LED lamp bead and lighting equipment

Abstract

The invention relates to an LED lamp bead and lighting equipment. The LED lamp bead comprises a substrate, a circuit control module and a light-emitting module, wherein the circuit control module and the light-emitting module are located on the substrate. The light-emitting module comprises at least one first light-emitting unit and at least one second light-emitting unit; the color rendering index of the first light-emitting unit is higher than that of the second light-emitting unit; the circuit control module is used for controlling the first light-emitting unit to be in the first state and the second light-emitting unit to be in the second state in response to the first color rendering index requirement, and controlling the first light-emitting unit to be in the second state and the second light-emitting unit to be in the first state in response to the second color rendering index requirement. In this way, switching between the high color rendering index and the low color rendering index during illumination can be effectively achieved, so that the illumination requirements of different color rendering indexes are met; moreover, the LED lamp beads serve as lighting units with high color rendering indexes and low color rendering indexes, the structure is simpler, the light mixing uniformity effect is better, and therefore the better lighting effect is provided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor lighting technology, and in particular to an LED lamp bead and a lighting device. Background Art

[0002] The Color Rendering Index (CRI) measures a light source's ability to reproduce the color of an object, with values ​​ranging from 0 to 100. A higher CRI indicates that the color of the object illuminated by the light source more closely resembles the natural light effect. With the rapid development of semiconductor lighting technology and the widespread adoption of light-emitting diodes (LEDs), the demand for lighting performance has also increased. This is particularly true in applications such as medical and museum lighting, which often require precise CRI control. Therefore, the ability to switch between different CRIs and improve lighting performance is crucial. Summary of the Invention

[0003] In view of this, the present application is dedicated to providing an LED lamp bead and lighting equipment that can realize different CRI switching control and improve the lighting effect.

[0004] A first aspect of the present application provides an LED lamp bead, comprising: a substrate, a circuit control module and a light-emitting module located on the substrate; the circuit control module is electrically connected to the light-emitting module;

[0005] The light emitting module includes at least one first light emitting unit and at least one second light emitting unit;

[0006] The color rendering index of the first light-emitting unit is higher than the color rendering index of the second light-emitting unit;

[0007] The circuit control module is configured to control the first light-emitting unit to be in a first state and the second light-emitting unit to be in a second state in response to a first color rendering index requirement, and to control the first light-emitting unit to be in the second state and the second light-emitting unit to be in the first state in response to a second color rendering index requirement; the first state includes a light-emitting state, and the second state includes a non-light-emitting state;

[0008] The first light-emitting unit includes a first chip and a first fluorescent layer located on the side of the first chip facing away from the substrate. The second light-emitting unit includes a second chip and a second fluorescent layer located on the side of the second chip facing away from the substrate. The first chip and the second chip are chips with the same parameters. The difference between the color rendering index of the light emitted by the first chip when stimulating the first fluorescent layer and the color rendering index of the light emitted by the second chip when stimulating the second fluorescent layer is greater than a first preset threshold.

[0009] Optionally, the color rendering index of the first light-emitting unit is higher than the mixed color rendering index of the first light-emitting unit and the second light-emitting unit; the mixed color rendering index of the first light-emitting unit and the second light-emitting unit is higher than the color rendering index of the second light-emitting unit;

[0010] The circuit control module is further configured to control the first light emitting unit and the second light emitting unit to be in the first state in response to a third color rendering index requirement.

[0011] Optionally, the circuit control module includes a first control circuit and a second control circuit;

[0012] The first control circuit includes a plurality of first light-emitting unit mounting positions, and the plurality of first light-emitting unit mounting positions are distributed in sequence with equal intervals; the plurality of first light-emitting units are mounted on corresponding first light-emitting unit mounting positions;

[0013] The second control circuit includes a plurality of second light emitting unit mounting positions, and the plurality of second light emitting unit mounting positions are distributed in sequence at equal intervals; the plurality of second light emitting units are mounted on corresponding second light emitting unit mounting positions.

[0014] Optionally, the orthographic projection of the first fluorescent layer on the substrate is located within the orthographic projection of the first chip on the substrate, and the coverage of the first fluorescent layer on the first chip is in the range of 95% to 100%;

[0015] The orthographic projection of the second fluorescent layer on the substrate is located in the orthographic projection of the second chip on the substrate, and the coverage rate of the second fluorescent layer on the second chip is in the range of 95% to 100%.

[0016] Optionally, the color temperature difference between the light emitted by the first chip when stimulating the first fluorescent layer (121B) and the light emitted by the second chip when stimulating the second fluorescent layer (122B) is less than or equal to a second preset threshold.

[0017] Optionally, the first fluorescent layer (121B) includes green fluorescent powder and red fluorescent powder; or, the first fluorescent layer (121B) includes red fluorescent powder and blue fluorescent powder; or, the first fluorescent layer (121B) includes red fluorescent powder, green fluorescent powder and yellow fluorescent powder;

[0018] The second fluorescent layer (122B) includes yellow fluorescent powder and red fluorescent powder; or the second fluorescent layer (122B) includes yellow-green fluorescent powder and red fluorescent powder.

[0019] Optionally, when the first fluorescent layer (121B) includes green fluorescent powder and red fluorescent powder, the ratio of the green fluorescent powder to the red fluorescent powder in the first fluorescent layer (121B) is in the range of [10:1, 3:1];

[0020] When the second fluorescent layer (122B) includes yellow-green fluorescent powder and red fluorescent powder, the ratio of the yellow-green fluorescent powder to the red fluorescent powder in the second fluorescent layer (122B) includes [33:1, 13:1].

