Full-path integrated temperature control system of three-temperature test sorting machine

Abstract

The invention provides a full-path integrated temperature control system of a three-temperature test sorting machine. The full-path integrated temperature control system comprises a pre-heating assembly, a carrying assembly, a detection assembly and a temperature control assembly, the pre-warming assembly, the carrying assembly and the detection assembly are all provided with temperature control assemblies so as to keep the same set test temperature; the temperature control assembly comprises a heating unit and a refrigerating unit. The pre-warming assembly comprises a pre-warming disc, and the pre-warming disc, a heating unit and a refrigerating unit are stacked in the first direction from top to bottom, wherein the heating unit and the refrigerating unit are arranged on the pre-warming assembly. The carrying assembly comprises a carrying disc, and the carrying disc is stacked with the heating unit and the refrigerating unit arranged on the carrying assembly from top to bottom in the first direction; the detection assembly comprises a lower pressing disc, and the lower pressing disc, a heating unit and a refrigerating unit are stacked from bottom to top in the first direction, wherein the heating unit and the refrigerating unit are arranged on the detection assembly. According to the full-path integrated temperature control system of the three-temperature test sorting machine disclosed by the invention, the full-path temperature of the chip from a pre-heating stage, a transfer stage to a detection stage is ensured to be consistent.

Description

Technical Field

[0001] The present invention relates to the technical field of three-temperature test and sorting machines, and in particular to a full-path integrated temperature control system for a three-temperature test and sorting machine. Background Art

[0002] Tri-temperature test and sorting machines are designed specifically for testing integrated circuit chips (ICs), capable of testing and sorting chips in high, room, and low temperature environments. Currently, existing tri-temperature test and sorting machines use a preheating device to preheat or cool the chips to a set test temperature during testing. This preheating prevents a significant difference between the initial chip surface temperature and the test temperature during testing.

[0003] However, during the testing process of the three-temperature test sorting machine in the existing technology, especially when the chip enters the transportation stage and the testing stage after being preheated by the preheating device, the chip temperature may change due to reasons such as environmental heat exchange, causing the chip surface temperature to deviate from the set test temperature, affecting the data accuracy and test efficiency of subsequent tests.

[0004] It should be noted that the above introduction to the background technology is merely for the purpose of providing a clear and complete description of the technical solutions of this application and facilitating understanding by those skilled in the art. Simply because these solutions are described in the background technology section of this application, it should not be assumed that the above technical solutions are well known to those skilled in the art. Summary of the Invention

[0005] The purpose of the present invention is to disclose a full-path integrated temperature control system for a three-temperature test and sorting machine, which is used to solve the many defects of the three-temperature test and sorting machines in the prior art, especially to ensure that the temperature of the chip is consistent throughout the entire path from the pre-temperature stage, the transfer stage to the detection stage.

[0006] To achieve the above-mentioned object, the present invention provides a full-path integrated temperature control system for a three-temperature test and sorting machine, comprising: a pre-temperature component, a carrier component and a detection component, and a temperature control component; The pre-heating component, the carrying component and the detection component are all provided with temperature control components to maintain the same set test temperature; The temperature control assembly includes: a heating unit and a cooling unit; The pre-heating assembly includes a pre-heating tray, and the pre-heating tray and the heating unit and the cooling unit provided in the pre-heating assembly are stacked from top to bottom along a first direction; The carrier assembly includes a carrier plate, and the carrier plate and the heating unit and the cooling unit provided on the carrier assembly are stacked from top to bottom along a first direction; The detection assembly includes a lower pressure plate, and the lower pressure plate and the heating unit and the cooling unit arranged on the detection assembly are stacked from bottom to top along a first direction.

[0007] As a further improvement of the present invention, the pre-heating tray is constructed with a pre-heating surface for carrying chips, and a first heating unit provided in the pre-heating assembly is provided with a first conductive surface on a side surface close to the pre-heating tray, and the first conductive surface is in contact with a bottom surface of the pre-heating tray on a side opposite to the pre-heating surface; A second conduction surface is constructed on the bottom surface of the first heating unit opposite to the pre-heating plate, and a third conduction surface is constructed on the surface of the first refrigeration unit arranged in the pre-heating component close to the first heating unit, and the second conduction surface is in contact with the third conduction surface.

[0008] As a further improvement of the present invention, the carrier is constructed with a transmission surface for carrying chips, and a second heating unit provided in the carrier assembly is constructed with a fourth conduction surface on a side surface close to the carrier, and the fourth conduction surface is in contact with the bottom surface of the carrier opposite to the transmission surface. A fifth conduction surface is constructed on the bottom surface of the second heating unit opposite to the carrier plate, and a sixth conduction surface is constructed on the surface of the second refrigeration unit arranged in the carrier assembly close to the second heating unit, and the fifth conduction surface is in contact with the sixth conduction surface.

[0009] As a further improvement of the present invention, the lower pressure plate is configured to have a holding surface for applying pressure to the chip, and a surface of the third heating unit provided in the detection assembly on one side close to the lower pressure plate is configured to have a seventh conductive surface, and the seventh conductive surface is in contact with a bottom surface of the lower pressure plate on a side opposite to the holding surface; An eighth conduction surface is constructed on the bottom surface of the third heating unit opposite to the lower pressure plate, and a ninth conduction surface is constructed on the surface of the third refrigeration unit arranged in the detection component close to the third heating unit, and the eighth conduction surface is in contact with the ninth conduction surface.

[0010] As a further improvement of the present invention, the first conduction surface of the first heating unit is provided with a plurality of positioning posts, and the bottom surface of the pre-heating tray is constructed with positioning holes corresponding to the positioning posts, wherein at least one of the positioning holes is a waist-shaped hole, and the long axis direction of the waist-shaped hole is parallel to the thermal expansion direction of the pre-heating tray.

[0011] As a further improvement of the present invention, the temperature control assembly further includes: a plurality of locking members penetrating the heating unit along the first direction and extending into the refrigeration unit.

[0012] As a further improvement of the present invention, the heating unit includes: a heating plate, and a plurality of groups of heating wires evenly arranged on the heating plate.

