Antenna assembly, high-integration radio frequency device and communication system

Abstract

The invention discloses an antenna assembly, a high-integration radio frequency device and a communication system, and relates to the technical field of radio frequency, the antenna assembly is used for the high-integration radio frequency device, the high-integration radio frequency device comprises a radiation floor layer, and the antenna assembly comprises a substrate, a radiation metal cover plate and a radio frequency circuit; the substrate is arranged on the radiation floor layer; the radiation metal cover plate covers the substrate, and the radiation metal cover plate and the substrate enclose to form an accommodating cavity; the radiation metal cover plate is provided with a first inner wall forming the accommodating cavity; the radio frequency circuit is mounted on the first inner wall and is used for processing an input radio frequency sending signal and outputting the processed signal to the radiation metal cover plate; the radiation metal cover plate is used for converting a radio frequency sending signal output by the radio frequency circuit into an electromagnetic wave and radiating the electromagnetic wave outwards, and is used for converting the received external electromagnetic wave into a radio frequency receiving signal and outputting the radio frequency receiving signal to the radio frequency circuit; according to the technical scheme provided by the invention, the problems of difficulty in heat dissipation, poor electromagnetic compatibility and limited space integration of a 5G / 6G high-integration radio frequency front end under multiple physical constraints can be solved.

Description

Technical Field

[0001] The present invention relates to the field of radio frequency technology, and in particular to an antenna assembly, a highly integrated radio frequency device and a communication system. Background Art

[0002] The design of highly integrated RF front-ends in fifth- and sixth-generation mobile communication systems (5G / 6G) faces technical challenges under multiple physical constraints. Traditional RF devices employ a layered "sandwich" architecture, stacking the antenna layer, RF circuit layer, and baseband layer in sequence. While this structure meets the basic functional requirements of electromagnetic radiation, it creates a triple contradiction between thermal management, electromagnetic compatibility, and spatial integration.

[0003] First, the power amplifier, as the core component of the RF circuit layer, generates a large amount of heat when operating at high frequencies. Due to the closed structure of the middle layer, this heat is difficult to dissipate effectively, forming localized high-temperature areas.

[0004] Secondly, the antenna layer, as the core unit for electromagnetic wave radiation, must be placed on the outermost layer of the device to ensure unobstructed radiation performance. This forces the RF circuit layer, where heat is concentrated, to be embedded between the antenna layer and the baseband layer, further exacerbating heat accumulation.

[0005] Third, with the increasing demand for high-density integration in devices like 5G base stations and phased array radars, traditional heat dissipation solutions (such as heat sinks and liquid cooling structures) inevitably increase device size due to their inherent structural characteristics, directly conflicting with miniaturization design goals. Currently, existing heat dissipation technologies also have limitations. While effective, air and liquid cooling solutions require additional pumps and piping, which increases device size and violates miniaturization design requirements. Microchannel cooling (MCC) solutions can reduce thermal resistance, but still increase size due to complex fluid interfaces and are less effective in high-frequency applications. Furthermore, the "heat sink antenna" solution relies solely on the antenna metal's thermal conductivity, failing to effectively address the layout issues of the RF circuit layer and exhibiting poor compatibility in the millimeter-wave band. Summary of the Invention

[0006] The main purpose of the present invention is to propose an antenna assembly, a highly integrated radio frequency device and a communication system, aiming to solve the problems of heat dissipation difficulties, poor electromagnetic compatibility and limited spatial integration of 5G / 6G highly integrated radio frequency front-ends under multiple physical constraints.

[0007] To achieve the above objectives, the present invention provides an antenna assembly for a highly integrated radio frequency device, wherein the highly integrated radio frequency device includes a radiation floor layer, and the antenna assembly includes: a substrate, provided on the radiant floor layer; a radiation metal cover plate, the radiation metal cover plate being disposed on the substrate and enclosing the substrate to form a receiving cavity, the radiation metal cover plate having a first inner wall constituting the receiving cavity; a radio frequency circuit, mounted on the first inner wall, for processing an input radio frequency transmission signal and outputting the processed signal to the radiation metal cover; The radiation metal cover is used to convert the radio frequency transmission signal output by the radio frequency circuit into electromagnetic waves and then radiate them outward, and to convert the received external electromagnetic waves into radio frequency receiving signals and then output them to the radio frequency circuit.

[0008] In one embodiment, the radiation metal cover plate includes a top plate and multiple side plates arranged on the top plate, the multiple side plates are arranged and connected in sequence along the circumference of the radiation metal cover plate, the top plate is arranged opposite to the base plate, the top plate, the base plate and the multiple side plates enclose the accommodating cavity, and the top plate has a first inner wall constituting the accommodating cavity.

[0009] In one embodiment, the heat-conducting layer includes at least one of thermal grease and a thermal gasket.

[0010] In one embodiment, the antenna assembly further includes a heat-conducting layer, and the heat-conducting layer is located in the accommodating cavity and closely attached between the first inner wall and the radio frequency circuit.

[0011] The present invention further provides a highly integrated radio frequency device, comprising: radiant flooring; The antenna assembly as described above is arranged opposite to the radiation floor layer, and the antenna assembly includes a substrate, a radiation metal cover and a radio frequency circuit. The substrate is arranged on the radiation floor layer, and the radio frequency circuit is used to process the input radio frequency transmission signal and output it to the radiation metal cover; the radiation metal cover is used to convert the radio frequency transmission signal output by the radio frequency circuit into an electromagnetic wave and radiate it outward, and to convert the received external electromagnetic wave into a radio frequency receiving signal and output it to the radio frequency circuit.

[0012] In one embodiment, the highly integrated radio frequency device further includes: A coaxial cable, comprising an outer conductor and a center conductor, wherein the outer conductor is located between the radiation floor layer and the substrate, the outer conductor connects the radiation floor layer to the substrate, the substrate is provided with a first signal hole, and the radiation floor layer is provided with a second signal hole at a position corresponding to the first signal hole, the center conductor is passed through the outer conductor, one end of the center conductor passes through the first signal hole, extends into the accommodating cavity of the antenna assembly, and is electrically connected to the radio frequency circuit, and the other end of the center conductor passes through the second signal hole for being electrically connected to the radio frequency device; The substrate is further provided with an opening, one end of the feeding probe passes through the opening and extends into the accommodating cavity to be electrically connected to the radio frequency circuit, and the other end of the feeding probe is connected to the radiation floor layer.

