Chip dismounting device and consumable box set

Abstract

The invention provides a chip dismounting device and a consumable box set, the chip dismounting device is used for dismounting a chip on a first consumable box, the chip dismounting device comprises a fixing seat and a dismounting assembly, the fixing seat is internally provided with a dismounting channel and a positioning part used for positioning the first consumable box, the dismounting channel and the positioning part are arranged in an intersecting mode, and the dismounting assembly is arranged on the fixing seat. The dismounting channel is provided with a communicating hole which is communicated with the positioning part; the disassembling assembly is movably arranged in the disassembling channel and comprises a disassembling part, at least part of the disassembling part is in an arc shape, and the disassembling part moves in the first direction and can make contact with the first consumable box through the communicating hole so as to disassemble the chip. The technical problem that when the chip is recycled and disassembled, the chip is prone to being damaged or cannot be stably disassembled is solved.

Description

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on January 21, 2025, with application number 202520149361.6 and application name “A chip disassembly device and consumable box set”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of recycling printing consumable chips, and in particular to a chip disassembly device and a consumable box set. Background Art

[0003] Ink cartridges are removably installed in electronic imaging devices. They typically contain a chip that stores information such as ink levels and cartridge model numbers. The electronic imaging device detects the chip and reads the stored information. When the ink in the cartridge is depleted, printing is no longer possible and a new cartridge must be replaced.

[0004] To avoid wasting resources, when the ink in the ink cartridge is completely consumed, the chip can be removed from the old cartridge and installed in a new cartridge for reuse. Existing techniques typically remove the chip along its edge to achieve chip recycling. However, this method is unstable and can easily damage the chip, leading to damage or instability in disassembly.

[0005] Therefore, there is an urgent need to solve the technical problem that chips are easily damaged or cannot be disassembled stably when they are disassembled for recycling. Summary of the Invention

[0006] The present application provides a chip disassembly device and a consumable box set to solve the technical problem that chips are easily damaged or cannot be disassembled stably when being disassembled for chip recycling.

[0007] In order to achieve the above-mentioned object, the present application provides a chip removal device for removing chips from a first consumable box, the chip removal device comprising:

[0008] A fixing seat, wherein the fixing seat has a disassembly passage and a positioning portion for positioning the first consumable material box, the disassembly passage and the positioning portion are intersected, the disassembly passage has a communication hole, and the communication hole is connected to the positioning portion;

[0009] A disassembly component is movably arranged in the disassembly channel, and the disassembly component includes a disassembly portion, at least a portion of which is arc-shaped. The disassembly portion moves along a first direction and can contact the first consumable box through the connecting hole to disassemble the chip component.

[0010] The present application provides a chip disassembly device, because at least part of the disassembly portion is Arc-shaped, The strength of the disassembly part itself can be enhanced, and uniform force distribution can be provided during the chip disassembly process, which can reduce the deformation of the disassembly part and improve the stability of the disassembly part, thereby improving the accuracy of the position for disassembling the chip and solving the problem of chip breakage or inability to cut off caused by unstable disassembly; in addition, the disassembly part is configured to move along the first direction to disassemble the chip, which can reduce the generation of debris during the disassembly process, prevent the debris from sticking to the chip during the disassembly process, and will not have an adverse effect on the secondary use of the chip.

[0011] In a possible implementation, the disassembly assembly further includes a force-applying portion, which is movably disposed in the disassembly channel and can drive the disassembly portion to move along a first direction.

[0012] In a possible implementation, the disassembly portion is movably connected to the force-applying portion, and the force-applying portion abuts against a top of the disassembly portion to drive the disassembly portion to move along the first direction.

[0013] In one possible implementation, the disassembly assembly further includes a locking member, which is connected to the force-applying portion; the force-applying portion can rotate relative to the locking member; the locking member can move along a first direction driven by the force-applying portion; and the disassembly portion is sleeved on the locking member.

[0014] In one possible implementation, the locking element includes:

[0015] A connecting piece, the disassembly portion is sleeved on the connecting piece, and the connecting piece is connected to the force-applying portion via an intermediate piece;

[0016] A stopper is connected to one end of the connecting member away from the force-applying portion, and the stopper is arranged away from the first consumable box in a second direction perpendicular to the first direction; and the stopper abuts against the disassembly portion.

[0017] In a possible implementation, the disassembly portion is fixedly connected to the force-applying portion and moves along with the force-applying portion.

[0018] In a possible implementation, the communication hole is located on a side wall of the disassembly channel, so that the disassembly channel is connected to the positioning portion and the chip is exposed in the disassembly channel;

[0019] The depth direction of the disassembly channel and the length direction of the chip both extend along the first direction.

[0020] In one possible implementation, a cavity is further provided in the fixing seat, the communication hole is provided at a lower end of the cavity, and the disassembly portion can pass through the communication hole and act on the first consumable box to separate the chip from the first consumable box;

[0021] A guide hole is further provided at the upper end of the cavity, and the disassembly channel is defined between the guide hole and the communicating hole.

[0022] In a possible implementation, the force-applying portion is connected to the inner wall surface of the disassembly channel via a thread.

[0023] In a possible implementation, the positioning portion includes two positioning cavities, which are arranged side by side and located on opposite sides of the disassembly channel respectively;

[0024] Furthermore, the two positioning cavities have different cavity widths to accommodate first consumable material boxes of different sizes.

[0025] In one possible implementation, along a second direction perpendicular to the first direction, the top of the positioning cavity is tilted downward so that the depth of the first consumable box extending into the disassembly channel gradually decreases along the first direction.

[0026] In a possible implementation, in a second direction perpendicular to the first direction, a cavity wall of the positioning cavity away from the disassembly component has an inclined guide portion;

[0027] The first consumables box abuts against the inclined guide portion, so that the chip is tilted toward one end of the inclined guide portion along the first direction.

[0028] In one possible implementation, the fixing seat includes:

[0029] a fixed body, the fixed body comprising a first baffle, a second baffle, and a third baffle, the first baffle and the second baffle being arranged opposite each other, the third baffle being connected to the same side of the first baffle and the second baffle, and the positioning cavity being formed between the first baffle, the second baffle, and the third baffle;

[0030] A disassembly guide portion is provided on a side of the first baffle and the second baffle relative to the third baffle, and the disassembly channel is formed in the disassembly guide portion.

[0031] In one possible implementation, the fixing seat further includes a first limiting portion, which is arranged on a side of the disassembly guide portion facing the positioning cavity, or the first limiting portion (36) is arranged on an outer wall surface of the disassembly guide portion (35); the first limiting portion abuts against the first consumable box to limit the position of the first consumable box in the positioning cavity.

[0032] In one possible implementation, the fixing seat also includes a second limiting portion, which is arranged on the inner wall surface of at least one of the first baffle and the second baffle facing the positioning cavity, and the second limiting portion is configured to abut against one end of the first consumable box so that the position of the chip assembly corresponds to the disassembly channel.

[0033] In one possible implementation, the positioning portion includes a mounting cavity and at least one adapter, and different adapters have different positioning cavities to adapt to different models of the first consumable box; and the mounting cavity can be adapted to one model of the first consumable box.

[0034] In one possible implementation, at least two positioning ribs are provided on a cavity wall of the mounting cavity on a side corresponding to the chip, and the at least two positioning ribs are spaced apart along the first direction and abut against the first consumable box or the adapter.

[0035] In one possible implementation, in a third direction perpendicular to the first direction, a snap-fit ​​component is connected to a side of the mounting cavity away from the disassembly channel, and the snap-fit ​​component abuts against the first consumable box or the adapter to limit the movement of the first consumable box in the third direction.

[0036] The present application also provides a consumable box set, comprising: a second consumable box; and the above-mentioned chip disassembly device.

[0037] A chip disassembly device provided in an embodiment of the present application can adapt to the positioning of first consumable boxes of different sizes, thereby being suitable for chip disassembly from first consumable boxes of various sizes, which can reduce the use of spare parts, reduce costs, and has wider applicability.

[0038] A chip disassembly device provided in an embodiment of the present application enables the disassembly portion to move along the length direction of the chip when the disassembly portion moves along a first direction to disassemble the chip, thereby helping to prevent disassembly debris from contaminating the electrical contact portion on the chip surface.