[0013] As a further improvement of the present invention, the refrigeration unit includes: a refrigeration plate, and a refrigeration flow channel constructed on the refrigeration plate for circulating refrigerant; The cooling channel includes: a first channel spirally extending from the periphery of the cooling plate to the center of the cooling plate, and a second channel spirally extending from the center of the cooling plate to the periphery of the cooling plate; The first flow channel and the second flow channel are staggeredly distributed along a spiral direction, the first flow channel is connected to the second flow channel, and the flow direction of the refrigerant in the first flow channel is opposite to the flow direction of the refrigerant in the second flow channel.

[0014] As a further improvement of the present invention, the refrigeration channel is constructed inside the refrigeration plate, and the refrigeration plate is opened to form an inlet connected to the first channel and an outlet connected to the second channel, so that the refrigerant can circulate in the refrigeration channel.

[0015] As a further improvement of the present invention, the refrigeration plate is constructed with a first partition and a second partition in a spiral shape, and the first partition and the second partition are staggered along the spiral direction; The first flow channel and the second flow channel are respectively enclosed between the refrigeration plate and the first partition and the second partition.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: the preheating component carries the chip to be tested through the preheating tray, and the preheating component uses an integrated heating unit and a cooling unit to pre-treat the temperature of the chip before testing, so that the chip reaches and maintains the set test temperature. After the preheating tray completes the initial temperature control of the chip, the preheated chip is moved to the carrier tray by a manipulator, and the carrying component uses an integrated heating unit and a cooling unit to keep the chip at the set test temperature during the movement of the carrier tray. The carrying component transports the preheated chip to the test station of the detection component through the carrier tray, and the detection component performs a compression test on the chip through the lower pressure plate. At the same time, the detection component uses an integrated heating unit and a cooling unit to keep the chip at the set test temperature during the compression test to ensure that the compression test temperature is consistent with the set test temperature, thereby achieving temperature consistency of the chip throughout the entire path from the preheating stage, the transport stage to the detection stage, avoiding deviations between the chip surface temperature and the set test temperature, ensuring the accuracy of the test data, and no need to wait for the chip surface temperature to reach the set test temperature before testing during the test, thereby improving the test efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1This is an overall schematic diagram of the full-path integrated temperature control system of the three-temperature test and sorting machine disclosed in the present invention; Figure 2 A cross-sectional view showing the connection between the pre-heating tray, the first heating unit, and the first cooling unit; Figure 3 is a cross-sectional view of the connection between the carrier plate, the second heating unit, and the second cooling unit; Figure 4 A cross-sectional view showing the connection between the lower platen, the third heating unit, and the third cooling unit; Figure 5 This is a schematic diagram of the connection between the pre-heating plate and the positioning column; Figure 6 is a cross-sectional view of the heating plate; Figure 7 A cross-sectional view of the cooling plate. DETAILED DESCRIPTION

[0018] The present invention is described in detail below with reference to the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in this field based on these embodiments are all within the scope of protection of the present invention.

[0019] The drawings in the present invention are not drawn strictly to scale, and the specific dimensions of each structure can be determined according to actual needs. The drawings described in the present invention are only schematic structural diagrams.

[0020] The preheating devices of the three-temperature test sorting machines in the prior art mostly adopt a layered structure of "preheating plate-refrigeration unit-heating unit", with the refrigeration unit located above the heating unit and cooling through refrigerant circulation. Heat needs to be transferred from the heating unit to the preheating plate through an intermediate layer (such as the refrigeration unit), which increases thermal resistance and reduces heating efficiency. In addition, during the testing process of the three-temperature test sorting machines in the prior art, especially when the chip enters the transfer stage and the testing stage after being preheated by the preheating device, the chip temperature may change due to factors such as environmental heat exchange, causing the chip surface temperature to deviate from the set test temperature, affecting the data accuracy and test efficiency of subsequent tests.

[0021] Please refer to Figures 1 to 7 A specific implementation of a full-path integrated temperature control system for a three-temperature testing and sorting machine is disclosed.

[0022] Ginseng Figures 1 to 4 As shown, in this embodiment, the full-path integrated temperature control system 100 of the three-temperature test and sorting machine includes: a pre-temperature component 10, a carrier component 20 and a detection component 30, and a temperature control component 40; The preheating component 10, the transport component 20 and the detection component 30 are all provided with a temperature control component 40 to maintain the same set test temperature; the temperature control component 40 includes: a heating unit 401 and a cooling unit 402; the preheating component 10 includes a preheating plate 11, and the preheating plate 11 and the heating unit 401 and the cooling unit 402 arranged in the preheating component 10 are stacked from top to bottom along the first direction; the transport component 20 includes a carrier plate 21, and the carrier plate 21 and the heating unit 401 and the cooling unit 402 arranged in the transport component 20 are stacked from top to bottom along the first direction; the detection component 30 includes a lower pressure plate 31, and the lower pressure plate 31 and the heating unit 401 and the cooling unit 402 arranged in the detection component 30 are stacked from bottom to top along the first direction.

[0023] The temperature control assembly 40 includes a heating unit 401 and a cooling unit 402. The three groups of temperature control assemblies 40 are respectively integrated into the pre-heating assembly 10, the transport assembly 20 and the detection assembly 30. The three groups of temperature control assemblies 40 are uniformly coordinated and controlled by a PLC control system (not shown) to synchronously control the set test temperatures of the pre-heating assembly 10, the transport assembly 20 and the detection assembly 30, so that the pre-heating assembly 10, the transport assembly 20 and the detection assembly 30 maintain the same set test temperature.

