LED flexible display packaging method and flexible display product

Abstract

The invention provides an LED flexible display packaging method and a flexible display product, and the method comprises the steps: enabling an electrode surface of an LED chip to be overturned and bonded to a temporary substrate, and stripping an epitaxial wafer substrate to obtain a temporary light-emitting unit; the upper surface of the temporary light-emitting unit is coated with light shielding glue in a spinning mode, the light shielding glue on the side wall of the LED chip is reserved through etching, and an anti-light-interference LED chip is formed; picking up anti-light-interference LED chips, fixing the anti-light-interference LED chips on a glass substrate to form monochromatic light-emitting units, and vertically stacking the monochromatic light-emitting units with different light colors to obtain a stacked light-emitting structure; respectively welding the positive electrodes of the anti-light-interference LED chips to the positive electrode through holes of the corresponding light colors on the flexible resin carrier plate through the positive electrode through holes; and the negative electrodes of the anti-light-interference LED chips are jointly welded to the negative electrode through holes in the flexible resin carrier plate through the negative electrode through holes, so that the flexible display packaging structure capable of being bent is formed. The display device can have high pixel density, and the color mixing precision and the display effect of the display device can be improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display device packaging, and in particular to an LED flexible display packaging method and a flexible display product. Background Art

[0002] With the continuous development of display technology, new display devices are evolving towards high resolution, high brightness, low power consumption, and flexible bendability. As an important representative of the third generation of display technology, Micro LED has attracted widespread attention in wearable devices, AR / VR terminals, automotive displays, smartphones, and other fields due to its advantages such as high brightness, high contrast, fast response speed, and long life.

[0003] Existing Micro LED display panels primarily utilize the MiP (Micro / Mini LED in Package) packaging process, which involves arranging and combining RGB LED chips on a single plane and securing them to a rigid PCB substrate. While this approach offers certain advantages in production compatibility and modular design, it is difficult to increase pixel density per unit area, limiting the development of high-resolution display devices. Furthermore, color crosstalk between adjacent RGB chips can easily occur, impacting color mixing accuracy and display quality, and compromising optical contrast. Summary of the Invention

[0004] The embodiments of the present disclosure at least provide an LED flexible display packaging method and a flexible display product, which can enable the display device to have a higher pixel density and improve the color mixing accuracy and display effect of the display device.

[0005] The present disclosure provides a method for packaging an LED flexible display, including:

[0006] Flipping the electrode surface of the LED chip and bonding it to a temporary substrate, and peeling off the epitaxial wafer substrate of the LED chip to obtain a temporary light-emitting unit;

[0007] Spin-coating a light-shielding adhesive on the upper surface of the temporary light-emitting unit, and retaining the light-shielding adhesive on the sidewall of the LED chip by etching to form an anti-light-interference LED chip;

[0008] Pick up the anti-light interference LED chip and fix it on the glass substrate with the first positive electrode through hole and the first negative electrode through hole to form a single-color light-emitting unit, and vertically stack the single-color light-emitting units of different light colors to obtain a stacked light-emitting structure;

[0009] In the stacked light-emitting structure, the positive electrodes of each of the anti-light-interference LED chips are respectively welded to the second positive electrode through-holes of the corresponding light color on the flexible resin carrier through the first positive electrode through-holes; the negative electrodes of each of the anti-light-interference LED chips are collectively welded to the second negative electrode through-holes on the flexible resin carrier through the first negative electrode through-holes to form a bendable flexible display packaging structure.

[0010] In an optional embodiment, the electrode surface of the LED chip is flipped and bonded to a temporary substrate, and the epitaxial wafer substrate of the LED chip is peeled off to obtain a temporary light-emitting unit, which specifically includes:

[0011] Spin coating a weakly viscous silica gel material on the temporary substrate to form a temporary bonding layer, flipping the LED chip over and bonding the electrode surface to the temporary bonding layer;

[0012] Applying ultraviolet laser to the epitaxial wafer including the sapphire substrate and the U-GaN sacrificial layer to decompose the U-GaN sacrificial layer so as to separate the sapphire substrate from the LED chip;

[0013] The light-emitting surface of the LED chip is etched to remove residual Ga metal, thereby obtaining the temporary light-emitting unit.

[0014] In an optional embodiment, a light shielding glue is spin-coated on the upper surface of the temporary light-emitting unit, and the light shielding glue on the side wall of the LED chip is retained by etching to form an anti-light interference LED chip, specifically comprising:

[0015] Spin coating the light shielding glue covering the LED chip on the surface of the temporary substrate;

[0016] removing the light shielding glue on the surface of the temporary light emitting unit by dry etching to expose the light emitting surface of the LED chip;

[0017] A photoresist mask covering the light-emitting surface and a preset width range around the light-emitting surface is prepared on the light-emitting surface by a micro-nano process;

[0018] The light shielding glue not covered by the photoresist mask is removed by dry etching, and after cleaning the photoresist mask, the anti-light interference LED chip with the light shielding glue retained on the sidewall is obtained, wherein the thickness of the retained light shielding glue is the preset width.

[0019] In an optional embodiment, the anti-light interference LED chip is picked up and fixed on a glass substrate with a first positive electrode through hole and a first negative electrode through hole to form a monochrome light-emitting unit, specifically comprising:

[0020] Using a stamp transfer head with an adhesive material to press and bond with the temporary bonding layer, lifting the stamp transfer head with the anti-light interference LED chip to separate the anti-light interference LED chip from the temporary substrate, wherein the adhesiveness of the stamp transfer head is greater than that of the temporary bonding layer;

[0021] Transferring the stamp transfer head to the glass substrate, aligning the positive electrode of the anti-light-interference LED chip with the positive electrode pre-prepared on the glass substrate, aligning the negative electrode of the anti-light-interference LED chip with the negative electrode pre-prepared on the glass substrate, and then applying pressure and heating the stamp transfer head to fix the anti-light-interference LED chip on the glass substrate;

[0022] After the stamp transfer head cools down, the anti-light-interference LED chip is released to form the monochromatic light-emitting unit in which the anti-light-interference LED chip is connected to the glass substrate.

[0023] In an optional embodiment, vertically stacking the monochromatic light-emitting units of different light colors to obtain a stacked light-emitting structure specifically includes:

[0024] Obtaining the monochromatic light-emitting units emitting red, blue, and green light, and determining the top light-emitting unit, the middle light-emitting unit, and the bottom light-emitting unit according to the arrangement order of the different light colors indicated by the preset display requirements;

[0025] Pick up the top light-emitting unit and place it on the middle light-emitting unit, and bond it to the middle light-emitting unit through the organic bonding adhesive coated on the bottom of the glass substrate in the top light-emitting unit;

[0026] Picking up the bonded top light-emitting unit and the middle light-emitting unit, and bonding them to the bottom light-emitting unit through the organic bonding adhesive coated on the bottom of the glass substrate in the middle light-emitting unit;

[0027] Remove the glass substrate corresponding to the bottom light-emitting unit, align the positive electrode of the anti-light-interference LED chip in the bottom light-emitting unit with the second positive electrode through-hole of the corresponding light color, and align the negative electrode of the anti-light-interference LED chip with the second negative electrode through-hole and fix them on the flexible resin carrier to obtain the stacked light-emitting structure.

