A chip ultra-thin packaging structure and chip packaging method

Abstract

This invention provides an ultra-thin chip packaging structure and a chip packaging method, relating to the field of chip packaging technology. The packaging structure includes a molding compound, within which a packaged chip is disposed. The packaged chip is mounted on a substrate. A thermally conductive layer is disposed on the side of the packaged chip away from the substrate. A thermally conductive plate is disposed on the side of the thermally conductive layer away from the packaged chip. A plurality of thermally conductive strips are disposed on the side of the thermally conductive plate away from the thermally conductive layer. The ends of the thermally conductive strips away from the thermally conductive plate are connected to a heat sink. The thermally conductive strips are arranged along the length direction of the heat sink. The side of the heat sink away from the thermally conductive strips is exposed in the molding compound, forming a heat dissipation surface. In this invention, by arranging a plurality of thermally conductive strips along the length direction of the heat sink, the overall bending stiffness of the heat sink can be improved, thereby enhancing the bending resistance of the packaging structure. When the packaging structure is subjected to external force, the heat sink with thermally conductive strips can reduce the bending deformation of the packaging structure and extend the chip's lifespan.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to a chip ultra-thin packaging structure and a chip packaging method. BACKGROUND

[0002] With the rapid development of electronic technology, electronic products gradually develop towards miniaturization and thinness, which puts forward higher requirements for chip packaging technology.

[0003] A chip ultra-thin packaging structure is disclosed in Chinese Patent No. CN217062075U, which belongs to the technical field of chip packaging and comprises a base, a shell, a chip and a plurality of pins. The shell is connected to the base, and an installation cavity is formed between the shell and the base. The chip is installed in the installation cavity, and the pins are installed between the base and the shell and extend outward from the installation cavity. The chip ultra-thin packaging structure has small size and good stability. The heat in the installation cavity can be quickly dissipated through the pins, so that the chip can work in a more suitable environment, thereby ensuring the long-term stable operation of the chip.

[0004] The above-mentioned chip ultra-thin packaging structure can meet the needs of ultra-thin electronic products. However, as the thickness of the chip ultra-thin packaging structure decreases, the bending and impact resistance of the packaging structure also decreases. When the packaging structure is subjected to external force, it is easy to be damaged due to bending deformation, which affects the service life of the chip. SUMMARY

[0005] The present application provides a chip ultra-thin packaging structure and a chip packaging method to solve the technical problem that the current chip ultra-thin packaging structure is easy to be damaged due to bending deformation when subjected to external force.

[0006] To solve the above technical problems, the present application discloses a chip ultra-thin packaging structure, comprising: a plastic encapsulation body, a packaging chip is arranged in the plastic encapsulation body, the packaging chip is arranged on a substrate, a heat conduction layer is arranged on the side of the packaging chip away from the substrate, a heat conduction plate is arranged on the side of the heat conduction layer away from the packaging chip, a plurality of heat conduction strips are arranged on the side of the heat conduction plate away from the heat conduction layer, one end of the heat conduction strip away from the heat conduction plate is connected with a heat dissipation plate, the heat conduction strip is arranged along the length direction of the heat dissipation plate, and the heat dissipation plate is exposed to the plastic encapsulation body on the side away from the heat conduction strip and forms a heat dissipation surface.

[0007] Preferably, the plurality of heat conduction strips are arranged at equal intervals, and the length of the heat conduction strip is equal to the length of the heat dissipation plate.

[0008] Preferably, a plurality of first heat conduction blocks are arranged between the front and rear two heat conduction strips, and the first heat conduction blocks are connected with the front and rear two heat conduction strips on the front and rear sides, respectively.

[0009] Preferably, the second heat-conducting block is arranged between two first heat-conducting blocks adjacent to each other, and the front and rear sides of the second heat-conducting block are connected with the heat-conducting strips on the front and rear sides, respectively.

[0010] Preferably, the upper end of the first heat-conducting block is connected with the lower surface of the heat-conducting plate, a first gap is arranged between the lower end of the first heat-conducting block and the upper surface of the heat-dissipating plate, the lower end of the second heat-conducting block is connected with the upper surface of the heat-dissipating plate, and a second gap is arranged between the upper end of the second heat-conducting block and the lower surface of the heat-conducting plate.

[0011] Preferably, a plurality of through holes are arranged at a position close to the upper end of the first heat-conducting block, and the through holes pass through the left and right sides of the first heat-conducting block.

[0012] The application further provides a chip packaging method for the chip ultra-thin packaging structure.

