Power device testing device and method and driving circuit

Abstract

The invention discloses a power device testing device, a power device testing method and a driving circuit, relates to the field of power device testing, and can be applied to power device testing. The test device comprises a boost power supply circuit and a push-pull circuit, the boost power supply circuit comprises a first power supply, a second power supply and a boost capacitor, and the boost power supply circuit is used for charging the boost capacitor through the first power supply and the second power supply until the voltage at two ends of the boost capacitor is greater than the output voltage of the first power supply; and the push-pull circuit is used for outputting a first driving current to drive the power device to be switched from the off state to the on state. According to the scheme of the invention, the voltage of the driving capacitor is boosted through the boost power supply circuit, and the driving voltage of the power device in the switching-on transient process is improved, so that the driving capability of the testing device in the switching-on process of the driving power device is improved, the bias capability of the testing device is enhanced, and the testing efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of circuits, and more particularly, to a power device testing apparatus, method, and driving circuit. Background Art

[0002] Power devices, also known as power electronic devices, are power-type semiconductor devices capable of handling high voltages and large currents. They are primarily used in the power conversion and control circuits of power equipment. To assess the capabilities of power device wafers, modules undergo rigorous testing of the on-state current rise rate (di / dt on) during automated factory testing. Directly driving power devices through driver chips is currently the most commonly used drive method, but its driving capability is limited by factors such as the driver chip, drive voltage, and drive resistance, making it unable to meet the requirements of power device pull-down testing. Furthermore, due to the different structure of automated test equipment and the single-board structure of the entire machine, the di / dt on pull-down capability of automated test equipment is limited.

[0003] Therefore, how to improve the driving capability of power device testing equipment is an urgent problem to be solved. Summary of the Invention

[0004] The present application provides a test device, method and driving circuit for power device testing, which increases the voltage of the driving capacitor through a boost power supply circuit, thereby increasing the driving voltage of the power device during the transient process of turning on the power device, thereby improving the driving capability of the test device in the process of driving the power device to turn on, enhancing the bias pulling capability of the test device, and improving the efficiency of the test.

[0005] In the first aspect, the present application provides a test device for testing power devices, which includes a boost power supply circuit and a push-pull circuit. The boost power supply circuit includes a first power supply, a second power supply and a boost capacitor. The boost power supply circuit is used to first charge the boost capacitor through the first power supply and the second power supply until the voltage across the boost capacitor is greater than the output voltage of the first power supply; and then power the push-pull circuit through the boost capacitor. The push-pull circuit is used to output a first drive current to drive the power device to switch from an off state to an on state.

[0006] It should be understood that the output voltage of the first power supply is the driving voltage range when the power device is operating normally. The driving voltage range can be understood as the voltage safe operating area of ​​the power device, which is the range of voltage conditions under which the power device can operate normally without self-damage or performance degradation. The output voltage of the first power supply can be greater than or equal to the turn-on voltage of the power device, which can also be called the turn-on voltage, threshold voltage, gate-source voltage, etc. When the input voltage of the power device exceeds the turn-on voltage, the surface inversion layers of the drain and source regions form a connected channel, causing the power device to switch from the off state to the on state. The output voltage of the first power supply can be less than the maximum voltage that the power device can withstand.

[0007] By using a boost capacitor to first receive the charge of the first power supply and the second power supply, the voltage across the boost capacitor rises to a level greater than the output voltage of the first power supply. The boost capacitor then outputs current to the power device through a push-pull circuit, driving the power device with a voltage higher than the normal operating voltage, thereby testing the bias pulling capability of the power device.

[0008] According to the solution of the present application, the driving voltage of the power device during the transient process of turning on can be increased, the driving capability of the test device can be improved, the bias pulling capability of the test device can be enhanced, and the test efficiency can be improved.

[0009] In combination with the first aspect, in certain implementations of the first aspect, during the process of the boost capacitor supplying power to the push-pull circuit, in response to the voltage across the boost capacitor dropping to less than or equal to the output voltage of the first power supply, the boost power supply circuit is used to supply power to the push-pull circuit through the first power supply so that the push-pull circuit outputs a second drive current to drive the power device.

[0010] When the boost capacitor supplies power to the push-pull circuit, as the voltage of the power device increases, the voltage across the boost capacitor decreases. When the voltage across the boost capacitor drops to less than or equal to the output voltage of the first power supply, the first power supply can directly output current to the push-pull circuit to drive the power device at a normal operating voltage.

[0011] According to the solution of the present application, after the driving transient process ends, the first power supply provides a stable driving voltage, which can ensure the normal working state of the power device and improve the test efficiency.

[0012] In combination with the first aspect, in certain implementations of the first aspect, the second power supply is a capacitor, and the boost power supply circuit is used to first charge the second power supply through the first power supply until the voltage of the second power supply is equal to the output voltage of the first power supply, and then charge the boost capacitor to a test voltage through the first power supply and the second power supply connected in series, and the test voltage is equal to twice the output voltage of the first power supply.

[0013] The second power supply can be another power supply isolated from the first power supply, or a capacitor. When the second power supply is a capacitor, it can be charged by the first power supply, so that the voltage across the capacitor equals the output voltage of the first power supply. The first and second power supplies are then connected in series to charge the boost capacitor. At this point, the voltage across the boost capacitor equals the sum of the output voltage of the first power supply and the voltage across the capacitor, which is twice the output voltage of the first power supply.

[0014] According to the solution of the present application, only one power supply is needed to boost the voltage and perform bias testing on the power device. The control is flexible and can be adjusted according to the test conditions, thereby improving the flexibility of the test.

[0015] In combination with the first aspect, in certain implementations of the first aspect, the testing device includes a control circuit, the boost power supply circuit is used to receive a control signal from the control circuit, and the boost power supply circuit is used to charge the boost capacitor according to the control signal or to supply power to the push-pull circuit through the boost capacitor.

[0016] The control circuit can generate a pulse width modulation (PWM) control signal using a control algorithm according to the set test parameters. The PWM signal will be amplified and isolated by the boost power supply circuit and the push-pull circuit to control the output current and drive the power device.

[0017] In combination with the first aspect, in certain implementations of the first aspect, the boost power supply circuit includes a driver chip IC, the driver IC includes an upper path and a lower path, and the driver IC is used to receive a control signal and control the conduction or shutoff of the upper path and the conduction or shutoff of the lower path according to the control signal.

