Directional coupler

Abstract

The invention discloses a directional coupler, which relates to the technical field of satellite navigation antennas and comprises a plurality of coupling channels, a power distribution network, a shielding structure and an edge intelligent processing unit. The multiple paths of coupling channels are separated through metal isolation structures; the power distribution network is composed of multiple stages of power distributors; the shielding structure wraps the multiple coupling channels and the power distribution network. A temperature-sensitive capacitor is arranged on the outer side of the multi-path coupling channel; a distributed heat dissipation substrate is arranged on the outer side of the power distribution network; an EBG shielding cover is arranged on the outer side of the shielding structure; the EBG-based shielding cover and the distributed heat dissipation substrate form a graded electromagnetic suppression system; dynamic linkage is formed based on a temperature-sensitive capacitor and multiple coupling channels, capacitance parameters are adjusted in real time to compensate temperature drift, and phase consistency is optimized. And the edge intelligent processing unit performs physical relationship modeling according to data acquired by a multi-physical field sensing network obtained by integrating multiple paths of coupling channels, a power distribution network and a shielding structure.

Description

Technical Field

[0001] The present invention relates to the technical field of satellite navigation antennas, and in particular to a directional coupler. Background Art

[0002] Directional couplers have a wide range of applications. In wireless communication systems, they are used for signal distribution, power monitoring, and antenna feed networks. In test and measurement, directional couplers are used to extract signals from transmission paths to monitor power levels or analyze signals without affecting overall system performance. In the military and aerospace fields, directional couplers are essential components in radar and satellite communication systems for signal routing and power control.

[0003] Traditional directional couplers use a stripline structure. Stripline high-directional couplers are three-layer structures, with a dielectric layer in the middle, ground layers on either side, and conductive strips in the dielectric layer for signal transmission. This structure uses the same uniform dielectric layer above and below, resulting in excellent directivity. However, because the transmission line is buried in the dielectric layer, parameters such as the amplitude and phase of the stripline coupler cannot be adjusted. When combining multiple coupler channels into a single channel, the amplitude and phase of each channel cannot be consistent. Furthermore, stripline processing costs are higher than those of microstrip lines. Microstrip directional couplers utilize two or more adjacent conductive paths on the same substrate to achieve coupling. Because the microstrip line is surrounded by a dielectric plate below and air above, the uneven dielectric layer above and below the coupler causes differences in the phase velocities of the odd and even modes, resulting in poor directivity. To address these shortcomings of microstrip directional couplers, meet practical engineering requirements, and reduce costs, a highly directional coupler with a microstrip structure has been designed. This microstrip high directional coupler adopts a two-stage coupling structure. By utilizing the convex and concave structures of the microstrip line on the basis of the microstrip high directional coupler, it effectively solves the problem of the microstrip high directional coupler changing its odd and even mode phase velocity due to the uneven upper and lower media, forming a highly directional microstrip line coupler. Summary of the Invention

[0004] The present application solves the problems of non-adjustable structure and poor multi-channel consistency in the prior art by providing a directional coupler, thereby achieving a technical effect of low cost, high directivity, and support for multi-channel amplitude and phase adjustment.

[0005] A directional coupler, comprising: Multi-way coupling channels, a power distribution network, a shielding structure, and an edge intelligent processing unit; the multi-way coupling channels are separated by a metal isolation structure; the power distribution network is composed of a multi-stage power divider; the shielding structure covers the multi-way coupling channels and the power distribution network; A temperature-sensitive capacitor is set outside the multi-channel coupling channel; a distributed heat dissipation substrate is set outside the power distribution network; and an EBG shielding cover is set outside the shielding structure; A hierarchical electromagnetic suppression system is constructed based on an EBG shield and a distributed heat dissipation substrate. A dynamic linkage is established between temperature-sensitive capacitors and multiple coupling channels, allowing for real-time adjustment of capacitor parameters to compensate for temperature drift and optimize phase consistency. The edge intelligent processing unit performs physical relationship modeling by integrating data obtained from a multi-physical field sensing network arranged in a multi-channel coupling channel, a power distribution network, and a shielding structure.

[0006] Furthermore, each channel in the multi-channel coupling channel comprises a microstrip high-directional coupling unit, and the coupling unit is composed of an input port, an output port, a coupling port, an isolation port, a 50-ohm resistor 105 and a two-stage coupler; Each distributor in the power distribution network is connected by an isolation resistor to combine the coupled signals of multiple coupling channels into one output; The shielding structure is used to suppress external interference and crosstalk between channels.

[0007] Furthermore, the temperature-sensitive capacitor is an external temperature-sensitive capacitor connected to the combiner port, and the output phase of the coupler is automatically adjusted through a feedback circuit to compensate for the phase deviation caused by temperature drift; The combining port is the output port after the signals are combined; The distributed heat dissipation substrate is a high thermal conductivity insulation gasket attached to the bottom of the PCB of the power distributor, and an external aluminum heat dissipation substrate is connected to conduct the resistance heat to the external radiator through the gasket; The EBG shield is nested outside the metal cavity of the coupler, and its unit period corresponds to the 5.3-5.5 GHz suppression frequency band, which is used to suppress electromagnetic interference outside the cavity and radiation leakage between internal channels.

[0008] Furthermore, in the hierarchical electromagnetic suppression system, the periodic unit size of the EBG shield and the spacing between the multi-channel coupling channels meet The matching relationship is such that when the filling density of the absorbing material is reduced to [30%, 50%], the mutual coupling between channels is still maintained at no more than -40dB.

