Microphone structure and electronic equipment

Abstract

The invention discloses a microphone structure and electronic equipment, the microphone structure comprises a substrate, a first shell, a second shell and an MEMS chip, the substrate and the first shell are used for being connected to the two opposite sides of a mainboard respectively, the first shell and the mainboard define a first cavity, the substrate is provided with a second through hole, and the second through hole is communicated with the first cavity. The second through hole is opposite to the first through hole; the second shell is arranged on the side, away from the first shell, of the substrate, a second cavity is defined by the second shell and the substrate, the second shell is provided with a sound inlet hole, and the sound inlet hole is communicated with the second cavity and the outside; the MEMS chip is arranged in the second cavity, and the back cavity of the MEMS chip is communicated with the first cavity through the second through hole and the first through hole. Therefore, the back cavity of the MEMS chip can be communicated with the first cavity, and the size of the back cavity of the MEMS chip can be increased.

Description

Technical Field

[0001] The present invention relates to the technical field of microphones, and more particularly, to a microphone structure and an electronic device. Background Art

[0002] Microphones, as core components for sound-to-electricity conversion, are widely used in consumer electronics, automotive electronics, IoT devices, and other fields. Depending on the location of the sound inlet, microphones can be categorized as either top-firing or bottom-firing. Top-firing microphones offer a simple sound inlet and housing structure, making assembly easy. Furthermore, the sound inlet is isolated from the PCB, minimizing the impact of thermal stress on acoustic performance during soldering.

[0003] However, in conventional top-feeding microphones, due to the limited volume of the acoustic cavity and the design of the top opening, it is difficult to meet the requirements of high signal-to-noise ratio, especially in noisy environments or low-frequency signal collection scenarios, the acoustic performance of the microphone is limited. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a new technical solution for a microphone structure and an electronic device.

[0005] According to one aspect of the present invention, a microphone structure is provided for connecting to a main board of an electronic device, wherein the main board has a first through hole.

[0006] The microphone structure comprises:

[0007] a substrate and a first shell, the substrate and the first shell being respectively connected to opposite sides of the mainboard, the first shell and the mainboard forming a first cavity, the substrate having a second through hole, the second through hole being opposite to the first through hole;

[0008] a second housing, the second housing being disposed on a side of the substrate away from the first housing, the second housing and the substrate forming a second chamber, the second housing being provided with a sound inlet hole, the sound inlet hole connecting the second chamber with the outside;

[0009] A MEMS chip is disposed in the second cavity, and a back cavity of the MEMS chip is connected to the first cavity through the second through hole and the first through hole.

[0010] Optionally, an ASIC chip is further included, and the ASIC chip is arranged in the second chamber and electrically connected to the MEMS chip.

[0011] Optionally, the second shell is sealed and connected to the substrate along the circumferential direction.

[0012] Optionally, a projection area of ​​the substrate on the mainboard is not smaller than a projection area of ​​the second shell on the mainboard.

[0013] Optionally, a projection area of ​​the first shell on the mainboard is not smaller than a projection area of ​​the substrate on the mainboard.

[0014] Optionally, the second shell is located above the first shell, and the sound inlet hole is provided on the top of the second shell.

[0015] Optionally, a projection of the sound inlet on the substrate is staggered with a projection of the MEMS chip on the substrate.

[0016] Optionally, the second through hole has the same size as the first through hole, and the back cavity of the MEMS chip is opposite to and connected to the second through hole.

[0017] Optionally, the cross-section of the sound inlet hole is circular, elliptical or rectangular.

[0018] According to another aspect of the present invention, an electronic device is provided, comprising a mainboard and the microphone structure, wherein the substrate and the first housing are respectively connected to opposite sides of the mainboard.

