Liquid crystal display screen with strong local support and production process thereof

Abstract

The present invention relates to the field of display screen technology, and in particular to a liquid crystal display screen with strong local support and its production process. A liquid crystal display screen with strong local support includes a circuit board, a liquid crystal panel, a semiconductor refrigeration plate, and a driving member that controls the movement of the semiconductor refrigeration plate according to the ambient temperature. The semiconductor refrigeration plate is slidably arranged between the liquid crystal panel and the circuit board. The semiconductor refrigeration plate has a first node and a third node. When the semiconductor refrigeration plate is at the first node, the ambient temperature is lower than the normal operating temperature of the liquid crystal panel, the semiconductor refrigeration plate starts to work, and its cooling surface faces the circuit board. When the semiconductor refrigeration plate is at the third node, the ambient temperature is higher than the normal operating temperature of the liquid crystal panel, the semiconductor refrigeration plate starts to work, and its cooling surface faces the liquid crystal panel. The driving member changes the direction of the cooling surface of the semiconductor refrigeration plate, so that the liquid crystal panel is at a normal operating temperature, thereby improving the performance of the liquid crystal panel during use.

Description

Technical Field

[0001] The present invention relates to the technical field of display screens, and in particular to a liquid crystal display screen with strong local support and a production process thereof. Background Art

[0002] With the rapid development of information technology, liquid crystal displays (LCDs), thanks to their thinness, lightness, and low power consumption, have become widely used in various display terminals, including smartphones, tablets, and televisions. However, the display performance of LCDs is closely related to operating temperature, and the impact of temperature on their response speed has become a key factor restricting the product's user experience and lifespan.

[0003] In low-temperature environments, the movement of liquid crystal molecules within LCD screens decreases, resulting in a significant drop in response speed. This can easily lead to ghosting and afterimages when switching between screens, severely impacting display clarity and visual quality. For example, in cold winter weather, when the ambient temperature drops to -10°C or even lower, the LCD display's response delay increases significantly, resulting in delayed feedback on user operations and significantly reducing device usability.

[0004] In high-temperature environments, excessively high temperatures can accelerate the aging process of LCD screens and shorten the product's lifespan. When the temperature exceeds the "clearing point" temperature of the liquid crystal material, the orderly arrangement of the liquid crystal molecules is destroyed, and the liquid crystal phase characteristics cannot be displayed, which in turn causes the display to fail to display images normally. Summary of the Invention

[0005] Based on this, it is necessary to provide a liquid crystal display screen with strong local support and a production process thereof to address the problem that the current liquid crystal screen is affected by temperature and has poor performance during use.

[0006] The above purpose is achieved through the following technical solutions:

[0007] A liquid crystal display screen with strong local support includes a circuit board, a liquid crystal panel and a heat conduction mechanism. The liquid crystal panel is electrically connected to the circuit board via a first pin. The liquid crystal panel and the circuit board are arranged along a first direction with a spacing therebetween. The heat conduction mechanism includes a semiconductor cooling plate that slides along the first direction and a driving member that controls the movement of the semiconductor cooling plate according to the ambient temperature. The semiconductor cooling plate is slidably arranged between the liquid crystal panel and the circuit board. The cooling surface and the heat dissipation surface of the semiconductor cooling plate are arranged along the first direction.

[0008] The semiconductor refrigeration chip has a first node, a second node and a third node. When the ambient temperature is lower than the normal operating temperature range of the liquid crystal panel, the semiconductor refrigeration chip is at the first node, the semiconductor refrigeration chip starts to work and its cooling surface faces the circuit board; when the ambient temperature is within the normal operating temperature range of the liquid crystal panel, the semiconductor refrigeration chip is at the second node, the semiconductor refrigeration chip stops working; when the ambient temperature exceeds the normal operating temperature of the liquid crystal panel, the semiconductor refrigeration chip is at the third node, the semiconductor refrigeration chip starts to work and its cooling surface faces the liquid crystal panel.

