Display panel, display device and display apparatus

Abstract

The application discloses a display panel, a display device and a display equipment. The display panel comprises a substrate, an isolation structure, a first encapsulation layer and a plurality of light-emitting units. The isolation structure is located on one side of the substrate, and the isolation structure is enclosed to form a plurality of isolated openings. The light-emitting units are arranged on one side of the substrate, and at least part of the light-emitting units is located in the corresponding isolated opening. Each light-emitting unit comprises a layer of light-emitting material layer or a plurality of layers of light-emitting material layers arranged in the thickness direction of the display panel. The first encapsulation layer comprises a plurality of encapsulation parts for encapsulating each light-emitting unit. The encapsulation part extends from the corresponding isolated opening to the side of the isolation structure away from the substrate. The plurality of light-emitting units comprises at least two light-emitting units of different light-emitting colors, and the number of the light-emitting material layers of the at least two light-emitting units of different light-emitting colors is different. The application can improve the use performance of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, display device, and display equipment. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant content of fine metal mask-less technology and are provided for reference.

[0004] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0005] This application provides a display panel, display device, and display equipment, aiming to improve the performance of OLED display products.

[0006] A first aspect of this application provides a display panel, which includes a substrate, an isolation structure, a first encapsulation layer, and a plurality of light-emitting units. The isolation structure is located on one side of the substrate and forms a plurality of isolation openings. The light-emitting units are disposed on one side of the substrate, with at least a portion of each light-emitting unit located in a corresponding isolation opening. Each light-emitting unit includes a single light-emitting material layer or multiple light-emitting material layers stacked along the thickness direction of the display panel. The first encapsulation layer includes a plurality of encapsulation portions for encapsulating each light-emitting unit, with the encapsulation portions extending from the corresponding isolation openings to the side of the isolation structure away from the substrate. The plurality of light-emitting units include light-emitting units of at least two different light-emitting colors, and the number of light-emitting material layers of the at least two different light-emitting colors is different.

[0007] An embodiment of the second aspect of this application provides a display device, which includes the display panel provided in any of the first aspect embodiments described above.

[0008] An embodiment of the third aspect of this application provides a display device, which includes the display panel provided in any of the first aspect embodiments described above.

[0009] According to an embodiment of the third aspect of this application, the size of the display device is greater than or equal to 32 inches; and / or, the pixel density of the display device is less than or equal to 100 pixels per inch.

[0010] According to the display panel of this application embodiment, by reasonably setting the number of light-emitting material layers of different color light-emitting units, the light-emitting characteristics of the light-emitting materials of different color OLEDs can be specifically adjusted and optimized. For example, for colors with short lifespans and rapid decay, appropriately increasing the number of stacked light-emitting material layers can, to a certain extent, compensate for the brightness decay caused by the short lifespan, making the decay degree of the light-emitting materials of different color OLEDs tend to be consistent during long-term use. This effectively prevents problems such as color shift, screen burn-in, or uneven brightness caused by excessive decay of a certain color, thereby improving the lifespan and performance of the display panel. Attached Figure Description

[0011] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0012] Figure 1 This is a top view of a display panel provided in an embodiment of this application;

[0013] Figure 2 This is one of the cross-sectional structural schematic diagrams of a display panel provided in the embodiments of this application;

[0014] Figure 3 This is a schematic cross-sectional view of an array substrate in a display panel provided in an embodiment of this application;

[0015] Figure 4 This is a schematic diagram of the structure of a pixel driving circuit in a display panel provided in an embodiment of this application;

[0016] Figure 5 This is a second schematic cross-sectional view of a display panel provided in an embodiment of this application;

[0017] Figure 6 This is the third cross-sectional structural schematic diagram of a display panel provided in the embodiments of this application;

[0018] Figure 7 This is a top view schematic diagram of the isolation structure and isolation opening in a display panel provided in an embodiment of this application;

[0019] Figure 8 yes Figure 7 One of the schematic diagrams of the cross-sectional structure at point AA in the middle;

[0020] Figure 9 yes Figure 7 Schematic diagram of the cross-sectional structure at point AA (Part 2);

[0021] Figure 10 yes Figure 7 Schematic diagram of the cross-sectional structure at point AA (part 3);

[0022] Figures 11a to 11c This is a diagram showing the structural changes during the fabrication of an isolation structure with different film thicknesses, as provided in the embodiments of this application.

[0023] Figure 12 This is the fourth cross-sectional structural schematic diagram of a display panel provided in the embodiments of this application;

[0024] Figure 13 This is the fifth cross-sectional structural schematic diagram of a display panel provided in the embodiments of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] AA, Display area; SPX1, First sub-pixel; SPX2, Second sub-pixel; SPX3, Third sub-pixel;

[0027] 100. Substrate; 111. Pixel driving circuit; T1. Driving transistor; T2. Switching transistor; 120. Planarization layer;

[0028] 200, Pixel definition layer; 201, First definition layer; 202, Second definition layer; 210, Pixel limiting part; 220, Pixel opening; 221, First pixel opening; 222, Second pixel opening; 223, Third pixel opening; 230, Light-emitting unit; 231, First light-emitting unit; 232, Second light-emitting unit; 233, Third light-emitting unit; EML, Light-emitting material layer;

[0029] 300, Isolation structure; 301, First sub-layer; 302, Second sub-layer; 303, Third sub-layer; 310, Isolation opening; 311, First isolation opening; 312, Second isolation opening; 313, Third isolation opening; 320, First isolation section; 321, Elevated section; 321a, Initial elevated section; 321b, First opening; 322, Main isolation section; 330, Second isolation section; 340, Isolation groove;

[0030] 410. First electrode;

[0031] 510. Second electrode; 511. Main body; 512. Contact part;

[0032] 610, First encapsulation layer; 611, Encapsulation portion; 611a, First segment; 611b, Second segment; 612a, First encapsulation portion; 612b, Second encapsulation portion; 612c, Third encapsulation portion; 613, First gap; 614, Second gap; 620, Second encapsulation layer; 630, Third encapsulation layer;

[0033] X, the first direction; Y, the second direction. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0036] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0037] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0038] For certain elements, terms like "above" or "overhead" are sometimes used when describing the position of an element in the Z direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "overhead," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0039] This application provides a display panel, a display device, and a display apparatus. The embodiments of the display panel, display device, and display apparatus will be described below with reference to the accompanying drawings.

[0040] Figure 1 This is a schematic diagram of a display panel according to one embodiment of this application. The display panel can be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. The display panel includes a display area AA with display function and a non-display area NA.

[0041] The display area AA of the display panel can be rectangular, square, circular, oval, or other shapes.

[0042] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. Each pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, a pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel, and the third sub-pixel SPX3 is a red sub-pixel. In some embodiments, in addition to sub-pixels SPX1, SPX2, and SPX3, a pixel PX also includes sub-pixels SPX that emit white or other colors of light.

[0043] Sub-pixels (SPX) include pixel driving circuits 111 and light-emitting devices driven by pixel driving circuits 111 to emit light of a corresponding color. First sub-pixel SPX1 includes a first light-emitting device, second sub-pixel SPX2 includes a second light-emitting device, and third sub-pixel SPX3 includes a third light-emitting device. One pixel driving circuit 111 drives at least one light-emitting device to emit light. For example, display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is a display area set according to a corresponding sensor and has light-transmitting properties, while the normal display area is a display area not set according to a corresponding sensor. In the normal display area, one pixel driving circuit 111 drives one light-emitting device to emit light, and in the light-transmitting display area, one pixel driving circuit 111 drives one or more light-emitting devices to emit light.

[0044] Optionally, the first light-emitting device, the second light-emitting device, and the third light-emitting device can be used to emit light of different colors respectively. Each of the first light-emitting device, the second light-emitting device, and the third light-emitting device includes a first electrode, a light-emitting unit, and a second electrode stacked together.

[0045] like Figures 2 to 4 As shown, the display panel provided in the first aspect embodiment of this application includes a substrate 100, an isolation structure 300, a first encapsulation layer 610, and a plurality of light-emitting units 230; the isolation structure 300 is located on one side of the substrate 100, and the isolation structure 300 encloses to form a plurality of isolation openings 310; the light-emitting units 230 are disposed on one side of the substrate 100, and at least a portion of the light-emitting units 230 is located in the corresponding isolation opening 310, each light-emitting unit 230 including a single light-emitting material layer EML or multiple layers of light-emitting material layers EML stacked along the thickness direction of the display panel; the first encapsulation layer 610 includes a plurality of encapsulation portions 611 for encapsulating each light-emitting unit 230, the encapsulation portions 611 extending from the corresponding isolation opening 310 to the side of the isolation structure 300 away from the substrate 100; wherein, the plurality of light-emitting units 230 include at least two different light-emitting units 230, and the number of light-emitting material layers EML of the at least two different light-emitting units 230 is different.

