Circuit board

Abstract

A circuit board includes a substrate, a processor slot, at least one dynamic random access memory slot, at least one peripheral component interconnect express slot, and a first connection slot disposed on the substrate and configured to connect an expansion circuit board, the circuit board adapted for a first class of chassis specifications, when the circuit board and the expansion circuit board are connected and arranged on the same plane, the assembly of the circuit board and the expansion circuit board is suitable for a second type of case specifications. The development cost can be reduced; and the use flexibility is improved.

Description

Technical Field

[0001] The present disclosure relates to an electrical connection assembly, in particular to a circuit board. Background Art

[0002] Existing personal computers utilize cases or chassis of various sizes to provide diverse functions and meet diverse needs. Generally, each chassis size is designed with a dedicated motherboard. However, these motherboards are designed to fit only a single chassis size, limiting the development cost of motherboards to just one or two chassis sizes. Furthermore, motherboards of the same size cannot be effectively used in chassis of different sizes, limiting the motherboard's flexibility. Therefore, there is a need to address these issues of motherboard manufacturing costs and flexibility. Summary of the Invention

[0003] The present disclosure provides a circuit board that can effectively solve the problems of high circuit board development costs and flexibility in use in the prior art.

[0004] In one embodiment of the present disclosure, a circuit board includes: a substrate, a processor socket, at least one dynamic random access memory socket, at least one peripheral component interconnect quick socket, and a first connection socket. The substrate includes multiple circuit layers and an insulating layer. The processor socket is arranged on the substrate. The at least one dynamic random access memory socket is arranged on the substrate and is located on one side of the processor socket. The at least one peripheral component interconnect quick socket is arranged on the substrate and is located on the other side of the processor socket. The peripheral component interconnect quick socket is arranged adjacent to the dynamic random access memory socket. The first connection socket is arranged on the substrate and is configured to electrically connect to an expansion circuit board. The circuit board is suitable for a first type of chassis specification, and when the circuit board and the expansion circuit board are electrically connected and arranged on the same plane, the assembly of the circuit board and the expansion circuit board is suitable for a second type of chassis specification.

[0005] In one embodiment of the present disclosure, a second connection slot is provided on the expansion circuit board, and the second connection slot is used to electrically connect to the first connection slot of the circuit board.

[0006] In one embodiment of the present disclosure, another peripheral component interconnection quick slot is provided on the expansion circuit board.

[0007] In one embodiment of the present disclosure, the expansion circuit board and the side edge of the circuit board are assembled on the plane in a manner of being connected together or having a predetermined distance therebetween.

[0008] In one embodiment of the present disclosure, the substrate has a first length and a first width. The first width of the substrate is between 215 mm and 222 mm, and the first length of the substrate is between 285 mm and 290 mm.

[0009] In one embodiment of the present disclosure, the expansion circuit board has a second length and a second width, and the second length of the expansion circuit board is less than or equal to the first length of the substrate.

[0010] In one embodiment of the present disclosure, the base plate has a protruding structure and reserves space for arranging an external fan.

[0011] In one embodiment of the present disclosure, the substrate is provided with screw holes for fixing a processor heat sink, and a portion of the wiring of the processor socket on the substrate overlaps with the copper ring of the screw hole on the substrate.

[0012] In one embodiment of the present disclosure, the substrate is provided with screw holes for fixing the processor heat sink, and the component distribution around the screw holes avoids the path through which some wiring of the processor socket passes, and the component distribution includes the distribution of guard holes around the screw holes.

[0013] In one embodiment of the present disclosure, the circuit board further includes a platform control hub disposed on the substrate.

[0014] In one embodiment of the present disclosure, the platform control hub is disposed at the intersection of an extension line of the PCI Express slot and an extension line of the dynamic random access memory slot.

[0015] In one embodiment of the present disclosure, the copper ring diameter of the via hole in the substrate for electrically connecting the high-speed signal line of the platform control hub is 20 mils, and the hole diameter of the via hole is 10 mils.

