Display panel, preparation method thereof, display device and equipment

Abstract

Embodiments of the present application provide a display panel, a preparation method thereof, a display device and equipment. The display panel comprises: a substrate; a first electrode layer; a pixel definition layer arranged on one side of the substrate, the pixel definition layer comprising a pixel limiting portion and a pixel opening formed by the pixel limiting portion; an isolation structure arranged on the side of the pixel definition layer away from the substrate and forming a plurality of isolation openings, the isolation opening and the corresponding pixel opening being in communication; a light emitting functional layer comprising a light emitting unit; a second electrode layer; a first encapsulation layer comprising an encapsulation portion for encapsulating each light emitting unit, the encapsulation portion being located on the side of the second electrode away from the substrate; wherein the distance between the orthographic projections of the two adjacent isolation openings on the substrate is a second width, the width of the orthographic projection of the isolation opening on the substrate is a third width, and the third width is greater than 2 times the second width and less than or equal to 125 times the second width. The present application can improve the use performance of the display panel.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel and its manufacturing method, display device and equipment. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, the performance of current OLED display products needs improvement. Summary of the Invention

[0005] This application provides a display panel, a method for manufacturing the same, a display device, and an equipment, aiming to improve the performance of the display panel.

[0006] An embodiment of the first aspect of this application provides a display panel, which includes a display area and a non-display area. The display panel includes: a substrate, including a substrate and a driving unit disposed on the substrate; a first electrode layer, disposed on one side of the substrate and including a plurality of spaced-apart first electrodes; a pixel definition layer, disposed on one side of the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the orthographic projection of the pixel opening on the substrate and the orthographic projection of the first electrode on the substrate at least partially overlap; and an isolation structure, disposed on the side of the pixel definition layer away from the substrate and forming a plurality of isolation openings, the isolation openings communicating with corresponding pixel openings, the isolation structure including a direction away from the substrate. The system comprises a first sublayer and a second sublayer stacked together, the second sublayer protruding toward the isolation opening relative to the first sublayer; a light-emitting functional layer including a plurality of light-emitting units at least partially located in the isolation opening, the light-emitting units being at least partially located in pixel openings; a second electrode layer including a plurality of second electrodes located on the side of the light-emitting units facing away from the substrate; and a first encapsulation layer including an encapsulation portion for encapsulating each light-emitting unit, the encapsulation portion being located on the side of the second electrodes facing away from the substrate; wherein the distance between the orthographic projections of two adjacent isolation openings onto the substrate is a second width, the width of the orthographic projection of the isolation opening onto the substrate is a third width, and the third width is greater than or equal to twice the second width and less than or equal to 125 times the second width.

[0007] The second aspect of this application also provides a display device, including the display panel provided in any of the first aspect embodiments described above.

[0008] An embodiment of the third aspect of this application also provides an apparatus including the display panel provided in any of the first aspect embodiments described above.

[0009] The display panel provided in this application embodiment includes a substrate, a pixel definition layer, an isolation structure, a light-emitting functional layer, a first electrode layer, a second electrode layer, and an encapsulation layer. The pixel definition layer includes a pixel defining portion and a pixel opening. The light-emitting unit is located within the pixel opening, and the pixel defining portion can improve the problem of crosstalk between adjacent light-emitting units. The isolation structure encloses and forms an isolation opening, which is correspondingly disposed with the pixel opening. The second sub-layer of the isolation structure protrudes relative to the first sub-layer, and a concave space can be formed under the second sub-layer. This allows the isolation structure to be used to separate the light-emitting material film layer into independent light-emitting units, simplifying the fabrication of the display panel. The first electrode and the second electrode cooperate to drive the light-emitting unit to emit light. The third electrode has a width greater than or equal to twice the second width and less than 125 times the second width. This gives the display panel a larger aperture ratio, making it more suitable for large-screen display devices such as televisions, and also improves the problem that the isolation structure's narrow width cannot effectively separate the light-emitting units. Therefore, the display panel provided in this application embodiment is suitable for large-screen display devices and can improve the display panel's performance in large-screen display devices. Attached Figure Description

[0010] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0011] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0012] Figure 2 yes Figure 1 A partially enlarged structural diagram;

[0013] Figure 3 yes Figure 2 A partial sectional view;

[0014] Figure 4 yes Figure 1 A schematic diagram of the driving unit of the display panel shown;

[0015] Figure 5 yes Figure 3 A schematic diagram of the pixel driving circuit included in the middle substrate;

[0016] Figure 6 yes Figure 2 A partial sectional view corresponding to another example;

[0017] Figure 7 yes Figure 1 A magnified view of the structure corresponding to another example;

[0018] Figure 8 yes Figure 1 A partial enlarged structural diagram corresponding to another example;

[0019] Figure 9 yes Figure 2 A partial sectional view corresponding to another example;

[0020] Figure 10 yes Figure 1 A corresponding example with a partially enlarged structural diagram;

[0021] Figure 11 yes Figure 1 A magnified schematic diagram of a corresponding example;

[0022] Figure 12 yes Figure 1 Another example is a partially enlarged structural diagram;

[0023] Figures 13 to 17 yes Figure 2 Partial sectional views corresponding to different examples;

[0024] Figure 18 yes Figure 4 A partially enlarged structural diagram;

[0025] Figure 19 yes Figure 3 A partially enlarged structural diagram;

[0026] Figure 20 yes Figure 3 This corresponds to a magnified view of the structure in another example;

[0027] Figure 21 yes Figure 3 A magnified schematic diagram of a portion of the isolation structure in one example;

[0028] Figure 22 yes Figure 3 A magnified schematic diagram of a portion of the isolation structure in one example;

[0029] Figure 23 yes Figure 2 A partially enlarged structural diagram;

[0030] Figure 24 yes Figure 3 A schematic diagram of the pixel driving circuit included in the substrate, corresponding to another example;

[0031] Figure 25 yes Figure 3 A schematic diagram of the pixel driving circuit included in a substrate corresponding to another embodiment;

[0032] Figure 26 yes Figure 3A schematic diagram showing the relative positional relationship between the pixel driving circuit and the first electrode in another embodiment;

[0033] Figure 27 yes Figure 3 A schematic diagram showing the relative positional relationship between the pixel driving circuit and the first electrode in another embodiment;

[0034] Figure 28 yes Figure 3 A schematic diagram showing the relative positional relationship between the pixel driving circuit and the first electrode in another embodiment;

[0035] Figure 29 yes Figure 2 A magnified view of the structure corresponding to another example;

[0036] Figures 30 to 45 yes Figure 2 Partial sectional views corresponding to different examples;

[0037] Figure 46 yes Figure 2 A schematic diagram of a planar structure corresponding to one example of an isolation structure;

[0038] Figure 47 yes Figure 1 A schematic diagram of the planar structure of the display panel in one example;

[0039] Figure 48 yes Figure 2 A schematic diagram of a planar structure corresponding to an isolation structure in one example;

[0040] Figures 49 to 51 yes Figure 2 Partial sectional views corresponding to different examples;

[0041] Figure 52 yes Figure 2 A schematic diagram of the planar structure of the pixel definition layer in one example;

[0042] Figure 53 yes Figure 2 A schematic diagram of the planar structure of the pixel definition layer, corresponding to another example;

[0043] Figure 54 yes Figure 2 A schematic diagram of the planar structure of the panel layer structure corresponding to one example;

[0044] Figure 55 yes Figure 2 A schematic diagram of a partial layered structure corresponding to one example;

[0045] Figures 56 to 58 yes Figure 2 Corresponding partial sectional views in different examples;

[0046] Figure 59 This is a schematic diagram of the display panel structure provided in another embodiment.

[0047] Figure 60 This is a schematic diagram of the process structure of a display panel fabrication method provided in an embodiment of this application;

[0048] Figure 61 This is a schematic diagram of the process flow of a display panel fabrication method provided in another embodiment of this application;

[0049] Figure 62 This is a schematic diagram of the process structure of a display panel fabrication method according to another embodiment of this application;

[0050] Figures 63 to 65 This is a schematic diagram of the manufacturing process of a display panel provided in one embodiment of this application.

[0051] Explanation of reference numerals in the attached figures:

[0052] 10. Display panel; SPX1, first sub-pixel; SPX2, second sub-pixel; SPX3, third sub-pixel;

[0053] 100, Substrate; 11, Driving circuit layer; 100a, Substrate; 110, Driving unit; 110a, First driving unit; 110b, Second driving unit; 111, Pixel driving circuit; T1, Driving transistor; T2, Switching transistor; 1111, Output terminal of pixel driving circuit; 112, Conductive layer; 1121, First conductive layer; 120, Planarization layer; 121a, First via; 121, First through-hole; 1211, First connection opening; 1212, Second connection opening; 122, Second through-hole; 123, Third through-hole; 130, First signal line; 140, Second signal line;

[0054] 200, Pixel definition layer; 201, First definition layer; 202, Second definition layer; 210, Pixel limiting part; 220, Pixel opening; 220a, First sub-opening; 221, First pixel opening; 222, Second pixel opening; 223, Third pixel opening; 2201, Side edge; 2202, Corner edge; 230, Light-emitting unit; 230a, Sub-light-emitting unit; 231, First light-emitting unit; 232, Second light-emitting unit; 233, Third light-emitting unit; EML, Light-emitting material layer; CGL, Charge generation layer;

[0055] 300, Isolation structure; 301, First sub-layer; 301h, First recess; 3011, First side surface; 3011a, First sub-surface; 3011b, Second sub-surface; 3012, First bottom surface; 3013, Covering part; 302, Second sub-layer; 302h, Second recess; 303, Third sub-layer; 303h, Third recess; 3031, Overlapping part; 3032, Connecting part; 310, Isolation opening; 310a, Second sub-opening; 311, First isolation opening; 312, Second isolation opening; 313, Third isolation opening; 320, First isolation part; 321, Elevated part; 321a, Initial elevated part; 321b, First opening; 322, Main isolation part; 330, Second isolation part; 340, Isolation groove; 350, Third isolation part;

[0056] 400, First electrode layer; 410, First electrode; 411, Sub-electrode; 420, Signal transfer unit;

[0057] 500, Second electrode layer; 510, Second electrode; 511, Main body; 512, Contact portion;

[0058] 600, Encapsulation layer; 610, First encapsulation layer; 611, Encapsulation portion; 611a, First segment; 611b, Second segment; 611h, Encapsulation recess; 612, Break; 612a, First encapsulation portion; 612b, Second encapsulation portion; 612c, Third encapsulation portion; 613, First gap; 614, Second gap; 610a, First encapsulation sublayer; 610aa, First encapsulation sub-part; 610b, Second encapsulation sublayer; 610ba, Second encapsulation sub-part; 610c, Third encapsulation sublayer; 610d, Gap space; 620, Second encapsulation layer; 630, Third encapsulation layer; 640, First wear-resistant layer;

[0059] 701. Dam; 700. Conductive part; 710. First conductive part; 720. Second conductive part;

[0060] 800. Protective cover; 810. Sealing structure; 820. Enclosed space;

[0061] 900, Polarizing film; 910, Recessed space; 920, Water and oxygen resistant structure; 930, Adhesive layer;

[0062] α1, First included angle; α2, Second included angle; α3, Third included angle; L, First distance; h, First height; W1, First width; W2, Second width; W3, Third width;

[0063] AA, Display area; NA, Non-display area; NA1, Side bezel; NA2, Bottom bezel;

[0064] X, first direction; Y, second direction; Z, thickness direction. Detailed Implementation

[0065] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0066] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0067] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0068] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0069] For certain elements, terms like "above" or "overhead" are sometimes used when describing the position of an element in the Z direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "overhead," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0070] For large-screen display devices such as televisions, it's rare to directly use true OLED subpixels. Instead, related technologies often employ a single backlight unit and quantum dot materials to alter the emitted light color, thus achieving color display and creating subpixels of different colors. Alternatively, a single-color backlight unit can be used, with filtering and other techniques employed to change the emitted light color and create subpixels of different colors. This significantly increases the display device's power consumption and negatively impacts its display quality.

[0071] Fine-mask-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance aspects, offering advantages such as high performance, full-size display, and agile delivery. Combining fine-mask-free technology with OLED subpixels for large-screen displays such as televisions is becoming a trend. However, due to the large display area and low pixel density of large-screen displays like televisions, the subpixel area is typically set to be large. Therefore, the pixel driver circuit 111 needs to provide 2 to 25 times more current than in smaller screen products like mobile phones. Consequently, the power supply capability and device stability of the pixel driver circuit 111 face severe challenges. Insufficient power supply to the pixel driver circuit 111 results in low brightness in TV products, preventing the achievement of high brightness, while excessive current causes device characteristic drift, leading to color accuracy changes (color shift) or reduced brightness.

[0072] To address the aforementioned technical problems, this application is proposed. For a better understanding of this application, the appendix is ​​provided below. Figures 1 to 65 The present application describes the display panel 10, its manufacturing method, and the corresponding display device and equipment.

[0073] Figure 1 This is a schematic diagram of the structure of a display panel 10 according to one embodiment of this application. The display panel 10 may be an organic light-emitting diode (OLED) display panel or a quantum dot (QLED) display panel. The display panel 10 includes a display area AA with display function and a non-display area NA.

[0074] The shape of the display area AA of the display panel 10 can be rectangular, square, circular, oval, or other shapes.

[0075] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. Each pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, a pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, in addition to sub-pixels SPX1, SPX2, and SPX3, a pixel PX also includes sub-pixels SPX that emit white or other colors of light.

[0076] Sub-pixels (SPX) include pixel driving circuits 111 and light-emitting devices driven by pixel driving circuits 111 to emit light of a corresponding color. First sub-pixel SPX1 includes a first light-emitting device, second sub-pixel SPX2 includes a second light-emitting device, and third sub-pixel SPX3 includes a third light-emitting device. One pixel driving circuit 111 drives at least one light-emitting device to emit light. For example, display area AA includes a normal display area AA and a light-transmitting display area AA. The light-transmitting display area AA is a display area AA set for a corresponding sensor and having light-transmitting properties, while the normal display area AA is a display area AA not set for a corresponding sensor. In the normal display area AA, one pixel driving circuit 111 drives one light-emitting device to emit light, and in the light-transmitting display area AA, one pixel driving circuit 111 drives one or more light-emitting devices to emit light.

[0077] like Figure 2 and Figure 3As shown, an embodiment of the first aspect of this application provides a display panel 10, which includes a display area AA and a non-display area NA. The display panel 10 includes: a substrate 100, including a substrate 100a and a driving unit 110 disposed on the substrate 100a; a first electrode layer 400, disposed on one side of the substrate 100 and including a plurality of spaced first electrodes 410; a pixel definition layer 200, disposed on one side of the substrate 100, the pixel definition layer 200 including a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210, the orthographic projection of the pixel opening 220 on the substrate 100a and the orthographic projection of the first electrode 410 on the substrate 100a at least partially overlap; and an isolation structure 300, disposed on the side of the pixel definition layer 200 away from the substrate 100 and forming a plurality of isolation openings 310, the isolation openings 310 communicating with the corresponding pixel openings 220, the isolation structure 300 including a portion of the first electrode 410 away from the substrate. A first sublayer 301 and a second sublayer 302 are stacked in the direction of 100, with the second sublayer 302 protruding relative to the first sublayer 301 toward the isolation opening 310; a light-emitting functional layer includes a plurality of light-emitting units 230 at least partially located in the isolation opening 310, with at least a portion of the light-emitting units 230 located in the pixel opening 220; a second electrode layer 500 includes a plurality of second electrodes 510 located on the side of the light-emitting units 230 away from the substrate 100; a first encapsulation layer 610 includes an encapsulation portion 611 for encapsulating each light-emitting unit 230, with the encapsulation portion 611 located on the side of the second electrodes 510 away from the substrate 100; wherein, the spacing between the orthographic projections of two adjacent isolation openings 310 onto the substrate 100a is a second width W2, the width of the orthographic projection of the isolation opening 310 onto the substrate 100a is a third width W3, and the third width W3 is greater than or equal to twice the second width W2 and less than or equal to 125 times the second width W2.

[0078] In the display panel 10 provided in this embodiment, the display panel 10 includes a substrate 100, a pixel definition layer 200, an isolation structure 300, an emissive functional layer, a first electrode layer 400, a second electrode layer 500, and an encapsulation layer 600. The pixel definition layer 200 includes a pixel defining portion 210 and a pixel opening 220. The emissive unit 230 is located within the pixel opening 220. The pixel defining portion 210 can improve the problem of light crosstalk between adjacent emissive units 230. The isolation structure 300 encloses and forms an isolation opening 310. The isolation opening 310 and the pixel opening 220 are correspondingly disposed. The second sub-layer 302 of the isolation structure 300 protrudes relative to the first sub-layer 301. A concave space can be formed under the second sub-layer 302, so that the isolation structure 300 can be used to separate the emissive material film layer into mutually independent emissive units 230, which can simplify the fabrication of the display panel 10. The first electrode 410 and the second electrode 510 cooperate to drive the light-emitting unit 230 to emit light. The third width W3 is greater than or equal to twice the second width W2 and less than 125 times the second width W2. This gives the display panel 10 a larger aperture ratio, making it more suitable for large-screen display devices such as televisions. It also improves the problem that the narrow width of the isolation structure 300 cannot properly separate the light-emitting unit 230. Therefore, the display panel 10 provided in this embodiment is suitable for large-screen display devices and can improve the performance of the display panel 10 in large-screen display devices.

[0079] Please refer to the above. The display area AA can be used to set sub-pixels, etc., to realize the light-emitting display function of the display panel 10. The non-display area NA can be used to set the driving unit 110, signal lines, etc., to transmit control signals to the light-emitting unit 230 of the display area AA.

[0080] There are multiple, selectable ways to set up the substrate 100, such as... Figure 3 and Figure 4 As shown, the substrate 100 further includes a substrate 100a and a driving unit 110 disposed on the substrate 100a. The driving unit 110 may include a pixel driving circuit 111. For example, the substrate 100 includes a substrate 100a and a driving circuit layer 11 and a planarization layer 120 disposed on the substrate 100a. The pixel driving circuit 111 includes a transistor and a capacitor. The capacitor includes a first electrode and a second electrode. The transistor includes a source, a drain, a gate, and a semiconductor layer. The driving circuit layer 11 also includes multiple signal lines, such as data signal lines, scan signal lines, driving power supply voltage signal lines, etc. The driving circuit layer 11 includes multiple metal layers, including a first metal layer, a second metal layer, and a third metal layer. The gate and the first electrode may be located on the first metal layer, the second electrode may be located on the second metal layer, and the source and drain may be located on the third metal layer.

[0081] Optional, see reference Figure 5The pixel driving circuit 111 includes a driving transistor T1 and a switching transistor T2. The source of the switching transistor T2 is connected to the data line Data that provides the data signal, the gate of the switching transistor T2 is connected to the scan line that provides the scan signal Scan, and the drain of the switching transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting device. Figure 5 This is one embodiment of the pixel driving circuit 111, but the pixel driving circuit 111 of this application is not limited to... Figure 5 The pixel driving circuit 111 of 2T1C shown can also be other pixel driving circuits 111, such as 7T1C, 8T1C pixel driving circuits 111, etc.

[0082] Optionally, the first electrode layer 400 includes a plurality of first electrodes 410 arranged in an array, each first electrode 410 being disposed corresponding to a pixel opening 220, and the first electrodes 410 being used to drive the light-emitting unit 230 to emit light. A portion of the first electrode 410 is exposed through the pixel opening 220, and another portion of the first electrode 410 is located between the pixel defining portion 210 and the substrate 100.

[0083] The first electrode 410 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metallic material with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 510 is formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0084] There are various ways to set the material of the pixel definition layer 200. For example, the material of the pixel definition layer 200 is an inorganic material. For example, the pixel definition layer 200 is formed using at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON) as an inorganic insulating material.

[0085] In one implementation, such as Figure 6 As shown, the pixel definition layer 200 includes multiple sub-layers. The pixel definition layer 200 includes a first definition layer 201 and a second definition layer 202 that are stacked sequentially along the direction away from the substrate 100. That is, the pixel definition layer 200 can adopt a double-layer design.

[0086] For example, the first defining layer 201 has better film-forming properties than the second defining layer 202. That is, under the same thickness conditions, the first defining layer 201 can better cover the stepped structure formed by the first electrode 410 than the second defining layer 202, without causing cracks. Conversely, to obtain the same stepped coverage effect, the thickness of the first defining layer 201 needs to be thinner than that of the second defining layer 202. That is, the thickness requirement for the first defining layer 201 is relatively low, which is beneficial for product thinning. In addition, better film-forming properties are reflected in the better coverage of the formed film, which is denser and more conducive to the isolation of moisture. That is, the material density of the first defining layer 201 is greater than that of the second defining layer 202.

[0087] For example, the second defining layer 202 has better etching resistance than the first defining layer 201. Since the side of the pixel defining layer 200 facing away from the substrate 100 will be etched during the manufacturing process of the display panel 10, by selecting a material with stronger etching resistance as the second defining layer 202, the etching resistance of the pixel defining layer 200 can be improved, thereby further improving the reliability of the display panel 10.

[0088] For example, the first defining layer 201 and the second defining layer 202 are made of different materials. For instance, the first defining layer 201 is made of silicon nitride, and the second defining layer 202 is made of silicon oxide.

[0089] For example, the thickness of the first defining layer 201 is greater than or equal to 1000 micrometers and less than or equal to 5000 micrometers. For instance, the thickness of the first defining layer 201 is 1000 micrometers, 2000 micrometers, 3000 micrometers, 4000 micrometers, 5000 micrometers, etc.

[0090] For example, the thickness of the second defining layer 202 is greater than or equal to 500 micrometers and less than or equal to 3000 micrometers. For instance, the thickness of the second defining layer 202 is 500 micrometers, 1000 micrometers, 2000 micrometers, 3000 micrometers, etc.

[0091] Optional, such as Figure 6 As shown, the isolation structure 300 also includes a third sub-layer 303, which is located on the side of the first sub-layer 301 facing the substrate 100, and protrudes from the first sub-layer 301 toward the isolation opening 310. During the fabrication of the isolation structure 300, when the first sub-layer 301 is side-etched, the third sub-layer 303 can provide protection to the film layer on the substrate 100 side.

[0092] Optionally, the first sublayer 301 and the second sublayer 302 are made of different materials, and the etching rate of the first sublayer 301 is lower than that of the second sublayer 302. The first sublayer 301 is made of a conductive material, specifically including at least one of aluminum (Al), aluminum alloys, and copper. The aluminum alloy may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The second sublayer 302 can be a single-layer structure or a multi-layer structure. If the second sublayer 302 is a single-layer structure, its material may include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. Figure 6 As shown, when the second sublayer 302 has a multi-layer structure, one layer of the second sublayer 302 is made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. Figure 6 As shown, the other layer material of the second sublayer 302 may include a conductive oxide or an inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0093] Optionally, the material of the third sublayer 303 includes a conductive material. For example, the material of the third sublayer 303 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0094] Optionally, the second electrode 510 is electrically connected to the isolation structure 300. For example, the material of the first sub-layer 301 includes a conductive material, and the second electrode 510 is electrically connected to the first sub-layer 301. Alternatively, the materials of both the first sub-layer 301 and the third sub-layer 303 include conductive materials, and the second electrode 510 is electrically connected to the third sub-layer 303 and the first sub-layer 301.

[0095] Optionally, at least one light-emitting unit 230 includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the substrate 100 (thickness direction Z). The light-emitting unit 230 may include a single light-emitting material layer EML, or a stacked light-emitting structure including multiple light-emitting material layers EML.

[0096] During the light emission process of the light-emitting unit 230, the first electrode 410 is used to generate holes, and the second electrode 510 is used to generate electrons. Holes and electrons combine within the light-emitting unit 230, causing the light-emitting unit 230 to emit light. The first electrode 410 is in contact with the light-emitting unit 230, and a portion of the light-emitting unit 230 may overlap with the isolation structure 300. This can cause holes to crosstalk between adjacent light-emitting units 230 through the light-emitting unit 230 and the isolation structure 300. In this embodiment, the pixel limiting portion 210 is provided with a recess, which allows at least a portion of the light-emitting unit 230 to break at the recess, thereby reducing the hole transmission area and improving the problem of lateral crosstalk.

[0097] In order for the light-emitting unit 230 to emit light, a pixel voltage is provided to the first electrode 410 and a common voltage is provided to the second electrode 510, respectively, forming a potential difference between the first electrode 410 and the second electrode 510, so that the light-emitting structure disposed between the first electrode 410 and the second electrode 510 emits light. In one embodiment, if a potential difference is formed between the first electrode 410 and the second electrode 510 of the light-emitting unit 230, the light-emitting material layer EML of the light-emitting unit 230 emits light.

[0098] In this circuit, the pixel voltage of the first electrode 410 is provided by the pixel driving circuit 111, and the common voltage of the second electrode 510 is provided by the isolation structure 300. Specifically, the second electrode 510 is electrically connected to the isolation structure 300, and the common voltage is supplied to the second electrode 510 by providing the isolation structure 300. That is, the isolation structure 300 has the function of supplying a common voltage to the second electrode 510.

[0099] Optionally, the encapsulation portion 611 is located on the side of the second electrode 510 facing away from the substrate 100, and extends through the sidewall of the isolation structure 300 to the side of the isolation structure 300 facing away from the substrate 100. That is, the encapsulation portion 611 not only covers the isolation opening 310, but also covers a portion of the isolation structure 300 surrounding the isolation opening 310, thereby expanding the distribution area of ​​the encapsulation portion 611 and improving the encapsulation effect of the encapsulation portion 611. Each encapsulation portion 611 can provide encapsulation protection to the corresponding light-emitting unit 230, realizing independent encapsulation. This encapsulation structure can more comprehensively and tightly encapsulate each light-emitting unit 230, effectively preventing external moisture, oxygen, etc. from entering the light-emitting unit 230, improving the yield of the light-emitting unit 230 affected by moisture and oxygen intrusion, and extending the service life of the display panel 10.

[0100] For example, such as Figure 3As shown, the encapsulation part 611 includes a first segment 611a and a second segment 611b that are connected to each other. The first segment 611a is located inside the isolation opening 310 and is disposed on the side of the light-emitting unit 230 away from the substrate 100. The second segment 611b is located on the side of the isolation structure 300 facing the isolation opening 310. The surface of the first segment 611a away from the substrate 100 and the surface of the second segment 611b away from the isolation structure 300 are at least partially connected to each other to enclose and form a gap space 610d.

[0101] For example, such as Figure 6 As shown, the surface of the first segment 611a facing away from the substrate 100 and the surface of the second segment 611b facing away from the isolation structure 300 may not be connected.

[0102] like Figure 3 As shown, the display panel 10 further includes a second encapsulation layer 620 and a third encapsulation layer 630. The second encapsulation layer 620 covers the isolation structure 300 and the encapsulation portion 611, and the third encapsulation layer 630 covers the second encapsulation layer 620. Both the first encapsulation layer 610 and the third encapsulation layer 630 are inorganic materials, and the materials of the first encapsulation layer 610 and the third encapsulation layer 630 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 620 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The second encapsulation layer 620 and the third encapsulation layer 630 are continuously disposed at least on the entire display area AA, with a portion of them also disposed on the non-display area NA.

