Electronic device

Abstract

An electronic device includes a stretchable electronic component layer and a decorative component layer. The decorative element layer includes a first sub-layer and a second sub-layer. The first sub-layer is disposed on the stretchable electronic component layer. The second sub-layer is disposed on the first sub-layer. The first sub-layer is located between the second sub-layer and the stretchable electronic element layer. And the second sub-layer is provided with decorative lines. The penetration rate of the first sub-layer is smaller than that of the second sub-layer.

Description

Technical Field

[0001] The present invention relates to an electronic device. Background Art

[0002] With the rapid development of electronic technology, electronic products are constantly being innovated. To enable electronic products to be applied in a variety of fields, stretchability, lightness, and flexible appearance are becoming increasingly important. In other words, electronic products are increasingly required to have different appearances based on different applications and environments, so electronic products need to be stretchable. However, when electronic products are stretched, they may experience problems such as joint failure and irregular warping due to the stress they are subjected to. In addition, the surfaces of stretchable electronic products are often decorated with patterns, but the presence of these patterns can cause blockiness in the image, seriously affecting image quality. Summary of the Invention

[0003] The present invention provides an electronic device with excellent characteristics.

[0004] The electronic device of the present invention includes a stretchable electronic component layer and a decorative component layer. The decorative component layer includes a first sublayer and a second sublayer. The first sublayer is disposed on the stretchable electronic component layer. The second sublayer is disposed on the first sublayer. The first sublayer is located between the second sublayer and the stretchable electronic component layer. The second sublayer has decorative patterns. The transmittance of the first sublayer is lower than the transmittance of the second sublayer. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 FIG. 1 is a schematic top and perspective view of an electronic device according to an embodiment of the present invention.

[0006] Figure 2 FIG. 1 is a cross-sectional diagram of an electronic device according to an embodiment of the present invention.

[0007] Figure 3 FIG. 1 is a schematic top view of a low-stretch working area of ​​a stretchable electronic component layer according to an embodiment of the present invention.

[0008] Figure 4 FIG. 1 is a schematic top view of a high-stretch working area of ​​a stretchable electronic component layer according to an embodiment of the present invention.

[0009] Figure 5 FIG. 1 is a cross-sectional diagram of an electronic device according to an embodiment of the present invention.

[0010] Figures 6A to 6G FIG. 1 is a cross-sectional diagram of a manufacturing process of an electronic device according to an embodiment of the present invention.

[0011] Figure 7 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0012] Figure 8 Show Figure 7 The state of an electronic device when it is under pressure.

[0013] Figure 9 FIG. 4 is a cross-sectional diagram of an electronic device according to another embodiment of the present invention.

[0014] Figure 10 Show Figure 9 The state of an electronic device when it is under pressure.

[0015] Figure 11 FIG. 4 is a cross-sectional diagram of an electronic device according to another embodiment of the present invention.

[0016] Figure 12 FIG. 1 is a cross-sectional diagram of an electronic device according to an embodiment of the present invention.

[0017] Figure 13 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0018] Figure 14 FIG. 4 is a cross-sectional diagram of an electronic device according to another embodiment of the present invention.

[0019] Figure 15 FIG2 is a top and perspective diagram of an electronic device according to another embodiment of the present invention.

[0020] Figure 16 for Figure 15 A cross-sectional schematic diagram of an electronic device.

[0021] Figure 17 FIG2 is a top and perspective diagram of an electronic device according to another embodiment of the present invention.

[0022] Figure 18 for Figure 17 A cross-sectional schematic diagram of an electronic device.

[0023] Figure 19 FIG. 1 is a schematic top and perspective view of an electronic device according to an embodiment of the present invention.

[0024] Figure 20 for Figure 19 A cross-sectional schematic diagram of an electronic device.