[0024] The heating units (401a, 401b, 401c) disposed in each component (i.e., the preheating assembly 10, the carrier assembly 20, and the detection assembly 30) respectively provide heat to the preheating tray 11, the carrier tray 21, and the lower pressure plate 31. By stacking the preheating tray 11, the heating unit 401a, and the cooling unit 402a disposed in the preheating assembly 10 from top to bottom along a first direction, the preheating tray 11 and the heating unit 401a are in direct contact, shortening the heat conduction path between the preheating tray 11 and the heating unit 401a and achieving efficient heat conduction. Similarly, the carrier plate 21 is in direct contact with the heating unit 401b provided in the carrier assembly 20, and the lower pressure plate 31 is in direct contact with the heating unit 401c provided in the detection assembly 30. This can shorten the heat conduction path between the carrier plate 21 and the heating unit 401b, and shorten the heat conduction path between the lower pressure plate 31 and the heating unit 401c, greatly reducing the thermal resistance and achieving efficient heat conduction, thereby solving the problem of the intermediate thermal resistance layer in the layered structure of the preheating device in the prior art, so as to improve the heating efficiency of the preheating plate 11, the carrier plate 21 and the lower pressure plate 31, so that the preheating plate 11, the carrier plate 21 and the lower pressure plate 31 can be quickly heated to the set test temperature (for example, 25°C or 150°C) under the action of the heating units (401a, 401b, 401c).

[0025] The refrigeration units (402a, 402b, 402c) configured in each component are used to absorb excess heat from the preheating plate 11, the carrier plate 21, and the lower pressure plate 31, or to actively reduce the temperature. Furthermore, the refrigeration units (402a, 402b, 402c) can evenly transfer cooling energy to the preheating plate 11, the carrier plate 21, and the lower pressure plate 31, preventing local overheating or overcooling and ensuring uniform temperatures across the preheating plate 11, the carrier plate 21, and the lower pressure plate 31. This allows the preheating plate 11, the carrier plate 21, and the lower pressure plate 31 to be cooled to a set test temperature (e.g., 25°C or -55°C). The refrigeration units (402a, 402b, 402c) and the heating unit 401 (401a, 401b, 401c) provided in each component work in concert to balance the heat of each component and maintain the stability of the set test temperature of each component during operation.

[0026] The present application discloses a full-path integrated temperature control system 100 of a three-temperature test sorting machine, wherein the preheating component 10 carries the chip to be tested through the preheating tray 11, and the preheating component 10 uses the integrated heating unit 401a and the cooling unit 402a to pre-treat the temperature of the chip before testing, so that the chip reaches and maintains the set test temperature (for example, 150°C, 25°C or -55°C); after the preheating tray 11 completes the initial temperature control of the chip, the preheated chip is moved to the carrier 21 by a manipulator (not shown), and the carrier component 20 uses the integrated heating unit 401b and the cooling unit 402b to keep the chip at the set test temperature during the movement of the carrier 21; the carrier component 20 uses the integrated heating unit 401b and the cooling unit 402b to keep the chip at the set test temperature during the movement of the carrier 21; The carrier 21 transfers the preheated chip to the test station 32 of the detection component 30. The detection component 30 performs a compression test on the chip through the lower pressure plate 31. At the same time, the detection component 30 uses the integrated heating unit 401c and the cooling unit 402c to keep the chip at the set test temperature during the compression test to ensure that the compression test temperature is consistent with the set test temperature, thereby achieving temperature consistency of the chip throughout the entire path from the preheating stage, the transfer stage to the detection stage, avoiding deviations between the chip surface temperature and the set test temperature, ensuring the accuracy of the test data, and eliminating the need to wait for the chip surface temperature to reach the set test temperature before testing during the test, thereby improving the test efficiency of the chip.

[0027] In some examples, the stacked structure formed by the heating units (401a, 401b, 401c) and the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31 respectively greatly reduces the thermal resistance, so that in normal temperature (for example, 25°C) or high temperature (for example, 150°C) environmental tests, the heating units (401a, 401b, 401c) can respectively perform efficient heat conduction on the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31, so that the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31 can be quickly heated to the set test temperature, and the temperature difference between the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31 is reduced, thereby reducing the temperature fluctuation of the chip from the pre-heating stage, the transportation stage to the detection stage, so as to ensure that the temperature of the chip is consistent from the pre-heating stage, the transportation stage to the detection stage in normal temperature or high temperature environmental tests. Moreover, in a low-temperature (e.g., -55°C) environmental test, the refrigeration units (402a, 402b, 402c) can evenly transfer cold energy to the pre-heating plate 11, the carrier plate 21, and the lower pressure plate 31, thereby avoiding local overheating or overcooling, making the overall temperature of the pre-heating plate 11, the carrier plate 21, and the lower pressure plate 31 uniform, and reducing the temperature difference between the pre-heating plate 11, the carrier plate 21, and the lower pressure plate 31, thereby reducing the temperature fluctuation of the chip from the pre-heating stage, the transportation stage to the detection stage, thereby ensuring that the temperature of the chip is consistent from the pre-heating stage, the transportation stage to the detection stage in a low-temperature environmental test.

[0028] In some examples, the temperature control assembly 40 further includes temperature sensors (not shown) disposed within each component for detecting the temperature of the pre-heating platen 11, the carrier platen 21, and the lower platen 31. The temperature sensors may cover the center and edge areas of the pre-heating platen 11, the carrier platen 21, and the lower platen 31 to collect temperature data. This temperature data can be transmitted in real time to a PLC control system to dynamically adjust the power of the temperature control assembly 40, enabling active temperature control throughout the entire process of pre-heating, transport, and testing (i.e., crimping testing), ensuring consistent chip temperature throughout the entire process from pre-heating and transport to testing.

[0029] In some examples, in a single batch of continuous three-temperature tests, the same batch of chips undergoes tests in high temperature, room temperature to low temperature (or, low temperature, room temperature to high temperature) environments in sequence. This application uses the test process of high temperature, room temperature to low temperature as an example to illustrate that the pre-heating component 10 in the full-path integrated temperature control system 100 of the three-temperature test sorting machine quickly heats the pre-heating plate 11 to a set test temperature (for example, 150°C) through the heating unit 401a to pre-heat the chips and maintain the set test temperature (for example, 150°C). At the same time, the carrier component 20 and the detection component 30 quickly heat the carrier plate 21 and the lower pressure plate 31 to the same set test temperature as the pre-heating plate 11 through the heating unit 401b and the heating unit 401c respectively, so that the temperature of the chips is consistent throughout the entire path from the pre-heating stage, the transport stage to the detection stage, ensuring the continuity of subsequent chip testing. After the chip is transferred to the test station 32 of the detection component 30, the detection component 30 performs a compression test on the chip through the lower pressure plate 31. The lower pressure plate 31 first tests the chip in a high-temperature environment. After the high-temperature test is completed, the lower pressure plate 31 is cooled to room temperature (for example, 25°C) through the refrigeration unit 402c, so that the lower pressure plate 31 can test the chip in a room temperature environment. After the room temperature test is completed, the lower pressure plate 31 is cooled to low temperature (for example, -55°C) through the refrigeration unit 402c, so that the lower pressure plate 31 can test the chip in a low-temperature environment.