[0018] It should be understood that the driver IC can be an existing driver chip. The driver chip integrates circuit functions and control logic, and can control and manage inputs and outputs. It can provide different interfaces and protocols to adapt to different types of equipment and application requirements. The driver IC is used to control and drive power devices, receive instructions and signals from the control circuit or other input sources, and provide the required power and signals so that the controlled power devices operate in a predetermined manner. The driver IC includes an upper path and a lower path, and the upper path and the lower path can be controlled to be turned on or off by devices such as switching tubes. The high level and low level in the PWM signal can correspond to the conduction of the two paths respectively, so that the driver IC can control the conduction of the upper path or the conduction of the lower path according to the high level or low level in the control signal.

[0019] In combination with the first aspect, in certain implementations of the first aspect, the driver IC includes an input terminal, an output terminal, and a ground terminal, the input terminal and the output terminal are used to be connected through an upper path, the output terminal and the ground terminal are used to be connected through a lower path, the positive pole of the first power supply is used to be connected to one end of the boost capacitor, and the negative pole of the first power supply is used to be connected to the output terminal; the positive pole of the second power supply is used to be connected to the input terminal, and the negative pole of the second power supply is used to be connected to the ground terminal and the other end of the boost capacitor.

[0020] The second power supply can be an additional power supply and is connected in series with the first power supply through the upper path, so that the first and second power supplies can charge the boost capacitor together. In this case, the voltage of the first drive current output by the boost capacitor to the push-pull circuit is equal to the sum of the voltages of the first and second power supplies.

[0021] In combination with the first aspect, in certain implementations of the first aspect, the driver IC includes an input terminal, an output terminal, and a ground terminal, the input terminal and the output terminal are used to be connected through an upper path, the output terminal and the ground terminal are used to be connected through a lower path, the positive pole of the first power supply is used to be connected to the input terminal and one end of the boost capacitor, and the negative pole of the first power supply is used to be connected to the output terminal; one end of the second power supply is used to be connected to the input terminal and one end of the boost capacitor, and the other end of the second power supply is used to be connected to the ground terminal and the other end of the boost capacitor.

[0022] In combination with the first aspect, in certain implementations of the first aspect, the driver IC includes an input terminal, an output terminal, and a ground terminal, the input terminal and the output terminal are used to be connected through an upper path, the output terminal and the ground terminal are used to be connected through a lower path, the positive pole of the first power supply is used to be connected to the input terminal and one end of the boost capacitor, and the negative pole of the first power supply is used to be connected to the ground terminal and the other end of the boost capacitor; one end of the second power supply is used to be connected to the input terminal and one end of the boost capacitor, and the other end of the second power supply is used to be connected to the output terminal.

[0023] The second power source can be a capacitor connected in series with the first power source via a lower path. This allows the first power source to first charge the second power source, which is then connected in series with the second power source to charge the boost capacitor. In this case, the boost capacitor outputs the first drive current to the push-pull circuit at a voltage equal to twice the voltage of the first power source.

[0024] According to the solution of the present application, a variety of connection test solutions are provided, and different drive boost solutions can be selected according to different test requirements, thereby improving the flexibility of the test.

[0025] In combination with the first aspect, in some implementations of the first aspect, the first power supply and the second power supply are connected via a resistor or a diode, and the resistor or the diode is used to control the direction of current between the first power supply and the second power supply.

[0026] A resistor or a diode is provided between the first power supply and the second power supply, so that the direction of the current can be controlled when the first power supply and the second power supply are connected in series to charge the boost capacitor.

[0027] In second aspect, the present application provides a control method for a power device testing device, the testing device including a control circuit, a boost power supply circuit and a push-pull circuit, the boost power supply circuit including a first power supply, a second power supply and a boost capacitor, the method including receiving a control signal from the control circuit; controlling the first power supply and the second power supply to jointly charge the boost capacitor according to the control signal until the voltage across the boost capacitor is greater than the output voltage of the first power supply; controlling the boost capacitor to power the push-pull circuit according to the control signal so that the push-pull circuit outputs a first drive current to drive the power device from an off state to an on state; controlling the first power supply to power the push-pull circuit according to the control signal so that the push-pull circuit outputs a second drive current to drive the power device.

[0028] In combination with the second aspect, in certain implementations of the second aspect, the second power supply is a capacitor, and the method includes controlling the first power supply according to a control signal to charge the second power supply until the voltage of the second power supply is equal to the output voltage of the first power supply, and then controlling the first power supply and the second power supply to be connected in series according to the control signal to charge the boost capacitor to a test voltage, and the test voltage is equal to twice the output voltage of the first power supply.

[0029] In combination with the second aspect, in certain implementations of the second aspect, the boost power supply circuit includes a driver chip IC, the driver IC includes an upper path and a lower path, and the method includes controlling the upper path to be turned on and the lower path to be turned off in response to the control signal being a high level; and controlling the upper path to be turned off and the lower path to be turned on in response to the control signal being a low level.

[0030] In a third aspect, the present application provides a driving circuit for driving a power device, the driving circuit including a boost power supply circuit and a push-pull circuit, the boost power supply circuit including a boost capacitor, the boost power supply circuit being used to first charge the boost capacitor to a voltage greater than a preset voltage, and then power the push-pull circuit through the boost capacitor, the push-pull circuit being used to output a first driving current to drive the power device from an off state to an on state; in response to the boost capacitor charging dropping to less than a first preset voltage during the process of the push-pull circuit outputting the first driving current, a second driving current is output to the push-pull circuit to drive the power device to maintain an on state; wherein, the voltage of the first driving current is greater than the voltage of the second driving current and the voltage of the second driving current is less than or equal to the preset voltage.

