion, which is arranged on at least one surface of the supporting substrate and includes a coil pattern in a planar spiral shape; a noise removal portion, which is in a planar spiral shape, is arranged on the at least one surface of the supporting substrate and is spaced apart from the coil portion; an insulating layer, which is arranged between the coil portion and the noise removal portion; a first external electrode and a second external electrode, which are arranged on the surface of the main body and are respectively connected to both ends of the coil portion; and a third external electrode, which is arranged on the surface of the main body and connected to one end of the noise removal portion.

[0010] According to one aspect of the present disclosure, a coil component includes: a main body; a coil portion embedded in the main body and having an end exposed from the main body; a noise removal portion embedded in the main body and spaced apart from the coil portion, the noise removal portion being an open loop and including a first end exposed from the main body and a second end embedded in the main body; a first external electrode disposed on the main body and connected to the end of the coil portion; and a second external electrode disposed on the main body and connected to the first end of the noise removal portion.

[0011] According to one aspect of the present disclosure, a coil assembly includes: a magnetic body; a coil portion embedded in the magnetic body and having an end exposed from the magnetic body; a noise removal portion embedded in the magnetic body and spaced apart from the coil portion; an insulating layer embedded in the magnetic body and disposed between the coil portion and the noise removal portion; a first external electrode and a second external electrode disposed on the magnetic body and respectively connected to the ends of the coil portion; and a third external electrode disposed on the magnetic body and connected to one end of the noise removal portion. The noise removal portion is in direct contact with the insulating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description taken in conjunction with the accompanying drawings, in which: Figure 1 is a diagram illustrating a coil assembly according to an example embodiment of the present disclosure; Figure 2 It is shown as viewed from the top surface Figure 1 An illustration of the coil assembly shown in ; Figure 3 It is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 4 It is along Figure 1 A cross-sectional view taken along line II-II'; Figure 5FIG. 1 is a diagram showing a coil assembly according to a modified example and a Figure 1 FIG. 1 is a diagram corresponding to a cross-sectional surface taken along line II-II'; Figure 6 FIG. 1 is a diagram showing a coil assembly according to another modified example and along Figure 1 FIG. 1 is a diagram corresponding to a cross-sectional surface taken along line II-II'; Figure 7 FIG. 1 is a diagram showing a coil assembly according to another modified example and along Figure 1 FIG. 1 is a diagram corresponding to a cross-sectional surface taken along line II-II'; Figure 8 is a diagram illustrating a coil component according to another example embodiment of the present disclosure; Figure 9 It is shown as viewed from the top surface Figure 8 An illustration of the coil assembly shown in ; Figure 10 It is along Figure 8 A cross-sectional view taken along line III-III'; Figure 11 It is along Figure 8 A cross-sectional view taken along line IV-IV'; Figure 12 FIG. 1 is a diagram showing a coil assembly according to a modified example and a Figure 8 FIG. 1 is a diagram corresponding to a cross-sectional surface taken along line IV-IV'; Figure 13 FIG. 1 is a diagram showing a coil assembly according to another modified example and along Figure 8 FIG. 1 is a diagram corresponding to a cross-sectional surface taken along line IV-IV'; Figure 14 FIG. 1 is a diagram showing a coil assembly according to another modified example and along Figure 8 FIG. 1 is a diagram corresponding to a cross-sectional surface taken along line IV-IV'; Figure 15 is a diagram showing signal transmission performance (S parameter) of a coil assembly in the prior art; Figure 16 is a diagram illustrating signal transmission performance (S parameters) of a coil assembly according to an example embodiment of the present disclosure; Figure 17 is a diagram illustrating signal transmission performance (S parameters) of a coil component according to another example embodiment of the present disclosure; Figure 18 is a diagram showing signal transmission performance (S parameter) of a coil assembly including a noise removal section in a closed loop form; Figure 19 is a diagram illustrating a coil component according to another example embodiment of the present disclosure; Figure 20 It is along Figure 19 A cross-sectional view taken along line V-V'; Figure 21 FIG. 1 is a diagram showing a coil assembly according to a modified example and a Figure 19 FIG. 1 is a diagram corresponding to a cross-sectional surface taken along line V-V'; Figure 22 is a diagram illustrating a coil component according to another example embodiment of the present disclosure; Figure 23 It is along Figure 22 A cross-sectional view taken along line VI-VI'; Figure 24 It is along Figure 22 A cross-sectional view taken along line VII-VII'; and Figure 25 is a diagram illustrating a connection relationship among a support substrate, a coil portion, and a noise removing portion according to another example embodiment. DETAILED DESCRIPTION

[0013] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

[0014] The terms used in the exemplary embodiments are only used to describe the exemplary embodiments and are not intended to limit the present disclosure. Unless otherwise indicated, singular terms include plural forms. The descriptive terms "including", "comprising", "constructed to", etc. are used to indicate the presence of features, quantities, steps, operations, elements, parts or combinations thereof, and do not exclude the possibility of combining or adding one or more features, quantities, steps, operations, elements, parts or combinations thereof. In addition, the terms "disposed on...", "located on...", etc. may indicate that an element is located on an object or below an object, and do not necessarily mean that the element is located on an object relative to the direction of gravity.

[0015] The terms “coupled to,” “combined to,” and the like may not only indicate that elements are in direct and physical contact with each other but may also include a configuration in which other elements are interposed between the elements such that the elements are also in contact with the other elements.

[0016] For ease of description, sizes and thicknesses of elements shown in the drawings are indicated as examples, and exemplary embodiments in the present disclosure are not limited thereto.

[0017] In the drawings, the L direction is a first direction or a length direction, the W direction is a second direction or a width direction, and the T direction is a third direction or a thickness direction.

[0018] In the description described with reference to the accompanying drawings, the same elements or elements corresponding to each other will be described using the same reference numerals, and repeated descriptions will not be repeated.

[0019] In electronic devices, various types of electronic components may be used, and various types of coil components may be used between the electronic components to remove noise or for other purposes.

