Display panel, preparation method thereof and display device

Abstract

The application relates to the technical field of display, and particularly provides a display panel, a preparation method thereof and a display device. The display panel comprises an array substrate, an isolation structure, an adhesion layer and a first encapsulation layer. The isolation structure is located on one side of the array substrate, the isolation structure is surrounded to form a plurality of isolation openings, and the isolation structure has a first side wall on the side facing the isolation openings. At least part of the adhesion layer is located on the side of the isolation structure facing the isolation openings and covers part of the surface of the first side wall. The adhesion layer is a discontinuous film layer and comprises a plurality of island-shaped film layers arranged at intervals. The first encapsulation layer comprises a plurality of encapsulation units. The encapsulation units are arranged one by one and cover the isolation openings. Any one of the encapsulation units is connected with the first side wall through the adhesion layer. The application is used for improving the process performance of the display panel to a certain extent.

Description

Technical Field

[0001] This application belongs to the field of display technology, and more specifically, relates to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-illumination, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, the current manufacturing process of OLED display panels needs improvement. Summary of the Invention

[0005] This application provides a display panel and its manufacturing method, as well as a display device, to improve the process performance of the display panel to at least a certain extent.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows: In a first aspect, this application provides a display panel, including an array substrate, an isolation structure, an adhesive layer, and a first encapsulation layer. The isolation structure is located on one side of the array substrate and forms a plurality of isolation openings. The isolation structure has a first sidewall on the side facing the isolation openings. At least a portion of the adhesive layer is located on the side of the isolation structure facing the isolation openings and covers a portion of the surface of the first sidewall. The adhesive layer is a discontinuous film layer, including a plurality of spaced island-shaped film layers. The first encapsulation layer includes a plurality of encapsulation units, each encapsulation unit being disposed in a one-to-one correspondence with and covering the isolation openings. Any one of the encapsulation units is connected to the first sidewall through the adhesive layer.

[0007] In the display panel provided in this application embodiment, by providing an adhesive layer that is at least partially located on the first sidewall, the connection strength between the first encapsulation layer and the first sidewall of the isolation structure can be effectively improved, thereby improving the film peeling problem that may occur between the first sidewall of the isolation structure and the first encapsulation layer, thereby improving the encapsulation strength of the first encapsulation layer for the isolation opening, and improving the display abnormality caused by poor encapsulation effect, thereby improving the process performance and processing yield of the display panel.

[0008] Optionally, the thickness of the adhesion layer along the normal direction of the first sidewall surface is less than or equal to 50 nm.

[0009] Optionally, the thickness of the adhesion layer is greater than or equal to 5 nm.

[0010] Optionally, the thickness of the adhesion layer is greater than or equal to 15 nm.

[0011] Optionally, the thickness of the adhesion layer is less than or equal to 30 nm.

[0012] Optionally, both the adhesive layer and the first encapsulation layer are made of inorganic materials.

[0013] Optionally, the oxygen content of the material of the adhesion layer is greater than the oxygen content of the material of the first encapsulation layer.

[0014] Optionally, the material of the adhesive layer includes at least one of silicon oxide and silicon oxynitride.

[0015] Optionally, the material of the adhesion layer may also include silicon nitride.

[0016] Optionally, the material of the first encapsulation layer includes at least one of silicon oxide, silicon oxynitride, and silicon nitride.

[0017] Optionally, the isolation structure includes a first isolation portion and a second isolation portion stacked together, the second isolation portion being located on the side of the first isolation portion facing away from the array substrate, and the first isolation portion and the second isolation portion forming the isolation opening;

[0018] Wherein, the orthographic projection of the first isolation portion on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate;

[0019] The first isolation portion includes a first isolation sub-portion and a second isolation sub-portion, wherein the second isolation sub-portion is located on the side of the first isolation sub-portion facing away from the array substrate;

[0020] Wherein, the orthographic projection of the second isolation sub-part on the array substrate is located within the orthographic projection of the first isolation sub-part on the array substrate.

[0021] Optionally, the orthographic projection of one end of the second isolation sub-part near the second isolation portion on the array substrate is located within the orthographic projection of one end of the second isolation sub-part near the first isolation sub-part on the array substrate.

[0022] Optionally, the material of the first isolation sub-part includes at least one of molybdenum, titanium, titanium nitride, molybdenum-tungsten alloy, or molybdenum-niobium alloy.

[0023] Optionally, the material of the second isolation sub-section includes at least one of aluminum and aluminum alloys.

[0024] Optionally, the material of the second isolation sub-section includes at least one of aluminum, aluminum-neodymium alloy, aluminum-yttrium alloy, and aluminum-silicon alloy.

[0025] Optionally, the material of the second isolation part includes at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, and molybdenum-niobium alloy.

[0026] Optionally, the second isolation section is a laminated structure.

[0027] Optionally, at least a portion of the first sidewall has a smooth sidewall, through which the adhesive layer is connected to the first sidewall.

[0028] Optionally, the first isolation portion has the smooth sidewall on the side facing the isolation opening.

[0029] Optionally, the second isolation sub-part has the smooth sidewall on the side facing the isolation opening.

[0030] Optionally, the display panel further includes a plurality of light-emitting elements, the light-emitting elements being located on one side of the array substrate and confined within the isolation opening, and the first encapsulation layer being located on the side of the light-emitting elements facing away from the array substrate.

[0031] Optionally, the light-emitting element is provided in a one-to-one correspondence with the isolation opening.

[0032] Optionally, within at least a portion of the isolation opening, the portion of the first encapsulation layer covering the isolation structure closes with the portion covering the light-emitting element to form a chamber.

[0033] Optionally, at least a portion of the chambers is an annular structure.

[0034] Optionally, the first encapsulation layer includes:

[0035] The first encapsulation portion is located within the isolation opening and covers the side of the light-emitting element facing away from the array substrate;

[0036] The second packaging portion is at least partially located on the side of the isolation structure facing away from the array substrate;

[0037] The third encapsulation part is located on the side of the isolation structure facing the isolation opening, and the third encapsulation part is connected to the adhesive layer and covers the first sidewall;

[0038] Wherein, along a direction perpendicular to the plane where the array substrate is located, the two ends of the third packaging part are respectively connected to the first packaging part and the second packaging part.

[0039] Optionally, a portion of the adhesive layer contacts the side surface of the second encapsulation portion facing the array substrate.

[0040] Optionally, along a direction perpendicular to the plane of the array substrate, the second package portion is suspended on the side surface of the isolation structure facing away from the array substrate.

[0041] Optionally, the third encapsulation portion and the first encapsulation portion enclose and form a cavity.

[0042] Optionally, the chamber has an annular structure.

[0043] Optionally, a portion of the adhesive layer is located between the light-emitting element and the first encapsulation layer.

[0044] Optionally, the light-emitting element includes a first electrode, a light-emitting functional layer, and a second electrode stacked together.

[0045] Optionally, the second electrode overlaps with the sidewall of the isolation structure facing the isolation opening.

[0046] Optionally, the display panel further includes a pixel definition layer located between the array substrate and the isolation structure. The pixel definition layer has a pixel opening that communicates with the isolation opening, and the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate.

[0047] Optionally, the first electrode is located between the array substrate and the pixel definition layer, at least a portion of the surface of the first electrode facing away from the array substrate is exposed through the pixel opening, the light-emitting functional layer covers the pixel opening and is in contact with the first electrode, and the second electrode covers the surface of the light-emitting functional layer facing away from the array substrate.

[0048] Optionally, the light-emitting element includes a plurality of first elements, a plurality of second elements, and a plurality of third elements, and the isolation opening includes a plurality of first openings, a plurality of second openings, and a plurality of third openings, wherein the first opening is used to accommodate the first element, the second opening is used to accommodate the second element, and the third opening is used to accommodate the third element;

[0049] Among them, any two of the first element, the second element, and the third element emit different colors.

[0050] Optionally, the display panel further includes a second encapsulation layer, at least a portion of which is located on the side of the first encapsulation layer facing away from the array substrate.

[0051] Optionally, the material of the second encapsulation layer includes organic materials.

[0052] Optionally, the display panel further includes a third encapsulation layer located on the side of the second encapsulation layer facing away from the array substrate.

[0053] Optionally, the material of the third encapsulation layer includes inorganic materials.

[0054] Optionally, the material of the third encapsulation layer is the same as the material of the first encapsulation layer.