[0031] In combination with the third aspect, in certain implementations of the third aspect, the boost power supply circuit includes a driver IC, a first power supply and a second power supply, the driver IC includes an upper path, a lower path, an input end, an output end and a ground end, the input end and the output end are used to be connected through the upper path, the output end and the ground end are used to be connected through the lower path, the positive pole of the first power supply is used to be connected to one end of the boost capacitor, and the negative pole of the first power supply is used to be connected to the output end; the positive pole of the second power supply is used to be connected to the input end, and the negative pole of the second power supply is used to be connected to the ground end and the other end of the boost capacitor, the boost power supply circuit is used to first charge the boost capacitor to a voltage greater than a preset voltage through the first power supply and the second power supply in series, and then power the push-pull circuit through the boost capacitor, the push-pull circuit is used to output a first drive current to drive the power device to switch from an off state to an on state; in response to the boost capacitor charging dropping to less than the first preset voltage during the process of the push-pull circuit outputting the first drive current, the push-pull circuit is powered by the first power supply so that the push-pull circuit outputs a second drive current to drive the power device to remain in the on state.

[0032] In combination with the third aspect, in certain implementations of the third aspect, the boost power supply circuit includes a driver IC, a first power supply and a second capacitor, the driver IC includes an upper path, a lower path, an input end, an output end and a ground end, the input end and the output end are used to be connected through the upper path, the output end and the ground end are used to be connected through the lower path, the first power supply and the second power supply are connected through a resistor or a diode, the resistor or diode is used to control the current direction between the first power supply and the second power supply, the positive pole of the first power supply is used to be connected to the input end and one end of the boost capacitor, and the negative pole of the first power supply is used to be connected to the output end; one end of the second capacitor is used to be connected to the input end and one end of the boost capacitor, and the other end of the second capacitor is used to be connected to the ground end and the other end of the boost capacitor; or, the negative pole of the first power supply is used to be connected to the ground end and the other end of the boost capacitor; one end of the second capacitor is used to be connected to the input end and one end of the boost capacitor, and the other end of the second capacitor is used to be connected to the output end; the boost power supply circuit is used to first charge the second capacitor through the first power supply, and then charge the boost capacitor to a voltage greater than a preset voltage through the first power supply and the second capacitor in series.

[0033] It should be understood that in some implementations, the second capacitor can be understood as the second power supply described in the first aspect and the second aspect.

[0034] In a fourth aspect, the present application provides a driving circuit for driving a power device, which includes a boost circuit and a push-pull circuit. The boost circuit is used to first charge the boost capacitor in the boost circuit to a test voltage, and the test voltage is greater than the driving voltage corresponding to the power device; and then output a first driving current to the push-pull circuit through the boost capacitor to drive the power device, and the voltage of the first driving current is the test voltage.

[0035] In combination with the fourth aspect, in some implementations of the fourth aspect, the driving circuit includes a power supply circuit, which is used to output a driving current for driving the power device, and the voltage of the driving current is equal to the driving voltage corresponding to the power device.

[0036] In combination with the fourth aspect, in certain implementations of the fourth aspect, the power supply circuit includes at least two power supplies, at least two power supplies are isolated from each other, one of the power supplies is used to output a driving current, and the remaining power supplies are used to output an additional current, the additional current is used to charge the boost capacitor, and the test voltage is equal to the sum of the voltage of the driving current and the voltage of the additional current.

[0037] In combination with the fourth aspect, in certain implementations of the fourth aspect, the boost circuit includes an additional power supply, which is used to be connected in series with the power supply circuit and together charge the boost capacitor to a test voltage, and the test voltage is equal to the sum of the voltage of the power supply circuit and the voltage of the additional power supply.

[0038] In combination with the fourth aspect, in certain implementations of the fourth aspect, the boost circuit includes an energy storage capacitor, and the boost capacitor in the boost circuit is first charged to a test voltage, including a boost circuit used to first receive a driving current to charge the energy storage capacitor; and then the power supply circuit and the energy storage capacitor are connected in series to charge the boost capacitor to a test voltage, and the test voltage is equal to twice the driving voltage.

[0039] In combination with the fourth aspect, in certain implementations of the fourth aspect, the voltage of the first driving current output by the boost capacitor to the push-pull circuit gradually decreases. In response to the voltage of the boost capacitor decreasing to be equal to the driving voltage, the power supply circuit is used to output the driving current to the push-pull circuit to drive the power device.

[0040] Specifically, the beneficial effects of other aspects can refer to the beneficial effects described in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 This is a connection diagram of the driver chip driving the power device;

[0042] Figure 2 This is a connection diagram of the driver chip and push-pull circuit driving the power device together;

[0043] Figure 3 This is a connection diagram of active gate drive power devices;

[0044] Figure 4 Schematic diagram of a test device for power device testing provided in an embodiment of the present application;

[0045] Figure 5 This is a schematic diagram of the current direction of the driving process provided by the embodiment of the present application;

[0046] Figure 6 This is a schematic diagram of the current magnitude during the driving process provided by an embodiment of the present application;

[0047] Figure 7 This is a possible circuit diagram of a test device provided in an embodiment of the present application;

[0048] Figure 8 This is a schematic diagram of the current direction of a test device provided in an embodiment of the present application;

[0049] Figure 9 is a circuit diagram of another possible testing device provided in an embodiment of the present application;

[0050] Figure 10 This is a schematic diagram of the current direction of another test device provided in an embodiment of the present application;

[0051] Figure 11 is a circuit diagram of another possible testing device provided in an embodiment of the present application;

[0052] Figure 12 This is another current direction schematic diagram of a testing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0053] The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present invention, but are not intended to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments.

[0054] Power devices are electronic components capable of processing and controlling electrical energy. They are capable of handling high voltages and high currents and are primarily used in power conversion and control circuits in power equipment. Power devices are typically used in high-power circuits and can withstand large currents and voltages. They play a vital role in various electronic devices and systems. Power devices can be categorized based on their operating principles and material properties. Common power devices include diodes, transistors, metal oxide semiconductor field effect transistors (MOSFETs), and insulated gate bipolar transistors (IGBTs).

[0055] Wafers are the fundamental raw material for semiconductor device manufacturing. Extremely high-purity semiconductors are produced through processes like crystal pulling and slicing to form wafers. These wafers undergo a series of semiconductor manufacturing processes to form extremely small circuit structures, which are widely used in various electronic devices. The quality and performance of wafers directly impact the performance of power devices.

