Exhaust system and electroplating equipment

Abstract

The present invention discloses an exhaust system and electroplating equipment, relating to the field of semiconductor manufacturing technology. In a first direction, an exhaust device is provided for each of the two corresponding electroplating spaces, and the exhaust device connects the bottom mounting surface of the lower electroplating cavity and the top mounting surface of the upper electroplating cavity in the first direction, so that the height of the exhaust device covers the electroplating cavities of the two electroplating spaces. In a second direction, the exhaust device connects the front and rear mounting surfaces of the electroplating cavities of the two corresponding electroplating spaces, so that the width of the exhaust device covers the electroplating cavities of the two corresponding electroplating spaces. An exhaust port connected to the electroplating cavities of the two electroplating spaces is provided on one side of the exhaust device close to the electroplating cavity. The exhaust device can simultaneously exhaust the electroplating cavities of the two electroplating spaces through the exhaust port to extract exhaust gas generated in the electroplating cavity during electroplating and / or non-electroplating periods to the outside.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to an air exhaust system and electroplating equipment. BACKGROUND

[0002] In the electroplating process of semiconductor wafers, the electroplating equipment realizes the deposition of metal film by configuring electroplating tanks and electroplating cavities. In order to meet the requirements of specific processes, the electroplating solution needs to be heated to a specific temperature. In this process, the closed electroplating tank and the semi-closed electroplating cavity will continuously emit corrosive acidic and alkaline gases, and may also produce toxic gases. If these exhaust gases are directly discharged without treatment into a dust-free workshop, not only will the environment be polluted and the health of the human body be affected, but also the precision equipment in the workshop will be corroded.

[0003] At present, the electroplating equipment generally uses a pipeline type air exhaust system for treatment, which includes dispersedly arranged air exhaust pipelines connected to each electroplating unit, occupies a large space, and leads to an increase in the size of the equipment, which is not conducive to the use and installation in a narrow space. SUMMARY

[0004] The purpose of the present application is to provide an air exhaust system and electroplating equipment to reduce the occupied space of the air exhaust system in the electroplating equipment, improve the space utilization rate, and improve the installation applicability of the electroplating equipment.

[0005] To achieve this purpose, the present application adopts the following technical solutions:

[0006] An air exhaust system for electroplating equipment, wherein two layers of electroplating spaces are provided in the electroplating equipment, each layer of electroplating space is provided with at least one group of electroplating cavities, the electroplating cavities of the upper layer of electroplating space and the electroplating cavities of the lower layer of electroplating space correspond to each other in a first direction, and one group of electroplating cavities includes two electroplating cavities arranged side by side, wherein,

[0007] An air exhaust device is provided corresponding to the electroplating cavities of the two layers of electroplating spaces arranged corresponding to each other in the first direction, and the air exhaust device is connected to the bottom mounting surface of the electroplating cavities of the lower layer of electroplating space and the top mounting surface of the electroplating cavities of the upper layer of electroplating space in the first direction, so that the height of the air exhaust device covers the electroplating cavities of the two layers of electroplating spaces in the first direction;

[0008] In a second direction, the air exhaust device is connected to the front and rear mounting surfaces of the electroplating cavities of the two layers of electroplating spaces arranged corresponding to each other, so that the width of the air exhaust device covers the electroplating cavities of the two layers of electroplating spaces in the second direction;

[0009] The air exhaust device is correspondingly provided with air exhaust ports connected to the electroplating cavities in different layers of the electroplating space on one side of the electroplating cavity, and the air exhaust device can simultaneously exhaust the electroplating cavities in different layers of the electroplating space through the air exhaust ports to exhaust the waste gas generated in the electroplating cavities during electroplating and / or non-electroplating to the outside.

[0010] As an optional solution of the air exhaust system, the air exhaust device is installed on the left side or the right side of the upper and lower groups of electroplating cavities corresponding to the top mounting surface, the bottom mounting surface and the front and rear mounting surfaces of the upper and lower groups of electroplating cavities.

[0011] As an optional solution of the air exhaust system, the thickness of the air exhaust device is less than the width of the air exhaust device, and the thickness of the air exhaust device is 1-10 cm.

[0012] As an optional solution of the air exhaust system, a group of electroplating cavities in the lower layer of the electroplating space is provided below the electroplating tank, the air exhaust device is connected to the electroplating tank, and the air exhaust device can exhaust the electroplating tank to exhaust the waste gas generated in the electroplating tank during electroplating and / or non-electroplating to the outside while synchronously exhausting the waste gas generated in the electroplating tank during electroplating and / or non-electroplating to the outside.

[0013] As an optional solution of the air exhaust system, the electroplating tank is provided with two electroplating tanks, one of which provides electroplating liquid for a group of electroplating cavities in the lower layer of the electroplating space, and the other of which provides electroplating liquid for a group of electroplating cavities in the upper layer of the electroplating space, and one air exhaust device is connected to the two electroplating tanks and can simultaneously exhaust the two electroplating tanks.

[0014] As an optional solution of the air exhaust system, the air exhaust device further comprises at least one air exhaust plate, the air exhaust plate is closed to form an air exhaust cavity, the air exhaust port and the electroplating tank are in communication with the air exhaust cavity, and the top of the air exhaust cavity is provided with an exhaust port.

[0015] As an optional solution of the air exhaust system, the air exhaust cavity is provided with a gas-liquid separation structure, which is used to separate the liquid in the gas entering the air exhaust cavity to discharge dry gas through the exhaust port.

[0016] As an optional solution of the air exhaust system, the gas-liquid separation structure comprises a first condensing plate, the first condensing plate is arranged on the opposite two inner walls of the air exhaust cavity, and the first condensing plate on one of the inner walls and the first condensing plate on the other of the inner walls are respectively staggered and inclined upward to form a continuous air exhaust channel.

[0017] As an optional solution of the air extraction system, the gas-liquid separation structure further comprises a second condensing plate, which is arranged opposite to the air extraction pipe connected with the electroplating tank.

[0018] As an optional solution of the air extraction system, the second condensing plate comprises a first plate and a second plate, which are arranged downwardly at a preset included angle.

[0019] As an optional solution of the air extraction system, the bottom of the air extraction plate is provided with a liquid collecting groove, which is provided with a first liquid discharge port, and the first liquid discharge port is communicated with the air extraction cavity.