[0020] In other words, in electronic devices, the coil component can be used as a power inductor, a high-frequency inductor, a general magnetic bead, a high-frequency magnetic bead, a common mode filter, etc.

[0021] First embodiment and its modified examples Figure 1 is a diagram illustrating a coil assembly according to example embodiments. Figure 2 It is shown as viewed from the top surface Figure 1 Schematic diagram of the coil assembly shown in . Figure 3 It is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 4 It is along Figure 1 A cross-sectional view taken along line II-II'. Figure 1 , insulating layers applied to example embodiments are not shown to clearly indicate combinations between elements.

[0022] Reference Figures 1 to 4 , the coil component 1000 in the example embodiment may include a body 100, a support substrate 200, a coil portion 300, insulating layers 410 and 420, a noise removal portion 500, and a first external electrode 610, a second external electrode 620, a third external electrode 630 and a fourth external electrode 640, and may further include an insulating film IF.

[0023] The body 100 may form an exterior shape of the coil component 1000 in example embodiments, and the coil part 300 may be buried in the body 100 .

[0024] The body 100 may have, for example, a hexahedral shape.

[0025] The body 100 may include a first surface 101 and a second surface 102 facing each other in the length direction X, a third surface 103 and a fourth surface 104 facing each other in the width direction Y, and a fifth surface 105 and a sixth surface 106 facing each other in the thickness direction Z. The first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the body 100 may be walls of the body 100 that connect the fifth surface 105 and the sixth surface 106 of the body 100. In the following description, "the front and rear surfaces of the body 100" may refer to the first and second surfaces 101, 102, respectively, and "the side surfaces of the body 100" may refer to the third and fourth surfaces 103, 104 of the body, respectively. In addition, "one surface and the other surface" of the body may refer to the fifth and sixth surfaces 105, 106 of the body 100, respectively.

[0026] As an example, the body 100 may be configured so that the coil component 1000 in which the outer electrodes 610, 620, 630, and 640 are formed may have a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but exemplary embodiments thereof are not limited thereto. The above dimensions are example dimensions determined without considering process errors, and examples of the dimensions are not limited thereto.

[0027] The main body 100 may include a magnetic material and a resin material. For example, the main body 100 may be formed by laminating one or more magnetic composite sheets including a magnetic material dispersed in a resin. Alternatively, the main body 100 may have a structure different from a structure in which the magnetic material is dispersed in a resin. For example, the main body 100 may be formed using a magnetic material such as ferrite.

[0028] The magnetic material can be ferrite or magnetic metal powder.

[0029] The ferrite may include, for example, one or more materials selected from spinel ferrites (such as Mg-Zn ferrite, Mn-Zn ferrite, Mn-Mg ferrite, Cu-Zn ferrite, Mg-Mn-Sr ferrite, Ni-Zn ferrite, etc.), hexagonal ferrites (such as Ba-Zn ferrite, Ba-Mg ferrite, Ba-Ni ferrite, Ba-Co ferrite, Ba-Ni-Co ferrite, etc.), garnet ferrites (such as Y ferrite) and Li ferrite.

[0030] The magnetic metal powder may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the magnetic metal powder may be one or more of pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder, and Fe-Cr-Al alloy powder.

[0031] The magnetic metal powder may be amorphous or crystalline. For example, the magnetic metal powder may be Fe-Si-B-Cr amorphous alloy powder, but exemplary embodiments of the magnetic metal powder are not limited thereto.

[0032] The ferrite and the magnetic metal powder may have an average diameter of 0.1 μm to 30 μm, but examples of the average diameter are not limited thereto.

[0033] The body 100 may include two or more types of magnetic materials dispersed in a resin. The concept that the types of magnetic materials are different may indicate that one of average diameter, composition, crystallinity, and shape of one magnetic material is different from corresponding ones of other magnetic materials.

[0034] The resin may include one of epoxy resin, polyimide, liquid crystal polymer, or a mixture thereof, but examples of the resin are not limited thereto.

[0035] The body 100 may include a core 110 penetrating the coil part 300 and the support substrate 200. The core 110 may be formed by filling a through hole of the coil part 300 with a magnetic composite sheet, but exemplary embodiments thereof are not limited thereto.

[0036] The support substrate 200 may be buried in the body 100. The support substrate 200 may support the coil part 300.

[0037] The support substrate 200 may be formed using an insulating material including a thermosetting resin such as epoxy resin, a thermoplastic resin such as polyimide, or a photosensitive insulating resin, or may be formed using an insulating material including a reinforcing material such as glass fiber and an inorganic filler and the above-mentioned insulating resin. For example, the support substrate 200 may be formed using materials such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, bismaleimide triazine (BT) resin, photosensitive dielectric (PID), copper clad laminate (CCL), etc., but examples of the material are not limited thereto.

[0038] As the inorganic filler, one or more materials selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3) can be used.

[0039] When the support substrate 200 is formed using an insulating material including a reinforcement material, the support substrate 200 may provide improved rigidity. When the support substrate 200 is formed using an insulating material not including glass fiber, the support substrate 200 may be desirable for reducing the overall thickness of the coil part 300.

[0040] The coil part 300 may be embedded in the body 100 and may reflect the performance of the coil assembly. For example, when the coil assembly 1000 is used as a power inductor, the coil part 300 may store an electric field as a magnetic field so that an output voltage can be maintained, thereby stabilizing the power of the electronic device.

[0041] The coil portion 300 may be formed on at least one of the two surfaces of the support substrate 200 and may form at least one turn. In an exemplary embodiment, the coil portion 300 may include: a first coil pattern 311 and a second coil pattern 312, respectively formed on two surfaces of the support substrate 200 facing each other in the thickness direction Z of the body 100; and a via 320 penetrating the support substrate 200 to connect the first coil pattern 311 and the second coil pattern 312 to each other.

[0042] Each of the first coil pattern 311 and the second coil pattern 312 may have a planar spiral shape and form at least one turn with respect to the core 110 as an axis. Figure 3 In the direction indicated in , the first coil pattern 311 may form at least one turn on the lower surface of the support substrate 200 relative to the core 110 as an axis, and the second coil pattern 312 may form at least one turn on the upper surface of the support substrate 200 relative to the core 110 as an axis.