[0016] In one embodiment of the present disclosure, the substrate includes 6 circuit layers.

[0017] In one embodiment of the present disclosure, the circuit board further includes a solid-state drive slot disposed on the substrate and located between the PCI Express slot and the processor slot.

[0018] In one embodiment of the present disclosure, the platform control hub is disposed between the PCI Express slot and the processor socket.

[0019] In one embodiment of the present disclosure, the substrate includes four circuit layers.

[0020] In one embodiment of the present disclosure, the circuit board further includes at least two solid-state drive slots disposed on the substrate, and two sets of circuit traces of the platform control hub respectively connected to the at least two solid-state drive slots are separated from each other on the substrate without overlapping.

[0021] Based on the above, in the relevant embodiments of the present disclosure, the circuit board is configured to electrically connect to the first connection slot of the expansion circuit board, so that the circuit board can be used in a smaller personal computer case. At the same time, an expansion circuit board can also be added to be installed in a larger personal computer case. More functions can also be provided through the expansion circuit board. In this way, a universal circuit board is provided for personal computer cases of different sizes, which improves usage flexibility, effectively saves manufacturing costs such as circuit board design and mold opening, and avoids problems in the prior art.

[0022] To make the above features and advantages of the present disclosure more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic top view of the structure of a circuit board according to one embodiment of the present disclosure is shown.

[0024] Figure 2 A schematic front view of the structure of a circuit board according to one embodiment of the present disclosure is shown.

[0025] Figure 3A A schematic top view of the structure of a circuit board installed in a first type of chassis according to one embodiment of the present disclosure is shown.

[0026] Figure 3B FIG. 1 is a schematic top view of the structure of a circuit board installed in a second type of chassis according to an embodiment of the present disclosure.

[0027] Figure 4 A schematic structural diagram of a via hole according to an embodiment of the present disclosure is shown.

[0028] Figure 5 A schematic top view of the structure of a circuit board according to another embodiment of the present disclosure is shown.

[0029] Figure 6 A schematic top view of the structure of a circuit board according to another embodiment of the present disclosure is shown.

[0030] Figure 7 A schematic top view of the structure of a circuit board according to one embodiment of the present disclosure is shown.

[0031] Figure 8 A schematic cross-sectional view of the structure of a screw hole according to an embodiment of the present disclosure is shown.

[0032] Figure 9 A schematic top view of the structure of a circuit board in the prior art is shown.

[0033] Figure 10 A schematic cross-sectional view of the structure of a screw hole in the prior art is shown.

