Die temperature control device

Abstract

The invention discloses a mold temperature control device which comprises a control unit, a temperature sensing device and a medium loop, a medium circulates in the medium loop and is used for carrying out heat exchange with a mold, and the temperature sensing device is used for collecting the real-time temperature of the mold; the control unit is used for comparing the real-time temperature of the mold with the target temperature of the mold, generating a control signal and driving the medium loop to adjust the medium temperature through the control signal so as to carry out feedback control on the real-time temperature of the mold. The temperature of the mold can be directly obtained through the temperature sensing device, and the influence of the environment temperature and other accidental factors on the mold temperature is eliminated. The temperature of the mold is directly controlled through the control unit, and the real-time temperature of the mold is more accurately and dynamically controlled by adopting a closed-loop control method.

Description

Technical Field

[0001] The invention belongs to the technical field of injection molding equipment, and particularly relates to a mold temperature control device. Background Art

[0002] Mold temperature control equipment is connected to the injection molding equipment (including the mold) via oil or water circuits. It controls the temperature of the injection molding equipment by heating or cooling the water or oil medium, thereby providing the required injection molding temperature conditions. Existing mold temperature control equipment controls the temperature of the injection molding equipment by setting and detecting the medium temperature at the mold temperature control device's outlet and inlet. This is supplemented by using temperature sensors such as mold temperature guns to measure the mold temperature and estimate the mold temperature. This ensures that the injected plastic material cools and crystallizes under reasonable conditions, thereby ensuring the size and quality of the molded product.

[0003] The shortcomings of existing equipment are: there will be temperature loss in the oil circuit and the water circuit, so the actual operating temperature of the injection molding equipment is inconsistent with the medium temperature, and the injection molding equipment generally needs to stop working and keep the mold in an open state when measuring the temperature. Therefore, the detected temperature is inconsistent with the actual production operation of the mold and the temperature of the mold in the closed state, and the actual temperature of the mold will be affected by changes in the injection molding cycle, injection molding temperature and ambient temperature (such as day / night, season).

[0004] Existing mold temperature control methods rely on open-loop control, which can affect the size and quality of the molded product. Furthermore, existing mold temperature controllers can only set the medium temperature, not the mold temperature directly.

[0005] Therefore, in view of the above technical problems, it is necessary to provide a mold temperature control device. Summary of the Invention

[0006] The purpose of the present invention is to provide a mold temperature control device that can directly obtain the mold temperature, avoid temperature data deviation caused by collecting medium temperature, and can accurately control the mold temperature through a closed-loop control method.

[0007] In order to achieve the above object, a specific embodiment of the present invention provides the following technical solutions:

[0008] A mold temperature control device includes: a control unit, a temperature sensor device and a medium circuit, wherein a medium flows through the medium circuit and is used to exchange heat with the mold, the temperature sensor device is used to collect the real-time temperature of the mold, the control unit is used to compare the real-time temperature of the mold with the target temperature of the mold to generate a control signal, and drives the medium circuit to adjust the medium temperature through the control signal to feedback control the real-time temperature of the mold.

[0009] In one or more embodiments of the present invention, the mold includes a male mold and a female mold, the temperature sensor device includes a first temperature sensor and a second temperature sensor, and the medium circuit includes a first medium circuit and a second medium circuit; the first temperature sensor is installed on the male mold to collect the real-time temperature of the male mold, and the control unit is used to generate a first control signal based on the real-time temperature of the male mold and the target temperature of the male mold, and drive the first medium circuit through the first control signal to adjust the temperature of the male mold; the second temperature sensor is installed on the female mold to obtain the real-time temperature of the female mold, and the control unit is used to generate a second control signal based on the real-time temperature of the female mold and the target temperature of the female mold, and drive the second medium circuit through the second control signal to adjust the temperature of the female mold.

[0010] In one or more embodiments of the present invention, the temperature sensing device includes a thermistor sensor; and / or the temperature sensing device includes a nose-pressure temperature sensor.

