Flexible light crystalline silicon assembly and manufacturing method of solar cell string of flexible light crystalline silicon assembly

Abstract

The invention relates to the technical field of solar photovoltaic module preparation, in particular to a flexible light crystalline silicon module and a manufacturing method of a solar cell string thereof, and the flexible light crystalline silicon module comprises a transparent organic front plate which is used for protecting internal materials from being eroded; the first adhesive film layer is made of any one packaging material of POE, EVA, PVB, PET, TPO or EPE; the transparent glass fiber plate is used for improving the structural strength of the flexible light crystalline silicon assembly, and the solar cell string is used for photoelectric conversion; the second adhesive film layer is made of POE or EVA or PVB, PET or TPO packaging materials; the shape of the metal foil layer is the same as that of the transparent glass fiber plate; the third adhesive film layer is made of POE or EVA or PVB, PET or TPO packaging materials; the backboard layer is made of a fluorine-containing backboard material; according to the invention, the sealing performance of the flexible light crystalline silicon assembly is improved by coating the solar cell string.

Description

Technical Field

[0001] The present invention relates to the technical field of solar photovoltaic module preparation, and in particular to a method for preparing a flexible lightweight crystalline silicon module and a solar cell string thereof. Background Art

[0002] With the advancement of photovoltaic technology, lightweight solar photovoltaic modules have attracted attention for their widespread application in scenarios such as distributed rooftop photovoltaics and building-integrated photovoltaic (BIPV). Traditional lightweight modules use solar cells connected in series by welding the positive and negative electrodes between them to form a cell string. The cell strings are then welded together in a specially designed series or parallel connection. Adhesive film layers, front panels, and back panels are then applied above and below the cell strings to form a laminated lightweight module. However, the organic adhesive films or glass fiber-based flexible backsheet materials used in lightweight modules have poor barrier properties to water vapor and oxygen, making it difficult to effectively prevent corrosion from environmental factors such as water, oxygen, and carbon dioxide. This results in insufficient long-term reliability. This is especially true when using widely used high-efficiency N-type solar cells such as TOPCon, HJT, or BC, which are extremely sensitive to water and oxygen. This poses challenges to the long-term reliability of lightweight modules produced using traditional methods. Furthermore, it is difficult to use high-efficiency N-type cells such as TOPCon, HJT, and BC, limiting further improvements in the photoelectric conversion efficiency of flexible modules.

[0003] For example, Chinese patent application publication number: CN119300474A discloses an enhanced flexible photovoltaic panel, a preparation method thereof, and a flexible lightweight photovoltaic module. The enhanced flexible photovoltaic panel includes: a moisture-proof protective layer, a composite fiber reinforced board, and an inner adhesive material layer laminated in sequence from the outside to the inside; the moisture-proof protective coating includes silicone resin, acrylic resin, silicone hydrophobic agent, filler, antioxidant, defoaming agent, leveling agent, curing agent and catalyst mixed in a mass ratio of 40-75:30:4:8:0.5:0.3:0.3:10:0.5; the molecular weight of the silicone resin is 1000-4000. The enhanced flexible photovoltaic panel optimizes the moisture-proof protective coating and, through the coordination of various layers, can effectively improve the comprehensive performance, reliability and stability of the flexible lightweight photovoltaic module, breaking the shortcomings of traditional flexible modules in bending strength, hardness, high temperature resistance and moisture resistance, and extending the service life of the flexible lightweight photovoltaic module.

[0004] However, the existing technology has the problem that the sealing performance of the flexible lightweight photovoltaic modules is poor and the sealing performance detection of the flexible lightweight photovoltaic modules is not accurate enough, resulting in insufficient long-term reliability of the modules. Summary of the Invention

[0005] To this end, the present invention provides a method for manufacturing a flexible lightweight crystalline silicon module and a solar cell string thereof, so as to overcome the problems in the prior art of poor sealing of flexible lightweight photovoltaic modules and inaccurate sealing detection of flexible lightweight photovoltaic modules, resulting in insufficient long-term reliability of the modules.

[0006] To achieve the above-mentioned object, the present invention provides a flexible lightweight crystalline silicon module, comprising:

[0007] Transparent organic front plate, made of fluorine-containing transparent material to protect internal materials from corrosion;

[0008] The first adhesive film layer is connected to the transparent organic front plate and is used to bond the upper and lower layers after lamination and melting, and is made of any one of POE, EVA, PVB, PET, TPO or EPE packaging materials;

[0009] A transparent fiberglass board connected to the first adhesive film layer, used to bond the solar cell strings and the transparent front panel during the lamination process by melting the resin and adhesive film layer in the transparent fiberglass board. The transparent fiberglass board is formed by impregnation, hot melting, in-situ polymerization, or liquid polymerization of glass fiber cloth and resin. The transparent fiberglass board has a thickness of 0.1 mm to 1 mm, and the outer edge of the transparent fiberglass board is 5 mm to 20 mm away from the inner edge of the first adhesive film layer and the underlying second adhesive film layer.

[0010] A solar cell string connected to the transparent glass fiber board for photoelectric conversion;

[0011] The second adhesive film layer is connected to the solar cell string and is used to bond the upper and lower layers after lamination and melting, and is made of any one of POE, EVA, PVB, PET, and TPO packaging materials;

[0012] a metal foil layer connected to the second adhesive film layer to prevent water vapor from corroding the solar cell, and the metal foil layer has the same shape as the transparent glass fiber board;

[0013] The third adhesive film layer is connected to the metal foil layer and is used to bond the upper and lower layers after lamination and melting, and is made of any one of POE, EVA, PVB, PET or TPO packaging materials;

[0014] A backboard layer connected to the third adhesive film layer to protect internal materials from corrosion, and made of a fluorine-containing backboard material;

[0015] The flexible lightweight crystalline silicon component is assembled with an aluminum frame or a composite material frame.

[0016] Furthermore, the transparent organic front panel is made of fluorine-containing materials, and the three layers of materials, namely the metal foil layer, the third adhesive film layer and the back panel layer, are made into a composite metal water-blocking back panel, which is laminated together with the second adhesive film layer and the solar cell string placed thereon, the first adhesive film layer and the transparent organic front panel to form a flexible and lightweight crystalline silicon component.

[0017] Furthermore, the solar cell string is an N-type cell, including an HJT, TOPCon or BC cell, and the thickness of the metal foil layer is 5 microns to 50 microns.

[0018] Furthermore, a circle of butyl tape is provided at the edge of the transparent organic front plate and the back plate layer for bonding the transparent organic front plate and the back plate, and the thickness of the butyl tape is 0.1 mm to 2 mm and the width is 5 mm to 20 mm.

