Manufacturing method of wire clamping circuit board, wire clamping circuit board and lamp strip

Abstract

The invention discloses a manufacturing method of a wire-clamping circuit board, the wire-clamping circuit board and a lamp strip. The wire-clamping circuit board comprises a first thin film; a metal foil line; a part of or all of the flat wire circuits are provided with gaps, so that the widths of the part of or all of the flat wire circuits are different; the second thin film is provided with a plurality of bonding pad windows; the first thin film and the second thin film are combined together, and the flat wire circuit and the metal foil circuit are clamped between the two thin films; the thickness of the flat wire circuit is greater than that of the metal foil circuit; the flat wire circuit is a main circuit, and the metal foil circuit is an auxiliary circuit, or the metal foil circuit is provided with both the main circuit and the auxiliary circuit; the main line is longer than the auxiliary line; metal exposed out of the bonding pad window is a flat wire circuit or / and a metal foil circuit. Through the design of the notches, part of positions are narrowed, but other positions can be kept wider, so that the current load is increased, and the problem of separation and layering of the thin film is solved.

Description

Technical Field

[0001] The present invention relates to a light strip technology, in particular to a method for manufacturing a wire-clamping circuit board, a wire-clamping circuit board and a light strip. Background Art

[0002] Referring to the invention disclosure document CN2017111008458, the prior art discloses a metal foil circuit and a wire circuit composite circuit board, which has the following defects:

[0003] Since the conductor circuit is a straight line, the conductor circuit with parallel conductors is set on both sides of the circuit board as the main circuit. It must maintain a certain distance from another part of the secondary circuit or all of the secondary circuits in the circuit board, otherwise it will cause a short circuit. When using circuit boards to make light strips, a larger main circuit is often required to meet the current carrying capacity of longer light strips. When the conductor circuit is larger, either the original conductor width needs to be maintained or the conductor is thickened. However, when the conductor is too thick, the upper and lower layers of adhesive films on the flexible board cannot tightly wrap the conductor circuit. The two sides of the conductor circuit cannot stick to the glue, forming a cavity. When the circuit board solders components through the furnace, the cavity gas expands due to heat, and the film will detach from the layer. Summary of the Invention

[0004] The present invention aims to solve at least one of the problems of the prior art. To this end, the present invention provides a method for manufacturing a wire-clip circuit board, a wire-clip circuit board, and a light strip. While maintaining the thickness of the flat conductor, the portions near and / or overlapping the secondary wires are cut away to create notches. This narrows the conductors at these locations while allowing other locations to remain wider, thereby increasing the current load and solving the problem of film detachment and delamination.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] In a first aspect, an embodiment of the present invention provides a method for manufacturing a wire-clip circuit board, comprising:

[0007] Making a metal foil circuit: providing a first adhesive film, bonding a metal foil to the first adhesive film, and removing unnecessary metal by die-cutting to obtain a metal foil circuit;

[0008] Bonding the flat wire: bonding the flat wire to the first adhesive film, wherein the flat wire does not overlap with the metal foil circuit, or partially overlaps with the metal foil circuit;

[0009] Making conductor notches: Adhere a waste discharge film with adhesive to the flat conductor, and use a die-cutting die to cut through the waste discharge film and the flat conductor from above. Multiple conductor blocks are cut out on the side of the flat conductor adjacent to the metal foil circuit. Pull up the waste discharge film to remove the conductor blocks. Multiple notches are formed in the flat conductor at the conductor block positions to increase the distance between the flat conductor and the metal foil circuit. The metal foil circuit and the flat conductor form a combined circuit.

[0010] Making the second adhesive film: After cutting a number of pad windows from the second adhesive film by die-cutting, the film is attached to the combined circuit to make a clamped circuit board.