[0011] In one or more embodiments of the present invention, the mold temperature control device also includes a quick-connect connector, which is communicatively connected to the control unit, the signal end of the temperature sensor device is movably connected to the quick-connect connector, and the temperature measuring end of the temperature sensor device is fixedly connected to the mold.

[0012] In one or more embodiments of the present invention, the first medium circuit includes a first heating pipeline and a first cooling pipeline, the first heating pipeline is used to circulate heating medium, and the first cooling pipeline is used to circulate cooling medium; and / or,

[0013] The second medium circuit includes a second heating pipeline and a second cooling pipeline. The second heating pipeline is used for circulating a heating medium, and the second cooling pipeline is used for circulating a cooling medium.

[0014] In one or more embodiments of the present invention, the first heating pipeline includes a first heat medium return port, a first liquid level controller, a first circulation pump, a first heater, a first heat medium outlet, and a first over-temperature controller provided on the first heater, which are sequentially arranged and connected through pipelines; the first cooling pipeline includes a first cooling medium inlet, a first cooling solenoid valve, and a first cooling medium outlet, which are sequentially arranged and connected through pipelines; heat exchange is performed between the first heating pipeline and the first cooling pipeline via a first heat exchanger; and the control unit adjusts the temperature of the male mold by controlling the first heater and the first cooling solenoid valve; and / or,

[0015] The second heating pipeline includes a second heat medium return port, a second liquid level controller, a second circulation pump, a second heater, a second heat medium outlet and a second over-temperature controller arranged in sequence and connected through pipelines. The second cooling pipeline includes a second cooling medium inlet, a second cooling solenoid valve and a second cooling medium outlet arranged in sequence and connected through pipelines. Heat exchange is performed between the second heating pipeline and the second cooling pipeline through a second heat exchanger. The control unit adjusts the temperature of the master mold by controlling the second heater and the second cooling solenoid valve.

[0016] In one or more embodiments of the present invention, the mold temperature control device further includes a plurality of third temperature sensors, the third temperature sensors being used to collect one or more of the outlet medium temperature of the first heating pipeline, the return medium temperature of the first heating pipeline, the outlet medium temperature of the second heating pipeline, and the return medium temperature of the second heating pipeline;

[0017] The control unit is used to generate a first alarm signal based on the outlet temperature of the first heating pipeline and / or the return temperature of the first heating pipeline, and to generate a second alarm signal based on the outlet temperature of the second heating pipeline and / or the return temperature of the second heating pipeline.

[0018] In one or more embodiments of the present invention, the control unit includes: a storage module for storing the target temperature of the mold; a calculation module for calculating the difference between the real-time temperature of the mold and the target temperature of the mold; and a control module for generating a control signal based on the difference.

[0019] In one or more embodiments of the present invention, the control unit further includes a communication interface, and the control unit is communicatively connected to a host computer via the communication interface, so as to realize communication between the host computer and the control unit.

[0020] In one or more embodiments of the present invention, the mold temperature control device further includes a first display device and a second display device;

[0021] The first display device is used to display the real-time temperature of the male mold, the target temperature of the male mold, the return medium temperature and the outlet medium temperature corresponding to the first medium circuit;

[0022] The second display device is used to display the real-time temperature of the mother mold, the target temperature of the mother mold, the return medium temperature and the outlet medium temperature corresponding to the second medium circuit.

[0023] Compared with the existing technology, the mold temperature control device of the present invention can directly obtain the temperature of the mold itself through the temperature sensing device, eliminating the influence of ambient temperature and other unexpected factors on the mold temperature. The mold temperature is directly controlled by the control unit, and a closed-loop control method is adopted to perform more precise dynamic control of the real-time temperature of the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 This is a functional block diagram of a mold temperature control device according to an embodiment of the present invention;

[0026] Figure 2 Schematic diagram of the positional relationship between the master mold and the second temperature sensor in one embodiment of the present invention;

[0027] Figure 3 This is a schematic structural diagram of a first medium circuit in one embodiment of the present invention;

[0028] Figure 4 This is a schematic structural diagram of a mold temperature control device in one embodiment of the present invention;

[0029] Figure 5 This is a principle block diagram of a control unit in one embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0031] Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations such as "include" or "comprising", etc., will be understood to include the stated elements or components but not to exclude other elements or other components.