[0009] Furthermore, the temperature-sensitive capacitor and the multi-channel coupling channel form a dynamic linkage, which means that the ambient temperature data is collected in real time by the temperature sensor in the temperature-sensitive capacitor array, and the temperature parameters are input into the closed-loop feedback control system to dynamically adjust the capacitance of the varactor diode of each coupling channel to offset the dielectric constant offset caused by temperature changes and maintain the phase consistency of the multi-channel coupling channels.

[0010] Furthermore, the two-stage coupler includes a first-stage coupling length branch 101 and a second-stage coupling length branch 104. The input port and the output port of the two-stage coupler are both connected in series with an adjustable capacitor and in parallel with an adjustable inductor. By adjusting the values ​​of the capacitor and the inductor to change the impedance of the coupler port, the phase velocity of the odd and even modes is indirectly adjusted to compensate for the phase difference caused by the inhomogeneity of the medium. An external adjustable matching network is set up to perform odd-mode and even-mode phase velocity-adjustable phase compensation on the signals transmitted between the input and output ports of the two-stage coupler of the coupling unit. By adjusting the component parameters of the series adjustable capacitor and the parallel adjustable inductor to change the equivalent dielectric constant of the transmission line, compensation data of the phase consistency of the multi-channel coupling channel is obtained.

[0011] Furthermore, the adjustable capacitor and adjustable inductor also include: decoupling control of the adjustable capacitor and adjustable inductor, establishing an independent mapping relationship between capacitance, inductance, amplitude and phase, and driving the adjustable capacitor actuator to independently adjust each component by solving the target capacitance and inductance in real time.

[0012] Furthermore, the external adjustable matching network further includes: The capacitors and inductors are encapsulated in independent low-temperature co-fired ceramic modules, connected to the coupler microstrip lines via gold wire bonding, and a micro heat sink is integrated at the bottom of the module. Copper pillars are embedded inside the low-temperature co-fired ceramic module for thermal conductivity, increasing the heat dissipation efficiency to 5W / cm². The low-temperature co-fired ceramic module is a high-performance electronic component based on a multilayer ceramic process.

[0013] Furthermore, the multi-physics field sensor network integration includes: arranging sensors in the temperature field, vibration field, humidity field and electromagnetic field to acquire data; The physical relationship modeling includes: establishing the interaction relationship between temperature field, vibration field, humidity field and electromagnetic field, and dynamically mapping the phase consistency of multi-channel coupling channels, the signal loss of the power distribution network and the electromagnetic suppression efficiency of the EBG shield.

[0014] Furthermore, the edge intelligent processing unit also includes: A dynamic modeling and analysis module calculates the phase compensation and shielding efficiency correction value of each coupling channel in real time based on the physical relationship modeling; adjusts the transmission line equivalent dielectric constant offset based on the phase compensation; and dynamically adjusts the EBG unit period and absorbing material filling density based on the shielding efficiency correction value to compensate for the bandgap frequency drift caused by vibration deformation; The cross-field collaborative control module synchronously applies the compensation parameters output by the dynamic modeling and analysis module to the amplitude regulators of the multi-channel coupling channels, the impedance matching nodes of the power distribution network, and the electromagnetic suppression parameters of the shielding structure; and compensates for the signal attenuation caused by dielectric loss based on the electromagnetic suppression parameters.

[0015] One or more technical solutions provided in this application have at least the following technical effects or advantages: By adopting a directional coupler that integrates multiple temperature-sensitive compensation coupling channels, EBG hierarchical shielding structure and multi-physical field intelligent collaborative control system, and through dynamic phase correction, hierarchical electromagnetic suppression and edge computing modeling, the multi-channel phase consistency, temperature stability and anti-interference capability are significantly improved, making it suitable for the field of high-precision satellite navigation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a flow chart of a directional coupler according to an embodiment of the present invention; Figure 2 PCB structure diagram of the microstrip highly directional coupler of channel 1 and channel 2 in an embodiment of the present invention; Figure 3 PCB structure diagram of the microstrip highly directional coupler of channel 3 and channel 4 in an embodiment of the present invention; Figure 4 PCB structure diagram of the microstrip highly directional coupler of channel 5 and channel 6 in an embodiment of the present invention; Figure 5 PCB structure diagram of the microstrip highly directional coupler of channel 7 and channel 8 in an embodiment of the present invention; Figure 6 is a structural diagram of a directional coupler according to an embodiment of the present invention; Figure 7 Graph showing return loss of a combined port of a power divider according to an embodiment of the present invention; Figure 8 A multi-channel coupling diagram in an embodiment of the present invention; Figure 9 This is a multi-channel isolation diagram in an embodiment of the present invention; Figure 10 This is a multi-channel phase consistency diagram in an embodiment of the present invention; Reference numerals: 101: first-stage coupling length branch; 102: first-stage coupling; 103: second-stage coupling; 104: second-stage coupling length branch; 105: 50-ohm resistor; 201: first power divider; 202: second power divider; 203: third power divider; 204: fourth power divider; 205: fifth power divider; 206: sixth power divider; 207: seventh power divider. DETAILED DESCRIPTION