[0030] It can be understood that during the continuous three-temperature test process of the same batch of chips from high temperature, normal temperature to low temperature (or, low temperature, normal temperature to high temperature), the pre-heating component 10 pre-heats or cools the chips to the initial set test temperature (for example, -55°C or 150°C), and at the same time, the carrier component 20 and the detection component 30 are also pre-heated or cooled to the same initial set test temperature as the pre-heating component 10 (for example, -55°C or 150°C), thereby achieving the consistency of the initial set test temperature of the same batch of chips throughout the entire path from the pre-heating stage, the transportation stage to the detection stage.

[0031] It should be noted that after the detection component 30 completes the initial test temperature (for example, -55°C or 150°C) detection of the chip, the detection component 30 will switch to normal temperature (for example, 25°C), and after completing the test of the chip under normal temperature environment, it will switch to high temperature or low temperature to test the chip. After the detection component 30 completes the initial test temperature test of the chip, the temperature of the detection component 30 switched to normal temperature, high temperature or low temperature is inconsistent with the temperature of the preheating component 10 and the carrier component 20 of the initial test temperature.

[0032] In some examples, during a multi-batch three-temperature test process, different batches of chips are tested in different temperature environments (high temperature, room temperature, or low temperature). This application uses the example of different batches of chips being first tested in a high temperature environment. The preheating component 10 in the full-path integrated temperature control system 100 of the three-temperature test sorting machine quickly heats the preheating plate 11 to a set test temperature (e.g., 150°C) through the heating unit 401a to preheat the chips and maintain the set test temperature (e.g., 150°C). At the same time, the transport component 20 and the detection component 30 quickly heat the carrier plate 21 and the lower pressure plate 31 to the same set test temperature as the preheating plate 11 through the heating unit 401b and the heating unit 401c, respectively. This ensures that the temperatures of different batches of chips are consistent throughout the entire path from the preheating stage, the transport stage, to the detection stage in the high-temperature test environment, ensuring the continuity of subsequent chip testing. After the chip is transferred to the test station 32 of the detection component 30, the detection component 30 performs a compression test on the chip through the lower pressure plate 31, and the lower pressure plate 31 tests the chip in a high-temperature environment. After different batches of chips complete the high-temperature test, the refrigeration unit 402a cools the pre-heating plate 11 to room temperature (for example, 25°C), the refrigeration unit 402b cools the carrier plate 21 to room temperature (for example, 25°C), and the refrigeration unit 402c cools the lower pressure plate 31 to room temperature (for example, 25°C), so that the temperature of different batches of chips is consistent throughout the entire path from the pre-heating stage, the transfer stage to the detection stage under a normal temperature test environment. The lower pressure plate 31 tests the chips under normal temperature environment. After different batches of chips complete the normal temperature test, the refrigeration unit 402a cools the pre-heating plate 11 to a low temperature (for example, -55°C), the refrigeration unit 402b cools the carrier plate 21 to a low temperature (for example, -55°C), and the refrigeration unit 402c cools the lower pressure plate 31 to a low temperature (for example, -55°C) to ensure that the temperatures of different batches of chips are consistent throughout the entire path from the pre-heating stage, the transportation stage to the detection stage under a low-temperature test environment.

[0033] It can be understood that during the three-temperature test process of different batches of chips from high temperature, room temperature to low temperature (or, low temperature, room temperature to high temperature), the pre-temperature component 10 pre-heats or cools the chips to the initial set test temperature (for example, -55°C or 150°C), and at the same time, the carrier component 20 and the detection component 30 are also pre-heated or cooled to the same initial set test temperature as the pre-temperature component 10 (for example, -55°C or 150°C), thereby achieving temperature consistency of the chips throughout the entire path from the pre-temperature stage, the transportation stage to the detection stage.

[0034] In some examples, during single-batch continuous three-temperature testing and multi-batch three-temperature testing, the preheating assembly 10, carrier assembly 20, and detection assembly 30 are all initially set to either a high or low temperature. This reduces the number of temperature switches, shortens the test cycle, and thus reduces energy consumption. If the test were to begin at room temperature (e.g., 25°C), additional heating (to a high temperature) or cooling (to a low temperature) steps would be required, increasing energy consumption and time costs.

[0035] It should be noted that the transport assembly 20 may include a slide 22 equipped with a carrier 21, a displacement drive unit 23 (e.g., an electric slide) that drives the slide 22 toward the test station 32 of the inspection assembly 30, and conventional components such as a displacement sensor, which are not described in detail here. The inspection assembly 30 may also include a transfer device for moving the chip on the carrier 21 to the test station 32, a lifting drive unit (not shown) that drives the lower platen 31 to perform a pressure test on the chip, which may be a servo electric cylinder device, and conventional components such as a pressure feedback unit, which are not described in detail here.