[0019] Furthermore, the flexible lightweight crystalline silicon components are pressed together through a hot lamination process. After hot lamination, the flexible lightweight crystalline silicon components are transferred to a cold pressing chamber for cold pressing to maintain shape and release stress. Cooling water at 17°C to 25°C is passed through the upper and lower walls of the cold pressing chamber, and the cold pressing pressure is 1 atmosphere.

[0020] A method for manufacturing a solar cell string applied to the flexible lightweight crystalline silicon module comprises:

[0021] Lay the solar cell strings flat on the carrier board, and determine the number of solar cell strings to be placed according to the area of ​​the carrier board;

[0022] Place the substrate carrying the solar cell string into the CVD coating equipment, with a coating thickness of 30nm to 150nm;

[0023] After the solar cell string is coated, the end points of the solar cell string welding ribbon are processed by laser.

[0024] Furthermore, for TOPCon cells and HJT cells, double-sided coating is performed, and for BC cells, double-sided coating is performed or only the welding surface of the metal connection is coated.

[0025] Furthermore, after the solar cell string is coated, the end points of the solar cell string welding ribbon are processed by laser, including:

[0026] Laser irradiation removes the oxide layer, contaminants or coating on the surface of the welding strip;

[0027] Use laser to etch micron-scale grooves, rough surfaces or porous structures at the ends of the welding strips;

[0028] A layer of solder is plated on the end of the welding strip through laser induced cladding technology;

[0029] For areas prone to stress concentration after welding, the local lattice structure is adjusted by laser micro-irradiation;

[0030] Laser cutting or melting to reshape the ends of the ribbon.

[0031] Compared with the prior art, the beneficial effects of the present invention are that the coated solar cell string of the present invention can serve as a high barrier layer to protect the solar cells from the erosion of water and oxygen; the structure and thickness design have an anti-reflection and anti-transmittance effect on the light, thereby increasing the utilization rate of sunlight; the transparent glass fiber board strengthens the structural strength of the module, forms an effective mechanical protection for the battery cell, improves the impact and vibration resistance of the module, and eliminates or significantly reduces the risk of hidden cracks in the solar cell; by arranging a metal foil layer at the bottom of the module, an excellent barrier layer is formed, which further effectively prevents the erosion of environmental factors such as water vapor, oxygen and carbon dioxide, and significantly improves the long-term life of the module Reliability is superior to traditional lightweight modules that only use KPF backsheets; the use of thin transparent organic front sheets and metal foil layers significantly reduces the weight of the modules, making them more suitable for application scenarios such as distributed rooftop photovoltaics, reducing installation difficulty and cost; due to its high barrier properties, the modules are compatible with a variety of high-efficiency solar cells, such as HJT, TOPCon, BC and other N-type cells, to improve photoelectric conversion efficiency. At the same time, the use of BC cells can further enhance the aesthetics and applicability of the modules in building-integrated photovoltaics (BIPV); the same reliability as using a frame can be achieved without a frame, reducing the weight and cost of the modules.

[0032] Furthermore, the present invention forms a single smoothing parameter index by linearly superimposing the ratio of surface roughness to a preset value and the ratio of curvature uniformity to a preset value, thereby avoiding the subjective judgment bias of multi-dimensional data. When the smoothing parameter is greater than the preset value, it indicates that the laser processing quality is better than the benchmark level, and the interlayer sealing defects are more likely to appear as macro bubbles (such as unfused adhesive film). Therefore, the vacuum box bubble method is preferably used for rapid screening; when the smoothing parameter is less than or equal to the preset value, there may be microscopic defects on the surface of the welding strip (such as excessive surface roughness resulting in weak adhesion of the adhesive layer), and the pressure decay method is required to quantify the detection of tiny leaks to avoid missed detection of hidden problems; a low-cost bubble method is used for high-smoothness components to reduce the occupancy time of high-precision equipment (such as pressure decay tester); and quantitative detection is directly used for low-smoothness components to avoid multiple re-inspections caused by hidden defects due to the bubble method.

[0033] Furthermore, the present invention identifies the ends of the welding strips, the edges of the butyl rubber, the edges of the metal foil layer and other positions as "critical positions" for sealing detection, because these areas are prone to leakage due to stress concentration and process defects (such as uneven adhesive layer and welding gap); when bubbles appear in conventional positions (such as the middle of the component), they may be local minor defects. When bubbles appear in critical positions, even if the number is small, further detection (such as pressure decay method review) is required to avoid long-term reliability of the component due to leakage in critical positions (such as water ingress and oxidation); through targeted detection of critical positions, potential risks affecting the waterproofness and weather resistance of the component can be discovered in advance, reducing the probability of failures such as power attenuation and short circuit due to insufficient sealing in outdoor applications, and extending the service life of the component.

[0034] Furthermore, in the present invention, if the standard deviation of the time interval for the appearance of bubbles is less than a preset value (indicating that the time interval fluctuates little), it indicates that the generation of bubbles is regular, which usually corresponds to periodic defects in the interlayer structure (such as leaks with uniform welding strip spacing, and periodic uneven film coating thickness). For example, if the film feed speed is unstable during the lamination of photovoltaic modules, it may cause the film to not be fused every 10 cm, which manifests as a bubble every 30 seconds (the standard deviation of the time interval is less than 0.5 seconds). The periodic characteristics can be used to quickly locate process problems (such as abnormal film unwinding tension); when the probability of bubbles appearing at key positions is lower than the preset value, it indicates that the bubble distribution is "uniform" (that is, there is no significant difference between the key positions and the regular positions), but this may indicate an overall material defect (such as poor curing of a large area of ​​the film) rather than a local process problem; the pressure decay method is initiated for secondary detection of non-periodic / non-uniform bubbles, and high-precision verification is performed only on suspicious samples, thereby improving the accuracy of interlayer sealing detection of flexible lightweight crystalline silicon modules.

[0035] Furthermore, the present invention adopts multiple parameters such as pressure decay rate, maximum pressure drop, and pressure recovery time for joint judgment to avoid missing a single indicator and directly judging components with excessive parameters or obvious pressure fluctuations as unqualified without entering a complex re-inspection process; components with normal parameters and no periodic fluctuations are quickly released to adapt to the production needs of the assembly line; a graded detection system combining the vacuum box bubble method and the pressure decay method is used to enable high-precision pressure detection equipment only for high-risk components (such as rough solder strips and poor butyl adhesive adhesion), thereby reducing the equipment idle rate. Excessive parameters point to static defects (such as local unfused film and insufficient butyl adhesive coating thickness), which can be solved by optimizing the lamination temperature / time and adjusting the film cutting accuracy; periodic fluctuations point to dynamic defects (such as microcracks caused by stress fatigue at the end points of the solder strips and mismatched thermal expansion coefficients of the metal foil layer), which require improvements from material selection (such as replacing low-expansion coefficient foil) or structural design (such as adding a stress buffer layer). BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1This is a schematic structural diagram of a flexible lightweight crystalline silicon module according to an embodiment of the present invention;

[0037] Figure 2 This is a flowchart of a method for manufacturing a solar cell string of a flexible lightweight crystalline silicon module according to an embodiment of the present invention;

[0038] Figure 3 This is a flowchart for preliminarily determining a sealing detection method for a flexible lightweight crystalline silicon module according to an embodiment of the present invention;

[0039] In the figure, 1, transparent organic front panel; 2, first adhesive film layer; 3, transparent fiberglass board; 4, solar cell string; 5, second adhesive film layer; 6, butyl tape; 7, metal foil; 8, third adhesive film layer; 9, back panel layer. DETAILED DESCRIPTION

[0040] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are merely used to explain the present invention and are not intended to limit the present invention.

