Solvent cup refilling mechanism

Abstract

An applicator cleaning system (10) may include a leveling system (22) configured to maintain a cleaning fluid in a cleaning container (20a, 20b, 20c, 20d) at a predetermined height. The leveling system (22) may output a cleaning fluid at a predetermined height. For example, the leveling system (22) may cascade excess cleaning fluid above the predetermined height into an overflow vessel (22b). Furthermore, the present disclosure provides a leveling system (22) that includes a leveling reservoir (22a) that may be fluidly coupled to a cleaning container (20a, 20b, 20c, 20d) such that cleaning fluid in the cleaning container (20a, 20b, 20c, 20d) is at the predetermined height when the cleaning fluid in the leveling reservoir (22a) is at the predetermined height.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application Serial No. 63 / 482,377, filed on March 31, 2023, the contents of which are incorporated herein by reference as if fully set forth herein. Technical Field

[0002] The present disclosure relates generally to a fluid container for a coating system used for various purposes, and in particular, to a solvent cup such as for a conformal coating system in which a coating applicator resides, and a method of using the solvent cup. Background Art

[0003] Conformal coating is typically the process of applying a dielectric material to electrical components, such as printed circuits, printed circuit boards (PCBs), and the devices mounted thereon, to protect them from moisture, fungus, dust, corrosion, abrasion, vibration, chemicals, tin whiskers, and other environmental stresses. Conformal coating materials range from solvent-based materials that cure by evaporating the solvent to "100% solids" conformal coating materials. Common conformal coating materials include silicones, acrylics, polyurethanes, epoxy synthetic resins, and various polymers. When applied to a PCB, an insulating resin film of uniform thickness is typically formed upon evaporation of the solvent or upon curing of solvent-free materials.

[0004] Automatic selective coating systems are known. Such systems can have conformal coating dispensers that dispense material in various patterns with varying deposition accuracy and produce coatings of varying thicknesses. During operation, multiple parts of the coating system can retain some coating material. For example, due to the properties of the coating material itself, due to a specific application process and pattern, etc., the nozzles of the coating dispenser can accumulate coating material. The accumulated coating material can solidify, harden, otherwise clog, and / or interfere with continued dispensing of coating material from the affected dispenser nozzles.

[0005] Several mechanisms exist in the field for cleaning accumulated or residual coating material from nozzles. In some cases, when the dispenser nozzle is not in use, it may be stored in a reservoir containing a solvent. This solvent interacts with any uncured coating that has accumulated on the nozzle and prevents it from curing, hardening, clogging the nozzle, etc. However, the high vapor pressure of the solvent often leads to rapid and undesirable evaporation and level changes in the reservoir. Consequently, the solvent in the reservoir must be continuously monitored and manually replaced as needed. This can increase costs and, if not properly monitored and replenished, can be a point of quality degradation.

[0006] Therefore, a need exists for a method and apparatus to ensure that an appropriate and / or sufficient supply of solvent is maintained for use in cleaning conformal coating systems. Summary of the Invention

[0007] The present application provides an applicator cleaning system, which may include a leveling system configured to maintain a cleaning fluid in a cleaning container at a predetermined height. The leveling system may output the cleaning fluid at the predetermined height. For example, the leveling system may cascade excess cleaning fluid above the predetermined height into an overflow container. In addition, the present disclosure provides a leveling system, which includes a leveling reservoir, which may be fluidically coupled to the cleaning container so that when the cleaning fluid in the leveling reservoir is at the predetermined height, the cleaning fluid in the cleaning container is at the predetermined height.

[0008] The leveling system can include multiple leveling reservoirs at different altitudes. The multiple leveling reservoirs can be adjacent to each other so that a higher-altitude leveling reservoir can be cascaded into a lower-altitude leveling reservoir. Excess cleaning fluid in the higher-altitude leveling reservoir can be cascaded into the overflow container via a lower-altitude leveling reservoir (or multiple lower-altitude leveling reservoirs), so that excess cleaning fluid in the lower-altitude leveling reservoir can be cascaded directly into the overflow container.

[0009] The leveling system may be remote from the cleaning vessel (or vessels) of the conformal coating system. Furthermore, the leveling system may not include a level sensor.

[0010] A pump can constantly provide cleaning fluid to the leveling system. For example, excess cleaning fluid can be cascaded into the overflow container (e.g., from the leveling reservoir or from the cleaning container) so that the cleaning fluid in the cleaning container can be maintained at the predetermined height. The pump can provide cleaning fluid at or above a predetermined flow rate (e.g., above the expected evaporation rate of the cleaning fluid).

[0011] A sensor may sense the flow rate of cleaning fluid from the pump to ensure that the pump is constantly providing cleaning fluid at or above a predetermined flow rate.

[0012] The cleaning container does not require a liquid level sensor to ensure that the cleaning fluid is at the predetermined height in the cleaning container. Therefore, the cleaning container may not include a liquid level sensor to sense the liquid level of the cleaning fluid in the cleaning container. Therefore, the cost and complexity associated with utilizing a liquid level sensor to sense the liquid level of the cleaning fluid in the cleaning container is not required.

[0013] Similarly, the leveling system may not include a fluid sensor to ensure that the cleaning fluid is at the predetermined height in the leveling reservoir. On the other hand, existing designs for solvent cups may require a level sensor to measure the level of solvent, or the user to regularly check and refill the solvent cup daily to ensure sufficient solvent is in the solvent cup.

[0014] According to an embodiment of the present disclosure, an applicator cleaning system may include a cleaning container, a leveling system, and a pump. The cleaning container may be configured to store a cleaning fluid and to receive an applicator for cleaning in the cleaning fluid. The leveling system may be configured to maintain the cleaning fluid in the cleaning container at a predetermined height. The leveling system may be configured to output the cleaning fluid at the predetermined height. The pump may be configured to provide the cleaning fluid to the leveling system so that the leveling system outputs the cleaning fluid at the predetermined height.

[0015] According to another embodiment of the present disclosure, the applicator cleaning system may include a cleaning container, a leveling system and a pump. The cleaning container may be configured to store a cleaning fluid and be configured to receive an applicator for cleaning in the cleaning fluid. The leveling system may be configured to maintain the cleaning fluid in the cleaning container at a predetermined height. The leveling system may include a leveling reservoir, which is fluidically coupled to the cleaning container so that when the cleaning fluid in the leveling reservoir is at the predetermined height, the cleaning fluid in the cleaning container is at the predetermined height. The pump may be configured to provide the cleaning fluid to the leveling reservoir.

[0016] According to another embodiment of the present disclosure, a method of implementing an applicator cleaning system may include storing a cleaning fluid in a cleaning container, and configuring the cleaning container to receive an applicator for cleaning in the cleaning fluid. The method may further include maintaining the cleaning fluid in the cleaning container at a predetermined height using a leveling system. The leveling system may be configured to output the cleaning fluid at the predetermined height. The method may further include providing the cleaning fluid to the leveling system using a pump, such that the leveling system outputs the cleaning fluid at the predetermined height.