[0036] In some examples, Figure 2As shown, the preheating tray 11 is constructed with a preheating surface 111 for carrying chips, and the first heating unit 41 provided in the preheating assembly 10 is constructed with a first conduction surface 411 on one side of the surface close to the preheating tray 11, and the first conduction surface 411 is in contact with the bottom surface of the preheating tray 11 on the side opposite to the preheating surface 111; the first heating unit 41 is constructed with a second conduction surface 412 on the bottom surface of the side opposite to the preheating tray 11, and the first cooling unit 42 provided in the preheating assembly 10 is constructed with a third conduction surface 421 on one side of the surface close to the first heating unit 41, and the second conduction surface 412 is in contact with the third conduction surface 421. The bottom surface of the preheating tray 11 is aligned with the first conduction surface 411 of the first heating unit 41, shortening the heat conduction path between the first heating unit 41 and the preheating tray 11. This allows the first heating unit 41 to directly conduct heat to the preheating tray 11, eliminating the intermediate thermal resistance layer in the layered structure of the preheating device in the prior art. This increases the heating rate of the preheating tray 11 and allows it to quickly reach the set test temperature (for example, 25°C or 150°C). The second conduction surface 412 is tightly aligned with the third conduction surface 421, forming a bidirectional heat conduction channel in the first heating unit 41, enabling direct heat exchange between the first heating unit 41 and the first cooling unit 42. The first refrigeration unit 42 conducts the cold energy to the second conduction surface 412 via the third conduction surface 421, and then transfers the cold energy to the pre-heating plate 11 via the first heating unit 41 to absorb excess heat from the pre-heating plate 11 or actively cool it down, thereby cooling the pre-heating plate 11 to a set test temperature (e.g., 25°C or -55°C). The first refrigeration unit 42 and the first heating unit 41 coordinately regulate the temperature of the pre-heating plate 11 to achieve active temperature control during the pre-heating stage, thereby maintaining the temperature of the chip stable during the pre-heating stage. The pre-heating surface 111 serves as a direct contact surface between the pre-heating plate 11 and the chip, enabling zero-gap heat conduction to the chip, efficiently transferring heat or cold energy to the chip, and allowing the chip to reach the set test temperature. In some examples, the pre-heating surface 111 is constructed with multiple placement slots (not shown) for accommodating the chip.

[0037] In some examples, preferably, the bottom surface of the preheating tray 11, the first conduction surface 411, the second conduction surface 412 and the third conduction surface 421 are all set to be planes, so as to maximize the contact area between the bottom surface of the preheating tray 11 and the first conduction surface 411 and the contact area between the second conduction surface 412 and the third conduction surface 421, thereby improving the heat conduction efficiency.

[0038] In some examples, Figure 3As shown, the carrier 21 is constructed with a transmission surface 211 for carrying chips, and the second heating unit 43 provided in the carrier assembly 20 is constructed with a fourth conduction surface 431 on a side surface close to the carrier 21, and the fourth conduction surface 431 is in contact with the bottom surface of the carrier 21 on the side opposite to the transmission surface 211; the second heating unit 43 is constructed with a fifth conduction surface 432 on the bottom surface of the side opposite to the carrier 21, and the second cooling unit 44 provided in the carrier assembly 20 is constructed with a sixth conduction surface 441 on a side surface close to the second heating unit 43, and the fifth conduction surface 432 is in contact with the sixth conduction surface 441. The bottom surface of the carrier plate 21 is in contact with the fourth conductive surface 431 of the second heating unit 43, shortening the heat conduction path between the second heating unit 43 and the carrier plate 21. This significantly reduces thermal resistance and allows the second heating unit 43 to directly transfer heat to the carrier plate 21, accelerating the temperature rise of the carrier plate 21 and rapidly heating it to the set test temperature (e.g., 25°C or 150°C). The fifth conductive surface 432 and the sixth conductive surface 441 are in close contact with each other, forming a bidirectional heat conduction channel between the second heating unit 43 and the second cooling unit 44. The second cooling unit 44 conducts cooling energy via the sixth conductive surface 441 to the fifth conductive surface 432. This cooling energy is then efficiently transferred to the carrier plate 21 via the second heating unit 43, absorbing excess heat from the carrier plate 21 or actively cooling it, effectively cooling the carrier plate 21 to the set test temperature (e.g., 25°C or -55°C). The second cooling unit 44 and the second heating unit 43 coordinate to regulate the temperature of the carrier plate 21, achieving active temperature control during the transfer phase to maintain a stable chip temperature. The transfer surface 211, serving as the direct contact surface between the carrier plate 21 and the chip, enables zero-gap heat conduction to the chip, efficiently transferring heat or cold to the chip, allowing the chip to reach the set test temperature. In some examples, the transfer surface 211 is constructed with several slots (not labeled) for accommodating the chip.

[0039] In some examples, preferably, the bottom surface of the carrier 21, the fourth conduction surface 431, the fifth conduction surface 432 and the sixth conduction surface 441 are all set to be planes, so as to maximize the contact area between the bottom surface of the carrier 21 and the fourth conduction surface 431 and the contact area between the fifth conduction surface 432 and the sixth conduction surface 441, thereby improving the heat conduction efficiency.

[0040] In some examples, Figure 4As shown, the lower pressure plate 31 is constructed with a holding surface 311 for applying pressure to the chip, and the third heating unit 45 provided in the detection component 30 is constructed with a seventh conduction surface 451 on a side surface close to the lower pressure plate 31, and the seventh conduction surface 451 is in contact with the bottom surface of the lower pressure plate 31 on the side opposite to the holding surface 311; the third heating unit 45 is constructed with an eighth conduction surface 452 on a side bottom surface opposite to the lower pressure plate 31, and the third refrigeration unit 46 provided in the detection component 30 is constructed with a ninth conduction surface 461 on a side surface close to the third heating unit 45, and the eighth conduction surface 452 is in contact with the ninth conduction surface 461. The bottom surface of the lower platen 31 mates with the seventh conduction surface 451 of the third heating unit 45, shortening the heat conduction path between the third heating unit 45 and the lower platen 31 and significantly reducing thermal resistance. This allows the third heating unit 45 to directly transfer heat to the lower platen 31, accelerating the temperature rise of the lower platen 31 and rapidly heating it to the set test temperature (e.g., 25°C or 150°C). The eighth conduction surface 452 and the ninth conduction surface 461 mate tightly with each other, forming a bidirectional heat conduction channel between the third heating unit 45 and the third cooling unit 46. The third cooling unit 46 conducts cooling energy via the ninth conduction surface 461 to the eighth conduction surface 452. This cooling energy is then efficiently transferred to the lower platen 31 via the third heating unit 45, absorbing excess heat from the lower platen 31 or actively cooling it, effectively cooling it to the set test temperature (e.g., 25°C or -55°C). The third cooling unit 46 and the third heating unit 45 coordinately regulate the temperature of the lower platen 31, achieving active temperature control during the testing phase. This allows for rapid temperature switching of the lower platen 31 during a single batch of continuous three-temperature tests, while maintaining a stable temperature during the testing phase across multiple batches of three-temperature tests. The holding surface 311, acting as a direct contact surface between the lower platen 31 and the chip, enables zero-gap heat conduction to the chip, efficiently transferring heat or cooling to the chip testing area and maintaining a stable test temperature.