[0025] Description of reference numerals:

[0026] 1: Hard carrier board

[0027] 2, 3: Textured film

[0028] 4: Jig

[0029] 4a: Surface

[0030] 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I: Electronic device 110: Stretchable electronic component layer

[0031] 110a: Work Area

[0032] 110ax1, 110ax2: Work area perforation

[0033] 110a-1: Low-stretch working area

[0034] 110a-2: High tensile working area

[0035] 110b: junction area

[0036] 110c, 124s, 130b, 162a: Surface

[0037] 110bh: perforation in the junction area

[0038] 112, 172: Stretchable substrate

[0039] 114: driving circuit layer

[0040] 116: Pixel structure

[0041] 116R, 116G, 116B: Light-emitting elements

[0042] 118: Pad

[0043] 120: Decorative element layer

[0044] 122: First sublayer

[0045] 124: Second sublayer

[0046] 124a: Decorative pattern

[0047] 124p: convex part

[0048] 130, 130B: carrier layer

[0049] 130': Unripe carrier layer

[0050] 130a: Texture

[0051] 130p: First micro-bump

[0052] 140: Flexible electronic components

[0053] 140h1: First piercing

[0054] 140h2: Second punch

[0055] 142: Chip

[0056] 144: Connector

[0057] 150: Protective layer

[0058] 150': Unripe protective layer

[0059] 150s: Sidewall

[0060] 160, 160A, 160B, 160H, 170, 170E, 170F: Sensing layer 162: Insulating substrate

[0061] 162p: Second micro-bump

[0062] 164A, 164B: Electrodes

[0063] A, B, C, D, E, K, J: thickness

[0064] AG: Air Gap

[0065] D110bh, D130p, D140h2, D162p: Dimension F: Height difference

[0066] L, l: distance

[0067] Lx1, Lx2: side length

[0068] P: Spacing

[0069] I-I', II-II': section line DETAILED DESCRIPTION

[0070] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0071] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or intermediate elements can also exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intermediate elements. As used herein, "connected" can refer to physical and / or electrical connections. Furthermore, "electrically connected" or "coupled" can mean the presence of other elements between two elements.

[0072] As used herein, "about," "approximately," or "substantially" includes the stated value and an average value that is within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, or ±5%. Furthermore, as used herein, "about," "approximately," or "substantially" can be selected based on the optical property, etching property, or other property, and may not apply to all properties with a single standard deviation.

[0073] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present invention, and will not be interpreted as idealized or overly formal unless explicitly defined as such herein.

[0074] Figure 1 FIG. 1 is a schematic top and perspective view of an electronic device according to an embodiment of the present invention. Figure 2 FIG. 1 is a cross-sectional diagram of an electronic device according to an embodiment of the present invention. Figure 2 correspond Figure 1 Section line I-I'.

[0075] Please refer to Figure 1 and Figure 2 , the electronic device 10 includes a stretchable electronic component layer 110. In some embodiments, the stretchable electronic component layer 110 includes a stretchable substrate 112, a drive circuit layer 114 disposed on the stretchable substrate 112, and a plurality of pixel structures 116 electrically connected to the drive circuit layer 114. In some embodiments, each pixel structure 116 may include a plurality of light-emitting elements 116R, 116G, 116B. In some embodiments, the light-emitting elements 116R, 116G, 116B are, for example, micro light-emitting diodes (μLEDs), but the present invention is not limited thereto. In some embodiments, the stretchable electronic component layer 110 may be a stretchable display layer. However, the present invention is not limited thereto, and in other embodiments, the stretchable electronic component layer 110 may also be other types of stretchable component layers, or a combination of other types of stretchable component layers and stretchable display layers.

[0076] In some embodiments, the material of the stretchable substrate 112 can be an organic polymer, such as polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonates (PC), polyether sulfone (PES), or polyarylate, or other suitable materials, or a combination of at least two of the foregoing materials, but the present invention is not limited thereto.

[0077] Please refer to Figure 2 In some embodiments, the stretchable electronic component layer 110 has a working area 110a and a bonding area 110b outside the working area 110a, and the bonding area 110b of the stretchable electronic component layer 110 has a pad 118, wherein the pad 118 is electrically connected to the driving circuit layer 114. In some embodiments, the working area 110a of the stretchable electronic component layer 110 may selectively include a low-stretch working area 110a-1 and a high-stretch working area 110a-2. The strain of the high-stretch working area 110a-2 is greater than the strain of the low-stretch working area 110a-1. For example, in some embodiments, the strain of the high-stretch working area 110a-2 may be less than 50%, and the strain of the low-stretch working area 110a-1 may be less than 6%, but the present invention is not limited to this.

[0078] In some embodiments, the high-stretch working area 110a-2 may be located between the low-stretch working area 110a-1 and the bonding area 110b; that is, the high-stretch working area 110a-2 may be closer to the bonding area 110b, while the low-stretch working area 110a-1 may be farther away from the bonding area 110b. However, the present invention is not limited to this. The relative positions of the low-stretch working area 110a-1, the high-stretch working area 110a-2, and the bonding area 110b depend on the desired bending state of the electronic device 10 and are not limited by the present invention.

