Camera apparatus and optical apparatus

Abstract

An embodiment includes: a fixed portion having a lens module; a moving part including a circuit board, a circuit element provided on the circuit board, a filter holder provided on the circuit board, a filter provided on the filter holder and opposed to the lens module in the optical axis direction, and an image sensor opposed to the filter; and a support portion supporting the moving portion with respect to the fixed portion, in which: the filter holder includes a first portion overlapping with the lens module in the optical axis direction and not overlapping with the circuit element, and a second portion overlapping with the circuit element in the optical axis direction and not overlapping with the lens module; the second portion is positioned higher than the circuit element and lower than the lens module.

Description

Technical Field

[0001] Embodiments relate to an actuator, a camera device, and an optical instrument including the camera device. Background Art

[0002] There are difficulties in applying the voice coil motor (VCM) technology used in existing general-purpose camera devices to ultra-miniature, low-power camera devices, so related research has been actively carried out.

[0003] The demand for and production of electronic products such as smartphones and camera-equipped mobile phones continues to increase. Mobile phone cameras are moving towards higher resolution and smaller size. This leads to the need for actuators to be smaller, larger in diameter, and more multifunctional. To achieve high-resolution mobile phone cameras, it is necessary to improve the performance of mobile phone cameras and add functions such as autofocus, hand-shake correction, and zoom. Summary of the Invention

[0004] Technical issues

[0005] The embodiment provides a camera device and an optical instrument including the camera device, which can prevent a filter holder accommodating an optical filter therein from being broken or damaged due to an impact.

[0006] Furthermore, the embodiment provides a camera device and an optical instrument including the camera device, which can prevent poor electrical connection caused by impact, and prevent generation of foreign matter and electrical short circuit between terminals caused by a welding process.

[0007] Technical Solution

[0008] A camera device according to an embodiment has a fixed unit including a lens module, a movable unit including a circuit board, a circuit element arranged on the circuit board, a filter holder arranged on the circuit board, a filter opposite to the lens module in an optical axis direction, an image sensor opposite to the filter, and a supporting unit configured to support the movable unit relative to the fixed unit, wherein the filter holder includes a first portion that overlaps with the lens module but does not overlap with the circuit element in the optical axis direction, and a second portion that overlaps with the circuit element but does not overlap with the lens module in the optical axis direction, wherein the second portion is positioned higher than the circuit element but lower than the lens module.

[0009] The filter holder may include a third portion located between the first portion and the second portion and not overlapping with the lens module and the circuit element in the optical axis direction.The third portion may be located between the first portion and the second portion.

[0010] The first portion may have an upper surface positioned higher than an upper surface of the filter.

[0011] The circuit board may include a first circuit board having a through hole and a second circuit board disposed below the first circuit board, and at least a portion of the circuit element and at least a portion of the filter holder may be disposed in the through hole of the first circuit board.

[0012] The second portion may be disposed in the through-hole in the first circuit board and may not overlap with the first circuit board in the optical axis direction.

[0013] The filter holder may include a fourth portion that does not overlap with the lens module and the circuit element in the optical axis direction and is disposed between the second portion and the first circuit board.

[0014] The filter holder may include a side portion, the side portion including first and second side portions positioned opposite to each other in a first direction, and third and fourth side portions positioned opposite to each other in a second direction perpendicular to the first direction, and a seating portion having a bottom surface positioned lower than an upper surface of the side portion of the filter holder in the optical axis direction, the filter being disposed in the seating portion. The length of the first side portion in the first direction may be 15% to 20% of the length of the filter in the first direction.

[0015] The length of the third side portion in the second direction may be 7% to 12% of the length of the filter in the second direction.

[0016] A distance between an upper surface of the optical filter and an upper surface of a side portion of the filter holder may be 19% to 50% of a length of the optical filter in the optical axis direction.

[0017] A camera device according to another embodiment may include a fixing unit, a moving unit including a circuit board, a circuit element provided on the circuit board, a filter holder provided on the circuit board, a filter provided on the filter holder, and an image sensor opposite to the filter, and

[0018] The supporting unit is configured to support the moving unit relative to the fixing unit, wherein the filter holder includes a receiving portion in which at least a portion of the circuit element is disposed, and the circuit element overlaps with at least a portion of the filter holder in the optical axis direction.

[0019] According to another embodiment, a camera device includes a lens module that is spaced apart from and disposed on a filter in the optical axis direction. The circuit element may not overlap with the lens module in the optical axis direction. The filter holder may include a seating portion having a bottom surface that defines a height difference relative to an upper surface of the filter holder in the optical axis direction, and the filter may be disposed on the bottom surface of the seating portion. The upper surface of the filter may be positioned lower than the upper surface of the filter holder.

[0020] The receiving portion may include a groove recessed from a lower surface of the filter holder, and at least a portion of the circuit element may be disposed in the groove. The filter holder may include a first area coupled to the circuit board and a second area located outside the first area, and the receiving portion may be disposed in the second area.

[0021] The circuit board may include a first circuit board having a perforation and a second circuit board arranged below the first circuit board, the circuit element and the filter holder may be arranged on the second circuit board, and at least a portion of the circuit element and at least a portion of the filter holder may be arranged in the perforation of the first circuit board. The upper surface of the filter holder may be positioned higher than the upper surface of the first circuit board. According to another embodiment, the camera device may include a damper arranged on the upper surface of the filter holder. The damper may overlap with the lens module in the direction of the optical axis. The damper may be made of a material with lower rigidity than the filter holder. The end of the side of the filter holder adjacent to the corner of the filter holder may include a portion with increased width.

[0022] According to one embodiment, a camera device includes a fixed unit and a movable unit, the movable unit including a first circuit board, a second circuit board and an image sensor, the first circuit board including a first terminal, the second circuit board being arranged below the first circuit board and including a second terminal, and the movable unit being movable relative to the fixed unit in a direction perpendicular to the optical axis direction, wherein the movable unit includes a conductive path portion, the conductive path portion including a wire and an insulating portion surrounding the wire, the wire being arranged between the first terminal and the second terminal and contacting the first terminal at one end thereof and contacting the second terminal at the other end thereof.

[0023] The conductive line may include a plurality of conductive lines that are spaced apart from each other. The second circuit board may include a groove recessed from an upper surface thereof, the conductive path portion being provided in the groove.

[0024] The conductive path portion may include a first portion in which the conductive wire is disposed and a second portion connected to the first portion, and may be coupled to the second circuit board by an adhesive. The conductive wire may not be disposed on the second portion.

[0025] The second terminal may include a plurality of second terminals spaced apart from each other, and a distance between two adjacent conductive lines among the plurality of conductive lines may be smaller than a distance between two adjacent second terminals among the plurality of second terminals.

[0026] The image sensor may be disposed on the second circuit board.

[0027] The camera apparatus may include a heat dissipation member provided below the second circuit board, and the heat dissipation member may overlap with the conductive path portion in the optical axis direction.

[0028] No conductive adhesive or solder may be provided between one end of the wire and the first terminal and between the other end of the wire and the second terminal.

[0029] The groove may have an opening on an outer surface of the second circuit board.

[0030] The first circuit board may include a groove recessed from a lower surface of the first circuit board, and the conductive path portion may be provided in the groove of the first circuit board.

[0031] The second circuit board may include a first groove recessed from an upper surface of the second circuit board, the first circuit board may include a second groove recessed from a lower surface of the first circuit board, and a portion of the conductive path portion may be disposed in the first groove, and another portion of the conductive path portion may be disposed in the second groove.

[0032] According to another embodiment, a camera device may include a fixed unit and a moving unit, the moving unit including a first circuit board, a second circuit board and an image sensor, the first circuit board including a first terminal, the second circuit board being arranged below the first circuit board and having a second terminal, and the moving unit being movable relative to the fixed unit in a direction perpendicular to the optical axis direction, wherein the second circuit board includes a plurality of conductive layers arranged in the optical axis direction, wherein the moving unit includes a conductive path portion, the conductive path portion including a first conductive wire and an insulating portion surrounding the first conductive wire, the first conductive wire contacting the first terminal at one end thereof and the second terminal at the other end thereof, and the other end of the first conductive wire being positioned lower than the uppermost conductive layer among the plurality of conductive layers of the second circuit board.

[0033] One end of the first conductive wire may be positioned higher than an uppermost conductive layer of the second circuit board.The second terminal may be formed at a conductive layer located below the uppermost conductive layer of the second circuit board.

[0034] The first circuit board may include a plurality of conductive layers arranged along the optical axis direction, and the first terminal may be formed at a lowermost conductive layer among the plurality of conductive layers of the first circuit board.

[0035] The first conductive line may include a plurality of first conductive lines spaced apart from each other, and the plurality of first conductive lines may overlap the first terminal and the second terminal in the optical axis direction.

[0036] The conductive path portion may include a second conductive wire that overlaps the first terminal but does not overlap the second terminal in the optical axis direction.

[0037] The conductive path portion may include a third conductive wire that overlaps the second terminal but does not overlap the first terminal in the optical axis direction.

[0038] The conductive path portion may include a fourth conductive wire that does not overlap with the first and second terminals in the optical axis direction.

[0039] One of the first circuit board and the second circuit board may include a recess in which at least a portion of the conductive path portion is received.

[0040] Beneficial effects

[0041] The embodiment can prevent the filter holder accommodating the optical filter therein from being broken or damaged due to impact.

[0042] According to the embodiment, since the conductive portion of the conductive path portion is surrounded or sealed by the insulating portion, the insulating portion can protect the conductive portion from external impact, thereby preventing poor electrical connection caused by the external impact.

[0043] Furthermore, according to the embodiment, there is no generation of foreign matter caused by the welding process.

[0044] Furthermore, according to the embodiment, since the conductive portion is encapsulated or sealed and thus insulated by the insulating portion, an electrical short circuit between the terminals can be prevented.

[0045] Furthermore, according to the embodiment, since the conductive path portion is attached to the first circuit board and the second circuit board by an adhesive rather than by a soldering process, it is possible to simplify the process and reduce the process time. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 is a perspective view of a camera apparatus according to an embodiment;

[0047] Figure 2 is a perspective view of the camera apparatus with a cover member removed;

[0048] Figure 3 yes Figure 1 an exploded perspective view of the camera apparatus shown;

[0049] Figure 4a It is along Figure 1 A cross-sectional view of the camera device taken along line AB in FIG.

[0050] Figure 4b It is along Figure 1 A cross-sectional view of the camera device taken along line CD in FIG.

[0051] Figure 4c It is along Figure 1 A cross-sectional view of the camera device taken along line EF in FIG.

[0052] Figure 5 yes Figure 3 An exploded perspective view of the AF operating unit shown;

[0053] Figure 6is a perspective view of a coil former, a sensing magnet, a balancing magnet, a first coil, a circuit board, a first position sensor, and a capacitor;

[0054] Figure 7 A perspective view of a coil former, a housing, a circuit board, an upper elastic member, a sensing magnet, a balancing magnet, a wire, and a damper;

[0055] Figure 8 is a bottom perspective view of the housing, coil former, lower elastic member, magnet and circuit board;

[0056] Figure 9 is a perspective view of an image sensor unit;

[0057] Figure 10a yes Figure 9 A first exploded perspective view of the image sensor unit is shown;

[0058] Figure 10b yes Figure 9 a second exploded perspective view of the image sensor unit shown;

[0059] Figure 11 yes Figure 10a A bottom perspective view of the holder, terminal member, first plate unit, support plate, heat dissipation member, base, and second plate unit shown;

[0060] Figure 12 is a plan view of the holder, the first board unit, the image sensor, the second coil, and the OIS position sensor;

[0061] Figure 13 is a rear perspective view of the retaining member and the first plate unit;

[0062] Figure 14 It is a three-dimensional view of the base, terminal member and wire;

[0063] Figure 15 is a bottom view of the first plate unit, the support plate and the heat dissipation member;

[0064] Figure 16 is a perspective view of the first plate unit, the support plate and the heat dissipation member;

[0065] Figure 17a is a first perspective view of a support plate coupled to a holder and a base;

[0066] Figure 17b is a second perspective view of the support plate coupled to the holder and the base;

[0067] Figure 18a shows the movement of the OIS moving unit in the X-axis direction;

[0068] Figure 18bshows the movement of the OIS moving unit in the Y-axis direction;

[0069] Figure 18c shows the clockwise rotation of the OIS moving unit when driven by four channels;

[0070] Figure 18d shows the counterclockwise rotation of the OIS moving unit when driven by four channels;

[0071] Figure 19a Shown Figure 5 An embodiment of the magnet shown;

[0072] Figure 19b Shown Figure 5 Another embodiment of the magnet shown;

[0073] Figure 20a shows the arrangement of the second panel unit, the extension area, the AF moving unit, the OIS moving unit, and the first to third areas of the controller according to the embodiment;

[0074] Figure 20b is a schematic cross-sectional view of a lens module, a first board unit, an image sensor, a first board unit, and a heat dissipation member;

[0075] Figure 21 is a block diagram showing the configuration of a controller and first to third sensors;

[0076] Figure 22 is a perspective view of the optical filter, the filter holder, and the first plate unit;

[0077] Figure 23 is a perspective view of a filter holder;

[0078] Figure 24 yes Figure 23 a bottom perspective view of the filter holder shown;

[0079] Figure 25 yes Figure 4b a partial enlarged view of the camera device shown;

[0080] Figure 26 yes Figures 1 to 25 A schematic cross-sectional view of the camera apparatus shown;

[0081] Figure 27a is a cross-sectional view of a camera apparatus according to a comparative example;

[0082] Figure 27b yes Figure 27a A schematic cross-sectional view of a camera device according to a comparative example is shown;

[0083] Figure 28a is a perspective view of the filter holder and damper;

[0084] Figure 28b is included Figure 28a A partial cross-sectional view of a camera device with a damper shown;

[0085] Figure 29a is a plan view of the filter holder, the filter, and the shielding member;

[0086] Figure 29b yes Figure 29a Enlarged view of the middle dotted line portion;

[0087] Figure 30 is a perspective view of a filter holder, a filter, and a shielding member according to another embodiment;

[0088] Figure 31 yes Figure 30 A plan view of the filter holder, filter, shielding member and lens module shown;

[0089] Figure 32 yes Figure 30 A cross-sectional view of the filter holder, filter, and lens module shown in the dashed line portion;

[0090] Figure 33 is a perspective view of a camera apparatus according to an embodiment;

[0091] Figure 34 yes Figure 33 a perspective view of the camera apparatus shown with the cover member removed;

[0092] Figure 35 yes Figure 33 an exploded perspective view of the camera apparatus shown;

[0093] Figure 36a It is along Figure 33 A cross-sectional view of the camera device taken along line AB in FIG.

[0094] Figure 36b It is along Figure 33 A cross-sectional view of the camera device taken along line CD in FIG.

[0095] Figure 36c It is along Figure 33 A cross-sectional view of the camera device taken along line EF in FIG.

[0096] Figure 37 yes Figure 35 An exploded perspective view of the AF operating unit shown;

[0097] Figure 38 yes Figure 33A perspective view of the coil former, sensing magnet, balancing magnet, first coil, circuit board, first position sensor and capacitor in FIG.

[0098] Figure 39a yes Figure 33 A three-dimensional diagram of the coil former, housing, circuit board, upper elastic member, sensing magnet and balance magnet in FIG;

[0099] Figure 39b yes Figure 39a a perspective view of the structure shown, wherein additional wires are provided;

[0100] Figure 40 is a bottom perspective view of the housing, coil former, lower elastic member, magnet and circuit board;

[0101] Figure 41 yes Figure 35 A perspective view of the image sensor unit shown;

[0102] Figure 42a yes Figure 41 A first exploded perspective view of the image sensor unit is shown;

[0103] Figure 42b yes Figure 41 a second exploded perspective view of the image sensor unit shown;

[0104] Figure 42c is an enlarged view of the hole in the retainer in 42a;

[0105] Figure 42d yes Figure 42a an enlarged view of the terminal member shown;

[0106] Figure 42e yes Figure 42a An enlarged view of the groove in the base is shown;

[0107] Figure 42f Is set with Figure 42b An enlarged view of a groove in a groove in a retainer of a terminal member is shown;

[0108] Figure 43 yes Figure 42a A bottom perspective view of the holder, terminal member, first plate unit, support plate, heat dissipation member, base, and second plate unit shown;

[0109] Figure 44 is a plan view of the holder, the first board unit, the image sensor, the second coil, and the OIS position sensor;

[0110] Figure 45 is a rear perspective view of the retaining member and the first plate unit;

[0111] Figure 46 It is a three-dimensional view of the base, terminal member and wire;

[0112] Figure 47 is a bottom view of the first plate unit, the support plate and the heat dissipation member;

[0113] Figure 48 is a perspective view of the first plate unit, the support plate and the heat dissipation member;

[0114] Figure 49a is a first perspective view of a support plate coupled to a holder and a base;

[0115] Figure 49b is a second perspective view of the support plate coupled to the holder and the base;

[0116] Figure 50a is an exploded perspective view of the first circuit board, the second circuit board, and the conductive path portion;

[0117] Figure 50b is a cross-sectional view of the terminals of the first circuit board, the terminals of the second circuit board, and the conductive path portion in the optical axis direction;

[0118] Figure 51 yes Figure 50a Enlarged view of the middle dotted line portion;

[0119] Figure 52 showing a conductive path portion disposed in a receiving portion of a second circuit board;

[0120] Figure 53a is a cross-sectional view of the first circuit board, the second circuit board, and the conductive path portion in the optical axis direction;

[0121] Figure 53b is a cross-sectional view showing a receiving portion of a second circuit board according to another embodiment;

[0122] Figure 54a is a plan view of the conductive path portion;

[0123] Figure 54b The conductive path portion and the terminals of the second circuit board are shown;

[0124] Figure 54c yes Figure 54b Enlarged view of the middle dotted line portion;

[0125] Figure 55 is a cross-sectional view showing a layered structure of a first circuit board, a second circuit board, and a conductive path portion;

[0126] Figure 56a is a cross-sectional view of a terminal of a first circuit board, a terminal of a second circuit board, and a conductive path portion according to another embodiment;

[0127] Figure 56a is a cross-sectional view of a terminal of a first circuit board, a terminal of a second circuit board, and a conductive path portion according to another embodiment;

[0128] Figure 57 shows a heat dissipation member according to another embodiment;

[0129] Figure 58a is a perspective view of an optical instrument according to an embodiment;

[0130] Figure 58b is a perspective view of an optical instrument according to another embodiment;

[0131] Figure 58c is a perspective view of an optical instrument according to yet another embodiment;

[0132] Figure 59 It shows Figures 58a to 58c A view of the configuration of the optical instrument is shown. DETAILED DESCRIPTION

[0133] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0134] The technical idea of ​​the present invention can be embodied in many different forms and should not be interpreted as being limited to the following embodiments described herein. Without departing from the technical spirit and scope of the present invention, one or more components of the embodiments can be selectively combined or replaced with each other.

[0135] Unless otherwise specifically defined, the terms (including technical and scientific terms) used in the embodiments of the present invention have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs. It should be further understood that commonly used terms, such as those defined in dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant art.

[0136] The terms used in the embodiments of the present invention are only used to describe specific embodiments and are not intended to limit the present invention. As used in this disclosure and the appended claims, unless the context clearly indicates otherwise, the singular form is intended to include the plural form. The phrase "at least one of A, B, or C" or "one or more of A, B, and C" can be interpreted as including one or more of all combinations of A, B, and C.

[0137] In addition, when describing the components of the present invention, terms such as "first," "second," "A," "B," "(a)," or "(b)" may be used. Since these terms are provided only to distinguish components from one another, they do not limit the nature, order, or sequence of the components.

[0138] It should be understood that when an element is referred to as being "linked," "coupled," or "connected" to another element, the element may be directly "linked," "coupled," or "connected" to the other element, or may be "linked," "coupled," or "connected" to the other element through another intervening element. Furthermore, it should be understood that when an element is referred to as being formed "on" or "under" another element, it may be directly "on" or "under" the other element, or may be indirectly disposed relative to the other element with one or more intervening elements. Furthermore, it should be understood that "on" or "under" an element may mean an upward or downward direction based on the element.

[0139] Hereinafter, the AF operating unit may also be referred to as a "lens moving device," a "lens moving unit," a "VCM (voice coil motor)," an "actuator," or a "lens moving device." Hereinafter, the term "coil" may be used interchangeably with a "coil unit," and the term "elastic member" may be used interchangeably with an "elastic unit" or a "spring."

[0140] In the following description, a “terminal” may also be referred to as a “pad,” an “electrode,” a “conductive layer,” or a “joining portion.”

[0141] In the following description, the terms "board portion," "printed circuit board," "circuit board," and "board" may be used interchangeably with each other.

[0142] For ease of description, although the camera module according to the embodiment is described using an orthogonal coordinate system (x, y, z), some other coordinate system may be used to describe the lens shifting device, and the embodiment is not limited thereto. In the various figures, the X-axis direction and the Y-axis direction refer to directions perpendicular to the optical axis (i.e., the Z-axis). The Z-axis direction, which is the direction of the optical axis OA, may be referred to as the "first direction," the X-axis direction may be referred to as the "second direction," and the Y-axis direction may be referred to as the "third direction." In addition, for example, the X-axis direction may be expressed as "one of the first horizontal direction and the second horizontal direction," and the Y-axis direction may be referred to as "the other of the first horizontal direction and the second horizontal direction."

[0143] For example, the optical axis may be an optical axis of a lens mounted on a lens barrel, or, for example, an axis perpendicular to an imaging area of ​​an image sensor and extending through the center of the imaging area.

[0144] The first direction may be a direction perpendicular to the imaging area of ​​the image sensor. In addition, the optical axis direction may be a direction parallel to the optical axis.

[0145] The camera device according to the embodiment of the present invention can perform an “auto focus function.” Here, the “auto focus function” is for automatically focusing an image of a subject on an image sensor surface.

[0146] Hereinafter, the camera apparatus may also be referred to as a “camera module,” “camera assembly,” “camera unit,” “camera,” “imaging device,” or “lens moving apparatus.”

[0147] In addition, the camera device according to this embodiment can perform a "hand shake correction" function. Here, the "hand shake correction" function can be used to prevent the outline of the captured image from being blurred due to vibration caused by the shaking of the user's hand when capturing a still image.

[0148] Figure 1 is a perspective view of a camera device 1010 according to an embodiment. Figure 2 is a perspective view of the camera apparatus 1010 with the cover member 1300 removed. Figure 3 yes Figure 1 An exploded perspective view of camera device 1010 is shown. Figure 4a It is along Figure 1 1 is a cross-sectional view of the camera device 1010 taken along line AB in FIG. Figure 4b It is along Figure 1 1 is a cross-sectional view of the camera device 1010 taken along line CD in FIG. Figure 4c It is along Figure 1 1 is a cross-sectional view of the camera device 1010 taken along line EF in FIG. Figure 5 yes Figure 3 1 is an exploded perspective view of the AF operation unit 1100 shown. Figure 6 11 is a perspective view of the bobbin 1110 , the sensing magnet 1180 , the balancing magnet 1185 , the first coil 1120 , the circuit board 1190 , the first position sensor 1170 , and the capacitor 1195 . Figure 7 It is a perspective view of the bobbin 1110 , the housing 1140 , the circuit board 1190 , the upper elastic member 1150 , the sensing magnet 1180 , the balancing magnet 1185 , the wire 1220 , and the damper 1048 or DA. Figure 8 11 is a bottom perspective view of the housing 1140 , the bobbin 1110 , the lower elastic member 1160 , the magnet 1130 , and the circuit board 1190 .

[0149] Reference Figures 1 to 8 The camera device 1010 may include an AF operating unit 1100 and an image sensor unit 1350. The AF operating unit 1100 may include an AF moving unit. The image sensor unit 1350 may include an OIS operating unit. The OIS operating unit may include an OIS moving unit. One of the AF moving unit and the OIS moving unit may be a first moving unit, and the other of the AF moving unit and the OIS moving unit may be a second moving unit.

[0150] The camera apparatus 1010 may further include at least one of a cover member 1300 or a lens module 1400. The cover member 1300 and a base 1210 to be described later may constitute a housing.

[0151] The AF operation unit 1100 may be coupled to the lens module 1400 to move the lens module in a direction of the optical axis OA or in a direction parallel to the optical axis and may perform an auto focus function of the camera apparatus 1010 .

[0152] The image sensor unit 1350 may include the image sensor 1810. For example, the image sensor unit 1350 (or the OIS operation unit) may include an OIS operation unit that includes the image sensor 1810. For example, the image sensor unit 1350 may move the OIS moving unit (e.g., image sensor 1810) in a direction perpendicular to the optical axis. In addition, the image sensor unit 1350 may cause the OIS moving unit (e.g., image sensor 1810) to tilt or rotate (or roll) relative to or around the optical axis. With the help of the image sensor unit 1350, the camera device 1010 can perform hand shake correction.

[0153] For example, the image sensor 1810 may include an imaging area configured to sense light passing through the lens module 1400. Here, the imaging area may alternatively be referred to as an "effective area," a "light-receiving area," an "active area," or a "pixel area." For example, the imaging area of ​​the image sensor 1810 may be an area on which light passing through the optical filter 1610 is incident, thereby forming an image included in the light in the area, and may include at least one unit pixel. For example, the imaging area may include a plurality of unit pixels.

[0154] The AF operation unit 1100 may also be referred to as a “lens moving unit” or a “lens moving device.” Alternatively, the AF operation unit 1100 may also be referred to as a “first moving unit (or second moving unit)”, a “first actuator (or second actuator)” or an “AF operation unit”.

[0155] In addition, the image sensor unit 1350 may also be referred to as an “image sensor moving unit,” an “image sensor shift unit,” a “sensor moving unit,” or a “sensor shift unit.” In addition, the image sensor unit 1350 may alternatively be referred to as a “second moving unit” (or “first moving unit”) or a “second actuator” (or “first actuator”).

[0156] Reference Figure 5 and Figure 6, the AF operating unit 1100 can move the lens module 1400 in the optical axis direction. For example, the AF operating unit 1100 can move the coil bobbin 1110 in the optical axis direction. For example, the AF operating unit 1100 can include the coil bobbin 1110, the first coil 1120, the magnet 1130, and the housing 1140. The AF operating unit 1100 can also include an upper elastic member 1150 and a lower elastic member 1160.

[0157] The AF operation unit 1100 may further include a first position sensor 1170 , a circuit board 1190 , and a sensing magnet 1180 for AF feedback operation. Furthermore, the AF operation unit 1100 may further include at least one of a balancing magnet 1185 and a capacitor 1195 .

[0158] The bobbin 1110 may be disposed in the housing 1140 and may move in the direction of the optical axis OA or in a first direction (eg, in the Z-axis direction) through electromagnetic interaction between the first coil 1120 and the magnet 1130 .

[0159] The bobbin 1110 may include a perforation to which the lens module 1400 is coupled or to which the lens module 1400 is mounted. For example, the perforation in the bobbin 1110 may be a through hole formed through the bobbin 1110 along the optical axis. Although the perforation in the bobbin 1110 may have a circular, elliptical, or polygonal shape, the present disclosure is not limited thereto.

[0160] For example, the lens module 1400 may include at least one lens. For example, the lens module 1400 may include a lens barrel. For example, the lens module 1400 may include a lens barrel, and one or more lenses may be mounted to or coupled to the lens barrel. However, the components of the lens module are not limited to the lens barrel, and may be any other component as long as the component has a holder structure capable of supporting one or more lenses.

[0161] For example, the lens module 1400 may be screwed to the bobbin 1110. Alternatively, for example, the lens module 1400 may be coupled to the bobbin 1110 by an adhesive (not shown). The lens module 1400 may be spaced apart from the optical filter 1610 in the optical axis direction. Light passing through the lens module 1400 may be irradiated to the image sensor 1810 through the optical filter 1610.

[0162] The coil bobbin 1110 may include one or more projections 1111A and 1111B disposed on its outer surface. For example, while one or more projections 1111A and 1111B may protrude in a direction parallel to a line perpendicular to the optical axis OA, the present disclosure is not limited thereto. For example, the coil bobbin 1110 may include two projections 1111A and 1111B positioned relative to each other.

[0163] Protrusions 1111A and 1111B of bobbin 1110 may correspond to grooves 1025A and 1205B in housing 1140 and may be inserted or disposed in grooves 1025A and 1205B in housing 1140 to inhibit or prevent bobbin 1110 from rotating beyond a predetermined range about the optical axis.

[0164] The bobbin 1110 may include a protrusion 1146A protruding in a direction perpendicular to the optical axis. For example, the protrusion 1146A of the bobbin 1110 may be provided at a corner of the bobbin 1110 .

[0165] The housing 1140 may include a groove 146B that corresponds to, faces, or overlaps the protrusion 1146A of the bobbin 1110. At least a portion of the protrusion 1146A may be disposed in the groove 146B in the housing 1140.

[0166] Protrusion 1146A of bobbin 1110 may serve as a stopper configured to allow bobbin 1110 to move within a predetermined range in the optical axis direction (eg, in a direction from upper elastic member 1150 toward lower elastic member 1160 ).

[0167] The upper surface of the bobbin 1110 may be provided with a first avoidance groove 1113a therein to avoid spatial interference with the first frame connector 1153 of the upper elastic member 1150. In addition, the lower surface of the bobbin 1110 may be provided with a second avoidance groove 1112b therein to avoid spatial interference with the second frame connector 1163 of the lower elastic member 1160.

[0168] The coil bobbin 1110 may include a first coupler 1116a that is coupled or fixed to the upper elastic member 1150. For example, although the first coupler 1116a of the coil bobbin 1110 may have a protrusion, the present disclosure is not limited thereto. In another embodiment, the first coupler 1116a may have a flat surface or a groove. In addition, the coil bobbin 1110 may include a second coupler 1116b that is coupled or fixed to the lower elastic member 1160. For example, although the second coupler 1116b may have a protrusion, the present disclosure is not limited thereto. In another embodiment, the second coupler 1116b may have a flat surface or a groove.

[0169] Reference Figure 5 , the outer surface of the bobbin 1110 may be provided with a groove 1105, and the first coil 1120 may be placed, inserted or disposed in the groove 1105. For example, the groove 1105 in the bobbin 1110 may have a shape consistent with the shape of the first coil 1120, that is, a closed curve shape (e.g., a ring shape).

[0170] In addition, the coil bobbin 1110 may be provided with a first seating groove 1026a, in which the common sensing magnet 1180 is seated, inserted, fixed, or disposed. In addition, the outer surface of the coil bobbin 1110 may be provided with a second seating groove 1026b, in which the balance magnet 1185 is seated, inserted, fixed, or disposed.

[0171] For example, the first seating groove 1026A and the second seating groove 1026B in the bobbin 1110 may be formed in outer surfaces facing each other of the bobbin 1110. For example, the first seating groove 1026A may be formed in the first protrusion 1111A of the bobbin 1110, and the second seating groove 1026B may be formed in the second protrusion 1111B of the bobbin 1110.