[0009] Preferably, two groups of electrodes connected to the power supply are provided on the circuit board, and each group of electrodes includes two second pins respectively connected to the positive and negative poles of the power supply; two electric plates are provided on the semiconductor refrigeration plate, and the two electric plates are the poles of the semiconductor refrigeration plate. Each electric plate is slidingly connected to the two second pins in the same group of electrodes, and when the two electric plates are slidingly connected to the corresponding second pins, the two electric plates are connected to the positive and negative poles of the power supply through the corresponding second pins.

[0010] Preferably, the driving member includes a first two-way memory alloy and a second two-way memory alloy, the first two-way memory alloy is located between the semiconductor refrigeration plate and the liquid crystal panel and is connected to the semiconductor refrigeration plate and the liquid crystal panel, the first two-way memory alloy bends along a second direction, and the second direction is perpendicular to the first direction; the second two-way memory alloy is located between the semiconductor refrigeration plate and the circuit board and is connected to the semiconductor refrigeration plate and the circuit board, and the bending direction of the second two-way memory alloy is consistent with that of the first two-way memory alloy; the first two-way memory alloy and the second two-way memory alloy can both bend or stretch when the temperature changes, and under the same temperature change, the first two-way memory alloy bends and the second two-way memory alloy stretches, or the first two-way memory alloy stretches and the second two-way memory alloy bends.

[0011] Preferably, the heat conduction mechanism also includes four heat conduction plates, two of which are respectively connected to the two sides of the semiconductor refrigeration plate in the first direction, and the other two heat conduction plates are respectively connected to the circuit board and the side of the liquid crystal panel close to the semiconductor refrigeration plate; the first two-way memory alloy is connected to the semiconductor refrigeration plate and the liquid crystal panel through the heat conduction plates on the liquid crystal panel and the side of the semiconductor refrigeration plate close to the liquid crystal panel, and the second two-way memory alloy is connected to the semiconductor refrigeration plate and the circuit board through the heat conduction plates on the circuit board and the side of the semiconductor refrigeration plate close to the circuit board.

[0012] Preferably, fins are provided on the surfaces of the two heat conducting plates located on the same side of the semiconductor refrigeration plate that are close to each other.

[0013] Preferably, thermal grease is provided between the liquid crystal panel, the semiconductor refrigeration sheet, the circuit board and the corresponding heat conducting plates.

[0014] Preferably, the liquid crystal panel includes a polarizer, glass, an ITO layer, a TOP layer, a PI layer, a frame sealing layer, a PI layer, a TOP layer, an ITO layer, glass and a polarizer distributed in sequence along a first direction, a sealed space is formed between the two PI layers and the frame sealing layer, and the sealed space is filled with space powder, a UV composite material and a liquid crystal material; the UV composite material is formed of UV glue and hard powder, the frame sealing layer is formed of epoxy resin glue and hard powder in a mass ratio of 100: (0.2~2), and in the UV composite material, the mass ratio of UV glue and hard powder is 100: (0.2~2).

[0015] Preferably, the thickness of the frame sealing layer is 4 μm, that is, the thickness of the formed sealed space is 3.8 μm to 4 μm.

[0016] Preferably, the space powder is composed of plastic balls, and the size of a single plastic ball is 3.5 μm to 4 μm.

[0017] A production process for a liquid crystal display screen with local strong support comprises the following steps:

[0018] S1: Install the TOP layer, ITO layer, glass and polarizer on one side of each PI layer in sequence.

[0019] S2, epoxy resin glue is mixed with hard powder, screen-printed on one of the PI layers, and cured to form a frame sealing layer.

[0020] S3, mixing UV glue with hard powder, screen printing and curing on another PI layer to form a UV composite material.

[0021] S4, isopropyl alcohol, water, and space powder are mixed in a mass ratio of 90:10:0.5, sprayed on one of the PI layers, and then the two PI layers are bonded and cured, and finally the sealed space formed is further filled with liquid crystal material.

