Automatic alignment and synchronous detection method for double-sided ink-jet circuit of ceramic circuit board

Abstract

The invention discloses an automatic alignment and synchronous detection method for double-sided ink-jet lines of a ceramic circuit board, and belongs to the technical field of ceramic circuit boards, and the method comprises the steps: carrying out the laser scanning of the surface of the ceramic circuit board, and generating the positioning data of the ceramic circuit board; the ceramic circuit board line graph is compared based on the ceramic circuit board positioning data, the alignment platform is driven by the servo motor to finely adjust the ceramic circuit board, and automatic and accurate alignment is achieved; and performing synchronous detection on the ceramic circuit board based on automatic optical detection, determining a defect positioning and classification result of the ceramic circuit board, and performing maintenance management and feedback optimization on the ceramic circuit board. The problem that the product quality is reduced due to the fact that automatic alignment and synchronous detection cannot be carried out on the double-sided ink-jet circuit of the ceramic circuit board in the prior art is solved. According to the invention, automatic alignment and synchronous detection can be carried out on double-sided ink-jet lines of the ceramic circuit board, high-precision and high-efficiency manufacturing of the ceramic circuit board can be realized, the defect rate in the production process is reduced, and the product quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic circuit boards, in particular to an automatic alignment and synchronous detection method for double-sided inkjet circuits of a ceramic circuit board. Background Art

[0002] A ceramic circuit board includes a ceramic substrate and a circuit unit arranged on the ceramic substrate. Among them, the Chinese patent with publication number CN117098324A discloses a method for preparing a ceramic circuit board, wherein the ceramic circuit board includes a ceramic substrate and a plurality of circuit units arranged on the ceramic substrate, and the plurality of circuit units are separated from each other; the preparation method includes the following steps: making an etching-resistant conductive lead on a first copper foil layer on the surface of the ceramic substrate, the conductive lead being used to form an electrical connection between the plurality of circuit units; performing graphic electroplating on the first copper foil layer to obtain a second copper foil layer matching the plurality of circuit units, the thickness of the second copper foil layer being greater than the thickness of the first copper foil layer; etching the first copper foil layer to obtain a plurality of circuit units; electroplating a metal protective layer on the surface and sidewalls of the circuit units; and disconnecting the conductive leads between the plurality of circuit units to block the electrical connection between the plurality of circuit units. Circuit units with better graphic accuracy can be obtained on the ceramic substrate, and the sidewalls of the circuit units can also be effectively protected. However, this patent has the following defects:

[0003] Existing technologies cannot automatically align and synchronously detect the double-sided inkjet circuits of ceramic circuit boards, cannot achieve high-precision and high-efficiency ceramic circuit board manufacturing, and increase the defect rate in the production process, reducing product quality. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for automatic alignment and synchronous detection of double-sided inkjet circuits on ceramic circuit boards, which can automatically align and synchronously detect double-sided inkjet circuits on ceramic circuit boards, achieve high-precision and high-efficiency ceramic circuit board manufacturing, reduce the defect rate in the production process, and improve product quality, thereby solving the problems raised in the above-mentioned background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] The automatic alignment and synchronous detection method of double-sided inkjet circuits of ceramic circuit boards includes:

[0007] Perform laser scanning on the surface of the ceramic circuit board to generate ceramic circuit board positioning data;

[0008] The circuit patterns of the ceramic circuit board are compared based on the positioning data of the ceramic circuit board, and the ceramic circuit board is fine-tuned by the servo motor-driven alignment platform to achieve automatic and precise alignment;

[0009] Based on automatic optical inspection, ceramic circuit boards are synchronously inspected to determine the defect location and classification results of the ceramic circuit boards, and maintenance management and feedback optimization of the ceramic circuit boards are carried out.

[0010] Preferably, comparing the circuit patterns of the ceramic circuit board based on the ceramic circuit board positioning data includes:

[0011] Scan the surface of the ceramic circuit board based on a high-precision laser scanner to obtain the reference points or characteristic patterns on the surface of the ceramic circuit board, thereby generating accurate ceramic circuit board positioning data;

[0012] Real-time monitoring of the inkjet circuit on the surface of the ceramic circuit board is performed based on a high-resolution CCD camera to collect data on the inkjet circuit on the ceramic circuit board;

[0013] Based on the positioning data of the ceramic circuit board, the data of the inkjet circuit of the ceramic circuit board is compared, analyzed and identified. By identifying the reference points or characteristic patterns on the surface of the ceramic circuit board, the automatic alignment results of the double-sided inkjet circuit of the ceramic circuit board are determined.

