High-adhesion acrylic pure glue and preparation method thereof

Abstract

The application relates to the technical field of adhesives, in particular to high-adhesion acrylic pure glue and a preparation method thereof, wherein the preparation raw materials include, according to weight parts, 215-374 parts of acrylic copolymer, 13-36 parts of epoxy resin, 3-45 parts of a crosslinking agent, 0.6-13 parts of a curing agent and 45-53 parts of a flame retardant; the crosslinking agent includes 2,4-dihydroxyphenyl ethanone and a hydrazide crosslinking agent. The specific crosslinking agent and the limited amount thereof are used, the prepared acrylic pure glue has a peeling strength of >20 N / cm, the elongation at break can be controlled within 150%, the glue overflow amount is less than 100 mu m, and glue gas is not generated.

Description

Technical Field

[0001] The present invention relates to the technical field of adhesives, and in particular to a high-adhesion acrylic pure adhesive and a preparation method thereof. Background Art

[0002] With the continuous development of adhesive technology, the application of adhesives in equipment assembly is becoming increasingly common. Acrylic adhesives, as one of the most commonly used structural adhesives, are widely used in aerospace, high-speed rail, ships, automobiles, electronics, machinery, construction, new energy and other fields.

[0003] For example, Chinese invention patent application CN1754933A discloses an acrylic adhesive composition and acrylic adhesive sheet, prepared from acrylic polymers, fusible phenolic resins, epoxy resins, and non-polar fillers, and exhibiting excellent heat resistance and storage stability. Chinese invention patent application CN113402989A provides an acrylic ester adhesive that extends the shelf life of the adhesive and facilitates long-term, large-area adhesive coating. However, the elongation at break of adhesives prepared using these technologies is generally 400% or higher, and the adhesive layer is prone to stringing during cutting, seriously affecting processing accuracy and subsequent processes. Summary of the Invention

[0004] In response to the problems in the prior art, the first aspect of the present invention provides a high-adhesion acrylic pure glue. The raw materials for preparation include, by weight, 215-374 parts of acrylic copolymer, 13-36 parts of epoxy resin, 3-45 parts of cross-linking agent, 0.6-13 parts of curing agent and 45-53 parts of flame retardant; the cross-linking agent includes 2,4-dihydroxyphenyl acetone and hydrazide cross-linking agent.

[0005] In one embodiment, the hydrazide cross-linking agent includes 7,11-octadecadiene-1,18-dicarbohydrazide.

[0006] In one embodiment, the mass ratio of the 2,4-dihydroxyphenyl acetone to the 7,11-octadecadiene-1,18-dicarbohydrazide is 1:2.

[0007] The crosslinking agent in the present invention is a compound of 2,4-dihydroxyphenyl acetone and a long-chain hydrazide crosslinking agent 7,11-octadecadiene-1,18-dicarbohydrazide. The phenolic hydroxyl groups of 2,4-dihydroxyphenyl acetone react with the epoxy groups of o-cresol epoxy resin to form a "phenolic hydroxyl-epoxy" crosslinking network, thereby improving the interfacial bonding strength between the adhesive and the substrate. The long-chain hydrazide crosslinking agent reacts with the epoxy groups through the hydrazide groups to form a "hydrazide-epoxy" crosslinking network. The long-chain structure of the crosslinking agent can limit the excessive extension of the molecular chain through steric hindrance and molecular entanglement, thereby reducing the elongation at break while ensuring the toughness of the adhesive layer. When the weight ratio of the two is further limited to 1:2, the two are compounded to form an interpenetrating network structure, while taking into account high peel strength and low deformation ability, and suppressing glue overflow, thereby avoiding excessive 2,4-dihydroxyphenyl acetone from being decomposed under high temperature during pressing to produce glue gas, thereby affecting product performance.

[0008] In one embodiment, the raw materials of the acrylic copolymer include, by weight, 85-119 parts of mixed monomers, 0.1-5 parts of initiator, and 130-250 parts of solvent.

[0009] In one embodiment, the mixed monomer comprises butyl methacrylate, ethyl acrylate, acrylonitrile, hydroxyethyl acrylate, and glycidyl methacrylate; the mass ratio of butyl methacrylate, ethyl acrylate, acrylonitrile, hydroxyethyl acrylate, and glycidyl methacrylate is: (42-49): (22-30): (9-16): (7-11): (5-13). Examples include: 45:30:9:8:7, 42:22:13:11:11, 49:26:12:7:5, and 44:24:16:8:13.

[0010] In one embodiment, the initiator comprises benzoyl peroxide.