[0103] Optional, such as Figure 2 As shown, the light-emitting unit 230 includes a first light-emitting unit 231, a second light-emitting unit 232 and a third light-emitting unit 233, and the pixel opening 220 includes a first pixel opening 221 for accommodating the first light-emitting unit 231, a second pixel opening 222 for accommodating the second light-emitting unit 232 and a third pixel opening 223 for accommodating the third light-emitting unit 233.

[0104] Optionally, the second width W2 can be the distance between the orthographic projections of any two adjacent isolation openings 310 onto the substrate 100a. As described above, the isolation structure 300 includes a first sub-layer 301 and a second sub-layer 302, and the second width W2 can be the width of the first sub-layer 301 or the width of the second sub-layer 302 between any two adjacent isolation openings 310. When the isolation structure 300 includes the aforementioned third sub-layer 303, the second width W2 can also be the width of the third sub-layer 303 between any two adjacent isolation openings 310. Figure 3As shown, in this embodiment, the width of the second sub-layer 302 between any two adjacent isolation openings 310 is used as the second width W2. The second sub-layer 302 has a significant impact on the aperture ratio and resolution of the display panel 10. By using the width of the second sub-layer 302 as the second width W2 and reasonably setting the second width W2 and the third width W3, the display panel 10 can be made more suitable for large-size display devices. Optionally, the orthographic projection of the isolation opening 310 onto the substrate 100a can be formed by the side surface of the first sub-layer 301 or the second sub-layer 302 facing the isolation opening 310. For example, as Figure 3 As shown, the orthographic projection of the isolation opening 310 onto the substrate 100a is formed by the side surface of the second sublayer 302 facing the isolation opening 310. The third width W3 of the isolation opening 310 can be the orthographic projection width of the side surface of the second sublayer 302 facing the isolation opening 310 onto the substrate 100a. Optionally, the third width W3 can be the distance between the edge of the orthographic projection of the isolation opening 310 onto the substrate 100a and the two intersection points of the straight line passing through the centroid of the orthographic projection of the isolation opening 310 onto the substrate 100a.

[0105] The third width W3 is greater than or equal to twice the second width W2 and less than or equal to 125 times the second width W2. The minimum value of the third width W2 is greater than or equal to twice the maximum value of the second width W2, and the maximum value of the third width W2 is less than or equal to 125 times the maximum value of the second width W2.

[0106] Optionally, the orthographic projection of the pixel opening 220 onto the substrate 100a has a first width W1. The first width W1 can be the distance between the two intersection points of the edge of the orthographic projection of the pixel opening 220 onto the substrate and a straight line passing through the centroid of the orthographic projection of the pixel opening 220 onto the substrate 100a. Optionally, the pixel opening 220 is formed by the pixel defining portion 210 surrounding the side surface of the pixel opening 220, and the size of the pixel opening 220 gradually increases in the direction away from the substrate 100. The pixel defining portion 210 has a bottom surface facing the substrate 100 and a bottom surface facing away from the substrate 100. The orthographic projection of the pixel opening 220 onto the substrate 100a can be formed by the bottom edge of the pixel defining portion 210, or the orthographic projection of the pixel opening 220 onto the substrate 100a can be formed by the top edge of the pixel defining portion 210, or the orthographic projection of the pixel opening 220 onto the substrate 100a can be formed by any position of the pixel defining portion 210 surrounding the side surface of the pixel opening 220. This embodiment of the application uses the example of the orthographic projection of the pixel opening 220 onto the substrate 100a being enclosed by the bottom surface of the pixel limiting portion 210. The area enclosed by the bottom surface constitutes the contact area between the light-emitting unit 230 and the first electrode 410 within the pixel opening 220, i.e., the effective light-emitting area. By having the orthographic projection of the pixel opening 220 onto the substrate 100a enclosed by the bottom surface of the pixel limiting portion 210, the effective light-emitting area of ​​the pixel opening 220 can be better designed.

[0107] Optional, such as Figure 2 As shown, multiple first light-emitting units 231 are arranged at intervals along the second direction Y to form a first pixel column, multiple second light-emitting units 232 are arranged at intervals along the second direction Y to form a second pixel column, and multiple third light-emitting units 233 are arranged at intervals along the second direction Y to form a third pixel column. The first pixel column, second pixel column, and third pixel column are arranged alternately along the first direction X. Optionally, the extension dimensions of the first light-emitting unit 231, second light-emitting unit 232, and third light-emitting unit 233 in the first direction X are smaller than their extension dimensions in the second direction Y, and the extension dimension of the light-emitting unit 230 in the first direction X is the width of the light-emitting unit 230. Correspondingly, the extension dimension of the pixel opening 220 in the first direction X is smaller than its extension dimension in the second direction Y, and the extension dimension of the pixel opening 220 in the first direction X is the width of the pixel opening 220, i.e., the first width W1. Correspondingly, the extension dimension of the isolation opening 310 in the first direction X is smaller than its extension dimension in the second direction Y, and the extension dimension of the isolation opening 310 in the first direction X is the width of the isolation opening 310, i.e., the third width W3.

[0108] Optionally, a second width W2 and a third width W3 can be taken in the same direction. For example, as shown... Figure 2As shown, along the first direction X, the width of the orthographic projection of the isolation opening 310 onto the substrate 100a is the aforementioned third width W3, and the distance between the orthographic projections of two adjacent isolation openings 310 onto the substrate 100a is the aforementioned second width W2. In other embodiments, the direction in which the third width W3 is taken may be different from the direction in which the second width W2 is taken.

[0109] Optionally, the second width W2 is 3μm to 6μm, and the third width W3 is greater than 6 times the second width W2 and less than or equal to 125 times the second width W2; or, the second width W2 is 7μm to 10μm, and the third width W3 is greater than 3 times the second width W2 and less than or equal to 69 times the second width W2; or, the second width W2 is 11μm to 16μm, and the third width W3 is greater than or equal to 2 times the second width W2 and less than or equal to 47 times the second width W2. Setting the size of the third width W3 for the second width W2 of different isolation structures 300 allows the display panel 10 to be adapted to large-screen display devices of different sizes and resolutions.

[0110] like Figure 2 As shown, when the first light-emitting unit 231 is a red light-emitting unit 230, the second light-emitting unit 232 is a green light-emitting unit 230, and the third light-emitting unit 233 is a blue light-emitting unit 230, and multiple light-emitting units 230 are arranged to form the aforementioned first pixel column, second pixel column, and third pixel column, and the second width W2 is 5 micrometers, the width of each isolation opening 310 in the first direction X is set as follows for different display area AA sizes, different resolutions, and pixel densities:

[0111] Table 1

[0112]

[0113] In Table 1, the dimensions of display area AA are in inches. For example, a size of 45 for display area AA means that display area AA is 45 inches. PPI stands for pixel density. W2 is the spacing between two adjacent isolation openings 310 in the first direction X, in micrometers. W3_R can be the first width W1 of the first isolation opening 311 in the first direction X, W3_G can be the width of the second isolation opening 312 in the first direction X, and W3_B can be the width of the third isolation opening 313 in the first direction X. The third width W3 is also in micrometers.

[0114] As shown in Table 1 above, when the second width W2 is 5 μm, the third width W3 is greater than 6 times the second width W2 and less than or equal to 125 times the second width W2. Specifically, the third width W3 corresponding to the first isolation opening 311 and the second isolation opening 312 is equal. When the second width W2 is 5 μm, the third width W3 corresponding to the first isolation opening 311 and the second isolation opening 312 is greater than 6 times the second width W2 and less than or equal to 57.2 times the second width W2. The third width W3 of the third isolation opening 313 is larger. When the second width W2 is 5 μm, the third width W3 corresponding to the third isolation opening 313 is greater than 11 times the second width W2 and less than or equal to 125 times the second width W2.

[0115] like Figure 2 As shown, when the first light-emitting unit 231 is a red light-emitting unit 230, the second light-emitting unit 232 is a green light-emitting unit 230, and the third light-emitting unit 233 is a blue light-emitting unit 230, and multiple light-emitting units 230 are arranged to form the aforementioned first pixel column, second pixel column, and third pixel column, and the second width W2 is 9 micrometers, the width of each isolation opening 310 in the first direction X is set as follows for different display area AA sizes, different resolutions, and pixel densities:

[0116] Table 2

[0117]

[0118] As shown in Table 2 above, when the second width W2 is 9 μm, the third width W3 is greater than 3 times the second width W2 and less than or equal to 69 times the second width W2. Specifically, the third width W3 of the first isolation opening 311 and the second isolation opening 312 is equal. When the second width W2 is 7 μm, the third width W3 corresponding to the first isolation opening 311 and the second isolation opening 312 is greater than 3 times the second width W2 and less than or equal to 34.6 times the second width W2. The third width W3 of the third isolation opening 313 is relatively large. When the second width W2 is 9 μm, the third width W3 corresponding to the third isolation opening 313 is greater than 5.4 times the second width W2 and less than or equal to 68.7 times the second width W2.

[0119] like Figure 2 As shown, when the first light-emitting unit 231 is a red light-emitting unit 230, the second light-emitting unit 232 is a green light-emitting unit 230, and the third light-emitting unit 233 is a blue light-emitting unit 230, and multiple light-emitting units 230 are arranged to form the aforementioned first pixel column, second pixel column, and third pixel column, and the second width W2 is 13 micrometers, the width of each isolation opening 310 in the first direction X is set as follows for different display area AA sizes, different resolutions, and pixel densities:

[0120] Table 3

[0121]

[0122] As shown in Table 3 above, when the second width W2 is 13 μm, the third width W3 is greater than twice the second width W2 and less than or equal to 47 times the second width W2. Specifically, the third width W3 of the first isolation opening 311 and the second isolation opening 312 are equal. When the second width W2 is 13 μm, the third width W3 corresponding to the first isolation opening 311 and the second isolation opening 312 is greater than 1.8 times the second width W2 and less than or equal to 23.8 times the second width W2. The third width W3 of the third isolation opening 313 is larger. When the second width W2 is 13 μm, the third width W3 corresponding to the third isolation opening 313 is greater than 3.3 times the second width W2 and less than or equal to 47.2 times the second width W2.

[0123] When the first light-emitting unit 231 is a red light-emitting unit 230, the second light-emitting unit 232 is a green light-emitting unit 230, and the third light-emitting unit 233 is a blue light-emitting unit 230, and multiple light-emitting units 230 are arranged to form the aforementioned first pixel column, second pixel column, and third pixel column, and the second width W2 is 15 micrometers, the width of each isolation opening 310 in the first direction X is set as follows for different display area sizes, different resolutions, and pixel densities:

[0124] Table 4

[0125]

[0126] As shown in Table 4 above, when the second width W2 is 15 μm, the third width W3 is greater than twice the second width W2 and less than or equal to 41 times the second width W2. Specifically, the third width W3 of the first isolation opening 311 and the second isolation opening 312 are equal. When the second width W2 is 15 μm, the third width W3 corresponding to the first isolation opening 311 and the second isolation opening 312 is greater than twice the second width W2 and less than or equal to 21 times the second width W2. The third width W3 of the third isolation opening 313 is larger. When the second width W2 is 13 μm, the third width W3 corresponding to the third isolation opening 313 is greater than twice the second width W2 and less than or equal to 41 times the second width W2. Note that the multiples between the third width W3 and the second width W2 were rounded to the nearest integer.

[0127] In some alternative embodiments, alternatively, such as Figure 7As shown, multiple first light-emitting units 231 and multiple second light-emitting units 232 are arranged alternately along the second direction Y to form a fourth pixel column, and multiple third light-emitting units 233 are arranged at intervals along the second direction Y to form a fifth pixel column. The fourth and fifth pixel columns are arranged alternately along the first direction X. Optionally, the extension dimension of the third light-emitting unit 233 in the first direction X is smaller than its extension dimension in the second direction Y. Correspondingly, the extension dimension of the third pixel opening 223 in the first direction X is smaller than its extension dimension in the second direction Y, and the width direction of the third pixel opening 223 can be either the first direction X or the second direction Y. For the first light-emitting unit 231 and the second light-emitting unit 232, the extension dimensions of the first light-emitting unit 231 and the second light-emitting unit 232 in the first direction X and their extension dimensions in the second direction Y may be different or the same. For example, the first light-emitting unit 231 and the second light-emitting unit 232 have the same extension size in the first direction X, the extension size of the first light-emitting unit 231 in the second direction Y is smaller than its extension size in the first direction X, and the dimensions of the second light-emitting unit 232 in the first direction X and the second direction Y can be the same, or the extension size of the second light-emitting unit 232 in the second direction Y is larger than its extension size in the first direction X.

[0128] Optionally, the size comparison of the second width W2 and the third width W3 can be a comparison of them in the same direction.

[0129] When multiple light-emitting units 230 are Figure 7 When the fourth and fifth pixel columns are arranged as shown, the width of each isolation opening 310 in the first direction X is set as follows for different display area AA sizes, different resolutions, and pixel densities:

[0130] Table 5

[0131]

[0132] As shown in Table 5 above, when both the third width W3 and the second width W2 are taken from the first direction X, that is, the extension dimension of the orthographic projection of the isolation opening 310 onto the substrate 100a in the first direction X is the third width W3, and the distance between the orthographic projections of two adjacent isolation openings 310 onto the substrate 100a along the first direction X is the second width W2. Firstly, the value of the second width W2 varies for different display sizes and resolutions. When the display area size is 110 inches and the resolution is 2K, the second width is 15 micrometers, and the third width W3 is greater than or equal to 37 times the second width W2 and less than or equal to 45.7 times the second width W2. When the display area size is 45 inches and the resolution is 8K, the pixel density is higher, and the third width W2 is greater than or equal to 9.7 times the second width W2 and less than or equal to 13.3 times the second width W2.

[0133] When multiple light-emitting units 230 are Figure 7 When the fourth and fifth pixel columns are arranged as shown, the width of each isolation opening 310 in the second direction Y is set as follows for different display area AA sizes, different resolutions, and pixel densities:

[0134] Table 6

[0135]

[0136] As shown in Table 6 above, when both the third width W3 and the second width W2 are taken from the second direction Y, that is, the extension dimension of the orthographic projection of the isolation opening 310 on the substrate 100a in the second direction Y is the third width W3, and the distance between the orthographic projections of two adjacent isolation openings 310 on the substrate 100a along the second direction Y is the second width W2. First, the value of the second width W2 is different for different display sizes and resolutions. When the display area size is 110 inches and the resolution is 2K, the second width is 15 micrometers, and the third width W3 is greater than or equal to 23.7 times the second width W2 and less than or equal to 84 times the second width W2. When the display area size is 45 inches and the resolution is 8K, the pixel density is higher, and the third width W3 is greater than or equal to 7.1 times the second width W2 and less than or equal to 24 times the second width W2.

[0137] like Figure 2 and Figure 7 As shown, multiple light-emitting units 230 are arranged in multiple columns along the first direction X and the second direction Y. The second width W2, the first width W1 of the pixel opening 220, and the third width W3 of the isolation opening 310 can take values ​​in the same direction. In some other optional embodiments, when multiple light-emitting units 230 are arranged in... Figure 2 and Figure 7 When arranged as shown, the second width W2, the first width W1 of the pixel opening 220, and the third width W3 of the isolation opening 310 may not take values ​​in the same direction.

[0138] In some alternative embodiments, such as Figure 8As shown, the first light-emitting unit 231 and the third light-emitting unit 233 are alternately arranged along the first direction X to form a first pixel row, and a plurality of second light-emitting units 232 are sequentially arranged along the first direction X to form a second pixel row, with the second light-emitting units 232 positioned between the first light-emitting unit 231 and the third light-emitting unit 233. The second width W2 can take a value in the first direction X or the second direction Y, or the second width W2 can take a value in any direction intersecting the first direction X. The second width W2 can be the spacing between any two adjacent isolation openings 310. For example, the second width W2 can be the minimum spacing between two adjacent isolation openings 310, or the second width W2 can be the maximum spacing between two adjacent isolation openings 310, or the second width W2 can be any value between the minimum spacing between two adjacent isolation openings 310 and the maximum spacing between two adjacent isolation openings 310.

[0139] Optional, such as Figure 2 , Figure 7 and Figure 8 As shown, this embodiment of the application uses the second width W2 as the maximum spacing between two adjacent isolation openings 310 for illustrative purposes. The maximum spacing between two adjacent isolation openings 310 has a significant impact on the aperture ratio and pixel density of the display panel 10. In this embodiment of the application, the second width W2 of the isolation structure 300 is designed as the maximum spacing between two adjacent isolation openings 310, so that the display panel 10 can be better adapted to large-size display devices.

[0140] Similarly, such as Figure 8 As shown, when the shapes of the isolation opening 310 and the pixel opening 220 are not regular rectangles, optionally, the width of the orthographic projection of the isolation opening 310 onto the substrate 100 in any direction can be used as the third width W3. For example, the minimum width of the orthographic projection of the isolation opening 310 onto the substrate 100 can be used as the third width W3, or the maximum width of the orthographic projection of the isolation opening 310 onto the substrate 100 can be used as the third width W3, or any value between the minimum and maximum width of the orthographic projection of the isolation opening 310 onto the substrate 100 can be used as the third width W3.

[0141] Optional, such as Figure 2 , Figure 7 and Figure 8As shown, this embodiment uses the minimum width of the orthographic projection of the isolation opening 310 onto the substrate 100 as the third width W3 for illustration. The minimum width of the orthographic projection of the isolation opening 310 onto the substrate 100 has a significant impact on the aperture ratio and pixel density of the display panel 10. This embodiment uses the minimum width of the orthographic projection of the isolation opening 310 onto the substrate 100 as the third width W3, enabling the display panel 10 to better adapt to large-size display devices. When the isolation opening 310 includes a first isolation opening 311, a second isolation opening 312, and a third isolation opening 313, the third width W3 can be the minimum width of the orthographic projection of any one of the first isolation opening 311, the second isolation opening 312, and the third isolation opening 313 onto the substrate 100.

[0142] like Figure 8 As shown, the orthographic projection of the pixel opening 220 onto the substrate 100 has a first width W1. Optionally, the width of the orthographic projection of the pixel opening 220 onto the substrate 100 in any direction can be used as the first width W1. For example, the minimum width of the orthographic projection of the pixel opening 220 onto the substrate 100 can be used as the first width W1, or the maximum width of the orthographic projection of the pixel opening 220 onto the substrate 100 can be used as the first width W1, or any value between the minimum and maximum width of the orthographic projection of the pixel opening 220 onto the substrate 100 can be used as the first width W1.

[0143] Optional, such as Figure 2 , Figure 7 and Figure 8 As shown, this embodiment uses the minimum width of the orthographic projection of the pixel opening 220 onto the substrate 100 as the first width W1 for illustration. Using the minimum width of the orthographic projection of the pixel opening 220 onto the substrate 100 as the first width W1 has a significant impact on the aperture ratio and pixel density of the display panel 10. This embodiment uses the minimum width of the orthographic projection of the pixel opening 220 onto the substrate 100 as the first width W1, enabling the display panel 10 to better adapt to large-size display devices. When the multiple pixel openings 220 include a first pixel opening 221, a second pixel opening 222, and a third pixel opening 223, the first width W1 can be the minimum width of any one of the first pixel opening 221, the second pixel opening 222, and the third pixel opening 223 projected onto the substrate 100.

[0144] In some alternative embodiments, such as Figure 6 and Figure 9 As shown, the light-emitting unit 230 includes a light-emitting material layer EML or multiple light-emitting material layers EML stacked along the thickness direction Z of the display panel 10. The multiple light-emitting units 230 include at least two light-emitting units 230 with different light-emitting colors, and the number of light-emitting material layers EML of the at least two light-emitting units 230 with different light-emitting colors is different.

[0145] In these optional embodiments, the number of light-emitting material layers (EMLs) of at least two different light-emitting units 230 with different emission colors is different. By reasonably setting the number of EMLs of light-emitting material layers of different color light-emitting units 230, the luminous characteristics of the light-emitting materials of different color OLEDs can be specifically adjusted and optimized. For example, for colors with shorter lifespans and faster decay, appropriately increasing the number of EMLs can compensate for the brightness decay caused by the short lifespan to a certain extent, making the decay degree of the light-emitting materials of different color OLEDs tend to be consistent during long-term use. This effectively prevents problems such as color shift, screen burn-in, or uneven brightness caused by excessive decay of a certain color, and improves the service life and performance of the display panel 10.

[0146] In addition, for light-emitting units 230 with low luminous efficiency, multiple layers of light-emitting material EML can be provided to improve their luminous efficiency and, at the same driving voltage, their service life is also correspondingly improved.

[0147] Compared to related technologies, the embodiments of this application can be applied to television sets. By changing the number of EML layers in OLEDs of different colors, the product lifespan is extended and reliable color shift is prevented. By setting the isolation structure 300 and the encapsulation part 611, the luminous efficiency and luminous quality of each light-emitting unit 230 can be improved, and the yield of light-emitting units 230 affected by water and oxygen intrusion can be improved, thus extending the service life of the television set.

[0148] In some alternative embodiments, please refer to the above, such as Figures 2 to 9 As shown, the multiple light-emitting units 230 include a first light-emitting unit 231 and a second light-emitting unit 232 with different light-emitting colors. The first light-emitting unit 231 and the second light-emitting unit 232 have different numbers of light-emitting material layers (EML). The second electrode 510 is electrically connected to the isolation structure 300, as shown. Figure 10 and Figure 11 As shown, the isolation structure 300 includes a first isolation portion 320 and a second isolation portion 330 that are spaced and insulated from each other. The isolation opening 310 includes a first isolation opening 311 formed by the first isolation portion 320 and a second isolation opening 312 formed by the second isolation portion 330. The first light-emitting unit 231 is located in the first isolation opening 311, and the second light-emitting unit 232 is located in the second isolation opening 312.

[0149] In these alternative embodiments, the number of light-emitting material layers (EML) of the first light-emitting unit 231 and the second light-emitting unit 232 is different, so the luminous efficiency of the first light-emitting unit 231 and the second light-emitting unit 232 is different, and the driving voltage required by the first light-emitting unit 231 and the second light-emitting unit 232 is different. The isolation structure 300 includes a first isolation portion 320 and a second isolation portion 330 spaced apart from each other. The first isolation portion 320 encloses a first isolation opening 311 and is used to electrically connect with the second electrode 510 within the first isolation opening 311. The second isolation portion 330 encloses a second isolation opening 312 and is electrically connected with the second electrode 510 within the second isolation opening 312. The first isolation portion 320 and the second isolation portion 330 are spaced apart and insulated from each other. In this embodiment, different signal lines are connected through the first isolation portion 320 and the second isolation portion 330, thereby transmitting different voltages to the corresponding second electrodes 510. This allows the driving voltage to be adapted to the driving requirements of the first light-emitting unit 231 and the second light-emitting unit 232, thus reducing the power consumption of the display panel 10 by ensuring that the voltage of all second electrodes 510 is the same.

[0150] Please refer to the above. The plurality of light-emitting units 230 also includes a third light-emitting unit 233, which emits a different color than the first light-emitting unit 231 and the second light-emitting unit 232. The isolation structure 300 also includes a third isolation portion 350, which encloses a third isolation opening 313, and the third light-emitting unit 233 is located in the third isolation opening 313.

[0151] There are various ways to set the number of light-emitting material layers (EMLs) in the third light-emitting unit 233. For example, the number of light-emitting material layers (EMLs) in the third light-emitting unit 233 can be the same as that in the first light-emitting unit 231. The third light-emitting unit 233 and the first light-emitting unit 231 can be driven by the same driving voltage. The first isolation part 320 and the third isolation part 350 can be connected to each other. For example, the first isolation part 320 and the third isolation part 350 can be integrally formed. A driving voltage signal line can be sent to one of the first isolation part 320 and the third isolation part 350, which can simplify the signal line arrangement of the display panel 10.

[0152] Or, such as Figure 10 As shown, the number of light-emitting material layers (EML) of the third light-emitting unit 233 and the second light-emitting unit 232 is the same. The third light-emitting unit 233 and the second light-emitting unit 232 can be driven by the same driving voltage. The third isolation part 350 and the second isolation part 330 can be connected to each other. For example, the second isolation part 330 and the third isolation part 350 are integrally formed. The driving voltage signal line can be delivered to one of the second isolation part 330 and the third isolation part 350, which can simplify the signal line arrangement of the display panel 10.

[0153] Or, such as Figure 12 As shown, the number of light-emitting material layers (EMLs) in the third light-emitting unit 233 is different from the number of light-emitting material layers (EMLs) in the first light-emitting unit 231 and the second light-emitting unit 232. The third isolation part 350 is insulated from the first isolation part 320 and the second isolation part 330, and can transmit different voltages to the first isolation part 320, the second isolation part 330 and the third isolation part 350, thereby adapting to the driving requirements of the first light-emitting unit 231, the second light-emitting unit 232 and the third light-emitting unit 233 and reducing the power consumption of the display panel 10.

[0154] exist Figures 10 to 12 In this embodiment, for the convenience of drawing the drawings, the width of the isolation structure 300 at different positions is not consistent. In other embodiments, the width of the isolation structure 300 is consistent. For example, the width of the first isolation part 320, the width of the second isolation part 330 and the width of the third isolation part 350 are equal, and the first isolation part 320, the second isolation part 330 and the third isolation part 350 are themselves set to the same width.

[0155] In some alternative embodiments, please refer to the above, such as Figure 10 and Figure 12 As shown, multiple first light-emitting units 231 are arranged to form a first pixel column, and multiple second light-emitting units 232 are arranged to form a second pixel column. The first pixel column and the second pixel column are arranged alternately along the first direction X. A first isolation portion 320 surrounds and forms multiple first isolation openings 311 arranged sequentially along the second direction Y, and a second isolation portion 330 surrounds and forms multiple second isolation openings 312 arranged sequentially along the second direction Y. The multiple first isolation portions 320 are electrically connected to each other, and the multiple second isolation portions 330 are electrically connected to each other.

[0156] In these optional embodiments, a plurality of first light-emitting units 231 are arranged to form a first pixel column, and the first isolation portion 320 can be enclosed to form a plurality of first isolation openings 311 arranged along the second direction Y. Similarly, the second isolation portion 330 can be enclosed to form a plurality of second isolation openings 312 arranged along the second direction Y. This simplifies the shape of the isolation structure 300 and facilitates the spaced insulation of the first isolation portion 320 and the second isolation portion 330.

[0157] Optionally, an isolation groove 340 may be provided between adjacent first isolation portions 320 and second isolation portions 330, and the first isolation portions 320 and second isolation portions 330 are mutually insulated through the isolation groove 340.

[0158] Optionally, multiple third light-emitting units 233 are arranged to form the aforementioned third pixel column. When the number of light-emitting material layers (EML) of the third light-emitting unit 233 is the same as the number of light-emitting material layers (EML) of the first light-emitting unit 231, the third isolation part 350 and the first isolation part 320 adjacent to it can be integrally formed, and no isolation groove 340 is provided between the third isolation part 350 and the first isolation part 320 adjacent to it.

[0159] Or, such as Figure 10 As shown, when the number of light-emitting material layers (EMLs) in the third light-emitting unit 233 is the same as the number of light-emitting material layers (EMLs) in the second light-emitting unit 232, the third isolation part 350 and the second isolation part 330 adjacent to it can be integrally formed, and no isolation groove 340 is provided between the third isolation part 350 and the second isolation part 330 adjacent to it. An isolation groove 340 is provided between the third isolation part 350 and the first isolation part 320.