[0013] A substrate is provided.

[0014] The chip is flip-chip packaged on the substrate.

[0015] A heat-conducting layer is prepared on the surface of the packaged chip.

[0016] A heat-conducting plate is mounted on the surface of the heat-conducting layer, a plurality of heat-conducting strips are arranged on the side of the heat-conducting plate away from the heat-conducting layer, and a heat-dissipating plate is arranged on the side of the heat-conducting strip away from the heat-conducting plate.

[0017] The plastic packaging device is used for plastic packaging to obtain a plastic packaging body, and the packaging is completed.

[0018] Preferably, the plastic packaging device comprises a mold body and a plastic packaging mechanism, the mold body comprises an upper mold and a lower mold, the lower mold is arranged below the upper mold, and the plastic packaging mechanism is arranged on the upper mold.

[0019] Preferably, the plastic packaging mechanism comprises an injection pipe and a discharge pipe, an injection hole is arranged on one side of the upper surface of the upper mold, a discharge hole is arranged on the side of the upper surface of the upper mold away from the injection hole, the injection pipe is slidingly arranged in the injection hole, a first injection port is arranged at the lower end of the injection pipe, a second injection port is arranged on the side wall of the injection pipe close to the lower end, and the discharge pipe is arranged in the discharge hole.

[0020] Preferably, a heating pipe is arranged outside the injection pipe, the lower end of the heating pipe is connected with the upper surface of the upper mold, an annular heating cavity is arranged in the heating pipe, a fluid inlet and a fluid outlet are arranged on the side wall of the heating pipe, and the fluid inlet and the fluid outlet are in communication with the annular heating cavity, respectively.

[0021] The technical solution of this invention has the following advantages: This invention provides an ultra-thin chip packaging structure and a chip packaging method, relating to the field of chip packaging technology. The packaging structure includes a molding compound, within which a packaged chip is disposed. The packaged chip is mounted on a substrate. A thermally conductive layer is disposed on the side of the packaged chip away from the substrate. A thermally conductive plate is disposed on the side of the thermally conductive layer away from the packaged chip. A plurality of thermally conductive strips are disposed on the side of the thermally conductive plate away from the thermally conductive layer. The ends of the thermally conductive strips away from the thermally conductive plate are connected to a heat sink. The thermally conductive strips are arranged along the length direction of the heat sink. The side of the heat sink away from the thermally conductive strips is exposed in the molding compound and forms a heat dissipation surface. In this invention, by arranging a plurality of thermally conductive strips along the length direction of the heat sink, the overall bending stiffness of the heat sink can be improved, thereby enhancing the bending resistance of the packaging structure. When the packaging structure is subjected to external force, the heat sink with thermally conductive strips can reduce the bending deformation of the packaging structure and extend the chip's lifespan.

[0022] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the means particularly pointed out in the written description and the accompanying drawings.

[0023] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0024] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0025] Figure 1 This is a schematic diagram of the overall structure of an ultra-thin chip packaging structure according to the present invention;

[0026] Figure 2 For the present invention Figure 1 Enlarged view of the structure at point A in the middle;

[0027] Figure 3 This is a top view of the heat-conducting strip in this invention;

[0028] Figure 4 This is a schematic diagram of a molding apparatus in a chip packaging method of the present invention;

[0029] Figure 5 For the present invention Figure 4 Enlarged view of the structure at point B in the middle;

[0030] Figure 6 This is a top view of the sealing cover in this invention;

[0031] Figure 7 This is a schematic diagram of the first sealing plate and the second sealing plate in this invention;

[0032] Figure 8 This is a schematic diagram showing the contact between the first sealing plate, the second sealing plate, and the outer wall of the heat-conducting plate in this invention;

[0033] Figure 9 For the present invention Figure 8 Enlarged view of the structure at point C.

[0034] In the diagram: 1. Molded package; 2. Encapsulated chip; 3. Substrate; 4. Thermally conductive layer; 5. Thermally conductive plate; 6. Thermally conductive strip; 7. Heat sink; 8. First thermally conductive block; 9. Second thermally conductive block; 10. First gap; 11. Second gap; 12. Through hole; 13. Upper mold; 14. Lower mold; 15. Injection pipe; 16. Discharge pipe; 17. First injection port; 18. Second injection port; 19. Heating tube; 20. Annular heating chamber; 21. Sealing cover; 22. Moving cover; 23. First electric push rod; 24. Sliding hole; 25. Connecting block; 26. First sealing hole; 27. First sealing block; 28. First contact block; 29. ​​First sealing plate; 30. Second sealing plate; 31. Flow channel; 32. Telescopic tube; 33. Second electric push rod; 34. Lower pressure plate. Detailed Implementation

