Chip mounter control method and system based on machine vision

Abstract

The invention relates to the technical field of chip mounter control, and provides a chip mounter control method and system based on machine vision, and the method comprises the steps: obtaining a soldering paste region image in a staged manner in the staged mounting of a chip mounter through the machine vision, so as to obtain corresponding soldering paste region data, according to the pressure data of each stage and the data of the soldering paste area, a mounting pressure and soldering paste area change relation model is constructed, and the relation model reflects current soldering paste fluid characteristics; and substituting the preset soldering paste area requirement of each soldering point into the mounting pressure and soldering paste area change relation model to obtain a second pressurizing pressure for mounting of each soldering point, and performing pressure control on a mounting head corresponding to the soldering point, so that the mounting pressure can be accurately controlled in the element mounting process of the chip mounter, and the mounting efficiency is improved. The pressure is enabled to adapt to the change of the soldering paste in the process, the chip mounting and subsequent welding efficiency is improved, and the production quality of a circuit board is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip placement machine control, and in particular to a chip placement machine control method and system based on machine vision. Background Art

[0002] When the placement machine places the placement components on the PCB board, it must ensure that each welding point is fully wetted by the solder paste. The placement pressure needs to be moderate. If it is too small, the component solder ends or pins will float on the surface of the solder paste, and the solder paste will not be able to firmly adhere to the components, which will easily cause position movement during transfer and reflow. If it is too large, it will cause too much solder paste to be squeezed out, which will easily cause solder paste adhesion and bridging during reflow, and in severe cases, it will damage the components. Too little or too much placement pressure will affect the amount of solder paste squeezed out and the placement quality of the components. However, the state of the solder paste will change with the placement process time. The placement machine cannot meet the needs by only controlling the downward pressure of the placement components with a fixed placement pressure, and it is difficult to ensure that the solder paste fully wets each solder point, affecting the placement and subsequent welding efficiency and reducing product quality. Summary of the Invention

[0003] The present invention provides a chip placement machine control method based on machine vision, which is used to solve the problem in the prior art that the pressure control of the chip placement machine is difficult to meet the characteristics of solder paste.

[0004] A first aspect of the present invention provides a method for controlling a placement machine based on machine vision, comprising:

[0005] Sending a patch light pressure signal, and acquiring a first solder paste contour area image and first solder paste area data based on a machine vision system after receiving a pressure feedback signal; acquiring a second solder paste contour image and second solder paste area data after sending a patch pressure signal;

[0006] Acquire the light pressing pressure and the first pressing pressure data, and construct a relationship model between the placement pressure and the solder paste area change based on the first solder paste area data and the second solder paste area data;

[0007] The preset solder paste area requirements of each welding point are substituted into the relationship model between the mounting pressure and the solder paste area change to obtain the second pressurizing pressure of each welding point, and the mounting head corresponding to the welding point is pressure-controlled.

[0008] Optionally, extracting the first solder paste area data is specifically:

[0009] Obtaining the amount of solder paste printed on the soldering point, and calculating the area of ​​the solder paste unpressed region at a preset ratio based on the solder paste printed amount; identifying the area of ​​a first solder paste region in the first solder paste contour region image, and subtracting the area of ​​the unpressed region from the area of ​​the first solder paste region to obtain a first solder paste extrusion area;

[0010] The obtaining of the second solder paste area data specifically includes: identifying the area of ​​the second solder paste area in the second solder paste contour area image, and subtracting the area of ​​the first solder paste area from the area of ​​the second solder paste area to obtain the second solder paste extrusion area.

[0011] Optionally, before sending the patch light pressure signal, the method further includes:

[0012] Obtain the position of each soldering point of the mounted component and the control data of the mounting head, construct the control parameters of the mounting head corresponding to each soldering point, and obtain the control scheme of the mounting head corresponding to the soldering point;

[0013] The pressure control of the placement head corresponding to the welding point specifically includes: identifying the pressure of each welding point that can meet the placement head control scheme within the second pressure range according to the second pressure range of the placement of each welding point, obtaining the third pressure of each welding point, and setting the execution order and pressure of the control scheme for each welding point.