[0028] In an optional embodiment, the positive electrodes of the anti-light-interference LED chips are respectively welded to the second positive electrode through-holes of the corresponding light color on the flexible resin carrier through the first positive electrode through-holes; the negative electrodes of the anti-light-interference LED chips are welded to the second negative electrode through-holes on the flexible resin carrier through the first negative electrode through-holes, thereby forming a bendable flexible display packaging structure, which specifically includes:

[0029] A negative electrode having the second negative electrode through-hole and a positive electrode having the second positive electrode through-holes corresponding to red light, blue light, and green light are pre-prepared on the flexible resin carrier, wherein the second positive electrode through-hole corresponding to each light color is independently connected to the positive electrode;

[0030] Pass a wire through the first positive electrode through hole in the middle light-emitting unit and weld it to the second positive electrode through hole corresponding to the light color of the top light-emitting unit;

[0031] Welding the first positive electrode through hole in the middle light-emitting unit to the second positive electrode through hole corresponding to the light color of the middle light-emitting unit through a wire;

[0032] Welding the first positive electrode through hole in the bottom light-emitting unit to the second positive electrode through hole corresponding to the light color of the bottom light-emitting unit through a wire;

[0033] The first negative electrode through-holes in the top light-emitting unit, the middle light-emitting unit, and the bottom light-emitting unit are welded to the second negative electrode through-holes through wires to form the flexible display packaging structure.

[0034] In an optional embodiment, when the flexible display packaging structure is used to fold inward, the cross-sectional length corresponding to the glass substrate in the top light-emitting unit is greater than the cross-sectional length corresponding to the glass substrate in the middle light-emitting unit;

[0035] When the flexible display packaging structure is used to be folded outward, the cross-sectional length corresponding to the glass substrate in the top light-emitting unit is smaller than the cross-sectional length corresponding to the glass substrate in the middle light-emitting unit.

[0036] The present disclosure also provides a flexible display product, which is prepared by the LED flexible display packaging method described in any one of the above embodiments. The flexible display product includes:

[0037] A plurality of stacked light-emitting structures are provided on the flexible resin carrier;

[0038] Each of the stacked light-emitting structures is formed by stacking the monochrome light-emitting units corresponding to red, green and blue light colors in a vertical direction, wherein the monochrome light-emitting units include the anti-light interference LED chip with the light shielding glue spin-coated on the side wall of the LED chip;

[0039] In the stacked light-emitting structure, for the anti-light-interference LED chips included in the monochromatic light-emitting units located at the top and middle, the corresponding electrode surfaces are fixed on the glass substrate; for the anti-light-interference LED chips included in the monochromatic light-emitting units located at the bottom, the corresponding electrode surfaces are fixed on the flexible resin carrier.

[0040] The flexible resin carrier is pre-prepared with a positive electrode and a negative electrode corresponding to each light color. The positive electrode of each anti-light interference LED chip is welded to the second positive electrode through-hole of the corresponding light color on the flexible resin carrier through the first positive electrode through-hole; the negative electrode of each anti-light interference LED chip is welded to the second negative electrode through-hole on the flexible resin carrier through the first negative electrode through-hole.

[0041] An embodiment of the present disclosure also provides an electronic device, including: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory communicate through the bus, and when the machine-readable instructions are executed by the processor, the above-mentioned LED flexible display packaging method or the steps in any possible implementation of the above-mentioned LED flexible display packaging method are performed.

[0042] An embodiment of the present disclosure further provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the computer program executes the above-mentioned LED flexible display packaging method or the steps of any possible implementation of the above-mentioned LED flexible display packaging method.

[0043] The embodiments of the present disclosure also provide a computer program product, including a computer program / instruction, which, when executed by a processor, implements the above-mentioned LED flexible display packaging method, or the steps in any possible implementation of the above-mentioned LED flexible display packaging method.

[0044] The disclosed embodiments provide an LED flexible display packaging method and flexible display product. The method flips the electrode surface of an LED chip and bonds it to a temporary substrate, then peels off the epitaxial wafer substrate of the LED chip to obtain a temporary light-emitting unit. A light-shielding adhesive is spin-coated on the upper surface of the temporary light-emitting unit, and the light-shielding adhesive on the sidewalls of the LED chip is retained by etching to form an anti-light-interference LED chip. The anti-light-interference LED chip is then picked up and fixed on a glass substrate with a first positive electrode through-hole and a first negative electrode through-hole to form a single-color light-emitting unit. The single-color light-emitting units of different colors are vertically stacked to form a stacked light-emitting structure. In the stacked light-emitting structure, the positive electrode of each anti-light-interference LED chip is soldered to the second positive electrode through-hole of the corresponding color on a flexible resin carrier through the first positive electrode through-hole. The negative electrode of each anti-light-interference LED chip is soldered to the second negative electrode through-hole on the flexible resin carrier through the first negative electrode through-hole to form a flexible flexible display packaging structure. This method can provide a display device with a higher pixel density and improve the color mixing accuracy and display effect of the display device.

[0045] In order to make the above-mentioned objectives, features and advantages of the present disclosure more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present disclosure and, together with the specification, are used to illustrate the technical solutions of the present disclosure. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without inventive effort.

[0047] Figure 1 A flow chart of an LED flexible display packaging method provided by an embodiment of the present disclosure is shown;

[0048] Figure 2 Showing a top view, a bottom view and a front view of a glass substrate provided by an embodiment of the present disclosure;

[0049] Figure 3 1. It shows a top view, a bottom view and a front view of a flexible resin carrier provided by an embodiment of the present disclosure;

[0050] Figure 4 A schematic diagram of a flexible display product provided by an embodiment of the present disclosure is shown;

[0051] Figure 5A schematic diagram of an electronic device provided by an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0052] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. The components of the embodiments of the present disclosure generally described and shown in the drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present disclosure provided in the drawings is not intended to limit the scope of the disclosure for which protection is sought, but merely represents selected embodiments of the present disclosure. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present disclosure.

[0053] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0054] The term "and / or" herein simply describes an association relationship, indicating that three relationships can exist. For example, A and / or B can represent the existence of A alone, the simultaneous existence of A and B, and the existence of B alone. In addition, the term "at least one" herein refers to any combination of at least two of any one or more of a plurality of items. For example, "at least one of A, B, and C" can represent any one or more elements selected from the set consisting of A, B, and C.