[0046] At least two different colored light-emitting units 230 have different numbers of light-emitting material layers (EMLs). This can be understood as the light-emitting unit 230 having a single or multiple EMLs, resulting in two types of light-emitting units 230 with different numbers of EMLs. Multiple EMLs include two or more layers of light-emitting material layers. Light-emitting units 230 with two or more EMLs can also be called tandem light-emitting units, which are formed by stacking and connecting multiple individual EMLs in series using one or more charge-generating layers. Tandem light-emitting units can contain two, three, or more EMLs. Through tandem technology, the efficiency of the light-emitting unit 230 can be further improved, which is beneficial for achieving high brightness display in OLED panels and also for extending the lifespan of OLED display panels.

[0047] For example, the light-emitting material layer EML of one color light-emitting unit 230 is a single layer, and the light-emitting material layer EML of another color light-emitting unit 230 is a double layer.

[0048] For example, the light-emitting unit 230 of one color has a double-layer light-emitting material layer EML, and the light-emitting unit 230 of another color has a triple-layer light-emitting material layer EML.

[0049] In the display panel provided in this application embodiment, the luminous characteristics of the luminous materials of different color OLEDs can be specifically adjusted and optimized by reasonably setting the number of luminous material layers (EML) of the different color luminous units 230. For example, for colors with short lifespans and rapid decay, appropriately increasing the number of EML stacks can compensate for the brightness decay caused by the short lifespan to a certain extent, making the decay degree of the luminous materials of different color OLEDs tend to be consistent during long-term use. This effectively prevents problems such as color shift, screen burn-in, or uneven brightness caused by excessive decay of a certain color, thereby improving the lifespan and performance of the display panel.

[0050] In addition, for light-emitting units 230 with low luminous efficiency, multiple layers of light-emitting material EML can be provided to improve their luminous efficiency and, at the same driving voltage, their service life is also correspondingly improved.

[0051] Optionally, the isolation structure 300 may be in the form of a grid to facilitate the division of sub-pixels in the display panel. The grid-like area enclosed within the grid-like isolation structure 300 may be the isolation opening 310 and its corresponding light-emitting unit 230.

[0052] The isolation structure 300 can isolate the light-emitting material layer (EML) and the second electrode 510 between adjacent sub-pixels during the vapor deposition of the light-emitting material and electrode materials of the display panel. This facilitates the formation of multiple spaced-apart light-emitting units 230 and second electrodes 510 within the isolation opening 310. Consequently, a high-precision photomask is not required when vapor-depositing the light-emitting units 230 and second electrodes 510 of the display panel, reducing the manufacturing cost of the display panel. The isolation opening 310 provides a relatively independent space for the light-emitting units 230, reducing mutual interference between different light-emitting units 230. This improves the luminous efficiency and luminous quality of each light-emitting unit 230, resulting in a clearer and more vibrant image on the display panel.

[0053] Multiple encapsulation portions 611 of the first encapsulation layer 610 extend from the corresponding isolation openings 310 to the side of the isolation structure 300 facing away from the substrate 100. The encapsulation portions 611 cover the sidewall of the isolation structure 300 facing the isolation openings 310 and extend to the side of the isolation structure 300 facing away from the array substrate 100. That is, the encapsulation portions 611 not only cover the isolation openings 310, but also cover a portion of the isolation structure 300 surrounding the isolation openings 310, thus expanding the distribution area of ​​the encapsulation portions 611 and improving their encapsulation effect. Each encapsulation portion 611 can provide encapsulation protection to its corresponding light-emitting device, achieving independent encapsulation. This encapsulation structure can more comprehensively and tightly encapsulate each light-emitting unit 230, effectively preventing external moisture and oxygen from intruding into the light-emitting unit 230, improving the yield of the light-emitting device affected by moisture and oxygen intrusion, and extending the service life of the display panel.

[0054] In related technologies, televisions (TVs) are typically large in size and have a longer lifespan compared to other smaller products such as mobile phones and monitors. Different colors of OLED materials have different lifespans, so as the product's operating time increases, a certain color will decay significantly, leading to color shift, screen burn-in, or uneven brightness, resulting in reliable color shift issues.

[0055] Compared to related technologies, the embodiments of this application can be applied to television sets. By changing the number of EML layers in OLEDs of different colors, the product lifespan is extended and reliable color shift is prevented. By setting the isolation structure 300 and the encapsulation part 611, the luminous efficiency and luminous quality of each light-emitting unit 230 can be improved, and the yield of light-emitting devices affected by water and oxygen intrusion can be improved, thus extending the service life of the television set.

[0056] Optionally, at least one light-emitting unit 230 includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the substrate 100 (thickness direction Z). The light-emitting unit 230 may include a single light-emitting material layer EML, or a stacked light-emitting structure including multiple light-emitting material layers EML.

[0057] There are multiple, selectable ways to set up the substrate 100, such as... Figure 3 and Figure 4 As shown, the substrate 100 also includes a substrate and a pixel driving circuit 111. For example, the substrate 100 includes a substrate and a driving circuit layer and a planarization layer 120 disposed on the substrate. The pixel driving circuit 111 includes a transistor and a capacitor. The capacitor includes a first electrode and a second electrode. The transistor includes a source, a drain, a gate, and a semiconductor layer. The driving circuit layer also includes multiple signal lines, such as data signal lines, scan signal lines, and driving power supply voltage signal lines. The driving circuit layer includes multiple conductive layers, including a first conductive layer, a second conductive layer, and a third conductive layer. The gate and the first electrode may be located on the first conductive layer, the second electrode may be located on the second conductive layer, and the source and drain may be located on the third conductive layer. In addition, the substrate 100 also includes scan lines that provide a scan signal Scan and data lines that provide a data signal Data to the pixel driving circuit 111.

[0058] Optional, refer to Figure 4 The pixel driving circuit 111 includes a driving transistor T1 and a switching transistor T2. The source of the switching transistor T2 is connected to the data line that provides the data signal Data, the gate of the switching transistor T2 is connected to the scan line that provides the scan signal Scan, and the drain of the switching transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting device. Figure 4 This is one embodiment of the pixel driving circuit 111, but the pixel driving circuit 111 of this application is not limited to... Figure 4 The pixel driving circuit 111 of 2T1C shown can also be other pixel driving circuits 111, such as 7T1C, 8T1C pixel driving circuits 111, etc.

[0059] According to an embodiment of the first aspect of this application, the plurality of light-emitting units 230 include a first light-emitting unit 231 and a second light-emitting unit 232. The lifespan of the light-emitting material layer EML of the first light-emitting unit 231 is shorter than the lifespan of the light-emitting material layer EML of the second light-emitting unit 232, and the number of light-emitting material layers EML of the first light-emitting unit 231 is greater than the number of light-emitting material layers EML of the second light-emitting unit 232.

[0060] Optionally, the first light-emitting unit 231 can be any one of red, blue or green light-emitting units 230, and the second light-emitting unit 232 can be any one of red, blue or green light-emitting units 230 except for the first light-emitting unit 231.

[0061] In these embodiments, the lifespan of the light-emitting material layer (EML) of different color light-emitting units 230 varies. In this solution, the lifespan of the EML of the first light-emitting unit 231 is shorter than that of the second light-emitting unit 232. With conventional settings, the first light-emitting unit 231 will decay faster over time, leading to uneven emission of different colors and causing reliable color shift problems such as color cast, screen burn-in, or uneven brightness, thus shortening the lifespan of the display panel. By setting the number of EMLs of the first light-emitting unit 231 to be greater than that of the second light-emitting unit 232, the overall brightness and stability of the first light-emitting unit 231 can be improved, increasing its lifespan. This ensures that the decay rates of the first and second light-emitting units 231 and 232 become similar during long-term use, maintaining a relative balance in the emission of different colors, effectively preventing reliable color shift problems, and thus improving the lifespan of the display panel.

[0062] For example, for the OLED material with the shortest lifespan, using a stacked design (the number of light-emitting material layers n≥2) can effectively increase the device lifespan, making the aging degree of the three OLED materials comparable or close.

[0063] In addition, by flexibly adjusting the number of light-emitting material layers (EML) of light-emitting units 230 with different lifespans, the output intensity and proportion of each color light can be controlled more precisely, making the display panel richer and more realistic when presenting various colors, bringing users a better visual experience and meeting the application scenarios with high requirements for color display.

[0064] Reference Figure 5 and Figure 6 In some optional embodiments, the film thickness of the first light-emitting unit 231 is greater than the film thickness of the second light-emitting unit 232 along the thickness direction of the display panel.