[0021] Optionally, a packaging structure is also included;

[0022] The substrate includes a light-emitting area; the light-emitting module is located in the light-emitting area;

[0023] The encapsulation structure includes an encapsulation layer; the encapsulation layer covers the light-emitting area.

[0024] Optionally, the packaging structure further includes a dam;

[0025] The dam is arranged around the light-emitting area, and the side of the encapsulation layer overlaps with a side of the dam close to the light-emitting area;

[0026] The distance between the substrate and a side of the dam facing away from the substrate is greater than or equal to the distance between the substrate and a side of the encapsulation layer facing away from the substrate.

[0027] Optionally, it further includes a reflective structure (14) located between the packaging structure and the substrate;

[0028] The reflective structure fills the light-emitting area and is arranged around the first chip and the second chip; the distance between the side of the reflective structure facing away from the substrate and the substrate is less than or equal to the distance between the side of the first chip and the second chip facing away from the substrate and the substrate.

[0029] Optionally, the material of the reflective structure includes an organic silicon compound; the viscosity of the organic silicon compound ranges from 1000 cp to 2000 cp.

[0030] Optionally, a plurality of the first light-emitting units and a plurality of the second light-emitting units are arranged in an array.

[0031] A second aspect of the present application provides a lighting device, comprising the LED lamp bead as described in the first aspect of the present application.

[0032] In the solution of the present application, the LED lamp bead includes a substrate, a circuit control module and a light-emitting module located thereon; the circuit control module is electrically connected to the light-emitting module; wherein the light-emitting module includes at least one first light-emitting unit and at least one second light-emitting unit; the color rendering index of the first light-emitting unit is higher than the color rendering index of the second light-emitting unit; the circuit control module is used to control the first light-emitting unit to be in a first state and the second light-emitting unit to be in a second state in response to the first color rendering index requirement, and, in response to the second color rendering index requirement, control the first light-emitting unit to be in a second state and the second light-emitting unit to be in the first state; the first state includes a light-emitting state, and the second state includes a non-light-emitting state; the first light-emitting unit includes a first chip and a first fluorescent layer located on the side of the first chip away from the substrate, the second light-emitting unit includes a second chip and a second fluorescent layer located on the side of the second chip away from the substrate, the first chip and the second chip are chips with the same parameters, and the difference between the color rendering index of the light emitted by the first fluorescent layer when the first chip excites the first fluorescent layer and the color rendering index of the light emitted by the second chip when the second chip excites the second fluorescent layer is greater than a first preset threshold. In this way, by setting at least one first light-emitting unit and at least one second light-emitting unit, it is possible to effectively switch between high color rendering index and low color rendering index during lighting, so as to meet the lighting needs of different color rendering indexes in different scenes; and, using LED lamp beads as lighting units with both high color rendering index and low color rendering index, the structure is simpler, and a single LED lamp bead can achieve lighting of different color rendering indexes from a more microscopic scope, and the mixed light uniformity effect is better, thereby providing a better lighting effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0034] Figure 1 This is a structural diagram of an LED lamp bead provided in one embodiment of the present application.

[0035] Figure 2 This is a structural diagram of an LED lamp bead provided in another embodiment of the present application.

[0036] Figure 3 This is a schematic diagram of the cross-sectional structure of an LED lamp bead provided in one embodiment of the present application.

[0037] Figure 4 This is a schematic diagram of the circuit connection relationship of an LED lamp bead provided in an embodiment of the present application.

[0038] Figure 5This is a schematic diagram of the planar structure of an LED lamp bead provided in one embodiment of the present application.

[0039] Figure 6 This is a schematic diagram of the planar structure of an LED lamp bead provided in another embodiment of the present application.

[0040] Figure 7 yes Figure 5 Another schematic diagram of the planar structure of the LED lamp bead shown.

[0041] Figure 8 yes Figure 6 Another schematic diagram of the planar structure of the LED lamp bead shown.

[0042] Figure 9 yes Figure 7 Another schematic diagram of the planar structure of the LED lamp bead shown.

[0043] Figure 10 yes Figure 8 Another schematic diagram of the planar structure of the LED lamp bead shown.

[0044] Figure 11 This is a schematic diagram of the cross-sectional structure of an LED lamp bead provided in another embodiment of the present application.

[0045] Figure 12 This is a schematic diagram of the arrangement of the first light-emitting unit and the second light-emitting unit in an LED lamp bead provided in one embodiment of the present application.

[0046] Figure 13 This is a schematic diagram of the arrangement of the first light-emitting unit and the second light-emitting unit in an LED lamp bead provided in another embodiment of the present application.

[0047] Figure 14 This is a schematic diagram of the arrangement of the first light-emitting unit and the second light-emitting unit in an LED lamp bead provided in another embodiment of the present application.

[0048] Reference numerals:

[0049] 10-substrate; 11-circuit control module; 12-light-emitting module; 111-first control circuit; 112-second control circuit; 121-first light-emitting unit; 122-second light-emitting unit; 121A-first chip; 121B-first fluorescent layer; 122A-second chip; 122B-second fluorescent layer; 13-packaging structure; 131-packaging layer; 132-dam; 14-reflection structure. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0051] As an important component that is indispensable to people's production and life, the development of lighting equipment has always attracted people's attention.