[0017] Any features of the above and below disclosed embodiments of the applicator cleaning system may be used in combination with one another.For example, the applicator cleaning system may include the leveling system and cleaning container of the first embodiment combined with the cleaning container of the second embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The foregoing summary, as well as the following detailed description of illustrative embodiments of the applicator cleaning system of the present application, will be better understood when read in conjunction with the accompanying drawings. For the purpose of illustrating the applicator cleaning system of the present application, illustrative embodiments are shown in the accompanying drawings. However, it should be understood that the present application is not limited to the precise arrangements and instrumentalities shown. In the drawings:

[0019] Figure 1 is a front schematic diagram of the applicator cleaning system;

[0020] Figure 2A yes Figure 1 A front oblique view of a cleaning container of an applicator cleaning system;

[0021] Figure 2B yes Figure 1 a front oblique view of a leveling system of an applicator cleaning system;

[0022] Figure 2C yes Figure 1 a front oblique view of a system reservoir of an applicator cleaning system;

[0023] Figure 3 is a front schematic diagram of another applicator cleaning system including a cleaning container that acts as a leveling reservoir overflowing into a corresponding overflow container; and

[0024] Figure 4 is included Figure 1 Front schematic diagram of the coating system with an applicator cleaning system. DETAILED DESCRIPTION

[0025] The present disclosure may be more readily understood by reference to the following detailed description, which is provided in conjunction with the accompanying drawings and examples that form a part of the present disclosure. It should be understood that the present disclosure is not limited to the specific apparatus, methods, applications, conditions, or parameters described and / or illustrated herein, and that the terms used herein are for the purpose of describing specific embodiments by way of example only, and are not intended to limit the scope of the present disclosure. Moreover, as used in the specification, including the appended claims, the singular forms "a," "an," and "the" include the plural, and references to a particular numerical value include at least that particular value unless the context clearly indicates otherwise.

[0026] As used herein, the term "plurality" means more than one. When expressing a range of values, another embodiment includes from one particular value and / or to another particular value. Similarly, when a value is expressed as an approximation by using the antecedent "about," it will be understood that the particular value forms another embodiment. All ranges are inclusive and combinable.

[0027] refer to Figure 1The applicator cleaning system 10 may include one or more cleaning containers 20a, 20b, 20c, and 20d (eg, solvent cups), a leveling system 22, and a pump 24 configured to provide a cleaning fluid 26 to the leveling system.

[0028] The cleaning containers 20a, 20b, 20c and 20d can each include a container disclosed in U.S. Provisional Application No. 63 / 400,436, filed on August 24, 2022, entitled "DEVICES AND METHODS FOR MINIMIZING EVAPORATION, MAINTAINING ACCESSIBILITY, AND TRIGGERING REFILL OR ULTRASONIC ROUTINES INCONFORMALCOATING APPLICATIONS," the entire contents of which are incorporated herein by reference.

[0029] Each cleaning container 20a, 20b, 20c, and 20d may be configured to store cleaning fluid for a cleaning applicator such as Figure 4 1 and 2. The conformal coating system 100 shown in FIG. 1 is provided with a cleaning fluid 26 (e.g., a solvent) in the applicator 110. The cleaning containers 20a, 20b, 20c, and 20d can be configured to receive the applicator for cleaning in the cleaning fluid. Furthermore, the number of cleaning containers shown and described herein is merely exemplary. In various aspects of the present disclosure, any number of cleaning containers may be present.

[0030] In one embodiment, the cleaning containers 20a, 20b, 20c, and 20d include an abrasive or rough surface (e.g., the hook side of a hook and loop fastener) that is configured to contact the applicator 110 when the applicator 110 is received in the corresponding cleaning container. In some embodiments, the cleaning containers can each be configured to receive more than one applicator at a time (e.g., one cleaning container can be configured to receive all applicators at a time).

[0031] like Figure 2A As shown, each cleaning container 20a, 20b, 20c, and 20d can include a body 30 and a cover 32. Each body 30 can be configured to store a cleaning fluid 26. In aspects of the present disclosure, embodiments of the cleaning containers can be implemented without the cover 32.

[0032] Each cleaning container 20a, 20b, 20c, and 20d can be configured to receive an applicator 110. For example, each body 30 can define an open portion at an upper end 30a thereof, opposite the lower end 30b along the vertical axis X. Each cover 32 can include a corresponding through-hole 34 that is configured, arranged, sized, etc. such that the applicator 110 can be received by the corresponding through-hole 34 to access the cleaning fluid 26 stored by the corresponding body 30.

[0033] The body 30 can be formed of a material that can withstand prolonged exposure to the cleaning fluid 26. In various aspects, the material of the body 30 can be a metallic material, a synthetic material, etc. In various aspects, the material of the body 30 can be stainless steel, steel, aluminum, etc. The body 30 can be configured to prevent and / or delay evaporation of the cleaning fluid 26 stored by the body 30.

[0034] Go to again Figure 1 The leveling system 22 can be configured to maintain the cleaning fluid 26 in each cleaning container 20a, 20b, and 20c at a first predetermined height L1. The first predetermined height L1 can be higher than the ground level (e.g., the Earth). The body 30 of each cleaning container 20a, 20b, and 20c can define a wall that is higher than the first predetermined height L1, so that the cleaning fluid 26 stored in the body 30 can rise without overflowing from the corresponding cleaning container 20a, 20b, and 20c (e.g., when receiving the applicator 110).

[0035] For example, the leveling system 22 may include a leveling reservoir 22a and an overflow container 22b. The leveling reservoir 22a may be fluidly coupled to each of the cleaning containers 20a, 20b, and 20c such that when the cleaning fluid 26 in the leveling reservoir 22a is at a first predetermined height L1, the cleaning fluid 26 in each of the cleaning containers 20a, 20b, and 20c is at the first predetermined height L1. It should be understood that any number of cleaning containers may be fluidly coupled to the leveling reservoir 22a.

[0036] The leveling system 22 may be configured to output the cleaning fluid 26 at a first predetermined height L1. For example, the leveling reservoir 22a may be configured to output excess cleaning fluid 26a of the cleaning fluid 26 to the overflow container 22b at the first predetermined height L1.

[0037] The leveling reservoir 22a can be configured to cascade excess cleaning fluid 26a above a first predetermined height L1 into the overflow container 22b. For example, the leveling reservoir 22a can have an open top, allowing excess cleaning fluid 26a to cascade (e.g., pour) from the leveling reservoir 22a into the overflow container 22b at the first predetermined height L1. The wall 40a defining a portion of the leveling container 22a and the overflow container 22b can be the shortest wall defining the leveling container 22a, allowing excess cleaning fluid 26a to cascade from the leveling container 22a to the overflow container 22b over the wall 40a. In one embodiment, the wall 40a can define an outlet port configured to output any excess cleaning fluid 26a above the first predetermined height L1 from the leveling reservoir 22a into the overflow container 22b.

[0038] The leveling system 22 may further include an upper leveling reservoir 22c configured to output excess cleaning fluid 26a via the leveling reservoir 22a to an overflow container 22b. The upper leveling reservoir 22c may be fluidly coupled to the cleaning container 20d such that when the cleaning fluid 26 in the upper leveling reservoir 22c is at a second predetermined height L2, the cleaning fluid 26 in the cleaning container 20d is also at a second predetermined height L2. The second predetermined height L2 may be higher than the ground level and the first predetermined height L1.

[0039] The body 30 of the cleaning container 20d may define a wall above the second predetermined height L2 so that the cleaning fluid 26 stored in the body 30 may rise without overflowing from the cleaning container 20d (eg, upon receiving the applicator 110).