[0022] The present invention has the following beneficial effects: when the ambient temperature is low, the semiconductor refrigeration plate at the first node begins to heat the liquid crystal panel, increasing the response speed of the liquid crystal panel; when the ambient temperature is high, the semiconductor refrigeration plate at the third node cools the liquid crystal panel, preventing high temperature from causing screen aging and damage. The arrangement of the first and third nodes of the semiconductor refrigeration plate enables the semiconductor refrigeration plate to better heat and cool the liquid crystal panel, thereby maintaining the liquid crystal panel at a normal operating temperature and improving the performance of the liquid crystal panel during use. The provision of a driver actively adjusts the node position of the semiconductor refrigeration plate according to the ambient temperature, making the semiconductor refrigeration plate more intelligent in dissipating heat and heating the liquid crystal panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1A schematic structural diagram of a liquid crystal display screen with local strong support provided by an embodiment of the present invention;

[0024] Figure 2 A front view of a liquid crystal display screen with local strong support provided by an embodiment of the present invention;

[0025] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0026] Figure 4 A second node state diagram of a semiconductor refrigeration plate of a liquid crystal display screen with strong local support provided by an embodiment of the present invention;

[0027] Figure 5 A third node state diagram of a semiconductor refrigeration plate of a liquid crystal display screen with strong local support provided by an embodiment of the present invention;

[0028] Figure 6 for Figure 2 Cross-sectional view along the BB direction;

[0029] Figure 7 for Figure 6 Enlarged view of point C in the middle;

[0030] Figure 8 A schematic structural diagram of a semiconductor cooling plate for a liquid crystal display screen with local strong support provided by an embodiment of the present invention;

[0031] Figure 9 A schematic diagram of a first two-way memory alloy structure of a semiconductor refrigeration plate of a liquid crystal display screen with strong local support provided by an embodiment of the present invention at a first node;

[0032] Figure 10 A schematic diagram of the first two-way memory alloy structure of a semiconductor refrigeration plate of a liquid crystal display screen with local strong support provided by an embodiment of the present invention at the third node.

[0033] Among them: 100, circuit board; 101, first pin; 102, semiconductor refrigeration chip; 103, second pin; 104, electric board; 105, first two-way memory alloy; 106, second two-way memory alloy; 107, connecting board; 108, spring; 200, liquid crystal panel; 201, frame sealing layer; 202, UV composite material; 203, space powder; 204, liquid crystal material; 205, heat conduction plate; 206, fin; 207, thermal grease; 208, polarizer; 209, glass; 210, ITO layer; 211, TOP layer; 212, PI layer. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0035] The serial numbers assigned to components herein, such as "first," "second," etc., are used solely to distinguish the objects being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings). In the description of the present invention, it should be understood that terms such as "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" indicate positions or relationships based on those shown in the accompanying drawings. These terms are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the device or component being referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0036] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0037] like Figures 1 to 10 As shown, an embodiment of the present invention provides a liquid crystal display screen with strong local support, including a circuit board 100, a liquid crystal panel 200 and a heat-conducting mechanism. The liquid crystal panel 200 is electrically connected to the circuit board 100 through a first pin 101. The liquid crystal panel 200 and the circuit board 100 are arranged along a first direction with a spacing therebetween. The heat-conducting mechanism includes a semiconductor cooling plate 102 sliding along the first direction and a driving member controlling the movement of the semiconductor cooling plate 102 according to the ambient temperature. The semiconductor cooling plate 102 is slidably arranged between the liquid crystal panel 200 and the circuit board 100, and the cooling surface and the heat dissipation surface of the semiconductor cooling plate 102 are arranged along the first direction.

[0038] The semiconductor refrigeration chip 102 has a first node, a second node and a third node. If the ambient temperature is lower than the normal operating temperature range of the liquid crystal panel 200, the semiconductor refrigeration chip 102 is at the first node, the semiconductor refrigeration chip 102 starts to work and its cooling surface faces the circuit board 100; if the ambient temperature is within the normal operating temperature range of the liquid crystal panel 200, the semiconductor refrigeration chip 102 is at the second node, the semiconductor refrigeration chip 102 stops working; if the ambient temperature exceeds the normal operating temperature range of the liquid crystal panel 200, the semiconductor refrigeration chip 102 is at the third node, the semiconductor refrigeration chip 102 starts to work and its cooling surface faces the liquid crystal panel 200.