[0052] The inventors have found that the color rendering index of traditional LED lamp beads is fixed after packaging and curing. However, due to the influence of different application scenarios, people's requirements for the color rendering index of LED lamp beads will also be different. LED lamp beads with a fixed color rendering index cannot meet the different lighting needs of the same lighting equipment in different time periods.

[0053] To this end, the embodiment of the present application provides an LED lamp bead, such as Figure 1 As shown, the LED lamp bead may at least include: a substrate 10 , a circuit control module 11 and a light emitting module 12 located on the substrate 10 ; the circuit control module 11 is electrically connected to the light emitting module 12 .

[0054] The substrate 10 mainly plays the role of supporting and bearing, etc. Specifically, the substrate 10 can be a rigid substrate such as a ceramic substrate or a silicon substrate, or a flexible substrate such as aluminum, stainless steel (SUS) or flexible polyimide (PI).

[0055] like Figure 2 As shown, the light emitting module 12 may include at least one first light emitting unit 121 and at least one second light emitting unit 122 ; the color rendering index of the first light emitting unit 121 is higher than that of the second light emitting unit 122 .

[0056] Specifically, the color rendering index of the first light-emitting unit 121 is higher than that of the second light-emitting unit 122. Therefore, the first light-emitting unit 121 can be considered a light-emitting unit with a high color rendering index, while the second light-emitting unit 122 can be considered a light-emitting unit with a low color rendering index. The terms "high" and "low" are used to refer to the color rendering indexes of the first light-emitting unit 121 and the second light-emitting unit 122. The light-emitting module 12 includes at least one first light-emitting unit 121 and at least one second light-emitting unit 122. This allows the light-emitting module 12 to provide a high color rendering index lighting function based on the first light-emitting unit 121 and a low color rendering index lighting function based on the second light-emitting unit 122.

[0057] Accordingly, to satisfy the switching control between a high color rendering index and a low color rendering index, the circuit control module 11 can be used to control the first light-emitting unit 121 to be in a first state and the second light-emitting unit 122 to be in a second state in response to a first color rendering index requirement, and to control the first light-emitting unit 121 to be in a second state and the second light-emitting unit 122 to be in a first state in response to a second color rendering index requirement; the first state includes an emitting state, and the second state includes a non-emitting state. In this way, the circuit control module 11 can be used to achieve switching between a high color rendering index and a low color rendering index when the LED lamp beads are illuminated, thereby meeting the user's different requirements for the color rendering index of the LED lamp beads at different time periods.

[0058] Moreover, LED lamp beads are used as lighting units with both high and low color rendering indexes. Compared with LED lamp beads with fixed color rendering indexes, there is no need to match them with LED lamp beads with other color rendering indexes to achieve switching between high and low color rendering indexes, and they are more versatile. In addition, LED lamp beads are used as lighting units with a smaller volume. A single LED lamp bead can achieve lighting with different color rendering indexes from a more microscopic range. When the LED lamp bead has multiple first light-emitting units 121 or multiple second light-emitting units 122, the distance between the light-emitting units can be effectively shortened, so that the mixed light effect is better, thereby providing a better lighting effect.

[0059] During implementation, the light-emitting module 12 may include a plurality of first light-emitting units 121 and a plurality of second light-emitting units 122, or include one first light-emitting unit 121 and a plurality of second light-emitting units 122, or include multiple first light-emitting units 121 and one second light-emitting unit 122, or include one first light-emitting unit 121 and one second light-emitting unit 122. Specifically, the number of first light-emitting units 121 and second light-emitting units 122 can be set according to actual needs and is not specifically limited here. For example, the number of first light-emitting units can be set within the range of 10 to 100, and the number of second light-emitting units can be kept consistent with the number of first light-emitting units, so as to achieve switching of different color rendering indices at the same brightness while taking into account both lighting brightness and power consumption.

[0060] In order to further ensure that the LED lamp beads can achieve the function of switching between high color rendering index and low color rendering index, such as Figure 3As shown, the first light-emitting unit 121 may include a first chip 121A and a first fluorescent layer 121B located on the side of the first chip 121A away from the substrate 10, and the second light-emitting unit 122 may include a second chip 122A and a second fluorescent layer 122B located on the side of the second chip 122A away from the substrate 10. The first chip 121A and the second chip 122A are chips with the same parameters. The difference between the color rendering index of the light emitted by the first fluorescent layer 121B excited by the first chip 122A and the color rendering index of the light emitted by the second fluorescent layer 122B excited by the second chip 122B is greater than the first preset threshold value, thereby ensuring the uniformity of the light output of the LED lamp bead and laying a physical foundation for achieving switching between high and low color rendering indexes.

[0061] The first preset threshold value can be set according to actual needs and is not specifically limited here. For example, the first preset threshold value can be set within the range of 8 to 15, thereby ensuring a relatively obvious color rendering index difference between the first light-emitting unit 121 and the second light-emitting unit 122.

[0062] During implementation, the first chip 121A and the second chip 122A can both be blue light LED chips. In order to make the LED lamp bead emit white light, a fluorescent layer needs to be set on the blue light LED chip. The blue light LED chip excites the phosphor in the fluorescent layer. After the phosphor in the fluorescent layer absorbs the blue light, the electrons jump and release long-wavelength light with lower energy. The unabsorbed blue light mixes with the light emitted by the phosphor to form approximately white light.