[0041] In some examples, preferably, the bottom surface of the lower pressure plate 31, the seventh conduction surface 451, the eighth conduction surface 452 and the ninth conduction surface 461 are all set to be planes, so as to maximize the contact area between the bottom surface of the lower pressure plate 31 and the seventh conduction surface 451 and the contact area between the eighth conduction surface 452 and the ninth conduction surface 461, thereby improving the heat conduction efficiency.

[0042] In some examples, Figure 5As shown, the first conductive surface 411 of the first heating unit 41 is equipped with multiple positioning posts 413. The bottom surface of the pre-heating tray 11 is constructed with positioning holes 112 corresponding to the positioning posts 413. At least one positioning hole 112 is a waist-shaped hole 113, with the long axis of the waist-shaped hole 113 parallel to the thermal expansion direction of the pre-heating tray 11. During installation of the pre-heating tray 11, the positioning holes 112 are aligned with the positioning posts 413 one by one, and the positioning posts 413 are inserted into the positioning holes 112. This ensures that the pre-heating tray 11 and the first heating unit 41 are precisely aligned and installed, ensuring that the bottom surface of the pre-heating tray 11 and the first conductive surface 411 of the first heating unit 41 are stably attached. Because the long axis of the waist-shaped holes 113 is parallel to the thermal expansion direction of the pre-heating tray 11, the pre-heating tray 11 can extend along the long axis of the waist-shaped holes 113 during thermal expansion, thereby eliminating thermal stress concentration.

[0043] In some examples, Figures 2 to 4 As shown, the temperature control assembly 40 further includes: a plurality of locking members 47 that penetrate the heating unit 401 along a first direction and extend into the cooling unit 402. The locking members 47 (eg, bolts) are arranged along the first direction (ie, Figure 1 The longitudinal axis (in the direction indicated by the Z axis) penetrates the heating unit 401 and extends into the cooling unit 402 to apply a pre-tightening force in a first direction to the heating unit 401 and the cooling unit 402, thereby eliminating the stacking gap between the heating unit 401 and the cooling unit 402 and ensuring stable contact of the heat conduction contact surface.

[0044] In some examples, the temperature control assembly 40 further includes: a plurality of first fixing members 51 (e.g., bolts) extending through the carrier plate 21 in a first direction and into the second heating unit 43; and a plurality of second fixing members 52 (e.g., bolts) extending through the lower pressure plate 31 in a first direction and into the third heating unit 45. The first fixing members 51 securely mount the carrier plate 21 to the second heating unit 43, applying a preload force in the first direction to the carrier plate 21, eliminating the stacking gap between the carrier plate 21 and the second heating unit 43 and ensuring stable contact between the bottom surface of the carrier plate 21 and the fourth conductive surface 431 of the second heating unit 43. The second fixing members 52 securely mount the lower pressure plate 31 to the third heating unit 45, applying a preload force in the first direction to the lower pressure plate 31, eliminating the stacking gap between the lower pressure plate 31 and the third heating unit 45 and ensuring stable contact between the bottom surface of the lower pressure plate 31 and the seventh conductive surface 451 of the third heating unit 45.

[0045] In some examples, Figure 2 and Figure 6 As shown, Figure 2 is a cross-sectional view of the pre-heating tray 11, the first heating unit 41, and the first cooling unit 42. Figure 6It is a cross-sectional view of the heating plate 48. The heating unit 401 includes: a heating plate 48, and several groups of heating wires 481 evenly arranged on the heating plate 48. The heating plate 48 is constructed with grooves 482 for accommodating the heating wires 481. It should be noted that the first heating unit 41, the second heating unit 43 and the third heating unit 45 all adopt the same structure as the heating unit 401. The area of ​​the heating plate included in the first heating unit 41 is adapted to the pre-heating plate 11, the area of ​​the heating plate included in the second heating unit 43 is adapted to the carrier plate 21, and the area of ​​the heating plate included in the third heating unit 45 is adapted to the lower pressure plate 31. The number of groups of heating wires 481 can be scaled or increased or decreased proportionally. The heating plate 48 is made of a high thermal conductivity material, and the depth and width of the groove 482 match the size of the heating wire 481 to fix the position of the heating wire 481. The heating plate 48 is fully and evenly heated by the heating wire 481 , so that the heating plate 48 can achieve a good heat conduction effect on the pre-heating plate 11 , the carrier plate 21 and the lower pressure plate 31 .

[0046] When it is necessary to actively heat the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31 (for example, from 25°C to 150°C, or from -55°C to 25°C), the target temperature instruction is sent to each component through the PLC control system, and the heating wire 481 in each component is started. The heat is evenly diffused through the heating plate 48, so that the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31 are quickly heated to the set test temperature (for example, 25°C or 150°C). The actual temperature of each component is detected by the temperature sensor, and the power of the heating wire 481 in each component is controlled by the PLC control system to ensure that the heat of the heating plate 48 is balanced with the chip temperature and the ambient temperature of each component, so as to maintain the set test temperature of each component (for example, 150°C) and ensure that the temperature of the chip is consistent throughout the entire path from the pre-heating stage, the transfer stage to the detection stage.

[0047] In some examples, Figure 6 As shown, the heating wire 481 is bent along the third direction Y. Specifically, in the second direction X, the heating wire 481 is bent multiple times along the second direction Y. The heating wire 481 is bent to fully and evenly heat the heating plate 48, achieving a more efficient and uniform heat conduction effect.