[0020] As an optional solution of the air extraction system, the air extraction device further comprises an adapter box, each shunt port of the adapter box is communicated with an exhaust passage of one electroplating cavity, and the converging port of the adapter box is communicated with the air extraction port.

[0021] As an optional solution of the air extraction system, the adapter box comprises a bearing disc and an adapter disc arranged at the bottom of the bearing disc, the bearing disc is used for bearing the electroplating cavity; a converging cavity is formed between the bottom wall of the bearing disc and the adapter disc, and the shunt port is communicated with the exhaust passage of the electroplating cavity and the converging cavity.

[0022] As an optional solution of the air extraction system, the flow passage cross section of the converging cavity gradually decreases from one end where the shunt port is located to the other end where the converging port is located.

[0023] As an optional solution of the air extraction system, the bottom of the adapter disc is provided with a second liquid discharge port.

[0024] An air extraction system for an electroplating device, the electroplating device is provided with a single-layer electroplating space, the electroplating space is provided with at least one group of electroplating cavities, and one group of electroplating cavities comprises two electroplating cavities arranged side by side, wherein,

[0025] One air extraction device is arranged corresponding to one group of electroplating cavities in a first direction, and the air extraction device is connected with the bottom mounting surface and the top mounting surface of one group of electroplating cavities in the first direction, so that the height of the air extraction device covers one group of electroplating cavities in the first direction; the air extraction device is connected with the front and rear mounting surfaces of one group of electroplating cavities in a second direction, so that the width of the air extraction device covers one group of electroplating cavities in the second direction.

[0026] The side of the air extraction device close to the electroplating cavities is provided with an air extraction port connected with one group of electroplating cavities, and the air extraction device can extract the exhaust gas generated during electroplating and / or non-electroplating from the electroplating cavities to the outside through the air extraction port.

[0027] As an optional solution of the air extraction system, an electroplating tank is arranged below the electroplating cavity, and the air extraction device is connected with the electroplating tank, so that the electroplating tank can be air extracted to extract the exhaust gas generated in the electroplating cavity during electroplating and / or non-electroplating to the outside while synchronously extracting the exhaust gas generated in the electroplating tank during electroplating and / or non-electroplating to the outside.

[0028] The electroplating equipment comprises the air extraction system according to any one of the preceding solutions.

[0029] The present application has the following beneficial effects:

[0030] The air extraction system is used for the electroplating equipment. The electroplating equipment comprises two layers of electroplating spaces, each of which is provided with at least one group of electroplating cavities. The electroplating cavities of the upper electroplating space correspond to the electroplating cavities of the lower electroplating space in the first direction. In the first direction, the electroplating cavities of the two layers of electroplating spaces correspond to each other and are provided with an air extraction device. The air extraction device is connected with the bottom mounting surface of the lower electroplating cavity and the top mounting surface of the upper electroplating cavity in the first direction, so that the height of the air extraction device covers the electroplating cavities of the two layers of electroplating spaces arranged correspondingly in the first direction. In the second direction, the air extraction device is connected with the front and rear mounting surfaces of the electroplating cavities of the two layers of electroplating spaces arranged correspondingly, so that the width of the air extraction device covers the electroplating cavities of the two layers of electroplating spaces in the second direction. The side of the air extraction device close to the electroplating cavities is provided with air extraction ports connected with the electroplating cavities in different layers of electroplating spaces, respectively. The air extraction device can simultaneously extract the exhaust gas of the electroplating cavities in different layers of electroplating spaces through the air extraction ports to extract the exhaust gas generated in the electroplating cavities during electroplating and / or non-electroplating to the outside. The air extraction device of the air extraction system can simultaneously extract the exhaust gas of the electroplating cavities of the two layers of electroplating spaces, greatly saves the horizontal and vertical space of the electroplating equipment, and facilitates the production line layout. Meanwhile, the air extraction device serves as a component for mounting and separating space, and the need for independent mounting bracket and partition is eliminated. On the basis of realizing efficient and centralized exhaust gas treatment, the space utilization rate is significantly improved, and the dual optimization of structure simplification and function integration is realized.

[0031] The electroplating equipment provided by the present application comprises the air extraction system described above. The air extraction device of the air extraction system not only realizes the confluence and centralized discharge of the exhaust gas of the electroplating cavities of the two layers of electroplating spaces, but also serves as a partition for the electroplating space and a mounting component for mounting the electroplating cavities, thereby realizing a highly compact modular layout. The air extraction device not only provides stable support for the centralized extraction and discharge of the exhaust gas, but also significantly optimizes the space topology structure of the equipment, thereby ensuring the synergistic effect of the overall rigidity and space utilization rate of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 FIG. 1 is a first structural schematic diagram of the electroplating equipment provided by the first embodiment of the present application;

[0033] Figure 2 is the front view of the electroplating equipment provided by the embodiment one of the present application;

[0034] Figure 3 is the structural schematic view of the air exhaust device of the electroplating equipment provided by the embodiment one of the present application;

[0035] Figure 4 is the second structural schematic view of the electroplating equipment provided by the embodiment one of the present application;

[0036] Figure 5 is the front view of the air exhaust device of the electroplating equipment provided by the embodiment one of the present application;

[0037] Figure 6 is the sectional view of the A-A direction in the Figure 5

[0038] Figure 7 is the first structural schematic view of the air exhaust adapter box provided by the embodiment one of the present application;

[0039] Figure 8 is the second structural schematic view of the air exhaust adapter box provided by the embodiment one of the present application;

[0040] Figure 9 is the top view of the air exhaust adapter box provided by the embodiment one of the present application;

[0041] Figure 10 is the sectional view of the B-B direction in the Figure 9

[0042] is the sectional view of the other direction of the air exhaust plate provided by the embodiment one of the present application; Figure 11

[0043] Figure 12 is the structural schematic view of the connection between the liquid collecting groove and the second air exhaust pipe provided by the embodiment one of the present application.

