Display device

By increasing the number of circuit boards in the display device and optimizing the wiring design, the problem of the length of the flexible circuit board affecting the binding yield is solved, and the production yield of the display device is improved.

CN120636274APending Publication Date: 2025-09-12WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510918935.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-03
Publication Date
2025-09-12

AI Technical Summary

Technical Problem

As the size of display panels increases, the length of flexible circuit boards increases, which affects the yield rate of bonding to the display panels and further affects the production yield rate of the display panels.

Method used

Increasing the number of circuit boards in a display device shortens the length of each circuit board, connecting multiple circuit boards to the driver chip, and adopting a multi-line design to simplify wiring and manufacturing processes, thereby improving the production accuracy and binding yield of the circuit boards.

Benefits of technology

By shortening the length of the circuit board, the manufacturing accuracy and binding yield of the circuit board are improved, thereby improving the production yield of the display device.

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Abstract

The embodiment of the invention provides a display device. The display device comprises a display panel, one or more driving chips and a plurality of circuit boards. The display panel is provided with a binding area. The one or more driving chips are bound to the binding area. The plurality of circuit boards are bound in the binding area. And the at least one circuit board is connected with the corresponding driving chip. Wherein the number of the plurality of circuit boards is greater than the number of the one or more driving chips. Thus, the number of the circuit boards is increased, the length of each circuit board is shortened, and therefore the manufacturing precision of each circuit board is improved. The manufacturing precision of the circuit board is improved, the binding yield of the circuit board can be improved, and then the production yield of the display device is improved.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device. Background Art

[0002] A display device typically includes a display panel, a flexible printed circuit board (FPC), and a driver chip. Both the FPC and the driver chip are bonded to the display panel. Furthermore, the FPC connects to both the display panel and the driver chip, providing signals such as power to the display panel and the signals necessary for the driver chip's operation. Currently, as display panels grow in size, the length of the FPC is adaptively increasing. However, excessive length of the FPC can affect the yield of its bonding to the display panel, and thus the production yield of the display panel. Summary of the Invention

[0003] The embodiments of the present application provide a display device that is beneficial for shortening the length of a circuit board, thereby improving the circuit board manufacturing accuracy and binding yield, so as to at least partially solve the above-mentioned technical problems.

[0004] To achieve the above objectives, according to a first aspect of the present application, a display device is provided. The display device includes a display panel, one or more driver chips, and multiple circuit boards. The one or more driver chips are bound to the binding area. Multiple circuit boards are bound to the binding area. At least one of the circuit boards is connected to a corresponding driver chip; wherein the number of the one or more circuit boards is greater than the number of the one or more driver chips.

[0005] Optionally, the multiple circuit boards include a first circuit board and a second circuit board; the display device also includes multiple first lines and multiple second lines, and the multiple first lines and multiple second lines are located in the binding area; the opposite ends of each first line are respectively connected to one of the first circuit boards and one of the driver chips corresponding to the first circuit board, and each second line is connected to a corresponding one of the second circuit boards.

[0006] Optionally, each of the second traces is electrically insulated from one or more of the driver chips.

[0007] Optionally, the number of the plurality of driving chips is the same as the number of the plurality of first circuit boards, and each of the first circuit boards is connected to a corresponding one of the driving chips via at least two of the first traces.

[0008] Optionally, one second circuit board is located between two adjacent first circuit boards, and at least two second traces connected to one second circuit board are located between two adjacent driving chips.

[0009] Optionally, the display device further includes a plurality of third traces, the plurality of third traces being located in the binding area, and each of the third traces being connected to a corresponding first circuit board; wherein the third trace connected to the first circuit board is located on a side of the first trace connected to the first circuit board that is away from the second trace.

[0010] Optionally, the plurality of second wires include power lines.

[0011] Optionally, the plurality of second wirings further include touch lines, and the touch lines and the power lines are located in different film layers in the display panel, and the touch lines overlap with the power lines.

[0012] Optionally, the display panel further includes a detection circuit, and the plurality of second wirings further include detection lines, and the detection lines are connected to the detection circuit.