[0017] To facilitate understanding of the present invention, the present application will be described more comprehensively below with reference to the relevant drawings; the drawings show preferred embodiments of the present invention, but the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosed content of the present invention.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains; the terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0019] Example 1: Figure 2 、 3 , 4, and 5, a directional coupler comprising: It includes a multi-way coupling channel, a power distribution network, a shielding structure and an edge intelligent processing unit; the multi-way coupling channels are separated by a metal isolation structure; the power distribution network is composed of a multi-stage power divider; the shielding structure covers the multi-way coupling channel and the power distribution network; Each channel in the multi-channel coupling channel comprises a microstrip high-directional coupling unit, and the coupling unit is composed of an input port, an output port, a coupling port, an isolation port, a 50-ohm resistor 105 and a two-stage coupler; Specifically, the multi-way coupling channel includes channel 1 to channel 8; the power divider consists of a first power divider 201, a second power divider 202, a third power divider 203, a fourth power divider 204, a fifth power divider 205, a sixth power divider 206, and a seventh power divider 207; all of which use 50-ohm resistors as isolation resistors; the multi-way coupling channels are separated by a metal isolation structure, and each channel includes a microstrip high-directional coupling unit, which consists of an input port (port 1), an output port (port 2), a coupling port (port 3), an isolation port (port 4), a 50-ohm resistor 105, a first-stage coupling 102, and a second-stage coupling 103; the directional coupler uses a microstrip line structure.

[0020] When the input signal enters port 1, more than 90% of the signal will be output to port 2, and less than 10% of the signal will be diverted to port 3 through the electromagnetic coupling mechanism. Port 4 has no signal or is very weak. Ideally, it is completely isolated; unidirectional coupling of the signal is achieved; the microstrip high-directional coupling unit can adjust the amplitude of the high-directional coupler by adjusting the length of the two-stage coupler.

[0021] Specifically, after the input signal enters port 1, part of the energy is transferred to the auxiliary line through the electromagnetic coupling between the main transmission line and the auxiliary transmission line (first-stage coupling 102). The remaining signal of the main transmission line continues to transmit, and part of the energy is transferred to the auxiliary line again through electromagnetic coupling (second-stage coupling 103). The length of the transmission line between the two stages of coupling is half a wavelength ( ), ensuring that the two coupled energies are in opposite phases at port 4, achieving destructive interference.

[0022] The spacing between the two coupling stages is half a wavelength. During the transmission of the signal from the first coupling stage 102 to the second coupling stage 103, the phase difference between the first coupling stage 102 and the second coupling stage 103 in the auxiliary line is 180°. When the energy of the two paths meets at port 4, the amplitudes are equal and the phases are opposite, resulting in complete destructive interference. Ideally, no energy is output from port 4: , in, is the total electric field of the isolated port, which represents the superposition result of the two signals here. ,but ; is the absolute phase delay of the first-stage coupling 102 when transmitting to port 4; is a complex exponential form, representing the phase rotation accumulated during transmission of the signal of the first-stage coupling 102; The fixed phase difference between the first-stage coupling and the second-stage coupling 103 ensures that the two signals are in anti-phase at port 4; by adjusting the coupling strength ( ) and spacing to make port 4 isolation > 56dB.

[0023] When the two-stage coupling reaches port 3, due to the symmetry of the transmission path, the phases are the same, constructive interference is achieved, and the coupling signal strength is maximized: , in, is the total electric field at port 3, which represents the synthesis of the two coupled signals. Its amplitude and phase determine the output power of port 3. is the common phase delay of the two-stage coupled signals at port 3, indicating the absolute phase of the two paths; is the phase delay accumulated by the signal in the transmission path; is the electric field amplitude transmitted to port 3 through the first coupling; is the electric field amplitude transmitted to port 3 through the second coupling; if the two-level coupling strength is equal ( ), the energy of port 3 is twice that of single-stage coupling, and the coupling degree is improved by 3dB.

[0024] The distributors in the power distribution network are connected with each other by using isolation resistors, so as to combine the coupling signals of multiple coupling channels into one output.

[0025] Specifically, each channel coupling port is connected to one channel using a one-to-two power splitter (201, 202, 203, 204, 205, 206, 207), and the coupled ports after the combined channels are connected using an RF connector; the coupler input port (port 1) is connected using a contact RF connector (port 1); the coupler output port (port 2) is connected to the antenna port; the coupler coupling port (port 3) is connected to the power splitter; and the coupler isolation port (port 4) is connected to a 50-ohm resistor 105.

[0026] The directional coupler is simulated by Ansys standard 3D electromagnetic simulation tools, such as Figure 7 As shown in FIG, it is the return loss of the combined port of the power divider (203) after the multi-channel coupling channels are combined. In the entire frequency band, the return loss in the 5.3GHz-5.5GHz frequency band is less than -20dB; as shown in FIG. Figure 8 As shown, the coupling degree of channel 1 to channel 8 coupled to the combining port of the power divider (204) is 25dB. After passing through the three-stage one-to-four power divider to the combining port, there is a 9dB attenuation. After the coupling port is combined with the power divider, the attenuation is 34.5dB±0.25dB.

[0027] Keeping a half-wavelength distance gap between the two-stage coupling structure increases the isolation at the isolation port; Figure 6 As shown, a branch (101) of a certain length is added between the two-stage couplers. The phase difference of each channel can be adjusted by the distance (101) between the two-stage couplers in each coupling channel, so that the phase consistency of each channel is maintained.

[0028] The shielding structure is used to suppress external interference and crosstalk between channels.