[0014] The second aspect of the present application provides a chip placement machine control system based on machine vision, comprising:

[0015] A machine vision processing module is configured to send a patch light pressure signal, obtain a first solder paste contour area image based on the machine vision system upon receiving the pressure feedback signal, and obtain first solder paste area data; and obtain a second solder paste contour image and second solder paste area data upon sending a patch pressure signal;

[0016] A relationship model building module is used to obtain the light pressing pressure and the first pressing pressure data, and to build a relationship model between the placement pressure and the solder paste area change based on the first solder paste area data and the second solder paste area data;

[0017] The placement machine control module is used to substitute the preset solder paste area requirements of each welding point into the relationship model between the placement pressure and the solder paste area change, obtain the second pressurizing pressure for each welding point, and perform pressure control on the placement head corresponding to the welding point.

[0018] Optionally, in the machine vision processing module, extracting the first solder paste area data is specifically:

[0019] Obtaining the amount of solder paste printed on the soldering point, and calculating the area of ​​the solder paste unpressed region at a preset ratio based on the solder paste printed amount; identifying the area of ​​a first solder paste region in the first solder paste contour region image, and subtracting the area of ​​the unpressed region from the area of ​​the first solder paste region to obtain a first solder paste extrusion area;

[0020] The obtaining of the second solder paste area data specifically includes: identifying the area of ​​the second solder paste area in the second solder paste contour area image, and subtracting the area of ​​the first solder paste area from the area of ​​the second solder paste area to obtain the second solder paste extrusion area.

[0021] Optionally, the machine vision processing module further includes, before sending the patch light pressure signal:

[0022] Obtain the position of each soldering point of the mounted component and the control data of the mounting head, construct the control parameters of the mounting head corresponding to each soldering point, and obtain the control scheme of the mounting head corresponding to the soldering point;

[0023] In the placement machine control module, pressure control is performed on the placement head corresponding to the welding point, specifically including: according to the second pressurization pressure range of each welding point, identifying the pressurization pressure of each welding point that can meet the placement head control scheme within the second pressurization pressure range, obtaining the third pressurization pressure of each welding point, and setting the execution order and pressurization pressure of the control scheme for each welding point.

[0024] The third aspect of the present application provides a device for controlling a placement machine based on machine vision, the device comprising a processor and a memory:

[0025] The memory is used to store program code and transmit the program code to the processor;

[0026] The processor is used to execute the machine vision-based placement machine control method described in any one of the first aspects of the present invention according to the instructions in the program code.

[0027] In a fourth aspect, the present application provides a computer-readable storage medium for storing program code, wherein the program code is used to execute a machine vision-based placement machine control method as described in any one of the first aspects of the present invention.

[0028] It can be seen from the above technical solution that the present invention has the following advantages: using machine vision to obtain solder paste area images in stages during the staged placement of the placement machine to obtain corresponding solder paste area data, and constructing a placement pressure and solder paste area change relationship model based on the pressure data and solder paste area data of each stage, the relationship model reflects the current solder paste fluid characteristics; the preset solder paste area requirements of each welding point are substituted into the placement pressure and solder paste area change relationship model to obtain the second pressurized pressure of each welding point, and the placement head corresponding to the welding point is pressure-controlled, which can accurately control the placement pressure during the placement of components by the placement machine, so that the pressure adapts to the changes in solder paste in the process, improves the efficiency of placement and subsequent welding, and improves the production quality of circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 The figure is a flow chart of a chip placement machine control method based on machine vision;

[0031] Figure 2 This is a structural diagram of a placement machine control system based on machine vision. DETAILED DESCRIPTION

[0032] In order to make the purpose, features, and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0033] The present invention provides a chip placement machine control method based on machine vision, which is used to solve the problem in the prior art that the pressure control of the chip placement machine is difficult to meet the characteristics of solder paste.

[0034] See also Figure 1 , Figure 1 This is a first flow chart of a method for controlling a chip placement machine based on machine vision provided by an embodiment of the present invention.