[0013] In one embodiment, the highly integrated radio frequency device further includes a first microstrip line and a second microstrip line, the first microstrip line and the second microstrip line are respectively located in the accommodating cavity and electrically connected to the radio frequency circuit, the center conductor extends through the first signal hole into the accommodating cavity and is electrically connected to the first microstrip line, and the feeding probe extends through the opening into the accommodating cavity and is electrically connected to the second microstrip line; And / or, the substrate has a first side surface and a second side surface opposite to each other, the first side surface is provided with a first floor panel, the second side surface is provided with a second floor panel, the substrate is provided with a conductive portion, the second floor panel is electrically connected to the first floor panel via the conductive portion, and the second floor panel is connected to the radiation floor layer via the outer conductor.

[0014] In one embodiment, the coaxial cable includes a coaxial signal transmitting line, a coaxial signal receiving line and a coaxial power supply line. The coaxial signal transmitting line, the coaxial signal receiving line and the coaxial power supply line are arranged at intervals on the radiation floor layer and are located between the radiation floor layer and the substrate. The coaxial signal transmitting line is used to send the input RF transmitting signal to the RF circuit, the coaxial signal receiving line is used to receive the RF receiving signal output by the RF circuit and forward it to an external RF device, and the coaxial power supply line is used to output the input power supply signal to the RF circuit.

[0015] In one embodiment, the highly integrated radio frequency device further includes: Metal housing; The low-frequency circuit is arranged at the bottom of the metal shell, the radiation floor layer is arranged on the low-frequency circuit, and the antenna assembly, the radiation floor layer, and the low-frequency circuit are arranged in sequence along the thickness direction of the antenna assembly in the metal shell.

[0016] The present invention further provides a communication system, which includes the highly integrated radio frequency device as described above.

[0017] The antenna assembly provided by the technical solution of the present invention includes a substrate, a radiating metal cover, and a radio frequency circuit. The substrate is disposed above a radiating floor layer, and the radiating metal cover and the substrate enclose a cavity. The radio frequency circuit is disposed within the cavity and mounted on the first inner wall of the cavity. This layout enables the radio frequency circuit to process radio frequency transmission signals input by an external radio frequency device and output them to the radiating metal cover, thereby stimulating an outwardly radiating electromagnetic field between the radiating metal cover and the radiating floor layer. The RF transmission signals output by the radio frequency circuit are converted into electromagnetic waves, which are then radiated outward through the electromagnetic field. At the same time, the radiating metal cover can also receive external electromagnetic waves and convert them into radio frequency reception signals, which are then output to the radio frequency circuit, thereby achieving complete electromagnetic wave transmission and reception functions. Compared to the traditional "sandwich" structure in which the radio frequency circuit layer is sandwiched between the antenna layer and the baseband layer, which causes heat accumulation, the radio frequency circuit in the technical solution of the present invention is mounted on the first inner wall of the radiating metal cover. This not only fully utilizes the space formed between the radiating metal cover and the substrate, but also brings the radio frequency circuit closer to the radiating metal cover, facilitating rapid heat conduction through the metal cover, thereby improving the thermal management capability of the antenna assembly. In addition, the RF circuit is arranged in a sealed accommodation cavity, which can effectively reduce external electromagnetic interference and enhance shielding performance; and the radiation metal cover, RF circuit, substrate and radiation floor layer are highly integrated and tightly coupled in the thickness direction of the highly integrated RF device, which can further shorten the signal path length and improve electromagnetic compatibility. At the same time, the technical solution of the present invention does not need to rely on additional heat dissipation structures or liquid cooling structures, and can avoid the volume increase problem caused by the use of additional heat dissipation structures or liquid cooling structures in traditional heat dissipation solutions, and achieve the unity of high-density integration and miniaturization design goals of highly integrated RF devices. In summary, the technical solution of the present invention can improve the thermal management efficiency, electromagnetic compatibility and space utilization of the RF front end, and effectively respond to the technical challenges of 5G / 6G communication systems to highly integrated RF devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0019] Figure 1 A schematic structural diagram of an embodiment of a highly integrated radio frequency device provided by the present invention; Figure 2 for Figure 1 Schematic diagram of the structure from another angle; Figure 3 for Figure 2 A partial schematic diagram of Figure 4 for Figure 3 Schematic diagram of the electromagnetic field generated between the radiant metal cover and the radiant floor layer; Figure 5 A comparison of the heat generated by the RF circuit layer in the highly integrated RF device provided by the present invention and the RF circuit layer in a traditional RF device; Figure 6 for Figure 1 Exploded diagram; Figure 7 for Figure 6 A partial enlarged view of point A in the middle; Figure 8 A schematic structural diagram of another embodiment of the highly integrated radio frequency device provided by the present invention; Figure 9 This is a structural diagram of another embodiment of the highly integrated radio frequency device provided by the present invention.

[0020] Description of Figure Numbers: 1000. Highly integrated RF device; 100. Antenna assembly; 1. Substrate; 11. First side surface; 12. Second side surface; 101. Accommodation cavity; 102. First signal hole; 103. Opening; 104. Conductive portion; 2. Radiating metal cover; 21. Top plate; 22. Side plate; 211. First inner wall; 3. RF circuit; 4. Thermal conductive layer; 5. First floor panel; 6. Second floor panel. 200, radiant floor layer; 201, second signal hole; 300, coaxial line; 310, outer conductor; 320, center conductor; 300A, coaxial signal transmitting line; 300B, coaxial signal receiving line; 300C, coaxial power line; 400, feeding probe; 500, first microstrip line; 600, second microstrip line; 700, low frequency circuit; 800. Shell.

[0021] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] The design of highly integrated RF front-ends in fifth- and sixth-generation mobile communication systems (5G / 6G) faces technical challenges under multiple physical constraints. Traditional RF devices employ a layered "sandwich" architecture, stacking the antenna layer, RF circuit layer, and baseband layer in sequence. While this structure meets the basic functional requirements of electromagnetic radiation, it creates a triple contradiction between thermal management, electromagnetic compatibility, and spatial integration.