[0035] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0036] Furthermore, in this invention, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the invention. They are merely used to distinguish components or operations described using the same technical terms and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions and features of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0037] Example 1

[0038] This invention provides an ultra-thin chip packaging structure, such as... Figures 1-3As shown, it includes: a molding compound 1, a packaged chip 2 disposed inside the molding compound 1, the packaged chip 2 disposed on a substrate 3, a thermally conductive layer 4 disposed on the side of the packaged chip 2 away from the substrate 3, a thermally conductive plate 5 disposed on the side of the thermally conductive layer 4 away from the packaged chip 2, a plurality of thermally conductive strips 6 disposed on the side of the thermally conductive plate 5 away from the thermally conductive layer 4, one end of the thermally conductive strips 6 being connected to a heat sink 7 away from the heat sink 5, the thermally conductive strips 6 being disposed along the length direction of the heat sink 7, and the side of the heat sink 7 away from the thermally conductive strips 6 being exposed outside the molding compound 1 and forming a heat dissipation surface.

[0039] The working principle and beneficial effects of the above technical solution are as follows: The packaged chip 2 can be mounted on the substrate 3 using a flip-chip process. A thermally conductive layer 4 is provided on the side of the packaged chip 2 away from the substrate 3. The thermally conductive layer 4 can be made of thermally conductive silicone. Then, a thermally conductive plate 5 is bonded to the thermally conductive layer 4. The heat generated by the packaged chip 2 during operation can be conducted to the thermally conductive plate 5 through the thermally conductive layer 4. By setting the thermally conductive layer 4, the gap between the thermally conductive plate 5 and the packaged chip 2 can be reduced, and the thermal conductivity of the thermally conductive plate 5 can be improved. A heat sink 7 is provided on the other side of the thermally conductive plate 5. The heat sink 7 is connected to the thermally conductive plate 5 through several thermally conductive strips 6. The heat of the thermally conductive plate 5 can be transferred to the heat sink 7 through the thermally conductive strips 6, and heat dissipation is achieved through the exposed heat dissipation surface of the heat sink 7, thereby ensuring the heat dissipation performance of the ultra-thin packaged structure of the chip. Preferably, the thermally conductive plate 5, thermally conductive strips 6, and heat sink 7 can be manufactured using an integrated molding process. The heat-conducting plate 5, heat-conducting strips 6, and heat sink 7 are all made of thermally conductive materials. A molding compound 1, which can be made of epoxy resin, is provided on the outside of the substrate 3, the packaged chip 2, the heat-conducting plate 5, and the heat sink 7 to encapsulate the packaged chip 2 and extend its service life. In this invention, several heat-conducting strips 6 are provided between the heat sink 7 and the heat-conducting plate 5. The heat-conducting strips 6 are arranged along the length of the heat sink 7 and perpendicular to the heat sink 7. The heat-conducting strips 6 can improve the overall bending stiffness of the heat sink 7 and enhance the bending resistance of the packaged structure. When the packaged structure is subjected to an external force perpendicular to the length of the heat sink 7, the heat sink 7 with heat-conducting strips 6 can effectively resist deformation, reduce the bending deformation of the packaged structure, improve the stability of the packaged structure, avoid the packaged chip 2 from being exposed due to bending and breakage, and extend the service life of the packaged chip 2.

[0040] Example 2

[0041] Based on the above embodiment 1, as follows Figure 3 As shown, several heat-conducting strips 6 are arranged at equal intervals, and the length of the heat-conducting strip 6 is equal to the length of the heat sink 7.

[0042] The working principle and beneficial effects of the above technical solution are as follows: the uniformly arranged heat-conducting strips 6 can effectively resist bending, thereby improving the rigidity and deformation resistance of the heat sink 7. Preferably, the length of the heat-conducting strips 6 is equal to the length of the heat sink 7, which can reduce the degree of bending at the edge of the heat sink 7 and ensure the overall bending resistance of the heat sink 7.

[0043] Example 3

[0044] Based on Example 1 or 2, such as Figures 1-3 As shown, several first heat-conducting blocks 8 are arranged between two adjacent heat-conducting strips 6, and the front and rear sides of the first heat-conducting blocks 8 are connected to the heat-conducting strips 6 on the front and rear sides respectively.