[0014] Preferably, determining the automatic alignment result of the double-sided inkjet circuits of the ceramic circuit board by identifying the reference points or characteristic patterns on the surface of the ceramic circuit board includes:

[0015] Perform feature matching based on a calibration plate on the high-resolution CCD camera and high-precision laser scanner in advance, and determine the initial mapping relationship between the ceramic circuit board positioning data and the ceramic circuit board inkjet line data based on the feature matching results;

[0016] Projecting the ceramic circuit board inkjet line data onto the ceramic circuit board positioning data based on the mapping relationship to obtain projection line data, retrieving sampling coordinate data matching the reference point or characteristic pattern from the projection line data, obtaining a projection position relationship between the sampling coordinate data, and determining a position offset between the projection position relationship and a camera position relationship determined by the ceramic circuit board inkjet line data;

[0017] Determine the position offsets corresponding to multiple frames of data on the surface of the ceramic circuit board based on the above method, determine the lateral offset and the longitudinal offset from the position offset, and obtain a lateral offset sequence and a longitudinal offset sequence by combining the frame features;

[0018] Determine whether the trends of the horizontal offset sequence and the vertical offset sequence are regular and the same;

[0019] If so, determine the correction coefficient of the initial mapping relationship based on the trend of the sequence;

[0020] Otherwise, determining a correction coefficient for the initial mapping relationship based on the lateral offset sequence and the average lateral offset and the average longitudinal offset of the longitudinal offset sequence;

[0021] Correcting the initial mapping relationship based on the correction coefficient to obtain a target mapping relationship;

[0022] Based on the target mapping relationship, combined with the reference points or characteristic patterns, the ceramic circuit board positioning data and the ceramic circuit board inkjet line data are matched to determine the automatic alignment result of the double-sided inkjet line of the ceramic circuit board.

[0023] Preferably, comparing, analyzing and identifying the inkjet circuit data of the ceramic circuit board based on the ceramic circuit board positioning data includes:

[0024] When the inkjet circuit data of the ceramic circuit board is within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is that the double-sided inkjet circuit of the ceramic circuit board has been automatically and accurately aligned;

[0025] When the inkjet circuit data of the ceramic circuit board is not within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is that the double-sided inkjet circuit of the ceramic circuit board is not automatically and accurately aligned. At this time, the ceramic circuit board alignment platform is driven to move by the servo motor to fine-tune the ceramic circuit board to achieve automatic and accurate alignment of the double-sided inkjet circuit of the ceramic circuit board.

[0026] Preferably, fine-tuning the ceramic circuit board includes:

[0027] Detect positioning holes on ceramic circuit boards using a high-precision camera and extract the center coordinates of positioning holes on ceramic circuit boards using image processing algorithms;

[0028] According to the center coordinates of the positioning holes on the ceramic circuit board, the direction and distance that the ceramic circuit board alignment platform needs to move are calculated to determine the real-time deviation information;

[0029] The real-time deviation information is sent to the servo driver, which sends a control signal to the servo motor and feeds back the real-time deviation information. The servo motor dynamically adjusts the alignment parameters and drives the ceramic circuit board alignment platform to accurately move to the target position, so that it can fine-tune the ceramic circuit board and form a closed-loop control.

[0030] After the ceramic circuit board is aligned, it is fixed on the ceramic circuit board alignment platform by a fixture or vacuum adsorption device to ensure that the position of the ceramic circuit board is stable during the printing process.

[0031] Preferably, the synchronous detection of the ceramic circuit board based on automatic optical detection includes:

[0032] Based on automatic optical detection, a high-resolution CCD camera is used to monitor the double-sided inkjet circuit of the ceramic circuit board in real time and collect real-time image data of the ceramic circuit board;

[0033] Preprocessing the real-time image data of the ceramic circuit board to determine the characteristic image data of the ceramic circuit board;

[0034] Based on deep learning technology, a ceramic circuit board defect location and classification model is constructed, and the ceramic circuit board feature image data is input into the ceramic circuit board defect location and classification model. The ceramic circuit board feature image data is analyzed and identified according to the ceramic circuit board defect location and classification model, and the ceramic circuit board is simultaneously detected to determine the ceramic circuit board defect location and classification results;

[0035] The defect location and classification results of the ceramic circuit board are recorded in the database to provide a basis for subsequent processing.

[0036] Preferably, the ceramic circuit board defect location and classification results include the ceramic circuit board defect location and type information; when a defect in the ceramic circuit board is detected synchronously, the ceramic circuit board defect is automatically marked and an alarm is issued, and a ceramic circuit board maintenance and management plan is formulated in a timely manner to guide operators to perform maintenance and management on the defective ceramic circuit board.

[0037] Preferably, the ceramic circuit board defect type information includes disconnection, short circuit, offset and uneven ink droplet;

[0038] For defects in ceramic circuit boards such as broken lines or uneven ink droplets, they can be corrected by manually filling ink or reprinting. Furthermore, by using a piezoelectric inkjet print head, the frequency and position of ink droplet ejection can be precisely controlled to achieve high-resolution circuit printing. Furthermore, the printing path can be optimized to ensure consistent printed circuits.