[0043] The ends of the first coil pattern 311 and the second coil pattern 312 may be connected to the first external electrode 610 and the second external electrode 620, respectively. As an example, the end of the first coil pattern 311 may extend to be exposed to the first surface 101 of the body 100, and the end of the second coil pattern 312 may extend to be exposed to the second surface 102 of the body 100, so that the first coil pattern 311 and the second coil pattern 312 may be connected to the first external electrode 610 formed on the first surface 101 of the body 100 and the second external electrode 620 formed on the second surface 102 of the body 100, respectively. In this case, each of the coil patterns 311 and 312, including the end portions, may be formed in an integral form.

[0044] At least one of the coil patterns 311 and 312 and the via 320 may include one or more conductive layers.

[0045] As an example, when the second coil pattern 312 and the via 320 are formed on the upper surface of the support substrate 200 by a plating process, each of the second coil pattern 312 and the via 320 may include a seed layer and an electroplating layer. The seed layer may be formed by a vapor deposition process such as an electroless plating process, a sputtering process, etc. Each of the seed layer and the electroplating layer may have a single-layer structure or a multi-layer structure. The electroplating layer with a multi-layer structure may be formed according to a conformal film structure in which the electroplating layer is covered by another electroplating layer or a structure in which the electroplating layer is only stacked on one surface of one of the electroplating layers. The seed layer of the second coil pattern 312 and the seed layer of the via 320 may be integrated with each other so that no boundary may be formed between them, but the exemplary embodiments are not limited thereto. The electroplating layer of the second coil pattern 312 and the electroplating layer of the via 320 may be integrated with each other so that no boundary may be formed between them, but the exemplary embodiments are not limited thereto.

[0046] As another example, refer to Figure 3 and Figure 4 In the direction of the coil portion 300, when the coil portion 300 is formed by independently forming a first coil pattern 311 provided on the lower surface of the support substrate 200 and a second coil pattern 312 provided on the upper surface of the support substrate 200, and stacking the first coil pattern 311 and the second coil pattern 312 on the support substrate 200, the via 320 may include a metal layer with a high melting point and a metal layer with a low melting point (lower than the melting point of the metal layer with a high melting point). The metal layer with a low melting point may be formed as a solder including lead (Pb) and / or tin (Sn). At least a portion of the metal layer with a low melting point may melt due to the pressure and temperature when the metal layer is stacked. Therefore, an intermetallic compound (IMC) layer may be formed on at least a portion of the boundary between the metal layer with a low melting point and the second coil pattern 312 and a portion of the boundary between the metal layer with a low melting point and the metal layer with a high melting point.

[0047] exist Figure 3 and Figure 4 In the direction indicated in FIG, the coil patterns 311 and 312 may be configured to be exposed from the lower surface and the upper surface of the support substrate 200, respectively. As another example, the first coil pattern 311 may be formed on the lower surface of the support substrate 200 and exposed from the lower surface of the support substrate 200, and the second coil pattern 312 may be buried in the support substrate 200 and exposed from the lower surface of the support substrate 200. Figure 3 and Figure 4 In the direction indicated in , the upper surface of the second coil pattern 312 may be exposed to the upper surface of the support substrate 200. In this case, a recessed portion may be formed on the upper surface of the second coil pattern 312, and the upper surface of the support substrate 200 and the upper surface of the second coil pattern 312 may not be coplanar with each other. As another example, the second coil pattern 312 may be formed on the upper surface of the support substrate 200 and exposed from the upper surface of the support substrate 200, and the first coil pattern 311 may be buried in the lower surface of the support substrate 200 and Figure 3 and Figure 4 In the direction of the center, the lower surface of the first coil pattern 311 may be exposed to the lower surface of the support substrate 200. In this case, a recessed portion may be formed on the lower surface of the first coil pattern 311, and the lower surface of the support substrate 200 and the lower surface of the first coil pattern 311 may not be coplanar with each other.

[0048] The coil patterns 311 and 312 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but examples of the material are not limited thereto.

[0049] The insulating film IF may be formed along the surfaces of the first coil pattern 311, the support substrate 200, and the second coil pattern 312. The insulating film IF may protect and insulate the coil patterns 311 and 312, and may include a well-known insulating material such as parylene. The insulating material included in the insulating film IF is not limited to any specific material. The insulating film IF may be formed by a method such as vapor deposition, but examples of the method are not limited thereto. In an example embodiment, the insulating layers 410 and 420 may be formed on the insulating film IF, and thus the insulating film IF may be provided between the support substrate 200 and the insulating layers 410 and 420, and between the coil patterns 311 and 312 and the insulating layers 410 and 420.

[0050] Insulation layers 410 and 420 may be provided between the coil portion 300 and the noise removing portion 500. As an example, Figure 3 and Figure 4 , in example embodiments, the first insulating layer 410 may be disposed on the first coil pattern 311 and between the first coil pattern 311 and the first noise removal pattern 510. The second insulating layer 420 may be disposed on the second coil pattern 312 and between the second coil pattern 312 and the second noise removal pattern 520.

[0051] The insulating layers 410 and 420 can be formed by stacking insulating films on both surfaces of the support substrate 200 on which the coil portion 300 and the insulating film IF are formed. The insulating film can be implemented by a general non-photosensitive insulating film such as ABF, prepreg, etc., or a photosensitive insulating film such as a dry film or PID. The insulating layers 410 and 420 can serve as dielectric layers related to the capacitive coupling between the coil patterns 311 and 312 of the coil portion 300 and the noise removal patterns 510 and 520 of the noise removal portion 500. For example, the insulating layers 410 and 420 may include a dielectric material. In this case, the insulating layers 410 and 420 may not include a magnetic material.