[0013] Optionally, the length of each of the first circuit boards is equal to the length of each of the second circuit boards.

[0014] In a display device according to an embodiment of the present application, at least one circuit board is connected to a corresponding driver chip. The number of the multiple circuit boards is greater than the number of the one or more driver chips. Increasing the number of circuit boards helps shorten the length of each circuit board, thereby improving the manufacturing precision of each circuit board. This increased manufacturing precision can improve the bonding yield of the circuit boards, thereby improving the production yield of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the overall structure of a display device provided in an exemplary embodiment of the present application;

[0016] Figure 2 Provided in the exemplary embodiment of this application Figure 1 A schematic diagram of a planar structure of the bending area and the binding area shown;

[0017] Figure 3 Provided in the exemplary embodiment of this application Figure 1 Another schematic diagram of the planar structure of the bending area and the binding area shown;

[0018] Figure 4 Provided in the exemplary embodiment of this application Figure 1 Another schematic diagram of the planar structure of the bending area and the binding area is shown.

[0019] Description of reference numerals:

[0020] 100. Display device;

[0021] 10. Display panel; 10A. Display area; 10B. Non-display area; 10B1. Binding area; 10B2. Bending area;

[0022] 101, first routing; 102, second routing; 103, third routing;

[0023] 20. Driver chip; 201. Source driver chip;

[0024] 30. Circuit board; 301. First circuit board; 302. Second circuit board;

[0025] 40. Power management chip;

[0026] 50. Printed circuit boards;

[0027] 601, data cable; 602, power cable; 603, touch cable;

[0028] 701, detection circuit; 702, detection line;

[0029] 801, first back plate; 802, second back plate; 803, heat dissipation layer; 804, polarizer; 805, protective cover;

[0030] X, first direction; Y, second direction. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0032] Figure 1 Schematic diagram of the overall structure of a display device provided in an exemplary embodiment of the present application. Figure 2 Provided in the exemplary embodiment of this application Figure 1 A schematic diagram of a planar structure of the bending area and the binding area shown. Figure 3 Provided in the exemplary embodiment of this application Figure 1 Another planar structural schematic diagram of the bending area and the binding area is shown. Figure 4 Provided in the exemplary embodiment of this application Figure 1 Another schematic diagram of the planar structure of the bending area and the binding area is shown.

[0033] like Figure 1As shown, the display device 100 includes a display panel 10. The display panel 10 may include any one of a liquid crystal display panel, an organic light emitting diode display panel, a micro light emitting diode display panel, and a sub-millimeter light emitting diode display panel. Exemplarily, the display panel 10 is an organic light emitting diode display panel.

[0034] The display panel 10 has a display area 10A. The display panel 10 may include a substrate (not shown) and a light-emitting device (not shown), which is disposed on the substrate and located in the display area 10A. The display panel 10 may also include a pixel driving circuit (not shown), which is disposed on the substrate and located in the display area 10A and is connected to the light-emitting device. The pixel driving circuit may include a transistor, which may be any one of a metal oxide transistor and a low-temperature polysilicon transistor.

[0035] like Figures 1 to 4 As shown, the display panel 10 further includes a non-display area 10B. The non-display area 10B is located outside the display area 10A. The non-display area 10B includes a binding area 10B1, which is used to bind the driving circuit of the pixel driving circuit.

[0036] like Figures 1 to 4 As shown, the display device 100 further includes one or more driver chips 20 and multiple circuit boards 30. The one or more driver chips 20 are bonded to the bonding area 10B1. Multiple circuit boards 30 are bonded to the bonding area 10B1. At least one circuit board 30 is connected to a corresponding driver chip 20 to provide the corresponding driver chip 20 with the signals required for operation.

[0037] In some embodiments, the number of circuit boards 30 is greater than the number of one or more driver chips 20. This increases the number of circuit boards 30 without increasing the number of driver chips 20, shortening the length of each circuit board 30 and improving the manufacturing precision of each circuit board. Furthermore, the increased manufacturing precision of the circuit boards 30 can improve the bonding yield of the circuit boards 30, thereby increasing the production yield of the display device 100.