[0039] For ceramic circuit board defects such as short circuits or offsets, local repairs are performed using robotic arms or robots. Automatic optical inspection is then performed again on the ceramic circuit boards after maintenance and management. The maintenance and management effects of the ceramic circuit boards are verified based on the inspection results, and the maintenance and management plan for the ceramic circuit boards is optimized based on the feedback from the inspection results, so that the defects of the ceramic circuit boards are completely resolved.

[0040] Preferably, preprocessing the real-time image data of the ceramic circuit board includes:

[0041] Denoising the ceramic circuit board real-time image data based on Gaussian filtering to remove Gaussian noise in the ceramic circuit board real-time image data while retaining edge information;

[0042] Based on histogram equalization, the contrast of the real-time image data of the ceramic circuit board is enhanced to improve the image contrast in the real-time image data of the ceramic circuit board and highlight the details on the ceramic circuit board;

[0043] and cropping non-critical areas of the ceramic circuit board real-time image data, scaling the image in the ceramic circuit board real-time image data to a specific resolution, and converting the color image into a grayscale image;

[0044] The image in the ceramic circuit board real-time image data is segmented into foreground and background by setting a threshold, and the Canny operator is used to extract the boundary information of the ceramic circuit board, and the key features in the ceramic circuit board real-time image data are extracted to determine the ceramic circuit board feature image data.

[0045] Preferably, the displacement deviation and the scaling deviation are obtained from the real-time deviation information;

[0046] Designing a nozzle coordinate offset opposite to the displacement deviation as a coordinate adjustment parameter;

[0047] Obtaining a line spacing deviation and a line length deviation from the scaled deviation, and calculating an adjustment amount of the nozzle speed based on the line spacing deviation and the line length deviation;

[0048] Obtaining the second line spacing deviation at the adjusted nozzle speed, and calculating the adjustment amount of the nozzle pulse frequency;

[0049] The servo motor dynamically adjusts the positioning parameters based on the coordinate adjustment parameters, the adjustment amount of the nozzle speed and the adjustment amount of the nozzle pulse frequency.

[0050] Compared with the prior art, the present invention has the following beneficial effects:

[0051] 1. The present invention uses a high-precision laser scanner to scan the surface of a ceramic circuit board, obtains reference points or characteristic patterns on the surface of the ceramic circuit board, and thus generates accurate ceramic circuit board positioning data. The present invention uses a high-resolution CCD camera to perform real-time monitoring of the inkjet circuits on the surface of the ceramic circuit board, collects the inkjet circuit data of the ceramic circuit board, compares, analyzes, and identifies the inkjet circuit data of the ceramic circuit board based on the ceramic circuit board positioning data, determines the automatic alignment result of the double-sided inkjet circuits of the ceramic circuit board by identifying the reference points or characteristic patterns on the surface of the ceramic circuit board, and drives the ceramic circuit board alignment platform to move by a servo motor to fine-tune the ceramic circuit board, thereby achieving automatic and accurate alignment of the double-sided inkjet circuits of the ceramic circuit board.

[0052] 2. The present invention is based on automatic optical detection and adopts a high-resolution CCD camera to perform real-time monitoring of the double-sided inkjet circuit of the ceramic circuit board, collects real-time image data of the ceramic circuit board, and pre-processes the real-time image data of the ceramic circuit board to determine the characteristic image data of the ceramic circuit board. Based on deep learning technology, a ceramic circuit board defect location classification model is constructed, and the characteristic image data of the ceramic circuit board is analyzed and identified according to the ceramic circuit board defect location classification model. The ceramic circuit board is synchronously detected to determine the ceramic circuit board defect location classification result. When defects in the ceramic circuit board are detected synchronously, the defects in the ceramic circuit board are automatically marked and alarmed, and a ceramic circuit board maintenance and management plan is formulated in time to guide operators to perform maintenance and management on the defective ceramic circuit board. The double-sided inkjet circuit of the ceramic circuit board can be automatically aligned and synchronously detected, which can realize high-precision and high-efficiency ceramic circuit board manufacturing, reduce the defect rate in the production process, and improve product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 The present invention is a flow chart of the automatic alignment and synchronous detection method for double-sided inkjet circuits of a ceramic circuit board. DETAILED DESCRIPTION

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0055] In order to solve the existing problem that the double-sided inkjet circuit of ceramic circuit board cannot be automatically aligned and synchronously detected, high-precision and high-efficiency ceramic circuit board manufacturing cannot be achieved, and the defect rate in the production process is increased, which reduces the product quality, please refer to Figure 1 , this embodiment provides the following technical solutions:

[0056] Example 1

[0057] The automatic alignment and synchronous detection method of double-sided inkjet circuits of ceramic circuit boards includes:

[0058] Perform laser scanning on the surface of the ceramic circuit board to generate ceramic circuit board positioning data;

[0059] The circuit patterns of the ceramic circuit board are compared based on the positioning data of the ceramic circuit board, and the ceramic circuit board is fine-tuned by the servo motor-driven alignment platform to achieve automatic and precise alignment;

[0060] In this embodiment, the surface of the ceramic circuit board is scanned based on a high-precision laser scanner to obtain reference points or characteristic patterns on the surface of the ceramic circuit board, thereby generating accurate ceramic circuit board positioning data;

[0061] Real-time monitoring of the inkjet circuit on the surface of the ceramic circuit board is performed based on a high-resolution CCD camera to collect data on the inkjet circuit on the ceramic circuit board;

[0062] Based on the positioning data of the ceramic circuit board, the data of the inkjet circuit of the ceramic circuit board is compared, analyzed and identified. By identifying the reference points or characteristic patterns on the surface of the ceramic circuit board, the automatic alignment results of the double-sided inkjet circuit of the ceramic circuit board are determined.

[0063] Among them, when the ceramic circuit board inkjet circuit data is within the ceramic circuit board positioning data range, the ceramic circuit board double-sided inkjet circuit automatic alignment result is that the ceramic circuit board double-sided inkjet circuit has been automatically and accurately aligned;

[0064] Among them, when the inkjet circuit data of the ceramic circuit board is not within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is that the double-sided inkjet circuit of the ceramic circuit board is not automatically and accurately aligned. At this time, the ceramic circuit board alignment platform is driven to move by the servo motor to fine-tune the ceramic circuit board to achieve automatic and accurate alignment of the double-sided inkjet circuit of the ceramic circuit board.

[0065] In this embodiment, the automatic alignment result of double-sided inkjet circuits of the ceramic circuit board is determined by identifying reference points or characteristic patterns on the surface of the ceramic circuit board, including:

[0066] Perform feature matching based on a calibration plate on the high-resolution CCD camera and high-precision laser scanner in advance, and determine the initial mapping relationship between the ceramic circuit board positioning data and the ceramic circuit board inkjet line data based on the feature matching results;

[0067] Projecting the ceramic circuit board inkjet line data onto the ceramic circuit board positioning data based on the mapping relationship to obtain projection line data, retrieving sampling coordinate data matching the reference point or characteristic pattern from the projection line data, obtaining a projection position relationship between the sampling coordinate data, and determining a position offset between the projection position relationship and a camera position relationship determined by the ceramic circuit board inkjet line data;

[0068] Determine the position offsets corresponding to multiple frames of data on the surface of the ceramic circuit board based on the above method, determine the lateral offset and the longitudinal offset from the position offset, and obtain a lateral offset sequence and a longitudinal offset sequence by combining the frame features;

[0069] Determine whether the trends of the horizontal offset sequence and the vertical offset sequence are regular and the same;

[0070] If so, determine the correction coefficient of the initial mapping relationship based on the trend of the sequence;

[0071] Otherwise, determining a correction coefficient for the initial mapping relationship based on the lateral offset sequence and the average lateral offset and the average longitudinal offset of the longitudinal offset sequence;

[0072] Correcting the initial mapping relationship based on the correction coefficient to obtain a target mapping relationship;

[0073] Based on the target mapping relationship, combined with the reference points or characteristic patterns, the ceramic circuit board positioning data and the ceramic circuit board inkjet line data are matched to determine the automatic alignment result of the double-sided inkjet line of the ceramic circuit board.

[0074] In this embodiment, a high-precision calibration plate (such as a checkerboard + corner points / planes detectable by the lidar) is specifically placed based on feature matching of the calibration plate, and is observed by the camera and lidar at the same time, thereby establishing a correspondence between the two and obtaining an initial mapping relationship.

[0075] In this embodiment, the sampling coordinate data that matches the reference point or the characteristic pattern is retrieved from the projection line data, and the sampling coordinate data is located at the position where the reference point or the characteristic pattern is located or is very close to the reference point or the characteristic pattern.

[0076] In this embodiment, the frame feature is specifically the temporal correlation between multiple frames of data.

[0077] In this embodiment, the sequence trend of the lateral offset sequence and the longitudinal offset sequence is, for example, gradually increasing or decreasing according to a specific offset, or the offset remains unchanged, while the offset changes irregularly.