[0063] In some embodiments, the color rendering index of the first light-emitting unit 121 is higher than the mixed color rendering index of the first light-emitting unit 121 and the second light-emitting unit 122; the mixed color rendering index of the first light-emitting unit 121 and the second light-emitting unit 122 is higher than the color rendering index of the second light-emitting unit 122; the circuit control module 11 is also used to control the first light-emitting unit 121 and the second light-emitting unit 122 to be in the first state in response to the third color rendering index requirement.

[0064] The mixed color rendering index of the first light-emitting unit 121 and the second light-emitting unit 122 refers to the color rendering index presented by the LED lamp bead when the first light-emitting unit 121 and the second light-emitting unit 122 are in the light-emitting state at the same time.

[0065] The third color rendering index requirement refers to a color rendering index requirement that is between the first color rendering index and the second color rendering index.

[0066] Specifically, the color rendering index can be set to three gears, among which the color rendering index of the first light-emitting unit 121 is configured as the first gear, the mixed color rendering index of the first light-emitting unit 121 and the second light-emitting unit 122 is configured as the second gear, and the color rendering index of the second light-emitting unit 122 is configured as the third gear. The LED lamp beads have three gears of color rendering index. Accordingly, under the control of the circuit control module 11, the LED lamp beads can realize the switching of the color rendering index of the three gears, thereby further meeting the user's requirements for different color rendering indexes of LED lamp beads in different scenarios, and effectively improving the user experience.

[0067] For example, the number of the first light-emitting unit 121 and the second light-emitting unit 122 are both 10, the color rendering index of the first light-emitting unit 121 is 90, the color rendering index of the second light-emitting unit 122 is 80, and the mixed color rendering index of the first light-emitting unit 121 and the second light-emitting unit 122 is 85. Then, the circuit control module 11 can control the first light-emitting unit 121 to be in a light-emitting state and the second light-emitting unit 122 to be in a non-light-emitting state in response to the user's first color rendering index (first gear) requirement, so that the color rendering index of the LED lamp bead is 90; similarly, the circuit control module 11 can control the first light-emitting unit 121 and the second light-emitting unit 122 to be in a light-emitting state in response to the user's third color rendering index (second gear) requirement, so that the color rendering index of the LED lamp bead is 85; and, the circuit control module 11 can control the first light-emitting unit 121 to be in a non-lighting state and the second light-emitting unit 122 to be in a light-emitting state in response to the user's second color rendering index (third gear) requirement, so that the color rendering index of the LED lamp bead is 80.

[0068] Furthermore, when the color rendering index of the LED lamp bead is at the second level, the first light-emitting unit 121 and the second light-emitting unit 122 are both in a light-emitting state. Since the LED lamp bead, as a lighting unit, has a smaller volume, the distance between the first light-emitting unit 121 and the second light-emitting unit 122 is smaller, which can not only effectively improve the light mixing effect between multiple first light-emitting units 121 and multiple second light-emitting units 122, but also effectively improve the light mixing effect between the first light-emitting unit 121 and the second light-emitting unit 122, thereby further improving the lighting effect of the LED lamp bead under the third color rendering index.

[0069] In order to better realize the switching of multiple color rendering indexes of LED lamp beads, in some implementations, such as Figure 4 As shown, the circuit control module 11 may include a first control circuit 111 and a second control circuit 112; wherein, the first control circuit 111 may include a plurality of first light-emitting unit mounting positions, and the plurality of first light-emitting unit mounting positions are distributed in sequence at equal intervals; and a plurality of first light-emitting units 121 are mounted on corresponding first light-emitting unit mounting positions.

[0070] Similarly, the second control circuit 112 may include a plurality of second light emitting unit mounting positions, which are distributed in sequence at equal intervals; and the plurality of second light emitting units 122 are mounted on the corresponding second light emitting unit mounting positions.

[0071] Specifically, the first light-emitting unit mounting position is used to set the first light-emitting unit 121, and the second light-emitting unit mounting position is used to set the second light-emitting unit 122. Arranging multiple first light-emitting unit mounting positions in a sequence with equal spacing, and setting multiple second light-emitting unit mounting positions in a sequence with equal spacing, that is, arranging multiple first light-emitting units 121 and multiple second light-emitting units 122 in a sequence with equal spacing, ensures the uniformity of the arrangement of the first light-emitting units 121 and the second light-emitting units 122 on the substrate 10, thereby further improving the uniformity of the light output and the light mixing effect of the LED lamp beads.

[0072] It should be noted that the embodiments of the present application are only described by taking the example of multiple first light-emitting unit mounting positions being distributed in sequence with equal intervals and multiple second light-emitting unit mounting positions being distributed in sequence with equal intervals, but the present application is not limited to this. In some other embodiments, multiple first light-emitting unit mounting positions may also be arranged at non-equal intervals, and multiple second light-emitting unit mounting positions may also be arranged at non-equal intervals. Specifically, the arrangement of each light-emitting unit mounting position can be set according to actual needs, and no specific limitation is made here.

[0073] When implementing, if Figure 5 and Figure 6 As shown, electronic printing can be used to form the first control circuit 111 and the second control circuit 112 on the substrate 10, thereby obtaining a printed circuit board having the first control circuit 111 and the second control circuit 112. Furthermore, a chip on board (COB) packaging format (such as Figure 5 as shown) or surface mount package (as Figure 6 As shown in FIG. 1 , the first light emitting unit 121 and the second light emitting unit 122 are mounted on corresponding light emitting unit mounting positions.