[0065] The film thickness of the light-emitting unit 230 may not be absolutely uniform at different locations. In this embodiment, the film thickness can be understood as the average film thickness of the light-emitting unit 230, or as the maximum film thickness of the light-emitting unit 230. For example, the maximum film thickness of the first light-emitting unit 231 is greater than the maximum film thickness of the second light-emitting unit 232. For example, the average film thickness of the first light-emitting unit 231 is greater than the average film thickness of the second light-emitting unit 232.

[0066] Because the first light-emitting unit 231 has more layers of light-emitting material (EML) compared to the second light-emitting unit 232, the film thickness of the first light-emitting unit 231 is greater than that of the second light-emitting unit 232. For light-emitting units 230 with different film thicknesses, the height of their isolation structure 300 or the thickness of their encapsulation portion 611 can be differentiated, such as... Figure 8 and Figure 12 As shown, this improves the bonding effect between the encapsulation part 611 and the isolation structure 300, as well as the stability of the encapsulation layer, thereby improving the encapsulation effect of the encapsulation part 611 on each light-emitting unit 230.

[0067] It should be noted that for light-emitting units 230 with the same number of stacked light-emitting material layers (EML) of different colors, their film thicknesses may also differ. For example, those made of a single material may be thicker, or a certain color light-emitting unit 230 may have more layers of other film layers besides the light-emitting material layer (EML). The solutions described in this application embodiment, such as differentiating the height of the isolation structure 300 or differentiating the thickness of different encapsulation portions 611, can also be applied to improve the structural stability and encapsulation effect of the encapsulation portion 611. For example, refer to... Figure 7 , Figure 8 and Figure 12 The display panel includes a substrate 100, an isolation structure 300, a first encapsulation layer 610, and a plurality of light-emitting units 230. The isolation structure 300 is located on one side of the substrate 100 and forms a plurality of isolation openings 310. The light-emitting units 230 are disposed on one side of the substrate 100, and at least a portion of the light-emitting units 230 is located in the corresponding isolation openings 310. The first encapsulation layer 610 includes a plurality of encapsulation portions 611 for encapsulating each light-emitting unit 230. The encapsulation portions 611 extend from the corresponding isolation openings 310 to the side of the isolation structure 300 away from the substrate 100. The plurality of light-emitting units 230 includes a first light-emitting unit 231 and a second light-emitting unit 232. The plurality of isolation openings 310 includes a first isolation opening 311 and a second isolation opening 312. The first isolation opening 311 is correspondingly disposed with the first light-emitting unit 231, and the second isolation opening 312 is correspondingly disposed with the second light-emitting unit 232. Along the thickness direction of the display panel, the film thickness of the first light-emitting unit 231 is greater than the film thickness of the second light-emitting unit 232.

[0068] The isolation structure 300 includes a first isolation portion 320 and a second isolation portion 330. The first isolation portion 320 encloses a first isolation opening 311, and the second isolation portion 330 encloses a second isolation opening 312. Along the thickness direction, the film thickness of the first isolation portion 320 is greater than the film thickness of the second isolation portion 330. And / or, the plurality of encapsulation portions 611 include a first encapsulation portion 612a corresponding to the first light-emitting unit 231 and a second encapsulation portion 612b corresponding to the second light-emitting unit 232. The maximum film thickness of the first encapsulation portion 612a within the first isolation opening 311 is less than the maximum film thickness of the second encapsulation portion 612b within the second isolation opening 312.

[0069] The film thickness of the first isolation portion 320 or the second isolation portion 330 can be understood as: along the thickness direction Z, the distance between the side surface of the second sub-layer 302 of each isolation portion away from the substrate 100 and the side surface of the pixel limiting portion 210 away from the substrate 100, that is, the distance between the upper surface of the second sub-layer 302 and the upper surface of the pixel limiting portion 210.

[0070] In this embodiment, since the film thickness of the first light-emitting unit 231 is greater than that of the second light-emitting unit 232, when the isolation structure 300 adopts a first isolation portion 320 with a film thickness greater than that of the second isolation portion 330, and the first isolation portion 320 surrounds the first isolation opening 311 corresponding to the first light-emitting unit 231, and the second isolation portion 330 surrounds the second isolation opening 312 corresponding to the second light-emitting unit 232, the thicker first isolation portion 320 can provide more stable support and isolation space for the first light-emitting unit 231, which has a thicker film layer and may generate greater stress. This helps to reduce the risk of insufficient packaging space caused by different isolation openings 310 heights. For example, by increasing the film thickness of the first isolation portion 320, the film thickness of the corresponding positions of the first packaging portion 612a and the second packaging portion 612b can be kept consistent. Figure 8 As shown. Furthermore, for the encapsulation portion 611, if the film thickness of the first encapsulation portion 612a within the first isolation opening 311 is less than the film thickness of the second encapsulation portion 612b within the second isolation opening 312, the thicker second encapsulation portion 612b can better fill the gap between the second isolation opening 312 and the second light-emitting unit 232, enhancing the sealing performance. In this case, the film thicknesses of the first isolation portion 320 and the second isolation portion 330 can be the same, such as... Figure 12 As shown. This targeted design of the isolation structure 300 and the film thickness of the encapsulation part 611 comprehensively improves the ability of the encapsulation part 611 to cope with different light-emitting units 230, thereby improving the structural stability and encapsulation effect of the encapsulation part 611.

[0071] The embodiments of this application can effectively improve encapsulation quality, extend product lifespan, and prevent reliable color shift by changing the number of EML layers in OLEDs of different colors, combining isolation structures 300 of different heights, and encapsulation parts 611 of different film thicknesses.

[0072] Reference Figures 6 to 10 In some optional embodiments, the display panel further includes a plurality of first electrodes 410 and a plurality of second electrodes 510, each first electrode 410 being located on the side of the corresponding light-emitting unit 230 facing the substrate 100; each second electrode 510 being located on the side of the corresponding light-emitting unit 230 away from the substrate 100; the isolation structure 300 includes a first sub-layer 301 and a second sub-layer 302 located on the side of the first sub-layer 301 away from the substrate 100, the second sub-layer 302 being disposed protruding from the first sub-layer 301 toward the isolation opening 310, along the thickness direction of the display panel, in each isolation opening 310, the minimum perpendicular distance between the surface of the second sub-layer 302 facing the substrate 100 and the surface of the second electrode 510 away from the substrate 100 is h1, and the film thickness of the encapsulation portion 611 located on the side of the light-emitting unit 230 away from the substrate 100 is h2; wherein, the minimum perpendicular distance h1 corresponding to each isolation opening 310 and the film thickness h2 of the encapsulation portion 611 both satisfy the following condition: h1 > h2.

[0073] The film thickness of the encapsulation portion 611 located on the side of the light-emitting unit 230 away from the substrate 100 may not be absolutely uniform. In this embodiment, the film thickness of the encapsulation portion 611 can be understood as the thickness of the encapsulation portion 611 located above the center position of the light-emitting unit 230, or as the maximum film thickness of the encapsulation portion 611 located on the light-emitting unit 230.

[0074] In these embodiments, the height h1 between the lower edge of the second sub-layer 302 in the isolation structure 300 and the upper edge of the second electrode 510 is at least greater than the film thickness h2 of the encapsulation portion 611. This reduces the risk of encapsulation voids between the encapsulation portion 611 and the isolation structure 300, avoids encapsulation failure, and allows the encapsulation portion 611 to extend well along the sidewall of the first sub-layer 301 and along the side of the second sub-layer 302 toward the substrate 100. This effectively allows it to adhere to the isolation structure 300 and extend to the side of the isolation structure 300 away from the substrate 100, improving the encapsulation effect.

[0075] The second sublayer 302 protrudes relative to the first sublayer 301 toward the isolation opening 310, allowing a concave shape to be formed beneath the second sublayer 302. During the fabrication of the light-emitting unit 230, the light-emitting material can be broken into independent light-emitting units 230 at the edge of the second sublayer 302. Optionally, the isolation structure 300 further includes a third sublayer 303, located on the side of the first sublayer 301 facing the substrate 100, and protruding relative to the first sublayer 301 toward the isolation opening 310. During the fabrication of the isolation structure 300, when the first sublayer 301 is side-etched, the third sublayer 303 can provide protection to the film layer on the substrate 100 side.

