Semiconductor manufacturing apparatus, push-up method, and semiconductor device manufacturing method

Abstract

Provided are a technique relating to a semiconductor manufacturing apparatus, a push-up method, and a method for manufacturing a semiconductor device, whereby it is possible to easily create a time pattern recipe. The semiconductor manufacturing apparatus includes: a push-up unit having a plurality of blocks capable of independently moving up and down; a display device that displays a setting screen in which the push-up order of the plurality of blocks is composed of a plurality of steps and the heights of the plurality of blocks can be input for each step; and a control unit configured so as to be able to set a plurality of push-up parameters by one input of a setting item of a setting screen, and to control the operation of the plurality of blocks on the basis of the set plurality of push-up parameters.

Description

Technical Field

[0001] The present invention relates to a semiconductor manufacturing apparatus and can be applied to, for example, a die mounter having a push-up unit. Background Art

[0002] One of the steps in the semiconductor device manufacturing process is the peeling step of peeling the bare chips separated from the wafer from the dicing tape. In this peeling step, for example, a push-up unit is used to peel the bare chips one by one from the back of the dicing tape held by the wafer supply unit. The bare chips are then picked up using a suction nozzle such as a collet provided on a pickup head or placement head.

[0003] The push-up unit is configured to independently move multiple blocks. The push-up sequence of the multiple blocks is composed of multiple steps, and the movement of the multiple blocks of the push-up unit is controlled based on a time chart recipe that can set the height and speed of the multiple blocks for each block and each step.

[0004] (For example, Patent Document 1)

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2020-161534 Summary of the Invention

[0008] The time chart recipe disclosed in Patent Document 1 is complex and difficult to create, requiring time and effort.

[0009] The present invention aims to provide a technique for easily creating a time chart recipe. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings.

[0010] The outline of the representative aspects of the present invention will be briefly described as follows.

[0011] That is, the semiconductor manufacturing device comprises: a push-up unit, which has multiple blocks, and each of the multiple blocks can move up and down independently; a display device, which displays a setting screen in which the push-up sequence of the multiple blocks is composed of multiple steps and the height of the multiple blocks can be input according to each step; and a control unit, which can set multiple push-up parameters according to an input of a setting item of the setting screen, and control the movement of the multiple blocks based on the set multiple push-up parameters.

[0012] Effects of the Invention

[0013] According to the present invention, a time chart recipe can be easily created. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1It is a schematic plan view showing a configuration example of a die mounter in the embodiment.

[0015] Figure 2 It means Figure 1 A diagram showing the schematic structure when viewed from the direction of arrow A.

[0016] Figure 3 Yes Figure 1 A schematic cross-sectional view of the main parts of the wafer supply unit is shown.

[0017] Figure 4 Yes Figure 1 The block diagram shows the schematic structure of the control system of the chip mounter.

[0018] Figure 5 Is to use Figure 1 FIG. 1 is a flow chart of a method for manufacturing a semiconductor device using a chip mounter.

[0019] Figure 6 yes Figure 2 A top view of the push-up unit is shown.

[0020] Figure 7 It indicates schematically Figure 6 A cross-section of an important part of the push-up unit is shown.

[0021] Figure 8 This is a diagram schematically showing an example of connection between blocks and drive shafts when the number of blocks is less than four.

[0022] Figure 9 This is a diagram explaining the flow of setting a time chart recipe based on the setting screen.

[0023] Figure 10 This is a diagram showing an example of a setting screen for a multi-stage operation in a four-stage block and the heights of the blocks based on this example.

[0024] Figure 11 Is based on Figure 10 The diagram shows the block operation timing of the push-up sequence obtained by setting the values ​​on the setting screen.

[0025] Figure 12 This is a diagram showing a setting example of a reverse multi-stage operation setting screen and the heights of blocks based on this example.

[0026] Figure 13 Is based on Figure 12 The diagram shows the block operation timing of the push-up sequence obtained by setting the values ​​on the setting screen.

[0027] Figure 14 This is a diagram showing a setting example of a setting screen for a reverse multi-stage operation in a three-stage block and the height of the blocks based on this example.

[0028] Figure 15 This is a diagram showing a setting example of a setting screen for a reverse multi-stage operation in a secondary block and the height of the blocks based on this example.

[0029] Figure 16 This is a diagram showing another example of the setting screen for the reverse multi-stage operation in the four-stage block and the height of the block based on this example.

[0030] Figure 17 This figure shows an example of a setting screen for common operations in a four-level block and the height of the blocks based on this example.

[0031] Figure 18 This is a diagram showing another example of the setting screen for the reverse multi-stage operation in the four-stage block and the height of the block based on this example.

[0032] Figure 19 Is based on Figure 18 The diagram shows the block operation timing of the push-up sequence obtained by setting the values ​​on the setting screen.

[0033] Description of Reference Numerals

[0034] 1. Chip mounter (semiconductor manufacturing equipment)

[0035] 13···Push-up unit

[0036] BL1~BL4···block

[0037] 80···Control Department

[0038] 83a···Monitor (display device) DETAILED DESCRIPTION

[0039] The following describes the embodiments using the accompanying drawings. However, in the following description, identical components may be denoted by the same reference numerals, and duplicate descriptions may be omitted. Furthermore, to clarify the description, the drawings may sometimes schematically represent the width, thickness, shape, and other aspects of various components, as compared to their actual appearance. Furthermore, the dimensional relationships and ratios of various elements may not necessarily be consistent across multiple drawings.

[0040] use Figures 1 to 3 The structure of a die mounter as one embodiment of a semiconductor manufacturing apparatus will be described. Figure 1 It is a schematic plan view showing a configuration example of a die mounter in the embodiment. Figure 2 It means Figure 1 A diagram of the schematic structure when viewed from the direction of arrow A. Figure 3 Yes Figure 1 A schematic cross-sectional view of the main parts of the wafer supply unit is shown.

[0041] The die bonder 1 generally comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a placement unit 40, a conveyor unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y2-Y1 direction represents the front-to-back direction of the die bonder 1, the X2-X1 direction represents the left-to-right direction, and the Z1-Z2 direction represents the up-down direction. The wafer supply unit 10 is located at the front of the die bonder 1, and the placement unit 40 is located at the rear.

[0042] The wafer supply unit 10 includes a wafer cassette elevator 11 , a wafer holding table 12 , a push-up unit 13 , and a wafer recognition camera 14 .

[0043] The wafer cassette elevator 11 moves a wafer cassette (not shown) containing multiple wafer rings WR up and down to a wafer transfer height. A wafer alignment chute (not shown) aligns the wafer rings WR supplied from the wafer cassette elevator 11. A wafer extractor (not shown) removes wafer rings WR from the wafer cassette and supplies them to the wafer holding table 12, or removes them from the wafer holding table 12 and stores them in the wafer cassette.

[0044] The wafer holding table 12 includes an expansion ring 121 for holding the wafer ring WR and a support ring 122 for holding the wafer ring WR and horizontally positioning the dicing tape DT.

[0045] A wafer W is bonded (attached) to the dicing tape DT. The wafer W is divided into a plurality of bare chips D. A film-shaped adhesive material DF called a die attach film (DAF) is attached between the wafer W and the dicing tape DT. The adhesive material DF is cured by heating.