[0041] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0042] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0043] Furthermore, it should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0044] See also Figures 1 and 2 As shown, Figure 1 This is a schematic structural diagram of a flexible lightweight crystalline silicon module according to an embodiment of the present invention; Figure 2 This is a flowchart of a method for manufacturing a solar cell string of a flexible lightweight crystalline silicon module according to an embodiment of the present invention.

[0045] The flexible lightweight crystalline silicon module according to an embodiment of the present invention includes:

[0046] The transparent organic front plate 1 is made of a fluorine-containing transparent material to protect the internal materials from corrosion;

[0047] The first adhesive film layer 2 is connected to the transparent organic front plate and is used to bond the upper and lower layers after lamination and melting. It uses any one of POE, EVA, PVB, PET, TPO or EPE packaging materials;

[0048] A transparent fiberglass board 3, connected to the first adhesive film layer, is used to bond the solar cell strings and the transparent front panel during the lamination process by melting the resin and adhesive film layer in the transparent fiberglass board. The transparent fiberglass board is formed by impregnation, hot melting, in-situ polymerization, or liquid polymerization of glass fiber cloth and resin. The transparent fiberglass board has a thickness of 0.1 mm to 1 mm, and the outer edge of the transparent fiberglass board is 5 mm to 20 mm away from the inner edge of the first adhesive film layer and the underlying second adhesive film layer.

[0049] A solar cell string 4, connected to the transparent glass fiber board, for photoelectric conversion;

[0050] The second adhesive film layer 5 is connected to the solar cell string and is used to bond the upper and lower layers after lamination and melting. It uses any one of POE, EVA, PVB, PET, and TPO packaging materials;

[0051] A metal foil layer 7 connected to the second adhesive film layer to prevent water vapor from corroding the solar cell. The metal foil layer has the same shape as the transparent fiberglass board.

[0052] A third adhesive film layer 8, which is connected to the metal foil layer and is used to bond the upper and lower layers after lamination and melting, and is made of any packaging material such as POE, EVA, PVB, PET or TPO;

[0053] Backboard layer 9, connected to the third adhesive film layer, used to protect internal materials from corrosion, using fluorine-containing backboard material;

[0054] The flexible lightweight crystalline silicon component is assembled with an aluminum frame or a composite material frame.

[0055] In implementation, if the frame is an assembled aluminum frame, it is installed on the edge of the flexible lightweight crystalline silicon component.

[0056] The fluorine-containing transparent material in the embodiment of the present invention can be polytetrafluoroethylene, POE (polyolefin elastomer), EVA (ethylene-vinyl acetate copolymer), PVB (polyvinyl butyral), PET (polyethylene terephthalate), TPO (thermoplastic polyolefin) and EPE (foamed polyethylene); the fluorine-containing backboard material can be PVDF (polyvinylidene fluoride).

[0057] The layers of the flexible lightweight crystalline silicon module in the embodiment of the present invention are pressed together through a hot lamination process, including stacking the transparent organic front panel, the first adhesive film layer, the transparent fiberglass board, the solar cell string, the second adhesive film layer, the metal foil layer, the third adhesive film layer, and the back panel layer in sequence according to the design order; the stacked components are placed in a hot laminator and laminated at a high temperature (120°C to 170°C) and an atmospheric pressure; during the lamination process, the adhesive film (POE, EVA, PVB, PET or TPO) and the resin on the transparent fiberglass board dissolve and flow, filling the gaps between the layers, and finally pressing the layers tightly together to form an integral structure; through the hot lamination process, good bonding and sealing can be achieved between the layers of the component, further improving the reliability and durability of the component.

[0058] Specifically, the transparent organic front panel is made of fluorine-containing materials, and the three layers of materials, namely the metal foil layer, the third film layer and the back panel layer, are preferentially made into a composite metal water-blocking back panel. The composite metal water-blocking back panel is laminated together with the second film layer and the solar cell string placed thereon, the first film layer and the transparent organic front panel to form a flexible and lightweight crystalline silicon module.

[0059] Specifically, the solar cell string is an N-type cell, including an HJT, TOPCon or BC cell, and the thickness of the metal foil layer is 5 microns to 50 microns.

[0060] Specifically, a circle of butyl tape 6 is provided at the edge of the transparent organic front plate and the back plate layer for bonding the transparent organic front plate and the back plate. The thickness of the butyl tape is 0.1 mm to 2 mm, and the width is 5 mm to 20 mm.

[0061] Specifically, the flexible lightweight crystalline silicon modules are pressed together through a hot lamination process. After hot lamination, the flexible lightweight crystalline silicon modules are transferred to a cold pressing chamber for cold pressing to maintain shape and release stress. Cooling water at 17°C to 25°C is passed through the upper and lower walls of the cold pressing chamber, and the cold pressing pressure is 1 atmosphere.

[0062] See also Figure 3 As shown, Figure 3 This is a workflow diagram for preliminarily determining a sealing detection method in a flexible lightweight crystalline silicon module according to an embodiment of the present invention.

[0063] Specifically, a method for manufacturing a solar cell string applied to the flexible lightweight crystalline silicon module includes:

[0064] Step S1, laying out the solar cell strings on a carrier, and determining the number of solar cell strings to be placed according to the area of ​​the carrier;

[0065] Step S2, placing the carrier board carrying the solar cell string into a CVD coating device, with the coating thickness ranging from 30nm to 150nm;

[0066] Step S3: After the solar cell string is coated, the end points of the solar cell string welding ribbons are processed by laser.

[0067] In an embodiment of the present invention, determining the number of solar cell strings to be placed based on the area of ​​the carrier board includes measuring the length and width of the carrier board to calculate the area of ​​the carrier board, measuring the length and width of a single solar cell string to calculate the area of ​​the single cell string, and calculating the number of cell strings that can theoretically be placed based on the area of ​​the carrier board and the area of ​​the single cell string.