[0026] First, the power amplifier, as the core component of the RF circuit layer, generates a large amount of heat when operating at high frequencies. Due to the closed structure of the middle layer, this heat is difficult to dissipate effectively, forming localized high-temperature areas.

[0027] Secondly, the antenna layer, as the core unit for electromagnetic wave radiation, must be placed on the outermost layer of the device to ensure unobstructed radiation performance. This forces the RF circuit layer, where heat is concentrated, to be embedded between the antenna layer and the baseband layer, further exacerbating heat accumulation.

[0028] Third, with the increasing demand for high-density integration in devices like 5G base stations and phased array radars, traditional heat dissipation solutions (such as heat sinks and liquid cooling structures) inevitably increase device size due to their inherent structural characteristics, directly conflicting with miniaturization design goals. Currently, existing heat dissipation technologies also have limitations. While effective, air and liquid cooling solutions require additional pumps and piping, which increases device size and violates miniaturization design requirements. Microchannel cooling (MCC) solutions can reduce thermal resistance, but still increase size due to complex fluid interfaces and are less effective in high-frequency applications. Furthermore, the "heat sink antenna" solution relies solely on the antenna metal's thermal conductivity, failing to effectively address the layout issues of the RF circuit layer and exhibiting poor compatibility in the millimeter-wave band.

[0029] The present invention proposes an antenna assembly 100, which aims to solve the problems of heat dissipation difficulties, poor electromagnetic compatibility and limited spatial integration of the above-mentioned 5G / 6G highly integrated RF front-end under multiple physical constraints.

[0030] See also Figures 1 to 5 In one embodiment of the present invention, the antenna assembly 100 is used in a highly integrated radio frequency device 1000. The highly integrated radio frequency device 1000 includes a radiation floor layer 200. The antenna assembly 100 includes: Base plate 1, provided on the radiant floor layer 200; The radiation metal cover plate 2 is covered on the substrate 1 and encloses the substrate 1 to form a receiving cavity 101. The radiation metal cover plate 2 has a first inner wall 211 forming the receiving cavity 101. The radio frequency circuit 3 is located in the accommodating cavity 101 and mounted on the first inner wall 211 , and is used to process the input radio frequency transmission signal and output it to the radiation metal cover 2 ; The radiating metal cover plate 2 is used to convert the radio frequency transmission signal output by the radio frequency circuit 3 into electromagnetic waves and radiate them outward, and to convert the received external electromagnetic waves into radio frequency receiving signals and output them to the radio frequency circuit 3.

[0031] It should be understood that the antenna assembly 100 is used in a highly integrated RF device 1000. In addition to the antenna assembly 100, such a RF device may also include a radiating floor layer 200. However, this does not mean that the structure consists solely of the antenna assembly 100 and the radiating floor layer 200. In this embodiment and subsequent embodiments, the highly integrated RF device 1000 including the antenna assembly 100 and the radiating floor layer 200 is primarily described as an example.

[0032] The radiation floor layer 200 can be made of metal material and serves as a reference ground plane and a part of the radiation path when electromagnetic waves are generated. The radiation floor layer 200 can provide basic support for the subsequent formation of electromagnetic fields.

[0033] The antenna assembly 100 may include a substrate 1, a radiation metal cover 2, and a radio frequency circuit 3; wherein: The substrate 1 is arranged above the radiation floor layer 200, and is opposite to and spaced from the radiation floor layer 200. In the thickness direction of the highly integrated radio frequency device 1000, the substrate 1 is located above the radiation floor layer 200. The substrate 1 can be made of materials such as a ceramic substrate or a high-frequency PCB board. These materials have good high-frequency characteristics and conductive properties, which help to reduce losses during signal transmission and improve the reflection efficiency of electromagnetic waves. By reasonably selecting the material of the substrate 1, electromagnetic waves can be effectively reflected during propagation and propagate along the direction of the radio frequency circuit 3 pointing to the radiation metal cover plate 2, thereby realizing directional radiation of electromagnetic waves. In this way, the substrate 1 not only supports the structure of the entire antenna assembly 100 and carries circuit wiring, but also plays an active role in guiding the electromagnetic wave propagation path.

[0034] The radiation metal cover plate 2 can be made of a metal material with good electrical conductivity, such as copper or aluminum. Its bottom edge is tightly connected to the substrate 1 to form a receiving cavity 101 for installing internal circuits such as the radio frequency circuit 3. The radiation metal cover plate 2 not only protects the radio frequency circuit 3, but more importantly, it is itself part of the radiation structure of the antenna assembly 100. It can cooperate with the radiation floor layer 200 below to form an electromagnetic wave radiation channel, which can effectively radiate electromagnetic waves outward or receive electromagnetic waves. The radiation metal cover plate 2 has a first inner wall 211 that constitutes the receiving cavity 101. The first inner wall 211 can provide a positioning and mounting surface for the installation of the radio frequency circuit 3, making the layout of the radio frequency circuit 3 more compact. At the same time, since the radiation metal cover plate 2 has good thermal conductivity, the heat generated by the radio frequency circuit 3 during operation can be directly conducted outward through the radiation metal cover plate 2, thereby accelerating the heat dissipation and avoiding the problem of local overheating of the radio frequency circuit 3.

