Case of instrument control system

Abstract

The invention discloses a case of an instrument control system, which is characterized in that a plurality of upper guide rails and lower guide rails which are arranged in parallel at intervals are arranged on the inner surfaces of an upper panel and a lower panel of a case body, heat conduction boxes are clamped between two adjacent upper guide rails and between two opposite adjacent lower guide rails, and a board card of a functional module is mounted in each heat conduction box; the two ends of the heat conduction box are both provided with sliding rails, the two sliding rails are clamped to the two adjacent upper guide rails and the two adjacent lower guide rails respectively, and the heat conduction box absorbs heat generated by the board card in a heat exchange mode and conducts the heat to the outside. According to the case of the instrument control system, the combined body of each board card for bearing the function module and the heat conduction box is clamped in the guide rail, so that the shock resistance is improved. Each board card is provided with one heat conduction box for heat exchange, the heat exchange efficiency is high, no fan needs to be arranged, and the cabinet can be provided with more cases; and the waterproof, antibacterial and anti-interference performances of the case are improved, and the adaptability of the case to the application environment of the vehicle-mounted instrument control system is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chassis, and in particular to a chassis of an instrumentation and control system. Background Art

[0002] The chassis is the core component of the safety-grade instrumentation and control system. In application, the design of the chassis needs to consider its ability to adapt to environmental factors such as temperature, humidity, vibration, impact, and EMC to ensure that all electronic equipment can operate safely, stably, and reliably.

[0003] In the chassis of the instrumentation and control system, there are various electronic devices such as communication function modules. In the prior art, a large number of connectors, aviation plugs, etc. need to be set at the rear of the chassis to transmit the signals of the communication function modules to the outside world. These large number of connectors, aviation plugs and other connection elements are connected in a dispersed manner, which affects the connection efficiency. In addition, in order for these communication function modules to work normally, it is usually necessary to configure additional fans to dissipate the heat generated by the operation of these communication function modules in a timely manner. However, after the chassis and fans are installed in the cabinet, the number of chassis installed in the cabinet is limited, which is not suitable for vehicle-mounted instrumentation and control systems, and the noise is high, which affects the operator's experience of use. Moreover, due to the need for heat dissipation, ventilation holes are usually opened on the surface of the chassis, which results in poor sealing of the chassis and cannot meet the needs of the vehicle-mounted application environment. In addition, when fixing these communication function modules, the existing chassis still has problems such as weak structural strength and instability, which cannot meet the seismic requirements of the vehicle-mounted instrumentation and control system. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the above-mentioned defects in the prior art and provide a chassis for an instrumentation and control system.

[0005] The present invention solves the above technical problems through the following technical solutions:

[0006] A chassis for an instrumentation and control system, the chassis comprising a housing, the housing comprising an upper panel and a lower panel, the inner surface of the upper panel being provided with a plurality of spaced-apart, parallel upper guide rails, the inner surface of the lower panel being provided with a plurality of spaced-apart, parallel lower guide rails, a heat conduction box being sandwiched between two adjacent upper guide rails and between two opposing adjacent lower guide rails, a board carrying a functional module of the instrumentation and control system being installed in the heat conduction box;

[0007] Both ends of the heat conduction box are provided with slide rails, and the two slide rails are respectively clamped on the two adjacent upper guide rails and the two adjacent lower guide rails. The heat conduction box absorbs the heat generated by the board in a heat exchange manner and conducts the heat to the outside.

[0008] In this solution, the chassis of the instrumentation and control system, through the cooperation of the upper and lower guide rails and the slide rails, holds the combination of each board carrying a functional module and a thermal conductivity box within it, improving structural strength and stability, thereby enhancing seismic resistance and, consequently, the chassis's adaptability to the seismic resistance requirements of the vehicle-mounted instrumentation and control system. Each board transfers heat to the outside through the thermal conductivity box via heat exchange, dissipating the heat promptly. Since each board is equipped with a thermal conductivity box for contact heat exchange, this contact heat conduction method is superior to air cooling. Therefore, the heat exchange efficiency is high, and no fan is required, which allows for the installation of more chassis within the cabinet and the realization of more functions. Furthermore, the absence of a fan reduces noise and eliminates the need for ventilation holes on the chassis shell, improving the chassis's sealing performance and enhancing its waterproof, antibacterial, and anti-interference properties. As a result, the chassis has improved adaptability to the application environment of the vehicle-mounted instrumentation and control system.