[0039] In addition to the technical problems solved by the embodiments of the present application described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by a chip disassembly device and consumable box set provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 A diagram showing the chip removal device in use according to the first embodiment of the present application;

[0042] Figure 2 An exploded view of the chip disassembly device and the first consumables box provided in Example 1 of the present application;

[0043] Figure 3 An exploded view of the chip disassembly device provided in the first embodiment of the application;

[0044] Figure 4 Another exploded view of the chip removal device provided in the first embodiment of the application;

[0045] Figure 5 A front view of the chip removal device provided in Example 1 of the present application;

[0046] Figure 6 A cross-sectional view of the chip disassembly device and the first consumables box provided in the first embodiment of the present application at the chip assembly position;

[0047] Figure 7 A cross-sectional view of the fixing base of the chip removal device provided in the first embodiment of the present application at the position of the communication hole;

[0048] Figure 8 A cross-sectional view of the chip disassembly device and the first consumables box provided in the first embodiment of the present application at the first limiting portion;

[0049] Figure 9 for Figure 8 A magnified view of the structure at point A;

[0050] Figure 10 Another cross-sectional view of the chip disassembly device provided in the first embodiment of the present application;

[0051] Figure 11 is a schematic diagram of the three-dimensional structure of a first consumables box;

[0052] Figure 12 A schematic diagram of the three-dimensional structure of the disassembly portion of the chip disassembly device provided in an embodiment of the present application;

[0053] Figure 13 for Figure 12 A cross-sectional view of the disassembled portion shown;

[0054] Figure 14 for Figure 13 A partial enlarged view of point C in the middle;

[0055] Figure 15 A schematic diagram of the three-dimensional structure of another disassembly portion of the chip disassembly device provided in an embodiment of the present application;

[0056] Figure 16 for Figure 15 A cross-sectional view of the disassembled portion shown;

[0057] Figure 17 A diagram showing a chip disassembly device in use according to the second embodiment of the present application;

[0058] Figure 18 This is another usage diagram of the chip removal device provided in the second embodiment of the present application;

[0059] Figure 19 A side view of a chip disassembly device and a first consumables box provided in the second embodiment of the present application;

[0060] Figure 20 for Figure 19 A cross-sectional view of the chip disassembly device and the first consumables box at the chip assembly position;

[0061] Figure 21 A side view of another chip disassembly device and a first consumables box provided in Example 2 of the present application;

[0062] Figure 22 for Figure 21 A cross-sectional view of the chip disassembly device and the first consumables box at the chip assembly position;

[0063] Figure 23 A side view of the chip disassembly device provided in the second embodiment of the present application;

[0064] Figure 24 A front view of the chip disassembly device provided in the second embodiment of the present application;

[0065] Figure 25 A cross-sectional structural diagram of the chip disassembly device and the first consumables box provided in the second embodiment of the present application at the first limiting portion;

[0066] Figure 26 A cross-sectional structural diagram of the chip disassembly device and the first consumables box provided in the second embodiment of the present application at the second limiting portion;

[0067] Figure 27 A cross-sectional structural diagram of the fixed body of the chip disassembly device provided in Example 2 of the present application at the position of the disassembly channel;

[0068] Figure 28 An exploded view of the chip disassembly device and the first consumables box provided in the second embodiment of the present application;

[0069] Figure 29 A schematic structural diagram of a locking member provided in Example 2 of the present application;

[0070] Figure 30 A schematic structural diagram of a disassembly assembly provided in Example 2 of the present application;

[0071] Figure 31 A schematic diagram of the structure of the chip disassembly device provided in Example 3 of the present application in a state of use;

[0072] Figure 32 This is a structural diagram of the first consumables box provided in Example 3 of the present application installed in the installation cavity;

[0073] Figure 33 This is a schematic structural diagram of the chip removal device provided in Example 3 of the present application in another usage state;

[0074] Figure 34 This is a schematic structural diagram of the chip removal device provided in the third embodiment of the present application in another usage state;

[0075] Figure 35 A cross-sectional structural diagram of the chip disassembly device provided in Example 3 of the present application at the disassembly channel position;

[0076] Figure 36 A cross-sectional structural diagram of the fixing base provided in the third embodiment of the present application at the position of the disassembly channel;

[0077] Figure 37 A schematic diagram of the structure of the fixing base provided in Example 3 of the present application;

[0078] Figure 38 for Figure 37 A partial enlarged schematic diagram of point B in the middle;

[0079] Figure 39 A schematic diagram of the structure of the adapter provided in Example 3 of the present application;

[0080] Figure 40 This is a structural diagram of the adapter and the first consumables box provided in Example 3 of the present application.

[0081] Description of reference numerals:

[0082] 10-first consumables box;

[0083] 11- housing;

[0084] 12- ink outlet;

[0085] 13-limited portion;

[0086] 14-handle;

[0087] 20-chip assembly;

[0088] 21-chip;

[0089] 22- bearing portion;

[0090] 3- positioning part;

[0091] 30-fixed seat;

[0092] 31- disassembly channel;

[0093] 32-positioning cavity; 321-inclined guide portion;

[0094] 33- communicating hole;

[0095] 34-Fixed body;

[0096] 341-first baffle;

[0097] 342 - second baffle; 3421 - contact portion; 3422 - recessed portion;

[0098] 343-third baffle;

[0099] 344- cavity; 3441- guide hole; 345- guide member; 346- bottom plate; 347- top plate;

[0100] 35-disassembly guide portion; 351-first disassembly guide portion; 352-second disassembly guide portion;

[0101] 36-first limiting portion;

[0102] 37- second limiting portion;

[0103] 38-installation cavity; 381-positioning rib; 382-clamping member; 3821-connecting section; 3822-bending section; 383-accommodating groove; 40-disassembly assembly;

[0104] 41- disassembly department;

[0105] 411-Blade;

[0106] 412-through cavity;

[0107] 413-Extension;

[0108] 42-force-applying part;

[0109] 421-operating handle;

[0110] 422- extension column;

[0111] 43-locking member; 431-connecting member; 4311-center hole; 432-stop platform; 4321-guide portion; 4322-abutting portion; 433-middle member;

[0112] 44-fixing parts;

[0113] 50-adapter; 51-avoidance portion; 52-opening portion. DETAILED DESCRIPTION

[0114] To make the objectives, technical solutions, and advantages of this application more clear, the technical solutions in this application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0115] The consumable box is an important component in the electronic imaging device. When the electronic imaging device is an inkjet printer, the corresponding consumable box is an ink cartridge that stores ink; when the electronic imaging device is a laser printer, the corresponding consumable box is a powder cartridge that stores toner, etc.

[0116] In order to store the manufacturer information, ink volume information, consumable box category information, ink color and other information of the consumable box, a chip is provided on the consumable box. The chip can be fixed to the supporting part of the consumable box by pasting, welding or other means. The chip is difficult to remove directly. The consumable box in this application takes the ink cartridge as an example. When the ink inside the ink cartridge is consumed and the electronic imaging device cannot print, in order to avoid waste of resources, the chip on the ink cartridge needs to be removed and installed on a new ink cartridge for reuse.

[0117] The chip removal device is a tool for removing chip components from the consumable box. Currently, a blade is usually used to remove the chip and the carrier supporting the chip from the consumable box along the edge of the chip. However, the disassembly stability is poor. The blade is easily deformed during the disassembly process, affecting the disassembly effect. There is also the problem of the chip being scratched and damaged, which affects the reuse of the chip.

[0118] In view of this, the present application provides a chip disassembly device, which can enhance the strength of the disassembly part itself because at least part of the disassembly part is in an arc shape, and provide uniform force distribution during the disassembly of the chip component, reduce the problem of deformation of the disassembly part, and improve the stability of the disassembly part, thereby improving the accuracy of the position for disassembling the chip component and solving the problem of chip breakage or inability to cut off caused by unstable disassembly; in addition, the disassembly part is configured to move along a first direction to disassemble the chip, which can reduce the generation of debris during the disassembly process, prevent the debris during the disassembly process from sticking to the chip, and prevent adverse effects on the secondary use of the chip.

[0119] The chip disassembly device and consumable box set provided in the embodiments of the present application are described below with reference to the accompanying drawings.

[0120] It should be noted that in the following description, reference Figure 1 As shown, the length direction of the ink cartridge is defined as the X-axis direction, the width direction of the ink cartridge is defined as the Z-axis direction, and the height direction of the ink cartridge is defined as the Y-axis direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are mutually perpendicular. Furthermore, the first direction in this application is defined as the Z-axis direction, the second direction is defined as the Y-axis direction, and the third direction is defined as the X-axis direction.

[0121] refer to Figure 1 、 Figure 2 and Figure 11 、 Figure 19 、 Figure 24 and Figure 25 as well as Figure 26 、 Figure 27 and Figure 30 As shown, the present application provides a chip disassembly device for disassembling a chip 21 provided on a first consumables box 10. The disassembled chip 21 may exist in the form of a chip assembly 20.

[0122] The chip assembly 20 includes a chip 21 and a carrier 22 for supporting the chip 21. The chip assembly 20 is located on the outer wall of the first consumable box 10, wherein the first consumable box 10 includes a housing 11. The carrier 22 can be an integral part of the housing 11. When the chip removal device removes the chip 21, the carrier 22 is peeled off from the housing 11 of the first consumable box 10 along with the chip 21. The carrier 22 can also be an independent structure bonded to the outer wall of the housing 11. The chip removal device can peel the chip assembly 20, consisting of the carrier 22 and the chip 21, off the outer wall of the housing 11.

[0123] refer to Figure 2 and Figure 11As shown, the first consumable box 10 has an ink outlet 12, which is used for the toner or ink stored inside the first consumable box 10 to flow out, and the supporting portion 22 and the ink outlet 12 are arranged on the same end surface of the first consumable box 10. In this example, the first consumable box 10 is roughly cubic in shape, and the supporting portion 22 and the ink outlet 12 are arranged on the lower surface of the first consumable box 10, that is, the surface on the +Y axis side of the first consumable box 10. The front surface of the first consumable box 10 is provided with a handle 14, that is, the surface on the -X axis side of the first consumable box 10 is provided with a handle 14, and the handle 14 extends obliquely along the -Y axis direction.