[0055] Research has found that existing Micro LED display panels primarily utilize the MiP (Micro / Mini LED in Package) packaging process, whereby RGB LED chips are arranged and combined on a single plane and secured to a rigid PCB substrate. While this approach offers certain advantages in production compatibility and modular design, it is difficult to increase pixel density per unit area, limiting the development of high-resolution display devices. Furthermore, color crosstalk between adjacent RGB chips can easily occur, impacting color mixing accuracy and display quality, and disturbing optical contrast.

[0056] Based on the above research, the present disclosure provides an LED flexible display packaging method and flexible display product. The method flips the electrode surface of an LED chip and bonds it to a temporary substrate, then peels off the epitaxial wafer substrate of the LED chip to obtain a temporary light-emitting unit. A light-shielding adhesive is spin-coated on the upper surface of the temporary light-emitting unit, and the light-shielding adhesive on the sidewall of the LED chip is retained by etching to form an anti-light-interference LED chip. The anti-light-interference LED chip is picked up and fixed on a glass substrate with a first positive electrode through-hole and a first negative electrode through-hole to form a single-color light-emitting unit. The single-color light-emitting units of different light colors are vertically stacked to obtain a stacked light-emitting structure. In the stacked light-emitting structure, the positive electrode of each anti-light-interference LED chip is respectively soldered to the second positive electrode through-hole of the corresponding light color on the flexible resin carrier through the first positive electrode through-hole. The negative electrode of each anti-light-interference LED chip is collectively soldered to the second negative electrode through-hole on the flexible resin carrier through the first negative electrode through-hole to form a flexible display packaging structure. This method can enable the display device to have a higher pixel density and improve the color mixing accuracy and display effect of the display device.

[0057] To facilitate understanding of this embodiment, a detailed introduction is first given to a method for packaging an LED flexible display disclosed in an embodiment of the present disclosure. The execution subject of the method for packaging an LED flexible display provided in an embodiment of the present disclosure may be a machine or a robotic arm in an automated production line, controlled by a computer device with certain computing capabilities. The computer device may include, for example, a terminal device or a server or other processing device. The terminal device may be a user equipment (UE), a mobile device, a user terminal, a terminal, a cellular phone, a cordless phone, a personal digital assistant (PDA), a handheld device, a computing device, a vehicle-mounted device, a wearable device, etc. In some possible implementations, the method for packaging an LED flexible display may be implemented by a processor calling computer-readable instructions stored in a memory.

[0058] See also Figure 1 FIG. 1 is a flow chart of a method for packaging an LED flexible display according to an embodiment of the present disclosure, wherein the method includes steps S101 to S104, wherein:

[0059] S101 , flipping the electrode surface of the LED chip and bonding it to a temporary substrate, and peeling off the epitaxial wafer substrate of the LED chip to obtain a temporary light-emitting unit.

[0060] In this step, it is necessary to peel the light-emitting chip in the original LED epitaxial wafer from the rigid substrate (such as sapphire) used for its growth and flip the electrode surface downward to provide structural and directional preparation for subsequent bonding, packaging, and vertical stacking.

[0061] Here, the LED chip includes, from bottom to top: a sapphire substrate, a rigid base for MOCVD epitaxial growth; an AlN buffer layer and a U-GaN sacrificial layer, which have laser decomposition characteristics; a p-type GaN / n-type GaN active area; and a metal electrode (P / N pole), which is located at the top layer of the device.

[0062] In a specific implementation, a weakly viscous silicone material is spin-coated on a temporary substrate to form a temporary bonding layer. The LED chip is flipped over and the electrode surface is bonded to the temporary bonding layer. Ultraviolet laser is applied to the epitaxial wafer including the sapphire substrate and the U-GaN sacrificial layer to decompose the U-GaN sacrificial layer so that the sapphire substrate and the LED chip are separated. The light-emitting surface of the LED chip is etched to remove residual Ga metal to obtain a temporary light-emitting unit.

[0063] Here, a temporary bonding layer is formed by spin coating on the surface of an optical glass sheet. This layer is usually PDMS (polydimethylsiloxane) or other silicone materials with weak adhesion, and the thickness range is generally 5 to 100 μm, which ensures that the chip is temporarily fixed and can be peeled off later. The epitaxial wafer is flipped so that its electrode surface faces downward and is aligned and bonded to the temporary bonding layer. At this time, the sapphire substrate faces up and the electrode surface faces down, and the flip is completed. An ultraviolet laser (wavelength 248nm or 266nm) is used to scan one side of the sapphire, and the laser is irradiated to the U-GaN sacrificial layer through the sapphire substrate: the laser energy produces instantaneous heating and decomposition reaction U-GaN→Ga (metal) + N2 (gas) in the sacrificial layer. The decomposition reaction destroys the adhesion between GaN and sapphire, realizing the overall peeling of the sapphire substrate, retaining the LED chip structure with the electrode surface facing down, and forming a temporary light-emitting unit.

[0064] Among them, since the decomposition reaction will leave metal Ga impurities on the surface of the LED chip, the chip surface can be wet pickled (such as HCl, H2SO4) or dry etched (such as ICP) to remove the residue and restore the cleanliness of the light-emitting surface.

[0065] Here, after the processing is completed, the temporary light-emitting unit has its electrode facing down, facing the temporary glass substrate, and the light-emitting surface facing up. The exposed chip active area is visible, and the chip body is stably fixed on the surface of the temporary glass substrate, which is convenient for subsequent spin coating of light shielding glue, etching, transfer and other operations.

[0066] Optionally, sapphire may be used as the temporary substrate.

[0067] In this way, LLO non-contact peeling technology is used without mechanical stress damage; the flipped structure matches the subsequent vertical stacking and electrode welding direction; transparent glass is used as a temporary substrate to facilitate subsequent alignment and picking; the temporary bonding material can be subsequently heated or solvent debonded to facilitate stamp transfer.

[0068] S102 , spin-coating a light-shielding adhesive on the upper surface of the temporary light-emitting unit, and retaining the light-shielding adhesive on the sidewall of the LED chip by etching to form an anti-light-interference LED chip.

[0069] In this step, because the RGB LED chips are stacked vertically to achieve full-color illumination, any lateral light leakage or interference between the individual LED light sources can lead to color distortion, reduced contrast, and other issues. Therefore, it's necessary to optically isolate the sidewalls of the LED chips. By retaining light-shielding adhesive on these sidewalls, this creates an anti-light-interference LED chip and suppresses light crosstalk.

[0070] Here, this step is based on the temporary light-emitting unit obtained in the previous step. Its structure includes the chip electrode facing down and fixed on a temporary glass substrate; the light-emitting surface facing up and exposed for processing; the chip sidewalls are also fully accessible, facilitating spin coating and etching processing.

[0071] In a specific implementation, a light-shielding glue covering the LED chip is spin-coated on the surface of a temporary substrate; the light-shielding glue on the surface of the temporary light-emitting unit is removed by dry etching to expose the light-emitting surface of the LED chip; a photoresist mask covering the light-emitting surface and a preset width range around the light-emitting surface is prepared on the light-emitting surface by a micro-nano process; the light-shielding glue not covered by the photoresist mask is removed by dry etching, and after cleaning the photoresist mask, an anti-light-interference LED chip with light-shielding glue retained on the side walls is obtained, wherein the thickness of the retained light-shielding glue is a preset width.