[0076] Optionally, the first sublayer 301 and the second sublayer 302 are made of different materials, and the etching rate of the first sublayer 301 is lower than that of the second sublayer 302. The first sublayer 301 is made of a conductive material, specifically including at least one of aluminum (Al) and aluminum alloys. The aluminum alloy may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The second sublayer 302 can be a single-layer structure or a multi-layer structure. If the second sublayer 302 is a single-layer structure, its material may include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. If the second sublayer 302 is a multi-layer structure, refer to... Figure 5 The material of one layer of the second sublayer 302 includes at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy or molybdenum-niobium alloy, and the material of the other layer of the second sublayer 302 may include conductive oxide or inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0077] Optionally, the material of the third sublayer 303 includes a conductive material. For example, the material of the third sublayer 303 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0078] In order for the light-emitting unit 230 to emit light, a pixel voltage is provided to the first electrode 410 and a common voltage is provided to the second electrode 510, respectively, forming a potential difference between the first electrode 410 and the second electrode 510, causing the light-emitting structure disposed between the first electrode 410 and the second electrode 510 to emit light. In one embodiment, if a potential difference is formed between the first electrode 410 and the second electrode 510 of the light-emitting unit 230, the light-emitting material layer EML of the light-emitting unit 230 emits light.

[0079] In this circuit, the pixel voltage of the first electrode 410 is provided by the pixel driving circuit 111, and the common voltage of the second electrode 510 is provided by the isolation structure 300. Specifically, the second electrode 510 is electrically connected to the isolation structure 300, and the common voltage is supplied to the second electrode 510 by providing the isolation structure 300. That is, the isolation structure 300 has the function of supplying a common voltage to the second electrode 510.

[0080] The first electrode 410 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metallic material with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 510 is formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0081] Optionally, the second electrode 510 is located at each isolation opening 310. Optionally, the second electrode 510 is electrically connected to the isolation structure 300. For example, the material of the first sub-layer 301 includes a conductive material, and the second electrode 510 is electrically connected to the first sub-layer 301. Alternatively, the materials of both the first sub-layer 301 and the third sub-layer 303 include conductive materials, and the second electrode 510 is electrically connected to the third sub-layer 303 and the first sub-layer 301. Alternatively, the material of the third sub-layer 303 includes a conductive material, the second electrode 510 is electrically connected to the third sub-layer 303, and the second electrode 510 is spaced apart from the first sub-layer 301.

[0082] Optionally, the second electrode 510 includes a main body 511 and a contact portion 512 that surrounds the main body 511 in a closed ring shape. The contact portion 512 and the third sub-layer 303 are in contact with each other, so that the second electrode 510 overlaps with the third sub-layer 303 of the isolation structure 300, thereby improving the stability of the second electrode 510 and the isolation structure 300 forming a surface electrode as a whole.

[0083] In some optional embodiments, the plurality of isolation openings 310 include a first isolation opening 311 and a second isolation opening 312. The first isolation opening 311 is correspondingly disposed with respect to the first light-emitting unit 231, and the second isolation opening 312 is correspondingly disposed with respect to the second light-emitting unit 232. In the first isolation opening 311 and the second isolation opening 312, the minimum perpendicular distance between the side surface of the second sublayer 302 facing the substrate 100 and the side surface of the second electrode 510 facing away from the substrate 100 is the same. Figures 8 to 10 As shown.

[0084] In these embodiments, the minimum perpendicular distance between the surface of the second sublayer 302 facing the substrate 100 and the surface of the second electrode 510 facing away from the substrate 100 in different isolation openings 310 is the same. This means that the spacing between the key structural layers corresponding to different isolation openings 310 remains consistent. This consistent spacing design allows the encapsulation portions 611 corresponding to the first isolation opening 311 and the second isolation opening 312 to be uniformly filled and attached at each isolation opening 310 during the formation process, avoiding problems such as uneven distribution and inconsistent thickness of encapsulation material caused by spacing differences. The uniform encapsulation structure can better withstand external stress, reduce the risk of structural damage caused by stress concentration, and more effectively block the intrusion of external moisture and oxygen, thereby improving the structural stability and encapsulation effect of the encapsulation portion 611.

[0085] Optionally, the plurality of isolation openings 310 include a plurality of first isolation openings 311, a plurality of second isolation openings 312, and a plurality of third isolation openings 313. A plurality of light-emitting devices are located on one side of the substrate 100, and the plurality of light-emitting devices include a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of third light-emitting devices. The first light-emitting devices are disposed corresponding to the first isolation openings 311, the second light-emitting devices are disposed corresponding to the second isolation openings 312, and the third light-emitting devices are disposed corresponding to the third isolation openings 313. In one embodiment, one light-emitting device is disposed corresponding to one isolation opening 310. For example, the first light-emitting device is disposed one-to-one with the first isolation opening 311, the second light-emitting device is disposed one-to-one with the second isolation opening 312, and the third light-emitting device is disposed one-to-one with the third isolation opening 313. At least a portion of the first light-emitting device is disposed within the corresponding first isolation opening 311, at least a portion of the second light-emitting device is disposed within the corresponding second isolation opening 312, and at least a portion of the third light-emitting device is disposed within the corresponding third isolation opening 313. In another embodiment, multiple light-emitting devices are correspondingly arranged with an isolation opening 310. For example, multiple light-emitting devices with the same light-emitting color are corresponding to an isolation opening 310.

[0086] Reference Figure 7 and Figure 8 In some optional embodiments, the isolation structure 300 includes a first isolation portion 320 and a second isolation portion 330. The first isolation portion 320 surrounds and forms a first isolation opening 311, and the second isolation portion 330 surrounds and forms a second isolation opening 312. Along the thickness direction, the film thickness of the first isolation portion 320 is greater than the film thickness of the second isolation portion 330.

[0087] Since the first light-emitting unit 231 is disposed at the first isolation opening 311 and the second light-emitting unit 232 is disposed at the second isolation opening 312, the first light-emitting unit 231 has a greater number of stacked light-emitting material layers (EML) or a thicker film layer than the second light-emitting unit 232. In order to form a package portion 611 with good encapsulation performance in both the first isolation opening 311 and the second isolation opening 312, this embodiment differentiates the film layer thickness of the isolation structure 300 around the different isolation openings 310, so that the film layer thickness of the first isolation portion 320 is greater than that of the second isolation portion 312. The thickness of the film layer in the isolation portion 330 is beneficial to ensure that the minimum perpendicular distance between the surface of the second sublayer 302 facing the substrate 100 and the surface of the second electrode 510 facing away from the substrate 100 is the same in different isolation openings 310. This makes the film layer thickness of different packaging portions 611 consistent, enabling uniform filling and adhesion at each isolation opening 310. It can better withstand external stress, reduce the risk of structural damage caused by stress concentration, and more effectively block the intrusion of external moisture and oxygen, thereby improving the structural stability and packaging effect of the packaging portion 611.

[0088] To achieve isolation structures 300 with different heights, in some optional embodiments, the first isolation portion 320 includes a raised portion 321 and a main isolation portion 322 located on the side of the raised portion 321 facing away from the substrate 100. The main isolation portion 322 includes a first sublayer 301 and a second sublayer 302. The orthographic projection of the first sublayer 301 onto the substrate 100 lies within the orthographic projection of the raised portion 321 onto the substrate 100. That is, the first isolation portion 320 has an additional raised portion 321 compared to the second isolation portion 330, thereby increasing the overall film thickness of the first isolation portion 320. The second isolation portion 330 also has a first sublayer 301 and a second sublayer 302 similar to those of the main isolation portion 322.

[0089] In these embodiments, by specifically setting the raised portion 321, it is beneficial to achieve differentiated settings for different isolation structures 300, so that the film thickness of the first isolation portion 320 is greater than that of the second isolation portion 330. On the other hand, the orthographic projection of the first sublayer 301 on the substrate 100 is located within the orthographic projection of the raised portion 321 on the substrate 100, so that the two do not form an undercut structure at the connection, which is beneficial for the encapsulation portion 611 to climb and attach along the side wall of the first isolation structure 300, thereby improving the encapsulation effect of the encapsulation portion 611.

[0090] Reference Figure 10In some optional embodiments, the main isolation portion 322 further includes a third sub-layer 303 located on the side of the first sub-layer 301 facing the substrate 100, and the orthographic projection of the third sub-layer 303 onto the substrate 100 lies within the orthographic projection of the padding portion 321 onto the substrate 100. For the isolation structure 300 provided with the third sub-layer 303, the orthographic projection of the third sub-layer 303 onto the substrate 100 also lies within the orthographic projection of the padding portion 321 onto the substrate 100, so that the two do not form an undercut structure at the connection point, which is beneficial for the encapsulation portion 611 to climb and attach along the sidewall of the first isolation structure 300, thereby improving the encapsulation effect of the encapsulation portion 611.

[0091] Depending on the preparation method, the first isolation section 320 may also form different morphologies.