[0046] The wafer holding table 12 moves in the X1-X2 direction and the Y1-Y2 direction via a drive unit (not shown), moving the picked-up bare chip D to the position of the push-up unit 13. Furthermore, the wafer holding table 12 rotates the wafer ring WR within the XY plane via a drive unit (not shown). The push-up unit 13 moves in the vertical direction via a drive unit (not shown). The push-up unit 13 peels the bare chip D from the dicing tape DT. The wafer holding table 12 and the push-up unit 13 constitute a pickup device (semiconductor manufacturing apparatus). The pickup device may also include a pickup unit 20.

[0047] When pushing up the bare die D, the wafer holding table 12 lowers the expansion ring 121 holding the wafer ring WR. At this time, since the support ring 122 does not descend, the dicing tape DT held by the wafer ring WR is stretched, increasing the spacing between the bare die D. This prevents the bare die D from interfering with or contacting each other, allowing for separation and easier pushing up. The expansion ring 121 and support ring 122 are collectively referred to as the expander. The push-up unit 13 pushes the bare die D upward from below to peel the bare die D, improving the collet's ability to pick up the bare die D.

[0048] The wafer recognition camera 14 recognizes the pickup position of the bare chip D picked up from the wafer W and performs surface inspection of the bare chip D.

[0049] The pickup unit 20 includes a pickup head 21 and a Y-drive unit 23. The pickup head 21 is provided with a collet chuck 22, which holds the peeled bare chip D by suction at its front end. The pickup head 21 picks up the bare chip D from the wafer supply unit 10 and places it on the intermediate stage 31. The Y-drive unit 23 moves the pickup head 21 in the Y1-Y2 direction. The pickup unit 20 includes various drive units (not shown) that raise and lower, rotate, and move the pickup head 21 in the X direction.

[0050] The intermediate stage unit 30 includes an intermediate stage 31 on which a bare chip D is placed, and a stage recognition camera 34 for identifying the bare chip D on the intermediate stage 31. The intermediate stage 31 has suction holes for sucking the placed bare chip D. The placed bare chip D is temporarily held on the intermediate stage 31. The intermediate stage 31 serves as a placement stage for placing the bare chip D and also as a pickup stage for picking up the bare chip D.

[0051] The mounting section 40 includes a mounting head 41, a Y drive section 43, a substrate recognition camera 44, and a mounting platform 46. The mounting head 41 is provided with a collet 42, which adsorbs and holds the bare chip D at the front end. The Y drive section 43 moves the mounting head 41 in the Y1-Y2 direction. The substrate recognition camera 44 photographs the position recognition mark (not shown) of the substrate S to identify the mounting position. Here, a plurality of product areas (hereinafter referred to as package areas P) that eventually become one package are formed on the substrate S. Position recognition marks are provided for each package area P. When the bare chip D is placed on the substrate S, the mounting platform 46 rises and supports the substrate S from below. The mounting platform 46 has a suction port (not shown) for vacuum adsorption of the substrate S, which can fix the substrate S. The mounting platform 46 has a heating section (not shown) for heating the substrate S. The mounting section 40 has various drive sections (not shown) that lift, rotate, and move the mounting head 41 in the X direction.

[0052] With this configuration, the placement head 41 corrects the pickup position and posture based on the image data from the stage recognition camera 34, and picks up the bare chip D from the intermediate stage 31. Furthermore, the placement head 41 places the bare chip D on the package area P of the substrate S based on the image data from the substrate recognition camera 44, or places the bare chip D in a stacked form on a bare chip already placed on the package area P of the substrate S.

[0053] The transport unit 50 includes a transport claw 51 that grips and transports the substrate S, and a transport path 52 along which the substrate S moves. The substrate S moves in the X direction by driving a nut (not shown) on the transport claw 51 of the transport path 52, which is not shown, using a ball screw (not shown) provided along the transport path 52. With this structure, the substrate S moves from the substrate supply unit 60 along the transport path 52 to the placement position. After placement, the substrate S moves to the substrate removal unit 70, where it is delivered.

[0054] The substrate supply unit 60 takes out the substrate S held in the transport jig and carried in from the transport jig and supplies it to the transport unit 50. The substrate unloading unit 70 holds the substrate S transported by the transport unit 50 on the transport jig.

[0055] Next, use Figure 4 The control unit 80 will be described. Figure 4 Yes Figure 1 The block diagram shows the schematic structure of the control system of the chip mounter.

[0056] The control system 8 includes a control unit (control device) 80, a drive unit 86, a signal unit 87, an optical system 88, etc. The control unit 80 generally includes a control and computing device 81 mainly composed of a CPU (Central Processing Unit), a storage device 82, an input / output device 83, a bus 84, and a power supply unit 85. The storage device 82 includes a main storage device 82a and an auxiliary storage device 82b. The main storage device 82a is composed of a RAM (Random Access Memory) that stores processing programs, etc. The auxiliary storage device 82b is composed of an HDD (Hard Disk Drive) or an SSD (Solid State Drive) that stores control programs, process recipes, control data required for control, image data, etc. The process recipe is a combination of steps and conditions in the manufacturing process of the semiconductor device described later by the control unit 80 and can obtain a specified result, and functions as a program.

[0057] The input / output device 83 includes a monitor 83a for displaying device status and information, a touch panel 83b for inputting operator instructions, a mouse 83c for operating the monitor 83a, and an image capture device 83d for capturing image data from the optical system 88. The input / output device 83 also includes a motor control unit 83e and an I / O signal control unit 83f. The motor control unit 83e controls the XY table (not shown) of the wafer supply unit 10, the ZY drive axes of the placement head table, and the drive unit of the push-up unit 13. The I / O signal control unit 83f receives signals from and controls a signal unit 87 that includes various sensors and switches or knobs for controlling the brightness of lighting devices. The optical system 88 includes the wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44. The control and calculation unit 81 receives necessary data and performs calculations via the bus 84, controls the pickup head 21, and transmits information to the monitor 83a and other devices.

[0058] use Figure 5 A part of the manufacturing process of a semiconductor device (a method of manufacturing a semiconductor device) using the die mounter 1 will be described. Figure 5 Is to use Figure 1 In the following description, the operation of each component constituting the die mounter 1 is controlled by the control unit 80 .

[0059] (Wafer loading process: process S1)

[0060] A wafer cassette (not shown) containing a wafer ring WR is loaded into the wafer cassette elevator 11 . The wafer supply unit 10 takes out the wafer ring WR from the wafer cassette filled with the wafer ring WR and carries it onto the wafer holding table 12 .

[0061] (Substrate loading process: process S2)

[0062] The transport jig holding the substrate S is loaded into the substrate supply unit 60 . The substrate supply unit 60 takes out the substrate S from the transport jig. The taken-out substrate S is carried into the mounting unit 40 via the transport unit 50 .