[0052] The noise removal unit 500 may be provided in the main body 100 to transmit noise transmitted to the component and / or noise generated from the component to the substrate on which the coil component is mounted. For example, the noise removal unit 500 may be embedded in the main body 100, may be provided on the coil unit 300, and may form an open loop so that one end of the noise removal unit 500 may be exposed to the surface of the main body 100. In this case, the open loop refers to an open circuit in an electrical sense. In an example embodiment, the first noise removal pattern 510 may be provided on the first insulating layer 410 and may be provided on the first coil pattern 311, and the second noise removal pattern 520 may be provided on the second insulating layer 420 and may be provided on the second coil pattern 312. The noise removal unit 500 including the first noise removal pattern 510 and the second noise removal pattern 520 may be capacitively coupled with the coil unit 300 through the insulating layers 410 and 420.

[0053] The noise removal portion 500 may form an open loop. For example, each of the first noise removal pattern 510 and the second noise removal pattern 520 may be arranged so that the other end extending from one end exposed to the third surface of the body 100 may be spaced apart from the one end. Therefore, in an example embodiment, each of the first noise removal pattern 510 and the second noise removal pattern 520 may be in the shape of a ring including a slit S formed therein, and correspond to the shape of the first coil pattern 311 and the second coil pattern 312. The slit S may extend in a direction intersecting adjacent turns. For example, the slit S may extend linearly in a direction perpendicular to or substantially perpendicular to the third surface 103 or the fourth surface 104.

[0054] Each of the first noise removal pattern 510 and the second noise removal pattern 520 may be disposed to correspond to an area where the coil part 300 is disposed. Figure 1 、 Figure 2 and Figure 4 The line width of the second noise removal pattern 520 in the region disposed on the third surface 103 of the main body 100 may be approximately equal to or substantially equal to the distance between the innermost and outermost turns of the second coil pattern 312 in the region disposed on the third surface 103, or the width of the region from the innermost to outermost turns. Since the noise removal portion 500 is disposed in the region corresponding to the coil portion 300, noise can be easily removed, and the reduction of magnetic material in the main body 100 can be significantly reduced. Consequently, degradation of component performance due to the reduction of magnetic material can be significantly prevented.

[0055] One end of the noise removal portion 500 may be exposed to the third surface 103 of the main body 100. One end of the noise removal portion 500 may be connected to a third external electrode 630 disposed on the third surface 103 of the main body 100. For example, in an example embodiment, one end of the first noise removal pattern 510 and one end of the second noise removal pattern 520 may be exposed to the third surface 103 of the main body 100 and may be connected to the third external electrode 630. When the coil assembly 1000 is mounted on a substrate, the third external electrode 630 may be connected to the ground of the substrate. When the coil assembly 1000 is packaged in an electronic component package, the third external electrode 630 may be connected to the ground of the electronic component package. In an example embodiment, a fourth external electrode 640 disposed on the fourth surface 104 of the main body 100 may be included and may function as a non-contact terminal (e.g., the fourth external electrode 640 may be spaced apart from the noise removal portion 500 and the coil portion 300) and may be connected to the ground of the substrate on which the coil assembly is mounted, or may be connected to the ground of the package. In one example, the support substrate 200 may include an end portion overlapping one end of the noise removing part 500 in the thickness direction Z. The end portion of the support substrate 200 similar to the one end of the noise removing part 500 may be exposed from the third surface 103 and connected to the third external electrode 630 .

[0056] The noise removal patterns 510 and 520 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but examples of the material are not limited thereto. In one example, each of the noise removal patterns 510 and 520 may include a conductive layer. The noise removal patterns 510 and 520 and the slit S may be formed by a method including at least one of a vapor deposition process (such as an electroless plating process, an electroplating process, a sputtering process) and an etching process, but examples of the method are not limited thereto.

[0057] The first and second external electrodes 610 and 620 may be disposed on the first and second surfaces 101 and 102 of the main body 100, respectively, and may be connected to the first and second coil patterns 311 and 312, respectively. Thus, the first external electrode 610 may be disposed on the first surface 101 of the main body 100 and may contact and connect to the end of the first coil pattern 311 exposed to the first surface 101 of the main body 100. The second external electrode 620 may be disposed on the second surface 102 of the main body 100 and may contact and connect to the end of the second coil pattern 312 exposed to the second surface 102 of the main body 100. The first and second external electrodes 610 and 620 may extend from the first and second surfaces 101 and 102 of the main body 100, respectively, to the sixth surface 106 of the main body 100. The first and second external electrodes 610 and 620 may extend from the first and second surfaces 101 and 102 of the main body 100, respectively, to a portion of each of the third, fourth, and fifth surfaces 103, 104, and 105 of the main body 100. Figure 1 The forms of the first external electrode 610 and the second external electrode 620 shown in other figures are merely examples, and optionally, each of the external electrodes 610 and 620 may be constructed to not extend to a portion of each of the third surface 103, the fourth surface 104 and the fifth surface 105 of the body 100, and may have an L-shaped form and various other forms.

[0058] When the coil component 1000 is mounted on a substrate such as a printed circuit board, the first external electrode 610 and the second external electrode 620 can electrically connect the coil component 1000 to the substrate. For example, the coil component 1000 in the example can be mounted so that the sixth surface 106 of the main body 100 can be oriented to face the upper surface of the printed circuit board, and the external electrodes 610 and 620 extending to the sixth surface 106 of the main body 100 can be electrically connected to the connection portion of the printed circuit board via a conductive bonding member such as solder.

[0059] The first external electrode 610, the second external electrode 620, the third external electrode 630, and the fourth external electrode 640 may include at least one of a conductive resin layer and an electroplating layer. The conductive resin layer may be formed by printing a paste, etc., and may include one or more conductive metals selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag), and a thermosetting resin. The electroplating layer may include one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn).