[0056] To test the capabilities of power device wafers, power modules undergo rigorous turn-on current rise rate (di / dt on) testing during factory automated testing. The turn-on current rise rate is the rate of change of current over time during the short period of time a power device experiences when it is turned on. When a power device is turned on, the region near the gate first enters the conducting state (latch-up), followed by diffusion to other locations in the active region. This process takes time. If the current rise rate is too large, excessive current can flow into the gate before the device is fully turned on, generating localized high heat at the gate and potentially damaging the device. Therefore, power devices require bias testing. Bias testing can determine the performance of power devices under different bias conditions. During bias testing, the operating voltage or current of a power device is intentionally deviated from its rated value to observe its ability to withstand abnormal conditions such as overvoltage and overcurrent. Abnormal conditions such as overvoltage and overcurrent can cause device damage or safety issues, and bias testing verifies the safety performance of power devices. Bias testing can help assess the reliability of power devices under abnormal operating conditions, thereby understanding their long-term stability. Through bias testing, we can understand the performance of power devices under different conditions and optimize the design. For bias testing, we can build a test circuit and set test parameters such as input voltage and current to test the power device. Optionally, we can use an automated test machine to test the power device.

[0057] Due to the difference in structure between the automated test equipment and the complete single board, the automated test equipment's di / dt on deviation pulling capability is limited. Therefore, it is necessary to improve the driving capability of the test equipment to further enhance the di / dt on deviation pulling capability.

[0058] The power device can be driven directly by the driver chip IC, which is also the most commonly used driving method. Figure 1 As shown, its circuit structure is simple and easy to design, but its driving capability is limited by factors such as the driving chip, driving voltage and driving resistance, and cannot meet the requirements of power device pull-off testing.

[0059] In one possible implementation, Figure 2As shown, adding a push-pull circuit after the driver IC effectively increases the circuit's maximum drive capability. A push-pull circuit is an output circuit consisting of two transistors of opposite polarity connected together. In a push-pull circuit, two bipolar junction transistors (BJTs) or MOSFETs with identical parameters are typically used in a push-pull configuration. These two transistors each amplify the positive and negative half-cycles of the waveform, resulting in low conduction losses and high efficiency. A push-pull circuit can both sink and drain current from the load. Push-pull circuits have different basic circuit structures. Common ones are N-type (upper N, lower P) or P-type (upper P, lower N) circuits. The appropriate push-pull circuit structure can be selected based on specific needs. Using a driver IC and a push-pull circuit improves current supply capability and rapidly charges the gate input capacitance. This increases turn-on time but reduces turn-off time, enabling rapid turn-on and avoiding high-frequency oscillation on the rising edge.

[0060] It should be understood that the maximum driving capability of the push-pull circuit is still limited by factors such as driving voltage and driving resistance.

[0061] In another possible implementation, Figure 3 As shown in (a), (b) and (c) in the figure, an active gate drive circuit can be used to adjust the drive voltage, drive resistance or drive current in real time during the driving process, thereby significantly improving the driving capability.

[0062] It should be understood that such a circuit is too complex, requires a large number of components, and is costly to design and use.

[0063] In summary, solutions using direct driver ICs or those using a driver IC and a push-pull circuit lack sufficient driving capability to meet the requirements of bias testing. Active gate drive circuits are also too complex and difficult to design, making efficient design and use impossible.

[0064] Based on the above problems, the present application provides a test device for power device testing, which increases the voltage of the boost capacitor through a boost power supply circuit, thereby increasing the driving voltage of the power device during the transient process of turning on the power device. This can improve the driving capability of the test device, enhance the bias pulling capability of the test device, and improve the efficiency of the test.

[0065] like Figure 4 As shown, the present application provides a test device for testing a power device. The test device includes a boost power supply circuit and a push-pull circuit.

[0066] The structure of the push-pull circuit is as follows Figure 2As shown in Figure 2. A push-pull circuit typically uses two bipolar junction transistors or MOSFETs with identical parameters. These transistors each amplify the waveform in the positive and negative half-cycles, resulting in low conduction losses and high efficiency. A push-pull circuit can both sink and drain current into the load. This improves current supply capability and rapidly charges the gate input capacitance, increasing turn-on time but reducing turn-off time. This allows the switch to turn on quickly, avoiding high-frequency oscillation on the rising edge.

[0067] The boost power supply circuit can include a boost circuit and a power supply circuit. The power supply circuit can provide one or more isolated power supplies. The isolated power supply eliminates ground loops between isolated circuits, cutting off the propagation paths of interference signals such as common-mode and surge signals. This effectively reduces the impact of ground potential differences and wire-coupled interference, improving common-mode interference suppression and anti-interference capabilities. The isolated power supply circuit can be powered by a separate isolated DC / DC converter or directly from an auxiliary power supply. The boost circuit is used to increase the voltage.

[0068] The boost power supply circuit includes a first power supply V CC , a second power supply and a boost capacitor C1.

[0069] The power supply circuit and the boost circuit in the figure of this application can be set separately and connected through other devices, such as other capacitors. CC This is a schematic diagram of the power supply from the power supply circuit. It is used to facilitate the indication of the direction of the current and is understood not to be an actual battery device.

[0070] The boost power supply circuit is used to first charge the boost capacitor through the first power supply and the second power supply until the voltage across the boost capacitor is greater than the output voltage of the first power supply; then power the push-pull circuit through the boost capacitor, and the push-pull circuit is used to output a first drive current to drive the power device to switch from the off state to the on state.

[0071] It should be understood that the output voltage of the first power supply is the driving voltage range when the power device is operating normally. The driving voltage range can be understood as the voltage safe operating area of ​​the power device, which is the range of voltage conditions under which the power device can operate normally without self-damage or performance degradation. The output voltage of the first power supply can be greater than or equal to the turn-on voltage of the power device, which can also be called the turn-on voltage, threshold voltage, gate-source voltage, etc. When the input voltage of the power device exceeds the turn-on voltage, the surface inversion layers of the drain and source regions form a connected channel, causing the power device to switch from the off state to the on state. The output voltage of the first power supply can be less than the maximum voltage that the power device can withstand.

[0072] By boosting the output voltage of the first power supply to the boost power supply circuit and then outputting it to the power device, the performance of the power device under voltage bias conditions can be tested. The test voltage is intentionally deviated from its rated value to test the bias pull capability of the power device. This bias pull test can understand the performance of the power device under different voltage conditions and optimize the design. The output voltage of the first power supply and the boost amplitude of the boost power supply circuit can be set as needed.