[0079] Figure 3 FIG. 1 is a schematic top view of a low-stretch working area of ​​a stretchable electronic component layer according to an embodiment of the present invention. Figure 4 This is a top view of a high-stretch working area of ​​a stretchable electronic component layer according to an embodiment of the present invention. Figure 2 、 Figure 3 and Figure 4In some embodiments, the working area 110a of the stretchable electronic component layer 110 has working area through-holes 110ax1 and 110ax2. In some embodiments, the working area through-holes 110ax1 of the low-stretch working area 110a-1 and the working area through-holes 110ax2 of the high-stretch working area 110a-2 may have different shapes. For example, in some embodiments, the working area through-holes 110ax1 of the low-stretch working area 110a-1 may be generally strip-shaped, while the working area through-holes 110ax2 of the high-stretch working area 110a-2 may be irregularly shaped. In some embodiments, the side length Lx2 of the working area through-holes 110ax2 of the high-stretch working area 110a-2 may be greater than the side length Lx1 of the working area through-holes 110ax1 of the low-stretch working area 110a-1. For example, in some embodiments, the side length Lx2 of the working area through-hole 110ax2 of the high-stretch working area 110a-2 is approximately 2 times or more than 2 times the distance P between two adjacent pixel structures 116, and the side length Lx1 of the working area through-hole 110ax1 of the low-stretch working area 110a-1 is approximately 1.5 times the distance P between two adjacent pixel structures 116, but the present invention is not limited to this.

[0080] Please refer to Figure 1 and Figure 2 In some embodiments, the decorative element layer 120 includes a first sublayer 122 and a second sublayer 124. The first sublayer 122 is disposed on the stretchable electronic element layer 110, and the second sublayer 124 is disposed on the first sublayer 122. The first sublayer 122 is located between the second sublayer 124 and the stretchable electronic element layer 110, and the second sublayer 124 has a decorative pattern 124a. The decorative pattern 124a can provide a tactile sensation. For example, in some embodiments, the decorative pattern 124a can be a leather pattern, a woven pattern, or other patterns. In some embodiments, due to the need to provide a tactile sensation, the second sublayer 124 can have a haze, wherein the haze can be large or small depending on the tactile and / or visual effect to be presented, and the present invention is not limited thereto. For example, to create a matte texture effect, the haze of the second sub-layer 124 may be within a range of 10% to 50%. To create a leather texture effect, the haze of the second sub-layer 124 may be within a range of 60% to 90%, but the present invention is not limited to this. Furthermore, in some embodiments, a hardener may be optionally added to the second sub-layer 124 having the decorative texture 124a to adjust the hardness and surface feel, without unduly affecting the optical performance.

[0081] It is worth noting that the transmittance of the first sub-layer 122 is lower than that of the second sub-layer 124. For example, in some embodiments, the transmittance of the first sub-layer 122 may be in the range of 10% to 40%, and the transmittance of the second sub-layer 124 may be greater than 80%, but the present invention is not limited to this. In some embodiments, it is preferred that the transmittance of the first sub-layer 122 of the decorative element layer 120 be in the range of 20% to 30%, and the transmittance of the second sub-layer 124 be greater than 92%, to achieve a better appearance and texture, but the present invention is not limited to this.

[0082] In some embodiments, the first sub-layer 122 and the second sub-layer 124 of the decorative element layer 120 may have different colors. For example, in some embodiments, the first sub-layer 122 may have a color (such as, but not limited to, gray, black, etc., where gray or black is better for displaying color balance), and the second sub-layer 124 may be substantially transparent.

[0083] In some embodiments, the first sublayer 122 is colored to adjust hue. The second sublayer 124 is substantially transparent and has decorative patterns 124a, providing a tactile feel. The first sublayer 122 can be referred to as a color layer. The second sublayer 124 can be referred to as a transparent pattern layer. By dividing the decorative element layer 120 into a color layer and a transparent pattern layer, the visual effects of the electronic device 10 can be improved. For example, in some embodiments, because the decorative pattern 124a is formed from a transparent material, variations in thickness of the decorative pattern 124a do not result in color patches, thereby enhancing the visual effects of the electronic device 10.