[0045] A second heat-conducting block 9 is provided between two adjacent first heat-conducting blocks 8 on the left and right sides, and the front and rear sides of the second heat-conducting block 9 are respectively connected to the heat-conducting strips 6 on the front and rear sides.

[0046] The upper end of the first heat-conducting block 8 is connected to the lower surface of the heat-conducting plate 5, and a first gap 10 is provided between the lower end of the first heat-conducting block 8 and the upper surface of the heat sink 7. The lower end of the second heat-conducting block 9 is connected to the upper surface of the heat sink 7, and a second gap 11 is provided between the upper end of the second heat-conducting block 9 and the lower surface of the heat-conducting plate 5.

[0047] Several through holes 12 are provided near the upper end of the first heat-conducting block 8, with both ends of the through holes 12 penetrating the left and right sides of the first heat-conducting block 8.

[0048] The working principle and beneficial effects of the above technical solution are as follows: Several first heat-conducting blocks 8 are evenly spaced between two heat-conducting strips 6, and second heat-conducting blocks 9 are arranged between two first heat-conducting blocks 8. By setting the first heat-conducting blocks 8 and the second heat-conducting blocks 9, not only can the stability of the heat-conducting strips 6 be improved and tilting prevented, but the thermal conductivity can also be improved, allowing more heat to be dissipated from the packaged chip 2, thus improving the overall heat dissipation performance of the packaged structure. Simultaneously, when the packaged structure is subjected to an external force perpendicular to the width direction of the heat sink 7, the heat-conducting strips 6 are connected by the first heat-conducting blocks 8 and the second heat-conducting blocks 9. The first heat-conducting blocks 8 and the second heat-conducting blocks 9 are perpendicular to the heat-conducting strips 6 and the surface of the heat sink 7, which can improve the bending resistance of the heat sink 7, reduce the bending deformation of the packaged structure, further improve the stability of the packaged structure, and extend the service life of the packaged chip 2. A first gap 10 is provided between the lower end of the first heat-conducting block 8 and the heat sink 7, and the second heat-conducting block 9 and the heat sink 7 are connected by the first heat-conducting blocks 8 and the second heat-conducting blocks 9. A second gap 11 is provided between the heat-conducting plates 5 to form an S-shaped flow path. Therefore, when preparing the encapsulation body 1, the molten encapsulation material can flow along the length direction of the heat-conducting strip 6. During the flow, it flows through the first gap 10 to the space between the first heat-conducting block 8 and the second heat-conducting block 9. After the molten encapsulation material fills the space between the first heat-conducting block 8 and the second heat-conducting block 9, it flows from the second gap 11 into the space between the second heat-conducting block 9 and the next first heat-conducting block 8. The encapsulation material flows in an S-shape between the heat-conducting plate 5 and the heat-dissipating plate 7, which can make the encapsulation material fill the space between the heat-conducting plate 5 and the heat-dissipating plate 7 evenly, reduce the unfilled area, and avoid the problem of local insufficient filling. During the flow of the molten encapsulation material, the curved flow path can make the gas between the heat-dissipating plate 7 and the heat-conducting plate 5 gradually flow out along the flow direction. This can not only reduce the formation of internal pores and improve the preparation quality of the encapsulation body 1, but also avoid a large amount of gas between the heat-conducting plate 5 and the heat-dissipating plate 7, thus improving the overall heat dissipation performance of the encapsulation structure.Because gas tends to accumulate and remain between the heat-conducting plate 5 and the heat sink 7 near the upper outer side of the first heat-conducting block 8, if the gas is not discharged in time, it will cause pores to form inside the molding compound 1. The presence of pores will reduce the impact and bending resistance of the molding compound 1, thereby reducing the overall stability of the encapsulation structure. Therefore, multiple through holes 12 are provided near the upper end of the first heat-conducting block 8. The through holes 12 have a conical structure, and the diameter of the inlet of the through hole 12 is larger than the diameter of the outlet of the through hole 12. The molten molding compound can carry the gas into the through holes 12 and flow into the space between the first heat-conducting block 8 and the second heat-conducting block 9 through the through holes 12. Then, as the first heat-conducting block 8 and the second heat-conducting block 9 are connected, the gas flows into the space between the first heat-conducting block 8 and the second heat-conducting block 9. The molten molding compound flows between the hot blocks 9 and is eventually discharged to the outside of the mold body. This design allows gas to escape between the heat sink 7 and the heat-conducting plate 5, reducing internal porosity, improving the molding quality of the molded body 1, significantly enhancing its bending resistance, and thus improving the overall structural strength and stability of the encapsulation structure, extending the lifespan of the packaged chip 2. By setting the first gap 10 and the second gap 11, the molding compound can be completely filled between the heat-conducting plate 5 and the heat sink 7, improving the reliability of the connection between the heat sink 7 and the molded body 1, preventing separation of the heat sink 7 and the molded body 1, and extending the lifespan of the encapsulation structure.