[0035] The RF circuit 3 may include devices such as power amplifiers, filters, switches and low-noise amplifiers. The radiating metal cover 2 is used to receive external electromagnetic waves and convert them into RF receiving signals and then output them to the low-noise amplifier. The low-noise amplifier amplifies the received RF receiving signals. Other devices such as power amplifiers, filters and switches play a role in different links, such as enhancing signal strength, removing unnecessary noise and selectively passing or blocking signals. During operation, these devices, especially high-power devices such as power amplifiers, will generate significant heat, which is the main heat source of the highly integrated RF device 1000. The RF circuit 3 is directly mounted on the first inner wall 211 of the radiating metal cover 2. This arrangement allows the heat generated by the RF circuit 3 during operation to be quickly conducted outward through the radiating metal cover 2 with good thermal conductivity, effectively improving the problem of heat being difficult to dissipate in time in the traditional "sandwich" structure, and improving the thermal management capability of the RF circuit 3. Figure 5 As shown, Figure 5 (a) is the heat distribution diagram of the RF circuit layer in the traditional RF device when it is working. The minimum heat value is 24.5℃ and the maximum heat value reaches 96.5℃. Figure 5 (b) is a heat distribution diagram of the RF circuit 3 in the highly integrated RF device 100 of the present invention during operation. As can be seen, in this embodiment, because the RF circuit 3 is directly mounted on the radiant metal cover 2, which has excellent thermal conductivity, the heat dissipation of the RF circuit 3 is significantly improved: the minimum heat value is reduced from 24.5°C to 24.2°C, and the maximum heat value is significantly reduced from 96.5°C to 67.4°C.

[0036] At the same time, the RF transmission signal output by the RF circuit 3 can be output to the radiating metal cover plate 2, thereby exciting the formation of an outwardly radiating electromagnetic field between it and the radiating floor layer 200 below, converting the RF transmission signal output by the RF circuit 3 into an electromagnetic wave and radiating it outward through the formed electromagnetic field. The interaction between this electromagnetic wave and the radiating metal cover plate 2 and the radiating floor layer 200 is essentially an electromagnetic coupling effect. It not only helps to reduce the electromagnetic interference between the RF circuit 3 and the surrounding environment, and improve the electromagnetic compatibility of the highly integrated RF device 1000, but also eliminates the need to add an additional heat dissipation structure or liquid cooling structure, thereby being more conducive to the miniaturization and compact layout of the highly integrated RF device 1000.

[0037] The antenna assembly 100 provided by the technical solution of the present invention includes a substrate 1, a radiating metal cover plate 2, and a radio frequency circuit 3, wherein the substrate 1 is provided on a radiating floor layer 200, and the radiating metal cover plate 2 and the substrate 1 enclose a housing 101. The radio frequency circuit 3 is provided within the housing 101 and mounted on a first inner wall 211 constituting the housing 101. This layout enables the radio frequency circuit 3 to process the radio frequency transmission signal input by an external radio frequency device and output it to the radiating metal cover plate 2, thereby exciting the formation of an outwardly radiating electromagnetic field between the radiating metal cover plate 2 and the radiating floor layer 200, converting the radio frequency transmission signal output by the radio frequency circuit 3 into electromagnetic waves, which are then radiated outward via the electromagnetic field. At the same time, the radiating metal cover plate 2 can also receive external electromagnetic waves and convert them into radio frequency receiving signals, which are then output to the radio frequency circuit 3, thereby achieving complete electromagnetic wave transmission and reception functions. Compared to the traditional "sandwich" structure where the RF circuit layer is sandwiched between the antenna layer and the baseband layer, which causes heat accumulation, the RF circuit 3 in the technical solution of the present invention is installed on the first inner wall 211 of the radiating metal cover plate 2. This not only fully utilizes the space formed between the radiating metal cover plate 2 and the substrate 1, but also brings the RF circuit 3 closer to the radiating metal cover plate 2, facilitating rapid heat conduction through the metal cover plate, thereby improving the thermal management capability of the antenna assembly 100. In addition, the RF circuit 3 is disposed within the sealed accommodating cavity 101, which effectively reduces external electromagnetic interference and enhances shielding performance. The radiating metal cover plate 2, RF circuit 3, substrate 1, and radiating floor layer 200 are highly integrated and tightly coupled along the thickness direction of the highly integrated RF device 1000, further shortening the signal path length and improving electromagnetic compatibility. In addition, the technical solution of the present invention does not require additional heat dissipation or liquid cooling structures, avoiding the volume increase caused by the use of additional heat dissipation or liquid cooling structures in traditional heat dissipation solutions, thereby achieving the unification of high-density integration and miniaturization design goals of the highly integrated RF device 1000. In summary, the technical solution of the present invention can improve the thermal management efficiency, electromagnetic compatibility and space utilization of the RF front-end, and effectively respond to the technical challenges of the 5G / 6G communication system to the highly integrated RF device 1000.

[0038] See also Figure 3 and Figure 4 In one embodiment of the present invention, the radiation metal cover plate 2 includes a top plate 21 and a plurality of side plates 22 provided on the top plate 21. The plurality of side plates 22 are sequentially arranged and connected along the circumference of the radiation metal cover plate 2. The top plate 21 is disposed opposite to the base plate 1. The top plate 21, the base plate 1, and the plurality of side plates 22 enclose a receiving cavity 101. The top plate 21 has a first inner wall 211 constituting the receiving cavity 101.

[0039] In this embodiment, the radiating metal cover plate 2 includes a top plate 21 and multiple side plates 22 disposed at the edges of the top plate 21. The multiple side plates 22 are sequentially arranged along the circumference of the top plate 21 and interconnected to form an enclosure structure surrounding the top plate 21. The top plate 21 is disposed opposite the base plate 1. The top plate 21, the base plate 1, and the multiple side plates 22 collectively form a closed accommodating cavity 101 for accommodating internal components such as the RF circuit 3.

[0040] Among them, the side surface of the top plate 21 facing the accommodating cavity 101 constitutes a first inner wall 211. The first inner wall 211 can provide a positioning surface for the installation of the RF circuit 3, and due to its good thermal conductivity, it helps to quickly conduct the heat generated by the RF circuit 3 during operation to the outside through the metal cover, thereby effectively improving the overall heat dissipation efficiency.

[0041] Furthermore, the multiple side panels 22 not only provide structural support and packaging protection but also serve as an important component of the electromagnetic wave radiation path. The RF transmission signal output by the RF circuit 3 is directed to the side panels 22, which convert the RF transmission signal into electromagnetic waves. These waves are then evenly radiated in all directions along the multiple side panels 22, expanding the radiation range of the antenna assembly 100 and improving the efficiency and directionality of the electromagnetic wave transmission.