[0040] In one embodiment, the upper leveling reservoir 22c is fluidly coupled to one or more additional cleaning containers. In one embodiment, the leveling system does not include the upper leveling reservoir 22c. In one embodiment, one or more additional leveling reservoirs can be fluidly coupled to other cleaning containers and configured to output excess cleaning fluid to the overflow container 22b.

[0041] Thus, the leveling system 22 can be configured to output the cleaning fluid 26 at the second predetermined height L2. For example, the upper leveling reservoir 22c can be configured to output excess cleaning fluid 26a at the second predetermined height L2 to the overflow container 22b.

[0042] The upper leveling reservoir 22c can be configured to cascade excess cleaning fluid 26a above the second predetermined height L2 into the overflow container 22b. For example, the upper leveling reservoir 22c can have an open top, allowing excess cleaning fluid 26a to cascade (e.g., pour) from the upper leveling reservoir 22c at the second predetermined height L2 into the leveling reservoir 22a, and then from the leveling reservoir 22a to the overflow container 22b. The wall 40b defining a portion of the upper leveling reservoir 22c and the leveling reservoir 22a can be the shortest wall defining the upper leveling reservoir 22c and the leveling reservoir 22a, allowing excess cleaning fluid 26a to cascade from the upper leveling reservoir 22c to the leveling reservoir 22a over the wall 40b, and then into the overflow container 22b. In one embodiment, the wall 40b may define an outlet port configured to output any excess cleaning fluid 26a above the second predetermined height L2 from the upper leveling reservoir 22c into the leveling reservoir 22a and then into the overflow container 22b.

[0043] For example, the leveling reservoirs 22a and 22c and / or the overflow container 22b may be completely offset from the cleaning containers 20a, 20b, 20c, and 20d along a horizontal axis Y perpendicular to the vertical axis X.

[0044] The leveling system 22 may include level sensors 42a and 42b configured to detect the level of the cleaning fluid 26 in the corresponding leveling reservoir 22a or 22c.

[0045] The controller 44 of the applicator cleaning system 10 can be configured to communicate with the level sensors 42a and 42b. For example, the controller can be configured to maintain the level of the cleaning fluid 26 in the leveling reservoir 22a at a first predetermined height, and to maintain the level of the cleaning fluid 26 in the upper leveling reservoir 22c at a second predetermined height. In one embodiment, the level sensor 42a and / or the level sensor 42b are not provided.

[0046] The applicator cleaning system 10 can include a flow sensor 46 configured to measure the flow rate of the cleaning fluid 26 pumped by the pump 24 to the leveling system 22. The controller 44 can be configured to communicate with the flow sensor 46 to maintain the flow rate at or above a predetermined threshold value so as to maintain the cleaning fluid 26 in the leveling system 22, such that the leveling reservoirs 22a and 22c remain filled and overflow into the overflow container 22b. Thus, maintaining the leveling reservoirs 22a and 22c filled and overflowing can result in maintaining the cleaning fluid 26 in the cleaning containers 20a, 20b, and 20c at a first predetermined height L1 and maintaining the cleaning fluid 26 in the cleaning container 20d at a second predetermined height L2.

[0047] The applicator cleaning system 10 may include a flow control valve 48 configured to regulate the flow of the cleaning fluid 26 from the pump 24 to the leveling system 22. The controller 44 may be configured to communicate with the flow valve 48 to maintain the flow at or above a predetermined threshold (e.g., based on feedback from the flow sensor 46).

[0048] In an embodiment, the leveling system 22 and / or the cleaning containers 20a, 20b, 20c, and 20d can be configured to adjust their respective heights. Adjusting the heights can ensure that the cleaning containers 20a, 20b, 20c, and 20d are filled to a predetermined level within their respective bodies 30 (e.g., approximately 90% of their respective bodies 30 can be filled).

[0049] For example, the cleaning containers 20a, 20b, 20c, and 20d may be mounted to the adjustable bracket 60a ( Figure 2A ) and / or the leveling system 22 may be mounted to the adjustable bracket 60b ( Figure 2A ). The adjustable bracket 60a can be configured to adjust the height of each of the cleaning containers 20a, 20b, 20c, and 20d relative to the leveling system 22 along the vertical axis X. For example, the adjustable bracket 60a can be adjustable so that one or more of the cleaning containers 20a, 20b, and 20c can be moved up or down relative to a first predetermined height L1 and remain in position after such movement. Similarly, the adjustable bracket 60a can be adjustable so that the cleaning container 20d can be moved up or down relative to a second predetermined height L2 and remain in position after such movement.

[0050] The adjustable bracket 60 b may be configured to adjust the height of the leveling system 22 such that the height of the leveling reservoirs 22 a and / or 22 c is adjusted, thereby adjusting the respective first predetermined height L1 and / or second predetermined height L2 along the vertical axis X. For example, the adjustable bracket 60 b may be adjustable such that the leveling reservoirs 22 a and 22 c and the overflow container 22 b may be moved upward or downward relative to the cleaning containers 20 a, 20 b, 20 c, and 20 d along the vertical axis X and maintain their positions after such movement.

[0051] In one embodiment, the output height of the leveling reservoir can be adjusted by another mechanism. For example, the leveling reservoir can include a separate or movable baffle configured to adjust the output height of the cleaning fluid, thereby adjusting the height of the cleaning fluid in the corresponding cleaning container.

[0052] Pump 24 can provide this cleaning fluid to leveling reservoirs 22a and 22c and thus to overflow containers 22a, 20b, 20c and 20d. During use, cleaning fluid 26 in cleaning containers 20a, 20b, 20c and 20d may become contaminated by applicator 110 and / or another source of contamination.

[0053] The applicator cleaning system 10 can include fluid lines 62a, 62b, 62c, and 62d that fluidly connect the cleaning containers 20a, 20b, 20c, and 20d to the leveling system 22, and a check valve 64 between the leveling system 22 and the cleaning containers 20a, 20b, 20c, and 20d. For example, the fluid lines 62a, 62b, and 62c can fluidly couple the leveling reservoir 22a to the cleaning containers 20a, 20b, and 20c, and the fluid line 62d can fluidly couple the upper leveling reservoir 22c to the cleaning container 20d.

[0054] The check valves 64 may be configured to prevent the cleaning fluid 26 in the cleaning containers 20a, 20b, 20c, and 20d from flowing upstream back into the leveling system 22, thereby preventing contaminants that may accumulate in the cleaning containers 20a, 20b, 20c, and 20d from flowing to the leveling system 22.

[0055] The leveling system 22 can include quick connectors 66a, 66b, 66c, and 66d configured to releasably couple the fluid lines 62a, 62b, 62c, and 62d to the respective outlets of the leveling reservoirs 22a and 22c. The quick connectors 66a, 66b, 66c, and 66d can be configured to close when disconnected from the respective fluid line 62a, 62b, 62c, or 62d. For example, if the fluid line 62a is disconnected from the leveling reservoir 22a, the quick connector 66b can close, thereby preventing the cleaning fluid 26 from overflowing from the leveling reservoir 22a. Thus, the quick connectors 66a, 66b, 66c, and 66d can provide for removal and cleaning of one of the fluid lines (e.g., fluid line 62a) and / or one of the cleaning containers (e.g., cleaning container 20a) without interfering with the operation of the pump 24, the leveling system 22, the other fluid lines (fluid lines 62b, 62c, and 62d), and / or the other cleaning containers (e.g., cleaning containers 20b, 20c, and 20d). Such removal and cleaning may not require draining, refilling, or priming of the pump 24 or the leveling system 22.

