Micro-nano etching process and equipment for solar cell silicon wafer

Abstract

The invention relates to the technical field of etching, in particular to a micro-nano etching process and equipment for a solar cell silicon wafer, which have the beneficial effects that the micro-nano etching process and equipment for the solar cell silicon wafer comprise a machine body and an etching assembly arranged in the machine body, the machine body is internally provided with a clamping assembly for fixing the silicon wafer and a bearing assembly for bearing the silicon wafer, and the micro-nano etching process and equipment for the solar cell silicon wafer further comprise a separation assembly, the bearing mechanism is arranged in the machine body and comprises a partition plate and torsional spring columns arranged on the two sides of the partition plate, and the bearing mechanism is driven by the driving mechanism to move downwards, so that the partition assembly can prevent etching liquid from being sputtered to the roller sets during etching, the service life of the roller sets is prolonged, and silicon wafers are prevented from being re-polluted when the silicon wafers are transported due to resetting of the roller sets; and when the bearing mechanism moves downwards, the scraping plate can be driven to move on the surface of the partition plate, so that etching precipitates on the surface of the partition plate are scraped, and the precipitates can be conveniently regenerated and recycled when the etching liquid is regenerated.

Description

Technical Field

[0001] The present invention relates to the field of etching technology, in particular to a micro-nano etching process and equipment for solar cell silicon wafers. Background Art

[0002] Solar photovoltaic power generation will become one of the important sources of energy in the future. With the continuous increase in global energy demand, the importance of solar photovoltaic power generation will become increasingly greater. In the manufacturing process of solar cells, especially for the current TBC battery process, the electrode patterns are concentrated on the back of the battery. It is necessary to use micro-nano processing technology to create specific patterns on the electrode surface. Common micro-nano processing technologies include micro-nano spray etching and laser grooving ablation technology.

[0003] Patent document CN116043225B discloses a device and method for etching a microstructure on a curved metal surface, which includes a machine body, a support platform, a mold, and an etching mechanism. The support platform is arranged on the machine body, the mold is installed on the support platform, and the top of the mold is provided with an arc-shaped positioning surface, which is used to support the curved metal; the etching mechanism is used to spray etching liquid onto the upper surface of the curved metal. The application has the ability to achieve different depths and shapes of microstructures etched at different positions.

[0004] During the actual processing, silicon wafers are sent to the roller carrying mechanism inside the etching machine via a conveyor belt. After micro-nano spray etching, they are cleaned with deionized water and then blown dry with high-purity nitrogen before being sent out by the roller carrying mechanism. However, during the spray etching process, the etching liquid has the problem of sputtering and escaping, which can easily wet the roller, causing corrosion to the roller and reducing its service life. In addition, when the roller transports the silicon wafer out of the machine body, the etching liquid on the roller will adhere to the silicon wafer and be carried out. The etching liquid is often an acidic or alkaline liquid such as hydrofluoric acid. After being carried out, it is easy to corrode the machine and affect subsequent processing. If it is contaminated to the etching position, it will cause etching to continue, resulting in uneven etching and reduced processing accuracy. Summary of the Invention

[0005] In view of the deficiencies in the prior art, the present invention provides a micro-nano etching process and equipment for solar cell silicon wafers, which solves the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: A micro-nano etching device for solar cell silicon wafers, comprising a body and an etching assembly disposed within the body, wherein the body is provided with a clamping assembly for fixing the silicon wafer and a supporting assembly for supporting the silicon wafer, and further comprising:

[0007] The partition assembly is arranged in the machine body and includes a partition plate and torsion spring columns arranged on both sides of the partition plate. It is passively opened when the clamping assembly fixes the silicon wafer and drives the carrying assembly to descend, and automatically resets the partition etching assembly and the carrying assembly when the carrying assembly is below it.

[0008] Preferably, the clamping assembly includes a bidirectional electric push rod arranged in the body and a driving member fixedly connected to the output shaft of the bidirectional electric push rod, the driving member is provided with a power rod, and the other end of the power rod is provided with a plate sleeve.