[0032] The terms "coupled," "connected," or "connected" as used in this specification encompass both direct and indirect connections. An indirect connection is a connection made through an intermediate medium, such as an electrically conductive medium, which may have parasitic inductance or capacitance. An indirect connection may also include a connection through other active or passive devices, such as switches, follower circuits, or other circuits or components, to achieve the same or similar functional objectives. Furthermore, in the present invention, terms such as "first" and "second" are primarily used to distinguish one technical feature from another and do not necessarily require or imply a specific relationship, quantity, or order between these technical features.

[0033] In the detailed description of the specification, reference is made to the accompanying drawings forming a part hereof, wherein like reference numerals designate like parts throughout, and wherein exemplary embodiments that may be implemented are shown by way of example. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present application. Therefore, the following detailed description should not be construed in a limiting sense.

[0034] The various operations in the specification may be described as multiple discrete actions or operations in a manner that is most helpful in understanding the claimed subject matter. However, the order of description should not be interpreted as implying that these operations must be sequentially related. Specifically, these operations may not be performed in the order presented. The described operations may be performed in an order different from the described embodiments. Various additional operations may be performed and / or the described operations may be omitted in additional embodiments.

[0035] The present invention discloses a mold temperature control device, comprising: a control unit, a temperature sensor device and a medium circuit, wherein a medium flows in the medium circuit, the medium is used for heat exchange with the mold, the temperature sensor device is used for collecting the real-time temperature of the mold, the control unit is used for comparing the real-time temperature of the mold with the target temperature of the mold and generating a control signal, and driving the medium circuit through the control signal to adjust the medium temperature, so as to feedback control the real-time temperature of the mold.

[0036] The mold temperature control device of the present invention is suitable for injection molds. Through a temperature sensing device, the temperature of the mold itself can be directly acquired, eliminating the need to obtain data indirectly representing the mold temperature, such as the mold pipe outlet or inlet temperature. This makes the subsequent control process more precise and eliminates the influence of ambient temperature and other unexpected factors on the mold temperature. In addition, because the control unit is based on the temperature of the mold itself, the control unit directly controls the mold temperature. Existing mold temperature controllers can only set the medium temperature, while the present invention can directly set the mold temperature. Furthermore, the mold temperature control device can use a closed-loop control method to dynamically control the real-time temperature of the injection mold to within ±1°C of the target temperature.

[0037] The present invention will be further described below with reference to specific embodiments.

[0038] Ginseng Figure 1 As shown, a mold temperature control device in one embodiment, the mold 30 includes a male mold 31 and a female mold 32, the temperature sensor device 20 includes at least one first temperature sensor 21 and at least one second temperature sensor 22, and the medium circuit 40 includes a first medium circuit 41 and a second medium circuit 42.

[0039] Furthermore, the male mold 31 includes a core and a first temperature control pipeline 311 arranged next to the core and used to control the temperature of the male mold 31. The female mold 32 includes a cavity and a second temperature control pipeline 321 arranged next to the cavity and used to control the temperature of the female mold 32. The first temperature control pipeline 311 includes corresponding heating circuits and cooling circuits, and the second temperature control pipeline 321 includes corresponding heating circuits and cooling circuits.

[0040] The first medium circuit 41 is used to control the temperature of the male mold 31 , and the second medium circuit 42 is used to control the temperature of the female mold 32 . A heating medium and a cooling medium flow through both the first medium circuit 41 and the second medium circuit 42 .

[0041] The first temperature sensor 21 is installed on the male mold 31 to obtain the real-time temperature of the male mold 31. The control unit 10 is used to generate a first control signal S1 based on the real-time temperature of the male mold 31 and the male mold target temperature, and drive the corresponding first medium circuit 41 through the first control signal S1 to adjust the temperature of the male mold 31.