[0035] S100, sending a patch light pressure signal, and upon receiving a pressure feedback signal, acquiring a first solder paste contour area image and first solder paste area data based on a machine vision system; after sending a patch pressure signal, acquiring a second solder paste contour image and second solder paste area data;

[0036] It should be noted that before the chip mounter performs the chip mounting operation, a solder paste printing step will be performed first, in which the solder paste is brush-printed on the pads. Then, in the chip mounting step, the mounting components are attached to the PCB board, and each pin is aligned with the corresponding pad. The chip mounter in this embodiment adopts a staged mounting method for high-density solder joint components. After sending a chip light pressure signal, the nozzle component of the chip mounter will absorb the mounting component and press it down at the attachment position with a preset light pressure. The light pressure is generally about 0.5N and can be set according to the actual mounting component type or solder paste type. In the staged mounting, the light pressure step is used to initially position the mounting component on the pad and temporarily fix the component by using the viscosity of the solder paste.

[0037] After sending a light pressure signal and receiving a pressure feedback signal, it indicates that the component is being pressed against the solder paste with light pressure at this moment. A pressure sensor can be set to detect the reaction force exerted on the placement head. When the component is pressed down, the solder paste is pressed and extends to the periphery of the pad, increasing the coverage area and decreasing the height. At this time, a CMOS camera of the machine vision system can be used to capture an image of the change in solder paste pressure to obtain a first solder paste contour area image. The image processing part of the machine vision can identify the contour area of ​​the solder paste in the image, and obtain the area or number of pixels of the area to obtain the first solder paste area data. After the light pressure stage of the staged placement, pressure placement is performed. Here, the pressure is a preset target placement pressure, which is generally 0.5-5N. During the pressure placement, machine vision is used to capture an image of the change in solder paste pressure to obtain a second solder paste contour area image. The contour area of ​​the solder paste is identified through machine vision image processing, and the area or number of pixels of the area is obtained to obtain the second solder paste area data. As the pressure on the second solder paste area contour increases, the extent of extension around the solder paste increases, and the contour area area also increases.

[0038] S200, obtaining light pressing pressure and first pressing pressure data, and constructing a relationship model between placement pressure and solder paste area change based on the first solder paste area data and the second solder paste area data;

[0039] It should be noted that the light pressure corresponds to the mounting pressure when the patch is lightly pressed, and the first pressurized pressure corresponds to the mounting pressure when the patch is pressurized. There is a certain relationship between the mounting pressure and the area of ​​the solder paste. The greater the mounting pressure, the greater the amount of solder paste extruded, and the larger the area of ​​the solder paste. The corresponding paste flow dynamics function model can be set according to the type of solder paste. For example, solder paste is a typical non-Newtonian fluid. The Herschel-Bulkley model can be used to describe the rheological behavior of the non-Newtonian fluid. The mounting pressure is replaced by the shear stress. The first solder paste area data corresponding to the light pressure and the second solder paste area data corresponding to the first pressurized pressure are used to correct the paste flow dynamics function model, and a relationship model between the mounting pressure and the solder paste area change is constructed.

[0040] S300, substituting the preset solder paste area requirements of each soldering point into the relationship model between placement pressure and solder paste area variation, obtaining a second pressurizing pressure for each soldering point, and performing pressure control on the placement head corresponding to the soldering point.

[0041] It should be noted that the relationship model between the placement pressure and the solder paste area change constructed in the above steps can reflect the degree of pressure, diffusion and extension of the solder paste under different placement pressures in the current solder paste state. It is difficult to observe the solder paste diffusion at the millimeter level with the naked eye, and there are a large number of pads on the PCB board, making it easier to make mistakes when identifying with the naked eye. The preset solder paste area requirements at each solder point are substituted into the relationship model to obtain the corresponding placement pressure. The solder paste coverage pad area is usually required to be 75%-90%. The corresponding solder paste area requirements can be set according to the pad size at each solder point, and then the second pressurization pressure required for the solder point is obtained in the relationship model, and the second pressurization pressure data is sent to the placement head corresponding to the solder point for pressure control.

[0042] In this embodiment, machine vision is used to obtain solder paste area images in stages during the staged placement of the placement machine to obtain corresponding solder paste area data, and a placement pressure and solder paste area change relationship model is constructed based on the pressure data and solder paste area data of each stage. The relationship model reflects the current solder paste fluid characteristics; the preset solder paste area requirements of each welding point are substituted into the placement pressure and solder paste area change relationship model to obtain the second pressurized pressure of each welding point, and the placement head corresponding to the welding point is pressure-controlled. The placement pressure can be accurately controlled during the placement of components by the placement machine, so that the pressure adapts to the changes in solder paste in the process, thereby improving the efficiency of placement and subsequent welding, and improving the production quality of circuit boards.