[0078] The beneficial effects of the above design scheme are: by pre-performing feature matching based on a calibration plate on a high-resolution CCD camera and a high-precision laser scanner, the initial mapping relationship between the ceramic circuit board positioning data and the ceramic circuit board inkjet line data is determined according to the feature matching results, thereby realizing preliminary mapping matching between the positioning data and the line data, and retrieving the sampled coordinate data matching the reference point or feature pattern in the projection line data, obtaining the projection position relationship between the sampled coordinate data, determining the position offset between the projection position relationship and the camera position relationship determined by the ceramic circuit board inkjet line data, and finally correcting the initial mapping relationship based on the position offset and taking into account the combination of multiple frames of data to ensure the accuracy and stability of the target mapping relationship obtained, and finally ensuring that the ceramic circuit board positioning data and the ceramic circuit board inkjet line data are matched based on the target mapping relationship in combination with the reference point or feature pattern, and determining the accuracy of the automatic alignment result of the double-sided inkjet line of the ceramic circuit board, thereby providing an accurate reference basis for the automatic alignment of the double-sided inkjet line of the ceramic circuit board during operation.

[0079] Example 2

[0080] In this embodiment, fine-tuning the ceramic circuit board includes:

[0081] Detect positioning holes on ceramic circuit boards using a high-precision camera and extract the center coordinates of positioning holes on ceramic circuit boards using image processing algorithms;

[0082] According to the center coordinates of the positioning holes on the ceramic circuit board, the direction and distance that the ceramic circuit board alignment platform needs to move are calculated to determine the real-time deviation information;

[0083] The real-time deviation information is sent to the servo driver, which sends a control signal to the servo motor and feeds back the real-time deviation information. The servo motor dynamically adjusts the alignment parameters and drives the ceramic circuit board alignment platform to accurately move to the target position, so that it can fine-tune the ceramic circuit board and form a closed-loop control.

[0084] After the ceramic circuit board is aligned, it is fixed on the ceramic circuit board alignment platform by a fixture or vacuum adsorption device to ensure that the position of the ceramic circuit board is stable during the printing process.

[0085] Specifically, the ceramic circuit board inkjet circuit data is compared, analyzed, and identified based on the ceramic circuit board positioning data. The automatic alignment results of the double-sided inkjet circuits on the ceramic circuit board are shown in Table 1.

[0086] Table 1: Automatic alignment results of double-sided inkjet circuits on ceramic PCBs

[0087]

[0088] Therefore, when the double-sided inkjet circuits of the ceramic circuit board are not automatically and accurately aligned, the ceramic circuit board alignment platform is driven to move by the servo motor to make fine adjustments to the ceramic circuit board to achieve automatic and accurate alignment of the double-sided inkjet circuits of the ceramic circuit board. The double-sided inkjet circuits of the ceramic circuit board can be automatically aligned to improve the manufacturing accuracy of the ceramic circuit board.

[0089] In one embodiment, a servo driver sends a control signal to a servo motor and feeds back real-time deviation information, so that the servo motor dynamically adjusts the alignment parameters, including:

[0090] Obtaining a displacement deviation and a scaling deviation from the real-time deviation information;

[0091] Designing a nozzle coordinate offset opposite to the displacement deviation as a coordinate adjustment parameter;

[0092] Obtaining a line spacing deviation and a line length deviation from the scaled deviation, and calculating an adjustment amount of the nozzle speed based on the line spacing deviation and the line length deviation;

[0093] The calculation formula for the nozzle speed adjustment amount H is as follows:

[0094]

[0095] Among them, V represents the current nozzle speed, C represents the reference constant, ΔE represents the line spacing deviation, ΔE max Indicates the preset maximum line spacing deviation, ΔE min Indicates the preset minimum line spacing deviation, ΔR indicates the line length deviation, ΔR max Indicates the preset maximum line length deviation, ΔR min Indicates the preset minimum line length deviation;

[0096] Obtaining the second line spacing deviation at the adjusted nozzle speed, and calculating the adjustment amount of the nozzle pulse frequency;

[0097] The calculation formula for the adjustment of the nozzle pulse frequency is as follows:

[0098]

[0099] Where K represents the adjustment amount of the nozzle pulse frequency, P represents the current nozzle pulse frequency, ΔE2 represents the second line spacing deviation, Δxy represents the nozzle coordinate offset, and Δxy0 represents the reference nozzle coordinate offset;

[0100] The servo motor dynamically adjusts the positioning parameters based on the coordinate adjustment parameters, the adjustment amount of the nozzle speed and the adjustment amount of the nozzle pulse frequency.

[0101] In this embodiment, the scaling deviation refers to the dimensional scaling caused by thermal expansion and contraction of the substrate or material deformation, specifically, the deviation of length and spacing.

[0102] In this embodiment, the nozzle speed affects the line spacing and line length, and the nozzle pulse frequency affects the line spacing deviation.

[0103] In this embodiment, the preset maximum line spacing deviation, the preset minimum line spacing deviation, the preset maximum line length deviation, and the preset minimum line length deviation are preset according to actual conditions and device characteristics.

