MEMS inertial measurement combination capable of resisting large impact and reducing vibration

Abstract

The invention provides an MEMS inertial measurement combination capable of resisting large impact and reducing vibration, and relates to the technical field of MEMS inertial systems. An MEMS inertial sensitive assembly of the inertial measurement combination is provided with eight vertexes similar to a cube, vibration reduction pieces are arranged at the positions of the eight vertexes of the MEMS inertial sensitive assembly respectively, the eight vibration reduction pieces are partially distributed on the two opposite side walls of the MEMS inertial sensitive assembly in the height direction of the MEMS inertial sensitive assembly, and the sides, away from the MEMS inertial sensitive assembly, of the vibration reduction pieces are connected with a base or a cover plate. And the MEMS inertia sensitive assembly can be fixed in the accommodating cavity by the eight vibration reduction pieces. According to the present invention, the partial width and the partial length of the vibration reduction member are overlapped with the MEMS inertial sensitive assembly, such that the volume of the accommodation chamber can be effectively reduced, and the balance degree of the MEMS inertial sensitive assembly on the inertial measurement system can be further improved by arranging the vibration reduction members at the eight vertex positions so as to substantially improve the large impact vibration resistance of the MEMS inertial measurement assembly.

Description

Technical Field

[0001] This specification relates to the technical field of MEMS inertial systems, and in particular to a MEMS inertial measurement assembly capable of resisting large shocks and reducing vibrations. Background Art

[0002] In recent years, MEMS inertial technology has developed rapidly, and MEMS inertial measurement combinations have been widely penetrated into the military and civilian fields, especially in medium and low-precision aircraft application scenarios. Due to its low cost, lightweight and high performance, it has begun to gradually replace fiber optic inertial systems. The current new generation of military equipment such as drones and micro missiles are developing in the direction of low cost, lightweight and autonomy, and have the ability to attack and intercept targets with high speed, high maneuverability and fast response. It also puts forward higher requirements on the performance, volume, weight and reliability of the inertial system, especially the MEMS inertial measurement combination, which should have the characteristics of low cost, high reliability, strong resistance to mechanical environment and high performance.

[0003] Currently, vibration reduction designs for MEMS inertial measurement units (IMUs) typically employ T-shaped dampers for three- or four-point vibration reduction of MEMS sensitive components. These damping solutions require a large internal space within the MEMS inertial measurement unit, hindering its miniaturization. Furthermore, the unique structure of the T-shaped damper makes assembly time-consuming, increasing product assembly costs. Furthermore, the unique installation method of the T-shaped damper makes assembly consistency difficult to control, resulting in inconsistent vibration reduction effects in different directions across the MEMS inertial measurement unit. This can easily cause additional angular motion in the inertial measurement unit being damped, affecting the output accuracy of the inertial system. Summary of the Invention

[0004] The purpose of this specification is to provide a MEMS inertial measurement assembly that is resistant to large shocks and vibrations, which can overcome the above-mentioned defects of existing inertial measurement assemblies.

[0005] The embodiments of this specification are implemented as follows:

[0006] This specification provides a MEMS inertial measurement assembly for resisting large shocks and reducing vibrations, including a MEMS inertial sensitive component, a housing component, and a vibration reduction component;

[0007] The housing assembly includes a base and a cover plate, wherein the base is provided with a receiving chamber with an open end, and the cover plate is capable of blocking the opening of the receiving chamber;

[0008] The MEMS inertial sensitive component has eight vertices of a cube-like shape, and the vibration dampers are respectively arranged at the positions of the eight vertices of the MEMS inertial sensitive component. Parts of the eight vibration dampers are distributed on the opposite side walls of the MEMS inertial sensitive component along its height direction. The side of the vibration damper away from the MEMS inertial sensitive component is connected to the base or the cover. The eight vibration dampers can fix the MEMS inertial sensitive component in the accommodating chamber.

[0009] In some embodiments of this specification, the eight vibration damping members are arranged in a direction from the MEMS inertial sensitive component toward the base.

[0010] In some embodiments of this specification, the base is provided with a mechanical mounting interface and an external electrical interface, the MEMS inertial measurement assembly for resisting large impact and vibration reduction is installed on an external device through the mechanical mounting interface, and the MEMS inertial sensitive component is electrically connected to the external device through the external electrical interface.

