IGCT heat dissipation assembly based on extra-high voltage power grid and heat dissipation method of IGCT heat dissipation assembly

Abstract

The invention relates to the technical field of IGCT heat dissipation for an extra-high voltage power grid, in particular to an IGCT heat dissipation assembly for an extra-high voltage power grid and a heat dissipation method thereof, and the IGCT heat dissipation assembly comprises a heat transfer substrate, a cooling regulation and control module, a driving regulation and control device and an electrostatic neutralization unit. The IGCT shell adopts a three-layer composite material design, and efficient heat conduction and electrical insulation are realized through a heat conduction metal layer, a corrugated metal framework and a ceramic insulating layer; the cooling regulation and control module and a liquid flow pump set form turbulent flow heat exchange through a separation membrane; the driving regulation and control device controls the cooling liquid to flow through mechanical motion; and the electrostatic neutralization unit monitors and neutralizes the charge of the cooling liquid in real time. According to the invention, through mechanical driving and turbulent flow enhanced heat dissipation of the honeycomb liquid cooling array and a static elimination mechanism of the charge neutralization module, the technical bottleneck of the existing IGCT heat dissipation assembly is comprehensively solved, and an efficient and reliable heat dissipation solution is provided for the IGCT in an extra-high voltage power grid.

Description

Technical Field

[0001] The present invention relates to the technical field of IGCT heat dissipation for ultra-high voltage power grids, and in particular to an IGCT heat dissipation component for ultra-high voltage power grids and a heat dissipation method thereof. Background Art

[0002] In ultra-high voltage (UHV) power grids, integrated gate-commutated thyristors (IGCTs) (IGCTs), as core power devices, generate significant heat during operation, and their heat dissipation performance directly impacts the stability and safety of the power grid. However, existing IGCT heat dissipation components face numerous technical bottlenecks: First, insufficient heat transfer efficiency. Conventional substrates, often made of a single metal or ceramic material, either suffer from excessively high contact thermal resistance (>0.1°C / W) due to thermal expansion coefficient mismatches or from poor thermal conductivity, which prevents rapid heat dissipation from the chip. Furthermore, the lack of an effective heat dissipation structure can easily lead to localized hotspots, shortening the IGCT's service life. Second, the heat dissipation method is single and poorly coordinated. In liquid-only cooling systems, the coolant typically flows in a laminar state, resulting in a low heat transfer coefficient. Third, charge management capabilities are weak. In ultra-high voltage environments, coolant flow and component friction easily generate static charge. Conventional components lack real-time neutralization and discharge mechanisms, resulting in charge densities often exceeding 50μC / m³ and charge decay times exceeding 120s. This poses a high risk of electrostatic discharge, which can disrupt equipment operation or even cause serious faults such as insulation breakdown, hindering the reliable application of IGCTs in UHV power grids. Summary of the Invention

[0003] This invention addresses the technical shortcomings of existing IGCT heat dissipation assemblies, such as insufficient heat transfer efficiency, a single heat dissipation method with poor synergy, and weak charge management capabilities. By providing an IGCT heat dissipation assembly and heat dissipation method for ultra-high voltage (UHV) power grids, this heat dissipation assembly overcomes the technical bottlenecks of conventional heat dissipation assemblies in UHV scenarios through the mechanical drive and turbulence-enhanced heat dissipation of a honeycomb liquid cooling array and the static elimination mechanism of a charge neutralization module.

[0004] The present invention provides an IGCT heat dissipation assembly for an ultra-high voltage power grid, comprising the following structure: An IGCT is provided on the top of the substrate. One side of the inner wall of the IGCT is a molybdenum-copper alloy layer, the middle layer is a corrugated copper alloy skeleton, and the outer layer of the corrugated copper alloy skeleton is covered with an aluminum nitride ceramic layer. The thermal conductivity of the molybdenum-copper alloy reaches 180W / m·K and has a thermal expansion coefficient close to that of the IGCT electrode ( ), thereby reducing contact thermal resistance and quickly absorbing chip heat; the middle layer is a corrugated copper alloy skeleton, which increases the heat transfer area by 40% through its corrugated structure and evenly transfers heat to the outer layer; the outer layer is covered with an aluminum nitride ceramic layer, which has both high insulation properties (dielectric strength ≥15kV / mm) and high thermal conductivity (thermal conductivity ≥170W / m·K), and can direct heat to the liquid cooling system while blocking ultra-high voltage electric field interference.