[0084] Please refer to Figure 2 In some embodiments, the electronic device 10 further includes a carrier layer 130, wherein the stretchable electronic component layer 110 is disposed on the carrier layer 130, and the stretchable electronic component layer 110 is located between the decorative component layer 120 and the carrier layer 130. For example, in some embodiments, the primary material of the carrier layer 130 may be silicone rubber, and the Young's modulus of the carrier layer 130 may be between 0.5 MPa and 50 MPa. Preferably, the Young's modulus of the carrier layer 130 is between 1 MPa and 10 MPa. In some embodiments, the stretch recovery rate of the carrier layer 130 may be less than 5%, preferably, less than 2%, but the present invention is not limited thereto.

[0085] Please refer to Figure 1 and Figure 2In some embodiments, the electronic device 10 further includes a flexible electronic component 140 bonded to the bonding area 110b of the stretchable electronic component layer 110. Specifically, the flexible electronic component 140 is bonded to the pad 118 of the bonding area 110b. For example, in some embodiments, the flexible electronic component 140 may include a chip 142, wherein the chip 142 may be bonded to the stretchable electronic component layer 110 via a chip on film (COF). However, the present invention is not limited thereto, and in other embodiments, the flexible electronic component 140 may also be other types of flexible components.

[0086] In some embodiments, the electronic device 10 further includes a protective layer 150 disposed on the carrier layer 130 and covering the stretchable electronic component layer 110 and a portion of the flexible electronic component 140 , wherein the protective layer 150 is located between the decorative element layer 120 and the stretchable electronic component layer 110 and between the decorative element layer 120 and the flexible electronic component 140 .

[0087] In some embodiments, the protective layer 150 may cover the chip 142 of the flexible electronic component 140. In some embodiments, the flexible electronic component 140 further includes a connector 144, the connector 144 is separated from the chip 142 by a distance L, and the sidewall 150s of the protective layer 150 is separated from the connector 144 by a distance l, where l is less than 0.5 times L, but the present invention is not limited thereto.

[0088] In some embodiments, the primary material of the decorative element layer 120 and the material of the protective layer 150 can be the same, such that the difference in refractive index between the decorative element layer 120 and the protective layer 150 is less than 0.05. For example, in some embodiments, the primary material of the decorative element layer 120 and the material of the protective layer 150 can comprise silicone rubber, but the invention is not limited thereto. In some embodiments, the Young's modulus of the decorative element layer 120 and the protective layer 150 can range from 0.5 MPa to 50 MPa, preferably from 1 MPa to 10 MPa, but the invention is not limited thereto. In some embodiments, the elongation of the decorative element layer 120 and the protective layer 150 can range from 600% to 800%, but the invention is not limited thereto. In some embodiments, the stretch recovery rate of the decorative element layer 120 and the protective layer 150 can be less than 5%, preferably less than 2%, but the invention is not limited thereto.

[0089] In some embodiments, the electronic device 10 further includes a sensing layer 160. The carrier layer 130 is located between the stretchable electronic component layer 110 and the sensing layer 160. In some embodiments, the sensing layer 160 is, for example, a touch sensing layer, but the present invention is not limited thereto. In some embodiments, the material of the main substrate layer of the sensing layer 160 may be silicone rubber, and the Young's modulus of the sensing layer 160 may be between 0.5 MPa and 50 MPa. Preferably, the Young's modulus of the sensing layer 160 is between 1 MPa and 10 MPa. In some embodiments, the stretch recovery rate of the sensing layer 160 may be less than 5%. Preferably, the stretch recovery rate of the sensing layer 160 is less than 2%, but the present invention is not limited thereto.

[0090] Please refer to Figure 2 The thickness of the first sublayer 122 of the decorative element layer 120 is K. The thickness of the second sublayer 124 of the decorative element layer 120 is J. In some embodiments, K ≤ J. The second sublayer 124 of the decorative element layer 120 has a surface 124s facing away from the stretchable electronic component layer 110. The decorative pattern 124a is formed on the surface 124s. The surface 124s has a height difference F. In some embodiments, 2F ≤ J ≤ 10F. The thickness of the protective layer 150 is B. The thickness of the flexible electronic component 140 is E. In some embodiments, B ≥ 2E. Preferably, the thickness B of the protective layer 150 is equal to 3E. The thickness of the decorative element layer 120 is A. A = K + J. The thickness of the carrier layer 130 is C. In some embodiments, A ≤ B ≤ C. The thickness of the sensing layer 160 is D. In some embodiments, A ≤ B ≤ C ≤ D. For example, in some embodiments, B≥300 μm, C≥300 μm, and the thicker material is used to protect and suppress arbitrary deformation of the stretchable trace, but the present invention is not limited thereto.