[0124] The chip 21 can be connected to the side of the carrier 22 facing away from the housing 11 by welding or an adhesive such as glue, that is, the chip 21 is exposed to the outer wall of the first consumable cartridge 10. The chip 21 can record information such as the ink level of the first consumable cartridge 10 and the number of times the first consumable cartridge 10 has been used. When the first consumable cartridge 10 is installed in the electronic imaging device, the chip 21 can transmit the information on the chip 21 to the electronic imaging device through electrical connection with the electronic imaging device.

[0125] Combine Figure 2 、 Figure 3 and Figure 4 、 Figure 20 、 Figure 27 and Figure 28 as well as Figure 31 、 Figure 32 and Figure 35 As shown in three different embodiments, the present application provides a chip disassembly device, including: a fixing seat 30 and a disassembly component 40, the fixing seat 30 has a disassembly channel 31 and a positioning portion 3 for positioning the first consumable box 10, the disassembly channel 31 is arranged to intersect with the positioning portion 3, and the disassembly channel 31 has a connecting hole 33, which is connected to the positioning portion 3.

[0126] The disassembly assembly 40 is movably disposed in the disassembly passage 31 and includes a disassembly portion 41, at least a portion of which is arc-shaped. The disassembly portion 41 moves along a first direction and can contact the first consumables box 10 through the communication hole 33 to achieve disassembly of the chip 21.

[0127] The chip removal device provided by the present application has a disassembly portion 41 that is at least partially arc-shaped, which can enhance the strength of the disassembly portion 41 itself. This provides uniform force distribution during the disassembly of the chip 21, reduces deformation of the disassembly portion 41, and improves the stability of the disassembly portion 41. This improves the accuracy of the position for disassembling the chip 21, thereby resolving the problem of chip breakage or inability to cut off caused by unstable disassembly.

[0128] In addition, the disassembly portion 41 moves along the first direction to disassemble the chip 21, which can reduce the generation of debris during the disassembly process and prevent the debris from adhering to the chip 21 during the disassembly process, without causing adverse effects on the secondary use of the chip.

[0129] In this example, the first direction reference Figure 2 The -Z axis indicates the direction.

[0130] In one possible implementation, the projection of the disassembly portion 41 along the first direction is arc-shaped or ring-shaped, which is beneficial to improving the structural strength of the disassembly portion 41 itself, reducing the deformation of the disassembly portion 41 during the disassembly of the chip 21, improving the stability of the structure of the disassembly portion 41, ensuring the disassembly accuracy, and preventing damage to the chip 21.

[0131] The present application provides a chip disassembly device that accurately positions the first consumable box 10 through the positioning part 3 to ensure that the chip 21 is located within the coverage range of the cutting track formed by the disassembly part 41 movably arranged in the disassembly channel 31 moving along the first direction. This is crucial to ensuring the accuracy and safety of the disassembly process.

[0132] It should be noted that when the projection of the disassembly portion 41 along the first direction is annular, the coverage range of the cutting track formed by the movement of the disassembly portion 41 along the first direction means that the projection of the chip 21 in the first direction is located inside the annular ring.

[0133] When the projection of the disassembly portion 41 along the first direction is in an arc shape, the coverage range of the chip 21 on the cutting track formed by the movement of the disassembly portion 41 along the first direction means that the projection of the chip 21 in the first direction is located within the closed space formed after connecting the two ends of the arc.

[0134] It is understandable that the projection of the chip 21 in the first direction does not intersect with the projection of the disassembly portion 41 along the first direction, so as to avoid the disassembly portion 41 accidentally touching the chip and causing damage to the chip when moving along the first direction.

[0135] In one possible implementation, reference Figure 2 and Figure 5 As shown, the positioning portion 3 includes two positioning cavities 32, which are located on opposite sides of the removal channel 31. In this way, the two positioning cavities 32 can share the same removal channel 31, thereby improving the space utilization of the chip removal device. The two positioning cavities 32 can be disposed within the fixing base 30.

[0136] The widths of the two positioning cavities 32 are H1 and H2, respectively, where H1≥H2. The widths of the two positioning cavities 32 can be different. Along the first direction, ie, along the Z-axis, the distance between the inner walls of the two positioning cavities 32 is different.

[0137] This is also due to the consideration that in some electronic imaging devices, the color ink cartridges and the black ink cartridges are of different sizes. Usually, the black ink cartridges have a larger width than the color ink cartridges. In order to facilitate the positioning of ink cartridges of different sizes and the recovery of chips, the positioning cavity 32 in a chip disassembly device provided in an embodiment of the present application has two different widths, so that two first consumable boxes 10 of different sizes can be effectively positioned, and the chips 21 of the two first consumable boxes 10 of different sizes can be disassembled, thereby improving the versatility of the chip disassembly device.

[0138] In another possible implementation, the positioning portion 3 may include only a positioning cavity 32, which can be used to position the first consumables cartridge 10. The positioning cavity 32 intersects with the removal passage 31 and can be connected to the removal passage 31 via a communication hole 33. The communication hole 33 exposes the chip 21 within the removal passage 31, allowing the removal portion 41 to remove the chip from the first consumables cartridge 10. This allows the chip removal device to be further miniaturized, making it easier to carry and store.

[0139] The following takes the positioning portion 3 including two positioning cavities 32 as an example to further illustrate the specific structure of the chip removal device.

[0140] In one possible implementation, reference Figure 6 、 Figure 7 、 Figure 20 、 Figure 27 As shown, the communication hole 33 is located on the side wall of the disassembly channel 31, and the disassembly channel 31 is connected to the positioning portion 3 through the communication hole 33. Correspondingly, both positioning cavities 32 are connected to the disassembly channel 31 through the communication hole 33; the depth direction of the disassembly channel 31 and the length direction of the chip 21 are both along the first direction.

[0141] When the disassembly portion 41 moves along the first direction to disassemble the chip assembly 20 , the disassembly portion 41 moves along the length direction of the chip 21 , which helps prevent disassembly debris from contaminating the electrical contacts on the chip surface.

[0142] The communication hole 33 needs to ensure that it provides sufficient space and angle to expose the chip 21 into the disassembly channel 31 without affecting the overall structural strength of the fixing base 30. By locating the communication hole 33 on the side wall of the disassembly channel 31, the chip 21 can be accurately exposed into the disassembly channel 31 in the positioning cavity 32, facilitating the operation of disassembling the assembly 40.

[0143] In one possible implementation, reference Figure 2 、 Figure 3 and Figure 4As shown, the fixing base 30 includes: a fixing body 34 and a disassembly guide portion 35. The fixing body 34 includes a first baffle 341, a second baffle 342, and a third baffle 343. The first baffle 341 and the second baffle 342 are arranged opposite to each other. The third baffle 343 is connected to the same side of the first baffle 341 and the second baffle 342. The positioning cavity 32 is formed between the first baffle 341, the second baffle 342, and the third baffle 343.

[0144] The disassembly guide portion 35 is provided on one side of the first and second baffle plates 341 and 342 opposite to the third baffle plate 343 , and the disassembly passage 31 is formed in the disassembly guide portion 35 .

[0145] The disassembly guide portion 35 guides the movement of the disassembly component 40 , enabling the disassembly component 40 to move along a preset trajectory, thereby effectively preventing the movement of the disassembly component 40 from being deflected, thereby avoiding the problem of the disassembly portion 41 damaging the chip 21 .

[0146] In one possible implementation, the first baffle 341 , the second baffle 342 , and the third baffle 343 are connected to form an integral structure.

[0147] In one possible implementation, the first baffle 341, the second baffle 342, and the third baffle 343 are respectively configured to abut against the outer wall surfaces of three different sides of the first consumable box 10 to improve the accuracy of positioning the first consumable box 10. The first baffle 341 and the second baffle 342 are relatively connected to the ends of the third baffle 343 so that the inner wall surfaces of the first baffle 341 and the second baffle 342 are substantially parallel.

[0148] In one possible implementation, reference Figure 2 、 Figure 8 and Figure 9 As shown, the fixing seat 30 also includes a first limiting portion 36, which is arranged on a side of the disassembly guide portion 35 facing the positioning cavity 32. The first limiting portion 36 abuts against the first consumable box 10 to limit the position of the first consumable box 10 in the positioning cavity 32.

[0149] In a possible implementation, the first limiting portion 36 may be a boss protruding from the disassembly guide portion 35 , or may be a recessed portion recessed in the disassembly guide portion 35 .