[0009] Preferably, the inner wall of the heat-conducting box is in contact with the mounting surface of the board, and the outer surface of the heat-conducting box is further provided with a plurality of heat dissipation ribs.

[0010] In this solution, the heat absorption area is increased by fitting the inner wall of the heat conduction box to the mounting surface of the board; the heat dissipation area is increased by providing a plurality of heat dissipation ribs on the outer surface of the heat conduction box, thereby improving the heat dissipation effect.

[0011] Preferably, the chassis also includes a front panel and a rear panel, which are respectively sealed and connected to the two ends of the box body along the depth direction, a control switch is provided on the front panel, and a communication connector for communicating with external equipment is provided on the rear panel, and the control switch and the communication connector are respectively electrically connected to at least part of the board cards; the front panel and the rear panel, and all surfaces of the box body between the front panel and the rear panel are closed panels.

[0012] In this solution, the two ends of the box along the depth direction are sealed by the front panel and the rear panel respectively, and closed panels are used on each panel and each surface of the box, so that the chassis is fully enclosed, the sealing is improved, and the waterproof, antibacterial and anti-interference performance levels of the chassis are improved.

[0013] Preferably, the communication connector is integrated with a plurality of wiring ports, and the wiring ports are electrically connected to the board.

[0014] In this solution, the communication connector adopts the above-mentioned integrated wiring port design, which is conducive to the centralized wiring of each board and the communication connector, optimizes the layout inside the chassis, and is conducive to the miniaturization of the chassis; on the other hand, it is convenient to achieve quick connection with external devices of the chassis.

[0015] Preferably, a wire binding rack is installed on the inner side surface of the rear panel, the communication connector is placed in the frame of the wire binding rack, and the wire binding rack is used to fix the wire harness between the board and the communication connector.

[0016] In this solution, the wire harness can be fixed by the wire tie rack provided above, which is also helpful for adjusting the length of the wire harness and preventing vibration from affecting the reliability of the wire harness connection during vehicle-mounted application.

[0017] Preferably, the board card includes a front card and a rear card, and the inner cavity of the box body includes a front card area and a rear card area along the depth direction, and a back plate provided between the front card area and the rear card area;

[0018] The upper guide rail includes a front card upper guide rail located in the front card area and a rear card upper guide rail located in the rear card area, and the lower guide rail includes a front card lower guide rail located in the front card area and a rear card lower guide rail located in the rear card area.

[0019] The heat conduction box includes a front card heat conduction box for mounting the front card and a rear card heat conduction box for mounting the rear card, the slide rails at both ends of the front card heat conduction box are respectively clamped between two adjacent front card upper guide rails and two adjacent front card lower guide rails, and the slide rails at both ends of the rear card heat conduction box are respectively clamped between two adjacent rear card upper guide rails and two adjacent rear card lower guide rails;

[0020] The backplane is provided with a plurality of communication module ports that are connected to each other on both sides along the depth direction, and the front card and the rear card are electrically connected to the communication module ports on both sides along the depth direction of the backplane respectively; the control switch is electrically connected to at least part of the front card, and the communication connector is electrically connected to at least part of the rear card.

[0021] In this solution, the chassis can achieve different functional requirements through the coordination of front and rear cards. The front and rear cards communicate via the communication module ports on both sides of the backplane. The control switch electrically connects to the front card to control its operation; the rear card, electrically connected to the communication connector, enables communication functions such as exchanging signals and transmitting data with external devices.

[0022] Preferably, the inner surface of the upper panel is provided with a backboard upper groove along the width direction, the inner surface of the lower panel is provided with a backboard lower groove along the width direction, and the two ends of the backboard along the height direction are respectively clamped between the backboard upper groove and the backboard lower groove.

[0023] In this solution, the backboard is stably fixed by being clamped in the upper sliding groove and the lower sliding groove provided above, thereby improving the structural strength and earthquake resistance.

[0024] Preferably, at least a portion of the outer surface of the box is provided with a plurality of heat dissipation structures to absorb the heat in the box and conduct it to the outside.

[0025] In this solution, the heat dissipation structure provided above is helpful for the box to dissipate heat to the outside more quickly.

[0026] Preferably, the heat dissipation structure includes a plurality of parallel tooth plates arranged at intervals.