[0091] Please refer to Figure 1 and Figure 2 In some embodiments, the flexible electronic component 140 has a first through-hole 140h1, and the first through-hole 140h1 is located outside the bonding region 110b of the stretchable electronic component layer 110. Specifically, a portion of the protective layer 150 fills the first through-hole 140h1 of the flexible electronic component 140 and connects to the carrier layer 130. The portion of the protective layer 150 that fills the first through-hole 140h1 of the flexible electronic component 140 has a limiting / fixing effect, limiting / fixing the relative positions of the flexible electronic component 140, the protective layer 150, and the carrier layer 130.

[0092] Please refer to Figure 1In some embodiments, the first through-hole 140h1 may be circular to prevent uneven stress during stretching. In some embodiments, the dimension D140h1 of the first through-hole 140h1 may range from 2 mm to 10 mm. Preferably, the dimension D140h1 of the first through-hole 140h1 ranges from 6 mm to 8 mm, but the present invention is not limited thereto.

[0093] Figure 5 FIG. 1 is a cross-sectional diagram of an electronic device according to an embodiment of the present invention. Figure 5 correspond Figure 1 Section line II-II'. Please refer to Figure 1 and Figure 5 In some embodiments, the flexible electronic component 140 has a second through-hole 140h2, and the bonding area 110b of the stretchable electronic component layer 110 has a bonding area through-hole 110bh. The second through-hole 140h2 of the flexible electronic component 140 is arranged corresponding to the bonding area through-hole 110bh of the stretchable electronic component layer 110. The second through-hole 140h2 of the flexible electronic component 140 and the bonding area through-hole 110bh of the stretchable electronic component layer 110 substantially overlap. A portion of the protective layer 150 fills the second through-hole 140h2 of the flexible electronic component 140 and the bonding area through-hole 110bh of the stretchable electronic component layer 110 and is connected to the carrier layer 130. The protective layer 150 partially filled with the second through-hole 140h2 of the flexible electronic component 140 and the bonding area through-hole 110bh of the stretchable electronic component layer 110 has a limiting / fixing effect, which can limit / fix the relative positions of the flexible electronic component 140, the protective layer 150, the stretchable electronic component layer 110 and the carrier layer 130.

[0094] Please refer to Figure 1 In some embodiments, the second through-hole 140h2 / joining area through-hole 110bh may be circular in shape to avoid uneven stress during stretching. In some embodiments, the size D140h2 / D110bh of the second through-hole 140h2 / joining area through-hole 110bh may fall within the range of 0.1 mm to 2.0 mm. Preferably, the size D140h2 / D110bh of the second through-hole 140h2 / joining area through-hole 110bh is between 0.6 mm and 1.2 mm, but the present invention is not limited thereto. Please refer to Figure 1 and Figure 2 In some embodiments, the electronic device 10 can be assembled on a curved surface of a fixture ( Figure 1 and Figure 2 (not shown), and the second through-hole 140h2 and / or the bonding area through-hole 110bh can be used to fix the electronic device 10 as a whole on the curved surface of the fixture.

[0095] Please refer to Figure 2In some embodiments, portions of the protective layer 150 may be filled into the active area through-holes 110ax1 and 110ax2 of the stretchable electronic component layer 110. The portions of the protective layer 150 filled into the active area through-holes 110ax1 and 110ax2 of the stretchable electronic component layer 110 have a limiting / fixing effect, limiting / fixing the relative positions of the protective layer 150, the stretchable electronic component layer 110, and the carrier layer 130.

[0096] Figures 6A to 6G This is a cross-sectional diagram of the manufacturing process of an electronic device according to an embodiment of the present invention. Figure 6A First, a stretchable electronic component layer 110 is formed on a hard carrier 1, and a flexible electronic component 140 is bonded to the stretchable electronic component layer 110. Figure 6B Next, the matured decorative element layer 120 and the texture film 2 for making the decorative texture 124a are laminated with the unmatured protective layer 150'. Figure 6B Then, the exposed surface of the unripe protective layer 150' is laminated on the stretchable electronic component layer 110, and the material of the unripe protective layer 150' is allowed to penetrate into the working area through-holes 110ax1, 110ax2 and the bonding area through-hole 110bh of the stretchable electronic component layer 110. At the same time, the unripe protective layer 150' is squeezed and penetrated into the first through-hole 140h1 and the second through-hole 140h2 of the flexible electronic component 140.