[0150] In one possible implementation, reference Figure 2 、 Figure 9 and Figure 11As shown, the lower surface of the first consumable box 10 has a limited portion 13, which can be a protrusion protruding from the lower surface of the first consumable box 10. When the first consumable box 10 is positioned in the positioning cavity 32, one end of the limited portion 13 along the X-axis direction abuts against the first limiting portion 36, limiting the position of the first consumable box 10 in the positioning cavity 32, that is, limiting the movement of the first consumable box 10 along the X-axis direction. At this time, the chip assembly 20 is directly opposite the communicating hole 33, so that the disassembly portion 41 can remove the chip assembly 20 correctly and stably.

[0151] In another possible implementation, the lower surface of the first consumable box 10 has a limited portion 13. When the first consumable box 10 is positioned in the positioning cavity 32, one end of the limited portion 13 along the X-axis direction abuts against the first limiting portion 36, limiting the movement of the first consumable box 10 along the X-axis direction, ensuring that the chip assembly 20 is facing the connecting hole 33; at the same time, the lower surface of the first consumable box 10 abuts against the first limiting portion 36, limiting the movement of the first consumable box 10 along the Y-axis direction, thereby achieving a limiting effect on the first consumable box 10 along the X-axis and Y-axis directions, so as to improve the accuracy of the position of the first consumable box 10 in the positioning cavity 32, and facilitate the disassembly portion 41 to correctly and stably disassemble the chip assembly 20.

[0152] In one possible implementation, the first limiting portion 36 can also be in contact with the relative upper and lower surfaces of the first consumable box 10 together with the third baffle 343, thereby limiting the movement of the first consumable box 10 along the Y-axis direction, which can effectively prevent the consumable box from moving during the disassembly process, thereby improving the stability and accuracy of the disassembly operation and helping to prevent damage to the chip assembly 20.

[0153] In some possible implementations, the first limiting portion 36 may be in contact only with the limited portion 13 to limit the movement of the first consumable box 10 in the X-axis direction. In addition to the third baffle 343, the movement of the first consumable box 10 in the Y-axis direction may also be limited by the side wall surface of the disassembly guide portion 35 facing the positioning cavity, that is, it may be a side wall surface position adjacent to the connecting hole 33, or it may be other positions.

[0154] In one possible implementation, reference Figure 3 and Figure 10 As shown, the fixing seat 30 also includes a second limiting portion 37, which is arranged on the inner wall surface of at least one of the first baffle 341 and the second baffle 342 facing the positioning cavity 32, and the second limiting portion 37 is configured to abut against the front surface of the first consumable box 10 to limit the movement of the first consumable box 10 along the X-axis direction so that the position of the chip assembly 20 corresponds to the disassembly channel 31.

[0155] In one possible implementation, the second limiting portion 37 is located at the connecting position of the two positioning cavities 32. When the first consumable box 10 with a larger width is installed in the positioning cavity 32, in addition to the limited portion 13 and the first limiting portion 36 abutting against each other, the front surface of the first consumable box 10 also abuts against the second limiting portion 37, thereby more stably positioning the first consumable box 10 in the fixed body 34.

[0156] In one possible implementation, the second limiting portion 37 may be a ridge or a step surface, and the second limiting portion 37 may be located on the inner wall surface of the first baffle 341 facing the positioning cavity 32, or located on the inner wall surface of the second baffle 342 facing the positioning cavity 32, or the second limiting portion 37 may be provided on the inner wall surfaces of the first baffle 341 and the second baffle 342 facing the positioning cavity 32.

[0157] In a possible implementation, both ends of the fixing seat 30 along the X-axis direction are open, so as to facilitate installation of the first consumables box 10 into the positioning cavity 32 along the X-axis direction for positioning.

[0158] It is easy to understand that, by the first baffle 341 and the second baffle 342 of the fixing seat 30 respectively abutting against the opposite side walls of the first consumable box 10 along the Z axis, the movement of the first consumable box 10 along the Z axis can be limited; by the blocking effect of the disassembly guide part 35 and the third baffle 343 on the first consumable box 10, the movement of the first consumable box 10 along the Y axis can be limited; by the first limiting part 36 and / or the second limiting part 37 abutting against one end of the first consumable box 10 along the X axis, the movement of the first consumable box 10 along the X axis can be limited, so that the position of the first consumable box 10 in the positioning cavity 32 is effectively fixed, thereby improving the stability of the first consumable box 10 during the chip disassembly process, helping to improve the accuracy of the disassembly position of the chip component 20, and preventing the chip 21 from being damaged or unable to be cut off due to deviation in the disassembly position.

[0159] In one possible implementation, reference Figure 2 and Figure 3 As shown, the disassembly assembly 40 further includes a force-applying portion 42 movably disposed in the disassembly channel 31 , and the force-applying portion 42 can drive the disassembly portion 41 to move along a first direction so that the disassembly portion 41 removes the chip 21 from the first consumable box 10 .

[0160] Exemplarily, the disassembly portion 41 and the force-applying portion 42 are movably connected, and the force-applying portion 42 can abut against the top of the disassembly portion 41. For example, the disassembly portion 41 can be sleeved on the bottom end of the force-applying portion 42, and the force-applying portion 42 has a stepped surface on the side near the bottom end of the force-applying portion 42, and the upper end surface of the disassembly portion 41 can abut against the stepped surface of the force-applying portion 42. In this way, when the force-applying portion 42 moves in the first direction, the force can be transmitted to the disassembly portion 41, driving the disassembly portion 41 to move in the first direction, thereby achieving the disassembly of the chip 21. At the same time, the step surface can also be used to stop the movement of the disassembly portion 41 in the Z-axis direction.

[0161] In a possible implementation, one end of the force-applying portion 42 relative to the disassembly portion 41 extends to the outside of the disassembly channel 31 and is connected to an operating handle 421 .

[0162] The force-applying portion 42 is used to receive an external force to drive the removal portion 41 to move, causing the removal portion 41 to move within the removal passage 31 to remove the chip 21 and the carrier 22. The chip removal device of this embodiment uses the force-applying portion 42 to drive the removal portion 41 to move along a first direction, i.e., the -Z-axis direction, within the removal passage 31 to remove the chip 21 and the carrier 22 from the ink cartridge. This device has a simple structure and is easy to operate, resolving the difficulty in removing the chip 21 from the ink cartridge in the prior art and significantly improving the reusability of the chip 21.

[0163] In one possible implementation, the operating handle 421 may be, for example, an operating handle. By operating the operating handle 421, an appropriate force can be applied to the force-applying portion 42, causing the disassembly portion 41 to move along the first direction, i.e., the −Z-axis direction, to disassemble the chip assembly 20. The operating handle may be in the shape of a straight line or a cross, etc., to facilitate the user to rotate and press the operating handle to apply an external force to the force-applying portion 42, causing the force-applying portion 42 to transmit the force to the disassembly portion 41.

[0164] In a possible implementation, the operating handle 421 may also be other structures that facilitate the electric drive of the force-applying portion 42 to move, thereby improving the operational efficiency and safety of the chip removal device.

[0165] In one possible implementation, reference Figure 3 As shown, the force-applying portion 42 has an extension column 422 at one end close to the disassembly portion 41. The extension column 422 has a smaller diameter and can extend into the cavity enclosed inside the disassembly portion 41, which helps prevent the disassembly portion 41 from tilting and other problems, thereby ensuring the effectiveness of disassembling the chip assembly 20.

[0166] In one possible implementation, the disassembly portion 41 is cylindrical and has a through cavity 412 therein. The through cavity 412 extends through the disassembly portion 41 along the Z-axis. There are no joint gaps around the disassembly portion 41. The disassembly portion 41 has high strength and small deformation. The end of the disassembly portion 41 facing the first consumable box 10 has a blade 411. The provision of the blade 411 facilitates the disassembly portion 41 to enter the connection position between the bearing portion 22 and the shell 11 of the first consumable box 10, thereby disassembling the connection position between the bearing portion 22 and the shell 11 of the first consumable box 10. The cylindrical shape of the disassembly portion 41 can provide better force distribution and working stability.

[0167] In a possible implementation, the blade 411 is circular and is used to disassemble the connection between the carrying portion 22 and the shell 11 of the first consumable box 10 so as to remove the chip assembly 20 from the first consumable box 10 .

[0168] In one possible implementation, the disassembly portion 41 includes a disassembly body, and a blade 411 is connected to one end of the disassembly body facing the first consumables box 10 . The blade 411 and the disassembly body may be integrally formed or separately provided.

[0169] In one possible implementation, reference Figure 12 and Figure 13 As shown, the inner wall and the outer wall of the blade 411 are both inclined guiding surfaces, that is, along the -Z axis direction, the inner wall of the blade 411 gradually tilts toward the outer wall of the blade 411, and the outer wall of the blade 411 gradually tilts toward the inner wall of the blade 411, so that along the -Z axis direction, the thickness of the blade 411 gradually decreases, and the blade 411 is at the thinnest position at one end of the first consumable box 10, which facilitates the blade 411 to enter the connection position between the bearing portion 22 and the shell 11 of the first consumable box 10 to realize the disassembly of the chip assembly 20.