[0172] The bobbin 1110 may include a guide protrusion 1104A configured to guide a portion of the first frame connector 1153 of the upper elastic member 1150. For example, the guide protrusion 1104A may protrude from the bottom surface of the escape portion 1112a of the bobbin 1110. Furthermore, for example, the bobbin 1110 may include a guide protrusion 1103 configured to guide a portion of the second frame connector 1163 of the lower elastic member 1160. For example, the guide protrusion 1103 may protrude from the bottom surface of the escape portion 1112b of the bobbin 1110.

[0173] Reference Figure 5 and Figure 7 , the damper 1048 may be disposed between the bobbin 1110 and the upper elastic member 1150. For example, the damper 1048 may be disposed between the bobbin 1110 and the first frame connector 1153 of the upper elastic member 1150 and may contact, couple, or attach to the bobbin 1110 and the first frame connector 1153.

[0174] For example, the upper elastic member 1150 may include an extension (or protrusion) extending from the first frame connector 1153. The extension 1155 may be spaced apart from each of the outer frame 1152 and the inner frame 1151. The extension 1155 may be spaced apart from one end of the first frame connector 1153 connected to the inner frame 1151 and the other end of the first frame connector 1153 connected to the outer frame 1152. The extension 1155 may extend toward the upper surface of the bobbin 1110.

[0175] For example, a portion (or end) of extension 1155 may be disposed on damper 1048, which is disposed on the upper surface of bobbin 1110, and a portion of extension 1155 may overlap damper 1048. For example, bobbin 1110 may include receiving portion 1104B in which damper 1048 is received or disposed. For example, receiving portion 1104B may be a groove. Receiving portion 1104B may be recessed from the bottom surface of avoidance portion 1112a of bobbin 1110.

[0176] For example, damper 1048 may be disposed between receiving portion 1104B of bobbin 1110 and extension portion 1155 of upper elastic member 1150, and may be in contact with, coupled to, or attached to both receiving portion 1104B and extension portion 1154. Because damper 1048 is in contact with or attached to both extension portion 1155 and receiving portion 1104B, damper 1048 may be used to damp or absorb vibration of bobbin 1110. For example, damper 1048 may be made of a damping member, such as silicone.

[0177] The first coil 1120 may be disposed or coupled to the bobbin 1110. For example, the first coil 1120 may be disposed or coupled to the outer surface of the bobbin 1110. For example, although the first coil 1120 may surround the outer surface of the bobbin 1110 in the rotation direction around the optical axis OA, the present disclosure is not limited thereto.

[0178] Although the first coil 1120 can be directly wound on the outer surface of the coil bobbin 1110, the present disclosure is not limited thereto. In another embodiment, the first coil 1120 can be provided as a coil ring wound on the coil bobbin 1110, or can be provided as an angled coil block.

[0179] A power or driving signal may be provided to the first coil 1120. The power or driving signal provided to the first coil 1120 may be a DC signal, an AC signal, or a signal containing DC and AC components, and may be a voltage type or a current type.

[0180] When a driving signal (eg, a driving current) is provided to the first coil 1120 , electromagnetic interaction between the first coil 1120 and the magnet 1130 may generate electromagnetic force, and the coil frame 1110 may move in the optical axis direction OA by the generated electromagnetic force.

[0181] In the initial position of the AF operating unit, the coil bobbin 1110 can move upward or downward from the initial position of the AF operating unit, which is called bidirectional driving of the AF operating unit. Alternatively, in the initial position of the AF operating unit, the coil bobbin 1110 can move upward, which is called unidirectional driving of the AF operating unit.

[0182] In the initial position of the AF operation unit, the first coil 1120 may correspond to or overlap the magnet 1130 provided on the housing 1140 in a direction perpendicular to the optical axis OA and parallel to a (straight) line passing through the optical axis.

[0183] For example, the AF operating unit may include a bobbin 1110 and components (eg, a first coil 1120 , a sensing magnet 1180 , and a balancing magnet 1185 ) coupled to the bobbin 1110 . The AF operating unit may further include a lens module 1400 .

[0184] The initial position of the AF operating unit may be the original position of the AF operating unit in a state where no power is applied to the coil 120, or the position of the AF operating unit when the upper elastic member 150 and the lower elastic member 160 are elastically deformed due to the weight of the AF operating unit alone. In addition, the initial position of the coil bobbin 110 may be the position of the AF operating unit when gravity acts in a direction from the coil bobbin 110 to the base 210, or when gravity acts in a direction from the base 210 to the coil bobbin 110.

[0185] The sensing magnet 180 may provide a magnetic field detected by the first position sensor 1170 , and the balancing magnet 1185 may be used to offset the influence of the magnetic field of the sensing magnet 1180 and establish a weight balance relative to the sensing magnet 1180 .

[0186] The sensing magnet 1180 may also be referred to as a "sensor magnet" or a "second magnet". The sensing magnet 1180 may be disposed on the coil bobbin 1110 or may be coupled to the coil bobbin 1110. The sensing magnet 1180 may be disposed facing the first position sensor 1170. The balancing magnet 1185 may be disposed on the coil bobbin 1110 or may be coupled to the coil bobbin 1110. For example, the balancing magnet 1185 may be disposed opposite to the sensing magnet 1180. The balancing magnet 1185 may alternatively be referred to as a "balancing member" or a "weighted member". In another embodiment, the balancing member may be a non-magnetic body.

[0187] For example, although each of the sensing magnet 1180 and the balancing magnet 1185 may be a unipolar magnet having one N pole and one S pole, the present invention is not limited thereto. In another embodiment, each of the sensing magnet 1180 and the balancing magnet 1185 may be a bipolar magnet having two N poles and two S poles, or a quadrupole magnet.

[0188] The sensing magnet 1180 may move in the optical axis direction together with the bobbin 1110 , and the first position sensor 1170 may detect the strength or force of the magnetic field of the sensing magnet 1180 moving in the optical axis direction and output an output signal corresponding to the detection result.

[0189] For example, the intensity or magnetic force of the magnetic field detected by the first position sensor 1170 may vary depending on the displacement of the bobbin 1110 in the optical axis direction. Therefore, the first position sensor 1170 may output an output signal proportional to the detected magnetic field intensity, and the output signal from the first position sensor 1170 may be used to detect the displacement of the bobbin 1110 in the optical axis direction.

[0190] The housing 1140 may be provided in the cover member 1300. For example, the housing 1140 may be provided on the image sensor unit 1350.

[0191] The housing 1140 may accommodate the bobbin 1110 therein, and may support the magnet 1130 , the first position sensor 1170 , and the circuit board 1190 .

[0192] Reference Figure 37 、 Figure 38 and Figure 40 The housing 1140 may have a hollow cylindrical shape. For example, the housing 1140 may have a polygonal (eg, rectangular or octagonal) or circular perforation, and the perforation in the housing 1140 may be a through hole formed through the housing 1140 in the optical axis direction.

[0193] The housing 1140 may include side portions and corner portions, the side portions corresponding to or facing the side plates 1302 of the cover member 1300 , and the corner portions corresponding to or facing the corner portions of the cover member 300 .

[0194] In order to prevent direct collision with the inner surface of the upper plate 1301 of the cover member 1300 , the housing 1140 may include a stopper 145 provided at an upper portion, upper surface, or upper end thereof.

[0195] Reference Figure 5 , the housing 1140 may have a mounting groove (or recess) 1014a configured to accommodate the circuit board 1190 therein. The mounting groove 1014a may have a shape corresponding to the shape of the circuit board 1190.

[0196] Reference Figure 7 , the housing 1140 may include protrusions 1044A and 1044B surrounding at least one of the circuit board 1190 or the support plate 1310. For example, the protrusions 1044A and 1044B may be provided or formed on an outer surface of the housing 1140. For example, the protrusions 1044A and 1044B may be provided or formed on an outer surface of a side portion of the housing 1140. The protrusions 1044A and 1044B may also be referred to as "protective members," "support members," "extension members," or "guide members."

[0197] The protrusions 1044A and 1044B of the housing 1140 can surround at least a portion of the circuit board 1190 and at least a portion of the support plate 1310. For example, the housing 1140 can include a first protrusion 1044A disposed on a first side of the housing and a second protrusion 1044B disposed on a second side of the housing 1140. The first protrusion 1044A and the second protrusion 1044B can be positioned relative to each other based on the optical axis OA or the coil bobbin 1110. In another embodiment, the second protrusion 1044B can be omitted.

[0198] For example, the circuit board 1190 may be disposed in the first protrusion 1044A. For example, the mounting groove 1014a may be formed in the first protrusion 1044A.

[0199] For example, each of the first protrusion 1044A and the second protrusion 1044B may include a first portion 1047A connected to the upper surface of the housing 1140, and a second portion 1047B connected to the first portion 1047A and spaced apart from the side of the housing 1140. For example, the first portion 1047A of the first protrusion 1044A may be connected to the upper surface of the first side of the housing 1140, and the first portion 1042a of the second protrusion 1044B may be connected to the upper surface of the second side of the housing 1140. For example, the first portion 1047A may protrude from the upper surface of the housing 1140 in the optical axis direction or in a direction toward the inner surface of the upper plate 1301 of the cover member 1300.

[0200] For example, at least a portion of the circuit board 1190 may be located between the first portion 1047A and the second portion 1047B of the first protrusion 1044A. In addition, for example, at least a portion of the support plate 1310 may be located between the first portion 1047A and the second portion 1047B of the first protrusion 1044A.

[0201] The housing 1140 may include an opening through which the terminals B1 to B4 of the terminal member 1095 of the circuit board 1190 are exposed. The opening may be formed in a side portion of the housing 1140.

[0202] Each of the first protrusion 1044A and the second protrusion 1044B of the housing 1140 may include a third portion 1047C extending from the second portion 1047B. For example, the third portion 1047C may extend or protrude from the lower portion or lower end of the second portion 1047B in a direction parallel to the outer surface of the first side (or second side) of the housing 1140 (e.g., in the second horizontal direction).

[0203] For example, the third portion 1047C may include a first portion extending from one end of the second portion 1047B and a second portion extending from the other end of the second portion 1047B. The first and second portions of the third portion may extend or protrude in opposite directions.

[0204] An adhesive or sealing member may be provided between the protrusions 1044A and 1044B of the housing 1140 and the cover member 1300. For example, an adhesive (or sealing member) may be provided between the protrusions 1044A and 1044B of the housing 1140 and the side plate 1302 of the cover member 1300 to bond therebetween. The protrusions 1044A and 1044B may increase the coupling area between the protrusions and the side plate 1302 of the cover member 1300, and may stably couple the housing 1140 to the cover member 1300 without interfering with the support plate 1310.

[0205] The upper portion, upper end, or upper surface of the housing 1140 may be provided with at least one first coupler to be coupled to the first outer frame 1152 of the upper elastic member 1150. The lower portion, lower end, or lower surface of the housing 1140 may be provided with a second coupler to be coupled and fixed to the second outer frame 1162 of the lower elastic member 1160. For example, each of the first and second couplers of the housing 1140 may have a shape of a flat surface, a protrusion, or a groove.

[0206] The corners of the housing 1140 may be provided with holes 1147, which serve as pathways through which the wires 1220 extend. The holes 1147 may be through-holes formed along the optical axis through the housing 1140. In another embodiment, the holes may be recessed from the outer surface of the corners of the housing 1140, and at least a portion of the holes may open at the outer surface of the corners. The number of holes 1147 in the housing 1140 may be equal to the number of support members.

[0207] The magnet 1130 may be provided, coupled, or fixed to the housing 1140 as a fixed unit. For example, the magnet 1130 may be provided, coupled, or fixed to a side of the housing 1140. The magnet 1130 may include an AF operation magnet 1071A for AF operation. In addition, the magnet 1130 may include an OIS operation magnet 1071B for OIS operation. Hereinafter, the AF operation magnet 1071A may be represented as one of the first magnet and the second magnet, and the OIS operation magnet 1071B may be represented as the other of the first magnet and the second magnet.

[0208] In another embodiment, the magnet 1130 may be disposed, coupled, or secured to a corner portion of the housing.

[0209] For example, the magnet 1130 may include a plurality of magnet units. For example, the magnet 1130 may include first to fourth magnet units 1130-1 to 1130-4 provided on the housing 1140. In another embodiment, the magnet 1130 may include two or more magnet units.

[0210] The magnet 1130 may be disposed on at least one of the side or corner portions of the housing 1140. For example, at least a portion of the magnet 1130 may be disposed on the side or corner portion of the housing 1140. Alternatively, for example, at least a portion of the magnet 1130 may be disposed on the side portion of the housing 1140, while the remaining portion of the magnet 1130 may be disposed on the corner portion of the housing 1140.

[0211] For example, each of the magnet units 1130-1 to 1130-4 may include a first portion provided at a corresponding one of the four corners of the housing 140. In addition, each of the magnet units 1130-1 to 1130-4 may include a second portion provided at a side of the housing 1140 adjacent to the corresponding corner of the housing 1140.

[0212] For example, the first magnet unit 1130-1 and the third magnet unit 1130-3 can be positioned relative to each other in a first horizontal direction (e.g., in the Y-axis direction) based on the housing 1140. For example, the second magnet unit 1130-2 and the fourth magnet unit 1130-4 can be positioned relative to each other in a second horizontal direction (e.g., in the X-axis direction) based on the housing 1140.

[0213] For example, the first magnet unit 130-1 and the third magnet unit 1130-3 can be arranged parallel to each other in the second horizontal direction (e.g., in the X-axis direction), and the second magnet unit 1130-2 and the fourth magnet unit 1130-4 can be arranged parallel to each other in the first horizontal direction (e.g., in the Y-axis direction).

[0214] In an initial position of the AF operation unit, the magnet 1130 may be disposed on the housing 1140 so as to partially overlap the first coil 1120 in a direction perpendicular to the optical axis OA and parallel to a line passing through the optical axis OA.

[0215] The magnet 1130 may include a monopole magnet or a dipole magnet including one north pole and one south pole. In another embodiment, the magnet 1130 may include a dipole magnet or a quadrupole magnet including two north poles and two south poles. In another embodiment, the magnet 1130 may include a monopole magnet and a dipole magnet.

[0216] For example, the magnet 1130 may include an AF magnet for AF operation (or AF operation magnet) and an OIS magnet for OIS operation (or OIS operation magnet). In another embodiment, for example, the magnet 1130 may be a common magnet for AF operation and OIS operation.

[0217] Figure 19a Shown Figure 5 One embodiment of a magnet 1130 is shown.

[0218] Reference Figure 19a , the magnet 1130 may include a first magnet 1071A as an AF operation magnet and a second magnet 1071B disposed below the first magnet 1071A.

[0219] The first magnet 1071A may be a dipole magnet including one north pole and one south pole. For example, the north pole and south pole of the first magnet 1071A may be arranged to face or oppose each other in a direction perpendicular to the optical axis. In another embodiment, the first magnet 1071A may be a quadrupole magnet including two north poles and two south poles.

[0220] The first magnet 1071A may include a plurality of magnet units 1071A1 to 1071A4. As described above, each of the plurality of magnet units 1071A1 to 1071A4 may be a dipole magnet or a quadrupole magnet. For example, the magnet units 1071A1 to 1071A4 may have the same size and shape. For example, two magnet units 1071A1 and 1071A3 that are opposite to each other in a first diagonal direction may have the same size and shape, while the remaining two magnet units 1071A2 and 1071A4 that are opposite to each other in a second diagonal direction may have the same size and shape.

[0221] In another embodiment, the size and shape of each of the two magnet units 1071A1 and 1071A3 may be different from the size and shape of each of the two remaining magnet units 1071A2 and 1072A4. For example, the length of the long side of each of the two magnet units 1071A1 and 1071A3 may be greater than the long side of each of the two remaining magnet units 1071A2 and 1071A4. For example, the length of the short side of each of the two magnet units 1071A and 1071A3 may be equal to the length of the short side of each of the two remaining magnet units 1071A2 and 1071A4.

[0222] The second magnet 1071B may be a quadrupole magnet including two north poles and two south poles. For example, the second magnet 1071B may include a first magnet portion 1030A, a second magnet portion 1030B, and a partition wall 1030C disposed between the first magnet portion 1030A and the second magnet portion 1030B. Here, the partition wall 1030C may be a non-magnetic material or air and may be referred to as a "neutral zone." In another embodiment, the second magnet 1071B may be a dipole magnet including one north pole and one south pole.

[0223] For example, the first magnet portion 1030A and the second magnet portion 1030B can be spaced apart from each other in a direction perpendicular to the first direction (or optical axis direction). For example, the first magnet portion 1030A can include a first N pole and a first S pole that are opposite or facing each other in the optical axis direction. The second magnet portion 1030B can include a second N pole and a second S pole that are opposite or facing each other in the optical axis direction. In addition, the first N pole (or first S pole) of the first magnet portion 1030A and the second S pole (or second N pole) of the second magnet portion 1030B can be opposite or facing each other in a direction perpendicular to the optical axis.

[0224] The second magnet 1071B may include a plurality of magnet units 1071B1 to 1071B4. As described above, each of the plurality of magnet units 1071B1 to 1071B4 may be a quadrupole magnet. In another embodiment, each of the magnet units 1071B1 to 1071B4 may be a dipole magnet. Each of the magnet units 1071B1 to 1071B4 may face or overlap a corresponding one of the second coil units 1230-1 to 1230-4.

[0225] For example, the magnet units 1071B1 to 1071B4 may have the same size and shape. For example, two magnet units 1071B1 and 1071B3 facing each other in a first diagonal direction may have the same size and shape, and the remaining two magnet units 1071B2 and 1071B4 facing each other in a second diagonal direction may have the same size and shape.

[0226] In another embodiment, the size and shape of each of the two magnet units 1071B1 and 1071B3 may be different from the size and shape of each of the two remaining magnet units 1071B2 and 1071B4. For example, the length of the long side of each of the two magnet units 1071B1 and 1071B3 may be greater than the length of the long side of each of the two remaining magnet units 1071B2 and 1071B4. For example, the length of the short side of each of the two magnet units 1071B1 and 1071B3 may be equal to the length of the short side of each of the two remaining magnet units 1071B2 and 1071B4.

[0227] The second magnet 1071B may be disposed below the first magnet 1071A. The second magnet 1071B may be disposed on the lower surface of the first magnet 1071A. For example, the upper surface of the second magnet 1071B may contact the lower surface of the first magnet 1071A, or may be fixed or coupled to the lower surface of the first magnet 1071A via an adhesive. For example, at least a portion of the first magnet 1071A may overlap with at least a portion of the second magnet 1071B in the first direction (or optical axis direction).

[0228] In another embodiment, the second magnet may be spaced apart from the first magnet. Here, a portion of the housing 1140 may be disposed between the first and second magnets. In another embodiment, a partition wall or yoke may be disposed between the first and second magnets. Here, the description of partition wall 1030C may apply to the partition wall with or without modification.

[0229] For example, the length T2 of the second magnet 1071B in the optical axis direction may be smaller than the length T1 of the first magnet 1071A in the optical axis direction (T2<T1). In another embodiment, the length T2 may be equal to the length T1.

[0230] The length L2 of the long side of the second magnet 1071B may be equal to or less than the length L1 of the long side of the first magnet 1071A (L2≦L1). In another embodiment, the length L2 may be greater than the length L1.

[0231] Furthermore, the width W2 (or the length of the short side) of the second magnet 1071B may be equal to or less than the width W1 (or the length of the short side) of the first magnet 1071A (W2≦W1). In another embodiment, the width W2 may be greater than the width W1.

[0232] In the initial position of the AF moving unit, the first coil 1120 may face or overlap the first magnet 1071A in a direction perpendicular to the first direction (or optical axis direction). Figure 19aIn the embodiment, the N pole of the first magnet 1071A may be arranged to face the first coil 1120, or may be positioned closer to the first coil 1120 than the S pole, but in another embodiment, this arrangement may be reversed.

[0233] For example, in the initial position of the OIS moving unit, at least a portion of the first magnet 1130 may overlap with at least a portion of the second coil 1230 in the first direction (or optical axis direction). For example, in the initial position of the OIS moving unit, at least a portion of the second magnet 1071B may overlap with at least a portion of the second coil 1230 in the first direction (or optical axis direction).

[0234] The length L2 of the long side of the second magnet 1071B may be greater than the length L3 of the long side of the second coil 1230 ( L2 > L3 ). In another embodiment, the length of the long side of the second magnet 1071B may be equal to or less than the length of the long side of the second coil 1230 .

[0235] The width W2 (or the length of the short side) of the second magnet 1071B may be greater than the length L4 of the short side of the second coil 1230 (W2>L4). In another embodiment, the length of the long side of the second magnet 1071B may be equal to or less than the length of the long side of the second coil 1230.

[0236] For example, the length of the long side of each of the two magnet units 1081B1 and 1071B3 of the second magnet 1071B may be smaller than the length of the long side of each of the coil units 1230-1 and 1230-3 of the second coil 1230. In another embodiment, the length of the long side of each of the two magnet units 1071B1 and 1071B3 may be equal to or greater than the length of the long side of each of the coil units 1230-1 and 1230-3.

[0237] In addition, the length of the long side of each of the two remaining magnet units 1071B2 and 1071B4 of the second magnet 1071B may be greater than the length of the long side of each of the coil units 1230-2 and 1230-4 of the second coil 1230. In another embodiment, the length of the long side of each of the magnet units 1071B2 and 1071B4 may be equal to or less than the length of the long side of each of the coil units 1230-2 and 1230-4 of the second coil 1230.

[0238] For example, the length of the short side of each of the first to fourth magnet units 1071B1 to 1071B4 of the second magnet 1071B may be smaller than the length of the short side of each of the first to fourth coil units 1230-1 to 1230-4 of the second coil 1230. In another embodiment, the length of the short side of each of the first to fourth magnet units 1071B to 1071B4 may be greater than the length of the short side of each of the first to fourth coil units 1230-1 to 1230-4.

[0239] Figure 19b Shown Figure 5 Another embodiment of a magnet 1130 is shown.

[0240] Reference Figure 19b , Figure 19b The second magnet 1071BB shown may be a dipole magnet including one north pole and one south pole. Figure 19a The description of the lengths T2, L2, and W2 of the second magnet 1071B shown in FIG can be applied with or without modification to FIG. Figure 19b The second magnet 1071BB is shown in FIG.

[0241] The circuit board 1190 may be disposed on the housing 1140, and the first position sensor 1170 may be disposed or mounted on the circuit board 1190 and may be electrically connected to the circuit board 1190. For example, the circuit board 1190 may be disposed in the mounting groove 1014a in the housing 1140, and the terminal member 1095 of the circuit board 1190 may be exposed to the outside of the housing 1140.

[0242] The circuit board 1190 may include a terminal member (or terminal unit) 1095 including a plurality of terminals B1 to B4 electrically connected to an external terminal or an external device. The plurality of terminals B1 to B4 of the circuit board 1190 may be electrically connected to the first position sensor 1170 .

[0243] First position sensor 1170 may be provided on housing 1140 and / or circuit board 1190. For example, first position sensor 1170 may be provided on a first surface of circuit board 1190, and terminals B1 to B4 may be provided on a second surface of circuit board 1190. Here, the second surface of circuit board 1190 may be a surface opposite to the first surface of circuit board 1190. For example, the first surface of circuit board 1190 may be a surface of circuit board 1190 that faces bobbin 1110 or sensing magnet 1180. For example, circuit board 1190 may be a printed circuit board or a flexible printed circuit board.

[0244] The first position sensor 1170 may be electrically connected to the circuit board 1190. For example, the first position sensor 1170 may be electrically connected to the first to fourth terminals B1 to B4 of the circuit board 1190. For example, the circuit board 1190 may include a circuit pattern or a wire (not shown) configured to electrically connect the first to fourth terminals B1 to B4 to the first position sensor 1170.

[0245] For example, in the initial position of the AF operating unit, at least a portion of the first position sensor 1170 may face or overlap the sensing magnet 1180 in a direction perpendicular to the optical axis OA and parallel to a line passing through the optical axis OA. In another embodiment, in the initial position of the AF operating unit, the first position sensor may not face or overlap the sensing magnet.

[0246] First position sensor 1170 can be used to detect the movement, displacement, or position of bobbin 1110 in the optical axis direction. In other words, first position sensor 1170 can detect the magnetic field or magnetic field intensity of sensing magnet 1180 mounted on bobbin 1110 caused by the movement of bobbin 1110 and can output an output signal corresponding to the detection result. Therefore, the output of first position sensor 1170 can be used to detect the movement, displacement, or position of bobbin 1110.

[0247] The first position sensor 1170 may be a driver IC including a Hall sensor and a driver. The position sensor 1170 may include first to fourth terminals for transmitting and receiving data to and from an external device using data communication using a protocol such as I2C communication, and fifth and sixth terminals for directly providing a drive signal to the coil 1120.

[0248] For example, each of the first to fourth terminals of the first position sensor 1170 may be electrically connected to a corresponding one of the first to fourth terminals B1 to B4 of the circuit board 1190 using solder or a conductive adhesive.

[0249] For example, the fifth and sixth terminals of the first position sensor 1170 may be electrically connected to the first coil 1120. For example, the first position sensor 1170 may be electrically connected to the first coil 1120 via at least one of the upper elastic member 1150 and the lower elastic member 1160 to provide a driving signal to the first coil 1120.

[0250] For example, a portion of the first upper elastic unit 1150-1 can be connected to one end of the first coil 1120, and another portion of the first upper elastic unit 1150-1 can be electrically connected to the circuit board 1190. A portion of the second upper elastic unit 1150-2 can be connected to the other end of the first coil 1120, and another portion of the second upper elastic unit 1150-2 can be electrically connected to the circuit board 1190. The circuit board 1190 may include a first soldering pad 1005A electrically connected to another portion of the first upper elastic unit 1150-1 and a second soldering pad 1005B electrically connected to another portion of the second upper elastic unit 1150-2. Each of the fifth and sixth terminals of the first position sensor 1170 can be electrically connected to a corresponding one of the first and second soldering pads 1005A and 1005B of the circuit board 1190.

[0251] In another embodiment, the first coil 1120 may be electrically connected to the circuit board 1190 and the fifth and sixth terminals of the first position sensor 1170 through two lower elastic members.

[0252] For example, in an embodiment where the first position sensor 1170 is a driver IC, the first terminal B1 and the second terminal B2 of the circuit board 1190 may be power terminals for power supply, the third terminal B3 may be a terminal for sending and receiving a clock signal, and the fourth terminal B4 may be a terminal for sending and receiving a data signal.

[0253] In another embodiment, the first position sensor 1170 may be a Hall sensor. Here, the first position sensor 1170 may include two input terminals and two output terminals, the drive signal or power being provided to the two input terminals, and the sensing voltage (or output voltage) being output through the two output terminals. For example, the drive signal may be provided to the first position sensor 1170 through the first terminal B1 and the second terminal B2 of the circuit board 1190, and the output of the first position sensor 1170 may be output to the outside through the third terminal B3 and the fourth terminal B4. In addition, the first coil 1120 may be electrically connected to the circuit board 1190. In addition to the first terminal B1 to the fourth terminal B4, the circuit board 1190 may further include two additional terminals so that the external drive signal can be provided to the first coil 1120 via the two additional terminals.

[0254] For example, a ground terminal among the power terminals of the first position sensor 1170 may be electrically connected to the cover member 1300 .

[0255] Capacitor 1195 may be provided or mounted on the first surface of circuit board 1190. Capacitor 1195 may be configured to have a chip shape. Here, the chip may include a first terminal corresponding to one end of capacitor 1195 and a second terminal corresponding to the other end of capacitor 1195. Capacitor 1195 may also be referred to as a "capacitive element" or "condenser."

[0256] The capacitor 1195 may be electrically connected in parallel to the first terminal B1 and the second terminal B2 of the circuit board 1190, through which power (or a drive signal) is externally supplied to the first position sensor 1170. Alternatively, the capacitor 1195 may be electrically connected in parallel to the terminals of the first position sensor 1170, which are electrically connected to the first terminal B1 and the second terminal B2 of the circuit board 1190.

[0257] Since the capacitor 1195 is electrically connected in parallel with the first terminal B1 and the second terminal B2 of the circuit board 1190, the capacitor 1195 can be used as a filtering circuit (smoothing circuit) for eliminating the ripple components contained in the power supply signals GND and VDD provided to the first position sensor 1170 from the outside, thereby providing a stable and consistent power supply signal to the first position sensor 1170.

[0258] In another embodiment, the sensing magnet 1180 may be disposed on the housing 1140, and the first position sensor 1170 may be disposed on the bobbin 1110. In another embodiment, the balancing magnet 1185 may be omitted.

[0259] Upper elastic member 1150 and lower elastic member 1160 may be coupled to bobbin 1110 and housing 1140. For example, upper elastic member 1150 may be coupled to an upper portion, upper end, or upper surface of bobbin 1110 and an upper portion, upper end, or upper surface of housing 1140, and lower elastic member 1160 may be coupled to a lower portion, lower end, or lower surface of bobbin 1110 or an upper portion, upper end, or upper surface of housing 1140. Upper elastic member 1150 and lower elastic member 1160 may elastically support bobbin 1110 relative to housing 1140.

[0260] The upper elastic member 1150 may include a plurality of upper elastic units (e.g., 150-1 to 150-4) that are electrically separated or spaced apart from each other. Although the lower elastic member 1160 is implemented as a single elastic unit, in another embodiment, the lower elastic member 1160 may include a plurality of lower elastic units that are electrically separated or spaced apart from each other. In another embodiment, at least one of the upper elastic member or the lower elastic member may be implemented as a single unit or a single structure.

[0261] Upper elastic member 1150 may further include: a first inner frame 1151 coupled or fixed to the upper portion, upper surface, or upper end of bobbin 1110; a second inner frame 1152 coupled or fixed to the upper portion, upper surface, or upper end of housing 1140; and a first frame connector 1153 connecting first inner frame 1151 to first outer frame 1152. Furthermore, upper elastic member 1150 may include the aforementioned extension 1155.

[0262] Lower elastic member 1160 may include: a second inner frame 161 coupled or fixed to the lower portion, lower surface, or lower end of coil bobbin 1110; a second outer frame 1162 coupled or fixed to the lower portion, lower surface, or lower end of housing 1140; and a second frame connector 1163 connecting second inner frame 161 to second outer frame 1162. The inner frame may alternatively be referred to as an inner portion, the outer frame may alternatively be referred to as an outer portion, and the frame connector may alternatively be referred to as a connector.

[0263] Each of the first frame connector 1153 and the second frame connector 1163 may be bent or curved (or may be formed into a curve) at least once to define a predetermined pattern.

[0264] Each of the upper elastic member 1150 and the lower elastic member 1160 may be made of a conductive material, such as a metal material. In addition, each of the upper elastic member 1150 and the lower elastic member 1160 may be made of an elastic member, such as a leaf spring.