[0056] Applicator cleaning system 10 may include a system reservoir 70 fluidly coupled to pump 24 and leveling system 22. System reservoir 70 may be configured to store a reserve of cleaning fluid 26 for pump 24 to provide to leveling system 22 and, thereby, cleaning containers 20a, 20b, 20c, and 20d.

[0057] Overflow container 22b can be configured to return excess cleaning fluid 26a from leveling reservoir 22a to system reservoir 70. Thus, cleaning fluid 26 can be constantly provided by pump 24 to leveling system 22 and cleaning containers 20a, 20b, 20c, and 20d without losing cleaning fluid (except due to evaporation). Moreover, because check valve 64 prevents backflow from cleaning containers 20a, 20b, 20c, and 20d via leveling system 22 to system reservoir 70, system reservoir 70 can be kept free of contaminants that could potentially accumulate in cleaning containers 20a, 20b, 20c, and 20d.

[0058] The system reservoir 70 may include a level sensor 72 ( Figure 2C Controller 44 may be configured to generate a user alert and / or shut down pump 24 when cleaning fluid 26 in system reservoir 70 falls below a predetermined reserve level (eg, when system reservoir 70 is at or below 10% of its capacity).

[0059] During use, the controller 44 can control the pump 24 to constantly pump the cleaning fluid 26 from the system reservoir 70 to the upper leveling reservoir 22c at or above a predetermined flow rate. The cleaning fluid 26 can constantly overflow from the upper leveling reservoir 22c into the leveling reservoir 22a at a second predetermined height L2, thereby maintaining the cleaning container 20d filled with the cleaning fluid 26 at the second predetermined height L2. For example, the cleaning fluid 26 can constantly cascade from the upper leveling reservoir 22c into the leveling reservoir 22a (e.g., in a manner similar to a fountain).

[0060] Evaporation of any cleaning fluid 26 in the cleaning container 20d causes fluid to flow from the upper leveling reservoir 22c to the cleaning container 20d so that the cleaning fluid in the cleaning container 20d does not drop below the second predetermined height L2.

[0061] Excess cleaning fluid 26a can constantly overflow from the leveling reservoir 22a into the overflow container 22b at a first predetermined height L1, thereby maintaining the cleaning containers 20a, 20b, and 20c filled with the cleaning fluid 26 at the first predetermined height L1. For example, excess cleaning fluid 26a can constantly cascade from the leveling reservoir 22a into the overflow container 22b (e.g., in a manner similar to a fountain). The overflow container 22b can return the excess cleaning fluid 26a to the system reservoir 70.

[0062] Evaporation of any (or all) cleaning fluid 26 in cleaning container 20a, 20b, or 20c causes fluid to flow from leveling reservoir 22a to such cleaning container 20a, 20b, or 20c such that the cleaning fluid 26 in cleaning container 20a, 20b, and 20c does not fall below first predetermined height L1.

[0063] Now refer to Figure 3 , shows a second embodiment of the applicator cleaning system 10 ′. It should be understood that the second embodiment may be similar to, for example, Figure 1 1 and 2. The first embodiment of the applicator cleaning system 10 is shown. Accordingly, the same reference numerals used above with reference to the first embodiment may also be used with the "primary" notations with reference to the second embodiment. It should also be understood that, unless otherwise stated below, the components (and features thereof) of the applicator cleaning system 10 of the second embodiment may be similar to the components of the applicator cleaning system 10 of the first embodiment.

[0064] Applicator cleaning system 10' can include one or more cleaning containers 20a', 20b', 20c', and 20d' (e.g., solvent cups) defining a leveling system 22', a pump 24, and respective leveling reservoirs of a system reservoir 70. Pump 24 can be configured to provide cleaning fluid 26 from system reservoir 70 to leveling system 22'.

[0065] More specifically, the pump 24 can be fluidically coupled to each of the cleaning containers 20a', 20b', 20c', and 20d'. The cleaning containers 20a', 20b', 20c', and 20d' can each be configured to output fluid to a corresponding overflow container 22b' at a first predetermined height L1 or a second predetermined height L2. For example, each cleaning container may include a body 30' defining an outlet 80. Each outlet 80 can be configured so that when upright relative to gravity, the corresponding body 30' remains filled to a predetermined liquid level within the corresponding body 30'. For example, at most approximately 90% of the corresponding body 30' can be filled with the cleaning fluid 26.

[0066] The cleaning containers 20a', 20b', and 20c' can be arranged so that the corresponding outlets 80 output the cleaning fluid 26 at the first predetermined height L1. For example, the outlets 80 can be configured to cascade excess cleaning fluid 26a' at the first predetermined height L1 to the corresponding overflow container 22b' to return the excess cleaning fluid 26a' to the system reservoir 70.

[0067] The cleaning container 20d' can be arranged so that the corresponding outlet 80 outputs the cleaning fluid 26 at the second predetermined height L2. For example, the outlet 80 of the cleaning container 20d' can be configured to cascade the excess cleaning fluid 26a' at the second predetermined height L2 to the corresponding overflow container 22b' to return the excess cleaning fluid 26a' to the system reservoir 70.

[0068] The cleaning containers 20a', 20b', 20c', and 20d' can be fluidly coupled to the pump 24 in parallel with each other. In one embodiment, the cleaning containers 20a', 20b', 20c', and 20d' can be fluidly coupled to the pump 24 in different ways. Regardless, the pump and the cleaning containers 20a', 20b', 20c', and 20d' can be configured so that excess cleaning fluid 26a constantly flows out of each outlet 80 at the corresponding first predetermined height L1 or second predetermined height L2.

[0069] The applicator cleaning system 10' can include a controller 44, a flow sensor 46, and a level sensor 72. The controller 44 can be in communication with the flow sensor 46 and the level sensor 72. For example, the controller 44 can be configured to operate the pump 24 so that the pump 24 maintains a flow rate at or above a predetermined threshold value so that the cleaning fluid 26 in the cleaning containers 20a', 20b', 20c', and 20d' remains filled and overflows into the corresponding overflow container 22b'.

[0070] The controller 44 may be configured to generate a user alert and / or shut down the pump 24 when the cleaning fluid 26 in the system reservoir 70 is below a predetermined reserve level (eg, when the system reservoir 70 is at or below 10% of its capacity).

[0071] Go to Figure 4 , the conformal coating system 100 may include conformal coating embodiments of the applicator cleaning system 10 (and / or the applicator cleaning system 10 ′) and one or more applicators 110 .

[0072] For example, as described herein, the cleaning container 20a may store a cleaning fluid 26 (e.g., Figure 1). The applicator 110 can be configured to receive one or more conformal coating materials from a material source 112. The applicator 110 can have an applicator tip 114, and the applicator 110 is configured to dispense the received material onto one or more substrates (not shown) through the applicator tip 114. The dispensing of the material can be controlled by one or more dispensing assemblies 132 within the applicator 110 and / or operably connected to the applicator 110. The one or more dispensing assemblies 132 can include movable valves, valve components, etc. (not shown), and can include an actuator to cause movement of the one or more valve components, which can be implemented by, for example, a solenoid.