[0019] One technical effect of the present invention is that a microphone structure is provided, comprising a substrate, a first shell, a second shell, and a MEMS chip, wherein the substrate and the first shell are respectively connected to opposite sides of the mainboard, the first shell and the mainboard enclose a first chamber, the substrate has a second through hole, and the second through hole is opposite to the first through hole; the second shell is provided on a side of the substrate away from the first shell, the second shell and the substrate enclose a second chamber, the second shell has a sound inlet, and the sound inlet connects the second chamber with the outside; the MEMS chip is provided in the second chamber, and the back chamber of the MEMS chip is connected to the first chamber via the second through hole and the first through hole. In this way, the back chamber size of the MEMS chip can be increased by utilizing the connection between the back chamber of the MEMS chip and the first chamber, thereby reducing abnormal tones and distortion caused by cavity resonance, and helping to improve the sound quality and signal-to-noise ratio, thereby improving the acoustic performance of the microphone structure.

[0020] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0022] Figure 1 is a schematic diagram of a microphone structure according to an embodiment of the present invention;

[0023] Figure 2 is a cross-sectional view of a microphone structure according to an embodiment of the present invention;

[0024] Figure 3 is a partial schematic diagram of a microphone structure according to an embodiment of the present invention;

[0025] Figure 4 is another partial schematic diagram of a microphone structure according to an embodiment of the present invention;

[0026] Figure 5 is a schematic diagram of a first housing according to an embodiment of the present invention;

[0027] Figure 6 It is a perspective view of a microphone structure according to an embodiment of the present invention.

[0028] Description of reference numerals:

[0029] 001, main board; 0011, first through hole;

[0030] 1. Substrate; 11. Second through hole; 2. First shell; 3. Second shell; 31. Sound inlet; 4. MEMS chip; 5. ASIC chip. DETAILED DESCRIPTION

[0031] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0033] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0034] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0035] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0036] According to one aspect of the present invention, a microphone structure is provided, which can be connected to the mainboard 001 of electronic devices such as mobile phones, smart watches, and smart headsets, thereby enhancing the functions of the electronic devices.

[0037] like Figure 1 and Figure 2 As shown, the microphone structure provided by the present invention includes:

[0038] A substrate 1 and a first housing 2, the substrate 1 and the first housing 2 being respectively connected to opposite sides of the mainboard 001, the first housing 2 and the mainboard 001 forming a first chamber, the substrate 1 having a second through hole 11, the second through hole 11 being opposite to the first through hole 0011;

[0039] a second housing 3, which is disposed on a side of the substrate 1 away from the first housing 2. The second housing 3 and the substrate 1 form a second chamber. The second housing 3 defines a sound inlet 31, which connects the second chamber with the outside world.

[0040] The MEMS chip 4 is disposed in the second cavity, and the back cavity of the MEMS chip 4 is connected to the first cavity through the second through hole 11 and the first through hole 0011.

[0041] like Figure 1 、 Figure 2 and Figure 5 As shown, the microphone structure's substrate 1 and first housing 2 are connected to opposite sides of a mainboard 001. For example, the substrate 1 and first housing 2 can be fixedly connected to the mainboard 001 by welding, gluing, or other methods to ensure a stable and reliable connection. Substrate 1 is typically a PCB (printed circuit board), which provides electrical connections and mechanical support for components.

[0042] like Figure 6 As shown in the perspective view, the first housing 2 and the mainboard 001 can enclose a first chamber. This first chamber can be used to house and protect components in the electronic device that require sealed protection, such as capacitors and resistors. This allows the internal space of the microphone structure to be fully utilized without the need for additional packaging of the components that require sealed protection. This reduces production costs, saves internal space in the electronic device, and facilitates the miniaturization and integration of electronic devices. Furthermore, the first chamber can protect the mainboard 001 and the corresponding components thereon, as well as the circuit structure of the electronic device.

[0043] like Figure 2 and Figure 4As shown, the substrate 1 is provided with a second through hole 11. During installation, the second through hole 11 is aligned with the first through hole 0011 on the main board 001 so that the second through hole 11 and the first through hole 0011 can form an air passage to facilitate air transmission.