[0074] COB packaging has the advantages of high integration, lightness and excellent heat dissipation, while surface mount packaging has the advantages of standardization, easy maintenance and adaptability to complex circuit design. In practical applications, the specific packaging form can be set according to actual needs and is not specifically limited here. For example, when the number of light-emitting units is small, such as when the number of the first light-emitting unit 121 and the second light-emitting unit 122 are both 1 or 2, the LED lamp bead is a low-power lighting unit and a surface mount packaging can be used. When the number of light-emitting units is large, such as when the number of the first light-emitting unit 121 and the second light-emitting unit 122 are both 6 or 12, COB packaging can be used to obtain the LED lamp bead.

[0075] Preferably, the first light-emitting unit 121 and the second light-emitting unit 122 can be mounted on the corresponding light-emitting unit mounting position by means of a flip chip. The flip chip is a pinless structure, the core of which is to mount the active surface of the chip (i.e., the surface with the circuit) directly upside down and directly connected to the pads on the substrate or the package carrier through bumps. During implementation, the light-emitting unit mounting position is the pad on the printed circuit board (the substrate 10 having the first control circuit 111 and the second control circuit 112). Flipping the first light-emitting unit 121 and the second light-emitting unit 122 onto the corresponding pads can save space for wire bonding, making the structure of the LED lamp bead more compact, thereby improving the miniaturization and reliability of the LED lamp bead.

[0076] In some embodiments, the orthographic projection of the first fluorescent layer 121B on the substrate 10 coincides with the orthographic projection of the first chip 121A on the substrate 10 .

[0077] Likewise, the orthographic projection of the second fluorescent layer 122B on the substrate 10 coincides with the orthographic projection of the second chip 122A on the substrate 10 .

[0078] By arranging that the orthographic projection of the first fluorescent layer 121B on the substrate 10 coincides with the orthographic projection of the first chip 121A on the substrate 10, and that the orthographic projection of the second fluorescent layer 122B on the substrate 10 coincides with the orthographic projection of the second chip 122A on the substrate 10, light emitting effects can be ensured from the side of the first chip 121A facing away from the substrate 10 and the side of the second chip 122A facing away from the substrate 10, thereby improving the lighting effect.

[0079] It should be noted that the embodiment of the present application is only described by taking the orthographic projection of the first fluorescent layer 121B on the substrate 10 as coinciding with the orthographic projection of the first chip 121A on the substrate 10, and the orthographic projection of the second fluorescent layer 122B on the substrate 10 as coinciding with the orthographic projection of the second chip 122A on the substrate 10 as an example, but the present application is not limited to this. In some other embodiments, the first fluorescent layer 121B may be arranged to cover the side of the first chip 121A facing away from the substrate 10, and the second fluorescent layer 122B may be arranged to cover the side of the second chip 122A facing away from the substrate 10. Specifically, to prevent the original light leakage of the LED chip from affecting the lighting effect, the orthographic projection of the first fluorescent layer 121B on the substrate 10 can be located in the orthographic projection of the first chip 121A on the substrate 10, and the coverage rate of the first fluorescent layer 121B to the first chip 121A is within the range of 95% to 100%, and the orthographic projection of the second fluorescent layer 122B on the substrate 10 is located in the orthographic projection of the second chip 122A on the substrate 10, and the coverage rate of the second fluorescent layer 122B to the second chip 122A is within the range of 95% to 100%. For example, the coverage rate of the first fluorescent layer 121B on the side of the first chip 121A facing away from the substrate 10 may be 98%, and the coverage rate of the second fluorescent layer 122B on the side of the second chip 122A facing away from the substrate 10 may be 98%. Alternatively, the coverage rate of the first fluorescent layer 121B on the side of the first chip 121A facing away from the substrate 10 may be 99%, and the coverage rate of the second fluorescent layer 122B on the side of the second chip 122A facing away from the substrate 10 may be 99%, and so on.

[0080] During implementation, the color temperature difference between the light emitted by the first chip 121A to excite the first fluorescent layer 121B and the light emitted by the second chip 122A to excite the second fluorescent layer 122B may be less than or equal to the second preset threshold.

[0081] The second preset threshold can be set according to actual needs and is not specifically limited here.

[0082] For example, when the color temperature difference between the first fluorescent layer 121B and the second fluorescent layer 122B is set to be less than or equal to the second preset threshold, the second preset threshold can be set to 100k, so that the first light-emitting unit 121 and the second light-emitting unit 122 have similar color temperatures. In this way, the LED lamp beads can be switched to different color rendering indexes at the same color temperature.

[0083] For another example, when the color temperature difference between the first fluorescent layer 121B and the second fluorescent layer 122B is set to be less than or equal to the second preset threshold, the second preset threshold can be set to 1000k, so that the first light-emitting unit 121 and the second light-emitting unit 122 have a larger color temperature difference. In this way, the LED lamp beads can be switched to different color rendering indexes at different color temperatures.

[0084] In order to improve the white light effect emitted by the LED lamp beads while ensuring that the first light-emitting unit 121 and the second light-emitting unit 122 have different color rendering indexes, in some embodiments, the first fluorescent layer 121B may include green phosphor and red phosphor; or, the first fluorescent layer 121B may include blue phosphor and red phosphor; or, the first fluorescent layer 121B may include green phosphor, yellow phosphor and red phosphor; the second fluorescent layer 122B may include yellow phosphor and red phosphor; or, the second fluorescent layer 122B may include yellow-green phosphor and red phosphor.