[0038] It should be noted that in related art, the number of circuit boards is equal to the number of driver chips, and each circuit board is connected to a corresponding driver chip. As display panels grow in size and the types of signals input to the pixel driver circuits increase, the length of the circuit boards increases, resulting in reduced manufacturing precision and, in turn, reduced binding precision.

[0039] In some embodiments, the plurality of driver chips 20 are arranged along the first direction X. In some embodiments, the plurality of driver chips 20 are located on the same side of the circuit board 30 along the second direction Y, which facilitates simplifying the connection between the circuit board 30 and the corresponding driver chips 20 .

[0040] In some embodiments, as Figures 2 to 4 As shown, the multiple circuit boards 30 are arranged along the first direction X. In some embodiments, along the first direction X, the spacing between any adjacent circuit boards 30 can be the same, so that the multiple circuit boards 30 are arranged at equal intervals, so that the multiple binding sub-areas of the display panel 10 that bind the multiple circuit boards are also arranged at equal intervals, simplifying the manufacturing process of the display panel 10.

[0041] In some embodiments, each circuit board 30 is a flexible circuit board, which includes a flexible substrate and circuits disposed on the flexible substrate.

[0042] In some embodiments, along the first direction X, the length of each circuit board 30 may be less than or equal to 60 mm, so as to improve the manufacturing accuracy of each circuit board 30 , reduce the difficulty of binding thereof, and improve the production yield of the display device 100 .

[0043] In some embodiments, the second direction Y may be perpendicular to the first direction X, but is not limited thereto. In some embodiments, the first direction X may be the length direction of the circuit boards 30 , and the second direction Y may be the width direction of the circuit boards 30 .

[0044] In some embodiments, as Figures 2 to 4 As shown, the multiple circuit boards 30 include a first circuit board 301 and a second circuit board 302. The display device 100 also includes multiple first traces 101 and multiple second traces 102, which are located in the binding area 10B1. Each first trace 101 connects one first circuit board 301 to a corresponding driver chip 20 at its opposite ends. Thus, the first trace 101 can transmit signals output by the first circuit board 301 to the corresponding driver chip 20. Each second trace 102 is connected to a corresponding second circuit board 302, allowing the second trace 102 to output signals output by the second circuit board 302. In this way, the first circuit board 301 performs the function of a conventional flexible circuit board in outputting signals to the driver chip, and the second circuit board 302 performs the function of a conventional flexible circuit board in outputting signals to the signal line. The combination of the first and second circuit boards 301, 302, can replace the function of a conventional flexible circuit board, thereby increasing the number of circuit boards. On the basis of increasing the number of circuit boards, the lengths of the first circuit board 301 and the second circuit board 302 are both shorter, and the manufacturing precision of both is higher, which improves the yield of binding the two to the display panel 10, thereby improving the production yield of the display device 100.

[0045] In some embodiments, each second trace 102 can be electrically insulated from one or more driver chips 20. Thus, the signal output by the second circuit board 302 is output to other structures outside the one or more driver chips 20 via the second trace 102. The second circuit board 302 functions like a traditional flexible circuit board, directly outputting signals to other structures outside the driver chips 20.

[0046] In other embodiments, the at least one second circuit board 302 may be connected to the corresponding at least one driver chip 20 via the at least one second trace 102 .

[0047] In some embodiments, the number of the plurality of driver chips 20 is the same as the number of the plurality of first circuit boards 301, and each first circuit board 301 is connected to a corresponding driver chip 20 via at least one first trace 101. Thus, the first circuit boards 301 and the driver chips 20 are connected in a one-to-one manner. The connection structure between the first circuit boards 301 and the driver chips 20 can follow the connection structure between conventional flexible circuit boards and driver chips, reducing the need for adjustments to the connection structure between the driver chips 20 and the plurality of circuit boards 30 required to increase the number of circuit boards, thereby reducing the manufacturing difficulty of the display device 100 when the number of circuit boards 30 is increased.