[0005] Furthermore, the honeycomb liquid cooling array is arranged on the top of the substrate to perform contact heat dissipation on the aluminum nitride ceramic layer. The honeycomb liquid cooling array includes a liquid cooling base, a liquid cooling chamber, a servo motor, a double-headed rocker, a telescopic membrane, a contact rod, a water pump group and other components. The liquid cooling chamber is divided into a liquid flow chamber and a displacement chamber, and the two are separated by a telescopic membrane. When the coolant flows in the liquid flow chamber, due to the periodic movement of the telescopic membrane, the coolant forms turbulence, which increases the heat transfer coefficient by 50%. The contact rod moves with the telescopic membrane and drives the fan blades to rotate, forming air cooling and heat dissipation, and combined with liquid cooling to achieve multi-dimensional heat dissipation, wherein the liquid cooling base is arranged between the substrate and the IGCT, connected to the liquid flow chamber, and its top is in direct contact with the IGCT, increasing the liquid cooling heat dissipation area.

[0006] Specifically, the drive assembly, mounted on top of the baseplate, activates the honeycomb liquid cooling array. The servo motor drives the double-ended rocker, causing the extrusion unit to periodically squeeze the telescopic membrane along the arc-shaped hole, powering the liquid cooling cycle. When the extrusion unit compresses the telescopic membrane, the volume of the liquid flow chamber decreases, generating pressure that accelerates the flow of coolant. When the extrusion unit disengages, a spring pulls the telescopic membrane back into position, creating a mechanical reciprocating motion. The spring, attached to the raised side of the telescopic membrane, ensures stability and repeatability during the membrane's return motion.

[0007] Furthermore, the charge neutralization module is embedded within the honeycomb liquid cooling array and moves synchronously with it. It includes an iridium titanium oxide electrode and an ion controller. The iridium titanium oxide electrode monitors the charge density of the liquid flow in real time. When the charge density exceeds 5μC / m³, the ion controller injects reverse ions to quickly eliminate excess charge in the liquid flow. The inner wall of the displacement chamber is coated with a fluorinated silica nanocoating with a thickness of 2-5μm, which can reduce tribostatic static and shorten the charge decay time to 0.5s.

[0008] In particular, a column is fixedly connected to one side of the outer wall of the base plate, a positioning ring is evenly distributed on one side of the outer wall of the column, a hollow column is rotatably connected inside the positioning ring, a fan blade is installed on the outer wall of the hollow column, a groove is provided on one side of the inner wall of the hollow column, a slider is fixedly connected to one side of the outer wall of the contact rod, and the slider corresponds to the groove.

[0009] The present invention also provides a heat dissipation method based on an IGCT heat dissipation assembly for an ultra-high voltage power grid, comprising the following steps: S1. The IGCT is located on top of the substrate. The IGCT initiates heat conduction through a three-layer composite structure: the molybdenum-copper alloy layer closely adheres to the IGCT electrode, utilizing its high thermal conductivity to quickly absorb chip heat; the corrugated copper alloy skeleton increases the heat transfer area through its corrugated structure, evenly dissipating heat; and the aluminum nitride ceramic layer, with its high insulation and thermal conductivity, directs heat to the liquid cooling system while blocking interference from the ultra-high voltage electric field. S2: The servo motor starts, driving the double-headed rocker to rotate, causing the extrusion part to periodically squeeze the telescopic membrane along the arc-shaped hole. When the extrusion part presses the telescopic membrane, the volume of the liquid flow chamber decreases, generating pressure, pushing the coolant to form turbulent flow. When the extrusion part is disengaged, the spring pulls the telescopic membrane back to its original position, and the water pump group pumps in low-temperature coolant to complete the cycle. S3. When the extrusion part squeezes the telescopic membrane, the coolant in the liquid flow chamber forms turbulence, and the heat transfer coefficient is increased by 50%; the contact rod moves with the telescopic membrane and drives the hollow column and fan blades to rotate, causing air turbulence to generate air cooling and heat dissipation; S4: The charge neutralization module is activated, and the iridium titanium oxide electrode monitors the charge density of the liquid flow in real time. When the charge density exceeds 5μC / m³, the ion controller injects reverse ions to quickly eliminate excess charge in the liquid flow and eliminate the risk of static electricity.