[0104] The beneficial effects of the above design scheme are: by obtaining the displacement deviation and scaling deviation from the real-time deviation information, designing the nozzle coordinate offset opposite to the displacement deviation as the coordinate adjustment parameter, the displacement deviation is eliminated, the line spacing deviation and the line length deviation are obtained from the scaling deviation, and the adjustment amount of the nozzle speed is calculated based on the line spacing deviation and the line length deviation. The current nozzle speed is considered in the calculation process, and a reference constant is added to make the calculation result more accurate. The second line spacing deviation at the adjusted nozzle speed is obtained, and the adjustment amount of the nozzle pulse frequency is calculated. The current nozzle pulse frequency is considered in the calculation process, and the influence of the error of the nozzle coordinate offset is considered to make the calculation result more accurate, and finally the servo motor dynamically adjusts the alignment parameters to ensure the accuracy of the ceramic circuit board and the precise alignment of the double-sided inkjet circuit of the ceramic circuit board during operation.

[0105] Example 3

[0106] Based on automatic optical inspection, ceramic circuit boards are synchronously inspected to determine the defect location and classification results of the ceramic circuit boards, and maintenance management and feedback optimization of the ceramic circuit boards are carried out.

[0107] In this embodiment, synchronous inspection of a ceramic circuit board is performed based on automatic optical inspection, including:

[0108] Based on automatic optical detection, a high-resolution CCD camera is used to monitor the double-sided inkjet circuit of the ceramic circuit board in real time and collect real-time image data of the ceramic circuit board;

[0109] Preprocessing the real-time image data of the ceramic circuit board to determine the characteristic image data of the ceramic circuit board;

[0110] In this embodiment, preprocessing the real-time image data of the ceramic circuit board includes:

[0111] Denoising the ceramic circuit board real-time image data based on Gaussian filtering to remove Gaussian noise in the ceramic circuit board real-time image data while retaining edge information;

[0112] Based on histogram equalization, the contrast of the real-time image data of the ceramic circuit board is enhanced to improve the image contrast in the real-time image data of the ceramic circuit board and highlight the details on the ceramic circuit board;

[0113] and cropping non-critical areas of the ceramic circuit board real-time image data, scaling the image in the ceramic circuit board real-time image data to a specific resolution, and converting the color image into a grayscale image;

[0114] The image in the ceramic circuit board real-time image data is segmented into foreground and background by setting a threshold, and the Canny operator is used to extract the boundary information of the ceramic circuit board, and the key features in the ceramic circuit board real-time image data are extracted to determine the ceramic circuit board feature image data.

[0115] Based on deep learning technology, a ceramic circuit board defect location and classification model is constructed, and the ceramic circuit board feature image data is input into the ceramic circuit board defect location and classification model. The ceramic circuit board feature image data is analyzed and identified according to the ceramic circuit board defect location and classification model, and the ceramic circuit board is simultaneously detected to determine the ceramic circuit board defect location and classification results. The ceramic circuit board defect location and classification results are recorded in the database to provide a basis for subsequent processing.

[0116] In this embodiment, the ceramic circuit board defect location and classification results include the ceramic circuit board defect location and type information; when a defect in the ceramic circuit board is synchronously detected, the ceramic circuit board defect is automatically marked and an alarm is issued, and a ceramic circuit board maintenance and management plan is formulated in a timely manner to guide operators to perform maintenance and management on the defective ceramic circuit board.

[0117] In this embodiment, the ceramic circuit board defect type information includes disconnection, short circuit, offset and uneven ink droplet;

[0118] For defects in ceramic circuit boards such as broken lines or uneven ink droplets, they can be corrected by manually filling ink or reprinting. Furthermore, by using a piezoelectric inkjet print head, the frequency and position of ink droplet ejection can be precisely controlled to achieve high-resolution circuit printing. Furthermore, the printing path can be optimized to ensure consistent printed circuits.

[0119] For ceramic circuit board defects such as short circuit or offset, local repair is performed using a robotic arm or robot;

[0120] The ceramic circuit boards after maintenance and management are subjected to automatic optical inspection again, and the maintenance and management effects of the ceramic circuit boards are verified based on the inspection results. The maintenance and management plan of the ceramic circuit boards is optimized based on the feedback of the inspection results, so that the defects of the ceramic circuit boards are completely resolved.

[0121] In summary, the double-sided inkjet circuits of the ceramic circuit board can be automatically aligned and synchronously detected, which can achieve high-precision and high-efficiency ceramic circuit board manufacturing, reduce the defect rate in the production process, and improve product quality.