[0011] In one embodiment, the solvent is ethyl acetate.

[0012] In one embodiment, the weight average molecular weight of the acrylic copolymer is 100,000-400,000, and can be 100,000, 210,000, 290,000, 320,000, 360,000, or 4,000,000.

[0013] In one embodiment, the curing agent includes an imidazole curing agent and an aromatic amine curing agent.

[0014] In one embodiment, the aromatic amine curing agent includes 4,4-dimethyldiphenylamine; and the imidazole curing agent includes imidazole.

[0015] In one embodiment, the mass ratio of the imidazole curing agent to the aromatic amine curing agent is (0.5-1.6):(3-9), which can be 0.5:9, 0.8:6, 1:3, 1:6, 1.6:3, or 1.6:9.

[0016] In one embodiment, the epoxy resin is a novolac epoxy resin.

[0017] In one embodiment, the novolac epoxy resin includes o-cresol novolac epoxy resin.

[0018] In one embodiment, the flame retardant is aluminum diethylphosphinate complex.

[0019] The invention provides an application of pure acrylic adhesive in protecting a rigid-flexible board from cover opening.

[0020] A second aspect of the present invention provides a method for preparing a high-adhesion acrylic adhesive, comprising the following steps:

[0021] The raw material of the acrylic acid copolymer is subjected to solution polymerization to obtain the acrylic acid copolymer;

[0022] The acrylic copolymer, epoxy resin, cross-linking agent, curing agent and flame retardant are stirred and dispersed uniformly to obtain the acrylic pure glue.

[0023] In one embodiment, the solution polymerization method comprises: (1) adding 10-50 wt% of a mixed monomer, 20-30 wt% of an initiator and 25-35 wt% of ethyl acetate into a reactor, stirring and heating, controlling the rotation speed at 160-200 r / min, and controlling the temperature at 80-88° C. to react for 1-2 hours; (2) uniformly mixing the remaining mixed monomer, 20-30 wt% of the initiator and 10-20 wt% of ethyl acetate and adding the mixture into a dropping funnel; (3) after the reaction of step (1) is completed, maintaining the temperature at 80-88° C., and starting to dropwise add the mixture of step (2), dripping for 2-3 hours, and then keeping the temperature for reaction for 1-2 hours, then adding 10-20 wt% of the initiator, keeping the temperature for reaction again for 1-2 hours, then adding the remaining initiator, continuing the temperature for reaction for 1-2 hours, adding the remaining ethyl acetate and stirring for 5-10 minutes, and cooling to obtain an acrylic copolymer.

[0024] Beneficial effects

[0025] 1. The crosslinking agent in the present invention is a compound of 2,4-dihydroxyphenyl acetone and a long-chain hydrazide crosslinking agent 7,11-octadecadiene-1,18-dicarbohydrazide to form an interpenetrating network structure, which takes into account high peel strength and low deformation ability, reduces elongation at break and inhibits glue overflow, and avoids excessive 2,4-dihydroxyphenyl acetone from decomposing under high temperature to produce glue gas, which affects product performance.

[0026] 2. The present invention combines 2,4-dihydroxyphenyl acetone and 7,11-octadecadiene-1,18-dicarbohydrazide with imidazole, which can make the epoxy resin and imidazole basically unreactive at room temperature, allowing the product to be stored for a long time.

[0027] 3. The present invention uses imidazole and 4,4-dimethyldiphenylmethane as curing agents to control the elongation at break and avoid cutting the elastic wire, while improving the peel strength and heat resistance. The two work together to make the adhesive both processable and reliable.

[0028] 4. The peel strength of the acrylic pure glue provided by the present invention is greater than 20N / cm, the elongation at break is low and can be controlled within 150%, the amount of glue overflow is less than 100μm, and there is little residue when the cover of the soft and hard combination board is opened. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is the test result diagram of comparative example 4 after the glue gas overflow test. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the examples and drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. The experimental methods for which specific conditions are not specified in the examples are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used for which the manufacturer is not specified are all conventional products that can be purchased commercially.

[0031] Example 1

[0032] The first aspect of this embodiment provides a high-adhesion acrylic pure glue, which is prepared from raw materials including, by weight, 280 parts of acrylic copolymer, 25 parts of epoxy resin, 30 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant; the cross-linking agent is 2,4-dihydroxyphenyl acetone and 7,11-octadecadiene-1,18-dicarbohydrazide.

[0033] The mass ratio of the 2,4-dihydroxyphenyl acetone to 7,11-octadecadiene-1,18-dicarbohydrazide is 1:2.