[0042] Through the above-mentioned structural design, not only can the mechanical strength of the radiating metal cover plate 2 be enhanced, so that it has higher structural stability in a highly integrated environment, but also the electromagnetic performance and thermal conductivity of the radiating structure can be significantly improved through the integrated design of the top plate 21 and the side plate 22. At the same time, the accommodating cavity 101 formed by the radiating metal cover plate 2 also provides a good electromagnetic shielding environment for the RF circuit 3, effectively reducing external interference and improving signal transmission quality. The synergistic effect of this series of technical features makes the antenna assembly 100 have a wider applicability and higher operational stability in highly integrated RF devices 1000, meeting the technical requirements of 5G / 6G communication systems for high-performance, high-density RF devices.

[0043] See also Figure 3 and Figure 4 In one embodiment of the present invention, the antenna assembly 100 further includes a heat-conducting layer 4 . The heat-conducting layer 4 is located in the accommodating cavity 101 and is closely attached between the first inner wall 211 and the RF circuit 3 .

[0044] In this embodiment, the thermal conductive layer 4 is made of a material with good thermal conductivity, such as thermal grease or a thermal conductive gasket, which can effectively fill the small gap between the RF circuit 3 and the radiating metal cover 2, thereby improving the thermal conduction efficiency between the two. Through this structure, the heat generated by the RF circuit 3 during operation can be transferred to the first inner wall 211 more quickly through the thermal conductive layer 4, and further dissipated outward through the radiating metal cover 2, thereby significantly improving the heat dissipation capacity of the RF circuit 3 and preventing the circuit performance or lifespan from being affected by local excessive temperatures. This embodiment can enhance the thermal management capabilities of the RF circuit 3 without changing the overall structural layout, thereby improving the stability and reliability of the antenna assembly 100.

[0045] The present invention also proposes a highly integrated radio frequency device 1000, see Figures 1 to 5 The highly integrated radio frequency device 1000 includes a radiation floor layer 200 and an antenna assembly 100. The specific structure of the antenna assembly 100 refers to the above-mentioned embodiment. Since the highly integrated radio frequency device 1000 adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here. In the highly integrated radio frequency device 1000, the radiation floor layer 200 is arranged opposite to the radiation metal cover plate 2 in the antenna assembly 100. The antenna assembly 100 includes a substrate 1, a radiation metal cover plate 2 and a radio frequency circuit 3. The substrate 1 is installed on the radiation floor layer 200 as a support structure and the basis for circuit wiring. The radio frequency circuit 3 is arranged on the first inner wall 211 of the radiation metal cover plate 2, and good heat conduction can be achieved through the thermal conductive layer 4. The RF circuit 3 can process the RF transmission signal input by the external RF device and output it to the radiating metal cover plate 2, thereby stimulating the formation of an outwardly radiating electromagnetic field between the radiating metal cover plate 2 and the radiating floor layer 200. The RF transmission signal output by the RF circuit 3 is converted into electromagnetic waves and then radiated outward through the electromagnetic field. At the same time, the radiating metal cover plate 2 can also receive external electromagnetic waves and convert them into RF receiving signals before outputting them to the RF circuit 3, thereby realizing complete electromagnetic wave transmission and reception functions. Through the above-mentioned structural design, the highly integrated RF device 1000 of this embodiment can improve its thermal management efficiency, electromagnetic compatibility, and space utilization without increasing its volume, thus solving the multiple physical constraints faced by the RF front end in 5G / 6G communication systems.

[0046] See also Figure 3 and Figure 4 In one embodiment of the present invention, the highly integrated radio frequency device 1000 further includes: The coaxial line 300 includes an outer conductor 310 and a center conductor 320. The outer conductor 310 is located between the radiation floor layer 200 and the substrate, connecting the radiation floor layer 200 to the substrate. The substrate 1 is provided with a first signal hole 102, and the radiation floor layer 200 is provided with a second signal hole 201 at a position corresponding to the first signal hole 102. The center conductor 320 is disposed within the outer conductor 310. One end of the center conductor 320 extends through the first signal hole 102 into the accommodating cavity 101 of the antenna assembly 100 to be electrically connected to the RF circuit 3. The other end of the center conductor 320 extends through the second signal hole 201 for electrical connection to the RF device. The substrate 1 further has an opening 103 , and one end of the feeding probe 400 extends through the opening 103 into the accommodating cavity 101 to be electrically connected to the RF circuit 3 , while the other end of the feeding probe 400 is connected to the radiation floor layer 200 .

[0047] In this embodiment, the highly integrated radio frequency device 1000 further includes a coaxial line 300 and a feeding probe 400, which are used to achieve efficient signal transmission and electromagnetic coupling between the radio frequency circuit 3 and an external radio frequency device.

[0048] The coaxial line 300 consists of an outer conductor 310 and a center conductor 320. The outer conductor 310 is arranged between the radiation floor layer 200 and the substrate 1, and connects the two parts together, playing a role in structural fixation. It also serves as an electromagnetic shielding structure, effectively reducing external interference and improving the electromagnetic compatibility of the highly integrated radio frequency device 1000. A first signal hole 102 is provided on the substrate 1, and a second signal hole 201 is provided on the radiation floor layer 200 at a position corresponding to the first signal hole 102. The center conductor 320 passes through the interior of the outer conductor 310, and one end of the center conductor 320 enters the accommodating cavity 101 of the antenna assembly 100 through the first signal hole 102 to establish an electrical connection with the radio frequency circuit 3; the other end passes through the second signal hole 201 and is connected to the external radio frequency device, thereby realizing stable and low-loss transmission of the radio frequency transmission signal from the external radio frequency device to the radio frequency circuit 3.

[0049] An opening 103 is also provided on the substrate 1 for installing a feeding probe 400. One end of the feeding probe 400 passes through the opening 103 into the accommodating cavity 101 and is electrically connected to the RF circuit 3, while the other end is connected to the radiation floor layer 200 to form an auxiliary feeding signal path. This additional path can enhance the signal coupling capability between the RF circuit 3 and the radiation floor layer 200 and the radiation metal cover 2. Specifically, the feeding probe 400 directly introduces a portion of the RF energy into the radiation floor layer 200, so that a more uniform and higher-intensity electromagnetic field distribution is formed between it and the radiation metal cover 2, thereby improving the efficiency and directionality of the outward radiation of electromagnetic waves, and further optimizing the radiation performance of the antenna assembly 100.