[0009] Preferably, the bearing assembly includes a bearing mechanism and a driving mechanism, the bearing mechanism includes a mounting plate located in the body and a servo motor fixedly mounted on the mounting plate, and a roller assembly is fixedly mounted on the output shaft of the servo motor.

[0010] Preferably, it further comprises driving wheels fixedly mounted on both ends of the roller assembly, wherein the diameter of the driving wheels is larger than the diameter of the rollers on the roller assembly.

[0011] Preferably, a cleaning assembly is further included, the cleaning assembly including telescopic spring columns arranged on both sides of the partition plate and scrapers arranged on the telescopic spring columns, the scrapers are provided with clamping columns, and the driving wheel is provided with a clamping slot.

[0012] Preferably, a sealing assembly is further included, which includes mounting grooves opened on both sides of the body and a sealing plate movably installed in the mounting grooves, a first thin rope is provided on the sealing plate, and the other end of the first thin rope is fixedly connected to the driving member.

[0013] Preferably, a condensation component is also included, which includes an elastic band arranged in the body and a fixing plate fixed to the elastic band, a condensation tube is provided at the bottom of the fixing plate, a second thin rope is fixedly connected to the first thin rope on one side, and the other end of the second thin rope is fixedly connected to the fixing plate.

[0014] Preferably, it also includes a connecting piece fixedly installed at the bottom of the fixing plate, and the other end of the connecting piece is provided with a wiping cotton.

[0015] Preferably, it further comprises a spring sheet fixedly connected to the inner side of the elastic band, and a pinball is fixedly mounted on the other end of the spring sheet.

[0016] A micro-nano etching process for solar cell silicon wafers, using the above-mentioned micro-nano etching equipment for solar cell silicon wafers, comprises the following steps:

[0017] S1: When in use, the silicon wafer is transported to the carrier mechanism, the clamping assembly is activated to fix the silicon wafer, and then the etching assembly is used to etch the silicon wafer;

[0018] S2: When the clamping assembly is started, the driving mechanism drives the carrying mechanism to move downward and pass through the partition assembly, which is used to separate the etching assembly and the carrying mechanism. At this time, the cleaning assembly passively cleans the partition plate.

[0019] S3: When the clamping assembly is activated, it pulls the first thin rope, causing the sealing plate to rise and seal the body to prevent the etching solution from evaporating to the outside;

[0020] S4: The condenser tube can be used to condense the volatile etching liquid, and after the first thin rope is pulled, the condenser tube will be tilted to prevent the condensed beads from falling over a large area and affecting the etching operation.

[0021] In the above technical scheme, the beneficial effect of the present invention is: the driving mechanism drives the supporting mechanism to move downward, so that the partition assembly can prevent the etching liquid from splashing onto the roller group during etching, thereby improving the service life of the roller group and avoiding the roller group resetting to cause re-contamination of the silicon wafer during transportation, thereby affecting the etching accuracy, and when the supporting mechanism moves downward, it will drive the scraper to move on the surface of the partition plate, thereby scraping off the etching precipitates on the surface of the partition plate, which is convenient for the regeneration and recovery of the precipitates when the etching liquid is regenerated.

[0022] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

[0023] This application document provides an overview of various implementations or examples of the technology described in this disclosure, and is not a comprehensive disclosure of the full scope or all features of the disclosed technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the structure of the present invention Figure 1 ;

[0025] Figure 2 Schematic diagram of the structure of the present invention Figure 2 ;

[0026] Figure 3 Schematic diagram of the structure of the present invention Figure 3 ;

[0027] Figure 4 This is a schematic diagram of the positional relationship structure of the clamping assembly, the bearing assembly and the separation assembly of the present invention;

[0028] Figure 5 This is a schematic diagram of the positional relationship between the clamping assembly and the driving mechanism of the present invention;

[0029] Figure 6 It is a structural schematic diagram of the bearing assembly and the separation assembly of the present invention;

[0030] Figure 7This is a schematic structural diagram of the cleaning component of the present invention;

[0031] Figure 8 The structural diagram of the process of the driving wheel driving the partition plate of the present invention Figure 1 ;

[0032] Figure 9 The structural diagram of the process of the driving wheel driving the partition plate of the present invention Figure 2 ;

[0033] Figure 10 It is a schematic diagram of the structures of the condensing component, sealing component and etching component of the present invention.