[0092] In some alternative embodiments, such as Figure 8 and Figure 10 As shown, a stepped structure is formed at the connection between the raised portion 321 and the main isolation portion 322, that is, at least part of the surface of the raised portion 321 facing away from the substrate 100 is not covered by the main isolation portion 322, which is conducive to the encapsulation portion 611 climbing and attaching along the side wall of the first isolation structure 300, thereby improving the encapsulation effect of the encapsulation portion 611.

[0093] Or, such as Figure 9 As shown, the side wall of the raised part 321 is smoothly connected to the side wall of the main isolation part 322 as an integral structure. The smooth connection structure is more conducive to the encapsulation part 611 climbing and attaching along the side wall of the first isolation structure 300, further improving the encapsulation effect of the encapsulation part 611.

[0094] Since there are at least two isolation structures 300 with different heights or film thicknesses, to ensure encapsulation performance, the isolation structures 300 with different film thicknesses are spaced apart, which is beneficial for the encapsulation of each isolation opening 310. (Refer to...) Figures 7 to 10 In some optional embodiments, the first isolation portion 320 and the second isolation portion 330 are spaced apart, and an isolation groove 340 is formed between the first isolation portion 320 and the second isolation portion 330.

[0095] Because the first isolation portion 320 and the second isolation portion 330 have different film thicknesses, if they are connected during the encapsulation process, the difference in film thickness may cause uneven distribution of the encapsulation material at the junction, resulting in inconsistent thicknesses. This affects the encapsulation effect and fails to effectively block the intrusion of external moisture, oxygen, etc., damaging the light-emitting unit 230. In this embodiment, the adjacent first isolation portion 320 and the second isolation portion 330 with different film thicknesses are spaced apart to form an isolation groove 340. This separates the isolation areas with different structures, allowing the encapsulation material to fill and adhere independently and more evenly in the corresponding area of ​​each isolation portion. This avoids the problem of uneven encapsulation caused by differences in film thickness, thereby improving the encapsulation effect of the encapsulation portion 611 corresponding to each isolation portion, better protecting the light-emitting unit 230, and improving the performance and reliability of the display panel.

[0096] When an RGB OLED uses a structure with a higher stacked light-emitting material layer (EML), a higher isolation structure 300 can prevent encapsulation voids and avoid encapsulation failure. Taking the B pixel as an example, when the B pixel adopts a structure with more stacked layers, the isolation structure 300 surrounding the B pixel is higher than the isolation structure 300 of other sub-pixels. At the same time, the first isolation part 320 corresponding to the B pixel and the second isolation part 330 corresponding to the adjacent color are separated to ensure that the first isolation part 320 does not affect the height of the isolation structure 300 corresponding to the R pixel and G pixel, thus avoiding affecting the encapsulation effect of the R pixel and G pixel.

[0097] In some alternative embodiments, such as Figure 7 As shown, the isolation groove 340 is arranged around the periphery of the first isolation portion 320. The first isolation portion 320 and the second isolation portion 330 are completely separated into independent islands. By setting the adjacent first isolation portion 320 and second isolation portion 330 with different film thicknesses at intervals to form the isolation groove 340, the isolation areas with different structures are separated. The encapsulation material can be filled and attached independently and more uniformly in the corresponding area of ​​each isolation portion, avoiding the problem of uneven encapsulation caused by the difference in film thickness. This improves the encapsulation effect of the encapsulation portion 611 corresponding to each isolation portion, better protects the light-emitting unit 230, and improves the performance and reliability of the display panel.

[0098] Furthermore, in the RGB strip pixel arrangement, due to their inherent structural characteristics, when the isolation groove 340 is arranged around the first isolation part 320, macroscopically, the multi-layered sub-pixels form a ring-shaped isolation groove 340 surrounding them. This ring design effectively isolates the multi-layered pixels from all directions. On one hand, it prevents harmful substances such as moisture and oxygen from permeating between different areas, avoiding the diffusion of harmful substances to the entire multi-layered pixel area due to local encapsulation failure, thus enhancing the sealing protection of the multi-layered pixels. On the other hand, the ring-shaped isolation groove 340 can also effectively buffer external stress, reducing the direct impact of stress on the multi-layered pixels, preventing damage to the pixel structure due to stress concentration, thereby improving the reliability and stability of the display panel and extending its service life.

[0099] Optionally, during the fabrication of the light-emitting unit 230 and the second electrode 510, a portion of the electrode material of the sub-pixel located within the isolation trench 340 can be retained, such as... Figure 8 As shown, this allows the first isolation section 320 to be electrically connected to the second isolation section 330 to facilitate the transmission of electrical signals.

[0100] Optionally, the material of the raised portion 321 may include a conductive material, such as at least one of aluminum (Al), aluminum alloy, molybdenum (Mo), titanium (Ti), copper (Cu), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0101] Reference Figure 11a , Figure 11b and Figure 11c This application embodiment also provides a method for preparing a first isolation portion 320 and a second isolation portion 330 with different heights, the preparation method including:

[0102] S10, a pixel definition layer 200 is prepared on the substrate 100, the pixel definition layer 200 including a pixel defining portion 210 and a plurality of pixel openings 220 formed by the pixel defining portion 210. For example... Figure 11a As shown.

[0103] S20, an initial raised portion 321a is formed on the pixel defining portion 210, the initial raised portion 321a enclosing a first opening 321b, and the orthographic projection of a portion of the pixel opening 220 on the substrate 100 at least partially overlaps with the orthographic projection of the first opening 321b on the substrate 100. Figure 11b As shown.

[0104] S30, a first isolation material layer and a second isolation material layer are sequentially prepared on the initial raised portion 321a and the pixel defining portion 210. The first and second isolation material layers are patterned so that the first and second isolation material layers located on and above the initial raised portion 321a form a first isolation portion 320, and the first and second isolation material layers on the pixel defining portion 210 form a second isolation portion 330. Along the thickness direction of the display panel, the film thickness of the first isolation portion 320 is greater than the film thickness of the second isolation portion 330. Figure 11c As shown.

[0105] In these embodiments, the initial raised portion 321a is disposed in the region where the first isolation portion 320 is located. The initial raised portion 321a can also be disposed in other regions. Subsequently, the multilayer sub-layers of the isolation structure 300 are fabricated normally. During the fabrication process of the multilayer sub-layers of the isolation structure 300, etching may reduce the size of the initial raised portion 321a, thereby forming the raised portion 321. In the region with the raised portion 321, the height of the isolation structure 300 will be higher than the height of the isolation structure 300 without the raised portion 321.

[0106] Reference Figures 8 to 10 In some optional embodiments, the display panel further includes a pixel definition layer 200, which includes a pixel defining portion 210 and a plurality of pixel openings 220 formed by the pixel defining portion 210. The first isolation portion 320 and the second isolation portion 330 are both located on the side of the pixel defining portion 210 away from the substrate 100. The pixel openings 220 are connected to the corresponding isolation openings 310. At least a portion of the light-emitting unit 230 is located in the pixel opening 220. Along a first direction X perpendicular to the thickness direction, the plurality of light-emitting units 230 include a first light-emitting unit 231, a second light-emitting unit 232 and a third light-emitting unit 233 arranged in sequence. The size of the pixel defining portion 210 between the first light-emitting unit 231 and the second light-emitting unit 232 is S1, and the size of the pixel defining portion 210 between the second light-emitting unit 232 and the third light-emitting unit 233 is S2, wherein S1≥S2.

[0107] The dimension S1 of the pixel limiting portion 210 between the first light-emitting unit 231 and the second light-emitting unit 232 can be understood as the width of the pixel limiting portion 210 between the first light-emitting unit 231 and the second light-emitting unit 232 along the first direction X. Similarly, the dimension S2 of the pixel limiting portion 210 between the second light-emitting unit 232 and the third light-emitting unit 233 can be understood as the width of the pixel limiting portion 210 between the second light-emitting unit 232 and the third light-emitting unit 233.

[0108] In these embodiments, a partition groove is formed between the first isolation portion 320 and the second isolation portion 330 corresponding to the first light-emitting unit 231 and the second light-emitting unit 232. The size of the pixel limiting portion 210 between the two is larger or equal to the size of the pixel limiting portion 210 between the openings of the single-layer or fewer-layer light-emitting units 230, so as to facilitate the forming of the isolation structure 300 on the pixel limiting portion 210 and to facilitate the formation of the isolation groove 340, so that the isolation groove 340 has a certain width.

