Method of forming integrated circuit (IC) card with visual display

Abstract

A method of forming an integrated circuit (IC) card (10, 100) includes positioning an IC module (24, 102) within a first cavity (43, 116) of a fit substrate (38, 118), positioning a light emitting diode (LED) display (41, 124) within a second cavity (47, 125) of the fit substrate, and electrically connecting the IC module with the LED display to allow data to be transmitted between the IC module and the LED display.

Description

Technical Field

[0001] The present invention relates to a method of forming an integrated circuit (IC) card (also known as a "smart card") having a visual display, such as a light emitting diode (LED) display. Background Art

[0002] In order to reduce fraud in so-called "Card-Not-Present" (CNP) transactions where electronic payment transactions are conducted in the absence of a payment card (such as a prepaid card, debit card or credit card) read by a card reader, the prior art has proposed providing a payment card capable of displaying a dynamic security code, which has a usage restriction, for example, it can only be used once.

[0003] Prepaid and debit cards also exist in the prior art, which have a certain amount of funds already "loaded" into them, allowing users to conduct electronic payment transactions. For most conventional prepaid or debit cards, the card balance can only be determined by establishing a physical and / or electrical connection between the card and a (third-party) card reader with a network connection. The card balance is then displayed on a visual display associated with the card reader. Cardholders may not want third parties to be aware of the card balance.

[0004] It is therefore an object of the present invention to provide a method of forming an IC card (which may be a dual interface card or a contactless card) with a visual display which mitigates the above disadvantages or at least provides a useful alternative to the trade and public. Summary of the Invention

[0005] According to the present invention, a method of forming an integrated circuit (IC) card is provided, comprising positioning an IC module at least partially within a first cavity of a first substrate, positioning a visual display member at least partially within a second cavity of the first substrate, and electrically connecting the IC module to the visual display member to allow data to be transmitted between the IC module and the visual display member. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings, in which: Figure 1 shows the front main surface of a lead frame suitable for use in the method according to the invention; Figure 2 Shown Figure 1 a rear major surface of the lead frame; Figure 3 shows the front major surface of a semi-finished integrated circuit (IC) module suitable for use in accordance with the method of the present invention; Figure 4 Shown Figure 3 The rear main surface of the semi-finished IC module; Figure 5 and 6 Shows the Figure 3 Another step of processing the semi-finished IC to form a finished IC chip suitable for use in the method according to the present invention; Figure 7 The front main surface of the mosaic substrate suitable for forming an IC card according to the method of the present invention is shown; Figure 8 Shown Figure 7 a rear major surface of the mosaic substrate; Figures 9 to 11 shows further steps in forming an IC in a method according to the invention; Figure 12 yes Figure 11 A partial dissected view of the IC card; Figure 13 shows a front view of an assembled IC card; Figure 14 Shown Figure 13 Rear view of the assembled IC card; Figure 15 Shown Figure 13 A cross-sectional view of an IC card; Figure 16 A cross-sectional view showing an IC module suitable for forming a contactless IC card according to another method of the present invention; Figure 17 Shown Figure 16 a front main surface of the IC module; Figure 18 Shown Figure 16 a rear main surface of the IC module; Figure 19 and 20 Shows the Figure 16 Another step of processing the IC module to form a finished IC module suitable for another method of the present invention; Figure 21 The first cavity of the mosaic substrate contains Figure 19 IC modules; Figure 22 Shows the outer substrate with Figure 21 fixedly engaging the chimeric substrates; and Figure 23 Shown Figure 22 A cross-sectional view of an assembled IC card. DETAILED DESCRIPTION

[0007] Figure 1 The front major surface 12 of the lead frame 14 is shown, Figure 2 The rear major surface 16 of the lead frame 14 is shown, and the front major surface 12 of the lead frame 14 is covered by a layer of conductive material (e.g., copper), which is further divided into six regions 18a, 18b, 18c, 18d, 18e, 18f (collectively referred to as "18a-f"). Five of the six regions 18a-f, 18a, 18b, 18c, 18d, 18e, are each electrically connected to a corresponding electrical connection point 20a, 20b, 20c, 20d, 20e (collectively referred to as "20a-e") on the rear major surface 16 of the lead frame 14, for example, each via a corresponding plated through-hole extending through the thickness of the lead frame 14.