[0097] Please refer to Figure 6B and Figure 6C Then, a heating process is performed to transform the unripe protective layer 150' into a ripe protective layer 150, wherein the ripe protective layer 150 is fixedly connected to the decorative element layer 120, the flexible electronic element 140 and the stretchable electronic element layer 110. Figure 6C Then, the hard carrier 1 and the stretchable electronic component layer 110 are separated to expose the surface 110 c of the stretchable electronic component layer 110 .

[0098] Please refer to Figure 6D Then, a carrier layer 130' is formed on the surface 110c of the stretchable electronic component layer 110. The carrier layer 130' is not yet matured, and a texture film 3 is selectively used to form textures 130a on the immature carrier layer 130'. Figure 6D and Figure 6E Then, a heating process is performed to form a mature carrier layer 130, wherein the mature carrier layer 130 is fixedly bonded to the stretchable electronic component layer 110 and the protective layer 150. Figure 6E and Figure 6F Then, the carrier layer 130 and the textured film 3 are separated to expose the surface 130b of the carrier layer 130, and the decorative element layer 120 and the textured film 2 are separated. Figure 6F Then, the sensing layer 160 is formed on the surface 130b of the carrier layer 130, and the electronic device 10 is completed. Figure 6G In some embodiments, the electronic device 10 may be assembled on a curved surface 4 a of a fixture 4 , wherein the curved surface 4 a may be any type of three-dimensional curved surface.

[0099] It should be noted that the following embodiments share the same component numbers and some of the contents of the previous embodiments, wherein the same reference numerals are used to represent the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the previous embodiments, and the following embodiments will not be repeated.

[0100] Figure 7 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention. Figure 7 The electronic device 10A and Figure 2 The electronic device 10 is similar to Figure 7 The detailed structure of the sensing layer 160A is also shown.

[0101] Please refer to Figure 7 In this embodiment, an air gap AG may exist between the sensing layer 160A and the carrier layer 130. The sensing layer 160A includes an insulating substrate 162 and an electrode 164A disposed on the insulating substrate 162. In this embodiment, the surface impedance of the carrier layer 130 may be within 10 4 Ω / sq~10 9 Ω / sq, that is, the carrier layer 130 is of electrostatic dissipative grade. For example, in this embodiment, the material of the carrier layer 130 is stretchable electrostatic dissipative grade silicone, but the present invention is not limited to this. In this embodiment, the surface impedance of the decorative element layer 120, the protective layer 150 and the insulating substrate 162 is greater than 10 12 Ω / sq.

[0102] Figure 8 Show Figure 7 The state of the electronic device when it is under pressure. Figure 7 and Figure 8 In this embodiment, electrodes 164A may be selectively exposed by insulating substrate 162. When pressure is applied to electronic device 10, carrier layer 130 may contact electrodes 164A of sensing layer 160A, forming a circuit and implementing touch functionality. In other words, in this embodiment, carrier layer 130 and sensing layer 160A form the touch-sensitive portion of electronic device 10A, which may be resistive.

[0103] In this embodiment, the surface 130b of the carrier layer 130 facing the sensing layer 160A may optionally have a plurality of first micro-protrusions 130p. The surface 162a of the insulating substrate 162 facing the carrier layer 130 may optionally have a plurality of second micro-protrusions 162p. The size D130p of the first micro-protrusions 130p (indicated by Figure 7 ) may be smaller than the size D162p of the second micro protrusion 162p (indicated at Figure 7 The first micro-protrusion 130p with a smaller size can provide a change in contact area, increase the degree of impedance change, and thus improve the sensitivity of the touch portion of the electronic device 10A. The shape is not limited to a hemispherical shape, and any geometric shape that can provide a change in contact area is acceptable, such as the rough surface of the matte silicone rubber itself. Figure 7 The hemispherical first micro-protrusion 130p is used as an example, and the larger second micro-protrusion 162p can be used as a gap layer.

[0104] Figure 9 FIG. 4 is a cross-sectional diagram of an electronic device according to another embodiment of the present invention. Figure 9 The electronic device 10B and Figure 7 The electronic device 10A is similar to the electronic device 10A, and the difference between the two is that: Figure 9 In the embodiment, the surface impedance of the carrier layer 130B falls within 10 -3 Ω / sq~10 3 Ω / sq range, that is, the carrier layer 130B is conductive. Figure 9 In the embodiment, the carrier layer 130B may be grounded.