[0011] The embodiment of the first aspect of the present invention has at least one of the following beneficial effects: In the embodiment of the present invention, after the flat wire is bonded to the first adhesive film, the waste discharge film with glue is bonded to the flat wire, and the waste discharge film and the flat wire are cut through from above the waste discharge film using a die-cutting die. A plurality of wire blocks are cut out on the side of the flat wire adjacent to the metal foil circuit, and the waste discharge film is pulled up to remove the wire blocks. A plurality of notches are formed at the wire block positions of the flat wire to increase the spacing between the flat wire and the metal foil circuit. The metal foil circuit and the flat wire form a combined circuit, thereby allowing the use of a wider flat wire without changing the thickness, without having to consider whether the flat wire will be close to or overlap with the secondary line. In subsequent processes, the portion close to the secondary line or / and overlapping with the secondary line will be cut off to obtain a notch. The presence of the notch makes the flat wire narrower at a local position, thereby solving the problem of avoiding short circuit with the secondary line according to the circuit design requirements, and the position where the notch is not formed can remain wider, thereby increasing the current load, solving the problem of film detachment and delamination, and improving the yield of the circuit board when soldering components.

[0012] In a second aspect, an embodiment of the present invention provides a circuit board with a wire clamp, comprising:

[0013] First film;

[0014] Metal foil circuit;

[0015] The flat wire circuit is provided with notches on part or all of the flat wire circuit, so that part or all of the flat wire circuit has different widths;

[0016] a second film having a plurality of pad windows provided thereon;

[0017] The first film and the second film are combined together to sandwich the flat wire circuit and the metal foil circuit between the two films; the thickness of the flat wire circuit is greater than the thickness of the metal foil circuit;

[0018] The flat wire circuit is a main circuit, and the metal foil circuit is a secondary circuit, or the metal foil circuit has both a main circuit and a secondary circuit;

[0019] The length of the main line is greater than the length of the secondary line;

[0020] The metal exposed in the pad window is a flat wire circuit and / or a metal foil circuit.

[0021] Optionally, the flat conductor circuit is a copper wire, a copper-clad aluminum wire, a copper-aluminum composite wire, an aluminum wire, a copper-clad iron wire or an iron wire; and the metal foil circuit is copper or a copper-aluminum composite foil.

[0022] Optionally, there are two flat wire circuits, one of which is provided with the notch; or, both flat wire circuits are provided with the notch.

[0023] Optionally, a plurality of shearing sections are provided on the circuit board, and shearing pads are provided between adjacent shearing sections, and the shearing pads are made of flat wire metal and / or metal foil.

[0024] Optionally, part of the metal foil circuit overlaps with the flat wire circuit; or the metal foil circuit and the flat wire circuit do not overlap.

[0025] Optionally, the length of the main line is greater than 0.5 meters, and the length of the secondary line is less than 0.5 meters.

[0026] Optionally, the first film, the second film, the flat wire circuit, and the metal foil circuit are bonded together by an adhesive.

[0027] In a third aspect, an embodiment of the present invention provides a light strip, comprising the wire clamping circuit board described in any one of the embodiments of the second aspect, wherein lamp beads are provided on the circuit board, and the lamp beads are soldered at the solder pad window.

[0028] The second and third aspects of the present invention have at least one of the following beneficial effects: the embodiments of the present invention provide notches on part or all of the flat wire circuits, so that part or all of the flat wire circuits have different widths; the first film and the second film are combined together to clamp the flat wire circuit and the metal foil circuit between the two films, and the thickness of the flat wire circuit is greater than the thickness of the metal foil circuit, which not only eliminates the need for an intermediate insulating film and reduces the cost of the circuit board, but also utilizes the notches to form flat wires of different widths, making full use of the bending and changing characteristics of the metal foil circuit, so that the flat wire can avoid the short circuit problem with the metal foil circuit and can also widen the flat wire circuit at a local position, abandoning the parallel wire design structure in the prior art. Without increasing the thickness of the flat wire, the current load of the flat wire is increased by widening at a local position, solving the problem of film detachment and delamination, and improving the yield rate of the circuit board when soldering components. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1.1Schematic diagram of the planar structure of a circuit board in one embodiment of the present invention (both flat conductor lines have notches);