[0008] Figure 3 The front major surface 22 of a semi-processed integrated circuit (IC) module 24 is shown. Figure 4 Shown is a rear major surface 26 of a partially completed IC module 24. On the front major surface 22 of the IC module 24 are five electrical connection points 28a, 28b, 28c, 28d, 28e (collectively "28a-e") which, when assembled, are positioned to correspond and align with the electrical connection points 20a-20e on the rear major surface 16 of the lead frame 14.

[0009] The electrical connection points 28a-e on the front major surface 22 of the IC module 24 are each electrically connected to corresponding electrical connection points 30a, 30b, 30c, 30d, 30e on the rear major surface 26 of the IC module 24, such as via corresponding plated through holes extending through the thickness of the IC module 24.

[0010] Figure 5 The rear main surface 26 of the semi-finished IC module 24 is shown, wherein the various electrical connection points 30a, 30b, 30c, 30d, 30e, 30f, 30g, 30h, 30i, 30j, 30k, 30l, 30m are appropriately electrically connected to each other and to the IC chip 32 by wire bonding or flip chip. Figure 6 The IC module 24 is shown with the IC chip 32 protected by a globe 34 made of a protective material to form a fully-processed IC module 24 .

[0011] exist Figure 7 The IC card 10 (see FIG. Figures 13 to 15 ) of the front main surface 36 of the embedded substrate 38, and Figure 8 The rear main surface 39 of the embedded substrate 38 is shown in FIG. The embedded substrate 38 is formed with a first cavity 43 (see FIG. Figure 15), which penetrates the thickness of the embedded substrate 38 and is used to accommodate the finished IC module 24. After the IC module 24 is fully assembled in the first cavity 43 of the embedded substrate 38, the front main surface 22 of the IC module 24 is exposed to the external environment. The embedded substrate 38 also includes a second cavity 47 (see Figure 15 ), which may or may not extend through the thickness of the interlocking substrate 38, is used to accommodate a visual display module, such as an LED module 40 having a data processing unit (such as a microcontroller unit (MCU) 37) and a visual display, which can provide static and / or running visual images and / or patterns. In one embodiment, the visual display can be an LED display 41, which includes a plurality of seven-segment displays for displaying a plurality of digits, for displaying, for example, a dynamic security code used in a CNP transaction involving an IC card 10, a deposit balance in a related debit card or prepaid card, or some other digitally presentable information. In another embodiment, the LED module 40 can include a running LED light module, which can display static and / or running images and / or patterns for providing various visual instructions to the user.

[0012] The IC module 24 is electrically connected to a loop antenna 42 (which may be made of copper) provided on the front main surface 36 of the mating substrate 38 to enable wireless communication between the IC module 24 (and thus the IC card 10 formed by the IC module 24) and the external environment, such as an external card reader (not shown), and / or to enable the IC module 24 (and thus the IC card 10) to receive electromagnetic radiation from the external environment, such as a smartphone (not shown) with near field communication (NFC) capabilities, which is used, for example, to activate the IC module 24 to operate the LED module 40. The IC module 24 is also electrically connected to the LED module 40 via wires 45 to transmit data between the IC module 24 and the LED module 40, such as from the IC module 24 to the LED module 40, for controlling the operation of the LED display screen 41 or the flowing LED light module.

[0013] like Figure 9 As shown, the rear main surface 39 of the mosaic substrate 38 is fixedly joined (for example, by lamination) with a first outer substrate 44 of corresponding size and structure, and the first outer substrate 44 has a through hole or a transparent window. When the mosaic substrate 38 and the first outer substrate 44 are fully assembled with each other, the LED display 41 or the flow LED light module can be seen through the through hole or the transparent window.

[0014] like Figure 10 and 11As shown, to form the IC card 10, the front major surface 36 of the interlocking substrate 38 is fixedly joined (e.g., by lamination) to a second outer substrate 46 of corresponding size and configuration. The second outer substrate 46 is formed with a through hole or cavity 48 that is sized and configured to accommodate the lead frame 14. The through hole or cavity 48 can be formed before the second outer substrate 46 is laminated to the interlocking substrate 38, or after the second outer substrate 46 is laminated to the interlocking substrate 38 (e.g., by grinding away material from the second outer substrate until the front major surface 22 of the IC module 24 is exposed to the external environment). When the lead frame 14 is fully assembled and accommodated in the through hole 48 of the second outer substrate 46, the lead frame 14 is electrically connected to the IC module 24 via a conductive adhesive material, such as an anisotropic conductive (ACF) hot melt film or tape 50.