[0039] When the ambient temperature is low, the semiconductor refrigeration plate 102 at the first node begins to heat the liquid crystal panel 200, increasing the response speed of the liquid crystal panel 200. When the ambient temperature is high, the semiconductor refrigeration plate 102 at the third node cools the liquid crystal panel 200 to prevent high temperature from causing screen aging and damage. The configuration of the first and third nodes of the semiconductor refrigeration plate 102 enables the semiconductor refrigeration plate 102 to better heat and cool the liquid crystal panel 200, thereby maintaining the liquid crystal panel 200 at a normal operating temperature and improving the performance of the liquid crystal panel 200 during use. The configuration of a driver actively adjusts the node position of the semiconductor refrigeration plate 102 according to the ambient temperature, making the semiconductor refrigeration plate 102 more intelligent in dissipating heat and heating the liquid crystal panel 200.

[0040] In this embodiment, the circuit board 100 is provided with two groups of electrodes connected to a power source. Each group of electrodes includes two second pins 103, each connected to the positive and negative poles of the power source. The semiconductor cooling plate 102 is provided with two electric plates 104, which serve as the poles of the semiconductor cooling plate 102 and can be connected to the positive and negative poles of the power source. Each electric plate 104 is slidably connected to two second pins 103 in the same group of electrodes. When the two electric plates 104 are slidably connected to the corresponding second pins 103, the two electric plates 104 are connected to the positive and negative poles of the power source through the corresponding second pins 103. The second pins 103 extend in a first direction, and the end of the second pins 103 away from the circuit board 100 is connected to the liquid crystal panel 200 through an insulator, making the second pins 103 more secure.

[0041] When the semiconductor refrigeration plate 102 slides along the first direction, one of the electric plates 104 slides and connects with the second pin 103 connected to the positive or negative electrode in one group, and the other electric plate 104 slides and connects with the second pin 103 connected to the negative or positive electrode in the other group. At this time, one side of the semiconductor refrigeration plate 102 cools and the other side dissipates heat. When the electric plate 104 approaches the other second pin 103 in the same group and before contacting each other, both electric plates 104 separate from the second pin 103 with which they are slidingly connected, and then connect to the other second pin 103 in the same group of electrodes to avoid short circuiting of the semiconductor refrigeration plate 102. After the connected second pin 103 is replaced, the current flow direction in the semiconductor refrigeration plate 102 changes, and the cooling surface and the heat dissipation surface of the semiconductor refrigeration plate 102 exchange positions, thereby dissipating heat or heating the liquid crystal panel 200 according to the change in ambient temperature, allowing the liquid crystal panel 200 to operate better.

[0042] In this embodiment, the driving element includes a first two-way memory alloy 105 and a second two-way memory alloy 106. The first two-way memory alloy 105 is located between the semiconductor refrigeration chip 102 and the liquid crystal panel 200 and is connected to the semiconductor refrigeration chip 102 and the liquid crystal panel 200. The first two-way memory alloy 105 bends along a second direction, which is perpendicular to the first direction. The second two-way memory alloy 106 is located between the semiconductor refrigeration chip 102 and the circuit board 100 and is connected to the semiconductor refrigeration chip 102 and the circuit board 100. The bending direction of the second two-way memory alloy 106 is the same as that of the first two-way memory alloy 105. Both the first two-way memory alloy 105 and the second two-way memory alloy 106 can bend or elongate when the temperature changes. Under the same temperature change, the first two-way memory alloy 105 bends and the second two-way memory alloy 106 elongates, or the first two-way memory alloy 105 elongates and the second two-way memory alloy 106 bends.

[0043] Assume that the starting temperature of the first two-way memory alloy 105 changing from the low-temperature phase shape to the high-temperature phase shape is As1, the starting temperature of the first two-way memory alloy 105 changing from the high-temperature phase shape to the low-temperature phase shape is Ms1, and the ending temperature is Mf1, the starting temperature of the second two-way memory alloy 106 changing from the low-temperature phase shape to the high-temperature phase shape is As2, and the ending temperature is Af2, and the starting temperature of the second two-way memory alloy 106 changing from the high-temperature phase shape to the low-temperature phase shape is Ms2.

[0044] As1>Ms1>Mf1>Af2>As2>Ms2, where As1 to As2 is a normal operating temperature range of the liquid crystal panel 200.