[0060] Figure 15 is a graph showing signal transmission performance (S parameter) of a coil assembly in the related art. Figure 16 is a graph illustrating signal transmission performance (S parameters) of a coil component according to example embodiments. Figure 18is a diagram showing the signal transmission performance (S parameter) of a coil assembly including a noise removal section in a closed loop form. Figure 15 、 Figure 16 and Figure 18 In FIG, the solid line represents the input reflection coefficient S11, and the dotted line represents the transmission coefficient S21 from the input terminal to the output terminal. Figure 15 Unlike the exemplary embodiment, a general coil assembly without a noise removal portion can smoothly transmit a low-frequency signal from a DC power source, but the effect of removing noise is significantly reduced at a frequency higher than a resonant frequency (self-resonant frequency (SRF)). Figure 16 , the coil assembly 1000 in the exemplary embodiment can relatively smoothly transmit a low-frequency signal from a direct current similar to a general coil assembly, and can effectively prevent unnecessary high-frequency noise compared to a general coil assembly. Figure 18 , when the noise removing portion forms a closed loop unlike the exemplary embodiment, noise may not be properly emitted to the outside, and thus, the effect of removing noise may be reduced.

[0061] Figure 5 FIG. 1 is a diagram showing a coil assembly according to a modified example and a Figure 1 The diagram corresponds to the cross-sectional surface taken along line II-II'. Figure 6 FIG. 1 is a diagram showing a coil assembly according to another modified example and along Figure 1 The diagram corresponds to the cross-sectional surface taken along line II-II'. Figure 7 FIG. 1 is a diagram showing a coil assembly according to another modified example and along Figure 1 The diagram corresponds to the cross-sectional surface taken along line II-II'.

[0062] Reference Figure 5 In example embodiments, one end of the first noise removing pattern 510 may be exposed to the fourth surface 104 of the body 100, and one end of the second noise removing pattern 520 may be exposed to the third surface 103 of the body 100. One end of the first noise removing pattern 510 may contact and be connected to the fourth external electrode 640 provided on the fourth surface 104 of the body 100, and one end of the second noise removing pattern 520 may contact and be connected to the third external electrode 630 provided on the third surface 103 of the body 100. Therefore, in example embodiments, even when one of the third external electrode 630 and the fourth external electrode 640 connected to a ground of a substrate or the like on which the coil component is mounted is disconnected from the substrate, noise may be removed.

[0063] Reference Figure 6In an example embodiment, the noise removal portion 500 may be provided only on the second coil pattern 312. When it is not necessary to remove noise, the noise removal portion may be selectively formed on one of the two surfaces of the support substrate 200, thereby reducing material costs and improving component performance by increasing the content of magnetic material included in a component having the same size. Alternatively or optionally, the coil component may further include the above-mentioned insulating layer 410 ( Figure 6 not shown).

[0064] Reference Figure 7 In an example embodiment, the insulating film IF may be formed along the surfaces of the support substrate 200, the coil patterns 311 and 312, the insulating layers 410 and 420, and the noise removal patterns 510 and 520, and disposed between the noise removal patterns 510 and 520 and the body 100. In an example embodiment, the time point for forming the insulating film IF may be different from that in the aforementioned example embodiment. Therefore, in an example embodiment, the insulating film IF may be formed by forming the coil patterns 311 and 312, the insulating layers 410 and 420, and the noise removal patterns 510 and 520 on the support substrate 200 and performing a trimming process. In an example embodiment, the number of trimming processes may be reduced compared to the aforementioned example embodiment.

[0065] Second exemplary embodiment and its modified examples Figure 8 is a diagram illustrating a coil component according to another example embodiment. Figure 9 It is shown as viewed from the top surface Figure 8 Schematic diagram of the coil assembly shown in . Figure 10 It is along Figure 8 A cross-sectional view taken along line III-III'. Figure 11 It is along Figure 8 A cross-sectional view taken along line IV-IV'. Figure 8 , insulating layers applied to example embodiments are not shown to clearly indicate combinations between elements.

[0066] Reference Figures 1 to 4 as well as Figures 8 to 11 In the coil component 2000 of the example embodiment, the shape of the noise removal unit 500 may be different from the shape of the noise removal unit 500 of the coil component 1000 described in the previous example embodiment. Therefore, in the example embodiment, only the noise removal unit 500 will be described. The description of other elements in the example embodiment may be the same as the description of the elements in the previous example embodiment.

[0067] Reference Figures 8 to 11, the noise removal portion 500 in the exemplary embodiment may be formed in a planar spiral form. Therefore, each of the first noise removal pattern 510 and the second noise removal pattern 520 may be in a planar spiral shape and may have multiple turns similar to the first coil pattern 311 and the second coil pattern 312.

[0068] In this case, the coil part 300 and the noise removal part 500 may have the same winding direction from the innermost turn to the outermost turn. Figure 8 The winding direction from the innermost turn to the outermost turn of the second coil pattern 312 may be the same as the winding direction from the innermost turn to the outermost turn of the second noise removal pattern 520. Figure 8 , the winding direction from the innermost turn to the outermost turn of the first coil pattern 311 may be the same as the winding direction from the innermost turn to the outermost turn of the first noise removal pattern 510. When the winding directions of the first and second noise removal patterns 510 and 520 are different from the winding directions of the first and second coil patterns 311 and 312, the noise removal effect may be reduced.

[0069] Figure 17 is a diagram showing the signal transmission performance (S parameter) of a coil component according to another exemplary embodiment of the present disclosure. Figure 17 In FIG, the solid line represents the input reflection coefficient S11, and the dotted line represents the transmission coefficient S21 from the input terminal to the output terminal. Figure 15 , unlike the exemplary embodiment, a general coil component without forming a noise removal portion may smoothly transmit a low-frequency signal from a direct current, but the effect of removing noise may be significantly reduced at a frequency higher than a resonant frequency (self-resonant frequency (SRF)). Figure 17 Unlike a general coil assembly, the coil assembly 2000 in the exemplary embodiment can transmit a low-frequency signal from a direct current relatively smoothly similar to a general coil assembly, and can effectively prevent unnecessary high-frequency noise compared to a general coil assembly. Figure 18 , when the noise removing portion forms a closed loop unlike the exemplary embodiment, noise may not be properly emitted to the outside, and thus, the effect of removing noise may be reduced.