[0034] In the figure: 1. Machine body; 11. Conveyor trough; 12. Dual-axis slide; 13. First electric push rod; 14. Spray module; 15. Conduit; 16. Identification camera; 17. Conveyor belt; 18. Carrying plate; 2. Bidirectional electric push rod; 21. Driving element; 22. Power rod; 23. Plate sleeve; 24. Second electric push rod; 25. Clamping plate; 26. Guide column; 3. Mounting plate; 31. Servo motor; 32. Roller assembly; 33. Rack; 34. Gear; 35. Sling retracting and releasing wheel; 36. Support frame 4. Partition plate; 41. Torsion spring column; 42. First through slot; 5. Fixed block; 51. Return spring; 52. Telescopic spring column; 53. Scraper; 54. Clamping column; 55. Slide groove; 56. Drive wheel; 57. Clamping groove; 6. Mounting groove; 61. Sealing plate; 62. Second through slot; 63. Elastic column; 64. First thin rope; 65. Guide ring; 7. Elastic belt; 71. Fixed plate; 72. Condenser; 73. Second thin rope; 8. Connector; 81. Wiping cotton; 9. Shrapnel; 91. Pinball. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0036] Example 1: Please refer to Figures 1 to 9 The present invention provides a technical solution: a micro-nano etching device for solar cell silicon wafers, comprising a body 1 and an etching assembly disposed within the body 1, wherein the body 1 is provided with a clamping assembly for fixing the silicon wafer and a supporting assembly for supporting the silicon wafer, and further comprising:

[0037] The partition assembly is arranged in the body 1, and includes a partition plate 4 and a torsion spring column 41 arranged on both sides of the partition plate 4. It is passively opened when the clamping assembly fixes the silicon wafer and drives the carrying assembly to descend, and automatically resets the partition etching assembly and the carrying assembly when the carrying assembly is below it.

[0038] The clamping assembly includes a bidirectional electric push rod 2 arranged in the body 1 and a driving member 21 fixedly connected to the output shaft of the bidirectional electric push rod 2. The driving member 21 is provided with a power rod 22, and the other end of the power rod 22 is provided with a plate sleeve 23.

[0039] The bearing assembly includes a bearing mechanism and a driving mechanism. The bearing mechanism includes a mounting plate 3 in the body 1 and a servo motor 31 fixedly mounted on the mounting plate 3 . A roller assembly 32 is fixedly mounted on the output shaft of the servo motor 31 .

[0040] The roller assembly 32 further includes driving wheels 56 fixedly mounted at both ends of the roller assembly 32 . The diameter of the driving wheels 56 is larger than the diameter of the rollers on the roller assembly 32 .

[0041] The cleaning assembly further includes a telescopic spring column 52 provided on both sides of the partition plate 4 and a scraper 53 provided on the telescopic spring column 52 . The scraper 53 is provided with a clamping column 54 , and a driving wheel 56 is provided with a clamping slot 57 .

[0042] Specifically, the etching assembly includes a dual-axis slide 12, a first electric push rod 13, a spray module 14, a conduit 15, an identification camera 16 and a conveyor belt 17. The dual-axis slide 12 and the first electric push rod 13 are used to adjust the etching stroke. The conduit 15 is fixedly installed on the lower side of the body 1 for recovering the etching liquid. The identification camera 16 is used to identify the thickness of the silicon wafer when it is transported into the body 1 and provide data on the etching depth. This process is completed before the clamping operation. There are two conveyor belts 17, which are located on both sides of the body 1. A carrying plate 18 is also fixedly installed inside the body 1. The carrying plate 18 is located between the gaps of the roller group 32, and the upper surface is at the same level as the top of the roller group 32. Conveying troughs 11 are also provided on both sides of the body 1 for importing and exporting silicon wafers. When in use, the silicon wafer is transported to the roller group 32 through the conveyor belt 17, and then the servo motor 31 is started to drive The roller group 32 rotates to transfer the silicon wafer to the carrying plate 18, and the carrying plate 18 is used to carry the silicon wafer. Then, it is necessary to start the bidirectional electric push rod 2 to drive the driving member 21 to move, so that the driving member 21 drives the power rod 22, and the power rod 22 drives the plate sleeve 23. The bottom of the plate sleeve 23 is higher than the top of the driving wheel 56. A second electric push rod 24 is also fixedly installed in the plate sleeve 23, and a clamping plate 25 is fixedly installed on the output shaft of the second electric push rod 24. When the plate sleeve 23 passes over the driving wheel 56, the second electric push rod 24 is started to drive the clamping plate 25 to descend, so that it contacts the top of the roller group 32, and then the plate sleeve 23 continues to move until the clamping plate 25 clamps the silicon wafer, so as to avoid interference with the driving wheel 56. A guide column 26 is also fixedly installed inside the body 1, and the driving member 21 is movably installed on the outer surface of the guide column 26 for carrying and guiding the driving member 21;