[0122] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0123] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. Automatic alignment and synchronous detection method for double-sided inkjet circuits on ceramic circuit boards, characterized in that: include: Perform laser scanning on the surface of the ceramic circuit board to generate ceramic circuit board positioning data; The circuit pattern of the ceramic circuit board is compared based on the positioning data of the ceramic circuit board, and the ceramic circuit board is fine-tuned by the servo motor-driven alignment platform to achieve automatic and precise alignment; The servo driver sends a control signal to the servo motor and feeds back real-time deviation information, and the servo motor dynamically adjusts the alignment parameters based on the coordinate adjustment parameters, the adjustment amount of the nozzle speed, and the adjustment amount of the nozzle pulse frequency. Based on automatic optical inspection, ceramic circuit boards are synchronously inspected to determine the defect location and classification results of the ceramic circuit boards, and maintenance management and feedback optimization of the ceramic circuit boards are carried out.

2. The automatic alignment and synchronization detection method for double-sided inkjet circuits of a ceramic circuit board according to claim 1, characterized in that: Compare the circuit patterns of the ceramic circuit board based on the ceramic circuit board positioning data, including: Scan the surface of the ceramic circuit board based on a high-precision laser scanner to obtain the reference points or characteristic patterns on the surface of the ceramic circuit board, thereby generating accurate ceramic circuit board positioning data; Real-time monitoring of the inkjet circuit on the surface of the ceramic circuit board is performed based on a high-resolution CCD camera to collect data on the inkjet circuit on the ceramic circuit board; Based on the positioning data of the ceramic circuit board, the data of the inkjet circuit of the ceramic circuit board is compared, analyzed and identified. By identifying the reference points or characteristic patterns on the surface of the ceramic circuit board, the automatic alignment results of the double-sided inkjet circuit of the ceramic circuit board are determined.

3. The automatic alignment and synchronization detection method for double-sided inkjet circuits of a ceramic circuit board according to claim 2, characterized in that: By identifying the reference points or characteristic patterns on the surface of the ceramic circuit board, the automatic alignment results of the double-sided inkjet circuit of the ceramic circuit board are determined, including: Perform feature matching based on a calibration plate on the high-resolution CCD camera and high-precision laser scanner in advance, and determine the initial mapping relationship between the ceramic circuit board positioning data and the ceramic circuit board inkjet line data based on the feature matching results; Projecting the ceramic circuit board inkjet line data onto the ceramic circuit board positioning data based on the mapping relationship to obtain projection line data, retrieving sampling coordinate data matching the reference point or characteristic pattern from the projection line data, obtaining a projection position relationship between the sampling coordinate data, and determining a position offset between the projection position relationship and a camera position relationship determined by the ceramic circuit board inkjet line data; Determine the position offsets corresponding to multiple frames of data on the surface of the ceramic circuit board based on the above method, determine the lateral offset and the longitudinal offset from the position offset, and obtain a lateral offset sequence and a longitudinal offset sequence by combining the frame features; Determine whether the trends of the horizontal offset sequence and the vertical offset sequence are regular and the same; If so, determine the correction coefficient of the initial mapping relationship based on the trend of the sequence; Otherwise, determining a correction coefficient for the initial mapping relationship based on the lateral offset sequence and the average lateral offset and the average longitudinal offset of the longitudinal offset sequence; Correcting the initial mapping relationship based on the correction coefficient to obtain a target mapping relationship; Based on the target mapping relationship, combined with the reference points or characteristic patterns, the ceramic circuit board positioning data and the ceramic circuit board inkjet line data are matched to determine the automatic alignment result of the double-sided inkjet line of the ceramic circuit board.

4. The method for automatic alignment and synchronous detection of double-sided inkjet circuits on a ceramic circuit board according to claim 1, wherein: Fine-tuning of ceramic circuit boards, including: Detect positioning holes on ceramic circuit boards using a high-precision camera and extract the center coordinates of positioning holes on ceramic circuit boards using image processing algorithms; According to the center coordinates of the positioning holes on the ceramic circuit board, the direction and distance that the ceramic circuit board alignment platform needs to move are calculated to determine the real-time deviation information; The real-time deviation information is sent to the servo driver, which sends a control signal to the servo motor and feeds back the real-time deviation information. The servo motor dynamically adjusts the alignment parameters and drives the ceramic circuit board alignment platform to accurately move to the target position, so that it can fine-tune the ceramic circuit board and form a closed-loop control. After the ceramic circuit board is aligned, it is fixed on the ceramic circuit board alignment platform by a fixture or vacuum adsorption device to ensure that the position of the ceramic circuit board is stable during the printing process.