[0045] When the semiconductor cooling plate 102 is at the first node, the side of the semiconductor cooling plate 102 closest to the liquid crystal panel 200 generates heat, causing the temperature of the liquid crystal panel 200 to rise. Over time, the temperature of the environment surrounding the first two-way memory alloy 105 and the second two-way memory alloy 106 gradually increases until it reaches As2, causing the second two-way memory alloy 106 to actively extend. When the ambient temperature reaches Af2, the semiconductor cooling plate 102 switches from the first node to the second node and stops operating. However, the liquid crystal panel 200 continues to generate heat, causing the ambient temperature to rise until it reaches As1. At this point, the first two-way memory alloy 105 begins to bend, and the semiconductor cooling plate 102 switches from the second node to the third node.

[0046] The second two-way memory alloy 106 is in a natural bending state when in Af2 and the first two-way memory alloy 105 is in Mf1, and the side thereof close to the semiconductor refrigeration plate 102 can still move along with the semiconductor refrigeration plate 102 in the first direction.

[0047] Specifically, each electrical plate 104 is provided with two connecting plates 107. The sides of the two connecting plates 107 facing away from the electrical plate 104 are located on either side of the semiconductor cooler 102 in the first direction. The connecting plates 107 are elastic and can bend in the second direction. The two groups of electrodes are located on either side of the semiconductor cooler 102 in the second direction. The two connecting plates 107 on each electrical plate 104 correspond to two second pins 103 in the same group of electrodes. When each connecting plate 107 is bent in the second direction away from the semiconductor cooler 102, it can contact the corresponding second pin 103. The semiconductor cooler 102 is provided with the same number of spring clips 108 as the connecting plates 107. The sides of the spring clips 108 facing away from the semiconductor cooler 102 are made of an insulating material. Each spring clip 108 corresponds to a connecting plate 107, bends in the second direction, and is located on the side of the connecting plate 107 facing away from the second pin 103. The bending of the spring piece 108 can push the corresponding connecting plate 107 along the second direction to move closer to the second pin 103 corresponding to the connecting plate 107 .

[0048] In this embodiment, the heat conduction mechanism also includes four heat conduction plates 205, two of which are connected to the two sides of the semiconductor refrigeration sheet 102 in the first direction, and the other two heat conduction plates 205 are connected to the circuit board 100 and the liquid crystal panel 200 on the side close to the semiconductor refrigeration sheet 102; the first two-way memory alloy 105 is connected to the semiconductor refrigeration sheet 102 and the liquid crystal panel 200 through the heat conduction plates 205 on the side close to the liquid crystal panel 200, and the second two-way memory alloy 105 is connected to the semiconductor refrigeration sheet 102 and the liquid crystal panel 200 through the heat conduction plates 205 on the side close to the liquid crystal panel 200. The two-way memory alloy 106 is connected to the circuit board 100 and the semiconductor cooling chip 102 via a heat conducting plate 205 on the side of the circuit board 100 closest to the circuit board 100. The forces generated by the deformation of the first two-way memory alloy 105 and the second two-way memory alloy 106 act on the corresponding heat conducting plates 205, thereby reducing damage to the liquid crystal panel 200 and the circuit board 100. The heat conducting plates 205 also evenly distribute heat across the liquid crystal panel 200 and the circuit board 100, preventing localized overheating of the liquid crystal panel 200 and the circuit board 100. The two sides of the spring 108 in the first direction are also connected to the two adjacent heat conducting plates 205, the semiconductor cooling chip 102, and the circuit board 100, respectively.

[0049] In this embodiment, fins 206 are provided on the adjacent surfaces of the two heat conducting plates 205 on the same side of the semiconductor refrigeration plate 102 . The fins 206 can increase the heat dissipation area of ​​the heat conducting plates 205 and improve the heat conduction efficiency of the heat conducting plates 205 .

[0050] In this embodiment, thermal grease 207 is provided between the liquid crystal panel 200, the semiconductor cooling sheet 102, the circuit board 100, and the corresponding heat conducting plates 205. The thermal grease 207 can improve the heat conduction efficiency.