[0034] Description of Reference Numerals

[0035] 10, 10p: substrate

[0036] 100, 101, 101p, 102: circuit boards

[0037] 11: Protruding structure

[0038] 12, 12p: processor socket

[0039] 13, 131, 1311, 1311p, 1312, 1312p: SSD slots

[0040] 14: Dynamic random access memory slot

[0041] 16: Peripheral component interconnection quick slot

[0042] 18: First connection slot

[0043] 19, 19p: Platform Control Hub

[0044] 20: Extension baseboard

[0045] 200: Expansion circuit board

[0046] 26: Peripheral component interconnection quick slot

[0047] 28: Second connection slot

[0048] BP: Convex Hull

[0049] CA1: Class I chassis

[0050] CA2: Second Class Chassis

[0051] CL, CLp: copper ring

[0052] D1, D2, D3, D4, D5: distance

[0053] E, E1: extension line

[0054] EF: External fan

[0055] GHp: Guard Hole

[0056] IL, IL1, IL1p, IL2, IL2p: insulation layer

[0057] IS: Insulation column

[0058] L1, L2: length

[0059] S: plane

[0060] SH, SHp: screw hole

[0061] SSD: Solid State Drive

[0062] TR1, TR1p, TR2, TR2p, TR3, TR3p, TR4, TR4p: Circuit traces VA: Via holes

[0063] W1, W2: width

[0064] X, Y, Z: coordinate axes DETAILED DESCRIPTION

[0065] To make the features and advantages of this disclosure more readily apparent, the following detailed description of preferred embodiments of this disclosure is provided in conjunction with the accompanying drawings. Furthermore, directional terms used in this disclosure, such as up, down, top, bottom, front, back, left, right, inside, outside, side, periphery, center, horizontal, transverse, vertical, longitudinal, axial, radial, topmost, or bottommost, are used solely to refer to the directions of the accompanying drawings. Therefore, the directional terms used are intended to illustrate and facilitate understanding of this disclosure and are not intended to limit this disclosure. In the drawings, elements with similar structures are designated by the same reference numerals.

[0066] Reference Figure 1 , which depicts a schematic top view of the structure of a circuit board in an embodiment of the present disclosure. The present disclosure provides a circuit board 100, comprising: a substrate 10, a processor socket 12, at least one dynamic random access memory socket 14, at least one peripheral component interconnect quick socket 16, and a first connection socket 18. The substrate 10 includes multiple circuit layers and an insulating layer. The processor socket 12 is arranged on the substrate 10. The at least one dynamic random access memory socket 14 is arranged on the substrate 10 and is located on one side of the processor socket 12. The at least one peripheral component interconnect quick socket 16 is arranged on the substrate 10 and is located on the other side of the processor socket 12. The peripheral component interconnect quick socket 16 is arranged adjacent to the dynamic random access memory socket 14. The first connection socket 18 is arranged on the substrate 10 and is configured to electrically connect to an expansion circuit board 200. The circuit board 100 is suitable for the first category chassis CA1 specification (refer to Figure 3A ), when the circuit board 100 and the expansion circuit board 200 are electrically connected and arranged on the same plane S (parallel to the XY plane, please refer to Figure 2 ), the assembly of the circuit board 100 and the expansion circuit board 200 is suitable for the second type chassis CA2 specification (refer to Figure 3B ).

[0067] Specifically, the substrate 10 is, for example, a multilayer composite circuit board. The processor socket 12 is, for example, a central processing unit (CPU) socket. The dynamic random access memory slot 14 is, for example, a dual in-line memory module (DIMM). The peripheral component interconnect express (PCI-E) slot 16 is, for example, a PCI-E slot with 1 lane (x1), 4 lanes (x4), or 16 lanes (x16).

[0068] Reference Figure 1 In one embodiment of the present disclosure, the expansion circuit board 200 includes an expansion base board 20. A second connection slot 28 is provided on the expansion base board 20. The second connection slot 28 is used to electrically connect to the first connection slot 18 of the circuit board 100. There is no limitation on the specific type and electrical connection method of the second connection slot 28 and the first connection slot 18. Various protocols or transmission interfaces that can perform complete transmission and reception of circuit signals between the components provided on the expansion circuit board 200 and the circuit board 100 are applicable to the present disclosure. Another peripheral component interconnection quick slot 26 can be provided on the expansion circuit board 200 to provide an additional transmission interface. For example, a PCI-E slot with 1 channel (x1), 4 channels (x4), or 16 channels (x16) can be additionally provided on the expansion circuit board 200. Of course, the electronic components that can be provided on the expansion circuit board 200 are not limited thereto.

[0069] Specifically, the chassis sizes of personal computers can be divided into, for example, Small Form Factor (SFF), Mini Tower (MT), Mid Tower (MDT) and Full Tower (FT) from small to large. In order to adapt a circuit board to multiple chassis sizes, such as the chassis of the above-mentioned sizes, the circuit board 100 must be small enough to be installed in a smaller chassis (such as SFF). However, in a larger chassis (such as MDT), in order to set more components on the circuit board to include more functions, the size of the circuit board (such as the motherboard) designed in the prior art is larger. The circuit board 100 disclosed in the present invention has a design that can be installed in a smaller or larger chassis, that is, the circuit board 100 (such as the motherboard) is installed separately in a smaller chassis. Figure 3A The first type of chassis CA1 shown in FIG. 1 ). In a larger chassis, the circuit board 100 and the expansion circuit board 200 can be installed at the same time (eg Figure 3BThe second type chassis CA2 is shown, and the circuit board 100 and the expansion circuit board 200 are connected through the first connection slot 18 and the second connection slot 28, so that the circuit board 100 can be provided with more components to include more functions by the expansion circuit board 200.