[0044] in the figure:

[0045] 100, rack;

[0046] 201, electroplating cavity; 202, electroplating tank;

[0047] 1, air exhaust plate; 11, air exhaust cavity; 12, first air exhaust port; 13, air exhaust port;

[0048] 21, first condensing plate; 22, second condensing plate; 221, first plate; 222, second plate;

[0049] ​​3, adapter box; 31, branch port; 32, merging port; 33, bearing disc; 331, first protrusion; 3311, first sealing groove; 332, second protrusion; 3321, second sealing groove; 34, adapter disc; 341, second liquid outlet; 35, merging cavity;

[0050] 41, first suction pipe; 42, second suction pipe;

[0051] 5, liquid collecting groove; 51, first liquid outlet;

[0052] 6, exhaust pipe. DETAILED DESCRIPTION

[0053] Embodiments of the present application are described in detail below with reference to the accompanying drawings. The same or similar components are denoted by the same or similar reference numerals throughout the drawings. The embodiments described below are exemplary and are intended to explain the present application, and should not be understood as limiting the present application.

[0054] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only intended to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions.

[0055] Unless otherwise clearly specified and limited, the terms "mounting", "connection", "connecting", "fixing" should be understood broadly, for example, can be fixed connection, can also be detachable connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0056] Unless specifically stated and defined otherwise, the "on" or "under" of a first feature in relation to a second feature can include that the first feature and the second feature are in direct contact, or that the first feature and the second feature are not in direct contact but are in contact through another feature between them. Moreover, the "on", "above" and "over" of the first feature in relation to the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The "under", "below" and "underneath" of the first feature in relation to the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0057] The technical solutions of the present application will be further illustrated below in combination with the drawings and through specific embodiments.

[0058] Embodiment one:

[0059] As shown in Figure 1 and Figure 2 , the present embodiment provides a plating equipment, which includes a rack 100, and two layers of plating spaces are arranged in the plating equipment, as the two layers of plating spaces shown in the figure. It should be noted that only part of the plating cavities 201 in the plating equipment is shown in the figure. Each layer of plating space is provided with at least one group of plating cavities 201, and the plating space in the rack 100 is used to install the plating cavities 201. The plating cavities 201 of the upper layer of plating space correspond to the plating cavities 201 of the lower layer of plating space in the first direction, and a group of plating cavities 201 includes two plating cavities 201 arranged side by side. A plating tank 202 is arranged below a group of plating cavities 201 in the lower layer of plating space, and the plating tank 202 provides plating liquid for the plating cavities 201.

[0060] Exemplarily, the two layers of plating spaces are an upper layer of plating space and a lower layer of plating space. Each layer of plating space is provided with a group of plating cavities 201, and a group of plating cavities 201 includes two plating cavities 201. Two plating tanks 202 are arranged below the plating cavities 201 in the lower layer of plating space, and one of the plating tanks 202 provides plating liquid for a group of plating cavities 201 in the lower layer of plating space. The other plating tank 202 provides plating liquid for a group of plating cavities 201 in the upper layer of plating space.

[0061] Of course, in other embodiments, according to the installation space of the plating equipment, three, four or more layers of plating spaces can also be arranged in the plating equipment, and one or more groups of plating cavities 201 are arranged in each plating space.

[0062] The gas volatilized in the electroplating cavity 201 and the electroplating tank 202 during electroplating or non-electroplating of the electroplating equipment is corrosive and may be accompanied by the generation of toxic gas. If these exhaust gases are directly discharged to the clean workshop without treatment, not only the environment is polluted and the human body is affected, but also the precision equipment in the workshop is corroded. The traditional exhaust gas discharge system generally uses a pipeline type exhaust system for treatment, which includes a plurality of dispersedly arranged exhaust pipelines, occupies a large space in the electroplating equipment, and causes the volume of the electroplating equipment to increase, which is not conducive to the use and installation in a narrow space.

[0063] To solve the above technical problems, the embodiment provides an exhaust system. The exhaust device of the exhaust system is installed on the rack 100. In the first direction, the height of the exhaust device covers the electroplating cavities 201 of the two layers of electroplating spaces. In the second direction, the width of the exhaust device covers the electroplating cavities 201 of the two layers of electroplating spaces. Thus, one exhaust device can concentrate the exhaust gas of two or more groups of electroplating cavities 201 in the two layers of electroplating spaces, greatly saves the horizontal and vertical space of the electroplating equipment, and facilitates the production line layout. Meanwhile, the exhaust device serves as a component for mounting and separating space, and the need for independent mounting brackets and partitions is eliminated. On the basis of realizing efficient and centralized exhaust gas treatment, the space utilization rate is significantly improved, and the dual optimization of structural simplification and function integration is realized.

[0064] The two layers of electroplating spaces corresponding to each other in the first direction are provided with one exhaust device, and the exhaust device is connected to the bottom mounting surface of the electroplating cavity 201 of the lower layer of electroplating spaces and the top mounting surface of the electroplating cavity 201 of the upper layer of electroplating spaces in the first direction, so that the height of the exhaust device covers the electroplating cavities 201 of the two layers of electroplating spaces in the first direction.

[0065] The exhaust device is connected to the front and rear mounting surfaces of the two layers of electroplating spaces corresponding to each other in the second direction, so that the width of the exhaust device covers the electroplating cavities 201 of the two layers of electroplating spaces in the second direction.

[0066] The side of the exhaust device close to the electroplating cavity 201 is provided with exhaust ports connected to the electroplating cavities 201 in different electroplating spaces, respectively. The exhaust device can simultaneously exhaust the electroplating cavities 201 in different electroplating spaces through the exhaust ports, so as to exhaust the exhaust gas generated in the electroplating cavities 201 during electroplating and / or non-electroplating to the outside.

[0067] It should be noted that, in the embodiment, the first direction is the height direction of the rack 100, and the second direction is the length direction or the width direction of the rack 100.

[0068] Exemplarily, the air exhaust device is arranged at one side of the two-layer electroplating space, extends from the top of the upper electroplating space to the bottom of the lower electroplating space, and the front and rear side mounting surfaces of the electroplating cavity 201 are respectively connected to the two sides of the air exhaust device along the second direction. The air exhaust device is provided with one air exhaust port corresponding to the upper electroplating space and the lower electroplating space at the side close to the electroplating cavity 201, and each air exhaust port can simultaneously exhaust the exhaust gas discharged by the two electroplating cavities 201 in each layer of the electroplating space. Through the layered air exhaust port, one air exhaust device can simultaneously exhaust the exhaust gas of the electroplating cavities 201 in the upper and lower electroplating spaces. The air exhaust device not only can exhaust the exhaust gas discharged by the electroplating cavities 201 in the electroplating spaces at different layers along the first direction, but also can separate the electroplating spaces along the second direction and provide mounting support for the electroplating cavities 201.