[0042] The second temperature sensor 22 is installed on the mother mold 32 to obtain the real-time temperature of the mother mold 32. The control unit 10 is used to generate a second control signal S2 based on the real-time temperature of the mother mold 32 and the target temperature of the mother mold, and drive the corresponding second medium circuit 42 through the second control signal S2 to adjust the temperature of the mother mold 32.

[0043] The feedback control of the control unit 10 is based on the temperatures of the male mold 31 and the female mold 32. For example, if the set temperature of the female mold 32 is 135°C and the real-time temperature of the female mold 32 is 130°C, the corresponding second control signal S2 generated by the control unit 10 drives the second medium circuit 42 until the real-time temperature feedback from the second temperature sensor 22 is 135±1°C, without considering the temperature loss caused by the circuit.

[0044] Existing mold temperature controllers generally only have a single set temperature. That means, with one mold temperature controller, the temperatures of the common mold and the mother mold must be the same. When the temperature requirements for the common mold and mother mold are inconsistent, two mold temperature controllers are required, which increases floor space and energy consumption. In this embodiment, a first temperature sensor 21 is provided to collect the real-time temperature of the male mold 31, and a first medium circuit 41 is used to regulate the temperature of the male mold 31. A second temperature sensor 22 is provided to collect the real-time temperature of the mother mold 32, and a second medium circuit 42 is used to regulate the temperature of the mother mold 32. When the temperature requirements for the common mold 31 and mother mold 32 are inconsistent, the temperatures of the common mold 31 and mother mold 32 can be regulated separately without increasing floor space and energy consumption.

[0045] Figure 2 The second temperature sensor 22 is shown to be installed at the position of the mother mold 32. The temperature measuring end of the second temperature sensor 22 is fixedly installed in the cavity of the mother mold 32 to obtain the real-time temperature of the mother mold 32. It should be noted that, Figure 2 The female mold 32 shown is only an example, and any female mold 32 (including the corresponding male mold 31 ) of any known or unknown shape can be used herein without limitation.

[0046] The first temperature sensor 21 is installed on the core of the male mold 31 , and the installation method of the first temperature sensor 21 on the core of the male mold 31 is the same as that of the female mold 32 , and the installation position corresponds to the installation position of the female mold 32 , which will not be repeated here.

[0047] In other alternative embodiments, the cavity of each female mold 32 can be installed with multiple second temperature sensors 22, and the core of each male mold 31 can be installed with multiple first temperature sensors 21, and the installation positions are set based on the needs of technicians in this field.

[0048] Furthermore, in one embodiment, the temperature sensor utilizes a nose-type temperature sensor. Specifically, the temperature sensing ends of the second temperature sensor 22 and the first temperature sensor 21 are provided with through-holes. The nose-type temperature sensor is mounted on the mold using a snap-on method to prevent the temperature sensor from shifting or falling due to mold vibration. The installation method of a nose-type temperature sensor is well known in the art and will not be described in detail here. In other alternative embodiments, the temperature sensing ends may utilize protective tube-type, screw-in, or magnetic temperature sensors, and may be used without restriction.

[0049] It can be understood that the temperatures of the male mold 31 and the female mold 32 are directly obtained through the first temperature sensor 21 and the second temperature sensor 22. There is no need to control the injection molding equipment to stop working, and there is no need to open the mold (i.e., the male mold 31 and the female mold 32). Therefore, the detected temperature is consistent with the actual production and operation temperature of the mold, which can greatly improve the control accuracy of the control unit 10. In addition, the control unit 10 in this embodiment performs closed-loop feedback control based on the temperatures collected by the first temperature sensor 21 and the second temperature sensor 22, respectively, which greatly reduces the mold temperature error.

[0050] Furthermore, the mold temperature control device also includes a quick-connect connector, which is communicatively connected to the control unit, the signal end of the temperature sensor 20 is movably connected to the quick-connect connector, and the temperature measuring end of the temperature sensor 20 is fixedly connected to the mold.

[0051] Specifically, the quick-connect connector includes a first quick-connect connector and a second quick-connect connector. The first quick-connect connector is communicatively connected to the control unit 10, the signal end of the first temperature sensor 21 is movably connected to the first quick-connect connector, and the temperature measuring end of the first temperature sensor 21 is fixedly connected to the male mold 31. The second quick-connect connector is communicatively connected to the control unit 10, the signal end of the second temperature sensor 22 is movably connected to the second quick-connect connector, and the temperature measuring end of the second temperature sensor 22 is fixedly connected to the female mold 32.