[0043] The above is a detailed description of the first embodiment of a chip placement machine control method based on machine vision provided by the present application. The following is a detailed description of the second embodiment of a chip placement machine control method based on machine vision provided by the present application.

[0044] In this embodiment, a method for controlling a placement machine based on machine vision is further provided. In the aforementioned step S100, the first solder paste area data is extracted as follows:

[0045] Obtaining the amount of solder paste printed on the soldering point, and calculating the area of ​​the solder paste unpressed region at a preset ratio based on the solder paste printed amount; identifying the area of ​​a first solder paste region in the first solder paste contour region image, and subtracting the area of ​​the unpressed region from the area of ​​the first solder paste region to obtain a first solder paste extrusion area;

[0046] The acquiring of the second solder paste area data specifically comprises: identifying the area of ​​the second solder paste area in the second solder paste contour area image, and subtracting the area of ​​the first solder paste area from the area of ​​the second solder paste area to obtain the second solder paste extrusion area;

[0047] It should be noted that, according to the different welding requirements corresponding to the welding points, the pads and the amount of solder paste printed are also different, so the area of ​​the solder paste when not under patch pressure is also different. The larger the amount of solder paste printed, the larger the area of ​​the corresponding solder paste unpressed area. During the printing process, the solder paste is usually spherical on the pad. The spherical particles of the solder paste help it to be evenly distributed and pass through the template smoothly during the printing process, ensuring that the solder paste can be evenly printed on the PCB pad. According to the solder paste printing amount, which corresponds to the volume of the sphere, the area of ​​the solder paste unpressed area is calculated according to the ratio between the volume of the sphere and the cross-sectional area; the area of ​​the first solder paste contour area is subtracted from the area of ​​the unpressed area to obtain the solder paste extrusion area, which corresponds to the solder paste extrusion amount under light pressure. In the pressurized placement stage, it can be regarded as placing the solder paste again with pressurized pressure on the solder paste after being lightly pressed. Therefore, it is necessary to subtract the area of ​​the first solder paste area from the area of ​​the second solder paste area to obtain the solder paste extrusion amount under pressurized pressure, and obtain the second solder paste area data;

[0048] The size of the pad is generally in the millimeter level, and the area occupied by the solder paste printed on the pad should be more than 75%. The measurement and recognition accuracy of machine vision can reach the micron level, so the changes in the solder paste distribution area can be accurately identified;

[0049] Furthermore, before the aforementioned step S100 sends the patch light pressure signal, the following steps may be further included:

[0050] Obtain the position of each soldering point of the mounted component and the control data of the mounting head, construct the control parameters of the mounting head corresponding to each soldering point, and obtain the control scheme of the mounting head corresponding to the soldering point;

[0051] In the aforementioned step S300, the pressure control of the placement head corresponding to the welding point specifically includes:

[0052] According to the second pressurization pressure range of each welding point, the pressurization pressure of each welding point that can meet the control scheme of the mounting head within the second pressurization pressure range is identified, the third pressurization pressure of each welding point is obtained, and the execution order and pressurization pressure of the control scheme of each welding point are set.

[0053] It should be noted that each solder point needs to correspond to a solder paste printing position, that is, a pad, to ensure that the solder paste melts during subsequent welding to form an independent solder point; for mounting components with multiple solder points, a modular mounting head can be used, configured with multiple independent suction nozzles or a multi-degree-of-freedom array nozzle combination, to control the pressure of the mounting components on each solder point, and perform differential downward pressure control. In components with a large number of solder points, different nozzle pressure combinations are required to dynamically control the pressure at different solder points; however, there are mounting components with high-density solder points, and the number of suction nozzles is less than the number of solder points. In this case, the nozzle of the mounting head needs to be set for multi-segment mounting control, and the pressure of multiple solder points is controlled to be pressed down at the same time each time. Therefore, the mounting head control data corresponding to the solder point can be obtained based on the position of the solder point and the mounting head control data. The control scheme is that each control scheme determines which nozzle arrays in the placement head can control the corresponding downward pressure of which welding points, forming a scheme feature in which the downward pressure of multiple welding points is consistent. However, although the downward pressure of multiple welding points in the same control scheme is consistent, the solder paste printing amount of these welding points is different and the solder paste area requirements for placement are also different. Therefore, the corresponding second pressure range can be set according to the solder paste coverage area required on the pad corresponding to each welding point, and within the second pressure range, each welding point can meet the unified downward pressure relationship of the welding points in the control scheme. Each placement head control scheme is placed and pressed in turn according to the third pressure allowed by its corresponding welding point, so that each welding point in the multi-solder point placement component can complete the placement with the optimal placement pressure.