[0070] Reference Figure 1 In the embodiment of the present disclosure, the substrate 10 has a first length L1 in the Y direction and a first width W1 in the X direction. The expansion circuit board 200 has a second length L2 and a second width W2. The second width W2 is smaller than the first width W1. The first width W1 of the substrate 10 is between 215mm and 222mm. The first length L1 of the substrate 10 is between 285mm and 290mm. The second length L2 of the expansion circuit board 200 is less than or equal to the first length L1 of the substrate 10, and is between 243mm and 247mm (corresponding to Figure 5 PCB 102 with 6 circuit layers) or 244mm to 247mm (corresponding to Figure 6 Specifically, for example, if the circuit board 100 is suitable for SFF, MT, MDT, and FT chassis, the first length L1 of the substrate 10 remains unchanged and is between 285mm and 290mm, so that the same circuit board packaging, such as chassis, can be used to improve the pallet utilization rate of the circuit board products. The first width W1 is, for example, between 215mm and 218mm (corresponding to Figure 6 PCB 102 with 4 circuit layers) or 219mm to 222mm (corresponding to Figure 5 The circuit board 100 includes a circuit board 102 with 6 circuit layers, so that it can be installed in the chassis space of SFF. When the circuit board 100 and the expansion circuit board 200 are electrically connected and arranged in the same plane S, they can be installed in the chassis space of MT. In other examples, the circuit board 100 is suitable for MT, MDT and FT chassis sizes, then the first length L1 of the substrate 10 remains unchanged, ranging from 285mm to 290mm (i.e. corresponding to Figure 6 The circuit board 102 comprising four circuit layers or corresponding Figure 5 The circuit boards 102 comprising six circuit layers are all identical so that they can be used in the same circuit board packaging, such as a chassis, to improve the utilization rate of pallets for transporting circuit board products.

[0071] Reference Figure 1The distance D2 between the 16-lane (x16) peripheral component interconnect express slot 16 and the baseboard 10 is, for example, 43 to 46 mm, so that in the SFF chassis, there is sufficient heat dissipation distance or heat exhaust space between the components inserted in the PCI-E slot (such as a display adapter) and the components arranged on the chassis, such as the system power supply unit (PSU). The distance D3 from the edge of the processor socket 12 to the edge of the baseboard 10 is, for example, 39 to 43 mm (corresponding to Figure 6 The circuit board 102 comprising four circuit layers or corresponding Figure 5 The circuit board 102 including 6 circuit layers is the same) so that the circuit board 101 (refer to Figure 5 ) and the circuit board 102 (refer to Figure 6 ) During the final test (FT) in the production process, the test fixture can be shared, which effectively reduces the number of tests and the test time, and reduces the factory production cost. The distance D4 between the peripheral component interconnect quick slot 16 and the processor slot 12 is, for example, 56 to 60 mm, so that when the circuit board 100 is in the final test (FT) in the production process, sufficient operating space is reserved for the fixtures and test fixtures used in the factory's automated production. It also leaves space for the layout of other slots (such as solid-state drive slots) and the layout space of high-frequency routing structures, the space required for a single routing, the length of the routing, and the width of the power flat cable slot, so as to facilitate the layout of various hardware components. The distance D5 between the center of the platform controller hub (Platform Controller Hub, PCH) 19 and the center of the dynamic random access memory slot 14 is, for example, 97 to 100 mm to reserve the space required for high-frequency routing and a single routing. The distance from the center of the platform control hub 19 to the left edge of the substrate 10 is also D2, for example, 43 to 46 mm, which is the space required for the layout of high-frequency wiring structures and a single wiring.