[0069] In an embodiment, the air exhaust device is the left or right side mounting surface of the upper and lower two groups of electroplating cavities 201 arranged correspondingly, and is respectively connected to the top mounting surface, the bottom mounting surface and the front and rear side mounting surfaces of the upper and lower two groups of electroplating cavities 201 arranged correspondingly. That is, the height of the air exhaust device is the height of the two-layer electroplating space, the width of the air exhaust device is the width of the electroplating space (two electroplating cavities 201 in one group of electroplating cavities 201 are arranged side by side, and the two electroplating cavities 201 arranged side by side only change the length, not the width, and the width of the air exhaust device only needs to cover the electroplating cavities 201 in the second direction), that is, the air exhaust device covers the upper and lower two groups of electroplating cavities 201, and exhausts the exhaust gas discharged by the four electroplating cavities 201 in the two groups of electroplating cavities 201; at the same time, the air exhaust device also serves as a side partition plate (left or right side partition plate) for space separation, and as a mounting support for the two groups of electroplating cavities 201. Such arrangement not only greatly reduces the installation space of the air exhaust device in the electroplating equipment, but also eliminates the need for separate partition plates and support members, realizes functional integration, and improves the space utilization rate in the electroplating equipment.

[0070] In an embodiment, as shown in Figure 3 The thickness of the air exhaust device is less than the width of the air exhaust device, and the thickness of the air exhaust device is 1-10 cm. The thickness of the air exhaust device is designed to be much smaller than the width of the air exhaust device, that is, the air exhaust device is designed to be flat, which occupies less space. By increasing the height of the air exhaust device, the air volume is increased, and the functions of partition and support are integrated.

[0071] Exemplarily, the thickness of the air exhaust device is 3 cm, 4 cm, 5 cm or 6 cm. Of course, in other embodiments, the thickness of the air exhaust device can be designed according to the amount of exhaust gas to be exhausted and the width and height of the air exhaust device to meet the rapid exhaust of exhaust gas of multiple electroplating cavities 201.

[0072] Based on the thickness of the above-mentioned air extraction device, it can be part of the mounting plate of the electroplating cavity 201 and has air extraction function itself. Compared with separately arranging a mounting plate for the electroplating cavity 201 and then separately arranging an air extraction device or air extraction pipeline, the space and cost are saved, and the overall electroplating equipment is simplified and more aesthetic.

[0073] In an embodiment, as shown in Figure 4 In an embodiment, as shown in

[0074] In an embodiment, the electroplating tank 202 is provided with two, one of which provides electrolyte for a group of electroplating cavities 201 in the lower layer electroplating space, and the other of which provides electrolyte for a group of electroplating cavities 201 in the upper layer electroplating space. One air extraction device is connected to the two electroplating tanks 202 and can simultaneously extract air from the two electroplating tanks 202. Each group of electroplating cavities 201 in each layer of electroplating space is configured with an independent electroplating tank 202 to ensure that each layer of electroplating cavity 201 can provide sufficient electrolyte. At the same time, one air extraction device simultaneously extracts waste gas from two groups of electroplating cavities 201 and volatile gas in two electroplating tanks 202, eliminating the risk of waste gas retention in layered space.

[0075] Further, the above-mentioned equipment allows the air extraction device to simultaneously serve four electroplating cavities 201 in the upper and lower groups of electroplating cavities 201 and simultaneously serve two electroplating tanks 202. This structure makes the overall electroplating equipment layout more reasonable and compact. Compared with the prior art, it does not need to install complex air extraction pipelines, greatly facilitating the installation of the electroplating equipment. Further, compared with the prior art, when maintaining the electroplating equipment, it only needs to disconnect the air extraction pipeline on the electroplating cavity 201, which is very easy to maintain. This design greatly facilitates the installation and maintenance of the electroplating equipment in terms of air extraction.

[0076] It can be further understood that in the electroplating equipment, the number of the air extraction device is more than one, in theory, two groups of electroplating cavities 201 in the upper and lower layers are provided with one air extraction device, if the electroplating equipment has sixteen electroplating cavities 201, eight electroplating cavities 201 in the upper and lower layers respectively, only four air extraction devices need to be provided.

[0077] In an embodiment, as shown in Figures 4-6 , the air extraction device further comprises at least one air extraction plate 1, the air extraction plate 1 is provided with an air extraction cavity 11, the air extraction port and the electroplating tank 202 are both communicated with the air extraction cavity 11, and the top of the air extraction cavity 11 is provided with an exhaust port 13. The exhaust port 13 is connected with an exhaust pipe 6, the exhaust pipe 6 is connected with a waste gas treatment system of the factory, and a fan is arranged outside the exhaust pipe 6. Under the action of the fan, the waste gas generated by the electroplating cavity 201 and the gas volatilized from the electroplating tank 202 all enter the air extraction cavity 11, and then enter the waste gas treatment system through the exhaust port 13 and the exhaust pipe 6. The mixed waste gas is treated by the waste gas treatment system and then discharged into the atmosphere.

[0078] Exemplarily, the air extraction plate 1 is provided with two first air extraction ports 12 on the side close to the electroplating cavity 201, the two first air extraction ports 12 are respectively arranged corresponding to one group of electroplating cavities 201 in the upper electroplating space and one group of electroplating cavities 201 in the lower electroplating space, and the two first air extraction ports 12 are both connected with a first air extraction pipe 41, and the first air extraction pipe 41 is connected with the electroplating cavity 201.

[0079] The bottom of the air extraction plate 1 is provided with two second air extraction ports, the two second air extraction ports correspond to two electroplating tanks 202 arranged side by side respectively, and the two second air extraction ports are both connected with a second air extraction pipe 42, and the second air extraction pipe 42 is connected with the electroplating tank 202.