[0170] Combine Figure 13 and Figure 14 As shown, the disassembly body includes an extension section 413 connected to the blade 411. The wall thickness of the extension section 413 is d. The angle between the projection of the outer side of the blade 411 on the ZOY plane and the extension of the projection of the outer wall of the extension section 413 on the ZOY plane is θ1. The angle between the projection of the inner side of the blade 411 on the ZOY plane and the extension of the projection of the inner wall of the extension section 413 on the ZOY plane is θ2. The distance between the tip of the blade 411 and the outer wall of the extension section 413 is h.

[0171] As an embodiment, the ratio of h to d may be less than or equal to 0.5. For example, the ratio of h to d may be 0.45, 0.4, 0.35, 0.3, 0.25, 0.2, 0.15, 0.1, or a range consisting of any two thereof.

[0172] In this way, the strength of the disassembly portion 41 can be enhanced and its deformation can be reduced. At the same time, it is easy to disassemble during the disassembly process, and no matter how the disassembly trajectory changes and squeezes the disassembly portion, it can be ensured that the disassembly portion 41 can be smoothly withdrawn.

[0173] It is understood that θ1 can be equal to θ2 or less than θ2. When θ1 is less than θ2, the slope of the outer side of the blade 411 is greater, providing a wider chip discharge channel, reducing friction between the chips and the outer side of the blade 411, and preventing chip accumulation or entanglement. Furthermore, sufficient cutting edge strength can be maintained while guiding the chips to curl toward the center, facilitating chip breaking.

[0174] In one possible implementation, reference Figure 15 and Figure 16 As shown, only the inner wall surface of the blade 411 forms an inclined guiding surface, and the outer wall surface of the blade 411 is a vertical surface, that is, along the -Z axis direction, the inner wall of the blade 411 gradually tilts toward the outer wall direction of the blade 411, and the outer wall of the blade 411 does not tilt toward the inner wall direction of the blade 411. This structure makes the operation of the blade 411 more stable.

[0175] In one possible implementation, the blade 411 may be in the shape of a ring, a semi-ring, an arc, or a plane.

[0176] In a possible implementation, the force applying portion 42 is connected to the inner wall surface of the disassembly channel 31 via threads.

[0177] In one possible implementation, reference Figure 2 and Figure 3 As shown, the outer wall surface of the force-applying part 42 is provided with an external thread, and the inner wall surface of the disassembly channel 31 is provided with an internal thread. The threaded connection is achieved by cooperating between the external thread and the internal thread, which has the effect of accurately adjusting the position of the force-applying part 42 in the disassembly channel 31, thereby facilitating the control of the force applied to the disassembly part 41.

[0178] In a possible implementation, the force-applying portion 42 is slidably disposed in the disassembly channel 31 , and the disassembly channel 31 guides the movement of the force-applying portion 42 to prevent the force-applying portion 42 from deflecting during movement.

[0179] The chip disassembly device provided in the present application is configured with a fixed body 34 to adapt to the positioning of first consumable boxes 10 of different sizes, thereby reducing the use of spare parts and lowering costs.

[0180] The chip disassembly device provided in the present application can separate the carrier and the chip mounted on the carrier from the first consumable box 10 together, thereby facilitating the recycling and reuse of the chips and avoiding the waste of chip resources.

[0181] Example 2:

[0182] Based on the above embodiment, this application also provides another specific embodiment of a chip removal device. The main difference between this embodiment and the above embodiment is that the chip removal device in this embodiment can tilt the first consumable box 10 in the positioning portion 3, so that the removal portion 41 can tilt and remove the chip 21 or the chip 21 and the carrier portion 22 from the first consumable box 10. In addition, in this embodiment, the removal component 40 has a different structure.

[0183] The following combination Figures 17 to 30 This embodiment is further described in detail.

[0184] Reference Figure 17 and Figure 18 As shown, the positioning portion 3 of this embodiment also includes two positioning cavities 32 . The two positioning cavities 32 are disposed in the fixing seat 30 , and the two positioning cavities 32 are disposed side by side on opposite sides of the disassembly channel 31 .

[0185] The two positioning cavities 32 have different cavity widths to accommodate the removal of chips 21 on first consumable cartridges 10 of different sizes. For example, the two positioning cavities 32 can be used to remove the ink cartridge chip 21 of a color cartridge and the black ink cartridge chip 21, respectively.

[0186] It should be noted that Figure 20 、 Figure 22 The chip disassembly device and the first consumables box 10 are rotated 90° clockwise for easier observation.

[0187] As an implementation method, Figures 19 to 20 As shown, along the second direction perpendicular to the first direction, that is, the height direction of the ink cartridge, reference Figure 19-20 In the +Y-axis direction, the top of the positioning cavity 32 is tilted downward, allowing the first consumables box 10 to extend obliquely into the removal passage 31. The plane of the chip 21 intersects the plane of the sidewall of the removal portion 41. In other words, the removal portion 41 does not penetrate the first consumables box 10 perpendicularly. This arrangement allows for a smoother transition in cutting force, a smoother cut surface, and distributed impact loads, resulting in more even wear on the cutting edge and extending the service life of the removal portion 41.

[0188] Furthermore, the depth of the first consumables box 10 extending into the disassembly channel 31 may gradually decrease along the first direction.

[0189] In this way, not only can the chip 21 on the first consumable box 10 be tilted in the disassembly channel 31, but also the depth of the first consumable box 10 extending into the disassembly channel 31 gradually decreases along the first direction (-Z axis direction in the figure).

[0190] Since the disassembly portion 41 is movably arranged in the disassembly channel 31, when the disassembly portion 41 moves along the first direction, the position where the disassembly portion 41 first contacts the first consumable box 10 is away from the chip 21, and as the disassembly portion 41 continues to move downward along the first direction, the contact position between the disassembly portion 41 and the first consumable box 10 gradually approaches the chip 21, but does not contact the chip 21 or the chip assembly 20, thereby avoiding the disassembly portion 41 from accidentally touching the chip 21 when moving downward, thereby damaging the chip 21, and also making the disassembly process more labor-saving.

[0191] It can be understood that the thickness of the chip assembly 20 along the first direction gradually decreases after being cut by the disassembly portion 41 .

[0192] In a possible implementation, the bottom of the positioning cavity 32 can be set as a horizontal surface or an inclined surface, and can be adaptively adjusted according to the shape of the first consumable box 10, which is not limited here.

[0193] As another embodiment, Figure 21 and Figure 22 As shown, along the second direction perpendicular to the first direction, that is, the height direction of the ink cartridge, reference Figure 21-22 In the +Y axis direction, the bottom of the positioning cavity 32 can be tilted upward so that the first consumable box 10 is tilted into the disassembly channel 31, and the plane where the chip 21 is located intersects with the plane where the side wall of the disassembly portion 41 is located.

[0194] Furthermore, the depth of the first consumables box 10 extending into the disassembly channel 31 may gradually increase along the first direction.

[0195] Similar to the above embodiment, this arrangement can also enable the chip 21 on the first consumables box 10 to be tilted in the disassembly channel 31 , and its technical effect will not be described in detail here.

[0196] For example, refer to Figure 20 and Figure 22As shown, the angle between the plane where the side wall of the disassembly portion 41 is located and the plane where the chip 21 is located can be greater than 1 degree, so that the chip assembly 20 cut off by the disassembly portion 41 can have a recognizable thickness difference along the Z-axis direction. For example, the chip 21 may have a larger thickness at the upper end and a smaller thickness at the lower end in the Z-axis direction; or the chip 21 may have a larger thickness at the lower end and a smaller thickness at the upper end in the Z-axis direction. Thus, the thickness variation of the disassembled chip assembly 20 can be associated with the original installation direction of the chip assembly 20 on the first consumable box 10, which is conducive to distinguishing the subsequent installation direction of the recovered chip on the second consumable box. In addition, the cutting force at this time is evenly distributed, which reduces the concentrated force on the tip of the tool and protects the blade 411.

[0197] Reference Figure 23 and Figure 24 As shown, the fixing base 30 in this embodiment includes a fixing body 34. The fixing body 34 includes a first baffle 341, a second baffle 342, and a third baffle 343. The first baffle 341 and the second baffle 342 are arranged opposite each other, and the third baffle 343 is connected to the same side of the first baffle 341 and the second baffle 342. The positioning cavity 32 is formed between the first baffle 341, the second baffle 342, and the third baffle 343.

[0198] For example, the second baffle 342 may include contact portions 3421 and recessed portions 3422 alternately arranged along the second direction. When the chip 21 on the first consumable box 10 is removed, the multiple contact portions 3421 may contact the surface of the first consumable box 10 and, together with the first baffle 341, limit the displacement of the first consumable box 10 in the first direction, thereby preventing the first consumable box 10 from shaking when the disassembly portion 41 is cutting.

[0199] There is a gap between the recessed portion 3422 and the surface of the first consumable box 10, which can reduce the contact area between the second baffle 342 and the first consumable box 10 while ensuring positioning, thereby reducing possible wear on the surface of the first consumable box 10 during use and making it easier to insert the first consumable box 10 into the positioning cavity 32.

[0200] In one possible implementation, in a second direction perpendicular to the first direction, a cavity wall of the positioning cavity 32 on a side away from the disassembly assembly 40 may have an inclined guide portion 321. The inclined guide portion 321 may abut against the first consumables box 10 to tilt the chip 21 along the first direction toward one end of the inclined guide portion 321.