[0015] like Figure 12 As more clearly shown in FIG, the electrical connection points 20a-e on the rear major surface 16 of the lead frame 14 include tin or gold contact balls 52, which will make electrical and physical contact with the ACF hot melt film or tape 50 when the lead frame 14 is fully assembled with the IC card 10. The ACF hot melt film or tape 50 is sandwiched between the lead frame 14 and the IC module 24 and is fixedly bonded to the lead frame 14 and the IC module 24 (e.g., by lamination). With this arrangement, the IC module 24 is electrically connected to the lead frame 14 and is in a bidirectional data communication relationship with each other.

[0016] Although the first outer substrate 44 and the second outer substrate 46 are both referred to as "outer" substrates, it should be noted that these two outer substrates may not be the outermost layers of the final IC card 10. For example, a graphic substrate and / or a protective substrate may be provided to further cover the first outer substrate 44 and / or the second outer substrate 46, while always ensuring that the LED display 41 or the flow LED light module can be seen from the outside and that the front main surface 12 of the lead frame 14 is exposed to the external environment.

[0017] like Figure 13 As shown, it shows a front view of the IC card 10, with the front main surface 16 of the lead frame 14 exposed to the external environment, thereby allowing the IC card 10 to physically contact an external card reader (not shown) to establish two-way data communication between the IC card 10 and the external card reader.

[0018] like Figure 14 , which shows a rear view of the IC card 10, with the LED display 41 visible through a hole in the rear main surface 56 of the IC card 10. As in other conventional prepaid cards, debit cards, or credit cards, a magnetic stripe 58 and a signature area 60 are provided on the rear main surface 56 of the IC card 10. It can be seen that in the case where the front main surface 12 of the lead frame 14 is exposed to the external environment through the front side of the IC card 10 (e.g., Figure 13As shown), the LED display 41 is visible through the opposite back side of the IC card 10 (as shown Figure 14 shown).

[0019] Figure 15 A cross-sectional view of an IC card 10 is shown. A nested substrate 38 is sandwiched between a first outer substrate 44 and a second outer substrate 46 and fixedly bonded to the first and second outer substrates 44, 46 (e.g., by lamination). A lead frame 14 is housed within a through-hole 48 of the second outer substrate 46 and electrically connected to the IC module 24 housed within a first cavity 43 of the nested substrate 38 via an ACF hot-melt film or adhesive tape 50. An LED module 40 is also housed within a second cavity 47 within the nested substrate 38. Although nested substrate 38 is disclosed as being sandwiched between the first and second outer substrates 44, 46, it is contemplated that the first and / or second outer substrates 44, 46 may not be in direct contact with the nested substrate 38. For example, one or more intermediate substrate layers may be provided between the nested substrate 38 and the first and / or second outer substrates 46 for functional or structural reasons.

[0020] Although the IC card 10 is a dual-interface card that allows (i) the IC card 10 to communicate data with an external card reader (not shown) via the loop antenna 42 or to wirelessly receive electromagnetic radiation from an external smartphone (not shown) with NFC functionality, and (ii) the IC card 10 to communicate data with an external card reader (not shown) by physical contact via the lead frame 14, the present invention also relates to a method of forming a contactless IC card with a visual display.

[0021] Figure 16 The present invention is suitable for forming a non-contact IC card 100 (see Figure 23 ) is a cross-sectional view of the IC module 102. Figure 17 The front major surface 104 of the IC module 102 is shown, and Figure 18 The rear major surface 106 of the IC module 102 is shown.

[0022] Unlike the IC module 24 of the IC card 10 described above, the IC module 102 does not necessarily establish an electrical connection with the lead frame. The front main surface 104 of the IC module 102 is provided with four electrical connection areas 108a, 108b, 108c, and 108d (collectively referred to as "108a-d"), each of which is electrically connected to a corresponding electrical connection point 110a, 110b, 110c, and 110d (collectively referred to as "110a-d") on the rear main surface 106 of the IC module 102, for example, via a corresponding plated through-hole extending through the thickness of the IC module 102. An IC chip 112 is also fixedly bonded to the rear main surface 106 of the IC module 102.

[0023] The IC chip 112 is further processed by electrically connecting the electrical connection points 110a-d to the IC chip 112, such as by wire bonding or flip chip bonding. Figure 18 The IC module 102 shown in FIG. Figure 19 As shown. Figure 20 As shown, the IC chip 112 is protected by an encapsulation body 114 made of a protective material for further processing. Figure 19 The IC module 102 is shown to form a finished IC module 102.