[0265] refer to Figure 5 、 Figure 7 a and Figure 7 b. For example, the second outer frame 1152 of the first upper elastic unit 1150-1 may include a first coupling portion 1004A coupled or electrically connected to the first solder pad 1005A of the circuit board 1190, and the second outer frame 1152 of the second upper elastic unit 1150-2 may include a second coupling portion 1004B electrically connected to the second solder pad 1005B of the circuit board 1190.

[0266] In another embodiment, at least one of the upper elastic member 1150 or the lower elastic member 1160 may include two elastic members. For example, each of the two elastic members of one of the upper elastic member 1150 and the lower elastic member 1160 may be coupled or electrically connected to a corresponding one of the first and second pads of the circuit board 1190. The first coil 1120 may be electrically connected to the two elastic members.

[0267] The first outer frame 1152 of the upper elastic member 1150 may include a first coupler 1510 coupled to the housing 1140, a second coupler 1520 coupled to the wire 1220, and a connector 1530 connecting the first coupler 1510 to the second coupler 1520. The first coupler 1510 may have a through hole or a hole for coupling to the first coupler 1143 of the housing 1140. The second coupler 1520 may have a through hole or a hole for coupling to the wire 1220. For example, the second coupler 1520 may be coupled to the wire 1220 using a conductive adhesive or solder. For example, while the connector 1530 may include a bent portion that is bent at least once, or a bent portion that is folded at least once, the present invention is not limited thereto. In another embodiment, the connector 1530 may have a linear shape.

[0268] Figure 9 is a perspective view of the image sensor unit 1350 . Figure 10a yes Figure 9 A first exploded perspective view of image sensor unit 1350 is shown. Figure 10b yes Figure 9 A second exploded perspective view of image sensor unit 1350 is shown. Figure 11 yes Figure 10a A bottom perspective view of the holder 1270 , the terminal member 1037 , the first board unit 1255 , the support plate 1310 , the heat dissipation member 1280 , the base 1210 , and the second board unit 1800 is shown. Figure 12 is a plan view of the holder 1270 , the first board unit 1255 , the image sensor 1810 , the second coil 1230 , and the OIS position sensor 1240 . Figure 13 is a rear perspective view of the holder 1270 and the first plate unit 1255 . Figure 14 It is a perspective view of the base 1210 , the terminal member 1037 , and the wire 1220 . Figure 15 12 is a bottom view of the first plate unit 1255 , the support plate 1310 , and the heat dissipation member 1280 . Figure 16 is a perspective view of the first plate unit 1255 , the support plate 1310 , and the heat dissipation member 1280 . Figure 17a is a first perspective view of the support plate 1310 coupled to the holder 1270 and the base 1210 . Figure 17b is a second perspective view of the support plate 1310 coupled to the holder 1270 and the base 1210 .

[0269] Reference Figures 9 to 17b The image sensor unit 1350 may include a fixed unit and an OIS moving unit, and the OIS moving unit is provided to be spaced apart from the fixed unit. The image sensor unit 1350 may include a supporting unit connecting the fixed unit to the OIS moving unit.

[0270] For example, the support unit may include the support plate 1310. Alternatively, for example, the support unit may be the support plate 1310. In another embodiment, the support unit may include an elastic member such as a leaf spring or a suspension wire instead of the support plate 1310.

[0271] The fixing unit may be a portion of the camera device 1010 that is immovable during OIS operation. For example, the fixing unit may include a board unit 1800. For example, the fixing unit may include a component coupled to a second board unit 1800. The board unit 255 or 800 may alternatively be referred to as a "board" or a "circuit board."

[0272] For example, the fixing unit may include a base 1210 coupled to the second plate unit 1800. For example, the fixing unit may include a housing 1140 of the AF operating unit, and components disposed on the housing 1140, such as a magnet 1130, a first position sensor 1170, and a circuit board 1190. Furthermore, the fixing unit may include a cover member 1300 coupled to the base 1210. The OIS moving unit may be disposed in the cover member 1300. For example, the cover member 1300 may accommodate the OIS moving unit and the support plate 1310 therein.

[0273] The OIS moving unit may include an image sensor 1810. The OIS moving unit may also include a first board unit 1255 that is spaced apart from and electrically connected to the second board unit 1800. For example, the OIS moving unit may include components disposed on the first board unit 1255, such as at least one of a heat dissipation member 1280, a holder 1270, a second coil 1230, and a second position sensor 1240. The holder 1270 may also be referred to as a "spacer member." In another embodiment, the holder 1270 may be omitted, and the second coil 1230 may be disposed on the first board unit 1255, such as on the first circuit board 1250.

[0274] For example, the camera device 1010 may include a fixed unit, a mobile unit, and a support unit (e.g., 310), wherein the mobile unit includes a first heat dissipation member 1280 disposed on the fixed unit and an image sensor 1810 disposed in the first heat dissipation member 1280, and the support unit is configured to support the mobile unit while allowing the mobile unit to move in a direction perpendicular to the optical axis. The support unit (e.g., 310) may be connected between the mobile unit and the fixed unit.

[0275] The moving unit may include a first board unit 1255 on which the image sensor 1810 is disposed, the fixing unit may include a second board unit 1800 disposed to be spaced apart from the first board unit 1255 , and the supporting unit may connect the first board unit 255 to the second board unit 1800 .

[0276] The support unit may include a conductive layer 1093-1, a first insulating layer 1094-1 disposed below the conductive layer 1093-1, and a second insulating layer 1094-2 disposed on the conductive layer 1093-1. The support unit may be configured such that a portion of the first insulating layer 1094-1 is removed, thereby exposing a region of the conductive layer 1093-1 through the removed portion.

[0277] The first board unit 1255 may include a first circuit board 1250 , a second circuit board 1260 electrically connected to the image sensor 1810 , and solder 1901 electrically connecting the first circuit board 1250 to the second circuit board 1260 .

[0278] The camera device 1010 may include an elastic member 220 (hereinafter referred to as a "wire") configured to flexibly support the OIS moving unit. The elastic member 220 may have a form of a wire or a spring.

[0279] For example, one end of the wire 1220 can be coupled to the upper elastic member 1150 (or the housing 1140), and the other end of the wire 1220 can be coupled to the holder 1270. For example, one end of the wire 1220 can be coupled to the first outer frame 1152 (e.g., the second coupler 1520) of the upper elastic member 1150 using solder or a conductive adhesive. For example, the other end of the wire 1220 can be coupled to the terminal member 1037, and the terminal member 1037 can be provided on or coupled to the holder 1270 using solder or a conductive adhesive.

[0280] Reference Figure 7 a and Figure 7 b. A damper DA may be disposed between one end of the wire 1220 extending through the hole 1147 in the housing 1140 and the hole 1147 in the housing 1140. For example, at least a portion of the damper DA may be disposed in the hole 1147 in the housing 1140 and may be coupled or attached to the housing 1140 and at least a portion of the wire 1220.

[0281] For example, the wire 1220 can be arranged parallel to the optical axis. For example, the wire 1220 can be arranged at a corner of the housing 1140 and / or a corner of the holder 1270. For example, the wire 1220 can include four wires 1220-1 to 1220-4. Each of the four wires 1220-1 to 1220-4 can be arranged at a corresponding one of the four corners of the housing 1140 and / or the four corners of the holder 1270.

[0282] Reference Figure 10a to Figure 1 Of, a hole 1271 may be formed in the retaining member 1270, through which at least a portion of the wire 1220 extends. For example, a corner of the retaining member 1270 may be formed through the hole 1271, through which the other end of the wire 1220 extends. For example, each of the four corners of the retaining member 1270 may have a hole 1271 formed therein. For example, while the hole 1271 may be a through hole formed through the retaining member 1270 in the direction of the optical axis, in another embodiment, the hole 1271 may also be in the form of a relief groove.

[0283] For example, the terminal member 1037 may be disposed on or coupled to the upper or lower surface of the holder 1270. For example, the terminal member 1037 may be disposed on or coupled to the lower surface of a corner of the holder 1270. The holder 1270 may have a groove 1028A formed therein, and the terminal member 1037 may be disposed in the groove 1028A. For example, the groove 1028A may be formed in the lower surface of the corner of the holder 1270.

[0284] Holder 1270 may include at least one protrusion 1028B, and terminal member 1037 may have at least one hole 1081A for coupling to at least one protrusion 1028B of holder 1170. Terminal member 1037 and holder 1270 may be coupled to each other using an adhesive or by heat fusion. Terminal member 1037 may have a hole 1071B into which the other end of wire 1220 is inserted or coupled. For example, each of holes 1081A and 1071B may be a through hole.

[0285] For example, the terminal member 1037 may include a body 1081 coupled to the retainer 1270. The body 1081 may include a connector 1071 coupled to the wire 1220. The connector 1071 may include a coupling region 1071A coupled to the wire 1220 and a hole 1071B formed in the first coupling region 1071A. The coupling region 1071A may be a region of the body 1081 coupled to the wire 1220 using solder or a conductive adhesive. For example, the other end of the wire 1220 passing through the hole 1071B may be connected to the lower portion or lower surface of the coupling region 1071A using solder or a conductive adhesive.

[0286] For example, the body 1081 may have at least one hole 1071C formed around the coupling region 1071 A. For example, the body 1081 may have a plurality of holes 1071C around the coupling region 1071 A. For example, the plurality of holes 1071C may be spaced apart from the hole 1071B.

[0287] The body 1081 may include a support portion located between the plurality of holes 1071C to support the coupling region 1071A. The support portion 1071D may also be referred to as a "connector" or "bridge." The support portion 1071D may include a plurality of support portions spaced apart from each other. The support portion 1071D may be connected to the coupling region 1071A.

[0288] The at least one hole 1071C may be used to allow solder to be formed primarily only in the coupling region 1071A during soldering due to interfacial tension (eg, surface tension) in a peripheral area of ​​the coupling region 1071A.

[0289] In order to perform welding, the connection area 1071A must be heated. Here, at least one hole 1071C can inhibit or prevent the heat of the connection area 1071A from being transferred to another area, while preventing the formation of a welded portion in the remaining area of ​​the body 1081. In other words, at least one hole 1071C can improve welding efficiency.

[0290] The terminal member 1037 may include an extension 1082 extending from the body 1081. The extension 1082 may be bent downward at the body 1081 and may extend downward. For example, the extension 1082 may extend toward the hole 1059 in the base 1210. The extension 1082 may also be referred to as a "bend portion."

[0291] For example, the terminal member 1037 may include four terminals 1037A to 1037D corresponding to the four wires 1220-1 to 1220-4 of the terminal member 1037. Each of the terminals 1037A to 1037D may be disposed on a corresponding one of the corners of the holder 1270 and may be coupled to a corresponding one of the wires 1220-1 to 1220-4. Figure 10a The description can be applied to the structure of each of the terminals 1037A to 1037D with or without modification. The terminal member 1037 can be made of a conductive material, such as metal. In another embodiment, the terminal member 1037 can be omitted, and the wire 1220 can be directly connected to the retaining member 1270.

[0292] Reference Figure 14, a damper or adhesive 1049 may be provided between the terminal member 1037 and the base 1210 and may be in contact with, coupled to, or attached to the terminal member 1037 and the base 1210. For example, the base 1210 may have a hole 1059 (or a groove) formed at a position corresponding to or facing the terminal member 1037. For example, the hole 1059 (or groove) may be formed at a corner of the base 1210.

[0293] For example, the damper 1049 may be disposed in the hole 1059 in the base 1210. Alternatively, at least a portion of the extension 1082 of the terminal member 1037 may be disposed in the hole 1059 in the base 1210, and the damper 1049 may be in contact with, coupled to, or attached to the extension 1082. The damper 1049 may be used to absorb or mitigate vibrations of the OIS moving unit, thereby preventing or suppressing oscillations of the OIS moving unit during OIS operation.

[0294] In another embodiment, extension 1082 may be omitted from terminal member 1037, and camera device 1010 may not include Figure 14 Damper 1049 is shown.

[0295] The support plate 1310 may support the OIS moving unit relative to the fixing unit such that the OIS moving unit moves in a direction perpendicular to the optical axis, tilts relative to the optical axis, or rotates within a predetermined range.

[0296] For example, one end of the support plate 1310 may be connected or coupled to the first plate unit 1255 , and the other end of the support plate 1310 may be connected or coupled to the second plate unit 1800 .

[0297] A retainer 1270 may be provided below the AF operating unit. For example, retainer 1270 may be made of a non-conductive member. For example, retainer 1270 may be made of an injectable material that is easily molded using an injection molding process. Furthermore, retainer 1270 may be made of an insulating material. Furthermore, retainer 1270 may be made of, for example, resin or plastic.

[0298] Reference Figure 10a , Figure 10f and Figure 12 The holder 1270 may include an upper surface, a lower surface opposite to the upper surface, and a side surface (eg, outer surface) connecting the upper surface to the lower surface. For example, the lower surface of the holder 1270 may be opposite to or face the second board unit 1800.

[0299] The holder 1270 can support the first board unit 1255 and can be coupled to the first board unit 1255. For example, the first board unit 1255 can be disposed below the holder 1270. The lower portion, lower surface, or lower end of the holder 1270 can be coupled to the upper portion, upper surface, or upper end of the first board unit 1255. For example, the holder 1270 can be coupled to the first board unit 1255 using an adhesive. In another embodiment, for example, the first board unit 1255 can be disposed above the holder 1270.

[0300] The holder 1270 may accommodate or support the second coil 1230. The holder 1270 may support the second coil 1230 while being spaced apart from the first board unit 1255. For example, at least a portion of the holder 1270 may be disposed between the second coil 1230 and the first board unit 1255.

[0301] The holder 1270 may have a through-hole 1070 corresponding to one area of ​​the first board unit 1255. For example, the through-hole 1070 in the holder 1270 may be a through-hole formed through the holder 1170 in the optical axis direction. For example, the through-hole 1270 in the holder 1270 may correspond to, face, or overlap with the image sensor 1810 in the optical axis direction.

[0302] Although the through-hole 1070 in the holder 1270 may have a polygonal shape, such as a quadrilateral, a circle, or an ellipse, when viewed from above, the present invention is not limited thereto. The through-hole 1070 may have any of a variety of shapes.

[0303] For example, the through-hole 1070 in the holder 1270 may be configured to have a shape or size that exposes the image sensor 1810, a portion of the upper surface of the first circuit board 1250, the upper surface of the second circuit board 1260, and components. For example, the surface area of ​​the through-hole 1070 in the holder 1270 may be larger than the surface area of ​​the image sensor 1810, and may be smaller than the surface area of ​​the through-hole 1250A in the first circuit board 1250.

[0304] Reference Figure 11 The holder 1270 may have holes 1041A, 1041B, and 1041C therein corresponding to the second position sensor 1240. For example, the holder 1270 may have holes 1041A, 1041B, and 1041C therein formed at positions corresponding to the first to third sensors 1240A, 1240B, and 1240C, respectively.

[0305] For example, holes 1041A, 1041B, and 1041C may be located near corners of retaining member 1270. Retaining member 1270 may also have dummy holes 1041D formed adjacent to corners of retaining member 1270, which do not correspond to any second position sensors 1240. Dummy holes 1041D may be used to achieve weight balance of the OIS moving unit during OIS operation. Dummy holes 1041D may be through holes. In another embodiment, dummy holes 1041D may not be formed. Holes 1041A, 1041B, and 1041C may be formed through retaining member 1270 in the direction of the optical axis. In another embodiment, holes 1041A, 1041B, and 1041C in retaining member 1270 may be omitted.

[0306] The upper surface of the holder 1270 may be provided with at least one coupling protrusion 1051 configured to be coupled to the second coil 1230. The coupling protrusion 1051 may protrude upward or toward the AF operating unit from the upper surface of the holder 1270. For example, the coupling protrusion 1051 may be formed adjacent to each of the holes 1041A to 1041D in the holder 1270.

[0307] For example, two coupling protrusions 1051A and 1051B may be provided or arranged at the holder 1270 to correspond to each hole 1041A to 1041D in the holder 1270. For example, each hole 1041A, 1041B, 1041C, and 1041D in the holder 1270 may be located between the two coupling protrusions 1051A and 1051B.

[0308] The retainer 1270 may include one or more couplers 1027A and 1027B to which at least a portion of the support plate is coupled. The couplers 1027A and 1027B may be coupled to the connectors 1320A and 1320B of the support plate 1310. For example, the first coupler 1027A may be coupled to the first connector 1320A, and the second coupler 1027B may be coupled to the second connector 1320B.

[0309] Reference Figure 12 、 Figure 17a and Figure 17b , the connectors 1027A and 1027B may be provided on the side of the holder 1270. Although Figure 12 In the illustrated embodiment, the couplers 1027A and 1027B may be flat portions of the side of the holder 1270, but in another embodiment, the couplers of the holder 1270 may be protrusions protruding from the upper surface of the holder 1270. For example, the couplers of the holder 1270 may protrude from the outer surface of the holder 1170 in the direction of the optical axis or in the upward direction.

[0310] For example, the holder 1270 may include two protrusions 1027A and 1027B that face or overlap or are opposite to each other in the second horizontal direction (eg, in the X-axis direction).

[0311] For example, the holder 1270 may include four sides (or side panels), and the couplers 1027A and 1027B may be formed on two of the four side panels, respectively. For example, each of the couplers 1027A and 1027B may be disposed or positioned at the center of the corresponding side (or side panel) of the holder 1270. In another embodiment, the couplers of the holder 1270 may be provided with a groove therein, and the adhesive may be received or disposed in the groove.

[0312] The first board unit 1255 may include a first circuit board 1250 and a second circuit board 1260 electrically connected to each other. The second circuit board 1260 may also be referred to as a “sensor board.” In another embodiment, a heat dissipation member 1280 may be included in the first board unit 1255 .

[0313] The first board unit 1255 may be disposed on the lower surface of the holder 1270. For example, the first board unit 1255 may be coupled to the lower surface of the holder 1270. For example, the first circuit board 1250 may be disposed on and / or coupled to the lower surface of the holder 1270. For example, the first surface of the first circuit board 1250 may be coupled or attached to the lower surface of the holder 1270 using an adhesive member.

[0314] Here, the first surface of the first circuit board 1250 may be opposite to or face the AF operating unit and may be a surface on which the second position sensor 1240 is provided. The second surface of the first circuit board 1250 may be a surface opposite to the first surface of the first circuit board 1250.

[0315] The first circuit board 1250 may alternatively be referred to as a “sensor board,” “main board,” “main circuit board,” “sensor circuit board,” “mobile circuit board,” etc. In all embodiments, the first circuit board 1250 may alternatively be referred to as a “second board” or “second circuit board,” and the second circuit board 1260 may alternatively be referred to as a “first board” or “first circuit board.”

[0316] Second position sensors 1240 (1240A, 1240B, and 1240C) may be provided on the first circuit board 1250 to detect movement of the OIS moving unit in a direction perpendicular to the optical axis and / or rotation, tilt, or roll of the OIS moving unit relative to the optical axis. Furthermore, a controller 1830 and / or circuit elements (e.g., capacitors) may be provided on the first circuit board 1250.

[0317] The first circuit board 1250 may include first terminals E1 to E8 to electrically connect to the second coil 1230. Here, the first terminals E1 to E8 may alternatively be referred to as "first pads" or "first coupling portions." The first terminals E1 to E8 of the first circuit board 1250 may be disposed or arranged on the first surface 60A of the first circuit board 1250. For example, the first circuit board 1250 may be a printed circuit board or a flexible printed circuit board (FPCB).

[0318] The first circuit board 1250 may have a through-hole 1250A that corresponds to or faces the through-holes of the bobbin 1110 and the lens module 1400. For example, the through-hole 1250A in the first circuit board 1250 may be a through-hole or a cavity formed through the first circuit board 1250 in the optical axis direction and may be formed at the center of the first circuit board 1250.

[0319] When viewed from above, the shape of the first circuit board 1250, such as the outer periphery of the first circuit board 1250, can be a shape that coincides with or corresponds to the shape of the holder 1270, such as a quadrilateral. When viewed from above, the through-hole 1250A in the first circuit board 1250 can have a polygonal shape, such as a quadrilateral, a circle, or an ellipse. For example, the through-hole 1250a in the first circuit board 1250 can open or expose the image sensor 1810 and / or the through-hole 1260A in the second circuit board 1260.

[0320] The first circuit board 1250 may include at least one terminal 1251 to electrically connect to the second circuit board 1260. The terminal 1251 of the first circuit board 1250 may alternatively be referred to as a "pad" or a "bonding portion." The terminal 1251 of the first circuit board 1250 may be provided or arranged on the lower surface of the first circuit board 1250.

[0321] For example, the terminal 1251 may include a plurality of terminals, and the plurality of terminals 1251 may be provided and arranged in a region between the through-hole 1250A in the first circuit board 1250 and one side of the first circuit board 1250 in a direction parallel to the one side. For example, the plurality of terminals 1251 may be provided to surround the through-hole 1250A.

[0322] The second circuit board 1260 may be disposed below the first circuit board 1250. The second circuit board 1260 may be electrically connected to the image sensor 1810.

[0323] When viewed from above, although the second circuit board 1260 may have a polygonal shape (eg, a quadrilateral shape, a square shape, or a rectangular shape), the present disclosure is not limited thereto. In another embodiment, the second circuit board 1260 may have a circular shape or an elliptical shape.

[0324] For example, the surface area of ​​the outer periphery of the second circuit board 1260 may be greater than the surface area of ​​the through-hole 1250A in the first circuit board 1250. For example, the underside of the through-hole 1250A in the first circuit board 1250 may be obscured or blocked by the second circuit board 1260.

[0325] For example, when viewed from above or below, the outer surface (or outside) of the second circuit board 1260 may be located between the outer surface (or side) of the first circuit board 1250 and the through-hole 1250A in the first circuit board 1250a.

[0326] For example, second circuit board 1260 may have a through-hole 1260A corresponding to through-hole 1250A in first circuit board 1250 and / or image sensor 1810. Through-hole 1260A in second circuit board 1260 may be a hole or cavity formed through second circuit board 1260 and may be formed in the center of second circuit board 1260.

[0327] For example, the through-hole 1260A in the second circuit board 1260 may open or expose the image sensor 1810. For example, the image sensor 1810 may be disposed in the through-hole 1260A in the second circuit board 1260 and may be electrically connected to the second circuit board 1260. For example, the image sensor 1810 may be electrically connected to the second circuit board 1260 via a wire.

[0328] In another embodiment, the through-hole 1260A may not be formed in the second circuit board 1260 , and the image sensor 1810 may be disposed on the upper surface of the second circuit board 1260 .

[0329] In another embodiment, the heat dissipation member 1280 may be omitted. In an embodiment where the heat dissipation member 1280 is omitted, the through-hole 1260A may not be formed in the second circuit board 1260 , and the image sensor 1810 may be disposed on the upper surface of the second circuit board 1260 .

[0330] In an embodiment where the heat dissipation member 1280 is omitted, for example, the image sensor 1810 may be provided on an upper surface of a single board in which the first circuit board and the second circuit board are integrally formed.

[0331] The second circuit board 1260 may include at least one terminal 1261 electrically connected to the at least one terminal 1251 of the first circuit board 1250. For example, the terminal 1261 of the second circuit board 1260 may include a plurality of terminals.

[0332] For example, at least one terminal 1261 of the second circuit board 1260 may be formed on a side surface or outer surface of the second circuit board 1260, connecting the upper surface and lower surface of the second circuit board 1260 to each other. The upper surface of the second circuit board 1260 may be the surface facing the first circuit board 1250, and the lower surface of the second circuit board 1260 may be the surface opposite to the upper surface of the second circuit board. For example, the terminal 1261 may have the form of a groove having a structure recessed from the side surface of the second circuit board 1260. Alternatively, for example, the terminal 1261 may have the form of a circular or semi-elliptical through-hole formed in the side surface of the second circuit board 1260. In another embodiment, at least one terminal of the second circuit board 1260 electrically connected to the second terminal 1251 of the first circuit board 1250 may be formed on the upper surface of the second circuit board 1260.

[0333] For example, the terminals 1261 of the second circuit board 1260 may be soldered or the conductive path portion 1901 (see FIG. Figure 11 ) is connected to the terminal 1251 of the first circuit board 1250. Although Figure 13 The enlarged dotted portion in the figure shows only one terminal of the second circuit board 1260 and one terminal 1251 of the first circuit board, but solder may be provided which is configured to connect the other terminal of the second circuit board 1260 to the corresponding terminal of the first circuit board 1250.

[0334] For example, each of the first circuit board 1250 and the second circuit board 1260 may be a printed circuit board or a flexible printed circuit board (FPCB). At least one of the first circuit board 1250 and the second circuit board 1260 may be an organic board or a ceramic board.

[0335] The heat dissipation member 1280 may be disposed on or coupled to the first board unit 1255. For example, the heat dissipation member 1280 may be disposed on or coupled to the second circuit board 1260. For example, the heat dissipation member 1280 may be disposed below the second circuit board 1260. For example, the heat dissipation member 1280 may be coupled or fixed to the lower surface of the second circuit board 1260. For example, at least a portion of the upper surface of the heat dissipation member 1280 may be coupled or fixed to the lower surface of the second circuit board 1260.

[0336] The term "heat dissipation member" may be used interchangeably with "heat dissipation fin," "heat dissipation tape," "heat dissipation layer," "heat dissipation film," "heat insulation board," "heat radiating plate," or "heat dissipation body."

[0337] In another embodiment, the heat dissipation member 1280 may be included in the first board unit 1255 , and the image sensor 1810 may be disposed on the first board unit 1255 .

[0338] The through-hole 1260A in the second circuit board 1260 can open or expose at least a portion of the heat dissipation member 1280. The image sensor 1810 can be disposed on, attached to, or coupled to the at least a portion of the heat dissipation member 1280 exposed through the through-hole 1260A. For example, the image sensor 1810 can be fixed, attached to, or coupled to the heat dissipation member 1280 using an adhesive. For example, the image sensor 1810 can be disposed on the first board unit 1255.

[0339] For example, at least one area of ​​the upper surface of the heat dissipation member 1280 may be exposed through the perforation 1260A, and the image sensor 1810 may be disposed on, attached to, or coupled to the at least one area of ​​the upper surface of the heat dissipation member 1280 exposed through the perforation 1260A.

[0340] In another embodiment, the second circuit board 1260 may include a groove formed in a lower surface thereof to accommodate or dispose the heat dissipation member 1280 therein.

[0341] In another embodiment, the through-hole 1260A may not be formed in the second circuit board 1260, and the heat dissipation member 1280 may be fixed, attached, or coupled to the lower surface of the second circuit board 1260. In another embodiment, the heat dissipation member 1280 may be omitted.

[0342] For example, the heat dissipation member 280 may be a plate-shaped member having a predetermined thickness and hardness. The heat dissipation member 1280 may improve the effect of dissipating heat generated by the heat source of the first board unit 1255 toward the outside. Here, the heat source of the first board unit 1255 may be an electronic component (or circuit element) provided on the first board unit 1255, such as the image sensor 1810, the controller 1830, the second position sensor 1240, and / or a capacitor.

[0343] For example, the heat dissipation member 1280 may include a metal material having high thermal conductivity and high heat dissipation efficiency, such as at least one of stainless steel, aluminum, nickel, phosphorus, cyan through-holes, or through-holes.

[0344] The heat dissipation member 1280 may serve to stably support the image sensor 1810 and may function as a reinforcement material for suppressing damage to the image sensor 1810 due to external impact or contact.

[0345] In another embodiment, the heat dissipation member 1280 may be made of a heat dissipation member having high thermal conductivity, such as an exothermic epoxy resin, an exothermic plastic (eg, polyimide), or an exothermic synthetic resin.

[0346] For example, in one embodiment, the term "heat dissipation member" may be used interchangeably with "heat dissipation body", "heat sink", "heat dissipation plate", "heat sink", "plate", "metal plate", "reinforcement material" or "reinforcement member".

[0347] In order to improve heat dissipation efficiency, the heat dissipation member 1280 may include a predetermined pattern having at least one groove or at least one unevenness. For example, grooves or uneven portions having a predetermined pattern may be formed in the lower surface of the heat dissipation member 1280.

[0348] For example, the predetermined pattern may include a plurality of grooves spaced apart from each other at predetermined intervals. For example, the predetermined pattern may have a striped shape. In another embodiment, the predetermined pattern may have a mesh or mesh shape. In another embodiment, the predetermined pattern may have a shape having dots spaced apart from each other. For example, each dot may have a circular, elliptical, or polygonal (e.g., quadrilateral) shape.

[0349] In another embodiment, a predetermined pattern may be formed on at least one of the upper surface, lower surface, or outer surface of the heat dissipation member 1280. In another embodiment, the heat dissipation member 1280 may include perforations or through holes instead of grooves or uneven portions. Because the heat dissipation member 1280 moves together with the OIS moving unit, the heat dissipation member 1280 may be spaced apart from the fixed unit (e.g., the second plate unit 1800). The heat dissipation member 1280 may include at least one avoidance groove 281 (see FIG. Figure 10a ) to avoid spatial interference with solder 1901.

[0350] Despite Figure 13 The first circuit board 1250 and the second circuit board 1260 are electrically coupled to each other using the conductive path portion 1901 , but in another embodiment, the first board and the second board may be implemented as a single integrated circuit board.

[0351] The second coil 1230 may be provided on or coupled to the OIS moving unit. For example, the second coil 1230 may be provided on the holder 1270. The second coil 1230 may be provided on the upper surface of the holder 1270. The second coil 1230 may be provided below the magnet 1130.

[0352] The second coil 1230 may be coupled to the holder 1270. For example, the second coil 1230 may be coupled or attached to the upper surface of the holder 1270. For example, the second coil 1230 may be coupled to the coupling protrusion 1251 of the holder 1270. The second coil 1230 may move the OIS moving unit by interacting with the magnet 1130.

[0353] For example, the second coil 1230 may correspond to, face, or overlap the magnet 1130 provided on the fixed unit in the direction of the optical axis OA. In another embodiment, the fixed unit may include a dedicated OIS magnet independent of the magnet of the AF operating unit, and the second coil may correspond to, face, or overlap the dedicated OIS magnet. Here, the OIS magnet may include the same number of OIS magnets as the number of coil units included in the second coil 1230.

[0354] In another embodiment, the OIS magnet may be provided on the fixed unit of the second coil 1230, and the OIS magnet 1071B of the magnet 1130 may be provided on the OIS moving unit. Here, the second coil 1230 may be electrically connected to the support plate 1310 and / or the second plate unit 1800 via a conductive member.

[0355] For example, the second coil 1230 may include a plurality of coil units 1230-1 to 1230-4. For example, the second coil 1230 may include four coil units 1230-1 to 1230-4 disposed at four corners of the holder 1270. For example, at least a portion of each of the coil units 1230-1 to 1230-4 may be disposed at a corresponding corner of the holder 1270. A portion of each of the coil units 1230-1 to 1230-4 may be disposed on a side adjacent to a corresponding corner of the holder 1270.