[0072] Reference Figure 2 , which illustrates a front view of the structure of a circuit board according to an embodiment of the present disclosure. The expansion circuit board 200 is suitable for being arranged in the same plane S (perpendicular to the Z axis) as the circuit board 100, for example Figure 2 As shown, the substrate 10 of the circuit board 100 and the extended substrate 20 of the extended circuit board 200 are arranged on the same plane S. The side edges of the extended circuit board 200 and the circuit board 100 are assembled on the plane S in a manner of being connected together or having a preset distance. Specifically, in order to be able to use the chassis ( Figure 2The second type of chassis CA2 is shown with its original structural components (such as bumps BP and insulating pillars IS) for mounting the circuit board 100 and the expansion circuit board 200. The circuit board 100 and the expansion circuit board 200 are arranged on the same plane S to achieve the versatility of the circuit board assembled with the circuit board 100 and the expansion circuit board 200.

[0073] Reference Figure 3A and 3B , which depicts a schematic top view of the structure of a circuit board installed in different chassis according to an embodiment of the present disclosure. Figure 3A In the smaller first type chassis CA1, only the circuit board 100 is installed. Figure 3B In the larger second type chassis CA2, the circuit board 100 and the extended circuit board 200 are installed at the same time. In one of the embodiments of the present disclosure, the base plate 10 has a protruding structure 11 and reserves space for arranging an external fan EF. Specifically, the external fan EF is relative to the circuit board 100. The external fan is not set on the circuit board 100, so it is called an external fan. The external fan EF is generally arranged in a personal computer chassis, such as a system fan of a personal computer. In addition, in order to further reduce the volume of the chassis and improve space utilization, the base plate 10 has a protruding structure 11 so that electronic components (not shown in the figure), such as slots, can be arranged on the protruding structure 11. The distance D1 from the left side to the right side of the protruding structure 11 at the lower edge of the base plate 10 is, for example, 109mm to 111mm (corresponding to Figure 5 PCB 102 with 6 circuit layers or 106mm to 108mm (corresponding to Figure 6 The circuit board 102 comprising four circuit layers is of an optimal size after reserving space for arranging the external fan EF, so as to maximize the utilization rate of the panel.

[0074] Continue to refer to Figure 1 In one embodiment of the present disclosure, the circuit board 100 further includes a platform control hub 19 disposed on the substrate 10 and in conjunction with the reference Figure 3A and Figure 4 , Figure 4 A schematic diagram of the structure of the via in an embodiment according to the present disclosure is shown. The copper ring CL of the via VA for electrically connecting the high-speed signal line layer of the platform control hub 19 in the substrate 10 has a diameter of 20 mils (mil), and the aperture of the via is 10 mil. Specifically, the via VA is provided in the insulating layer IL of the substrate 10, and a copper conductive layer (copper ring CL) is provided in the via VA so that the routing of the high-speed signal line can be changed layer. In order to allow more electronic components to be arranged on the circuit board 100 suitable for a smaller chassis, the via VA for the high-speed signal line layer of the platform control hub 19 adopts a smaller size, for example, the via VA of the platform control hub 19 adopts a via20d10 specification, the copper ring CL of which has a diameter of 20 mil and the aperture of the via VA is 10 mil.

[0075] Reference Figure 5 , which illustrates a top view of the structure of a circuit board 101 according to another embodiment of the present disclosure. In one embodiment of the present disclosure, the platform control hub 19 is disposed at the intersection of an extension line E of the PCI Express slot 16 and an extension line E1 of the DRAM slot 14.