[0034] The raw materials of the acrylic copolymer include 99 parts by weight of mixed monomers, 1 part of initiator and 180 parts of solvent.

[0035] The mixed monomers are butyl methacrylate, ethyl acrylate, acrylonitrile, hydroxyethyl acrylate and glycidyl methacrylate, with a mass ratio of 45:30:9:8:7.

[0036] The initiator is benzoyl peroxide, and the solvent is ethyl acetate.

[0037] The weight average molecular weight of the acrylic copolymer is 320,000.

[0038] The epoxy resin is o-cresol epoxy resin, model SQCN703, from Jinan Shengquan Group Co., Ltd.

[0039] The curing agent is imidazole and 4,4-dimethyldiphenylamine, and the weight ratio of the imidazole to 4,4-dimethyldiphenylamine is 1:6.

[0040] The flame retardant is aluminum diethylphosphinate complex.

[0041] A second aspect of this embodiment provides a method for preparing a high-adhesion acrylic adhesive, comprising the following steps:

[0042] The raw materials of the acrylic copolymer are subjected to solution polymerization to obtain the acrylic copolymer; the solution polymerization method comprises: (1) adding 30 wt% of a mixed monomer, 25 wt% of an initiator and 30 wt% of ethyl acetate into a reactor, heating while stirring, controlling the rotation speed at 180 r / min, and controlling the temperature at 84°C to react for 1.5 hours; (2) uniformly mixing the remaining mixed monomer, 25 wt% of the initiator and 15 wt% of the ethyl acetate and adding the mixture into a dropping funnel; (3) maintaining the temperature at 84°C after the reaction of step (1) is completed, and starting to dropwise add the mixture of step (2), dripping it for 2.5 hours, and then keeping the temperature for reaction for 1.5 hours after dripping is completed, then adding 15 wt% of the initiator, keeping the temperature for reaction again for 1.5 hours, then adding the remaining initiator, continuing the temperature for reaction for 1.5 hours, adding the remaining ethyl acetate and stirring for 7 minutes, and cooling to obtain the acrylic copolymer.

[0043] The acrylic copolymer, epoxy resin, cross-linking agent, curing agent and flame retardant are stirred and dispersed uniformly to obtain the acrylic pure glue.

[0044] Example 2

[0045] The specific implementation of this embodiment is the same as that of Example 1, except that, in parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 28 parts of epoxy resin, 30 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0046] Example 3

[0047] The specific implementation of this embodiment is the same as that of Example 1, except that the weight average molecular weight of the acrylic copolymer is 290,000.

[0048] Example 4

[0049] The specific implementation of this embodiment is the same as that of Example 1, except that, in parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 28 parts of epoxy resin, 30 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0050] The weight average molecular weight of the acrylic copolymer is 290,000.

[0051] Example 5

[0052] The specific implementation of this embodiment is the same as that of Example 1, except that, in parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 39 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0053] Example 6

[0054] The specific implementation of this embodiment is the same as that of Example 1, except that, in parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 36 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0055] The weight average molecular weight of the acrylic copolymer is 290,000.

[0056] Example 7

[0057] The specific implementation of this embodiment is the same as that of Example 1, except that, based on weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 24 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0058] Example 8

[0059] The specific implementation of this embodiment is the same as that of Example 1, except that, based on weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 24 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0060] The weight average molecular weight of the acrylic copolymer is 290,000.

[0061] Example 9

[0062] The specific implementation of this embodiment is the same as that of Example 1, except that, in parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 30 parts of cross-linking agent, 6.8 parts of curing agent and 45 parts of flame retardant.

[0063] The curing agent is imidazole and 4,4-dimethyldiphenylamine, and the weight ratio of the imidazole to 4,4-dimethyldiphenylamine is 0.8:6.

[0064] Example 10

[0065] The specific implementation of this embodiment is the same as that of Example 1, except that, in parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 30 parts of cross-linking agent, 4 parts of curing agent and 45 parts of flame retardant.

[0066] The mixed monomers are butyl methacrylate, ethyl acrylate, acrylonitrile, hydroxyethyl acrylate and glycidyl methacrylate, with a mass ratio of 42:22:13:11:11.

[0067] The weight average molecular weight of the acrylic copolymer is 360,000.

[0068] The curing agent is imidazole and 4,4-dimethyldiphenylamine, and the weight ratio of the imidazole to 4,4-dimethyldiphenylamine is 1:3.

[0069] Example 11

[0070] The specific implementation of this embodiment is the same as that of Example 1, except that, in parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 36 parts of epoxy resin, 21 parts of cross-linking agent, 4.6 parts of curing agent and 53 parts of flame retardant.