[0063] (Picking process: process S3)

[0064] After step S1, the wafer holding table 12 is moved so that the desired bare chip D can be picked up from the dicing tape DT. The bare chip D is imaged by the wafer recognition camera 14, and the bare chip D is positioned and inspected based on the image data obtained. Image processing is performed on the image data to calculate the offset (in the X, Y, and θ directions) of the bare chip D on the wafer holding table 12 from the die placement machine's bare chip position reference point, and then position the bare chip. Furthermore, the wafer holding table 12 is pre-set and maintained at a predetermined position with respect to the bare chip position reference point as the initial setting of the device. Image processing is then performed on the image data to inspect the surface of the bare chip D.

[0065] The positioned bare chip D is peeled from the dicing tape DT by the push-up unit 13 and the pickup head 21 . The bare chip D peeled from the dicing tape DT is sucked and held by the collet 22 provided on the pickup head 21 , and is transported and placed on the intermediate stage 31 .

[0066] The stage recognition camera 34 captures the bare chip D on the intermediate stage 31. The resulting image data is used to perform positioning and surface inspection of the bare chip D. Image processing is performed on the image data to calculate the offset (in the X, Y, and θ directions) of the bare chip D on the intermediate stage 31 from the die placement machine's bare chip position reference point, allowing for positioning. Furthermore, the intermediate stage 31 is pre-set and maintained at a predetermined position with respect to the bare chip position reference point as the initial setting for the device. Image processing is then performed on the image data to perform surface inspection of the bare chip D.

[0067] The pickup head 21 that has conveyed the bare chip D to the intermediate stage 31 returns to the wafer supply unit 10. The next bare chip D is peeled from the dicing tape DT in the above-described order, and the bare chips D are subsequently peeled one by one from the dicing tape DT in the same order.

[0068] (Placement process: process S4)

[0069] The conveying unit 50 conveys the substrate S to the mounting platform 46. The substrate S placed on the mounting platform 46 is photographed by the substrate recognition camera 44, and the positioning and surface inspection of the substrate S are performed based on the image data obtained by the photography. By performing image processing on the image data, the offset (X, Y, and θ directions) of the substrate S from the substrate position reference point of the chip mounter 1 is calculated. In addition, the predetermined position of the mounting unit 40 is pre-set as the initial setting of the device and maintained. By performing image processing on the image data, the surface inspection of the substrate S is performed.

[0070] The placement head 41's suction position is corrected based on the offset of the bare chip D on the intermediate stage 31 calculated in step S3, and the bare chip D is then suctioned by the collet 42. The placement head 41, having suctioned the bare chip D from the intermediate stage 31, then places the bare chip D on a predetermined portion of the substrate S supported on the placement stage 46. The predetermined portion of the substrate S is the package area P of the substrate S, an area where components are already placed and then added to it, or a placement area for components that are stacked. The bare chip D placed on the substrate S is photographed by the substrate recognition camera 44, and based on the image data captured by the photographing, an inspection is performed to determine whether the bare chip D is placed in the desired position.

[0071] The placement head 41 that has placed the bare chip D on the substrate S returns to the intermediate stage 31. Following the above sequence, the next bare chip D is picked up from the intermediate stage 31 and placed on the substrate S. By repeating this sequence, bare chips D are placed on all the packaging areas P of the substrate S.

[0072] (Substrate Unloading Step: Step S5)

[0073] The substrate S with the bare chip D mounted thereon is conveyed to the substrate unloading unit 70. The substrate S is taken out from the conveying claws 51 by the substrate unloading unit 70 and stored in a conveying jig. The conveying jig storing the substrate S is unloaded from the die mounter 1.

[0074] As described above, the bare chip D is mounted on the substrate S and unloaded from the die mounter 1. Thereafter, for example, the transport jig holding the substrate S with the mounted bare chip D is transported to a wire bonding step, where the electrodes of the bare chip D are electrically connected to the electrodes of the substrate S via Au wires or the like. The substrate S is then transported to an injection molding step, where the bare chip D and the Au wires are sealed with an injection resin (not shown), completing the semiconductor package.

[0075] Next, use Figure 6 and Figure 7 The push-up unit 13 will be described. Figure 6 yes Figure 2 A top view of the push-up unit is shown. Figure 7 It indicates schematically Figure 6 A cross-section of an important part of the push-up unit is shown.

[0076] The push-up unit 13 includes a first unit 131 and a second unit 132 to be mounted on the first unit 131. The second unit 132 is a common part regardless of the type, and the first unit 131 is a part that can be replaced for each type.

[0077] The first unit 131 is provided with a block portion 1311 on a cylindrical dome 1312. An opening 1313 is provided in the center of the upper surface of the dome 1312 to enable the block portion 1311 to move up and down. A plurality of suction ports 1314 and a plurality of grooves 1315 connecting the plurality of suction ports 1314 are provided on the outer peripheral portion of the opening 1313 on the upper surface of the dome 1312. When the push-up unit 13 is raised so that its upper surface contacts the back surface of the cutting tape DT, the interior of the suction port 1314 is depressurized by a suction mechanism (not shown). At this time, the back surface of the cutting tape DT is sucked downward and in close contact with the upper surface of the dome 1312.

[0078] The block portion 1311 has a plurality of blocks that push the cutting tape DT upward. Here, an example is shown in which the block portion 1311 has four blocks BL1 to BL4. The innermost block BL4 is in the shape of a quadrangular prism. The three outer blocks BL1 to BL3 are in the shape of a quadrangular cylinder, each having a quadrilateral opening extending in the Z1-Z2 direction. A block BL2 smaller in size than block BL1 is arranged inside block BL1. Furthermore, a block BL3 smaller in size than block BL2 is arranged inside block BL2. Furthermore, a block BL4 smaller in size than block BL3 is arranged inside block BL3.

[0079] Of the four blocks BL1 to BL4, the outermost block BL1 has a diameter slightly smaller than the outer periphery of the bare chip D to be peeled. This allows the outer peripheral corners of the top surface of block BL1 to be slightly inward of the outer edge of the bare chip D. This allows the force separating the bare chip D and dicing tape DT to be concentrated at the starting point (the outermost periphery of the bare chip D) when peeling the two.

[0080] Second unit 132, serving as a drive unit, includes four drive shafts ND4 to ND1 that independently drive blocks BL1 to BL4 in the vertical direction. For example, each drive shaft ND1 to ND4 consists of a motor and a push rod mechanism that converts the motor's rotation into vertical movement. The front ends (upper ends) of the drive shafts ND4 to ND1 connected to blocks BL1 to BL4 are referred to as needles. The needles of the drive shafts ND1 to ND4 are referred to as NDL1 to NDL4, respectively.

[0081] Alternatively, the number of blocks of the first unit 131 may be less than four. In this case, among the drive shafts ND1 to ND4 of the second unit 132, there are some that are in motion and some that are not in motion. Figure 8 Provide explanation. Figure 8 This is a diagram schematically showing an example of connection between blocks and drive shafts when the number of blocks is less than four.

[0082] In the case of using three blocks BL1 to BL3, for example, Figure 8In the 3BLK type push-up unit 13 shown, the block BL1 is driven by the drive shaft ND4, the block BL2 is driven by the drive shaft ND3, and the block BL3 is driven by the drive shaft ND1. In other words, the drive shaft ND2 does not operate. Alternatively, the block BL3 may be driven by the drive shaft ND2 instead of the drive shaft ND1.