[0010] Furthermore, the specific operating process of the honeycomb liquid cooling array is as follows: After the servo motor on the positioning plate is activated, it drives the double-ended rocker to rotate. The other end of the double-ended rocker extends into the displacement chamber through an arc-shaped hole. The extrusion portion at its end periodically squeezes the telescopic membrane during rotation. When the extrusion portion approaches the telescopic membrane, the telescopic membrane is pushed toward the liquid flow chamber, reducing the volume of the liquid flow chamber and accelerating the flow of the coolant inside under the action of pressure. When the extrusion portion moves away from the telescopic membrane, the telescopic membrane returns to its original position under the elastic force of the spring, restoring the volume of the liquid flow chamber. At this time, the water pump assembly pumps the low-temperature coolant in the liquid storage chamber into the liquid flow chamber, forming a circulation system. The raised end of the telescopic membrane is provided with a hemispherical structure to reduce frictional resistance with the extrusion portion. Simultaneously, the contact rod moves with the telescopic membrane. When the extrusion portion squeezes the telescopic membrane, the contact rod rotates the hollow column and fan blades through the slider and groove, creating air cooling and heat dissipation.

[0011] Specifically, the charge neutralization module works as follows: the iridium titanium oxide electrode in the liquid flow chamber monitors the charge density in the coolant in real time. When the ion controller detects that the charge density exceeds 5μC / m³, it immediately injects reverse ions into the electrode to neutralize the excess charge in the coolant, achieving continuous charge discharge. The fluorinated silica nanocoating covering the inner wall of the displacement chamber has a surface resistivity of 10¹ 0 The characteristics of Ω can shorten the charge decay time to 0.5s, completely eliminating the risk of static electricity.

[0012] The technical solution of the present invention achieves the following beneficial effects: First, the matching thermal expansion coefficients of the molybdenum-copper alloy layer and the IGCT electrode reduce the contact thermal resistance. The corrugated copper alloy skeleton achieves uniform heat diffusion by increasing the heat transfer area. The aluminum nitride ceramic layer ensures efficient thermal conductivity on the basis of high insulation. The three layers work together to increase the thermal response speed by more than 30%, providing core guarantee for the stable operation of IGCT in ultra-high voltage environment.

[0013] Secondly, liquid cooling and air cooling synergize to enhance heat dissipation. The cyclical movement of the telescopic membrane driven by the drive assembly creates turbulent flow in the coolant in the liquid flow chamber, increasing the heat transfer coefficient by 50%. The contact rod, in conjunction with the membrane's movement, simultaneously drives the fan blades to generate air cooling, significantly improving heat dissipation compared to a single liquid cooling solution.

[0014] Finally, the charge neutralization module completely eliminates static electricity risks. Iridium-titanium oxide electrodes and the real-time reverse ion injection of the ion controller rapidly neutralize the liquid charge, shortening the charge decay time to 0.5 seconds and preventing static electricity accumulation from interfering with or damaging UHV grid equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of an IGCT heat dissipation assembly for an ultra-high voltage power grid according to the present invention; Figure 2 This is a diagram showing an IGCT heat dissipation assembly for a UHV power grid according to the present invention; Figure 3 Schematic diagram of an IGCT heat dissipation assembly for ultra-high voltage power grid according to the present invention; Figure 4 A cross-sectional view of an IGCT heat dissipation assembly for an ultra-high voltage power grid according to the present invention; Figure 5 It is an enlarged view of point A of the present invention; Figure 6 It is an enlarged view of point B of the present invention; Figure 7 This is an exploded view of the IGCT heat dissipation assembly for ultra-high voltage power grid according to the present invention.