[0076] like Figure 5 As shown, in the embodiment of the present disclosure, the circuit board 101 further includes a solid state drive slot 13 disposed on the substrate 10 and located between the PCI Express slot 16 and the processor slot 12. In order to provide three PCI Express slots 16 and provide a solid state drive slot 13 between the PCI Express slot 16 and the processor slot 12, reference may be made to FIG. Figure 5 From left to right along the X-axis, four-channel (x4), sixteen-channel (x16), and one-channel (x1) PCI Express slots 16 are provided, respectively, so that there is space between the sixteen-channel (x16) PCI Express slot 16 and the processor socket 12 for accommodating a solid-state drive slot 13 and a corresponding solid-state drive (SSD) (indicated by a dotted line). In another embodiment, additional space on the substrate 10 can accommodate more solid-state drive slots 131 and dynamic random access memory slots 14.

[0077] In one embodiment of the present disclosure, the substrate 10 includes 6 circuit layers stacked in the Z direction. Figure 6 ) includes 4 circuit layers, and the circuit board 101 includes more circuit layers and has more routing space so that the circuit board 101 with 6 circuit layers can be equipped with more electronic components than the circuit board 102 with 4 circuit layers.

[0078] Reference Figure 6 , which illustrates a schematic top view of the structure of the circuit board 102 according to an embodiment of the present disclosure. In one embodiment of the present disclosure, the platform control hub 19 is disposed between the PCI Express slot 16 and the processor socket 12. In order to set up three PCI Express slots 16 and set up the platform control hub 19 between the PCI Express slots 16 and the processor socket 12, please refer to Figure 6 In the X-axis direction, 16 channels (x16), 1 channel (x1) and 1 channel (x1) peripheral component interconnection express slots 16 are set from left to right, so that there is space between the 16 channels (x16) peripheral component interconnection express slots 16 and the processor slot 12 to set the platform control hub 19.

[0079] In one embodiment of the present disclosure, the substrate 10 includes four circuit layers. Specifically, the four-layer circuit board 102 has fewer electronic components than the six-layer circuit board 101. However, to enable the sharing of test fixtures during the production process, the processor socket 12, dynamic random access memory socket 14, and one-channel (x1) peripheral component interconnect quick slot 16 of the circuit board 102 and circuit board 101 are located in the same position. The configuration distances of other electronic components are slightly different. Considering the layout space of the high-frequency trace structure and the space required for a single trace, the distance from the left edge of the substrate 10 to the 16-channel (x16) peripheral component interconnect quick slot 16 is 18mm to 22mm. The distance from the 16-channel (x16) peripheral component interconnect quick slot 16 to the center of the platform control hub 19 is 38mm to 42mm, and the distance from the center of the platform control hub 19 to the edge of the heat sink of the processor socket 12 is 38mm to 42mm. The distance from the center of the platform control hub 19 to the dynamic random access memory slot 14 is 24 mm to 28 mm.

[0080] Reference Figure 7 , which illustrates a schematic top view of the structure of a circuit board according to one embodiment of the present disclosure. Figure 8 , which depicts a schematic cross-sectional view of the structure of a screw hole according to an embodiment of the present disclosure. Figure 7 In the embodiment of the illustrated circuit board 101, the substrate 10 is provided with a screw hole SH for fixing a processor heat sink, and a portion of the circuit traces TR1 of the processor socket 12 on the substrate 10 overlaps with the copper ring CL of the screw hole SH on the substrate 10. Specifically, the orthographic projection of the portion of the circuit traces TR1 of the processor socket 12 on the substrate 10 overlaps with the orthographic projection of the copper ring CL of the screw hole SH on the substrate 10. Furthermore, the distribution of components around the screw hole SH avoids the path through which the portion of the traces TR1 of the processor socket 12 passes. For example, there is a guard hole setting area around the screw hole SH, which is used to set a plurality of guard holes GHp (refer to Figure 9 ), the component distribution includes the distribution of guard holes GHp around the screw hole SH, and the distribution of the guard holes in the guard hole arrangement area avoids the path through which the traces TR1 of the processor socket 12 pass. Alternatively, no guard holes are arranged in the guard hole arrangement area around the screw hole SH that was originally used to arrange the guard holes GHp.