[0083] In the case of using two blocks BL1, BL2, for example, Figure 8 In the 2BLK type push-up unit 13 shown, the block BL1 is driven by the drive shaft ND4, and the block BL2 is driven by the drive shaft ND1. That is, the drive shafts ND2 and ND3 do not operate. Alternatively, the block BL2 may be driven by the drive shaft ND3 instead of the drive shaft ND1.

[0084] Since each block BL1 to BL4 of the push-up unit 13 can operate independently, the push-up unit 13 can perform various operations (push-up sequences). The push-up sequence of multiple blocks is composed of multiple steps.

[0085] For example, the push-up unit 13 can simultaneously push up blocks BL1 to BL4 in the first step, simultaneously push up blocks BL2 to BL4 in the second step, simultaneously push up blocks BL3 and BL4 in the third step, and finally push up block BL4 in the fourth step. This operation is referred to as a multi-stage operation in this specification. A multi-stage operation involving four blocks is referred to as a multi-stage operation in a four-stage block.

[0086] Furthermore, the push-up unit 13 can simultaneously push up blocks BL1 to BL4 in the first step, lower block BL1 in the second step, lower block BL2 in the third step, and lower block BL3 in the fourth step. In this specification, this operation is referred to as a reverse multi-stage operation. The reverse multi-stage operation of four blocks is referred to as a reverse multi-stage operation in a four-stage block.

[0087] Next, use Figure 9 The following describes a method for setting the time chart recipe 200 that defines the operation of the push-up unit 13. The time chart recipe 200 constitutes a part of the process recipe. Figure 9 This is a diagram explaining the flow of setting a time chart recipe based on the setting screen.

[0088] In the setting screen 100, for example, there is a setting screen 101 for multi-stage action (FMS1), a setting screen 102 for reverse multi-stage action (FMS2), and a setting screen 103 for general action (FMS3). In the setting screen 103, it is possible to set the multi-stage action and the reverse multi-stage action. The operator selects a setting screen from the plurality of setting screens 101, 102, and 103 using the touch panel 83b or the like. The control unit 80 displays the selected setting screen on the monitor 83a. Then, the operator inputs a setting value for the item on the setting screen. Based on the input setting value, the control unit 80 sets the push-up parameter (PARA) of the time chart recipe 200 (creates the time chart recipe 200). In addition, the control unit 80 can rewrite (set) the time chart recipe 200 in real time and change the push-up action based on information obtained from images of sensors and recognition cameras.

[0089] The control unit 80 is configured to control the drive shafts ND4 to ND1 that drive blocks BL1 to BL4, respectively, based on the push-up parameters set in the time chart recipe. The push-up parameters are set, for example, by inputting values ​​into a setting screen displayed on the monitor 83a. The push-up parameters include the push-up height, push-up speed, and timing for each of NDL1 to NDL4.

[0090] Here, the push-up height refers to the position (height) of the front ends of NDL1 to NDL4. The heights of NDL1 to NDL4 are sometimes referred to as NDL1_H to NDL4_H, or collectively referred to as NDL_H. When the top ends of blocks BL1 to BL4 are located on the upper surface of dome 1312, NDL_H = 0. Sometimes, the heights of NDL1 to NDL4 are referred to as the heights of blocks BL4 to BL1. When referring to the heights of blocks BL4 to BL1, the upper surface of dome 1312 serves as the reference.

[0091] The push-up speed (V) refers to the rising speed (VU) or the falling speed (VD) of NDL1 to NDL4 (blocks BL4 to BL1).

[0092] Timing (T) refers to the time from the end of the rise or fall of NDL1 to NDL4 (blocks BL4 to BL1) in each step to the start of the rise or fall of NDL1 to NDL4 (blocks BL4 to BL1) in the next step. Timing is also called the action time difference (interval time) used to adjust the processing time between each block. In addition, the length of one step is the time from NDL1 to NDL4 (blocks BL4 to BL1) from the stopped state to the time when it reaches the predetermined height. Instead of timing, the length (time) of one step can also be set as a parameter. In this case, the time includes the time from NDL1 to NDL4 (blocks BL4 to BL1) from the stopped state to the time when it reaches the predetermined height and the time to maintain its height and stop.

[0093] The following describes an example of push-up parameters set in a time chart recipe for a push-up unit 13 having four drive shafts. Here, n=1 to 4, and m=1 to 4.

[0094] NDLm_H_Sn: Parameter of the height (H) of needle m (NDLm) in the nth step (Sn)

[0095] NDLm_VU_Sn: Parameter of the upward push-up speed (VU) of the needle m (NDLm) in the nth step (Sn)

[0096] NDLm_VD_Sn: Parameter of the downward push-up speed (VD) of the needle m (NDLm) in the nth step (Sn)

[0097] NDLm_T_Sn: Parameters of the timing (T) of hand m (NDLm) in the nth step (Sn)

[0098] [Setting example of FMS1]

[0099] Next, use Figure 10 right Figure 7 A setting example of the multi-stage motion setting screen 101 in the push-up unit 13 and its operation will be described. Figure 10 This is a diagram showing an example of a setting screen for a multi-stage operation in a four-stage block and the heights of the blocks based on this example.

[0100] The operator operates touch panel 83b to select setting screen 101. Control unit 80 displays setting screen 101 on monitor 83a. On setting screen 101, NDL1_H [μm] can be entered for the first setting, NDL2_H [μm] for the second setting, NDL3_H [μm] for the third setting, and NDL4_H [μm] for the fourth setting. "-" indicates that data cannot be entered. For the first through fourth settings, the push-up speed [mm / sec] and timer [msec] can be entered.

[0101] NDL1_H, NDL2_H, NDL3_H, and NDL4_H for each step can be set using a single data set. On the setting screen 101, enter "600" for NDL1_H in the first setting, "450" ​​for NDL2_H in the second setting, "300" for NDL3_H in the third setting, and "150" for NDL4_H in the fourth setting.

[0102] The push-up speed and timer for each step can be set using the common data in NDL1 to NDL4. In the setting screen 101, enter "5" for the push-up speed and "100" for the timer in the first to third settings. In the fourth setting, enter "1" for the push-up speed and "500" for the timer.

[0103] The following describes the setting of the push-up parameters based on the values ​​input to the setting screen 101 .

[0104] (Fourth setting: setting of the first step (STEP 1))

[0105] When “150” is input to NDL4_H, the control unit 80 sets “150” to NDL4_H_S1 and sets “150”, which is the same value as NDL4_H_S1, to NDL1_H_S1, NDL2_H_S1, and NDL3_H_S1.

[0106] If "1" is input for the push-up speed, the control unit 80 sets NDL1_VU_S1, NDL2_VU_S1, NDL3_VU_S1, and NDL4_VU_S1 to "1." Furthermore, if "1" is input for the push-up speed, the control unit 80 sets NDL1_VD_S1, NDL2_VD_S1, NDL3_VD_S1, and NDL4_VD_S1 to "1."