[0016] Among them, 1. substrate; 2. molybdenum-copper alloy layer; 3. aluminum nitride ceramic layer; 4. honeycomb liquid cooling array; 401. liquid cooling base; 402. liquid cooling chamber; 403. positioning plate; 404. servo motor; 405. liquid flow chamber; 406. displacement chamber; 407. contact rod; 408. annular membrane; 409. water pump group; 410. extrusion part; 411. fluorinated silicon dioxide nano-coating; 412. telescopic membrane; 413. double-headed rocker; 414. arc hole; 415. spring; 416. limit tube; 417. sealing ring; 418. liquid storage chamber; 5. drive component; 6. charge neutralization module; 601. iridium titanium oxide electrode; 602. ion controller; 7. corrugated copper alloy frame; 8. column; 9. positioning ring; 10. hollow column; 11. fan blade; 12. groove; 13. slider. DETAILED DESCRIPTION

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] The present invention provides an IGCT heat dissipation component and heat dissipation method for ultra-high voltage power grid, combined with the attached Figure 1 To the attached Figure 7 The specific implementation is described in detail. The heat dissipation assembly of the present invention comprises a substrate 1, a honeycomb liquid cooling array 4, a driving assembly 5 and a charge neutralization module 6, all of which work together to achieve efficient heat dissipation and static elimination functions.

[0019] The substrate 1 is the core carrier of the entire heat dissipation component, and an IGCT is installed on its top. The IGCT structure is designed as a three-layer composite material. The innermost cavity wall of the IGCT is a molybdenum-copper alloy layer 2. This layer is made of molybdenum-copper alloy with a thermal conductivity of 180W / m·K and a thermal expansion coefficient of , with a thermal expansion coefficient close to that of the IGCT electrode, thus ensuring a close fit between the two, significantly reducing contact thermal resistance, and quickly absorbing the heat generated by the IGCT chip. The middle layer is a corrugated copper alloy skeleton 7. The corrugated structure design increases the heat transfer area by 40% and evenly transfers heat to the outer layer. The outer layer is covered with an aluminum nitride ceramic layer 3. This layer uses high-purity aluminum nitride ceramic material with high insulation dielectric strength ≥15kV / mm and high thermal conductivity ≥170W / m·K. It can direct heat to the honeycomb liquid cooling array 4 while effectively blocking UHV electric field interference. The three-layer structure works synergistically to increase the thermal response speed by more than 30%, providing a core guarantee for the stable operation of IGCT in UHV environments. The liquid cooling base 401 is arranged below the IGCT assembly and is connected to the liquid flow cavity 405. By directly contacting the IGCT, the liquid cooling heat dissipation area of ​​the IGCT is increased.