[0160] Or, such as Figure 12 As shown, when the number of light-emitting material layers (EMLs) in the third light-emitting unit 233 is different from the number of light-emitting material layers (EMLs) in the first light-emitting unit 231 and the second light-emitting unit 232, the third isolation portion 350 and the first isolation portions 320 and the second isolation portions 330 located on both sides of it are provided with insulation. For example, an isolation groove 340 is provided between the third isolation portion 350 and the first isolation portions 320 and the second isolation portions 330 located on both sides of it.

[0161] Optionally, the isolation structure 300 includes a plurality of first isolation portions 320 distributed along a first direction X. The plurality of first isolation portions 320 are electrically connected to each other. For example, the plurality of first isolation portions 320 may extend to the non-display area NA and be electrically connected to each other in the non-display area NA via signal lines. Alternatively, signal lines are provided within the substrate 100 of the display area AA, and the plurality of first isolation portions 320 are connected to the signal lines via vias, thereby making the plurality of first isolation portions 320 electrically connected to each other. For example, the substrate 100 includes the plurality of metal layers described above, and at least one metal layer may have a first auxiliary connection portion provided therein. The plurality of first isolation portions 320 and the first auxiliary connection portion are connected to each other via vias and are electrically connected to each other through the first auxiliary connection portion. The first auxiliary connection portion may be in the form of a strip, a mesh, etc.

[0162] Similarly, the isolation structure 300 includes a plurality of second isolation portions 330 distributed along the first direction X. These second isolation portions 330 are electrically connected to each other. For example, the plurality of second isolation portions 330 may extend to the non-display area NA and be electrically connected to each other in the non-display area NA via signal lines. Alternatively, signal lines may be provided within the substrate 100 of the display area AA, and the plurality of second isolation portions 330 may be connected to the signal lines via vias, thereby electrically connecting the plurality of second isolation portions 330 to each other. For example, the substrate 100 includes the aforementioned plurality of metal layers, and at least one metal layer may have a second auxiliary connection portion provided therein. The plurality of second isolation portions 330 and the second auxiliary connection portion are connected via vias and electrically connected to each other through the second auxiliary connection portion. The second auxiliary connection portion may be in the form of a strip, a mesh, etc.

[0163] When the third isolation portion 350 is insulated from the first isolation portion 320 and the second isolation portion 330, the isolation structure 300 similarly includes a plurality of third isolation portions 350 distributed along the first direction X. These plurality of third isolation portions 350 are electrically connected to each other. For example, the plurality of third isolation portions 350 may extend to the non-display area NA and be electrically connected to each other in the non-display area NA via signal lines. Alternatively, signal lines may be provided within the substrate 100 of the display area AA, and the plurality of third isolation portions 350 may be connected to the signal lines via vias, thereby electrically connecting the plurality of third isolation portions 350 to each other. For example, the substrate 100 includes the aforementioned plurality of metal layers, and at least one metal layer may have a third auxiliary connection portion provided therein. The plurality of third isolation portions 350 and the third auxiliary connection portion are connected via vias and electrically connected to each other through the third auxiliary connection portion. The third auxiliary connection portion may be in the form of a strip, a mesh, etc.

[0164] Optionally, the lifespan of the light-emitting material layer EML of the first light-emitting unit 231 is shorter than the lifespan of the light-emitting material layer EML of the second light-emitting unit 232, and the number of light-emitting material layers EML of the first light-emitting unit 231 is greater than the number of light-emitting material layers EML of the second light-emitting unit 232.

[0165] Optionally, the first light-emitting unit 231 can be any one of red, blue or green light-emitting units 230, and the second light-emitting unit 232 can be any one of red, blue or green light-emitting units 230 except for the first light-emitting unit 231.

[0166] In these embodiments, the lifespan of the light-emitting material layer (EML) of different color light-emitting units 230 varies. In this solution, the lifespan of the EML of the first light-emitting unit 231 is shorter than that of the second light-emitting unit 232. If conventionally configured, the first light-emitting unit 231 will decay faster with increasing usage time, leading to uneven emission of different colors and causing reliable color shift problems such as color cast, screen burn-in, or uneven brightness, thus shortening the lifespan of the display panel 10. By setting the number of EMLs of the first light-emitting unit 231 to be greater than that of the second light-emitting unit 232, the overall brightness and stability of the first light-emitting unit 231 can be improved, increasing its lifespan. This ensures that the decay rates of the first and second light-emitting units 231 and 232 become similar during long-term use, maintaining a relative balance in emission of different colors, effectively preventing reliable color shift problems, and thus improving the lifespan of the display panel 10.

[0167] For example, for the OLED material with the shortest lifespan, a stacked design (with n≥2 light-emitting material layers, EMLs) can effectively increase the device lifespan, making the aging levels of the three OLED materials comparable or similar. Furthermore, by flexibly adjusting the number of light-emitting material layers (EMLs) in the light-emitting units 230 with different lifespans, the output intensity and proportion of each color light can be more precisely controlled, making the display panel 10 display a richer and more realistic range of colors, providing users with a superior visual experience and meeting the needs of application scenarios with high color display requirements.

[0168] The lifespan of the light-emitting material layer EML of the first light-emitting unit 231 is shorter than that of the light-emitting material layer EML of the second light-emitting unit 232, meaning that under the same usage conditions, the lifespan of the light-emitting material layer EML of the first light-emitting unit 231 is shorter than that of the light-emitting material layer EML of the second light-emitting unit 232.

[0169] like Figure 6 , Figure 9 and Figure 13 As shown, in some optional embodiments, along the thickness direction Z of the display panel 10, the film thickness of the first light-emitting unit 231 is greater than the film thickness of the second light-emitting unit 232.

[0170] The film thickness of the light-emitting unit 230 may not be absolutely uniform at different locations. In this embodiment, the film thickness can be understood as the average film thickness of the light-emitting unit 230, or as the maximum film thickness of the light-emitting unit 230. For example, the maximum film thickness of the first light-emitting unit 231 is greater than the maximum film thickness of the second light-emitting unit 232. For example, the average film thickness of the first light-emitting unit 231 is greater than the average film thickness of the second light-emitting unit 232.

[0171] Because the first light-emitting unit 231 has more layers of light-emitting material (EML) compared to the second light-emitting unit 232, the film thickness of the first light-emitting unit 231 is greater than that of the second light-emitting unit 232. For light-emitting units 230 with different film thicknesses, the height of the isolation structure 300 or the thickness of the encapsulation portion 611 can be differentiated, thereby improving the bonding effect between the encapsulation portion 611 and the isolation structure 300, as well as the stability of the encapsulation layer 600, and ultimately improving the encapsulation effect of the encapsulation portion 611 on each light-emitting unit 230.

[0172] It should be noted that for light-emitting units 230 with the same number of stacked light-emitting material layers (EML) of different colors, their film thicknesses may also be different. For example, those made of a single material may be thicker, or a certain color light-emitting unit 230 may have more layers of other film layers besides the light-emitting material layer (EML). The solutions described in the embodiments of this application, such as differentiating the height of the isolation structure 300 or differentiating the thickness of different encapsulation portions 611, can also be applied to improve the structural stability and encapsulation effect of the encapsulation portion 611.

[0173] In some alternative embodiments, along the thickness direction Z, such as Figures 14 to 16 As shown, the film thickness of the first isolation portion 320 is greater than the film thickness of the second isolation portion 330, that is, the distance from the surface of the first isolation portion 320 away from the substrate 100a to the surface of the pixel definition layer 200 is greater than the distance from the surface of the second isolation portion 330 away from the substrate 100a to the surface of the pixel definition layer 200; and / or, as Figure 17 As shown, the plurality of encapsulation portions 611 include a first encapsulation portion 612a corresponding to the first light-emitting unit 231 and a second encapsulation portion 612b corresponding to the second light-emitting unit 232. The maximum film thickness of the first encapsulation portion 612a within the first isolation opening 311 is less than the maximum film thickness of the second encapsulation portion 612b within the second isolation opening 312.

[0174] In this embodiment, since the film thickness of the first light-emitting unit 231 is greater than that of the second light-emitting unit 232, when the isolation structure 300 adopts a first isolation portion 320 with a film thickness greater than that of the second isolation portion 330, and the first isolation portion 320 surrounds the first isolation opening 311 corresponding to the first light-emitting unit 231, and the second isolation portion 330 surrounds the second isolation opening 312 corresponding to the second light-emitting unit 232, the thicker first isolation portion 320 can provide more stable support and isolation space for the first light-emitting unit 231, which has a thicker film layer and may generate greater stress. This helps to reduce the risk of insufficient packaging space caused by different isolation openings 310 heights. For example, by increasing the film thickness of the first isolation portion 320, the film thickness of the corresponding positions of the first packaging portion 612a and the second packaging portion 612b can be kept consistent. Figure 9 As shown. Furthermore, for the encapsulation portion 611, if the film thickness of the first encapsulation portion 612a within the first isolation opening 311 is less than the film thickness of the second encapsulation portion 612b within the second isolation opening 312, the thicker second encapsulation portion 612b can better fill the gap between the second isolation opening 312 and the second light-emitting unit 232, enhancing the sealing performance. In this case, the film thicknesses of the first isolation portion 320 and the second isolation portion 330 can be the same, such as... Figure 13 As shown. This targeted design of the isolation structure 300 and the film thickness of the encapsulation part 611 comprehensively improves the ability of the encapsulation part 611 to cope with different light-emitting units 230, thereby improving the structural stability and encapsulation effect of the encapsulation part 611.

[0175] The embodiments of this application can effectively improve encapsulation quality, extend product lifespan, and prevent reliable color shift by changing the number of EML layers in OLEDs of different colors, combining isolation structures 300 of different heights, and encapsulation parts 611 of different film thicknesses.

[0176] For example, in some alternative embodiments, such as Figure 13 As shown, along the thickness direction Z of the display panel 10, the minimum perpendicular distance between the surface of the second sublayer 302 facing the substrate 100 and the surface of the second electrode 510 away from the substrate 100 is h1, and the film thickness of the encapsulation portion 611 is h2. The minimum perpendicular distance h1 corresponding to each isolation opening 310 and the film thickness h2 of the encapsulation portion 611 both satisfy the following condition: h1 > h2. Optionally, h2 can be the thickness of the encapsulation portion 611 located in the middle of the light-emitting unit 230; for example, h2 is the thickness of the first segment 611a.

[0177] In these embodiments, the height h1 between the lower edge of the second sub-layer 302 in the isolation structure 300 and the upper edge of the second electrode 510 is at least greater than the film thickness h2 of the encapsulation portion 611. This reduces the risk of encapsulation voids between the encapsulation portion 611 and the isolation structure 300, avoids encapsulation failure, and allows the encapsulation portion 611 to extend well along the sidewall of the first sub-layer 301 and along the side of the second sub-layer 302 toward the substrate 100. This effectively allows it to adhere to the isolation structure 300 and extend to the side of the isolation structure 300 away from the substrate 100, improving the encapsulation effect.

[0178] In some alternative embodiments, the minimum perpendicular distance between the side surface of the second sublayer 302 facing the substrate 100 corresponding to the first isolation opening 311 and the side surface of the second electrode 510 away from the substrate 100 is the same as the minimum perpendicular distance between the side surface of the second sublayer 302 facing the substrate 100 corresponding to the second isolation opening 312 and the side surface of the second electrode 510 away from the substrate 100.

[0179] In these embodiments, the minimum perpendicular distance between the surface of the second sublayer 302 facing the substrate 100 and the surface of the second electrode 510 facing away from the substrate 100 in different isolation openings 310 is the same. This means that the spacing between the key structural layers corresponding to different isolation openings 310 remains consistent. This consistent spacing design allows the encapsulation portions 611 corresponding to the first isolation opening 311 and the second isolation opening 312 to be uniformly filled and attached at each isolation opening 310 during the formation process, avoiding problems such as uneven distribution and inconsistent thickness of encapsulation material caused by spacing differences. The uniform encapsulation structure can better withstand external stress, reduce the risk of structural damage caused by stress concentration, and more effectively block the intrusion of external moisture and oxygen, thereby improving the structural stability and encapsulation effect of the encapsulation portion 611.

[0180] In some alternative embodiments, such as Figures 14 to 16 As shown, along the thickness direction Z, the film thickness of the first isolation portion 320 is greater than the film thickness of the second isolation portion 330, that is, the distance from the surface of the first isolation portion 320 away from the substrate 100a to the surface of the pixel definition layer 200 is greater than the distance from the surface of the second isolation portion 330 away from the substrate 100a to the surface of the pixel definition layer 200.

[0181] Since the first light-emitting unit 231 is disposed in the first isolation opening 311 and the second light-emitting unit 232 is disposed in the second isolation opening 312, and the first light-emitting unit 231 has a greater number of light-emitting material layers (EML) or a thicker film layer than the second light-emitting unit 232, in order to form a package portion 611 with good encapsulation performance in both the first isolation opening 311 and the second isolation opening 312, this embodiment of the application differentiates the film layer thickness of the isolation structure 300 around the different isolation openings 310, so that the film layer thickness of the first isolation portion 320 is greater than that of the second isolation portion 312. The thickness of the film layer in the isolation portion 330 is beneficial to ensure that the minimum perpendicular distance between the surface of the second sublayer 302 facing the substrate 100 and the surface of the second electrode 510 facing away from the substrate 100 is the same in different isolation openings 310. This makes the film layer thickness of different packaging portions 611 consistent, enabling uniform filling and adhesion at each isolation opening 310. It can better withstand external stress, reduce the risk of structural damage caused by stress concentration, and more effectively block the intrusion of external moisture and oxygen, thereby improving the structural stability and packaging effect of the packaging portion 611.

[0182] To achieve isolation structure 300 morphologies of different heights, in some optional embodiments, such as Figures 14 to 16As shown, the first isolation portion 320 includes a raised portion 321 and a main isolation portion 322 located on the side of the raised portion 321 facing away from the substrate 100. The main isolation portion 322 includes a first sublayer 301 and a second sublayer 302. The orthographic projection of the side of the main isolation portion 322 facing the substrate 100a is located within the orthographic projection of the raised portion 321 on the substrate 100a.

[0183] In these embodiments, by specifically setting the raised portion 321, it is beneficial to achieve differentiated settings for different isolation structures 300, so that the film thickness of the first isolation portion 320 is greater than the film thickness of the second isolation portion 330.

[0184] Optionally, the orthographic projection of the first sublayer 301 onto the substrate 100a is located within the orthographic projection of the raised portion 321 onto the substrate 100a, so that the two do not form an undercut structure at the connection point, which is beneficial for the encapsulation portion 611 to climb and attach along the sidewall of the first isolation structure 300, thereby improving the encapsulation effect of the encapsulation portion 611.

[0185] like Figure 16 As shown, in some optional embodiments, the main isolation portion 322 further includes a third sub-layer 303 located on the side of the first sub-layer 301 facing the substrate 100. The orthographic projection of the third sub-layer 303 onto the substrate 100a is within the orthographic projection of the padding portion 321 onto the substrate 100a. For the isolation structure 300 provided with the third sub-layer 303, the orthographic projection of the third sub-layer 303 onto the substrate 100a is also within the orthographic projection of the padding portion 321 onto the substrate 100a, so that the two do not form an undercut structure at the connection point, which is beneficial for the encapsulation portion 611 to climb and attach along the sidewall of the first isolation structure 300, thereby improving the encapsulation effect of the encapsulation portion 611.

[0186] Depending on the preparation method, the first isolation section 320 may also form different morphologies.

[0187] In some alternative embodiments, such as Figure 14 and Figure 16 As shown, a stepped structure is formed at the connection between the raised portion 321 and the main isolation portion 322, that is, at least part of the surface of the raised portion 321 facing away from the substrate 100 is not covered by the main isolation portion 322, which is conducive to the encapsulation portion 611 climbing and attaching along the side wall of the first isolation structure 300, thereby improving the encapsulation effect of the encapsulation portion 611.

[0188] Or, such as Figure 15 As shown, the side wall of the raised part 321 is smoothly connected to the side wall of the main isolation part 322 as an integral structure. The smooth connection structure is more conducive to the encapsulation part 611 climbing and attaching along the side wall of the first isolation structure 300, further improving the encapsulation effect of the encapsulation part 611.

[0189] Since there are at least two isolation structures 300 with different heights or film thicknesses, to ensure encapsulation performance, the isolation structures 300 with different film thicknesses are spaced apart, which is beneficial for the encapsulation of each isolation opening 310. (Refer to...) Figures 10 to 12 , Figures 14 to 16 As shown, in some optional embodiments, the first isolation portion 320 and the second isolation portion 330 are spaced apart, and an isolation groove 340 is formed between the first isolation portion 320 and the second isolation portion 330.

[0190] Because the first isolation portion 320 and the second isolation portion 330 have different film thicknesses, if they are connected during the encapsulation process, the difference in film thickness may cause uneven distribution of the encapsulation material at the junction, resulting in inconsistent thicknesses. This affects the encapsulation effect and fails to effectively block the intrusion of external moisture, oxygen, etc., damaging the light-emitting unit 230. In this embodiment, the first isolation portion 320 and the second isolation portion 330, which are adjacent and have different film thicknesses, are spaced apart to form an isolation groove 340. This separates the isolation areas with different structures, allowing the encapsulation material to fill and adhere independently and more evenly in the corresponding area of ​​each isolation portion. This avoids the problem of uneven encapsulation caused by differences in film thickness, thereby improving the encapsulation effect of the encapsulation portion 611 corresponding to each isolation portion, better protecting the light-emitting unit 230, and improving the performance and reliability of the display panel 10.

[0191] When an RGB OLED uses a structure with a higher stacked light-emitting material layer (EML), a higher isolation structure 300 can prevent encapsulation voids and avoid encapsulation failure. Taking the B pixel as an example, when the B pixel adopts a structure with more stacked layers, the isolation structure 300 surrounding the B pixel is higher than the isolation structure 300 of other sub-pixels. At the same time, the first isolation part 320 corresponding to the B pixel and the second isolation part 330 corresponding to the adjacent color are separated to ensure that the first isolation part 320 does not affect the height of the isolation structure 300 corresponding to the R pixel and G pixel, thus avoiding affecting the encapsulation effect of the R pixel and G pixel.

[0192] In some alternative embodiments, such as Figure 11As shown, the isolation groove 340 is arranged around the first isolation portion 320, and the orthographic projection of the isolation groove 340 onto the substrate 100a is located within the orthographic projection of the pixel limiting portion 210 onto the substrate 100a. The first isolation portion 320 and the second isolation portion 330 are completely separated into independent islands. By arranging adjacent first isolation portions 320 and second isolation portions 330 with different film thicknesses at intervals to form the isolation groove 340, isolation areas with different structures are separated. The encapsulation material can be independently and more uniformly filled and attached to the corresponding area of ​​each isolation portion, avoiding the problem of uneven encapsulation caused by differences in film thickness. This improves the encapsulation effect of the encapsulation portion 611 corresponding to each isolation portion, better protects the light-emitting unit 230, and improves the performance and reliability of the display panel 10. In addition, there is no need to provide a pixel opening 220 below the isolation groove 340. The orthographic projection of the isolation groove 340 onto the substrate 100a is located within the orthographic projection of the pixel limiting portion 210 onto the substrate 100a, which is beneficial for providing conductive material in the isolation groove 340 to electrically connect the two isolated portions.

[0193] In addition, in such Figure 2 In the RGB strip pixel arrangement shown, due to their structural characteristics, the multi-layered sub-pixels, when the isolation groove 340 is arranged around the first isolation part 320, macroscopically form an annular isolation groove 340 surrounding the multi-layered sub-pixels. This annular design can effectively isolate the multi-layered pixels from all directions. On the one hand, it can prevent the mutual penetration of harmful substances such as water vapor and oxygen between different areas, avoiding the diffusion of harmful substances to the entire multi-layered pixel area due to local encapsulation failure, thus enhancing the sealing protection of the multi-layered pixels. On the other hand, the annular isolation groove 340 can also effectively buffer external stress, reduce the direct impact of stress on the multi-layered pixels, prevent pixel structure damage caused by stress concentration, thereby improving the reliability and stability of the display panel 10 and extending its service life.

[0194] Optionally, during the fabrication of the light-emitting unit 230 and the second electrode 510, such as Figures 14 to 16 As shown, a portion of the electrode material of the sub-pixel located within the isolation groove 340 can be retained, allowing the first isolation section 320 to be electrically connected to the second isolation section 330 to facilitate the transmission of electrical signals.

[0195] Optionally, the material of the raised portion 321 may include a conductive material, such as at least one of aluminum (Al), aluminum alloy, molybdenum (Mo), titanium (Ti), copper (Cu), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0196] In some alternative embodiments, such as Figures 14 to 16As shown, the first isolation portion 320 and the second isolation portion 330 are both located on the side of the pixel limiting portion 210 away from the substrate 100. The pixel opening 220 is connected to the corresponding isolation opening 310. At least a portion of the light-emitting unit 230 is located in the pixel opening 220. The plurality of light-emitting units 230 include a first light-emitting unit 231, a second light-emitting unit 232 and a third light-emitting unit 233. The size of the pixel limiting portion 210 between the first light-emitting unit 231 and the second light-emitting unit 232 is D1, and the size of the pixel limiting portion 210 between the second light-emitting unit 232 and the third light-emitting unit 233 is D2, wherein D1≥D2.

[0197] The dimension D1 of the pixel limiting portion 210 between the first light-emitting unit 231 and the second light-emitting unit 232 can be understood as the width of the pixel limiting portion 210 between the first light-emitting unit 231 and the second light-emitting unit 232 along the first direction X. Similarly, the dimension D2 of the pixel limiting portion 210 between the second light-emitting unit 232 and the third light-emitting unit 233 can be understood as the width of the pixel limiting portion 210 between the second light-emitting unit 232 and the third light-emitting unit 233.

[0198] In these embodiments, an isolation groove 340 is formed between the first isolation portion 320 and the second isolation portion 330 corresponding to the first light-emitting unit 231 and the second light-emitting unit 232. The size of the pixel limiting portion 210 between the two is larger or equal to the size of the pixel limiting portion 210 between the openings of the single-layer or fewer-layer light-emitting units 230, so as to facilitate the forming of the isolation structure 300 on the pixel limiting portion 210 and to facilitate the formation of the isolation groove 340, so that the isolation groove 340 has a certain width.

[0199] In some alternative embodiments, such as Figures 14 to 16 As shown, the encapsulation part 611 includes a first encapsulation part 612a for encapsulating the first light-emitting unit 231 and a second encapsulation part 612b for encapsulating the second light-emitting unit 232; the film thickness of the first encapsulation part 612a at the middle of the first light-emitting unit 231 within the first isolation opening 311 is equal to the film thickness of the second encapsulation part 612b at the middle of the second light-emitting unit 232 within the second isolation opening 312.

[0200] The maximum film thickness of the first encapsulation portion 612a within the first isolation opening 311 can be understood as the film thickness of the portion located in the central region of the first isolation opening 311 that is not blocked by the second sublayer 302. The same applies to the maximum film thickness of the second encapsulation portion 612b within the second isolation opening 312.

[0201] In these optional embodiments, the maximum film thickness of the encapsulation portion 611 within different isolation openings 310 is the same. This ensures that the encapsulation portions 611 corresponding to the first isolation opening 311 and the second isolation opening 312 can be uniformly filled and attached at each isolation opening 310 during the formation process, avoiding problems such as uneven distribution and inconsistent thickness of the encapsulation material caused by differences in spacing. The uniform encapsulation structure can better withstand external stress, reducing the risk of structural damage caused by stress concentration. It can also more effectively block the intrusion of external moisture and oxygen, thereby improving the structural stability and encapsulation effect of the encapsulation portion 611.

[0202] In some alternative embodiments, such as Figure 17 As shown, the minimum perpendicular distance between the surface of the second sublayer 302 facing the substrate 100 corresponding to the first isolation opening 311 and the surface of the second electrode 510 away from the substrate 100 is h11, and the minimum perpendicular distance between the surface of the second sublayer 302 facing the substrate 100 corresponding to the second isolation opening 312 and the surface of the second electrode 510 away from the substrate 100 is h12, where h11 < h12.

[0203] When the height or film thickness of the isolation structure 300 is the same, and the film thickness of each encapsulation part 611 is consistent, the more the luminescent material layer EML thickness / stack of the OLED device, the smaller the gap of the encapsulation part 611 under the second sub-layer 302. This is because the more the luminescent material layer EML thickness / stack, the smaller the space between the second sub-layer 302 and the second electrode 510, and therefore the smaller the gap of the encapsulation part 611. When the gap is less than a certain threshold, the encapsulation part 611 will form encapsulation voids during the preparation, which can easily lead to encapsulation failure.

[0204] In these optional embodiments, since the number of stacked light-emitting material layers (EML) of the first light-emitting unit 231 in the first isolation opening 311 is greater than the number of stacked light-emitting material layers (EML) of the second light-emitting unit 232 in the second isolation opening 312, a morphology of h11 < h12 will be formed when the isolation structures 300 have a uniform height and are not differentiated. Optionally, the film thickness of the isolation structure 300 around the first isolation opening 311 is the same as the film thickness of the isolation structure 300 around the second isolation opening 312.

[0205] In some alternative embodiments, such as Figure 17 As shown, along the thickness direction Z, the film thickness of the first encapsulation portion 612a within the first isolation opening 311 is less than the film thickness of the second encapsulation portion 612b within the second isolation opening 312.

[0206] In these optional embodiments, the film thickness of the first encapsulation portion 612a within the first isolation opening 311 is set to be less than the film thickness of the second encapsulation portion 612b within the second isolation opening 312. The thicker second encapsulation portion 612b can better fill the gap between the second isolation opening 312 and the second light-emitting unit 232, enhancing the sealing performance. This targeted design of the film thickness of the encapsulation portion 611 improves the ability of the encapsulation portion 611 to cope with different light-emitting units 230, thereby improving the structural stability and encapsulation effect of the encapsulation portion 611.

[0207] When the light-emitting material layers (EML) in the light-emitting units 230 of different colors adopt a structure with different numbers of stacked layers, under the same isolation structure 300 height for the RGB colors, the light-emitting unit 230 with a lower film thickness uses a thicker encapsulation film. This is beneficial because each encapsulation part 611 can form a sealing structure in which the surface of the encapsulation part 611 facing away from the light-emitting unit 230 overlaps with the surface of the encapsulation part 611 facing away from the first sub-layer 301, thereby improving the structural stability of the encapsulation part 611.

[0208] In some optional embodiments, in at least partially isolated openings 310, the film thickness h2 of the encapsulation portion 611 and the minimum vertical distance h1 satisfy the following condition: 1.8*h2≤h1≤2.2*h2. For example, h1=2*h2. In these embodiments, when the minimum vertical distance h1 is approximately equal to twice the film thickness h2 of the encapsulation portion 611, the encapsulation portion 611 can form a sealing structure, thereby improving the encapsulation effect of the encapsulation portion 611.

[0209] And / or, in some alternative embodiments, such as Figure 17 As shown, in at least a partial isolation opening 310, the surface of the encapsulation portion 611 facing away from the light-emitting unit 230 overlaps with the surface of the encapsulation portion 611 facing away from the first sub-layer 301.