[0029] Specifically, in order to avoid the influence of the external electromagnetic environment on the coupler, a metal shielding cover is added above the metal cavity to completely isolate the multi-channel coupler from the outside world. Figure 7 As shown in Figure 2, the return loss of the combined coupler is below 25dB; Figure 8 As shown in Figure 2, the coupling degree of each coupling channel is 34.5dB±0.25dB, and the amplitude difference of each channel after being combined by the power divider is within 0.3dB; Figure 9 As shown, the isolation of each coupling channel is above 56dB, and the directivity is greater than 20dB; Figure 10 As shown in FIG, the phase difference of each channel after being combined by the power divider is within 3°.

[0030] For example, without the metal isolation structure, the multi-channel phase difference reached ±5°; with the structure of Example 1, the measured phase difference was ≤±3. The microstrip structure reduces processing costs by 62% compared to traditional stripline, reducing the production cost per unit from 85% to 32%.

[0031] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages: The present application designs a multi-channel microstrip line structure directional coupler. Each channel of the directional coupler adjusts the phase through a two-stage coupling structure to adjust the amplitude and phase inconsistency after processing. The microstrip line structure is adopted to reduce the manufacturing cost. The channels are isolated by isolation walls to effectively prevent signal crosstalk between the channels. Within the passband of 5.3GHz-5.5GHz, the directivity of each channel is greater than 20dB. The present application provides a low-cost, high-directivity microstrip line structure directional coupler that supports multi-channel amplitude and phase adjustment, solving the problems of traditional structures that are non-adjustable and have poor multi-channel consistency.

[0032] Example 2: In Example 1, a low-cost, highly directive, microstrip line structure directional coupler that supports multi-channel amplitude and phase adjustment is designed to solve the problems of the traditional structure being non-adjustable and having poor multi-channel consistency. However, the use of metal partition walls and shielding covers may cause leakage at high frequencies, resulting in insufficient isolation; the resistance of the power divider may have the risk of overheating, affecting reliability; this example further improves Example 1.

[0033] The temperature-sensitive capacitor is arranged outside the multi-channel coupling channel; the distributed heat dissipation substrate is arranged outside the power distribution network; and the EBG shielding cover is arranged outside the shielding structure; The temperature-sensitive capacitor is an external temperature-sensitive capacitor connected to the combining port, which automatically adjusts the output phase of the coupler through the feedback circuit to compensate for the phase deviation caused by temperature drift; the combining port is the output port after the signal is combined; Specifically, the capacitor array is connected to the combiner port via an SMA (radio frequency coaxial connector) connector. An FPGA (a semiconductor device that can reconfigure hardware logic through programming) is embedded in the side wall of the cavity and independently powered. The temperature-sensitive element uses an array of NTC (negative temperature coefficient) thermistors (accuracy of ±0.5°C) and MEMS (micro-electromechanical systems) varactor diodes (capacitance of 0.5-2pF). The FPGA collects temperature data in real time and adjusts the capacitance to compensate for phase temperature drift. The compensation model is: , in, is the capacitance change that needs to be compensated; is the initial capacitance value; is the temperature coefficient, =50ppm / ℃; T is the current temperature, The reference temperature is typically 25°C; this optimizes the phase consistency from ±3° to ±1.8° and reduces the temperature drift coefficient by 40%.

[0034] The distributed heat dissipation substrate is a high thermal conductivity insulation gasket attached to the bottom of the PCB of the power distributor, and an external aluminum heat dissipation substrate is connected to conduct the resistance heat to the external radiator through the gasket; A high-thermal-conductivity insulating gasket is attached to the back of the power divider PCB (printed circuit board), and an external aluminum heat sink is fixed to the cavity bottom plate with bolts. During heat dissipation, heat is transferred to the high-thermal-conductivity insulating gasket, the heat sink substrate, and finally to the external radiator through resistors. The external heat sink increases the power capacity from 5W to 15W, and the temperature rise ΔT in the resistor area is ≤30°C.

[0035] The EBG shield is a detachable EBG structure shield nested outside the metal cavity, and its unit period corresponds to the 5.3-5.5 GHz suppression frequency band, which is used to suppress electromagnetic interference outside the cavity and radiation leakage between internal channels; The system utilizes low-cost FR4 (a common substrate type for electronic circuit boards) (1.6mm thick) with mushroom-shaped EBG cells etched onto the surface as an EBG (electromagnetic bandgap) shield. This shield is connected to the original metal cavity via snap-on conductive springs, creating a double-layer shielding structure. The EBG cells generate a bandgap effect (stopband attenuation ≥ 20dB) in the target frequency band, suppressing surface wave propagation. A flexible ferrite absorbing layer (0.2mm thick) is applied to the back of the FR4 substrate to absorb near-field radiation. This improves isolation from 56dB to 62dB, while maintaining insertion loss fluctuations of ≤0.1dB.

[0036] A hierarchical electromagnetic suppression system is constructed based on an EBG shield and a distributed heat dissipation substrate. A dynamic linkage is established between temperature-sensitive capacitors and multiple coupling channels, allowing for real-time adjustment of capacitor parameters to compensate for temperature drift and optimize phase consistency. The hierarchical electromagnetic suppression system, wherein the periodic unit size of the EBG shield and the spacing between the multi-channel coupling channels meet The matching relationship is such that when the filling density of the absorbing material is reduced to [30%, 50%], the mutual coupling between channels is still maintained at no more than -40dB; Specifically, the periodic unit size of the EBG shield and the spacing between the multi-channel coupling channels must meet the following requirements: , Where d is the periodic unit size, The center wavelength of the working frequency band, such as 5.4GHz corresponding wavelength =56.6mm, is the relative dielectric constant of the substrate material, such as FR4 =4.3; thereby ensuring that the band gap of the EBG structure is precisely matched with the crosstalk frequency band between channels, and absorbing or reflecting interfering electromagnetic waves through the resonance effect of the periodic structure.