[0073] When idle, each applicator 110 ( Figure 4 Only one applicator 110 is shown in FIG. 1 ) can be parked in a corresponding cleaning container 20a, 20b, 20c or 20d ( Figure 1 For example, each respective applicator tip 114 of the plurality of applicators 110 may be parked in a corresponding cleaning container 20a, 20b, 20c, or 20d.

[0074] The conformal coating system 100 can include a heater 126 configured to heat the coating material. The heater 126 can be positioned adjacent to the material source 112, the applicator 110, or elsewhere in the conformal coating system 100. In an embodiment, the conformal coating system 100 can include a plurality of heaters 126.

[0075] The applicator 110 can be operably connected to a transport mechanism 124. In some aspects, the transport mechanism 124 can be configured to move the applicator 110 between an operating or dispensing position and a cleaning position. In the operating position, the applicator 110 is configured to dispense material onto a substrate. When in the operating position, the applicator 110 can move relative to the substrate. In the cleaning position, the applicator 110 can be spaced apart from the substrate (e.g., proximate to or at least partially within the cleaning container 20a, as described herein) and prevented from dispensing material onto the substrate.

[0076] The conformal coating system 100 may further include one or more controllers configured to send and / or receive signals to direct the operation of one or more components of the conformal coating system 100. The controller 200 may be configured to send data and / or signals to and / or receive data and / or signals from one or more components of the conformal coating system 100 (e.g., user input / output 172) to control the operation of the conformal coating system 100. The controller 200 may be configured to operate the one or more heaters 126, the transfer mechanism 124, the one or more dispensing assemblies 132, and / or other components of the conformal coating system 100. The controller 200 may include or be operably connected to one or more sensors configured to detect and measure various parameters of the conformal coating system 100.

[0077] Continue to refer Figure 4 , the controller 200 can include or be connected to one or more position sensors 150. As described herein, the one or more position sensors 150 can be configured to detect and / or measure the position of one or more components of the conformal coating system 100. As a non-limiting example, the one or more position sensors 150 can be configured to detect and / or measure the position of a portion of the applicator 110 or the cleaning container 20a.

[0078] The controller 200 may include or be connected to one or more level sensors 130. As described herein, the one or more level sensors 130 may be configured to detect and / or measure the level of a fluid in one or more components of the conformal coating system 100. As a non-limiting example, the one or more level sensors 130 may be configured to detect and / or measure the level of a fluid in the system reservoir 70 ( Figure 1 ) in the liquid level of the cleaning fluid 26.

[0079] In some aspects, the conformal coating system 100 can include multiple position sensors 150 and / or one or more level sensors 130, and the present disclosure is not limited by the specific number or corresponding arrangement of the various sensors described. It should be understood that the specific arrangement of the above components can be according to any suitable arrangement and can depend on the size of the selected individual components, the number of selected components, manufacturing constraints, and / or other considerations common in the industry. Figure 4 The arrangements depicted in the schematic diagrams of FIG. 5 are exemplary and are not limiting with respect to the relative positioning of the components described.

[0080] The conformal coating system 100 can further include a pump 160 configured to provide coating material to the applicator 110. As a non-limiting example, the pump 160 can be configured to provide coating material to the applicator 110 in response to a signal from the controller 200 and / or a sensor (e.g., one or more position sensors 150) indicating that the applicator is in a predetermined position relative to the substrate.

[0081] The conformal coating system 100 can further include an ultrasonic transducer 170. The ultrasonic transducer 170 can be implemented on the outside of the cleaning container 20a. Furthermore, in one embodiment, the ultrasonic transducer 170 can be disposed on the outside of the cleaning container 20a and pointed toward the location of the applicator 110 during cleaning of the applicator 110. However, the ultrasonic transducer 170 can additionally and / or alternatively be implemented anywhere within the cleaning container 20a while immersed in the cleaning fluid 26. Furthermore, in some embodiments, the ultrasonic transducer 170 can be disposed within the cleaning container 20a and pointed toward the location of the applicator 110 during cleaning of the applicator 110.

[0082] The ultrasonic transducer 170 can generally be configured to generate ultrasonic waves through the cleaning fluid 26. To prevent the ultrasonic waves from being absorbed or otherwise disturbed, the ultrasonic transducer 170 can be angled obliquely relative to the vertical axis X so that the ultrasonic waves are generated in a direction toward the through hole 34 defined by the cover 32, such as Figure 2A The ultrasonic transducer 170 can be actuated as needed to generate ultrasonic waves, in response to signals from the controller 200 and / or a sensor (eg, position sensor 150) indicating the position of the applicator 110, as a non-limiting example.

[0083] The controller 200 may include a processor 220 configured to receive signals from one or more fluid level sensors 130 and / or one or more position sensors 150. Additionally, the controller 200 may include analog-to-digital converters, digital-to-analog converters, at least one filter, and the like to prepare and condition the signals. The received signals may include measurements of the fluid level in the system reservoir 70 and / or the position of the applicator 110, respectively. The processor 220 may include a programmable logic controller (PLC), a microprocessor-based controller, a hardened personal computer, or other conventional programmable control device capable of performing the functions described herein, as will be understood by those of ordinary skill. The processor 220 may perform the necessary operations by manipulating switching elements that distinguish and change these states, from one discrete physical state to the next. Switching elements typically include electronic circuits that maintain one of two binary states, such as flip-flops, as well as electronic circuits, such as logic gates, that provide an output state based on a logical combination of the states of one or more other switching elements. These basic switching elements can be combined to create more complex logic circuits, including registers, adder-subtractors, arithmetic logic units, floating-point units, and the like.

[0084] The processor 220 can be configured to connect and communicate with a memory 224 configured to receive and store measurements. The memory 224 can include random access memory (RAM) and / or computer-readable storage media, such as read-only memory (ROM) or non-volatile RAM (NVRAM), for storing basic routines for starting and / or operating the processor 220. The processor 220 can be configured as a controller and / or another component of the conformal coating system 100 and is configured to transfer information between various components and devices of the conformal coating system 100. The memory 224 can also store other software components required for the operation of the processor 220 and / or other components of the conformal coating system 100, including an operating system, software for implementing the cleaning methods described herein, and the like. The processor 220 can include, connect to, or otherwise communicate with a computer-readable storage medium to store and retrieve information, such as program modules, data structures, or other data. Those skilled in the art will appreciate that the computer-readable storage medium can be any available medium that provides storage of non-transitory data and is accessible by the processor 220. As non-limiting examples, computer-readable storage media may include volatile and non-volatile storage media, transitory computer-readable storage media, non-transitory computer-readable storage media, and removable and non-removable media implemented in any method or technology. Such computer-readable storage media include, but are not limited to, RAM, ROM, erasable programmable ROM ("EPROM"), electrically erasable programmable ROM ("EEPROM"), flash memory or other solid-state memory technology, compact disc ROM ("CD-ROM"), digital versatile disc ("DVD"), high-definition DVD ("HD-DVD"), Blu-ray or other optical storage, magnetic cassettes, magnetic tape, disk storage, other magnetic storage devices, or any other medium that can be used to store desired information in a non-transitory manner.

[0085] In one embodiment, the controller 200 includes a controller 44 ( Figure 1 and Figure 3 ) or perform the functions of controller 44.