[0027] In this solution, the heat dissipation structure adopts the above-mentioned structural tooth plate, which increases the heat dissipation area and thus improves the heat dissipation effect.

[0028] Preferably, the upper panel and the lower panel are respectively provided with locking parts at the entrance of the heat conduction box into the upper guide rail, and the heat conduction box is provided with an unlocking part that cooperates with the locking part. The unlocking part is rotatably connected to the body of the heat conduction box to clamp or leave the locking part.

[0029] In this solution, the locking and unlocking parts provided above realize the detachable connection between the heat conduction box and the upper guide rail and facilitate replacement; the heat conduction box can also be stably fixed when locked to prevent it from falling off due to vibration in the vehicle application environment.

[0030] The positive and progressive effects of the present invention are as follows: the chassis of the instrumentation and control system, through the cooperation of the upper and lower guide rails and the slide rails, sandwiches the combination of each board carrying a functional module and a thermal conductivity box therein, thereby improving structural strength and stability, thereby enhancing seismic resistance and improving the chassis' adaptability to the seismic resistance requirements of the vehicle-mounted instrumentation and control system. Each board transfers heat to the outside through the thermal conductivity box in a heat exchange manner, promptly dissipating the heat. Since each board is equipped with a thermal conductivity box for heat exchange, rather than using a fan to extract heat from all boards as in the prior art, the heat exchange efficiency is high, and no fan is required. This allows the number of chassis installed in the cabinet to increase, realizing more functions. At the same time, the lack of a fan reduces noise, eliminates the need for ventilation holes on the chassis shell surface, improves the chassis's sealing performance, and provides better moisture resistance. As a result, the chassis has improved adaptability to the application environment of the vehicle-mounted instrumentation and control system. The above-mentioned communication connector adopts an integrated wiring port design, which is beneficial for centralized wiring of each board and communication connector, optimizes the layout inside the chassis, and is beneficial for miniaturization of the chassis; on the other hand, it is convenient to quickly connect with external devices of the chassis. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 Schematic diagram of the three-dimensional structure of the chassis according to an embodiment of the present invention.

[0032] Figure 2 Schematic diagram of the three-dimensional structure of the box body according to an embodiment of the present invention.

[0033] Figure 3 for Figure 2 Schematic diagram of the enlarged structure of local D in the middle.

[0034] Figure 4 2 is a top view of a box according to an embodiment of the present invention.

[0035] Figure 5 for Figure 4 Cross-sectional view along the EE direction.

[0036] Figure 6 Schematic diagram of the three-dimensional structure of the rear panel according to an embodiment of the present invention.

[0037] Figure 7 Schematic diagram of the three-dimensional structure of the backplane according to an embodiment of the present invention.

[0038] Figure 8 This is a schematic structural diagram of the assembled thermal conductive box and board according to an embodiment of the present invention.

[0039] Description of reference numerals:

[0040] Chassis 1

[0041] Box 2

[0042] Front card area 21

[0043] Rear card area 22

[0044] Upper panel 23

[0045] Upper guide rail 231

[0046] Front card upper guide rail 2311

[0047] Rear card upper guide rail 2312

[0048] Upper chute 232

[0049] Lower panel 24

[0050] Lower rail 241

[0051] Front card lower guide rail 2411

[0052] Rear card lower guide rail 2412

[0053] Lower chute 242

[0054] Locking member 25

[0055] Backplane 3

[0056] Communication module port 31

[0057] Heat dissipation structure 4

[0058] Tooth plate 41

[0059] Front Panel 5

[0060] Control switch 51

[0061] Glass window 52

[0062] Rear Panel 6

[0063] Communication connector 61

[0064] Wire Tie Rack 62

[0065] Thermal Conductive Box 7

[0066] Slide 71

[0067] Unlocking piece 72

[0068] Heat dissipation ribs 73

[0069] Board 8

[0070] Pin plug 81

[0071] Depth direction A

[0072] Width direction B

[0073] Height direction C DETAILED DESCRIPTION

[0074] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0075] This embodiment provides a chassis 1 for an instrumentation and control system. The instrumentation and control system is used in nuclear power facilities to control the communications of various associated electronic instruments and equipment. This chassis 1 is a miniaturized chassis 1. After assembly, it is installed in a cabinet (not shown). The cabinet is then installed on a vehicle, implementing a vehicle-mounted instrumentation and control system.