[0068] Furthermore, for TOPCon cells and HJT cells, double-sided coating is required, while for BC cells, double-sided coating can be selected or coating can be performed only on the welding surface of the metal connection.

[0069] Furthermore, after the solar cell string is coated, the end points of the solar cell string welding ribbon are processed by laser, including:

[0070] Laser irradiation removes the oxide layer, contaminants or coating on the surface of the welding strip;

[0071] Use laser to etch micron-scale grooves, rough surfaces or porous structures at the ends of the welding strips;

[0072] A layer of solder is plated on the end of the welding strip through laser induced cladding technology;

[0073] For areas prone to stress concentration after welding, the local lattice structure is adjusted by laser micro-irradiation;

[0074] Laser cutting or melting to reshape the ends of the ribbon.

[0075] In the embodiment of the present invention, the laser processing of the end points of the solar cell string welding ribbon includes selecting a high-precision laser processing equipment, such as a fiber laser or an excimer laser, with a power range of 100W to 500W, a wavelength of 1064nm, a pulse width of 10ns to 100ns, and a repetition frequency of 1kHz to 100kHz; equipping with a high-precision three-dimensional motion control system that can accurately control the position and movement path of the laser beam at the end point of the welding ribbon; installing a smoke exhaust system and a protective cover to ensure the safety of the operator and the cleanliness of the working environment; the solar cell treated by the coating The coating thickness of the solar cell string is 30nm to 150nm; the soldering ribbon used to connect the solar cells is made of copper or silver and may have an oxide layer or contaminants on the surface; laser irradiation is used to remove the oxide layer, contaminants or coating on the surface of the soldering ribbon: adjust the parameters of the laser equipment, set the power to 200W, the pulse width to 20ns, and the repetition frequency to 50kHz; fix the solar cell string on the workbench so that the end point of the soldering ribbon is at the focus of the laser beam; turn on the laser equipment and scan the surface of the soldering ribbon end point at a speed of 1mm / s to 5mm / s to remove the oxide layer, contaminants or coating on the surface. The scanning path is spiral or reciprocating straight line to ensure full coverage of the end surface of the weld ribbon; check the removal effect, if there is any residue, increase the number of scans or adjust the laser parameters appropriately; adjust the parameters of the laser equipment, set the power to 150W, the pulse width to 30ns, and the repetition frequency to 30kHz; plan the laser etching path according to the design requirements, for example, when etching micron-level grooves, the path is straight, and the groove spacing is 10 microns to 50 microns; when etching rough surfaces, the path is random dot matrix; when etching porous structures, the path is circular or square dot matrix, and the pore size is 1 micron to 10 microns; turn on the laser equipment and etch according to the planned path. The etching depth is 1 micron to 10 microns, which can be adjusted by controlling the number and energy of laser pulses; use a microscope or scanning electron microscope to observe the etching effect to ensure that the grooves, rough surfaces or porous structures meet the design requirements; prepare solder, such as tin-based solder or silver-based solder, and make it into powder or filament for easy laser cladding; adjust the parameters of the laser equipment, set the power to 300W, the pulse width to 50ns, and the repetition frequency to 20kHz; place the solder near the end point of the weld ribbon, turn on the laser equipment, and allow the laser beam to irradiate the solder, melt it and evenly cover the surface of the weld ribbon end point. The cladding thickness is 10 microns to 50 microns, which can be adjusted by controlling the laser scanning speed and the amount of solder supplied. Use a microscope to check the uniformity and thickness of the cladding layer. If there is unevenness or insufficient thickness, re-cladding can be performed. Use a microscope or stress detection equipment to determine the areas prone to stress concentration after welding. Adjust the parameters of the laser equipment, set the power to 100W, the pulse width to 10ns, and the repetition frequency to 10kHz. Focus the laser beam on the stress concentration area and perform micro-irradiation treatment with low-energy, high-frequency pulses.The irradiation time is 10 to 60 seconds and can be adjusted based on actual stress conditions. Use stress detection equipment to monitor the stress distribution after treatment to ensure effective stress relief. Plan the laser cutting or melting and reshaping path according to design requirements. For example, when cutting excess ribbon, the path should be linear; when reshaping the ribbon endpoint, the path should be circular or square. Adjust the laser equipment parameters to set the power to 250W, the pulse width to 40ns, and the repetition rate to 40kHz. Turn on the laser equipment and cut or melt and reshape according to the planned path. The cutting accuracy is ±0.1mm, and the reshaped ribbon endpoint shape should meet the design requirements. Use a microscope to inspect the cutting or reshaping results, and any non-compliance can be corrected.

[0076] The coated solar cell string of the present invention can serve as a high-barrier layer to protect the solar cells from corrosion by water and oxygen. Its structure and thickness design provide anti-reflection and anti-transmittance effects on light, thereby increasing the utilization rate of sunlight. The transparent fiberglass board strengthens the structural strength of the module, providing effective mechanical protection for the solar cells, improving the module's impact and vibration resistance, and eliminating or significantly reducing the risk of hidden cracks in the solar cells. A metal foil layer is provided at the bottom of the module, forming an excellent barrier layer that further effectively prevents corrosion from environmental factors such as water vapor, oxygen, and carbon dioxide, significantly improving the long-term reliability of the module and comprehensively outperforming traditional lightweight modules using only KPF backsheets. The use of a thin transparent organic front sheet and metal foil layer significantly reduces the weight of the module, making it more suitable for applications such as distributed rooftop photovoltaics and reducing installation difficulty and cost. Due to its high barrier properties, the module is compatible with a variety of high-efficiency solar cells, such as HJT, TOPCon, and BC N-type cells, improving photoelectric conversion efficiency. The use of BC cells further enhances the module's aesthetics and applicability in building-integrated photovoltaic (BIPV) applications. The module can achieve the same reliability as a frame-free module, reducing the weight and cost of the module.

[0077] Specifically, the interlayer sealing of the flexible lightweight crystalline silicon module is tested, and a sealing testing method for the flexible lightweight crystalline silicon module is preliminarily determined based on the smoothing parameters of the end points of the welding strips of the flexible lightweight crystalline silicon module and the bonding parameters of the butyl tape;

[0078] When the smoothing parameter of the end point of the welding ribbon of the flexible lightweight crystalline silicon module is greater than the preset smoothing parameter and the bonding parameter of the butyl tape is greater than the preset bonding parameter, it is preliminarily determined that the interlayer sealing of the flexible lightweight crystalline silicon module is tested by the vacuum box bubble method;

[0079] When the smoothing parameter of the end point of the welding strip of the flexible lightweight crystalline silicon component is less than or equal to the preset smoothing parameter or the bonding parameter of the butyl tape is less than or equal to the preset bonding parameter, it is determined to detect the interlayer sealing of the flexible lightweight crystalline silicon component by the pressure decay method.