[0055] In a second aspect, this application also provides a method for manufacturing a display panel, the method comprising:

[0056] An isolation structure is fabricated on one side of an array substrate, the isolation structure enclosing a plurality of isolation openings, and the side of the isolation structure facing the isolation openings has a first sidewall;

[0057] A light-emitting element is fabricated within the isolation opening;

[0058] An adhesive material layer is prepared on one side of the isolation structure. The adhesive material layer is a discontinuous film layer, including a plurality of spaced island-shaped film layers. The adhesive material layer covers at least a portion of the surface of the first sidewall and covers the surface of the light-emitting element facing away from the array substrate.

[0059] A first encapsulation material layer is prepared on one side of the isolation structure;

[0060] The first encapsulation material layer and the adhesive material layer are patterned to obtain an adhesive layer and a first encapsulation layer. The first encapsulation layer covers the isolation opening and is connected to the first sidewall through the adhesive layer.

[0061] In the display panel manufacturing method provided in this application embodiment, an adhesion layer can be added before the first encapsulation layer is prepared. The adhesion layer can effectively improve the adhesion between the first sidewall of the isolation structure and the first encapsulation layer, thereby effectively reducing the probability of peeling defects between the first encapsulation layer and the isolation structure and effectively improving problems such as display dark spot abnormalities caused by such defects. This achieves the effect of improving the display panel process performance and increasing the display panel manufacturing yield.

[0062] Optionally, the light-emitting element has a first element, a second element, and a third element with different light-emitting colors; the isolation opening includes a first opening, a second opening, and a third opening, wherein the first opening is used to accommodate the first element, the second opening is used to accommodate the second element, and the third opening is used to accommodate the third element; the step of fabricating the isolation structure on one side of the array substrate includes:

[0063] An isolation material layer is prepared on one side of the array substrate;

[0064] The isolation material layer is patterned to obtain an isolation structure with the first opening, and the isolation structure has the first sidewall on the side facing the first opening.

[0065] Optionally, the step of fabricating an isolation structure on one side of the array substrate further includes:

[0066] The first element is prepared within the first opening;

[0067] An adhesive material layer is prepared on one side of the isolation structure. The adhesive material layer is a discontinuous film layer, including a plurality of spaced island-shaped film layers. The adhesive material layer covers at least a portion of the surface of the first sidewall and covers the surface of the light-emitting element facing away from the array substrate.

[0068] A first encapsulation material layer is prepared on one side of the isolation structure;

[0069] The first encapsulation material layer and the adhesive material layer are patterned to obtain the adhesive layer and the first encapsulation layer. The first encapsulation layer covers the first opening and is connected to the first sidewall through the adhesive layer.

[0070] The isolation structure is graphically processed to obtain an isolation structure with a second opening, and the isolation structure has a first sidewall on the side facing the second opening.

[0071] Optionally, the step of fabricating an isolation structure on one side of the array substrate further includes:

[0072] The second element is prepared within the second opening;

[0073] An adhesive material layer is prepared on one side of the isolation structure. The adhesive material layer is a discontinuous film layer, including a plurality of spaced island-shaped film layers. The adhesive material layer covers at least a portion of the surface of the first sidewall and covers the surface of the light-emitting element facing away from the array substrate.

[0074] A first encapsulation material layer is prepared on one side of the isolation structure;

[0075] The first encapsulation material layer and the adhesive material layer are patterned to obtain the adhesive layer and the first encapsulation layer. The first encapsulation layer covers the second opening and is connected to the first sidewall through the adhesive layer.

[0076] The isolation structure is graphically processed to obtain an isolation structure with the third opening, and the isolation structure has the first sidewall on the side facing the third opening.

[0077] Optionally, the step of preparing an adhesive material layer on one side of the isolation structure includes:

[0078] Multiple discrete island-shaped film layers are formed on one side of the isolation structure using a vapor phase deposition method, and the multiple island-shaped film layers constitute the adhesion layer.

[0079] Optionally, the vapor deposition includes chemical vapor deposition.

[0080] In a third aspect, this application also provides a display device comprising the display panel described in any one of the foregoing claims, or comprising the display panel prepared by the preparation method described in any one of the foregoing claims.

[0081] The display device provided in this application includes the above-mentioned display panel and / or the method for preparing the display panel. Therefore, the display device has at least the beneficial effects of any one or more of the above-mentioned display panels. The specific effects are as described above and will not be repeated here.

[0082] The beneficial effects of the display panel, the method for manufacturing the display panel, and the display device provided in this application are as follows: Compared with related technologies, the display panel provided in this application can effectively improve the adhesion between the first encapsulation layer and the isolation structure through an adhesion layer composed of island-shaped film layers located between the first encapsulation layer and the first sidewall of the isolation structure. This improves the encapsulation reliability of the first encapsulation layer for the corresponding isolation opening, thereby reducing the probability of dark spot defects in the display panel caused by peeling defects between the first encapsulation layer and the first sidewall. This effectively optimizes the process performance of the display panel and ultimately achieves the goal of improving the display reliability and processing yield of the display panel. Attached Figure Description

[0083] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application, and therefore should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0084] Figure 1This is a schematic diagram of the planar structure of the display panel provided in an embodiment of this application;

[0085] Figure 2 for Figure 1 The image shows an enlarged view of the structure of area S in the display panel.

[0086] Figure 3 for Figure 2 The diagram shows a cross-sectional structure of the film layer in the AA direction of the display panel.

[0087] Figure 4 A schematic diagram showing the distribution of the adhesive layer on the first sidewall in a display panel provided in an embodiment of this application;

[0088] Figure 5 for Figure 4 A schematic diagram of the cross-sectional structure of the adhesion layer in the DD direction;

[0089] Figure 6 for Figure 3 Enlarged view of the structure of region C;

[0090] Figure 7 This is a schematic diagram of the structure of a certain light-emitting functional layer in a display panel provided in an embodiment of this application;

[0091] Figure 8 This is a schematic diagram of the structure of the array substrate in the display panel provided in the embodiments of this application;

[0092] Figure 9 This is a pixel circuit diagram of a display panel provided in an embodiment of this application;

[0093] Figure 10 for Figure 2 The diagram shows a cross-sectional structure of a portion of the film layer along the BB direction of the display panel.

[0094] Figure 11 This is a flowchart illustrating the method for manufacturing a display panel according to an embodiment of this application.

[0095] Figures 12A-12E A schematic diagram illustrating the manufacturing process of the display panel provided in an embodiment of this application;

[0096] Figure 13 This is a schematic diagram of the structure of the display device provided in the embodiments of this application.

[0097] The following are the labeling elements in the figure:

[0098] 100. Display device; 10. Display panel;

[0099] 1. Array substrate; 11. Transistor; 12. Planarization layer; 2. Isolation structure; 21. First isolation portion; 211. First isolation sub-portion; 212. Second isolation sub-portion; 22. Second isolation portion; 201. Isolation opening; 2011. First opening; 2012. Second opening; 2013. Third opening; 202. First sidewall; 2021. Smooth sidewall; 3. Adhesion layer; 301. Island film layer; 3'. Adhesion material layer; 4. First encapsulation layer; 401. Chamber; 41. First encapsulation portion; 42. Second encapsulation portion; 43. Third encapsulation portion; 4'. First encapsulation material layer; 5. Light-emitting element; 51. First electrode; 52. Light-emitting functional layer; 53. Second electrode; 501. First element; 502. Second element; 503. Third element; 6. Pixel definition layer; 601. Pixel opening; 7. Second encapsulation layer; 8. Third encapsulation layer. Detailed Implementation

[0100] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0101] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0102] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0103] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0104] For certain elements, terms such as "above" or "over" are sometimes used when describing the position of an element located in the Z direction, and "below" or "under" are used when describing the position of an element located in the opposite direction. Furthermore, when using terms such as "above," "over," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by a gap or other elements. Moreover, "above," "over," or "on top" of the first feature relative to the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "under," or "beneath" of the first feature relative to the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature. Furthermore, the terms "first," "second," and "third," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature specified as "first" or "second" can explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically defined.

[0105] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0106] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between components; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0107] The term "layer" as used herein can refer to a portion of material comprising a material of a certain thickness. A layer may extend along an entire underlying or overlying structure, or may have a smaller extent than the underlying or overlying structure. Furthermore, a layer may be a region of a homogeneous or non-homogeneous continuous structure, with a thickness less than the thickness of that continuous structure. For example, a layer may be located between the top and bottom surfaces of the continuous structure, or between any pairs of lateral planes at the top and bottom surfaces. A layer may extend laterally, vertically, and / or along a tapered surface. An array substrate may be a layer, and may include one or more layers, and / or may have one or more layers located on, above, and / or below it. A layer may include multiple layers. For example, an interconnect layer may include one or more conductor and contact layers (forming contacts, interconnects, and / or vias therein) and one or more dielectric layers.