[0050] Through the above-described structural arrangement, the coaxial line 300 and the feed probe 400 together form a complete coaxial feeding structure. The coaxial line 300 is responsible for inputting the RF transmit signal and outputting the RF receive signal, ensuring stability and anti-interference capabilities during the transmission of the RF transmit and receive signals. The feed probe 400, on the other hand, enhances the excitation effect of RF energy in the radiating floor layer 200 and the radiating metal cover 2, thereby improving electromagnetic wave emission efficiency. This dual-feed method not only improves the electromagnetic compatibility and space utilization of the highly integrated RF device 1000, but also enhances the stability and performance of the entire highly integrated RF device 1000.

[0051] See also Figure 3 and Figure 4 and Figure 6 and Figure 7 In one embodiment of the present invention, the highly integrated radio frequency device 1000 further includes a first microstrip line 500 and a second microstrip line 600. The first microstrip line 500 and the second microstrip line 600 are respectively located in the accommodating cavity 101 and are electrically connected to the radio frequency circuit 3. The center conductor 320 extends through the first signal hole 102 into the accommodating cavity 101 and is electrically connected to the first microstrip line 500. The feeding probe 400 extends through the opening 103 into the accommodating cavity 101 and is electrically connected to the second microstrip line 600.

[0052] In this embodiment, the highly integrated RF device 1000 further includes a first microstrip line 500 and a second microstrip line 600, both of which are disposed within the housing cavity 101 of the antenna assembly 100 and electrically connected to the RF circuit 3. The center conductor 320 passes through the first signal hole 102 in the substrate 1 and enters the housing cavity 101, and is connected to the first microstrip line 500, thereby introducing the RF transmit signal from an external RF device into the RF circuit 3, or feeding the RF receive signal output by the RF circuit 3 back to the external RF device. Simultaneously, the feed probe 400 passes through the opening 103 in the substrate 1 and enters the housing cavity 101, and is connected to the second microstrip line 600, providing another feed signal path for the RF circuit 3. Through the above-described structural arrangement, the first microstrip line 500 primarily transmits the RF transmit signal introduced by the center conductor 320, ensuring that the RF transmit signal can be stably and efficiently transmitted from the external RF device to the RF circuit 3. Alternatively, it transmits the RF receive signal output by the RF circuit 3, ensuring that the RF receive signal can also be stably and efficiently transmitted from the RF circuit 3 to the center conductor 320, and then fed back to the external RF device. The second microstrip line 600 is used to connect to the feed probe 400, serving as an auxiliary feed path to enhance the signal excitation and electromagnetic coupling between the RF circuit 3 and the radiating structure. The radiating structure is primarily composed of the aforementioned radiating metal cover plate 2 and the radiating floor layer 200, which work together to form an electromagnetic field that radiates electromagnetic waves outward. The two microstrip lines are functionally independent and yet work in synergy, enabling the RF transmit signal to act on the RF circuit 3 in a more balanced and efficient manner, or enabling the RF receive signal to act on the external RF device in a more balanced and efficient manner, further improving the electromagnetic wave excitation efficiency and radiation performance of the antenna assembly 100.

[0053] In other words, this embodiment can realize the input of RF transmission signals or the output of RF reception signals without increasing the complexity of the overall structure, thereby improving the redundancy of signal transmission and the stability of the system. This structural form can effectively meet the requirements of 5G / 6G communication systems for high performance and high reliability of the highly integrated RF device 1000.

[0054] See also Figure 6 and Figure 7 In one embodiment of the present invention, the substrate 1 has a first side surface 11 and a second side surface 12 opposite to each other. The first side surface 11 is provided with a first floor panel 5, and the second side surface 12 is provided with a second floor panel 6. The substrate 1 has a conductive portion 104, and the second floor panel 6 is electrically connected to the first floor panel 5 through the conductive portion 104. The second floor panel 6 is connected to the radiation floor layer 200 through an outer conductor 310.

[0055] In this embodiment, the substrate 1 has a first side surface 11 and a second side surface 12 disposed opposite each other. A first ground plane 5 is disposed on the first side surface 11, and a second ground plane 6 is disposed on the second side surface 12. A conductive portion 104 is provided within the substrate 1, connecting the first and second ground planes 5 and 6 to form a unified potential reference plane. Furthermore, the second ground plane 6 is electrically connected to the radiating ground plane layer 200 via an external conductor 310, extending the potential reference on the substrate 1 to the entire radiating structure of the RF device.

[0056] Through the above structure, a continuous conductive path is formed between the first and second floor panels 5 and 6 via the conductive portion 104. This path is connected to the radiating floor panel 200 via the outer conductor 310, establishing a complete ground path from the substrate 1 to the radiating structure. This structure helps enhance the electrical consistency between the various components within the RF device and improves the stability of electromagnetic wave propagation, thereby improving the radiation performance of the antenna assembly 100. Furthermore, a good ground connection effectively suppresses stray signals, reduces electromagnetic interference, and improves the electromagnetic compatibility of the entire device, meeting the high performance and high reliability requirements of highly integrated RF devices in 5G / 6G communication systems.

[0057] It's worth noting that the conductive portion 104 not only provides electrical connection between the first and second ground planes 5 and 6 but, more importantly, forms a structure with a specific equivalent electrical length together with the outer conductor 310 and the radiating ground plane layer 200. Specifically, the conductive portion 104 penetrates the substrate 1 and directly connects to the outer conductor 310, resulting in a path from the first ground plane 5 to the radiating ground plane layer 200 with a relatively short physical length, exhibiting an equivalent electrical length of λ / 2 (one-half wavelength) at the operating frequency. Conventional antenna assemblies 100 typically require longer physical dimensions to meet the λ / 4 or λ / 2 resonance conditions. However, the coordination of the conductive portion 104 and the outer conductor 310 in this embodiment achieves a shorter physical path while maintaining an equivalent electrical length of λ / 2. This significantly reduces the overall size of the antenna assembly 100, improving space utilization and integration capabilities, making it particularly suitable for the miniaturized RF devices required by 5G / 6G. Furthermore, the equivalent λ / 2 structure formed by this conductive path exhibits excellent transmission characteristics, with an input impedance close to the standard characteristic impedance value (e.g., 50Ω), facilitating impedance matching between the RF circuit 3 and the radiating structure. Good impedance matching means less signal reflection and lower energy loss during transmission, thereby improving transmission efficiency and enhancing the overall performance and operational stability of RF devices.