[0049] Example 4

[0050] Based on any one of Embodiments 1-3, the present invention also provides a chip packaging method for an ultra-thin chip packaging structure, comprising the following steps:

[0051] S10: Provides a substrate 3;

[0052] S20: Flip-package chip 2 on substrate 3;

[0053] S30: Prepare a thermally conductive layer 4 on the surface of the packaged chip 2;

[0054] S40: A heat-conducting plate 5 is installed on the surface of the heat-conducting layer 4. Several heat-conducting strips 6 are arranged on the side of the heat-conducting plate 5 away from the heat-conducting layer 4. A heat dissipation plate 7 is arranged on the side of the heat-conducting strips 6 away from the heat-conducting plate 5.

[0055] S50: The molding device is used to perform molding to obtain the molded body 1, and the encapsulation is completed.

[0056] The working principle and beneficial effects of the above technical solution are as follows: A substrate 3 is provided, and multiple conductive copper pillars are arranged on the substrate 3. The conductive copper pillars can be made of metallic copper. Then, a flip-chip 2 is flip-chip mounted on the substrate 3, and the packaged chip 2 is electrically connected to the substrate 3 through the conductive copper pillars. Then, conductive silicone is uniformly coated on the surface of the packaged chip 2 to prepare a thermally conductive layer 4. Then, a thermally conductive plate 5 is installed on the surface of the thermally conductive layer 4. Several thermally conductive strips 6 are arranged on the side of the thermally conductive plate 5 away from the thermally conductive layer 4, and a heat sink 7 is arranged on the side of the thermally conductive strips 6 away from the thermally conductive plate 5. Finally, a molding device is used to perform molding to obtain a molded body 1, thus completing the chip packaging. In the above solution, the thermally conductive strips 6 can improve the overall bending stiffness of the heat sink 7 and enhance the bending resistance of the package structure. When the package structure is subjected to an external force perpendicular to the length direction of the heat sink 7, the heat sink 7 with thermally conductive strips 6 can effectively resist deformation, reduce the bending deformation of the package structure, improve the stability of the package structure, avoid the packaged chip 2 from being exposed due to bending and breakage, and extend the service life of the packaged chip 2.

[0057] Example 5

[0058] Based on Example 4, such as Figures 4-9 As shown, the molding device includes a mold body and a molding mechanism. The mold body includes an upper mold 13 and a lower mold 14. The lower mold 14 is disposed below the upper mold 13, and the molding mechanism is disposed on the upper mold 13.

[0059] The molding mechanism includes an injection tube 15 and an discharge tube 16. An injection hole is provided on one side of the upper surface of the upper mold 13, and a discharge hole is provided on the side of the upper surface of the upper mold 13 away from the injection hole. The injection tube 15 is slidably disposed in the injection hole. A first injection port 17 is provided at the lower end of the injection tube 15, and a second injection port 18 is provided near the lower end side wall of the injection tube 15. The discharge tube 16 is disposed in the discharge hole.

[0060] The working principle and beneficial effects of the above technical solution are as follows: During molding, the upper mold 13 is first opened, and the heat sink 7 is placed downwards into the lower mold 14. Then, the upper mold 13 is placed on top of the lower mold 14. Next, one end of the injection pipe 15 is connected to the output end of the molding material injection device. The molten molding material is injected into the injection pipe 15 through the injection device, and then injected into the mold cavity formed by the upper mold 13 and the lower mold 14 through the first injection port 17. The first injection port 17 is conical, and the molten molding material flows vertically downwards through the first injection port 17. A second injection port 18 is also provided on the side wall of the injection pipe 15, and the second injection port 18 is close to the first injection port 17. At the end, the second injection port 18 is perpendicular to the first injection port 17. Since the first injection port 17 is conical, some of the molten molding compound can flow out through the second injection port 18, thereby promoting the horizontal flow of the molten molding compound in the mold cavity and promoting the flow of the molten molding compound towards the discharge pipe 16, which helps to expel gas. Preferably, a vacuum pump is connected to the output end of the discharge pipe 16. The vacuum pump extracts the gas in the mold cavity, which is conducive to the rupture of bubbles and their discharge from the discharge pipe 16. This further reduces the porosity in the molding compound 1, improves the bending resistance of the molding compound 1, enhances the overall structural strength and stability of the packaging structure, and extends the service life of the packaged chip 2.