[0356] Each of coil units 1230-1 to 1230-4 can have the form of a coil block in a closed loop or annular shape. For example, each coil unit can have a cavity or hole. For example, each coil unit can be composed of a fine pattern (FP) coil, a wound coil, or a coil block. For example, the cavity or hole in each of coil units 1230-1 to 1230-4 can be assembled on or coupled to the protrusion 1251 of the holder 1270.

[0357] In another embodiment, the second coil 1230 may be disposed on the first circuit board 1250 and may be coupled to the first circuit board 1250 .

[0358] The second coil 1230 can be electrically connected to the first circuit board 1250. For example, the first coil unit 1230-1 can be electrically connected to two terminals E1 and E2 of the first circuit board 1250, and the second coil unit 1230-2 can be electrically connected to the other two terminals E3 and E4. In addition, the third coil unit 1230-2 can be electrically connected to two other terminals E5 and E6 of the first circuit board 250, and the fourth coil unit 1230-4 can be electrically connected to the other two terminals E7 and E8 of the first circuit board 1250.

[0359] Power or a driving signal may be provided to the first to fourth coil units 1230-1 to 1230-4 through the first circuit board 1250. The power or driving signal provided to the second coil 1230 may be a DC signal, an AC signal, or a signal containing DC and AC components, and may be a voltage type or a current type.

[0360] Through interaction between the first to fourth magnet units 1130 - 1 to 1130 - 4 and the first to fourth coil units 1230 - 1 to 1230 - 4 , the OIS moving unit may move in the first or second horizontal direction, or may roll with respect to the optical axis.

[0361] For example, current may be independently applied to at least three coil units among the four coil units 1230 - 1 to 1230 - 4 . In another embodiment, current may be independently applied to at least two coil units among the four coil units 1230 - 1 to 1230 - 4 .

[0362] For example, an independent driving signal, such as an independent driving current, may be provided to each of the four coil units 1230 - 1 to 1230 - 4 .

[0363] The controllers 1830 and 780 may provide at least one drive signal to at least one of the first to fourth coil units 1230-1 to 1230-4, and may move the OIS moving unit in the X-axis direction and / or the Y-axis direction, or may rotate the OIS moving unit within a predetermined angular range around the optical axis by controlling at least one drive signal. Hereinafter, the "controller" may be at least one of the controller 1830 of the camera device 1010 or the controller 780 of the optical instrument 200A.

[0364] When the second coil 1230 is driven through three channels, three independent drive signals can be provided to the second coil 1230. For example, among the four coil units, two coil units (e.g., 1230-2 and 1230-4 or 1230-1 and 1230-3) diagonally opposite each other can be connected in series, and one drive signal can be provided to the two coil units connected in series. Independent drive signals can be provided to the other two coil units in the four coil units.

[0365] Alternatively, when the second coil 1230 is driven through four channels, independent driving signals may be respectively provided to four coil units 1230 - 1 to 1230 - 4 that are separated from each other.

[0366] Figure 18a is a view illustrating movement of the OIS moving unit in the X-axis direction. Figure 18bis a view illustrating movement of the OIS moving unit in the Y-axis direction.

[0367] The north pole and south pole of each of the first magnet unit 1071B1 and the third magnet unit 1071B3 facing each other in the first diagonal direction can be arranged to face each other in the first horizontal direction (for example, in the Y-axis direction). In addition, the north pole and south pole of each of the second magnet unit 1071B2 and the fourth magnet unit 1071B4 facing each other in the second diagonal direction perpendicular to the first diagonal direction can be arranged to face each other in the second horizontal direction (for example, in the X-axis direction).

[0368] In other words, the directions of the N pole and the S pole of the first magnet unit 1071B1 may be the same as or parallel to the direction in which the N pole and the S pole of the fourth magnet unit 1071B4 face each other.

[0369] In another embodiment where the second magnet 1071B is a dipole magnet, the north pole of each of the first to fourth magnet units 1071B1 to 1071B4 may be located on the inner side and the south pole may be located on the outer side based on the boundary line (or boundary plane) between the north pole and the south pole. In another embodiment, the south pole of each of the first to fourth magnet units 1071B1 to 1071B4 may be located on the inner side and the north pole may be located on the outer side based on the boundary line between the north pole and the south pole. The boundary line (or boundary plane) may be a portion that is almost completely non-magnetic and has almost no polarity.

[0370] Reference Figure 18a The OIS moving unit can be moved or displaced in the X-axis direction by the first electromagnetic force Fx1 (or Fx3) generated by the interaction between the second coil unit 1230-2 and the second magnet unit 1071B2 and the second electromagnetic force Fx2 (or Fx4) generated by the interaction between the fourth coil unit 1230-4 and the fourth magnet unit 1071B4. For example, the directions of the first electromagnetic force Fx1 (or Fx3) and the second electromagnetic force Fx2 (or Fx4) can be the same.

[0371] Reference Figure 18b The OIS moving unit can be moved or displaced in the Y-axis direction by the third electromagnetic force Fy1 (or Fy3) generated by the interaction between the first coil unit 1230-1 and the first magnet unit 1071B1, and the fourth electromagnetic force (Fy2 (Fy4)) generated by the interaction between the third coil unit 1230-3 and the third magnet unit 1071B3. For example, the directions of the third electromagnetic force Fy1 (or Fy3) and the fourth electromagnetic force Fy2 (or Fy4) can be the same.

[0372] Figure 18cThe clockwise rotation of the OIS moving unit in the case of being driven by four channels is shown. Figure 18d The counterclockwise rotation of the OIS moving unit in the case of being driven by four channels is shown.

[0373] Reference Figure 18c With the help of the first electromagnetic force FR1 generated by the interaction between the first coil unit 1230-1 and the first magnet unit 1071B1, the second electromagnetic force FR2 generated by the second coil unit 1230-2 and the second magnet unit 1071B2, the third electromagnetic force FR3 generated by the interaction between the third coil unit 1230-3 and the third magnet unit 1071B3, and the fourth electromagnetic force FR4 generated by the interaction between the fourth coil unit 1230-4 and the fourth magnet unit 1071B4, the OIS moving unit can rotate clockwise around the optical axis, or tilt or roll relative to the optical axis.

[0374] Reference Figure 18d , with the help of a first electromagnetic force FL1 generated by the interaction between the first coil unit 1230-1 and the first magnet unit 1071B1, a second electromagnetic force FL2 generated by the second coil unit 1230-2 and the second magnet unit 1071B2, a third electromagnetic force FL3 generated by the interaction between the third coil unit 1230-3 and the third magnet unit 1071B3, and a fourth electromagnetic force FL4 generated by the interaction between the fourth coil unit 1230-4 and the fourth magnet unit 1071B4, the OIS moving unit can rotate counterclockwise around the optical axis, or can tilt or roll relative to the optical axis.

[0375] For example, the direction of the first electromagnetic force FR1 (or FL1) and the direction of the third electromagnetic force FR3 (or FL3) may be opposite to each other. Furthermore, for example, the direction of the second electromagnetic force FR2 (or FL2) and the direction of the fourth electromagnetic force FR4 (or FL4) may be opposite to each other. Furthermore, for example, the direction of the first electromagnetic force RF1 (or FL1) and the direction of the second electromagnetic force FR2 (or FL2) may be perpendicular to each other.

[0376] In the case of driving through three channels, the driving signal may not be provided to the two coil units connected in series (for example, 1130-1 and 1130-3 or 1130-2 and 1130-4), and thus the electromagnetic force caused by the two coil units connected in series may not be generated. For example, in the case of driving through three channels, the electromagnetic forces FR2 and FR4 may be omitted, and the electromagnetic forces FR1 and FR3 may exist Figure 18c Alternatively, in the case of driving through three channels, there may be electromagnetic forces R2 and FR4, and Figure 18cIn addition, in the case of driving by three channels, the electromagnetic forces FL2 and FL4 can be omitted, and the electromagnetic forces FL1 and FL3 can exist in Figure 18d Alternatively, in the case of driving through three channels, there may be electromagnetic forces FL2 and FL4, and Figure 18d Electromagnets FL1 and FL3 are omitted.

[0377] Compared with driving through three channels, Figure 18c and Figure 18d The driving through four channels shown can increase the electromagnetic force required for the OIS moving unit to rotate, thereby reducing the driving current required to drive the first coil unit 1230 - 1 to the fourth coil unit 1230 - 4 , thereby reducing power consumption.

[0378] Despite Figure 2 In the illustrated embodiment, the OIS operation for hand-shake correction is performed using the second magnet 1071B and the second coil 1230. However, in another embodiment, the OIS operation for hand-shake correction may be performed using a shape memory alloy member. For example, the shape memory alloy member may be coupled to the fixed unit and the OIS moving unit, and may be electrically connected to the first plate unit 1255. The controllers 1830 and 780 may provide a driving signal to the shape memory alloy member, and may move the OIS moving unit in a direction perpendicular to the optical axis, or may rotate, tilt, or roll the OIS moving unit relative to the optical axis via the shape memory alloy member.

[0379] In another embodiment, the OIS operation can be performed using the second magnet 1071B and the second coil 1230, and the camera device 1010 can include a spherical member (not shown) disposed between the base 1210 and the holder 1270 to support the OIS moving unit. Here, the spherical member can support the OIS moving unit so that the OIS moving unit moves in a direction perpendicular to the optical axis, or rotates, tilts, or rolls relative to the optical axis using friction and / or rolling force between the base 1210 and the holder 1270. In one embodiment, for example, the spherical member can be disposed in the hole 1059 in the base 210 and can be in contact therewith. In another embodiment, the spherical member can be provided, and the terminal member 1037 and the wire 1220 can be omitted.

[0380] The second position sensor 1240 can be disposed, coupled, or mounted to a first surface (e.g., an upper surface) of the first plate unit 1255. The second position sensor 1240 can detect movement or displacement of the OIS movable unit in a direction perpendicular to the optical axis, for example, movement or displacement of the OIS movable unit in a direction perpendicular to the optical axis. In addition, the second position sensor 1240 can detect rotation, roll, or tilt of the OIS movable unit relative to or around the optical axis within a predetermined range. The first position sensor 1170 may alternatively be referred to as an "AF position sensor," and the second position sensor 1240 may alternatively be referred to as an "OIS position sensor."

[0381] The second position sensor 1240 may face or overlap the magnet 1130 in the optical axis direction. For example, the second position sensor 1240 may include three or more sensors (e.g., 240A to 240C) corresponding to or overlapping three or more magnet units among the first to fourth magnet units 1130-1 to 1130-4 in the optical axis direction to detect movement of the OIS moving unit.

[0382] For example, the second position sensor 1240 may be disposed below the second coil 1230 .

[0383] For example, the second position sensor 1240 may not overlap with the second coil 1230 in a direction perpendicular to the optical axis. For example, the sensing element of the second position sensor 1240 may not overlap with the second coil 1230 in a direction perpendicular to the optical axis. The sensing element may be an element configured to detect a magnetic field.

[0384] For example, the center of the second position sensor 1240 may not overlap with the second coil 1230 in a direction perpendicular to the optical axis. For example, the center of the second position sensor 1240 may be the spatial center in the X-axis and Y-axis directions on an XY coordinate plane perpendicular to the optical axis. Alternatively, the center of the second position sensor 240 may be the spatial center in the X-axis, Y-axis, and Z-axis directions.

[0385] In another embodiment, at least a portion of the second position sensor 1240 may overlap with the second coil 1230 in a direction perpendicular to the optical axis.

[0386] For example, the second position sensor 1240 may overlap with the holes 1041A to 1041C in the holder 1270 in the optical axis direction. For example, the second position sensor 1240 may overlap with the cavity in the second coil 1230 in the optical axis direction. For example, at least a portion of the holes 1041A to 1041C in the holder 1270 may overlap with the cavity in the second coil 1230 in the optical axis direction.

[0387] For example, at least a portion of the second position sensor 1240 , eg, a center of the second position sensor 1240 , may not overlap with the second coil 1230 .

[0388] For example, the second position sensor 1240 may include a first sensor 1240A, a second sensor 1240B, and a third sensor 1240C, which are disposed to be spaced apart from each other.

[0389] For example, each of the first to third sensors 1240A, 1240B, and 1240C can be a Hall sensor. In another embodiment, each of the first to third sensors 1240A, 1240B, and 1240C can be a driver IC including a Hall sensor and a driver. The description of the first position sensor 1170 can be applied to the first to third sensors 1240A, 1240B, and 1240C with or without modification. For example, each of the first to third sensors 1240A, 1240B, and 1240C can be a displacement detection sensor, wherein its output voltage varies according to the relative position or relationship with respect to the corresponding magnet unit.

[0390] Each of the first sensor 1240A, the second sensor 1240B, and the third sensor 1240C may be electrically connected to the first circuit board 1250 .

[0391] The second position sensor 1240 may be disposed below the cavity in the second coil 1230. In another embodiment, the second position sensor 1240 may be disposed outside the second coil 1230 when viewed along the optical axis or from above.

[0392] The second position sensor 1240 may not overlap with the second coil 1230 in a direction perpendicular to the optical axis direction. For example, the second position sensor 1240 may overlap with the holder 1270 in a direction perpendicular to the optical axis direction.

[0393] For example, the first sensor 1240A may be disposed below the cavity in the first coil unit 1230-1. The first sensor 1240A may be disposed in a corresponding one of the holes 1041A to 1041C in the holder 1270. The second sensor 1240B may be disposed below the cavity in the second coil unit 1230-2. The second sensor 1240B may be disposed in another hole 1041B among the holes 1041A to 1041C in the holder 1270. The third sensor 1240C may be disposed below the cavity in the third coil unit 1230-3. The third sensor 1240C may be disposed in another hole 1041C among the holes 1041A to 1041C in the holder 1270.

[0394] For example, each of the first to third sensors 1240A, 1240B, and 1240C may not overlap with a corresponding one of the coil units 1230-1 to 1230-3 in a direction perpendicular to the optical axis. The first to third sensors 1240A, 1240B, and 1240C may overlap with the holder 1270 in a direction perpendicular to the optical axis.

[0395] By arranging the first to third sensors 1240A, 1240B and 1240C so as not to overlap with the OIS coil 230 in a direction perpendicular to the optical axis, the influence of the magnetic field of the OIS coil 230 on the output of the OIS position sensor 1240 can be reduced, thereby performing accurate OIS feedback operation and ensuring the reliability of the OIS operation.

[0396] The second position sensor 1240 may face, correspond to, or overlap the magnet 1130 in the optical axis direction. For example, in the initial position of the OIS moving unit, at least a portion of the first sensor 1240A may overlap with the first magnet unit 1071B1 of the second magnet 1071B in the optical axis direction. The first sensor 1240A may output a first output signal (e.g., a first output voltage) corresponding to the detection result of the magnetic field of the first magnet unit 1071B1.

[0397] For example, at the initial position of the OIS moving unit, at least a portion of the second sensor 1240B may overlap with the second magnet unit 1071B2 of the second magnet 1071B in the optical axis direction, and the second sensor 1240B may output a second output signal (e.g., a second output voltage) corresponding to the magnetic field detection result of the second magnetic unit 1071B2.

[0398] For example, in the initial position of the OIS moving unit, at least a portion of the third sensor 1240C may overlap with the third magnet unit 1071B3 of the second magnet 1071B in the optical axis direction, and the third sensor 1240C may output a third output signal (e.g., a third output voltage) corresponding to the magnetic field detection result of the third magnet unit 1071B3.

[0399] The initial position of the OIS moving unit may be the original position of the OIS moving unit when no power or driving signal is applied to the second coil 1230 from the controllers 1830 and 780, or the position of the OIS moving unit when the support plate is elastically deformed due to the weight of the OIS moving unit alone. Furthermore, the initial position of the OIS moving unit may be the position of the OIS moving unit when gravity acts in the direction from the first plate unit 1255 to the second plate unit 1800, or when gravity acts in the direction from the second plate unit 1800 to the first plate unit 1250.

[0400] In order to improve the linearity of the relationship between the displacement of the OIS moving unit and the output of the second position sensor 1240, each of the sensor units 1240A, 1240B and 1240C can overlap with a corresponding one of the magnet units 1071B1, 1071B2 and 1072B3 in the optical axis direction within the travel range of the OIS moving unit.

[0401] For example, the controllers 1830 and 780 may use at least one of the first output voltage of the first sensor 1240A, the second output voltage of the second sensor 1240B, and the third output voltage of the third sensor 1240C to control the scrolling of the OIS mobile unit. For example, the controllers 1830 and 780 may use the first output voltage and the third output voltage to control the scrolling of the OIS mobile unit.

[0402] For example, the controllers 1830 and 780 may use at least one of the first to third output voltages to control or adjust the movement or displacement of the OIS mobile unit in a first horizontal direction (e.g., in the y-axis direction) or in a second horizontal direction (e.g., in the x-axis direction). For example, the controllers 1830 and 780 may use the first output voltage of the first sensor 1240A to control or adjust the movement or displacement of the OIS mobile unit in the first horizontal direction (e.g., in the y-axis direction), and may use the second output voltage of the second sensor 1240B to control or adjust the movement and displacement of the OIS mobile unit in the second horizontal direction.

[0403] Each of the first to third sensors 1240A, 1240B, and 1240C may be a Hall sensor. In another embodiment, each of the first to third sensors may be a driver IC including a Hall sensor. In another embodiment, each of the first and second sensors 1240A and 1240B may be a Hall sensor, and the third sensor 1240C may be a tunnel magnetoresistance (TMR) sensor. Here, the tunnel magnetoresistance (TMR) sensor may be a TMR magnetic angle sensor.

[0404] In another embodiment, each of the first to third sensors 1240A, 1240B, and 1240C may be a tunnel magnetoresistive (TMR) sensor, wherein the TMR sensor may be a TMR linear magnetic field sensor whose output is linearly related to the displacement (or travel) of the OIS moving unit.

[0405] The base 1210 may be disposed below the first plate unit 1255. The base 1210 may be spaced apart from the first plate unit 1255. The base 1210 may have a polygonal shape, for example, a quadrangular shape, which coincides with or corresponds to the cover member 1300 or the first plate unit 1255.

[0406] For example, the base 1210 may have a through hole 1210a that corresponds to or faces the first board unit 1255. The through hole 1210a in the base 1210 may be a through hole formed along the optical axis through the base 1210. In another embodiment, the base may not have a through hole.

[0407] For example, the base 1210 may be coupled to the side plate 1302 of the cover member 1300. The side or outer surface of the base 1210 may include a step 1211 (see FIG. Figure 14 ), when the side or outer surface is bonded to the side plate 1302 of the cover member 1300, an adhesive is applied to the step 1211. Here, the step 1211 can guide the side plate 1302 of the cover member 1300 coupled to its upper side. The step 1211 of the base 1210 and the lower end of the side plate 1302 of the cover member 1300 can be bonded or fixed to each other using an adhesive or the like.

[0408] The base 1210 may include one or more protrusions 1216A and 1216B protruding from its upper surface. For example, the protrusions 1216A and 1216B may protrude upward from the outer surface of the base 1210. For example, the base 1210 may include two protrusions 1216A and 1216B facing or overlapping each other in a first horizontal direction (e.g., in the Y-axis direction).

[0409] For example, base 1210 may include four sides (or side panels), and protrusions 1216A and 1216B may be formed at two of the four side portions. For example, protrusions 1216A and 1216B may be provided or positioned at the center of the side (or side panel) of base 1210.

[0410] The base 210 may include a groove 341B. The groove 341b may be an adhesive receiving groove. The groove 341b may be formed in the outer surface of a corresponding one of the protrusions 216A and 216B of the base 210. The groove 1341b may be formed in the upper surface of a corresponding one of the protrusions 1216A and 1216B of the base 1210. The groove 1341b may be formed from the upper surface to the lower surface of the corresponding one of the protrusions 1216A and 1216B. An adhesive may be provided in the groove 1341b to bond the support plate 1310 to the base 1210. The groove 1341b may include multiple grooves. For example, the groove 1341b may extend in the direction of the optical axis. In another embodiment, the groove formed in the corresponding one of the protrusions 1216A and 1216B of the base 1210 may extend in a direction perpendicular to the optical axis.

[0411] For example, the second board unit 1800 may be disposed below the base 1210. For example, the second board unit 1800 may be disposed to be spaced apart from the OIS moving unit (eg, the first board unit 1255 and the first heat dissipation member 1280) in the optical axis direction.

[0412] For example, the second board unit 800 may be disposed below the lower surface of the base 1210. The second board unit 1800 may be coupled to the base 1210. For example, the second board unit 1800 may be coupled to the lower surface of the base 1210.

[0413] The second board unit 1800 may be used to provide a signal to the image sensor unit 1350 from the outside, or output a signal transmitted from the image sensor unit 1350 to the outside.

[0414] The second board unit 1800 may include a first region 1801 (or first board) that corresponds to, faces, or overlaps with the AF operation unit 1100 or the image sensor 1810 in the optical axis direction, a second region 1802 (or second board) on which a connector 1804 is provided, and a third region 1803 (or third board) that connects the first region 1801 to the second region 1802. The connector 1804 may include a port that electrically connects the second region 1802 of the second board unit 1800 to an external device (e.g., the optical instrument 200A). The through-hole 1210a in the base 1210 may be closed or blocked by the first region 1801 of the second board unit 1800.

[0415] First region 1801 of second plate unit 1800 may correspond to, face, or overlap at least one of cover member 1300 or base 1210 in the optical axis direction. For example, first region 1801 may overlap upper plate 1301 and side plate 1302 of cover member 1300 in the optical axis direction.

[0416] Each of the first region 1801 and the second region 1802 of the second panel unit 1800 may include a rigid panel. The third region 1803 may include a flexible panel. Each of the first region 1801 and the third region 1802 may further include a flexible panel.

[0417] In another embodiment, at least one of the first to third regions 1801 to 1803 of the circuit board 1800 may include at least one of a rigid board or a flexible board.

[0418] The second board unit 1800 may be disposed behind the first board unit 1255. For example, the first board unit 1255 may be disposed between the AF operating unit 1100 and the second board unit 1800. In another embodiment, the second board unit may be disposed between the AF operating unit and the first board unit.

[0419] Although the first region 1801 of the second board unit 1800 may have a polygonal shape (eg, a quadrilateral, square, or rectangular shape) when viewed from above, the present disclosure is not limited thereto. In another embodiment, the first region 801 may have a circular shape or the like.

[0420] Figure 20a The arrangement of the first to third areas 1801 to 1803 , the extension area 1808 , the AF moving unit, the OIS moving unit, and the controller 1830 of the second panel unit 1800 according to the embodiment is shown.

[0421] Reference Figure 20a , the first region 1801 may include four side portions 1085A to 1085D (or side surfaces). For example, the first region 1801 may include a first side portion 1085A and a second side portion 1085B facing or opposite to each other in the second horizontal direction (e.g., in the x-axis direction), and a third side portion 1085C and a fourth side portion 1085D facing or opposite to each other in the first horizontal direction (e.g., in the y-axis direction).

[0422] Second region 1802 may be disposed adjacent to first side 1085A of first region 1801, and third region 1803 may be connected to first side 1085A of first region 1801. For example, third region 1803 may extend from first region 1801 and may be connected to a side of second region 1802 opposite first side 1085A.

[0423] The second board unit 1800 may include a plurality of terminals 1800B corresponding to the terminals 1311 of the support plate 1310. The plurality of terminals 1800B may be formed in the first region 1801 of the second board unit 1800. For example, the second board unit 1800 may include a first terminal 800B1 and a second terminal 800B2, the first terminals 800B1 being disposed or arranged to be spaced apart from each other along one side of the third side portion 1085C of the first region 1801 in the second horizontal direction (e.g., in the x-axis direction), and the second terminals 800B2 being disposed or arranged to be spaced apart from each other along one side of the fourth side portion 1085D of the first region 1801 in the second horizontal direction.

[0424] For example, the plurality of terminals 1800B may be formed on a first surface (eg, an upper surface) of the second board unit 1800 (eg, the first region 1801 ) facing the first board unit 1255 .

[0425] For example, the controller 1830 may be provided on an extended region extending from one of the third side portion 1085C and the fourth side portion 1085D of the first region 1801 of the second board unit 1800. In another embodiment, the controller may be provided on an extended region extending from a side portion of the first region 1801 of the second board unit 1800 where the plurality of terminals are formed.

[0426] The first region 1801 may have a coupling hole (not shown) formed therein, and the base 1210 may have a coupling protrusion (not shown) formed thereon to be coupled to the coupling hole in the first region 1801 .

[0427] The camera device 1010 may further include a heat dissipation member 1380 disposed, coupled, or fixed to the second board unit 1800. For example, the heat dissipation member 1380 may be disposed, coupled, or fixed to the upper surface of the first region 1801 of the second board unit 1800. In another embodiment, the heat dissipation member 1380 may be omitted.

[0428] The camera apparatus 1010 may further include a third heat dissipation member (not shown) disposed on, coupled to, or fixed to a second surface (eg, a lower surface) of the second board unit 1800 .

[0429] For example, the heat dissipation member 1380 may be a plate-shaped member having a predetermined thickness and hardness. The heat dissipation member 1380 may face or overlap the first heat dissipation member 1280 in the optical axis direction.

[0430] Despite Figure 20a The middle controller 1830 is disposed or coupled to the upper surface of the extension area 1808 , but in another embodiment, the controller may also be disposed or coupled to the lower surface of the extension area 1808 .

[0431] Despite Figure 20a The central controller 1830 is disposed on the extended region 1808 of the second board unit 1800 located outside the cover member 1300 , but in another embodiment, the controller may also be disposed in the first region of the second board unit 1800 located outside the base 1210 .

[0432] In another embodiment, the controller can be disposed or mounted on the second circuit board 1260, which serves as the sensor board. In another embodiment, for example, the controller can be disposed or mounted on the upper surface of the second circuit board 1260. Because the heat dissipation member 1280 is disposed on or coupled to the lower surface of the second circuit board 1260, when the controller is disposed on the second circuit board 1260, heat generated by the controller can be easily dissipated through the heat dissipation member 1280, thereby improving heat dissipation efficiency and performance.

[0433] Figure 20b is a schematic cross-sectional view of the lens module 1400 , the first board unit 1255 , the image sensor 1810 , and the second board unit 1800 .

[0434] Reference Figure 20b , the image sensor 1810 may be disposed in a through-hole 1260A (or hole) in the second circuit board 1260 and may be coupled to the first heat dissipation member 1280 .

[0435] For example, the first heat dissipation member 1280 may include a body 1037A disposed below the second circuit board 1260 and a protrusion 1037B (or a protrusion region) disposed in a through-hole 1260A in the second circuit board 1260 .

[0436] The camera device 101010 may include a heat dissipation body 1450 connecting the heat dissipation member 1280 to a support (eg, a support plate 1310 ).

[0437] The second heat dissipation body 1450 may include a body (or first region) coupled to the lower surface of the heat dissipation body 1280 and a connection member (or second region) connecting the body to a support member such as the support plate 1310. The heat dissipation body 1450 may include a graphite sheet.

[0438] Image sensor 1810 may be disposed on, coupled to, or fixed to protrusion 1037B. For example, image sensor 1810 may be disposed on, coupled to, or attached to the upper surface of protrusion 1037B. For example, the upper surface of protrusion 1037B may be positioned lower than the upper surface of second circuit board 1260. In another embodiment, the upper surface of protrusion 1037B may be flush with the upper surface of second circuit board 1260.

[0439] The heat dissipation member 1380 may be provided on the first surface 1801A (or upper surface) of the first region 1801 of the second board unit 1800 , which faces the first heat dissipation member 1280 in the optical axis direction.

[0440] The distance G1 (or gap) between the first board unit 1255 and the second board unit 1800 in the optical axis direction may be 0.05 mm to 0.7 mm. For example, the distance G1 may be the distance between the lower surface of the heat dissipation member 1280 and the upper surface of the heat dissipation member 1380 .

[0441] In another embodiment, the distance G1 may be 0.15 mm to 0.5 mm. In another embodiment, the distance G1 may be 0.15 mm to 0.3 mm. In another embodiment, the distance G1 may be 0.2 mm to 0.3 mm.

[0442] The second board unit 1800 may include a first conductive layer 1093 that is exposed from the first surface 1801A and contacts the second heat dissipation member 1380, for example, the lower surface of the second heat dissipation member 1380. For example, the first conductive layer 1093 may be thermally fused to the lower surface of the second heat dissipation member 1380, or may be coupled to the lower surface of the second heat dissipation member 1380 using a conductive adhesive (e.g., solder, etc.). For example, the first conductive layer 1093 may be electrically connected to the heat dissipation member 1380.

[0443] Second board unit 1800 may include a second conductive layer 1092A that is connected to first conductive layer 1093 and exposed from a second surface 1801B (or lower surface) of second board unit 1800, which is opposite to first surface 1801A of second board unit 1800. For example, second conductive layer 1092A may be electrically connected to a ground of second board unit 1800.

[0444] The first conductive layer 1093 may be a through hole formed through at least a portion of the second board unit 1800. For example, the first conductive layer 1093 may include a first via hole 1093A formed through the second board unit 1800 and open or exposed at the second surface 1801B of the second board unit 1800. In addition, the first conductive layer 1093 may include a second via hole 1093B, one end of which contacts the lower surface of the heat dissipation member 1380 and the other end of which contacts, is coupled to, or is connected to the second conductive layer 1092A.

[0445] exist Figure 20bIn the embodiment, the second conductive layer 1092A may be disposed in, coupled to, or attached to a groove formed in the second surface 1801B of the second board unit 1800. In another embodiment, the second conductive layer may be disposed in, coupled to, or attached to the second surface 1801B of the second board unit 1800 without forming a groove on the second surface 1801B.

[0446] The first conductive layer 1093 and the second conductive layer 1092A can function as a heat dissipation pattern or heat dissipation pad for the second board unit 1800. In other words, since the first conductive layer 1093 and the second conductive layer 1092A are used only for heat dissipation, they do not need to be electrically connected to other conductive lines other than the grounding member of the second board unit 1800. Here, the other conductive lines may be conductive lines electrically connected to electronic components (or circuit components) such as the image sensor 1810 or the support board 1310.

[0447] The second conductive layer 1092A can be electrically connected to the cover member 1300 (e.g., the side plate 1302) via solder, a conductive adhesive, or a conductive tape. In another embodiment, the second conductive layer 1092A connected to the grounding component of the second board unit 1800 can be electrically connected to the cover member 1300 via a bracket. The bracket can be a structure that receives or accommodates the camera device therein to protect the camera device. For example, the bracket can be made of a conductive member. Since the grounding component of the second board unit 1800 and the second heat dissipation member 1380 are electrically connected to the cover member 1300, the camera device 1010 can be protected from static electricity and the heat dissipation efficiency can be improved.