[0052] The number of the first quick-connect connectors corresponds to the number of the first temperature sensors 21 , and the number of the second quick-connect connectors corresponds to the number of the second temperature sensors 22 .

[0053] It is understandable that if the temperature sensor and control unit 10 are directly connected by a cable, the temperature sensor on the mold must be removed each time the mold is opened and closed. Repeated installation and removal of the temperature sensor will impair the temperature sensor's detection accuracy. The present invention uses a temperature sensor quick-connect connector between the mold and the control unit 10 to facilitate mold replacement and reduce mold replacement time.

[0054] Ginseng Figure 3 As shown, the first medium circuit 41 includes a first heating pipeline and a first cooling pipeline, wherein the first heating pipeline is used to circulate a heating medium, and the first cooling pipeline is used to circulate a cooling medium, wherein the heating medium includes thermal oil or water, and the cooling medium includes cooling water.

[0055] The first heating circuit includes a first heat medium return port, a first liquid level controller 401, a first circulation pump 402, a first heater 403, and a first heat medium outlet, which are sequentially arranged and connected by pipelines. The first cooling circuit includes a first cooling medium inlet (i.e., the cooling water inlet shown in the figure), a first cooling solenoid valve 404, and a first cooling medium outlet (i.e., the cooling water outlet shown in the figure), which are sequentially arranged and connected by pipelines. Heat exchange occurs between the first heating circuit and the first cooling circuit via a first heat exchanger 405. It will be understood that the control unit 10 adjusts the temperature of the first medium circuit 41 by controlling the first heater 403 and the first cooling solenoid valve 405. The first medium circuit 41 is connected to the first temperature control circuit 311, and the media in the first medium circuit 41 and the first temperature control circuit 311 circulate between them, thereby achieving temperature regulation of the male mold 31.

[0056] Furthermore, the mold temperature control device also includes a plurality of third temperature sensors 406. At least one third temperature sensor 406 is installed on the pipeline between the first heat medium outlet and the first heater 403 to collect the outlet temperature of the first heating pipeline. At least one third temperature sensor 406 is installed on the pipeline between the first heat medium return port and the first heater 403 to collect the return temperature of the first heating pipeline.

[0057] The control unit 10 is configured to generate a first alarm signal based on the outlet temperature of the first heating pipe and the return temperature of the first heating pipe. Furthermore, the control unit 10 compares the outlet temperature of the first heating pipe with the return temperature of the first heating pipe. When the outlet temperature of the first heating pipe is greater than or equal to a first set threshold, the control unit 10 generates a corresponding first alarm signal. When the return temperature of the first heating pipe is greater than or equal to a corresponding second set threshold, the control unit 10 generates a corresponding second alarm signal. When the difference between the return temperature of the first heating pipe and the outlet temperature of the first heating pipe is greater than or equal to a third set threshold, the control unit 10 generates a corresponding first alarm signal.

[0058] In one embodiment, the first temperature sensor 21 , the second temperature sensor 22 , and the third temperature sensor 406 all include thermistor sensors. In other alternative embodiments, other types of temperature sensors may also be used.

[0059] Furthermore, the first heating pipeline also includes a first overtemperature controller 407, several first pressure indicators 408, a first pressure limiter, several filters, a ball valve, an exhaust solenoid valve and a pressure relief solenoid valve mounted on the first liquid level controller 10, and a pressure relief valve mounted on the first heater 403. The first overtemperature controller 407 is mounted on the first heater 403, the first pressure indicator 408 is mounted on the pipeline between the first heat medium outlet and the first heater 43, and another first pressure indicator 408 and a first pressure limiter are mounted on the first liquid level controller 401. The first pressure limiters include a first high-pressure limiter and a first ultra-high-pressure limiter. The first cooling pipeline also includes several one-way valves, a water supply solenoid valve, a filter, a pressure pump, and a low-pressure limiter.