[0061] Example 6

[0062] Based on Example 5, such as Figure 5 As shown, a heating tube 19 is sleeved on the outside of the injection tube 15. The lower end of the heating tube 19 is connected to the upper surface of the upper mold 13. An annular heating cavity 20 is provided inside the heating tube 19. A fluid inlet and a fluid outlet are provided on the side wall of the heating tube 19. The fluid inlet and the fluid outlet are respectively connected to the annular heating cavity 20.

[0063] The working principle and beneficial effects of the above technical solution are as follows: A heating tube 19 is set outside the injection tube 15. The external high-temperature fluid can enter the annular heating chamber 20 through the fluid inlet and then be discharged from the fluid outlet, so that the annular heating chamber 20 is kept at a high temperature. The injection tube 15 is heated by the annular heating chamber 20, which can prevent the molding material from cooling too quickly in the injection tube 15, thereby improving the fluidity of the molding material, reducing the generation of air holes in the molding body 1, and further improving the molding quality of the molding body 1.

[0064] Example 7

[0065] Based on Example 5 or 6, such as Figures 4-9As shown, a pressing port is opened at the center of the upper surface of the upper mold 13. A sealing cover 21 is provided on the upper mold 13, and the lower end of the sealing cover 21 is connected to the pressing port. A movable cover 22 is provided inside the sealing cover 21, and the lower end of the movable cover 22 is connected to the pressing port. The outer wall of the movable cover 22 is slidably connected to the inner wall of the sealing cover 21. A first electric push rod 23 is provided at the top of the sealing cover 21, and the output end of the first electric push rod 23 is connected to the upper surface of the movable cover 22. A sliding hole 24 is opened on the side of the sealing cover 21 near the injection pipe 15. A connecting block 25 is slidably provided in the sliding hole 24. One end of the connecting block 25 is connected to the side wall of the movable cover 22, and the other end of the connecting block 25 is connected to the side wall of the injection pipe 15. First sealing holes 26 are symmetrically provided on the inner walls of the left and right sides of the movable cover 22. A first sealing block 27 is provided in the first sealing hole 26, and the first sealing block 27 is slidably connected to the inner wall of the first sealing hole 26. The first sealing block 27 is provided near the sealing cover 21. A first contact block 28 is placed. A first sealing plate 29 is provided at the end of the first sealing block 27 away from the sealing cover 21. The end of the first sealing plate 29 away from the first sealing block 27 extends to the outside of the first sealing hole 26. Second sealing holes are symmetrically arranged on the inner walls of the front and rear sides of the movable cover 22. A second sealing block is arranged in the second sealing hole. The second sealing block is slidably connected to the inner wall of the second sealing hole. A second contact block is provided at the end of the second sealing block near the sealing cover 21. A second sealing plate 30 is provided at the end of the second sealing block away from the sealing cover 21. The end of the second sealing plate 30 away from the second sealing block extends to the outside of the second sealing hole. The lower surface of the second sealing plate 30 is slidably connected to the upper surface of the first sealing plate 29. A flow channel 31 is provided inside the movable cover 22. The flow channel 31 is connected to the first sealing hole 26 and the end of the second sealing hole near the sealing cover 21. A telescopic tube 32 is provided on the movable cover 22. One end of the telescopic tube 32 is connected to the flow channel 31.