[0081] Specifically, the substrate 10 includes, for example, a stacked first insulating layer IL1 and a second insulating layer IL2, and circuit traces TR1 and TR2 disposed on the first insulating layer IL1. The screw hole SH for fixing the processor heat sink is provided with a copper conductive layer (copper ring CL) extending from the second insulating layer IL2 into the screw hole SH to provide grounding. To accommodate the size of the screw, the radius of the copper ring here is relatively large, occupying the space of the circuit traces TR1 and TR2. However, the present disclosure does not require a guard hole or a guard hole is designed as an avoidance hole around the screw hole SH. Therefore, the orthographic projection of the circuit traces TR1 or TR2 of the processor socket 12 on a different layer from the copper ring CL on the substrate 10 can be set to overlap with the orthographic projection of the copper ring CL of the screw hole SH on the substrate 10. That is, the space of the substrate 10 around the screw hole SH can be increased and can be used for routing, thereby improving space utilization and reducing the size of the substrate 10. In one embodiment, the first width W1 of the substrate 10 can be reduced by 2 mm, allowing the platform controller hub 19 and the dynamic random access memory slot 14 to be closer. In other embodiments, the circuit boards 100 and 102 can also be adapted to the aforementioned screw hole SH design, which will not be further described.

[0082] Reference Figure 9 and Figure 10 In the prior art circuit board 101p, a guard hole GHp is provided next to the heat sink screw hole SHp on the substrate 10p, and its copper conductive layer CLp extends from the second insulating layer IL2p and penetrates the various circuit layers of the substrate 10p. Therefore, it not only occupies the routing space of the circuit trace TR2p of the processor socket 12p on the second insulating layer IL2p, but also occupies the routing space of the circuit trace TR1p of the processor socket 12p on the first insulating layer IL1p, making the routing on the substrate 10p and the socket configuration not tight enough, resulting in a larger size of the substrate 10p or poor space utilization.

[0083] Reference Figure 7 , the embodiments of the present disclosure ( Figure 7Taking the illustrated circuit board 101 as an example, at least two solid-state drive slots 1311 and 1312 are disposed on the substrate 10, and the two sets of circuit traces TR3 and TR4 of the platform control hub 19, which respectively connect to the at least two solid-state drive slots 1311 and 1312, are separated from each other on the substrate 10 without overlapping, effectively reducing the winding space and trace length. Specifically, the platform control hub 19 provides, for example, two to three sets of communication ports (ports), which are suitable for M.2 interface slots for PCI-E signals. Each set of communication ports has four pins to provide high performance and a large number of input / output operations. In other words, the platform control hub 19 forms a direct connection between the at least two solid-state drive slots 1311 and 1312 in a non-interlaced manner with a shorter trace length, avoiding excessive trace winding and occupying substrate area. In one embodiment, as long as the specifications of the two sets of communication ports of the platform control hub 19 support and are compatible with each other, the communication ports can be interchanged to achieve the effect of shortening the trace and reducing the substrate length. In the prior art, the two sets of circuit traces TR3p and TR4p of the platform control hub 19p respectively connected to at least two solid-state drive slots 1311p and 1312p have their orthographic projections on the substrate 10p overlapped with each other (refer to Figure 9 Even though the two sets of circuit traces TR3p and TR4p are located on different circuit layers, they still occupy a larger winding space and have a longer trace length.

[0084] In summary, compared to the prior art, the circuit board disclosed herein is configured to electrically connect to the first connection slot of the expansion circuit board, allowing the baseboard to be adapted for use in smaller computer cases, such as those used in personal computers or similar computer systems. Furthermore, by adding an expansion circuit board to electrically connect to the expansion circuit board, the baseboard can be installed in a larger computer case. The expansion circuit board can also provide more functions, thereby providing a universal circuit board for computer cases of different sizes, improving flexibility, effectively saving manufacturing costs such as circuit board design and mold making, and avoiding problems encountered in the prior art.