[0080] In an embodiment, as shown in Figure 2 , Figures 7-10 , the air extraction device further comprises a switching box 3, each shunt port 31 of the switching box 3 is communicated with an exhaust passage of one electroplating cavity 201, and the convergent port 32 of the switching box 3 is communicated with the air extraction port. Through the switching box 3, the waste gas of two adjacent electroplating cavities 201 can be collected and guided into the air extraction cavity 11 through the exhaust port 13.

[0081] The adapter box 3 has a converging cavity 35, two diverging ports 31 and at least one converging port 32. The diverging ports 31 are arranged corresponding to the exhaust passages of the electroplating cavities 201, and the converging ports 32 are arranged on any cavity wall of the converging cavity 35 for leading the collected exhaust gas out. Different converging ports 32 are arranged on the same cavity wall or different cavity walls of the converging cavity 35. Each diverging port 31 is sealingly connected with the exhaust passage of the electroplating cavity 201 arranged corresponding thereto, so as to ensure the sealing between the diverging port 31 and the exhaust passage, and to guide the exhaust gas in each electroplating cavity 201 into the converging cavity 35, and then to the converging ports 32 through the converging cavity 35, and then into the air suction cavity 11 through the first air suction pipe 41 and the first air suction port 12. The number of the converging ports 32 can be arranged according to the total exhaust capacity of the electroplating cavities 201 connected with the adapter box 3. If the total exhaust capacity of two or more electroplating cavities 201 connected with the adapter box 3 is large, two converging ports 32 can be arranged to ensure that the exhaust gas can be quickly discharged. If the total exhaust capacity of two electroplating cavities 201 connected with the adapter box 3 is small, one converging port 32 can be arranged. The arrangement position of the converging ports 32 needs to be determined according to the position of the first air suction port 12 connected with the adapter box 3.

[0082] Exemplarily, the adapter box 3 is arranged below a group of electroplating cavities 201, i.e. one adapter box 3 is used to collect the exhaust gas in two electroplating cavities 201. The adapter box 3 includes two diverging ports 31 and one converging port 32. The two diverging ports 31 are arranged at one end of the adapter box 3, and the converging port 32 is arranged at the other end. The two diverging ports 31 are connected with the exhaust passages of the two electroplating cavities 201 respectively. The exhaust gas in the two electroplating cavities 201 flows into the converging cavity 35 through the exhaust passages and the diverging ports 31 connected with the exhaust passages respectively. The exhaust gas in the converging cavity 35 flows from one end of the converging cavity 35 to the converging port 32 at the other end, and then flows into the first air suction pipe 41 through the converging port 32, and then into the air suction cavity 11 through the first air suction port 12.

[0083] Since the exhaust gas generated by the electroplating cavities 201 flows upward, the exhaust passages of the electroplating cavities 201 extend from the bottom to the top of the electroplating cavities 201, so as to guide the exhaust gas at the top of the electroplating cavities 201 to the diverging ports 31 through the exhaust passages, and then to the converging cavity 35 through the diverging ports 31.

[0084] In an embodiment, the cavity wall where the shunt port 31 is located is outwardly convex with a first convex portion 331, the shunt port 31 penetrates through the first convex portion 331, and the end face of the first convex portion 331 is provided with a first sealing groove 3311 for setting a first sealing ring. The cavity wall where the confluence port 32 is located is outwardly convex with a second convex portion 332, the confluence port 32 penetrates through the second convex portion 332, and the end face of the second convex portion 332 is provided with a second sealing groove 3321 for setting a second sealing ring. By setting the first sealing ring between the shunt port 31 and the exhaust passage of the electroplating cavity 201, the sealing property of the connection between the shunt port 31 and the electroplating cavity 201 is ensured. Similarly, by setting the second sealing ring between the confluence port 32 and the adapter of the first air suction pipe 41 connected thereto, the sealing property between the confluence port 32 and the first air suction pipe 41 is ensured, and environmental pollution caused by waste gas overflow is avoided.

[0085] In an embodiment, the adapter box 3 comprises a bearing disc 33 and an adapter disc 34 arranged at the bottom of the bearing disc 33, the bearing disc 33 is used for bearing the electroplating cavity 201; a confluence cavity 35 is formed between the bottom wall of the bearing disc 33 and the adapter disc 34, and the shunt port 31 communicates the exhaust passage of the electroplating cavity 201 and the confluence cavity 35. Such a setting makes the adapter box 3 not only have the function of concentrating waste gas, but also have the bearing function; without the need to additionally arrange a bearing member, the occupied space in the electroplating equipment is further saved.

[0086] In an embodiment, the adapter box 3 is integrally formed by using a corrosion-resistant metal plate. Since the waste gas generated in the electroplating cavity 201 is corrosive, in order to prolong the service life of the adapter box 3, the adapter box 3 is made of a corrosion-resistant metal plate, and the processing mode of integral forming is more convenient for processing and reduces the manufacturing cost.

[0087] And / or, the inner wall of the confluence cavity 35 is coated with a corrosion-resistant layer. Since the confluence cavity 35 is directly in contact with the waste gas, while the adapter box 3 is made of a corrosion-resistant metal plate, the inner wall of the confluence cavity 35 is coated with a corrosion-resistant layer to reduce the probability of waste gas leakage caused by corrosion of the confluence cavity 35.

[0088] For example, the corrosion-resistant layer can be a high-performance polymer coating, such as a polytetrafluoroethylene coating, etc.

[0089] Of course, in other embodiments, only the inner wall of the confluence cavity 35 can be coated with a corrosion-resistant layer.

[0090] In an embodiment, the cross section of the converging cavity 35 is in a flat polygonal structure, and the extending direction of the converging cavity 35 is the same as the arrangement direction of the electroplating cavities 201. The design of the flat structure reduces the occupied space of the adapter box 3 in the electroplating equipment, and the polygonal structure meets the connection of multiple electroplating cavities 201 in the same arrangement direction and / or different arrangement directions, realizes the reduction of the occupied volume of a single adapter box 3, and increases the number of the electroplating cavities 201 connected by a single adapter box 3 as much as possible, thereby reducing the number of the adapter boxes 3 arranged in the electroplating equipment and saving the occupied space inside the electroplating equipment.