[0048] In some embodiments, as Figures 2 to 4 As shown, a second circuit board 302 is located between two adjacent first circuit boards 301, and at least two second traces 102 connected to the second circuit board 302 are located between two adjacent driver chips 20. Thus, when adjusting the traces connecting adjacent flexible circuit boards in the related art so that the traces are connected to the first circuit board 301 and the second circuit board 302, respectively, at least a portion of the traces near the gaps between adjacent flexible circuit boards in the related art can be adjusted to connect to the second circuit board 302. This reduces the adjustment range of the traces in the gaps between adjacent flexible circuit boards in the related art, thereby reducing the manufacturing difficulty of the display device 100 when the number of circuit boards 30 is increased.

[0049] It should be noted that in related art, the multiple traces connected to each flexible circuit board are located on either side of the corresponding driver chip, with the traces on one side adjacent to the gap between adjacent flexible circuit boards, and the traces on the other side located on the side of the driver chip away from the gap. In some embodiments of the present application, the traces adjacent to the gap between adjacent flexible circuit boards are adjusted to connect to the second circuit board 302, and the adjustment range of the positions of the traces adjacent to the gap between adjacent flexible circuit boards is not large.

[0050] In some embodiments, the length of each first circuit board 301 can be equal to the length of each second circuit board 302. In this way, the lengths of the binding sub-areas on the display panel 10 for binding the first circuit board 301 and the second circuit board 302 are the same, simplifying the manufacturing process of the display device 100.

[0051] In some embodiments, the second circuit board 302 may be provided with redundant pins (not shown in the figure), which are electrically insulated from the traces in the display area 10A of the display panel 10 so that the length of the second circuit board 302 can be the same as the length of the second circuit board 302.

[0052] In some embodiments, as Figures 2 to 4 As shown, the display device 100 may further include a plurality of third traces 103. The plurality of third traces 103 are located in the binding area 10B1. Each third trace 103 is connected to a corresponding first circuit board 301, allowing the first circuit board 301 to output signals to other structures outside the driver chip 20 via the third traces 103. The first trace 101 connected to the first circuit board 301 is located between the third trace 103 and the second trace 102 connected to the first circuit board 301. Thus, when the traces connecting adjacent flexible circuit boards in the related art are adjusted so that the traces are connected to the first circuit board 301 and the second circuit board 302 respectively, the connection method between the third trace 103 and the first circuit board 301 can follow the connection method for traces located away from the gaps between adjacent flexible circuit boards in the related art. In other words, when the number of circuit boards is increased, there is no need to adjust the connection method and layout of traces located away from the gaps between adjacent flexible circuit boards in the related art, thereby simplifying the manufacturing process of the display device 100.

[0053] In some embodiments, as Figures 2 to 4 As shown, along the first direction X, at least part of the second traces 102 connected to a second circuit board 302 is located between adjacent driver chips 20. In this way, at least part of the second traces 102 are arranged in the gaps between adjacent driver chips 20, simplifying the wiring design of at least part of the second traces 102.

[0054] It should be noted that when the number of the driver chips 20 is two or more, Figures 2 to 4 The combination design of two first circuit boards 301 and one second circuit board 302 can be repeatedly arranged along the first direction X.

[0055] In some embodiments, as Figures 2 to 4As shown, the driver chip 20 may include a source driver chip 201. The display panel 10 may also include a plurality of data lines 601. The plurality of data lines 601 extend from the display area 10A to the binding area 10B1 of the non-display area 10B and are connected to the source driver chip 201. Each source driver chip 201 outputs a data signal to the corresponding data line 601. The first circuit board 301 is also connected to the source driver chip 201 via the first trace 101.

[0056] In some embodiments, as Figure 1 As shown, the display device 100 may further include a printed circuit board 50, which is connected to the multiple circuit boards 30. A power management chip 40 may be provided on the printed circuit board 50, and the power signal output by the power management chip 40 may be output to the display panel 10 via at least one circuit board 30. A timing controller (not shown) may also be provided on the printed circuit board 50, and the data signal output by the timing controller may be output to the source driver chip 201 via at least the first circuit board 301. The printed circuit board 50 may also be provided with a touch control chip (not shown), and the touch signal output by the touch control chip may be output to the display panel 10 via at least one circuit board 30.