[0076] like Figures 1-8 As shown, the chassis 1 includes a box body 2, a front panel 5 and a rear panel 6. The box body 2 is a square sheet metal frame structure, the front panel 5 is a control panel, and the rear panel 6 is a panel for communication with external devices. The front panel 5 and the rear panel 6 are respectively connected to the front and rear ends of the box body 2 along the depth direction A.

[0077] The housing 2 includes an upper panel 23 and a lower panel 24. The inner surface of the upper panel 23 is provided with a plurality of spaced, parallel upper guide rails 231, while the inner surface of the lower panel 24 is provided with a plurality of spaced, parallel lower guide rails 241. Both the upper and lower guide rails 231 and 241 are metal rails, fixedly attached to the inner surfaces of the upper and lower panels 23 and 24, or integrally formed with the upper and lower panels 23 and 24. A heat conduction box 7 is sandwiched between two adjacent upper guide rails 231 and between two opposing adjacent lower guide rails 241. This is a flat metal box that houses a board 8 containing the functional modules of the instrumentation and control system.

[0078] Both ends of the heat conduction box 7 are provided with slide rails 71, and the two slide rails 71 are respectively clamped on the two adjacent upper guide rails 231 and the two adjacent lower guide rails 241. The heat conduction box 7 absorbs the heat generated by the board 8 in a heat exchange manner and conducts the heat to the outside.

[0079] The chassis 1 of the instrumentation and control system, through the cooperation of the upper and lower guide rails 231 and 241 and the slide rails 71, holds the combination of each board 8 carrying a functional module and the thermal conductivity box 7 therein, thereby enhancing structural strength and stability, thereby improving seismic resistance and enhancing the chassis 1's adaptability to the seismic requirements of vehicle-mounted instrumentation and control systems. Each board 8 transfers heat to the outside through the thermal conductivity box 7 via heat exchange, dissipating the heat promptly. Because each board 8 is equipped with a thermal conductivity box 7 for contact heat exchange, this contact heat conduction method achieves superior cooling performance over air cooling. Consequently, heat exchange efficiency is high, eliminating the need for fans and achieving a fanless cooling design. This increases the number of chassis in the cabinet and enables more functionality. Furthermore, the lack of fans reduces noise and eliminates the need for ventilation holes on the surface of the chassis 1, improving the chassis 1's sealing performance and enhancing its waterproof, antibacterial, and anti-interference properties. Consequently, the chassis 1 improves its adaptability to the application environments of vehicle-mounted instrumentation and control systems.

[0080] Among them, such as Figure 8As shown, the inner wall of the heat-conducting box 7 is attached to the mounting surface of the board 8. The side of the board 8 has two communication pin plugs 81, which are exposed outside the heat-conducting box 7. The outer surface of the heat-conducting box 7 is also provided with a number of heat-dissipating ribs 73. These ribs are of different lengths and are distributed accordingly according to the structure of the outer surface of the heat-conducting box 7. There are many forms of ribs. The sheet metal shell of the heat-conducting box 7 can be milled to form recessed or protruding ribs, or a heat-dissipating tooth structure can be machined. In this structure of the heat-conducting box 7, the heat absorption area is increased by attaching the inner wall of the heat-conducting box 7 to the mounting surface of the board 8. The heat-dissipating area is increased by also providing a number of heat-dissipating ribs 73 on the outer surface of the heat-conducting box 7. Thus, the heat-dissipating effect is improved. In other embodiments, the specific shape and structure of the heat-conducting box 7 can be adjusted accordingly according to the external structure of the board 8 and the needs of other devices that require heat dissipation. When achieving heat exchange, the heat conduction box 7 can also use other methods to achieve heat exchange with the board 8, and is not limited to the method of fitting the mounting surface of the board 8 in this embodiment. For example, a thermal pad or other heat exchange material or structure can also be set between the heat conduction box 7 and the board 8 to achieve better heat exchange effect.