[0073] In one possible implementation, when the boost capacitor is supplying power to the push-pull circuit, the boost power supply circuit is used to power the push-pull circuit through the first power supply in response to the voltage across the boost capacitor dropping to less than or equal to the output voltage of the first power supply so that the push-pull circuit outputs a second drive current to drive the power device.

[0074] In one possible implementation, the second power supply is a capacitor, and the boost power supply circuit is used to first charge the second power supply through the first power supply until the voltage of the second power supply is equal to the output voltage of the first power supply, and then charge the boost capacitor to a test voltage through the first power supply and the second power supply connected in series, and the test voltage is equal to twice the output voltage of the first power supply.

[0075] like Figure 5 and Figure 6 As shown in the figure, the testing process can be roughly divided into the following steps:

[0076] like Figure 5 (a) and Figure 6 As shown, at time t1 before the power device is turned on, the boost power supply circuit boosts the voltage output by one or more isolated power supplies to a higher voltage and charges the boost capacitor C1. The voltage across the boost capacitor rises to the test voltage VCCH.

[0077] like Figure 5 (b) and Figure 6 As shown, during the time period t2-t3 during the power device's on-state, the boost capacitor in the boost power supply circuit supplies power to the push-pull circuit. The push-pull circuit is configured to output a first drive current, charging the CISS capacitor in the power device and providing charge for the power device's on-state, thereby driving the power device from the off state to the on state. The voltage across the boost capacitor gradually decreases, while the voltage across the power device increases.

[0078] like Figure 5 (c) and Figure 6 As shown in FIG. 1 , after time t3, as the gate voltage of the power device increases, the voltage across the boost capacitor C1 decreases. In response to the voltage across the boost capacitor C1 decreasing to equal to the first power supply V CC , diode D1 is turned on, the first power supply V CC The diode D1 continuously provides driving power to the power device.

[0079] In one possible implementation, the boost power supply circuit includes a driver IC, which includes an upper path and a lower path. The driver IC is used to receive a control signal and control the on / off of the upper path and the lower path according to the control signal.

[0080] The driver IC includes an input terminal VCC, an output terminal VOUT and a ground terminal GND. The input terminal VCC and the output terminal VOUT are used to be connected through an upper path, the output terminal VOUT and the ground terminal GND are used to be connected through a lower path, and the ground terminal GND is used to be grounded.

[0081] The boost power supply circuit can be implemented in many ways.

[0082] In one possible implementation, Figure 7 As shown, the first power supply V CC The positive electrode is used to connect to one end of the boost capacitor C1, the first power supply V CC The negative electrode is used to connect to the output terminal; the second power supply V EE The positive electrode is used to connect to the input terminal, the second power supply V EE The negative electrode is used to connect to the ground terminal and the other end of the boost capacitor C1.

[0083] The second power supply V EE It can be another isolated power supply from the power supply circuit or a separately set battery.

[0084] The boost power supply circuit consists of a driver IC, two isolated power supplies, the first power supply V CC and the second power supply V EE , diode D1 and capacitor C1. Figure 8 As shown in (a), at time t1 before the power device is turned on, the input control signal of the driver IC is high, and the upper path in the driver IC is turned on. CC and the second power supply V EE Form a series connection, the first power supply V CC The voltage of the second power supply V EE The voltage across the boost capacitor C1 is applied to the boost capacitor C1, and the voltage across the boost capacitor C1 reaches the test voltage VCCH, which is equal to the first power supply V CC The voltage of the second power supply V EE The sum of the voltages. Figure 8 As shown in (b), at time t3-t4, the input control signal of the driver IC is low, the lower path in the driver IC is turned on, and the first power supply V CC The normal driving voltage is provided to the driven power device through the diode D1 and the lower path in the driver IC.

[0085] In another possible implementation, Figure 9 As shown, the first power supply V CC The positive electrode is used to connect with the input terminal and one end of the boost capacitor C1, the first power supply V CC one end of the second power supply is used to be connected to the input end and one end of the boost capacitor C1, and the other end of the second power supply is used to be connected to the ground end and the other end of the boost capacitor C1.

[0086] The second power source may be a capacitor C2 or other charge storage devices.

[0087] The boost power supply circuit is powered by the first power supply V CC , a second power supply C2, a resistor R1, a diode D1 and a boost capacitor C1. Figure 10 As shown in (a), before time t1, the input control signal of the driver IC is low, the lower path in the driver IC is turned on, and the first power supply V CC The first power supply V CC The second power supply C2 is charged through the resistor R1 and the first power supply V CC and the driver IC lower path charges to the first power supply V CC The output voltage is Figure 10 As shown in (b), at time t1, the input control signal of the driver IC is high, the upper path in the driver IC is turned on, and the first power supply V CC , the second power supply C2 and the boost capacitor C1 form a series connection, the first power supply V CC The voltage of the first power supply V and the voltage of the second power supply C2 are applied to both ends of the boost capacitor C1, and the voltage across the boost capacitor C1 reaches the test voltage VCCH, which is equal to the voltage of the first power supply V CC The voltage of the second power supply V EE The sum of the voltages of the first power supply V CC Twice the output voltage. Figure 10 As shown in (c), at time t3-t4, the input control signal of the driver IC is low, the lower path in the driver IC is turned on, and the first power supply V CC The normal driving voltage is provided to the driven power device through the diode D1 and the lower path in the driver IC.

[0088] The first power supply V CC The first power supply V is connected to the second power supply C2 through a resistor R1. The resistor R1 is a resistor with a large resistance value and is used to control the first power supply V CC The current direction between the first power supply V and the second power supply C2. At time t1, due to the existence of resistor R1, the first power supply V CC It will be connected to the boost capacitor C1 through the path of diode D1.

[0089] In another possible implementation, Figure 11 As shown, the first power supply V CC The positive electrode is used to connect with the input terminal and one end of the boost capacitor C1, the first power supply V CC The negative electrode is used to be connected to the ground terminal and the other end of the boost capacitor C1; one end of the second power supply is used to be connected to the input terminal and one end of the boost capacitor C1, and the other end of the second power supply is used to be connected to the output terminal.

[0090] The second power source may be a capacitor C2 or other charge storage devices.