[0011] In some embodiments of the present specification, the vibration damping member has a clamping portion and a vibration damping portion that are interconnected, and a mounting groove is provided on one side of the clamping portion, and the mounting groove is adapted to the angle at which the vertex of the MEMS inertial sensitive component is located; the vibration damping portion is provided with a first vibration damping through hole and a second vibration damping through hole that are independent of each other, and the hole channel direction of the first vibration damping through hole intersects with the hole channel direction of the second vibration damping through hole.

[0012] In some embodiments of the present specification, a hole channel direction of the first vibration-damping through hole is consistent with a height direction of the MEMS inertial sensitive component.

[0013] In some embodiments of the present specification, a hole channel direction of the second vibration damping through hole is perpendicular to a hole channel direction of the first vibration damping through hole, and the hole channel direction of the second vibration damping through hole is from the MEMS inertial sensitive component toward the clamping portion.

[0014] In some embodiments of the present specification, the clamping portion is a rounded cube, and the mounting groove is provided at the two vertices of the clamping portion along its height direction, and one end of the first vibration-damping through hole can pass through the other two vertices of the clamping portion along its height direction.

[0015] In some embodiments of this specification, the vibration damping portion is shaped like a rounded cube, the number of the first vibration damping through holes is two, and the arrangement direction of the two first vibration damping through holes is the diagonal direction of the vibration damping portion.

[0016] In some embodiments of the present specification, one end of the second vibration-damping through hole is arranged at a position corresponding to a position of the mounting groove, and the second vibration-damping through hole can be arranged to penetrate along another diagonal direction of the vibration-damping portion.

[0017] In some embodiments of the present specification, the mounting groove is formed by a curved sidewall and a flat sidewall arranged perpendicular to each other, and the curved sidewall can abut against the corner where the vertex of the MEMS inertial sensitive component is located.

[0018] The embodiments of this specification have at least the following advantages or beneficial effects:

[0019] Compared with the prior art, this MEMS inertial measurement unit with high-impact vibration reduction performance has vibration dampers installed at the eight vertices of the MEMS inertial sensing component, with portions of the vibration dampers distributed along both sidewalls in the height direction. As can be seen, the partial width and length of the vibration dampers are stacked with the MEMS inertial sensing component, effectively reducing the volume of the accommodating chamber. Furthermore, the placement of vibration dampers at the eight vertices further improves the balance of the MEMS inertial sensing component on the inertial measurement system, thereby significantly enhancing the MEMS inertial measurement unit's high-impact vibration resistance and, in turn, improving its applicability and reliability in harsh mechanical environments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of this specification, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of this specification and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 Schematic diagram of the exploded structure of the MEMS inertial measurement unit with large impact resistance and vibration reduction provided in this manual;

[0022] Figure 2 A front view schematic diagram of the MEMS inertial measurement assembly for large shock and vibration reduction provided in this specification;

[0023] Figure 3 A top view of the MEMS inertial measurement assembly for high-impact vibration reduction provided in this specification;

[0024] Figure 4 A schematic diagram of the structure of the MEMS inertial measurement assembly for large shock and vibration reduction provided in this manual;

[0025] Figure 5 This is a schematic diagram of the structure of the vibration damping component provided in this manual.

[0026] Icons: 1. MEMS inertial sensitive component; 2. Cover; 3. Base; 31. External electrical interface; 32. Mechanical installation interface; 4. Vibration damping part; 41. Clamping part; 42. Vibration damping part; 43. Installation groove; 44. First vibration damping through hole; 45. Second vibration damping through hole. DETAILED DESCRIPTION

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this specification more clear, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of this specification. Obviously, the described embodiments are part of the embodiments of this specification, not all of the embodiments. Generally, the components of the embodiments of this specification described and shown in the drawings herein can be arranged and designed in a variety of different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present specification provided in the accompanying drawings is not intended to limit the scope of the present specification as claimed, but merely represents selected embodiments of the present specification. Based on the embodiments in this specification, all other embodiments obtained by persons of ordinary skill in the art without making any creative effort are within the scope of protection of this specification.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0030] In the description of the embodiments of this specification, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the product of this specification is usually placed when in use. It is only for the convenience of describing this specification and simplifying the description, and does not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as a limitation on this specification. In addition, if the terms "first", "second", "third", etc. appear, they are only used to distinguish the description and should not be understood as indicating or implying relative importance.

[0031] Furthermore, the use of terms such as "horizontal," "vertical," and "overhanging" does not necessarily mean that the component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0032] In the description of the embodiments of this specification, it should be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this specification based on specific circumstances.