[0030] Figure 1.2 yes Figure 1.1 The schematic diagram of the planar structure of the light strip after the circuit board is soldered with the lamp beads and resistors;

[0031] Figure 1.3 yes Figure 1.1 A schematic diagram of the planar structure of the second film on the structure shown;

[0032] Figure 1.4 yes Figure 1.1 A schematic diagram of a planar structure in which a metal foil circuit is bonded to a first film in the structure shown;

[0033] Figure 1.5 yes Figure 1.1 A schematic diagram of a planar structure in which a flat conductor circuit is bonded to a first film;

[0034] Figure 1.6 yes Figure 1.1 A schematic diagram of the circuit planar structure after the second film is torn off in the structure shown;

[0035] Figure 1.7 Is a multiple Figure 1.6 Schematic diagram of the long circuit board planar structure of the circuit shown.

[0036] Figure 2.1 It is a schematic diagram of the planar structure of a circuit board in another embodiment of the present invention (a flat wire circuit with a notch, and another flat wire circuit without a notch);

[0037] Figure 2.2 yes Figure 2.1 A schematic diagram of the planar structure of the second film on the structure shown;

[0038] Figure 2.3 yes Figure 2.1 A schematic diagram of a planar structure in which a metal foil circuit is bonded to a first film in the structure shown;

[0039] Figure 2.4 yes Figure 2.1 A schematic diagram of a planar structure in which a flat conductor circuit is bonded to a first film;

[0040] Figure 2.5 yes Figure 2.1 A schematic diagram of the circuit planar structure after the second film is torn off in the structure shown;

[0041] Figure 2.6 Is a multiple Figure 2.5 Schematic diagram of the long circuit board planar structure of the circuit shown.

[0042] Description of Figure Numbers:

[0043] 1-first film, 2-metal foil circuit, 3-flat wire circuit, 31-notch, 4-second film, 41-pad window, 5-cut pad, 6-lamp bead. DETAILED DESCRIPTION

[0044] To make the purpose, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features in the embodiments described below can be combined with each other in any manner unless there is any conflict.

[0045] Many different embodiments or examples are provided below for realizing the structure of the present invention.

[0046] See also Figure 1.1-Figure 2.6 An embodiment of the present invention provides a method for manufacturing a wire-clip circuit board, comprising:

[0047] Making a metal foil circuit: Provide a first adhesive film, which can be a PI film or a PET film with an adhesive, and adhere a metal foil (copper foil) to the first adhesive film. Remove the unnecessary metal by die-cutting to obtain a metal foil circuit 2, as shown in FIG. Figure 1.4 or Figure 2.3 As shown;

[0048] Bonding flat wire: Bond the flat wire to the first adhesive film, the flat wire does not overlap with the metal foil circuit, or partially overlaps. Figure 1.1-Figure 2.6 In the illustrated embodiment, the flat wire and the metal foil circuit partially overlap. When the flat wire and the metal foil circuit are fabricated into a light strip, they themselves need to be conductive. Therefore, the conductive connection between the two circuits can be achieved by partially overlapping the two circuits. In other embodiments, the flat wire and the metal foil circuit may not overlap. When the flat wire and the metal foil circuit are fabricated into a light strip, the conductive connection can be achieved by welding components.

[0049] Making conductor gaps: Adhere the waste discharge film with glue to the flat conductor, use a die-cutting die to cut through the waste discharge film and the flat conductor from above, cut out multiple conductor blocks on the side of the flat conductor adjacent to the metal foil circuit, pull up the waste discharge film to remove the conductor blocks, and form multiple gaps 31 at the conductor block positions of the flat conductor to increase the distance between the flat conductor and the metal foil circuit (if too close, a short circuit will be formed. It can be understood that it is not required that the flat conductor and the metal foil circuit maintain a distance at all positions, because some positions can overlap. These are determined by the circuit design). The metal foil circuit and the flat conductor form a combined circuit; it can be understood that the gap 31 can be made on only one flat conductor, such as Figure 2.1 、 Figure 2.4-Figure 2.6As shown, the notch can also be made on two flat wires, such as Figure 1.1 、 Figures 1.5-1.7 shown.