[0051] In this embodiment, the liquid crystal panel 200 includes a polarizer 208, a glass 209, an ITO layer 210, a TOP layer 211, a PI layer 212, a frame sealing layer 201, a PI layer 212, a TOP layer 211, an ITO layer 210, a glass 209 and a polarizer 208 distributed in sequence along a first direction. A sealed space is formed between the two PI layers 212 and the frame sealing layer 201, and the sealed space is filled with space powder 203, a UV composite material 202 and a liquid crystal material 204; the UV composite material 202 is formed of UV glue and hard powder, and the frame sealing layer 201 is formed of epoxy resin glue and hard powder in a mass ratio of 100:(0.2~2). In the UV composite material 202, the mass ratio of UV glue and hard powder is 100:(0.2~2).

[0052] Specifically, the frame sealing layer 201 is formed by epoxy resin glue and hard powder in a mass ratio of 100:1.2, and the mass ratio of UV glue and hard powder is 100:0.5; the refractive index of the UV glue is 1.3-1.7.

[0053] The filling pattern of the UV composite material 202 in the sealed space includes dots with a diameter of 0.2 to 0.5 mm.

[0054] In this embodiment, the thickness of the frame sealing layer 201 is 4 μm, that is, the thickness of the formed sealed space is 3.8 μm to 4 μm.

[0055] In this embodiment, the space powder 203 is composed of plastic balls, the size of a single plastic ball is 3.5 μm to 4 μm, and the filling density of the space powder 203 in the sealed space is 80 to 120 pieces / mm².

[0056] The working principle of the liquid crystal display screen with local strong support provided by the above embodiment is as follows:

[0057] First, a locally supported liquid crystal display (LCD) is assembled and then placed in its operating position. The first and second dual-way memory alloys 105 and 106 adjust their expansion and contraction based on the ambient temperature to control the node positions of the semiconductor cooling plate 102. The LCD is then powered on, and operation begins.

[0058] When the ambient temperature when the display screen is started is lower than Ms2, the second two-way memory alloy 106 is in a bent state and bends along the second direction, and the semiconductor refrigeration plate 102 is at the first node. At this time, the middle parts of the two springs 108 on the two heat conducting plates 205 between the semiconductor refrigeration plate 102 and the circuit board 100 are bent along the first direction, and the bent springs 108 respectively abut against the two connecting plates 107 on the electric board 104, and the bent springs 108 push the corresponding connecting plates 107 to deflect along the second direction and contact the corresponding second pins 103. At this time, the connecting plates 107 in contact with the two second pins 103 are respectively connected to the positive and negative poles of the power supply through the corresponding second pins 103. The side of the semiconductor refrigeration plate 102 close to the circuit board 100 begins to cool down, and the side close to the liquid crystal panel 200 begins to heat up. The heat generated by the semiconductor refrigeration plate 102 heats the liquid crystal panel 200 through the heat conducting plate, so that the temperature of the liquid crystal panel 200 rises to the normal operating temperature range as quickly as possible.

[0059] As the heat dissipated by the semiconductor cooler 102 and generated by the liquid crystal panel 200 increases, the ambient temperature rises. When the temperature around the first two-way memory alloy 105 and the second two-way memory alloy 106 rises to As2, the second two-way memory alloy 106 begins to elongate. The elongated second two-way memory alloy 106 pulls the heat conducting plate 205 connected to the semiconductor cooler 102 away from the circuit board 100. At this point, the bending of the compressed spring 108 decreases, and the connecting plate 107, which was in contact with the second pin 103, loses the support of the spring 108 and gradually moves away from the second pin 103, until it completely separates from the second pin 103. The semiconductor cooler 102 switches from the first node to the second node. At the second node, the semiconductor cooler 102 is powered off, neither cooling nor generating heat.

[0060] During the process of switching from the first node to the second node, the temperature does not affect the first two-way memory alloy 105. The spring piece 108 between the first two-way memory alloy 105 and the semiconductor refrigeration plate 102 and the liquid crystal panel 200 undergoes physical deformation of bending along the second direction under the push of the semiconductor refrigeration plate 102. The spring piece 108 between the first two-way memory alloy 105 and the semiconductor refrigeration plate 102 and the liquid crystal panel 200 will not push the corresponding connecting plate 107 to contact the second pin 103.