[0060] The first medium circuit 41 and the second medium circuit 42 have the same structure. Specifically, the second heating pipeline includes a second heat medium return port, a second liquid level controller, a second circulation pump, a second heater, a second heat medium outlet and a second over-temperature controller arranged in sequence and connected by pipelines. The second cooling pipeline includes a second cooling medium inlet, a second cooling solenoid valve and a second cooling medium outlet arranged in sequence and connected by pipelines. Heat exchange is performed between the second heating pipeline and the second cooling pipeline through a second heat exchanger. The control unit 10 adjusts the temperature of the master mold by controlling the second heater and the second cooling solenoid valve.

[0061] At least one third temperature sensor is installed on the pipeline between the second heat medium outlet and the second heater to detect the outlet temperature of the second heating pipeline. At least one third temperature sensor is installed on the pipeline between the second heat medium return port and the second heater to detect the return temperature of the second heating pipeline. The control unit is configured to generate a second alarm signal based on the outlet temperature and return temperature of the second heating pipeline.

[0062] The second heating circuit further includes a second over-temperature controller, a second pressure indicator, a second pressure limiter, several filters, a ball valve, an exhaust solenoid valve and a pressure relief solenoid valve mounted on the second liquid level controller, and a pressure relief valve mounted on the second heater. The second over-temperature controller is mounted on the second heater, the second pressure indicator is mounted on the pipeline between the second heat medium outlet and the second heater, and the second pressure indicator and second pressure limiter are mounted on the second liquid level controller. The second pressure limiter includes a second high-pressure limiter and a second ultra-high-pressure limiter. The second cooling circuit also includes several one-way valves, a water supply solenoid valve, a filter, a pressure pump, and a low-pressure limiter.

[0063] The second medium circuit 42 is connected to the second temperature control pipeline 321 , and the medium in the second medium circuit 42 and the second temperature control pipeline 321 circulates with each other. The control unit 10 indirectly controls the temperature of the second temperature control pipeline 321 by controlling the second medium circuit 42 , thereby achieving temperature control of the mold 32 .

[0064] This embodiment is illustrated by taking the first medium circuit 41 as an example in conjunction with the drawings, and the specific connection relationship of the second medium circuit 42 is not repeated in the drawings. It can be understood that any known or unknown first medium circuit 41 and second medium circuit 42 can be used here without restriction.

[0065] Ginseng Figure 4 As shown, a mold temperature control device of one embodiment includes a shell, and the interior of the shell includes a first chamber 103 and a second chamber 104 separated from each other, wherein a first medium circuit 41 and a second medium circuit 42 are fixedly arranged in the second chamber 104, and a control unit 10 is fixedly arranged in the first chamber 103.

[0066] Furthermore, the mold temperature control device in one embodiment also includes a first display device 101 and a second display device 102. The first display device 101 and the second display device 102 are nested on the surface of the shell and are electrically connected to the control unit 10. The first display device 101 is used to display the real-time temperature of the male mold 31, the target temperature of the male mold 31, the return medium temperature and the outlet medium temperature corresponding to the first medium circuit 41, the real-time heating power of the male mold 31, and the real-time cooling power of the male mold 31. The second display device 102 is used to display the real-time temperature of the female mold 32, the target temperature of the female mold 32, the return medium temperature and the outlet medium temperature corresponding to the second medium circuit 42, the real-time heating power of the female mold 32, and the real-time cooling power of the female mold 32.

[0067] Furthermore, in one embodiment, the housing is further provided with a connection port 105 for accommodating the first temperature sensor 21 and the second temperature sensor 22 .

[0068] Ginseng Figure 5 As shown, the control unit in one embodiment further includes a storage module 14, a calculation module 13, and a control module 11. The storage module 14 is used to store the target temperatures of the molds, including the male mold target temperature and the female mold target temperature. The calculation module 13 is used to calculate the difference between the real-time mold temperature and the target mold temperature. Specifically, it is used to calculate a first difference between the real-time temperature of the male mold and the male mold target temperature, and a second difference between the real-time temperature of the female mold and the female mold target temperature. The control module is used to generate a first control signal S1 based on the first difference and a second control signal S2 based on the second difference.

