Economical interconnection transfer device based on hybrid recombination of heterogeneous modules

Through heterogeneous module hybrid recombination technology, a common DC bus port is provided, the connection transformer is eliminated, and voltage level matching is achieved. This solves the problems of high cost and large size of traditional flexible interconnection devices, expands the power regulation range, and adapts to high interconnected grid phase angle differences.

CN120601439APending Publication Date: 2025-09-05HUNAN UNIV
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Patent Information

Application Number
CN202510804608.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-17
Publication Date
2025-09-05

AI Technical Summary

Technical Problem

Traditional flexible interconnection devices are expensive and occupy a large area, making them difficult to apply on a large scale. In addition, the voltage stress and rated capacity of small-capacity ports are limited, making it difficult to cope with scenarios with high phase angle differences in interconnected power grids.

Method used

By adopting heterogeneous module hybrid recombination technology, a common DC bus port is provided through the mixture of cascaded H-bridge modules and neutral point clamped converter modules, voltage level matching is achieved, the connection transformer is eliminated, and the power regulation of parallel modules and series modules is combined to adapt to the high phase angle difference of the interconnected power grid.

Benefits of technology

It reduces the cost and volume of the device, expands the power regulation range, effectively copes with the phase angle difference of high interconnected power grids, and realizes low-cost flexible interconnection.

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Abstract

The invention provides an economical interconnection transfer device based on heterogeneous module hybrid recombination. The economical interconnection transfer device comprises a parallel module, a series module, a first direct current split capacitor C1 and a second split direct current capacitor C2. Through a heterogeneous module hybrid recombination technology, a common DC bus port matched with the voltage grade is provided for the series module, a connection transformer does not need to be adopted to match the voltage grades of different modules, and a scene with a relatively high interconnected power grid phase angle difference can be effectively coped with.
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