[0210] In these optional embodiments, when the side surface of the encapsulation part 611 away from the light-emitting unit 230 overlaps with the side surface of the encapsulation part 611 away from the first sub-layer 301, the encapsulation part 611 itself encloses to form a sealing structure, the encapsulation part 611 has good self-support effect, strong structural stability, and good encapsulation effect.

[0211] In other embodiments, the surface of the encapsulation portion 611 facing away from the light-emitting unit 230 may not be connected to the surface of the encapsulation portion 611 facing away from the first sub-layer 301, such as... Figure 6 As shown.

[0212] Referring to the above, the encapsulation portion 611 includes a first segment 611a located within the isolation opening 310 and a second segment 611b extending from the first segment 611a to the side of the isolation structure 300 facing away from the substrate 100, with a gap between the second segment 611b and the isolation structure 300. In some optional embodiments, the plurality of encapsulation portions 611 include a first encapsulation portion 612a for encapsulating the first light-emitting unit 231 and a second encapsulation portion 612b for encapsulating the second light-emitting unit 232. Along the thickness direction Z of the display panel 10, the size of the first gap 613 between the second segment 611b of the first encapsulation portion 612a and the isolation structure 300 is larger than the size of the second gap 614 between the second segment 611b of the second encapsulation portion 612b and the isolation structure 300.

[0213] Different thicknesses of the light-emitting units 230, or different numbers of light-emitting material layers (EML), will result in different gap heights between the second sub-layer 302 of the isolation structure 300 and the second segment 611b of the encapsulation part 611. The thicker the light-emitting unit 230, the larger the gap will be; the more layers of the light-emitting material layer (EML) there are, the larger the gap will be. This gap is because when the light-emitting material is deposited, light-emitting material is also deposited on the second sub-layer 302. Then, after the encapsulation part 611 is encapsulated, when the wet process washes away the light-emitting material in other locations, the light-emitting material sandwiched between the second segment 611b and the second sub-layer 302 is washed away, thus leaving a gap.

[0214] Optionally, the second encapsulation layer 620 partially fills the first gap 613, and the number of stacked light-emitting material layers (EML) of the first light-emitting unit 231 is greater than or equal to 3. In these embodiments, when the number of stacked light-emitting material layers (EML) of the first light-emitting unit 231 is ≥ 3, the size of the first gap 613 is sufficient to allow the second encapsulation layer 620 to fill the gap, increasing the bonding force between the encapsulation portion 611 and other film layers, thereby preventing the encapsulation portion 611 from falling off or peeling off, and improving encapsulation reliability. If the number of light-emitting material layers (EML) in the second light-emitting unit 232 is less than 3, due to the characteristics of film tension, the second encapsulation layer 620 will not completely fill the second gap 614, or the second encapsulation layer 620 may be located outside the second gap 614.

[0215] Optionally, when the number of luminescent material layers (EMLs) in the first light-emitting unit 231 is greater than the number of EMLs in the second light-emitting unit 232, the first light-emitting unit 231 can be used to emit blue light. In related technologies, the lifespan of blue luminescent materials is significantly lower than that of green or red luminescent materials. This embodiment of the application, by increasing the number of EML stacks in the blue light-emitting unit 230, can effectively improve its overall brightness and stability, increase its lifespan, and ensure that the attenuation rates of the first light-emitting unit 231 and the second light-emitting unit 232 are similar during long-term use, maintaining a relative balance between different colors of light emission, thereby effectively preventing reliable color shift problems and improving the lifespan of the display panel 10. It should be noted that if the lifespan of green or red luminescent materials is lower than that of blue luminescent materials, the number of EML stacks in the green or red light-emitting unit 230 can also be set to be greater than the number of EML stacks in the blue light-emitting unit 230.

[0216] In some alternative embodiments, such as Figures 3 to 5 , Figures 18 to 20 As shown, when the number of light-emitting material layers (EMLs) in the first light-emitting unit 231 is greater than the number of light-emitting material layers (EMLs) in the second light-emitting unit 232, the substrate 100 includes a plurality of driving units 110. Each driving unit 110 includes a driving transistor T1. The plurality of driving units 110 includes a first driving unit 110a for driving the first light-emitting unit 231 and a second driving unit 110b for driving the second light-emitting unit 232. The number of driving transistors T1 in the first driving unit 110a is less than the number of driving transistors T1 in the second driving unit 110b, or the channel width of the driving transistors T1 in the first driving unit 110a is less than the channel width of the driving transistors T1 in the second driving unit 110b.

[0217] In these optional embodiments, the number of light-emitting material layers (EMLs) in the first light-emitting unit 231 is greater than the number of light-emitting material layers (EMLs) in the second light-emitting unit 232. The luminous efficiency of the first light-emitting unit 231 is higher than that of the second light-emitting unit 232. At the same brightness, the first light-emitting unit 231 requires less driving current. Therefore, the number of driving transistors is less than the number of driving transistors T1 in the second driving unit 110b. Alternatively, the channel width of the driving transistors T1 in the first driving unit 110a is smaller than the channel width of the driving transistors T1 in the second driving unit 110b, which can reduce the power consumption of the display panel 10. Figure 19 As shown, the number of light-emitting material layers (EMLs) in the first light-emitting unit 231 can be 3, such as... Figure 20As shown, the second light-emitting unit 232 has two light-emitting material layers (EMLs). When the light-emitting unit 230 includes two or more light-emitting material layers (EMLs), a charge generation layer (CGL) is disposed between the two light-emitting material layers (EMLs). Optionally, in the direction away from the substrate 100, a hole injection layer and a hole transport layer can be disposed between the first light-emitting material layer (EML) and the first electrode 410, and an electron transport layer and an electron injection layer can be disposed between the first light-emitting material layer (EML) and the charge generation layer (CGL). A hole injection layer and a hole transport layer can be disposed between the second light-emitting material layer (EML) and the charge generation layer (CGL), that is, a hole injection layer and a hole transport layer can be disposed between the light-emitting material layer (EML) and the charge generation layer (CGL) or the first electrode 410 located on its side facing the substrate 100. An electron transport layer and an electron injection layer can be disposed between the light-emitting material layer (EML) and the charge generation layer (CGL) or the second electrode 510 located on its side away from the substrate 100.

[0218] In some alternative embodiments, such as Figures 1 to 3 , Figure 21 As shown, the material of the first sublayer 301 includes copper. The first sublayer 301 includes a first side surface 3011 facing the isolation opening 310. The first side surface 3011 is a plane or a smoothly transitioned curved surface. When the material of the first sublayer 301 includes copper, the first sublayer 301 can be formed in the same wet etching process step, so the first side surface 3011 is smoother and is either a plane or a smoothly transitioned curved surface.

[0219] Optional, such as Figure 21 As shown, the first sublayer 301 includes a first side surface 3011 facing the isolation opening 310. A plurality of spaced-apart covering portions 3013 are provided on the first side surface 3011 facing at least one isolation opening 310. The material of the covering portions 3013 includes copper oxide. When the material of the first sublayer 301 includes copper, copper oxide black spots will form when the first sublayer 301 is exposed to air. Furthermore, the plurality of covering portions 3013 are spaced apart rather than distributed across the entire surface. When the second electrode 510 and the first side surface 3011 overlap, current can be transmitted between the second electrode 510 and the first side surface 3011.

[0220] In some alternative embodiments, such as Figures 1 to 3 , Figure 22 As shown, the material of the first sublayer 301 includes aluminum. The first sublayer 301 includes a first side surface 3011 facing the isolation opening 310. The first side surface 3011 includes a first sub-surface 3011a and a second sub-surface 3011b that are connected in succession in a direction away from the substrate 100. The first sub-surface 3011a and the second sub-surface 3011b are arranged intersectingly.

[0221] In these alternative embodiments, when the material of the first sublayer 301 includes aluminum, aluminum can be dry-etched or wet-etched, and the first sublayer 301 can be formed in two process steps to form the first sub-surface 3011a and the second sub-surface 3011b.

[0222] In some optional embodiments, the extended surface of the first sub-surface 3011a and the plane where the substrate 100 is located have a second included angle α2, and the extended surface of the second sub-surface 3011b and the plane where the substrate 100 is located have a third included angle α3, wherein the second included angle α2 is smaller than the third included angle α3.

[0223] In these alternative embodiments, when the second included angle α2 is smaller than the third included angle α3, it is convenient to form a recess on the first side surface, and the third included angle α3 between the second sub-surface 3011b adjacent to the second sub-layer 302 and the first bottom surface 3012 is larger, which is convenient to form a larger concave space under the second sub-layer 302.

[0224] Optionally, the difference between the third included angle α3 and the second included angle α2 is 2° to 20°. This is to mitigate the impact of an excessively large or small difference between the third included angle α3 and the second included angle α2 on the forming of the first sub-surface 3011a and the second sub-surface 3011b.

[0225] In some alternative embodiments, such as Figures 1 to 3 , Figure 21 As shown, the first sub-layer 301 includes a first side surface 3011 facing the isolation opening 310. The material of the first sub-layer 301 includes copper. There is a first included angle α1 between the first side surface 3011 and the plane where the substrate 100 is located. The first included angle α1 is 40°~85°. The first included angle α1 is relatively large, which facilitates the formation of a larger space under the second sub-layer 302, and is beneficial for the isolation structure 300 to isolate the light-emitting unit 230.

[0226] The second sublayer 302 protrudes a first distance L relative to the first sublayer 301 toward the isolation opening 310. Multiple light-emitting units 230 include a first light-emitting unit 231 and a second light-emitting unit 232 with different emitting colors. The isolation opening 310 includes a first isolation opening 311 for accommodating the first light-emitting unit 231 and a second isolation opening 312 for accommodating the second light-emitting unit 232. Optionally, the first distance L can be the minimum distance between the orthographic projection edge of the first sublayer 301 on the substrate 100a and the orthographic projection edge of the second sublayer 302 on the substrate 100a.

[0227] When the material of the first sublayer 301 includes copper, such as Figures 1 to 3 , Figure 21As shown, the first distance L corresponding to the first isolation opening 311 and the first distance L corresponding to the second isolation opening 312 are equal. The first distance L corresponding to the first isolation opening 311 is the distance by which the second sub-layer 302 protrudes relative to the first sub-layer 301 toward the first isolation opening 311. Correspondingly, the first distance L corresponding to the second isolation opening 312 can be the distance by which the second sub-layer 302 protrudes relative to the first sub-layer 301 toward the second isolation opening 312.

[0228] In the process of fabricating the first light-emitting unit 231 using the isolation structure 300, the entire layer of material used to fabricate the first light-emitting unit 231 is first placed within the first isolation opening 311 and the second isolation opening 312, and then the material used to fabricate the first light-emitting unit 231 within the second isolation opening 312 is removed. In these optional embodiments, when the material of the first sub-layer 301 includes copper, due to the inherent properties of copper, the first sub-layer 301 is less affected when the material used to fabricate the first light-emitting unit 231 is removed from the second isolation opening 312. Therefore, the first distance L corresponding to the first isolation opening 311 and the first distance L corresponding to the second isolation opening 312 are equal within the process fabrication error range.

[0229] In some other alternative embodiments, such as Figures 1 to 3 , Figure 22 As shown, when the material of the first sub-layer 301 includes aluminum, the first distance L corresponding to the first isolation opening 311 and the first distance L corresponding to the second isolation opening 312 are different. When the material of the first sub-layer 301 includes aluminum, the first sub-layer 301 may be affected when removing the material used to prepare the first light-emitting unit 231 in the second isolation opening 312, so the first distance L corresponding to the first isolation opening 311 and the first distance L corresponding to the second isolation opening 312 are different.

[0230] When the material of the first sublayer 301 includes copper, such as Figures 1 to 3 , Figure 21 As shown, the first distance L ranges from 0.8 μm to 1.6 μm, for example, the first distance L is 0.8 μm, 0.9 μm, 1.3 μm, 1.5 μm, 1.6 μm, etc.; and / or, the first sublayer 301 has a first height h, and the ratio of the first distance L to the first height h ranges from 0.75 to 2. When the material of the first sublayer 301 includes copper, the first distance L is larger to ensure the separation effect of the isolation structure 300 on the light-emitting material. The first height h of the first sublayer 301 refers to the distance between a point on the surface of the first sublayer 301 facing the substrate 100 and the corresponding point on its surface facing away from the substrate 100.

[0231] Optionally, the material of the first sublayer 301 includes aluminum, such as... Figures 1 to 3 , Figure 22As shown, the first distance L ranges from 0.7 μm to 1.1 μm, for example, the first distance L is 0.7 μm, 0.75 μm, 0.8 μm, 1.0 μm, 1.1 μm, etc.; and / or, the first sublayer 301 has a first height h, and the ratio of the first distance L to the first height h ranges from 0.8 to 1.3. When the material of the first sublayer 301 includes aluminum, the value of the first distance L is slightly smaller, so as to avoid the first distance L being too large when the first sublayer 301 is etched during the subsequent fabrication of the light-emitting unit 230, which would affect the structural stability of the isolation structure 300.

[0232] Optionally, when the material of the first sublayer 301 includes copper, the light-emitting unit 230 and the first sublayer 301 are in contact connection. Alternatively, the isolation structure 300 may further include a third sublayer 303 located on the side of the first sublayer 301 facing the substrate 100a. The third sublayer 303 protrudes toward the isolation opening 310, the light-emitting unit 230 and the third sublayer 303 are in contact connection, and the light-emitting unit 230 and the first sublayer 301 are spaced apart.

[0233] In these optional embodiments, when the isolation structure 300 does not include the third sub-layer 303, the edge of the light-emitting unit 230 can contact the first sub-layer 301; when the isolation structure 300 includes the third sub-layer 303, the light-emitting unit 230 can contact the third sub-layer 303, and the light-emitting unit 230 and the first sub-layer 301 are spaced apart.

[0234] In some alternative embodiments, such as Figures 1 to 3 , Figures 21 to 23 As shown, when the display panel 10 includes the third sub-layer 303 and the second electrode 510 as described above, the second electrode 510 includes a main body portion 511 and a contact portion 512 that surrounds the main body portion 511 in a closed ring shape, and the contact portion 512 is in contact with the third sub-layer 303.

[0235] In these optional embodiments, the contact portion 512 is in the shape of a closed ring, and the contact portions 512 located in different directions of the main body portion 511 are all in contact with the third sub-layer 303. For example, the orthographic projection of the contact portion 512 on the substrate 100a and the orthographic projection of the third sub-layer 303 on the substrate 100a overlap at least partially to form an overlapping area. The overlapping area surrounds the main body portion 511 in a closed ring shape, so that the edges of the second electrode 510 can be in contact with the third sub-layer 303. This can increase the overlap area between the second electrode 510 and the isolation structure 300, reduce the overlap resistance, and make the display panel 10 more suitable for large-screen display devices such as televisions.

[0236] In some alternative embodiments, such as Figure 2As shown, the width of the pixel opening 220 projected onto the substrate 100a is a first width W1, and the first width W1 is greater than the second width W2 and less than or equal to 124 times the width of the second width W2.

[0237] In these alternative embodiments, the width of the pixel aperture 220 is greater than the spacing between two adjacent isolation apertures 310, which can improve the aperture ratio of the display panel 10, making the display panel 10 suitable for large-screen display devices such as televisions.

[0238] Optionally, the first width W1 and the second width W2 can be set as described above, and will not be repeated here.

[0239] Optionally, along the first direction X, the width of the orthographic projection of the pixel opening 220 onto the substrate 100a is the first width W1 mentioned above, and the distance between the orthographic projections of two adjacent isolation openings 310 onto the substrate 100a is the second width W2 mentioned above.

[0240] Optionally, the second width W2 is 3μm to 6μm, and the first width W1 is greater than 5 times the second width W2 and less than or equal to 124 times the second width W2; or, the second width W2 is 7μm to 10μm, and the first width W1 is greater than 2 times the second width W2 and less than or equal to 68 times the second width W2; or, the second width W2 is 11μm to 15μm, and the first width W1 is greater than the second width W2 and less than or equal to 47 times the second width W2.

[0241] like Figure 2 As shown, when the first light-emitting unit 231 is a red light-emitting unit 230, the second light-emitting unit 232 is a green light-emitting unit 230, and the third light-emitting unit 233 is a blue light-emitting unit 230, and multiple light-emitting units 230 are arranged to form the aforementioned first pixel column, second pixel column, and third pixel column, and the second width W2 is 5 micrometers, the width of each pixel opening 220 in the first direction X is set as follows for different display area AA sizes, different resolutions, and pixel densities:

[0242] Table 7

[0243]

[0244] In Table 7, the size of the display area AA is in inches; for example, "display size 45" in the table indicates a display size of 45 inches. PPI stands for pixel density. W2 is the spacing between two adjacent isolation openings 310 in the first direction X, i.e., the second width W2, in micrometers. W1_R can be the first width W1 of the first pixel opening 221 in the first direction X, W1_G can be the width of the second pixel opening 222 in the first direction X, and W1_B can be the width of the third pixel opening 223 in the first direction X. The unit of the first width W1 is also micrometers.

[0245] As shown in Table 7 above, when the second width W2 is 5μm, the first width W1 is greater than 5 times the second width W2 and less than or equal to 124 times the second width W2. Specifically, the first width W1 of the first pixel opening 221 and the second pixel opening 222 is equal. When the second width W2 is 5μm, the first width W1 corresponding to the first pixel opening 221 and the second pixel opening 222 is greater than 5 times the second width W2 and less than or equal to 62 times the second width W2. The first width W1 of the third pixel opening 223 is relatively large. When the second width W2 is 5μm, the first width W1 corresponding to the third pixel opening 223 is greater than 10 times the second width W2 and less than or equal to 124 times the second width W2.

[0246] like Figure 2 As shown, when the first light-emitting unit 231 is a red light-emitting unit 230, the second light-emitting unit 232 is a green light-emitting unit 230, and the third light-emitting unit 233 is a blue light-emitting unit 230, and multiple light-emitting units 230 are arranged to form the aforementioned first pixel column, second pixel column, and third pixel column, and the second width W2 is 9 micrometers, the width of each pixel opening 220 in the first direction X is set as follows for different display area AA sizes, different resolutions, and pixel densities:

[0247] Table 8

[0248]

[0249] As shown in Table 8 above, when the second width W2 is 9μm, the first width W1 is greater than twice the second width W2 and less than or equal to 68 times the second width W2. Specifically, the first width W1 of the first pixel opening 221 and the second pixel opening 222 is equal. When the second width W2 is 9μm, the first width W1 corresponding to the first pixel opening 221 and the second pixel opening 222 is greater than 2.4 times the second width W2 and less than or equal to 34.2 times the second width W2. The first width W1 of the third pixel opening 223 is relatively large. When the second width W2 is 9μm, the first width W1 corresponding to the third pixel opening 223 is greater than 4.8 times the second width W2 and less than or equal to 68.2 times the second width W2.

[0250] like Figure 2 As shown, when the first light-emitting unit 231 is a red light-emitting unit 230, the second light-emitting unit 232 is a green light-emitting unit 230, and the third light-emitting unit 233 is a blue light-emitting unit 230, and multiple light-emitting units 230 are arranged to form the aforementioned first pixel column, second pixel column, and third pixel column, and the second width W2 is 13 micrometers, the width of each pixel opening 220 in the first direction X is set as follows for different display area AA sizes, different resolutions, and pixel densities:

[0251] Table 9

[0252]

[0253] As shown in Table 9 above, when the second width W2 is 13μm, the first width W1 is greater than the second width W2 but less than or equal to 47 times the second width W2. Specifically, the first width W1 of the first pixel opening 221 and the second pixel opening 222 is equal. When the second width W2 is 13μm, the first width W1 corresponding to the first pixel opening 221 and the second pixel opening 222 is greater than 1.4 times the second width W2 and less than or equal to 23.4 times the second width W2. The first width W1 of the third pixel opening 223 is relatively large. When the second width W2 is 13μm, the first width W1 corresponding to the third pixel opening 223 is greater than 2.9 times the second width W2 and less than or equal to 46.8 times the second width W2.

[0254] When the first light-emitting unit 231 is a red light-emitting unit 230, the second light-emitting unit 232 is a green light-emitting unit 230, and the third light-emitting unit 233 is a blue light-emitting unit 230, and multiple light-emitting units 230 are arranged to form the aforementioned first pixel column, second pixel column, and third pixel column, and the second width W2 is 15 micrometers, the width of each pixel opening 220 in the first direction X is set as follows for different display area sizes, different resolutions, and pixel densities:

[0255] Table 10

[0256]

[0257] As shown in Table 10 above, when the second width W2 is 15μm, the first width W1 is greater than or equal to the second width W2 and less than or equal to 40 times the second width W2. Specifically, the first width W1 of the first pixel opening 221 and the second pixel opening 222 is equal. When the second width W2 is 15μm, the first width W1 corresponding to the first pixel opening 221 and the second pixel opening 222 is greater than or equal to the second width W2 and less than or equal to 20 times the second width W2. The first width W1 of the third pixel opening 223 is larger. When the second width W2 is 15μm, the first width W1 corresponding to the third pixel opening 223 is greater than twice the second width W2 and less than or equal to 40 times the second width W2. The multiples between the first width W1 and the second width W2 were rounded to the nearest integer.

[0258] In some alternative embodiments, alternatively, such as Figure 7 As shown, multiple first light-emitting units 231 and multiple second light-emitting units 232 are arranged alternately along the second direction Y to form a fourth pixel column, and multiple third light-emitting units 233 are arranged at intervals along the second direction Y to form a fifth pixel column. The fourth and fifth pixel columns are arranged alternately along the first direction X. Optionally, the extension dimension of the third light-emitting unit 233 in the first direction X is smaller than its extension dimension in the second direction Y. Correspondingly, the extension dimension of the third pixel opening 223 in the first direction X is smaller than its extension dimension in the second direction Y, and the width direction of the third pixel opening 223 can be either the first direction X or the second direction Y. For the first light-emitting unit 231 and the second light-emitting unit 232, the extension dimensions of the first light-emitting unit 231 and the second light-emitting unit 232 in the first direction X and their extension dimensions in the second direction Y may be different or the same. For example, the first light-emitting unit 231 and the second light-emitting unit 232 have the same extension size in the first direction X, the extension size of the first light-emitting unit 231 in the second direction Y is smaller than its extension size in the first direction X, and the dimensions of the second light-emitting unit 232 in the first direction X and the second direction Y can be the same, or the extension size of the second light-emitting unit 232 in the second direction Y is larger than its extension size in the first direction X.

[0259] Optionally, the comparison of the second width W2 and the first width W1 can be a comparison of them in the same direction.

[0260] When multiple light-emitting units 230 are Figure 7 When the fourth and fifth pixel columns are arranged as shown, the settings for each pixel opening 220 and the width of the isolation structure 300 in the first direction X are as follows, depending on the size of the display area AA, the resolution, and the pixel density:

[0261] Table 11

[0262]

[0263] As shown in Table 11 above, when both the first width W1 and the second width W2 are taken from the first direction X, that is, the extension dimension of the orthographic projection of the pixel opening 220 onto the substrate 100a in the first direction X is the first width W1, and the distance between the orthographic projections of two adjacent isolation openings 310 along the first direction X onto the substrate 100a is the second width W2. Firstly, the value of the second width W2 varies for different display sizes and resolutions. When the display area size is 110 inches and the resolution is 2K, the second width is 15 micrometers, and the first width W1 is greater than or equal to 36.3 times the second width W2 and less than or equal to 45 times the second width W2. When the display area size is 45 inches and the resolution is 8K, the pixel density is higher, and the first width W1 is greater than or equal to 7.7 times the second width W2 and less than or equal to 11.3 times the second width W2.

[0264] When multiple light-emitting units 230 are Figure 7 When the fourth and fifth pixel columns are arranged as shown, the width of the pixel opening 220 and the isolation structure 300 in the second direction Y are set as follows for different display area AA sizes, different resolutions and pixel densities:

[0265] Table 12

[0266]

[0267] As shown in Table 12 above, when both the first width W1 and the second width W2 are taken from the second direction Y, that is, the extension dimension of the orthographic projection of the pixel opening 220 onto the substrate 100a in the second direction Y is the first width W1, and the distance between the orthographic projections of two adjacent isolation openings 310 along the second direction Y onto the substrate 100a is the second width W2. Firstly, the value of the second width W2 varies for different display sizes and resolutions. When the display area size is 110 inches and the resolution is 2K, the second width is 15 micrometers, and the first width W1 is greater than or equal to 34.5 times the second width W2 and less than or equal to 125 times the second width W2. When the display area size is 45 inches and the resolution is 8K, the pixel density is higher, and the first width W1 is greater than or equal to 2.55 times the second width W2 and less than or equal to 11 times the second width W2.

[0268] like Figure 8 As shown, when multiple light-emitting units are in Figure 8 When the pixel opening 220 is irregularly shaped, the values ​​of the first width W1 and the second width W2 are determined as described above and will not be repeated here.

[0269] Optionally, multiple isolation openings 310 are distributed at intervals along a first direction X and a second direction Y. The width 'a' of the isolation opening 310 in the first direction X ranges from 20 μm to 650 μm; and / or, the length 'b' of the isolation opening 310 in the second direction Y ranges from 100 μm to 1300 μm. In these optional embodiments, when the size of the isolation opening 310 is within the above range, the size of the isolation opening 310 is relatively large, making it suitable for large-screen display devices such as televisions.

[0270] Optionally, the width a of the isolation opening 310 in the first direction X can be the third width W3 mentioned above.

[0271] In some alternative embodiments, such as Figures 2 to 4 As shown, the display panel 10 also includes a planarization layer 120, which is located on the side of the driving unit 110 away from the substrate 100a and includes a first connecting hole 121a; wherein the driving unit 110 and the first electrode 410 are electrically connected via the first connecting hole 121a to drive the light-emitting unit 230 to emit light, and the driving unit 110 connected to the first electrode 410 includes two or more driving transistors T1.

[0272] In these optional embodiments, the driving unit 110 connected to at least one first electrode 410 includes two or more driving transistors T1. These two or more driving transistors T1 provide driving signals to the first electrode 410, facilitating a larger area for both the first electrode 410 and the light-emitting unit 230, thus making it more suitable for large-screen display devices. Furthermore, in the display panel 10 provided in the application embodiments, since two or more driving transistors T1 are connected to the same first electrode 410, even when the display panel 10 is used in large-screen display devices such as televisions, and the pixel aperture 220 area is large, it can still ensure that the light-emitting unit 230 is well driven and displayed, guaranteeing the display effect of the display panel 10.

[0273] Optionally, in this embodiment, the driving unit 110 is used to drive the light-emitting unit 230. The driving unit 110 and the light-emitting unit 230 are configured in a one-to-one correspondence. The sub-pixel PX includes the light-emitting unit 230, and the sub-pixel PX and the light-emitting unit 230 are configured in a one-to-one correspondence. Different driving units 110 are connected to different scan signal lines or data signal lines. The driving unit 110 may include one or more pixel driving circuits 111. When the driving unit 110 includes multiple pixel driving circuits 111, the multiple pixel driving circuits 111 of the same driving unit 110 are configured to correspond to the same sub-pixel PX, and the multiple pixel driving circuits 111 of the same driving unit 110 are connected to the same data signal line and the same scan signal line, so that the multiple pixel driving circuits 111 of the same driving unit 110 are driven by the same signal.