[0020] The honeycomb liquid cooling array 4 is arranged on the top of the substrate 1. The specific structure of the honeycomb liquid cooling array 4 includes components such as a liquid cooling base 401, a liquid cooling cavity 402, a servo motor 404, a double-headed rocker 413, a telescopic membrane 412, a contact rod 407 and a water pump group 409. The IGCT is installed at the top axis of the liquid cooling base 401. The liquid cooling base 401 is symmetrically arranged on the surface of the substrate 1. The top of the liquid cooling base 401 is also provided with a liquid cooling cavity 402. The liquid cooling base 401 is connected to the liquid cooling cavity 402. The IGCT is arranged on the top of the liquid cooling base 401 and is in direct contact with it to increase the liquid cooling area. The tops of the two liquid cooling cavities 402 are fixedly connected to the same positioning plate 403, and the servo motor 404 is fixedly installed on the positioning plate 403. The output end of the servo motor 404 is fixedly connected to the double-headed rocker 413, as shown in FIG. Figure 3As shown, the double-ended rocker 413 has an inverted "U" shape. The end of the double-ended rocker 413 extends through the arc-shaped hole 414 and into the displacement chamber 406. Its end is rotatably connected to the extrusion portion 410. The interior of the liquid cooling chamber 402 is divided into a liquid flow chamber 405 and a displacement chamber 406 by a telescopic membrane 412. The telescopic membrane 412 consists of a hard isolation membrane and a soft isolation membrane. The hard isolation membrane has a through hole for the contact rod 407 to pass through, while the soft isolation membrane is located on the other side of the through hole. The side closest to the aluminum nitride ceramic layer 3 is the liquid flow chamber 405, and the other side is the displacement chamber 406. One end of the contact rod 407 extends out of the liquid cooling chamber 402 and is inserted into the hollow column 10. The other end of the contact rod 407 extends into the soft isolation membrane. A spring 415 is installed between the end of the contact rod 407 and the hard isolation membrane. The liquid cooling chamber 402 is provided with an annular membrane 408 at the connection with the contact rod 407 to ensure dynamic sealing when the contact rod 407 slides. At the same time, the limiting tube 416 provides a limiting effect on the contact rod 407, ensuring that the contact rod 407 can only move forward and backward along the extension direction of the limiting tube 416. At the same time, the sealing ring 417 further prevents the overflow of the coolant. The outer wall of the liquid cooling chamber 402 is provided with a water pump group 409. One end of the water pump group 409 is connected to the liquid flow chamber 405, which is in turn connected to the liquid cooling base. The other end is connected to the liquid storage chamber 418 through a hose. The inner wall of the displacement chamber 406 is covered with a fluorinated silica nano-coating 411. The coating thickness is 2-5μm and has a surface resistivity of 10¹ 0 The characteristics of Ω can shorten the charge decay time to 0.5s.

[0021] The honeycomb liquid cooling array 4 operates as follows: Servomotor 404 activates, driving a double-ended rocker 413 to rotate. The other end of the double-ended rocker 413 extends through an arc-shaped hole 414 into the displacement chamber 406. During rotation, the extrusion portion 410 at its end periodically compresses the telescopic membrane 412. The raised portion of the telescopic membrane 412 is a soft compression membrane, while the flat surface of the membrane 412 is a hard isolation membrane. As the extrusion portion 410 approaches the membrane 412, the volume of the soft compression membrane decreases under the pressure, reducing the volume of the liquid flow chamber 405 and generating pressure. This accelerates the flow of coolant and creates turbulence within the liquid flow chamber 405. This turbulent effect increases the heat transfer coefficient by 50%, significantly enhancing heat dissipation.

[0022] like Figure 3As shown, the contact surface between the extrusion portion 410 and the telescopic membrane 412 presents a parabolic structure having two valleys and one peak. As the extrusion portion 410 moves, the contact position between the telescopic membrane 412 and the extrusion portion 410 continuously changes. When the contact point between the telescopic membrane 412 and the extrusion portion 410 moves from the valley to the peak, the telescopic membrane 412 exerts a squeezing effect on the contact rod 407, and the volume of the liquid flow chamber 405 gradually decreases. When the contact point between the telescopic membrane 412 and the extrusion portion 410 moves from the peak to the valley, the extrusion portion 410 gradually releases its squeezing of the telescopic membrane 412. Simultaneously, under the action of the spring 415, the contact rod 407 causes the telescopic membrane 412 to return to its original state, and the volume of the liquid flow chamber 405 gradually increases. At this time, the water pump assembly 409 pumps the low-temperature coolant in the liquid storage chamber 418 into the liquid flow chamber 405, forming a circulation. When the contact rod 407 moves, the slider 13 provided on the outer wall thereof will slide along the groove 12 inside the hollow column 10. Figure 7 As shown, groove 12 is arranged in a spiral shape. Therefore, under the combined action of contact rod 407 and slider 13, hollow column 10 begins to rotate, synchronously driving fan blades 11 to rotate, disturbing the air and creating a wind cooling effect. The combined action of sealing ring 417 and annular membrane 408 ensures dynamic sealing when contact rod 407 slides, preventing coolant leakage.