[0058] In summary, this embodiment achieves a highly compact layout and excellent input impedance characteristics of the antenna assembly 100 by introducing a conductive portion 104 having an equivalent electrical length of λ / 2 without sacrificing RF performance, thereby providing an effective technical path for the realization of high-performance, highly integrated RF devices.

[0059] See also Figure 8 In one embodiment of the present invention, the coaxial cable 300 includes a coaxial signal transmitting line 300A, a coaxial signal receiving line 300B, and a coaxial power supply line 300C. The coaxial signal transmitting line 300A, the coaxial signal receiving line 300B, and the coaxial power supply line 300C are arranged at intervals on the radiation floor layer 200 and located between the radiation floor layer 200 and the substrate 1. The coaxial signal transmitting line 300A is used to send the input RF transmitting signal to the RF circuit 3, the coaxial signal receiving line 300B is used to receive the RF receiving signal output by the RF circuit 3 and forward it to an external RF device, and the coaxial power supply line 300C is used to output the input power supply signal to the RF circuit 3.

[0060] In this embodiment, the coaxial line 300 includes a coaxial signal transmission line 300A, a coaxial signal receiving line 300B, and a coaxial power line 300C. These three coaxial lines 300 are arranged in an interval arrangement between the radiation floor layer 200 and the substrate 1 and fixed therebetween. Among them, the coaxial signal transmission line 300A is used to transmit the RF transmission signal from the external RF device to the RF circuit 3 to realize the signal input function; the coaxial signal receiving line 300B is used to receive the RF receiving signal output by the RF circuit 3 and transmit it to the external RF device to complete the signal output; the coaxial power line 300C is used to transmit the external input DC power to the RF circuit 3 to provide it with the power required for operation.

[0061] In particular, this embodiment utilizes a three-way through-hole structure. Through three independent channels corresponding to the coaxial signal transmission line 300A, the coaxial signal reception line 300B, and the coaxial power supply line 300C, the RF transmission signal, the RF reception signal, and the DC power supply signal are isolated and transmitted independently during transmission. This three-way through-hole structure prevents mutual interference between different signals (especially high-frequency RF signals and DC power supply), and prevents signal crosstalk, noise superposition, or voltage fluctuations caused by shared pathways, thereby significantly improving the stability and reliability of the highly integrated RF device 1000. Specifically, since the RF transmission signal and the RF reception signal typically operate in the high-frequency band, sharing the same feed path with the DC power supply signal or poorly shielded can easily cause signal distortion, gain reduction, and even system malfunction. The independent transmission method of the three-way through-hole ensures good electromagnetic isolation between the signal paths, reduces the risk of cross-interference, and improves the anti-interference capability and operational stability of the entire highly integrated RF device 1000. It is particularly suitable for 5G / 6G communication systems with high-density and high-performance requirements.

[0062] In summary, this embodiment introduces a coaxial feeding method with a three-through-hole structure to achieve independent transmission of RF transmission signals, RF reception signals, and DC power supply signals, thereby improving the electrical isolation and operational reliability of the highly integrated RF device 1000 from a structural level, and providing strong guarantees for the stable operation of the highly integrated RF device 1000 in complex electromagnetic environments.

[0063] See also Figure 9 In one embodiment of the present invention, the highly integrated radio frequency device 1000 further includes: Metal housing 800.

[0064] The low-frequency circuit 700 is arranged at the bottom of the metal shell 800, the radiation floor layer 200 is arranged on the low-frequency circuit 700, and the antenna assembly 100, the radiation floor layer 200, and the low-frequency circuit 700 are arranged in sequence along the thickness direction of the antenna assembly 100 in the metal shell 800.

[0065] In this embodiment, the highly integrated radio frequency device 1000 further includes a low-frequency circuit 700 and a metal shell 800. The antenna assembly 100, the radiation floor layer 200, and the low-frequency circuit 700 are arranged in sequence along the thickness direction of the antenna assembly 100 and are disposed together in the metal shell 800. The metal shell 800 not only serves as structural support and packaging protection, but also acts as an overall shielding structure, effectively isolating external electromagnetic interference while suppressing signal crosstalk between different internal circuit layers, significantly improving the electromagnetic compatibility and operational stability of the device. The antenna assembly 100 is located in the top area of ​​the metal shell 800 and is responsible for the transmission and reception of electromagnetic waves; the radiation floor layer 200 is located immediately below it and serves as an important component of the electromagnetic wave radiation path; the low-frequency circuit 700 is arranged below it to implement functions such as signal control, processing, or conversion.

[0066] Thus, this embodiment, based on the low-frequency circuit 700 being located at the bottom of the metal housing 800 and the radiant floor layer 200 being located above the low-frequency circuit 700, achieves a highly compact layout by sequentially arranging the antenna assembly 100, the radiant floor layer 200, and the low-frequency circuit 700 along the thickness direction of the antenna assembly 100 and integrating them sequentially within the metal housing 800. Furthermore, the excellent conductivity and shielding properties of the metal housing 800 help suppress signal crosstalk between internal circuits, enhancing the stability of device operation. This makes it particularly suitable for 5G / 6G communication scenarios that require high integration and electromagnetic environment adaptability.