[0043] When the two-way electric push rod 2 is started to clamp the operation, a hydraulic cylinder can be set inside the body 1 as a driving mechanism to drive the mounting plate 3 to move downward. As a preference, the driving mechanism includes a rack 33 fixedly installed at the bottom of the driving member 21 and a gear 34 meshing with the rack 33. A rope retracting wheel 35 is also fixedly installed in the middle of the gear 34. When the driving member 21 moves, it drives the rack 33 to move, so that the rack drives the gear 34 to rotate, and the gear 34 drives the rope retracting wheel 35 to rotate, thereby releasing the steel cable, causing the mounting plate 3 to fall. A support frame 36 is also movably provided between the gear 34 and the rope retracting wheel 35, and the other end of the support frame 36 is fixedly connected to the inner wall of the body 1 for supporting the rope retracting wheel 35; a first through groove 42 adapted to the torsion spring column 41 is provided on the mounting plate 3 to prevent the mounting plate 3 from interfering with the torsion spring column 41. When the plate 3 is lowered, the servo motor 31 needs to be started to adjust the driving wheel 56 and make the clamping slot 57 be just above the clamping column 54. When the clamping slot 57 follows the mounting plate 3 to descend, since the diameter of the driving wheel 56 is larger than the diameter of the roller group 32, the driving wheel 56 will contact the clamping column 54, so as to prevent the etching liquid remaining on the clamping column 54 from contacting the roller group 32 during the previous etching process. At the same time, the driving wheel 56 can also limit the silicon wafer to prevent the silicon wafer from falling from the roller group 32. It should be noted that when this happens, the silicon wafer will contact the driving wheel 56. When clamping, it is necessary to first move the plate sleeve 23 above the silicon wafer and make the clamping plate 25 descend to contact the silicon wafer. Then, continue to move the plate sleeve 23. At this time, the clamping plate 25 will drive the silicon wafer forward so that there is a gap between the silicon wafer and the driving wheel 56. Then, the clamping plate 25 is placed between the silicon wafer and the driving wheel 56 to complete the clamping operation.

[0044] Furthermore, when the driving wheel 56 descends and contacts the clamping column 54, the driving wheel 56 will squeeze the clamping column 54, causing the telescopic end of the telescopic spring column 52 to descend. At this time, the scraper 53 contacts the surface of the partition plate 4. As the driving wheel 56 continues to descend, the partition plate 4 installed in the machine body 1 through the torsion spring column 41 will flip over. When it flips over, the position of the clamping column 54 changes, and it is necessary to start the servo motor 31 to adjust the driving wheel 56 appropriately, as shown in the attached figure. Figure 8 As shown, when the partition plate 4 is flipped to a nearly vertical state, the servo motor 31 needs to be started again to drive the driving wheel 56 to rotate, so that the clamping slot 57 is separated from the clamping column 54, so that the driving wheel 56 can be smoothly moved to the bottom of the partition plate 4. Correspondingly, the roller group 32 will also be under the partition plate 4, and the partition plate 4 is installed inside the body 1 through the torsion spring column 41. When the driving wheel 56 is separated from the clamping column 54, the partition plate 4 is gradually reset under the action of the torsion spring until it is in the horizontal state again. In this way, the etching liquid can be prevented from splashing onto the roller group 32 during etching, thereby increasing the service life of the roller group 32 and preventing the re-contamination of the silicon wafers caused by the reset of the roller group 32 during transportation.