[0274] In some alternative embodiments, such as Figures 2 to 4 , Figure 24 As shown, the driving unit 110 includes a pixel driving circuit 111, and the pixel driving circuit 111 includes two or more driving transistors T1. The two or more driving transistors T1 of the pixel driving circuit 111 connected to the same first electrode 410 are connected in parallel.

[0275] In these alternative embodiments, the driving capability of the pixel driving circuit 111 is improved by increasing the number of driving transistors T1 in the pixel driving circuit 111, thereby increasing the current of the driving unit 110 and improving the display effect. This does not require increasing the number of pixel driving circuits 111, and the structure of the driving unit 110 of the display panel 10 can be simplified.

[0276] When the pixel driving circuit 111 includes two driving transistors T1, and the two driving transistors T1 are connected to the same first electrode 410, the two or more driving transistors T1 connected to the same first electrode 410 are electrically connected to the first electrode 410 through the same first via 121a. This reduces the number of openings on the planarization layer 120 and simplifies the fabrication of the planarization layer 120. Optionally, such as Figure 3 As shown, in the same pixel driving circuit 111, the source or drain of the two driving transistors T1 are connected to the first electrode 410 through the same first through hole 121a.

[0277] In some other alternative embodiments, such as Figures 2 to 4 , Figure 25 As shown, the driving unit 110 includes two or more pixel driving circuits 111, each pixel driving circuit 111 including a driving transistor T1, and the driving transistors T1 of the two or more pixel driving circuits 111 are connected to the same first electrode 410. In these optional embodiments, by increasing the number of pixel driving circuits 111 without changing the original structure of the pixel driving circuits 111, the driving effect of the driving unit 110 can be guaranteed.

[0278] When the same driving unit 110 includes two or more pixel driving circuits 111, such as Figure 26 As shown, the driving transistors T1 of two or more pixel driving circuits 111 are connected to the same first electrode 410 via the same first via 121a to simplify the fabrication of the planarization layer 120. Alternatively, as... Figure 27As shown, the first electrode 410 is provided with two or more first connecting holes 121a, and the orthographic projections of the two or more first connecting holes 121a corresponding to the same first electrode 410 on the substrate 100a are distributed at intervals around the orthographic projection of the first electrode 410 on the substrate 100a. Two or more pixel driving circuits 111 connected to the same first electrode 410 and the first connecting holes 121a are arranged in a one-to-one correspondence. This allows the first connecting holes 121a to be set at different positions according to the structure of the pixel driving circuit 111, thus shortening the connection path length between the first electrode 410 and the driving transistor T1.

[0279] In some alternative embodiments, such as Figure 28 As shown, the first electrode 410 includes two or more sub-electrodes 411, the driving unit 110 includes two or more pixel driving circuits 111, each pixel driving circuit 111 includes a driving transistor T1, the sub-electrodes 411 and the pixel driving circuits 111 are arranged in a one-to-one correspondence, each sub-electrode 411 is provided with a first connecting hole 121a, and the driving transistor T1 of each pixel driving circuit 111 is electrically connected to the sub-electrode 411 through the first connecting hole 121a.

[0280] In these optional embodiments, the same first electrode 410 is divided into multiple sub-electrodes 411. Each sub-electrode 411, pixel driving circuit 111, driving transistor T1, and first connecting hole 121a are configured in a one-to-one correspondence. This improves the connection yield between the pixel driving transistor T1 and the sub-electrodes 411, thereby enhancing the display effect. Furthermore, when one of the multiple sub-electrodes 411 in the first electrode 410 experiences a manufacturing defect, the other sub-electrodes 411 are less likely to be affected.

[0281] The number of sub-electrodes 411 included in the first electrode 410 can be set in various ways, such as... Figure 28 As shown, in some optional embodiments, the first electrode 410 includes two sub-electrodes 411, the two sub-electrodes 411 of the same first electrode 410 are spaced apart along the second direction Y, and the two first connecting holes 121a corresponding to the two sub-electrodes 411 of the same first electrode 410 are located on the side opposite to each other in the second direction Y.

[0282] In these optional embodiments, in the same first electrode 410, the first connecting holes 121a corresponding to the two sub-electrodes 411 are located on opposite sides rather than between two adjacent sub-electrodes 411, which makes it easier to reduce the spacing between the two sub-electrodes 411 in the first electrode 410 as needed, thereby improving the light emission effect of the same light-emitting unit 230.

[0283] In some alternative embodiments, such as Figures 2 to 4 , Figure 28As shown, the substrate 100 also includes a first signal line 130 extending along a first direction X and a second signal line 140 extending along a second direction Y. Multiple pixel driving circuits 111 connected to multiple sub-electrodes 411 of the same first electrode 410 are connected to the same first signal line 130 and the same second signal line 140. The first signal line 130 includes at least one of a scan signal line and a light emission control signal line, and the second signal line 140 includes a data signal line.

[0284] In these alternative embodiments, the multiple pixel driving circuits 111 included in the same driving unit 110 are connected to the same first signal line 130 and second signal line 140, and the multiple pixel driving circuits 111 of the same driving unit 110 are driven by the same signal, which simplifies the circuit structure of the display panel 10.

[0285] Optionally, when the first signal line 130 includes a scan signal line, the scan signal line can be configured in various ways. For example, one scan signal line may correspond to the same driving unit 110, and multiple pixel driving circuits 111 included in the same driving unit 110 may be connected to the same scan signal line. Alternatively, multiple scan signal lines may be configured for the same driving unit 110, such as a first scan signal line and a second scan signal line, and multiple pixel driving circuits 111 of the same driving unit 110 may be connected to the same first scan signal line and the same second scan signal line.

[0286] Optional, such as Figures 28 to 29 As shown, when the first electrode 410 is divided into multiple sub-electrodes 411, the light-emitting unit 230 can be divided into multiple sub-light-emitting units 230a, or the light-emitting unit 230 can be undivided, with the same light-emitting unit 230 corresponding to multiple sub-electrodes 411 of the same first electrode 410. For example, as... Figure 13 As shown, in some optional embodiments, the light-emitting unit 230 includes two or more sub-light-emitting units 230a, and the sub-light-emitting units 230a and sub-electrodes 411 are arranged in a one-to-one correspondence. The pixel opening 220 includes two or more first sub-openings 220a, and at least a portion of the sub-light-emitting units 230a is located in the first sub-openings 220a. The isolation opening 310 includes two or more second sub-openings 310a, and each sub-light-emitting unit 230a is located in each second sub-opening 310a.

[0287] In these optional embodiments, the sub-electrode 411, the sub-light-emitting unit 230a, the first sub-opening 220a and the second sub-opening 310a are arranged in a one-to-one correspondence, so that when one of the sub-light-emitting units 230a malfunctions, it will not cause malfunctions in the other sub-light-emitting units 230a.

[0288] And / or, in some other alternative embodiments, such as Figure 29As shown, the pixel opening 220 includes two or more first sub-openings 220a, and the first sub-openings 220a and the sub-electrodes 411 are arranged in a one-to-one correspondence. The two or more first sub-openings 220a are arranged in the same isolation opening 310, and at least a portion of the light-emitting unit 230 in the same isolation opening 310 is located in the two or more first sub-openings 220a.

[0289] In these optional embodiments, the sub-electrodes 411 and the first sub-openings 220a are arranged in a one-to-one correspondence, with each sub-electrode 411 exposed through its respective first sub-opening 220a to contact the light-emitting unit 230. However, the light-emitting unit 230 and the isolation opening 310 are not separated, which simplifies the fabrication of the isolation structure 300 and the light-emitting unit 230, simplifies the fabrication process of the isolation structure 300 and the light-emitting unit 230, and improves the fabrication efficiency of the display panel 10.

[0290] Optionally, when the first electrode 410 is not divided into multiple sub-electrodes 411, the light-emitting unit 230, the pixel opening 220, and the isolation opening 310 can be divided to form the aforementioned sub-light-emitting unit 230a, the first sub-opening 220a, and the second sub-opening 310a. Alternatively, the light-emitting unit 230, the pixel opening 220a, and the isolation opening 310 can be configured to correspond one-to-one with the first electrode 410 without being divided. This application does not limit this.

[0291] Optionally, the first encapsulation layer 610 can be formed from a single film layer. In other optional embodiments, such as Figures 1 to 3 , Figure 30 As shown, the first encapsulation layer 610 includes a first encapsulation sublayer 610a and a second encapsulation sublayer 610b. The second encapsulation sublayer 610b is located on the side of the first encapsulation sublayer 610a away from the substrate 100. The encapsulation portion 611 includes a first encapsulation portion 610aa located in the first encapsulation sublayer 610a. The density of the second encapsulation sublayer 610b is greater than the density of the first encapsulation sublayer 610a.

[0292] Density is a physical quantity that describes the degree of compactness of atoms or molecules within a material, reflecting the number of atoms or molecules per unit volume. The higher the density, the better the material's ability to block water and oxygen.

[0293] In these optional embodiments, the first encapsulation layer 610 includes a first encapsulation sublayer 610a and a second encapsulation sublayer 610b. The first encapsulation sublayer 610a includes a plurality of first encapsulation sub-parts 610aa, which are correspondingly disposed with the light-emitting unit 230 to form an encapsulation of the light-emitting unit 230. Each first encapsulation sub-part 610aa independently encapsulates each light-emitting unit 230. The provision of the second encapsulation sublayer 610b can further improve the encapsulation effect of the first encapsulation layer 610. Moreover, the density of the second encapsulation sublayer 610b is greater than that of the first encapsulation sublayer 610a. The second encapsulation sublayer 610b is more compact than the first encapsulation sublayer 610a, which further improves the overall encapsulation reliability of the first encapsulation layer 610, improves the problem that a single first encapsulation sublayer 610a is difficult to meet the encapsulation requirements of the display panel 10, and improves the display effect and performance of the display panel 10. In particular, it can improve the problem that a single first encapsulation sublayer 610a is difficult to meet the encapsulation requirements of a large-size display panel 10, and improve defects such as black spots in the large-size display panel 10 caused by low encapsulation reliability.

[0294] Furthermore, when different color light-emitting units 230 include different numbers of light-emitting material layers (EMLs), or when at least one light-emitting unit 230 includes two or more light-emitting material layers (EMLs), the sealing requirements of the encapsulation layer 600 are higher. In this embodiment, the first encapsulation layer 610 is configured to include at least two film layers: a first encapsulation sublayer 610a and a second encapsulation sublayer 610b. This improves the problem that a single first encapsulation sublayer 610a cannot meet the encapsulation requirements when multiple light-emitting material layers (EMLs) are stacked.

[0295] Optionally, a plurality of first package sub-parts 610aa are spaced apart, or at least some of the first package sub-parts 610aa are interconnected, or at least some of the first package sub-parts 610aa overlap in the orthographic projection of the substrate 100a and overlap on the side of the isolation structure 300 away from the substrate 100.

[0296] Optionally, the second encapsulation sublayer 610b is prepared by atomic layer deposition (ALD) to give it a denser film structure. Optionally, the first encapsulation sublayer 610a is prepared by chemical vapor deposition (CVD).

[0297] Optionally, the refractive index of the first encapsulation sublayer 610a is greater than that of the second encapsulation sublayer 610b. In these optional embodiments, the refractive indices of the first encapsulation sublayer 610a and the second encapsulation sublayer 610b decrease, forming a progressive optical coupling layer, reducing interface reflection loss and improving light extraction efficiency. The high-refractive-index first encapsulation sublayer 610a is close to the light-emitting unit 230, shortening the optical path difference and reducing color shift caused by wavelength interference. The low-refractive-index second encapsulation sublayer 610b acts as a light-emitting interface buffer, scattering ambient light reflection.

[0298] Optional, such as Figure 31 As shown, the encapsulation layer 600 further includes the aforementioned second encapsulation layer 620 and third encapsulation layer 630. The second encapsulation layer 620 is located on the side of the first encapsulation layer 610 facing away from the substrate 100, and the material of the second encapsulation layer 620 includes an organic material. The third encapsulation layer 630 is located on the side of the second encapsulation layer 620 facing away from the substrate 100, and the material of the third encapsulation layer 630 includes an inorganic material. In these optional embodiments, the first encapsulation layer 610, the second encapsulation layer 620, and the third encapsulation layer 630 form a three-layer thin-film evaporator (TFE), improving the encapsulation performance of the display panel 10.

[0299] Optionally, the material of the first encapsulation layer 610 may include inorganic materials. A second encapsulation layer 620 is formed on the side of the first encapsulation layer 610 facing away from the substrate 100 by means of printing or other methods, for planarization and stress relief. The TFE encapsulation combined with the second encapsulation sub-layer 610b design can improve the low encapsulation reliability of conventional three-layer TFE encapsulation structures using only the first encapsulation sub-layer 610a, the second encapsulation layer 620, and the third encapsulation layer 630 in large-size display panels 10, which can lead to defects such as black spots. Optionally, the materials of the first encapsulation sub-layer 610a and the second encapsulation sub-layer 610b may be the same or different. The materials of the first encapsulation layer 610 and the third encapsulation layer 630 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 620 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The second encapsulation layer 620 and the third encapsulation layer 630 are continuously disposed at least over the entire display area AA, with a portion also disposed in the non-display area NA.

[0300] In some alternative embodiments, such as Figure 32 As shown, the boundary of the second encapsulation layer 620, when projected onto the substrate 100a, lies within the projection of the second encapsulation sublayer 610b onto the substrate 100a. That is, the boundary of the second encapsulation layer 620 is recessed within the second encapsulation sublayer 610b. This increases the distribution area of ​​the second encapsulation sublayer 610b and improves its sealing effect.

[0301] like Figure 31 and Figure 32 As shown, optionally, the second encapsulation sublayer 610b and the third encapsulation layer 630 are disposed in contact with each other on the periphery of the second encapsulation layer 620. In these optional embodiments, the boundary of the second encapsulation layer 620 is recessed within the boundary of the second encapsulation sublayer 610b. After the third encapsulation layer 630 is deposited on the second encapsulation layer 620, the third encapsulation layer 630 can be disposed in contact with at least a portion of the periphery of the second encapsulation sublayer 610b on the second encapsulation layer 620, thereby improving edge encapsulation reliability.

[0302] In some optional embodiments, the orthographic projection of the second encapsulation sublayer 610b onto the substrate 100a lies within the orthographic projection of the third encapsulation layer 630 onto the substrate 100a. In these optional embodiments, the third encapsulation layer 630 fully covers the second encapsulation sublayer 610b and reinforces the edges of the second encapsulation sublayer 610b, further improving the encapsulation reliability of the display panel 10.

[0303] like Figure 33 As shown, in some optional embodiments, the display panel 10 further includes a first wear-resistant layer 640 disposed on the outer surface of the third encapsulation layer 630 opposite to the second encapsulation layer 620, wherein the wear rate of the first wear-resistant layer 640 is less than the wear rate of the third encapsulation layer 630. Wear rate is a quantitative parameter characterizing the rate of volume loss of a material under mechanical action, and is defined as "the volume worn per unit length under a unit load".

[0304] In these optional embodiments, the wear rate of the first wear-resistant layer 640 is less than that of the third encapsulation layer 630, meaning that the wear resistance of the first wear-resistant layer 640 is superior to that of the third encapsulation layer 630. When the first wear-resistant layer 640 is disposed on the third encapsulation layer 630, the first wear-resistant layer 640 has better wear resistance and provides protection for the third encapsulation layer 630, improving the encapsulation reliability of the display panel 10. Optionally, the material of the first wear-resistant layer 640 includes wear-resistant materials such as diamond carbon or SiO2 nanoparticle coatings.

[0305] In some optional embodiments, the orthographic projection of the third encapsulation layer 630 onto the substrate 100a lies within the orthographic projection of the first wear-resistant layer 640 onto the substrate 100a. In these optional embodiments, the first wear-resistant layer 640 fully covers the outer surface of the third encapsulation layer 630, increasing the coverage area of ​​the first wear-resistant layer 640, thereby protecting the third encapsulation layer 630 and further improving the encapsulation reliability of the display panel 10.

[0306] In some optional embodiments, the orthographic projection of the first encapsulation sub-layer 610aa onto the substrate 100a lies within the orthographic projection of the second encapsulation sub-layer 610b onto the substrate 100a. In these optional embodiments, the first encapsulation sub-layer 610a is covered by the second encapsulation sub-layer 610b, further improving the encapsulation reliability of the display panel 10.

[0307] In some alternative embodiments, such as Figures 30 to 31 As shown, the second encapsulation sublayer 610b is a continuous layer, and the orthographic projections of multiple first encapsulation sub-parts 610aa onto the substrate 100a lie within the orthographic projection of the same second encapsulation sublayer 610b onto the substrate 100a. In these optional embodiments, the second encapsulation sublayer 610b is a continuous layer, which not only covers and protects the areas where the multiple first encapsulation sub-parts 610aa are located, but also covers the gap areas between the first encapsulation sub-parts 610aa, improving encapsulation reliability. Furthermore, the continuous layer design of the second encapsulation sublayer 610b reduces the complexity of the manufacturing process.

[0308] like Figure 34 As shown, optionally, the second encapsulation sublayer 610b includes a plurality of second encapsulation sub-parts 610ba, the second encapsulation sub-parts 610ba being located on the side of the first encapsulation sub-parts 610aa away from the substrate 100, and the orthographic projection of the first encapsulation sub-parts 610aa onto the substrate 100a being located within the orthographic projection of the second encapsulation sub-parts 610baa onto the substrate 100a.

[0309] In these optional embodiments, the second encapsulation sublayer 610b includes a plurality of second encapsulation sub-parts 610ba, the first encapsulation sublayer 610a includes a plurality of first encapsulation sub-parts 610aa, and the second encapsulation sub-parts 610ba and the first encapsulation sub-parts 610aa are correspondingly arranged. While improving the encapsulation performance of the display panel 10, the first encapsulation sub-parts 610aa and the second encapsulation sub-parts 610ba can be etched using the same mask, simplifying the manufacturing process.

[0310] Optionally, the first package sub-part 610aa is located on the side of the second electrode 510 away from the substrate 100, and extends through the sidewall of the isolation structure 300 to the side of the isolation structure 300 away from the substrate 100.

[0311] like Figure 35As shown, exemplarily, the first encapsulation sub-part 610aa includes a first segment 611a and a second segment 611b that are interconnected. The first segment 611a is located within the isolation opening 310 and disposed on the side of the light-emitting unit 230 facing away from the substrate 100. The second segment 611b is located on the side of the isolation structure 300 facing the isolation opening 310. The surface of the first segment 611a facing away from the substrate 100 and the surface of the second segment 611b facing away from the isolation structure 300 are at least partially interconnected to enclose and form a gap space 610d. Exemplarily, the surface of the first segment 611a facing away from the substrate 100 and the surface of the second segment 611b facing away from the isolation structure 300 may also not be connected.

[0312] For example, the first package sub-part 610aa further includes a third segment connected to the second segment 611b, the third segment being located on the side of the isolation structure 300 away from the substrate 100. Optionally, the third segments of at least two adjacent first package sub-parts 610aa are spaced apart to form a gap region. Optionally, the second package sub-layer 610b is continuously disposed in the gap region, or the second package sub-layer 610b is discontinuous in the gap region.

[0313] For example, the third segment and the isolation structure 300 are spaced apart to form a spacer space, and the second encapsulation layer 620 fills at least part of the spacer space to improve the adhesion between the film layers.

[0314] like Figure 36 As shown, in some optional embodiments, the display panel 10 has a display area AA, and the second encapsulation layer 620 has a first thickness B1 in the display area AA (referring to the thickness corresponding to the middle position of the light-emitting unit), and the edge of the second encapsulation layer 620 away from the display area AA has a second thickness B2, and the ratio of the second thickness B2 to the first thickness B1 is less than or equal to 0.4. For example, the ratio of the second thickness B2 to the first thickness B1 is 0.1, 0.2, 0.3, or 0.4.

[0315] In these optional embodiments, the second encapsulation layer 620 extends from the display area AA to the non-display area NA. The portion of the second encapsulation layer 620 in the non-display area NA has an edge away from the display area AA. The second encapsulation layer 620 has a second thickness B2 at the edge and a first thickness B1 in the display area AA. The second thickness B2 is less than the first thickness B1. The ratio of the second thickness B2 to the first thickness B1 is less than or equal to 0.4 to suit large-size display panels 10. In large-size display panels 10, the non-display area NA has a larger width, and the overflow path of the second encapsulation layer 620 is longer. During the leveling process of the second encapsulation layer 620, the edge thickness is farther from the display area AA, resulting in a lower thickness. Therefore, it is not necessary to strictly control the overflow path length of the second encapsulation layer 620 as in small-size display panels 10.

[0316] Referring to the above, the display panel 10 includes a display area AA and a non-display area NA, the non-display area NA being disposed around at least a portion of the display area AA. Alternatively, in other embodiments, the non-display area NA is disposed around a light-transmitting hole. This light-transmitting hole is a hole corresponding to a sensor and extends through the display panel 10. For example, the non-display area NA includes a border area surrounding the display area AA and an area surrounding the light-transmitting hole. Figure 37 As shown, the display panel 10 also includes a dam 701 located in the non-display area NA, and a second encapsulation layer 620 located on the side of the dam 701 facing the display area AA; wherein the dam 701 is disposed around the isolation structure 300, or the boundary of the isolation structure 300 is at least partially located on the dam 701, or the boundary of the isolation structure 300 is located outside the area enclosed by the dam 701.

[0317] In these optional embodiments, a dam 701 is positioned in the non-display area NA to block the second encapsulation layer 620, causing it to stop at the dam 701 position, or preventing the second encapsulation layer 620 from overflowing to the side of the dam 701 away from the display area AA, thus ensuring the encapsulation reliability of the display panel 10. The second encapsulation sub-layer 610b or the third encapsulation layer 630 extends to the side of the dam 701 away from the display area AA to increase the water and oxygen intrusion path. When the width of the non-display area of ​​a large-size display product is sufficiently large, the dam 701 may not be necessary.

[0318] Optionally, the dam 701 is arranged around at least a portion of the display area AA. Optionally, there are multiple dams 701. Optionally, the multiple dams 701 are spaced apart in the direction from the display area AA to the non-display area NA.

[0319] In some alternative embodiments, the second encapsulation layer 620 and the dam 701 are spaced apart. Specifically, the second encapsulation layer 620 and the dam 701 closest to the display area AA are spaced apart. Alternatively, the boundary of the second encapsulation layer 620 is located on the sidewall of the dam 701 facing the display area AA.

[0320] In these alternative embodiments, such as Figure 38 As shown, the second encapsulation layer 620 and the dam 701 are spaced apart. For example, in a large-size display panel 10, the non-display area NA has a large width, and the distance between the dam 701 and the display area AA is large. The second encapsulation layer 620 is difficult to flow to the position of the dam 701, reducing the risk of overflow of the second encapsulation layer 620. The boundary of the second encapsulation layer 620 is located on the side wall of the dam 701 facing the display area AA. The second encapsulation layer 620 flows to the position of the dam 701 and is stopped by the dam 701 to prevent the second encapsulation layer 620 from continuing to overflow in a direction away from the display area AA.

[0321] In some alternative embodiments, such as Figure 37 As shown, the second encapsulation sublayer 610b covers the sidewall of the isolation structure 300 facing the dam 701. In these alternative embodiments, the isolation opening 310 is independently encapsulated by the first encapsulation sub-part 610aa, and the sidewall of the isolation structure 300 facing the dam 701 is covered by the second encapsulation sublayer 610b, which physically isolates the sidewall of the isolation structure 300 and increases the water and oxygen intrusion path, thus improving the problem of water and oxygen intruding into the light-emitting unit 230 through the sidewall of the isolation structure 300, resulting in poor display.

[0322] Optionally, the dam 701 comprises a single layer or multiple layers of metallic material, or the dam 701 comprises metallic material and inorganic material, or the dam 701 comprises a single layer or multiple layers of organic material. Optionally, when the substrate 100 comprises the aforementioned first metal layer, second metal layer, and third metal layer, the plurality of metal layers may optionally further comprise a fourth metal layer located on the side of the third metal layer facing away from the substrate 100a. Optionally, at least a portion of the dam 701 is co-layered with at least one of the first metal layer, second metal layer, third metal layer, and fourth metal layer. For example, at least a portion of the dam 701 is co-layered with the fourth metal layer, or at least a portion of the dam 701 is co-layered with the first metal layer, second metal layer, and fourth metal layer.

[0323] Optionally, on the same cross section extending along the thickness direction Z of the display panel, the thickness of the first encapsulation sublayer 610a is greater than the thickness of the second encapsulation sublayer 610b. In this case, the thickness of the first encapsulation sublayer 610a and the thickness of the second encapsulation sublayer 610b can both refer to the thickness along the thickness direction Z of the display panel at the position corresponding to the middle position of the light-emitting unit; or they can both refer to the thickness along the thickness direction Z of the display panel at the position where the upper surface of the isolation structure between adjacent isolation openings intersects flat.

[0324] In these alternative embodiments, the second encapsulation sublayer 610b has the smallest thickness but the highest density, which improves the overall encapsulation reliability of the first encapsulation layer 610 while reducing the material usage of the second encapsulation sublayer 610b and reducing the overall film thickness of the display panel 10.

[0325] like Figure 38 As shown, in some optional embodiments, the first encapsulation layer 610 further includes a third encapsulation sublayer 610c, which is located on the side of the second encapsulation sublayer 610b away from the substrate 100, and the density of the second encapsulation sublayer 610b is greater than the density of the third encapsulation sublayer 610c.

[0326] In these optional embodiments, the inclusion of a third encapsulation sublayer 610c can further improve the encapsulation effect of the first encapsulation layer 610. Furthermore, the density of the second encapsulation sublayer 610b is greater than that of the first encapsulation sublayer 610a and the third encapsulation sublayer 610c. The second encapsulation sublayer 610b is more dense than the first encapsulation sublayer 610a, further improving the overall encapsulation reliability of the first encapsulation layer 610. This addresses the problem that a single first encapsulation layer 610 is insufficient to meet the encapsulation requirements of the display panel 10, thereby improving the display effect and performance of the display panel 10. In particular, it can improve the problem that a single first encapsulation layer 610 is insufficient to meet the encapsulation requirements of large-size display panels 10.

[0327] In some alternative embodiments, on the same cross section extending along the thickness direction Z of the display panel, the thickness of the first encapsulation sublayer 610a is greater than the thickness of the second encapsulation sublayer 610b, and the thickness of the third encapsulation sublayer 610c is greater than the thickness of the second encapsulation sublayer 610b.

[0328] In these alternative embodiments, the second encapsulation sublayer 610b has the smallest thickness but the highest density, which improves the overall encapsulation reliability of the first encapsulation layer 610 while reducing the material usage of the second encapsulation sublayer 610b and reducing the overall film thickness of the display panel 10.

[0329] In some alternative embodiments, the refractive index of the first encapsulation sublayer 610a is greater than the refractive index of the second encapsulation sublayer 610b, and the refractive index of the second encapsulation sublayer 610b is greater than the refractive index of the third encapsulation sublayer 610c.

[0330] In these optional embodiments, the refractive indices of the first encapsulation sublayer 610a, the second encapsulation sublayer 610b, and the third encapsulation sublayer 610c decrease in that order, forming a progressive optical coupling layer to reduce interface reflection loss and improve light extraction efficiency. The high-refractive-index first encapsulation sublayer 610a is close to the light-emitting unit 230, shortening the optical path difference and reducing color shift caused by wavelength interference. The low-refractive-index third encapsulation sublayer 610c acts as a light-emitting interface buffer, scattering ambient light reflection.