[0091] Exemplarily, the cross section of the converging cavity 35 is in a quadrilateral structure. Of course, in other embodiments, the cross section of the converging cavity 35 can also be in a hexagonal structure.

[0092] In an embodiment, the converging port 32 is located on the top cavity wall of the converging cavity 35. Since the exhaust gas generally flows upward, the converging port 32 is arranged on the top cavity wall of the converging cavity 35, so that the exhaust gas can be discharged faster.

[0093] Exemplarily, the two diverging ports 31 and the converging port 32 are both arranged on the top cavity wall of the converging cavity 35. The exhaust gas entering the converging cavity 35 through the diverging port 31 flows to the converging port 32 under the action of the suction pressure, and then enters the first suction duct 41 from the converging port 32.

[0094] In an embodiment, the flow cross section of the converging cavity 35 gradually decreases from one end where the diverging port 31 is located to the other end where the converging port 32 is located. By making the flow cross section gradually tapered along the flow direction, a continuous accelerated flow field is formed on the path from the diverging port 31 to the converging port 32, which significantly improves the fluid kinetic energy and reduces the static pressure, and enhances the wall shear force at the same time. The smooth transition characteristics can inhibit flow separation and vortex generation, reduce energy loss, and maintain flow stability. Finally, a high-speed converging flow is realized at the converging port 32, so that the exhaust gas can quickly enter the suction plate 1.

[0095] Of course, in other embodiments, the converging port 32 is located on the opposite cavity wall of the cavity wall where the diverging port 31 is located. Arranging the converging port 32 on the cavity wall opposite to the diverging port 31 can make the exhaust gas flow out of the diverging port 31 directly impact the opposite cavity wall and form a main flow channel through the center of the converging cavity 35, thereby inducing symmetrical and stable vortex structures on both sides of the cavity, effectively reducing the flow dead zone.

[0096] In an embodiment, the bottom of the adapter disc 34 is provided with a second liquid discharge port 341. Since the temperature in the electroplating cavity 201 is very high, after the exhaust gas in the electroplating cavity 201 enters the converging cavity 35 through the diverging port 31, the temperature in the converging cavity 35 is relatively low, and the acid and alkali gases contained in the exhaust gas will condense into acid and alkali liquid. The acid and alkali liquid is quickly discharged through the second liquid discharge port 341 to avoid corrosion to the structure of the rear section of the suction device.

[0097] In one embodiment, the second drain port 341 is located at the lowest point of the confluence chamber 35. The second drain port 341 is located at the lowest point of the confluence chamber 35 so that the condensed acid and alkali liquids at various locations in the confluence chamber 35 will gather at the lowest point, which is more conducive to the discharge of the acid and alkali liquids.

[0098] In one embodiment, if Figure 6 and Figure 11 As shown, a gas-liquid separation structure is provided in the exhaust chamber 11, which is used to separate the liquid from the exhaust gas entering the exhaust chamber 11 and discharge the gas after the liquid is separated through the exhaust port 13. The acid, alkali liquid and electrolyte in the mixed exhaust gas are separated by the gas-liquid separation structure, reducing the risk of corrosion of the exhaust pipe 6.

[0099] In one embodiment, the gas-liquid separation structure includes first condensation plates 21, which are positioned on opposing inner walls of the exhaust chamber 11. The first condensation plates 21 on one inner wall are staggered and arranged upwardly, with the first condensation plates 21 on the other inner wall intersecting and forming a connected exhaust passage. This arrangement not only allows the mixed exhaust gas to fully contact the first condensation plates 21 for condensation, but also extends the flow path of the mixed exhaust gas within the exhaust chamber 11, thereby improving condensation efficiency.

[0100] Of course, in other embodiments, the gas-liquid separation structure may also be a gas-liquid separator.

[0101] In one embodiment, the gas-liquid separation structure further includes a second condensation plate 22, which is arranged opposite to the exhaust pipe connected to the electroplating tank 202. The two second exhaust ports at the bottom of the exhaust plate 1 are each connected to a second exhaust pipe 42, and each second exhaust pipe 42 is connected to an electroplating tank 202, so that the acidic and alkaline gases volatilized in the two electroplating tanks 202 are respectively guided into the exhaust chamber 11 through the two second exhaust pipes 42. The second condensation plate 22 is arranged opposite to the second exhaust pipe 42, so that the volatilized gas in the electroplating tank 202 enters the exhaust chamber 11 through the second exhaust pipe 42, directly contacts the second condensation plate 22 for heat exchange, and condenses to produce acidic and alkaline liquid. The separated dry gas enters the exhaust gas treatment system through the exhaust port 13 and the exhaust pipe 6.

[0102] Exemplarily, two second condensation plates 22 are provided, and the two second condensation plates 22 are provided in one-to-one correspondence with the air outlets of the two second exhaust pipes 42 to achieve independent condensation of the acidic and alkaline gases volatilized in the two electroplating tanks 202 and improve the condensation efficiency.

[0103] In one embodiment, the second condensation plate 22 includes a first plate 221 and a second plate 222, each arranged at a predetermined angle and tilted downward. The first plate 221 and the second plate 222 can guide and block the gas flowing out of the outlet of the second exhaust pipe 42, effectively guiding and extending the residence time of the gas flowing out of the outlet of the second exhaust pipe 42 to ensure sufficient condensation. At the same time, they physically isolate the uncondensed gas from escaping upward, completely preventing the risk of it mixing and reacting with the exhaust gas entering from the first exhaust port 12 within the exhaust chamber 11.

[0104] Exemplarily, the preset angle is ≥90°.

[0105] In one embodiment, if Figure 12 As shown, a liquid collecting trough 5 is provided at the bottom of the exhaust plate 1, and a first drain port 51 is provided at the bottom of the liquid collecting trough 5, and the first drain port 51 is connected to the exhaust chamber 11. The waste gas generated by the electroplating chamber 201 enters the exhaust chamber 11 through the first exhaust port 12 and contacts the first condensation plate 21. The acid and alkali liquid generated by condensation falls to the bottom of the exhaust chamber 11 under the action of gravity. At the same time, the volatilized gas from the electroplating tank 202 enters the exhaust chamber 11 through the second exhaust pipe 42 and contacts the second condensation plate 22. The acid and alkali liquid generated by condensation falls to the bottom of the exhaust chamber 11 under the action of gravity. The acid and alkali liquid accumulated at the bottom of the exhaust chamber 11 are concentrated in the liquid collecting trough 5 and discharged through the first drain port 51.