[0109] The first electrode 410 is disposed on the substrate 100. The pixel definition layer 200 covers the end of the first electrode 410. The pixel definition layer 200 has a pixel opening 220 through which the first electrode 410 is exposed. The light-emitting units 230 of the first light-emitting device, the second light-emitting device, and the third light-emitting device cover the sidewall of the pixel opening 220 of the pixel definition layer 200 and the side of the pixel definition layer 200 facing away from the substrate 100. Each light-emitting unit 230 is located within the pixel opening 220 and is in contact with the first electrode 410. The first electrode 410 and the isolation structure 300 are insulated from each other by the pixel limiting portion 210, making it less likely for the first electrode 410 to short-circuit with the second electrode 510 through the isolation structure 300, thereby improving the working stability of the display panel.

[0110] During the light emission process of the light-emitting unit 230, the first electrode 410 is used to generate holes, and the second electrode 510 is used to generate electrons. Holes and electrons combine within the light-emitting unit 230, causing the light-emitting unit 230 to emit light. The first electrode 410 is in contact with the light-emitting unit 230, and a portion of the light-emitting unit 230 may overlap with the isolation structure 300. This can cause holes to crosstalk between adjacent light-emitting units 230 through the light-emitting unit 230 and the isolation structure 300. In this embodiment, the pixel limiting portion 210 is provided with a recess, which allows at least a portion of the light-emitting unit 230 to break at the recess, thereby reducing the hole transmission area and improving the problem of lateral crosstalk.

[0111] The second electrodes 510 of the first, second, and third light-emitting devices respectively cover the corresponding light-emitting units 230. The second electrodes 510 are electrically connected to the isolation structure 300. For example, the second electrode 510 is connected to the first sub-layer 301 of the isolation structure 300, and / or, the second electrode 510 is connected to the third sub-layer 303 of the isolation structure 300. The first electrode 410 can be an anode, and the second electrode 510 can be a cathode. The first electrode 410 of each light-emitting device can be connected to the pixel driving circuit 111 through vias, so that the pixel driving circuit 111 drives the light-emitting device to emit light.

[0112] In one implementation, reference is made to Figure 2 and Figure 5 An isolation structure 300 is disposed on the pixel definition layer 200. The pixel definition layer 200 has a first pixel opening 221 communicating with a first isolation opening 311, a second pixel opening 222 communicating with a second isolation opening 312, and a third pixel opening 223 communicating with a third isolation opening 313. The areas of the orthographic projections of the first pixel opening 221, the second pixel opening 222, and the third pixel opening 223 on the substrate 100 may be the same or different. The shapes of the orthographic projections of the pixel opening 220 and the corresponding isolation opening 310 on the substrate 100 may be the same or different. Generally, the area of ​​the orthographic projection of the isolation opening 310 on the substrate 100 is larger than the area of ​​the orthographic projection of the pixel opening 220 communicating with that isolation opening 310 on the substrate 100. The orthographic projections of the pixel opening 220 and the isolation opening 310 on the substrate 100 overlap. There are various ways to set the material of the pixel definition layer 200. For example, the pixel definition layer 200 can be made of an inorganic material, such as an inorganic insulating material selected from silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON). In another embodiment, the isolation structure 300 is disposed within a groove of the pixel definition layer 200. Alternatively, the pixel definition layer 200 may not be provided in the display panel, and the isolation structure 300 may be disposed on one side of the substrate 100, with the isolation structure 300 in contact with the side of the substrate 100.

[0113] In one embodiment, the pixel definition layer 200 includes multiple sub-layers, including a first definition layer 201 and a second definition layer 202 stacked sequentially along the direction away from the substrate 100, that is, the pixel definition layer 200 can adopt a double-layer design.

[0114] For example, the first defining layer 201 has better film-forming properties than the second defining layer 202. That is, under the same thickness conditions, the first defining layer 201 can better cover the stepped structure formed by the first electrode 410 than the second defining layer 202, without causing cracks. Conversely, to obtain the same stepped coverage effect, the thickness of the first defining layer 201 needs to be thinner than that of the second defining layer 202. That is, the thickness requirement for the first defining layer 201 is relatively low, which is beneficial for product thinning. In addition, better film-forming properties are reflected in the better coverage of the formed film, which is denser and more conducive to the isolation of moisture. That is, the material density of the first defining layer 201 is greater than that of the second defining layer 202.

[0115] For example, the second defining layer 202 has better etching resistance than the first defining layer 201. Since the side of the pixel defining layer 200 facing away from the substrate 100 will be etched during the manufacturing process of the display panel, by selecting a material with stronger etching resistance as the second defining layer 202, the etching resistance of the pixel defining layer 200 can be improved, thereby further improving the reliability of the display panel.

[0116] For example, the first defining layer 201 and the second defining layer 202 are made of different materials. For instance, the first defining layer 201 is made of silicon nitride, and the second defining layer 202 is made of silicon oxide.

[0117] For example, the thickness of the first defining layer 201 is greater than or equal to 1000 micrometers and less than or equal to 5000 micrometers. For instance, the thickness of the first defining layer 201 is 1000 micrometers, 2000 micrometers, 3000 micrometers, 4000 micrometers, 5000 micrometers, etc.

[0118] For example, the thickness of the second defining layer 202 is greater than or equal to 500 micrometers and less than or equal to 3000 micrometers. For instance, the thickness of the second defining layer 202 is 500 micrometers, 1000 micrometers, 2000 micrometers, 3000 micrometers, etc.

[0119] In some alternative embodiments, refer to Figure 8 The orthographic projection of the isolation groove 340 onto the substrate 100 lies within the orthographic projection of the pixel limiting portion 210 onto the substrate 100. Since the pixel opening 220 is not required below the isolation groove 340, and the orthographic projection of the isolation groove 340 onto the substrate 100 lies within the orthographic projection of the pixel limiting portion 210 onto the substrate 100, it is advantageous to provide conductive material within the isolation groove 340 to electrically connect the two separated isolation portions.

[0120] In some alternative embodiments, along the thickness direction, the maximum film thickness of the first encapsulation portion 612a within the first isolation opening 311 is equal to the maximum film thickness of the second encapsulation portion 612b within the second isolation opening 312.

[0121] The maximum film thickness of the first encapsulation portion 612a within the first isolation opening 311 can be understood as the film thickness of the portion located in the central region of the first isolation opening 311 that is not blocked by the second sublayer 302. The same applies to the maximum film thickness of the second encapsulation portion 612b within the second isolation opening 312.

[0122] In these embodiments, the maximum film thickness of the encapsulation portion 611 within different isolation openings 310 is the same. This ensures that the encapsulation portions 611 corresponding to the first isolation opening 311 and the second isolation opening 312 can be uniformly filled and attached at each isolation opening 310 during the formation process, avoiding problems such as uneven distribution and inconsistent thickness of the encapsulation material caused by differences in spacing. The uniform encapsulation structure can better withstand external stress, reducing the risk of structural damage caused by stress concentration. At the same time, it can more effectively block the intrusion of external moisture and oxygen, thereby improving the structural stability and encapsulation effect of the encapsulation portion 611.

[0123] Reference Figure 12 In some optional embodiments, the plurality of isolation openings 310 include a first isolation opening 311 and a second isolation opening 312. The first isolation opening 311 is correspondingly disposed with the first light-emitting unit 231, and the second isolation opening 312 is correspondingly disposed with the second light-emitting unit 232. In the first isolation opening 311, the minimum perpendicular distance between the side surface of the second sublayer 302 facing the substrate 100 and the side surface of the second electrode 510 away from the substrate 100 is h11. In the second isolation opening 312, the minimum perpendicular distance between the side surface of the second sublayer 302 facing the substrate 100 and the side surface of the second electrode 510 away from the substrate 100 is h12, where h11 < h12.

[0124] When the height or film thickness of the isolation structure 300 is the same, and the film thickness of each encapsulation part 611 is consistent, the more the luminescent material layer EML thickness / stack of the OLED device, the smaller the gap of the encapsulation part 611 under the second sub-layer 302. This is because the more the luminescent material layer EML thickness / stack, the smaller the space between the second sub-layer 302 and the second electrode 510, and therefore the smaller the gap of the encapsulation part 611. When the gap is less than a certain threshold, the encapsulation part 611 will form encapsulation voids during the preparation, which can easily lead to encapsulation failure.

[0125] In this embodiment, since the number of EML layers of the first light-emitting unit 231 in the first isolation opening 311 is greater than the number of EML layers of the second light-emitting unit 232 in the second isolation opening 312, a morphology of h11 < h12 will be formed when the isolation structures 300 have a uniform height and no differentiation is made. Optionally, the film thickness of the isolation structure 300 around the first isolation opening 311 is the same as the film thickness of the isolation structure 300 around the second isolation opening 312.