[0070] Figure 12 FIG. 1 is a diagram showing a coil assembly according to a modified example and a Figure 8 The diagram corresponds to the cross-sectional surface taken along line IV-IV' in FIG. Figure 13 FIG. 1 is a diagram showing a coil assembly according to another modified example and along Figure 8 The diagram corresponds to the cross-sectional surface taken along line IV-IV' in FIG. Figure 14 FIG. 1 is a diagram showing a coil assembly according to another modified example and along Figure 8The diagram corresponds to the cross-sectional surface taken along line IV-IV' in FIG.

[0071] Reference Figure 12 In example embodiments, one end of the first noise removing pattern 510 may be exposed to the fourth surface 104 of the body 100, and one end of the second noise removing pattern 520 may be exposed to the third surface 103 of the body 100. One end of the first noise removing pattern 510 may contact and be connected to the fourth external electrode 640 provided on the fourth surface 104 of the body 100, and one end of the second noise removing pattern 520 may contact and be connected to the third external electrode 630 provided on the third surface 103 of the body 100. Therefore, in example embodiments, even when one of the third external electrode 630 and the fourth external electrode 640 connected to a ground of a substrate or the like on which the coil component is mounted is disconnected from the substrate, noise may be removed.

[0072] Reference Figure 13 In an example embodiment, the noise removal portion 500 may be provided only on the second coil pattern 312. When it is not necessary to remove noise, the noise removal portion may be selectively formed on one of the two surfaces of the support substrate 200, thereby reducing material costs and improving component performance by increasing the content of magnetic material included in a component having the same size. Alternatively or optionally, the coil component may further include the above-mentioned insulating layer 410 ( Figure 13 not shown).

[0073] Reference Figure 14 In an example embodiment, the insulating film IF may be formed along the surfaces of the support substrate 200, the coil patterns 311 and 312, the insulating layers 410 and 420, and the noise removal patterns 510 and 520, and disposed between the noise removal patterns 510 and 520 and the body 100. In an example embodiment, the timing of forming the insulating film IF may be different from that of the aforementioned example embodiment. Therefore, in an example embodiment, the insulating film IF may be formed by forming the coil patterns 311 and 312, the insulating layers 410 and 420, and the noise removal patterns 510 and 520, and performing a trimming process. In an example embodiment, the number of trimming processes may be reduced compared to the aforementioned example embodiment.

[0074] Third exemplary embodiment and its modified examples Figure 19 is a diagram illustrating a coil component according to another example embodiment. Figure 20 It is along Figure 19 A cross-sectional view taken along line V-V'. Figure 19 , insulating layers applied to example embodiments are not shown to clearly indicate combinations between elements.

[0075] Reference Figures 1 to 4 as well as Figure 19 and Figure 20 In coil assembly 3000, the shapes of the third and fourth external electrodes 630 and 640 in the example embodiment may differ from those of the third and fourth external electrodes 630 and 640 described in the previous example embodiment. Therefore, in the example embodiment, only the third and fourth external electrodes 630 and 640 will be described. The descriptions of the other elements in the example embodiment may be the same as those in the previous example embodiment.

[0076] Reference Figure 19 and Figure 20 , the third external electrode 630 and the fourth external electrode 640 in example embodiments may be connected to each other on the sixth surface 106 of the body 100 .

[0077] For example, the end of the third external electrode 630 extending to the sixth surface 106 of the main body 100 may contact and be connected to the end of the fourth external electrode 640 extending to the sixth surface 106 of the main body 100. When the coil assembly 3000 in the example embodiment is mounted on a substrate such as a printed circuit board, the sixth surface 106 of the main body 100 may be the mounting surface. A plurality of signal pads (also known as "pads") and a plurality of ground pads may be formed on the surface of the substrate on which the coil assembly is mounted for connection to other components. In the example embodiment, by configuring the third external electrode 630 and the fourth external electrode 640 to be connected to each other on the sixth surface 106 of the main body 100, the ground pads of the substrate on which the coil assembly is mounted can be easily connected to the first noise removal pattern 510 and the second noise removal pattern 520. Therefore, the mounting process can be easily performed.

[0078] Figure 21 FIG. 1 is a diagram showing a coil assembly according to a modified example and a Figure 19 The diagram corresponds to the cross-sectional surface taken along line V-V' in FIG.

[0079] Reference Figure 21 , the third external electrode 630 and the fourth external electrode 640 in the example embodiment may be configured to surround the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the body 100. In the example embodiment, the third external electrode 630 and the fourth external electrode 640 connected to the noise removal patterns 510 and 520 may be easily formed on the surface of the body 100. In other words, the third external electrode 630 and the fourth external electrode 640 may be easily formed by a printing method such as a screen printing process. Even when the third external electrode 630 and the fourth external electrode 640 are formed by a plating process, the third external electrode 630 and the fourth external electrode 640 may be easily formed by patterning a plating resist in a simplified manner.

[0080] Although not shown, the exemplary embodiment may also be modified to the aforementioned exemplary embodiment.

[0081] Fourth exemplary embodiment Figure 22 is a diagram illustrating a coil component according to another example embodiment. Figure 23 It is along Figure 22 A cross-sectional view taken along line VI-VI'. Figure 24 It is along Figure 22 A cross-sectional view taken along line VII-VII'. Figure 25 : is a diagram showing a connection relationship between a support substrate, a coil portion, and a noise removal portion according to another exemplary embodiment. Figure 22 and Figure 25 , insulating layers applied to example embodiments are not shown to clearly indicate combinations between elements.

[0082] Reference Figures 1 to 4 as well as Figures 22 to 25 In coil component 4000, the arrangement relationship between coil portion 300, noise removal portion 500, first insulating layer 410, and second insulating layer 420 may differ from the arrangement relationship between coil portion 300 and noise removal portion 500 of coil component 1000 described in the aforementioned exemplary embodiment. Therefore, in the exemplary embodiment, only the arrangement relationship between coil portion 300, noise removal portion 500, first insulating layer 410, and second insulating layer 420 will be described. The description of other elements in the exemplary embodiment may be the same as the description of the elements in the aforementioned exemplary embodiment.