[0108] In related technologies, the display panel can be an organic light-emitting diode (OLED) display panel or a quantum dot light-emitting diode (QLED) display panel. The display panel incorporates an isolation structure; please refer to [link / reference]. Figure 1 This isolation structure can be used to isolate some functional film layers in adjacent light-emitting elements (also known as light-emitting devices), ensuring that adjacent light-emitting elements do not interfere with each other, thus helping to improve the display effect of the display panel. However, in related technologies, it has been found that some light-emitting elements fail, leading to dark spot problems in the display panel, which to some extent affects the reliability and yield of the display panel. This application, through research, found that the failure of light-emitting elements in the display panel is due to the electrode failing to connect with the isolation structure, causing the light-emitting element to be unable to conduct with the corresponding pixel circuit, thus affecting the normal lighting of the light-emitting element and causing dark spot failure.

[0109] Based on this, the present application provides a display panel 10 and its manufacturing method, and a display device 100, to at least alleviate or improve the above-mentioned technical problems to a certain extent, and to achieve the purpose of improving the process performance of the display panel 10.

[0110] This application embodiment provides a display panel 10, please refer to... Figures 1-3 The display panel 10 includes an array substrate 1, an isolation structure 2, an adhesive layer 3, and a first encapsulation layer 4, wherein the isolation structure 2, the adhesive layer 3, and the first encapsulation layer 4 are all located on the same side of the array substrate 1.

[0111] Specifically, the isolation structure 2 is located on one side of the array substrate 1 and encloses a plurality of isolation openings 201. The side of the isolation structure 2 facing the isolation openings 201 has a first sidewall 202. At least a portion of the adhesive layer 3 is located on the side of the isolation structure 2 facing the isolation openings 201 and covers at least a portion of the surface of the first sidewall 202. The first encapsulation layer 4 includes a plurality of encapsulation units, each encapsulation unit being disposed in a one-to-one correspondence with the isolation openings 201 and covering the isolation openings 201. Any encapsulation unit is connected to the first sidewall 202 through the adhesive layer 3.

[0112] Please see Figure 3 In the figure, the adhesion layer 3 is only used to indicate its arrangement and distribution range, and is not used to limit the actual structure of the adhesion layer 3. It should be noted that the adhesion layer 3 provided in this embodiment is a discontinuous film layer. Along its extension direction, part of the adhesion layer 3 is broken, so that some film layers / materials constituting the adhesion layer 3 are independently arranged and form an island-like structure, ultimately forming an island-like film layer 301. Multiple island-like film layers 301 in a discrete state are arranged at intervals, forming a discontinuous adhesion layer 3 on the surface of the first sidewall 202. Please refer to [link to relevant documentation]. Figure 4 and Figure 5 .

[0113] In the display panel 10 provided in this application embodiment, the adhesive layer 3 can be used to firmly bond the encapsulation unit to the corresponding isolation opening 201 through the first sidewall 202, thereby improving the film peeling problem that may occur between the first sidewall 202 of the isolation structure 2 and the first encapsulation layer 4, thereby improving the encapsulation firmness of the first encapsulation layer 4 to the isolation opening 201, and improving the display abnormality caused by poor encapsulation effect, thereby improving the process performance and processing yield of the display panel 10.

[0114] When the encapsulation unit can be firmly bonded to the first sidewall 202 through the adhesive layer 3, the encapsulation unit needs to overcome a greater peeling force to peel off from the first sidewall 202 under the action of the adhesive layer 3. Therefore, the bonding strength between the encapsulation unit and the first sidewall 202 of the isolation structure 2 is significantly enhanced. At this time, the corresponding film layer of the light-emitting element 5 covered by and in contact with the encapsulation unit (e.g., the second electrode 53 described below) can also be reliably connected to the first sidewall 202. At this time, the possibility of the corresponding film layer of the light-emitting element 5 being peeled off from the first sidewall 202 of the isolation structure 2 due to the pulling / traction of the encapsulation unit connected to it is significantly reduced. Therefore, the light-emitting element 5 can be reliably connected (overlapped) with the first sidewall 202 of the isolation structure 2, and the bonding strength between the light-emitting element 5 and the isolation structure 2 is ultimately improved, reducing the possibility of dark spot failure of the light-emitting element 5 due to the electrode failing to overlap with the isolation structure 2 and maintain electrical connection. In addition, since the packaging unit improves the bonding strength with the first sidewall 202 through the adhesion layer 3, it can also effectively improve the packaging reliability of the packaging unit and reduce the possibility of moisture and etching liquid entering the light-emitting element 5 through the gap between the packaging unit and the isolation opening 201, thus providing better packaging and protection for the light-emitting element 5.

[0115] Please see Figure 3 and Figure 5 Along the direction of the surface normal of the first sidewall 202 (i.e., the direction perpendicular to the first sidewall 202), the thickness of the adhesion layer 3 is less than or equal to 50 nm.

[0116] Specifically, the thickness of the adhesion layer 3 can be set to be between 5nm and 50nm; further, the thickness of the adhesion layer 3 can be set to be between 15nm and 30nm.

[0117] For example, the thickness of the adhesion layer 3 can be set to any value among 5nm, 10nm, 15nm, 20nm, 25nm, 30nm, 35nm, 40nm, 45nm, 50nm, etc.

[0118] When the adhesive layer 3 is attached to the first sidewall 202 of the isolation structure 2, the adhesive layer 3 can serve as a bonding interface to increase the roughness of the surface of the first sidewall 202, so that the first encapsulation layer 4 prepared subsequently can be firmly bonded to the first sidewall 202 through the adhesive layer 3, thereby reducing the possibility of the first encapsulation layer 4 being peeled off from the first sidewall 202 of the isolation structure 2 due to external forces.

[0119] To ensure a strong bond between the encapsulation layer and the adhesion layer 3, both the adhesion layer 3 and the first encapsulation layer 4 can be made of inorganic materials with similar properties. Since both the adhesion layer 3 and the first encapsulation layer 4 consist of inorganic materials with similar properties, the surface energy of both layers is high. This allows for improved adhesion through the use of relatively similar materials. Furthermore, the overall coefficients of thermal expansion of the two layers are also similar, effectively reducing stress.

[0120] In some embodiments, the oxygen content of the material of the adhesion layer 3 may be set to be greater than the oxygen content of the material of the first encapsulation layer 4.

[0121] Specifically, the material of the adhesive layer 3 includes at least one of silicon oxide and silicon oxynitride; in some cases, the material of the adhesive layer 3 also includes silicon nitride; the material of the first encapsulation layer 4 includes at least one of silicon oxide, silicon oxynitride and silicon nitride.

[0122] Because the material composition of the adhesion layer 3 prepared by the above materials is similar to that of the first encapsulation layer 4, the two can be firmly bonded under the action of forces such as chemical bonds, and form a double-layer structure visible under microscopic conditions.

[0123] In this embodiment, both the adhesion layer 3 and the first encapsulation layer 4 can be formed by vapor deposition (e.g., chemical vapor deposition CVD) to effectively encapsulate the light-emitting element 5 located within the corresponding isolation opening 201. The adhesion layer 3 can be prepared using an island-like coating process, employing an island-like growth (Volmer-Weber type) method. In this process, the atoms or molecules of the deposited material tend to bond together rather than to the atoms of the first sidewall 202. Consequently, the wettability between the deposited material and the interface (i.e., the surface of the first sidewall 202) is poor, allowing for the growth of multiple discrete island-like film layers 301.

[0124] Please see Figure 2 and Figure 3 The first encapsulation layer 4 includes multiple encapsulation units, which are arranged corresponding to the isolation opening 201 and encapsulate and protect the light-emitting element 5 located in the isolation opening 201.

[0125] In some embodiments, the first encapsulation layer 4 includes a first encapsulation portion 41, a second encapsulation portion 42, and a third encapsulation portion 43. The first encapsulation portion 41 is located within the isolation opening 201 and covers the side of the light-emitting element 5 facing away from the array substrate 1. At least a portion of the second encapsulation portion 42 is located on the side of the isolation structure 2 facing away from the array substrate 1. The third encapsulation portion 43 is located on the side of the isolation structure 2 facing the isolation opening 201 and can cover the first sidewall 202 through the adhesion layer 3. In a direction perpendicular to the plane of the array substrate 1 (i.e., the Z direction), the two ends of the third encapsulation portion 43 are respectively connected to the first encapsulation portion 41 and the second encapsulation portion 42 to form a continuous encapsulation unit.