[0331] Optionally, when the first encapsulation layer 610 includes a first encapsulation sublayer 610a, a second encapsulation sublayer 610b, and a third encapsulation sublayer 610c, the thicknesses of the first encapsulation sublayer 610a and the third encapsulation sublayer 610c are both less than the thickness of the first encapsulation sublayer 610a when the first encapsulation layer 610 includes only the first encapsulation sublayer 610a and the second encapsulation sublayer 610b. Optionally, when the first encapsulation layer 610 includes a first encapsulation sublayer 610a, a second encapsulation sublayer 610b, and a third encapsulation sublayer 610c, the sum of the thicknesses of the first encapsulation sublayer 610a and the third encapsulation sublayer 610c is equal to the thickness of the first encapsulation sublayer 610a when the first encapsulation layer 610 includes only the first encapsulation sublayer 610a and the second encapsulation sublayer 610b.

[0332] In some alternative embodiments, such as Figure 39 As shown, the display panel 10 also includes a protective cover plate 800, located on the side of the first encapsulation layer 610 away from the substrate 100. The protective cover plate 800 and the substrate 100 are disposed opposite to each other, and a sealing structure 810 is provided between the protective cover plate 800 and the substrate 100.

[0333] In these optional embodiments, a sealed chamber is formed between the protective cover 800 and the substrate 100 on which the light-emitting unit 230 is disposed through a sealing structure 810, blocking ambient water and oxygen. The protective cover 800 and the first encapsulation layer 610 form a dual encapsulation, with rigid encapsulation and flexible encapsulation working together to further improve the encapsulation reliability of the display panel 10.

[0334] Optionally, the sealing structure 810 includes glass glue, which is sintered between the protective cover plate 800 and the substrate 100 to form a seal. Optionally, the sealing structure 810 is fixedly connected to an inorganic material of the display panel 10, for example, the sealing structure 810 is fixed to the third encapsulation layer 630, or the sealing structure 810 is fixed to the second encapsulation sub-layer 610b, or the sealing structure 810 is fixed to other inorganic insulating layers. Optionally, the sealing structure 810 includes an opaque sealing material such as sealant.

[0335] Optionally, the display panel 10 further includes a second wear-resistant layer disposed on the outer surface of the protective cover 800 away from the first encapsulation layer 610, wherein the wear rate of the second wear-resistant layer is less than the wear rate of the protective cover 800.

[0336] In these optional embodiments, the wear rate of the second wear-resistant layer is less than that of the protective cover plate 800, meaning the wear resistance of the second wear-resistant layer is superior to that of the protective cover plate 800. When a second wear-resistant layer is provided on the protective cover plate 800, the second wear-resistant layer has better wear resistance and provides protection for the protective cover plate 800, improving the encapsulation reliability of the display panel 10. Optionally, the material of the second wear-resistant layer includes wear-resistant materials such as diamond carbon or SiO2 nanoparticle coatings.

[0337] In some optional embodiments, the protective cover 800, the substrate 100, and the sealing structure 810 enclose a sealed space 820, within which the light-emitting unit 230 and the isolation structure 300 are located. The sealed space 820 is filled with an inert gas, such as nitrogen or argon.

[0338] In these alternative embodiments, the inert gas completely isolates oxygen and moisture, reducing the risk of oxidation of the light-emitting unit 230 at the source. The sealed space 820 forms a pressure buffer layer, improving the impact resistance of the display panel 10.

[0339] In some alternative embodiments, such as Figure 40 As shown, the display panel 10 also includes the second encapsulation layer 620 and the third encapsulation layer 630 mentioned above; the protective cover plate 800 is located on the side of the third encapsulation layer 630 away from the substrate 100.

[0340] In these optional embodiments, the protective cover 800 forms an airtight cavity through the sealing structure 810, blocking ambient water and oxygen. The first encapsulation layer 610, the second encapsulation layer 620, and the third encapsulation layer 630 form a three-layer thin-film encapsulation. The protective cover 800 and TFE form a dual encapsulation of rigid and flexible encapsulation, further improving the encapsulation reliability of the display panel 10.

[0341] Optional, such as Figure 1 As shown, the aforementioned non-display area NA includes side borders NA1 located on both sides of the display area AA in the first direction X and a bottom border NA2 located on one side of the display area AA in the second direction Y. Figure 39 and Figure 40 As shown, within the side bezel NA1, the sealing structure 810 is located on the side of the second encapsulation sublayer 610b or the third encapsulation layer 630 away from the display area AA; the display panel 10 also includes a driving power supply voltage signal line at least partially located within the lower bezel NA2, where the orthographic projection of the sealing structure 810 onto the substrate 100a and the driving power supply voltage signal line at least partially overlap. The sealing structure 810 is disposed around the display area AA in the side bezel NA1 and lower bezel NA2 regions to form a sealed protection for the display area AA. Optionally, the driving power supply voltage signal line includes a high-level power line ELVDD and a low-level power line ELVSS.

[0342] In some alternative embodiments, such as Figure 39 and Figure 40As shown, the orthographic projection of the second encapsulation layer 620 onto the substrate 100a lies within the orthographic projection of the protective cover plate 800 onto the substrate 100a. In these alternative embodiments, the second encapsulation layer 620 is recessed within the protective cover plate 800, which provides physical shielding protection for the second encapsulation layer 620 against edge delamination caused by assembly stress.

[0343] In some alternative embodiments, the orthographic projection of the third encapsulation layer 630 onto the substrate 100a lies within the orthographic projection of the protective cover 800 onto the substrate 100a. In these alternative embodiments, the edges of the third encapsulation layer 630 are covered by the protective cover 800, which can improve water and oxygen permeation caused by cutting cracks.

[0344] In some alternative embodiments, such as Figure 39 As shown, the distance L0 between the boundary of the isolation structure 300 and the sealing structure 810 is greater than or equal to 50 μm. For example, the distance between the boundary of the isolation structure 300 and the sealing structure 810 is 50 μm, 60 μm, 70 μm, or 80 μm. In these optional embodiments, the distance between the boundary of the isolation structure 300 and the sealing structure 810 is greater than or equal to 50 μm to accommodate a large-size display panel 10.

[0345] In some alternative embodiments, such as Figure 41 As shown, the display panel 10 also includes a polarizer 900 located between the substrate 100 and the protective cover plate 800. The sidewalls of the polarizer 900 are recessed relative to the substrate 100 and the protective cover plate 800 to form a recessed space 910, and the recessed space 910 is filled with a water- and oxygen-resistant structure 920. Optionally, the water- and oxygen-resistant structure 920 includes glass glue.

[0346] In these optional embodiments, the edges of the substrate 100, polarizer 900 and protective cover 800 of the display panel 10 are not aligned. For example, the edge sidewall of the polarizer 900 is recessed relative to the substrate 100 and protective cover 800 to form a recessed space 910. Water and oxygen can easily accumulate in the recessed space 910 and invade the interior of the screen. Therefore, filling the recessed space 910 with a water and oxygen resistant structure 920 can isolate water and oxygen, cut off the water and oxygen intrusion path, and improve the packaging reliability of the display panel 10.

[0347] Optionally, an adhesive layer 930 is provided between the polarizer 900 and the protective cover plate 800, the adhesive layer 930 being used to bond the polarizer 900 and the protective cover plate 800. Optionally, the adhesive layer 930 includes OCA (Optical Clear Adhesive), etc.

[0348] In some optional embodiments, on the same cross section extending along the thickness direction Z of the display panel, the thickness of the second encapsulation sublayer 610b is less than the thickness of the first encapsulation sublayer 610a, and the ratio of the thickness of the second encapsulation sublayer 610b to the thickness of the first encapsulation sublayer 610a is less than or equal to 0.1. For example, the ratio of the thickness of the second encapsulation sublayer 610b to the thickness of the first encapsulation sublayer 610a is 0.02, 0.05, 0.08, 0.1, etc.

[0349] Optionally, in the thickness direction Z, the thickness of the second encapsulation sublayer 610b at the same location is less than the thickness of the first encapsulation sublayer 610a. That is, the comparison of the thicknesses of the second encapsulation sublayer 610b and the first encapsulation sublayer 610a refers to the comparison on the same cross section extending along the thickness direction Z.

[0350] In these optional embodiments, the ratio of the thickness of the second encapsulation sublayer 610b to the thickness of the first encapsulation sublayer 610a is less than or equal to 0.1. This can improve the problems caused by an excessively large ratio of the thickness of the second encapsulation sublayer 610b to the thickness of the first encapsulation sublayer 610a, resulting in excessively large material costs for the second encapsulation sublayer 610b and excessively large overall film thickness of the display panel 10, or by an excessively small thickness for the first encapsulation sublayer 610a, resulting in poor encapsulation effect and low structural strength of the first encapsulation sublayer 610a.

[0351] In some optional embodiments, the thickness of the second encapsulation sublayer 610b ranges from 100 Å to 1000 Å. For example, the thickness of the second encapsulation sublayer 610b is 100 Å, 600 Å, 800 Å, 1000 Å, etc.

[0352] In these optional embodiments, the thickness of the second encapsulation sublayer 610b is greater than or equal to 100 Å. This can mitigate the problems caused by an insufficiently thin second encapsulation sublayer 610b, which results in high manufacturing precision, high manufacturing difficulty, poor encapsulation performance, and low structural strength, making it prone to cracking. Conversely, a thickness of less than or equal to 1000 Å can mitigate the problems caused by an excessively thick second encapsulation sublayer 610b, which results in excessively high material costs and an excessively thick overall film thickness of the display panel 10.

[0353] The display panel 10 may also include at least one film layer such as a touch layer and a color filter substrate 100. The film layer may also be bonded to the display panel 10 via an adhesive layer such as OCA (Optical Clear Adhesive).

[0354] Optionally, the width of the signal line located in the non-display area NA is greater than the width of the signal area in the display area AA.

[0355] Optionally, the substrate 100 also includes a gate driving circuit located in the non-display area NA. The channel region size of the transistor in the gate driving circuit is larger than the channel region size of the transistor in the pixel driving circuit 111 located in the display area AA, so as to ensure the transistor lifespan of the gate driving circuit and improve the driving capability of the gate driving circuit.

[0356] In some alternative embodiments, such as Figures 42 to 44 As shown, the substrate 100 includes a substrate 100a and a driving circuit layer 11 disposed on one side of the substrate 100a. The driving circuit layer 11 includes a plurality of conductive layers 112. At least one of the plurality of conductive layers 112 and at least one of the first electrode layers 400 include a conductive portion 700. The isolation structure 300 is connected to the conductive portion 700 through a first via 121. The second electrode 510, the isolation structure 300 and the conductive portion 700 are electrically connected to each other.

[0357] In these alternative embodiments, since the isolation structure 300 is connected to the conductive part 700 through the first via 121, the second electrode 510, the isolation structure 300 and the conductive part 700 are electrically connected to each other, thereby reducing the voltage drop of the isolation structure 300, thereby improving the brightness uniformity of the display panel 10 and reducing the power consumption of the display panel 10.

[0358] Furthermore, when at least two light-emitting units 230 include different numbers of light-emitting material layers (EMLs), the light-emitting units 230 with different numbers of EMLs have different requirements for driving voltage and voltage drop. In this embodiment, by adding a conductive part 700, the voltage drop of the isolation structure 300 can be reduced, thereby better adapting to the driving requirements of different light-emitting units 230.

[0359] At least one of the plurality of conductive layers 112 and at least one of the first electrode layers 400 include a conductive portion 700. Optionally, as... Figure 43 As shown, one of the multiple conductive layers 112 includes a conductive portion 700, meaning the conductive portion 700 is disposed in one of the multiple conductive layers 112. Optionally, at least two of the multiple conductive layers 112 each include a conductive portion 700, meaning the conductive portion 700 is disposed in two of the multiple conductive layers 112, or all of the multiple conductive layers 112 include a conductive portion 700. Figure 44As shown, optionally, the first electrode layer 400 includes a conductive portion 700, that is, the conductive portion 700 and the first electrode 410 are disposed in the same layer. Optionally, at least two of the first electrode layer 400 and the plurality of conductive layers 112 each include a conductive portion 700, that is, a part of the conductive portion 700 is disposed in the same layer as the first electrode 410, and another part of the conductive portion 700 is disposed in the conductive layer 112, specifically, it can be disposed in one conductive layer 112 or it can be disposed in multiple conductive layers 112.

[0360] The isolation structure 300 is connected to the conductive portion 700 through a first via 121, which penetrates the structural layer between the isolation structure 300 and the conductive portion 700. Optionally, if the first electrode layer 400 includes the conductive portion 700, then the first via 121 penetrates the structural layer between the isolation structure 300 and the conductive portion 700 of the first electrode layer 400. Specifically, the first via 121 penetrates the pixel defining portion 210 between the isolation structure 300 and the conductive portion 700 of the first electrode layer 400. Optionally, if at least one of the plurality of conductive layers 112 includes the conductive portion 700, then the first via 121 penetrates the structural layer between the isolation structure 300 and the conductive portion 700. The second electrode 510 is electrically connected to the isolation structure 300, and the isolation structure 300 is connected to the conductive portion 700, such that the second electrode 510, the isolation structure 300, and the conductive portion 700 are electrically connected to each other. The isolation structure 300 can be electrically connected to the same conductive part 700 through at least two first vias 121. The at least two first vias 121 can be distributed at different positions on the display panel 10 to reduce the voltage drop of the isolation structure 300, thereby improving the brightness uniformity of the display panel 10. The isolation structure 300 can be electrically connected to the conductive part 700 through one first via 121. The orthographic projection of the first via 121 on the substrate 100a can extend to form a strip shape, a ring shape, etc. Specifically, the shape of the orthographic projection of the first via 121 on the substrate 100a is partially or completely adapted to the orthographic projection of the conductive part 700 on the substrate 100a. That is, the orthographic projection of the first via 121 on the substrate 100a and the orthographic projection of the conductive part 700 on the substrate 100a can at least partially overlap or completely overlap, thereby reducing the voltage drop of the isolation structure 300 along the extension direction of the first via 121, thereby improving the brightness uniformity of the display panel 10.

[0361] In the display panel 10 of this embodiment, since the isolation structure 300 is connected to the conductive part 700 through the first via 121, the second electrode 510, the isolation structure 300 and the conductive part 700 are electrically connected to each other, thereby reducing the voltage drop of the isolation structure 300, thereby improving the brightness uniformity of the display panel 10 and reducing the power consumption of the display panel 10.

[0362] like Figure 42As shown, in some embodiments, the isolation structure 300 includes a first sub-layer 301 and a second sub-layer 302, which are stacked in a direction away from the substrate 100. The second sub-layer 302 protrudes relative to the first sub-layer 301 toward the isolation opening 310. The surface of the second sub-layer 302 facing away from the substrate 100 is recessed in a direction toward the substrate 100 to form a second recess 302h. The orthographic projection of the second recess 302h onto the substrate 100a overlaps at least partially with the orthographic projection of the first via 121 onto the substrate 100a.

[0363] In these alternative embodiments, the isolation structure 300 includes a first sub-layer 301 and a second sub-layer 302, the second sub-layer 302 protruding relative to the first sub-layer 301 toward the isolation opening 310, such that a recess can be formed beneath the second sub-layer 302. During the fabrication of the light-emitting unit 230, the light-emitting material can be broken into independent light-emitting units 230 at the edge of the second sub-layer 302.

[0364] Before fabricating the isolation structure 300, a first via 121 is provided to expose at least a portion of the conductive portion 700. An isolation material for forming the isolation structure 300 is provided, uniformly distributed on one side of the substrate 100a, with a portion of the isolation material falling into the first via 121. This results in a second recess 302 in the isolation structure 300 formed by this isolation material, where the surface of the second sublayer 302 facing away from the substrate 100 is recessed towards the substrate 100, forming a second recess 302h. This second recess 302h corresponds to the first via 121 in the thickness direction Z of the display panel 10, and the orthographic projection of the second recess 302h onto the substrate 100a at least partially overlaps with the orthographic projection of the first via 121 onto the substrate 100a. Optionally, the orthographic projection of the second recess 302h onto the substrate 100a is located within the orthographic projection of the first via 121 onto the substrate 100a. Optionally, the isolation material for forming the isolation structure 300 is deposited on one side of the substrate 100a using a deposition technique.

[0365] In some alternative embodiments, such as Figure 43As shown, the isolation structure 300 also includes a third sub-layer 303, which is located on the side of the first sub-layer 301 facing the substrate 100, and the third sub-layer 303 protrudes relative to the first sub-layer 301 towards the isolation opening 310. The second electrode 510 also extends to the surface of the third sub-layer 303 away from the substrate 100 and overlaps with the third sub-layer 303. The surface of the third sub-layer 303 away from the substrate 100 is recessed in the direction towards the substrate 100 to form a third recess 303h. The orthographic projection of the third recess 303h on the substrate 100a and the orthographic projection of the first via 121 on the substrate 100a overlap at least partially. The third sub-layer 303 includes a connecting portion 3031 and a connecting portion 3032 connected to each other. The connecting portion 3031 is located on the side of the substrate 100, and at least part of the connecting portion 3032 is located in the first via 121 and contacts the conductive portion 700.

[0366] During the fabrication of the isolation structure 300, when the first sublayer 301 is side-etched, the third sublayer 303 can provide protection to the film layer on the substrate 100 side.

[0367] During the fabrication of the isolation structure 300, a third isolation material for forming the third sublayer 303, a first isolation material for forming the first sublayer 301, and a second isolation material for forming the second sublayer 302 are sequentially disposed on one side of the substrate 100a, and the third, first, and second isolation materials are sequentially stacked. A portion of the third isolation material falls into the first via 121 to form a connection portion 3032 that contacts the conductive portion 700, and another portion of the third isolation material falls outside the first via 121 to form an overlap portion 3031, such that the surface of the connection portion 3032 facing away from the substrate 100 is recessed relative to the surface of the overlap portion 3031 facing away from the substrate 100 in the direction toward the substrate 100 to form a third recess 303h. Optionally, the overlap portion 3031 surrounds the portion forming the isolation opening 310, and the second electrode 510 fabricated subsequently contacts the overlap portion 3031.

[0368] In some alternative embodiments, such as Figures 42 to 44 As shown, a portion of the first sublayer 301 is located on the side of the overlapping portion 3031 away from the substrate 100, and another portion of the first sublayer 301 is located within the third recess 303h. The surface of the first sublayer 301 away from the substrate 100 is recessed in the direction toward the substrate 100 to form the first recess 301h. The orthogonal projection of the first recess 301h onto the substrate 100a is located within the orthogonal projection of the third recess 303h onto the substrate 100a.

[0369] A portion of the first insulating material falls on the first region of the third insulating material used to form the overlap portion 3031, and another portion of the first insulating material falls within the third recess 303h and is located on the second region of the third insulating material used to form the connecting portion 3032. After the first sublayer 301 and the third sublayer 303 are formed, the first insulating material located on the first region forms the portion of the first sublayer 301 located on the side of the overlap portion 3031 facing away from the substrate 100, and the first insulating material located on the second region forms the portion of the first sublayer 301 located on the side of the third recess 303h facing away from the substrate 100, such that the surface of the first sublayer 301 facing away from the substrate 100 is recessed in the direction toward the substrate 100 to form the first recess 301h. It can be understood that, due to the provision of the first via 121, the third sublayer 303 has the third recess 303h; and due to the third sublayer 303 having the third recess 303h, the first sublayer 301 located on one side of the third sublayer 303 has the first recess 301h.

[0370] Optionally, a portion of the second sublayer 302 is located on the side of the overlap portion 3031 away from the substrate 100, and another portion of the second sublayer 302 is located within the first recess 301h. The orthogonal projection of the second recess 302h onto the substrate 100a is located within the orthogonal projection of the first recess 301h onto the substrate 100a.

[0371] A portion of the second sublayer 302 may be located on the side of the overlap portion 3031 facing away from the substrate 100. At least a portion of the second insulating material used to form the second sublayer 302 falls on the first region of the third insulating material used to form the overlap portion 3031, at least a portion falls within the first recess 301h, and is located on the second region of the third insulating material used to form the connecting portion 3032. After the second sublayer 302 is formed, the portion of the second insulating material located in the first region forms the portion of the second sublayer 302 corresponding to the portion supported on the overlap portion 3031, and the portion of the second insulating material located in the second region forms the portion of the second sublayer 302 corresponding to the portion supported on the third recess 303h, such that the surface of the second sublayer 302 facing away from the substrate 100 is recessed in the direction toward the substrate 100 to form the second recess 302h. It can be understood that because the first sublayer 301 has the first recess 301h, the second sublayer 302 located on one side of the first sublayer 301 has the second recess 302h.

[0372] In some embodiments, such as Figures 42 to 44As shown, a portion of the third sub-layer 303 is located within the first via 121, while the first sub-layer 301 and the third sub-layer 303 are located outside the first via 121. In some embodiments, a portion of the third sub-layer 303 and a portion of the first sub-layer 301 are located within the first via 121, and the third sub-layer 303 is located outside the first via 121. In some embodiments, a portion of the third sub-layer 303, a portion of the first sub-layer 301, and a portion of the second sub-layer 302 are all located within the first via 121.

[0373] In some embodiments, the material of the first sublayer 301 includes at least one of copper and copper alloys. Compared to aluminum, copper has higher hardness and greater electrical conductivity, making the first sublayer 301 advantageous for use in large-size display panels 10. The large-size display panel 10 can be a display panel 10 for a monitor or a display panel 10 for a television.

[0374] In some embodiments, the resistivity of the second electrode 510 is greater than the resistivity of the third sublayer 303, and the resistivity of the second electrode 510 is greater than the resistivity of the conductive portion 700.

[0375] The second electrode 510 needs to transmit light emitted by the light-emitting unit 230, thus the material used to fabricate the second electrode 510 is limited by the material's transmittance. The resistivity of the second electrode 510 is set to be greater than the resistivity of the third sublayer 303 to reduce the voltage drop of the third sublayer 303 and ensure that the multiple second electrodes 510 obtain a stable voltage. The resistivity of the second electrode 510 is also greater than the resistivity of the conductive portion 700 to reduce the voltage drop of the conductive portion 700 and ensure that the multiple second electrodes 510 obtain a stable voltage.

[0376] Please see Figure 44 In some embodiments, the display panel 10 further includes a first encapsulation layer 610, which includes a plurality of encapsulation portions 611. The encapsulation portions 611 are located on the side of the second electrode 510 away from the substrate 100. The encapsulation portions 611 also cover the sidewall of the isolation structure 300 facing the isolation opening 310 and extend to the side of the isolation structure 300 away from the substrate 100. Some of the encapsulation portions 611 are located within the second recess 302h.

[0377] The encapsulation portion 611 is located on the side of the second electrode 510 away from the substrate 100, and extends through the sidewall of the isolation structure 300 to the side of the isolation structure 300 away from the substrate 100.

[0378] For example, the encapsulation portion 611 includes the first segment 611a and the second segment 611b described above. When fabricating the encapsulation portion 611, the encapsulation material used to fabricate the encapsulation portion 611 can fall onto the second electrode 510, or it can fall onto the side of the isolation structure 300 facing away from the substrate 100. A portion of the encapsulation material is correspondingly carried within the second recess 302h, such that a portion of the formed encapsulation portion 611 is located within the second recess 302h, increasing the area of ​​the encapsulation portion 611 opposite to the isolation structure 300, and reducing or preventing unnecessary detachment of the encapsulation portion 611 from the isolation structure 300.

[0379] The surface of the encapsulation portion 611 facing away from the substrate 100 is recessed in the direction toward the substrate 100 to form an encapsulation recess 611h. It can be understood that since the second sublayer 302 has a second recess 302h, the encapsulation portion 611 located on one side of the second sublayer 302 has an encapsulation recess 611h.

[0380] In some embodiments, such as Figure 44 As shown, there is a break 612 between adjacent encapsulation portions 611, and the orthographic projection of the break 612 on the second sub-layer 302 is offset from the second recess 302h.

[0381] Light-emitting units 230 for emitting different colors of light are fabricated in stages, and encapsulation portions 611 corresponding to encapsulating different light-emitting units 230 are fabricated in stages, with a break 612 between adjacent encapsulation portions 611. The orthographic projection of the break 612 on the second sub-layer 302 is spaced apart from the second recess 302h, that is, the break 612 is located on one side of the encapsulation recess 611h. The orthographic projection of the break 612 on the second sub-layer 302 is staggered from the second recess 302h, so that the encapsulation portion 611 can avoid or reduce damage to the second sub-layer 302 with the second recess 302h during the fabrication of the light-emitting unit 230 and the second electrode 510; it also increases the relative area between the encapsulation portion 611 located on the side of the break 612 and the isolation structure 300 in adjacent encapsulation portions 611, reducing or avoiding unwanted detachment between the encapsulation portion 611 and the isolation structure 300.

[0382] Optionally, when the display panel 10 includes the aforementioned second encapsulation layer 620, the second encapsulation layer 620 can fill the break 612 to seal the break 612, thereby improving the encapsulation effect of the first encapsulation layer 610 and the second encapsulation layer 620 as a whole on the light-emitting unit 230. The second encapsulation layer 620 can fill the break 612 and the gap between the isolation structure 300 and the second sub-layer 302, reducing or preventing the encapsulation portion 611 from peeling off from the isolation structure 300. The second encapsulation layer 620 can also planarize the encapsulation recess 611h, which facilitates the provision of a flat third encapsulation layer 630 on one side of the second encapsulation layer 620.

[0383] Please see Figure 45 In some embodiments, the isolation structure 300 is electrically connected to the conductive portion 700 through at least two first vias 121.

[0384] The first via 121 can be circular, elliptical, triangular, polygonal, or elongated in its orthographic projection onto the substrate 100a. At least two first vias 121 can be spaced apart. For example, two first vias 121 can be located at opposite ends of the display area AA, and are electrically connected to the conductive portion 700 to reduce the voltage drop across the isolation structure 300 along the connection direction between the opposite ends. Alternatively, two first vias 121 can be located on opposite sides of one or more pixel openings 220 to reduce the voltage drop across the isolation structure 300 along the connection direction between the opposite sides.

[0385] Optionally, at least a portion of the first via 121 and the conductive portion 700 are located in the display area AA. The first electrode 410, the light-emitting unit 230, and the second electrode 510 are located in the display area AA, and at least a portion of the first via 121 and the conductive portion 700 are located in the display area AA, so as to reduce the voltage drop of the isolation structure 300 connected to the second electrode 510.

[0386] In some embodiments, such as Figure 45 As shown, the conductive part 700 includes a first conductive part 710, and the isolation structure 300 is connected to the same first conductive part 710 through at least two first vias 121.

[0387] The conductive portion 700 may include only one first conductive part 710, and the isolation structure 300 is connected to the same first conductive part 710 through at least two first vias 121, so that the isolation structure 300 achieves voltage drop reduction at at least two points through the first conductive part 710. Alternatively, the conductive portion 700 may include multiple first conductive parts 710, and the isolation structure 300 is connected to the same first conductive part 710 through at least two first vias 121, so that the isolation structure 300 achieves voltage drop reduction at at least two points through the first conductive part 710.