[0061] As the liquid crystal panel 200 heats up, the ambient temperature around the first two-way memory alloy 105 and the second two-way memory alloy 106 continues to rise. When the temperature reaches As1, which exceeds the maximum operating temperature of the liquid crystal panel 200, the first two-way memory alloy 105 begins to actively bend. The bent first two-way memory alloy 105 drives the semiconductor cooling plate 102 toward the liquid crystal panel 200 through the corresponding heat conducting plate 205. The spring 108 between the semiconductor cooling plate 102 and the liquid crystal panel 200 is bent. The bent spring 108 contacts the connecting plate 107 on the corresponding electric plate 104 and pushes the connecting plate 107 toward the corresponding second pin 103. The semiconductor cooling plate 102 switches from the second node to the third node.

[0062] When the spring 108 between the semiconductor cooler 102 and the liquid crystal panel 200 pushes the corresponding connecting plate 107 into contact with the second pin 103 corresponding to the connecting plate 107, the semiconductor cooler 102 switches from the second node to the third node. At this point, the cooling and heat dissipation surfaces of the semiconductor cooler 102 swap positions, with the heat dissipation surface facing the circuit board 100 and the cooling surface facing the liquid crystal panel 200, thereby cooling the liquid crystal panel 200.

[0063] An embodiment of the present invention further provides a production process for a liquid crystal display screen with local strong support, comprising the following steps:

[0064] S1 , sequentially mounting a TOP layer 211 , an ITO layer 210 , a glass 209 and a polarizer 208 on one side of each PI layer 212 .

[0065] S2, epoxy resin glue and hard powder are mixed, screen-printed on one of the PI layers 212 and cured at a curing temperature of 170° C. After mixing and curing, the epoxy resin glue and hard powder form a frame sealing layer 201.

[0066] S3, mixing UV glue and hard powder, screen printing and curing on another PI layer 212, pre-curing at 70°C during curing; then UV curing at 2500-3500mJ, finally forming a UV composite material 202.

[0067] In step S4, isopropyl alcohol, water, and space powder 203 are mixed in a mass ratio of 90:10:0.5 and sprayed onto one of the PI layers 212. The two PI layers 212 are then bonded together and cured. Finally, the resulting sealed space is filled with liquid crystal material 204. No further curing is required after spraying the space powder 203; the isopropyl alcohol and water evaporate after atomization. Finally, the assembled LCD panel 200 is mounted on the circuit board 100 via the first pins 101.

[0068] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The above-described embodiments merely illustrate several embodiments of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A liquid crystal display screen with strong support at a local position, characterized in that: include: A circuit board, a liquid crystal panel, and a heat conduction mechanism, wherein the liquid crystal panel is electrically connected to the circuit board via a first pin, and the liquid crystal panel and the circuit board are arranged along a first direction with a distance therebetween; The heat conduction mechanism includes a semiconductor refrigeration plate that slides along a first direction and a driving member that controls the movement of the semiconductor refrigeration plate according to the ambient temperature. The semiconductor refrigeration plate is slidably arranged between the liquid crystal panel and the circuit board, and the cooling surface and the heat dissipation surface of the semiconductor refrigeration plate are arranged along the first direction. The semiconductor refrigeration chip has a first node, a second node, and a third node. When the ambient temperature is lower than the normal operating temperature range of the liquid crystal panel, the semiconductor refrigeration chip is at the first node, the semiconductor refrigeration chip starts to work, and its cooling surface faces the circuit board; when the ambient temperature is within the normal operating temperature range of the liquid crystal panel, the semiconductor refrigeration chip is at the second node, and the semiconductor refrigeration chip stops working; when the ambient temperature exceeds the normal operating temperature range of the liquid crystal panel, the semiconductor refrigeration chip is at the third node, the semiconductor refrigeration chip starts to work, and its cooling surface faces the liquid crystal panel; The driving member includes a first two-way memory alloy and a second two-way memory alloy, the first two-way memory alloy is located between the semiconductor refrigeration chip and the liquid crystal panel and is connected to the semiconductor refrigeration chip and the liquid crystal panel, and the first two-way memory alloy is bent along a second direction, and the second direction is perpendicular to the first direction. The second two-way memory alloy is located between the semiconductor refrigeration plate and the circuit board and is connected to the semiconductor refrigeration plate and the circuit board. The bending direction of the second two-way memory alloy is consistent with that of the first two-way memory alloy. Both the first two-way memory alloy and the second two-way memory alloy can bend or elongate when the temperature changes, and under the same temperature change, the first two-way memory alloy bends and the second two-way memory alloy elongates, or the first two-way memory alloy elongates and the second two-way memory alloy bends.