[0067] Notably, the metallized vias on substrate 1 electrically connect to the radiant floor layer 200, thereby connecting the radiant floor layer 200 to the underlying low-frequency circuit 700. The low-frequency circuit 700, housed within the metal housing 800, not only functions as a signal control or processing unit but also, through its connection to the metallized vias and radiant floor layer 200, forms an electromagnetic shielding path extending from the RF portion to the bottom of the device. Due to the inherently excellent conductivity and sealing properties of the metal housing 800, combined with the conductive connection between the metallized vias and radiant floor layer 200, the electromagnetic shielding capability of the entire highly integrated RF device 1000 is further enhanced, effectively suppressing internal and external electromagnetic interference and improving the stability of RF performance. Furthermore, the metal housing 800 provides structural support and heat dissipation for the low-frequency circuit 700. The conductive path between the radiant floor layer 200 and the metallized vias also directs some heat into the metal housing 800, creating an auxiliary heat dissipation channel that contributes to overall thermal management efficiency.

[0068] In summary, this embodiment, by introducing the metal shell 800, metallized vias, and a reasonable layout of the low-frequency circuit 700, can significantly enhance the electromagnetic shielding performance of the highly integrated RF device 1000 while achieving high functional integration, and expand the heat dissipation path, thereby providing a strong guarantee for the stable operation and long-term reliability of the highly integrated RF device 1000 in complex electromagnetic environments.

[0069] The present invention also provides a communication system, which includes a highly integrated radio frequency device 1000. The specific structure of the highly integrated radio frequency device 1000 refers to the above embodiment. Since this communication system adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described one by one here.

[0070] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformation made by utilizing the contents of the present invention's description and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. An antenna assembly, characterized in that: Used for a highly integrated radio frequency device, the highly integrated radio frequency device includes a radiation floor layer, and the antenna assembly includes: a substrate, provided on the radiant floor layer; a radiation metal cover plate, the radiation metal cover plate being disposed on the substrate and enclosing the substrate to form a receiving cavity, the radiation metal cover plate having a first inner wall constituting the receiving cavity; a radio frequency circuit, mounted on the first inner wall, for processing an input radio frequency transmission signal and outputting the processed signal to the radiation metal cover; The radiation metal cover is used to convert the radio frequency transmission signal output by the radio frequency circuit into electromagnetic waves and then radiate them outward, and to convert the received external electromagnetic waves into radio frequency receiving signals and then output them to the radio frequency circuit.

2. The antenna assembly according to claim 1, wherein: The radiation metal cover plate includes a top plate and multiple side plates arranged on the top plate, the multiple side plates are arranged and connected in sequence along the circumference of the radiation metal cover plate, the top plate is arranged opposite to the base plate, the top plate, the base plate and the multiple side plates enclose the accommodating cavity, and the top plate has a first inner wall constituting the accommodating cavity.

3. The antenna assembly according to any one of claims 1 to 2, wherein: The antenna assembly further includes a heat-conducting layer, which is located in the accommodating cavity and closely attached between the first inner wall and the radio frequency circuit.

4. The antenna assembly according to claim 3, wherein: The heat-conducting layer includes at least one of thermal grease and a thermal gasket.

5. A highly integrated radio frequency device, characterized in that: The highly integrated radio frequency device comprises: radiant flooring; The antenna assembly according to any one of claims 1 to 4 is arranged opposite to the radiation floor layer, and the antenna assembly includes a substrate, a radiation metal cover and a radio frequency circuit, the substrate is arranged on the radiation floor layer, and the radio frequency circuit is used to process the input radio frequency transmission signal and output it to the radiation metal cover; the radiation metal cover is used to convert the radio frequency transmission signal output by the radio frequency circuit into an electromagnetic wave and radiate it outward, and to convert the received external electromagnetic wave into a radio frequency receiving signal and output it to the radio frequency circuit.

6. The highly integrated radio frequency device according to claim 5, wherein: The highly integrated radio frequency device further includes: A coaxial cable, comprising an outer conductor and a center conductor, wherein the outer conductor is located between the radiation floor layer and the substrate, the outer conductor connects the radiation floor layer to the substrate, the substrate is provided with a first signal hole, and the radiation floor layer is provided with a second signal hole at a position corresponding to the first signal hole, the center conductor is passed through the outer conductor, one end of the center conductor passes through the first signal hole, extends into the accommodating cavity of the antenna assembly, and is electrically connected to the radio frequency circuit, and the other end of the center conductor passes through the second signal hole for being electrically connected to the radio frequency device; The substrate is further provided with an opening, one end of the feeding probe passes through the opening and extends into the accommodating cavity to be electrically connected to the radio frequency circuit, and the other end of the feeding probe is connected to the radiation floor layer.

7. The highly integrated radio frequency device according to claim 6, wherein: The highly integrated radio frequency device further includes a first microstrip line and a second microstrip line, the first microstrip line and the second microstrip line are respectively located in the accommodating cavity and electrically connected to the radio frequency circuit, the central conductor extends through the first signal hole into the accommodating cavity and is electrically connected to the first microstrip line, and the feeding probe extends through the opening into the accommodating cavity and is electrically connected to the second microstrip line; And / or, the substrate has a first side surface and a second side surface opposite to each other, the first side surface is provided with a first floor panel, the second side surface is provided with a second floor panel, the substrate is provided with a conductive portion, the second floor panel is electrically connected to the first floor panel via the conductive portion, and the second floor panel is connected to the radiation floor layer via the outer conductor.

8. The highly integrated radio frequency device according to claim 6, wherein: The coaxial cable includes a coaxial signal transmitting line, a coaxial signal receiving line and a coaxial power supply line. The coaxial signal transmitting line, the coaxial signal receiving line and the coaxial power supply line are arranged at intervals on the radiation floor layer and are located between the radiation floor layer and the substrate. The coaxial signal transmitting line is used to send the input RF transmitting signal to the RF circuit, the coaxial signal receiving line is used to receive the RF receiving signal output by the RF circuit and forward it to an external RF device, and the coaxial power supply line is used to output the input power supply signal to the RF circuit.

9. The highly integrated radio frequency device according to claim 5, wherein: The highly integrated radio frequency device further includes: Metal housing; The low-frequency circuit is arranged at the bottom of the metal shell, the radiation floor layer is arranged on the low-frequency circuit, and the antenna assembly, the radiation floor layer, and the low-frequency circuit are arranged in sequence along the thickness direction of the antenna assembly in the metal shell.

10. A communication system, characterized in that: The communication system includes the highly integrated radio frequency device according to any one of claims 5 to 9.

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