[0050] Making the second adhesive film: The film is made of PI film or PET film with adhesive. After cutting out a number of pad windows from the second adhesive film by die-cutting, it is attached to the combined circuit to make a clamped circuit board.

[0051] It can be seen from this that a wider flat wire can be used without changing the thickness, and there is no need to consider whether the flat wire will be close to or overlap with the secondary line. In subsequent processes, the part close to the secondary line and / or overlapping with the secondary line can be cut off to obtain a gap. The existence of the gap makes the flat wire narrower at a local position, thereby solving the problem of avoiding short circuit with the secondary line according to the circuit design requirements, and the position where the gap is not formed can be kept wider, thereby increasing the current load, solving the problem of film detachment and delamination, and improving the yield of the circuit board when soldering components.

[0052] The embodiment of the present invention further provides a clamped circuit board, comprising: a first film 1; a metal foil circuit 2; a flat wire circuit 3, wherein some or all of the flat wire circuits 3 are provided with notches 31, so that some or all of the flat wire circuits are of different widths; a second film 4, wherein a plurality of pad windows 41 are provided thereon; the first film 1 and the second film 4 are combined together, specifically by bonding them together with an adhesive, so that the flat wire circuit 3 and the metal foil circuit 2 are clamped between the two films, and the flat wire circuit 3 and the metal foil circuit 2 are also bonded and fixed by the adhesive; the thickness of the flat wire circuit 3 is greater than that of the metal foil circuit 1, the flat wire circuit is the main circuit, and the metal foil circuit 2 is the main circuit. The circuit is a secondary circuit, or the metal foil circuit has both a main circuit and a secondary circuit, that is, the flat wire circuit 3 as the main circuit is set to be thicker than the metal foil circuit 2 to meet the current load requirements. The flat wire circuit 3 is generally connected to the positive and negative poles of the power supply; and the metal foil circuit 2 is at least partially used as a secondary circuit to weld components. The current of a single component is small relative to the main circuit. Therefore, the metal foil circuit 2 is designed to be thinner than the main circuit, which can not only meet the current load requirements of the components, but also reduce the use of metal foil, thereby reducing manufacturing costs; the length of the main circuit is greater than the length of the secondary circuit. In this embodiment, the length of the main circuit is >0.5 meters, and the length of the secondary circuit is <0.5 meters. When the circuit board is in use, multiple secondary circuits are electrically connected to the main circuit; the metal exposed in the pad window 41 is the flat wire circuit 3 and / or the metal foil circuit 2. According to the circuit design requirements, only the metal foil circuit 2 can be exposed in a single pad window 41, such as Figure 1.1 A single pad window 41 may also only expose the flat wire circuit 3, such as Figure 1.1a single pad window 41 can also expose both the flat wire circuit 3, and exposed metal foil circuit 2, such as Figure 1.1 Pad c in.

[0053] In some embodiments of the present invention, the flat wire circuit 3 is copper wire, copper-clad aluminum wire, copper-aluminum composite wire, aluminum wire, copper-clad iron wire or iron wire; the metal foil circuit 2 is copper or copper-aluminum composite foil.

[0054] In some embodiments of the present invention, a plurality of shearing sections are provided on the circuit board, and shearing pads 5 are provided between adjacent shearing sections. According to the circuit design, the shearing pads 5 are flat wire metal and / or metal foil metal.

[0055] An embodiment of the present invention further provides a light strip, comprising the wire clamping circuit board described in any embodiment of the second aspect, wherein lamp beads 6 are provided on the circuit board, and the lamp beads 6 are soldered at the soldering pad window.