[0037] The absorbing material makes up for the high frequency stray interference not covered by EBG. If the channel spacing s=12mm, the substrate =4.3, then the EBG periodic unit size is: , At this time, the filling density of the absorbing material can be reduced to 35%, and the mutual coupling is still ≤-40dB.

[0038] The use of an EBG shield and 30% absorbing material can suppress mutual coupling to -42dB, and the weight of the absorbing material is reduced from 120g to 50g, achieving lightweight, high-suppression, and low-cost graded electromagnetic shielding.

[0039] The temperature-sensitive capacitors and the multiple coupling channels form a dynamic linkage, which means that the ambient temperature data is collected in real time by the temperature sensors in the temperature-sensitive capacitor array, and the temperature parameters are input into the closed-loop feedback control system to dynamically adjust the capacitance of the varactor diodes of each coupling channel to offset the dielectric constant offset caused by temperature changes and maintain the phase consistency of the multiple coupling channels.

[0040] Specifically, the temperature-sensitive capacitor is used as a sensor to read the capacitance or temperature value in real time through an analog-to-digital converter with a sampling frequency of ≥10Hz. Based on the collected capacitance or temperature value, a temperature-phase mapping model is established: , in, is the phase change, is the temperature change, k is the phase shift caused by each degree Celsius temperature change, which is measured to be +0.2°C; compensation requires reverse adjustment of the coupler electrical length to offset the temperature drift effect. , is the phase change compensation amount.

[0041] The relationship between the phase change compensation amount and the electrical length is: , in, is the change in equivalent electrical length, c is the speed of light in vacuum, and f is the operating frequency; when =0.1mm / pF C, f = 28 GHz, C is the capacitance adjustment value, and the corresponding phase compensation value can be obtained by substituting it into .

[0042] Fast continuous adjustment (response time: <100ns) uses a varactor diode; high-precision discrete adjustment (adjustment step: 0.1pF) uses a MOS (a type of semiconductor material) switch to switch the capacitor combination; a PID controller (feedback control algorithm) is used to adjust the capacitor value based on the real-time phase error to ensure a steady-state error of <0.1°.

[0043] For example, the compensation model verified the temperature drift suppression effect in a temperature variation test from -40°C to +85°C. The phase offset was optimized from ±3° to ±1.8°, and the temperature drift coefficient was reduced by 43%. When operating continuously at 15W, the temperature rise in the power divider resistance area dropped from 52°C to 28°C. The vector network analyzer test of the EBG shield increased the isolation at the 5.4GHz frequency point from 56dB to 62dB, and the insertion loss fluctuation was ≤0.1dB.

[0044] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages: This application uses an external EBG shield to simplify production complexity and reduce precision machining costs; the absorbing material has a low filling density, further reducing material costs; the heat dissipation substrate does not require an active temperature control system, reducing hardware costs; the graded electromagnetic suppression system effectively suppresses mutual coupling and external interference between channels, maintaining high directivity; the temperature-sensitive compensation network reduces the impact of temperature drift on phase consistency, indirectly improving directivity.

[0045] Example 3: Example 2 achieves performance improvement in a static environment through external hardware, but cannot cope with dynamic changes; this example further improves Example 2.

[0046] The two-stage coupler includes a first-stage coupling length branch 101 and a second-stage coupling length branch 104. The input port and output port of the two-stage coupler are both connected in series with an adjustable capacitor and in parallel with an adjustable inductor. The coupler port impedance is changed by adjusting the values ​​of the capacitor and the inductor, and the odd-mode and even-mode phase velocities are indirectly adjusted to compensate for the phase difference caused by dielectric inhomogeneity. An external adjustable matching network is provided to perform odd-mode and even-mode phase velocity-adjustable phase compensation on the signals transmitted between the input port and the output port of the two-stage coupler of the coupling unit. The transmission line equivalent dielectric constant is changed by adjusting the component parameters of the series adjustable capacitor and the parallel adjustable inductor, thereby obtaining compensation data for the phase consistency of multiple coupling channels.

[0047] Specifically, an adjustable capacitor is connected in series with the input / output end of the original two-stage coupler, and an adjustable inductor is connected in parallel. By adjusting the capacitor / inductor value to change the coupler port impedance, the odd and even mode phase velocities are indirectly adjusted to compensate for the phase difference caused by medium inhomogeneity. The formula is: , in, is the equivalent dielectric constant, which is affected by the series capacitance (C) and parallel inductance (L). is the change in the electrical length of the coupler.

[0048] The adjustable capacitor and adjustable inductor also include: performing decoupling control based on the adjustable capacitor and adjustable inductor, establishing an independent mapping relationship between capacitance, inductance, amplitude, and phase, and driving the adjustable capacitor actuator to independently adjust each component by solving the target capacitance and inductance in real time.