[0126] Please see Figure 3 The third encapsulation part 43 can be tightly attached to and firmly connected to the first sidewall 202 by the adhesive layer 3 covering part of the surface of the first sidewall 202; at the same time, part of the adhesive layer 3 is located on the side of the light-emitting element 5 facing away from the array substrate 1 and is in contact with the side of the first encapsulation part 41 facing the array substrate 1, and part of the adhesive layer 3 is in contact with the surface of the second encapsulation part 42 facing the array substrate 1.

[0127] At this time, the orthographic projection of the adhesive layer 3 on the array substrate 1 can coincide with the orthographic projection of the first encapsulation layer 4 on the array substrate 1. Alternatively, the orthographic projection of the adhesive layer 3 on the array substrate 1 is located within the orthographic projection of the first encapsulation layer 4 on the array substrate 1. The first encapsulation layer 4 is firmly bonded to the first sidewall 202 of the isolation structure 2 through the adhesive layer 3, so as to reduce the probability of dark spot defects in the light-emitting element 5 caused by the peeling of the first encapsulation layer 4 from the first sidewall 202 of the isolation structure 2.

[0128] Please see Figure 3 Along the direction perpendicular to the plane where the array substrate 1 is located, the second packaging part 42 is suspended on the side surface of the isolation structure 2 that faces away from the array substrate 1.

[0129] During the deposition of the first encapsulation layer 4, the encapsulation material constituting the first encapsulation layer 4 gradually deposits and thickens on the surfaces of the isolation structure 2 and the light-emitting element 5 until the deposition is complete. During the deposition process, the first encapsulation layer 4 encloses and forms an open cavity in the portion near the first sidewall 202 of the isolation structure 2. As the material deposition thickness gradually increases, the size of the opening gradually decreases, preventing the encapsulation material from entering the cavity until the cavity is completely closed.

[0130] Please see Figure 3 Within at least a partial isolation opening 201, the portion of the first encapsulation layer 4 covering the isolation structure 2 closes with the portion covering the light-emitting element 5 to form a chamber 401.

[0131] In this embodiment, the side of the first encapsulation portion 41 facing away from the array substrate 1 and the side of the third encapsulation portion 43 facing away from the isolation structure 2 can be at least partially connected to each other to enclose and form the aforementioned cavity 401. At least a portion of the cavity 401 can be an annular structure, and the other portion can be a strip structure. The strip-shaped cavity 401 can be a straight line, an arc, or a curved structure without any special rules.

[0132] Specifically, the third encapsulation portion 43 may include a first sub-portion and a second sub-portion connected together. The first sub-portion is located within the isolation opening 201 and is disposed towards the center of the isolation opening 201 in a direction parallel to the plane of the array substrate 1. At least a portion of the second sub-portion is located within the isolation opening 201 and is disposed towards the direction of the array substrate 1. The first sub-portion is used to connect with the first encapsulation portion 41, and the second sub-portion is used to connect with the second encapsulation portion 42. As the first encapsulation layer 4 is fabricated, the end of the second sub-portion used to connect with the second encapsulation portion 42 gradually thickens until it contacts the first encapsulation portion 41. At this time, the second sub-portion and the first encapsulation portion 41 can enclose and form the closed cavity 401 described above.

[0133] The sealed chamber 401 helps to prevent the intrusion of etching liquids and other substances used in subsequent processes, so as to better protect the light-emitting element 5 located in the isolation opening 201.

[0134] Please see Figure 2 and Figure 3 The display panel 10 includes a plurality of light-emitting elements 5, which are located on one side of the array substrate 1 and confined within the isolation opening 201. The first encapsulation layer 4 is located on the side of the light-emitting elements 5 facing away from the array substrate 1.

[0135] Specifically, the light-emitting element 5 can be set one-to-one with the isolation opening 201. The isolation structure 2 can limit the light-emitting element 5 through the isolation opening 201, thereby freeing the light-emitting element 5 from the limitation of the fine mask plate, which helps to reduce the spacing between two adjacent light-emitting elements 5, thereby helping to improve the pixel arrangement density of the display panel 10.

[0136] In order to limit the position of the light-emitting element 5 and to isolate the related film layers constituting the light-emitting element 5, while enabling the packaging unit to achieve a better packaging effect for the light-emitting element 5, the overall cross-sectional shape of the isolation structure 2 formed between two adjacent isolation openings 201 in the direction perpendicular to the plane of the array substrate 1 is similar to a rectangular or trapezoidal structure. Alternatively, its cross-sectional shape can also present a "wider at the top and narrower at the bottom" shape, i.e., an inverted trapezoid, with the side facing away from the array substrate 1 protruding relative to the side facing closer to the array substrate 1. This shape of the isolation structure 2 is also called "suspended".

[0137] The isolation structure 2 can be a single-layer structure or a multi-layer structure. When the isolation structure 2 is a multi-layer structure, the different membrane layers constituting the isolation structure 2 are made of different materials.

[0138] In some embodiments, the isolation structure 2 is a stacked structure; please refer to [link / reference]. Figure 3 and Figure 6 The isolation structure 2 includes a first isolation portion 21 and a second isolation portion 22 arranged in layers. The second isolation portion 22 is located on the side of the first isolation portion 21 facing away from the array substrate 1 along a direction perpendicular to the plane of the array substrate 1 (i.e., the Z direction). The first isolation portion 21 and the second isolation portion 22 enclose each other to form an isolation opening 201.

[0139] Please see Figure 3 The orthographic projection of the first isolation portion 21 on the array substrate 1 is located within the orthographic projection of the second isolation portion 22 on the array substrate 1. At this time, the size of the second isolation portion 22 in the direction perpendicular to Z is larger than the size of the first isolation portion 21 in the same direction, thereby making the first isolation portion 21 and the second isolation portion 22 form the suspended structure described above.

[0140] Specifically, the first isolation section 21 can be a single-layer structure or a multi-layer structure. When the first isolation section 21 is a multi-layer structure, it includes a first isolation sub-section 211 and a second isolation sub-section 212 stacked together. Please refer to [link / reference]. Figure 3 and Figure 6 The second isolation sub-part 212 is located on the side of the first isolation sub-part 211 facing away from the array substrate 1; wherein the orthographic projection of the second isolation sub-part 212 on the array substrate 1 is located within the orthographic projection of the first isolation sub-part 211 on the array substrate 1.

[0141] At this time, the isolation structure 2 can form an undercut structure in which the portion near the array substrate 1 tapers towards the center compared to the portion away from the array substrate 1. This undercut structure can cause the film layer constituting the light-emitting element 5 to be broken at this point during the fabrication of the display panel 10, thereby making the film layers located in two adjacent isolation openings 201 independent film layers, so that each different light-emitting element 5 can be controlled independently. At the same time, the isolation structure 2 can also eliminate the need for a mask when fabricating the film layers constituting the light-emitting element 5 in the display panel 10, thereby helping to reduce processing costs.

[0142] In some embodiments, the second isolation sub-part 212 located between the first isolation sub-part 211 and the second isolation part 22 has a rectangular or trapezoidal structure.

[0143] Specifically, the second isolation sub-section 212 has a trapezoidal structure. The orthographic projection of the end of the second isolation sub-section 212 near the second isolation section 22 on the array substrate 1 is located within the orthographic projection of the end of the second isolation sub-section 212 near the first isolation sub-section 211 on the array substrate 1.

[0144] The sidewall of the second isolation sub-part 212 near the isolation opening 201 is offset away from the center of the isolation opening 201 relative to the sidewall of the second isolation part 22 and the sidewall of the first isolation sub-part 211 near the isolation opening 201, so as to further form an undercut structure between the second isolation sub-part 212 and the second isolation part 22.

[0145] Of course, in other similar embodiments, the shape of the isolation structure 2 can also be adapted to the processing requirements.

[0146] In this embodiment, the second isolation portion 22 and the second isolation sub-portion 212 are made of different materials, and the etching rate of the second isolation portion 22 is less than the etching rate of the second isolation sub-portion 212.

[0147] Specifically, the material of the second isolation portion 212 includes a conductive material, which may include at least one of aluminum (Al) and aluminum alloys. The aluminum alloy may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The second isolation portion 22 may be a single-layer or multi-layer structure. When the second isolation portion 22 is a single-layer structure, the material of the second isolation portion 22 may include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, and molybdenum-niobium alloy. When the second isolation portion 22 is a multi-layer structure, one layer of the second isolation portion 22 may include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, and molybdenum-niobium alloy, and another layer may include a conductive oxide or an inorganic insulating material. The conductive oxide may be, for example, indium tin oxide (ITO) or indium zinc oxide (IZO).