[0048] In some examples, Figure 2 and Figure 7As shown, refrigeration unit 402 includes a refrigeration plate 49 and a refrigeration channel 490 configured on refrigeration plate 49 for circulating refrigerant. Refrigeration channel 490 includes a first channel 491 spirally extending from the periphery of refrigeration plate 49 toward the center of refrigeration plate 49, and a second channel 492 spirally extending from the center of refrigeration plate 49 toward the periphery of refrigeration plate 49. The first channel 491 and the second channel 492 are staggered along the spiral direction and communicate with each other. The refrigerant in the first channel 491 flows in the opposite direction to the refrigerant in the second channel 492. Refrigeration plate 49 is made of a highly thermally conductive material. It should be noted that the first refrigeration unit 42, the second refrigeration unit 44 and the third refrigeration unit 46 all adopt the same structure as the refrigeration unit 402. The area of ​​the refrigeration plate included in the first refrigeration unit 42 is adapted to the first heating unit 41, the area of ​​the refrigeration plate included in the second refrigeration unit 44 is adapted to the second heating unit 43, and the area of ​​the refrigeration plate included in the third refrigeration unit 46 is adapted to the third heating unit 45. The refrigeration channel 490 can be scaled synchronously in proportion.

[0049] In some examples, Figure 7 As shown, the refrigerant flow channel 490 is constructed within the refrigeration plate 49. The refrigeration plate 49 is provided with an inlet 493 connected to the first flow channel 491 and an outlet 494 connected to the second flow channel 492, allowing refrigerant to circulate within the refrigeration flow channel 490. The refrigerant circulation and delivery device includes a refrigeration compressor (not shown) that provides refrigerant to the refrigeration plates 49 in each component. The refrigerant is injected into the refrigeration flow channel 490 through the inlet 493. The refrigerant enters the first flow channel 491 from the inlet 493 and flows along a spiral path from the outer periphery of the refrigeration plate 49 to the center of the refrigeration plate 49 in the first flow channel 491. After entering the second flow channel 492, the refrigerant flows along a spiral path from the center of the refrigeration plate 49 to the outer periphery of the refrigeration plate 49 in the second flow channel 492. The refrigerant returns to the refrigeration compressor from the outlet 494 through the second flow channel 492. The refrigerant provided by the refrigeration compressor to the refrigeration plates 49 in each component can then return to the refrigeration compressor after heat exchange at the working position, thus achieving a cyclic operation.

[0050] When it is necessary to actively cool the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31, the external refrigerant circulation and delivery device (not shown) provides refrigerant to the refrigeration plate 49 in each component, and the refrigerant flows from the periphery of the refrigeration plate 49 to the center of the refrigeration plate 49 along a spiral path in the first flow channel 491. During this process, the refrigerant continuously absorbs the heat load from the peripheral area to the central area of ​​the refrigeration plate 49, and preferentially cools the high-temperature peripheral area of ​​the refrigeration plate 49. After reaching the center of the refrigeration plate 49, the refrigerant automatically flows from the first flow channel 491 into the second flow channel 492, and flows from the center of the refrigeration plate 49 toward the periphery of the refrigeration plate 49 along a spiral path in the second flow channel 492, and cools the high temperature of the central area of ​​the refrigeration plate 49 again to make the overall temperature of the refrigeration plate 49 uniform.

[0051] During this process, the temperature of the refrigerant first injected into the first flow channel 491 gradually increases, and after the heated refrigerant enters the second flow channel 492, at the same time, new low-pressure and low-temperature refrigerant is continuously injected into the first flow channel 491, and the refrigerant flow direction (such as the refrigerant flow direction) in the first flow channel 491 is gradually increased. Figure 7 direction indicated by the arrow L1) and the refrigerant flow direction in the second flow channel 492 (as shown in FIG. Figure 7 The direction is opposite to that indicated by the middle arrow L2, so that the refrigerant flowing in the second flow channel 492 releases heat to the new refrigerant in the adjacent first flow channel 491, and the refrigerant flowing in the first flow channel 491 continuously exchanges heat with the refrigerant flowing in the second flow channel 492, so that the newly injected low-temperature refrigerant in the first flow channel 491 absorbs heat, avoiding overcooling of the peripheral area of ​​the cooling plate 49, and causing the heated refrigerant in the second flow channel 492 to release heat, avoiding overheating of the central area of ​​the cooling plate 49, thereby reducing the temperature difference between the refrigerant in the first flow channel 491 and the refrigerant in the second flow channel 492, ensuring that the overall temperature of the cooling plate 49 is uniform, so that the cooling plate 49 can uniformly transfer cooling capacity to the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31, avoiding local overheating or overcooling of the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31, and reducing the temperature difference between the pre-heating plate 11, the carrier plate 21 and the lower pressure plate 31. The refrigerant flowing in the second flow channel 492 returns to the refrigeration compressor through the outlet 494, and the cycle repeats. The actual temperature of each component is detected by a temperature sensor, and the PLC control system controls the refrigerant circulation and delivery device to adjust the refrigerant flow rate to each component, ensuring that the heat absorbed by the refrigerant is balanced with the chip temperature and the ambient temperature of each component. This maintains the set test temperature of each component and ensures that the chip temperature is consistent throughout the entire process from the pre-heating stage, the transport stage, to the testing stage.

[0052] In some examples, Figure 7 As shown, the cooling plate 49 is constructed with a spiral-shaped first partition 495 and a second partition 496, which are staggered along the spiral direction. The cooling plate 49 and the first partition 495 and the second partition 496 respectively enclose a first flow channel 491 and a second flow channel 492. One end of the first partition 495 is connected to the side of the cooling plate 49, and the other end of the first partition 495 is free. One end of the second partition 496 is connected to the side of the cooling plate 49, and the other end of the second partition 496 is free. When the refrigerant enters the first flow channel 491 from the inlet 493, it is guided by the first partition 495 and the second partition 496 to flow along a spiral path toward the center of the refrigeration plate 49. After absorbing heat, the refrigerant naturally turns from the free end of the first flow channel 491 to the free end of the second flow channel 492. When it flows back in the second flow channel 492, it exchanges heat with the new refrigerant in the adjacent first flow channel 491 through countercurrent flow. The staggered layout of the first partition 495 and the second partition 496 can expand the heat exchange area, thereby reducing the temperature difference in the entire area of ​​the refrigeration plate 49 and making the overall temperature of the refrigeration plate 49 uniform.