[0201] It can be understood that the inclined guide portion 321 can also make the first consumable box 10 tilted and extend into the disassembly channel 31, which has the same effect as the aforementioned positioning cavity 32 with the top of the cavity tilted downward or the bottom of the cavity tilted upward, and its effect will not be repeated here.

[0202] For example, continue to refer to Figure 24 As shown, the inclined guide portion 321 is protrudingly provided on the inner wall surface of the third baffle 343 and extends into the two positioning cavities 32 along the third direction (X-axis direction) in the figure.

[0203] The thickness of the inclined guide portion 321 in the corresponding positioning cavity 32 gradually decreases along the first direction (-Z axis direction), so that the first consumables box 10 can be arranged tilted downward. Alternatively, the thickness of the inclined guide portion 321 in the corresponding positioning cavity 32 gradually increases along the first direction (-Z axis direction), so that the first consumables box 10 can be arranged tilted upward.

[0204] In some other embodiments, the inclined guide portion 321 in the positioning cavity 32 may also be omitted, that is, a horizontal surface is provided on the cavity wall of the positioning cavity 32 away from the disassembly component 40 in the second direction perpendicular to the first direction.

[0205] Continue to refer to Figure 20 and Figure 23 、 Figure 24 As shown, the fixing base 30 in this embodiment further includes a disassembly guide portion 35 . The disassembly guide portion 35 is provided on one side of the first baffle 341 and the second baffle 342 opposite to the third baffle 343 , and the disassembly channel 31 is formed in the disassembly guide portion 35 .

[0206] The disassembly guide portion 35 may include a first disassembly guide portion 351 and a second disassembly guide portion 352. The first disassembly guide portion 351 and the second disassembly guide portion 352 are connected to form the disassembly passage 31. The second disassembly guide portion 352 protrudes from the outer surface of the first disassembly guide portion 351.

[0207] The disassembly guide portion 35 guides the movement of the disassembly component 40 , enabling the disassembly component 40 to move along a preset trajectory, thereby effectively preventing the movement of the disassembly component 40 from being deflected, thereby avoiding the problem of the disassembly portion 41 damaging the chip 21 .

[0208] Reference Figures 17 to 21 as well as Figure 25 As shown, the fixing seat 30 further includes a first limiting portion 36 , which is disposed on the outer wall of the disassembly guide portion 35 . The first limiting portion 36 abuts against the first consumable box 10 to limit the position of the first consumable box 10 in the positioning cavity 32 .

[0209] Exemplarily, the first limiting portion 36 can be a groove recessed in the outer wall of the disassembly guide portion 35 , and the first consumable box 10 is provided with a limited portion 13 protruding from the outer wall of the first consumable box 10 . The first limiting portion 36 can abut against the limited portion 13 .

[0210] When the first consumable box 10 moves along the third direction in the positioning cavity 32, when the outer contour of the limited portion 13 abuts against the first limiting portion 36, the first consumable box cannot move further, thereby limiting the first consumable box 10 in the third direction (X-axis direction) and aligning the chip 21 in the disassembly channel 31.

[0211] In one possible implementation, the height of the first limiting portion 36 in the first direction can match the corresponding positioning cavity 32. For example, the height of the first limiting portion 36 in the first direction is greater than or equal to the cavity width of the corresponding positioning cavity 32, thereby making the abutment between the first limiting portion 36 and the first consumable box 10 more reliable.

[0212] Reference Figure 26 As shown, the fixing seat 30 also includes a second limiting portion 37, which is arranged on the inner wall surface of at least one of the first baffle 341 and the second baffle 342 facing the positioning cavity 32, and the second limiting portion 37 is configured to abut against one end of the first consumable box 10 so that the position of the chip 21 or the chip assembly 20 corresponds to the disassembly channel 31.

[0213] It can be understood that the configuration of the second limiting portion 37 in this embodiment can refer to the description of the second limiting portion 37 of the chip removal device in the aforementioned embodiment, and no further description thereof will be given here.

[0214] Reference Figure 27 As shown, the communication hole 33 is located on the side wall of the disassembly channel 31 , and the disassembly channel 31 and the positioning portion 3 can be communicated through the communication hole 33 . Correspondingly, both positioning cavities 32 can be communicated with the disassembly channel 31 through the communication hole 33 .

[0215] When the first consumable box 10 is installed in one of the positioning cavities 32, the chip 21 and the supporting part 22 can extend into the disassembly channel 31 through the connecting hole 33, so that the chip 21 can be accurately exposed to the disassembly channel 31 in the positioning cavity 32, facilitating the subsequent disassembly operation of the component 40.

[0216] The specific structure of the disassembly assembly 40 in the second embodiment is further described below.

[0217] Reference Figure 28 As shown, the disassembly assembly 40 includes a disassembly portion 41, a force-applying portion 42, and a locking member 43. The disassembly portion 41, the force-applying portion 42, and the locking member 43 are all movably disposed within the disassembly passage 31. Furthermore, the disassembly portion 41 is movably disposed between the force-applying portion 42 and at least a portion of the locking member 43. The force-applying portion 42 can drive the locking member 43 and the disassembly portion 41 to move in a first direction (the direction of the -Z axis).

[0218] The locking member 43 is connected to the force applying portion 42, and the force applying portion 42 can rotate relative to the locking member 43. The locking member 43 can move along the first direction (the direction where the -Z axis is located) under the drive of the force applying portion 42.

[0219] The disassembly portion 41 is sleeved on the locking member 43 and can move with the locking member 43. Thus, when the locking member 43 moves downward in the first direction driven by the force-applying portion 42, the disassembly portion 41 can also move downward in the first direction, thereby achieving the disassembly of the chip 21 or the chip 21 and the carrier 22. Furthermore, after the chip 21 or the chip 21 and the carrier 22 are removed from the first consumables box 10, the force-applying portion 42 can be moved upward in the Z-axis direction, which can drive the disassembly portion 41, which was originally blocked at the communication hole 33, to move upward through the locking member 43, thereby restoring communication between the positioning cavity 32 and the disassembly passage 31, facilitating the installation of the first consumables box 10 in the positioning cavity 32 during the next disassembly.

[0220] It is understandable that when the force-applying portion 42 is threadedly connected to the inner wall surface of the disassembly channel 31 , the disassembly portion 41 can be driven to move upward along the Z-axis direction by rotating the force-applying portion 42 in the opposite direction.

[0221] The disassembly portion 41 is movably disposed outside the locking member 43. The disassembly portion 41 may also be detachably connected to the locking member 43. For example, the disassembly portion 41 may be sleeved outside the locking member 43, and the disassembly portion 41 and the locking member 43 may be engaged. Alternatively, the disassembly portion 41 may be sleeved outside the locking member 43, and the disassembly portion 41 and the locking member 43 may be threadedly connected. This is not limited herein.

[0222] Combine Figures 28-30 As shown, in one possible implementation, the locking member 43 includes a connecting member 431 and a stop 432. The disassembly portion 41 is sleeved on the connecting member 431, and the connecting member 431 is connected to the force-applying portion 42 via an intermediate member 433, so that the locking member 43 can move downward in the first direction under the drive of the force-applying portion 42.

[0223] The connecting member 431 is provided with a central hole 4311, through which the intermediate member 433 passes, and the intermediate member 433 is rotatable relative to the connecting member 431. For example, a protrusion may be provided on the inner wall of the connecting member 431 on the side where the connecting member 431 and the intermediate member 433 contact each other, thereby reducing the friction between the connecting member 431 and the intermediate member 433 and allowing the intermediate member 433 to rotate relative to the connecting member 431.

[0224] As an implementation method, Figure 25 As shown, one end of the intermediate member 433 may be provided with an external thread, and may cooperate with the internal thread of the force-applying portion 42 to achieve a threaded connection, so that the connection between the two is stable.

[0225] As another embodiment, Figure 30 As shown, one end of the middle piece 433 can be arranged closely against the inner wall of the force applying portion 42 , that is, the middle piece 433 and the force applying portion 42 are interference fit to achieve connection between the two.

[0226] It should be noted that when the force-applying portion 42 is threadedly connected to the disassembly passage 31, the force-applying portion 42 rotates along its axis while moving in the first direction, potentially causing the intermediate member 433 to rotate along with it. However, since the intermediate member 433 is rotatable relative to the connecting member 431, the connecting member 431 and the disassembly portion 41 only move in the first direction and do not rotate.

[0227] In other embodiments, the intermediate member 433 may be connected to the force-applying portion 42 via a bearing. The outer ring of the bearing may be fixedly connected to the internal cavity of the force-applying portion 42, while the inner ring of the bearing is fixedly connected to the intermediate member 433. In this manner, the rotation of the outer ring of the bearing relative to the inner ring of the bearing can achieve rotational isolation between the force-applying portion 42 and the intermediate member 433. In this case, the intermediate member 433 does not rotate with the force-applying portion 42, thereby preventing the connection member 431 from rotating.