[0056] As can be seen from the above structure, the embodiment of the present invention provides a notch 31 on part or all of the flat wire circuit 3, so that part or all of the flat wire circuit 3 has different widths; the first film 1 and the second film 4 are combined together to clamp the flat wire circuit 3 and the metal foil circuit 2 between the two films. The thickness of the flat wire circuit 3 is greater than the thickness of the metal foil circuit 2, which not only eliminates the use of an intermediate insulating film and reduces the cost of the circuit board, but also uses the notch 31 to form flat wires of different widths, making full use of the bending and change characteristics of the metal foil circuit, so that the flat wire can avoid the short circuit problem with the metal foil circuit and can widen the flat wire circuit at a local position, abandoning the parallel wire design structure in the prior art. Without increasing the thickness of the flat wire, the current load of the flat wire is increased by widening the local position, solving the problem of film detachment and delamination, and improving the yield rate of the circuit board when soldering components.

[0057] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the scope of the present invention.

Claims

1. A method for manufacturing a wire-clamping circuit board, characterized in that: include: Making a metal foil circuit: providing a first adhesive film, bonding a metal foil to the first adhesive film, and removing unnecessary metal by die-cutting to obtain a metal foil circuit; Bonding the flat wire: bonding the flat wire to the first adhesive film, wherein the flat wire does not overlap with the metal foil circuit, or partially overlaps with the metal foil circuit; Making conductor notches: Adhere a waste discharge film with adhesive to the flat conductor, and use a die-cutting die to cut through the waste discharge film and the flat conductor from above. Multiple conductor blocks are cut out on the side of the flat conductor adjacent to the metal foil circuit. Pull up the waste discharge film to remove the conductor blocks. Multiple notches are formed in the flat conductor at the conductor block positions to increase the distance between the flat conductor and the metal foil circuit. The metal foil circuit and the flat conductor form a combined circuit. Making the second adhesive film: After cutting a number of pad windows from the second adhesive film by die-cutting, the film is attached to the combined circuit to make a clamping circuit board.

2. A clamping circuit board, characterized in that: include: First film; Metal foil circuit; The flat wire circuit is provided with notches on part or all of the flat wire circuit, so that part or all of the flat wire circuit has different widths; a second film having a plurality of pad windows provided thereon; The first film and the second film are combined together to sandwich the flat wire circuit and the metal foil circuit between the two films; the thickness of the flat wire circuit is greater than the thickness of the metal foil circuit; The flat wire circuit is a main circuit, and the metal foil circuit is a secondary circuit, or the metal foil circuit has both a main circuit and a secondary circuit; The length of the main line is greater than the length of the secondary line; The metal exposed in the pad window is a flat wire circuit and / or a metal foil circuit.

3. The circuit board according to claim 2, characterized in that: The flat conductor circuit is copper wire, copper-clad aluminum wire, copper-aluminum composite wire, aluminum wire, copper-clad iron wire or iron wire; the metal foil circuit is copper or copper-aluminum composite foil.

4. The circuit board according to claim 2, characterized in that: There are two flat wire circuits, one of which is provided with the notch; or both flat wire circuits are provided with the notch.

5. The circuit board according to claim 2, characterized in that: The circuit board is provided with a plurality of shearing sections, and shearing pads are provided between adjacent shearing sections. The shearing pads are made of flat wire metal and / or metal foil.

6. The circuit board with a wire clamp according to claim 5, characterized in that: Part of the metal foil circuit overlaps with the flat wire circuit; or the metal foil circuit does not overlap with the flat wire circuit.

7. The circuit board with a wire clamp according to claim 2, characterized in that: The length of the main line is greater than 0.5 meters, and the length of the secondary line is less than 0.5 meters.

8. The circuit board with a wire clamp according to claim 2, characterized in that: The first film, the second film, the flat wire circuit and the metal foil circuit are bonded together by adhesive.

9. A light strip, characterized in that: The invention comprises the wire clamping circuit board according to any one of claims 2 to 8, wherein a lamp bead is provided on the circuit board and the lamp bead is welded at the soldering pad window.

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