[0105] Figure 10 Show Figure 9 The state of the electronic device when it is under pressure. Figure 9 and Figure 10 When pressure is applied to the electronic device 10, a change in capacitance occurs between the carrier layer 130B and the electrode 164B, thereby implementing a touch function. In other words, in this embodiment, the carrier layer 130B and the sensing layer 160B form the touch portion of the electronic device 10B, which can be capacitive. In this embodiment, the electrode 164B can be embedded in the insulating substrate 162 and not exposed to prevent short circuits. In this embodiment, the insulating substrate 162 can be made of a material with a high dielectric constant to increase the capacitance change.

[0106] Figure 11 This is a cross-sectional diagram of an electronic device according to another embodiment of the present invention. Figure 11 , Figure 11 The electronic device 10C and Figure 2 The electronic device 10 is similar to the electronic device 10, the difference between the two is: Figure 11In the embodiment, in addition to the sensing layer 160 disposed on one side of the carrier layer 130 , the electronic device 10C further includes a sensing layer 170 disposed on the other side of the carrier layer 130 , thereby forming a double-sided touch screen.

[0107] Figure 12 This is a cross-sectional diagram of an electronic device according to an embodiment of the present invention. Figure 12 , Figure 12 The electronic device 10D and Figure 11 The electronic device 10C is similar to the electronic device 10C, and the difference between the two is that: Figure 12 In the embodiment of the present invention, the electronic device 10D can omit the stretchable electronic component layer 110, the protective layer 150 and the flexible electronic component 140, and thus the stacked structure for display can be omitted.

[0108] Figure 13 This is a cross-sectional diagram of an electronic device according to another embodiment of the present invention. Figure 13 , Figure 13 The electronic device 10E and Figure 11 The electronic device 10C is similar to the electronic device 10C, and the difference between the two is that: Figure 13 In the embodiment of the present invention, the sensing layer 170E and the stretchable electronic element layer 110E may be omitted. Figure 11 The stretchable substrate 172 of the sensing layer 170 and the stretchable substrate 112 of the stretchable electronic component layer 110 are shown.

[0109] Figure 14 This is a cross-sectional diagram of an electronic device according to another embodiment of the present invention. Figure 14 , Figure 14 The electronic device 10F and Figure 12 The electronic device 10D is similar to the electronic device 10D, and the difference between the two is that: Figure 14 In the embodiment, the sensing layer 170F may be omitted. Figure 12 The stretchable substrate 172 of the sensing layer 170 is shown.

[0110] Figure 15 FIG2 is a top and perspective diagram of an electronic device according to another embodiment of the present invention. Figure 16 for Figure 15 Please refer to the cross-sectional diagram of the electronic device. Figure 15 and Figure 16 In this embodiment, the range of the sensing layer 160 of the electronic device 10G may be greater than or equal to the range of the working area 110 a of the stretchable electronic component layer 110 .

[0111] Figure 17 FIG2 is a top and perspective diagram of an electronic device according to another embodiment of the present invention. Figure 18 for Figure 17 Please refer to the cross-sectional diagram of the electronic device. Figure 17 and Figure 18 In this embodiment, the sensing layer 160H of the electronic device 10H may be smaller than the working area 110a of the stretchable electronic component layer 110. In this embodiment, part of the electronic device 10H may have a sensing function, and part of the electronic device 10H may have a transparent display function.

[0112] Figure 19 FIG. 1 is a schematic top and perspective view of an electronic device according to an embodiment of the present invention. Figure 20 for Figure 19 Please refer to the cross-sectional diagram of the electronic device. Figure 19 and Figure 20 In this embodiment, the electronic device 10I may omit the sensing layer.

Claims

1. An electronic device comprising: a stretchable electronic component layer; as well as A decorative element layer, comprising: a first sublayer disposed on the stretchable electronic component layer; as well as A second sublayer is disposed on the first sublayer, wherein the first sublayer is located between the second sublayer and the stretchable electronic component layer, the second sublayer has a decorative pattern, and a transmittance of the first sublayer is less than a transmittance of the second sublayer. 2 . The electronic device as claimed in claim 1 , wherein the first sub-layer and the second sub-layer of the decoration element layer have different colors. 3 . The electronic device as claimed in claim 1 , wherein the transmittance of the first sub-layer of the decoration element layer falls within a range of 10% to 40%. The electronic device as claimed in claim 1 , wherein the transmittance of the second sub-layer of the decoration element layer is greater than 80%. 5 . The electronic device as claimed in claim 1 , wherein a thickness of the first sub-layer of the decoration element layer is K, a thickness of the second sub-layer of the decoration element layer is J, and K≦J.