[0081] In this embodiment, the front panel 5 and the rear panel 6 are not only connected to the front and rear ends of the box body 2 along the depth direction A, but also sealedly connected to the box body 2 by means of sealing rings or sealing strips. Two control switches 51 are provided on the front panel 5, and a communication connector 61 for communication with external devices is provided on the rear panel 6. The control switches 51 and the communication connector 61 are electrically connected to at least part of the board 8 respectively; the front panel 5 and the rear panel 6, as well as the surfaces of the box body 2 between the front panel 5 and the rear panel 6 are all closed panels, that is, the front panel 5, the rear panel 6, and the upper panel 23, the lower panel 24 and the two side panels of the box body 2 are all closed flat plate structures without any holes on the surface. In this way, the chassis 1 is fully enclosed, the sealing is improved, and the waterproof, antibacterial and anti-interference performance levels of the chassis 1 are improved. It should be noted here that Figure 1 and Figure 2 In the figure, the front panel 5, the rear panel 6 and the box body 2 have 5 elliptical perforations at both ends in the height direction C. These elliptical perforations are above the upper panel 23 and below the lower panel 24. They are mainly used for binding wires, reducing weight and aesthetics, and do not affect the inner cavity of the closed box body 2.

[0082] Among them, such as Figure 6As shown, the communication connector 61 integrates several wiring ports, which are electrically connected to the board 8. This communication connector 61, also known as the S6 rectangular metal frame connector, can be mixed with common low-frequency, power, high-speed differential, high-frequency, and optical contacts to achieve integrated signal output, reduce the number of cable assemblies in the chassis 1, and achieve interface integration and modularization requirements. The chassis 1 can be quickly disassembled and connected quickly, which facilitates the miniaturization of the chassis 1. It also facilitates quick connection with external devices of the chassis 1.

[0083] Among them, such as Figure 6 As shown, a wire tie rack 62 is installed on the inner side of the rear panel 6. The wire tie rack 62 is a square cage-shaped metal frame. The communication connector 61 is placed in the frame of the wire tie rack 62. The wire tie rack 62 is used to fix the wiring harness between the connecting board 8 and the communication connector 61. That is, if the wiring harness is too long or needs to be fixed uniformly, the wiring harness is fixed on the wire tie rack 62. In this way, the length of the section of the wiring harness connected to the board 8 and the section connected to the communication connector 61 is relatively stable and will not change in length due to vibration or other factors, affecting its connection reliability. Therefore, the wire tie rack 62 can fix the wiring harness and is also conducive to adjusting the length of the wiring harness to prevent vibration from affecting the reliability of the wiring harness connection during vehicle-mounted applications.

[0084] like Figure 2-Figure 5 As shown, in this embodiment, the board 8 includes a front card and a rear card, and the inner cavity of the box body 2 includes a front card area 21 and a rear card area 22 along the depth direction A, and a back plate 3 arranged between the front card area 21 and the rear card area 22; the upper guide rail 231 includes a front card upper guide rail 2311 located in the front card area 21 and a rear card upper guide rail 2312 located in the rear card area 22, and the lower guide rail 241 includes a front card lower guide rail 2411 located in the front card area 21 and a rear card lower guide rail 2412 located in the rear card area 22; the thermal conduction box 7 includes a front card thermal conduction box for installing the front card and a rear card thermal conduction box for installing the rear card, and the slide rails 71 at both ends of the front card thermal conduction box are respectively clamped between the two adjacent front card upper guide rails 2311 and between the two adjacent front card lower guide rails 2411, and the slide rails 71 at both ends of the rear card thermal conduction box are respectively clamped between the two adjacent rear card upper guide rails 2312 and between the two adjacent rear card lower guide rails 2412. A plurality of communication module ports 31 are provided on both side surfaces of the backplane 3 along the depth direction A, and are connected to each other for communication. The front card and the rear card are electrically connected to the communication module ports 31 on both side surfaces of the backplane 3 along the depth direction A respectively; the control switch 51 is electrically connected to at least part of the front card, and the communication connector 61 is electrically connected to at least part of the rear card.

[0085] The front card upper guide rail 2311 and the front card lower guide rail 2411 form a matching pair. Because the front card is longer, the front card upper guide rail 2311 and the front card lower guide rail 2411 are correspondingly longer, and the front card thermal conductivity box is also longer. The rear card upper guide rail 2312 and the rear card lower guide rail 2412 form a matching pair. Because the rear card is shorter, the rear card upper guide rail 2312 and the rear card lower guide rail 2412 are correspondingly shorter, and the rear card thermal conductivity box is also longer. Along the width direction B, the front cards are arranged sequentially from left to right within the front card area 21, and the rear cards are also arranged sequentially from left to right within the rear card area 22. The front cards correspond to the rear cards one-to-one. The front cards are primarily used for signal acquisition, while the rear cards are primarily used for signal transmission. Specifically, the rear cards use a solderless board to interconnect IO signals (i.e., input / output signals) with external interfaces via an integrated communication connector 61. Along the depth direction A, the two communication module ports 31 on the front and rear sides of the backplane 3 at the same position are electrically connected to each other.