[0091] The boost power supply circuit is powered by the first power supply V CC , a second power supply C2, a diode D1, a diode D2 and a boost capacitor C1. Figure 12 As shown in (a), before time t1, the input control signal of the driver IC is low, the lower path in the driver IC is turned on, and the first power supply V CC The first power supply V CC The second power supply C2 is charged through the diode D2 and the first power supply V CC and the driver IC lower path charges to the first power supply V CC The output voltage is Figure 12 As shown in (b), at time t1, the input control signal of the driver IC is high, the upper path in the driver IC is turned on, and the first power supply V CC , the second power supply C2 and the boost capacitor C1 form a series connection, the first power supply V CC The voltage of the first power supply V and the voltage of the second power supply C2 are applied to both ends of the boost capacitor C1, and the voltage across the boost capacitor C1 reaches the test voltage VCCH, which is equal to the voltage of the first power supply V CC The voltage of the second power supply V EE The sum of the voltages of the first power supply V CC Twice the output voltage. Figure 12 As shown in (c), at time t3-t4, the input control signal of the driver IC is low, the lower path in the driver IC is turned on, and the first power supply V CC The normal driving voltage is provided to the driven power device through the diode D1 and the lower path in the driver IC.

[0092] The first power supply V CC The first power supply V is connected to the second power supply C2 through a diode D2. The diode D2 is used to control the first power supply V CC At t1, the diode D2 is not conducting due to the higher voltage of the second power supply C2. CCIt is connected in series with the second power supply C2 and the boost capacitor C1 through the upper path in the driver IC.

[0093] It should be understood that the driver IC shown in the figures of this application is merely illustrative and may include other components and circuits. The figures also do not show the connection between the boost capacitor and the push-pull circuit. Those skilled in the art may add other components and circuit connections between the boost capacitor and the push-pull circuit to achieve other functions and purposes, and this application does not limit this.

[0094] The test device in the above implementation can be combined with other devices to form an automated power module test system, which can be used in laboratories, factory workshops, and other places and manufactured by equipment manufacturers. Different implementation methods of the drive boost test device can be selected according to different testing requirements.

[0095] In one possible implementation, the testing device includes a control circuit, the boost power supply circuit is used to receive a control signal from the control circuit, and the boost power supply circuit is used to charge the boost capacitor or supply power to the push-pull circuit through the boost capacitor according to the control signal.

[0096] According to the solution of the present application, the voltage of the driving capacitor is increased through a boost power supply circuit, thereby increasing the driving voltage of the power device during the transient process of turning on the power device, thereby improving the driving capability of the test device in the process of driving the power device to turn on, enhancing the bias pulling capability of the test device, and improving the efficiency of the test.

[0097] The present application provides a control method for a power device testing device.

[0098] The test device is as shown above, and the method includes: receiving a control signal from a control circuit; controlling the first power supply and the second power supply to jointly charge the boost capacitor according to the control signal until the voltage across the boost capacitor is greater than the output voltage of the first power supply; controlling the boost capacitor to power the push-pull circuit according to the control signal so that the push-pull circuit outputs a first drive current to drive the power device to switch from an off state to an on state; controlling the first power supply to power the push-pull circuit according to the control signal so that the push-pull circuit outputs a second drive current to drive the power device.

[0099] For specific examples, please refer to the description of the implementation method in the previous article.

[0100] In one possible implementation, the second power supply is a capacitor, and the method includes controlling the first power supply to charge the second power supply according to a control signal until the voltage of the second power supply is equal to the output voltage of the first power supply, and then controlling the first power supply and the second power supply to be connected in series according to the control signal to charge the boost capacitor to a test voltage, and the test voltage is equal to twice the output voltage of the first power supply.

[0101] The boost power supply circuit includes a driver chip IC, which includes an upper path and a lower path. The method includes controlling the upper path to be turned on and the lower path to be turned off in response to a control signal being at a high level; and controlling the upper path to be turned off and the lower path to be turned on in response to a control signal being at a low level.

[0102] It should be understood that the upper path and the lower path are merely distinguishing descriptions and do not limit the positional relationship of the paths.

[0103] The present application provides a driving circuit for driving a power device.

[0104] The driving circuit includes the aforementioned power supply circuit, boost circuit and push-pull circuit, or the driving circuit includes the aforementioned boost power supply circuit and push-pull circuit.

[0105] The driving circuit includes a boost power supply circuit and a push-pull circuit. The boost power supply circuit includes a boost capacitor. The boost power supply circuit is used to first charge the boost capacitor to a voltage greater than a preset voltage, and then power the push-pull circuit through the boost capacitor. The push-pull circuit is used to output a first driving current to drive the power device to switch from an off state to an on state; in response to the boost capacitor charging falling to less than a first preset voltage during the process of the push-pull circuit outputting the first driving current, a second driving current is output to the push-pull circuit to drive the power device to maintain the on state; wherein the voltage of the first driving current is greater than the voltage of the second driving current and the voltage of the second driving current is less than or equal to the preset voltage.

[0106] The preset voltage may be a driving voltage when the power device is operating normally. The driving circuit may output two driving currents at different times, the two driving currents having different voltages, and at least one driving current having a voltage greater than the driving voltage when the power device is operating normally.

[0107] In one possible implementation, the boost power supply circuit includes a driver IC, a first power supply and a second power supply, the driver IC includes an input terminal, an output terminal and a ground terminal, the input terminal and the output terminal are used to be connected through an upper path, the output terminal and the ground terminal are used to be connected through a lower path, the positive electrode of the first power supply is used to be connected to one end of the boost capacitor, and the negative electrode of the first power supply is used to be connected to the output terminal; the positive electrode of the second power supply is used to be connected to the input terminal, and the negative electrode of the second power supply is used to be connected to the ground terminal and the other end of the boost capacitor, the boost power supply circuit is used to first charge the boost capacitor to a voltage greater than a preset voltage through the first power supply and the second power supply in series, and then power the push-pull circuit through the boost capacitor, the push-pull circuit is used to output a first drive current to drive the power device to switch from an off state to an on state; in response to the boost capacitor charging dropping to less than a first preset voltage during the process of the push-pull circuit outputting the first drive current, the push-pull circuit is powered by the first power supply so that the push-pull circuit outputs a second drive current to drive the power device to remain in the on state.