[0080] In the embodiment of the present invention, the smoothing parameter of the end point of the welding ribbon of the flexible lightweight crystalline silicon component is the sum of the ratio of the surface roughness to the preset surface roughness and the ratio of the curvature uniformity to the preset curvature uniformity. The preset surface roughness is the average surface roughness of the welding ribbon end points of several flexible lightweight crystalline silicon components with known qualified sealing properties. The preferred value of the preset surface roughness is set to 0.3 microns. The preset curvature uniformity is the average curvature uniformity of the welding ribbon end points of several flexible lightweight crystalline silicon components with known qualified sealing properties. The preferred value of the preset curvature uniformity is set to 0.0015 microns. The preset smoothing parameter is set to 1.5. Based on the test data of the welding ribbon end points of 100 groups of qualified components (surface roughness average 0.3 microns ± 0.05 microns, curvature uniformity 0.0015mm -1 ±0.0002mm -1 ) statistical results, when the smoothing parameter is greater than 1.5, the probability of no bubble generation in the component during the 85℃ / 85%RH aging test is greater than 95%; however, the above value is not limited to this, and those skilled in the art can also adjust the value according to actual needs.

[0081] The surface roughness described in the embodiment of the present invention can be measured by profilometry or optical interferometry. For example, the end point of the laser-treated solder strip is selected to ensure that the measurement area is 3 mm extending outward from the connection between the solder strip and the battery cell (i.e., the key position); a roughness measuring instrument (such as a stylus profilometer) is used to directly scan the surface to obtain a profile curve; or an optical microscope (such as a confocal microscope) is used to capture a surface image, and software (such as ImageJ) is used to analyze the pixel height difference and calculate the roughness; the roughness values ​​of multiple measurement points (such as 5 points in the horizontal and vertical directions along the end point of the solder strip) are averaged as the surface roughness of the component. Actual measured value of roughness; curvature uniformity can be determined by the ratio of the standard deviation of the curvature values ​​of each measuring point at the end point of the weld ribbon to the average value of the curvature values ​​of each measuring point at the end point of the weld ribbon. For example, a non-contact optical measuring instrument (such as a laser profilometer or a 3D scanner) is used to obtain the three-dimensional profile data of the end point of the weld ribbon; the profile data is fitted (such as polynomial fitting or spline curve fitting) to calculate the curvature radius R of each point, and the curvature value is 1 / R; the average value (μ) and standard deviation (σ) of the curvature values ​​of all measuring points are calculated; the curvature uniformity is the ratio of the standard deviation to the average value, which reflects the degree of discreteness of the curvature distribution; the smaller the ratio, the better the curvature uniformity.

[0082] It is understandable that when the surface roughness of the weld ribbon end point is high, there may be burrs, sharp edges or unevenness, which can easily puncture the film layer during the lamination process, forming microscopic gaps or bubbles, leading to the infiltration of water vapor and oxygen, and poor sealing. High curvature uniformity means that the shape of the weld ribbon end point is irregular (such as locally too sharp or too blunt). During lamination, the film is difficult to evenly wrap the weld ribbon after melting, and stress concentration is easily formed at the curvature mutation point, causing the sealing layer to crack. The absolute value (surface roughness, curvature uniformity) is converted into a ratio with the "preset qualified mean" to eliminate unit differences and facilitate horizontal comparison.

[0083] The bonding parameters of the butyl tape described in the embodiment of the present invention are the sum of the ratio of the butyl tape thickness to the preset thickness and the ratio of the butyl tape width to the preset width. The preset thickness is the average thickness of the butyl tapes of several flexible lightweight crystalline silicon modules with known qualified sealing properties. The preferred value of the preset thickness is set to 1 mm. The preset width is the average width of the butyl tapes of several flexible lightweight crystalline silicon modules with known qualified sealing properties. The preferred value of the preset width is set to 10 mm. The preset bonding parameter is set to 1.4. Based on the statistical results of the test data of the welding tape endpoints of 100 groups of qualified modules, when the bonding parameter is greater than 1.4, the probability of no bubbles being generated in the module during the 85°C / 85%RH aging test is greater than 95%, but the above values ​​are not limited to this. Those skilled in the art can also adjust the values ​​according to actual needs.

[0084] It is understandable that when the thickness of the butyl tape is low, the adhesive layer is too thin and can be easily torn apart by external stress (such as bending of the component), or the sealing may fail due to the short water vapor penetration path; when the width of the butyl tape is small, the bonding area between the tape and the edge of the component is small, and the edge may warp and detach after lamination, forming a water vapor intrusion channel; the thickness and width are both geometric size parameters, and the sum of the ratios with the "preset qualified mean" can comprehensively reflect the coverage adequacy and structural strength of the butyl tape.

[0085] The present invention forms a single smoothing parameter index by linearly superimposing the ratio of surface roughness to a preset value and the ratio of curvature uniformity to a preset value, thereby avoiding the subjective judgment bias of multi-dimensional data. When the smoothing parameter is greater than the preset value, it indicates that the laser processing quality is better than the benchmark level, and the interlayer sealing defects are more likely to appear as macro bubbles (such as unfused adhesive film). Therefore, the vacuum box bubble method is preferably used for rapid screening; when the smoothing parameter is less than or equal to the preset value, there may be micro defects on the surface of the welding strip (such as excessive surface roughness resulting in weak adhesion of the adhesive layer), and the pressure decay method is required to quantify the detection of tiny leaks to avoid missed detection of hidden problems; a low-cost bubble method is used for high-smoothness components to reduce the occupancy time of high-precision equipment (such as pressure decay tester); and quantitative detection is directly used for low-smoothness components to avoid multiple re-inspections caused by the bubble method due to hidden defects.

[0086] Specifically, when it is preliminarily determined that the vacuum box bubble method is used to detect the interlayer sealing of the flexible lightweight crystalline silicon module, the interlayer sealing characteristics of the flexible lightweight crystalline silicon module are determined based on the number of bubbles generated during the detection process and / or whether the location where the bubbles appear is a critical location;

[0087] When the number of bubbles generated during the test is greater than a preset number, it is determined that the interlayer sealing of the flexible lightweight crystalline silicon module is unqualified;

[0088] When the number of bubbles generated during the test is less than or equal to the preset number and the bubble locations are normal, it is determined that the interlayer sealing of the flexible lightweight crystalline silicon module is qualified;

[0089] When the number of bubbles generated during the detection process is less than or equal to a preset number and the location where the bubbles appear is a critical location, it is determined to further judge the interlayer sealing characteristics of the flexible lightweight crystalline silicon component.