[0086] Chassis 1 can accommodate up to 21 basic modules with different functions, allowing for flexible configuration to implement reactor protection, power control, and human-machine interface functions. Basic modules 1 through 8 and 13 through 20 can be configured as four groups of signal and logic processing units, each capable of implementing different logic processing functions. Each logic processing unit group consists of one basic logic processing module and three input / output signal processing modules. (When configured with a temperature input module, chassis 1's internal signal lines are limited to thermocouple signals.) Basic modules 9 through 12 are typically configured as communication modules, responsible for data exchange between application logic modules, chassis 1's external communication interfaces, and human-machine interface units. Module 21 is a dedicated configuration module used to configure chassis 1's serial number and system monitoring signals, and also serves as the chassis' power input interface. The front panel 5 features two control switches 51 and a glass window 52 with a shielded mesh, ensuring airtightness while allowing visibility of the lighting on each module.

[0087] The chassis 1 can achieve different functional requirements through the coordination of the front and rear cards. The front and rear cards communicate via the communication module ports 31 on both sides of the backplane 3. The control switch 51 electrically connects to the front card to control its operation. The rear card, in turn, connects to the communication connector 61 to enable communication functions such as exchanging signals and transmitting data with external devices.

[0088] In other embodiments, the type, number, and shape of the board 8 may vary depending on the application. Therefore, the type of board 8 is not limited to the front and rear board types of this embodiment. It is also possible to have only one type of board 8, or to have a single board 8 that integrates the functions of both front and rear boards. The number of front and rear boards can be adjusted accordingly based on communication needs and is not limited to the 21 basic modules with different functions in this embodiment. The number of integrated connection ports in the communication connector 61 may be greater than the number of rear boards, but it will at least meet the communication connection needs of all rear boards.

[0089] Among them, such as Figure 2 and Figure 5 As shown, the inner surface of the upper panel 23 is provided with an upper groove 232 of the back panel 3 along the width direction B, and the inner surface of the lower panel 24 is provided with a lower groove 242 of the back panel 3 along the width direction B. The two ends of the back panel 3 along the height direction C are respectively clamped between the upper groove 232 of the back panel 3 and the lower groove 242 of the back panel 3. By being clamped in the upper groove 232 and the lower groove 242, the back panel 3 is stably fixed, thereby improving the structural strength and earthquake resistance.

[0090] Furthermore, if Figure 2 and Figure 5 As shown, several heat dissipation structures 4 are attached to the outer surface of the housing 2 to absorb heat from the housing 2 and conduct it to the outside. These heat dissipation structures 4 facilitate faster heat dissipation from the housing 2 to the outside. Specifically, the heat dissipation structure 4 includes several parallel, spaced-apart tooth plates 41. This tooth-shaped heat dissipation structure 4 increases the heat dissipation area, thereby improving the heat dissipation effect. The heat dissipation structure 4 can take many forms, and is not limited to the one in this embodiment.

[0091] like Figure 3 and Figure 8 As shown, the upper panel 23 and the lower panel 24 are each provided with a locking member 25 at the entrance where the thermal conductive box 7 is inserted into the upper guide rail 231. The thermal conductive box 7 is provided with an unlocking member 72 that cooperates with the locking member 25. The unlocking member 72 is elastic and rotatably connected to the body of the thermal conductive box 7. By turning the unlocking member 72, the locking member 25 can be locked to confine the thermal conductive box 7 in the guide rail. The unlocking member 72 can also be turned to separate the locking member 25 from the locking member 25 to remove the thermal conductive box 7 from the guide rail. Therefore, the locking member 25 and the unlocking member 72 achieve a detachable connection between the upper guide rail 231 and the lower guide rail 241 for easy replacement. When locked, they can also stably fix the thermal conductive box 7 to prevent it from falling out due to vibration in an in-vehicle application environment.

[0092] In other implementations, the chassis of the instrumentation and control system designed using this embodiment can also be used in other application scenarios, and is not limited to applications in nuclear power facilities.