[0033] Please refer to Figures 1 to 5 The MEMS inertial measurement assembly for resisting large shock and reducing vibration provided in one embodiment of the present specification mainly includes a MEMS inertial sensitive component 1, a shell component and a vibration reduction component 4;

[0034] The housing assembly includes a base 3 and a cover plate 2. The base 3 defines a receiving chamber with an open end, and the cover plate 2 can block the opening of the receiving chamber.

[0035] The MEMS inertial sensitive component 1 has eight vertices of a cube-like shape. The vibration dampers 4 are respectively provided at the positions of the eight vertices of the MEMS inertial sensitive component 1. Parts of the eight vibration dampers 4 are distributed on the opposite side walls of the MEMS inertial sensitive component 1 along its height direction. The side of the vibration damper 4 away from the MEMS inertial sensitive component 1 is connected to the base 3 or the cover 2. The eight vibration dampers 4 can fix the MEMS inertial sensitive component 1 in the accommodating chamber.

[0036] In this embodiment, the MEMS inertial sensing component 1 is generally in the shape of a cube with eight vertices.

[0037] It should be noted that the conventional T-shaped vibration damping component is arranged at the waist position of the MEMS inertial sensitive component 1 along its height direction. It can be seen that the width or length of the T-shaped vibration damping component occupies part of the volume of the accommodating chamber. In this case, the size of the housing component and the size of the accommodating chamber should be larger to accommodate the MEMS inertial sensitive component 1 provided with the T-shaped vibration damping component, that is, Figure 1 The MEMS inertial measurement assembly shown, which has a diameter of approximately 40 mm and a height of 20 mm, cannot be integrated using a conventional T-shaped vibration damping component arrangement.

[0038] Specifically, the MEMS inertial measurement assembly has vibration dampers 4 disposed at the eight vertices of the MEMS inertial sensing component 1, with portions of the vibration dampers 4 distributed along both sidewalls in the height direction. As can be seen, the width and length of portions of the vibration dampers 4 are stacked with the MEMS inertial sensing component 1, effectively reducing the volume of the accommodating chamber. Furthermore, the provision of vibration dampers 4 at the eight vertices further enhances the balance of the MEMS inertial sensing component 1 on the inertial measurement system, thereby significantly improving the MEMS inertial measurement assembly's resistance to high shock and vibration, and thereby enhancing the MEMS inertial measurement assembly's applicability and reliability in harsh mechanical environments.

[0039] In this embodiment, the cover plate 2 is provided with four screw holes, and can be fixed to the base 3 by passing four screws through the four screw holes, thereby forming the above-mentioned inertial measurement combination.

[0040] In this embodiment, the base 3 itself cooperates to form a receiving chamber.

[0041] It should be noted that the base 3 has screw locking locations on its circumferential sidewalls, and on the side of the circumferential sidewalls close to the cover plate 2. Therefore, when the volume of the accommodation space is sufficient to accommodate the MEMS sensor component, the outer dimensions of the base 3 and the housing will be larger. However, the placement of the vibration damper 4 on the MEMS inertial sensor component 1 can effectively improve the space utilization of the accommodation space.

[0042] In this embodiment, the eight vibration dampers 4 are arranged in the direction from the MEMS inertial sensing component 1 to the base 3. This arrangement further improves the balance of the MEMS inertial sensing component 1 in the system, significantly enhances the MEMS inertial measurement assembly's resistance to large shock and vibration, and improves the system's environmental adaptability and reliability.

[0043] In this embodiment, the base 3 is provided with a mechanical mounting interface 32 and an external electrical interface 31. The MEMS inertial measurement assembly with large impact resistance and vibration reduction is installed on an external device through the mechanical mounting interface 32, and the MEMS inertial sensitive component 1 is electrically connected to the external device through the external electrical interface 31.

[0044] In this embodiment, the vibration damping member 4 has a clamping portion 41 and a vibration damping portion 42 connected to each other. A mounting groove 43 is provided on one side of the clamping portion 41. The mounting groove 43 is adapted to the angle of the vertex of the MEMS inertial sensitive component 1. The vibration damping portion 42 is provided with a first vibration damping through hole 44 and a second vibration damping through hole 45 that are independent of each other. The hole channel direction of the first vibration damping through hole 44 intersects the hole channel direction of the second vibration damping through hole 45.

[0045] In this embodiment, the above-mentioned clamping part 41 and the vibration-damping part 42 can be made by integral molding. The separate description of the above-mentioned clamping part 41 and the vibration-damping part 42 is only to clearly describe the setting relationship and setting position, rather than two parts separated for separation.