[0053] In some examples, Figures 1 to 7 As shown, the first partition 495 and the second partition 496 can both be welded by a plurality of elongated components (not marked), and the plurality of elongated components are welded along a set spiral path to form the first partition 495 and the second partition 496 respectively. When the overall shape of the preheating plate 11, the carrier plate 21 and the lower pressure plate 31 is preferably a rectangular parallelepiped, since the area of ​​the cooling plate 49 and the area of ​​the heating plate 48 in each component are adapted to the area of ​​the corresponding preheating plate 11, the carrier plate 21 or the lower pressure plate 31, the overall shape of the cooling plate 49 is also a rectangular parallelepiped, and thus it is preferred that a 90° angle is formed between any two connected components. By forming a 90° angle between any two connected components, the refrigerant in the first flow channel 491 and the second flow channel 492 can achieve vertical turning during the flow, so as to form turbulence during the vertical turning process, so that the outer layer refrigerant flowing along the side wall of the first partition 495 in the first flow channel 491 is mixed with the central refrigerant, and the outer layer refrigerant flowing along the side wall of the second partition 496 in the second flow channel 492 is mixed with the central refrigerant, so that the mixed refrigerant can quickly absorb heat and improve the heat exchange efficiency.

[0054] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0055] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0056] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A full-path integrated temperature control system for a three-temperature test and sorting machine, characterized in that: include: Pre-heating components, transport components, detection components, and temperature control components; The pre-heating component, the carrying component and the detection component are all provided with temperature control components to maintain the same set test temperature; The temperature control assembly includes: a heating unit and a cooling unit; The pre-heating assembly includes a pre-heating tray, and the pre-heating tray and the heating unit and the cooling unit provided in the pre-heating assembly are stacked from top to bottom along a first direction; The carrier assembly includes a carrier plate, and the carrier plate and the heating unit and the cooling unit provided on the carrier assembly are stacked from top to bottom along a first direction; The detection assembly includes a lower pressure plate, and the lower pressure plate and the heating unit and the cooling unit arranged on the detection assembly are stacked from bottom to top along a first direction.

2. The full-path integrated temperature control system of the three-temperature test and sorting machine according to claim 1 is characterized in that: The pre-heating plate is configured to have a pre-heating surface for carrying chips, and a first heating unit provided in the pre-heating assembly is configured to have a first conductive surface on a side of the surface close to the pre-heating plate, and the first conductive surface is in contact with a bottom surface of the pre-heating plate opposite to the pre-heating surface; A second conduction surface is constructed on the bottom surface of the first heating unit opposite to the pre-heating plate, and a third conduction surface is constructed on the surface of the first refrigeration unit arranged in the pre-heating component close to the first heating unit, and the second conduction surface is in contact with the third conduction surface.

3. The full-path integrated temperature control system of the three-temperature test and sorting machine according to claim 1 is characterized in that: The carrier is constructed with a transmission surface for carrying chips, and a second heating unit provided in the carrier assembly is provided with a fourth conductive surface on a side surface close to the carrier, and the fourth conductive surface is in contact with the bottom surface of the carrier opposite to the transmission surface; A fifth conduction surface is constructed on the bottom surface of the second heating unit opposite to the carrier plate, and a sixth conduction surface is constructed on the surface of the second refrigeration unit arranged in the carrier assembly close to the second heating unit, and the fifth conduction surface is in contact with the sixth conduction surface.

4. The full-path integrated temperature control system of the three-temperature test and sorting machine according to claim 1 is characterized in that: The lower pressing plate is configured to have a holding surface for applying pressure to the chip, and a surface of the third heating unit provided in the detection assembly on a side close to the lower pressing plate is configured to have a seventh conducting surface, and the seventh conducting surface is in contact with a bottom surface of the lower pressing plate on a side opposite to the holding surface; An eighth conduction surface is constructed on the bottom surface of the third heating unit opposite to the lower pressure plate, and a ninth conduction surface is constructed on the surface of the third refrigeration unit arranged in the detection component close to the third heating unit, and the eighth conduction surface is in contact with the ninth conduction surface.

5. The full-path integrated temperature control system of the three-temperature test and sorting machine according to claim 2 is characterized in that: The first conduction surface of the first heating unit is provided with a plurality of positioning posts, and the bottom surface of the pre-heating tray is constructed with positioning holes corresponding to the positioning posts, wherein at least one of the positioning holes is a waist-shaped hole, and the long axis direction of the waist-shaped hole is parallel to the thermal expansion direction of the pre-heating tray.

6. The full-path integrated temperature control system of the three-temperature test and sorting machine according to any one of claims 1 to 4, characterized in that: The temperature control assembly further includes: a plurality of locking members penetrating the heating unit along a first direction and extending into the refrigeration unit.

7. The full-path integrated temperature control system of the three-temperature test and sorting machine according to any one of claims 1 to 4, characterized in that: The heating unit includes a heating plate and a plurality of groups of heating wires evenly arranged on the heating plate.

8. The full-path integrated temperature control system of the three-temperature test and sorting machine according to any one of claims 1 to 4, characterized in that: The refrigeration unit includes: a refrigeration plate, and a refrigeration flow channel constructed on the refrigeration plate for circulating refrigerant; The cooling channel includes: a first channel spirally extending from the periphery of the cooling plate to the center of the cooling plate, and a second channel spirally extending from the center of the cooling plate to the periphery of the cooling plate; The first flow channel and the second flow channel are staggeredly distributed along a spiral direction, the first flow channel is connected to the second flow channel, and the flow direction of the refrigerant in the first flow channel is opposite to the flow direction of the refrigerant in the second flow channel.

9. The full-path integrated temperature control system of the three-temperature test and sorting machine according to claim 8, characterized in that: The refrigeration flow channel is constructed inside the refrigeration plate. The refrigeration plate is provided with an inlet connected to the first flow channel and an outlet connected to the second flow channel, so that the refrigerant can circulate in the refrigeration flow channel.

10. The full-path integrated temperature control system of the three-temperature test and sorting machine according to claim 8, characterized in that: The refrigeration plate is constructed with a first partition and a second partition in a spiral shape, and the first partition and the second partition are staggered along the spiral direction; The first flow channel and the second flow channel are respectively enclosed between the refrigeration plate and the first partition and the second partition.

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