[0049] Specifically, in a directional coupler, the capacitor and By adjusting the impedance matching of the input / output terminals, the signal coupling efficiency is affected. For example, increasing and This will reduce the series impedance, allowing more signal energy to couple from port 1 to port 3, thereby improving .and and The parallel inductive reactance of shunts the high-frequency signal energy and suppresses the amplitude; an amplitude adjustment model is established: , in, is the transmission coefficient amplitude from coupler port 3 to port 1, reflecting the energy transfer efficiency of the signal from the input to the coupled port; and For the adjustable capacitor connected in series with the input and output ports, increasing the capacitance will enhance the electric field coupling, thereby improving the magnitude; and It is an adjustable inductor connected in parallel on both sides of the transmission line. Increasing the inductance will increase the inductive reactance, inhibit the transmission of high-frequency signals, and reduce ; and is the coefficient determined by the characteristic impedance of the transmission line and the operating frequency, The value range is [ , ], The value range is [01, 40].

[0050] Phase delay is related to the ratio of inductive reactance to capacitive reactance. By adjusting the difference between L and C, the phase velocity of odd and even modes can be controlled, thereby adjusting ;like and , emotional dominance leads to is negative; if and , capacitive dominance leads to Is positive; establish a phase adjustment model: , in, The difference between the inductors located in the two arms of the coupler introduces an inductive phase shift; is the capacitance connected in parallel to the coupling arm, and the difference introduces a capacitive phase shift; To convert the ratio of the inductance difference to the capacitance difference into a phase angle, reflecting the orthogonal modulation relationship.

[0051] The capacitors and inductors are encapsulated in independent low-temperature co-fired ceramic modules, connected to the coupler microstrip lines via gold wire bonding, and a micro heat sink is integrated at the bottom of the module. Copper pillars are embedded inside the low-temperature co-fired ceramic module for thermal conductivity, increasing the heat dissipation efficiency to 5W / cm². The low-temperature co-fired ceramic module is a high-performance electronic component based on multilayer ceramic technology.

[0052] Specifically, the low-temperature co-fired ceramic module independently packages the adjustable capacitors / inductors in a multi-layer ceramic structure, achieving electrical isolation through internally embedded copper pillars and vertical interconnects. This design reduces parasitic capacitance / inductance to, for example, less than 0.05pF / 0.1nH, making the adjustment of the capacitors and inductors independent of each other and avoiding electromagnetic coupling between components in traditional PCB layouts. A micro heat sink and internal copper pillar thermal conductive structure integrated at the bottom of the module ensure that the junction temperature of the adjustable capacitor actuator remains stable below 85°C when the decoupling control algorithm frequently adjusts the components, avoiding parameter drift caused by thermal runaway. The gold wire bonding and coupler microstrip line connection reduces path impedance by 30% compared to traditional solder joint connections, shortening signal transmission delay to 0.3ps.

[0053] For example, by using vector network analyzer frequency sweep data, adjustable capacitors and inductors can achieve amplitude adjustment of ±2dB and phase compensation of ±15°; high-speed oscilloscopes capture dynamic compensation response time of <100ns, and real-time correction of 0.5° phase jitter caused by vibration.

[0054] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages: The external adjustable matching network achieves parameter adjustment through adjustable capacitors / inductors, reducing customized design costs; the decoupling control algorithm reduces manual debugging costs, reduces production complexity through automated optimization, and eliminates mutual coupling effects in amplitude / phase adjustment in real time to ensure high directivity; the adjustable capacitor / inductor array supports dynamic adjustment of the amplitude and phase of each channel, and combines with algorithms to achieve independent control of multiple channels.

[0055] Example 4: Example 3 only considers a single factor, such as temperature. However, in real applications, changes in multiple physical fields can simultaneously affect system performance. For example, temperature changes can affect the dielectric constant, vibration can cause mechanical deformation, and humidity can affect loss. This example further improves Example 3.

[0056] The multi-physics field sensor network integration includes: arranging sensors in temperature field, vibration field, humidity field and electromagnetic field to obtain data; Specifically, the temperature field uses a miniature thin-film platinum resistor mounted on the surface of the dielectric plate; the vibration field uses a MEMS three-axis accelerometer; the humidity field uses a capacitive humidity sensor; the electromagnetic field uses a miniature directional coupler; the temperature sensors are distributed at the coupling lines, resistors, and power dividers, and the accelerometers are installed at the four corners and center of the cavity to capture the six-degree-of-freedom vibration mode.

[0057] The physical relationship modeling includes: establishing the interaction relationship between temperature field, vibration field, humidity field and electromagnetic field, and dynamically mapping the phase consistency of multi-channel coupling channels, the signal loss of the power distribution network and the electromagnetic suppression efficiency of the EBG shield.

[0058] The edge intelligent processing unit performs physical relationship modeling by integrating data obtained from a multi-physical field sensing network arranged in a multi-channel coupling channel, a power distribution network, and a shielding structure.

[0059] Specifically, the sensor network collects data from various physical fields in real time, establishes a cross-domain collaborative model, and dynamically maps it to performance parameters: , in, is the total phase shift, is the phase shift caused by temperature change, The phase shift caused by mechanical deformation due to vibration, Changes in dielectric constant for humidity The phase shift caused by this can be adjusted in real time through temperature-sensitive capacitors and adjustable inductors. To cancel the phase shift: , in, is the compensation capacitor; is the capacitance-phase adjustment coefficient, such as ; By adjusting the compensation capacitor , changing the equivalent electrical length of the transmission line, thereby offsetting the total phase shift.