[0107] When “500” is input for the timer, the control unit 80 sets “500” for NDL1_T_S1 , NDL2_T_S1 , NDL3_T_S1 , and NDL4_T_S1 .

[0108] (Third setting: Setting of the second step (STEP 2))

[0109] When "300" is input to NDL3_H, the control unit 80 sets "300" to NDL3_H_S2 and sets "300" to NDL1_H_S2 and NDL2_H_S2, which are the same value as NDL3_H_S2. Furthermore, the control unit 80 sets "150" to NDL4_H_S2, which is the same value as NDL4_H_S1 in the fourth setting.

[0110] If "5" is input for the push-up speed, the control unit 80 sets NDL1_VU_S2, NDL2_VU_S2, NDL3_VU_S2, and NDL4_VU_S2 to "5". Also, if "5" is input for the push-up speed, the control unit 80 sets NDL1_VD_S2, NDL2_VD_S2, NDL3_VD_S2, and NDL4_VD_S2 to "5".

[0111] When “100” is input for the timer, the control unit 80 sets “100” to NDL1_T_S2, NDL2_T_S2, NDL3_T_S2, and NDL4_T_S2.

[0112] (Second setting: Setting of the third step (STEP 3))

[0113] If "450" ​​is input to NDL2_H, the control unit 80 sets "450" ​​to NDL2_H_S3 and sets "450" ​​to NDL1_H_S3, which is the same value as NDL2_H_S3. Furthermore, the control unit 80 sets "300" to NDL3_H_S3, which is the same value as NDL3_H_S2 in the third setting, and sets "150" to NDL4_H_S3, which is the same value as NDL4_H_S1 in the fourth setting.

[0114] If "5" is input for the push-up speed, the control unit 80 sets NDL1_VU_S3, NDL2_VU_S3, NDL3_VU_S3, and NDL4_VU_S3 to "5". Also, if "5" is input for the push-up speed, the control unit 80 sets NDL1_VD_S3, NDL2_VD_S3, NDL3_VD_S3, and NDL4_VD_S3 to "5".

[0115] When “100” is input for the timer, the control unit 80 sets “100” to NDL1_T_S3, NDL2_T_S3, NDL3_T_S3, and NDL4_T_S3.

[0116] (First setting: Setting of the fourth step (STEP 4))

[0117] If "600" is input to NDL1_H, the control unit 80 sets "600" to NDL1_H_S4. Furthermore, the control unit 80 sets "450" ​​to NDL2_H_S4, which is the same value as the second setting NDL2_H_S3, and "300" to NDL3_H_S4, which is the same value as the third setting NDL3_H_S2, and "150" to NDL4_H_S4, which is the same value as the fourth setting NDL4_H_S1.

[0118] If "5" is input for the push-up speed, the control unit 80 sets NDL1_VU_S4, NDL2_VU_S4, NDL3_VU_S4, and NDL4_VU_S4 to "5". Also, if "5" is input for the push-up speed, the control unit 80 sets NDL1_VD_S4, NDL2_VD_S4, NDL3_VD_S4, and NDL4_VD_S4 to "5".

[0119] When “100” is input for the timer, the control unit 80 sets “100” to NDL1_T_S4, NDL2_T_S4, NDL3_T_S4, and NDL4_T_S4.

[0120] If the push-up parameters are set as above, then Figure 10 As shown within the dotted line BLK, in the first step, blocks BL1 to BL4 are pushed up to a height of 150 μm. In the second step, blocks BL2 to BL4 are pushed up to a height of 300 μm. In the third step, blocks BL3 and BL4 are pushed up to a height of 450 μm. In the fourth step, block BL4 is pushed up to a height of 600 μm.

[0121] In addition, the control unit 80 may also Figure 10 As shown in the dotted line BLK, the status of the heights of the blocks BL1 to BL4 in the first to fourth steps is displayed on the setting screen 101 based on the set parameters.

[0122] use Figure 11 Right Figure 10 The operation of each block set on the setting screen 101 shown in FIG. Figure 11 Is based on Figure 10 The diagram shows the block operation timing of the push-up sequence obtained by setting the values ​​on the setting screen.

[0123] First, the picking action before the action of each block of the push-up unit 13 is explained. The picking action starts when the target bare chip D on the dicing tape DT is positioned by the push-up unit 13 and the collet 22. If the positioning is completed, vacuum is drawn through the suction port 1314 of the push-up unit 13 and the gaps between the blocks BL1 to BL4, so that the dicing tape DT is adsorbed on the upper surface of the push-up unit 13. At this time, the upper surfaces of the blocks BL1 to BL4 are at the same height (initial position) as the upper surface of the dome 1312. In this state, vacuum is supplied from the vacuum supply source, and the collet 22 descends toward the device surface of the bare chip D while drawing vacuum, so that it lands.

[0124] Step 1:

[0125] Blocks BL1 to BL4 are raised at a speed of 1 mm / sec to a height of 150 μm and then stop. After 100 msec has passed since the end of the first step (blocks BL1 to BL4 stop), the second step is entered.

[0126] Step 2:

[0127] Blocks BL2 to BL4 are raised at a speed of 5 mm / sec to a height of 300 μm and then stop. After 100 msec has passed since the end of the second step (blocks BL2 to BL4 stop), the process proceeds to the third step.

[0128] Step 3:

[0129] Blocks BL3 and BL4 are raised at a speed of 5 mm / sec to a height of 450 μm and then stop. After 100 msec has passed since the end of the third step (blocks BL3 and BL4 stop), the process proceeds to the fourth step.

[0130] Step 4:

[0131] The block BL4 is raised at a speed of 5 mm / sec to a height of 600 μm and stops. After a time of 100 msec has passed since the end of the fourth step (stopping of the block BL4), the collet 22 starts to rise.

[0132] [FMS2 setting example]

[0133] Next, use Figure 12 right Figure 7 A setting example of a setting screen for the reverse multi-stage motion in the push-up unit 13 shown in FIG. 1 and its operation will be described. Figure 12 This is a diagram showing a setting example of a reverse multi-stage operation setting screen and the heights of blocks based on this example.

[0134] The operator operates touch panel 83b to select setting screen 102. Control unit 80 displays setting screen 102 on monitor 83a. On setting screen 102, users can enter NDL2_H [μm] for the first setting, NDL3_H [μm] for the second setting, NDL4_H [μm] for the third setting, and NDL1_H [μm] for the fourth setting. For the first through fourth settings, users can enter the push-up speed [mm / sec] and timer [msec].

[0135] NDL1_H, NDL2_H, NDL3_H, and NDL4_H for each step can be set using a single data item. On the setting screen 102, enter "0" for NDL2_H in the first setting, "0" for NDL3_H in the second setting, "0" for NDL4_H in the third setting, and "150" for NDL1_H in the fourth setting.

[0136] The push-up speed and timer for each step can be set using the common data in NDL1 to NDL4. In the setting screen 102, enter "5" for the push-up speed and "100" for the timer in the first to third settings. In the fourth setting, enter "1" for the push-up speed and "500" for the timer.

[0137] The following describes the setting of the push-up parameters based on the values ​​input to the setting screen 102 .