5. The method for automatic alignment and synchronous detection of double-sided inkjet circuits on a ceramic circuit board according to claim 1, wherein: The servo driver sends control signals to the servo motor and feeds back real-time deviation information, allowing the servo motor to dynamically adjust alignment parameters, including: Obtaining a displacement deviation and a scaling deviation from the real-time deviation information; Designing a nozzle coordinate offset opposite to the displacement deviation as a coordinate adjustment parameter; Obtaining a line spacing deviation and a line length deviation from the scaled deviation, and calculating an adjustment amount of the nozzle speed based on the line spacing deviation and the line length deviation; Obtaining the second line spacing deviation at the adjusted nozzle speed, and calculating the adjustment amount of the nozzle pulse frequency; The servo motor dynamically adjusts the positioning parameters based on the coordinate adjustment parameters, the adjustment amount of the nozzle speed and the adjustment amount of the nozzle pulse frequency.

6. The method for automatic alignment and synchronous detection of double-sided inkjet circuits on a ceramic circuit board according to claim 1, wherein: Compare, analyze and identify the inkjet circuit data of ceramic circuit boards based on the positioning data of ceramic circuit boards, including: When the inkjet circuit data of the ceramic circuit board is within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is that the double-sided inkjet circuit of the ceramic circuit board has been automatically and accurately aligned; When the inkjet circuit data of the ceramic circuit board is not within the positioning data range of the ceramic circuit board, the automatic alignment result of the double-sided inkjet circuit of the ceramic circuit board is that the double-sided inkjet circuit of the ceramic circuit board is not automatically and accurately aligned. At this time, the ceramic circuit board alignment platform is driven to move by the servo motor to fine-tune the ceramic circuit board to achieve automatic and accurate alignment of the double-sided inkjet circuit of the ceramic circuit board.

7. The method for automatic alignment and synchronous detection of double-sided inkjet circuits on a ceramic circuit board according to claim 1, wherein: Synchronous inspection of ceramic circuit boards based on automated optical inspection, including: Based on automatic optical detection, a high-resolution CCD camera is used to monitor the double-sided inkjet circuit of the ceramic circuit board in real time and collect real-time image data of the ceramic circuit board; Preprocessing the real-time image data of the ceramic circuit board to determine the characteristic image data of the ceramic circuit board; Based on deep learning technology, a ceramic circuit board defect location and classification model is constructed, and the ceramic circuit board feature image data is input into the ceramic circuit board defect location and classification model. The ceramic circuit board feature image data is analyzed and identified according to the ceramic circuit board defect location and classification model, and the ceramic circuit board is simultaneously detected to determine the ceramic circuit board defect location and classification results; The defect location and classification results of the ceramic circuit board are recorded in the database to provide a basis for subsequent processing.

8. The method for automatic alignment and synchronous detection of double-sided inkjet circuits on a ceramic circuit board according to claim 7, characterized in that: The ceramic circuit board defect positioning and classification results include the location and type information of the ceramic circuit board defects; when defects are detected on the ceramic circuit board, the ceramic circuit board defects are automatically marked and an alarm is issued, and a ceramic circuit board maintenance and management plan is formulated in a timely manner to guide operators to perform maintenance and management on the defective ceramic circuit board.

9. The automatic alignment and synchronization detection method for double-sided inkjet circuits of a ceramic circuit board according to claim 8, characterized in that: The ceramic circuit board defect type information includes disconnection, short circuit, offset and uneven ink drop; For defects in ceramic circuit boards such as broken lines or uneven ink droplets, they can be corrected by manually filling ink or reprinting. Furthermore, by using a piezoelectric inkjet print head, the frequency and position of ink droplet ejection can be precisely controlled to achieve high-resolution circuit printing. Furthermore, the printing path can be optimized to ensure consistent printed circuits. For ceramic circuit board defects such as short circuit or offset, local repair is performed using a robotic arm or robot; The ceramic circuit boards after maintenance and management are subjected to automatic optical inspection again, and the maintenance and management effects of the ceramic circuit boards are verified based on the inspection results. The maintenance and management plan of the ceramic circuit boards is optimized based on the feedback of the inspection results, so that the defects of the ceramic circuit boards are completely resolved.

10. The method for automatic alignment and synchronous detection of double-sided inkjet circuits on a ceramic circuit board according to claim 7, wherein: Preprocessing of real-time image data of ceramic circuit boards, including: Denoising the ceramic circuit board real-time image data based on Gaussian filtering to remove Gaussian noise in the ceramic circuit board real-time image data while retaining edge information; Based on histogram equalization, the contrast of the real-time image data of the ceramic circuit board is enhanced to improve the image contrast in the real-time image data of the ceramic circuit board and highlight the details on the ceramic circuit board; and cropping non-critical areas of the ceramic circuit board real-time image data, scaling the image in the ceramic circuit board real-time image data to a specific resolution, and converting the color image into a grayscale image; The image in the ceramic circuit board real-time image data is segmented into foreground and background by setting a threshold, and the Canny operator is used to extract the boundary information of the ceramic circuit board, and the key features in the ceramic circuit board real-time image data are extracted to determine the ceramic circuit board feature image data.

Images