[0448] In another embodiment, the first conductive layer and the second conductive layer of the second board unit 1800 may be applied to the second circuit board 1260 with or without modification. For example, the second circuit board 1260 according to another embodiment may include at least one third conductive layer in contact with the first heat dissipation member 1280, and at least a portion of the third conductive layer may be exposed from the second circuit board 1260.

[0449] Since the heat dissipation member 1380 is disposed on the first surface of the second board unit 1800 , the distance between the heat dissipation member 1280 and the heat dissipation member 1380 may be reduced, thereby improving heat dissipation efficiency.

[0450] Heat radiated from the first heat dissipation member 1280 can be transferred to the second heat dissipation member 1380 by convection or radiation, and the transferred heat can be radiated to the outside via the second heat dissipation member 1380, thereby improving heat dissipation efficiency. Since the upper surface of the second heat dissipation member 1380 and the lower surface of the first heat dissipation member 1280 are arranged to face or overlap each other in the optical axis direction, heat can be efficiently transferred from the first heat dissipation member 1280 to the second heat dissipation member 1380.

[0451] For example, the heat dissipation member 1280 and the second heat dissipation member 1380 may be made of the same material. In another embodiment, the first heat dissipation member 1280 and the second heat dissipation member 1380 may be made of different materials. For example, the thermal conductivity of the first heat dissipation member 1280 may be applied to the second heat dissipation member 1380 with or without modification.

[0452] In addition, the heat dissipation member 1380 may stably support the second board unit 1800 and may function as a reinforcement member configured to suppress breakage of the second board unit 1800 due to external impact or contact.

[0453] In another embodiment, the second heat dissipation member 1380 may be made of a heat dissipation member having high thermal conductivity, such as an exothermic epoxy resin, an exothermic plastic, or an exothermic synthetic resin.

[0454] To improve heat dissipation efficiency, the second heat dissipation member 1380 may include at least one groove or uneven portion. For example, a groove or uneven portion having a predetermined pattern may be formed on at least one of the upper surface or the lower surface of the second heat dissipation member 1380.

[0455] In another embodiment, the heat dissipation member 1380 may have holes or through-holes instead of grooves. For example, the heat dissipation member 1380 according to another embodiment may have multiple through-holes. The description of the predetermined pattern of the heat dissipation member 1280 may be applied to the heat dissipation member 1380 with or without modification.

[0456] The camera apparatus according to another embodiment may include a heat dissipation member provided under the second board unit 1800. Here, the description of the material of the heat dissipation member 1280 or 1380 may be applied to the heat dissipation member with or without modification.

[0457] The support plate 1310 may support the OIS moving unit so that the OIS moving unit can move relative to the fixing unit in a direction perpendicular to the optical axis direction, and electrically connect the first board unit 1255 and the second board unit 1800 .

[0458] The support plate 1310 may also be referred to as a "support member," a "connecting plate," or a "connecting portion." Alternatively, the support plate 1310 may also be referred to as an "insert." Alternatively, the insert may include the first circuit board 1250 and the support plate 1310 formed integrally.

[0459] In another embodiment, a support unit can be provided in place of support plate 1310, with one end of the support unit connected to a movable unit, such as first plate unit 1255, and the other end connected to a fixed unit, such as second plate unit 1800. For example, the support unit can include at least one of a leaf spring or a suspension wire. For example, the support unit can electrically connect first plate unit 1255 to second plate unit 1800.

[0460] The support plate 1310 may include a flexible plate, or may be a flexible plate. For example, the support plate 1310 may include a flexible printed circuit board (FPCB). At least a portion of the support plate 1310 may be flexible. The first circuit board 1250 may be connected to the support plate 1310.

[0461] For example, refer to Figure 16 , the support plate 1310 may include a connection portion 1320 connected to the first circuit board 150. For example, the first circuit board 1250 and the support plate 1310 may be formed integrally. In another embodiment, the first circuit board 1250 and the support plate 1310 may not be formed integrally, but may be formed separately. The first circuit board 1250 and the support plate 1310 may be connected to each other via the connection portion 1320 and may be electrically connected to each other. In another embodiment, the connection portion 1320 may be formed integrally with at least one of the support plate 1310 or the first circuit board 1250.

[0462] The support plate 1310 may be electrically connected to the first circuit board 1250. The support plate 1310 may be electrically connected to the second board unit 1800. For example, one end of the support plate 1310 may be connected or coupled to the first board unit 1255 (e.g., the second circuit board 1250). The other end of the support plate 1310 may be connected or coupled to the second board unit 1800.

[0463] The support plate 1310 can support the OIS movable unit relative to the fixed unit. The support plate 1310 can guide the movement of the OIS movable unit. The support plate 1310 can guide the OIS movable unit so that the OIS movable unit can move in a direction perpendicular to the optical axis. The support plate 1310 can guide the OIS movable unit so that the OIS movable unit can rotate, tilt, or roll relative to the optical axis. The support plate 1310 can also limit the movement of the OIS movable unit along the optical axis.

[0464] A portion of the support plate 1310 may be coupled, attached, or fixed to the base 1210 as a fixing unit, and another portion of the support plate 1310 may be coupled, attached, or fixed to the holder 1270 as an OIS moving unit.

[0465] For example, a portion of the body 1086 and 1087 of the support plate 1310 can be connected to the base 1210 as a fixed unit (e.g., protrusions 1216A and 1216B), and the other portion of the body 1086, 1087 can be connected to the retaining member 1270 as an OIS moving unit (e.g., connectors 1027A and 1027B).

[0466] The connection portion 1320 of the support plate 1310 can be connected to the first board unit 1255 (e.g., the first circuit board 1250) and can be electrically connected thereto. The extensions 1007A to 1007D of the support plate 1310 can be coupled to the second board unit 1800 (e.g., the terminal 1800B) and can be electrically connected thereto.

[0467] The support plate 1310 may include a circuit board and an elastic portion coupled to a circuit member. The elastic portion for flexibly supporting the OIS mobile unit may be implemented as an elastomer, such as a spring. The elastic portion may include metal or be made of an elastic material. The circuit member for electrically connecting the first circuit board 1250 to the second board unit 1800 may be a flexible board, or may include at least one of a flexible board and a rigid board. For example, the circuit member may be a flexible printed circuit board (FPCB).

[0468] For example, the support plate 1310 may include one or more connectors 1320A and 1320B connected to the first board unit 1255 (eg, the first circuit board 1250 ) and electrically connected to the first board unit 1255 (eg, the first circuit board 1250 ).

[0469] In addition, support board 1310 may include one or more extensions 1007A to 1007D connected to second board unit 1800 and electrically connected to second board unit 1800. One or more extensions 1007A to 1007D may include a plurality of terminals 1311.

[0470] For example, the support plate 1310 may be provided to surround the OIS moving unit, such as the first board unit 1255. For example, the support plate 1310 may be provided to surround the four side portions 1033A to 1033D of the first circuit board 1250 (see FIG. Figure 16 ) or around its outer surface.

[0471] For example, the support plate 1310 may not overlap with the OIS moving unit (e.g., the first plate unit 1255) in the optical axis direction, and at least a portion of the support plate 1310 may overlap with the OIS moving unit (e.g., the first plate unit 1255) in a direction perpendicular to the optical axis direction.

[0472] For example, the support plate 1310 may include a plurality of support plates that are separated or spaced apart from each other. In another embodiment, the support plate 1310 may be formed to have a single integrated structure.

[0473] The support plate 1310 may include bodies 1086 and 1087. For example, the bodies 1086 and 1087 may be provided to surround an OIS moving unit, such as the first plate unit 1255. For example, the bodies 1086 and 1087 may not overlap with the OIS moving unit (e.g., the first plate unit 1255) in the optical axis direction, and at least a portion of each of the bodies 1086 and 1087 may overlap with the OIS moving unit (e.g., the first plate unit 1255) in a direction perpendicular to the optical axis direction.

[0474] For example, each of the bodies 1086 and 1087 may have a plate form that is flat in the optical axis direction or in a direction parallel to the optical axis direction. For example, when viewed from above, each of the bodies 1086 and 1087 may have a polygonal outline, such as a quadrilateral or a circular shape.

[0475] For example, each of the bodies 1086 and 1087 may include a plurality of parts that are separated or spaced apart from each other. In another embodiment, each body may be formed to have an integrated structure.

[0476] Support plate 1310 may include an extension portion extending from each of bodies 1086 and 1087 and coupled to second board unit 1800. For example, the extension portion of support plate 1310 may extend toward second board unit 1800, and one end of the extension portion of support plate 1410 may be coupled to second board unit 1800. One end of the extension portion of support plate 1310 may be provided with a plurality of terminals that are electrically connected to second board unit 1800 using solder or a conductive adhesive. For example, the extension portion of support plate 1310 may alternatively be referred to as a "terminal portion," a "protruding portion," or a "leg portion."

[0477] For example, each of the extensions 1007A to 1007D of the support plate 1310 may include a first portion extending from a corresponding one of the bodies 1086 and 1087 in the direction of the optical axis and a second portion extending from the first portion in a direction perpendicular to the optical axis. For example, the extensions 1007A to 1007D of the support plate 1310 may be fixed or coupled to a fixed unit (e.g., the base 1210). For example, when the OIS moving unit moves, the bodies 1086 and 1087 of the support plate 1310 may be movable, but the extensions 1007A to 1007D of the support plate 1310 may be fixed and immovable.

[0478] For example, the support plate 1310 may include a first support plate 1310-1 and a second support plate 1310-2 spaced apart from each other. The first support plate 1310-1 and the second support plate 1310-2 may be formed line-symmetrically. In another embodiment, the first support plate 1310-1 and the second support plate 1310-2 may be integrally formed as a single plate. In another embodiment, the support plate 1310 may include three or more support plates.

[0479] For example, the first support plate 1310 - 1 and the second support plate 1310 - 2 may be disposed to surround the four side portions 1033A to 1033D of the first circuit board 1250 .

[0480] For example, the first support plate 1310 - 1 may include a first body 1086 and two or more extensions 1007A and 1007B extending from the first body 1086 . The two or more extensions 1007A and 1007B of the first support plate 1310 - 1 may include a plurality of terminals 1311 .

[0481] The second support plate 1310-2 may include a second body 1087 and two or more extensions 1007C and 1007D extending from the second body 1087. The two or more extensions 1007C and 1007D of the second support plate 1310-2 may include a plurality of terminals 1311.

[0482] The first circuit board 1250 may include a first side portion 1033A and a second side portion 1033B positioned opposite to each other, and a third side portion 1033C and a fourth side portion 1033D positioned between the first side portion 1033A and the second side portion 1033B and opposite to each other.

[0483] For example, the first connector 1320A may connect the first body 1086 to the first side 1033A of the first circuit board 1250 . The second connector 1320B may connect the second body 1087 to the second side 1033B of the first circuit board 1250 .

[0484] The first body 1086 may include a first portion 1006A, a second portion 1006B, and a third portion 1006C. The first portion 1006A corresponds to or faces the first side 1033A of the first circuit board 1250, the second portion 1004b corresponds to a portion (or side) of the third side 1033C of the first circuit board 1250, and the third portion 1006C corresponds to a portion of the fourth side 1033D of the circuit board 1250. Furthermore, the first body 1086 may include a first bent portion 1006D and a second bent portion 1006E. The first bent portion 1006D connects one end of the first portion 1006A to the second portion 1006B and bends the first portion 1006A. The second bent portion 1006E connects the other end of the first portion 1006A to the third portion 1006C and bends the other end of the first portion 1006A. For example, the first body 1086 may have a U-shape.

[0485] For example, the first support plate 1310 - 1 may include extensions 1007A and 1007B. For example, the extension 1007A may be connected to one side of the first body 1086 , and the extension 1007B may be connected to the other side of the first body 1086 .

[0486] For example, extension 1007A may extend or protrude from first portion 1006B of first body 1086 toward second board unit 1800, and extension 1007B may extend or protrude from third portion 1006C of first body 1086 toward second board unit 1800. Extension 1007B may be positioned opposite extension 1007A, with first board unit 1255 (e.g., first circuit board 1250) interposed therebetween.

[0487] For example, the first connector 1320A can connect the first portion 1006A of the first body 1086 to the first side portion 1033A of the first circuit board 1250. The first connector 1320A can include a curved portion. For example, the first connector 1320A can connect the center area of ​​the first portion 1006A of the first body 1086 to the center area of ​​the first side portion 1033A of the first circuit board 1250.

[0488] The second body 1087 may include a first portion 1009A, a second portion 1009B, and a third portion 1009C. The first portion 1009A corresponds to or faces the second side 1033B of the first circuit board 1250, the second portion 1009B corresponds to or faces another portion (or another side) of the third side 1033C of the first circuit board 1250, and the third portion 1009C corresponds to or faces another portion (or another side) of the fourth side 1033D of the first circuit board 1250. Furthermore, the second body 1087 may include a first bent portion 1009D and a second bent portion 1009E. The first bent portion 1009D connects one end of the first portion 1009A to the second portion 1009B and bends at one end of the first portion 1009A. The second bent portion 1009E connects the other end of the first portion 1009A to the third portion 1009C and bends at the other end of the first portion 1009A. For example, the second body 1087 may have a "U" shape. For example, the second body 1087 may have a shape symmetrical to the first body 1086 based on the optical axis. For example, the second body 1087 may have a shape symmetrical to the first body 1086 based on the optical axis.

[0489] For example, the second support plate 1310 - 2 may include extensions 1007C and 1007D. For example, the extension 1007C may be connected to one side of the second body 1087 , and the extension 1007D may be connected to the other side of the second body 1086 .

[0490] Extension 1007C may extend or protrude from second portion 1009B of second body 1087 toward second board unit 1800, and extension 1007D may extend or protrude from third portion 1009C of second body 1087 toward second board unit 1800. Extension 1007D may be positioned opposite extension 1007C, with first board unit 1255 (e.g., first circuit board 1250) interposed therebetween.

[0491] For example, when viewed from the front, the extension portion 1007A and the extension portion 1007C may be axisymmetric to each other. In another embodiment, the extension portion 1007A and the extension portion 1007C may not be axisymmetric to each other.

[0492] For example, when viewed from the front, the extension portion 1007B and the extension portion 1007D may be axisymmetric to each other. In another embodiment, the extension portion 1007B and the extension portion 1007D may not be axisymmetric to each other.

[0493] For example, the second connector 1320B may connect the first portion 1009A of the second body 1087 to the second side portion 1033B of the first circuit board 1250. The second connector 1320B may include a curved portion. For example, the second connector 1320B may connect the center area of ​​the first portion 1009A of the second body 1087 to the center area of ​​the second side portion 1033B of the first circuit board 1250.

[0494] Reference Figure 16 , the terminal members (e.g., 1007A and 1007C) of the support plate 1310 can be provided with terminals P1 to P4, which are electrically connected to the terminals B1 to B4 of the terminal member 1095 of the circuit board 1190 of the AF operating unit 1100. The terminals B1 to B4 of the terminal member 1095 of the circuit board 1190 and the terminals P1 to P4 of the extensions 1007A and 1007C of the support plate 1310 can be connected to each other using solder or a conductive adhesive. In other words, the circuit board 1190 of the AF operating unit 1100 can be electrically connected to the second board unit 1800 via the support plate 1310.

[0495] Reference Figure 16 , support plate 1310 may include a conductive layer 1093-1. Furthermore, support plate 1310 may include a first insulating layer 1094-1 disposed on one surface (or first surface) or one side of conductive layer 1093-1. Furthermore, support plate 1310 may include a second insulating layer 1094-2 disposed on another surface (or second surface) or another side of conductive layer 1093-1. In another embodiment, for example, support plate 1310 may include at least one of first insulating layer 1094-1 or second insulating layer 1094-2. Support plate 1310 may include a protective layer 1096 disposed on first insulating layer 1094-1. For example, protective layer 1096 may be an EMI component (e.g., an EMI tape). Alternatively, protective layer 1096 may be a heat dissipation component such as graphite. Alternatively, protective layer 1096 may be an elastic material. Alternatively, projection layer 1096 may be a conductive component. Alternatively, protective layer 1096 may be an insulating component.

[0496] Figure 17a is a first perspective view of the support plate 1310 coupled to the holder 1270 and the base 1210 . Figure 17b is a second perspective view of the support plate 1310 coupled to the holder 1270 and the base 1210 .

[0497] Reference Figure 17a and Figure 17b, the holder 1270 may include first to fourth side portions 1064A to 1064D corresponding to or facing the first to fourth side portions 1033A to 1033D of the first circuit board 1250 .

[0498] The first side portion 1064A and the second side portion 1064B of the holder 1270 may be disposed so as to face or be opposite to each other in a second horizontal direction (e.g., in the X-axis direction). The third side portion 1064C and the fourth side portion 1064D of the holder 1270 may be disposed so as to face or be opposite to each other in a first horizontal direction (e.g., in the Y-axis direction).

[0499] At least a portion of the support plate 1310 may be attached to or coupled to the holder 1270. For example, two or more connectors 1320A and 1320B of the support plate 1310 may be coupled to two or more of the first to fourth side portions 1064A, 1064D of the holder 1270 using an adhesive. For example, the first connector 1320A may be coupled, attached, or fixed to the first side portion 1064A of the holder 1270 using an adhesive, and the second connector 1320B may be coupled, attached, or fixed to the second side portion 1064B of the holder 1270 using an adhesive.

[0500] The first coupler 1027A may be formed at the first side portion 1064A of the holder 1270, and the second coupler 1027B may be formed at the second side portion 1064B of the holder 1270. The support plate 1310 may be coupled, attached, or fixed to the couplers 1027A and 1027B of the holder 1270. The support plate 1310 may be coupled, attached, or fixed to the outer surface (or inner surface) of the couplers 1027A and 1027B of the holder 1270. In another embodiment, each of the first coupler and the second coupler may have a protrusion form.

[0501] For example, a portion of the support plate 1310 may be coupled, attached, or fixed to the first and second couplers 1027A and 1027B of the holder 1270. The bodies 1086 and 1087 of the support plate 1310 may be coupled, attached, or fixed to the first and second couplers 1027A and 1027B of the holder 1270.

[0502] For example, the first support plate 1310-1 can be coupled, attached, or fixed to the first coupler 1027A, and the second support plate 1310-2 can be coupled, attached, or fixed to the second coupler 1027B. For example, the first portion 1006A of the first body 1086 can be coupled, attached, or fixed to the outer surface (or inner surface) of the first coupler 1027A, and the first portion 1009A of the second body 1087 can be coupled, attached, or fixed to the outer surface (or inner surface) of the second coupler 1027B.

[0503] The base 1210 may include a first side portion 1065A to a fourth side portion 1065D (see Figure 14 ), which corresponds to or faces the first to fourth side portions 1033A to 1033D of the first circuit board 1250. The first to fourth side portions 1065A to 1065D of the base 1210 may correspond to or face the first to fourth side portions 1064A to 1064D of the holder 1270.

[0504] The first side 1065A and the second side 1065B of the base 1210 may be disposed so as to face or be opposite to each other in a first horizontal direction (e.g., in the Y-axis direction). In addition, the third side 1065C and the fourth side 1065D of the base 1210 may be disposed so as to face or be opposite to each other in a second horizontal direction (e.g., in the X-axis direction).

[0505] At least a portion of the support plate 1310 may be coupled, attached, or fixed to the base 1210. For example, the bodies 1086 and 1087 of the support plate 1310 may be coupled to the base 1210 using an adhesive. For example, portions of the bodies 1086 and 1087 of the support plate 1310 that are connected to the extensions 107A to 1007D may be coupled to the base 1210.

[0506] For example, at least a portion of the support plate 1310 may be coupled, attached, or fixed to protrusions 1216A and 1216B formed on the base 1210. For example, the support plate 1310 may be coupled, attached, or fixed to the outer surface (or inner surface) of the protrusions 1216A and 1216B of the base 1210. The first protrusion 1216A may be formed at the third side 1065C of the base 1210, and the second protrusion 1216B may be formed at the fourth side 1065D of the base 1210.

[0507] For example, the bodies 1086 and 1087 of the support plate 1310 may be coupled, attached, or fixed to the first protrusion 1216A and the second protrusion 1216B of the base 1210 .

[0508] For example, one end of the first support plate 1310-1 (e.g., the second portion 1006B) can be connected, attached, or fixed to an area of ​​the first protrusion 1216A of the base 1210, and the other end of the first support plate 1310-1 (e.g., the third portion 1006C) can be connected, attached, or fixed to an area of ​​the second protrusion 1216B of the base 1210.

[0509] For example, one end of the second support plate 1310-2 (e.g., the second portion 1009B) can be connected, attached, or fixed to another area of ​​the first protrusion 1216A of the base 1210, and the other end of the second support plate 1310-2 (e.g., the third portion 1009C) can be connected, attached, or fixed to another area of ​​the second protrusion 1216B of the base 1210.

[0510] The first coupling region 1069A may be formed between the first body 1086 of the first support plate 1310 - 1 and the first coupler 1027A of the holder 1270 , and the second coupling region 1069B may be formed between the second body 1087 of the second support plate 1310 - 2 and the second coupler 1027B of the holder 1270 .

[0511] In addition, a third coupling region 1059A may be formed between one end of each of the first support plate 1310-1 and the second support plate 1310-2 and the first protrusion 1216A of the base 1210. A fourth coupling region 1059B may be formed between the other end of each of the first support plate 1310-1 and the second support plate 1310-2 and the second protrusion 1216B of the base 1210.

[0512] The OIS moving unit can be flexibly supported relative to the fixed unit by the support plate 1310 and the first to fourth coupling regions 1069A, 1069B, 1059A, and 1059B. The terminal 1311 of the support plate 1310 can be soldered with solder 1902 (see FIG. Figure 17a and 17b ) or a conductive adhesive and electrically connected to the terminal 1800B of the second board unit 1800.

[0513] Reference Figure 1 and Figure 4b , the camera device 1010 may include a shielding member 1440 covering the solder 1902. The shielding member 1440 may be used to protect the connection between the terminal 1311 of the support plate 1310 and the terminal 1800B of the second board unit 1800. The shielding member 1440 may be disposed below the groove 1304 in the cover member 1300.

[0514] In another embodiment, for example, the support member may be an elastic member that does not include a plate, such as a spring, wire, shape memory alloy, or spherical member. For example, when the support member is made of wire, multiple wires may be provided on at least one of the corners and sides of base 1210 or second board unit 1800 to connect first board unit 1255 (e.g., second circuit board 1260) to second board unit 1800 (or base 1210). For example, one end of each of the multiple wires may be coupled to first board unit 1255 (e.g., second circuit board 1260), and the other end of each of the multiple wires may be coupled to second board unit 1800 (or base 1210).

[0515] The image sensor unit 1350 may include at least one of a controller 1830 , a memory 1512 , or a capacitor 1514 .

[0516] The controller 1830 may be provided to be spaced apart from the first board unit 1255. For example, the controller 830 may be provided on the second board unit 1800.

[0517] The memory 1512 may be provided on one of the first board unit 1255 and the second board unit 1800. For example, the memory 1512 may be provided or mounted on the first region 1801 of the second board unit 1800. For example, the memory 1512 may avoid spatial interference with the heat dissipation member 1380 or may be spaced apart from the heat dissipation member 1380. For example, the heat dissipation member 1380 may include an escape groove or opening to avoid spatial interference with the memory 1512, and the memory 1512 may be provided in the escape groove or opening in the heat dissipation member 1380. The capacitor 1514 may be provided on at least one of the first board unit 1255 and the second board unit 1800.

[0518] Memory 1512 can store a first data value (or code value) corresponding to the output of second position sensor 1240 based on the displacement (or stroke) of the OIS moving unit in a direction perpendicular to the optical axis (e.g., in the X-axis direction or the Y-axis direction) for OIS feedback operation. Furthermore, memory 1512 can store a first data value (or code value) corresponding to the output of first position sensor 1170 based on the displacement (or stroke) of bobbin 1110 in a first direction (e.g., in the optical axis direction or in the Z-axis direction) for AF feedback operation.

[0519] For example, each of the first and second data values ​​may be stored as a lookup table in the memory 1512. In addition, the memory 1512 may store mathematical formulas, algorithms, or programs for the operation of the controller 1830. For example, the memory 1512 may be a non-volatile memory such as an electrically erasable programmable read-only memory (EEPROM).

[0520] The controller 1830 may be positioned outside the cover member 1300 , or may be provided on a region of the second board unit 1800 outside the cover member 1300 .

[0521] Reference Figure 20a , second panel unit 1800 may include an extension region 1808 connected to and extending from first region 1801. Extension region 1808 may extend from first side portion 1085A of first region 1801. For example, extension region 1808 may protrude from first side portion 1085A of the first region. For example, extension region 1808 may protrude from an outer surface of first side portion 1085A of the first region. For example, extension region 1808 may extend or protrude in a second horizontal direction (e.g., in the X-axis direction).

[0522] The extended region 1808 may be positioned external to the cover member 1300 , or may be positioned outside of the cover member 1300 .

[0523] The extended area 1808 may alternatively be referred to as a "fourth area," a "protruding area," an "extended portion," or a "protruding portion." The extended area 1808 may not overlap with the AF movable unit and the OIS movable unit in the optical axis direction. For example, the extended area 1808 may extend in the same direction as the third area 1803 (e.g., in the second horizontal direction).

[0524] The controller 1830 may be disposed in the extended region 1808 of the second board unit 1800. For example, the controller 1830 may be disposed or mounted on the upper surface of the extended region 1808 of the second board unit 1800. In another embodiment, the controller 1830 may be disposed or mounted on the lower surface of the extended region 1808. For example, the controller 1830 may not overlap with the cover member 1300 in the optical axis direction. For example, the extended region 1808 may not overlap with the cover member 1800 in the optical axis direction. For example, the surface area of ​​the upper surface of the extended region 1808 may be equal to or greater than the surface area of ​​the lower surface of the controller 1830.

[0525] Since the extension region 1808 and the third region 1803 are connected to the first side portion 1085A of the second board unit 1800, the surface area occupied by the camera device 1010 in the direction perpendicular to the optical axis can be reduced. Therefore, this embodiment can reduce the increase in size of the camera device 1010 caused by the extension region 1808.

[0526] In another embodiment, the extension region may be connected to one of the second to fourth side portions 1085B, 1085C, and 1085D of the first region 1801 of the second board unit 1800 and may protrude from one of the second to fourth side portions 1085B, 1085C, and 1085D in the first region 1801 .

[0527] The controller 1830 may be positioned outside the cover member 1300 or may be positioned outside the cover member 1300. For example, the controller 1830 may be located outside a space defined between the cover member 1300, the base 1210, and the first region 1801 of the second board unit 1800.

[0528] For example, the controller 1830 may not overlap the lens module 1400, the AF moving unit, the OIS moving unit, and the first region 1801 of the second plate unit 1255 in the optical axis direction.

[0529] In a sensor-shift camera device that uses a moving image sensor to perform hand-shake correction, since the OIS moving unit, which includes the image sensor and the first board unit, is spaced apart from the fixed unit, which includes the second board unit, heat generated by the OIS moving unit may not be sufficiently dissipated to the outside via the fixed unit. Furthermore, a sensor-shift camera device may have a structure in which the AF operating unit and the OIS operating unit are contained within a cover member to prevent malfunctions caused by foreign matter, thereby making it difficult to dissipate heat to the outside of the camera device.

[0530] The image sensor, the second coil, and the controller may correspond to a heat source. Here, the "controller" may be a driver IC configured to control an AF operation and / or an OIS operation.

[0531] Camera device 1010 may include a heat dissipation member 1870 disposed, coupled, or attached to extended region 1808 to improve heat dissipation efficiency. Heat dissipation member 1870 may contact extended region 1808. For example, heat dissipation member 1870 may be disposed below extended region 1808. For example, heat dissipation member 1870 may be disposed, coupled, or fixed to the lower surface of extended region 1808. Heat dissipation member 1870 may be a plate-like member, and the description of the material of heat dissipation member 1280 may apply to heat dissipation member 1870 with or without modification. At least a portion of heat dissipation member 1870 may overlap with controller 1830 in the optical axis direction.

[0532] The camera device 1010 may include a cover box 1405 disposed in the extension region 1808 and housing the controller 1830 therein to protect the controller 1830 from external impact. The cover box 1405 may include an upper plate 1405A and a side plate 1405B connected to the upper plate 1405A and extending from the upper plate 1405A toward the extension region 1808.

[0533] The cover box 1405 may be disposed, coupled or fixed to the upper surface of the extension region 1808. For example, the lower portion, lower end or lower surface of the side panel 1405B of the cover box 1405 may be coupled, attached or fixed to the upper surface of the extension region 1808.

[0534] Since the cover case 1405 accommodates the controller 1830 therein, heat generated by the controller 1830 can be prevented from being dissipated to the outside and transferred to the image sensor. The description of the material of the heat dissipation member 1280 or the cover member 1300 can be applied to the cover case 1405 with or without modification.

[0535] Camera device 1010 may also include a heat dissipation layer 1860 disposed on controller 1830. Heat dissipation layer 1860 may cover the surface of controller 1830. For example, heat dissipation layer 1860 may be disposed so as to surround the surface of controller 1830. For example, heat dissipation layer 1860 may contact the top and side surfaces of controller 1830 to surround these surfaces. Heat dissipation layer 1860 may be made of heat-dissipating plastic or heat-dissipating resin, such as heat-dissipating epoxy resin. Heat dissipation layer 1860 may improve the heat dissipation efficiency and performance of controller 1830.

[0536] In another embodiment, the heat dissipation layer may be provided on at least one of the upper surface or the side surface of the controller 1830. For example, the heat dissipation layer may expose at least a portion of the controller 1830.

[0537] The controller 1830 may be electrically connected to the second position sensor 1240. The controller 1830 may adjust or control the drive signal provided to the second coil 1230 and may perform a feedback OIS operation using the output signals received from the sensors 1240A, 1240B, and 1240C of the second position sensor 1240 and the first data value stored in the memory 1512.

[0538] In addition, the controller 1830 may be electrically connected to the first position sensor 1170. For example, when the first position sensor 1170 is solely implemented as a Hall sensor, the first position sensor 1780 may be electrically connected to the controller 1830. Here, the controller 1830 may control the driving signal provided to the first coil 1120, thereby performing a feedback autofocus operation using the output signal of the first position sensor 1170 and the second data value stored in the memory 1512.

[0539] Although the controller 1830 may be implemented as a driver IC, the present disclosure is not limited thereto. For example, the controller 1830 may be electrically connected to the terminal 1800B of the second board unit 1800 .

[0540] The controller 1830 can control the first position sensor that is solely implemented as a Hall sensor and the second position sensor that is solely implemented as a Hall sensor. For example, the controller 1830 can provide a drive signal to the first position sensor that is solely implemented as a Hall sensor and / or the second position sensor that is solely implemented as a Hall sensor, and can receive an output signal from the first position sensor and / or an output signal from the second position sensor.