[0066] The working principle and beneficial effects of the above technical solution are as follows: One end of the telescopic tube 32 is connected to the pump body, and a solenoid valve is installed on the telescopic tube 32. The pump body can deliver gas into the flow channel 31 or extract gas from the flow channel 31. A pressure sensor is installed in the flow channel 31 to detect the gas pressure in the flow channel 31. When injecting the molding compound, the first electric push rod 23 pushes the moving cover 22 to slide downward in the sealing cover 21. When the lower surface of the first sealing plate 29 is flush with the lower surface of the substrate 3, the first electric push rod 23 stops pushing out and the pump body is started. The gas enters the first sealing hole 26 and the second sealing hole through the flow channel 31. The gas entering the first sealing hole 26 can push the first sealing block 27 to slide outward in the first sealing hole 26. 27 drives the first sealing plate 29 to move closer to the substrate 3. At the same time, the gas entering the second sealing hole can push the second sealing block to slide outward in the second sealing hole. The second sealing block drives the second sealing plate 30 to move closer to the substrate 3. The first sealing plate 29 and the second sealing plate 30 gradually contact the outer wall of the substrate 3. When the gas pressure in the flow channel 31 detected by the gas pressure sensor reaches the preset pressure range, the pump stops working. At this time, under the push of the first sealing plate 29 and the second sealing plate 30, the substrate 3 is in the center position of the mold cavity, improving the consistency of the packaging. Then, the first electric push rod 23 is activated again. The first electric push rod 23 pushes out and drives the moving cover 22 to slide downward. When the lower surface of the first sealing plate 29 is flush with the lower surface of the heat conduction plate 5, The first electric push rod 23 stops working, and the pump body continues to start, causing the first sealing plate 29 and the second sealing plate 30 to be pushed out. The first sealing plate 29 and the second sealing plate 30 respectively contact the outer wall of the heat-conducting plate 5. When the gas pressure in the flow channel 31 detected by the pressure sensor reaches the preset pressure range, the pump body stops working, the solenoid valve closes, and the first sealing plate 29 and the second sealing plate 30 remain in contact with the outer wall of the heat-conducting plate 5, with the lower surface of the second sealing plate 30 contacting the upper surface of the first sealing plate 29. The first sealing plate 29, the second sealing plate 30 and the moving cover 22 isolate the substrate 3, the chip, the heat-conducting plate 5 from the mold cavity. When the moving cover 22 slides downward, it can drive the injection tube 15 to slide downward through the connecting block 25, so that the second injection tube 15... The discharge direction of the material outlet 18 is located between the heat-conducting plate 5 and the heat dissipation plate 7. When the first sealing plate 29 and the second sealing plate 30 contact the outer wall of the heat-conducting plate 5, the molten molding compound is injected into the mold cavity through the injection pipe 15. Under the isolation of the moving cover 22, the first sealing plate 29, and the second sealing plate 30, the molten molding compound can flow along the heat-conducting strip 6 and along the S-shaped path formed by the first heat-conducting block 8 and the second heat-conducting block 9. Furthermore, the molten molding compound flowing out of the second injection outlet 18 can push the molten molding compound in the mold cavity to flow horizontally, so that the molding compound is evenly filled between the heat-conducting plate 5 and the heat dissipation plate 7, reducing the unfilled area. And through the curved flow path, the gas between the heat dissipation plate 7 and the heat-conducting plate 5 is gradually discharged from the discharge pipe 16 along the flow direction.To reduce the formation of internal pores and improve the molding quality of the molding body 1, the overall heat dissipation and bending resistance of the encapsulation structure are further improved. When molten molding material is discharged from the discharge pipe 16, the injection of molten molding material is stopped, and then the first electric push rod 23 is activated, causing the moving cover 22 to be pushed downward a preset distance. The first sealing plate 29 slides downward along the heat-conducting plate 5, but does not separate from the heat-conducting plate 5. By pushing downward to squeeze the molding material, the pores in the molten molding material are further eliminated. Then, the first electric push rod 23 is controlled to retract upward, and the gas in the flow channel 31 is extracted by the pump body, causing the first sealing plate 29 and the second sealing plate 30 to slide into the moving cover 22. When the lower surface of the first sealing plate 29 is flush with the lower surface of the lower pressure plate 34, the gas is transported to the flow channel by the pump body. Inside section 31, the first sealing plate 29 and the second sealing plate 30 contact the outer wall of the lower pressure plate 34. At this time, the pump body and the solenoid valve are closed, and molten molding compound continues to be injected through the injection pipe 15 until it overflows from the discharge pipe 16. Then, the molding compound is solidified, and excess molding compound is removed to obtain the molding body 1. The stepwise injection of molten molding compound ensures more complete filling of the molding compound between the heat-conducting plate 5 and the heat dissipation plate 7, reducing pores in the molding body 1. Furthermore, after the first injection, since the first sealing plate 29 and the second sealing plate 30 are on different horizontal planes, a protrusion will form between them. When the molten molding compound is injected for the second time, this protrusion will enhance the connection between the molding compounds, improving the molding quality of the molding body 1.

[0067] Example 8

[0068] Based on Example 7, such as Figure 4 As shown, a second electric push rod 33 is provided at the top center of the sealing cover 21. The output end of the second electric push rod 33 passes through the sealing cover 21 and the moving cover 22 in sequence and is provided with a lower pressure plate 34.