[0071] The mixed monomers are butyl methacrylate, ethyl acrylate, acrylonitrile, hydroxyethyl acrylate and glycidyl methacrylate, with a mass ratio of 49:26:12:7:5.

[0072] The weight average molecular weight of the acrylic copolymer is 210,000.

[0073] The curing agent is imidazole and 4,4-dimethyldiphenylamine, and the weight ratio of the imidazole to 4,4-dimethyldiphenylamine is 1.6:3.

[0074] Example 12

[0075] The specific implementation of this embodiment is the same as that of Example 1, except that, in parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 13 parts of epoxy resin, 30 parts of cross-linking agent, 9.5 parts of curing agent and 45 parts of flame retardant.

[0076] The mixed monomers are butyl methacrylate, ethyl acrylate, acrylonitrile, hydroxyethyl acrylate and glycidyl methacrylate, with a mass ratio of 44:24:16:8:13.

[0077] The curing agent is imidazole and 4,4-dimethyldiphenylamine, and the weight ratio of the imidazole to 4,4-dimethyldiphenylamine is 0.5:9.

[0078] Comparative Example 1

[0079] The specific implementation of this comparative example is the same as that of Example 1, except that, based on parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 20 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0080] The cross-linking agent is 7,11-octadecadiene-1,18-dicarbohydrazide.

[0081] Comparative Example 2

[0082] The specific implementation of this comparative example is the same as that of Example 1, except that, based on parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 6 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0083] The cross-linking agent is 7,11-octadecadiene-1,18-dicarbohydrazide.

[0084] Comparative Example 3

[0085] The specific implementation of this comparative example is the same as that of Example 1, except that, based on parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 3 parts of cross-linking agent, 12.05 parts of curing agent and 45 parts of flame retardant.

[0086] The weight average molecular weight of the acrylic copolymer is 290,000.

[0087] The curing agent is imidazole and 4,4-dimethyldiphenylamine, and the weight ratio of the imidazole to 4,4-dimethyldiphenylamine is 0.05:12.

[0088] Comparative Example 4

[0089] The specific implementation of this comparative example is the same as that of Example 1, except that, based on parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 40 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0090] The mass ratio of the 2,4-dihydroxyphenyl acetone to 7,11-octadecadiene-1,18-dicarbohydrazide is 1:1.

[0091] Figure 1 This is the test result of the glue gas overflow test of Comparative Example 4. The irregular black areas seen in the figure are the substrate areas contaminated by glue gas.

[0092] Comparative Example 5

[0093] The specific implementation of this comparative example is the same as that of Example 1, except that, based on parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 40 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0094] The mass ratio of the 2,4-dihydroxyphenyl acetone to 7,11-octadecadiene-1,18-dicarbohydrazide is 1:3.

[0095] Comparative Example 6

[0096] The specific implementation of this comparative example is the same as that of Example 1, except that, based on parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 10 parts of cross-linking agent, 7 parts of curing agent and 45 parts of flame retardant.

[0097] The cross-linking agent is 2,4-dihydroxyphenyl acetone.

[0098] Comparative Example 7

[0099] The specific implementation of this comparative example is the same as that of Example 1, except that, based on parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 9 parts of cross-linking agent, 6.05 parts of curing agent and 45 parts of flame retardant.

[0100] The weight average molecular weight of the acrylic copolymer is 290,000.

[0101] The curing agent is imidazole and 4,4-dimethyldiphenylamine, and the weight ratio of the imidazole to 4,4-dimethyldiphenylamine is 0.05:6.

[0102] Comparative Example 8

[0103] The specific implementation of this comparative example is the same as that of Example 1, except that, based on parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 7 parts of curing agent and 45 parts of flame retardant.

[0104] The weight average molecular weight of the acrylic copolymer is 290,000.

[0105] Comparative Example 9

[0106] The specific implementation of this comparative example is the same as that of Example 1, except that, based on parts by weight, the raw materials for preparation include: 280 parts of acrylic copolymer, 25 parts of epoxy resin, 30 parts of cross-linking agent, and 7 parts of curing agent.

[0107] The weight average molecular weight of the acrylic copolymer is 290,000.

[0108] Performance Testing

[0109] The adhesives prepared in each example and comparative example were applied to the release surface of a PET release film and dried in a 90°C oven to obtain a 50 μm thick adhesive layer. Another layer of release film was then covered on the adhesive layer. The sample was then aged in a 60°C oven for 60 hours to obtain an adhesive film. The products prepared in each example and comparative example were subjected to the following tests:

[0110] 1. Elongation at break test:

[0111] The protective films on both sides of the products of the examples and comparative examples were removed, and their elongation at break was tested.