[0541] In another embodiment, the first position sensor may be implemented as a Hall sensor alone, and the second position sensor may be implemented as a driver IC including the Hall sensor. Here, the controller 1830 may be electrically connected to the first position sensor, may provide a drive signal to the first position sensor, and may receive an output signal from the first position sensor.

[0542] For example, the controller 1830 may include a driver configured to drive at least one of the first position sensor or the second position sensor.

[0543] The image sensor unit 1350 may further include a motion sensor (not shown) provided on one of the first board unit 1255 and the second board unit 1800. The motion sensor may be electrically connected to the controller 1830. The motion sensor may output rotational angular velocity information corresponding to the movement of the camera device 1010. For example, the motion sensor may be implemented as a two-axis or three-axis gyroscope sensor or an angular velocity sensor. For example, the motion sensor may output information regarding the amount of movement in the X-axis direction and the Y-axis direction, as well as the amount of rotation caused by the movement of the camera device 1010.

[0544] In another embodiment, the motion sensor may be omitted from the camera device 1010. In the case where the motion sensor is omitted from the camera device, the camera device 1010 may receive position information regarding the movement of the camera device 1010 from the motion sensor provided at the optical instrument 200A.

[0545] The image sensor unit 1350 may further include an optical filter 1610 disposed between the lens module 1400 and the image sensor 1810. The image sensor unit 1350 may further include an optical filter holder 1600 in which the optical filter is disposed, placed, or received. The optical filter holder 1600 may alternatively be referred to as a "holder" or a "sensor base."

[0546] Filter 1610 can be used to prevent light within a specific frequency band that has passed through lens barrel 400 from being introduced into image sensor 1810. Filter 1610 can be, for example, an infrared light blocking filter. For example, filter 1610 can be oriented parallel to an XY plane that is perpendicular to optical axis OA. Filter 1610 can be disposed below lens module 1400.

[0547] The filter holder 1600 may be provided below the AF operation unit 1100. For example, the filter holder 1600 may be provided on the first board portion 1255. For example, the filter holder 1600 may be provided on the upper surface of the second circuit board 1260 of the first board unit 1255.

[0548] For example, at least a portion of the filter holder 1600 may be disposed in the through-hole 1250A in the first circuit board 1250. For example, at least a portion of the circuit element CA may be disposed in the through-hole 1250A in the first circuit board 1250.

[0549] For example, the upper surface of the filter holder 1600 may be positioned higher than the upper surface of the first circuit board 1250. For example, the upper surface of the filter 1610 may be positioned higher than the upper surface of the first circuit board 1250. For example, the lower surface of the filter 1610 may be positioned higher than the upper surface of the first circuit board 1250. In another embodiment, the lower surface of the filter 1610 may be located at the same height as or higher than the upper surface of the first circuit board 1250.

[0550] For example, the lower surface of the second area 1058B of the filter holder 1600 (or the bottom surface of the groove in the receiving portion 1053) can be positioned higher than the upper surface of the first circuit board 1250. In another embodiment, the lower surface of the second area 1058B of the filter holder 1600 (or the bottom surface of the groove in the receiving portion 1053) can be located at the same height as or lower than the upper surface of the first circuit board 1250.

[0551] The filter holder 1600 may be formed using an adhesive 1614 (see Figure 22) is coupled to an area of ​​the first circuit board 1255 surrounding the image sensor 1810 (e.g., an area of ​​the second circuit board 1260). The filter holder 1600 may be exposed through the through-hole 1250A in the first circuit board 1250. For example, the through-hole 1250A in the circuit board 1250 may expose the filter holder 1600 disposed on the second circuit board 1260 and the filter 1610 disposed on the filter holder 1600 through the through-hole 1250A. The filter holder 1600 may have a through-hole 1061A formed in the area where the filter 1610 is mounted or disposed to allow light passing through the filter 1610 to enter the image sensor 1810. The through-hole 1061A in the filter holder 1600 may be configured to have a through-hole form formed through the filter holder 1600 in the direction of the optical axis. For example, the through-hole 1061A in the filter holder 1600 may be formed through the center of the filter holder 1600 and may be disposed to correspond to or face the image sensor 1810. The through-hole 1061A in the filter holder 1600 may alternatively be referred to as a “hole,” a “cavity,” or a “through-hole.”

[0552] The filter holder 1600 may have a seating portion 1500 that is recessed from its upper surface and in which the filter 1610 is located. The filter 610 may be disposed, seated, or mounted in the seating portion 1500. The seating portion 1500 may be formed to surround the through-hole 1061A. In another embodiment, the seating portion of the filter holder may be configured in the form of a projection that protrudes from the upper surface of the filter.

[0553] The camera device 1010 may further include an adhesive 1612 disposed between the filter 1610 and the seating portion 1500. Figure 22 ), the filter 1610 can be coupled or attached to the filter holder 1600. For example, the adhesive 1612 can be an epoxy resin, a heat-hardening adhesive (e.g., a heat-hardening epoxy resin), an ultraviolet curing epoxy resin, etc.

[0554] In another embodiment, the filter holder may be coupled to the holder 1270 or the AF operating unit 1100 .

[0555] Reference Figure 3, the cover member 1300 may have the form of a box with an opening at its lower portion, and include an upper plate 1301 and side plates 1302. The lower portion of the side plates 1302 of the cover member 1300 may be coupled to the base 1210. The upper plate 1301 of the cover member 1300 may have a polygonal shape, such as a quadrilateral or an octagonal shape. For example, the side plates 1302 may include four side plates connected to each other. The upper plate 1301 of the cover member 1300 may have a through-hole 1303 formed therein, through which the lens of the lens module 1400 coupled to the coil bobbin 1110 is exposed to external light.

[0556] Reference Figure 1 and Figure 3 , a groove 1304 may be formed in the side plate 1302 of the cover member 1300 , through which the terminal 1095 of the circuit board 1190 and the terminal 800B of the second board unit corresponding to the terminal 1095 are exposed.

[0557] For example, the cover member 1300 may be made of metal. For example, the cover member 1300 may be made of SUS (e.g., SUS4 series stainless steel). In addition, the cover member 1300 may be made of cold-rolled steel sheet (SPC). For example, the cover member 1300 may be made of SUS containing 50% or more Fe. To prevent oxidation, an anti-oxidation metal such as nickel may be plated on the surface of the cover member 1300. In another embodiment, for example, the cover member 1300 may be made of a magnetic material or a magnetic metal.

[0558] In another embodiment, the cover member 1300 may be injection molded from, for example, plastic or resin. In addition, the cover member 1300 may be made of an insulating material or a material capable of shielding electromagnetic waves.

[0559] The cover member 1300 and the base 1210 may house the AF operating unit 1100 and the OIS moving unit therein. The cover member 1300 and the base 1210 may protect the AF operating unit 1100 and the OIS moving unit from external impacts and may prevent foreign matter from being introduced from the outside.

[0560] For example, in the initial position of the OIS moving unit, the outer surface of the holder 1270 may be spaced apart from the inner surface of the base 1210 by a predetermined distance. For example, in the initial position of the OIS moving unit, the holder 1270 and the lower surface of the first plate unit 1255 may be spaced apart from the base 1210 by a predetermined distance.

[0561] The controller 1830 can provide at least one driving signal to at least one of the first coil unit 1230-1 to the fourth coil unit 1230-4, and can control the at least one driving signal to move the OIS mobile unit in the X-axis direction and / or the Y-axis direction, or to rotate, tilt or roll the OIS mobile unit relative to the optical axis within a predetermined angle range.

[0562] Figure 21 1 is a block diagram illustrating the configuration of the controller 1830 and the first to third sensors 1240A, 1240B, and 1240C. The controller 1830 can use a clock signal SCL and a data signal SDA to perform communication, such as I2C communication, to transmit and receive data with a host. For example, the host may be the controller 780 of the optical instrument 200A.

[0563] The controller 1830 can be electrically connected to the second coil 1230. The controller 1830 can include a drive unit 1510 configured to provide a drive signal for driving the first coil unit 1230-1 to the fourth coil unit 1230-4. For example, the drive unit 1510 can include an H-bridge circuit or an H-bridge driver capable of changing the polarity of the drive signal. Here, the drive signal can be a PWM signal for reducing current consumption, and the drive frequency of the PWM signal can be 20kHz or higher, which exceeds the audible frequency range. In another embodiment, the drive signal can be a DC signal.

[0564] Each of the first to third sensors 1240A, 1240B, and 1240C may include two input terminals and two output terminals. The controller 1830 may supply power or drive signals to the two input terminals of each of the first to third sensors 1240A to 1240C. For example, the first input terminals of the first to third sensors 1240A to 1240C may be commonly connected to each other. For example, the two input terminals may be a (+) input terminal and a (-) input terminal (e.g., a ground terminal).

[0565] For example, the controller 1830 may receive a first output voltage of the first sensor 1240A, a second output voltage of the second sensor 1240B, and a third output voltage of the third sensor 1240C, and may use the received first to third output signals to control the movement (or displacement) of the OIS moving unit in the X-axis direction or the Y-axis direction. Furthermore, the controller 1830 may use the received first to third output voltages to control the rotation, tilt, or roll of the OIS moving unit relative to the optical axis.

[0566] In addition, the controller 1830 may include an analog-to-digital converter 1530 configured to receive an output voltage output from two output terminals of each of the first to third sensors 1240A to 1240C and output a data value, digital value, or code value corresponding to the analog-to-digital conversion result of the received output voltage. The controller 1830 may control the movement (or displacement) of the OIS moving unit in the X-axis direction or the Y-axis direction, as well as the rotation, tilt, or roll of the OIS moving unit relative to the optical axis.

[0567] The temperature sensor 1540 may measure the ambient temperature (eg, the temperature of the first to third sensors 1240A, 1240B, and 1240C) and may output a temperature detection signal Ts corresponding to the measurement result. For example, the temperature sensor 1540 may be a thermistor.

[0568] The resistance value of the resistor included in the temperature sensor 1540 may vary according to the ambient temperature, and thus the value of the temperature detection signal Ts may vary according to the ambient temperature. A mathematical formula or lookup table related to the ambient temperature and the temperature detection signal Ts established through calibration may be stored in the memory or the controller 1830 and 1780.

[0569] Since the output values ​​of the first to third sensors 1240A, 1240B and 1240C are also affected by temperature, in order to accurately and reliably perform the OIS feedback operation, it is necessary to compensate the output values ​​of the first to third sensors 1240A, 1240B and 1240C according to the ambient temperature.

[0570] To this end, for example, the controllers 1830 and 780 can compensate the output values ​​(or data values ​​corresponding to the outputs) of the first to third sensors 1240A, 1240B, and 1240C using the ambient temperature measurement value of the temperature sensor 1540 and a temperature compensation algorithm or compensation formula. The temperature compensation algorithm or compensation formula can be stored in the controllers 1830 and 780 or in a memory.

[0571] The camera device may further include a fourth sensor 1240D that corresponds to or faces the fourth magnet unit 1130-4 in the optical axis direction. The fourth sensor 1240D may be provided on the first board unit 1255 (e.g., the first circuit board 1250). For example, the fourth sensor 1240D may be provided near a corner of the first circuit board 1250 where the first to third sensors 1240A to 1240C are not provided. The description of the configuration relationship between the first sensor 1240A and the first coil unit 1230-1 may be applied, with or without modification, to the configuration between the fourth sensor 1240D and the fourth coil unit 1230-4.

[0572] For example, the fourth sensor 1240D may be positioned to face the second sensor 1240B in a diagonal direction. For example, the output voltage of the fourth sensor 1240D may also be used to detect movement of the OIS moving unit in the X-axis direction or the Y-axis direction.

[0573] In another embodiment, the fourth sensor 1240D may correspond to the first position sensor 1170 of the AF operating unit 1100 .

[0574] The controller 1830 may be electrically connected to at least one of the first position sensor 1170 , the second coil 1230 , or the second position sensor 1240 via the second board unit 1800 , the support board 1310 , and the first board unit 1255 .

[0575] In another embodiment, the controller 1830 may be provided on the first board unit 1255. In another embodiment, for example, the controller 1830 may be provided on the first circuit board 1250.

[0576] Figure 22 is a perspective view of the optical filter 1610 , the filter holder 1600 , and the first board unit 1255 . Figure 23 16 is a perspective view of the filter holder 1600 . Figure 24 yes Figure 23 A bottom perspective view of the filter holder 1600 is shown. Figure 25 yes Figure 4b A partially enlarged view of camera device 1010 is shown.

[0577] Reference Figures 22 to 25 The seating portion 1500 of the filter holder 1600 may include a bottom surface 1511 and an inner surface 1513 , and the peripheral portion of the filter 1610 may be disposed on the bottom surface 1511 of the seating portion 1500 of the filter holder 1600 .

[0578] For example, the filter holder 1600 may further include a side surface (or inner peripheral surface) 1525 that connects the bottom surface 1511 of the seating portion 1500 to the lower surface 1051b of the filter holder 1600. For example, the side surface 1525 may be orthogonal to the lower surface 1051b of the filter holder 1600, but the present disclosure is not limited thereto. In another embodiment, the angle defined between the side surface 1525 and the lower surface 1051b of the filter holder 1600 may be an acute angle. In another embodiment, the angle defined between the side surface 1525 and the lower surface 1051b of the filter holder 1600 may be an obtuse angle. For example, in another embodiment, the side surface 1525 may be a chamfered surface.

[0579] For example, a height difference may be formed in the optical axis direction between the bottom surface 1511 and the upper surface 1051a of the holder 1600. For example, the height difference or distance in the optical axis direction between the upper surface 1051a and the bottom surface 1511 of the holder 1600 may be greater than the thickness of the optical filter 1610 (or the length of the optical filter 1610 in the optical axis direction).

[0580] For example, the bottom surface 1511 may be positioned lower than the upper surface 1051a of the filter holder 1600. For example, the bottom surface 1511 of the filter holder 1600 may be positioned lower than the upper surface 1051a of the filter holder 1600 but higher than the lower surface 1051b of the filter holder 1600.

[0581] For example, inner surface 1513 may connect upper surface 1051a and bottom surface 1511 of seating portion 1500. For example, the angle between inner surface 1513 and bottom surface 1511 may be a right angle, but the present disclosure is not limited thereto. In another embodiment, the angle between inner surface 1513 and bottom surface 1511 may be an acute angle or an obtuse angle. For example, inner surface 1513 may be a chamfered surface.

[0582] For example, the perforation 1061A can be formed in the bottom surface 1511 of the seating portion 1500 so as to be spaced apart from the inner surface 1513 of the seating portion 1500. The shape of the perforation 1061A in the filter holder 1600 can be consistent with the shape of the filter 1610 or the shape of the image sensor 1810 (e.g., the shape of the active area of ​​the image sensor 1810). For example, the shape of the perforation 1061A in the filter holder 1600 can be polygonal (e.g., quadrilateral) when viewed from above, but the present disclosure is not limited thereto. In another embodiment, the shape of the perforation 1061A can be circular, octagonal, or elliptical.

[0583] The surface area of ​​the through hole 1061A may be smaller than the surface area of ​​the filter 1610 defined by the lateral length and the longitudinal length of the filter 1610 , so that the filter 1610 is disposed on the bottom surface 1511 of the seating portion 1500 of the filter holder 1600 .

[0584] For example, a peripheral portion of the lower surface of the filter 1610 may be opposite to the bottom surface 1511 of the seating portion 1500 and may be coupled or attached to the bottom surface 1511 using an adhesive 1612. For example, an inner surface 1513 of the seating portion 1500 of the filter holder 1600 may be opposite to or face a side surface of the filter 1610.

[0585] For example, the inner surface 1513 of the seating portion 1500 may include four inner surfaces, but the present disclosure is not limited thereto. In another embodiment, the number of the inner surfaces of the seating portion may be three or more.

[0586] In addition, the filter holder 1600 may include a recess 1508 formed in a corner region of the inner surface 1513 of the seating portion 1500. At least a portion of the recess 1508 may be recessed toward an edge region (or corner) of the outer surface of the filter holder 1600. The recess 1508 may prevent an adhesive 1612 (e.g., UV epoxy) configured to attach the filter 1610 to the seating portion 1500 from overflowing outside the seating portion 1500.

[0587] The optical filter 1610 may be disposed in the seating portion 1500. The optical filter 1610 may have a plate shape or a flat quadrangular shape, but the present disclosure is not limited thereto.

[0588] For example, the optical filter 1610 may not protrude upward beyond the upper surface 1051a of the filter holder 1600. For example, the upper surface of the optical filter 1610 may be positioned lower than the upper surface of the filter holder 1600.

[0589] In another embodiment, the upper surface of the optical filter 1610 may be located at the same height as or higher than the upper surface of the optical filter holder 1600 .

[0590] For example, the filter holder 1600 may include a plurality of side portions (or side surfaces) 1521A to 1521D. For example, the filter holder 1600 may include a plurality of corner portions 1522A to 1522D. For example, each corner portion of the filter holder 1600 may be a corner portion where two adjacent side portions intersect with each other. Each corner portion of the filter holder 1600 may be located between two adjacent side portions and may connect the two adjacent side portions to each other.

[0591] Next, the corner regions (or corner portions) 1523A to 1523D of the filter holder 1600 are defined. For example, referring to Figure 23 , the filter holder 1600 may include four corner areas 1523A to 1523D.

[0592] For example, when viewed from above, a corner region (e.g., 1523A) may be a region that includes a corner (e.g., 1522A) and is surrounded by extension lines of the inner surfaces 1513 of two side portions 1521A and 1521D adjacent to the corner (e.g., 1522A). The definition of a corner region may also be applied to the definition of each corner region with or without modification.

[0593] In another embodiment, when viewed from above, each corner region of the filter holder 1600 may be an area including a corner (e.g., 1522A) and surrounded by extension lines of two side surfaces (or inner peripheral surfaces) 1525 of the filter holder, which extension lines correspond to two side portions 1521A and 1521D adjacent to the corner (e.g., 1522A).

[0594] For example, the filter holder 1600 may include a first side portion (first side surface) 1521A, a second side portion (second side surface) 1521B, a third side portion (third side surface) 1521C, and a fourth side portion (fourth side surface) 1521D. The first side portion 1521A and the second side portion 1521B may be positioned opposite each other with the through-hole 1061A interposed therebetween, and the third side portion 1521C and the fourth side portion 1521D may be positioned opposite each other with the through-hole 1061A interposed therebetween.

[0595] For example, the length of the first side portion 1521A (or the second side portion 1521B) may be greater than the length of the third side portion 1521C (or the fourth side portion 1521D). For example, the length of the first side portion 1521A and the length of the second side portion 1521B may be the same. Furthermore, for example, the length of the third side portion 1521C and the length of the fourth side portion 1521D may be the same. In another embodiment, the length of the first side portion 1521A (or the second side portion 1521B) may be the same as the length of the third side portion 1521C (or the fourth side portion 1521D).

[0596] Reference Figure 24 , the filter holder 1600 may include a first region 1058A coupled to the first board unit 1255 (eg, the second circuit board 1260 ) and a second region 1058B located outside the first region 1058A.

[0597] For example, first region 1058A may be coupled to an upper surface of second circuit board 1260. For example, at least a portion of adhesive 1614 may be disposed between first region 1058A and an upper surface of second circuit board 1260 and may couple first region 1058A to the upper surface of second circuit board 1260.

[0598] In addition, the filter holder 1600 may include a third region 1058C located inside the first region 1058 A. A perforation 1061A may be formed in the third region 1058C.

[0599] For example, the second region 1058B may be located between the first region 1058A and the outer surface of the filter holder 1600. For example, the receiving portion 1053 may be located in the second region 1058B of the filter holder 1600.

[0600] For example, the lower surface 1051b of the filter holder 1600 may include a first surface 1052-1 that is coupled to the first board unit 1255 (e.g., the second circuit board 1260) using an adhesive 1614. For example, the lower surface 1051b of the filter holder 1600 may include a second surface 1052-2 that defines a height difference relative to the first surface 1052-1 in the optical axis direction. The second surface 1052-2 may be positioned higher than the first surface 1052-1. For example, of the first surface 1052-1 and the second surface 1052-2, the second surface 1052-2 may be closer to the upper surface 1051a of the filter holder 1600.

[0601] For example, the first region 1058A may include the first surface 1052-1, and the third region 1058C may include the second surface 1052-2. The second region 1058B may be located between the first region 1058A and the periphery (or edge) of the lower portion 1051b of the filter holder 1600. For example, the second region 1058B may be located outside the first region 1058A. For example, the second region 1058B may be located between the first region 1058A and the outer surface of the holder 1600.

[0602] For example, at least a portion of the third region 1058C may overlap with the bottom surface 1511 of the seating portion 1500 in the optical axis direction. For example, the first region 1058A may not overlap with the bottom surface 1511 of the seating portion 1500 in the optical axis direction. In another embodiment, a portion of the first region 1058A may overlap with the bottom surface 1511 of the seating portion 1500 in the optical axis direction.

[0603] For example, the third region 1058C may overlap with a peripheral portion of the optical filter 1610 disposed on the bottom surface 1511 of the seating portion 1500. For example, the first region 1058A may not overlap with a peripheral portion of the optical filter 1610 disposed on the bottom surface 1511 of the seating portion 1500. In another embodiment, the first region 1058A may overlap with a peripheral portion of the optical filter 1610 disposed on the bottom surface of the seating portion 1500.

[0604] For example, the third region 1058C may be formed along the periphery of the through-hole 1061A adjacent to the through-hole 1601A in the filter holder 1600. For example, when viewed from below, the third region 1058C may have a shape corresponding to the through-hole 1061A, such as a polygon (e.g., a quadrilateral).

[0605] The circuit elements may be provided on the first board unit 1255. For example, the circuit elements may be provided on at least one of the first circuit board 1250 or the second circuit board 1260.

[0606] Reference Figure 28b , for example, the circuit element CA may be disposed on an upper surface of the second circuit board 1260. For example, the circuit element CA may be disposed in the through-hole 1250A in the first circuit board 1250 when viewed from above.

[0607] For example, the circuit element may include a passive element and an active element.For example, the circuit element may include at least one of a capacitor, a memory, a controller, a sensor (eg, a motion sensor), or an integrated circuit (IC).

[0608] The filter holder 1600 may include a receiving portion 1053 configured to receive a circuit element disposed on the first board unit 1255. For example, the receiving portion 1053 may be located below the upper surface 1051a of the filter holder 1600. For example, the receiving portion 1053 may be formed in the lower surface 1051b of the filter holder 1600. For example, the receiving portion 1053 may include a groove recessed from the lower surface of the filter holder 1600. For example, the receiving portion 1053 may have the form of a pocket adapted to receive at least a portion of the circuit element CA therein.

[0609] At least a portion of the circuit element CA disposed on the first board unit 1255 may be disposed in the receiving portion 1053 of the filter holder 1600 .

[0610] For example, at least a portion of the circuit element CA may be located below the filter holder 1600 . Alternatively, at least a portion of the circuit element CA may be provided at a position corresponding to the receiving portion 1053 of the filter holder 1600 .

[0611] The receiving portion 1053 of the filter holder 1600 may overlap with at least a portion of the circuit element (eg, CA) in the optical axis direction, and may serve to prevent spatial interference between the filter holder 1600 and the circuit element.

[0612] Reference Figure 25 , the circuit element CA may be disposed between the filter holder 1600 (eg, an upper surface of the filter holder 1600 ) and the first board unit 1255 (eg, the second circuit board 1260 ).

[0613] For example, the circuit element CA may be provided between the inner surface (or inner peripheral surface) of the first circuit board 1250 defined by the through hole 1250A and the second surface 1053 - 2 of the receiving portion 1053 of the filter holder 1600 .

[0614] For example, the receiving portion 1053 of the filter holder 1600 may not overlap with the lens module 1400 in the optical axis direction. For example, the circuit element CA may not overlap with the lens module 1400 in the optical axis direction. For example, the receiving portion 1053 or the circuit element CA may not overlap with the image sensor 1810 in the optical axis direction.

[0615] For example, the receiving portion 1053 and the circuit element CA may overlap with the bobbin 1110 of the AF moving unit. For example, at least a portion of the filter holder 1600 may overlap with the circuit element CA in the optical axis direction. Figure 28b The entire circuit element CA may overlap with the filter holder 1600 in the optical axis direction, but in another embodiment, a portion of the circuit element CA may overlap with the filter holder 1600 in the optical axis direction while another portion of the circuit element CA may not overlap with the filter holder 1600. Here, the portion of the circuit element overlapping with the lens module 1400 may be closer to the optical axis OA than the other portion of the circuit element not overlapping with the lens module 1400.

[0616] For example, the filter holder 1600 may include a first portion 1029A that overlaps the lens module 1400 but not the circuit element CA in the optical axis direction, and a second portion 1029B that overlaps the circuit element CA but not the lens module 1400 in the optical axis direction.

[0617] Furthermore, for example, the filter holder 1600 may include a third portion 1029C that does not overlap with the lens module 1400 and the circuit element CA in the optical axis direction. For example, the third portion 1029C may be located between the first portion 1029A and the second portion 1029B.

[0618] Furthermore, for example, the filter holder 1600 may include a fourth portion 1029D that does not overlap with the lens module 1400 and the circuit element CA in the optical axis direction and is located outside the circuit element CA. For example, the outside of the circuit element CA may be a side where the optical axis or the lens module 1400 is positioned relative to the circuit element CA. For example, the fourth portion 1029D may be located between the second portion 1029B and the first circuit board 1250.

[0619] Since the filter holder 1600 includes a second portion 1029B that does not overlap with the lens module 1400 in the optical axis direction but overlaps with the circuit element CA, the surface area of ​​the upper surface of the filter holder 1600 can be increased in a direction perpendicular to the optical axis, thereby dispersing the impact force caused by the collision with the lens module 1400 and preventing the filter 1610 from breaking.

[0620] In another embodiment, a portion of the circuit element may be disposed to overlap with the lens module 1400 .

[0621] For example, the receiving portion 1053 may include a first surface 1053-1 and a second surface 1053-2 connecting the first surface 1053-1 to the lower surface 1051b, wherein the first surface 1053-1 defines a height difference relative to the lower surface 1051b of the filter holder 1600. The first surface 1053-1 of the receiving portion 1053 may alternatively be referred to as a "bottom surface," and the second surface 1053b may alternatively be referred to as a "side surface." For example, the second surface 1053-2 may be an inclined surface that is inclined relative to the first surface 1053-1. For example, the second surface 1053a may be a chamfered surface.

[0622] The first surface 1053-1 of the receiving portion 1053 may be positioned higher than the lower surface 1051b of the filter holder 1600. For example, of the first surface 1053-1 of the receiving portion 1053 and the lower surface 1051b of the filter holder 1600, the first surface 1053-1 of the receiving portion 1053 may be closer to the upper surface 1051a of the holder 1600.

[0623] For example, at least a portion of the circuit element CA may be located below the first surface 1053 - 1 of the receiving portion 1053 of the filter holder 1600 , and spatial interference between the circuit element and the filter holder 1600 may be avoided through the receiving portion 1053 of the filter holder 1600 .

[0624] For example, the receiving portion 1053 may not overlap with the first region 1058A of the filter holder 1600 in the optical axis direction. For example, the receiving portion 1053 may be formed in the second region 1058B of the filter holder 1600. This is done to prevent the height or height difference of the bottom surface 1511 of the filter holder 1600 required for placing the optical filter 1610 thereon from being restricted by the formation of the receiving portion 1053.

[0625] For example, the filter holder 1600 may include an extension disposed above the circuit element CA. For example, the extension of the filter holder 1600 may be the second region 1058B of the filter holder 1600. The extension of the filter holder 1600 may overlap with the circuit element CA in the optical axis direction.

[0626] For example, the extension of the filter holder 1600 may be disposed in the through-hole 1250A in the first circuit board 1250. For example, the extension of the filter holder 1600 may not overlap with the first circuit board 1250 in the optical axis direction. For example, the extension of the filter holder 1600 may be spaced apart from the first circuit board 1250. The circuit element CA may be spaced apart from the inner surface of the first circuit board 1250 defined by the through-hole 1250A.

[0627] For example, refer to Figure 25 , the extension portion of the filter holder 1600 may protrude toward the first circuit board 1250 (or the inner surface of the first circuit board 1250 ) based on the circuit element CA.

[0628] Reference Figure 24 , the first surface 1053-1 of the receiving portion 1053 may be positioned higher than the bottom surface 1511 of the seating portion 1500. For example, the upper surface 1051a of the filter holder 1600 may be closer to the first surface 1053-1 of the receiving portion 1053 than the bottom surface 1511 of the seating portion 1500. For example, the lower surface 1051b of the filter holder 1600 may be closer to the bottom surface 1511 of the seating portion 1500 than the first surface 1053-1 of the receiving portion 1053.

[0629] In another embodiment, for example, the first surface 1053-1 of the receiving portion 1053 and the bottom surface 1511 of the seating portion 1500 may be located at the same height. In another embodiment, of the first surface of the receiving portion 1053 and the bottom surface of the seating portion 1500, the bottom surface of the seating portion 1500 may be closer to the upper surface of the filter holder 1600.

[0630] For example, the receiving portion 1053 may include two receiving portions respectively provided on the first side portion 1521A and the second side portion 1521B of the filter holder 1600 that are opposite to each other. Figure 24 For example, the receiving portion 1053 may include a first receiving portion 1053A provided on the first side portion 1521A of the filter holder 1600 and a second receiving portion 1053B provided on the second side portion 1521B of the filter holder 1600 .

[0631] In another embodiment, the receiving portion 1053 may include at least one receiving portion provided on at least one of the first to fourth side portions 1521A to 1521D of the filter holder 1600 .

[0632] For example, the receiving portion 1053 may have an opening at the outer surface of the filter holder 1600. In another embodiment, the receiving portion 1053 may not have an opening at the outer surface of the filter holder 1600 and may be closed by the outer surface of the filter holder 1600.

[0633] For example, the first receiving portion 1053A may include at least one groove. The second receiving portion 1053B may include at least one groove. For example, the first receiving portion 1053A may include a plurality of grooves 1053A1 and 1053A2 spaced apart from each other, and the second receiving portion 1053B may include a plurality of grooves 1053B1 to 1053B3 spaced apart from each other.

[0634] The filter holder 1600 may include partition walls 1054A to 1054A3, each of which is configured to isolate or separate two adjacent grooves from each other. For example, the filter holder 160 may include a partition wall 1054A1 disposed between the plurality of grooves 1053A1 and 1053A2 of the first receiving portion 1053A, and partition walls 1054A2 and 1054A3 each disposed between two adjacent grooves among the plurality of grooves 1053B1 to 1053B3.

[0635] The camera device 1010 may include circuit elements, such as capacitors CA, disposed in two or more recesses 1053A1 and 1053A2 in the first receiving portion 1053A. Furthermore, the camera device 1010 may include circuit elements, such as capacitors CA, disposed in two or more recesses 1053B1 to 1053B3 in the second receiving portion 1053B.