[0023] It is particularly important to note that multiple groups of contact rods 407 and telescopic membranes 412 are provided in the honeycomb liquid cooling array 4. When the squeezing portion 410 completely releases the squeezing of the current telescopic membrane 412, it begins to squeeze the next telescopic membrane 412. As the squeezing portion 410 moves, the interior of the liquid flow cavity 405 is continuously compressed and restored, thereby continuously forming turbulence inside the liquid cooling base 401, thereby improving the heat dissipation effect.

[0024] The charge neutralization module 6 is embedded in the honeycomb liquid cooling array 4 and moves synchronously with the honeycomb liquid cooling array 4. The charge neutralization module 6 includes an iridium titanium oxide electrode 601 and an ion controller 602. The iridium titanium oxide electrode 601 is embedded in the inner wall of the liquid flow chamber 405 with a spacing of 5-10mm, and monitors the charge density in the coolant in real time. When the ion controller 602 detects that the charge density exceeds 5μC / m³, it immediately injects reverse ions into the iridium titanium oxide electrode 601 to neutralize the excess charge in the coolant and achieve continuous charge discharge. The fluorinated silicon dioxide nano-coating 411 covering the inner wall of the displacement chamber 406 has a surface resistivity of 10¹ 0 The characteristics of Ω can shorten the charge decay time to 0.5s, completely eliminating the risk of ultra-high voltage static electricity.

[0025] The top of the base plate 1 is fixedly connected with a column 8, and a uniformly distributed positioning ring 9 is provided on one side of the outer wall of the column 8. A hollow column 10 is rotatably connected to the inner side of the positioning ring 9. A fan blade 11 is installed on the outer wall of the hollow column 10. A groove 12 is provided on one side of the inner wall of the hollow column 10. A slider 13 is fixedly connected to one side of the outer wall of the contact rod 407. The slider 13 corresponds to the groove 12. The contact rod 407 moves toward the inside of the hollow column 10 under the extrusion action of the extrusion part 410. The slider 13 is embedded in the groove 12 at the same time as the contact rod 407 enters the hollow column 10. Since the groove 12 is a screw The rotary setting, during the forward movement of the contact rod 407, this part of the forward force is converted into the rotational force of the hollow column 10, and the hollow column 10 drives the fan blades 11 to rotate, thereby accelerating the air flow outside the aluminum nitride ceramic layer 3, and realizing the simultaneous liquid cooling and air cooling. In addition, the special shape of the extrusion portion 410 increases the displacement distance of the contact rod 407, increases the number of rotations of the hollow column 10, and improves the air cooling effect accordingly. Of course, in order to further increase the number of rotations of the hollow column 10, the pitch of the groove 12 can be appropriately reduced to increase the number of rotations of the groove.

[0026] The present invention also provides a heat dissipation method based on an IGCT heat dissipation assembly for an ultra-high voltage power grid, the specific steps of which are as follows: An IGCT is installed on top of S1 and substrate 1. The IGCT initiates heat conduction through a three-layer composite structure: the molybdenum-copper alloy layer 2 closely adheres to the IGCT electrode and uses its high thermal conductivity to quickly absorb chip heat; the corrugated copper alloy skeleton 7 increases the heat transfer area through its corrugated structure, evenly dissipating the heat; and the aluminum nitride ceramic layer 3, with its high insulation and high thermal conductivity, conducts heat to the liquid cooling system while blocking interference from the ultra-high voltage electric field. S2: Servo motor 404 starts, driving double-ended rocker 413 to rotate, causing extrusion unit 410 to periodically squeeze expansion membrane 412 along arc-shaped hole 414. When extrusion unit 410 compresses expansion membrane 412, the volume of liquid flow chamber 405 decreases, generating pressure, pushing the coolant into turbulent flow. When extrusion unit 410 disengages, spring 415 pushes expansion membrane 412 back into place via contact rod 407, and water pump assembly 409 pumps in low-temperature coolant to complete the circulation. S3: When extrusion unit 410 squeezes expansion membrane 412, the coolant in liquid flow chamber 405 forms turbulent flow, increasing the heat transfer coefficient by 50%. Contact rod 407 moves with expansion membrane 412, driving the fan blades to rotate, generating air cooling and heat dissipation.