[0106] For example, a notch is provided at the bottom of the exhaust plate 1, the liquid collecting tank 5 is connected to the notch, two second exhaust ports are spaced apart at the bottom of the liquid collecting tank 5, and the two second exhaust pipes 42 enter the exhaust chamber 11 through the two second exhaust ports, respectively, so that the second condensation plate 22 is just above the air outlet of the second exhaust pipe 42. After the volatilized gas in the electroplating tank 202 enters the exhaust chamber 11 through the air outlet of the second exhaust pipe 42, it condenses with the second condensation plate 22 to produce acid and alkali liquid, which flows to the liquid collecting tank 5 under the guidance of the downwardly inclined first plate 221 and second plate 222. Similarly, the exhaust gas generated by the electroplating chamber 201 enters the exhaust chamber 11 through the first exhaust port 12 and contacts the first condensation plate 21. The acid and alkali liquid produced by condensation flows along the cavity wall of the exhaust chamber 11 to the cavity bottom of the exhaust chamber 11 under the guidance of the first condensation plate 21, and is discharged through the first drain port 51 after being gathered in the liquid collecting tank 5.

[0107] The electroplating equipment provided in this embodiment includes the above-mentioned exhaust system. The exhaust device of the exhaust system can not only converge and centrally discharge the exhaust gas from more than two groups of electroplating chambers 201, but also separate the electroplating space. At the same time, it is used as an installation component for installing the electroplating chamber 201, thereby realizing a highly compact modular layout; it not only provides stable support for the centralized exhaust gas extraction, but also significantly optimizes the spatial topology of the equipment, ensuring the synergistic improvement of the overall rigidity of the equipment and the space utilization rate.

[0108] Embodiment Two

[0109] The embodiment provides an electroplating device, which is provided with a single-layer electroplating space, and the electroplating space is provided with at least one group of electroplating cavities, and one group of electroplating cavities comprises two electroplating cavities arranged in parallel.

[0110] The embodiment also provides an air exhaust system for the electroplating device, and one air exhaust device is arranged corresponding to one group of electroplating cavities in the first direction, and the air exhaust device is connected with the bottom mounting surface and the top mounting surface of one group of electroplating cavities in the first direction, so that the height of the air exhaust device covers one group of electroplating cavities in the first direction, and the air exhaust device is connected with the front and rear mounting surfaces of one group of electroplating cavities in the second direction, so that the width of the air exhaust device covers one group of electroplating cavities in the second direction. One side of the air exhaust device close to the electroplating cavities is provided with an air exhaust port connected with one group of electroplating cavities, and the air exhaust device can exhaust the air in one group of electroplating cavities through the air exhaust port, so as to exhaust the exhaust gas generated in the electroplating cavities during electroplating and / or non-electroplating to the outside.

[0111] The air exhaust system provided by the embodiment can simultaneously exhaust the exhaust gas discharged by two electroplating cavities through one air exhaust device. Similarly, the exhaust gas generated by the two electroplating cavities is converged through one adapter box, and the connection mode of the adapter box and the two electroplating cavities is the same as that in the embodiment one, which will not be described herein.

[0112] In one embodiment, the electroplating device is provided with an electroplating tank below the electroplating cavities, and the air exhaust device is connected with the electroplating tank, so as to exhaust the electroplating tank, so as to exhaust the exhaust gas generated in the electroplating tank during electroplating and / or non-electroplating to the outside at the same time as the exhaust gas generated in the electroplating cavities during electroplating and / or non-electroplating is exhausted to the outside.

[0113] Exemplarily, one electroplating tank is provided, and the electroplating tank simultaneously provides electrolyte for two electroplating cavities in one group of electroplating cavities, and the exhaust gas generated by the two electroplating cavities and the gas volatilized from the electroplating tank are exhausted through the same air exhaust device.

[0114] The specific structure of the air exhaust device provided by the embodiment is basically the same as that of the air exhaust device provided by the embodiment one, and the difference lies in that the height of the air exhaust plate is only the height of the single-layer electroplating space, and the first air exhaust port and the second air exhaust port are both provided with one.

[0115] The air exhaust system provided by the embodiment is suitable for the electroplating device provided with only a single-layer electroplating space in the first direction, and also has the effects of reducing the occupied space of the air exhaust system in the electroplating device, improving the space utilization rate, and improving the installation applicability of the electroplating device.

[0116] The above merely preferred embodiments of the present application, for those skilled in the art, according to the idea of the present application, in the specific implementation and application range will have changes, the content of the description should not be understood as limiting the present application.

Claims

1. An exhaust system for an electroplating device, wherein two layers of electroplating spaces are provided in the electroplating device, each layer of the electroplating space is provided with at least one group of electroplating cavities (201), the electroplating cavities (201) of the upper electroplating space and the electroplating cavities (201) of the lower electroplating space correspond to each other in a first direction, and a group of electroplating cavities (201) includes two electroplating cavities (201) arranged side by side, characterized in that: An exhaust device is correspondingly provided for the electroplating cavities (201) of the two electroplating spaces arranged corresponding to each other in a first direction, and the exhaust device connects the bottom mounting surface of the electroplating cavity (201) of the lower electroplating space and the top mounting surface of the electroplating cavity (201) of the upper electroplating space in the first direction, so that the height of the exhaust device covers the electroplating cavities (201) of the two electroplating spaces in the first direction; In the second direction, the exhaust device is respectively connected to the front and rear mounting surfaces of the electroplating cavities (201) of the two layers of electroplating spaces that are arranged corresponding to each other, so that the width of the exhaust device covers the electroplating cavities (201) of the two layers of electroplating spaces in the second direction; The exhaust device is provided with exhaust ports connected to the electroplating cavities (201) located in different layers of electroplating space on one side thereof, and the exhaust device can simultaneously exhaust the electroplating cavities (201) in different layers of electroplating space through the exhaust ports, so as to extract waste gas generated in the electroplating cavity (201) during electroplating and / or non-electroplating periods to the outside; The exhaust device further comprises an adapter box (3), the adapter box (3) being arranged below a group of electroplating cavities (201), the adapter box (3) connecting the exhaust passages of the two electroplating cavities (201) and the exhaust port, the exhaust passages of the electroplating cavities (201) extending from the bottom to the top of the electroplating cavities (201).