[0024] like Figure 21 As shown in FIG, the IC module 102 is accommodated in the first cavity 116 of the embedded substrate 118 (see FIG. Figure 23 ). The IC module 102 is electrically connected to a loop antenna 120 (e.g., made of copper wire) laid on the interlocking substrate 118, thereby enabling the IC module 102 to establish two-way wireless data communication with an external card reader (not shown). The IC module 102 is also electrically connected to a visual display module, such as an LED module 122, via an electrical wire 121. The LED module 122 is housed in a second cavity 125 of the interlocking substrate 118, and the LED module 122 has a data processing unit (e.g., a microcontroller unit 123) and a visual display, such as an LED display 124 (e.g., an LED display including multiple seven-segment displays or a flow LED display module). This arrangement allows data to be transmitted between the IC module 102 and the LED module 122 (e.g., from the IC module 102 to the LED module 122), for example, allowing the IC module 102 to control the operation of the LED display 124 or the flow LED display module. Additionally, loop antenna 120 allows IC module 102 to receive electromagnetic radiation from the external environment, such as an NFC-enabled smartphone (not shown), to activate IC module 102 to operate LED module 122 .

[0025] like Figure 22 As shown in the figure, the first outer substrate 126 of corresponding size and structure is fixedly joined to the interlocking substrate 118 (for example, by lamination) to protect the various parts and components assembled into or onto the interlocking substrate 118, except for leaving a through hole or transparent window, which allows the LED display 124 or the flow LED display module to be observed from the outside.

[0026] Steering Figure 23 It can be seen that in the contactless IC card 100, the second external substrate 128 of corresponding size and structure is fixedly joined to the mosaic substrate 118 (for example, by lamination), so that the mosaic substrate 118 is sandwiched between the first external substrate 126 and the second external substrate 128 and fixedly joined to the first external substrate 126 and the second external substrate 128.

[0027] Likewise, although the first outer substrate 126 and the second outer substrate 128 are referred to as "outer" substrates, it should be noted that these two outer substrates may not be the outermost layers of the final IC card 100. For example, a graphic substrate and / or a protective substrate may be provided to further cover the first outer substrate 126 and / or the second outer substrate 128 while always ensuring that the LED display 124 can be seen from the outside.

[0028] Furthermore, although the intercalating substrate 118 is disclosed as being sandwiched between the first outer substrate 126 and the second outer substrate 128, it is contemplated that the first outer substrate 126 and / or the second outer substrate 128 may not be in direct contact with the intercalating substrate 118. For example, one or more intermediate substrate layers may be disposed between the intercalating substrate 118 and the first outer substrate 126 and / or between the intercalating substrate 118 and the second outer substrate 128 for functional or structural reasons.

[0029] It should be understood that the above embodiments merely illustrate examples of how the present invention may be implemented, and that various modifications and / or adjustments may be made to the above embodiments without departing from the spirit of the present invention.

[0030] It should also be understood that certain features of the invention described in the context of separate embodiments, for clarity of presentation, may be provided in combination in a single embodiment. Conversely, various features of the invention described in the context of a single embodiment, for brevity, may also be presented separately or in any suitable subcombination.

Claims

1. A method of forming an integrated circuit (IC) card, comprising: positioning the IC module at least partially within the first cavity of the first substrate; positioning a visual display member at least partially within the second cavity of the first substrate; as well as The IC module and the visual display member are electrically connected to allow data to be transferred between the IC module and the visual display member.

2. The method according to claim 1, wherein The IC module is adapted to control the operation of the visual display member.

3. The method according to claim 1 or 2, wherein: The visual display component includes a data processing unit and a visual display unit.

4. The method according to claim 3, wherein: The visual display unit includes a light emitting diode (LED) display or an LED flowing light display.

5. The method according to claim 3, wherein: The data processing unit includes a microcontroller unit (MCU).

6. The method according to claim 1 or 2, further comprising: The lead frame is fixedly joined and electrically connected to the IC module.

7. The method according to claim 6, wherein: The lead frame and the IC module are fixedly bonded to each other and electrically connected via a conductive adhesive layer.

8. The method according to claim 7, wherein: The conductive adhesive layer includes an anisotropic conductive (ACF) hot melt film or tape.

9. The method according to claim 6, further comprising: A second substrate is fixedly coupled to the first substrate, wherein the second substrate comprises a through hole or a third cavity for at least partially accommodating the lead frame.

10. The method according to claim 6, wherein: The lead frame is exposed to the external environment through a first side of the IC card, and the visual display member is visible through an opposing second side of the IC card.

Images