[0072] Here, light shielding glue (black shielding glue or black glue) is spin-coated on the surface of the temporary light-emitting unit. The material has strong light absorption and thermal stability. Typical materials are: epoxy resin containing carbon black filler, polyimide system or nanoparticle modified organic glue. The thickness of the glue layer is controlled at 2 to 5 μm, which can cover the chip surface and the surrounding side walls.

[0073] Among them, the first step is dry etching (exposing the light-emitting surface), and the entire upper surface is plasma-etched using ICP (inductively coupled plasma) etching technology. Since the light-emitting surface is located at the top, during the vertical etching process, the light-shielding glue is removed layer by layer from the top of the chip, and eventually the light-emitting surface is completely exposed, while part of the light-shielding glue is still retained on the vertical side walls around the chip. A layer of photoresist is spin-coated on the light-emitting surface after debonding, and photolithography exposure and development are performed to obtain a set of patterned photolithography masks that cover the LED light-emitting surface and the surrounding preset width area. The mask structure can accurately define the area that needs to be protected to improve the uniformity and boundary control of the sidewall shielding glue retention. The second step of dry etching (sidewall directional control) is to perform ICP etching again to remove the residual light-shielding glue in the area not protected by the photoresist. After the etching is completed, the light-emitting surface at the top of the chip and its adjacent areas are clean and glue-free, while the vertical side walls still retain a circle of light-shielding tape with a width of about 2μm.

[0074] Furthermore, the residual photoresist is removed using a solvent or plasma method, ultimately obtaining an LED chip with a sidewall shielding structure, i.e., an anti-light interference LED chip. When multiple LED chips are processed in parallel, the LED chips are separated after the channels are etched by ICP.

[0075] In this way, the light-shielding glue forms a black light-absorbing band on the side wall of the LED chip, effectively blocking the lateral light leakage between the light-emitting units in the vertical stack, significantly improving the color purity and display contrast of the packaged pixels. This structure can match the subsequent glass substrate packaging and electrode lead design, and has good process compatibility.

[0076] S103 , picking up the anti-light interference LED chip and fixing it on a glass substrate with a first positive electrode through-hole and a first negative electrode through-hole to form a monochromatic light-emitting unit, and vertically stacking the monochromatic light-emitting units of different light colors to obtain a stacked light-emitting structure.

[0077] In this step, anti-light-interference LED chips of different colors (red, green, and blue) are fixed sequentially to a glass substrate with through holes to form multiple monochrome light-emitting units, which are further stacked vertically along the Z-axis to form a stacked light-emitting structure with three-color mixing capability, thereby greatly improving the pixel density and achieving LED high-resolution color display.

[0078] In a specific implementation, a stamp transfer head with a sticky material is used to apply pressure and bond to a temporary bonding layer, and the stamp transfer head is lifted with the anti-light-interference LED chip to separate the anti-light-interference LED chip from the temporary substrate, wherein the stickiness of the stamp transfer head is greater than that of the temporary bonding layer; the stamp transfer head is transferred to a glass substrate, and the positive electrode of the anti-light-interference LED chip is aligned with the positive electrode pre-prepared on the glass substrate, and the negative electrode of the anti-light-interference LED chip is aligned with the negative electrode pre-prepared on the glass substrate, and then the stamp transfer head is pressurized and heated to fix the anti-light-interference LED chip on the glass substrate; after the stamp transfer head cools down, the anti-light-interference LED chip is released to form a monochrome light-emitting unit in which the anti-light-interference LED chip is connected to the glass substrate.

[0079] Here, a micro-nano stamp transfer head with a PDMS or polyurethane adhesive surface is used to align the anti-light interference LED chip fixed on a temporary glass substrate, and a slight pressure (10-1000g / cm 2 ), make the sticky surface of the stamp transfer head fit with the top of the chip, slowly lift the transfer head to separate the chip from the temporary substrate and move it with the stamp head. Align the stamp head with the target glass substrate, which has a first positive electrode through-hole (connected to the P pole) and a first negative electrode through-hole (connected to the N pole), and align the chip electrode and the glass substrate electrode through an optical system or a microscope platform. Apply heat and pressure (such as heating to 25-300 ° C, pressure 10-5000 g / cm 2) to achieve bonding. After cooling to room temperature, slowly lift the transfer head to complete the chip release. This process forms a complete single-color light-emitting unit (including chip + glass substrate + through-hole structure).

[0080] As a possible implementation, see Figure 2 As shown, there are a top view, a bottom view and a front view of a glass substrate provided in an embodiment of the present disclosure. The glass substrate is used as a substrate for the interlayer of the light-emitting unit, and P and N electrodes are made on the glass substrate and then connected to the through-hole. The metal structure of the through-hole material includes but is not limited to Au / Sn, Au / In and other metal materials that can form intermetallic compounds. The silicone bonding adhesive is coated on the back of the glass substrate (black dotted line) using inkjet printing technology or nanoimprinting technology to fix the LED chip. The silicone bonding adhesive is coated on the back of the glass substrate, exposing the through-hole for wiring. The P electrode on the left is independently controlled, so there can be multiple through-holes. Only one through-hole is shown here as an example.

[0081] It should be noted that when the flexible display package structure is folded inward, the cross-sectional length of the glass substrate in the top light-emitting unit is greater than that of the glass substrate in the middle light-emitting unit; when the flexible display package structure is folded outward, the cross-sectional length of the glass substrate in the top light-emitting unit is less than that of the glass substrate in the middle light-emitting unit. This is used to design the device's bending angle, but to prevent the chip from falling off, the bending angle should not be too large.

[0082] Furthermore, monochrome light-emitting units with red, blue and green light colors are obtained, and the top light-emitting unit, the middle light-emitting unit and the bottom light-emitting unit are determined according to the arrangement order of different light colors indicated by the preset display requirements; the top light-emitting unit is picked up and placed on the middle light-emitting unit, and bonded to the middle light-emitting unit through the organic solid crystal glue coated on the bottom of the glass substrate in the top light-emitting unit; the top light-emitting unit and the middle light-emitting unit after the bonded connection are picked up, and bonded to the bottom light-emitting unit through the organic solid crystal glue coated on the bottom of the glass substrate in the middle light-emitting unit; the glass substrate corresponding to the bottom light-emitting unit is removed, and the positive electrode of the anti-light-interference LED chip in the bottom light-emitting unit is aligned with the second positive electrode through-hole of the corresponding light color, and the negative electrode of the anti-light-interference LED chip is aligned with the second negative electrode through-hole and fixed on the flexible resin carrier to obtain a stacked light-emitting structure.