[0148] The first isolation sub-section 211 includes a conductive material, which may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0149] To further improve the bonding strength between the adhesive layer 3 and the first sidewall 202, in this embodiment, at least a portion of the first sidewall 202 is provided with a smooth sidewall 2021, through which the adhesive layer 3 can be connected to the first sidewall 202. The first encapsulation layer 4 can also be firmly bonded to the smooth sidewall 2021 of the isolation structure 2 via the adhesive layer 3.

[0150] It should be noted that smooth sidewall 2021 refers to a sidewall surface that is relatively smooth and without obvious protrusions or depressions, compared to the uneven surface or obvious protrusions and depressions formed by etching holes and recesses after lateral etching.

[0151] The isolation structure 2 has a region with smooth sidewalls 2021, which can be a smooth curved surface or have certain undulations or depressions, but the changes in undulations or depressions are relatively uniform and do not change drastically with different locations. Such changes in undulations or depressions will not have a negative impact on the deposition of subsequent film layers such as the adhesion layer 3 and the first encapsulation layer 4.

[0152] In this embodiment, at least a portion of the first sidewall 202 of the isolation structure 2 has the aforementioned smooth sidewall 2021.

[0153] Specifically, the first isolation portion 21 of the isolation structure 2 has a smooth sidewall 2021 on the side facing the isolation opening 201. In other words, the smooth sidewall 2021 is located on the side of the first isolation portion 21 facing the isolation opening 201.

[0154] Furthermore, the second isolation sub-part 212 may be provided with a smooth sidewall 2021 on the side facing the isolation opening 201. In other words, the smooth sidewall 2021 is located on the side of the second isolation sub-part 212 facing the isolation opening 201.

[0155] Since the etching resistance of the second isolator 212 is less than that of either the first isolator 211 or the second isolator 22, when the second isolator 212 has a smooth sidewall 2021 facing the isolation opening 201, either the first isolator 211 or the second isolator 22 may form the smooth sidewall 2021 facing the isolation opening 201. Furthermore, since the surface area of ​​the second isolator 212 facing the isolation opening 201 is larger, the first encapsulation layer 4 can be firmly bonded to the sidewall of the second isolator 212 facing the isolation opening 201 via the adhesion layer 3, thereby effectively providing a strong bond between the first encapsulation layer 4 and the isolation structure 2.

[0156] Please see Figure 3 The display panel 10 also includes a pixel definition layer 6, and an isolation structure 2 is located on the side of the pixel definition layer 6 facing away from the array substrate 1 and is in contact with the pixel definition layer 6. The pixel definition layer 6 has a pixel opening 601 that communicates with the isolation opening 201.

[0157] Specifically, the orthographic projection of the pixel opening 601 on the array substrate 1 lies within the orthographic projection of the isolation opening 201 on the array substrate 1, and the light-emitting element 5 is confined within the isolation opening 201 by the pixel opening 601. The pixel defining layer 6 is made of inorganic insulating material, which can prevent moisture formed in the film layers such as the array substrate 1 from eroding the light-emitting element 5 located on the side of the pixel defining layer 6 facing away from the array substrate 1, thus helping to improve the reliability of the display panel 10.

[0158] For example, the material of the pixel definition layer 6 may include at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0159] Please see Figure 3 The light-emitting element 5, which is disposed corresponding to the isolation opening 201, is a stacked structure, including a first electrode 51, a light-emitting functional layer 52, and a second electrode 53 stacked together. The first electrode 51 is located between the pixel definition layer 6 and the array substrate 1 and can be exposed through the pixel opening 601. The light-emitting functional layer 52 is in contact with the side of the first electrode 51 facing away from the array substrate 1 and covers the sidewall of the pixel opening 601 of the pixel definition layer 6 and the side of the pixel definition layer 6 facing away from the array substrate 1. The second electrode 53 is located on the side of the light-emitting functional layer 52 facing away from the first electrode 51 and is in contact with the light-emitting functional layer 52. The second electrode 53 is used to overlap with the first sidewall 202 of the isolation structure 2.

[0160] Specifically, during actual processing, the second electrode 53 overlaps with the side wall of the first isolation sub-part 211 facing the isolation opening 201.

[0161] Specifically, the first electrode 51 is the anode and the second electrode 53 is the cathode; of course, the first electrode 51 can also be adjusted to be the cathode and the second electrode 53 to be the anode as needed. The first electrode 51 can be used to connect to the pixel circuit (not shown in the figure) of the display panel 10 so that the pixel circuit drives the light-emitting element 5 to emit light.

[0162] The first electrode 51 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metallic material with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 53 is formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0163] The luminescent functional layer 52 can be a multilayer structure processed from organic small molecule luminescent materials, complex luminescent materials, and polymers. For example, the luminescent functional layer 52 may include a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a luminescent material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL. Please refer to [link to relevant documentation]. Figure 7 One of the light-emitting functional layers 52 may include a single light-emitting material layer (EML), or multiple stacked light-emitting material layers (EMLs). Different light-emitting material layers can be used to emit different colors of light. Generally, the number of the aforementioned light-emitting material layers is at least three, and they are used to emit red, green, and blue light, respectively.

[0164] Please see Figure 8 The array substrate 1 is a functional thin-film structure fabricated on a substrate, mainly comprising a thin-film transistor (TFT) array and driving circuitry. It controls the switching, current magnitude, and emission state of different light-emitting elements 5 in the display panel 10, cooperating with the light-emitting elements to achieve the image display function of the display panel 10. The array substrate 1 includes a pixel circuit layer and a planarization layer 12. The pixel circuit layer includes pixel circuits for driving the light-emitting elements 5 to emit light. Please refer to... Figure 8 , Figure 8 The image shows transistor 11 in the pixel circuit. A via is provided in the planarization layer 12, through which the first electrode 51 of the light-emitting element 5 can be electrically connected to transistor 11 in the pixel circuit layer. Furthermore, the pixel circuit layer includes at least one insulating layer, which may include at least one of inorganic and organic layers. Additionally, the array substrate 1 located between the substrate and the pixel definition layer 6 also includes scan lines providing scan signals (Scan) and data lines providing data signals (Data) to the pixel circuit.

[0165] Please see Figure 9 The pixel circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to the data line providing the data signal "Data", and the gate of the data transistor T2 is connected to the scan line providing the scan signal "Scan". The drain of the data transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are connected to the gate and source of the driving transistor T1, respectively. The drain of the driving transistor T1 is connected to the light-emitting element 5. It should be noted that... Figure 9 This is merely one implementation of the pixel circuit in the embodiments of this application, and the pixel circuit that the embodiments of this application may have is not limited to... Figure 9 The 2T1C pixel circuit shown can also be other pixel circuits, such as 7T1C, 8T1C pixel circuits, etc.

[0166] Please see Figure 2 and Figure 10The isolation structure 2 encloses and forms multiple isolation openings 201, with each isolation opening 201 corresponding to a light-emitting element 5, and at least a portion of the light-emitting element 5 located within the corresponding isolation opening 201. The light-emitting elements 5 corresponding to the isolation openings 201 have different light-emitting colors.

[0167] Depending on the color of the emitted light, multiple light-emitting elements 5 can be provided, each having multiple first elements 501, multiple second elements 502, and multiple third elements 503 with different emitted colors. Any two of the first elements 501, second elements 502, and third elements 503 emit different colors. Correspondingly, multiple isolation openings 201 are provided, including multiple first openings 2011, multiple second openings 2012, and multiple third openings 2013. The multiple light-emitting elements 5 are located on one side of the array substrate 1 and are respectively confined within the first openings 2011, second openings 2012, and third openings 2013. The first opening 2011 is used to accommodate the first element 501, the second opening 2012 is used to accommodate the second element 502, and the third opening 2013 is used to accommodate the third element 503.

[0168] In some embodiments, the emission wavelengths of the first element 501 and the second element 502 are both defined to be greater than the emission wavelength of the third element 503. For example, the light emitted by the third element 503 can be set to blue.

[0169] In some embodiments, the emission wavelength of the first element 501 is defined to be greater than the emission wavelength of the second element 502. For example, the light emitted by the first element 501 can be set to red, and the light emitted by the second element 502 can be set to green.

[0170] The light emission colors of the first element 501, the second element 502, and the third element 503 mentioned above are for illustrative purposes only and are not intended to limit their actual light emission colors.

[0171] Within different isolation openings 201, one or more of the three different light-emitting elements 5 described above can be arranged according to design requirements. In a direction parallel to the plane of the array substrate 1, at least two adjacent light-emitting elements 5 have different emission wavelengths. Please refer to [reference needed]. Figure 10 .