[0069] The working principle and beneficial effects of the above technical solution are as follows: When the first sealing plate 29 and the second sealing plate 30 are in contact with the outer wall of the substrate 3, the second electric push rod 33 is activated. The second electric push rod 33 extends and drives the lower pressure plate 34 to move downward until the lower pressure plate 34 contacts the substrate 3 until the molding compound 1 is prepared. The lower pressure plate 34 can press the substrate 3, improve the reliability of the connection between the substrate 3 and the chip, avoid the separation of the substrate 3 and the chip during the injection of molding compound, ensure the packaging quality, and extend the service life of the packaged chip 2.

[0070] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0071] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0072] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. Other modifications can be easily made by those skilled in the art. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A chip ultra-thin package structure, characterized in that, include: A molding compound (1) is provided inside the molding compound (1). The encapsulated chip (2) is disposed on a substrate (3). A thermally conductive layer (4) is disposed on the side of the encapsulated chip (2) away from the substrate (3). A thermally conductive plate (5) is disposed on the side of the thermally conductive layer (4) away from the encapsulated chip (2). Several thermally conductive strips (6) are disposed on the side of the thermally conductive plate (5) away from the thermally conductive layer (4). One end of the thermally conductive strip (6) away from the thermally conductive plate (5) is connected to a heat sink (7). The thermally conductive strips (6) are disposed along the length direction of the heat sink (7). The side of the heat sink (7) away from the thermally conductive strips (6) is exposed outside the molding compound (1) and forms a heat dissipation surface. Several first heat-conducting blocks (8) are arranged between two adjacent heat-conducting strips (6), and the first heat-conducting blocks (8) are connected to the heat-conducting strips (6) on the front and back sides respectively. A second heat-conducting block (9) is set between two adjacent first heat-conducting blocks (8), and the front and rear sides of the second heat-conducting block (9) are connected to the heat-conducting strips (6) on the front and rear sides respectively. The upper end of the first heat-conducting block (8) is connected to the lower surface of the heat-conducting plate (5), and a first gap (10) is provided between the lower end of the first heat-conducting block (8) and the upper surface of the heat sink (7). The lower end of the second heat-conducting block (9) is connected to the upper surface of the heat sink (7), and a second gap (11) is provided between the upper end of the second heat-conducting block (9) and the lower surface of the heat-conducting plate (5). Several through holes (12) are provided near the upper end of the first heat-conducting block (8), and the two ends of the through holes (12) penetrate through the left and right sides of the first heat-conducting block (8).

2. The chip ultra-thin package structure of claim 1, wherein, Several heat-conducting strips (6) are set at equal intervals, and the length of the heat-conducting strips (6) is equal to the length of the heat sink (7).

3. A chip packaging method of the chip ultrathin package structure according to any one of claims 1-2, characterized in that, Includes the following steps: Provide a substrate (3); The chip (2) is flip-chip packaged on the substrate (3); A thermally conductive layer (4) is prepared on the surface of the packaged chip (2); A heat-conducting plate (5) is installed on the surface of the heat-conducting layer (4). Several heat-conducting strips (6) are set on the side of the heat-conducting plate (5) away from the heat-conducting layer (4). A heat dissipation plate (7) is set on the side of the heat-conducting strips (6) away from the heat-conducting plate (5). A molding device is used to mold the plastic body (1) to complete the encapsulation.

4. The chip packaging method of claim 3, wherein, The sealing device includes a mold body and a sealing mechanism. The mold body includes an upper mold (13) and a lower mold (14). The lower mold (14) is located below the upper mold (13), and the sealing mechanism is located on the upper mold (13).

5. The chip packaging method of claim 4, wherein, The molding mechanism includes an injection tube (15) and an discharge tube (16). An injection hole is provided on one side of the upper surface of the upper mold (13), and a discharge hole is provided on the side of the upper surface of the upper mold (13) away from the injection hole. The injection tube (15) is slidably disposed in the injection hole. A first injection port (17) is provided at the lower end of the injection tube (15), and a second injection port (18) is provided near the lower side wall of the injection tube (15). The discharge tube (16) is disposed in the discharge hole.

6. The chip packaging method of claim 5, wherein, A heating tube (19) is sleeved outside the injection tube (15). The lower end of the heating tube (19) is connected to the upper surface of the upper mold (13). An annular heating cavity (20) is set inside the heating tube (19). A fluid inlet and a fluid outlet are set on the side wall of the heating tube (19). The fluid inlet and the fluid outlet are respectively connected to the annular heating cavity (20).

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