[0057] In some embodiments, as Figures 2 to 4 As shown, the second trace 102 may include a power line 602. Since the number of power lines connected to each flexible circuit board in conventional technology is large, and the power lines are usually close to the gaps between adjacent flexible circuit boards, it is easier to adjust the power line 602 to connect with the second circuit board 302.

[0058] In some embodiments, the at least two power lines 602 connected to the second circuit board 302 may be connected to each other to reduce the resistance voltage drop of the power signal transmitted by the at least two power lines 602 .

[0059] In some embodiments, the power line 602 may include at least one of a first power line and a second power line, wherein the first power line may be used to output a positive power voltage VDD, and the second power line may be used to transmit a negative power voltage VSS.

[0060] In some embodiments, as Figures 3 and 4As shown, the second trace 102 also includes a touch line 603. The touch line 603 and the power line 602 are located in different film layers in the display panel 10, and the touch line 603 overlaps with the power line 602. In conventional technology, a flexible circuit board is usually directly connected to the touch line to transmit the touch signal to the touch electrode in the display area through the touch line. In the embodiment of the present application, the touch trace connected to the flexible circuit board in conventional technology is adjusted to be connected to the second circuit board 302, so that the second circuit board 302 can transmit not only the power signal but also the touch signal, which is more conducive to shortening the length of the first circuit board 301. In addition, the touch line 603 and the power line 602 are located in different film layers and overlap. The power line 602 transmits a fixed voltage, so that it can play a shielding role and improve the interference problem caused by other signals on the touch signal transmitted by the touch line 603.

[0061] In some embodiments, as Figure 4 As shown, the display panel 10 also includes a detection circuit 701, and the plurality of second traces 102 also include a detection line 702, which is connected to the detection circuit 701. In conventional technology, a flexible circuit board is usually connected to the detection line, and the detection circuit is adjacent to and connected to the driver chip to control whether the signal output by the driver chip is output to the display area, thereby achieving detection. In the embodiment of the present application, the detection line 702 connected to the flexible circuit board is adjusted to be connected to the second circuit board 302, so that the second circuit board 302 can transmit the detection signal, making the length of the first circuit board 301 shorter than that of a conventional flexible circuit board.

[0062] In some embodiments, the detection line 702 is located on the side of the power line 602 close to the first circuit board 301. When the detection line 702 extends to connect to the detection circuit 701, the length of the detection line 702 can be shorter, and the connection method between the detection line 702 and the detection circuit 701 can be simple.

[0063] In some embodiments, the detection circuit 701 may include a detection transistor, a source and a drain of the detection transistor are connected between the source driver chip 201 and the data line 601 , and a gate of the detection transistor is connected to the detection line 702 .

[0064] In some embodiments, the first trace 101 may include at least one of a power line 602, a touch line 603, and a detection line 702. Thus, the first trace 101 may also transmit at least one of a power signal, a touch signal, and a detection signal. For example, the first trace 101 may include a power line 602 and a touch line 603.

[0065] In some embodiments, as Figures 1 to 4As shown, the display panel 10 may further include a bending area 10B2. The portion of the display panel 10 corresponding to the bending area 10B2 is connected between the portion of the display panel 10 corresponding to the display area 10A and the portion of the display panel 10 corresponding to the binding area 10B1. The portion of the display panel 10 corresponding to the bending area 10B2 may be curved in a circular or elliptical arc shape, such that the portion of the display panel 10 corresponding to the binding area 10B1 is located on the back side of the light-emitting surface of the display panel 10, thereby reducing the bezel of the display panel 10. The power line 602 and touch line 603 described above both extend from the binding area 10B1 to the bending area 10B2 to connect with the corresponding traces in the display area 10A.