[0083] In a specific implementation, the order of the three-color chips in the vertical stack is determined according to the display control strategy (for example, red → green → blue from bottom to top). Each monochrome light-emitting unit is independently prepared and includes an LED chip, a light-shielding sidewall, a glass substrate, and corresponding electrode through-holes. An optically transparent organic solid-state adhesive (such as a silane-modified epoxy resin) is spin-coated on the back of the glass substrate of the upper monochrome light-emitting unit, and the unit is lightly pressed and adhered to the LED chip of the lower unit. The solid-state adhesive is cured by heating (for example, 80-120°C for 10-60 minutes) to complete a firm bond. Repeat the above steps to complete the vertical combination of three monochrome light-emitting units to form an RGB three-color stacked light-emitting structure.

[0084] Here, each monochrome light-emitting unit includes an anti-light interference LED chip (red light / green light / blue light), a glass substrate for fixing the chip, a first positive electrode through-hole and a first negative electrode through-hole for electrode lead-out, and a black light-shielding glue retained on the side wall of the chip to avoid light interference during stacking. According to the light-emitting direction requirements in the product design (such as upward light or downward light) or the mixed light optimization strategy, the stacking order of red light, green light, and blue light is set. For example, if the "green-red-blue" sequence is adopted, the green light is at the bottom, the red light is in the middle, and the blue light is at the top. Each monochrome light-emitting unit is named: bottom light-emitting unit, middle light-emitting unit, top light-emitting unit.

[0085] Among them, pick up the top light-emitting unit, and spin-coat a layer of transparent organic solid crystal glue (such as UV-curing silicone) on the bottom of its glass substrate, and place it precisely above the LED chip of the middle light-emitting unit. After adjusting the alignment, pressure is applied to bond them to form a bonding pair, and heat or ultraviolet irradiation is used to cure the solid crystal glue to form a firm bonding structure between the upper and lower units.

[0086] Furthermore, the aforementioned "top + middle" double-layer structure that has been bonded is picked up, and the die-bonding adhesive is spin-coated on the bottom of the glass substrate corresponding to the middle light-emitting unit, and it is placed above the LED chip of the bottom light-emitting unit to complete the assembly of the three-layer vertical stacking structure. The adhesive layer is heated or irradiated again to ensure stable bonding of the overall structure.

[0087] Here, since the bottom light-emitting unit ultimately needs to be directly fixed to the flexible resin carrier, its glass substrate will hinder welding. Therefore, laser stripping, chemical etching, or mechanical removal are used to completely remove the glass substrate of the bottom light-emitting unit, exposing the positive and negative electrode surfaces of the underlying anti-light interference LED chip in preparation for subsequent welding.

[0088] The flexible resin substrate is prefabricated with three sets of second positive electrode through-holes, corresponding to the RGB colors, and one set of shared second negative electrode through-holes. The positive and negative electrodes of the LED chips in the bottom light-emitting unit are aligned with the through-holes on the flexible resin substrate, with the positive electrodes aligned with the corresponding second positive electrode through-holes and the negative electrodes aligned with the shared second negative electrode through-holes. Gold wire bonding or eutectic bonding are then used to electrically connect the chip electrodes to the substrate through-holes. Once soldered, the entire stacked light-emitting structure is securely fixed to the flexible resin substrate.

[0089] As a possible implementation, see Figure 3 As shown, there are a top view, a bottom view and a main view of a flexible resin carrier provided by an embodiment of the present disclosure. The flexible resin carrier is used as the substrate of the bottom layer of the light-emitting unit. P and N electrodes are made on the flexible resin carrier and then connected to the through-hole. The metal structure of the through-hole material includes but is not limited to metal materials such as Au / Sn, Au / In, etc. that can form intermetallic compounds. Unlike the glass substrate, the flexible resin carrier accommodates three P electrode through-holes at the same time, which respectively control the RGB three-color light-emitting units. The electrode wiring is on the back of the substrate and connected to the driver IC chip. In addition, a layer of ~2μm high heat dissipation mixed phase change silicone material will be spin-coated on the back of the flexible resin carrier, which is insulated to enhance heat dissipation. The inner wall of the through-hole is filled with metal material for conductivity.

[0090] It should be noted that due to the vertical stacking design, the P-PAD and N-PAD regions of the LED chip's light-emitting units partially block light. Therefore, the PAD design area should not be too large, accounting for approximately one-third of the total chip area. After PN conduction, light is emitted from the substrate, but due to the PAD's obstruction, the effective light-emitting area accounts for approximately two-thirds of the LED area. This ratio is for example only; the specific PAD design size can be set according to actual needs and is not specifically limited here.

[0091] In this way, the three-color light-emitting units can be precisely stacked in the vertical direction, significantly improving the pixel density. The chips are connected with transparent die-bonding glue without affecting the luminous efficiency. The chip electrodes are accurately led out through the through-holes in the glass substrate, which is convenient for subsequent welding to the flexible resin carrier. The black light-shielding side walls are retained to effectively suppress cross-light and interference and improve display clarity.

[0092] S104. In the stacked light-emitting structure, the positive electrodes of the anti-light-interference LED chips are respectively welded to the second positive electrode through-holes of the corresponding light colors on the flexible resin carrier through the first positive electrode through-holes; the negative electrodes of the anti-light-interference LED chips are collectively welded to the second negative electrode through-holes on the flexible resin carrier through the first negative electrode through-holes to form a bendable flexible display packaging structure.

[0093] In this step, precise electrical connection is completed between the three-layer anti-light interference LED chip and the flexible resin carrier, independent drive control of the RGB three-color chips and common circuit negative grounding are realized, and an overall packaging structure with flexible bending capability is constructed, providing a basis for the integration of high-density flexible display modules.

[0094] In a specific implementation, a negative electrode with a second negative electrode through hole and a positive electrode with second positive electrode through holes corresponding to red light, blue light and green light are pre-prepared on a flexible resin carrier, wherein the second positive electrode through hole corresponding to each light color is independently connected to the positive electrode; the first positive electrode through hole in the top light-emitting unit is passed through the first positive electrode through hole in the middle light-emitting unit through a wire and welded to the second positive electrode through hole corresponding to the light color of the top light-emitting unit; the first positive electrode through hole in the middle light-emitting unit is welded to the second positive electrode through hole corresponding to the light color of the middle light-emitting unit through a wire; the first positive electrode through hole in the bottom light-emitting unit is welded to the second positive electrode through hole corresponding to the light color of the bottom light-emitting unit through a wire; the first negative electrode through hole in the top light-emitting unit, the middle light-emitting unit and the bottom light-emitting unit are welded to the second negative electrode through hole through a wire to form a flexible display packaging structure.

[0095] Here, each LED chip is fixed on an independent glass substrate, and its electrodes are led out through the first positive electrode through-hole and the first negative electrode through-hole of the glass substrate. The flexible resin carrier (such as BT resin) is preset with a second positive electrode through-hole corresponding to the RGB light colors (connected to the P poles of R / G / B respectively), and a common second negative electrode through-hole (connected to the N poles of the three chips). Each through-hole is pre-filled with metal (such as Au / Sn) to enhance the conductivity and welding reliability.