[0083] Reference Figures 22 to 25 , the noise removing part 500 in example embodiments may be disposed between the coil part 300 and the support substrate 200 .

[0084] For example, the first noise removing pattern 510 may be in contact with and formed on the lower surface of the support substrate 200, the first coil pattern 311 may be disposed on the first noise removing pattern 510, and the first insulating layer 410 may be disposed between the first noise removing pattern 510 and the first coil pattern 311. Figures 22 to 25The first noise removal pattern 510 and the first coil pattern 311 are electrically insulated from each other in the direction indicated in FIG. The second noise removal pattern 520 may be in contact with and formed on the upper surface of the support substrate 200, the second coil pattern 312 may be disposed on the second noise removal pattern 520, and the second insulating layer 420 may be disposed between the second noise removal pattern 520 and the second coil pattern 312 and may electrically insulate the second noise removal pattern 520 and the second coil pattern 312 from each other. The via 320 connecting the first coil pattern 311 and the second coil pattern 312 to each other may include a first via 321 penetrating the support substrate 200, a second via 322 penetrating the first insulating layer 410, and a third via 323 penetrating the second insulating layer 420. The second via 322 and the third via 323 may penetrate the first insulating layer 410 and the second insulating layer 420, respectively, and may be in contact with and connected to both ends of the first via 321. The second and third via holes 322 and 323 may be spaced apart from the first and second noise removal patterns 510 and 520 , respectively.

[0085] The first via 321, the second via 322, and the third via 323 may be formed using different processes, and boundaries may be formed between the vias. The first via 321, the second via 322, and the third via 323 may also be formed using the same process and may be integrated with each other. When the first via 321, the second via 322, and the third via 323 are formed using different processes, the second via 322 extending through the first insulating layer 410 may cover one end of the first via 321 extending through the support substrate 200. The third via 323 extending through the second insulating layer 420 may cover the other end of the first via 321 extending through the support substrate 200. Therefore, the seed layer of the second via 322 may be interposed between the electroplating layers of the first and second vias 321 and 322, and the seed layer of the third via 323 may be interposed between the electroplating layers of the first and third vias 321 and 323, forming a boundary between the electroplating layers of the first and second vias 321 and 322, and between the electroplating layers of the first and third vias 321 and 323. When the first, second, and third vias 321 and 323 are formed using the same process, the seed layer may be formed on the inner wall of the via hole that penetrates the first insulating layer 410, the support substrate 200, and the second insulating layer 420, and the via hole may be filled with the electroplating layer. In this case, unlike the above process, the first, second, and third vias 321 and 323 can be distinguished from each other by a defined region, rather than by their interface surfaces. In both processes, the seed layer and the electroplating layer of the second via 322 may be integrated with the seed layer and the electroplating layer of the first coil pattern 311, respectively, but example embodiments are not limited thereto. Similarly, the seed layer and the electroplating layer of the third via 323 may be integrated with the seed layer and the electroplating layer of the second coil pattern 312, respectively, but example embodiments are not limited thereto.

[0086] Figure 24An example is shown in which the diameter of the second via 322 may be the same in the upper and lower portions of the second via 322 and the diameter of the third via 323 may be the same in the upper and lower portions of the third via 323, but the example embodiments thereof are not limited thereto. As an example, although not limited thereto, in order to form the second via 322, the second via 322 may be formed using a process for forming a via hole in the first insulating layer 410 so that the diameter of the second via 322 may decrease in a direction from one surface of the first insulating layer 410 in contact with the first coil pattern 311 to another surface of the first insulating layer 410 in contact with the support substrate 200, and in order to form the third via 323, the third via 323 may be formed using a process for forming a via hole in the second insulating layer 420 so that the diameter of the third via 323 may decrease in a direction from one surface of the second insulating layer 420 in contact with the second coil pattern 312 to another surface of the second insulating layer 420 in contact with the support substrate 200. In addition, Figure 24 An example is shown in which both ends of the first via 321 obtained in the thickness direction Z of the main body 100 can directly contact one end of the second via 322 and one end of the third via 323, respectively, but the example embodiment thereof is not limited thereto. As an example, although not limited thereto, via pads spaced apart from the first noise removal pattern 510 and the second noise removal pattern 520 can be formed on both surfaces of the support substrate 200, and the first via 321, the second via 322, and the third via 323 can be respectively in contact with and interconnected with the via pads. By including the via pads, the connection reliability between the first via 321, the second via 322, and the third via 323 can be ensured. The diameter of the via pad may be larger than the diameter of each of the ends of the second via 322 and the third via 323 that are in contact with the via pad, but the example embodiment thereof is not limited thereto. In addition, Figure 24 An example is shown in which the centers of the first, second, and third vias 321, 322, and 323 may match, but example embodiments are not limited thereto. The vias 320 may be configured as staggered vias such that the centers of the first, second, and third vias 321, 322, and 323 may not match.

[0087] In an example embodiment, unlike the aforementioned example embodiments, the noise removal unit 500 may be formed on the support substrate 200, and the coil unit 300 may be formed on the noise removal unit 500. Because the coil unit 300 has a relatively high aspect ratio, when the insulating layers 410 and 420 are disposed on the coil unit 300, it may be difficult to flatten the surfaces of the insulating layers 410 and 420, and thus, it may be difficult to dispose the noise removal unit 500 on the insulating layers 410 and 420. In an example embodiment, to address the above-described problem, the noise removal unit 500 may be preferentially formed on the support substrate 200 to have a relatively simplified pattern shape and a low aspect ratio.

[0088] Although not shown, the exemplary embodiment may also be modified to the aforementioned exemplary embodiment.

[0089] According to the aforementioned exemplary embodiments, noise can be easily removed.

[0090] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations can be made without departing from the scope of the present invention as defined by the appended claims.