[0138] (Fourth setting: setting of the first step)

[0139] When “150” is input to NDL1_H, the control unit 80 sets “150” to NDL1_H_S1 and sets “150”, which is the same value as NDL1_H_S1, to NDL2_H_S1, NDL3_H_S1, and NDL4_H_S1.

[0140] If "1" is input for the push-up speed, the control unit 80 sets NDL1_VU_S1, NDL2_VU_S1, NDL3_VU_S1, and NDL4_VU_S1 to "1." Furthermore, if "1" is input for the push-up speed, the control unit 80 sets NDL1_VD_S1, NDL2_VD_S1, NDL3_VD_S1, and NDL4_VD_S1 to "1."

[0141] When “500” is input for the timer, the control unit 80 sets “500” for NDL1_T_S1 , NDL2_T_S1 , NDL3_T_S1 , and NDL4_T_S1 .

[0142] (Third setting: Setting of the second step)

[0143] When “0” is input to NDL4_H, the control unit 80 sets “0” to NDL4_H_S2 and sets “150”, which is the same value as the fourth setting NDL1_H_S1, to NDL1_H_S2, NDL2_H_S2, and NDL3_H_S2.

[0144] If "5" is input for the push-up speed, the control unit 80 sets NDL1_VU_S2, NDL2_VU_S2, NDL3_VU_S2, and NDL4_VU_S2 to "5". Also, if "5" is input for the push-up speed, the control unit 80 sets NDL1_VD_S2, NDL2_VD_S2, NDL3_VD_S2, and NDL4_VD_S2 to "5".

[0145] When “100” is input for the timer, the control unit 80 sets “100” to NDL1_T_S2, NDL2_T_S2, NDL3_T_S2, and NDL4_T_S2.

[0146] (Second setting: Setting of the third step)

[0147] When "0" is input to NDL3_H, the control unit 80 sets "0" to NDL3_H_S3 and sets "150" to NDL1_H_S3 and NDL2_H_S3, which are the same value as the fourth setting NDL1_H_S1. Furthermore, the control unit 80 sets "0" to NDL4_H_S3, which is the same value as the third setting NDL4_H_S2.

[0148] If "5" is input for the push-up speed, the control unit 80 sets NDL1_VU_S3, NDL2_VU_S3, NDL3_VU_S3, and NDL4_VU_S3 to "5". Also, if "5" is input for the push-up speed, the control unit 80 sets NDL1_VD_S3, NDL2_VD_S3, NDL3_VD_S3, and NDL4_VD_S3 to "5".

[0149] When “100” is input for the timer, the control unit 80 sets “100” to NDL1_T_S3, NDL2_T_S3, NDL3_T_S3, and NDL4_T_S3.

[0150] (First setting: Setting of the fourth step)

[0151] If "0" is input to NDL2_H, the control unit 80 sets "0" to NDL2_H_S4 and sets "150" to NDL1_H_S4, which is the same value as NDL1_H_S1 in the fourth setting. Furthermore, the control unit 80 sets "0" to NDL3_T_S4, which is the same value as NDL3_H_S3 in the second setting, and sets "0" to NDL4_H_S4, which is the same value as NDL4_H_S2 in the third setting.

[0152] If "5" is input for the push-up speed, the control unit 80 sets NDL1_VU_S4, NDL2_VU_S4, NDL3_VU_S4, and NDL4_VU_S4 to "5". Also, if "5" is input for the push-up speed, the control unit 80 sets NDL1_VD_S4, NDL2_VD_S4, NDL3_VD_S4, and NDL4_VD_S4 to "5".

[0153] When “100” is input for the timer, the control unit 80 sets “100” to NDL1_T_S4, NDL2_T_S4, NDL3_T_S4, and NDL4_T_S4.

[0154] If the push-up parameters are set as above, then Figure 12As shown within the dotted line BLK, in the first step, blocks BL1 to BL4 are raised to a height of 150 μm. In the second step, block BL1 is lowered to a height of 0 μm. In the third step, block BL2 is lowered to a height of 0 μm. In the fourth step, block BL3 is lowered to a height of 0 μm.

[0155] In addition, the control unit 80 may also Figure 12 As shown in the dotted line BLK, the status of the heights of the blocks BL1 to BL4 in the first to fourth steps is displayed on the setting screen 102 based on the set parameters.

[0156] use Figure 13 Right Figure 12 The operation of the blocks set on the setting screen 102 shown in FIG. Figure 13 Is based on Figure 12 The diagram shows the block operation timing of the push-up sequence obtained by setting the values ​​on the setting screen.

[0157] Step 1:

[0158] Blocks BL1 to BL4 are raised at a speed of 1 mm / sec to a height of 150 μm and then stop. After 500 msec has passed since the end of the first step (blocks BL1 to BL4 stop), the second step is entered.

[0159] Step 2:

[0160] The block BL1 descends at a speed of 5 mm / sec to a height of 0 μm and stops. After 100 msec has passed since the end of the second step (stopping of the block BL1), the process proceeds to the third step.

[0161] Step 3:

[0162] The block BL2 is lowered at a speed of 5 mm / sec to a height of 0 μm and stops. After 100 msec has passed since the end of the third step (stopping of the block BL2), the process proceeds to the fourth step.

[0163] Step 4:

[0164] The block BL3 descends at a speed of 5 [mm / sec] to a height of 0 [μm] and stops. After a time of 100 msec has passed since the end of the fourth step (stopping of the block BL3), the collet 22 starts to ascend.

[0165] [Example of setting the third-level block of FMS2]

[0166] use Figure 14 right Figure 8A setting example of the reverse multi-stage motion setting screen 102 in the 3BLK type push-up unit 13 shown and its operation will be described. Figure 14 This is a diagram showing a setting example of a setting screen for a reverse multi-stage operation in a three-stage block and the height of the blocks based on this example.

[0167] NDL2 is not used in the 3BLK type push-up unit 13. Therefore, the operator inputs the same value "150" as NDL1_H in the fourth setting for NDL2_H in the first setting, "5" for the push-up speed, and "0" for the timer. Figure 12 The same values ​​as those in the setting screen 102 shown in FIG. 2 are set in the second to fourth settings except for the parameters related to NDL2. Figure 12 The push-up unit of the reverse multi-stage action shown has the same push-up parameters.

[0168] The following describes the setting of push-up parameters based on the values ​​input into the setting screen 102. Furthermore, since NDL2_H in the first setting is the same value as NDL1_H in the fourth setting, and the timer in the first setting is "0," indicating that NDL2 is not in use, the control unit 80 sets the parameters related to NDL2 to "0."

[0169] [Example of setting the secondary block of FMS2]

[0170] use Figure 15 An example of setting the reverse multi-stage motion setting screen and its operation in the 2BLK type push-up unit 13 will be described. Figure 15 This is a diagram showing a setting example of a setting screen for a reverse multi-stage operation in a secondary block and the height of the blocks based on this example.