[0096] Each layer of anti-light-interference LED chips connects its P-electrode through the first positive electrode through-hole on its glass substrate. In the stacked structure, gold wires pass through the through-holes of the previous layer, guiding the electrode signals to the chips below layer by layer. The P-electrode leads of each RGB chip are ultimately soldered to the second positive electrode through-hole on the flexible substrate corresponding to the light color. For example, the positive electrode of a blue chip is connected to the second blue positive electrode through-hole, ensuring that each color chip can be independently dimmed and driven.

[0097] Among them, the negative electrodes of all anti-light interference LED chips are also led out through the first negative electrode through-holes of their respective glass substrates. The N-pole gold wires of the three chips are gathered together in a co-linear manner and finally welded to the second negative electrode through-holes on the flexible carrier board, realizing a common negative electrode circuit for the three-color chips and simplifying the drive circuit design.

[0098] It should be noted that the diameter of the gold wire can be controlled at ≤10μm, and the joining is completed by ball bonding + hot pressing welding. The welding area of ​​the flexible carrier is metallized to improve the strength and conductive stability of the solder joint. After welding is completed, epoxy encapsulation glue can be used to fill and seal the connection area to further improve environmental adaptability and mechanical stability.

[0099] In this way, through the above connection steps, a complete flexible display packaging structure is formed, which has independent drive control for red, green and blue, a clear and distinct through-hole electrode conduction path, and can be bent forward or reverse along the stacking direction.

[0100] The disclosed embodiments provide a method for packaging LED flexible displays. The method flips the electrode surface of an LED chip and bonds it to a temporary substrate, then peels off the epitaxial wafer substrate of the LED chip to obtain a temporary light-emitting unit. A light-shielding adhesive is spin-coated on the upper surface of the temporary light-emitting unit, and the light-shielding adhesive on the sidewalls of the LED chip is retained by etching to form an anti-light-interference LED chip. The anti-light-interference LED chip is then picked up and fixed on a glass substrate with a first positive electrode through-hole and a first negative electrode through-hole to form a single-color light-emitting unit. The single-color light-emitting units of different colors are vertically stacked to form a stacked light-emitting structure. In the stacked light-emitting structure, the positive electrode of each anti-light-interference LED chip is soldered to the second positive electrode through-hole of the corresponding color on a flexible resin carrier through the first positive electrode through-hole. The negative electrode of each anti-light-interference LED chip is soldered to the second negative electrode through-hole on the flexible resin carrier through the first negative electrode through-hole to form a flexible, flexible display packaging structure. This method can provide a display device with a higher pixel density and improve the color mixing accuracy and display effect of the display device.

[0101] Those skilled in the art will understand that in the above-mentioned method of the specific implementation method, the writing order of each step does not mean a strict execution order and does not constitute any limitation on the implementation process. The specific execution order of each step should be determined by its function and possible internal logic.

[0102] Based on the same inventive concept, the embodiments of the present disclosure also provide a flexible display product prepared using the LED flexible display packaging method. Since the principle of solving the problem by the flexible display product in the embodiments of the present disclosure is similar to the above-mentioned LED flexible display packaging method in the embodiments of the present disclosure, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be repeated.

[0103] See also Figure 4 , Figure 4 Schematic diagram of a flexible display product provided by an embodiment of the present disclosure. Figure 4As shown in the figure, the flexible display product includes: a plurality of stacked light-emitting structures arranged on a flexible resin carrier; each stacked light-emitting structure is formed by stacking monochrome light-emitting units corresponding to red, green and blue light colors in a vertical direction, wherein the monochrome light-emitting unit includes an anti-light-interference LED chip with a light-shielding glue spin-coated on the side wall of the LED chip; in the stacked light-emitting structure, for the anti-light-interference LED chips included in the monochrome light-emitting units located at the top and the middle, the corresponding electrode surfaces are fixed on the glass substrate; for the anti-light-interference LED chips included in the monochrome light-emitting units located at the bottom, the corresponding electrode surfaces are fixed on the flexible resin carrier; positive electrodes and a negative electrode corresponding to each light color are pre-prepared on the flexible resin carrier, and the positive electrode of each anti-light-interference LED chip is respectively welded to the second positive electrode through-hole of the corresponding light color on the flexible resin carrier through the first positive electrode through-hole; the negative electrode of each anti-light-interference LED chip is welded to the second negative electrode through-hole on the flexible resin carrier through the first negative electrode through-hole.

[0104] In a specific implementation, the flexible display product includes multiple stacked light-emitting structures disposed on a flexible resin carrier. Each stacked light-emitting structure consists of three vertically stacked layers of single-color light-emitting units, each emitting red, green, and blue light. Each single-color light-emitting unit includes an anti-light-interference LED chip and a glass substrate for securing the chip. The anti-light-interference LED chip has a light-shielding adhesive spin-coated on its sidewalls to suppress lateral light interference between adjacent chips, thereby improving color mixing purity and display contrast.

[0105] Here, in each stacked light-emitting structure, the LED chips of the monochrome light-emitting units located at the top and middle have their electrode surfaces facing downward and are fixed on the corresponding glass substrates; the glass substrate of the monochrome light-emitting unit located at the bottom is removed in a subsequent step, and the electrode surface of its LED chip is directly fixed on the flexible resin carrier to achieve reliable electrical connection with the carrier.

[0106] Here, the flexible resin carrier is pre-configured with multiple electrode through-holes, including second positive electrode through-holes corresponding to red, green, and blue light, and a shared second negative electrode through-hole. The positive electrode of each anti-light-interference LED chip is individually led out through the first positive electrode through-hole on its glass substrate and soldered to the second positive electrode through-hole of the corresponding color on the flexible resin carrier. The negative electrodes of all anti-light-interference LED chips are collectively led out through the first negative electrode through-hole on their respective glass substrates and soldered to the second negative electrode through-hole on the flexible resin carrier.

[0107] This structure enables independent electrical control and shared grounding between each light-emitting unit, allowing each stacked light-emitting structure to independently adjust the intensity of red, green, and blue light, thereby achieving a flexible display with high brightness, high contrast, and excellent color reproduction. The entire package structure has a low thickness, transparent interlayer adhesive, and the carrier board, composed of flexible materials such as BT resin or polyimide, has good mechanical flexibility and can adapt to complex morphing requirements such as curling and bending.

[0108] This flexible display product is manufactured based on the above-mentioned flexible packaging method. Its core lies in: using multiple groups of RGB stacked light-emitting structures to construct unit pixels, and each pixel point is electrically driven by a through-hole connection structure and a flexible resin carrier board, achieving the technical goals of high pixel density, bendable display, and full-color independent control.