[0090] It is understandable that bubbles appearing in critical locations, even in small numbers, may indicate high-risk defects. For example, bubbles at the ends of solder ribbons may expose the solder joints of the cell, causing oxidation or short circuits. Bubbles at the edges of butyl tapes may cause the edge of the module to lose its sealing barrier, leading to water vapor intrusion into internal materials (such as battery strings and transparent fiberglass boards). Bubbles appearing in conventional locations (such as the middle of the module) are usually caused by local minor defects (such as impurities in the film), have little impact on the overall sealing, and can be judged as qualified.

[0091] In the embodiment of the present invention, the preset number can be randomly selected from a number of flexible lightweight crystalline silicon components with known qualified sealing properties, and multiple samples are tested by the vacuum box bubble method. The number of bubbles generated by each sample during the test process is recorded and the average value is calculated as the preset number. The preferred value of the preset number is set to 8, but the above value is not limited to this. Those skilled in the art can also adjust the value according to actual needs.

[0092] The key positions (including but not limited to the corners or connection points of the components) described in the embodiment of the present invention include but are not limited to the end area of ​​the solder tape and the edge area of ​​the butyl tape; the key position detection adopts an optical detection system with a resolution of not less than 0.1mm to ensure that the bubble positioning error is less than 0.5mm, and the end area of ​​the solder tape includes a range extending 3mm outward from the connection between the solder tape and the battery cell; the edge area of ​​the butyl tape includes a strip area of ​​2mm on both the inside and outside of the tape.

[0093] It is understandable that there is welding stress at the connection between the solder ribbon and the battery cell. If the surface roughness or curvature uniformity exceeds the standard (i.e., the smoothing parameters are insufficient), it is easy for the adhesive film to fail to completely fill the gap after melting, forming bubbles or gaps. The range extending 3mm outward is the main working area of ​​the welding process and the key interface for interlayer bonding. Defects here will directly affect the electrical connection sealing of the battery string; butyl tape is the core material for sealing the edge of the module. When its thickness or width is insufficient (i.e., the bonding parameters are insufficient), the edge is prone to cracking due to external force or environmental stress (such as thermal expansion and contraction); the 2mm area inside and outside the tape is the contact interface between the tape, the film, and the frame. If the bonding is not strong, water vapor can easily penetrate into the interior of the module from here; the metal foil layer (such as aluminum foil) is used to block water vapor. If its edge is not tightly bonded to the film, it is easy to form a "water vapor penetration channel", especially when the module is bent or subjected to stress, the edge is prone to warping, resulting in sealing failure.

[0094] The present invention identifies the ends of the welding strips, the edges of the butyl rubber, the edges of the metal foil layer and other positions as "critical positions" for sealing detection, because these areas are prone to leakage due to stress concentration and process defects (such as uneven adhesive layer and welding gap); when bubbles appear in conventional positions (such as the middle of the component), they may be local minor defects. When bubbles appear in critical positions, even if the number is small, further detection (such as pressure decay method review) is required to avoid long-term reliability degradation of the component (such as water ingress and oxidation) due to leakage in critical positions; through targeted detection of key positions, potential risks affecting the waterproofness and weather resistance of the component can be discovered in advance, reducing the probability of power attenuation, short circuit and other failures due to insufficient sealing in outdoor applications, and extending the service life of the component.

[0095] Specifically, when further determining the interlayer sealing characteristics of the flexible lightweight crystalline silicon component, the interlayer sealing characteristics of the flexible lightweight crystalline silicon component are determined according to the appearance time characteristics of the bubbles and / or the appearance position characteristics of the bubbles during the detection process;

[0096] When the bubble appearance time characteristic during the detection process is a periodic characteristic or the bubble appearance position characteristic is a uniform characteristic, it is determined that the interlayer sealing of the flexible lightweight crystalline silicon module is unqualified;

[0097] When the appearance time characteristics of the bubbles during the detection process are non-periodic or the appearance position characteristics of the bubbles are non-uniform, it is determined to use the pressure decay method to perform a secondary detection of the interlayer sealing of the flexible lightweight crystalline silicon component.

[0098] In an embodiment of the present invention, determining whether the appearance time characteristic is a periodic characteristic includes recording the time points of several bubble appearances, calculating the time intervals between adjacent bubbles, and calculating the standard deviation of the time intervals. When the standard deviation is less than a preset standard deviation, the appearance time characteristic is determined to be a periodic characteristic. The preset standard deviation can be determined by the following method: randomly selecting multiple samples from several flexible lightweight crystalline silicon components with known qualified sealing properties for vacuum box bubble method testing; recording the time points of bubbles generated by each sample during the testing process; for each sample, calculating the time intervals between adjacent bubbles; for each sample, calculating the standard deviation of the time intervals; calculating the average value of the standard deviations of the time intervals of all samples is the preset standard deviation, but the above values ​​are not limited to this, and those skilled in the art can also adjust the value according to actual needs.

[0099] In an embodiment of the present invention, determining whether the bubble appearance position characteristic is a uniformity characteristic includes recording the position type (critical position or regular position) of several bubble appearances, calculating the probability that the position of the bubble appearance is a critical position, and determining that the bubble appearance position characteristic is a uniformity characteristic under the condition that the probability that the position of the bubble appearance is a critical position is less than a preset probability. The value of the preset probability can be determined by the following method: randomly selecting multiple samples from several flexible lightweight crystalline silicon components with known qualified sealing properties for vacuum box bubble method detection; recording the position type (critical position or regular position) of the bubbles generated by each sample during the detection process; for each sample, counting the number of times the bubble appearance position is a critical position and the total number of bubbles, for example, assuming that the total number of bubbles in a sample is 100 times, of which the number of bubbles in the critical position is 10 times; for each sample, calculating the probability that the bubble appearance position is a critical position, and calculating the average value of the probability that the bubble appearance position of all samples is a critical position is the preset probability, but the above value is not limited to this, and those skilled in the art can also adjust the value according to actual needs.