[0086] Continue to refer Figure 4, the memory 224 may include repositories for measurement data 228 and control data 232. The measurement data 228 may include measurements received from one or more level sensors 130, one or more position sensors 150, and / or one or more other components of the conformal coating system 100. In addition, the measurement data 228 may include acquisition time, other environmental data, etc. The control data 232 may include predefined information that may be pre-programmed into the processor 220 prior to operation of the conformal coating system 100. In operation, the processor 220 may compare the measurement data 228 with the control data 232.

[0087] The processor 220 can also be configured to send one or more signals to one or more components of the conformal coating system 100. In some aspects, the processor 220 can be configured to send one or more signals to components outside of the conformal coating system 100, for example, to or through a wired connection, a wireless connection, a network connection, a cloud network connection (not shown), etc.

[0088] The following are several non-limiting examples of aspects of the disclosure.

[0089] In one general aspect, an applicator cleaning system may include a cleaning container configured to store a cleaning fluid and configured to receive an applicator for cleaning in the cleaning fluid. The applicator cleaning system may also include: a leveling system configured to maintain the cleaning fluid in the cleaning container at a predetermined height, wherein the leveling system is configured to output the cleaning fluid at the predetermined height; and a pump configured to provide the cleaning fluid to the leveling system so that the leveling system outputs the cleaning fluid at the predetermined height. Other embodiments of this aspect include corresponding computer systems, apparatus, and computer programs recorded on one or more computer storage devices, each computer storage device being configured to perform the actions of the method.

[0090] Embodiments may include one or more of the following features. An applicator cleaning system in which the pump is configured to constantly output cleaning fluid to a leveling system. In the applicator cleaning system, the leveling system includes an overflow container and a leveling reservoir, the leveling reservoir being fluidly coupled to the cleaning container such that when the cleaning fluid in the leveling reservoir is at a predetermined height, the cleaning fluid in the cleaning container is at the predetermined height, and wherein the leveling reservoir is configured to output excess cleaning fluid in the cleaning fluid to the overflow container of the leveling system at the predetermined height. In the applicator cleaning system, the overflow container is configured to return excess cleaning fluid to the system reservoir. In the applicator cleaning system, the leveling reservoir is configured to maintain the cleaning fluid at a predetermined height by cascading excess cleaning fluid into the overflow container. In the applicator cleaning system, the leveling reservoir may include an open top such that excess cleaning fluid cascades from the leveling reservoir into the overflow container at the predetermined height. In the applicator cleaning system, the leveling reservoir is a first leveling reservoir, the predetermined height is a first predetermined height, and the leveling system includes a second leveling reservoir that outputs the cleaning fluid at a second predetermined height. In the applicator cleaning system, the leveling reservoir is remote from the cleaning container. The applicator cleaning system may include a quick connector configured to releasably connect a fluid line fluidically coupled to the cleaning container to the leveling reservoir. The applicator cleaning system may include: a flow sensor configured to measure the flow of the cleaning fluid from the pump to the leveling system; and a controller configured to maintain the flow at or above a predetermined threshold so that the cleaning fluid in the leveling system is maintained at a predetermined height. The applicator cleaning system may include: a liquid level sensor configured to measure the height of the cleaning fluid in the leveling system; and a controller configured to maintain the liquid level of the cleaning fluid in the leveling system at a predetermined height. An applicator cleaning system, wherein the applicator cleaning system includes a flow control valve configured to regulate the flow of cleaning fluid from the pump to the leveling system. In the applicator cleaning system, the applicator cleaning system includes a check valve configured to allow the cleaning fluid to flow from the leveling system to the cleaning container, and configured to not allow fluid to flow from the cleaning container to the leveling system. In the applicator cleaning system, the cleaning container includes an opening above the predetermined height through which an applicator is received for cleaning in the cleaning fluid. In the applicator cleaning system, the leveling system is configured to move up and down relative to the cleaning container. In the applicator cleaning system, the cleaning container is configured to move up and down relative to the leveling system. In the applicator cleaning system, the cleaning container does not include a level sensor configured to measure the level of the cleaning fluid in the cleaning container.In the applicator cleaning system, the leveling system includes a cleaning container so that a pump is configured to provide cleaning fluid to the cleaning container so that the cleaning container outputs the cleaning fluid at a predetermined height. In the applicator cleaning system, the leveling system includes an overflow container so that the overflow container is configured to receive the cleaning fluid output from the cleaning container. The coating system may include an applicator cleaning system and an applicator. The coating system further includes one or more additional cleaning containers and one or more additional applicators. In the coating system, the coating system is a conformal coating system. A method of using an applicator cleaning system or a coating system comprises: utilizing a pump to constantly pump cleaning fluid to a leveling system so that the leveling system outputs cleaning fluid at a predetermined height, thereby maintaining the cleaning fluid in the cleaning container at a predetermined height. Implementations of the described technology may include hardware, methods or processes or computer tangible media.

[0091] In one general aspect, the applicator cleaning system may include a cleaning container configured to store a cleaning fluid and configured to receive an applicator for cleaning in the cleaning fluid. The applicator cleaning system may also include: a leveling system configured to maintain the cleaning fluid in the cleaning container at a predetermined height, wherein the leveling system includes a leveling reservoir fluidically coupled to the cleaning container so that when the cleaning fluid in the leveling reservoir is at the predetermined height, the cleaning fluid in the cleaning container is at the predetermined height; and a pump configured to provide the cleaning fluid to the leveling reservoir. Other embodiments of this aspect include corresponding computer systems, devices, and computer programs recorded on one or more computer storage devices, each computer storage device being configured to perform the actions of the method.

[0092] Embodiments may include one or more of the following features. An applicator cleaning system wherein the leveling system further comprises an overflow container, wherein the leveling reservoir is configured such that when the leveling reservoir is filled with cleaning fluid, excess cleaning fluid provided to the leveling reservoir by the pump cascades from the leveling reservoir into the overflow container at the predetermined height. An applicator cleaning system wherein the pump is configured to provide the cleaning fluid to the leveling reservoir such that excess cleaning fluid cascades from the leveling reservoir into the overflow container at the predetermined height. An applicator cleaning system wherein the overflow container is configured to return excess cleaning fluid to the system reservoir to supply the cleaning fluid to the pump. An applicator cleaning system wherein the pump is configured to constantly output the cleaning fluid to the leveling system. The applicator cleaning system, wherein the leveling reservoir is a first leveling reservoir, the predetermined height is a first predetermined height, and the leveling system includes a second leveling reservoir that outputs cleaning fluid at a second predetermined height. The applicator cleaning system, wherein the leveling reservoir is remote from the cleaning container. The applicator cleaning system may include a quick connector configured to releasably connect a fluid line fluidically coupled to the cleaning container to the leveling reservoir. The applicator cleaning system may include: a flow sensor configured to measure the flow of the cleaning fluid from the pump to the leveling system; and a controller configured to maintain the flow at or above a predetermined threshold so that the cleaning fluid in the leveling system is maintained at a predetermined height. The applicator cleaning system, wherein the cleaning container does not include a liquid level sensor configured to measure the liquid level of the cleaning fluid in the cleaning container. The coating system may include an applicator cleaning system and an applicator. The coating system further includes one or more additional cleaning containers and one or more additional applicators. The coating system is a conformal coating system. A method of using the applicator cleaning system or the coating system includes: using the pump to constantly pump the cleaning fluid to the leveling system so that the leveling system outputs the cleaning fluid at the predetermined height, thereby maintaining the cleaning fluid in the cleaning container at the predetermined height. Implementations of the described technology may include hardware, methods, processes, or computer-tangible media.