[0109] Here, the main body of the flexible resin carrier is BT resin or polyimide material, which has bendability and thermal stability. Its surface is prefabricated with three groups of second positive electrode through holes for red light, green light, and blue light driving, respectively, and a group of common second negative electrode through holes. The through holes are filled with metal materials (such as Au / Sn) to achieve welding and conduction of chip leads.

[0110] Here, multiple stacked light-emitting structures are arranged on the flexible resin carrier, and each stacked structure is composed of three monochrome light-emitting units stacked vertically, specifically red light anti-light-interference LED chip + glass substrate; green light anti-light-interference LED chip + glass substrate; blue light anti-light-interference LED chip + glass substrate.

[0111] Each single-color light-emitting unit consists of an LED chip and the glass substrate to which it is attached. The sidewalls of each LED chip are coated with black light-shielding adhesive to form an anti-light interference structure. The shielding adhesive effectively blocks lateral light crosstalk between the chips of each color in the vertical stack, improving display contrast. In each stacked structure, the LED chips of the top light-emitting unit (e.g., blue light) and the middle light-emitting unit (e.g., red light) are fixed to their corresponding glass substrates with their electrodes facing downward. The bottom light-emitting unit (e.g., green light) has its glass substrate removed, and the electrode surface of its LED chip is directly fixed to the flexible resin carrier for electrical connection.

[0112] Furthermore, the positive electrode of each anti-light-interference LED chip is led out through the first positive electrode through-hole in the glass substrate where it resides and connected via soldering to the second positive electrode through-hole corresponding to its color in the flexible resin carrier: blue light chip → blue light second positive electrode; red light chip → red light second positive electrode; green light chip → green light second positive electrode. The negative electrode of each anti-light-interference LED chip is also led out through the first negative electrode through-hole and then soldered together with gold wire to the shared second negative electrode through-hole in the flexible resin carrier, achieving a circuit structure in which multiple chips share a common negative electrode and are driven by independent positive electrodes.

[0113] It should be noted that due to the small thickness of the stacked structure and the controllable glue layer between units, the structure supports bending inward or outward, and the area and layout of the glass substrate can be designed to be asymmetric, thereby guiding the bending deformation behavior of the overall pixel points; this display product can be widely used in wearable devices, flexible mobile phones, curled displays, automotive curved displays and other scenarios.

[0114] The flexible display product provided by the present application includes: a plurality of stacked light-emitting structures disposed on a flexible resin carrier; each stacked light-emitting structure is formed by vertically stacking monochromatic light-emitting units corresponding to red, green, and blue light colors, wherein the monochromatic light-emitting units include anti-light-interference LED chips with light-shielding adhesive spin-coated on the sidewalls of the LED chips; in the stacked light-emitting structures, the corresponding electrode surfaces of the anti-light-interference LED chips included in the monochromatic light-emitting units located at the top and middle are fixed to the glass substrate; the corresponding electrode surfaces of the anti-light-interference LED chips included in the monochromatic light-emitting units located at the bottom are fixed to the flexible resin carrier; the flexible resin carrier is pre-prepared with a positive electrode and a negative electrode corresponding to each light color; the positive electrode of each anti-light-interference LED chip is respectively welded to the second positive electrode through-hole of the corresponding light color on the flexible resin carrier through the first positive electrode through-hole; and the negative electrode of each anti-light-interference LED chip is welded to the second negative electrode through-hole of the flexible resin carrier through the first negative electrode through-hole. This can achieve a higher pixel density and improve color mixing accuracy and display quality.

[0115] Corresponding to Figure 1 The LED flexible display packaging method in the present disclosure also provides an electronic device 500, such as Figure 5 FIG. 5 is a schematic structural diagram of an electronic device 500 provided in an embodiment of the present disclosure, including:

[0116] Processor 51, memory 52, and bus 53; memory 52 is used to store execution instructions, including memory 521 and external memory 522; the memory 521 here is also called internal memory, which is used to temporarily store the operation data in the processor 51 and the data exchanged with the external memory 522 such as the hard disk. The processor 51 exchanges data with the external memory 522 through the memory 521. When the electronic device 500 is running, the processor 51 and the memory 52 communicate through the bus 53, so that the processor 51 executes Figure 1 The steps of the LED flexible display packaging method.

[0117] The present disclosure also provides a computer-readable storage medium having a computer program stored thereon. When executed by a processor, the computer program executes the steps of the LED flexible display packaging method described in the above method embodiment. The storage medium may be a volatile or non-volatile computer-readable storage medium.

[0118] The embodiment of the present disclosure also provides a computer program product, which includes computer instructions. When the computer instructions are executed by a processor, the steps of the LED flexible display packaging method described in the above method embodiment can be executed. For details, please refer to the above method embodiment, which will not be repeated here.

[0119] The computer program product may be implemented in hardware, software, or a combination thereof. In one embodiment, the computer program product is implemented as a computer storage medium. In another embodiment, the computer program product is implemented as a software product, such as a software development kit (SDK).

[0120] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. In the several embodiments provided in the present disclosure, it should be understood that the disclosed device and method can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the device or unit can be electrical, mechanical or other forms.

[0121] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0122] In addition, each functional unit in each embodiment of the present disclosure may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0123] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present disclosure, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present disclosure. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0124] Finally, it should be noted that the above-described embodiments are only specific implementation methods of the present disclosure, which are used to illustrate the technical solutions of the present disclosure, rather than to limit them. The scope of protection of the present disclosure is not limited thereto. Although the present disclosure has been described in detail with reference to the above-described embodiments, those skilled in the art should understand that any person skilled in the art can modify or easily conceive of changes to the technical solutions described in the above-described embodiments within the technical scope disclosed in the present disclosure, or replace some of the technical features therein with equivalents. Such modifications, changes, or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure, and should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure shall be subject to the scope of protection of the claims.

Claims

1. A LED flexible display packaging method, characterized in that: include: Flipping the electrode surface of the LED chip and bonding it to a temporary substrate, and peeling off the epitaxial wafer substrate of the LED chip to obtain a temporary light-emitting unit; Spin-coating a light-shielding adhesive on the upper surface of the temporary light-emitting unit, and retaining the light-shielding adhesive on the sidewall of the LED chip by etching to form an anti-light-interference LED chip; Pick up the anti-light interference LED chip and fix it on the glass substrate with the first positive electrode through hole and the first negative electrode through hole to form a single-color light-emitting unit, and vertically stack the single-color light-emitting units of different light colors to obtain a stacked light-emitting structure; In the stacked light-emitting structure, the positive electrodes of each of the anti-light-interference LED chips are respectively welded to the second positive electrode through-holes of the corresponding light color on the flexible resin carrier through the first positive electrode through-holes; the negative electrodes of each of the anti-light-interference LED chips are collectively welded to the second negative electrode through-holes on the flexible resin carrier through the first negative electrode through-holes to form a bendable flexible display packaging structure.