[0126] Optionally, along the thickness direction, the maximum film thickness of the first encapsulation portion 612a within the first isolation opening 311 is less than the maximum film thickness of the second encapsulation portion 612b within the second isolation opening 312, such as... Figure 12As shown, the film thickness of the first encapsulation portion 612a within the first isolation opening 311 is less than the film thickness of the second encapsulation portion 612b within the second isolation opening 312. The thicker second encapsulation portion 612b can better fill the gap between the second isolation opening 312 and the second light-emitting unit 232, enhancing the sealing performance. This targeted design of the film thickness of the encapsulation portion 611 improves the ability of the encapsulation portion 611 to handle different light-emitting units 230, thereby improving the structural stability and encapsulation effect of the encapsulation portion 611.

[0127] When the light-emitting material layers (EML) in the light-emitting units 230 of different colors adopt a structure with different numbers of stacked layers, under the same isolation structure 300 height for the RGB colors, the light-emitting unit 230 with a lower film thickness uses a thicker encapsulation film. This is beneficial because each encapsulation part 611 can form a sealing structure in which the surface of the encapsulation part 611 facing away from the light-emitting unit 230 overlaps with the surface of the encapsulation part 611 facing away from the first sub-layer 301, thereby improving the structural stability of the encapsulation part 611.

[0128] Combined with reference Figure 6 and Figure 12 In some optional embodiments, in at least partially isolated openings 310, the film thickness h2 of the encapsulation portion 611 and the minimum vertical distance h1 satisfy the following condition: 1.8*h2≤h1≤2.2*h2; for example, h1=2*h2. In these embodiments, when the minimum vertical distance h1 is approximately equal to twice the film thickness h2 of the encapsulation portion 611, the encapsulation portion 611 can form a sealing structure, thereby improving the encapsulation effect of the encapsulation portion 611.

[0129] Optionally, in at least a partial isolation opening 310, the surface of the encapsulation portion 611 facing away from the light-emitting unit 230 overlaps with the surface of the encapsulation portion 611 facing away from the first sub-layer 301, such as... Figure 12 As shown. When the surface of the encapsulation part 611 facing away from the light-emitting unit 230 overlaps with the surface of the encapsulation part 611 facing away from the first sub-layer 301, the encapsulation part 611 itself forms a sealing structure. The encapsulation part 611 has good self-support effect, strong structural stability, and good encapsulation effect.

[0130] In other embodiments, the surface of the encapsulation portion 611 facing away from the light-emitting unit 230 may not be connected to the surface of the encapsulation portion 611 facing away from the first sub-layer 301, such as... Figure 6 As shown.

[0131] Combined with reference Figure 5 , Figure 6 , Figure 12 and Figure 13In some optional embodiments, the encapsulation portion 611 includes a first segment 611a located within the isolation opening 310 and a second segment 611b extending from the first segment 611a to the side of the isolation structure 300 facing away from the substrate 100, with a gap between the second segment 611b and the isolation structure 300; wherein, a plurality of encapsulation portions 611 include a first encapsulation portion 612a corresponding to the first light-emitting unit 231 and a second encapsulation portion 612b corresponding to the second light-emitting unit 232, and along the thickness direction of the display panel, the size of the first gap 613 between the second segment 611b of the first encapsulation portion 612a and the isolation structure 300 is larger than the size of the second gap 614 between the second segment 611b of the second encapsulation portion 612b and the isolation structure 300.

[0132] Different thicknesses of light-emitting units 230 or different numbers of light-emitting material layers EML will result in different gap heights between the second sub-layer 302 of the isolation structure 300 and the second segment 611b of the encapsulation part 611. The thicker the light-emitting unit 230, the larger the gap will be. The more layers of light-emitting material layers EML are stacked, the larger the gap will be.

[0133] This gap is because when the luminescent material is deposited, the luminescent material is also deposited on the second sub-layer 302. Then, after the encapsulation part 611 is packaged, when the luminescent material in other places is washed away in the wet process, the luminescent material sandwiched between the second segment 611b and the second sub-layer 302 is washed away, thus leaving a gap.

[0134] In some optional embodiments, the display panel further includes a second encapsulation layer 620 located on the side of the first encapsulation layer 610 facing away from the substrate 100, a portion of the second encapsulation layer 620 filling the first gap 613, and the number of stacked layers of the light-emitting material layer EML of the first light-emitting unit 231 being greater than or equal to 3 layers, such as... Figure 13 As shown.

[0135] In these embodiments, when the number of light-emitting material layers (EML) in the first light-emitting unit 231 is ≥3, the size of the first gap 613 is sufficient for the second encapsulation layer 620 to fill the gap, increasing the bonding force between the encapsulation portion 611 and other film layers, thereby preventing the encapsulation portion 611 from falling off or peeling off and improving encapsulation reliability. If the number of light-emitting material layers (EML) in the second light-emitting unit 232 is less than 3, due to the characteristics of film tension, the second encapsulation layer 620 will not completely fill the second gap 614, or the second encapsulation layer 620 may be located outside the second gap 614.

[0136] Optionally, the display panel further includes a third encapsulation layer 630 disposed on the side of the second encapsulation layer 620 facing away from the substrate 100. The material of the first encapsulation layer 610 may include inorganic materials, which have good density and good barrier properties against moisture and oxygen. The material of the second encapsulation layer 620 may include organic materials to give the second encapsulation layer 620 good flowability, enabling it to level the uneven surface morphology of the first encapsulation layer 610, making the surface of the second encapsulation layer 620 facing away from the substrate 100 relatively flat. The material of the third encapsulation layer 630 may include inorganic materials to further improve the encapsulation effect of the display panel.

[0137] Optionally, the first encapsulation layer 610 can be prepared by chemical vapor deposition (CVD). Optionally, the second encapsulation layer 620 can be prepared by inkjet printing (IJP). Optionally, the third encapsulation layer 630 can be prepared by chemical vapor deposition.

[0138] Both the first encapsulation layer 610 and the third encapsulation layer 630 are inorganic materials, and the materials of the first encapsulation layer 610 and the third encapsulation layer 630 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 620 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The second encapsulation layer 620 and the third encapsulation layer 630 are continuously disposed at least over the entire display area AA, with a portion of them also disposed in the non-display area NA.

[0139] The display panel may also include at least one film layer such as a touch layer, a polarizer, a color filter substrate 100, and a protective cover. This film layer may also be bonded to the display panel via an adhesive layer such as OCA (Optical Clear Adhesive).

[0140] In some optional embodiments, the first light-emitting unit 231 emits blue light, and the second light-emitting unit 232 emits green or red light.

[0141] In related technologies, the lifespan of blue luminescent materials is significantly shorter than that of green or red luminescent materials. This application embodiment, by increasing the number of EML (Emitting Material Layer) stacks in the blue luminescent unit 230, can effectively improve its overall brightness and stability, and increase its lifespan. This ensures that during prolonged use, the attenuation rates of the first luminescent unit 231 and the second luminescent unit 232 become similar, and different colors of light emission maintain a relative balance, thereby effectively preventing reliable color shift problems and ultimately improving the lifespan of the display panel.

[0142] It should be noted that if the lifespan of the green or red luminescent material is shorter than that of the blue luminescent material, the number of EML stacks in the green or red luminescent unit 230 can be set to be greater than the number of EML stacks in the blue luminescent unit 230.

[0143] This application provides a method for manufacturing a display panel, including:

[0144] Step S11: Provide a substrate 100.

[0145] In step S12, an isolation structure 300 is formed on one side of the substrate 100. The isolation structure 300 is provided with a plurality of isolation openings 310, including a plurality of first isolation openings 311, a plurality of second isolation openings 312 and a plurality of third isolation openings 313.

[0146] Step S14: Fabricate the film layer of the first light-emitting device, which includes the light-emitting unit 230 and the second electrode 510 of the first light-emitting device.

[0147] Step S15: Fabricate the first encapsulation layer 610 of the first light-emitting device. Since the film layer and the first encapsulation layer 610 of the first light-emitting device are both fabricated as a single layer, the film layer and the first encapsulation layer 610 of the first light-emitting device are present at the positions of the multiple first isolation openings 311, the multiple second isolation openings 312 and the multiple third isolation openings 313.

[0148] Step S16: Etch away the film layer and the first encapsulation layer 610 of the first light-emitting device at the locations of the plurality of second isolation openings 312 and the plurality of third isolation openings 313, so that the light-emitting unit 230 and the second electrode 510 of the first light-emitting device and the first encapsulation portion 612a of the first light-emitting device are formed only at the locations of the plurality of first isolation openings 311.

[0149] Based on the above steps S14 to S16, the light-emitting unit 230 and the second electrode 510 of the second light-emitting device and the second encapsulation part 612b of the second light-emitting device are respectively arranged at the positions of the multiple second isolation openings 312, and the light-emitting unit 230 and the second electrode 510 of the third light-emitting device and the third encapsulation part 612c of the third light-emitting device are arranged at the positions of the multiple third isolation openings 313.