[0054] The above is a detailed description of a chip placement machine control method based on machine vision provided in the first aspect of the present application. The following is a detailed description of an embodiment of a chip placement machine control system based on machine vision provided in the second aspect of the present application.

[0055] See also Figure 2 , Figure 2 This embodiment provides a chip placement machine control system based on machine vision, including:

[0056] The machine vision processing module 10 is configured to send a patch light pressure signal, obtain a first solder paste contour area image based on the machine vision system upon receiving the pressure feedback signal, and obtain first solder paste area data; and obtain a second solder paste contour image and second solder paste area data upon sending a patch pressure signal;

[0057] A relationship model building module 20 is used to obtain the light pressing pressure and the first pressing pressure data, and to build a relationship model between the placement pressure and the solder paste area change according to the first solder paste area data and the second solder paste area data;

[0058] The placement machine control module 30 is used to substitute the preset solder paste area requirements of each welding point into the relationship model between placement pressure and solder paste area change, obtain the second pressurizing pressure for each welding point, and perform pressure control on the placement head corresponding to the welding point.

[0059] Furthermore, the machine vision processing module 10 extracts the first solder paste area data, specifically:

[0060] Obtaining the amount of solder paste printed on the soldering point, and calculating the area of ​​the solder paste unpressed region at a preset ratio based on the solder paste printed amount; identifying the area of ​​a first solder paste region in the first solder paste contour region image, and subtracting the area of ​​the unpressed region from the area of ​​the first solder paste region to obtain a first solder paste extrusion area;

[0061] The obtaining of the second solder paste area data specifically includes: identifying the area of ​​the second solder paste area in the second solder paste contour area image, and subtracting the area of ​​the first solder paste area from the area of ​​the second solder paste area to obtain the second solder paste extrusion area.

[0062] Furthermore, the machine vision processing module 10 further includes, before sending the patch light pressure signal:

[0063] Obtain the position of each soldering point of the mounted component and the control data of the mounting head, construct the control parameters of the mounting head corresponding to each soldering point, and obtain the control scheme of the mounting head corresponding to the soldering point;

[0064] In the placement machine control module 30, pressure control is performed on the placement head corresponding to the welding point, specifically including: according to the second pressurization pressure range of each welding point, identifying the pressurization pressure of each welding point that can meet the placement head control scheme within the second pressurization pressure range, obtaining the third pressurization pressure of each welding point, and setting the execution order and pressurization pressure of the control scheme of each welding point.

[0065] The third aspect of the present application also provides a method and device for controlling a placement machine based on machine vision, comprising a processor and a memory: wherein the memory is used to store program code and transmit the program code to the processor; the processor is used to execute the above-mentioned method for controlling a placement machine based on machine vision according to the instructions in the program code.

[0066] A fourth aspect of the present application provides a computer-readable storage medium, characterized in that the computer-readable storage medium is used to store program code, and the program code is used to execute the above-mentioned machine vision-based placement machine control method.

[0067] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the above-described devices and equipment can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0068] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0069] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0070] In addition, the functional units in the various embodiments of the present invention may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or software functional units.

[0071] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, or the portion that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes various media that can store program code, such as a USB flash drive, a mobile hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0072] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features thereof can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A control method for a chip placement machine based on machine vision, characterized in that include: Sending a patch light pressure signal, and acquiring a first solder paste contour area image and first solder paste area data based on a machine vision system after receiving a pressure feedback signal; acquiring a second solder paste contour image and second solder paste area data after sending a patch pressure signal; Acquire the light pressing pressure and the first pressing pressure data, and construct a relationship model between the placement pressure and the solder paste area change based on the first solder paste area data and the second solder paste area data; The preset solder paste area requirements of each welding point are substituted into the relationship model between the mounting pressure and the solder paste area change to obtain the second pressurizing pressure of each welding point, and the mounting head corresponding to the welding point is pressure-controlled.