[0172] In the display panel 10 provided in this application embodiment, its display area includes a plurality of pixels arranged in the X and Y directions. Each pixel includes a plurality of sub-pixels displaying different colors. In some embodiments, depending on the emitted color, a pixel includes a first sub-pixel, a second sub-pixel, and a third sub-pixel; for example, the first sub-pixel is a red sub-pixel, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a blue sub-pixel. Of course, in other similar embodiments, in addition to the above-mentioned sub-pixels, a pixel may also include white sub-pixels and sub-pixels emitting other colors of light.

[0173] Each sub-pixel includes the aforementioned light-emitting element 5 and a pixel circuit that corresponds to and cooperates with the light-emitting element 5 to drive the light-emitting element 5 to emit a corresponding color. That is, the first sub-pixel includes a first element 501, the second sub-pixel includes a second element 502, and the third sub-pixel includes a third element 503. One pixel circuit drives at least one light-emitting element 5 to emit light.

[0174] Of course, when the display area of ​​the display panel includes a normal display area and a light-transmitting display area, the light-transmitting display area is the display area set with the corresponding sensor and has light-transmitting performance, while the normal display area is the display area not set with the corresponding sensor. In the normal display area, one pixel circuit drives one light-emitting element 5 to emit light, and in the light-transmitting display area, one pixel circuit drives one or more light-emitting elements 5 to emit light.

[0175] In order for the light-emitting functional layer 52 to emit light, a pixel voltage is provided to the first electrode 51 and a common voltage is provided to the second electrode 53, forming a potential difference between the first electrode 51 and the second electrode 53, so that the light-emitting functional layer 52 disposed between the first electrode 51 and the second electrode 53 emits light. In one embodiment, if a potential difference is formed between the first electrode 51 and the second electrode 53 of the first element 501, the light-emitting material layer EML of the light-emitting functional layer 52 emits red light; if a potential difference is formed between the first electrode 51 and the second electrode 53 of the second element 502, the light-emitting material layer EML of the light-emitting functional layer 52 emits green light; and if a potential difference is formed between the first electrode 51 and the second electrode 53 of the third element 503, the light-emitting material layer EML of the light-emitting functional layer 52 emits blue light.

[0176] In this configuration, the pixel voltage of the first electrode 51 is provided by the pixel circuit described above, and the common voltage of the second electrode 53 is provided by the isolation structure 2. Specifically, the second electrode 53 is electrically connected to the isolation structure 2, and the common voltage is supplied to the second electrode 53 by providing the isolation structure 2. That is, the isolation structure 2 has the function of supplying a common voltage to the second electrode 53.

[0177] In some embodiments, the display panel 10 further includes a second encapsulation layer 7 and a third encapsulation layer 8, wherein at least a portion of the second encapsulation layer 7 is located on the side of the first encapsulation layer 4 facing away from the array substrate 1, and the third encapsulation layer 8 is located on the side of the second encapsulation layer 7 facing away from the array substrate 1.

[0178] Specifically, at least a portion of the second encapsulation layer 7 is located within the isolation opening 201 to fill the isolation opening 201, while a portion of the third encapsulation layer 8 is located between the suspended second encapsulation portion 42 of the first encapsulation layer 4 and the isolation structure 2.

[0179] The third encapsulation layer 8 is made of organic polymers (such as polyimide, acrylic resin, etc.).

[0180] The third encapsulation layer 8, made of organic materials, can be prepared using techniques such as IJP (Ink Jet Printing). A portion of the second encapsulation layer 7 can flow into the aforementioned isolation opening 201, and by filling the isolation opening 201, it improves the flatness of the display panel 10, while also providing some protection to the related film layers located beneath it.

[0181] The surface of the second encapsulation layer 7 facing away from the array substrate 1 is a flat surface, and the third encapsulation layer 8 is located on the side of the second encapsulation layer 7 facing away from the array substrate 1.

[0182] Specifically, the material of the third encapsulation layer 8 can be the same as that of the first encapsulation layer 4, for example, it can be made of inorganic materials.

[0183] The display panel 10 may also include at least one film layer such as a touch layer, a polarizer, a color filter substrate, and a protective cover. The aforementioned film layer may also be bonded to the display panel 10 via an adhesive layer such as OCA (Optical Clear Adhesive).

[0184] It is understood that the display panel 10 provided in this application embodiment can improve the bonding strength between the first encapsulation layer 4 and the isolation structure 2 by using an adhesion layer 3 located at least partially on the first sidewall 202 of the isolation structure 2 facing the isolation opening 201. This reduces the possibility of the first encapsulation layer 4 peeling off from the first sidewall 202 of the isolation structure 2, thereby reducing the probability that the second electrode 53 connected to the first encapsulation layer 4 will be pulled off from the first sidewall 202 by the first encapsulation layer 4 and ultimately cause the light-emitting element 5 to have a dark spot defect. This further optimizes the process performance of the display panel 10 and ultimately achieves the purpose of improving the display reliability and processing yield of the display panel 10.

[0185] Based on the same inventive concept, in a second aspect, embodiments of this application also provide a method for manufacturing a display panel 10, please refer to... Figure 11 .

[0186] The preparation method includes:

[0187] Step S1: An isolation structure 2 is fabricated on one side of the array substrate 1. The isolation structure 2 encloses and forms a plurality of isolation openings 201. The side of the isolation structure 2 facing the isolation openings 201 has a first sidewall 202. (See also...) Figure 12A ;

[0188] Step S2: Fabricate the light-emitting element 5 within the isolation opening 201. (See [link to previous step]) Figure 12B ;

[0189] Step S3: An adhesion material layer 3' is prepared on one side of the isolation structure 2. The adhesion material layer 3' is a discontinuous film layer, including multiple spaced island-shaped film layers 301. The adhesion material layer 3' covers at least a portion of the surface of the first sidewall 202 and covers the surface of the light-emitting element 5 facing away from the array substrate 1. Please refer to [link to relevant documentation]. Figure 12C ;

[0190] Step S4: Prepare a first encapsulation material layer 4' on one side of the isolation structure 2. Please refer to [link / reference]. Figure 12D ;

[0191] Step S5: The first encapsulation material layer 4' and the adhesive material layer 3' are patterned to obtain the adhesive layer 3 and the first encapsulation layer 4. The first encapsulation layer 4 covers the isolation opening 201 and is connected to the first sidewall 202 through the adhesive layer 3. Please refer to [link to relevant documentation]. Figure 12E .

[0192] In the method for preparing the display panel 10 provided in this application embodiment, an adhesion layer 3 can be added before the preparation of the first encapsulation layer 4. The adhesion layer 3 can effectively improve the adhesion between the first sidewall 202 of the isolation structure 2 and the first encapsulation layer 4, thereby effectively reducing the probability of peeling defects between the first encapsulation layer 4 and the isolation structure 2, and effectively improving problems such as display dark spot abnormalities caused by such defects, thereby improving the process performance of the display panel 10 and increasing the yield of the display panel 10.

[0193] Taking the structure of the display panel 10 described above as an example, the multiple isolation openings 201 of the display panel 10 include a first opening 2011, a second opening 2012 and a third opening 2013, and the multiple light-emitting elements 5 include a first element 501, a second element 502 and a third element 503 with different light-emitting colors. The first opening 2011 is used to accommodate the first element 501, the second opening 2012 is used to accommodate the second element 502, and the third opening 2013 is used to accommodate the third element 503.

[0194] It should be noted that the following description of the manufacturing process of the display panel 10 is based solely on the order of the first element 501, the second element 502, and the third element 503, and is not intended to limit the actual manufacturing order.

[0195] To ensure that the first sidewall 202 of the isolation structure 2 facing the isolation opening 201 is relatively smooth and has a smooth sidewall 2021, a second opening 2012 for accommodating the second element 502 can be provided after the first element 501 is prepared; similarly, a third opening 2013 for accommodating the third element 503 is provided after the second element 502 is prepared.

[0196] Compared to directly preparing at least two of the first opening 2011, the second opening 2012, and the third opening 2013, this preparation method helps to improve the smoothness of the surface of the isolation structure 2 facing the isolation opening 201, thereby further improving the adhesion strength between the adhesive layer 3 and the first encapsulation layer 4 and the first sidewall 202 of the isolation structure 2.

[0197] Specifically, in step S1 above, the step of fabricating the isolation structure 2 on one side of the array substrate 1 includes:

[0198] Step S101: Prepare an isolation material layer on one side of the array substrate 1;

[0199] Step S102: The isolation material layer is graphically processed to obtain an isolation structure 2 with a first opening 2011. The isolation structure 2 has a first sidewall 202 on the side facing the first opening 2011.