[0093] It should be noted that the illustration and description of the examples shown in the accompanying drawings are for illustrative purposes only and should not be construed as limiting the present disclosure. It will be understood by those skilled in the art that the present disclosure contemplates various examples. In addition, it should be understood that the concepts described above with respect to the above examples may be used alone or in combination with any of the other examples described above. It should be further understood that the various alternative examples described above with respect to one illustrated example may apply to all examples as described herein, unless otherwise indicated.

[0094] Conditional language used herein, such as "can," "can," "may," "could," "for example," etc., unless expressly stated otherwise or otherwise understood in the context of use, is generally intended to convey that certain embodiments include certain features, elements, and / or steps, while other embodiments do not. Thus, such conditional language is generally not intended to imply that one or more examples in any way require features, elements, and / or steps, or that one or more examples must include these features, elements, and / or steps. The terms "comprise," "include," "have," etc. are synonymous and are used inclusively in an open-ended manner and do not exclude additional elements, features, actions, operations, etc.

[0095] Although the present disclosure has been described in detail, it should be understood that various changes, substitutions, and modifications may be made herein without departing from the spirit and scope of the present disclosure as defined by the appended claims. In addition, any embodiment disclosed herein may be combined with the features disclosed with respect to any other embodiment disclosed herein. Furthermore, the scope of the present disclosure is not intended to be limited to the specific embodiments described in the specification. As will be readily understood by those of ordinary skill in the art, in accordance with the present disclosure, processes, machines, manufactures, compositions of matter, devices, methods, or steps that currently exist or are later developed to perform substantially the same functions or achieve substantially the same results as the corresponding embodiments described herein may be utilized.

[0096] It should be understood that the steps of the exemplary methods set forth herein do not necessarily need to be performed in the order described, and the order of the steps of such methods should be understood to be merely exemplary. Likewise, in methods consistent with various embodiments of the present invention, additional steps may be included in such methods, and certain steps may be omitted or combined.

[0097] Although elements in the following method claims, if any, are recited in a specific order with corresponding labels, those elements are not necessarily intended to be limited to implementation in that specific order unless the claim recitation otherwise implies a specific order for implementing some or all of those elements.

[0098] It should be understood that reference to "a" or "an" in this document to describe a feature, such as a component or step, does not preclude additional features or multiples of that feature. For example, reference to a device having or defining "a" feature does not preclude the device from having or defining more than one feature, as long as the device has or defines at least one feature. Similarly, reference to "an" of multiple features in this document does not preclude the invention from including two or more, or up to all, of the features. For example, reference to a device having or defining "one of X and Y" does not preclude the device from having both X and Y.

Claims

1. An applicator cleaning system comprising: a cleaning container configured to store a cleaning fluid and configured to receive an applicator for cleaning in the cleaning fluid; a leveling system configured to maintain the cleaning fluid in the cleaning container at a predetermined height, wherein the leveling system is configured to output the cleaning fluid at the predetermined height; as well as A pump is configured to provide the cleaning fluid to the leveling system so that the leveling system outputs the cleaning fluid at the predetermined height.

2. The applicator cleaning system of claim 1 , wherein: The pump is configured to constantly output the cleaning fluid to the leveling system.

3. The applicator cleaning system of any one of claims 1 or 2, wherein: The leveling system includes an overflow container and a leveling reservoir, the leveling reservoir fluidly coupled to the cleaning container such that when the cleaning fluid in the leveling reservoir is at the predetermined height, the cleaning fluid in the cleaning container is at the predetermined height, and The leveling reservoir is configured to output excess cleaning fluid in the cleaning fluid to an overflow container of the leveling system at the predetermined height.

4. The applicator cleaning system of claim 3, wherein: The overflow container is configured to return excess cleaning fluid in the cleaning fluid to a system reservoir.

5. An applicator cleaning system according to any one of claims 3 or 4, wherein: The leveling reservoir is configured to maintain the cleaning fluid at the predetermined height by cascading excess cleaning fluid into the overflow container.

6. The applicator cleaning system of claim 5, wherein: The leveling reservoir includes an open top such that the excess cleaning fluid cascades from the leveling reservoir into the overflow container at the predetermined height.

7. An applicator cleaning system according to any one of claims 5 or 6, wherein: The leveling reservoir is a first leveling reservoir, the predetermined height is a first predetermined height, and The leveling system includes a second leveling reservoir that outputs the cleaning fluid at a second predetermined height.

8. The applicator cleaning system of any one of claims 3 to 7, wherein: The leveling reservoir is remote from the cleaning container.

9. The applicator cleaning system of any one of claims 3 to 8, further comprising a quick connect configured to releasably couple a fluid line fluidly coupled to the cleaning container to the leveling reservoir.

10. The applicator cleaning system of any one of claims 1-9, further comprising: a flow sensor configured to measure a flow rate of the cleaning fluid from the pump into the leveling system; as well as A controller is configured to maintain the flow rate at or above a predetermined threshold so that the cleaning fluid in the leveling system is maintained at the predetermined height.

11. The applicator cleaning system of any one of claims 1 to 10, further comprising: a fluid level sensor configured to measure a height of the cleaning fluid in the leveling system; as well as A controller is configured to maintain the level of cleaning fluid in the leveling system at the predetermined height.

12. The applicator cleaning system of any one of claims 1-11, wherein: The applicator cleaning system includes a flow control valve configured to regulate the flow of cleaning fluid from the pump to the leveling system.

13. The applicator cleaning system of any one of claims 1-12, wherein: The applicator cleaning system includes a check valve configured to allow the cleaning fluid to flow from the leveling system to the cleaning container and configured to not allow fluid to flow from the cleaning container to the leveling system.

14. The applicator cleaning system of any one of claims 1 to 13, wherein: The cleaning container includes an opening above the predetermined height through which the applicator is received for cleaning in the cleaning fluid.

15. The applicator cleaning system of any one of claims 1 to 14, wherein: The leveling system is configured to move up and down relative to the cleaning container.

16. An applicator cleaning system according to any one of claims 1 to 15, wherein: The cleaning container is configured to move up and down relative to the leveling system.

17. An applicator cleaning system according to any one of claims 1 to 16, wherein: The cleaning container does not include a level sensor configured to measure a level of the cleaning fluid in the cleaning container.

18. The applicator cleaning system of any one of claims 1, 2, or 9-17, wherein: The leveling system includes the cleaning container, such that a pump is configured to provide the cleaning fluid to the cleaning container such that the cleaning container outputs the cleaning fluid at the predetermined height.

19. The applicator cleaning system of claim 18, wherein: The leveling system includes an overflow container configured to receive the cleaning fluid output from the cleaning container.

20. A coating system comprising: An applicator cleaning system according to any one of claims 1 to 19, The applicator.

21. The coating system of claim 20, further comprising one or more additional cleaning containers and one or more additional applicators.

22. The coating system according to any one of claims 20 or 21, wherein The coating system is a conformal coating system.

23. A method of using the applicator cleaning system according to any one of claims 1 to 19 or using the coating system according to any one of claims 20 to 22, comprising: The cleaning fluid is constantly pumped to the leveling system by the pump, so that the leveling system outputs the cleaning fluid at the predetermined height, thereby maintaining the cleaning fluid in the cleaning container at the predetermined height.