[0093] Although specific embodiments of the present invention have been described above, those skilled in the art will appreciate that these are merely illustrative and that the scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, and such changes and modifications are intended to fall within the scope of the present invention.

Claims

1. A chassis of an instrumentation and control system, the chassis comprising a box body, the box body comprising an upper panel and a lower panel, characterized in that: A plurality of upper guide rails are provided on the inner surface of the upper panel and are arranged in parallel at intervals, and a plurality of lower guide rails are provided on the inner surface of the lower panel and are arranged in parallel at intervals. A heat conduction box is sandwiched between two adjacent upper guide rails and between two opposite adjacent lower guide rails, and a board carrying a functional module of the instrumentation and control system is installed in the heat conduction box; Both ends of the heat conduction box are provided with slide rails, and the two slide rails are respectively clamped on the two adjacent upper guide rails and the two adjacent lower guide rails. The heat conduction box absorbs the heat generated by the board in a heat exchange manner and conducts the heat to the outside.

2. The chassis of the instrumentation and control system according to claim 1, characterized in that: The inner wall of the heat-conducting box is in contact with the mounting surface of the board, and the outer surface of the heat-conducting box is provided with a plurality of heat dissipation ribs.

3. The chassis of the instrumentation and control system according to claim 1, characterized in that: The chassis further includes a front panel and a rear panel, the front panel and the rear panel being respectively sealed and connected to both ends of the chassis in the depth direction, the front panel being provided with a control switch, the rear panel being provided with a communication connector for communication with an external device, the control switch and the communication connector being respectively electrically connected to at least part of the board; The front panel, the rear panel, and each surface of the box between the front panel and the rear panel are closed panels.

4. The chassis of the instrumentation and control system according to claim 3, characterized in that: The communication connector is integrated with a plurality of connection ports, and the connection ports are electrically connected to the board card.

5. The chassis of the instrumentation and control system according to claim 4, characterized in that: A wire binding rack is installed on the inner side surface of the rear panel, and the communication connector is placed in the frame of the wire binding rack. The wire binding rack is used to fix the wire harness connecting the board and the communication connector.

6. The chassis of the instrumentation and control system according to claim 3, characterized in that: The board card includes a front card and a rear card, and the inner cavity of the box body includes a front card area and a rear card area along the depth direction, and a back plate provided between the front card area and the rear card area; The upper guide rail includes a front card upper guide rail located in the front card area and a rear card upper guide rail located in the rear card area, and the lower guide rail includes a front card lower guide rail located in the front card area and a rear card lower guide rail located in the rear card area. The heat conduction box includes a front card heat conduction box for mounting the front card and a rear card heat conduction box for mounting the rear card, the slide rails at both ends of the front card heat conduction box are respectively clamped between two adjacent front card upper guide rails and two adjacent front card lower guide rails, and the slide rails at both ends of the rear card heat conduction box are respectively clamped between two adjacent rear card upper guide rails and two adjacent rear card lower guide rails; The backplane is provided with a plurality of communication module ports that are connected to each other on both sides along the depth direction, and the front card and the rear card are electrically connected to the communication module ports on both sides along the depth direction of the backplane respectively; the control switch is electrically connected to at least part of the front card, and the communication connector is electrically connected to at least part of the rear card.

7. The chassis of the instrumentation and control system according to claim 6, characterized in that: The inner surface of the upper panel is provided with a backboard upper groove along the width direction, the inner surface of the lower panel is provided with a backboard lower groove along the width direction, and the two ends of the backboard along the height direction are respectively clamped between the backboard upper groove and the backboard lower groove.

8. The chassis of the instrumentation and control system according to claim 1, characterized in that: At least a portion of the outer surface of the box is provided with a plurality of heat dissipation structures to absorb the heat in the box and conduct it to the outside.

9. The chassis of the instrumentation and control system according to claim 8, characterized in that: The heat dissipation structure includes a plurality of tooth plates arranged in parallel and at intervals.

10. The chassis of the instrumentation and control system according to claim 1, wherein: The upper panel and the lower panel are respectively provided with locking parts at the entrance of the heat conduction box into the upper guide rail. The heat conduction box is provided with an unlocking part that cooperates with the locking part. The unlocking part is rotatably connected to the body of the heat conduction box to clamp or leave the locking part.

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