[0085] In practice, the blue LED chip can achieve light color conversion by combining with different phosphors, and finally generate white light by mixing. For example, the first phosphor layer can include β-SiAlON green phosphor and K2SiF6:Mn 4+ Red phosphor, wherein the ratio of green phosphor to red phosphor in the first phosphor layer 121B may include [10:1, 3:1]; that is, the ratio of green phosphor to red phosphor may be 3:1, 4:1, 10:1, etc. The blue light emitted by the LED chip is mixed with the β-SiAlON green phosphor and K2SiF6:Mn 4+ The combination of red phosphors emits white light with a high color rendering index (CRI ≥ 90). The second phosphor layer may include Lu3Al5O 12 :Ce 3+ Yellow phosphor and CaAlSiN3:Eu 2+ Red phosphor, wherein the ratio of yellow-green phosphor to red phosphor in the second phosphor layer 122B may include [33:1, 13:1], that is, the ratio of green phosphor to red phosphor may be 33:1, 15:1, 13:1, and so on. 12 :Ce 3+ Yellow phosphor and CaAlSiN3:Eu 2+ The combination of red phosphors can emit white light with a color rendering index lower than that of the first phosphor layer (CRI ≥ 80).

[0086] Specifically, in order to ensure that the light emitted by the LED lamp beads is closer to natural light and can meet the color rendering index requirements, when the first fluorescent layer 121B includes green fluorescent powder and red fluorescent powder, the green fluorescent powder and the red fluorescent powder can be silicate / ammonium oxide green powder (excitation wavelength is in the range of 520nm to 530nm) and nitride / nitride oxide red powder (excitation wavelength is 650nm and above); when the first fluorescent layer 121B includes blue fluorescent powder and red fluorescent powder, the blue fluorescent powder and the red fluorescent powder can be silicate blue powder (excitation wavelength is 650nm and above). In the embodiment of the present invention, the first phosphor layer 121B includes a green phosphor, a yellow phosphor, and a red phosphor, and the green phosphor, the yellow phosphor, and the red phosphor can be silicate / ammonium oxide green powder (excitation wavelength is in the range of 520nm to 540nm), aluminate yellow powder (excitation wavelength is in the range of 540nm to 560nm), and nitride / nitride oxide red powder (excitation wavelength is 650nm and above). When the first phosphor layer 121B includes a green phosphor, a yellow phosphor, and a red phosphor, the green phosphor, the yellow phosphor, and the red phosphor can be silicate / ammonium oxide green powder (excitation wavelength is in the range of 520nm to 540nm), aluminate yellow powder (excitation wavelength is in the range of 540nm to 560nm), and nitride / nitride oxide red powder (excitation wavelength is 650nm and above). When the second fluorescent layer 122B includes yellow phosphor and red phosphor, the yellow phosphor and the red phosphor can be respectively aluminate yellow powder (excitation wavelength in the range of 540nm to 560nm) and nitride / nitride oxide red powder (excitation wavelength in the range of 650nm and above); or, when the second fluorescent layer 122B includes yellow-green phosphor and red phosphor, the yellow-green phosphor and the red phosphor can be respectively nitride / nitride oxide red powder (excitation wavelength in the range of 650nm and above) and silicate yellow-green powder (excitation wavelength in the range of 520nm to 540nm).

[0087] In the process of preparing the LED lamp bead, the first fluorescent layer 121B and the second fluorescent layer 122B can be pre-prepared fluorescent film layers. When preparing the LED lamp bead, the prepared fluorescent film layers can be directly attached to the corresponding chip (such as Figure 7 and Figure 8 Alternatively, fluorescent glue may be directly applied to the corresponding chip to form a fluorescent layer (as shown in FIG. Figure 9 and Figure 10 The thickness of the pre-prepared fluorescent film layer can be set within a range of 100 μm to 200 μm, and when the fluorescent glue is applied, the thickness of the applied fluorescent glue can be set within a range of 300 μm to 400 μm, thereby ensuring that the blue light emitted by the chip can fully cooperate with the phosphor in the fluorescent layer, ensuring that the LED lamp beads have a good white light effect.

[0088] In some embodiments, Figure 3 As shown, the LED lamp bead may further include a packaging structure 13 .

[0089] Specifically, the substrate 10 may include a light-emitting region; the light-emitting module 12 may be located within the light-emitting region. The encapsulation structure 13 may include an encapsulation layer 131; the encapsulation layer 131 covers the light-emitting region. This protects the light-emitting module 12 from moisture intrusion and simple collisions, thereby extending the lifespan of the LED.

[0090] During implementation, the material of the encapsulation layer 131 can be epoxy resin or silicone to achieve the effect of isolating moisture and insulation.

[0091] In some embodiments, Figure 11 As shown, the package structure 13 may further include a dam 132 .

[0092] Specifically, the dam 132 can be arranged around the light-emitting area, and the side of the encapsulation layer 131 overlaps the side of the dam closest to the light-emitting area, so that the dam 132 and the encapsulation layer 131 can cooperate with the substrate 10 to seal the light-emitting module 12. The distance between the side of the dam 132 facing away from the substrate 10 and the substrate 10 is greater than or equal to the distance between the side of the encapsulation layer 131 facing away from the substrate 10 and the substrate 10. In this way, the dam 132 can be used to limit the coverage of the encapsulation layer 131 during the packaging process, ensuring a precise ratio of the blue light chip and the phosphor, avoiding uneven light color or loss of light efficiency, and preventing the encapsulation colloid of the encapsulation layer from contaminating peripheral circuits, thereby improving packaging reliability.