[0112] 2. Peel strength test:

[0113] The protective film on one side of the products of the embodiment and comparative example was torn off, and the products were transferred to a polyimide film at 80°C. The protective film on the other side was torn off, and the products were transferred to a copper foil at 80°C. Conventional pressing was performed at 185°C / 20kg / 2.5h. The peel strength was tested in accordance with IPC-TM-650. The higher the peel strength, the better the bonding performance.

[0114] 3. Glue overflow test:

[0115] The products of the examples and comparative examples were transferred to a polyimide film at 80°C; the protective film on the other side was removed, and the products were transferred to a copper foil at 80°C, and quickly pressed at 185°C / 100kg / 120s. The test was performed in accordance with the provisions of IPC-TM-650.

[0116] 4. Glue gas overflow test:

[0117] The products of the embodiment and comparative example were transferred to a polyimide film at 80°C; the protective film on the other side was removed, and the products were transferred to a copper foil at 80°C. Conventional pressing was performed at 185°C / 20kg / 2.5h. The glue gas overflow was observed under a microscope to observe the range of the PCB board contaminated by the glue gas overflow.

[0118] 5. Flame retardant performance test:

[0119] The adhesive prepared in each example and comparative example was coated on the release surface of the PET release film and dried in an oven at 90° C. to obtain a 50 μm thick adhesive layer. The adhesive layer was then flame retardant tested according to the UL94 vertical burning method.

[0120] The above test results are shown in Table 1.

[0121] Table 1

[0122]

[0123] As shown in Table 1, the peel strength of the acrylic pure adhesive prepared in this application is greater than 20 N / cm, the elongation at break can be controlled within 150%, the amount of adhesive overflow is less than 100 μm, and no adhesive gas is generated.

[0124] From the experimental data of the comparative example, it can be seen that if 2,4-dihydroxyphenyl acetone is not included, the peeling force of the prepared adhesive is difficult to meet the requirements. If the mass ratio of 2,4-dihydroxyphenyl acetone to 7,11-octadecadiene-1,18-dicarbohydrazide in the cross-linking agent is 1:1, excess 2,4-dihydroxyphenyl acetone will remain in the adhesive. After traditional pressing at 185℃ / 2.5h, the substance will turn into small molecular gas and overflow, resulting in a large amount of black glue gas in the circuit board, which will pollute the circuit board. The black glue gas can be seen Figure 1 The black part in the figure is the glue gas. If there is too little imidazole in the system, the elongation at break of the product will be too high, and the yarn will be elastic when cut.

Claims

1. A high-adhesion acrylic pure glue, characterized in that: The raw materials for the preparation include, by weight, 215-374 parts of an acrylic copolymer, 13-36 parts of an epoxy resin, 3-45 parts of a crosslinking agent, 0.6-13 parts of a curing agent, and 45-53 parts of a flame retardant; the crosslinking agent is 2,4-dihydroxyphenyl acetone and 7,11-octadecadiene-1,18-dicarbohydrazide; the mass ratio of the 2,4-dihydroxyphenyl acetone to the 7,11-octadecadiene-1,18-dicarbohydrazide is 1:2; The curing agent is 4,4'-diaminodiphenyl sulfone and imidazole; the mass ratio of the imidazole to the 4,4'-diaminodiphenyl sulfone is (0.1-3): (0.5-10).

2. The high-adhesion acrylic adhesive according to claim 1, characterized in that: The raw materials of the acrylic copolymer include, by weight, 42-49 parts of butyl methacrylate, 22-30 parts of ethyl acrylate, 9-16 parts of acrylonitrile, 7-11 parts of hydroxyethyl acrylate, 5-13 parts of glycidyl methacrylate, 0.1-5 parts of initiator and 130-250 parts of solvent.

3. The high-adhesion acrylic adhesive according to claim 2, characterized in that: The weight average molecular weight of the acrylic copolymer is 100,000-400,000.

4. The high-adhesion acrylic adhesive according to claim 1, characterized in that: The epoxy resin is a phenolic epoxy resin.

5. A method for preparing the high-adhesion acrylic adhesive according to any one of claims 1 to 4, characterized in that: The following steps are involved: The raw material of the acrylic acid copolymer is subjected to solution polymerization to obtain the acrylic acid copolymer; The acrylic copolymer, epoxy resin, cross-linking agent, curing agent and flame retardant are stirred and dispersed uniformly to obtain the acrylic pure glue.

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