[0045] More specifically, when the driving wheel 56 drives the partition plate 4 to flip, the card column 54 will also drop while flipping, thereby driving the scraper 53 to move on the surface of the partition plate 4, thereby scraping off the etching deposits on the surface of the partition plate 4, and facilitating the regeneration and recovery of the deposits when the etching liquid is regenerated. The cleaning component also includes a fixed block 5 fixed on both sides of the partition plate 4, and a reset spring 51 fixedly connected to the fixed block 5, and the other end of the reset spring 51 is fixedly connected to the sleeve end of the telescopic spring column 52, which is used to reset the scraper 53. The sleeve end of the telescopic spring column 52 is also fixed with a T-shaped protrusion, and the two sides of the partition plate 4 are provided with a slide groove 55 adapted to the protrusion, which is used to limit the telescopic spring column 52 and provide a moving stroke for the scraper 53.

[0046] In the above description, it should be noted that when the mounting plate 3 is installed in the form of a sling, it is necessary to ensure that the weight of the entire bearing mechanism can smoothly drive the partition plate 4 to flip, and at the same time ensure that the spacing between the driving wheel 56 and the partition plate 4 can allow the partition plate 4 to be smoothly reset, and when the roller group 32 completes the reset, the mounting plate 3 and the sling retracting wheel 35 are tightly pressed to prevent it from shaking;

[0047] On the other hand, when arranging the partition plates 4, it is necessary to allow a spacing between the two middle partition plates 4 to facilitate the etching liquid to fall to the bottom of the inner cavity of the body 1. The position of this spacing needs to be between the gaps of adjacent roller groups 32 to avoid contact between the etching liquid and the roller groups 32. This layout will cause adjacent partition plates 4 to flip in opposite directions. Therefore, when the driving wheel 56 is descending and is about to separate from the card column 54, the two partition plates 4 are in a nearly vertical state. At this time, it should be noted that it is necessary to ensure that the direction of the card slot 57 corresponding to each partition plate 4 can be adapted, and the spacing between the driving wheel 56 and the partition plate 4 needs to be greater than the spacing between the partition plate 4 and the card column 54 to prevent the two partition plates 4 from flipping and interfering, as shown in the attached figure. Figure 9 In addition, a sealing rubber pad can be provided on one side of the partition plate 4. When the partition plate 4 is reset, the deformed sealing rubber pad can seal the gap between the partition plates 4 and 4 to prevent the etching liquid from dripping from the gap. Figure 9 As shown in b.

[0048] Example 2: Please refer to Figure 1 、 Figure 2 and Figure 10 , also includes a sealing assembly, the sealing assembly includes mounting grooves 6 opened on both sides of the body 1 and a sealing plate 61 movably installed in the mounting groove 6, a first thin cable 64 is provided on the sealing plate 61, and the other end of the first thin cable 64 is fixedly connected to the driving member 21.

[0049] During the micro-nano etching process, since the volume of the sprayed etching liquid is small, its volatility reaction is also greater, and the volatile components of acid or alkaline are easily dispersed with the air flow from the input and output ports of the equipment, affecting the working environment. The traditional method is to add a negative pressure device on the top of the equipment. However, for micro-nano etching, when the power of the negative pressure device is too large, it is easy to affect the etching accuracy. Specifically, a second through groove 62 adapted to the conveying groove 11 is opened in the middle of the sealing plate 61. When the clamping operation is not performed, the conveying groove 11 coincides with the second through groove 62 for the introduction and export of silicon wafers. On the basis of Example 1, when the bidirectional electric push rod 2 is started to drive When the moving member 21 is driven, the driving member 21 will pull the first thin cable 64, so that the first thin cable 64 pulls the sealing plate 61 upward, thereby staggering the second through groove 62 and the conveying groove 11, and the sealing plate 61 seals the conveying groove 11, thereby preventing the volatile etching liquid components from escaping. A guide ring 65 is also fixedly installed on the inner wall of the body 1. The guide ring 65 is movably installed with the first thin cable 64 for guiding and limiting the first thin cable 64. An elastic column 63 is also fixedly installed at the bottom of the mounting groove 6. The other end of the elastic column 63 is fixedly connected to the bottom of the sealing plate 61 for assisting in resetting the sealing plate 61.