[0046] Specifically, the vibration damper 4 is provided with a mounting groove 43 that aligns with the vertex of the MEMS inertial sensor 1, thereby achieving a vibration reduction effect. The provision of the first vibration-damping through-hole 44 and the second vibration-damping through-hole 45 effectively reduces the stiffness of the vibration damper 4 and its resonant frequency, thereby providing the advantage of resisting large impact vibrations. Furthermore, the vibration damper 4 has the advantages of a simple structure, low manufacturing cost, low manufacturing difficulty, and high consistency, thereby effectively improving the balance of the MEMS inertial sensor 1.

[0047] Moreover, the eight vibration dampers 4 are assembled at the apex positions of the MEMS inertial sensing component 1 through the mounting grooves 43, which has the advantages of simple assembly, low assembly cost, and high installation precision. At the same time, it can also effectively improve the situation where vibration damping components (such as T-shaped vibration damping components) easily cause the inertial measurement component being damped to generate additional angular motion, thereby affecting the output precision of the inertial system.

[0048] In this embodiment, the hole direction of the first vibration-damping through hole 44 is consistent with the height direction of the MEMS inertial sensor component 1. The hole direction of the second vibration-damping through hole 45 is perpendicular to the hole direction of the first vibration-damping through hole 44, and the hole direction of the second vibration-damping through hole 45 is from the MEMS inertial sensor component 1 toward the clamping portion 41.

[0049] In detail, the hole channel direction of the above-mentioned first vibration-damping through hole 44 is the height direction of the vibration damping member 4, and the channel direction of the above-mentioned second vibration-damping through hole 45 is from the MEMS inertial sensitive component 1 toward the clamping portion 41 and is perpendicular to the setting direction of the second vibration-damping through hole 45, which can further reduce the stiffness of the above-mentioned vibration damping member 4. Moreover, the above-mentioned setting method can greatly improve the spatial structure utilization rate of the vibration damping member 4. That is, while the volume of the vibration damping member 4 is smaller, the above-mentioned first vibration-damping through hole 44 and the above-mentioned second vibration-damping through hole 45 are independently arranged (that is, as two non-connected through holes), and the stiffness of the above-mentioned vibration damping member 4 can be reduced. It can be seen that the above-mentioned setting method can further reduce the volume of the vibration damping member 4, thereby being suitable for situations where the space of the MEMS inertial system is extremely limited.

[0050] In this embodiment, the first vibration-damping through hole 44 is provided through the vibration-damping member 4 along a height direction, and the second vibration-damping through hole 45 is provided through the vibration-damping portion 42 along a diagonal direction.

[0051] In this embodiment, the clamping portion 41 is a rounded cube, and the mounting groove 43 is provided at the two vertices of the clamping portion 41 along its height direction. One end of the first vibration-damping through hole 44 can pass through the other two vertices of the clamping portion 41 along its height direction.

[0052] In this embodiment, the vibration-damping portion 42 is shaped like a rounded cube, and there are two first vibration-damping through-holes 44, which are arranged diagonally with respect to the vibration-damping portion 42. Specifically, the original shapes of the aforementioned clamping portion 41 and the aforementioned vibration-damping portion 42 are both rounded cubes with identical widths and lengths, thereby forming the shape of the aforementioned vibration-damping member 4 into a rounded cube. As can be seen, the vibration-damping member 4 provided with the mounting groove 43 has a regular structural shape, offering the advantages of low manufacturing cost, ease of manufacturing, and simple assembly. Therefore, the aforementioned method of providing through-holes in both the vertical and horizontal directions effectively reduces the stiffness of the vibration-damping member and simultaneously lowers its resonant frequency.

[0053] In this embodiment, one end of the second vibration-damping through hole 45 is disposed at a position corresponding to the mounting groove 43 , and the second vibration-damping through hole 45 can be disposed through the other diagonal direction of the vibration-damping portion 42 .

[0054] In this embodiment, the mounting groove 43 is formed by a curved sidewall and a flat sidewall arranged perpendicular to each other. The curved sidewall is capable of abutting the corner of the vertex of the MEMS inertial sensor component 1. This arrangement facilitates abutment with the circumferential sidewall of the MEMS inertial sensor component 1, effectively increasing the contact area between the MEMS inertial sensor component 1 and the vibration damping member 4, thereby improving the vibration damping effect.