[0200] At this point, steps S2 to S5 can be continued to prepare the first element 501 within the first opening 2011 and prepare a packaging unit that can encapsulate the first element 501.

[0201] In some embodiments, step S3, the step of preparing an adhesive material layer 3' on one side of the isolation structure 2, includes:

[0202] Multiple discrete island-shaped film layers 301 are formed on one side of the isolation structure 2 by vapor deposition, and the multiple island-shaped film layers 301 constitute the adhesion layer 3.

[0203] Specifically, vapor deposition includes chemical vapor deposition.

[0204] In some embodiments, the adhesive material layer 3' can be prepared by chemical vapor deposition (CVD) using an island-shaped coating process. Employing an island-shaped growth (Volmer-Weber type) method, the atoms or molecules of the deposited material tend to bond to each other rather than to the atoms of the first sidewall 202. This results in poor wettability between the deposited material and the interface (i.e., the surface of the first sidewall 202) that supports it, thus enabling the growth of multiple discrete island-shaped film layers 301.

[0205] In this embodiment, the first encapsulation material layer 4' can also be prepared by vapor deposition in step S4.

[0206] In some embodiments, steps S3 and S4 can be performed by the same device, that is, steps S3 and S4 are executed sequentially using the same device to prepare the adhesive material layer 3' and the first encapsulation material layer 4'.

[0207] It should be noted that since the related film layers used to constitute the light-emitting element 5, the adhesive material layer 3', and the first encapsulation material layer 4' are all prepared as a single layer, the light-emitting element 5 and the adhesive material layer 3' prepared in steps S2 to S4 are located not only within the first opening 2011 but also on the side surface of the isolation structure 2 facing away from the array substrate 1. Therefore, it is necessary to etch and remove the film material located in the non-designed position in step S5 to obtain the adhesive layer 3 and the first encapsulation layer 4. Of course, the first element 501 has already been separated from the related redundant film layers (including the film layer with the same material as the light-emitting functional layer 52 and the second electrode 53) located on the side of the isolation structure 2 facing away from the array substrate 1 by the isolation structure 2, so it is only necessary to etch and remove the redundant film layers in step S5.

[0208] In step S5, a photoresist layer covering the first encapsulation material layer 4' can be prepared first, and then the photoresist layer can be processed by a patterning process (exposure and development) to obtain the corresponding photoresist pattern. Subsequently, using the photoresist pattern as a mask, dry etching technology is applied to pattern the first encapsulation material layer 4' and the adhesive material layer 3' to remove part of the first encapsulation material layer 4' and part of the adhesive layer 3 located on the side of the isolation structure 2 facing away from the array substrate 1, thereby obtaining the first encapsulation layer 4 and the adhesive layer 3.

[0209] During the etching process, the light-emitting functional layer 52 and the second electrode 53 layer located on the side of the isolation structure 2 facing away from the array substrate 1 lose the protection of the first encapsulation material layer 4' and the adhesive material layer 3', and are also etched away, thereby obtaining the first element 501 located only within the first opening 2011 and protected by the first encapsulation layer 4.

[0210] Based on the above steps, by repeating the operation, the first opening 2011 and the first element 501 and the packaging unit arranged corresponding to the first opening 2011 can be prepared sequentially, the second opening 2012 and the second element 502 and the packaging unit arranged corresponding to the second opening 2012 can be prepared, and the third opening 2013 and the third element 503 and the packaging unit arranged corresponding to the third opening 2013 can be prepared.

[0211] The preparation process described above will be explained in detail below:

[0212] First, step S1 is performed to fabricate a pixel definition layer 6 and an isolation structure 2 on one side of the array substrate 1. The isolation structure 2 encloses and forms a plurality of isolation openings 201, and the pixel definition layer 6 encloses and forms a plurality of pixel openings 601 arranged opposite to the isolation openings 201. Please refer to [link to relevant documentation]. Figure 12A Then, step S2 is performed to obtain a plurality of light-emitting elements 5 confined within the isolation opening 201. In this step, a redundant film layer of the same material as a portion of the film layer of the light-emitting element 5 (the light-emitting functional layer 52 and the second electrode 53) is also formed on the side surface of the isolation structure 2 facing away from the array substrate 1. Please refer to [link to relevant documentation]. Figure 12B Then, steps S3 and S4 are performed to sequentially prepare an adhesion material layer 3' and a first encapsulation material layer 4' on the side of the isolation structure 2 and the light-emitting element 5 facing away from the array substrate 1. Please refer to [link to relevant documentation]. Figure 12C and Figure 12D The prepared adhesive material layer 3' and encapsulation material layer sequentially cover the light-emitting element 5, the isolation structure 2, and the redundant film layer; finally, step S5 is performed to pattern the first encapsulation material layer 4' and the adhesive material layer 3' to obtain the required adhesive layer 3 and first encapsulation layer 4. The first encapsulation layer 4 includes encapsulation units arranged opposite to the corresponding isolation opening 201. Please refer to [link to relevant documentation]. Figure 12E .

[0213] In other similar embodiments, the above-described step S1, the step of fabricating the isolation structure 2 on one side of the array substrate 1, further includes:

[0214] Step S103: Prepare the first element 501 within the first opening 2011;

[0215] Step S104: An adhesive material layer 3' is prepared on one side of the isolation structure 2. The adhesive material layer 3' is a discontinuous film layer, including a plurality of island-shaped film layers 301 arranged at intervals. The adhesive material layer 3' covers at least a portion of the surface of the first sidewall 202 and covers the surface of the light-emitting element 5 facing away from the array substrate 1.

[0216] Step S105: Prepare a first encapsulation material layer 4' on one side of the isolation structure 2;

[0217] Step S106: The first encapsulation material layer 4' and the adhesive material layer 3' are patterned to obtain the adhesive layer 3 and the first encapsulation layer 4. The first encapsulation layer 4 covers the first opening 2011 and is connected to the first sidewall 202 through the adhesive layer 3.

[0218] Step S107: The isolation structure 2 is graphically processed to obtain an isolation structure 2 with a second opening 2012. The isolation structure 2 has a first sidewall 202 on the side facing the second opening 2012.

[0219] Steps S103 to S106 can be referred to steps S2 to S5 as described above, and step S107 can be referred to step S102 as described above, and will not be repeated here.

[0220] In other similar embodiments, the above-described step S1, the step of fabricating the isolation structure 2 on one side of the array substrate 1, may further include:

[0221] Step S108: Prepare the second element 502 within the second opening 2012;

[0222] Step S109: An adhesive material layer 3' is prepared on one side of the isolation structure 2. The adhesive material layer 3' is a discontinuous film layer, including a plurality of island-shaped film layers 301 arranged at intervals. The adhesive material layer 3' covers at least a portion of the surface of the first sidewall 202 and covers the surface of the light-emitting element 5 facing away from the array substrate 1.

[0223] Step S110: Prepare a first encapsulation material layer 4' on one side of the isolation structure 2;

[0224] Step S111: The first encapsulation material layer 4' and the adhesive material layer 3' are patterned to obtain the adhesive layer 3 and the first encapsulation layer 4. The first encapsulation layer 4 covers the second opening 2012 and is connected to the first sidewall 202 through the adhesive layer 3.

[0225] Step S112: The isolation structure 2 is graphically processed to obtain the isolation structure 2 with a third opening 2013. The side of the isolation structure 2 facing the third opening 2013 has a first sidewall 202.

[0226] Steps S108 to S112 are operated in the same way as steps S103 to S107, the only difference being the color of the emitted light from the prepared light-emitting element 5.

[0227] It is understood that the method for preparing the display panel 10 provided in this application can effectively improve the adhesion between the first encapsulation material layer 4' and the first sidewall 202 of the isolation structure 2 by preparing an adhesion material layer 3' on the first sidewall 202 of the isolation structure 2 before preparing the first encapsulation material layer 4'. This reduces the possibility of peeling defects between the first encapsulation layer 4 and the first sidewall 202, thereby improving the probability of display dark spot defects caused by the first encapsulation layer 4 pulling the relevant film layer of the light-emitting element 5. This achieves the purpose of optimizing the process performance of the display panel 10 and improving the display reliability and processing yield of the display panel 10.

[0228] Based on the same inventive concept, in a third aspect, embodiments of this application also provide a display device 100, please refer to... Figure 13 The display device 100 includes the display panel 10 described in any of the preceding claims, or includes the display panel 10 prepared by the preparation method described in any of the preceding claims.