[0069] Furthermore, the control module 11, the calculation module 13, the storage module 14 and the communication interface 15 are connected via an internal bus 12. The control unit includes one of a CPU, an MCU and an FPGA.

[0070] Furthermore, the control unit 10 also includes a communication interface 15, through which the control unit 10 communicates with a host computer, for enabling communication between the host computer and the control unit 10. The communication interface 15 is provided on the housing. In one embodiment, the communication interface adopts a communication protocol selected from UART, RS232, RS485, IIC, and SPI.

[0071] It can be understood that the host computer in one embodiment includes an injection molding device or a production management information system MES, and the injection molding device or the production management information system MES communicates with the mold temperature control device of this embodiment through an RS485 communication interface, and remotely and automatically sets and manages the set value of the mold temperature control device in the injection molding device or the production management information system MES, and obtains the real-time temperature of the male mold 31, the real-time temperature of the female mold 32, etc.

[0072] In other alternative embodiments, the mold temperature control device includes two control units 10 with the same structure, one of which is used to generate a first control signal S1 based on the real-time temperature of the male mold 31 and the target temperature of the male mold, and drive the corresponding first medium circuit 41 through the first control signal S1 to adjust the temperature of the male mold 31, and drive the first medium circuit through the first control signal S1 to adjust the temperature of the male mold, and the other control unit is used to generate a second control signal S2 based on the real-time temperature of the female mold 32 and the target temperature of the female mold, and drive the corresponding second medium circuit 42 through the second control signal S2 to adjust the temperature of the female mold 32.

[0073] Specifically, the control unit 10 of the mold temperature control device adopts a closed-loop PID control method, including:

[0074] The real-time temperature of the male mold 31 is obtained through the first temperature sensor 21, and the real-time temperature of the female mold 32 is obtained through the second temperature sensor 22;

[0075] Comparing the real-time temperature of the male mold with the target male mold temperature and calculating a first difference, and issuing a corresponding first control signal S1 based on the first difference to control the heating efficiency of the first heater 403 and control the flow of the first cooling solenoid valve 404 to adjust the cooling efficiency;

[0076] Comparing the real-time temperature of the master mold with the target temperature of the master mold and calculating a second difference, and issuing a corresponding second control signal S2 based on the second difference to control the heating efficiency of the second heater and control the flow of the second cooling solenoid valve to adjust the cooling efficiency;

[0077] Repeat the above steps until the difference between the real-time temperature of the male mold 31 and the target temperature of the male mold 31 is less than a specified value (for example, 1°C), and until the difference between the real-time temperature of the female mold 32 and the target temperature of the female mold 32 is less than a specified value.

[0078] It can be seen from the above technical solutions that the present invention has the following beneficial effects:

[0079] The present invention can directly obtain the temperature of the mold itself through the temperature sensor device, eliminating the influence of ambient temperature and other unexpected factors on the mold temperature. The mold temperature is directly controlled by the control unit, and a closed-loop control method is adopted to achieve more accurate dynamic control of the real-time temperature of the mold.

[0080] The real-time temperatures of the male and female molds are obtained by temperature sensors installed on the male and female molds respectively, and closed-loop control is performed through the control unit to meet the injection molding needs with inconsistent temperature requirements of the male and female molds.

[0081] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0082] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A mold temperature control device, characterized in that: include: A control unit, a temperature sensor and a medium circuit, wherein a medium flows through the medium circuit, the medium is used to exchange heat with the mold, the temperature sensor is used to collect the real-time temperature of the mold, the control unit is used to compare the real-time temperature of the mold with the target temperature of the mold to generate a control signal, and drives the medium circuit through the control signal to adjust the medium temperature, so as to feedback control the real-time temperature of the mold.