[0055] In this embodiment, the hole diameters of the first vibration-damping through hole 44 and the second vibration-damping through hole 45 are 0.98 mm to 1.02 mm, the height of the vibration-damping member 4 is 4.98 mm to 5.02 mm, the width of the vibration-damping member 4 is 4.48 mm to 4.52 mm, and the side wall thickness of the above-mentioned mounting groove 43 is 2 mm.

[0056] Specifically, the specific size setting of the vibration damping member 4 can not only make the volume of the vibration damping member 4 smaller, but also meet the vibration damping requirements of the vibration damping member 4.

[0057] The above are merely preferred embodiments of this specification and are not intended to limit this specification. Those skilled in the art will readily appreciate that this specification is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this specification shall be within the scope of protection of this specification.

Claims

1. A MEMS inertial measurement assembly with high impact resistance and vibration reduction, characterized in that: Including MEMS inertial sensitive components, shell components and vibration damping parts; The housing assembly includes a base and a cover plate, wherein the base is provided with a receiving chamber with an open end, and the cover plate is capable of sealing the opening of the receiving chamber; The MEMS inertial sensitive component has eight vertices of a cube-like shape, and the vibration dampers are respectively arranged at the positions of the eight vertices of the MEMS inertial sensitive component. Parts of the eight vibration dampers are distributed on the opposite side walls of the MEMS inertial sensitive component along its height direction. The side of the vibration damper away from the MEMS inertial sensitive component is connected to the base or the cover. The eight vibration dampers can fix the MEMS inertial sensitive component in the accommodating chamber.

2. The MEMS inertial measurement unit with large shock resistance and vibration reduction according to claim 1, characterized in that: The eight vibration damping members are arranged in a direction from the MEMS inertial sensitive component toward the base.

3. The MEMS inertial measurement assembly for large shock resistance and vibration reduction according to claim 1, characterized in that: The base is provided with a mechanical installation interface and an external electrical interface. The MEMS inertial measurement assembly with large impact resistance and vibration reduction is installed on an external device through the mechanical installation interface. The MEMS inertial sensitive component is electrically connected to the external device through the external electrical interface.

4. The MEMS inertial measurement unit with large shock resistance and vibration reduction according to claim 1, characterized in that: The vibration damping member comprises a clamping portion and a vibration damping portion connected to each other, a mounting groove being provided on one side of the clamping portion, and the mounting groove being adapted to the angle at which the vertex of the MEMS inertial sensitive component is located; the vibration damping portion is provided with a first vibration damping through hole and a second vibration damping through hole being independent of each other, and the hole channel direction of the first vibration damping through hole intersects the hole channel direction of the second vibration damping through hole.

5. The MEMS inertial measurement assembly for large shock resistance and vibration reduction according to claim 4, characterized in that: The hole channel direction of the first vibration-damping through hole is consistent with the height direction of the MEMS inertial sensitive component.

6. The MEMS inertial measurement assembly for large shock resistance and vibration reduction according to claim 5, characterized in that: A hole passage direction of the second vibration-damping through hole is perpendicular to a hole passage direction of the first vibration-damping through hole, and the hole passage direction of the second vibration-damping through hole is from the MEMS inertial sensitive component toward the clamping portion.

7. The MEMS inertial measurement assembly for large shock resistance and vibration reduction according to claim 6, characterized in that: The clamping portion is a rounded cube, and the mounting groove is provided at the two vertices of the clamping portion along its height direction. One end of the first vibration-damping through hole can penetrate the other two vertices of the clamping portion along its height direction.

8. The MEMS inertial measurement assembly for large shock resistance and vibration reduction according to claim 7, characterized in that: The vibration damping portion is in the shape of a rounded cube, the number of the first vibration damping through holes is two, and the arrangement direction of the two first vibration damping through holes is the diagonal direction of the vibration damping portion.

9. The MEMS inertial measurement assembly for large shock resistance and vibration reduction according to claim 8, characterized in that: One end of the second vibration-damping through hole is arranged at a position corresponding to the position of the mounting groove, and the second vibration-damping through hole can be arranged to penetrate along another diagonal direction of the vibration-damping portion.

10. The MEMS inertial measurement assembly for large shock resistance and vibration reduction according to claim 4, characterized in that: The mounting groove is formed by a curved side wall and a flat side wall which are perpendicular to each other. The curved side wall can abut against the corner where the vertex of the MEMS inertial sensitive component is located.

Images