2. The liquid crystal display screen with local strong support according to claim 1, characterized in that: Two groups of electrodes connected to the power supply are provided on the circuit board, and each group of electrodes includes two second pins respectively connected to the positive and negative poles of the power supply; two electric plates are provided on the semiconductor refrigeration plate, and the two electric plates are the poles of the semiconductor refrigeration plate. Each electric plate is respectively slidably connected to the two second pins in the same group of electrodes, and when the two electric plates are slidably connected to the corresponding second pins, the two electric plates are connected to the positive and negative poles of the power supply through the corresponding second pins.

3. The liquid crystal display screen with local strong support according to claim 1, characterized in that: The heat conduction mechanism also includes four heat conduction plates, two of which are respectively connected to the two sides of the semiconductor refrigeration plate in the first direction, and the other two heat conduction plates are respectively connected to the circuit board and the side of the liquid crystal panel close to the semiconductor refrigeration plate; the first two-way memory alloy is connected to the semiconductor refrigeration plate and the liquid crystal panel through the heat conduction plates on the side of the liquid crystal panel and the semiconductor refrigeration plate close to the liquid crystal panel, and the second two-way memory alloy is connected to the semiconductor refrigeration plate and the circuit board through the heat conduction plates on the side of the circuit board and the semiconductor refrigeration plate close to the circuit board.

4. The liquid crystal display screen with local strong support according to claim 3, characterized in that: Fins are provided on the surfaces of the two heat conducting plates located on the same side of the semiconductor refrigeration plate that are close to each other.

5. The liquid crystal display screen with local strong support according to claim 3, characterized in that: Thermal grease is provided between the liquid crystal panel, semiconductor refrigeration sheet, circuit board and corresponding heat conducting plates.

6. The liquid crystal display screen with local strong support according to claim 1, characterized in that: The liquid crystal panel includes a polarizer, glass, an ITO layer, a TOP layer, a PI layer, a frame sealing layer, a PI layer, a TOP layer, an ITO layer, glass and a polarizer distributed in sequence along a first direction. A sealed space is formed between the two PI layers and the frame sealing layer, and the sealed space is filled with space powder, a UV composite material and a liquid crystal material; the UV composite material is formed of UV glue and hard powder, the frame sealing layer is formed of epoxy resin glue and hard powder in a mass ratio of 100: (0.2~2), and in the UV composite material, the mass ratio of UV glue and hard powder is 100: (0.2~2).

7. The liquid crystal display screen with local strong support according to claim 6, characterized in that: The thickness of the frame sealing layer is 4 μm, that is, the thickness of the formed sealing space is 3.8 μm to 4 μm.

8. The liquid crystal display screen with local strong support according to claim 6, characterized in that: The space powder is composed of plastic balls, and the size of a single plastic ball is 3.5μm to 4μm.

9. A production process for a liquid crystal display screen with strong local support, used for a liquid crystal display screen with strong local support according to any one of claims 6 to 8, characterized in that: The following steps are involved: S1, sequentially install the TOP layer, ITO layer, glass and polarizer on one side of each PI layer; S2, mixing epoxy resin glue with hard powder, screen printing and curing on one of the PI layers to form a frame sealing layer; S3, mixing UV glue with hard powder, screen printing and curing on another PI layer to form a UV composite material; S4, mix isopropyl alcohol, water, and space powder in a mass ratio of 90: Mix them in a ratio of 10:0.5 and spray them on one of the PI layers. Then, bond the two PI layers together and solidify them. Finally, fill the sealed space formed with liquid crystal material.

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