[0108] The specific working process and structure can be referred to in the previous article Figure 7 and Figure 8 The description is not repeated here.

[0109] In another possible implementation, the boost power supply circuit includes a driver IC, a first power supply and a second capacitor, the driver IC includes an input terminal, an output terminal and a ground terminal, the input terminal and the output terminal are used to be connected through an upper path, the output terminal and the ground terminal are used to be connected through a lower path, the first power supply and the second power supply are connected through a resistor, the positive pole of the first power supply is used to be connected to the input terminal and one end of the boost capacitor, and the negative pole of the first power supply is used to be connected to the output terminal; one end of the second capacitor is used to be connected to the input terminal and one end of the boost capacitor, and the other end of the second capacitor is used to be connected to the ground terminal and the other end of the boost capacitor; the boost power supply circuit is used to first charge the second capacitor through the first power supply, and then charge the boost capacitor to a voltage greater than a preset voltage through the first power supply and the second capacitor in series.

[0110] The specific working process and structure can be referred to in the previous article Figure 9 and Figure 10 The description is not repeated here.

[0111] In another possible implementation, the boost power supply circuit includes a driver IC, a first power supply and a second capacitor, the driver IC includes an input terminal, an output terminal and a ground terminal, the input terminal and the output terminal are used to be connected through an upper path, the output terminal and the ground terminal are used to be connected through a lower path, the first power supply and the second power supply are connected through a diode, and the negative electrode of the first power supply is used to be connected to the ground terminal and the other end of the boost capacitor; one end of the second capacitor is used to be connected to the input terminal and one end of the boost capacitor, and the other end of the second capacitor is used to be connected to the output terminal; the boost power supply circuit is used to first charge the second capacitor through the first power supply, and then charge the boost capacitor to a voltage greater than a preset voltage through the first power supply and the second capacitor in series.

[0112] The specific working process and structure can be referred to in the previous article Figure 11 and Figure 12 The description is not repeated here.

[0113] The above-mentioned drive circuit can be combined with other devices to form an automated power module test system, which can be used in laboratories, factory production workshops, and other places and manufactured by equipment manufacturers. Different implementation methods of the drive boost test device can be selected according to different testing requirements. The drive circuit can also be used in other power device driving scenarios that require the output of two drive voltages, which is not limited by this application.

[0114] In the embodiments of this application, words such as "exemplary" and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "exemplary" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of the word "exemplary" is intended to present concepts in a concrete way.

[0115] It should be understood that references to "embodiments" throughout this specification mean that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment of the present application. Therefore, various embodiments throughout this specification do not necessarily refer to the same embodiment. Furthermore, these particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0116] It should be understood that in the various embodiments of the present application, the size of the sequence number of each process does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. The names of all nodes and messages in this application are merely names set by this application for the convenience of description. The names in the actual network may be different. It should not be understood that this application limits the names of various nodes and messages. On the contrary, any name with the same or similar function as the node or message used in this application is regarded as the method or equivalent replacement of this application, and is within the scope of protection of this application.

[0117] It should also be understood that in this application, "when...", "if...", "in the case of...", and "if" all refer to the corresponding processing being performed under certain objective circumstances. They do not limit the time, nor do they require that the device must perform a judgment action when implementing it, nor do they imply the existence of other limitations. In addition, in this application, the descriptions of the above-mentioned conditions such as "when...", "if...", "in the case of...", and "if" can be understood as necessary conditions, and there is no limitation on whether the conditions are sufficient conditions or whether they are necessary and sufficient conditions. For example, "in the case of A, execute B" can be understood as "if at least A is satisfied, execute B."

[0118] In addition, in each embodiment of the present application, "B corresponding to A" means that B is associated with A and B can be determined based on A. However, it should be understood that determining B based on A does not mean determining B based solely on A, but B can also be determined based on A and / or other information.

[0119] "At least one" refers to one or more, and "multiple" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: the existence of A alone, the existence of A and B at the same time, and the existence of B alone, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, "at least one of A, B or C" includes A, B, C, AB, AC, BC or ABC, and "at least one of A, B and C" can also be understood to include A, B, C, AB, AC, BC or ABC. And, unless otherwise specified, the ordinal numbers "first" and "second" mentioned in the embodiments of the present application are used to distinguish multiple objects, and are not used to limit the order, timing, priority or importance of multiple objects.

[0120] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, optical storage, etc.) that contain computer-usable program code.

[0121] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0122] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0123] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A test device for power device testing, characterized in that: The testing device includes a boost power supply circuit and a push-pull circuit. The boost power supply circuit includes a first power supply, a second power supply, and a boost capacitor. The boost power supply circuit is used to: First, the boost capacitor is charged by the first power supply and the second power supply until the voltage across the boost capacitor is greater than the output voltage of the first power supply; The push-pull circuit is then powered by the boost capacitor, and the push-pull circuit is used to output a first driving current to drive the power device to switch from an off state to an on state.

2. The testing device according to claim 1, wherein: During the process in which the boost capacitor supplies power to the push-pull circuit, the boost power supply circuit is used to: In response to the voltage across the boost capacitor decreasing to less than or equal to the output voltage of the first power supply, the push-pull circuit is powered by the first power supply so that the push-pull circuit outputs a second driving current to drive the power device.

3. The testing device according to claim 1 or 2, characterized in that: The second power supply is a capacitor, and the boost power supply circuit is used for: First, the second power supply is charged by the first power supply until the voltage of the second power supply is equal to the output voltage of the first power supply. The boost capacitor is then charged to a test voltage by connecting the first power supply and the second power supply in series. The test voltage is equal to twice the output voltage of the first power supply.

4. The testing device according to any one of claims 1 to 3, characterized in that: The testing device includes a control circuit, the boost power supply circuit is used to receive a control signal from the control circuit, and the boost power supply circuit is used to charge the boost capacitor or supply power to the push-pull circuit through the boost capacitor according to the control signal.

5. The testing device according to claim 4, characterized in that: The boost power supply circuit includes a driver chip IC, which includes an upper path and a lower path. The driver IC is used to receive the control signal and control the on / off of the upper path and the on / off of the lower path according to the control signal.