[0388] For example, the first conductive electronic portion 710 is projected onto the substrate 100a in the shape of an elongated strip, and a plurality of first vias 121 are arranged at intervals along the extending direction of the first conductive electronic portion 710, and the isolation structure 300 is connected to the first conductive electronic portion 710 through the plurality of first vias 121.

[0389] For example, the orthographic projection of the first conductive electronic portion 710 on the substrate 100a is annular, and a plurality of first vias 121 are arranged in an annular shape and spaced apart along the extension direction of the first conductive electronic portion 710. The isolation structure 300 is connected to the first conductive electronic portion 710 through the plurality of first vias 121.

[0390] For example, the orthogonal projections of a plurality of first conductive electronic portions 710 onto the substrate 100a form a grid. A plurality of first vias 121 are distributed in an array.

[0391] Please refer to the following: Figure 46 and Figure 47 In some embodiments, the conductive part 700 includes a plurality of first conductive parts 710, which are spaced apart from each other, so that multiple locations of the isolation structure 300 can be connected to the plurality of first conductive parts 710 respectively, thereby reducing the voltage drop through the plurality of first conductive parts 710.

[0392] The plurality of first conductive parts 710 may be located in the same conductive layer 112 or in multiple conductive layers 112. The plurality of first conductive parts 710 are spaced apart from each other, which may be multiple first conductive parts 710 located in the same conductive layer 112 spaced apart from each other, or multiple first conductive parts 710 located in different conductive layers 112 spaced apart from each other along the thickness direction Z of the display panel 10.

[0393] For example, such as Figure 47 As shown, a plurality of first conductive electronic portions 710 are arranged in rows and columns along a first direction X and a second direction Y. For example, the first conductive electronic portions 710 extend from one end of the display area AA to the other end along the first direction X, and the plurality of first conductive electronic portions 710 are spaced apart along the second direction Y. For example, as... Figure 48 As shown, the first conductive electronic portion 710 extends from one end of the display area AA to the other end along the second direction Y, and a plurality of first conductive electronic portions 710 are arranged at intervals along the first direction X.

[0394] In some embodiments, such as Figure 48 As shown, the conductive portion 700 includes a plurality of first conductive portions 710, which are interconnected, and the plurality of first conductive portions 710 form a grid shape on the orthogonal projection of the substrate 100a.

[0395] Multiple first conductive parts 710 can be located in the same conductive layer 112 and interconnected; alternatively, multiple first conductive parts 710 can be located in multiple conductive layers 112 and connected by vias in different conductive layers 112. Interconnection of multiple first conductive parts 710 helps maintain voltage consistency among them and reduces voltage drop in the isolation structure 300 connected to each first conductive part 710.

[0396] In some embodiments, the orthographic projection of a plurality of first conductive electronic portions 710 onto the substrate 100a forms a grid, and the orthographic projection of one or more light-emitting units 230 onto the substrate 100a is located at the mesh openings of the grid. The shape and size of the mesh openings are adapted to the shape and size of one or more light-emitting units 230.

[0397] like Figure 49 As shown, in some embodiments, the conductive portion 700 further extends to the non-display area NA, and the conductive portion 700 includes a second conductive sub-portion 720 located in the non-display area NA, with the first conductive sub-portion 710 and the second conductive sub-portion 720 connected.

[0398] The conductive portion 700 may extend from the first conductive portion 710 located in the display area AA to the non-display area NA. Optionally, when the conductive portion 700 includes a plurality of first conductive portions 710, one or more of the plurality of first conductive portions 710 are respectively connected to the same second conductive portion 720. Optionally, when the conductive portion 700 includes a plurality of first conductive portions 710, one or more of the plurality of first conductive portions 710 are respectively connected to different second conductive portions 720.

[0399] The first conductive part 710 and the second conductive part 720 can have different arrangement rules. For example, the second conductive part 720 is disposed on opposite sides of the plurality of first conductive parts 710 in a first direction X, the plurality of first conductive parts 710 are arranged at intervals along a second direction Y, and the two ends of the first conductive parts 710 along the first direction X are respectively connected to the second conductive part 720. For example, the second conductive part 720 is disposed around the periphery of the plurality of first conductive parts 710, the plurality of first conductive parts 710 form a grid in the orthographic projection of the substrate 100a, and the opposite ends of the plurality of first conductive parts 710 are connected to the second conductive part 720.

[0400] like Figure 50 As shown, in some embodiments, the first electrode layer 400 includes a conductive portion 700, and the first via 121 includes a first connection opening 1211 penetrating the pixel defining portion 210. The isolation structure 300 is connected to the conductive portion 700 through the first connection opening 1211. The conductive portion 700 and the first electrode 410 are spaced apart, and the pixel defining portion 210 electrically isolates the conductive portion 700 and the first electrode 410. The conductive portion 700 and the first electrode 410 can be fabricated in the same layer, thereby simplifying the fabrication steps.

[0401] Please see Figure 51 In some embodiments, the conductive portion 700 includes a plurality of first conductive portions 710, which are located in at least two of the plurality of conductive layers 112. The isolation structure 300 is electrically connected to the first conductive portions 710 located in different conductive layers 112 through different first vias 121.

[0402] The orthographic projections of the first conductive sub-parts 710 located in different conductive layers 112 onto the substrate 100a can overlap, thereby facilitating via connections of the first conductive sub-parts 710 located in different conductive layers 112. The orthographic projections of the first conductive sub-parts 710 located in different conductive layers 112 onto the substrate 100a can also intersect, allowing the first conductive sub-parts 710 located in different conductive layers 112 to be distributed at different positions in the display area AA, which is beneficial for connection with isolation structures 300 located at different positions in the display area AA.

[0403] By disposing multiple first conductive sub-parts 710 in at least two of the multiple conductive layers 112, the area occupied by the first conductive sub-parts 710 in their respective conductive layers 112 is reduced, thereby reducing the influence of the first conductive sub-parts 710 on other conductive circuits distributed in the conductive layers 112.

[0404] In some embodiments, the conductive portion 700 includes a plurality of first conductive sub-portions 710, which are located in at least two of the plurality of conductive layers 112. The first conductive sub-portions 710 located in different conductive layers 112 are electrically connected. The isolation structure 300 is electrically connected to the first conductive sub-portion 710 in one of the at least two conductive layers 112 closest to the isolation structure 300 through a first via 121.

[0405] The isolation structure 300 is electrically connected to a first conductive sub-part 710 in a conductive layer 112. This first conductive sub-part 710 is also electrically connected to a first conductive sub-part 710 in another conductive layer 112, ensuring that the opening depths of the plurality of first vias 121 are consistent. The plurality of first conductive sub-parts 710 connected to the isolation structure 300 are electrically connected to the first conductive sub-parts 710 in the other conductive layer 112, thereby reducing the voltage drop across the plurality of first conductive sub-parts 710 connected to the isolation structure 300. By distributing the plurality of first conductive sub-parts 710 in at least two of the plurality of conductive layers 112, the area occupied by the first conductive sub-parts 710 in their respective conductive layers 112 is reduced, thus minimizing the impact of the first conductive sub-parts 710 on other conductive circuits distributed in the conductive layer 112.

[0406] In some embodiments, the driving circuit layer 11 further includes a driving unit 110, and the first electrode 410 is connected to the output terminal 1111 of the driving unit 110 via a second via 122; the first via 121 includes a first connection opening 1211 penetrating the pixel limiting portion 210, and the orthographic projection of the first connection opening 1211 on the substrate 100a and the orthographic projection of the second via 122 on the substrate 100a are spaced apart.

[0407] The output terminal 1111 of the driving unit 110 is located on the side of the first electrode layer 400 near the substrate 100a. The output terminal 1111 of the driving unit 110 is connected to the first electrode 410 via the second via 122, so that the output terminal 1111 of the driving unit 110 can provide voltage to the first electrode 410. The orthographic projection of the first connection opening 1211 on the substrate 100a and the orthographic projection of the second via 122 on the substrate 100a are spaced apart, thereby avoiding direct connection between the isolation structure 300, the conductive part 700 and the conductive material in the second via 122.

[0408] Please see Figure 52 In some embodiments, the pixel opening 220 is provided with multiple side edges 2201 connected end to end, and the second via 122 and the first connecting opening 1211 located on the circumference of the same pixel opening 220 are provided around different side edges 2201 of the pixel opening 220.

[0409] In this application, the display panel 10 can be understood as being viewed along the thickness direction Z of the display panel 10 from a planar perspective. The second via 122 circumferentially above the pixel opening 220 can be used to connect the first electrode 410 located within the pixel opening 220 to the output terminal 1111 of the pixel driving circuit. The second via 122 circumferentially above the pixel opening 220 and the first connection opening 1211 are arranged around different sides 2201 of the pixel opening 220, thereby reducing or avoiding direct connection between the isolation structure 300, the conductive portion 700, and the conductive material within the second via 122.

[0410] For example: multiple light-emitting units 230 are arranged in a row along a first direction X, and a first connecting opening 1211 is disposed between adjacent light-emitting units 230 arranged along the first direction X. The first connecting opening 1211 is disposed around the side 2201 extending along the second direction Y of the light-emitting unit 230. The multiple light-emitting units 230 arranged in a row are arranged along the second direction Y, and multiple second vias 122 are arranged along the second direction Y. The second vias 122 are disposed around the side 2201 extending along the first direction X of the light-emitting unit 230.

[0411] Please see Figure 53 In some embodiments, the pixel opening 220 is provided with multiple sides 2201 and corner edges 2202 connecting adjacent sides 2201. From a plan view, the first connecting opening 1211 is provided around the corner edge 2202.

[0412] The corner edge 2202 can be an arc-shaped edge or a right-angled edge. For example, the corner edge 2202 can be an arc-shaped edge, and the pixel opening 220 can be a rounded rectangle. For example, the corner edge 2202 can be a right-angled edge, and the pixel opening 220 can be a rectangle. When the first connecting opening 1211 is set around the corner edge 2202, the second via 122 can be set along the side edge 2201 of the pixel opening 220, and the second via 122 can also be set along another corner edge 2202 of the pixel opening 220.

[0413] Please see Figure 54 In some embodiments, a first connection opening 1211 is provided only around one side 2201 of a pixel opening 220, thereby reducing the voltage drop of the isolation structure 300 along the extending direction of the side 2201 through the conductive portion 700. Optionally, the length of the first connection opening 1211 along the extending direction of the side 2201 it surrounds is less than or equal to the length of the side 2201 along its extending direction.

[0414] Please see Figure 55 In some embodiments, a first connection opening 1211 is provided around a plurality of adjacent pixel openings 220, thereby reducing the voltage drop of the isolation structure 300 located in the region where the plurality of adjacent pixel openings 220 are located through the conductive portion 700.

[0415] Optionally, a first connection opening 1211 is annular, and the first connection opening 1211 is arranged around a plurality of adjacent pixel openings 220. Optionally, a first connection opening 1211 is strip-shaped, and the first connection opening 1211 is arranged sequentially around a plurality of arranged pixel openings 220, wherein the length of the first connection opening 1211 along the arrangement direction of the plurality of arranged pixel openings 220 is greater than the length of any one of the plurality of arranged pixel openings 220 along its arrangement direction.

[0416] Please see Figure 56 In some embodiments, the conductive portion 700 is located in the first conductive layer 1121 of a plurality of conductive layers 112, and the output terminal 1111 of the driving unit 110 is located in the first conductive layer 1121. The output terminal 1111 of the driving unit 110 and the conductive portion 700 located in the first conductive layer 1121 can be fabricated simultaneously. The output terminal 1111 of the driving unit 110 is the output terminal 1111 of the pixel driving circuit.

[0417] In other embodiments, the conductive portion 700 is located in the first conductive layer 1121 of a plurality of conductive layers 112, and the output terminal 1111 of the driving unit 110 is located on the side of the first conductive layer 1121 facing the substrate 100a. The first conductive layer 1121 having the conductive portion 700 can be additionally provided in the substrate 100 provided in the prior art. The output terminal 1111 of the driving unit 110 is located on the side of the first conductive layer 1121 facing the substrate 100a, such that the first through-hole penetrates the insulating layer between the output terminal 1111 of the driving unit 110 and the first conductive layer 1121.

[0418] In other embodiments, the conductive portion 700 is located in the first conductive layer 1121 of a plurality of conductive layers 112, and the output terminal 1111 of the pixel driving circuit is located on the side of the first conductive layer 1121 facing away from the substrate 100a. The first conductive layer 1121 with the conductive portion 700 can be additionally provided in the substrate 100 provided in the prior art. The output terminal 1111 of the pixel driving circuit is located on the side of the first conductive layer 1121 facing away from the substrate 100a, such that the first via penetrates the insulating layer between the output terminal 1111 of the pixel driving circuit and the first electrode 410. The first conductive layer 1121 may also include any one of a gate, a source / drain, a first electrode plate, and a second electrode plate. The gate is disposed opposite to the semiconductor layer, the source / drain is connected to the semiconductor layer via a via, and the gate, semiconductor layer, and source / drain cooperate to form a transistor. The first electrode plate and the second electrode plate are disposed opposite to each other and cooperate to form a capacitor.

[0419] In some embodiments, the area of ​​the orthographic projection of the first via 121 onto the substrate 100a is S1, and the area of ​​the orthographic projection of the second via 122 onto the substrate 100a is S2, where S1 > S2. Setting S1 > S2 increases the contact area between the isolation structure 300 and the conductive portion 700, thereby reducing the impedance between them.

[0420] Please see Figure 57 In some embodiments, at least one of the multiple conductive layers 112 includes a conductive portion 700. The substrate 100 includes a planarization layer 120 located on the side of the output terminal 1111 of the driving unit 110 away from the substrate 100a. The planarization layer 120 and the pixel definition layer 200 are adjacent. The conductive portion 700 is located on the side of the planarization layer 120 facing the substrate 100a. The first electrode layer 400 is located on the side of the planarization layer 120 away from the substrate 100a. The first via 121 includes a first connection opening 1211 penetrating the pixel definition portion 210 and a second connection opening 1212 penetrating the planarization layer 120. A portion of the isolation structure 300 contacts the conductive portion 700 in sequence through the first connection opening 1211 and the second connection opening 1212.

[0421] The planarization layer 120 can planarize the output terminal 1111 of the driving unit 110, and the planarization layer 120 can also provide a flat surface for forming the first electrode 410 and the pixel defining portion 210. When the output terminal 1111 of the driving unit 110 and the conductive portion 700 are located in the same conductive layer 112, the output terminal 1111 of the driving unit 110 is connected to the first electrode 410 through the second via 122, and a portion of the isolation structure 300 contacts the conductive portion 700 in sequence through the first connection opening 1211 and the second connection opening 1212.

[0422] In some embodiments, the orthographic projection of the second connection opening 1212 on the substrate 100a lies within the orthographic projection of the first connection opening 1211 on the substrate 100a.

[0423] When fabricating the display panel 10, an initial planarization layer 120 without the second connection opening 1212 can be first set, and then a pixel definition material layer can be set on the initial planarization layer 120. The pixel definition material layer is then patterned to obtain a pixel definition layer 200 with the first connection opening 1211. The initial planarization layer 120 exposed from the first connection opening 1211 is then patterned to obtain a planarization layer 120 with the second connection opening 1212. Because the first connection opening 1211 is set first, and then the second connection opening 1212 is set, the orthographic projection of the second connection opening 1212 on the substrate 100a is located within the orthographic projection of the first connection opening 1211 on the substrate 100a.

[0424] Optionally, such as Figure 56 and Figure 57 As shown, the minimum diameter P1 of the first connecting opening 1211 is 4 micrometers to 7 micrometers, and the minimum diameter P2 of the second connecting opening 1212 is 2 micrometers to 5 micrometers. Optionally, the minimum diameter P1 of the first connecting opening 1211 is 4 micrometers, and the minimum diameter P2 of the second connecting opening 1212 is 2 micrometers. Optionally, the minimum diameter P1 of the first connecting opening 1211 is 7 micrometers, and the minimum diameter P2 of the second connecting opening 1212 is 5 micrometers. Optionally, the minimum diameter P1 of the first connecting opening 1211 is 5 micrometers, and the minimum diameter P2 of the second connecting opening 1212 is 3 micrometers.

[0425] Please see Figure 58 In other embodiments, the pixel defining portion 210 extends from one side of the planarization layer 120 into the second connection opening 1212 and contacts the conductive portion 700, and the orthographic projection of the first connection opening 1211 on the substrate 100a is located within the orthographic projection of the second connection opening 1212 on the substrate 100a.

[0426] When fabricating the display panel 10, a planarization layer 120 with a second connection opening 1212 exposing the conductive portion 700 can be first formed. Then, a pixel definition material layer is formed on the planarization layer 120, with a portion of the pixel definition material layer entering the second connection opening 1212 and contacting the conductive portion 700. The pixel definition material layer is patterned to obtain a pixel definition layer 200 with a first connection opening 1211. Since the second connection opening 1212 is formed first and the first connection opening 1211 is formed later, the orthographic projection of the first connection opening 1211 on the substrate 100a is located within the orthographic projection of the second connection opening 1212 on the substrate 100a.

[0427] Optionally, the minimum diameter P1 of the first connecting opening 1211 is 1.5 micrometers to 3 micrometers, and the minimum diameter P2 of the second connecting opening 1212 is 2.5 micrometers to 6 micrometers. Optionally, the minimum diameter P1 of the first connecting opening 1211 is 1.5 micrometers, and the minimum diameter P2 of the second connecting opening 1212 is 2.5 micrometers. Optionally, the minimum diameter P1 of the first connecting opening 1211 is 3 micrometers, and the minimum diameter P2 of the second connecting opening 1212 is 6 micrometers. Optionally, the minimum diameter P1 of the first connecting opening 1211 is 2 micrometers, and the minimum diameter P2 of the second connecting opening 1212 is 4 micrometers.

[0428] Please see Figure 47 In some embodiments, multiple light-emitting units 230 are arranged in rows along a first direction X and a second direction Y, where the first direction X is the row direction and the second direction Y is the column direction. The first conductive electronic part 710 is correspondingly disposed on two adjacent columns of light-emitting units 230 and extends along the second direction Y. The multiple first conductive electronic parts 710 are spaced apart along the first direction X.

[0429] Multiple first conductive electronic portions 710 can extend from one end of the display panel 10 to the other end along the second direction Y.

[0430] Optional, such as Figure 48 and Figure 59 As shown, the first electrode layer 400 includes a signal transfer section 420 located in the non-display area NA. The isolation structure 300 extends from the display area AA to the non-display area NA and is electrically connected to the signal transfer section 420. The signal transfer section 420 is also electrically connected to the power signal line.

[0431] The first electrode 410 and the signal transfer portion 420 can be fabricated in the same layer, and the first electrode 410 and the signal transfer portion 420 are spaced apart. The isolation structure 300 can be electrically connected to the power signal line through the signal transfer portion 420. In some embodiments, the second conductive part 720 is multiplexed as the signal transfer portion 420. The material of the first electrode 410 is patterned to obtain the first electrode 410 located in the display area AA, the first conductive part 710, and the second conductive part 720 located in the non-display area NA. A portion of the isolation structure 300 is located in the display area AA and electrically connected to the first conductive part 710, and a portion of the isolation structure 300 is located in the non-display area NA and electrically connected to the second conductive part 720. The second conductive part 720 is also electrically connected to the power signal line.

[0432] In some embodiments, the isolation structure 300 is electrically connected to the signal transfer section 420 through a third via 123 that passes through the pixel limiting section 210 and is located in the non-display area NA.

[0433] The isolation structure 300 connected to the third via 123 has a stacked third sub-layer 303, a first sub-layer 301 and a second sub-layer 302, with a portion of the third sub-layer 303 located within the third via 123 and electrically connected to the signal adapter 420.

[0434] In some embodiments, the orthogonal projection of the third via 123 on the substrate 100 surrounds at least a portion of the display area AA, allowing multiple locations of the isolation structure 300 to connect to the same signal transfer portion 420 via the third via 123. This helps reduce the voltage drop of the isolation structure 300.

[0435] like Figure 60 As shown, an embodiment of the second aspect of this application also provides a method for manufacturing a display panel 10. The display panel 10 can be any of the display panels 10 provided in the first aspect embodiments described above. Please refer to both methods. Figures 1 to 60 The method for manufacturing the display panel 10 includes:

[0436] Step S01: A pixel definition material layer is formed on one side of the substrate 100.

[0437] Step S02: A first material layer and a second material layer are sequentially disposed on the side of the pixel definition material layer away from the substrate 100. The material of the first material layer includes copper.

[0438] Step S03: Dry etching is performed on the second material layer to form a second sub-layer 302, and the second sub-layer 302 encloses and forms a first preparatory opening.

[0439] Step S04: The first material layer is wet-etched through the first preparatory opening to form a first sub-layer 301. The first sub-layer 301 and the second sub-layer 302 are combined to form an isolation structure 300. The first sub-layer 301 and the second sub-layer 302 enclose an isolation opening 310, and the second sub-layer 302 protrudes towards the isolation opening 310 relative to the first sub-layer 301.

[0440] In the method for manufacturing the display panel 10 provided in this application embodiment, firstly, a pixel definition material layer is set in step S02. Then, a first material layer and a second material layer for manufacturing the isolation structure 300 are set in step S02. The material of the first material layer includes copper, giving it good electrical conductivity. Next, the second material layer located on the first material layer is patterned in step S03 to form a first pre-opening, allowing at least a portion of the first material layer to be exposed through the first pre-opening. Finally, the isolation structure 300 is formed by wet etching of the first material layer through the first pre-opening. The first material layer only requires one wet etching step to form, simplifying the manufacturing of the isolation structure 300. Therefore, in this application embodiment, by setting the material of the first sub-layer 301 to include copper, not only can the conductivity of the first sub-layer 301 be improved, making the display panel 10 suitable for large-screen display devices such as televisions, but the manufacturing process of the display panel 10 can also be simplified, improving the manufacturing efficiency of the display panel 10.

[0441] Optionally, the isolation structure 300 may consist of a first sub-layer 301 and a second sub-layer 302. In some other optional embodiments, the isolation structure 300 further includes a third sub-layer 303 located on the side of the first sub-layer 301 facing the substrate 100. In this case, in step S02: the third material layer, the first material layer, and the second material layer are sequentially disposed on the side of the pixel defining material layer facing away from the substrate 100. Figure 61 Step S04 may include:

[0442] Step S041: The first material layer is wet-etched through the first pre-opening to form a first sub-layer 301, and the first sub-layer 301 surrounds to form a second pre-opening, and the second pre-opening is connected to the first pre-opening.

[0443] Step S042: The third material layer is patterned through the first pre-opening and the second pre-opening to form a third sub-layer 303. The third sub-layer 303, the first sub-layer 301 and the second sub-layer 302 form an isolation structure 300. The first sub-layer 301, the second sub-layer 302 and the third sub-layer 303 enclose an isolation opening 310. The second sub-layer 302 protrudes relative to the first sub-layer 301 toward the isolation opening 310, and the third sub-layer 303 protrudes relative to the first sub-layer 301 toward the isolation opening 310.

[0444] In these alternative embodiments, since the isolation structure 300 includes a third sub-layer 303, after the first material layer is patterned in step S041 to form the first sub-layer 301, the third material layer is patterned in step S042 to form the third sub-layer 303. When the first material layer is processed in step S041, the third material layer is not patterned, and the third material layer can provide protection to the film layer on the substrate 100 side.

[0445] There are various ways to configure the material of the third material layer. For example, if the material of the third material layer includes molybdenum, then in step S042, a wet etching process can be used to pattern the third material layer to improve the fabrication efficiency of the third sublayer 303. Alternatively, in some optional embodiments, the material of the third material layer includes a tungsten-molybdenum alloy or titanium, then in step S042, a dry etching process can be used to pattern the third material layer to improve the fabrication efficiency of the third sublayer 303.

[0446] like Figure 62 As shown, this application embodiment also provides a method for preparing a first isolation portion 320 and a second isolation portion 330 with different heights, the preparation method including:

[0447] S01': As Figure 63 As shown, a pixel definition material layer is prepared on substrate 100.

[0448] S20': As Figure 64 As shown, an initial raised portion 321a is prepared on the pixel definition material layer, and the initial raised portion 321a surrounds and forms a first opening 321b. The orthographic projection of a portion of the pixel opening 220 on the substrate 100a and the orthographic projection of the first opening 321b on the substrate 100a overlap at least partially.

[0449] S30': As Figure 65 As shown, a first isolation material layer and a second isolation material layer are sequentially prepared on the initial raised portion 321a and the pixel limiting portion 210. The first isolation material layer and the second isolation material layer are patterned so that the first isolation material layer and the second isolation material layer located on the initial raised portion 321a and thereon form the first isolation portion 320, and the first isolation material layer and the second isolation material layer on the pixel limiting portion 210 form the second isolation portion 330. Along the thickness direction Z of the display panel 10, the film thickness of the first isolation portion 320 is greater than the film thickness of the second isolation portion 330.

[0450] In these embodiments, the initial raised portion 321a is disposed in the region where the first isolation portion 320 is located. The initial raised portion 321a can also be disposed in other regions. Subsequently, the multilayer sub-layers of the isolation structure 300 are fabricated normally. During the fabrication process of the multilayer sub-layers of the isolation structure 300, etching may reduce the size of the initial raised portion 321a, thereby forming the raised portion 321. In the region with the raised portion 321, the height of the isolation structure 300 will be higher than the height of the isolation structure 300 without the raised portion 321.

[0451] In some possible implementations, this application also provides a display device, which includes the display panel 10 described in this application. The display device may include a device with image processing capabilities, such as a mobile phone, desktop computer, laptop computer, tablet computer, in-vehicle display, wearable device, etc. Since this display device includes the display panel 10 described in this application, it possesses the beneficial effects of the aforementioned display panel 10, which will not be elaborated further here.

[0452] In some possible implementations, this application also provides a device including the display panel 10 described in this application. This device may include an image processing device, such as a television, desktop computer, laptop computer, tablet computer, automotive display, wearable device, etc. Since this device includes the display panel 10 described in this application, it possesses the beneficial effects of the aforementioned display panel 10, which will not be elaborated further here.

[0453] Optionally, the display area AA of the device is greater than or equal to 35 inches, and / or the pixel density of the device is less than or equal to 100 pixels per inch, so that the device can achieve the purpose of large-size display.

[0454] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered to be within the scope of this specification. For example, in different drawings, at the position where the second sublayer 302 protrudes relative to the first sublayer 301 toward the isolation opening 310, some encapsulation portions 611 are drawn as a seal (e.g. Figure 17 That is, some of the first segments 611a and the second segments 611b are connected to each other to form a gap space 610d. Some of the encapsulation parts 611 are shown as unsealed (e.g. Figure 9 That is, the first segment 611a and the second segment 611b are set apart from each other. However, this closed or unclosed structure can be arbitrarily selected as needed, provided that it does not conflict with other design purposes.