[0636] In a sensor-shift camera device in which the image sensor moves for OIS operation, when the distance or gap between the lens module (or lens barrel) and the filter holder is designed to be equal to that of the lens-shift camera device, the lens module (or lens barrel) may directly collide with the filter, causing the filter to break, crack, or be damaged.

[0637] A lens-shift camera device is designed to prevent contact between the lens and the filter holder. This design primarily takes into account the amount of lens droop due to design and installation tolerances of individual components (e.g., an injection-molded lens and an injection-molded filter holder), as well as simulation of instantaneous impact deformation of the lens and filter holder. To prevent contact between the lens and the filter holder, the lens-shift camera device can be designed to minimize the height of individual components.

[0638] Reducing the flange back length (FBL) advantageously ensures improved lens performance. Therefore, when the distance between the lens module and the filter holder in a sensor-shift camera device increases (as in a lens-shift camera device), the FBL may increase, potentially reducing lens performance. Furthermore, the height of the lens along the optical axis can be increased, thereby increasing the length of the camera device along the optical axis and, consequently, increasing the size of the camera device.

[0639] The lens module may collide with the filter holder due to external impact. As a result, the filter holder may be impacted and deformed by the collision with the lens holder. Due to the deformation of the filter holder, the lens module may collide with the filter, impacting the filter and damaging, breaking, or cracking the filter.

[0640] According to one embodiment, the distance K1 between the upper surface 1051a of the filter holder 1600 and the upper surface of the filter 1610 can be increased by increasing the thickness K2 of the filter holder 1600. Due to the increase in K2, the rigidity of the filter holder 1600 can be increased. Even when the lens module 1400 collides with the filter holder 1600 and the filter holder 1600 is deformed, the lens module 1400 can be prevented from contacting the upper surface of the filter 1610, or the impact force applied to the filter 1610 can be reduced, thereby preventing damage or breakage of the filter 1610.

[0641] According to this embodiment, the filter holder 1600 may include a receiving portion 1053 configured to receive a circuit element therein, and the surface area of ​​the upper surface 1051a of the filter holder 1600 may be increased. Due to the increased surface area of ​​the upper surface 1051a of the filter holder 1600, the contact area when colliding with the lens module 1400 may be increased, dispersing the impact or force applied to the filter holder 1600 by colliding with the lens module 1400, and suppressing or reducing deformation of the filter holder 1600. Therefore, contact between the lens module 1400 and the optical filter 1610 may be prevented. Even if the lens module 1400 and the optical filter 1610 come into contact, damage or destruction of the optical filter 1610 may be prevented by reducing the impact applied to the optical filter 1610.

[0642] In addition, according to one embodiment, since the circuit element received in the receiving portion 1053 is arranged to overlap with the filter holder 1600 in the optical axis direction, it can be designed so as not to increase the overall size of the filter holder 1600 even when the surface area of ​​the upper surface of the filter holder 1600 increases.

[0643] Figure 26 yes Figures 1 to 25A schematic cross-sectional view of camera device 1010 is shown.

[0644] Reference Figure 26 a. A distance K1 between the upper surface 1051a of the filter holder 1600 and the upper surface of the filter 1610 may be 0.04 mm to 0.11 mm. In another embodiment, the distance K1 may be 0.06 mm to 0.08 mm. Alternatively, for example, the distance K1 may be 0.65 mm to 0.75 mm.

[0645] For example, the distance K2 between the lower surface 1051b (e.g., 1052-1) of the filter holder 1600 and the upper surface 1051a of the filter holder 1600 may be 0.5 mm to 0.8 mm. In another embodiment, for example, the distance K2 may be 0.6 mm to 0.75 mm. In another embodiment, for example, the distance K2 may be 0.6 mm to 0.65 mm.

[0646] For example, the length Q1 of the optical filter 1610 along the optical axis may be 0.18 mm to 0.26 mm. In another embodiment, the length Q1 may be 0.2 mm to 0.24 mm. In another embodiment, the length Q1 may be 0.21 mm to 0.23 mm. For example, the length Q1 may be the thickness of the optical filter 1610. For example, the thickness of the adhesive 1612 may be 0.01 mm to 0.03 mm.

[0647] For example, the distance K3 between the upper surface 1051a of the filter holder 1600 and the bottom surface 1511 of the seating portion 150 may be 0.25 mm to 0.38 mm. In another embodiment, for example, the distance K3 may be 0.28 mm to 0.34 mm. In yet another embodiment, the distance K3 may be 0.3 mm to 0.32 mm. For example, the distance K3 may be the minimum distance between the upper surface 1051a of the filter holder 1600 and the bottom surface 1511 of the seating portion 1500.

[0648] The distance K1 between the upper surface 1051a of the filter holder 1600 and the upper surface of the filter 1610 may be smaller than the length Q1 of the filter 1610 in the optical axis direction. For example, the distance K1 may be the minimum distance between the upper surface 1051a of the filter holder 1600 and the upper surface of the filter 1610.

[0649] For example, the ratio (Q1 / K1) obtained by dividing Q1 by K1 may be 1.8 to 5.2. In another embodiment, the ratio (Q1 / K1) may be 2.5 to 3.5.

[0650] When the ratio (Q1 / K1) is less than 1.8, collision between the lens module 1400 and the filter 61 can be suppressed. However, as the distance K1 increases, the length of the filter holder 1600 in the optical axis direction may increase, and thus the size of the camera apparatus may increase.

[0651] When the ratio (Q1 / K1) exceeds 0.2, the distance K1 may be excessively reduced, and thus the effect of preventing the collision between the lens module 1400 and the filter 1610 may be significantly reduced.

[0652] In order to stably ensure prevention of size increase of the camera apparatus and prevention of collision between the lens module 1400 and the optical filter 1610 , the ratio (Q1 / K1) may be 2.9 to 3.2.

[0653] The distance K1 may be 19% to 50% of the length Q1. In another embodiment, the distance K1 may be 25% to 40%. In another embodiment, the distance K1 may be 30% to 35% of the length Q1.

[0654] When the distance K1 is less than 19% of the length Q1, the distance K1 may be excessively reduced, and thus the effect of preventing collision between the lens module 1440 and the filter 1610 may be significantly reduced. When the distance K1 exceeds 50% of the length Q1, the distance K1 may be excessively increased, and thus the total length of the filter holder 1600 in the optical axis direction may increase, thereby increasing the size of the camera device.

[0655] In order to stably ensure prevention of size increase of the camera apparatus and collision between the lens module 1400 and the filter 1610 , the distance K1 may be 30% to 35% of the length Q1 .

[0656] For example, a distance K4 between the lower surface 1051 b (eg, the first surface 1052 - 1 ) of the filter holder 1600 and the first surface 1053 - 1 of the receiving portion 1053 may be 0.6 mm to 0.9 mm.

[0657] For example, the width M5 of the receiving portion 1053 may be 0.4 mm to 0.8 mm. In another embodiment, for example, the width M5 may be 0.5 mm to 0.7 mm.

[0658] exist Figure 23 and Figure 26 In the embodiment, the overall thickness or height of the side portions 1521A to 1521D of the filter holder 1600 may be increased. For example, the upper surfaces of the side portions 1521A to 1521D of the filter holder 1600 may have the same height or may be located on the same plane.

[0659] In another embodiment, the upper surface of at least one of the side portions 1521A to 1521D of the filter holder 1600 (e.g., a protrusion or protruding area) may be positioned higher than the upper surface of the corner regions 1523A to 1523D of the filter holder 1600. For example, at least one of the side portions 1521A to 1521D of the filter holder 1600 (e.g., a protrusion or protruding area) may protrude upward or along the optical axis direction beyond the upper surface of the corner regions 1523A to 1523D of the filter holder 1600. Here, the upper surface of the filter holder 1600 that serves as the measurement reference for K1, K2, and H2 may be the upper surface of at least one of the side portions of the filter holder 1600.

[0660] In another embodiment, a region (e.g., a protruding region) of the upper surface of at least one of the side portions 1521A to 1521D of the filter holder 1600 may be positioned higher than the upper surface of another one of the side portions 1521A to 1521D of the filter holder 1600. For example, a region (e.g., a protruding region) of at least one of the side portions 1512A to 1521D of the filter holder 1600 may protrude in the optical axis direction or upward beyond the upper surface of another region of at least one of the side portions 1521A to 1521D of the filter holder 1600.

[0661] In another embodiment, the upper surface of at least one of the corner regions 1523A to 1523D of the filter holder 1600 may be positioned higher than the upper surfaces of the side portions 1521A to 1521D of the filter holder 1600. For example, at least one of the corner regions 1523A to 1523D of the filter holder 1600 may protrude beyond the upper surfaces of the side portions 1521A to 1521D of the filter holder 1600 in the optical axis direction or upward.

[0662] In another embodiment, one area (e.g., a protruding area) of the upper surface of at least one of the corner areas 1523A to 1523D of the filter holder 1600 may be positioned higher than the upper surfaces of the side portions 1521A to 1521D of the filter holder 1600. For example, one area (e.g., a protruding area) of at least one of the corner areas 1523A to 1523D of the filter holder 1600 may protrude in the optical axis direction or upward beyond the upper surface of another area of ​​the corner areas 1523A to 1523D of the filter holder 1600.

[0663] In the various embodiments described above, the upper surface of the filter holder 1600 as a measurement reference of K1 , K2 , and H2 may be an upper surface of a protruding or projecting region of the filter holder 1600 .

[0664] Reference Figure 25 When viewed from the front, the side portions 1521A and 1521B of the filter holder 1600 may protrude from the circuit element (e.g., capacitor CA) in a direction perpendicular to the optical axis. For example, between the circuit element CA and the side portions 1521A and 1521B of the filter holder 1600, the side portions 1521A and 1521B of the filter holder 1600 may be closer to the first circuit board 1250. For example, the inner circumferential surface of the first circuit board 1250 may be closer to the side portions 1521A and 1521B of the filter holder 1600 than to the circuit element CA (e.g., capacitor). Therefore, the filter holder 1600 can more stably protect the circuit element CA from external impact.

[0665] For example, the circuit board CA may be positioned to be spaced apart from the receiving portion 1053 of the filter holder 1600. For example, the circuit element CA may be positioned to be spaced apart from at least one of the first surface 1053-1 and the second surface 1053-2 of the receiving portion 1053 of the filter holder 1600.

[0666] Reference Figure 22 , the length R3 of the filter 1610 in the same direction as the width M1 of the first side portion 1521A of the filter holder 1600 may be 8 mm to 10 mm. In another embodiment, the length R3 may be 8 mm to 9 mm. In yet another embodiment, for example, the length R3 may be 8.5 mm to 9 mm.

[0667] Furthermore, the length R4 of the filter 1610 in the same direction as the width M3 of the filter holder 1600 may be 10 mm to 13 mm. In another embodiment, the length R4 may be 11 mm to 12 mm. In yet another embodiment, the length R4 may be 11.5 mm to 12 mm.

[0668] Reference Figure 23 For example, each of the width M1 of the first side portion 1521A and the width M2 of the second side portion 1521B of the filter holder 1600 may be 1.4 mm to 2 mm. In another embodiment, each of the widths M1 and M2 may be 1.5 mm to 1.8 mm. In yet another embodiment, each of the widths M1 and M2 may be 1.6 mm to 1.7 mm.

[0669] For example, width M1 (or width M2) may be the length of first side portion 1521A (or second side portion 1521B) in a direction from first side portion 1521A toward second side portion 1521B. Alternatively, width M1 (or width M2) may be the length of first side portion 1521A (or second side portion 1521B) in a direction perpendicular to the outer surface of first side portion 1521A (or second side portion 1521B). Alternatively, width M1 (or width M2) may be the width of the upper surface of first side portion 1521A (or second side portion 1521B).

[0670] For example, the width M1 of the first side portion 1521A of the filter holder 1600 and the width M2 of the second side portion 1521B of the filter holder 1600 may be the same. In another embodiment, the width M1 of the first side portion 1521A of the filter holder 1600 and the width M2 of the second side portion 1521B of the filter holder 1600 may be different from each other.

[0671] For example, each of the width M3 of the third side portion 1521C and the width M4 of the fourth side portion 1521D of the filter holder 1600 may be 0.8 mm to 1.3 mm. In another embodiment, for example, each of the width M3 and the width M4 may be 1.0 mm to 1.2 mm. In yet another embodiment, for example, each of the width M3 and the width M4 may be 1.0 mm to 1.1 mm.

[0672] For example, the width M4 of the fourth side portion 1521D of the filter holder 1600 may be the same as the width M3 of the third side portion 1521C of the filter holder 1600. In another embodiment, the width M3 of the third side portion 1521C of the filter holder 1600 and the width M4 of the fourth side portion 1521B of the filter holder 1600 may be different from each other.

[0673] For example, the width M3 (or width M4) may be the length of the third side portion 1521C (or fourth side portion 1521D) in the direction from the third side portion 1521C toward the fourth side portion 1521D. For example, the width M3 (or width M4) may be the length of the third side portion 1521C (or fourth side portion 1521D) in a direction perpendicular to the outer surface of the third side portion 1521C (or fourth side portion 1521D). Alternatively, the width M3 (or width M4) may be the width of the upper surface of the third side portion 1521C (or fourth side portion 1521D).

[0674] In another embodiment, the widths of the first to fourth side portions 1521A to 1521D of the filter holder 1600 may be the same.

[0675] Reference Figure 22 and Figure 23, the width M1 of the first side portion 1521A of the filter holder 1600 (or the width M2 of the second side portion 1521B) may be 15% to 20% of the length R3 of the filter 1610. In another embodiment, the width M1 (or the width M2) may be 16% to 19% of the length R3. In another embodiment, the width M1 (or the width M2) may be 17% to 18% of the length R3.

[0676] When the width M1 is less than 15% of the length R3, the width M1 may be excessively reduced. Therefore, it is impossible to disperse the impact applied to the filter holder 1600 due to the collision with the lens module 1400 to obtain the effect of suppressing the deformation of the filter holder 1600 and prevent the filter 1610 from being damaged or broken.

[0677] When the width M1 exceeds 20% of the length R3, the width M1 may be excessively increased. Therefore, the length of the filter holder 1600 in the direction perpendicular to the optical axis direction can be increased, so that the size of the camera device can be increased.

[0678] In order to prevent the camera apparatus from increasing in size and to stably disperse an impact caused by a collision between the lens module 1400 and the filter holder 1600 , the width M1 may be 17% to 19% of the length R3 .

[0679] The description of the relationship between the width M1 and the length R3 may apply, with or without modification, to the relationship between the width M2 of the second side portion 1521B and the length R3 of the filter 1610 .

[0680] The width M3 or M4 of the third side portion 1521C (or the fourth side portion 1521D) of the filter holder 1600 may be 7% to 12% of the length R4 of the filter 1610. In another embodiment, the width M3 or M4 may be 8% to 11% of the length R4 of the filter 1610. In yet another embodiment, the width M3 or M4 may be 9% to 10% of the length R4 of the filter 1610.

[0681] When width M3 is less than 7% of length R4, width M3 may be excessively reduced. Consequently, it is impossible to disperse the impact applied to filter holder 1600 due to collision with lens module 1400, thereby suppressing deformation of filter holder 1600 and preventing damage or breakage of filter 1610. When width M3 exceeds 12% of length R4, width M3 may be excessively increased, thereby increasing the length of filter holder 1600 in a direction perpendicular to the optical axis and, consequently, increasing the size of the camera device.

[0682] In order to prevent the camera apparatus from increasing in size and to stably disperse the impact force caused by the collision between the lens module 1400 and the filter holder 1600 , the width M3 may be 8% to 10% of the length R4 .

[0683] The description of the relationship between the width M3 and the length R4 may apply, with or without modification, to the relationship between the width M4 of the fourth side portion 1521D and the length R4 of the filter 1610 .

[0684] Reference Figure 23 The length R1 of the through hole 1051A in the filter holder 1600 in the same direction as the width M1 of the first side portion 1521A of the filter holder 1600 may be 7 mm to 9 mm. In another embodiment, for example, the length R1 may be 7.5 mm to 8 mm. In yet another embodiment, the length R1 may be 7.6 mm to 7.8 mm.

[0685] The length R2 of the through hole 1061A in the filter holder 1600 in the same direction as the width M3 of the third side portion 1521C of the filter holder 1600 may be 8 mm to 12 mm. In another embodiment, the length R2 may be 8 mm to 11 mm. In yet another embodiment, the length R2 may be 10 mm to 10.5 mm.

[0686] The width M1 of the first side portion 1521A of the filter holder 1600 may be 16% to 28% of the length R1 of the through hole 1061A in the filter holder 1600. In another embodiment, the width M1 may be 18% to 24% of the length R1.

[0687] When the width M1 is less than 16% of the length R1, the width M1 may be excessively reduced. Therefore, it is impossible to disperse the impact applied to the filter holder 1600 due to the collision with the lens module 1400 to obtain the effect of suppressing deformation of the filter holder 1600 and prevent the filter 1610 from being damaged or broken.

[0688] When the width M1 exceeds 28% of the length R1 , the width M1 may excessively increase, thereby increasing the length of the filter holder 1600 in a direction perpendicular to the optical axis direction, and thus increasing the size of the camera apparatus.

[0689] In order to prevent the camera apparatus from increasing in size and to stably disperse an impact caused by a collision between the lens module 1400 and the filter holder 1600 , the width M1 may be 18% to 22% of the length R1 .

[0690] The description of the relationship between the width M1 and the length R1 may apply, with or without modification, to the relationship between the width M2 of the second side portion 1521B and the length R1 of the through-hole 1061A.

[0691] The width M3 of the third side portion 1521C of the filter holder 1600 may be 7% to 16% of the length R2 of the through hole 1061A in the filter holder 1600 .

[0692] When width M3 is less than 7% of length R2, width M3 may be excessively reduced. Consequently, it is impossible to disperse the impact applied to filter holder 1600 due to collision with lens module 1400, thereby suppressing deformation of filter holder 1600 and preventing damage or breakage of filter 1610. When width M3 exceeds 16% of length R2, width M3 may be excessively increased, thereby increasing the length of filter holder 1600 perpendicular to the optical axis and, consequently, increasing the size of the camera device.

[0693] In order to prevent the camera apparatus from increasing in size and to stably disperse an impact caused by a collision between the lens module 1400 and the filter holder 1600 , the width M3 may be 9% to 12% of the length R2 .

[0694] The description of the relationship between the width M3 and the length R2 may be applied, with or without modification, to the relationship between the width M4 of the fourth side portion 1521D and the length R2 of the filter 1610 .

[0695] Figure 27a is a cross-sectional view of a camera device according to a comparative example. Figure 27b yes Figure 27a Schematic cross-sectional view of a camera apparatus of a comparative example is shown. Components of the comparative example that are the same as those of the embodiment may be denoted by the same reference numerals, and the description of the embodiment may be applied to the same components with or without modification.

[0696] Reference Figure 27a and Figure 27b , in the camera apparatus according to the comparative example, the length of the filter holder 1600 - 1 in the transverse direction and the distance of the filter holder 1600 - 1 in the longitudinal direction may be the same.

[0697] In the filter holder 1060-1 according to the comparative example, the circuit element CA may be provided on one side of the filter holder 1060-1 instead of the receiving portion 1053 according to the embodiment, and the filter holder 1060-1 may not overlap with the circuit element CA in the optical direction.

[0698] The distance K3 between the bottom surface of the seating portion of the filter holder 1060-1 in the comparative example and the upper surface of the filter holder 1060-1 can be smaller than the distance K1 in the embodiment. The FBL of the comparative example and the FBL of the embodiment can be the same. The distance between the OIS moving unit and the fixed unit in the optical axis direction of the comparative example can be the same as the distance between the OIS moving unit and the fixed unit in the optical axis direction of the embodiment. For example, in the comparative example, the distance H3 between the heat dissipation member 1280 of the OIS moving unit and the heat dissipation member 1380 of the fixed unit can be the same as the distance H3 between the heat dissipation member 1280 of the OIS moving unit and the heat dissipation member 1380 of the fixed unit in the embodiment. Furthermore, in the comparative example, the distance H4 between the connector of the support plate 1310 coupled to the holder 1270 of the OIS moving unit and the base of the fixed unit can be the same as the distance H4 between the connector of the support plate 1310 coupled to the holder 1270 of the OIS moving unit and the base of the fixed unit in the embodiment. However, in this embodiment, the distance H2 between the lens module 1400 and the upper surface of the holder 1600 may be smaller than the distance H1 between the lens module 1400 and the upper surface of the holder 1060-1 in the comparative example (H2

[0699] Reference Figure 27a Since the distance K3 between the upper surface of the filter holder 1060-1 and the upper surface of the filter 1610 in the comparative example is small, the lens module 1400 and the filter 1610 may contact and collide with each other due to external impact, causing the filter 1610 to be broken or damaged.

[0700] According to this embodiment, in order to prevent the filter from being damaged by collision with the lens module, the structure of the filter holder 1600 can be modified as described above, without increasing the length of the optical filter block (FBL) as is done in lens-shift type camera devices. Therefore, this embodiment can perform the sensor shift function using a single lens assembly having the same performance as a lens in a lens-shift type camera device, thereby achieving performance superior to that of a lens-shift type camera device.

[0701] Furthermore, since this embodiment does not require increasing the height of the lens to prevent damage to the filter caused by collision between the lens module and the filter, it is possible to prevent the height of the camera device from increasing.

[0702] ​In addition, since this embodiment is constructed so that the surface area of ​​the upper surface of the filter holder 1600 is increased, and a receiving portion that overlaps with the circuit element and receives the circuit element therein is formed in the outer portion of the filter holder 1600, the impact force during the collision with the lens module 1400 can be dispersed to reduce the stress applied to the filter holder 1600 and ensure the reliability of the camera device in resisting external impacts without increasing the size of the camera device in the direction perpendicular to the optical axis.

[0703] Figure 28a 16 is a perspective view of the filter holder 1600 and the damper 1045 . Figure 28b is included Figure 28a A partial cross-sectional view of a camera device showing damper 1045 .

[0704] Reference Figure 28a and Figure 28b , the camera device 1010 may include a damper 1045 disposed on the filter holder 1600. For example, the damper 1045 may be disposed, coupled, or attached to the upper surface of the filter holder 1600. The damper 1045 may also be referred to as a "stopper" or a "shock absorber."

[0705] For example, the damper 1045 may be disposed, coupled, or attached to the upper surface 1051a of the side portions 1521A to 1521D of the filter holder 1600. The damper 1045 may have the same shape as the side portions 1521A to 1521D of the filter holder 1600. At least a portion of the damper 1045 may be disposed between the filter holder 1600 and the lens module 1400. The damper 1045 may overlap with at least a portion of the lens module 1400 in the optical axis direction. Furthermore, the damper 1045 may overlap with the receiving portion 1053 of the filter holder 1600 in the optical axis direction. Furthermore, the damper 1045 may overlap with at least a portion of the circuit element CA in the optical axis direction.

[0706] The damper 1045 may be used to prevent or suppress deformation of the filter holder 1600 by absorbing an impact caused by a collision with the lens module 1400. Thus, the damper 1045 may be used to suppress contact or collision between the lens module 1400 and the filter 1610.

[0707] although Figure 28a One damper 1045 covering the entire surface of the upper surface 1051a of the filter holder 1600 is shown, but the damper 1045 according to another embodiment may include a plurality of dampers provided on the upper surface of the filter holder 1600. For example, the plurality of dampers may be spaced apart from each other.

[0708] For example, the damper 1045 may include at least one damper disposed on the upper surface of at least one of the plurality of side portions 1521A to 1521D of the filter holder 1600. For example, the at least one damper may be disposed between the through-hole 1061A in the filter holder 1600 and the outer surface of the side portions 1521A to 1521D of the filter holder 1600. For example, the at least one damper may contact the inner surface 1513 of the seating portion 1500. In another embodiment, the at least one damper may be spaced apart from the inner surface 1513 of the seating portion 1500. In another embodiment, the at least one damper may be disposed in a corner region of the filter holder 1600. In another embodiment, the at least one damper may contact the outer surface of the filter holder 1600. In yet another embodiment, the at least one damper may be spaced apart from the outer surface of the filter holder 1600.

[0709] For example, the damper 1045 may be made of a different material than the filter holder 1600. For example, the damper 1045 may be made of a material having lower rigidity than the filter holder 1600. For example, the damper 1045 may include a material having lower rigidity than the filter holder 1600.

[0710] For example, the damper 1045 may include a shock absorbing material such as rubber, silicone, foam rubber, POM material (e.g., polyoxymethylene, polyoxymethylene) or polyurethane. For example, the damper 1045 may include one of rubber, silicone, foam rubber, POM material or polyurethane.

[0711] right Figure 23 and Figure 26 The description of the distances K1 and K2 can be applied with or without modification to Figure 28a and 28b In another embodiment, when Figure 23 and Figure 26 The distances K1 and K2 described in the Figure 28a and 28b In the embodiment shown in FIG, the distances K1 and K2 may be distances to the upper surface of the damper 1045 rather than the lengths to the upper surface of the filter holder 600A.

[0712] Figure 29a 16 is a plan view of the filter holder 1600 , the filter 1610 , and the shielding member 2500 . Figure 29b yes Figure 29a An enlarged view of the dotted portion 1011A in FIG.

[0713] Reference Figure 29a and Figure 29b, the camera device 1010 may further include a shielding member 2500 disposed on the optical filter 1610. For example, the shielding member 2500 may be disposed on the upper surface of the optical filter 1610. The shielding member 2500 may also be referred to as an "absorbing member" or a "shielding portion."

[0714] For example, the shielding member 2500 may be provided in a peripheral area of ​​the upper surface of the optical filter 1610 and may be used to shield or absorb light that passes through the lens module 1400 and toward the peripheral area of ​​the optical filter 1610, so that at least a portion of the light cannot pass through the optical filter 1610. For example, the shielding member 2500 may be coupled or attached to the upper surface of the optical filter 1610.

[0715] For example, when viewed from above, the optical filter 1610 may have a quadrilateral shape, and the shielding members 2500 may be symmetrically arranged along the respective sides of the upper surface of the optical filter 1610. For example, the shielding members 2500 may be formed to have a constant width along the respective sides of the upper surface of the optical filter 1610. For example, the shielding members 2500 may be made of an opaque material. For example, the shielding members may be made of an opaque adhesive material applied to the optical filter 1610 or a film attached to the optical filter 1610.

[0716] The active areas of the optical filter 1610 and the image sensor 1810 may face or overlap each other in the optical axis direction. For example, the shielding member 2500 may face or overlap the active area 1810A of the image sensor 1810 in the optical axis direction (see FIG. Figure 29b ) do not overlap. For example, the active area 1810A of the image sensor 1810 may include an effective pixel array. In addition, for example, the active area 1810A of the image sensor 1810 may include an effective pixel array and a dummy pixel array.

[0717] For example, the shielding member 2500 may have a perforation through which a portion of the upper surface of the optical filter 1610 is exposed or opened. For example, the shielding member 2500 may not overlap with the active area 1810A of the image sensor 1810 in the optical axis direction. For example, when viewed along the optical axis or from above, the active area 1810A of the image sensor 1810 may be located within the perforation in the shielding member 2500.

[0718] For example, at least a portion of the shielding member 2500s may overlap with the wires connecting the image sensor 1810 to the second circuit board 1260. Thus, the shielding member 2500 may shield a portion of light that passes through the lens module 1400 and is then directed to the terminals and / or wires of the second circuit board 1260, thereby preventing a flare phenomenon and, therefore, preventing distortion of an image formed on the image sensor 1810. For example, the shielding member 2500 may overlap with the bottom surface 1511 of the filter holder 610 in the optical axis direction.

[0719] When viewed from above, the inner surface (or inner circumference) of the shielding member 2500 defined by the perforations in the shielding member 2500 may have a quadrilateral shape. Furthermore, the shielding member 2500 may include recesses 2510 formed in corners (or corner regions) of the inner surface (or inner circumference) of the shielding member 2500. The recesses 2510 may extend or be recessed in the direction of the corners of the outer surface of the shielding member 2500. For example, the recesses 2510 may include recesses provided at two or more of the four corners of the filter 1610.

[0720] When viewed from above, the recess 2510 may be formed to avoid a corner (or corner region) of the image sensor 1810 (eg, a corner 1811 of the active region 1810A of the image sensor 1810 ).

[0721] In order to perform active alignment between lens module 1400 and image sensor 1810, it is necessary to detect the positions of the four corners 1811 of image sensor 1810. Because active alignment is performed with shielding member 2500 attached to optical filter 1610, if shielding member 2500 blocks the corners of the active area of ​​image sensor 1810 due to errors in the attachment process, active alignment cannot be easily performed. Recesses 2510 can be used to allow easy identification of the four corners 1811 of image sensor 1810 during active alignment.

[0722] The recess 2510 may have any shape as long as it has a structure that can avoid the corner 1811 of the image sensor 1810. When viewed along the optical axis or from above, the recess 2510 may be formed to have, for example, an arc shape, a curved shape, or a polygonal shape.

[0723] Figure 30 is a perspective view of a filter holder 1600 - 1 , a filter 1610 - 1 , and a blocking member 1500 - 1 according to another embodiment. Figure 31 yes Figure 30 A plan view of the filter holder 1600 - 1 , the filter 1610 - 1 , the blocking member 1500 - 1 , and the lens module 1400 is shown. Figure 32 yes Figure 31 A cross-sectional view of the filter holder 1600-1, the filter 1610-1, and the lens module 1400 in the middle dotted line portion 11B.

[0724] Reference Figures 30 to 32In order to avoid spatial interference between the optical filter 1610-11 and the lens module 1400, the optical filter 1610-1 may include a relief portion 1033 provided at a corner or corner region. For example, the relief portion 1033 may have a shape formed by removing a corner or corner region from the optical filter 1610-1. For example, the corner of the optical filter 1610-1 may be a corner where two adjacent outer surfaces of the optical filter 1610-1 intersect with each other. For example, the corner region of the optical filter 1610-1 may be a predetermined range region of the optical filter 1610-1 connecting the two adjacent outer surfaces.

[0725] For example, the relief portion 1033 may have a shape formed by chamfering a corner or corner region of the optical filter 1610-1. For example, the relief portion 1033 may be formed at at least one of the four corners (or corner regions) of the optical filter 1610-1.

[0726] For example, the avoidance portion 1033 may overlap with the lower portion or lower end of the lens module 1400 in the optical axis direction. For example, since the avoidance portion 1033 overlaps with the lower portion or lower end of the lens module 1400 in the optical axis direction, the corner (or corner area) of the filter 1610-1 may not overlap with the lens module 1400 in the optical axis direction.

[0727] When viewed from above, the outer peripheral surface of the optical filter 1610-1 may have an octagonal shape. For example, when viewed from above, the outer peripheral surface of the optical filter 1610-1 may include four long sides and four short sides. Each of the four short sides may be located between two adjacent long sides and may connect the two adjacent long sides to each other.