[0228] The stopper 432 is connected to one end of the connecting member 431 away from the force-applying portion 42 , and is disposed away from the first consumables box 10 in the second direction (the direction of the Y axis).

[0229] It is understood that, in order to avoid the disassembly portion 41 on the side closer to the first consumables box 10 in the Y-axis direction and prevent it from interfering with the disassembly portion 41's removal of the chip 21, the stop 432 is only provided on the side farther from the first consumables box 10 in the Y-axis direction. Furthermore, the connecting member 431 has an asymmetric structure. The connecting member 431 on the side closer to the first consumables box 10 in the Y-axis direction extends less in the first direction, thereby preventing the connecting member 431 from interfering with the first consumables box 10's insertion into the disassembly passage 31.

[0230] In one possible implementation, the outer wall of the stopper 432 can slide along the inner wall of the disassembly channel 31 formed by the second disassembly guide 352. The force-applying portion 42 moves within the disassembly channel 31 formed by the first disassembly guide 351, so that when the disassembly portion 41 moves within the disassembly channel 31, both the upper and lower ends are constrained and the disassembly portion 41 does not deviate in the Y-axis direction.

[0231] In this way, the first disassembly guide part 351 can guide the force-applying part 42 and the second disassembly guide part 352 can guide the movement of the stop 432, so that the disassembly part 41 can disassemble the chip 21 or chip assembly 20 on the first consumable box 10 according to a preset trajectory, thereby reducing the risk of deviation of the disassembly part 41 when moving along the first direction and improving the reliability of the chip disassembly device.

[0232] Continue to refer to Figure 29 As shown, in one possible implementation, the stopper 432 includes a guide portion 4321 and an abutting portion 4322. The abutting portion 4322 can abut against the bottom of the disassembly portion 41, so that after the disassembly of the disassembly portion 41 is completed, it can move upward along the Z-axis direction under the drive of the stopper 432, return to the initial position, and wait for the next disassembly. The guide portion 4321 is provided with an inclined slope to guide the bottom end of the disassembly portion 41 to abut against the abutting portion 4322. In addition, the guide portion 4321 can also abut against the side wall of the disassembly portion 41 away from the first consumable box 10 in the second direction to limit the displacement of the disassembly portion 41 in the Y-axis direction, thereby preventing the disassembly portion 41 from shaking slightly during disassembly, further improving the cutting strength.

[0233] Example 3:

[0234] Based on the above embodiment, this application also provides another specific embodiment of a chip removal device. The main differences between this embodiment and the above embodiment are that the communication hole 33 in this embodiment is located at the lower end of the inner cavity of the fixing seat 30, and the positioning portion 3 is arranged differently from the above embodiment. In addition, the connection method of the removal component 40 in this embodiment is different.

[0235] Reference Figures 31-36 As shown, the positioning portion 3 in this embodiment may include a mounting cavity 38 or a mounting cavity 38 and at least one adapter 50. The mounting cavity 38 is disposed within the fixing base 30. The mounting cavity 38 is adapted to accommodate a first consumable cartridge 10 of a certain model. The adapter 50 is installable within the mounting cavity 38. Different adapters 50 have different positioning cavities 32, thereby being adapted to accommodate different models of first consumable cartridges 10.

[0236] It is understandable that if Figure 32 As shown, the chip removal device in this embodiment can be directly adapted to the positioning of a first consumable cartridge 10 of a certain model through the mounting cavity 38, thereby realizing the removal of the chip 21 on the first consumable cartridge 10. In this case, the chip 21 adapted to large-size ink cartridges can be removed.

[0237] Or, as Figure 33 and Figure 34 As shown, the mounting cavity 38 can be used in combination with adapters 50 of different sizes to achieve adaptation to first consumable boxes 10 of different sizes.

[0238] For example, in Figure 28 In the embodiment, the width of the positioning cavity 32 formed by the adapter 50 and the mounting cavity 38 is h1. Figure 29 In the embodiment, the width of the positioning cavity 32 formed by the adapter 50 and the mounting cavity 38 is h2, where h1<h2. Thus, the adapter 50 can be adapted to first consumables boxes 10 of different widths by selecting the size of the adapter 50.

[0239] In this way, the mounting cavity 38 itself, or the combination of different adapters 50 and the mounting cavity 38 , can be used to adapt to a variety of first consumable boxes 10 , thereby further improving the applicability of the chip disassembly device.

[0240] Reference Figure 35 and Figure 36 As shown, a cavity 344 is provided in the fixing base 30 to accommodate the disassembly assembly 40. A communication hole 33 is provided at the lower end of the cavity 344. Furthermore, a guide hole 3441 is provided at the upper end of the cavity 344. The disassembly assembly 40 can pass through the guide hole 3441 and enter the cavity 344.

[0241] A disassembly channel 31 is defined between the guide hole 3441 and the connecting hole 33, and the connecting hole 33 enables the disassembly channel 31 to be connected with the positioning portion 3, so that when the disassembly portion 41 moves along the first direction (-Z axis direction), it can pass through the connecting hole 33 and act on the first consumable box 10 to separate the chip 21 or the chip assembly 20 from the first consumable box 10.

[0242] In one possible implementation, the fixing base 30 is connected to a guide member 345, which is connected to the lower end of the cavity 344. The communication hole 33 is provided on the guide member 345. The lower end of the cavity 344 is set to be open. The cooperation between the guide member 345 and the cavity 344 can achieve the sealing of the lower end opening of the cavity 344 and the guidance of the detachable portion 41 in the first direction. In addition, the detachable portion 41 can be extended into the positioning portion 3 through the communication hole 33.

[0243] In another possible implementation, the communication hole 33 can be directly formed in the bottom wall of the cavity 344. The disassembly portion 41 can extend into the positioning portion 3 through the communication hole 33 formed in the bottom wall of the cavity to cut and disassemble the chip 21 on the first consumables box 10. In this way, the number of parts of the chip disassembly device can be reduced.

[0244] In one possible implementation, the disassembly assembly 40 includes a disassembly portion 41 and a force-applying portion 42. Furthermore, the disassembly portion 41 and the force-applying portion 42 can be fixedly connected via a fixing member 44, allowing the disassembly portion 41 to move along with the force-applying portion 42. When the disassembly channel 31 and the force-applying portion 42 are threadedly connected, rotating the force-applying portion 42 can drive the disassembly portion 41 to rotate and move up and down along the Z-axis.

[0245] Continue to refer to Figure 36 As shown, at least two positioning ribs are provided on the cavity wall of the mounting cavity 38 on the side corresponding to the chip 21 , and the at least two positioning ribs are spaced apart along the first direction; and the at least two positioning ribs abut against the first consumable box 10 or the adapter 50 .

[0246] For example, two positioning ribs 381 are provided within the mounting cavity 38. When the two positioning ribs 381 directly contact the first consumables box 10, the first consumables box 10 is directly installed within the mounting cavity 38. A cavity is formed between the two positioning ribs 381 to avoid the location of the chip 21 and prevent wear on the chip 21. When the two positioning ribs 381 contact the adapter 50, the movement of the first consumables box 10 installed within the adapter 50 is restricted by limiting the movement of the adapter 50 in the second direction.

[0247] The positioning ribs 381 can directly or indirectly limit the movement of the first consumable box 10 in the second direction, so as to further improve the stability of the first consumable box 10 when being cut.

[0248] Continue to refer to Figure 36 As shown, in a third direction perpendicular to the first direction, an accommodating groove 383 may be opened on the cavity wall of the installation cavity 38 to accommodate the handle 14 of the first consumable box 10 .

[0249] Reference Figure 32 、 Figure 36 as well as Figure 37 As shown, in one possible implementation, in the third direction, a clamping member 382 is connected to the side of the mounting cavity 38 away from the disassembly channel 31, and the clamping member 382 abuts against the first consumable box 10 or the adapter 50 to limit the movement of the first consumable box 10 in the third direction.

[0250] Reference Figure 38 As shown, the clamping member 382 includes a connecting section 3821 and a bent section 3822. The connecting section 3821 is connected to the bottom wall of the mounting cavity 38. The bent section 3822 is connected to the connecting section 3821 and protrudes from the bottom wall of the mounting cavity 38. The bent section 3822 can abut against the first consumables box 10 or the adapter 50.

[0251] It can be understood that when the adapter 50 or the first consumable box 10 is installed in the installation cavity 38 along the third direction, the bending section 3822 will be squeezed by the adapter 50 or the first consumable box 10. At this time, the clamping member 382 can swing downward in a small range relative to the bottom wall of the installation cavity 38, and after the adapter 50 or the first consumable box 10 is installed in the installation cavity 38, it returns to its initial state to achieve adaptation and positioning of the adapter 50 or the first consumable box 10.

[0252] The specific structure of the fixing base 30 in this embodiment is further described below.

[0253] Reference Figure 37 The fixing base 30 includes a first baffle 341, a second baffle 342, a third baffle 343, a bottom plate 346, and a top plate 347. The mounting cavity 38 is formed by the first baffle 341, the second baffle 342, the third baffle 343, the bottom plate 346, and the top plate 347.