[0455] The above embodiments merely illustrate several implementations of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims. Although this application has been described with reference to preferred embodiments, various modifications can be made and equivalent components can be replaced without departing from the scope of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area, and the display panel includes: A substrate, including a substrate and a driving unit disposed on the substrate; A first electrode layer is disposed on one side of the substrate and includes a plurality of spaced-apart first electrodes; A pixel definition layer is disposed on one side of the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The orthographic projection of the pixel opening on the substrate and the orthographic projection of the first electrode on the substrate at least partially overlap. An isolation structure is disposed on the side of the pixel definition layer away from the substrate and surrounds and forms a plurality of isolation openings. The isolation openings are connected to the corresponding pixel openings. The isolation structure includes a first sub-layer and a second sub-layer stacked in a direction away from the substrate. The second sub-layer protrudes toward the isolation openings relative to the first sub-layer. A light-emitting functional layer includes a plurality of light-emitting units at least partially located in the isolation opening, wherein at least a portion of the light-emitting units is located in the pixel opening; The second electrode layer includes a plurality of second electrodes located on the side of the light-emitting unit away from the substrate; The first encapsulation layer includes an encapsulation portion for encapsulating each of the light-emitting units, the encapsulation portion being located on the side of the second electrode opposite to the substrate; The distance between two adjacent isolation openings projected onto the substrate is the second width, and the width of the isolation opening projected onto the substrate is the third width, wherein the third width is greater than or equal to twice the second width and less than or equal to 125 times the second width.

2. The display panel according to claim 1, characterized in that, The second width is 3μm to 6μm, and the third width is greater than 6 times the second width and less than or equal to 125 times the second width; Alternatively, the second width is 7μm to 10μm, and the third width is greater than 3 times the second width and less than or equal to 69 times the second width; Alternatively, the second width is 11μm to 16μm, and the third width is greater than or equal to twice the second width and less than or equal to 47 times the second width.

3. The display panel according to claim 1, characterized in that, The light-emitting unit includes a light-emitting material layer or multiple light-emitting material layers stacked along the thickness direction of the display panel. The plurality of light-emitting units include light-emitting units with at least two different light-emitting colors, and the light-emitting material layers of the light-emitting units with at least two different light-emitting colors have different numbers of layers.

4. The display panel according to claim 3, characterized in that, The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit with different light-emitting colors, and the first light-emitting unit and the second light-emitting unit have different numbers of light-emitting material layers; The second electrode is electrically connected to the isolation structure, which includes a first isolation portion and a second isolation portion that are spaced apart and insulated from each other. The isolation opening includes a first isolation opening formed by the first isolation portion and a second isolation opening formed by the second isolation portion. The first light-emitting unit is located in the first isolation opening, and the second light-emitting unit is located in the second isolation opening.

5. The display panel according to claim 4, characterized in that, The plurality of light-emitting units also include a third light-emitting unit that emits a different color than the first light-emitting unit and the second light-emitting unit; The isolation structure further includes a third isolation portion, and the isolation structure includes a third isolation opening formed by the third isolation portion, wherein the third light-emitting unit is located in the third isolation opening; The third light-emitting unit has the same number of light-emitting material layers as the first light-emitting unit, and the third isolation part is connected to the first isolation part. Alternatively, the third light-emitting unit has the same number of light-emitting material layers as the second light-emitting unit, and the third isolation portion is connected to the second isolation portion. Alternatively, the number of light-emitting material layers in the third light-emitting unit may be different from those in the first and second light-emitting units, and the third isolation portion may be spaced apart from the first and second isolation portions.

6. The display panel according to claim 4, characterized in that, Multiple first light-emitting units are arranged sequentially along a second direction to form a first pixel column, and multiple second light-emitting units are arranged sequentially along the second direction to form a second pixel column, with the first pixel column and the second pixel column arranged alternately along a first direction; The first isolation portion encloses and forms a plurality of first isolation openings arranged sequentially along the second direction, and the second isolation portion encloses and forms a plurality of second isolation openings arranged sequentially along the second direction. The plurality of first isolation portions are electrically connected to each other, and the plurality of second isolation portions are electrically connected to each other.

7. The display panel according to claim 4, characterized in that, Along the thickness direction of the display panel, the minimum perpendicular distance between the surface of the second sub-layer facing the substrate and the surface of the second electrode facing away from the substrate is h1, and the film thickness of the encapsulation portion is h2. The minimum vertical distance h1 corresponding to each isolation opening and the film thickness h2 of the encapsulation part both satisfy the following condition: h1 > h2.

8. The display panel according to claim 7, characterized in that, The minimum perpendicular distance between the side surface of the second sublayer facing the substrate corresponding to the first isolation opening and the side surface of the second electrode away from the substrate is the same as the minimum perpendicular distance between the side surface of the second sublayer facing the substrate corresponding to the second isolation opening and the side surface of the second electrode away from the substrate.

9. The display panel according to claim 8, characterized in that, Along the thickness direction, the distance from the surface of the first isolation portion away from the substrate to the surface of the pixel definition layer is greater than the distance from the surface of the second isolation portion away from the substrate to the surface of the pixel definition layer.

10. The display panel according to claim 9, characterized in that, The first isolation portion includes a raised portion and a main isolation portion located on the side of the raised portion away from the substrate. The main isolation portion includes a first sublayer and a second sublayer. The orthographic projection of the side of the main isolation portion facing the substrate onto the substrate is located within the orthographic projection of the raised portion onto the substrate.

11. The display panel according to claim 9, characterized in that, The first isolation portion and the second isolation portion are spaced apart, and an isolation groove is formed between the first isolation portion and the second isolation portion. The isolation groove is arranged around the periphery of the first isolation portion, and the orthogonal projection of the isolation groove on the substrate is located within the orthogonal projection of the pixel limiting portion on the substrate.

12. The display panel according to claim 11, characterized in that, Both the first isolation portion and the second isolation portion are located on the side of the pixel limiting portion away from the substrate; The plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit. The size of the pixel-defining portion between the first light-emitting unit and the second light-emitting unit is D1, and the size of the pixel-defining portion between the second light-emitting unit and the third light-emitting unit is D2, wherein D1 ≥ D2.

13. The display panel according to claim 8, characterized in that, The encapsulation part includes a first encapsulation part for encapsulating the first light-emitting unit and a second encapsulation part for encapsulating the second light-emitting unit; The film thickness of the first encapsulation portion at the middle of the first light-emitting unit within the first isolation opening is equal to the film thickness of the second encapsulation portion at the middle of the second light-emitting unit within the second isolation opening.

14. The display panel according to claim 7, characterized in that, The minimum perpendicular distance between the surface of the second sublayer facing the substrate corresponding to the first isolation opening and the surface of the second electrode away from the substrate is h11, and the minimum perpendicular distance between the surface of the second sublayer facing the substrate corresponding to the second isolation opening and the surface of the second electrode away from the substrate is h12, where h11 < h12.

15. The display panel according to claim 14, characterized in that, The encapsulation part includes a first encapsulation part for encapsulating the first light-emitting unit and a second encapsulation part for encapsulating the second light-emitting unit; Along the thickness direction, the film thickness of the first encapsulation portion at the middle of the first light-emitting unit within the first isolation opening is less than the film thickness of the second encapsulation portion at the middle of the second light-emitting unit within the second isolation opening. And / or, the membrane thickness of the isolation structure around the first isolation opening is the same as the membrane thickness of the isolation structure around the second isolation opening.

16. The display panel according to claim 7, characterized in that, In at least a portion of the isolation opening, the film thickness h2 of the encapsulation portion and the minimum vertical distance h1 satisfy the following condition: 1.8*h2≤h1≤2.2*h2; And / or, in at least a portion of the isolation opening, the surface of the encapsulation portion facing away from the light-emitting unit overlaps with the surface of the encapsulation portion facing away from the first sub-layer.

17. The display panel according to claim 16, characterized in that, The encapsulation portion includes a first segment located within the isolation opening and a second segment extending from the first segment to the side of the isolation structure opposite to the substrate, wherein the second segment has a gap with the isolation structure; The plurality of encapsulation portions include a first encapsulation portion for encapsulating the first light-emitting unit and a second encapsulation portion for encapsulating the second light-emitting unit. Along the thickness direction of the display panel, the first gap dimension between the second segment of the first encapsulation portion and the isolation structure is greater than the second gap dimension between the second segment of the second encapsulation portion and the isolation structure.

18. The display panel according to claim 3, characterized in that, Multiple light-emitting units include a first light-emitting unit and a second light-emitting unit with different light-emitting colors, wherein the number of light-emitting material layers in the first light-emitting unit is greater than the number of light-emitting material layers in the second light-emitting unit; The driving unit includes a driving transistor, and the plurality of driving units include a first driving unit for driving the first light-emitting unit and a second driving unit for driving the second light-emitting unit. The number of driving transistors in the first driving unit is less than the number of driving transistors in the second driving unit, or the channel width of the driving transistors in the first driving unit is less than the channel width of the driving transistors in the second driving unit.

19. The display panel according to claim 1, characterized in that, The first sublayer is made of copper and includes a first side surface facing the isolation opening. The first side surface is either a plane or a smoothly transitioned curved surface. A plurality of spaced-apart covers are provided on the first side surface facing at least one of the isolation openings. The cover is made of copper oxide.

20. The display panel according to claim 1, characterized in that, The material of the first sublayer includes aluminum, and the first sublayer includes a first side surface facing the isolation opening. The first side surface includes a first sub-face and a second sub-face that are connected in succession in a direction away from the substrate, and the first sub-face and the second sub-face are intersecting.

21. The display panel according to claim 20, characterized in that, There is a second included angle between the extended surface of the first sub-surface and the plane where the substrate is located, and there is a third included angle between the extended surface of the second sub-surface and the plane where the substrate is located, wherein the second included angle is smaller than the third included angle.

22. The display panel according to claim 21, characterized in that, The difference between the third included angle and the second included angle is 2° to 20°.

23. The display panel according to claim 1, characterized in that, The first sublayer includes a first side surface facing the isolation opening, the material of the first sublayer includes copper, and there is a first included angle between the first side surface and the plane where the substrate is located, the first included angle being 40° to 85°.

24. The display panel according to claim 1, characterized in that, The second sub-layer protrudes a first distance from the first sub-layer toward the isolation opening. The plurality of light-emitting units include first and second light-emitting units with different emitting colors. The isolation opening includes a first isolation opening for accommodating the first light-emitting unit and a second isolation opening for accommodating the second light-emitting unit. The material of the first sublayer includes copper, and the first distance corresponding to the first isolation opening and the first distance L corresponding to the second isolation opening are equal; Alternatively, the material of the first sublayer may include aluminum, and the first distance corresponding to the first isolation opening and the first distance L corresponding to the second isolation opening may be different.

25. The display panel according to claim 24, characterized in that, The material of the first sublayer includes copper, and the first distance ranges from 0.8 μm to 1.6 μm; and / or, the first sublayer has a first height h, and the ratio of the first distance L to the first height h ranges from 0.75 to 2.

26. The display panel according to claim 24, characterized in that, The material of the first sublayer includes aluminum, and the first distance ranges from 0.7 μm to 1.1 μm; and / or, the first sublayer has a first height h, and the ratio of the first distance L to the first height h ranges from 0.8 to 1.

3.

27. The display panel according to claim 1, characterized in that, The material of the first sublayer includes copper. The light-emitting unit and the first sub-layer are in contact connection; Alternatively, the isolation structure may further include a third sublayer located on the side of the first sublayer facing the substrate, the third sublayer protruding toward the isolation opening, the light-emitting unit being in contact with the third sublayer, and the light-emitting unit being spaced apart from the first sublayer.

28. The display panel according to claim 1, characterized in that, The isolation structure further includes a third sub-layer, which is located on the side of the first sub-layer facing the substrate, and the third sub-layer protrudes relative to the first sub-layer facing the isolation opening; The second electrode includes a main body and a contact portion that surrounds the main body in a closed ring shape, and the contact portion is in contact with the third sublayer.

29. The display panel according to claim 1, characterized in that, The width of the pixel opening projected onto the substrate is a first width, which is greater than the second width and less than or equal to 124 times the second width.

30. The display panel according to claim 29, characterized in that, The second width is 3μm to 6μm, and the first width is greater than 5 times the second width and less than or equal to 124 times the second width; Alternatively, the second width is 7μm to 10μm, and the first width is greater than twice the second width and less than or equal to 68 times the second width; Alternatively, the second width is 11μm to 16μm, and the first width is greater than the second width and less than or equal to 47 times the second width.

31. The display panel according to claim 1, characterized in that, The plurality of isolation openings are distributed at intervals along a first direction and a second direction, wherein the width 'a' of the isolation opening in the first direction ranges from 20 μm to 650 μm; and / or, the length 'b' of the isolation opening in the second direction ranges from 100 μm to 1300 μm.

32. The display panel according to claim 1, characterized in that, The display panel further includes a planarization layer, which is located on the side of the driving unit away from the substrate and includes a first through hole; The driving unit and the first electrode are electrically connected via the first through hole to drive the light-emitting unit to emit light, and the driving unit connected to the first electrode includes two or more driving transistors.

33. The display panel according to claim 32, characterized in that, The driving unit includes a pixel driving circuit, and the pixel driving circuit includes two or more driving transistors, with the two or more driving transistors of the pixel driving circuit connected to the same first electrode connected in parallel.

34. The display panel according to claim 33, characterized in that, Two or more driving transistors connected to the same first electrode are electrically connected to the first electrode via the same first through-hole.

35. The display panel according to claim 32, characterized in that, The driving unit includes two or more pixel driving circuits, each pixel driving circuit includes one driving transistor, and the driving transistors of the two or more pixel driving circuits are connected to the same first electrode.

36. The display panel according to claim 35, characterized in that, The driving transistors of two or more pixel driving circuits are connected to the same first electrode via the same first through-hole; Alternatively, the first electrode may be provided with two or more first connecting holes, and the orthographic projections of the two or more first connecting holes corresponding to the same first electrode on the substrate are distributed at intervals around the orthographic projection of the first electrode on the substrate. Two or more pixel driving circuits connected to the same first electrode and the first connecting holes are provided in a one-to-one correspondence.

37. The display panel according to claim 32, characterized in that, The first electrode includes two or more sub-electrodes, the driving unit includes two or more pixel driving circuits, each pixel driving circuit includes one driving transistor, the sub-electrodes and the pixel driving circuits are arranged in a one-to-one correspondence, each sub-electrode is provided with a first connecting hole, and the driving transistor of each pixel driving circuit is electrically connected to the sub-electrode through the first connecting hole.

38. The display panel according to claim 37, characterized in that, The first electrode includes two sub-electrodes, the two sub-electrodes of the same first electrode are spaced apart along a second direction, and the two first connecting holes corresponding to the two sub-electrodes of the same first electrode are located on the side opposite to each other in the second direction.

39. The display panel according to claim 37, characterized in that, The substrate further includes a first signal line extending along a first direction and a second signal line extending along a second direction, and a plurality of pixel driving circuits connected to a plurality of sub-electrodes of the same first electrode are connected to the same first signal line and the same second signal line; The first signal line includes at least one of a scan signal line and a light emission control signal line, and the second signal line includes a data signal line.

40. The display panel according to claim 37, characterized in that, The light-emitting unit includes two or more sub-light-emitting units, and the sub-light-emitting units and the sub-electrodes are arranged in a one-to-one correspondence. The pixel opening includes two or more first sub-openings, and at least a portion of the sub-light-emitting units is located in the first sub-opening. The isolation opening includes two or more second sub-openings, and each sub-light-emitting unit is located in each second sub-opening. Alternatively, the pixel opening may include two or more first sub-openings, with each first sub-opening and the sub-electrode corresponding to one another. The two or more first sub-openings may correspond to the same isolation opening, and at least a portion of the light-emitting unit within the same isolation opening may be located in two or more first sub-openings.

41. The display panel according to claim 1, characterized in that, Also includes: The first encapsulation layer includes a first encapsulation sublayer and a second encapsulation sublayer, the second encapsulation sublayer being located on the side of the first encapsulation sublayer facing away from the substrate, and the encapsulation portion includes a first encapsulation portion located in the first encapsulation sublayer. The density of the second encapsulation sublayer is greater than that of the first encapsulation sublayer.

42. The display panel according to claim 41, characterized in that, The second encapsulation layer is located on the side of the first encapsulation layer away from the substrate, and the material of the second encapsulation layer includes organic materials; A third encapsulation layer is located on the side of the second encapsulation layer opposite to the substrate, and the material of the third encapsulation layer includes inorganic materials. Wherein, the orthographic projection of the second encapsulation layer onto the substrate lies within the orthographic projection of the second encapsulation sublayer onto the substrate.

43. The display panel according to claim 42, characterized in that, The second encapsulation sublayer and the third encapsulation layer are in contact with each other, and the orthographic projection of the second encapsulation sublayer on the substrate is located within the orthographic projection of the third encapsulation layer on the substrate.

44. The display panel according to claim 42, characterized in that, The second encapsulation layer has a first thickness in the display area, and the second encapsulation layer has a second thickness at the edge away from the display area, wherein the ratio of the second thickness to the first thickness is less than or equal to 0.

4.

45. The display panel according to claim 42, characterized in that, The non-display area surrounds at least a portion of the display area, or the non-display area is arranged around a light-transmitting hole, and the display panel further includes: A dam is located in the non-display area, and the second encapsulation layer is located on the side of the dam facing the display area; The embankment is arranged around the isolation structure, or the boundary of the isolation structure is at least partially located on the embankment, or the boundary of the isolation structure is located outside the area enclosed by the embankment.

46. ​​The display panel according to claim 45, characterized in that, The second encapsulation layer and the dam are spaced apart; or, the boundary of the second encapsulation layer is located on the sidewall of the dam facing the display area.

47. The display panel according to claim 45, characterized in that, The second encapsulation sublayer covers the sidewall of the isolation structure facing the dam.

48. The display panel according to claim 41, characterized in that, The second encapsulation sublayer is disposed as a whole, and the orthographic projections of multiple first encapsulation sub-parts on the substrate are located within the orthographic projection of the same second encapsulation sublayer on the substrate; Alternatively, the encapsulation portion may include a second encapsulation sub-portion located on the second encapsulation sub-layer, the second encapsulation sub-portion located on the side of the first encapsulation sub-portion facing away from the substrate, a plurality of second encapsulation sub-portions being spaced apart, and the orthographic projection of the first encapsulation sub-portion onto the substrate being located within the orthographic projection of the second encapsulation sub-portion onto the substrate.

49. The display panel according to claim 41, characterized in that, The first encapsulation layer further includes a third encapsulation sublayer, which is located on the side of the second encapsulation sublayer facing away from the substrate, and the density of the second encapsulation sublayer is greater than that of the third encapsulation sublayer.

50. The display panel according to claim 49, characterized in that, On the same cross section extending along the thickness direction of the display panel, the thickness of the first encapsulation sub-layer is greater than the thickness of the second encapsulation sub-layer, and the thickness of the third encapsulation sub-layer is greater than the thickness of the second encapsulation sub-layer.

51. The display panel according to claim 49, characterized in that, The refractive index of the first encapsulation sublayer is greater than that of the second encapsulation sublayer, and the refractive index of the second encapsulation sublayer is greater than that of the third encapsulation sublayer.

52. The display panel according to claim 41, characterized in that, The display panel also includes: A protective cover is located on the side of the first encapsulation layer opposite to the substrate. The protective cover and the substrate are disposed opposite to each other, and a sealing structure is provided between the protective cover and the substrate.

53. The display panel according to claim 52, characterized in that, The protective cover, the substrate, and the sealing structure enclose a sealed space, and the light-emitting unit and the isolation structure are both located within the sealed space, which is filled with inert gas.

54. The display panel according to claim 52, characterized in that, The display panel also includes: The second encapsulation layer is located on the side of the first encapsulation layer away from the substrate, and the material of the second encapsulation layer includes organic materials; The third encapsulation layer is located on the side of the second encapsulation layer away from the substrate. The material of the third encapsulation layer includes inorganic materials. The protective cover is located on the side of the third encapsulation layer away from the substrate.

55. The display panel according to claim 54, characterized in that, The non-display area includes side borders located on both sides of the display area in a first direction and a bottom border located on one side of the display area in a second direction; Within the side bezel, the sealing structure is located on the side of the second encapsulation sublayer or the third encapsulation layer away from the display area; The display panel also includes a power signal line located at least partially within the lower bezel, wherein the orthographic projection of the sealing structure onto the substrate and the power signal line at least partially overlap within the lower bezel.

56. The display panel according to claim 54, characterized in that, The orthographic projection of the second encapsulation layer onto the substrate lies within the orthographic projection of the protective cover onto the substrate; And / or, the orthographic projection of the third encapsulation layer onto the substrate lies within the orthographic projection of the protective cover onto the substrate.

57. The display panel according to claim 52, characterized in that, The display panel also includes a polarizer located between the substrate and the protective cover plate. The sidewall of the polarizer is recessed relative to the substrate and the protective cover plate to form a recessed space, and the recessed space is filled with a water- and oxygen-resistant structure.

58. The display panel according to claim 41, characterized in that, On the same cross section extending along the thickness direction of the display panel, the thickness of the second encapsulation sub-layer is less than the thickness of the first encapsulation sub-layer, and the ratio of the thickness of the second encapsulation sub-layer to the thickness of the first encapsulation sub-layer is less than or equal to 0.

1.

59. The display panel according to claim 1, characterized in that, The substrate includes a substrate and a driving circuit layer disposed on one side of the substrate, the driving circuit layer including a plurality of conductive layers; Wherein, at least one of the plurality of conductive layers and at least one of the first electrode layers includes a conductive portion, the isolation structure is connected to the conductive portion through a first via, and the second electrode, the isolation structure and the conductive portion are electrically connected to each other.

60. The display panel according to claim 59, characterized in that, The second sublayer is recessed in the direction of the substrate away from the substrate to form a second recess, and the orthogonal projection of the second recess on the substrate at least partially overlaps with the orthogonal projection of the first via on the substrate.

61. The display panel according to claim 60, characterized in that, The isolation structure further includes a third sub-layer, which is located on the side of the first sub-layer facing the substrate, and the third sub-layer protrudes relative to the first sub-layer facing the isolation opening, and the second electrode overlaps with the third sub-layer; The third sublayer is recessed in the direction of the substrate from the surface opposite to the substrate to form a third recess. The orthographic projection of the third recess on the substrate and the orthographic projection of the first via on the substrate at least partially overlap. The third sublayer includes an overlapping portion and a connecting portion connected to each other. The overlapping portion is located on one side of the substrate, and at least a portion of the connecting portion is located in the first via and contacts the conductive portion.

62. The display panel according to claim 61, characterized in that, A portion of the first sublayer is located on the side of the overlapping portion away from the substrate, and another portion of the first sublayer is located in the third recess. The surface of the first sublayer away from the substrate is recessed in the direction toward the substrate to form the first recess. The orthographic projection of the first recess onto the substrate is located within the orthographic projection of the third recess onto the substrate. A portion of the second sublayer is located on the side of the overlap that is away from the substrate, and another portion of the second sublayer is located within the first recess. The orthographic projection of the second recess onto the substrate is located within the orthographic projection of the first recess onto the substrate.

63. The display panel according to claim 60, characterized in that, The encapsulation portion covers the sidewall of the isolation structure facing the isolation opening and extends to the side of the isolation structure away from the substrate, with a portion of the encapsulation portion located within the second recess.

64. The display panel according to claim 63, characterized in that, There is a break between adjacent encapsulation portions, and the orthographic projection of the break on the second sub-layer is offset from the second recess.

65. The display panel according to claim 59, characterized in that, The first via and at least a portion of the conductive portion are both located in the display area; The conductive part includes a first conductive sub-part, and the isolation structure is connected to the first conductive sub-part through at least two first through holes.

66. The display panel according to claim 65, characterized in that, The conductive part includes a plurality of first conductive sub-parts, which are spaced apart from each other. And / or, the conductive portion includes a plurality of first conductive sub-parts, the plurality of first conductive sub-parts being interconnected, and the plurality of first conductive sub-parts forming a grid shape on the orthogonal projection of the substrate.

67. The display panel according to claim 65, characterized in that... The conductive portion also extends to the non-display area, and the conductive portion includes a second conductive sub-portion located in the non-display area, wherein the first conductive sub-portion and the second conductive sub-portion are connected.

68. The display panel according to claim 65, characterized in that, The first electrode layer includes the conductive portion, the first via includes a first connection opening penetrating the pixel defining portion, and the isolation structure is connected to the conductive portion through the first connection opening.

69. The display panel according to claim 65, characterized in that, The conductive portion includes a plurality of first conductive sub-parts, and the plurality of first conductive sub-parts are located in at least two of the plurality of conductive layers. The isolation structure is electrically connected to the first conductive sub-parts located in different conductive layers through different first vias, or to the first conductive sub-parts located in different conductive layers. The isolation structure is also electrically connected to the first conductive sub-parts in at least two of the plurality of conductive layers that are closest to the isolation structure through the first vias.

70. The display panel according to claim 59, characterized in that... The isolation structure is connected to the conductive portion through at least two first vias. The first electrode layer includes the conductive portion. The first via includes a first connection opening that penetrates the pixel defining portion. The isolation structure is connected to the conductive portion through the first connection opening.

71. The display panel according to claim 59, characterized in that, The first electrode is electrically connected to the output terminal of the driving unit via a second via. The first via includes a first connection opening penetrating the pixel defining portion, and the first connection opening and the second via are spaced apart. The plurality of conductive layers include a first conductive layer, the output terminal of the driving unit is located on the first conductive layer, or the output terminal of the driving unit is located on the side of the first conductive layer facing the substrate, or the output terminal of the driving unit is located on the side of the first conductive layer away from the substrate.

72. The display panel according to claim 71, characterized in that, The area of ​​the first via projected onto the substrate is S1, and the area of ​​the second via projected onto the substrate is S2, where S1 > S2.

73. The display panel according to claim 71, characterized in that, The substrate includes a planarization layer located on the side of the output terminal of the driving unit facing away from the substrate. The planarization layer is adjacent to the pixel definition layer. The first via includes a first connection opening penetrating the pixel definition portion and a second connection opening penetrating the planarization layer. A portion of the isolation structure contacts the conductive portion in sequence through the first connection opening and the second connection opening. The orthographic projection of the second connection opening on the substrate is located within the orthographic projection of the first connection opening on the substrate; Alternatively, the pixel defining portion extends from one side of the planarization layer into the second connection opening and contacts the conductive portion, wherein the orthographic projection of the first connection opening on the substrate is located within the orthographic projection of the second connection opening on the substrate.

74. The display panel according to claim 73, characterized in that, The conductive part includes a plurality of first conductive sub-parts, and the plurality of light-emitting units are arranged in rows along a first direction and a second direction. The first direction is the row direction and the second direction is the column direction. The first conductive sub-parts are correspondingly disposed on two adjacent columns of light-emitting units and extend along the second direction. The plurality of first conductive sub-parts are spaced apart along the first direction.

75. The display panel according to claim 59, characterized in that, The first electrode layer includes a signal transfer portion located in the non-display area. The isolation structure extends from the display area to the non-display area and is electrically connected to the signal transfer portion. The signal transfer portion is also electrically connected to a power signal line. The isolation structure is electrically connected to the signal transfer portion through a third via that penetrates the pixel defining portion and is located in the non-display area.

76. The display panel according to claim 75, characterized in that, The orthogonal projection of the third via on the substrate surrounds at least a portion of the display area.

77. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 76.

78. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 76.

79. The device according to claim 78, characterized in that, The display area of ​​the device is greater than or equal to 32 inches; and / or the pixel density of the device is less than or equal to 100 pixels per inch.

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