[0728] The seating portion 1500-1 of the filter holder 1600-1 may include a bottom surface 1511A and an inner surface 1513A. The seating portion 1500-1 may have a shape that coincides with or is the same as the shape of the filter 1610-1, so that the filter 1610-1 is seated or disposed on the seating portion 1500-1. For example, the seating portion 1500-1 may have a shape that matches the shape of the filter 1610-1.

[0729] When viewed from above, the inner surface 1513A of the seating portion 1500-1 may have an octagonal shape. The inner surface 1513A of the seating portion 1500-1 may include a long inner surface corresponding to the long outer surface of the filter 1610-1 and a short inner surface corresponding to the short outer surface of the filter 1610-1.

[0730] although Figure 30 The shape of the placement portion shown in Figure 23 The shape of the seating portion 1500 shown in FIG is different, but Figure 23The description of the placement portion 1500 in FIG. 1 may be applied to the following with or without modification: Figure 30 The placement portion 1500 - 1 is shown in FIG.

[0731] The filter holder 1600-1 may include a perforation 1501A. When viewed from above, the shape of the perforation 1501A may be consistent with or identical to the shape of the outer surface of the filter holder 1610-1. For example, the perforation 1501A may have an octagonal shape. Figure 30 The shape of the perforation 1501A shown is different from Figure 23 The shape of the perforation 1061A of the filter 1610 is shown, but Figure 23 The description of the perforation 1061A may be applied with or without modification to Figure 30 Perforation 1501A is shown.

[0732] A corner or a corner region of the upper surface 1051 a 1 of the filter holder 1600 - 1 may overlap with a lower portion (eg, a lens barrel) of the lens module 1400 in the optical axis direction.

[0733] Although the widths of the side portions 1521A to 1521D of the filter holder 1600 may be constant, Figure 30 At least one end of the side portions 1521A to 1521D of the illustrated filter holder 1600 - 1 may include a portion whose width increases toward the corner portions 1522A to 1522D of the filter holder 1600 - 1 .

[0734] For example, the end portion of the side portion 1521B of the filter holder 1600 adjacent to the corner portion (e.g., 1522C) of the filter holder 1600 may include a portion having an increased width W12. Here, the width W12 may be the length between the inner surface 1513A and the outer surface of the side portion 1521B. Alternatively, the width W12 may be the length of the side portion in a width direction perpendicular to the longitudinal direction of the side portion.

[0735] For example, the width W12 or W22 may be the width of one end of the side portion (eg, 1521B or 1521C) of the filter holder 1600 - 1 adjacent to the corner region of the filter holder 1600 - 1 .

[0736] For example, the width W12 may be the length of the end portion of the side portion 1521B of the filter holder 1600-1 in the first horizontal direction (the Y-axis direction). For example, the width W13 may be the length of the end portion of the side portion 1521C of the filter holder 1600-1 in the second horizontal direction (the X-axis direction).

[0737] For example, the width W12 of a first portion of a side portion (e.g., 1521B) of the filter holder 1600-1 adjacent to one corner portion (e.g., 1522C) of the filter holder 1600-1 may be increased, and the width W13 of a second portion of a side portion (e.g., 1521B) of the filter holder 1600-1 adjacent to another corner portion (e.g., 1522B) of the filter holder 1600-1 may be increased.

[0738] For example, the width W12 of the first portion of the side portion (e.g., 1521B) of the filter holder 1600-1 may be greater than the width W11 of the third portion of the filter holder 1600-1. For example, the third portion of the filter holder 1600-1 may be located between the first portion and the second portion and may connect the first portion and the second portion to each other.

[0739] In another embodiment, the width (or length) W12 or W13 of the corner region of the filter holder 1600-1 in the first horizontal direction (Y-axis direction) may be greater than the width W11 (or length) of the side portion 1521A or 1521B (or the center region of the side portion) of the filter holder 1600-1 (W12>W11). For example, the width W11 may be the length of the center portion of the side portion 1521A or 1521B of the filter holder 1600-1 in the direction toward the second side portion 1521B.

[0740] For example, the width (or length) W22 or W23 of the corner region of the filter holder 1600-1 in the second horizontal direction (in the X-axis direction) may be greater than the width (or length) W21 of the side portion 1521C or 1521D (or the central region of the side portion) of the filter holder 1600-1 in the second horizontal direction (in the X-axis direction) (W22>W21). For example, the width W21 may be the length of the central portion of the side portion 1521C or 1521D of the filter holder 1600-1 in the direction from the third side portion 1521C toward the fourth side portion 1521D.

[0741] For example, the shielding member 1500-1 may be disposed in a peripheral area of ​​the upper surface of the filter 1610-1 having an octagonal shape. When viewed from above, the outer peripheral surface of the shielding member 1500-1 may be identical to or the same as the outer peripheral surface of the filter 1610-1.

[0742] For example, the shielding member 1500-1 may have a shape with a corner or corner area cut off or removed. For example, the outer peripheral surface of the shielding member 1500-1 may include four long sides and four short sides. For example, the outer peripheral surface of the shielding member 1500-1 may have an octagonal shape.

[0743] For example, a corner or a corner region of the blocking member 1500 - 1 may not overlap with the lens module 1400 (eg, lens barrel) in the optical axis direction.

[0744] Due to external impact, the lower portion of the lens module may collide with the filter holder and / or the filter. Since the corner portion of the filter has a small contact area, the corner portion is easily damaged or broken when colliding with the lens module. Figure 30 In the illustrated embodiment, relief portions 1033 can be formed at corners or corner regions of optical filter 1610-1, so that the corners or corner regions of optical filter 1610 do not overlap with the lens module in the optical axis direction, thereby limiting or attenuating collisions between lens module 1400 and optical filter 1610-1. Relief portions 1033 increase the collision area, thereby reducing the impact or stress applied to the corner regions of optical filter 1610-1 due to collisions with lens module 1400, thereby preventing breakage or damage to optical filter 1610-1.

[0745] In addition, Figure 30 In the illustrated embodiment, the width of the corners or corner regions of the upper surface of the filter holder 1600-1 can be increased, thereby increasing the rigidity of the corners or corner regions of the filter holder 1600-1 and improving the effect of dispersing impact forces or stress. By dispersing the impact forces or stress applied to the corners (or corner regions) of the upper surface of the filter holder 1600-1, damage or breakage of the corners (or corner regions) of the filter 1610 during collision can be prevented.

[0746] Figure 33 is a perspective view of the camera apparatus 10 according to the embodiment. Figure 34 yes Figure 33 A perspective view of camera device 10 is shown with cover member 300 removed. Figure 35 yes Figure 33 An exploded perspective view of camera device 10 is shown. Figure 36a It is along Figure 33 sectional view of the camera device 10 taken along line AB in FIG. Figure 36b It is along Figure 33 sectional view of the camera device 10 taken along line CD in FIG. Figure 36c It is along Figure 33 sectional view of the camera device 10 taken along line EF in FIG. Figure 37 yes Figure 35 FIG. 1 is an exploded perspective view of the AF operation unit 100 shown in FIG. Figure 38 1 is a perspective view of the bobbin 110 , the sensing magnet 180 , the balancing magnet 185 , the first coil 120 , the circuit board 190 , the first position sensor 170 , and the capacitor 195 . Figure 39a1 is a perspective view of the bobbin 110 , the housing 140 , the circuit board 190 , the upper elastic member 150 , the sensing magnet 180 , and the balancing magnet 185 . Figure 39b yes Figure 39a A perspective view of the structure shown, wherein a wire 220 is additionally provided. Figure 40 1 is a bottom perspective view of the housing 140 , the bobbin 110 , the lower elastic member 160 , the magnet 130 , and the circuit board 190 .

[0747] Reference Figures 33 to 40 The camera device 10 may include an AF operation unit 100 and an image sensor unit 350. The AF operation unit 100 may include an AF moving unit. The image sensor unit 350 may include an OIS moving unit. One of the AF moving unit and the OIS moving unit may be a first moving unit, and the other of the AF moving unit and the OIS moving unit may be a second moving unit.

[0748] The camera apparatus 10 may further include at least one of a cover member 300 and a lens module 400. The cover member 300 and a base 210 (described later) may define the housing.

[0749] The AF operation unit 100 may be coupled to the lens module 400 and may move the lens module 400 in a direction of the optical axis OA or in a direction parallel to the optical axis to perform an autofocus function of the camera apparatus 10 .

[0750] The image sensor unit 350 may include the image sensor 810. For example, the image sensor unit 350 (or the OIS operating unit) may include an OIS moving unit including the image sensor 810. For example, the image sensor unit 350 may move the OIS moving unit (e.g., the image sensor 810) in a direction perpendicular to the optical axis. Furthermore, the image sensor unit 350 may cause tilt or rotation (or roll) relative to or about the optical axis. The image sensor unit 350 may perform hand shake correction on the camera device 10.

[0751] For example, the image sensor 810 may include an imaging area configured to detect light passing through the lens module 400. Here, the imaging area may alternatively be referred to as an effective area, a light receiving area, an active area, or a pixel area. For example, the imaging area of ​​the image sensor 810 may be an area including an image contained in light that passes through the optical filter 610 and is then incident on the imaging area, and may include at least one unit pixel. For example, the imaging area may include a plurality of unit pixels.

[0752] The AF operation unit 100 may also be referred to as a “lens moving unit” or a “lens moving device.” Alternatively, the AF operation unit 100 may also be referred to as a “first moving unit (or second moving unit)”, a “first actuator (or second actuator)” or an “AF operation unit”.

[0753] The image sensor unit 350 may also be referred to as an “image sensor moving unit,” an “image sensor shift unit,” a “sensor moving unit,” or a “sensor shift unit.” Alternatively, the image sensor unit 350 may also be referred to as a “second moving unit (or first moving unit)” or a “second actuator (or first actuator).”

[0754] Reference Figure 37 and Figure 38 , the AF operating unit 100 can move the lens module 400 in the optical axis direction. For example, the AF operating unit 100 can move the coil bobbin 110 in the optical axis direction. For example, the AF operating unit 100 can include the coil bobbin 110, the first coil 120, the magnet 130, and the housing 140. The AF operating unit 100 can also include an upper elastic member 150 and a lower elastic member 160.

[0755] The AF operating unit 100 may further include a first position sensor 170 , a circuit board 190 , and a sensing magnet 180 for an AF feedback operation. The AF operating unit 100 may further include at least one of a balancing magnet 185 and a capacitor 195 .

[0756] The bobbin 110 may be disposed in the housing 140 so as to move in the optical axis direction OA or a first direction (eg, Z-axis direction) through electromagnetic interaction between the first coil 120 and the magnet 130 .

[0757] The bobbin 110 may have a through hole to which the lens module 400 is coupled or mounted. For example, the through hole in the bobbin 110 may be a through hole formed through the bobbin 110 along the optical axis and may have a circular, elliptical or polygonal shape, but is not limited thereto.

[0758] The lens module 400 may include at least one lens and / or a lens barrel. For example, the lens module 400 may include at least one lens and a lens barrel that receives the at least one lens. However, the configuration of the lens module is not limited to the lens barrel, and the lens module may have any configuration as long as the configuration can support at least one lens.

[0759] For example, the lens module 400 may be threadedly engaged with the bobbin 110. Alternatively, the lens module 400 may be coupled to the bobbin 110 using, for example, an adhesive (not shown). Light passing through the lens module 400 may be irradiated to the image sensor 810 through the filter 610.

[0760] The bobbin 110 may include one or more protrusions 111A and 111B disposed on its outer surface. For example, while one or more protrusions 111A and 111B may protrude in a direction parallel to a line perpendicular to the optical axis OA, the present disclosure is not limited thereto. For example, the bobbin 110 may include two protrusions 111A and 111B positioned opposite each other.

[0761] Protrusions 111A and 111B of bobbin 110 may correspond to and be disposed in grooves 25A and 25B in housing 140 to minimize or prevent bobbin 110 from rotating beyond a predetermined range about the optical axis.

[0762] The bobbin 110 may include a protrusion 146A protruding in a direction perpendicular to the optical axis. For example, the protrusion 146A of the bobbin 110 may be provided on a corner portion of the bobbin 110 .

[0763] The housing 140 may include a groove 146b that corresponds to, faces, or overlaps the protrusion 146A of the bobbin 110. At least a portion of the protrusion 146A of the bobbin 110 may be disposed in the groove 146B in the housing 140.

[0764] In addition, protrusion 146A of coil bobbin 110 can serve as a stopper configured to move coil bobbin 110 within a predetermined range in the optical axis direction (e.g., in a direction from upper elastic member 150 toward lower elastic member 160) in response to external impact, etc.

[0765] The bobbin 110 may form a first avoidance groove 112a in its upper surface to avoid spatial interference with the first frame connector 153 of the upper elastic member 150. The bobbin 110 may form a second avoidance groove 112b in its lower surface to avoid spatial interference with the second frame connector 163 of the lower elastic member 160.

[0766] The coil bobbin 110 may include a first coupler 116a configured to be coupled and fixed to the upper elastic member 150. For example, although the first coupler 116a of the coil bobbin 110 may have a protruding form, the present invention is not limited thereto. In another embodiment, the first coupler 116a of the coil bobbin 110 may have a flat surface or a groove form. In addition, the coil bobbin 110 may include a second coupler 116b configured to be coupled and fixed to the lower elastic member 160. Although the second coupler 116b may have, for example, a protruding form, the present disclosure is not limited thereto. In another embodiment, the second coupler 116b may have a flat surface or a groove form.

[0767] refer to Figure 37, the outer surface of the bobbin 110 may form a groove 105 therein, and the first coil 120 is placed, assembled or disposed in the groove 105. For example, the groove 105 in the bobbin 110 may have a shape corresponding to the shape of the first coil 120, that is, a closed curve shape (e.g., a ring shape).

[0768] The coil bobbin 110 may be provided with a first seating groove 26a in which the sensing magnet 180 may be seated, assembled, fixed, or disposed. Furthermore, the coil bobbin 110 may be provided with a second seating groove 26b on its outer surface in which the balancing magnet 185 may be seated, assembled, fixed, or disposed.

[0769] For example, the first seating groove 26a and the second seating groove 26b in the bobbin 110 may be formed in outer surfaces facing each other of the bobbin 110. For example, the first seating groove 26a may be formed in the first protrusion 111A of the bobbin 110, and the second seating groove 26b may be formed in the second protrusion 111B of the bobbin 110.

[0770] The bobbin 110 may include a guide protrusion 104A configured to guide a portion of the first frame connector 153 of the upper elastic member 150. For example, the guide protrusion 104A may protrude from a bottom surface of the escape portion 112a in the bobbin 110.

[0771] Reference Figure 37 and Figure 38 , the damper 48 may be disposed between the bobbin 110 and the upper elastic member 150. For example, the damper 48 may be disposed between the bobbin 110 and the first frame connector 153 of the upper elastic member 150 and may be in contact with, coupled to, or attached to the same.

[0772] For example, the upper elastic member 150 may include an extension (or protrusion) extending from the first frame connector 153. The extension 155 may be spaced apart from the outer frame 152 and the inner frame 151. In addition, the extension 155 may be spaced apart from one end of the first frame connector 153 connected to the inner frame 151 and the other end of the first frame connector 153 connected to the outer frame 152. For example, the extension 155 may extend beyond the upper surface of the bobbin 110.

[0773] For example, a portion (or end) of extension 155 may be disposed on damper 48 disposed on the upper surface of bobbin 110 so as to overlap damper 48. For example, bobbin 110 may include receiving portion 104b in which damper 48 is received or disposed. For example, receiving portion 104b may be a groove. Receiving portion 104b may have a structure that is recessed from the bottom surface of avoidance portion 112a in bobbin 110.

[0774] For example, damper 48 may be disposed between receiving portion 104b and extension portion 155 of upper elastic member 150 and may be in contact with, coupled to, or attached thereto. Damper 48 may be in contact with or attached to extension portion 155 and receiving portion 104b in bobbin 110 to damp or absorb vibration of bobbin 110. For example, damper 48 may be made of a damping member such as silicone.

[0775] The first coil 120 may be disposed on or coupled to the bobbin 110. For example, the first coil 120 may be disposed on or coupled to an outer surface of the bobbin 110. For example, the first coil 120 may be wound around the outer surface of the bobbin 110 in a winding direction around the optical axis OA, but is not limited thereto.

[0776] Although the first coil 120 may be directly wound on the outer surface of the bobbin 110, the present invention is not limited thereto. In another embodiment, the first coil 120 may be implemented as a coil ring wound on the bobbin 110, or as a coil block having an inclined shape.

[0777] A power or driving signal may be provided to the coil 120. The power or driving signal provided to the first coil 120 may be a DC signal, an AC signal, or a signal containing DC and AC components, and may be a voltage type or a current type.

[0778] When a driving signal (eg, a driving current) is supplied to the first coil 120 , an electromagnetic force caused by electromagnetic interaction with the first magnet may be generated, thereby moving the bobbin 110 in the direction of the optical axis OA by the generated electromagnetic force.

[0779] In the initial position of the AF operating unit, the bobbin 110 can move upward or downward, which is called bidirectional driving of the AF operating unit. Alternatively, in the initial position of the AF operating unit, the bobbin 110 can move upward, which is called unidirectional driving.

[0780] In an initial position of the AF operation unit, the first coil 120 may be disposed to correspond to the magnet 130 provided on the housing 140 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis.

[0781] For example, the AF operating unit may include a bobbin 110 and components (eg, a first coil 120 , a sensing magnet 180 , and a balancing magnet 185 ) coupled to the bobbin 110 . The AF operating unit may further include a lens module 400 .

[0782] The initial position of the AF operating unit may be the original position of the AF operating unit in a state where no power is applied to the first coil 120, or the position of the AF operating unit when the upper elastic member 150 and the lower elastic member 160 are elastically deformed only due to the weight of the AF operating unit. In addition, the initial position of the bobbin 110 may be the position of the AF operating unit when gravity acts in a direction from the bobbin 110 to the base 210 or when gravity acts in a direction from the base 210 to the bobbin 110.

[0783] The sensing magnet 180 may provide a magnetic field detected by the first position sensor 170 , and the balancing magnet 185 may be used to offset the influence of the magnetic field of the sensing magnet 180 and establish a weight balance relative to the sensing magnet 180 .

[0784] The sensing magnet 180 may be alternatively referred to as a "sensor magnet" or a "second magnet." The sensing magnet 180 may be disposed on the coil former 110 or may be coupled to the coil former 110. The sensing magnet 180 may be disposed facing the first position sensor 170. The balancing magnet 185 may be disposed on the coil former 110 or may be coupled to the coil former 110. For example, the balancing magnet 185 may be disposed opposite the sensing magnet 180.

[0785] Although each of the sensing magnet and the balancing magnet 180 and 185 may be a unipolar magnet having one N pole and one S pole, the present invention is not limited thereto. In another embodiment, each of the sensing magnet and the balancing magnet 180 and 185 may be a bipolar magnet having two N poles and two S poles, or a quadrupole magnet.

[0786] The sensing magnet 180 may move in the optical axis direction together with the bobbin 110 , and the first position sensor 170 may detect the strength or force of the magnetic field of the sensing magnet 180 moving in the optical axis direction and output an output signal corresponding to the detection result.

[0787] For example, the intensity or magnetic force of the magnetic field detected by first position sensor 170 may vary depending on the displacement of bobbin 110 in the optical axis direction. Therefore, first position sensor 170 may output an output signal proportional to the detected magnetic field intensity, and the output signal from first position sensor 170 may be used to detect the displacement of bobbin 110 in the optical axis direction.

[0788] The housing 140 may be provided in the cover member 300. For example, the housing 140 may be provided on the image sensor unit 350.

[0789] The housing 140 may accommodate the bobbin 110 therein, and may support the magnet 130 , the first position sensor 170 , and the circuit board 190 .

[0790] refer to Figure 37 、 Figure 38 and Figure 40 The housing 140 may be configured to have a hollow cylindrical shape. For example, the housing 140 may have a polygonal (eg, rectangular or octagonal) or circular perforation, and the perforation in the housing 140 may be a through hole formed through the housing 140 in the optical axis direction.

[0791] The housing 140 may include side portions and corner portions, the side portions corresponding to or facing the side plates 302 of the cover member 300 , and the corner portions corresponding to or facing the corner portions of the cover member 300 .

[0792] In order to prevent direct collision with the inner surface of the upper plate 301 of the cover member 300 , the housing 140 may include a stopper 145 provided at an upper portion, upper surface, or upper end thereof.

[0793] Reference Figure 37 , the housing 140 may have a mounting groove (or seating groove) 14A configured to accommodate the circuit board 190 therein. The mounting groove 14A may have a shape corresponding to the shape of the circuit board 190.

[0794] Reference Figure 39a and Figure 39b , the housing 140 may include protrusions 44A and 44B surrounding at least one of the support plate 310 and the circuit board 190. For example, the protrusions 44A and 44B may be provided or formed on the outer surface of the housing 140. For example, the protrusions 44A and 44B may be provided or formed on the outer surface of the side of the housing 140. The protrusions 44A and 44B may also be referred to as "protective portions," "support portions," "extending portions," or "guide portions."

[0795] The protrusions 44A and 44B of the housing 140 can surround at least a portion of the circuit board 190 and at least a portion of the support plate 310. For example, the housing 140 can include a first protrusion 44A disposed on a first side of the housing and a second protrusion 44B disposed on a second side of the housing 140. The first protrusion 44A and the second protrusion 44B can be positioned relative to each other with respect to the optical axis OA or the coil bobbin 110. In another embodiment, the second protrusion 44B can be omitted.

[0796] For example, the circuit board 190 may be disposed in the first protrusion 44A. For example, the mounting groove 14A may be formed in the first protrusion 44A.

[0797] For example, each of the first protrusion 44A and the second protrusion 44B may include a first portion 47A connected to the upper surface of the housing 140 and a second portion 47B connected to the first portion 47A and spaced apart from the side of the housing 140. For example, the first portion 47A of the first protrusion 44A may be connected to the upper surface of the first side of the housing 140, and the first portion 47A of the second protrusion 44B may be connected to the upper surface of the second side of the housing 140. For example, the first portion 47A may protrude from the upper surface of the second side of the housing 140 in the optical axis direction or toward the inner surface of the upper plate 301 of the cover member 300.

[0798] For example, at least a portion of the circuit board 190 may be located between the first portion 47A and the second portion 47B of the first protrusion 44A. In addition, for example, at least a portion of the support plate 310 may be located between the first portion 47A and the second portion 47B of the first protrusion 44A.

[0799] The housing 140 may have an opening through which the terminals B1 to B4 of the terminal portion 95 are exposed. The opening may be formed in a side portion of the housing 140.

[0800] Each of the first protrusion 44A and the second protrusion 44B of the housing 140 may include a third portion 37C extending from the second portion 47B. For example, the third portion 37C may extend or protrude from a lower portion or lower end of the second portion 47B in a direction parallel to the outer surface of the first side portion (or second side portion) of the housing 140 (e.g., a second horizontal direction).

[0801] For example, the third portion 37C may include a portion 3-1 extending from one end of the second portion 47B and a portion 3-2 extending from the other end of the second portion 47B. The portion 3-1 and the portion 3-2 may extend or protrude in opposite directions.

[0802] An adhesive or sealing member may be provided between the protrusions 44A and 44B of the housing 140 and the cover member 300. For example, an adhesive (or sealing member) may be provided between the protrusions 44A and 44B of the housing 140 and the side plate 302 of the cover member 300, and the two parts may be coupled to each other. The protrusions 44A and 44B may increase the surface area of ​​the protrusions 44A and 44B coupled to the cover member 300, and the housing 140 may be stably coupled to the cover member 300 without interfering with the support plate 310.

[0803] The upper portion, upper end, or upper surface of the housing 140 may be provided with at least one first coupler 143 to be coupled to the first outer frame 152 of the upper elastic member 150. The lower portion, lower end, or lower surface of the housing 140 may be provided with a second coupler to be coupled and fixed to the second outer frame 162 of the lower elastic member 160. For example, each of the first and second couplers of the housing 140 may have a shape of a flat surface, a protrusion, or a groove.

[0804] The corners of the housing 140 may have holes 147 formed therein, which are paths through which the wires 220 extend. The holes 147 may be through-holes formed by penetrating the outer surface of the corners of the housing 140 along the optical axis. In another embodiment, the holes may have a structure, and at least a portion of the holes may be exposed from the outer surface of the corners. The holes 147 in the housing 140 may include the same number of holes as the number of support members.

[0805] The magnet 130 may be disposed on, coupled to, or fixed to the housing 140 as a fixed component. For example, the magnet 130 may be disposed on, coupled to, or fixed to a side portion of the housing 140. The magnet 130 may include an AF operation magnet 71A for AF operation. The magnet 130 may include an OIS operation magnet 71B for OIS operation. Hereinafter, the AF operation magnet 71A may be referred to as one of the first and second magnets, and the OIS operation magnet 71B may be referred to as the other of the first and second magnets.

[0806] In another embodiment, the magnet 130 may be disposed, coupled, or fixed to a corner of the housing.

[0807] For example, the magnet 130 may include a plurality of magnet units. For example, the magnet 130 may include first to fourth magnet units 130-1 to 130-4 provided on the housing 140. In another embodiment, the magnet 130 may include two or more magnet units.

[0808] The magnet 130 may be disposed on at least one of the side or corner portions of the housing 140. For example, at least a portion of the magnet 130 may be disposed on a side or corner portion of the housing 140. Alternatively, for example, at least a portion of the magnet 130 may be disposed on a side portion of the housing 140, while the remaining portion of the magnet 130 may be disposed at a corner portion of the housing 140.

[0809] For example, each of the magnet units 130-1 to 130-4 may include a first portion provided on a corresponding one of the four corners of the housing 130. In addition, each of the magnet units 130-1 to 130-4 may include a second portion provided on a side of the housing 140 adjacent to one corner of the housing 140.

[0810] For example, the first magnet unit 130-1 and the third magnet unit 130-3 may be located on opposite sides of the housing 140 in a first horizontal direction (e.g., the Y-axis direction). For example, the second magnet unit 130-2 and the fourth magnet unit 130-4 may be located on opposite sides of the housing 140 along a second horizontal direction (e.g., the X-axis direction).

[0811] For example, the first magnet unit 130-1 and the third magnet unit 130-3 may be disposed parallel to each other in the second horizontal direction (e.g., the X-axis direction), and the second magnet unit 130-2 and the fourth magnet unit 130-4 may be disposed parallel to each other in the first horizontal direction (e.g., the Y-axis direction).

[0812] In an initial position of the AF operation unit, the magnet 130 may be disposed on the housing so as to partially overlap the first coil 120 in a direction perpendicular to the optical axis OA and parallel to a line passing through the optical axis OA.

[0813] The magnet 130 may include a monopole magnet or a dipole magnet including one north pole and one south pole. In another embodiment, the magnet 130 may include a dipole magnet or a quadrupole magnet including two north poles and two south poles. In another embodiment, the magnet 130 may include a monopole magnet and a dipole magnet.

[0814] For example, the magnet 130 may include an AF magnet for AF operation (or AF operation magnet) and an OIS magnet for OIS operation (or OIS operation magnet). In another embodiment, for example, the magnet 130 may be a common magnet for AF operation and OIS operation.

[0815] The description of magnet 1130 already described above may be applied to magnet 130 with or without modification.

[0816] The circuit board 190 may be disposed on the housing 140, and the first position sensor 170 may be disposed on or mounted to the circuit board 190 and may be electrically connected to the circuit board 190. For example, the circuit board 190 may be disposed in the mounting groove 14A in the housing 140, and the terminals 95 of the circuit board 190 may be exposed to the outside of the housing 140.

[0817] The circuit board 190 may include a terminal member (or terminal unit) 95 including a plurality of terminals B1 to B4 to be electrically connected to an external terminal or external device. The plurality of terminals B1 to B4 of the circuit board 190 may be electrically connected to the first position sensor 170 .

[0818] The first position sensor 170 may be provided on the housing 140 and / or the circuit board 190. The first position sensor 170 may be provided on a first surface of the circuit board 190, and the plurality of terminals B1 to B4 may be provided on a second surface of the circuit board 190. Here, the second surface of the circuit board 190 may be a surface opposite to the first surface of the circuit board 190. For example, the first surface of the circuit board 190 may be a surface of the circuit board 190 facing the coil bobbin 110 or the sensing magnet 180. For example, the circuit board 190 may be a printed circuit board or a flexible printed circuit board (FPCB).

[0819] The first position sensor 170 may be electrically connected to the circuit board 190. For example, the first position sensor 170 may be electrically connected to the first to fourth terminals B1 to B4 of the circuit board 190. The circuit board 190 may include a circuit pattern or wire (not shown) for electrically connec...

Claims

1. A camera device comprising: a fixing unit including a lens module; a moving unit comprising a circuit board, a circuit element provided on the circuit board, a filter holder provided on the circuit board, an optical filter opposite to the lens module in an optical axis direction and provided on the filter holder, and an image sensor opposite to the optical filter; and a supporting unit configured to support the moving unit relative to the fixing unit, wherein the filter holder includes: a first portion that overlaps with the lens module in the optical axis direction but does not overlap with the circuit element; and a second portion that overlaps with the circuit element in the optical axis direction but does not overlap with the lens module. The second portion is positioned higher than the circuit element but lower than the lens module.

2. The camera device according to claim 1, wherein The filter holder includes a third portion that is located between the first portion and the second portion and does not overlap with the lens module and the circuit element in the optical axis direction.

3. The camera device according to claim 2, wherein: The third portion is located between the first portion and the second portion.

4. The camera device according to claim 1, wherein The first portion has an upper surface positioned higher than an upper surface of the filter.

5. The camera device according to claim 1, wherein The circuit board includes a first circuit board having a through hole and a second circuit board disposed below the first circuit board, and At least a portion of the circuit element and at least a portion of the filter holder are disposed in the through hole of the first circuit board.

6. The camera device according to claim 5, wherein: The second portion is disposed in the through hole of the first circuit board and does not overlap with the first circuit board in the optical axis direction.

7. The camera device according to claim 5, wherein: The filter holder includes a fourth portion that does not overlap with the lens module and the circuit element in the optical axis direction and is disposed between the second portion and the first circuit board.

8. The camera device according to claim 1, wherein The filter holder comprises: side portions, including a first side portion and a second side portion positioned opposite to each other in a first direction; and a third side portion and a fourth side portion positioned opposite to each other in a second direction perpendicular to the first direction, and A seating portion includes a bottom surface positioned lower than an upper surface of a side portion of the filter holder in the optical axis direction, and the filter is disposed in the seating portion.

9. The camera device according to claim 8, wherein: The length of the first side portion in the first direction is 15% to 20% of the length of the optical filter in the first direction.

10. The camera device according to claim 8, wherein The length of the third side portion in the second direction is 7% to 12% of the length of the optical filter in the second direction.

Images