2. The ventilation system according to claim 1, characterized in that: The exhaust device is a left or right mounting surface of the upper and lower groups of electroplating cavities (201) arranged correspondingly to each other, and is respectively connected to the top mounting surface, the bottom mounting surface, and the front and rear mounting surfaces of the upper and lower groups of electroplating cavities (201) arranged correspondingly to each other.

3. The ventilation system according to claim 2, characterized in that: The thickness of the exhaust device is smaller than the width of the exhaust device, and the thickness of the exhaust device is 1 cm-10 cm.

4. The ventilation system according to any one of claims 1 to 3, characterized in that: An electroplating tank (202) is provided below a group of electroplating cavities (201) located in the lower electroplating space. The exhaust device is connected to the electroplating tank (202) and can exhaust the electroplating tank (202) so as to exhaust the waste gas generated by the electroplating cavity (201) during electroplating and / or non-electroplating to the outside, and simultaneously exhaust the waste gas generated by the electroplating tank (202) during electroplating and / or non-electroplating to the outside.

5. The ventilation system according to claim 4, characterized in that: Two electroplating tanks (202) are provided, wherein one of the electroplating tanks (202) provides electroplating liquid for a group of electroplating cavities (201) located in the lower electroplating space; the other electroplating tank (202) provides electroplating liquid for a group of electroplating cavities (201) located in the upper electroplating space, and one exhaust device is connected to the two electroplating tanks (202) and can exhaust the two electroplating tanks (202) at the same time.

6. The ventilation system according to claim 4, characterized in that: The exhaust device further comprises at least one exhaust plate (1), the exhaust plate (1) being enclosed to form an exhaust cavity (11), the exhaust port and the electroplating tank (202) being both connected to the exhaust cavity (11), and an exhaust port (13) being provided at the top of the exhaust cavity (11).

7. The ventilation system according to claim 6, characterized in that: A gas-liquid separation structure is provided in the exhaust chamber (11), and the gas-liquid separation structure is used to separate the liquid in the gas entering the exhaust chamber (11), so as to discharge the dry gas through the exhaust port (13).

8. The ventilation system according to claim 7, characterized in that: The gas-liquid separation structure includes a first condensation plate (21), which is arranged on two opposite inner walls of the exhaust chamber (11), and the first condensation plate (21) on one inner wall and the first condensation plate (21) on the other inner wall are staggered and tilted upward to form a connected exhaust channel.

9. The ventilation system according to claim 8, characterized in that: The gas-liquid separation structure further comprises a second condensation plate (22), and the second condensation plate (22) is arranged opposite to the exhaust pipe connected to the electroplating tank (202).

10. The ventilation system according to claim 9, characterized in that: The second condensation plate (22) comprises a first plate (221) and a second plate (222) which are arranged at a preset angle and are tilted downward.

11. The ventilation system according to claim 6, characterized in that: A liquid collecting trough (5) is provided at the bottom of the air extraction plate (1), a first liquid drain port (51) is provided at the bottom of the liquid collecting trough (5), and the first liquid drain port (51) is communicated with the air extraction chamber (11).

12. The ventilation system according to any one of claims 1 to 3, characterized in that: Each branch port (31) of the adapter box (3) is connected to an exhaust channel of the electroplating chamber (201), and the confluence port (32) of the adapter box (3) is connected to the exhaust port.

13. The ventilation system according to claim 12, characterized in that: The adapter box (3) comprises a carrier plate (33) and an adapter plate (34) arranged at the bottom of the carrier plate (33); the carrier plate (33) is used to carry the electroplating chamber (201); a confluence chamber (35) is formed between the bottom wall of the carrier plate (33) and the adapter plate (34); the diversion port (31) communicates with the exhaust channel of the electroplating chamber (201) and the confluence chamber (35).

14. The ventilation system according to claim 13, characterized in that: The flow cross-section of the confluence cavity (35) gradually decreases from the end where the diversion port (31) is located to the end where the confluence port (32) is located.

15. The ventilation system according to claim 13, characterized in that: A second liquid drain port (341) is provided at the bottom of the adapter plate (34).

16. An exhaust system for an electroplating device, wherein the electroplating device is provided with a single-layer electroplating space, the electroplating space is provided with at least one group of electroplating cavities (201), and a group of electroplating cavities (201) includes two electroplating cavities (201) arranged side by side, characterized in that: A ventilation device is provided corresponding to a group of electroplating cavities (201) in a first direction, and the ventilation device is connected to a bottom mounting surface and a top mounting surface of a group of electroplating cavities (201) in the first direction, so that the height of the ventilation device covers the group of electroplating cavities (201) in the first direction, and the ventilation device is respectively connected to the front and rear mounting surfaces of a group of electroplating cavities (201) in a second direction, so that the width of the ventilation device covers the group of electroplating cavities (201) in the second direction; The exhaust device is provided with an exhaust port connected to a group of electroplating cavities (201) on one side thereof close to the electroplating cavity (201), and the exhaust device is capable of exhausting the group of electroplating cavities (201) through the exhaust port, so as to extract waste gas generated by the electroplating cavity (201) during electroplating and / or non-electroplating periods to the outside; The exhaust device comprises an adapter box (3), which is arranged below a group of electroplating cavities (201). The adapter box (3) connects the exhaust channels of the two electroplating cavities (201) and the exhaust port, and the exhaust channels of the electroplating cavities (201) extend from the bottom to the top of the electroplating cavities (201).

17. The ventilation system according to claim 16, characterized in that: An electroplating tank (202) is provided below the electroplating cavity (201), and the exhaust device is connected to the electroplating tank (202) and can exhaust the electroplating tank (202) so as to exhaust the waste gas generated by the electroplating cavity (201) during the electroplating period and / or the non-electroplating period to the outside, and simultaneously exhaust the waste gas generated by the electroplating tank (202) during the electroplating period and / or the non-electroplating period to the outside.

18. Electroplating equipment, characterized in that Comprising the exhaust system according to any one of claims 1-17.

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