Claims

1. A coil assembly comprising: main body; a supporting substrate, embedded in the main body; a first coil pattern and a second coil pattern, wherein the first coil pattern is provided on one surface of the support substrate and one end of the first coil pattern is exposed on the surface of the main body, and the second coil pattern is provided on the other surface of the support substrate and one end of the second coil pattern is exposed on the surface of the main body; a first noise removal pattern and a second noise removal pattern, the first noise removal pattern being spaced apart from the first coil pattern and being provided on a side of the first coil pattern opposite to a side on which the support substrate is provided in a thickness direction of the main body to form an open loop, with one end exposed on a surface of the main body, and the second noise removal pattern being spaced apart from the second coil pattern and being provided on a side of the second coil pattern opposite to a side on which the support substrate is provided in a thickness direction of the main body to form an open loop, with one end exposed on the surface of the main body; a first insulating layer provided between a first end portion of the first coil pattern on a side opposite to the support substrate and the first noise removal pattern in the thickness direction of the support substrate, and continuously provided from the first end portion to the first noise removal pattern in the thickness direction; a second insulating layer provided between a second end portion of the second coil pattern on the side opposite to the support substrate and the second noise removal pattern in the thickness direction, and continuously provided from the second end portion to the second noise removal pattern in the thickness direction; a first external electrode and a second external electrode, wherein the first external electrode is provided on a surface of the main body and connected to the one end of the first coil pattern, and the second external electrode is provided on a surface of the main body and connected to the one end of the second coil pattern; a third external electrode disposed on a surface of the main body and connected to the one end of the first noise removal pattern or the one end of the second noise removal pattern; as well as an insulating film formed along a surface of the first coil pattern, a surface of the second coil pattern, a surface of the first insulating layer, a surface of the second insulating layer, a surface of the first noise removal pattern, and a surface of the second noise removal pattern, The first coil pattern and the first noise removal pattern are formed in a planar spiral shape in the in-plane direction of the main surface of the support substrate, The first coil pattern has a plurality of first coil turns, the first noise removal pattern has a plurality of first noise removal turns, and a winding direction from an innermost turn to an outermost turn among the plurality of first coil turns is the same as a winding direction from an innermost turn to an outermost turn among the plurality of first noise removal turns.

2. The coil assembly according to claim 1, wherein The second coil pattern and the second noise removal pattern are formed in a planar spiral shape in the in-plane direction of the main surface of the support substrate, The second coil pattern has a plurality of second coil turns, the second noise removal pattern has a plurality of second noise removal turns, and a winding direction from an innermost turn to an outermost turn among the plurality of second coil turns is the same as a winding direction from an innermost turn to an outermost turn among the plurality of second noise removal turns.

3. A coil assembly comprising: main body; a supporting substrate, embedded in the main body; a first coil pattern and a second coil pattern, wherein the first coil pattern is provided on one surface of the support substrate and one end of the first coil pattern is exposed on the surface of the main body, and the second coil pattern is provided on the other surface of the support substrate and one end of the second coil pattern is exposed on the surface of the main body; a first noise removal pattern and a second noise removal pattern, the first noise removal pattern being spaced apart from the first coil pattern and being provided on a side of the first coil pattern opposite to a side on which the support substrate is provided in a thickness direction of the main body to form an open loop, with one end exposed on a surface of the main body, and the second noise removal pattern being spaced apart from the second coil pattern and being provided on a side of the second coil pattern opposite to a side on which the support substrate is provided in a thickness direction of the main body to form an open loop, with one end exposed on the surface of the main body; a first insulating layer provided between a first end portion of the first coil pattern on a side opposite to the support substrate and the first noise removal pattern in the thickness direction of the support substrate, and continuously provided from the first end portion to the first noise removal pattern in the thickness direction; a first external electrode and a second external electrode, wherein the first external electrode is provided on a surface of the main body and connected to the one end of the first coil pattern, and the second external electrode is provided on a surface of the main body and connected to the one end of the second coil pattern; as well as a third external electrode disposed on a surface of the main body and connected to the one end of the first noise removal pattern or the one end of the second noise removal pattern; The first coil pattern and the first noise removal pattern are formed in a planar spiral shape in the in-plane direction of the main surface of the support substrate, The first coil pattern has a plurality of first coil turns, the first noise removal pattern has a plurality of first noise removal turns, a winding direction from an innermost turn to an outermost turn of the plurality of first coil turns is the same as a winding direction from an innermost turn to an outermost turn of the plurality of first noise removal turns, and the number of turns of the plurality of first coil turns is different from the number of turns of the plurality of first noise removal turns.

4. The coil assembly according to claim 3, wherein The number of the turns of the plurality of first noise removing turns is smaller than the number of the turns of the plurality of first coil turns.

5. The coil assembly according to claim 3 or 4, wherein: A width of one of the plurality of first coil turns in a direction along the main surface of the support substrate is different from a width of one of the plurality of first noise removal turns. The coil assembly according to claim 5 , wherein: In a direction along the main surface of the support substrate, a width of one of the plurality of first noise removal turns is larger than a width of one of the plurality of first coil turns.

7. The coil assembly according to any one of claims 3 to 6, wherein: The coil component further includes a second insulating layer, the second insulating layer being disposed between a second end portion of the second coil pattern on a side opposite to the support substrate and the second noise removal pattern in the thickness direction, and being continuously disposed along the thickness direction from the second end portion to the second noise removal pattern. The second coil pattern and the second noise removal pattern are formed in a planar spiral shape in the in-plane direction of the main surface of the support substrate, The second coil pattern has a plurality of second coil turns, the second noise removal pattern has a plurality of second noise removal turns, and a winding direction from an innermost turn to an outermost turn among the plurality of second coil turns is the same as a winding direction from an innermost turn to an outermost turn among the plurality of second noise removal turns.

8. The coil assembly according to claim 2 or 7, wherein: When viewed in the direction from the second coil pattern toward the first coil pattern, the winding direction from the innermost turn to the outermost turn among the multiple first coil turns and the multiple first noise removal turns is opposite to the winding direction from the innermost turn to the outermost turn among the multiple second coil turns and the multiple second noise removal turns.

Images