[0027] S4. The charge neutralization module 6 is started, and the iridium titanium oxide electrode 601 monitors the charge density of the liquid flow in real time. When the charge density exceeds 5μC / m³, the ion controller 602 injects reverse ions to quickly eliminate excess charge in the liquid flow and eliminate the risk of ultra-high voltage static electricity.

[0028] In practical applications, the heat dissipation component of the present invention is suitable for IGCT equipment in UHV power grids. For example, in a UHV substation, IGCT, as a core power device, needs to operate stably for a long time, and it generates a large amount of heat when working. Traditional heat dissipation components are often unable to meet the high heat flux density requirements due to insufficient heat transfer efficiency and a single heat dissipation method. The present invention comprehensively solves the bottleneck of the existing technology through the mechanical drive and turbulence-enhanced heat dissipation of the substrate and honeycomb liquid cooling array and the static elimination mechanism of the charge neutralization module. The IGCT three-layer composite structure on the top of the substrate 1 ensures efficient heat transfer, the honeycomb liquid cooling array 4 enhances the heat dissipation effect through mechanical drive and liquid circulation, and the charge neutralization module 6 specifically solves the static electricity problem in the UHV environment. The three work together to achieve safe and stable heat dissipation of the IGCT.

[0029] In summary, this invention achieves efficient heat dissipation and static elimination through innovative design and technical solutions. The honeycomb liquid cooling array achieves multi-dimensional heat dissipation through mechanical drive and turbulent enhanced heat dissipation, while the charge neutralization module completely eliminates static electricity risks, providing reliable technical support for IGCTs in UHV power grids.

[0030] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An IGCT heat dissipation component for ultra-high voltage power grid, characterized in that: The invention comprises a substrate (1), a honeycomb liquid cooling array (4), a driving component (5) and a charge neutralization module (6), wherein an IGCT is provided on the top of the substrate (1), an inner wall of the IGCT is provided on one side with a molybdenum-copper alloy layer (2), an intermediate layer is provided with a corrugated copper alloy skeleton (7), an outer layer of the corrugated copper alloy skeleton (7) is covered with an aluminum nitride ceramic layer (3), the honeycomb liquid cooling array (4) is provided on the top of the substrate (1) and contacts the aluminum nitride ceramic layer (3), the driving component (5) is used to drive the start of the honeycomb liquid cooling array (4), the charge neutralization module (6) is embedded in the honeycomb liquid cooling array (4), a column (8) is fixedly connected to the top of the substrate (1), an outer wall of the column (8) is provided with a uniformly distributed positioning ring (9), a hollow column (10) is rotatably connected to the inside of the positioning ring (9), a fan blade (11) is installed on the outer wall of the hollow column (10), and a groove (12) is provided on the inner wall of the hollow column (10).

2. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 1, characterized in that: The honeycomb liquid cooling array (4) comprises a liquid cooling base (401), a liquid cooling chamber (402), a servo motor (404), a double-headed rocker (413), a telescopic membrane (412), a contact rod (407) and a water pump group (409); the liquid cooling chamber (402) is divided into a liquid flow chamber (405) and a displacement chamber (406); the telescopic membrane (412) separates the liquid flow chamber (405) and the displacement chamber (406); the liquid cooling base (401) is arranged between the substrate (1) and the IGCT, is connected to the liquid flow chamber (405), and its top is in direct contact with the IGCT; the outer wall of the contact rod (407) is fixedly connected to a slider (13), and the slider (13) corresponds to the groove (12).

3. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 2, characterized in that: The servo motor (404) drives the double-headed rocker (413) to rotate. The double-headed rocker (413) extends into the displacement cavity (406) through the arc-shaped hole (414) and is connected to the extrusion part (410). The extrusion part (410) periodically squeezes the telescopic membrane (412).

4. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 3, characterized in that: A raised side of the telescopic membrane (412) is fixedly connected to a spring (415), and the other end of the spring (415) is fixedly connected to the outer wall of the liquid cooling cavity (402). The raised end of the telescopic membrane (412) is a soft compression membrane, and the flat surface of the telescopic membrane (412) is a hard isolation membrane. One side of the inner wall of the liquid cooling cavity (402) is fixedly connected to a limiting tube (416), and a sealing ring (417) is provided on the inner wall of the limiting tube (416).

5. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 1, characterized in that: The charge neutralization module (6) comprises an iridium titanium oxide electrode (601) and an ion controller (602), wherein the iridium titanium oxide electrode (601) is embedded in the inner wall of the liquid flow chamber (405).

6. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 2, characterized in that: The inner wall of the replacement cavity (406) is covered with a fluorinated silicon dioxide nano-coating (411), and the thickness of the fluorinated silicon dioxide nano-coating (411) is 2 to 5 microns.

7. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 1, characterized in that: The corrugated copper alloy skeleton (7) increases the heat transfer area through the corrugated structure design.

8. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 2, characterized in that: One end of the contact rod (407) contacts the aluminum nitride ceramic layer (3), and the other end is fixedly connected to one side of the inner wall of the telescopic membrane (412).

9. The IGCT heat dissipation assembly for ultra-high voltage power grid according to claim 2, characterized in that: One end of the water pump assembly (409) is connected to the liquid flow chamber (405), and the other end is connected to the liquid storage chamber (418) via a hose. The thermal conductivity of the molybdenum-copper alloy layer (2) is 180W / m·K, and the thermal expansion coefficient is .

10. A heat dissipation method for IGCT based on ultra-high voltage power grid, characterized in that: An IGCT is provided on the top of the S1 substrate (1). The IGCT initiates heat conduction through a three-layer composite structure: the molybdenum-copper alloy layer (2) is tightly attached to the IGCT electrode and uses its high thermal conductivity to quickly absorb the heat of the chip; the corrugated copper alloy skeleton (7) increases the heat transfer area through the corrugated structure and evenly diffuses the heat; the aluminum nitride ceramic layer (3) conducts the heat to the liquid cooling system with its high insulation and high thermal conductivity, while blocking the interference of the ultra-high voltage electric field; S2, the servo motor (404) is started, driving the double-headed rocker (413) to rotate, so that the extrusion part (410) periodically squeezes the telescopic membrane (412) along the arc-shaped hole (414). When the extrusion part (410) presses the telescopic membrane (412), the volume of the liquid flow chamber (405) is reduced to generate pressure, pushing the coolant to form turbulent flow; when the extrusion part (410) is disengaged, the spring (415) pushes the telescopic membrane (412) to return to its original position through the contact rod (407), and the water pump group (409) pumps the low-temperature coolant to complete the cycle; S3, when the extrusion portion (410) squeezes the telescopic membrane (412), the cooling liquid in the liquid flow chamber (405) forms turbulence, and the heat transfer coefficient is increased by 50%; the contact rod (407) moves with the telescopic membrane (412), driving the fan blades to rotate to form air cooling and heat dissipation; S4. The charge neutralization module (6) is started, and the iridium titanium oxide electrode (601) monitors the charge density of the liquid flow in real time; when the charge density exceeds 5 μC / m³, the ion controller (602) injects reverse ions to quickly eliminate excess charge in the liquid flow and eliminate the risk of ultra-high voltage static electricity.

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