24. An applicator cleaning system comprising: a cleaning container configured to store a cleaning fluid and configured to receive an applicator for cleaning in the cleaning fluid; a leveling system configured to maintain the cleaning fluid in the cleaning container at a predetermined height, wherein the leveling system includes a leveling reservoir fluidly coupled to the cleaning container such that when the cleaning fluid in the leveling reservoir is at the predetermined height, the cleaning fluid in the cleaning container is at the predetermined height; as well as A pump is configured to provide the cleaning fluid to the leveling reservoir.

25. The applicator cleaning system of claim 24, wherein: The leveling system further comprises an overflow container, wherein the leveling reservoir is configured such that when the leveling reservoir is filled with the cleaning fluid, excess cleaning fluid provided to the leveling reservoir by the pump cascades from the leveling reservoir into the overflow container at the predetermined height.

26. The applicator cleaning system of claim 25, wherein: The pump is configured to provide the cleaning fluid to the leveling reservoir such that excess cleaning fluid cascades from the leveling reservoir into the overflow container at the predetermined height.

27. An applicator cleaning system according to any one of claims 25 or 26, wherein: The overflow container is configured to return the excess cleaning fluid to a system reservoir for supplying the cleaning fluid to the pump.

28. An applicator cleaning system according to any one of claims 24 to 27, wherein: The pump is configured to constantly output the cleaning fluid to the leveling system.

29. An applicator cleaning system according to any one of claims 24 to 28, wherein The leveling reservoir is a first leveling reservoir, the predetermined height is a first predetermined height, and The leveling system includes a second leveling reservoir that outputs the cleaning fluid at a second predetermined height.

30. An applicator cleaning system according to any one of claims 24 to 29, wherein The leveling reservoir is remote from the cleaning container.

31. The applicator cleaning system of any one of claims 24 to 30, further comprising a quick connect configured to releasably couple a fluid line fluidly coupled to the cleaning container to the leveling reservoir.

32. The applicator cleaning system of any one of claims 24 to 31 , further comprising: a flow sensor configured to measure a flow rate of the cleaning fluid from the pump into the leveling system; as well as A controller is configured to maintain the flow rate at or above a predetermined threshold so that the cleaning fluid in the leveling system is maintained at the predetermined height.

33. An applicator cleaning system according to any one of claims 24 to 32, wherein: The cleaning container does not include a level sensor configured to measure a level of the cleaning fluid in the cleaning container.

34. A coating system comprising: An applicator cleaning system according to any one of claims 24 to 33, The applicator.

35. The coating system of claim 34, further comprising one or more additional cleaning containers and one or more additional applicators.

36. A coating system according to any one of claims 34 or 35, wherein The coating system is a conformal coating system.

37. A method of using an applicator cleaning system according to any one of claims 24 to 33 or using a coating system according to any one of claims 34 to 36, comprising: The cleaning fluid is constantly pumped to the leveling system by the pump, so that the leveling system outputs the cleaning fluid at the predetermined height, thereby maintaining the cleaning fluid in the cleaning container at the predetermined height.

38. A method of implementing an applicator cleaning system, comprising: storing a cleaning fluid in a cleaning container, and configuring the cleaning container to receive an applicator for cleaning in the cleaning fluid; maintaining the cleaning fluid in the cleaning container at a predetermined height using a leveling system, wherein the leveling system is configured to output the cleaning fluid at the predetermined height; as well as The cleaning fluid is provided to the leveling system by a pump, so that the leveling system outputs the cleaning fluid at the predetermined height.

39. The method of implementing an applicator cleaning system of claim 38, wherein: The pump constantly outputs the cleaning fluid to the leveling system.

40. A method of implementing an applicator cleaning system according to any one of claims 38 or 39, wherein: The leveling system includes an overflow container and a leveling reservoir, the leveling reservoir fluidly coupled to the cleaning container such that when the cleaning fluid in the leveling reservoir is at the predetermined height, the cleaning fluid in the cleaning container is at the predetermined height, and The leveling reservoir outputs excess cleaning fluid in the cleaning fluid to the overflow container of the leveling system at the predetermined height.

41. The method of implementing an applicator cleaning system of claim 40, wherein: The overflow container returns excess cleaning fluid in the cleaning fluid to the system reservoir.

42. A method of implementing an applicator cleaning system according to any one of claims 40 or 41, wherein: The leveling reservoir maintains the cleaning fluid at the predetermined height by cascading excess cleaning fluid into the overflow container.

43. The method of implementing an applicator cleaning system of claim 42, wherein: The leveling reservoir includes an open top such that the excess cleaning fluid cascades from the leveling reservoir into the overflow container at the predetermined height.

44. A method of implementing an applicator cleaning system according to any one of claims 42 or 43, wherein: The leveling reservoir is a first leveling reservoir, the predetermined height is a first predetermined height, and The leveling system includes a second leveling reservoir that outputs the cleaning fluid at a second predetermined height.

45. A method of implementing an applicator cleaning system according to any one of claims 40 to 44, wherein: The leveling reservoir is remote from the cleaning container.

46. ​​The method of implementing an applicator cleaning system of any one of claims 40 to 45, further comprising a quick connect configured to releasably couple a fluid line fluidly coupled to the cleaning container to the leveling reservoir.

47. The method of implementing an applicator cleaning system according to any one of claims 38 to 46, further comprising: measuring the flow rate of the cleaning fluid from the pump into the leveling system using a flow sensor; as well as The flow rate is maintained at or above a predetermined threshold using a controller so that the cleaning fluid in the leveling system is maintained at the predetermined height.

48. The method of implementing an applicator cleaning system according to any one of claims 38 to 47, further comprising: measuring the height of the cleaning fluid in the leveling system using a liquid level sensor; as well as The level of the cleaning fluid in the leveling system is maintained at the predetermined height using a controller.

49. A method of implementing an applicator cleaning system according to any one of claims 38 to 48, wherein: The method of implementing the applicator cleaning system comprises: A flow control valve is configured to regulate the flow of cleaning fluid from the pump to the leveling system.

50. A method of implementing an applicator cleaning system according to any one of claims 38 to 49, wherein: The method of implementing the applicator cleaning system comprises: configuring a check valve to allow the cleaning fluid to flow from the leveling system to the cleaning container, and The check valve is configured to not allow fluid to flow from the cleaning container to the leveling system.

51. A method of implementing an applicator cleaning system according to any one of claims 38 to 50, wherein: The cleaning container includes an opening above the predetermined height that receives the applicator for cleaning in the cleaning fluid.

52. A method of implementing an applicator cleaning system according to any one of claims 38 to 51, wherein: The leveling system is configured to move up and down relative to the cleaning container.

53. A method of implementing an applicator cleaning system according to any one of claims 38 to 52, wherein the cleaning container is configured to move up and down relative to the leveling system.

54. A method of implementing an applicator cleaning system according to any one of claims 38 to 53, wherein: The cleaning container does not include a level sensor configured to measure a level of the cleaning fluid in the cleaning container.

55. A method of implementing an applicator cleaning system according to any one of claims 38, 39 or 46 to 54, wherein: The leveling system includes the cleaning container, such that a pump is configured to provide the cleaning fluid to the cleaning container such that the cleaning container outputs the cleaning fluid at the predetermined height.

56. The method of implementing an applicator cleaning system of claim 55, wherein: The leveling system includes an overflow container that receives the cleaning fluid output from the cleaning container.

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