6. The electronic device as described in claim 1, wherein the second sublayer of the decorative element layer has a surface facing away from the stretchable electronic element layer, the decorative pattern is formed on the surface, the surface has a height difference, the height difference is F, the second sublayer of the decorative element layer has a thickness J, and 2F≤J≤10F.

7. The electronic device according to claim 1, further comprising: a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer; a flexible electronic component bonded to a bonding region of the stretchable electronic component layer; as well as a protective layer disposed on the carrier layer and covering the stretchable electronic component layer and a portion of the flexible electronic component, wherein the protective layer is located between the decorative component layer and the stretchable electronic component layer and between the decorative component layer and the flexible electronic component; The protective layer has a thickness of B, the flexible substrate of the flexible electronic component has a thickness of E, and B≥2E.

8. The electronic device according to claim 1, further comprising: a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer; a flexible electronic component bonded to a bonding region of the stretchable electronic component layer, wherein the flexible electronic component has a first through-hole, and the first through-hole is located outside the bonding region of the stretchable electronic component layer; as well as a protective layer disposed on the carrier layer and covering the stretchable electronic component layer and a portion of the flexible electronic component, wherein the protective layer is located between the decorative component layer and the stretchable electronic component layer and between the decorative component layer and the flexible electronic component; A portion of the protection layer fills the first through-hole of the flexible electronic component and is connected to the carrier layer.

9. The electronic device according to claim 1, further comprising: a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer; as well as a flexible electronic component bonded to a bonding region of the stretchable electronic component layer, wherein the flexible electronic component has a second through-hole, the bonding region of the stretchable electronic component layer has a bonding region through-hole, and the second through-hole of the flexible electronic component and the bonding region through-hole of the stretchable electronic component layer are arranged correspondingly; as well as a protective layer disposed on the carrier layer and covering the stretchable electronic component layer and a portion of the flexible electronic component, wherein the protective layer is located between the decorative component layer and the stretchable electronic component layer and between the decorative component layer and the flexible electronic component; A portion of the protection layer is filled into the second through-hole of the flexible electronic component and the bonding region through-hole of the stretchable electronic component layer and is connected to the carrier layer.

10. The electronic device as claimed in claim 1 , wherein a working area of ​​the stretchable electronic component layer has a working area through-hole, the electronic device further comprising: a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer; as well as a protective layer disposed on the carrier layer and covering the stretchable electronic component layer, wherein the protective layer is located between the decorative component layer and the stretchable electronic component layer; A portion of the protection layer is filled into the working area through-hole of the stretchable electronic component layer and is connected to the carrier layer.

11. The electronic device according to claim 1 , further comprising: a carrier layer, wherein the stretchable electronic component layer is disposed on the carrier layer, and the stretchable electronic component layer is located between the decorative component layer and the carrier layer; as well as a sensing layer, wherein the carrier layer is located between the stretchable electronic component layer and the sensing layer; There is an air gap between the sensing layer and the carrier layer. 12 . The electronic device as claimed in claim 11 , wherein a surface of the carrier layer facing the sensing layer has a plurality of first micro-protrusions. 13 . The electronic device as claimed in claim 12 , wherein the sensing layer comprises an insulating substrate, and a surface of the insulating substrate facing the carrier layer has a plurality of second micro-protrusions. 14 . The electronic device as claimed in claim 13 , wherein a size of the first micro-protrusion of the carrier layer is smaller than a size of the second micro-protrusion of the sensing layer.

15. The electronic device as claimed in claim 11, wherein the sensing layer comprises an insulating substrate and an electrode disposed on the insulating substrate, and the surface impedance of the carrier layer falls within 10 4 Ω / sq~10 9 The range of Ω / sq.

16. The electronic device as claimed in claim 1, wherein the sensing layer comprises an insulating substrate and an electrode embedded in the insulating substrate, and the surface impedance of the carrier layer falls within 10 -3 Ω / sq~10 3 The range of Ω / sq.

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