[0254] The first baffle 341 and the second baffle 342 are arranged opposite each other, and the third baffle 343 is connected to the first baffle 341. The bottom plate 346 is connected to the first baffle 341, the second baffle 342, and the third baffle 343. A gap is formed between the bottom plate 346 and the third baffle 343 and the second baffle 342. The chip 21 on the first consumable box 10 can be exposed in the gap. Furthermore, after the disassembly portion 41 passes through the connecting hole 33 in the first direction, it can extend into the gap to remove the chip 21.

[0255] Reference Figure 39 and Figure 40 As shown, the present application further provides an adapter 50. The adapter 50 can be installed in the above-mentioned installation cavity 38. The adapter 50 is provided with an opening 52 to adapt to the first consumables box 10. In addition, the outer wall of the adapter 50 is provided with a relief portion 51 to avoid the ink outlet 12 on the first consumables box 10.

[0256] Reference Figure 40 As shown, the limited portion 13 on the first consumables box 10 can abut against the outer wall of the adapter 50 to achieve positioning of the first consumables box in the third direction.

[0257] The present application also provides a consumables box set, comprising: a second consumables box (not shown in the figure), and the above-mentioned chip disassembly device.

[0258] In one possible implementation, the recycled chip 21 or chip assembly 20 can be used to be installed in a second consumable box. The outer wall of the second consumable box is provided with a chip mounting position. In order to facilitate the installation of the recycled chip 21 or chip assembly 20, the chip 21 or chip assembly 20 can be installed in the chip mounting position by snapping or pasting. In addition, a detachable chip rack can also be provided on the chip mounting position. The chip rack has a mounting groove. The chip 21 or chip assembly 20 can be set in the mounting groove. The chip 21 or chip assembly 20 can be installed in the mounting groove by snapping or pasting, thereby realizing the recycling and reuse of the chip 21, which is beneficial to saving resources and reducing costs.

[0259] In the description of this application, it should be understood that the terms used, such as "center", "length", "width", "thickness", "top", "bottom", "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "inside", "outside", "axial", and "circumferential", indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the position or component referred to must have a specific orientation, a specific structure, and operation, and therefore should not be understood as a limitation on this application.

[0260] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0261] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood broadly. For example, they can mean fixed connection, detachable connection, or integration; they can mean mechanical connection, electrical connection, or mutual communication; they can mean direct connection or indirect connection through an intermediate medium, and they can enable internal communication between two elements or interaction between two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0262] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0263] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A chip disassembly device for disassembling a chip (21) from a first consumables box (10), characterized in that: The chip disassembly device comprises: A fixing seat (30), wherein the fixing seat (30) has a disassembly passage (31) and a positioning portion (3) for positioning the first consumable material box (10), the disassembly passage (31) and the positioning portion (3) are arranged to intersect, the disassembly passage (31) has a communication hole (33), and the communication hole (33) is connected to the positioning portion (3); A disassembly component (40) is movably arranged in the disassembly channel (31), and the disassembly component (40) includes a disassembly portion (41), at least a portion of the disassembly portion (41) is arc-shaped, and the disassembly portion (41) moves along a first direction and can contact the first consumable material box (10) through the connecting hole (33) to disassemble the chip (21).

2. The chip disassembly device according to claim 1, characterized in that: The disassembly assembly (40) further includes a force-applying portion (42), which is movably disposed in the disassembly channel (31) and can drive the disassembly portion (41) to move along a first direction.

3. The chip disassembly device according to claim 2, characterized in that: The disassembly portion (41) is movably connected to the force-applying portion (42), and the force-applying portion (42) abuts against the top of the disassembly portion (41) to drive the disassembly portion (41) to move along the first direction.

4. The chip disassembly device according to claim 2, characterized in that: The disassembly assembly (40) further includes a locking member (43); The locking member (43) is connected to the force-applying portion (42); the force-applying portion (42) can rotate relative to the locking member (43); and the locking member (43) can move along a first direction driven by the force-applying portion (42); Furthermore, the disassembly portion (41) is sleeved on the locking member (43).

5. The chip disassembly device according to claim 4, characterized in that: The locking member (43) comprises: A connecting piece (431), the disassembling portion (41) is sleeved on the connecting piece (431), and the connecting piece (431) is connected to the force-applying portion (42) via an intermediate piece (433); A stopper (432), the stopper (432) is connected to one end of the connecting member (431) away from the force-applying portion (42), and the stopper (432) is arranged away from the first consumable box (10) in a second direction perpendicular to the first direction; and the stopper (432) is against the disassembly portion (41).

6. The chip disassembly device according to claim 2, characterized in that: The disassembly portion (41) is fixedly connected to the force-applying portion (42) and moves along with the force-applying portion (42).

7. The chip disassembly device according to claim 1, characterized in that: The communication hole (33) is located on a side wall of the disassembly channel (31), so that the disassembly channel (31) is communicated with the positioning portion (3), and the chip (21) is exposed in the disassembly channel (31); The depth direction of the disassembly channel (31) and the length direction of the chip (21) both extend along the first direction.

8. The chip disassembly device according to claim 1, characterized in that: A cavity (344) is further provided in the fixing seat (30), the communicating hole (33) is provided at the lower end of the cavity (344), and the disassembly portion (41) can pass through the communicating hole (33) and act on the first consumable box (10) to separate the chip (21) from the first consumable box (10); A guide hole (3441) is further provided at the upper end of the cavity (344), and the disassembly channel (31) is defined between the guide hole (3441) and the communicating hole (33).

9. The chip disassembly device according to claim 2, characterized in that: The force applying portion (42) is connected to the inner wall surface of the disassembly channel (31) via threads.

10. The chip disassembly device according to any one of claims 1 to 7, characterized in that: The positioning portion (3) includes two positioning cavities (32), which are arranged side by side and are respectively located on opposite sides of the disassembly channel (31); Furthermore, the widths of the two positioning cavities (32) are different so as to accommodate the first consumable material boxes (10) of different sizes.

11. The chip disassembly device according to claim 10, characterized in that: Along a second direction perpendicular to the first direction, the top of the positioning cavity (32) is tilted downward so that the depth of the first consumable box (10) extending into the disassembly channel (31) gradually decreases along the first direction.

12. The chip disassembly device according to claim 10, characterized in that: In a second direction perpendicular to the first direction, a cavity wall of the positioning cavity (32) on a side away from the disassembly assembly (40) is provided with an inclined guide portion (321); The first consumable material box (10) abuts against the inclined guide portion (321) so that the chip (21) tilts toward one end of the inclined guide portion (321) along the first direction.

13. The chip disassembly device according to claim 10, characterized in that: The fixing seat (30) comprises: a fixed body (34), the fixed body (34) comprising a first baffle (341), a second baffle (342), and a third baffle (343), the first baffle (341) and the second baffle (342) being arranged opposite to each other, the third baffle (343) being connected to the same side of the first baffle (341) and the second baffle (342), and the positioning cavity (32) being formed between the first baffle (341), the second baffle (342), and the third baffle (343); A disassembly guide portion (35) is provided on one side of the first baffle (341) and the second baffle (342) relative to the third baffle (343), and the disassembly channel (31) is formed in the disassembly guide portion (35).

14. The chip disassembly device according to claim 13, characterized in that: The fixing seat (30) further includes a first limiting portion (36), the first limiting portion (36) being arranged on a side of the disassembly guide portion (35) facing the positioning cavity (32), or the first limiting portion (36) being arranged on an outer wall surface of the disassembly guide portion (35); The first limiting portion (36) abuts against the first consumables box (10) to limit the position of the first consumables box (10) in the positioning cavity (32).

15. The chip disassembly device according to claim 13, characterized in that: The fixing seat (30) also includes a second limiting portion (37), which is arranged on the inner wall surface of at least one of the first baffle (341) and the second baffle (342) facing the positioning cavity (32), and the second limiting portion (37) is configured to abut against one end of the first consumable box (10) so that the position of the chip (21) corresponds to the disassembly channel (31).

16. The chip removal device according to any one of claims 1 to 6 and 8, characterized in that: The positioning portion (3) includes a mounting cavity (38) and at least one adapter (50), and different adapters (50) have different positioning cavities (32) to adapt to different models of the first consumable box (10); Furthermore, the installation cavity (38) can be adapted to one model of the first consumable material box (10).

17. The chip disassembly device according to claim 16, characterized in that: At least two positioning ribs (381) are provided on the cavity wall of the installation cavity (38) on the side corresponding to the chip (21), and the at least two positioning ribs (381) are spaced apart along the first direction and abut against the first consumable box (10) or the adapter (50).

18. The chip disassembly device according to claim 16, characterized in that: In a third direction perpendicular to the first direction, a clamping member (382) is connected to a side of the mounting cavity (38) away from the disassembly channel (31), and the clamping member (382) abuts against the first consumable box (10) or the adapter (50) to limit the movement of the first consumable box (10) in the third direction.

19. A consumables box set, characterized in that: include: Second consumables box; as well as, The chip disassembly device according to any one of claims 1 to 18.

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