2. A chip placement machine control method based on machine vision according to claim 1, characterized in that, The extracting of the first solder paste area data is specifically as follows: Obtaining the amount of solder paste printed on the soldering point, and calculating the area of ​​the solder paste unpressed region at a preset ratio based on the solder paste printed amount; identifying the area of ​​a first solder paste region in the first solder paste contour region image, and subtracting the area of ​​the unpressed region from the area of ​​the first solder paste region to obtain a first solder paste extrusion area; The obtaining of the second solder paste area data specifically includes: identifying the area of ​​the second solder paste area in the second solder paste contour area image, and subtracting the area of ​​the first solder paste area from the area of ​​the second solder paste area to obtain the second solder paste extrusion area.

3. A chip placement machine control method based on machine vision according to claim 1, characterized in that, Before sending the patch light pressure signal, the method further includes: Obtain the position of each soldering point of the mounted component and the control data of the mounting head, construct the control parameters of the mounting head corresponding to each soldering point, and obtain the control scheme of the mounting head corresponding to the soldering point; The pressure control of the placement head corresponding to the welding point specifically includes: identifying the pressure of each welding point that can meet the placement head control scheme within the second pressure range according to the second pressure range of the placement of each welding point, obtaining the third pressure of each welding point, and setting the execution order and pressure of the control scheme for each welding point.

4. A chip placement machine control system based on machine vision, characterized in that: include: A machine vision processing module is configured to send a patch light pressure signal, obtain a first solder paste contour area image based on the machine vision system upon receiving the pressure feedback signal, and obtain first solder paste area data; and obtain a second solder paste contour image and second solder paste area data upon sending a patch pressure signal; A relationship model building module is used to obtain the light pressing pressure and the first pressing pressure data, and to build a relationship model between the placement pressure and the solder paste area change based on the first solder paste area data and the second solder paste area data; The placement machine control module is used to substitute the preset solder paste area requirements of each welding point into the relationship model between the placement pressure and the solder paste area change, obtain the second pressurizing pressure for each welding point, and perform pressure control on the placement head corresponding to the welding point.

5. A chip placement machine control system based on machine vision according to claim 4, characterized in that, In the machine vision processing module, the first solder paste area data is extracted, specifically: Obtaining the amount of solder paste printed on the soldering point, and calculating the area of ​​the solder paste unpressed region at a preset ratio based on the solder paste printed amount; identifying the area of ​​a first solder paste region in the first solder paste contour region image, and subtracting the area of ​​the unpressed region from the area of ​​the first solder paste region to obtain a first solder paste extrusion area; The obtaining of the second solder paste area data specifically includes: identifying the area of ​​the second solder paste area in the second solder paste contour area image, and subtracting the area of ​​the first solder paste area from the area of ​​the second solder paste area to obtain the second solder paste extrusion area.

6. A chip placement machine control system based on machine vision according to claim 4, characterized in that: The machine vision processing module further includes, before sending the patch light pressure signal: Obtain the position of each soldering point of the mounted component and the control data of the mounting head, construct the control parameters of the mounting head corresponding to each soldering point, and obtain the control scheme of the mounting head corresponding to the soldering point; In the placement machine control module, pressure control is performed on the placement head corresponding to the welding point, specifically including: according to the second pressurization pressure range of each welding point, identifying the pressurization pressure of each welding point that can meet the placement head control scheme within the second pressurization pressure range, obtaining the third pressurization pressure of each welding point, and setting the execution order and pressurization pressure of the control scheme for each welding point.

7. A chip placement machine control device based on machine vision, characterized in that: The device includes a processor and a memory: The memory is used to store program code and transmit the program code to the processor; The processor is used to execute the machine vision-based placement machine control method described in any one of claims 1 to 3 according to the instructions in the program code.

8. A computer-readable storage medium, characterized in that The computer-readable storage medium is used to store program code, and the program code is used to execute the machine vision-based placement machine control method described in any one of claims 1 to 3.

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