[0171] NDL2 and NDL3 are not used in the 2BLK type push-up unit 13. Therefore, the operator inputs "150" which is the same value as NDL1_H in the fourth setting for NDL2_H in the first setting, inputs "5" for the push-up speed, and inputs "0" for the timer. The operator inputs "150" which is the same value as NDL1_H in the fourth setting for NDL3 in the second setting, inputs "5" for the push-up speed, and inputs "0" for the timer. Here, the operator inputs the same value as NDL1_H in the third and fourth settings. Figure 12 The control unit 80 sets the same values ​​as those in the setting screen shown in FIG. Figure 12 The push-up unit of the reverse multi-stage action shown has the same push-up parameters.

[0172] The following describes the setting of push-up parameters based on the values ​​input into the setting screen 102. Furthermore, since NDL2_H in the first setting is the same value as NDL1_H in the fourth setting, and the timer in the first setting is "0," NDL2 is not used, and the control unit 80 sets the parameters related to NDL2 to "0." Furthermore, since NDL3_H in the second setting is the same value as NDL1_H in the fourth setting, and the timer in the second setting is "0," NDL3 is not used, and the control unit 80 sets the parameters related to NDL3 to "0."

[0173] [Other setting examples of the fourth-level block of FMS2]

[0174] use Figure 16 right Figure 7 Another setting example and operation of the setting screen 102 for the reverse multi-stage motion in the push-up unit 13 shown in FIG. 1 will be described. Figure 16 This is a diagram showing another example of the setting screen for the reverse multi-stage operation in the four-stage block and the height of the block based on this example.

[0175] Figure 16 The setting screen 102 shown can be used to select settings. Figure 12 In the setting screen 102 shown, NDL4_H [μm] is further input in the fourth setting.

[0176] Push speed and timing input and Figure 12 The setting screen 102 shown is the same. The input of the first to third settings NDL1_H to NDL4_H is the same as Figure 12 The setting screen 102 shown is the same. In the fourth setting, "150" is input for NDL1_H and "75" is input for NDL4_H. In the fourth setting, "1" is input for the push-up speed and "500" is input for the timer.

[0177] The push-up parameter settings based on the values ​​entered in the first to third settings of the setting screen 102 are similar to Figure 12 The following describes parameter settings based on the fourth setting.

[0178] (Fourth setting: setting of the first step)

[0179] If "150" is input to NDL1_H, "150" is set to NDL1_H_S1, and the same value "150" as NDL1_H_S1 is set to NDL2_H2_S1 and NDL3_H_S1. If "75" is input to NDL4_H, the control unit 80 sets "75" to NDL4_H_S1.

[0180] If "1" is input for the push-up speed, the control unit 80 sets NDL1_VU_S1, NDL2_VU_S1, NDL3_VU_S1, and NDL4_VU_S1 to "1." Furthermore, if "1" is input for the push-up speed, the control unit 80 sets NDL1_VD_S1, NDL2_VD_S1, NDL3_VD_S1, and NDL4_VD_S1 to "1."

[0181] When “500” is input for the timer, the control unit 80 sets “500” for NDL1_T_S1 , NDL2_T_S1 , NDL3_T_S1 , and NDL4_T_S1 .

[0182] If the push-up parameters are set as above, then Figure 16 As shown in the dotted line BLK, in the first step, the blocks BL1 to BL3 are pushed up to a height of 150 [μm], and the fourth block BL4 is pushed up to a height of 75 [μm]. Figure 12 The setting screen 102 shown is the same, so the second to fourth steps are the same as Figure 12 The setting screen 102 shown operates in the same manner.

[0183] In addition, the control unit 80 may also Figure 16 As shown in the dotted line BLK, the status of the heights of the blocks BL1 to BL4 in the first to fourth steps is displayed on the setting screen 102 based on the set parameters.

[0184] [FMS3 setting example]

[0185] Next, use Figure 17 right Figure 7 An example of setting a setting screen for a common action in the push-up unit 13 and its operation will be described. Figure 17 This figure shows an example of a setting screen for common operations in a four-level block and the height of the blocks based on this example.

[0186] The operator operates touch panel 83b to select setting screen 103. Control unit 80 displays setting screen 103 on monitor 83a. On setting screen 103, NDL1_H [μm], NDL2_H [μm], NDL3_H [μm], NDL4_H [μm], the push-up speed [mm / sec], and the push-up speed (descent) [mm / sec] can be input for each step. Furthermore, NDL1_T [msec], NDL2_T [msec], NDL3_T [msec], and NDL4_T [msec] can be input for each step. Common values ​​for the push-up speed (VU) for ascending and the push-up speed (VD) for descending are set for NDL1 to NDL4.

[0187] The setting screen 103 is different from the setting screens 101 and 102 in that it requires input of settings for all items in each step. Figure 17 The push-up parameters set by inputting the setting screen 103 shown in FIG. Figure 12 The push-up parameters set by inputting on the setting screen 102 shown are the same.

[0188] [Other setting examples of FMS3]

[0189] use Figure 18 right Figure 7 Another setting example and operation of the setting screen 103 for the reverse multi-stage motion in the push-up unit 13 shown in FIG. 1 will be described. Figure 18 This is a diagram showing another example of the setting screen for the reverse multi-stage operation in the four-stage block and the height of the block based on this example.

[0190] In the first setting, enter "300" for NDL1_H and "0" for NDL2_H to NDL4_H. Enter "5" for the ascending push-up speed (VU) and "5" for the descending push-up speed (VD). Enter "100" for NDL1_T to NDL4_T. In the second setting, enter "300" for NDL1_H to NDL4_H. Enter "5" for VU and "5" for VD. Enter "160" for NDL1_T, "160" for NDL2_T, "130" for NDL3_T, and "100" for NDL4_T.

[0191] The following describes the setting of the push-up parameter based on the value input to the setting screen 103 .

[0192] (Second setting: Setting of the first step)

[0193] When “300” is input to NDL1_H to NDL4_H, the control unit 80 sets “300” to NDL1_H_S1, NDL2_H_S1, NDL3_H_S1, and NDL4_H_S1.

[0194] If "5" is input to VU, the control unit 80 sets "5" to NDL1_VU_S1, NDL2_VU_S1, NDL3_VU_S1, and NDL4_VU_S1. If "5" is input to VD, the control unit 80 sets "5" to NDL1_VD_S1, NDL2_VD_S1, NDL3_VD_S1, and NDL4_VD_S1.

[0195] If "160" is input to NDL1_T, "160" is input to NDL2_T, "130" is input to NDL3_T, and "100" is input to NDL4_T, the control unit 80 sets "160" to NDL1_T_S1, "160" to NDL2_T_S1, "130" to NDL3_T_S1, and "100" to NDL4_T_S1.

[0196] (First setting: Setting of the second step)

[0197] When "300" is input to NDL1_H, the control unit 80 sets NDL1_H_S2 to "300." When "0" is input to NDL2_H to NDL4_H, the control unit 80 sets NDL2_H_S2, NDL3_H_S2, and NDL4_H_S2 to "0."

[0198] If "5" is input to VU, the control unit 80 sets "5" to NDL1_VU_S2, NDL2_VU_S2, NDL3_VU_S2, and NDL4_VU_S2. If "5" is input to VD, the control unit 80 sets "5" to NDL1_VD_S2, NDL2_VD_S2, NDL3_VD_S2, and NDL4_VD_S2.