[0229] The display device 100 provided in this embodiment can be a mobile phone, desktop computer, laptop computer, tablet computer, vehicle display, wearable device (such as smartwatch, smart bracelet) or other products or components with display function. Since the display panel 10 in the display device 100 has any one or more of the above-mentioned beneficial effects of display panels 10, the specific effects are described in the foregoing embodiments and will not be repeated here.

[0230] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0231] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: Array substrate; An isolation structure is located on one side of the array substrate. The isolation structure encloses and forms a plurality of isolation openings. The side of the isolation structure facing the isolation openings has a first sidewall, and at least a portion of the first sidewall has a smooth sidewall. An adhesive layer, at least partially located on the side of the isolation structure facing the isolation opening and covering a portion of the surface of the first sidewall, is connected to the first sidewall via the smooth sidewall. The adhesive layer is a discontinuous film layer comprising a plurality of spaced island-shaped film layers. The first encapsulation layer includes multiple encapsulation units, each of which is corresponding to and covers the isolation opening. Any one of the encapsulation units is connected to the first sidewall through the adhesive layer. Both the adhesive layer and the first encapsulation layer are made of inorganic materials.

2. The display panel according to claim 1, characterized in that, Along the normal direction of the first sidewall surface, the thickness of the adhesion layer is less than or equal to 50 nm; The oxygen content of the material in the adhesion layer is greater than that of the material in the first encapsulation layer.

3. The display panel according to claim 1, characterized in that, The isolation structure includes a first isolation portion and a second isolation portion stacked together, the second isolation portion being located on the side of the first isolation portion facing away from the array substrate, and the first isolation portion and the second isolation portion forming the isolation opening; Wherein, the orthographic projection of the first isolation portion on the array substrate is located within the orthographic projection of the second isolation portion on the array substrate; The first isolation portion includes a first isolation sub-portion and a second isolation sub-portion, wherein the second isolation sub-portion is located on the side of the first isolation sub-portion facing away from the array substrate; Wherein, the orthographic projection of the second isolation sub-part on the array substrate is located within the orthographic projection of the first isolation sub-part on the array substrate; The orthographic projection of the end of the second isolation sub-part near the second isolation portion on the array substrate is located within the orthographic projection of the end of the second isolation sub-part near the first isolation sub-part on the array substrate.

4. The display panel according to claim 1, characterized in that, The display panel also includes a plurality of light-emitting elements, which are located on one side of the array substrate and confined within the isolation opening, and the first encapsulation layer is located on the side of the light-emitting elements facing away from the array substrate.

5. The display panel according to claim 4, characterized in that, Within at least a portion of the isolation opening, the portion of the first encapsulation layer covering the isolation structure closes with the portion covering the light-emitting element to form a cavity; At least part of the chambers are annular structures.

6. The display panel according to claim 4, characterized in that, The first encapsulation layer includes: The first encapsulation portion is located within the isolation opening and covers the side of the light-emitting element facing away from the array substrate; The second packaging portion is at least partially located on the side of the isolation structure facing away from the array substrate; The third encapsulation part is located on the side of the isolation structure facing the isolation opening, and the third encapsulation part is connected to the adhesive layer and covers the first sidewall; Wherein, along a direction perpendicular to the plane where the array substrate is located, the two ends of the third packaging part are respectively connected to the first packaging part and the second packaging part; Part of the adhesive layer is in contact with the side surface of the second encapsulation portion facing the array substrate; Along a direction perpendicular to the plane of the array substrate, the second package portion is suspended on the side surface of the isolation structure facing away from the array substrate.

7. The display panel according to claim 4, characterized in that, Part of the adhesive layer is located between the light-emitting element and the first encapsulation layer.

8. The display panel according to claim 4, characterized in that, The light-emitting element includes a first electrode, a light-emitting functional layer, and a second electrode stacked together.

9. The display panel according to claim 8, characterized in that, The display panel further includes a pixel definition layer, which is located between the array substrate and the isolation structure. The pixel definition layer has a pixel opening that communicates with the isolation opening, and the orthographic projection of the pixel opening on the array substrate is located within the orthographic projection of the isolation opening on the array substrate.

10. The display panel according to claim 4, characterized in that, The light-emitting element includes a plurality of first elements, a plurality of second elements, and a plurality of third elements. The isolation opening includes a plurality of first openings, a plurality of second openings, and a plurality of third openings. The first opening is used to accommodate the first element, the second opening is used to accommodate the second element, and the third opening is used to accommodate the third element. Among them, any two of the first element, the second element, and the third element emit different colors.

11. The display panel according to any one of claims 1-10, characterized in that, The display panel further includes a second encapsulation layer and a third encapsulation layer, wherein at least a portion of the second encapsulation layer is located on the side of the first encapsulation layer facing away from the array substrate, and the third encapsulation layer is located on the side of the second encapsulation layer facing away from the array substrate. The material of the second encapsulation layer includes organic materials, and the material of the third encapsulation layer includes inorganic materials.

12. A method for manufacturing a display panel, characterized in that, The preparation method includes: An isolation structure is fabricated on one side of an array substrate. The isolation structure encloses and forms a plurality of isolation openings. The side of the isolation structure facing the isolation openings has a first sidewall, which has a smooth sidewall. A light-emitting element is fabricated within the isolation opening; An adhesive material layer is prepared on one side of the isolation structure. The adhesive material layer is a discontinuous film layer prepared by an island-shaped coating process, including a plurality of spaced island-shaped film layers. The adhesive material layer covers at least a portion of the surface of the first sidewall and the side surface of the light-emitting element facing away from the array substrate through the smooth sidewall. A first encapsulation material layer is prepared on one side of the isolation structure; The first encapsulation material layer and the adhesive material layer are patterned to obtain an adhesive layer and a first encapsulation layer. The first encapsulation layer covers the isolation opening and is connected to the first sidewall through the adhesive layer.

13. The method for manufacturing a display panel according to claim 12, characterized in that, The light-emitting element has a first element, a second element, and a third element with different light-emitting colors. The isolation opening includes a first opening, a second opening, and a third opening. The first opening is used to accommodate the first element, the second opening is used to accommodate the second element, and the third opening is used to accommodate the third element. The step of fabricating an isolation structure on one side of the array substrate includes: An isolation material layer is prepared on one side of the array substrate; The isolation material layer is patterned to obtain an isolation structure with the first opening, and the isolation structure has the first sidewall on the side facing the first opening.

14. The method for manufacturing a display panel according to claim 13, characterized in that, The step of fabricating an isolation structure on one side of the array substrate further includes: The first element is prepared within the first opening; An adhesive material layer is prepared on one side of the isolation structure. The adhesive material layer is a discontinuous film layer, including a plurality of spaced island-shaped film layers. The adhesive material layer covers at least a portion of the surface of the first sidewall and covers the surface of the light-emitting element facing away from the array substrate. A first encapsulation material layer is prepared on one side of the isolation structure; The first encapsulation material layer and the adhesive material layer are patterned to obtain the adhesive layer and the first encapsulation layer. The first encapsulation layer covers the first opening and is connected to the first sidewall through the adhesive layer. The isolation structure is graphically processed to obtain an isolation structure with a second opening, and the isolation structure has a first sidewall on the side facing the second opening.

15. The method for manufacturing a display panel according to claim 14, characterized in that, The step of fabricating an isolation structure on one side of the array substrate further includes: The second element is prepared within the second opening; An adhesive material layer is prepared on one side of the isolation structure. The adhesive material layer is a discontinuous film layer, including a plurality of spaced island-shaped film layers. The adhesive material layer covers at least a portion of the surface of the first sidewall and covers the surface of the light-emitting element facing away from the array substrate. A first encapsulation material layer is prepared on one side of the isolation structure; The first encapsulation material layer and the adhesive material layer are patterned to obtain the adhesive layer and the first encapsulation layer. The first encapsulation layer covers the second opening and is connected to the first sidewall through the adhesive layer. The isolation structure is graphically processed to obtain an isolation structure with the third opening, and the isolation structure has the first sidewall on the side facing the third opening.

16. The method for manufacturing a display panel according to claim 12, characterized in that, The step of preparing an adhesive material layer on one side of the isolation structure includes: Multiple discrete island-shaped film layers are formed on one side of the isolation structure using a vapor phase deposition method, and the multiple island-shaped film layers constitute the adhesion layer; The vapor deposition includes chemical vapor deposition.

17. A display device, characterized in that, It includes the display panel according to any one of claims 1-11, or the display panel prepared by the preparation method according to any one of claims 12-16.

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