[0050] Example 3: Please refer to Figure 1 and Figure 10 , also includes a condensation component, the condensation component includes an elastic band 7 arranged in the body 1 and a fixing plate 71 fixed to the elastic band 7, a condensation tube 72 is provided at the bottom of the fixing plate 71, a second thin rope 73 is fixedly connected to the first thin rope 64 on one side, and the other end of the second thin rope 73 is fixedly connected to the fixing plate 71.

[0051] The fixing plate 71 further comprises a connecting member 8 fixedly mounted on the bottom of the fixing plate 71 , and a wiping cotton 81 is provided at the other end of the connecting member 8 .

[0052] It also includes a spring piece 9 fixedly connected to the inner side of the elastic band 7, and a spring ball 91 is fixedly installed on the other end of the spring piece 9.

[0053] Specifically, the condenser tube 72 can condense and recover the volatilized etching liquid components, thereby increasing the regeneration amount of the etching liquid and reducing the risk of the volatile components escaping again after the sealing plate 61 is reset and the conveying trough 11 is opened. On the basis of Example 2, when the first thin cable 64 is pulled by the driving member 21, the second thin cable 73 is also pulled by the driving member 21, so that the second thin cable 73 pulls one end of the fixed plate 71. At this time, one end of the elastic band 7 is deformed, causing one side of the condenser tube 72 to tilt. In this way, the condensed beads on the condenser tube 72 can be collected and fallen from one side, thereby preventing the condensed beads on the condenser tube 72 from falling over a large area and causing corrosion to the machine. In addition to the condenser tube 72, the condensation system also includes a condensation circulation device, which is a prior art and will not be described in detail in the present invention.

[0054] Furthermore, when the fixed plate 71 is tilted, the connecting member 8 will be driven to move in an inclined path, so that the wiping cotton 81 can wipe the recognition camera 16, so that the recognition camera 16 can ensure that its shooting surface is clean during the next recognition, thereby improving the accuracy of the silicon wafer thickness data; when one etching is completed, the clamping operation is released at a certain speed. At this time, the fixed plate 71 will be reset when the elastic band 7 recovers its deformation, so that the end of the condensation tube 72 that collects the condensed beads will vibrate, causing the condensed beads to drip, thereby avoiding the existence of condensed beads that have been collected but not dripped, causing the equipment to vibrate and cause them to drip onto the silicon wafer during transportation of the silicon wafer, thereby affecting its etching accuracy. On the other hand, when the elastic band 7 is reset, the spring piece 9 and the ball 91 will also vibrate, thereby bouncing back and forth, touching the fixed plate 71, and assisting the condensed beads to drip.

[0055] A micro-nano etching process for solar cell silicon wafers, using the above-mentioned micro-nano etching equipment for solar cell silicon wafers, comprises the following steps:

[0056] S1: When in use, the silicon wafer is conveyed to the carrier mechanism via the conveyor belt 17, and then the clamping assembly is activated to fix the silicon wafer, and then the etching assembly is used to etch it;

[0057] S2: When the clamping assembly is started, the driving mechanism drives the carrying mechanism to move downward and pass through the partition assembly, which is used to separate the etching assembly and the carrying mechanism. At this time, the cleaning assembly passively cleans the partition plate 4;

[0058] S3: When the clamping assembly is activated, the first thin rope 64 is pulled, causing the sealing plate 61 to rise, thereby sealing the body 1 to prevent the etching liquid from volatilizing to the outside;

[0059] S4: The condenser 72 can be used to condense the volatilized etching liquid. After the first thin rope 64 is pulled, the condenser 72 will be in an inclined state to prevent the condensed beads from falling over a large area and affecting the etching operation.