[0199] If "100" is input to NDL1_T, "100" is input to NDL2_T, "100" is input to NDL3_T, and "100" is input to NDL4_T, the control unit 80 sets "100" to NDL1_T_S2, "100" to NDL2_T_S2, "100" to NDL3_T_S2, and "100" to NDL4_T_S2.

[0200] If the push-up parameters are set as above, then Figure 18 As shown in the dotted line BLK, in the first step, the blocks BL1 to BL4 are pushed up to a height of 300 [μm]. In the second step, the blocks BL1, BL2, and BL3 are lowered in this order.

[0201] In addition, the control unit 80 may also Figure 18 As shown in the dotted line BLK, the status of the heights of the blocks BL1 to BL4 in the first to fourth steps is displayed on the setting screen 103 based on the set parameters.

[0202] use Figure 19 right Figure 18 The operation of the blocks set on the setting screen 103 shown in FIG. Figure 19 Is based on Figure 18The diagram shows the block operation timing of the push-up sequence obtained by setting the values ​​on the setting screen.

[0203] Step 1:

[0204] Blocks BL1 to BL4 ascend at a speed of 5 mm / sec to a height of 300 μm and then stop. After 100 msec from the time block BL1 stops (end of the first step), block BL1 enters the second step. After 130 msec from the time block BL2 stops (end of the first step), block BL2 enters the second step. After 160 msec from the time block BL3 stops (end of the first step), block BL3 enters the second step. After 160 msec from the time block BL4 stops (end of the first step), block BL4 enters the second step.

[0205] Step 2:

[0206] Block BL1 descends at a speed of 5 mm / sec to a height of 0 μm and stops. Block BL2 descends at a speed of 5 mm / sec to a height of 0 μm and stops. Block BL3 descends at a speed of 5 mm / sec to a height of 0 μm and stops. Block BL4 maintains a height of 300 μm.

[0207] The time point when the second step ends (the latest block among blocks BL1 to BL3 stops) becomes the starting point of NDL1_T to NDL4_T of the first setting (second step). After 100 msec from the end of the second step, the collet 22 starts to rise.

[0208] According to this embodiment, at least one of the following effects is achieved.

[0209] (a) Multiple push-up parameters can be set by inputting a single setting item on the setting screen, thereby reducing input effort.

[0210] (b) Parameters for all blocks or steps can be set with one input in one block or step, thereby reducing input effort and errors.

[0211] (c) By providing a specific setting screen for the push-up sequence, it is possible to limit the input items.

[0212] (d) Through the above (c), it is easy to expand the parameters from the input setting value.

[0213] (e) According to the above (c), the inputting effort can be reduced.

[0214] As mentioned above, the invention completed by the present inventors has been specifically described based on the embodiments. However, the present invention is not limited to the above-mentioned embodiments, and various modifications are possible, of course.

[0215] In the embodiment, an example in which four drive shafts are provided has been described, but the number may be more or less than four.

[0216] In the embodiment, an example in which a block is used as the pushing means is described, but a needle may also be used.

[0217] In the embodiment, an example using a die bonding film has been described. However, a pre-treatment portion for applying an adhesive to a substrate may be provided without using a die bonding film.

[0218] In the embodiments, a die placement machine is described in which a pickup head picks up bare chips from a wafer supply unit and places them on an intermediate stage, and a placement head places the bare chips placed on the intermediate stage on a substrate. However, the present invention is not limited to this embodiment and is also applicable to a die placement device that picks up bare chips from a wafer supply unit.

[0219] For example, the present invention can also be applied to a die mounter that does not have an intermediate stage and a pickup head, but uses a placement head to mount a bare chip of a wafer supply unit on a substrate.

[0220] Furthermore, the present invention can also be applied to a flip chip mounter that does not have an intermediate stage and picks up a bare chip from a wafer supply unit, rotates a bare chip pickup head upward, and delivers the bare chip to a placement head, which then places the bare chip on a substrate.

[0221] In the embodiment, the die mounter is described as an example, but the present invention is also applicable to a semiconductor manufacturing apparatus that places picked-up bare chips on a tray.

Claims

1. A semiconductor manufacturing device, characterized in that: have: A push-up unit having a plurality of blocks, each of which can independently move up and down; a display device that displays a setting screen in which the order of pushing up the plurality of blocks is composed of a plurality of steps and the height of the plurality of blocks can be input for each step; and The control unit is configured to enable setting of a plurality of push-up parameters by inputting a single setting item on a setting screen, and to control operations of the plurality of blocks based on the set plurality of push-up parameters.

2. The semiconductor manufacturing apparatus according to claim 1, wherein The display device is configured to display a setting screen for inputting a first push-up sequence and a setting screen for inputting a second push-up sequence, The first push-up sequence is a multi-stage action sequence of pushing all the blocks up to a predetermined height and pushing the inner blocks up in sequence. The second push-up sequence is a sequence of reverse multi-stage actions in which all the blocks are pushed up to a predetermined height and then sequentially lowered from the outer blocks.

3. The semiconductor manufacturing apparatus according to claim 2, wherein: The setting screen for inputting the first push-up order allows inputting the height of the outermost block in the input area of ​​the first step and inputting the height of the inner block adjacent to the outermost block in the input area of ​​the second step.

4. The semiconductor manufacturing apparatus according to claim 2, wherein: The setting screen for inputting the second push-up order is configured so that the height of the innermost block can be input in the input area of ​​the first step, and the height of the outermost block can be input in the input area of ​​the second step.

5. The semiconductor manufacturing apparatus according to claim 2, wherein: The display device is configured to display a setting screen on which the first push-up order and the second push-up order can be input.

6. The semiconductor manufacturing apparatus according to any one of claims 1 to 4, wherein: The control unit is configured to be able to set the push-up parameter for the heights of all the blocks in each step based on the input of the height of one block in each step on the setting screen.

7. The semiconductor manufacturing apparatus according to any one of claims 1 to 5, wherein: The setting screen is configured to allow input of push-up speeds of the plurality of blocks for each step.

8. The semiconductor manufacturing apparatus according to any one of claims 1 to 5, wherein: The setting screen is configured to allow input of a timer for each step, the timer being the time from when the plurality of blocks are raised or lowered to when the plurality of blocks are raised or lowered in the next step.

9. The semiconductor manufacturing apparatus according to claim 4, wherein: The setting screen is configured so that the height of the outermost block can also be input in the input area of ​​the first step.

10. A method for pushing up a semiconductor manufacturing apparatus, the method comprising: a pushing-up unit having a plurality of blocks, each of the plurality of blocks being independently movable up and down; and a display device for displaying a setting screen in which a sequence for pushing up the plurality of blocks is constituted by a plurality of steps and in which a height of the plurality of blocks can be input for each step. The method is characterized by comprising: a step of setting a plurality of push-up parameters based on one input of a setting item on the setting screen; and A step of controlling the operations of the plurality of blocks based on the set parameters.

11. A method for manufacturing a semiconductor device, characterized in that: include: a step of peeling a bare chip from a wafer held on a wafer ring and picking up the bare chip using the push-up method of claim 10; and The picked-up bare chip is mounted on a substrate.

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