[0085] Although the present disclosure has been shown and described with respect to one or more implementations, those skilled in the art will appreciate equivalent variations and modifications based on reading and understanding of this specification and the accompanying drawings. The present disclosure includes all such modifications and variations and is limited only by the scope of the appended patent applications. In particular, with respect to the various functions performed by the above-mentioned components, the terms used to describe such components are intended to correspond to any component (unless otherwise indicated) that performs the specified function of the component (e.g., it is functionally equivalent) even if structurally not equivalent to the disclosed structure of the function in the exemplary implementation of the present specification shown herein. In addition, although the specific features of this specification have been disclosed with respect to only one of several implementations, such features can be combined with one or more other features of other implementations that are desirable and advantageous for a given or specific application. Moreover, insofar as the terms "including," "having," "containing," or their variations are used in specific embodiments or claims, such terms are intended to be included in a manner similar to the term "comprising."

Claims

1. A circuit board, characterized in that: include: A substrate comprising multiple circuit layers and an insulating layer; a processor socket, arranged on the substrate; At least one dynamic random access memory slot is provided on the substrate and is located on one side of the processor slot; At least one PCI Express slot is disposed on the substrate and is located on the other side of the processor slot, wherein the PCI Express slot is disposed adjacent to the dynamic random access memory slot; as well as A first connection slot is provided on the substrate and is configured to electrically connect an expansion circuit board, wherein the circuit board is applicable to a first type of chassis specification. When the circuit board and the expansion circuit board are electrically connected and arranged in the same plane, the assembly of the circuit board and the expansion circuit board is applicable to a second type of chassis specification.

2. The circuit board according to claim 1, wherein: The expansion circuit board is provided with a second connection slot, and the second connection slot is used to be electrically connected to the first connection slot of the circuit board.

3. The circuit board according to claim 1, wherein: Another peripheral component interconnection quick slot is provided on the expansion circuit board.

4. The circuit board according to claim 1, wherein: The expansion circuit board and the side edge of the circuit board are assembled on the plane in a manner of being connected together or having a preset distance therebetween.

5. The circuit board system according to claim 1, wherein: The substrate has a first length and a first width. The first width of the substrate is between 215 mm and 222 mm, and the first length of the substrate is between 285 mm and 290 mm.

6. The circuit board according to claim 5, characterized in that The expansion circuit board has a second length and a second width, and the second length of the expansion circuit board is less than or equal to the first length of the substrate.

7. The circuit board according to claim 1, wherein: The base plate has a protruding structure and reserves a space for arranging an external fan.

8. The circuit board according to claim 1, wherein: The substrate is provided with screw holes for fixing the processor heat sink, and part of the wiring of the processor socket is overlapped with the copper ring of the screw hole on the substrate.

9. The circuit board according to claim 1, wherein: The substrate is provided with screw holes for fixing the processor heat sink, and the component distribution around the screw holes avoids the path through which some wiring of the processor socket passes, and the component distribution includes the distribution of guard holes around the screw holes.

10. The circuit board according to claim 1, wherein: The platform control hub is arranged on the substrate.

11. The circuit board according to claim 10, wherein: The platform control hub is arranged at the intersection of an extension line of the PCI Express slot and an extension line of the dynamic random access memory slot.

12. The circuit board according to claim 11, wherein: The invention further comprises a solid state drive slot disposed on the substrate and located between the peripheral component interconnection express slot and the processor slot.

13. The circuit board according to claim 12, wherein: The substrate includes 6 circuit layers.

14. The circuit board according to claim 10, wherein: The platform control hub is disposed between the PCI Express slot and the processor socket.

15. The circuit board according to claim 14, wherein: The substrate comprises four circuit layers.

16. The circuit board according to claim 10, wherein: The copper ring diameter of the via hole in the substrate for electrically connecting the high-speed signal line layer of the platform control hub is 20 mils, and the aperture of the via hole is 10 mils.

17. The circuit board according to claim 10, wherein: The invention further comprises at least two solid state drive slots disposed on the substrate, and two sets of circuit traces of the platform control hub respectively connected to the at least two solid state drive slots are separated from each other on the substrate without overlapping.

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