[0093] In some embodiments, Figure 11 As shown, the LED lamp bead can also include a reflective structure 14 located between the packaging structure 13 and the substrate 10; the reflective structure 14 fills the light-emitting area and is arranged around the first chip 121A and the second chip 122A; the distance between the side of the reflective structure 14 facing away from the substrate 10 and the substrate 10 is less than or equal to the distance between the side of the first chip 121A and the second chip 122A facing away from the substrate 10 and the substrate 10.

[0094] Specifically, after the first chip 121A and the second chip 122A are arranged, a low-viscosity, highly reflective colloid can be injected between the chips to form a reflective structure 14. The reflective structure 14 can reflect light projected onto the reflective structure 14 by the first chip 121A and the second chip 122A, thereby improving the light extraction efficiency of the first chip 121A and the second chip 122A, and further enhancing the light extraction effect of the LED lamp beads.

[0095] In addition, the distance between the side of the reflective structure 14 facing away from the substrate 10 and the substrate 10 is less than or equal to the distance between the side of the first chip 121A facing away from the substrate 10 and the substrate 10, and is less than or equal to the distance between the side of the second chip 122A facing away from the substrate 10 and the substrate 10. This can achieve light reflection of the side light emitted by each light-emitting unit, overcome the problem of light leakage in each light-emitting unit, and further improve the light output efficiency of the light-emitting module.

[0096] Among them, the low-viscosity and highly reflective colloid can be an organic silicon compound; the viscosity range of the organic silicon compound includes 1000cp~2000cp, and the tolerance to high temperature of 250° can exceed 500 hours. After injection and leveling to form the reflective structure 14, the height between the side facing away from the substrate 10 and the substrate 10 can be lower than the distance between the side of the chip facing away from the substrate 10 and the substrate 10, and the distance difference between the side of the reflective structure 14 facing away from the substrate 10 and the substrate 10 and the side of the chip facing away from the substrate 10 and the substrate 10 can be set within the range of 20μm~30μm, thereby ensuring that the reflective structure 14 can reflect the light emitted from the side of the chip, thereby improving the light extraction efficiency.

[0097] Using a low-viscosity organosilicon compound as the material for reflective structure 14 improves the leveling effect when the organosilicon compound is injected between the chips, thereby further enhancing the reflective performance of reflective structure 14. Furthermore, the organosilicon compound's strong high-temperature tolerance ensures the LED lamp beads' efficient light output while extending their lifespan.

[0098] In some embodiments, when there are multiple first light-emitting units 121 and multiple second light-emitting units 122, in order to improve the uniformity and light mixing effect of the LED lamp beads, multiple first light-emitting units 121 and multiple second light-emitting units 122 can be arranged in an array.

[0099] Specifically, the array arrangement can be set according to actual needs and is not specifically limited here.

[0100] For example, Figure 12 As shown, the plurality of first light emitting units 121 and the plurality of second light emitting units 122 may be alternately arranged in concentric rings.

[0101] For example, Figure 13 As shown, the plurality of first light emitting units 121 and the plurality of second light emitting units 122 may be arranged in a checkerboard pattern.

[0102] For example, Figure 14 As shown, the plurality of first light emitting units 121 and the plurality of second light emitting units 122 may be cross-arranged in an orthogonal matrix.

[0103] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further provides a lighting device, comprising the LED lamp beads as described in any of the above embodiments.

[0104] During implementation, the number of LED lamp beads can be one or more.

[0105] It should be understood that the specific examples herein are only intended to help those skilled in the art better understand the embodiments of this specification, rather than to limit the scope of the present invention.

[0106] It can be understood that in the various implementations of this specification, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the implementation methods of this specification.

[0107] It can be understood that the various embodiments described in this specification can be implemented individually or in combination, and the embodiments in this specification are not limited to this.

[0108] Unless otherwise indicated, all technical and scientific terms used in the embodiments of this specification have the same meaning as those commonly understood by those skilled in the art in the technical field of this specification. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the scope of this specification. The term "and / or" used in this specification includes any and all combinations of one or more related listed items. The singular forms "a", "above", and "the" used in the embodiments of this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0109] In the several embodiments provided in this specification, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0110] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of this embodiment.

[0111] In addition, each functional unit in each embodiment of this specification may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0112] The above description is merely a specific embodiment of this specification, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this specification should be included in the scope of protection of this specification. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. An LED lamp bead, characterized in that: include: A substrate (10), a circuit control module (11) and a light emitting module (12) located on the substrate (10); the circuit control module (11) and the light emitting module (12) are electrically connected; The light emitting module (12) comprises at least one first light emitting unit (121) and at least one second light emitting unit (122); The color rendering index of the first light-emitting unit (121) is higher than the color rendering index of the second light-emitting unit (122); The circuit control module (11) is used for controlling the first light-emitting unit (121) to be in a first state and the second light-emitting unit (122) to be in a second state in response to a first color rendering index requirement, and for controlling the first light-emitting unit (121) to be in the second state and the second light-emitting unit (122) to be in the first state in response to a second color rendering index requirement; the first state includes a light-emitting state, and the second state includes a non-light-emitting state; The first light-emitting unit (121) comprises a first chip (121A) and a first fluorescent layer (121B) located on a side of the first chip (121A) facing away from the substrate (10); the second light-emitting unit (122) comprises a second chip (122A) and a second fluorescent layer (122B) located on a side of the second chip (122A) facing away from the substrate (10); the first chip (121A) and the second chip (122A) are chips with the same parameters; and a difference between a color rendering index of light emitted by the first chip (122A) stimulating the first fluorescent layer (121B) and a color rendering index of light emitted by the second chip (122B) stimulating the second fluorescent layer (122B) is greater than a first preset threshold.