[0150] An embodiment of the second aspect of this application provides a display device that includes the display panel provided in any of the first aspects of the embodiments described above. The display device may include a device with image processing capabilities, such as a mobile phone, desktop computer, laptop computer, tablet computer, automotive display, wearable device, etc. Because this display device includes the display panel described in this application, it has better performance and higher reliability.

[0151] An embodiment of the third aspect of this application provides a display device including the display panel provided in any of the first aspect embodiments described above. Optionally, the display device may refer to a display device with a size of 32 inches or larger, a usage distance of >1 meter, and a pixel density (PPI) generally less than or equal to 100. By applying an isolation structure 300 and luminescent material layers (EML) with different numbers of stacked layers according to the service life, the product lifespan of the display device can be ≥50,000 hours.

[0152] Optionally, the display device may be 32 inches or larger, such as a TV.

[0153] Optionally, the pixel density of the display device is less than or equal to 100 pixels per inch.

[0154] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0155] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

[0156] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings; Multiple light-emitting units are disposed on one side of the substrate, at least a portion of the light-emitting units are located in the corresponding isolation opening, and each light-emitting unit includes a layer of light-emitting material or multiple layers of light-emitting material stacked along the thickness direction of the display panel; The first encapsulation layer includes a plurality of encapsulation portions for encapsulating each of the light-emitting units, the encapsulation portions extending from the corresponding isolation opening to the side of the isolation structure opposite to the substrate; The plurality of light-emitting units include light-emitting units of at least two different light-emitting colors, and the number of light-emitting material layers of the light-emitting units of at least two different light-emitting colors is different; The plurality of light-emitting units include a first light-emitting unit and a second light-emitting unit. The lifespan of the light-emitting material layer of the first light-emitting unit is shorter than that of the light-emitting material layer of the second light-emitting unit, and the number of light-emitting material layers of the first light-emitting unit is greater than the number of light-emitting material layers of the second light-emitting unit. The isolation structure includes a first isolation part and a second isolation part. The first isolation part encloses and forms a first isolation opening, and the second isolation part encloses and forms a second isolation opening. The first isolation part and the second isolation part are spaced apart, and an isolation groove is formed between the first isolation part and the second isolation part. The display panel further includes a pixel definition layer, which includes a pixel defining portion and a plurality of pixel openings formed by the pixel defining portion. The first isolation portion and the second isolation portion are both located on the side of the pixel defining portion away from the substrate. The pixel openings are connected to the corresponding isolation openings. At least a portion of the light-emitting unit is located in the pixel opening. Along a first direction perpendicular to the thickness direction, the plurality of light-emitting units includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit arranged in sequence. The size of the pixel defining portion between the first light-emitting unit and the second light-emitting unit is S1, and the size of the pixel defining portion between the second light-emitting unit and the third light-emitting unit is S2, wherein S1 ≥ S2.

2. The display panel according to claim 1, characterized in that, Along the thickness direction of the display panel, the film thickness of the first light-emitting unit is greater than the film thickness of the second light-emitting unit.

3. The display panel according to claim 1, characterized in that, The display panel also includes: Multiple first electrodes, each first electrode being located on the side of the corresponding light-emitting unit facing the substrate; Multiple second electrodes, each second electrode being located on the side of the corresponding light-emitting unit facing away from the substrate; The isolation structure includes a first sub-layer and a second sub-layer located on the side of the first sub-layer facing away from the substrate. The second sub-layer protrudes from the first sub-layer toward the isolation opening. Along the thickness direction of the display panel, in each isolation opening, the minimum perpendicular distance between the surface of the second sub-layer facing the substrate and the surface of the second electrode facing away from the substrate is h1. The film thickness of the encapsulation portion located on the side of the light-emitting unit facing away from the substrate is h2. The minimum vertical distance h1 corresponding to each isolation opening and the film thickness h2 of the encapsulation part both satisfy the following condition: h1 > h2.

4. The display panel according to claim 3, characterized in that, The isolation structure further includes a third sub-layer, which is located on the side of the first sub-layer facing the substrate, and the third sub-layer protrudes relative to the first sub-layer facing the substrate. The second electrode includes a main body and a contact portion that surrounds the main body in a closed ring shape, and the contact portion is in contact with the third sublayer.

5. The display panel according to claim 3, characterized in that, The plurality of isolation openings includes a first isolation opening and a second isolation opening, wherein the first isolation opening is configured corresponding to the first light-emitting unit and the second isolation opening is configured corresponding to the second light-emitting unit; In both the first and second isolation openings, the minimum perpendicular distance between the side surface of the second sublayer facing the substrate and the side surface of the second electrode facing away from the substrate is the same.

6. The display panel according to claim 5, characterized in that, Along the thickness direction, the film thickness of the first isolation portion is greater than the film thickness of the second isolation portion.

7. The display panel according to claim 6, characterized in that, The first isolation portion includes a raised portion and a main isolation portion located on the side of the raised portion away from the substrate. The main isolation portion includes a first sub-layer and a second sub-layer. The orthographic projection of the first sub-layer onto the substrate is located within the orthographic projection of the raised portion onto the substrate.

8. The display panel according to claim 7, characterized in that, The main isolation portion further includes a third sublayer located on the side of the first sublayer facing the substrate, wherein the orthographic projection of the third sublayer on the substrate is within the orthographic projection of the padding portion on the substrate.

9. The display panel according to claim 7, characterized in that, A stepped structure is formed at the connection between the raised part and the main isolation part; Alternatively, the side wall of the raised portion and the side wall of the main isolation portion are smoothly connected to form an integral structure.

10. The display panel according to claim 1, characterized in that, The isolation groove is disposed around the periphery of the first isolation section.

11. The display panel according to claim 1, characterized in that, The isolation groove is projected onto the substrate in a direction that the pixel defining portion ...

12. The display panel according to claim 5, characterized in that, Along the thickness direction, the maximum film thickness of the first encapsulation portion within the first isolation opening is equal to the maximum film thickness of the second encapsulation portion within the second isolation opening.

13. The display panel according to claim 3, characterized in that, The plurality of isolation openings includes a first isolation opening and a second isolation opening, wherein the first isolation opening is configured corresponding to the first light-emitting unit and the second isolation opening is configured corresponding to the second light-emitting unit; In the first isolation opening, the minimum perpendicular distance between the side surface of the second sublayer facing the substrate and the side surface of the second electrode away from the substrate is h11, and in the second isolation opening, the minimum perpendicular distance between the side surface of the second sublayer facing the substrate and the side surface of the second electrode away from the substrate is h12, where h11 < h12.

14. The display panel according to claim 13, characterized in that, Along the thickness direction, the maximum film thickness of the first encapsulation portion within the first isolation opening is less than the maximum film thickness of the second encapsulation portion within the second isolation opening. And / or, the membrane thickness of the isolation structure around the first isolation opening is the same as the membrane thickness of the isolation structure around the second isolation opening.

15. The display panel according to claim 3, characterized in that, In at least a portion of the isolation opening, the film thickness h2 of the encapsulation portion and the minimum vertical distance h1 satisfy the following condition: 1.8*h2≤h1≤2.2*h2; And / or, in at least part of the isolation opening, the surface of the encapsulation portion facing away from the light-emitting unit overlaps with the surface of the encapsulation portion facing away from the first sub-layer.

16. The display panel according to any one of claims 1 to 14, characterized in that, The encapsulation portion includes a first segment located within the isolation opening and a second segment extending from the first segment to the side of the isolation structure opposite to the substrate, wherein the second segment has a gap with the isolation structure; The plurality of encapsulation portions include a first encapsulation portion corresponding to the first light-emitting unit and a second encapsulation portion corresponding to the second light-emitting unit. Along the thickness direction of the display panel, the first gap size between the second segment of the first encapsulation portion and the isolation structure is greater than the second gap size between the second segment of the second encapsulation portion and the isolation structure.

17. The display panel according to claim 16, characterized in that, The display panel further includes a second encapsulation layer located on the side of the first encapsulation layer away from the substrate, a portion of the second encapsulation layer filling the first gap, and the number of stacked light-emitting material layers of the first light-emitting unit being greater than or equal to 3 layers.

18. The display panel according to any one of claims 1 to 14, characterized in that, The first light-emitting unit emits blue light, and the second light-emitting unit emits green or red light.

19. A display device, characterized in that, The display panel includes any one of claims 1 to 18.

20. A display device, characterized in that, The display panel includes any one of claims 1 to 18.

21. The display device according to claim 20, characterized in that, The display device is 32 inches or larger; and / or the pixel density of the display device is less than or equal to 100 pixels per inch.

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