[0100] It is understandable that if the standard deviation of the time interval between the appearance of bubbles is less than the preset value (i.e., the time intervals tend to be consistent), it indicates that the generation of bubbles has a periodic pattern, which is usually related to the regular distribution of structural defects inside the component. For example, the curvature uniformity of the end points of the solder strips is insufficient, resulting in the stress concentration points being distributed at equal intervals; the thickness / width of the butyl tape is uneven, resulting in the periodic appearance of weak points in the adhesive layer; periodic defects often stem from insufficient process stability (such as equipment precision problems or material consistency defects). Such defects will cause the sealing of components to continue to deteriorate during long-term use, and even lead to the risk of batch failure; therefore, directly judging them as unqualified can avoid potential large-scale quality problems; if the standard deviation of the time interval between the appearance of bubbles is large (non-periodic), it indicates that the defects are randomly distributed (such as bubbles in the local adhesive layer, tiny gaps in the welding points); such defects may be occasional process fluctuations. The risk level of non-periodic bubbles is lower than that of systematic defects, so they need to be tested again in combination with the pressure decay method to determine whether the defect poses a substantial threat by quantifying the leakage rate (such as the pressure drop per unit time) to avoid misjudging qualified components. Key locations such as the end area of ​​the solder ribbon and the edge of the butyl tape are stress concentration areas and process weaknesses (such as burrs are prone to occur during welding, and gaps are easily formed at the edge of the tape due to uneven extrusion). If bubbles appear frequently in these locations, even if the number is small, it may indicate that the surface roughness of the solder ribbon end exceeds the standard, resulting in microscopic gaps in the sealing interface, or the bonding parameters of the butyl tape are insufficient to effectively fill the interface gap. Leakage at key locations will directly lead to the intrusion of moisture / corrosive gases, accelerate the oxidation of the battery cell or the circuit short circuit, and seriously affect the life of the component.

[0101] In the present invention, if the standard deviation of the time interval for the appearance of bubbles is less than a preset value (indicating that the time interval fluctuates little), it indicates that the generation of bubbles is regular, which usually corresponds to periodic defects in the interlayer structure (such as leaks with uniform welding strip spacing, and periodic uneven film coating thickness). For example, if the film feed speed is unstable during the lamination of photovoltaic modules, it may cause the film to not be fused every 10 cm, which manifests as a bubble every 30 seconds (the standard deviation of the time interval is less than 0.5 seconds). The periodic characteristics can be used to quickly locate process problems (such as abnormal film unwinding tension); when the probability of bubbles appearing at key positions is lower than the preset value, it indicates that the bubble distribution is "uniform" (that is, there is no significant difference between the key positions and the regular positions), but this may indicate an overall material defect (such as poor curing of a large area of ​​the film) rather than a local process problem; the pressure decay method is initiated for secondary detection of non-periodic / non-uniform bubbles, and high-precision verification is performed only on suspicious samples, thereby improving the accuracy of interlayer sealing detection of flexible lightweight crystalline silicon modules.

[0102] Specifically, when determining to detect the interlayer sealing performance of a flexible lightweight crystalline silicon module using the pressure decay method, the interlayer sealing performance of the flexible lightweight crystalline silicon module is determined based on whether a single sealing characteristic parameter exceeds the standard and / or whether periodic fluctuations in pressure occur during the detection process;

[0103] When a single sealing characteristic parameter exceeds the standard or the pressure fluctuates periodically during the test, it is determined that the interlayer sealing of the flexible lightweight crystalline silicon module is unqualified;

[0104] When a single sealing characteristic parameter does not exceed the standard and the pressure does not fluctuate periodically during the test, it is determined that the interlayer sealing of the flexible lightweight crystalline silicon module is qualified.

[0105] The single sealing characteristic parameter in the embodiment of the present invention includes but is not limited to "pressure decay rate, maximum pressure drop and pressure recovery time". Judging whether a single sealing characteristic parameter exceeds the standard includes that the single sealing characteristic parameter exceeds the corresponding preset threshold. The method for determining the preset threshold is the same as the method for determining the preset standard deviation and the preset probability, and will not be repeated here.

[0106] In an embodiment of the present invention, determining whether periodic fluctuations in pressure occur during the detection process includes recording data on changes in pressure over time during the pressure decay method detection process. A high-precision pressure sensor and data acquisition system can be used to record pressure values ​​at certain time intervals (such as once per second); calculating the time intervals between adjacent pressure data points to determine the frequency of pressure changes, calculating the standard deviation of the pressure change time intervals, and determining that the pressure changes are periodic under the condition that the standard deviation of the pressure change time intervals is less than the standard deviation of the preset time intervals. The method for determining the preset time interval standard deviation is the same as the method for determining the preset standard deviation and the preset probability, and will not be repeated here.

[0107] In an embodiment of the present invention, for components that fail the pressure decay method inspection, the defect location is automatically marked and fed back to the lamination process control system to adjust the corresponding process parameters. For example, if a single sealing characteristic parameter exceeds the standard (such as the pressure decay rate is too high), the film (POE / EVA, etc.) is not completely melted, resulting in weak adhesion between layers; if the current temperature is lower than the film melting peak (such as EVA about 140°C, POE about 150°C), the lamination temperature is increased by 5 to 10°C; if the temperature has reached the standard but the pressure decay rate is still high, it may be due to insufficient temperature uniformity, and the temperature difference of the laminator heating plate needs to be calibrated (controlled within ±2°C).

[0108] The present invention adopts the joint judgment of multiple parameters such as pressure decay rate, maximum pressure drop, and pressure recovery time to avoid the direct judgment of unqualified components with parameters exceeding the standard or obvious pressure fluctuations due to the omission of a single indicator, without entering a complex re-inspection process; components with normal parameters and no periodic fluctuations are quickly released to adapt to the production needs of the assembly line; a graded detection system combining the vacuum box bubble method and the pressure decay method is used to enable high-precision pressure detection equipment only for high-risk components (such as rough solder strips and poor butyl adhesive adhesion), thereby reducing the equipment idle rate. Parameters exceeding the standard point to static defects (such as local unfused film and insufficient butyl adhesive coating thickness), which can be solved by optimizing the lamination temperature / time and adjusting the film cutting accuracy; periodic fluctuations point to dynamic defects (such as microcracks caused by stress fatigue at the end points of the solder strip and mismatched thermal expansion coefficients of the metal foil layer), which need to be improved from the material selection (such as replacing low expansion coefficient foil) or structural design (such as adding a stress buffer layer).