2. The LED lamp bead according to claim 1, characterized in that: The color rendering index of the first light-emitting unit (121) is higher than the mixed color rendering index of the first light-emitting unit (121) and the second light-emitting unit (122); the mixed color rendering index of the first light-emitting unit (121) and the second light-emitting unit (122) is higher than the color rendering index of the second light-emitting unit (122); The circuit control module (11) is further configured to control the first light-emitting unit (121) and the second light-emitting unit (122) to be in the first state in response to a third color rendering index requirement.

3. The LED lamp bead according to claim 1, characterized in that: The circuit control module (11) comprises a first control circuit (111) and a second control circuit (112); The first control circuit (111) comprises a plurality of first light-emitting unit mounting positions, wherein the plurality of first light-emitting unit mounting positions are distributed in sequence at equal intervals; the plurality of first light-emitting units (121) are mounted on corresponding first light-emitting unit mounting positions; The second control circuit (112) comprises a plurality of second light-emitting unit mounting positions, and the plurality of second light-emitting unit mounting positions are distributed in sequence at equal intervals; and the plurality of second light-emitting units (122) are mounted on corresponding second light-emitting unit mounting positions.

4. The LED lamp bead according to claim 1, characterized in that: The orthographic projection of the first fluorescent layer (121B) on the substrate (10) is located within the orthographic projection of the first chip (121A) on the substrate (10), and the coverage rate of the first fluorescent layer (121B) on the first chip (121A) is within a range of 95% to 100%; The orthographic projection of the second fluorescent layer (122B) on the substrate (10) is located in the orthographic projection of the second chip (122B) on the substrate (10), and the coverage rate of the second fluorescent layer (122B) on the second chip (122A) is within the range of 95% to 100%.

5. The LED lamp bead according to claim 1, characterized in that: The color temperature difference between the light emitted by the first chip when stimulating the first fluorescent layer (121B) and the light emitted by the second chip when stimulating the second fluorescent layer (122B) is less than or equal to a second preset threshold.

6. The LED lamp bead according to claim 1, characterized in that: The first fluorescent layer (121B) includes green fluorescent powder and red fluorescent powder; or, the first fluorescent layer (121B) includes red fluorescent powder and blue fluorescent powder; or, the first fluorescent layer (121B) includes red fluorescent powder, green fluorescent powder and yellow fluorescent powder; The second fluorescent layer (122B) includes yellow fluorescent powder and red fluorescent powder; or the second fluorescent layer (122B) includes yellow-green fluorescent powder and red fluorescent powder.

7. The LED lamp bead according to claim 6, characterized in that: When the first fluorescent layer (121B) includes green fluorescent powder and red fluorescent powder, the ratio of the green fluorescent powder to the red fluorescent powder in the first fluorescent layer (121B) is in the range of [10:1, 3:1]; When the second fluorescent layer (122B) includes yellow-green fluorescent powder and red fluorescent powder, the ratio of the yellow-green fluorescent powder to the red fluorescent powder in the second fluorescent layer (122B) is within a range of [33:1, 13:1].

8. The LED lamp bead according to claim 1, characterized in that: Also included is a packaging structure (13); The substrate (10) includes a light-emitting area; the light-emitting module (12) is located in the light-emitting area; The encapsulation structure (13) comprises an encapsulation layer (131); the encapsulation layer (131) covers the light-emitting area.

9. The LED lamp bead according to claim 8, characterized in that: The packaging structure (13) further includes a dam (132); The dam (132) is arranged around the light-emitting area, and the side of the encapsulation layer (131) overlaps with a side of the dam (132) close to the light-emitting area; The distance between the side of the dam (132) facing away from the substrate (10) and the substrate (10) is greater than or equal to the distance between the side of the encapsulation layer (131) facing away from the substrate (10) and the substrate (10).

10. The LED lamp bead according to claim 8, characterized in that: It also includes a reflective structure (14) located between the packaging structure (13) and the substrate (10); The reflective structure (14) is filled in the light-emitting area and is arranged around the first chip (121A) and the second chip (122A); the distance between the side of the reflective structure (14) facing away from the substrate (10) and the substrate (10) is less than or equal to the distance between the side of the first chip (121A) and the second chip (122A) facing away from the substrate (10) and the substrate (10).

11. The LED lamp bead according to claim 10, characterized in that: The material of the reflective structure (14) includes an organic silicon compound; the viscosity of the organic silicon compound ranges from 1000 cp to 2000 cp.

12. The LED lamp bead according to claim 1, characterized in that: A plurality of the first light-emitting units (121) and a plurality of the second light-emitting units (122) are arranged in an array.

13. A lighting device, characterized in that: The invention comprises an LED lamp bead as described in any one of claims 1 to 12.

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