[0060] The power distribution network loss is affected by the combined effects of temperature and humidity, and the thermal conductivity of the heat dissipation substrate is adjusted by adjusting the heat dissipation substrate. and impedance matching Dynamic network optimization: , in, For heat dissipation efficiency, is the benchmark heat dissipation efficiency, is the temperature correction coefficient, the value range is [0.001, 0.01], is the temperature change, that is, the difference between the current temperature and the reference temperature, is the humidity correction coefficient, with a value range of [-0.005, 0.001], and H is the relative humidity of the current environment. The heat dissipation efficiency is dynamically adjusted according to changes in temperature and humidity to ensure that the temperature rise of resistors in the power distribution network is controllable.

[0061] , in, To match the impedance, is the reference matching impedance, is the loss correction coefficient, ranging from [0.05, 0.2], Signal loss caused by temperature and humidity; by dynamically adjusting impedance , compensate for the signal attenuation caused by increased temperature and humidity, and maintain the transmission efficiency of the power distribution network.

[0062] By dynamically adjusting the density of the absorbing material or the EBG unit period to maintain the electromagnetic suppression efficiency, the formula is obtained: , Where p is the filling density of the absorbing material, is the initial absorbing material filling density, is the bandgap frequency offset, is the bandgap center frequency; when vibration causes the bandgap frequency of the EBG shield to When an offset occurs, the degradation of the electromagnetic suppression performance is compensated by adjusting the filling density p of the absorbing material.

[0063] The edge intelligent processing unit also includes: A dynamic modeling and analysis module calculates the phase compensation and shielding efficiency correction value of each coupling channel in real time based on the physical relationship modeling; adjusts the transmission line equivalent dielectric constant offset based on the phase compensation; and dynamically adjusts the EBG unit period and absorbing material filling density based on the shielding efficiency correction value to compensate for the bandgap frequency drift caused by vibration deformation; The cross-domain collaborative control module applies the compensation parameters output by the dynamic modeling and analysis module to the amplitude regulators of the multi-channel coupling channels, the impedance matching nodes of the power distribution network, and the electromagnetic suppression parameters of the shielding structure. This electromagnetic suppression parameter compensates for signal attenuation caused by dielectric loss. Specifically, the multi-physics data interface module integrates multi-source environmental data from temperature, vibration, humidity, and electromagnetic field sensors to build a real-time monitoring network. The dynamic modeling and analysis module, based on physical relationship modeling, maps environmental changes into phase compensation parameters and electromagnetic shielding efficiency correction values, such as temperature drift phase deviation and vibration-induced deformation compensation; The cross-domain collaborative control module jointly regulates the amplitude regulator of the coupling channel, the impedance matching node of the power distribution network, and the EBG shielding parameters to achieve multi-system adaptive collaborative optimization under environmental disturbances.

[0064] For example, when measuring deformation compensation using a laser interferometer, phase fluctuations were suppressed from ±2° to ±0.5° under 5g / 100Hz vibration conditions. A comparative test using a vector network analyzer showed that at a relative humidity of 90%, the increase in power distribution loss was reduced from 1.2dB to 0.5dB. A power analyzer monitored the system for 72 hours and concluded that the edge intelligent unit reduced system power consumption by 38%, from 8.5W to 5.3W.

[0065] In scenarios where high-power applications are actively enabled, an overload mode is added, allowing the temperature to exceed the normal value for a certain period of time. When the directional coupler is used in instantaneous high-power scenarios, the edge intelligent processing unit activates a three-level overload control strategy, implementing a first-level protection against thermal stress deformation, a second-level protection against local ablation, and a third-level protection against dielectric breakdown, forming a complete failure protection chain: The first-level strategy targets the thermal shock buffering phase (0-30 seconds). The distributed heat dissipation substrate's thermal pads are switched to phase-change material mode, increasing instantaneous heat absorption to 8W / cm². The EBG shield activates the piezoelectric actuator, reducing the unit period by 12% to match the frequency offset. The temperature-sensitive capacitors are switched to negative temperature coefficient mode, increasing the compensation rate to 200ppm / °C, achieving both instantaneous thermal shock buffering and frequency stability maintenance. The secondary strategy targets the power redistribution phase (30-120 seconds). This strategy uses a MOSFET array (a switching network used to implement dynamic power redistribution and redundant path switching) in an adjustable matching network to shift 50% of the power to redundant channels, reducing single-point heat density and achieving balanced heat distribution and optimized power handling. The third-level strategy targets the emergency cooling stage (>120 seconds). Nitrogen microflows are injected into the copper column heat conduction channel of the low-temperature co-fired ceramic module to form forced convection cooling, generating a plasma sheath on the inner surface of the shielding cavity to achieve emergency heat dissipation and arc protection.

[0066] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages: This application uses a multi-physics field sensing network to integrate temperature / pressure / electromagnetic sensors and a low-power edge computing unit to reduce data processing costs; physical relationship modeling corrects the impact of environmental changes on directionality in real time to maintain high directionality; and the adaptive adjustment mechanism suppresses dynamic interference through dynamic shielding and phase compensation.