6. The testing device according to claim 5, characterized in that: The driver IC includes an input terminal, an output terminal, and a ground terminal. The input terminal and the output terminal are connected through the upper path, and the output terminal and the ground terminal are connected through the lower path. The positive electrode of the first power supply is used to be connected to one end of the boost capacitor, and the negative electrode of the first power supply is used to be connected to the output end; The positive electrode of the second power supply is used to be connected to the input end, and the negative electrode of the second power supply is used to be connected to the ground end and the other end of the boost capacitor.

7. The testing device according to claim 5, characterized in that: The driver IC includes an input terminal, an output terminal, and a ground terminal. The input terminal and the output terminal are connected through the upper path, and the output terminal and the ground terminal are connected through the lower path. The positive electrode of the first power supply is used to be connected to the input end and one end of the boost capacitor, and the negative electrode of the first power supply is used to be connected to the output end; One end of the second power supply is used to connect to the input end and one end of the boost capacitor, and the other end of the second power supply is used to connect to the ground end and the other end of the boost capacitor.

8. The testing device according to claim 5, characterized in that: The driver IC includes an input terminal, an output terminal, and a ground terminal. The input terminal and the output terminal are connected through the upper path, and the output terminal and the ground terminal are connected through the lower path. The positive electrode of the first power supply is used to connect to the input terminal and one end of the boost capacitor, and the negative electrode of the first power supply is used to connect to the ground terminal and the other end of the boost capacitor; One end of the second power supply is used to connect to the input end and one end of the boost capacitor, and the other end of the second power supply is used to connect to the output end.

9. The testing device according to claim 7 or 8, characterized in that: The first power supply and the second power supply are connected via a resistor or a diode, and the resistor or the diode is used to control the direction of current between the first power supply and the second power supply.

10. A control method for a power device testing device, characterized in that: The testing device includes a control circuit, a boost power supply circuit, and a push-pull circuit. The boost power supply circuit includes a first power supply, a second power supply, and a boost capacitor. The method includes: receiving a control signal from a control circuit; controlling the first power supply and the second power supply to jointly charge the boost capacitor according to the control signal until the voltage across the boost capacitor is greater than the output voltage of the first power supply; controlling the boost capacitor to supply power to the push-pull circuit according to the control signal so that the push-pull circuit outputs a first driving current to drive the power device to switch from an off state to an on state; The first power supply is controlled to supply power to the push-pull circuit according to the control signal so that the push-pull circuit outputs a second driving current to drive the power device.

11. The method according to claim 10, characterized in that The second power supply is a capacitor, and the method includes: According to the control signal, the first power supply is controlled to charge the second power supply until the voltage of the second power supply is equal to the output voltage of the first power supply, Then, according to the control signal, the first power supply and the second power supply are controlled to be connected in series to charge the boost capacitor to a test voltage, where the test voltage is equal to twice the output voltage of the first power supply.

12. The method according to claim 10, characterized in that The boost power supply circuit includes a driver IC, the driver IC includes an upper path and a lower path, and the method includes: In response to the control signal being at a high level, controlling the upper path to be turned on and the lower path to be turned off; In response to the control signal being at a low level, the upper path is controlled to be turned off and the lower path is controlled to be turned on.

13. A driving circuit for driving a power device, characterized in that: The driving circuit includes a boost power supply circuit and a push-pull circuit, wherein the boost power supply circuit includes a boost capacitor, and the boost power supply circuit is used to: First, the boost capacitor is charged to a voltage greater than a preset voltage, and then the push-pull circuit is powered by the boost capacitor, wherein the push-pull circuit is used to output a first drive current to drive the power device to switch from an off state to an on state; In response to the boost capacitor charging falling below the first preset voltage during the process of the push-pull circuit outputting the first drive current, outputting a second drive current to the push-pull circuit to drive the power device to remain in an on state; The voltage of the first driving current is greater than the voltage of the second driving current, and the voltage of the second driving current is less than or equal to the preset voltage.

14. The driving circuit according to claim 13, wherein: The boost power supply circuit includes a driver IC, a first power supply, and a second power supply. The driver IC includes an upper path, a lower path, an input terminal, an output terminal, and a ground terminal. The input terminal and the output terminal are connected through the upper path, and the output terminal and the ground terminal are connected through the lower path. The positive electrode of the first power supply is connected to one end of the boost capacitor, and the negative electrode of the first power supply is connected to the output terminal; the positive electrode of the second power supply is connected to the input terminal, and the negative electrode of the second power supply is connected to the ground terminal and the other end of the boost capacitor. The boost power supply circuit is used to: First, the boost capacitor is charged to a voltage greater than the preset voltage by connecting the first power supply and the second power supply in series, and then the push-pull circuit is powered by the boost capacitor. The push-pull circuit is configured to output a first drive current to drive the power device to switch from an off state to an on state. In response to the boost capacitor charging dropping to less than the first preset voltage during the process of the push-pull circuit being used to output the first drive current, the push-pull circuit is powered by the first power supply so that the push-pull circuit outputs the second drive current to drive the power device to remain in the on state.

15. The driving circuit according to claim 13, wherein: The boost power supply circuit includes a driver IC, a first power supply, and a second capacitor. The driver IC includes an upper path, a lower path, an input terminal, an output terminal, and a ground terminal. The input terminal and the output terminal are connected via the upper path, and the output terminal and the ground terminal are connected via the lower path. The first power supply and the second power supply are connected via a resistor or a diode. The resistor or the diode is used to control the current direction between the first power supply and the second power supply. The positive electrode of the first power supply is used to connect to the input terminal and one end of the boost capacitor, and the negative electrode of the first power supply is used to connect to the output terminal; one end of the second capacitor is used to connect to the input terminal and one end of the boost capacitor, and the other end of the second capacitor is used to connect to the ground terminal and the other end of the boost capacitor; or, The negative electrode of the first power supply is used to be connected to the ground terminal and the other end of the boost capacitor; one end of the second capacitor is used to be connected to the input terminal and one end of the boost capacitor, and the other end of the second capacitor is used to be connected to the output terminal; The boost power supply circuit is used for: The second capacitor is first charged by the first power supply, and then the boost capacitor is charged to a voltage greater than the preset voltage by connecting the first power supply and the second capacitor in series.

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