2. The method according to claim 1, characterized in that Flipping the electrode surface of the LED chip and bonding it to a temporary substrate, and peeling off the epitaxial wafer substrate of the LED chip to obtain a temporary light-emitting unit, specifically comprising: Spin coating a weakly viscous silica gel material on the temporary substrate to form a temporary bonding layer, flipping the LED chip over and bonding the electrode surface to the temporary bonding layer; Applying ultraviolet laser to the epitaxial wafer including the sapphire substrate and the U-GaN sacrificial layer to decompose the U-GaN sacrificial layer so as to separate the sapphire substrate from the LED chip; The light-emitting surface of the LED chip is etched to remove residual Ga metal, thereby obtaining the temporary light-emitting unit.

3. The method according to claim 1, characterized in that Spin-coating a light-shielding adhesive on the upper surface of the temporary light-emitting unit and retaining the light-shielding adhesive on the sidewall of the LED chip by etching to form an anti-light-interference LED chip specifically includes: Spin coating the light shielding glue covering the LED chip on the surface of the temporary substrate; removing the light shielding glue on the surface of the temporary light emitting unit by dry etching to expose the light emitting surface of the LED chip; A photoresist mask covering the light-emitting surface and a preset width range around the light-emitting surface is prepared on the light-emitting surface by a micro-nano process; The light shielding glue not covered by the photoresist mask is removed by dry etching, and after cleaning the photoresist mask, the anti-light interference LED chip with the light shielding glue retained on the sidewall is obtained, wherein the thickness of the retained light shielding glue is the preset width.

4. The method according to claim 2, characterized in that Picking up the anti-light interference LED chip and fixing it on a glass substrate with a first positive electrode through hole and a first negative electrode through hole to form a single-color light-emitting unit, specifically including: Using a stamp transfer head with an adhesive material to press and bond with the temporary bonding layer, lifting the stamp transfer head with the anti-light interference LED chip to separate the anti-light interference LED chip from the temporary substrate, wherein the adhesiveness of the stamp transfer head is greater than that of the temporary bonding layer; Transferring the stamp transfer head to the glass substrate, aligning the positive electrode of the anti-light-interference LED chip with the positive electrode pre-prepared on the glass substrate, aligning the negative electrode of the anti-light-interference LED chip with the negative electrode pre-prepared on the glass substrate, and then applying pressure and heating the stamp transfer head to fix the anti-light-interference LED chip on the glass substrate; After the stamp transfer head cools down, the anti-light-interference LED chip is released to form the monochromatic light-emitting unit in which the anti-light-interference LED chip is connected to the glass substrate.

5. The method according to claim 1, wherein The stacked light emitting structure is obtained by vertically stacking the monochromatic light emitting units of different light colors, specifically comprising: Obtaining the monochromatic light-emitting units emitting red, blue, and green light, and determining the top light-emitting unit, the middle light-emitting unit, and the bottom light-emitting unit according to the arrangement order of the different light colors indicated by the preset display requirements; Pick up the top light-emitting unit and place it on the middle light-emitting unit, and bond it to the middle light-emitting unit through the organic bonding adhesive coated on the bottom of the glass substrate in the top light-emitting unit; Picking up the bonded top light-emitting unit and the middle light-emitting unit, and bonding them to the bottom light-emitting unit through the organic bonding adhesive coated on the bottom of the glass substrate in the middle light-emitting unit; Remove the glass substrate corresponding to the bottom light-emitting unit, align the positive electrode of the anti-light-interference LED chip in the bottom light-emitting unit with the second positive electrode through-hole of the corresponding light color, and align the negative electrode of the anti-light-interference LED chip with the second negative electrode through-hole and fix them on the flexible resin carrier to obtain the stacked light-emitting structure.

6. The method according to claim 5, characterized in that The positive electrodes of the anti-light-interference LED chips are respectively welded to the second positive electrode through-holes of the corresponding light color on the flexible resin carrier through the first positive electrode through-holes; the negative electrodes of the anti-light-interference LED chips are welded to the second negative electrode through-holes on the flexible resin carrier through the first negative electrode through-holes, thereby forming a bendable flexible display packaging structure. Specifically, the structure includes: A negative electrode having the second negative electrode through-hole and a positive electrode having the second positive electrode through-holes corresponding to red light, blue light, and green light are pre-prepared on the flexible resin carrier, wherein the second positive electrode through-hole corresponding to each light color is independently connected to the positive electrode; Pass a wire through the first positive electrode through hole in the middle light-emitting unit and weld it to the second positive electrode through hole corresponding to the light color of the top light-emitting unit; Welding the first positive electrode through hole in the middle light-emitting unit to the second positive electrode through hole corresponding to the light color of the middle light-emitting unit through a wire; Welding the first positive electrode through hole in the bottom light-emitting unit to the second positive electrode through hole corresponding to the light color of the bottom light-emitting unit through a wire; The first negative electrode through-holes in the top light-emitting unit, the middle light-emitting unit, and the bottom light-emitting unit are welded to the second negative electrode through-holes through wires to form the flexible display packaging structure.

7. The method according to claim 5, characterized in that: When the flexible display packaging structure is used to be folded inward, the cross-sectional length of the glass substrate in the top light-emitting unit is greater than the cross-sectional length of the glass substrate in the middle light-emitting unit; When the flexible display packaging structure is used to be folded outward, the cross-sectional length corresponding to the glass substrate in the top light-emitting unit is smaller than the cross-sectional length corresponding to the glass substrate in the middle light-emitting unit.

8. A flexible display product, characterized in that: Prepared by the LED flexible display packaging method according to any one of claims 1 to 7, the flexible display product comprises: A plurality of stacked light-emitting structures are provided on the flexible resin carrier; Each of the stacked light-emitting structures is formed by stacking the monochrome light-emitting units corresponding to red, green and blue light colors in a vertical direction, wherein the monochrome light-emitting units include the anti-light interference LED chip with the light shielding glue spin-coated on the side wall of the LED chip; In the stacked light-emitting structure, for the anti-light-interference LED chips included in the monochromatic light-emitting units located at the top and middle, the corresponding electrode surfaces are fixed on the glass substrate; for the anti-light-interference LED chips included in the monochromatic light-emitting units located at the bottom, the corresponding electrode surfaces are fixed on the flexible resin carrier. The flexible resin carrier is pre-prepared with a positive electrode and a negative electrode corresponding to each light color. The positive electrode of each anti-light interference LED chip is welded to the second positive electrode through-hole of the corresponding light color on the flexible resin carrier through the first positive electrode through-hole; the negative electrode of each anti-light interference LED chip is welded to the second negative electrode through-hole on the flexible resin carrier through the first negative electrode through-hole.

9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor and the memory communicate via the bus, and when the machine-readable instructions are executed by the processor, the steps of the LED flexible display packaging method as described in any one of claims 1 to 7 are performed.

10. A computer-readable storage medium, characterized in that The computer readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the LED flexible display packaging method according to any one of claims 1 to 7 are executed.

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