[0060] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A micro-nano etching device for solar cell silicon wafers, comprising a body (1) and an etching assembly arranged in the body (1), wherein the body (1) is provided with a clamping assembly for fixing the silicon wafer and a supporting assembly for supporting the silicon wafer, characterized in that: Also includes: A separation component is arranged in the machine body (1), comprising a separation plate (4) and torsion spring columns (41) arranged on both sides of the separation plate (4), which is passively opened when the clamping component fixes the silicon wafer and drives the carrying component to descend, and automatically resets the separation etching component and the carrying component when the carrying component is below it.

2. The micro-nano etching device for solar cell silicon wafers according to claim 1, characterized in that: The clamping assembly comprises a bidirectional electric push rod (2) arranged in a machine body (1) and a driving member (21) fixedly connected to an output shaft of the bidirectional electric push rod (2); a power rod (22) is provided on the driving member (21); and a plate sleeve (23) is provided at the other end of the power rod (22).

3. The micro-nano etching device for solar cell silicon wafers according to claim 1, characterized in that: The bearing assembly comprises a bearing mechanism and a driving mechanism. The bearing mechanism comprises a mounting plate (3) located in the machine body (1) and a servo motor (31) fixedly mounted on the mounting plate (3). A roller assembly (32) is fixedly mounted on the output shaft of the servo motor (31).

4. The micro-nano etching device for solar cell silicon wafers according to claim 3, characterized in that: It also includes driving wheels (56) fixedly mounted on both ends of the roller assembly (32), wherein the diameter of the driving wheel (56) is larger than the diameter of the rollers on the roller assembly (32).

5. The micro-nano etching device for solar cell silicon wafers according to claim 4, characterized in that: It also includes a cleaning assembly, which includes telescopic spring columns (52) arranged on both sides of the partition plate (4) and a scraper (53) arranged on the telescopic spring columns (52), a clamping column (54) being provided on the scraper (53), and a clamping groove (57) being provided on the driving wheel (56).

6. The micro-nano etching device for solar cell silicon wafers according to claim 2, characterized in that: The machine body (1) further comprises a sealing assembly, wherein the sealing assembly comprises mounting grooves (6) provided on both sides of the machine body (1) and a sealing plate (61) movably mounted in the mounting grooves (6). A first thin rope (64) is provided on the sealing plate (61), and the other end of the first thin rope (64) is fixedly connected to the driving member (21).

7. The micro-nano etching device for solar cell silicon wafers according to claim 6, characterized in that: The invention also includes a condensation component, which includes an elastic band (7) arranged in the body (1) and a fixing plate (71) fixed to the elastic band (7), a condensation tube (72) is provided at the bottom of the fixing plate (71), a second thin rope (73) is fixedly connected to the first thin rope (64) on one side, and the other end of the second thin rope (73) is fixedly connected to the fixing plate (71).

8. The micro-nano etching device for solar cell silicon wafers according to claim 7, characterized in that: It also includes a connecting piece (8) fixedly mounted on the bottom of the fixing plate (71), and the other end of the connecting piece (8) is provided with a wiping cotton (81).

9. The micro-nano etching device for solar cell silicon wafers according to claim 7, characterized in that: It also includes a spring piece (9) fixedly connected to the inner side of the elastic band (7), and a spring ball (91) is fixedly mounted on the other end of the spring piece (9).

10. A micro-nano etching process for solar cell silicon wafers, using a micro-nano etching device for solar cell silicon wafers according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: When in use, the silicon wafer is transported to the carrier mechanism, the clamping assembly is activated to fix the silicon wafer, and then the etching assembly is used to etch the silicon wafer; S2: When the clamping assembly is started, the driving mechanism drives the carrying mechanism to move downward and pass through the separation assembly, and the separation assembly is used to separate the etching assembly and the carrying mechanism. At this time, the cleaning assembly passively cleans the separation plate (4); S3: When the clamping assembly is activated, the first thin rope (64) is pulled, causing the sealing plate (61) to rise, thereby sealing the machine body (1) to prevent the etching liquid from volatilizing to the outside; S4: The condenser (72) can be used to condense the volatilized etching liquid, and after the first thin rope (64) is pulled, the condenser (72) will be in an inclined state to prevent the condensed beads from falling over a large area and affecting the etching operation.

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