[0067] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Various modifications and variations are readily apparent to those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A directional coupler, characterized in that: It includes multi-way coupling channels, power distribution network, shielding structure and edge intelligent processing unit; The multi-way coupling channels are separated by metal isolation structures; the power distribution network is composed of a multi-stage power divider; the shielding structure covers the multi-way coupling channels and the power distribution network; A temperature-sensitive capacitor is provided outside the multi-channel coupling channel; a distributed heat dissipation substrate is provided outside the power distribution network; An EBG shielding cover is provided on the outside of the shielding structure; A hierarchical electromagnetic suppression system is constructed based on an EBG shield and a distributed heat dissipation substrate. A dynamic linkage is established between temperature-sensitive capacitors and multiple coupling channels, allowing for real-time adjustment of capacitor parameters to compensate for temperature drift and optimize phase consistency. The edge intelligent processing unit performs physical relationship modeling based on data obtained by a multi-physical field sensing network integrated with multiple coupling channels, a power distribution network and a shielding structure.

2. A directional coupler according to claim 1, characterized in that: Each channel in the multi-channel coupling channel comprises a microstrip high-directional coupling unit, wherein the coupling unit is composed of an input port, an output port, a coupling port, an isolation port, a 50-ohm resistor (105) and a two-stage coupler; Each distributor in the power distribution network is connected by an isolation resistor to combine the coupled signals of multiple coupling channels into one output; The shielding structure is used to suppress external interference and crosstalk between channels.

3. A directional coupler according to claim 1, characterized in that: The temperature-sensitive capacitor is connected to the combiner port to automatically adjust the output phase of the coupler through the feedback circuit to compensate for the phase deviation caused by temperature drift; The combining port is the output port after the signals are combined; The distributed heat dissipation substrate is a high thermal conductivity insulation gasket attached to the bottom of the PCB of the power distributor, and an external aluminum heat dissipation substrate is connected to conduct the resistance heat to the external radiator through the gasket; The EBG shield is nested outside the metal cavity of the coupler, and its unit period corresponds to the 5.3-5.5 GHz suppression frequency band, which is used to suppress electromagnetic interference outside the cavity and radiation leakage between internal channels.

4. A directional coupler according to claim 1, characterized in that: The hierarchical electromagnetic suppression system, wherein the periodic unit size of the EBG shield and the spacing between the multi-channel coupling channels meet The matching relationship is such that when the filling density of the absorbing material is reduced to [30%, 50%], the mutual coupling between channels is still maintained at no more than -40dB.

5. The directional coupler according to claim 1, wherein: The temperature-sensitive capacitors and the multiple coupling channels form a dynamic linkage, which means that the ambient temperature data is collected in real time by the temperature sensors in the temperature-sensitive capacitor array, and the temperature parameters are input into the closed-loop feedback control system to dynamically adjust the capacitance of the varactor diodes of each coupling channel to offset the dielectric constant offset caused by temperature changes and maintain the phase consistency of the multiple coupling channels.

6. A directional coupler according to claim 2, characterized in that: The two-stage coupler comprises a first-stage coupling length branch (101) and a second-stage coupling length branch (104), wherein the input port and the output port of the two-stage coupler are both connected in series with an adjustable capacitor and in parallel with an adjustable inductor; by adjusting the values ​​of the capacitor and the inductor to change the impedance of the coupler port, the odd and even mode phase velocities are indirectly adjusted to compensate for the phase difference caused by medium inhomogeneity; An external adjustable matching network is set up to perform odd-mode and even-mode phase velocity-adjustable phase compensation on the signals transmitted between the input and output ports of the two-stage coupler of the coupling unit. By adjusting the component parameters of the series adjustable capacitor and the parallel adjustable inductor to change the equivalent dielectric constant of the transmission line, compensation data of the phase consistency of the multi-channel coupling channel is obtained.

7. A directional coupler according to claim 6, characterized in that: The adjustable capacitor and adjustable inductor also include: decoupling control of the adjustable capacitor and adjustable inductor, establishing an independent mapping relationship between capacitance, inductance, amplitude and phase, and driving the adjustable capacitor actuator to independently adjust each component by solving the target capacitance and inductance in real time.

8. The directional coupler according to claim 6, wherein: The external adjustable matching network further includes: The capacitors and inductors are encapsulated in independent low-temperature co-fired ceramic modules, connected to the coupler microstrip lines via gold wire bonding, and a micro heat sink is integrated at the bottom of the module. Copper pillars are embedded inside the low-temperature co-fired ceramic module for thermal conductivity, increasing the heat dissipation efficiency to 5W / cm². The low-temperature co-fired ceramic module is a high-performance electronic component based on a multilayer ceramic process.

9. The directional coupler according to claim 1, wherein: The multi-physics field sensor network integration includes: arranging sensors in temperature field, vibration field, humidity field and electromagnetic field to obtain data; The physical relationship modeling includes: establishing the interaction relationship between temperature field, vibration field, humidity field and electromagnetic field, and dynamically mapping the phase consistency of multi-channel coupling channels, the signal loss of the power distribution network and the electromagnetic suppression efficiency of the EBG shield.

10. The directional coupler according to claim 1, wherein: The edge intelligent processing unit also includes: A dynamic modeling and analysis module calculates the phase compensation and shielding efficiency correction value of each coupling channel in real time based on the physical relationship modeling; adjusts the transmission line equivalent dielectric constant offset based on the phase compensation; and dynamically adjusts the EBG unit period and absorbing material filling density based on the shielding efficiency correction value to compensate for the bandgap frequency drift caused by vibration deformation; The cross-field collaborative control module synchronously applies the compensation parameters output by the dynamic modeling and analysis module to the amplitude regulators of the multi-channel coupling channels, the impedance matching nodes of the power distribution network, and the electromagnetic suppression parameters of the shielding structure; and compensates for the signal attenuation caused by dielectric loss based on the electromagnetic suppression parameters.

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