[0109] The vacuum box bubble method and the pressure decay method described in the embodiments of the present invention are both existing technologies. For example, the vacuum box bubble method includes placing the component in a vacuum box and generating a pressure difference between the inside and outside of the component by vacuuming. If there are sealing defects between the layers of the component, such as tiny pores or unfused areas, gas will escape from these defects and form bubbles on the surface of the component. The sealing of the component is judged by observing the generation of bubbles, such as the number, position, and size of bubbles. For example, the flexible lightweight crystalline silicon component to be tested is placed on a test platform in the vacuum box, ensuring that the surface of the component is flat and in good contact with the platform, and the vacuum box door is closed and sealed. The vacuum pump is started and the pressure in the vacuum box is gradually reduced at a preset rate. The pressure is usually reduced to a certain value (such as about 10 kPa) and maintained for a period of time (such as 10 to 30 minutes) so that the pressure difference between the inside and outside of the component reaches a level sufficient to allow the gas to escape. During the vacuuming process and the pressure maintenance process, whether bubbles are generated on the surface of the component is observed through an observation window or using optical detection equipment, and the location, number, size, and other information of the bubbles are recorded. The sealing of the component is judged based on the observed bubbles. If there are a large number of bubbles and they are widely distributed, it means that the sealing of the component is poor and there may be many interlayer defects. If there are fewer bubbles and they are concentrated in certain specific locations, such as the end points of the welding ribbon and the edges of the butyl tape, the sealing conditions of these locations need to be further analyzed. If no bubbles are generated or the bubbles are very few and tiny, it can be preliminarily judged that the sealing of the component is good. The pressure decay method mentioned above involves filling the interior of the component or the sealed cavity with gas at a certain pressure, then turning off the gas source, and judging the sealing of the component by measuring the change in pressure over time. If there is a leak in the component, gas will escape from the leak point, causing the pressure in the cavity to gradually decrease. The sealing performance of the component can be evaluated based on parameters such as the pressure decay rate, maximum pressure drop, and pressure recovery time. Sealing and filling: Place the flexible lightweight crystalline silicon component in a sealed test cavity, isolate the component from the outside world through a sealing device, and then fill the test cavity or the interior of the component with gas at a certain pressure, such as dry nitrogen or air. The pressure value is usually determined according to the design requirements and test standards of the component. After the gas is filled to the set pressure, the gas source is turned off and the pressure change is monitored.Use a high-precision pressure sensor to record the pressure value in real time, and transmit the data to the data acquisition system for storage and analysis; calculate parameters such as the pressure decay rate, maximum pressure drop, and pressure recovery time based on the pressure decay curve; the pressure decay rate reflects the rate at which the pressure drops over time. The larger the decay rate, the more serious the leak; the maximum pressure drop indicates the maximum pressure drop within a certain period of time, which can be used to assess the severity of the leak; the pressure recovery time refers to the time required for the pressure to recover to a certain proportion (such as 90%) after inflation is stopped. This parameter can reflect the stability and sealing of the internal structure of the component; the calculated parameters are compared with the preset threshold to determine whether the sealing of the component is qualified. If parameters such as the pressure decay rate and maximum pressure drop exceed the preset threshold, or the pressure recovery time does not meet the requirements, the sealing of the component is judged to be unqualified; conversely, if all parameters are within the qualified range, the sealing of the component is judged to be qualified.

[0110] Thus far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art may make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will fall within the scope of protection of the present invention.

Claims

1. A flexible lightweight crystalline silicon component, characterized in that: include: Transparent organic front plate, made of fluorine-containing transparent material to protect internal materials from corrosion; The first adhesive film layer is connected to the transparent organic front plate and is used to bond the upper and lower layers after lamination and melting, and is made of any one of POE, EVA, PVB, PET, TPO or EPE packaging materials; A transparent fiberglass board connected to the first adhesive film layer, used to bond the solar cell strings and the transparent front panel during the lamination process by melting the resin and adhesive film layer in the transparent fiberglass board. The transparent fiberglass board is formed by impregnation, hot melting, in-situ polymerization, or liquid polymerization of glass fiber cloth and resin. The transparent fiberglass board has a thickness of 0.1 mm to 1 mm, and the outer edge of the transparent fiberglass board is 5 mm to 20 mm away from the inner edge of the first adhesive film layer and the underlying second adhesive film layer. A solar cell string connected to the transparent glass fiber board for photoelectric conversion; The second adhesive film layer is connected to the solar cell string and is used to bond the upper and lower layers after lamination and melting, and is made of any one of POE, EVA, PVB, PET, and TPO packaging materials; a metal foil layer connected to the second adhesive film layer to prevent water vapor from corroding the solar cell, and the metal foil layer has the same shape as the transparent glass fiber board; The third adhesive film layer is connected to the metal foil layer and is used to bond the upper and lower layers after lamination and melting, and is made of any one of POE, EVA, PVB, PET or TPO packaging materials; A backboard layer connected to the third adhesive film layer to protect internal materials from corrosion, and made of a fluorine-containing backboard material; The flexible lightweight crystalline silicon component is assembled with an aluminum frame or a composite material frame.

2. The flexible lightweight crystalline silicon component according to claim 1, characterized in that: The transparent organic front panel is made of fluorine-containing material, and the three layers of materials, namely the metal foil layer, the third adhesive film layer and the back panel layer, are made into a composite metal water-blocking back panel. The composite metal water-blocking back panel is laminated together with the second adhesive film layer and the solar cell string placed thereon, the first adhesive film layer and the transparent organic front panel to form a flexible and lightweight crystalline silicon module.

3. The flexible lightweight crystalline silicon component according to claim 2, characterized in that: The solar cell string is an N-type cell, including an HJT, TOPCon or BC cell, and the thickness of the metal foil layer is 5 microns to 50 microns.

4. The flexible lightweight crystalline silicon component according to claim 3, characterized in that: A circle of butyl tape is provided at the edge of the transparent organic front plate and the back plate layer for bonding the transparent organic front plate and the back plate. The thickness of the butyl tape is 0.1 mm to 2 mm and the width is 5 mm to 20 mm.

5. The flexible lightweight crystalline silicon component according to claim 4, characterized in that: Flexible lightweight crystalline silicon modules are pressed together through a hot lamination process. After hot lamination, the flexible lightweight crystalline silicon modules are transferred to a cold pressing chamber for cold pressing to maintain shape and release stress. Cooling water at 17°C to 25°C is passed through the upper and lower walls of the cold pressing chamber, and the cold pressing pressure is 1 atmosphere.

6. A method for manufacturing a solar cell string for a flexible lightweight crystalline silicon module according to any one of claims 1 to 5, characterized in that: include: Lay the solar cell strings flat on the carrier board, and determine the number of solar cell strings to be placed according to the area of ​​the carrier board; Place the substrate carrying the solar cell string into the CVD coating equipment, with a coating thickness of 30nm to 150nm; After the solar cell string is coated, the end points of the solar cell string welding ribbon are processed by laser.

7. The method for manufacturing a solar cell string of a flexible lightweight crystalline silicon module according to claim 6, characterized in that: For TOPCon cells and HJT cells, double-sided coating is performed. For BC cells, double-sided coating is performed or only the welding surface of the metal connection is coated.

8. The method for manufacturing a solar cell string of a flexible lightweight crystalline silicon module according to claim 7, characterized in that: After the solar cell string is coated, the end points of the solar cell string are processed by laser, including: Laser irradiation removes the oxide layer, contaminants or coating on the surface of the welding strip; Use laser to etch micron-scale grooves, rough surfaces or porous structures at the ends of the welding strips; A layer of solder is plated on the end of the welding strip through laser induced cladding technology; For areas prone to stress concentration after welding, the local lattice structure is adjusted by laser micro-irradiation; Laser cutting or melting to reshape the ends of the ribbon.

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