[0066] In some embodiments, as Figure 1 As shown, the display device 100 further includes a first backplane 801 and a second backplane 802. The first backplane 801 and the second backplane 802 are located between a portion of the display panel 10 corresponding to the display area 10A and a portion of the display panel 10 corresponding to the binding area 10B1. Furthermore, the first backplane 801 is fixed to the portion of the display panel 10 corresponding to the display area 10A via an adhesive layer, and the second backplane 802 is fixed to the portion of the display panel 10 corresponding to the binding area 10B1 via an adhesive layer.

[0067] In some embodiments, as Figure 1 As shown, the display device 100 further includes a heat dissipation layer 803, which is located between the first back plate 801 and the second back plate 802. In some embodiments, the heat dissipation layer 803 may include a foam layer and a metal layer, with the foam layer located between the metal layer and the first back plate 801. The metal layer is connected to the second back plate 802 via an adhesive layer. The printed circuit board 50 is fixed to the heat dissipation layer 803.

[0068] In some embodiments, as Figure 1 As shown, the display device 100 further includes a polarizer 804 . The polarizer 804 is located on the light-emitting side of the display panel 10 and is fixed on the light-emitting surface of the display panel 10 .

[0069] In some embodiments, as Figure 1 As shown, the display device 100 further includes a protective cover plate 805 , which is located on the light-emitting side of the display panel 10 and fixed on the polarizer 804 .

[0070] In other embodiments, the portion of the display panel 10 corresponding to the display area 10A may also be coplanar with the portion of the display panel 10 corresponding to the binding area 10B1 , that is, the display panel 10 is not curved.

[0071] In summary, in the display device of the embodiment of the present application, at least one circuit board is connected to a corresponding driver chip. The number of the multiple circuit boards is greater than the number of the one or more driver chips. Increasing the number of circuit boards helps shorten the length of each circuit board, thereby improving the manufacturing precision of each circuit board. This increased manufacturing precision of the circuit boards can improve the bonding yield of the circuit boards, thereby improving the production yield of the display device.

[0072] The description of the above embodiments is only used to help understand the technical solutions and core ideas of this application; ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display device, characterized in that: include: a display panel having a binding area; One or more driver chips, bound to the binding area; A plurality of circuit boards are bound to the binding area, and at least one of the circuit boards is connected to the corresponding driver chip; wherein the number of the one or more circuit boards is greater than the number of the one or more driver chips.

2. The display device according to claim 1, wherein The plurality of circuit boards include a first circuit board and a second circuit board; The display device also includes multiple first lines and multiple second lines, and the multiple first lines and the multiple second lines are located in the binding area; the opposite ends of each first line are respectively connected to a first circuit board and a driver chip corresponding to the first circuit board, and each second line is connected to a corresponding second circuit board.

3. The display device according to claim 2, wherein: Each of the second traces is electrically insulated from one or more of the driver chips.

4. The display device according to claim 2, wherein: The number of the plurality of driving chips is the same as the number of the plurality of first circuit boards, and each of the first circuit boards is connected to a corresponding one of the driving chips via at least one first trace.

5. The display device according to claim 4, wherein: One second circuit board is located between two adjacent first circuit boards, and at least two second traces connected to one second circuit board are located between two adjacent driving chips.

6. The display device according to claim 5, wherein: The display device also includes a plurality of third traces, which are located in the binding area, and each of the third traces is connected to a corresponding first circuit board; wherein the first trace connected to the first circuit board is located between the third trace connected to the first circuit board and the second trace.

7. The display device according to any one of claims 2 to 6, characterized in that: The plurality of second traces include power lines.

8. The display device according to claim 7, wherein: The plurality of second wirings further include touch lines, the touch lines and the power lines are located in different film layers of the display panel, and the touch lines overlap with the power lines.

9. The display device according to any one of claims 2 to 6, characterized in that: The display panel further includes a detection circuit, and the plurality of second wirings further include detection lines, which are connected to the detection circuit.

10. The display device according to any one of claims 2 to 6, characterized in that: The length of one of the first circuit boards is equal to the length of one of the second circuit boards.