2. The mold temperature control device according to claim 1, characterized in that: The mold includes a male mold and a female mold, the temperature sensor includes a first temperature sensor and a second temperature sensor, and the medium circuit includes a first medium circuit and a second medium circuit; The first temperature sensor is mounted on the male mold to collect the real-time temperature of the male mold, and the control unit is used to generate a first control signal based on the real-time temperature of the male mold and the male mold target temperature, and drive the first medium circuit through the first control signal to adjust the temperature of the male mold; The second temperature sensor is installed on the master mold to obtain the real-time temperature of the master mold. The control unit is used to generate a second control signal based on the real-time temperature of the master mold and the target temperature of the master mold, and drive the second medium circuit through the second control signal to adjust the temperature of the master mold.

3. The mold temperature control device according to claim 1, characterized in that: The temperature sensor device includes a thermistor sensor; and / or, The temperature sensor device includes a nose-pressure temperature sensor.

4. The mold temperature control device according to claim 1, characterized in that: The mold temperature control device also includes a quick-plug connector, which is communicatively connected to the control unit, the signal end of the temperature sensor is movably connected to the quick-plug connector, and the temperature measuring end of the temperature sensor is fixedly connected to the mold.

5. The mold temperature control device according to claim 2, characterized in that: The first medium circuit includes a first heating pipeline and a first cooling pipeline, the first heating pipeline is used to circulate heating medium, and the first cooling pipeline is used to circulate cooling medium; and / or, The second medium circuit includes a second heating pipeline and a second cooling pipeline. The second heating pipeline is used for circulating a heating medium, and the second cooling pipeline is used for circulating a cooling medium.

6. The mold temperature control device according to claim 5, characterized in that: The first heating pipeline includes a first heat medium return port, a first liquid level controller, a first circulation pump, a first heater, a first heat medium outlet, and a first over-temperature controller provided on the first heater, which are sequentially arranged and connected through pipelines; the first cooling pipeline includes a first cooling medium inlet, a first cooling solenoid valve, and a first cooling medium outlet, which are sequentially arranged and connected through pipelines; heat exchange is performed between the first heating pipeline and the first cooling pipeline via a first heat exchanger; and the control unit adjusts the temperature of the male mold by controlling the first heater and the first cooling solenoid valve; and / or, The second heating pipeline includes a second heat medium return port, a second liquid level controller, a second circulation pump, a second heater, a second heat medium outlet and a second over-temperature controller arranged in sequence and connected through pipelines. The second cooling pipeline includes a second cooling medium inlet, a second cooling solenoid valve and a second cooling medium outlet arranged in sequence and connected through pipelines. Heat exchange is performed between the second heating pipeline and the second cooling pipeline through a second heat exchanger. The control unit adjusts the temperature of the master mold by controlling the second heater and the second cooling solenoid valve.

7. The mold temperature control device according to claim 6, characterized in that: The mold temperature control device further includes a plurality of third temperature sensors, which are used to collect one or more of the outlet temperature of the first heating pipeline, the return temperature of the first heating pipeline, the outlet temperature of the second heating pipeline, and the return temperature of the second heating pipeline; The control unit is used to generate a first alarm signal based on the outlet temperature of the first heating pipeline and / or the return temperature of the first heating pipeline, and to generate a second alarm signal based on the outlet temperature of the second heating pipeline and / or the return temperature of the second heating pipeline.

8. The mold temperature control device according to claim 1, characterized in that: The control unit comprises: a storage module, configured to store the target temperature of the mold; a calculation module, configured to calculate a difference between the real-time temperature of the mold and the target temperature of the mold; A control module is configured to generate a control signal based on the difference.

9. The mold temperature control device according to claim 1, characterized in that: The control unit further comprises a communication interface, and the control unit is communicatively connected to a host computer via the communication interface, for realizing communication between the host computer and the control unit.

10. The mold temperature control device according to claim 2, characterized in that: The mold temperature control device further includes a first display device and a second display device; The first display device is used to display the real-time temperature of the male mold, the target temperature of the male mold, the return medium temperature and the outlet medium temperature corresponding to the first medium circuit; The second display device is used to display the real-time temperature of the mother mold, the target temperature of the mother mold, the return medium temperature and the outlet medium temperature corresponding to the second medium circuit.

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