[0044] like Figure 1 and Figure 2 As shown, the second housing 3 is positioned on the side of the substrate 1 away from the first housing 2, such that the second housing 3 and substrate 1 are located on one side of the motherboard 001, while the first housing 2 is located on the opposite side of the motherboard 001. The second housing 3 and substrate 1 can be sealed using glue, ultrasonic welding, or other methods, and a second chamber is formed between the second housing 3 and substrate 1. This second chamber can be used to house related components such as the MEMS chip 4 and ASIC chip 5.

[0045] like Figure 3 As shown, a sound inlet hole 31 can be opened on the top or side of the second shell 3. The sound inlet hole 31 can connect the second cavity with the outside world, so that the external sound can enter the second cavity through the sound inlet hole 31, providing a propagation channel for sound collection.

[0046] like Figure 2 As shown, a MEMS (Micro-Electro-Mechanical Systems) chip 4 is arranged on the substrate 1 and located in the second cavity. The sealed space of the second cavity can be used to protect the MEMS chip 4 to ensure that the MEMS chip 4 can work normally. At the same time, the internal space of the microphone structure can be fully utilized, which facilitates the miniaturization and integration of the microphone structure.

[0047] When external sound enters the second chamber through the sound inlet 31, the diaphragm of the MEMS chip 4 in the second chamber will vibrate under the action of the sound pressure. This vibration causes the distance between the diaphragm of the MEMS chip 4 and the back plate to change, and ultimately generates a voltage signal proportional to the sound pressure at the output end, thereby realizing the conversion of the sound signal into an electrical signal. Figure 2 As shown, after the sound enters the second cavity from the sound inlet 31, it can directly act on the MEMS chip 4, which greatly shortens the sound propagation path, reduces the loss of sound energy, and thus improves the sensitivity of sound collection.

[0048] like Figure 2 As shown, the back cavity of the MEMS chip 4 is connected to the first chamber via the second through hole 11 and the first through hole 0011. This connection allows the back cavity of the MEMS chip 4 and the first chamber to form a relatively independent and stable sound environment, which helps improve the accuracy and stability of sound collection and also helps reduce the interference of external noise on sound collection.

[0049] Furthermore, by connecting the back cavity of the MEMS chip 4 to the first cavity via the second through-hole 11 and the first through-hole 0011, the first cavity can also be used to increase the size of the back cavity of the microphone structure. When the sound signal is large, the microphone structure has sufficient space to buffer and release pressure, avoiding sound distortion, so that the dynamic range of sound that the microphone structure can detect is wider. Moreover, the increase in the size of the back cavity can also reduce abnormal tones and distortion caused by cavity resonance, helping to improve the sound quality and signal-to-noise ratio, thereby improving the acoustic performance of the microphone structure.

[0050] In the microphone structure of the present invention, the second housing 3 and base plate 1 form a second chamber, while the first housing 2 and main board 001 form a first chamber. These two chambers are relatively independent. This structure creates a closed sound collection space that effectively blocks direct ingress of external noise, thereby reducing interference from external noise on sound collection.

[0051] In the microphone structure of the present invention, the substrate 1 and first housing 2 are connected to opposite sides of the mainboard 001, forming a stable mechanical support structure. This structure ensures that the microphone maintains stable performance despite various operating environments, such as vibration and impact. Furthermore, the sealed connection between the second housing 3 and the substrate 1 ensures the tightness of the second chamber, preventing external impurities such as dust and moisture from entering the microphone interior, thereby improving the service life and reliability of the microphone structure.

[0052] In addition, the formation of the first and second chambers also provides a relatively stable temperature environment for the MEMS chip 4. When the microphone structure generates heat during operation, the air in the chamber can play a certain role in heat dissipation, preventing the MEMS chip 4 from overheating and performance degradation.

[0053] Furthermore, the first and second chambers can also be used to house corresponding components, making the microphone structure of the present invention compact and space-saving, facilitating its integration into various electronic devices, such as smartphones, tablets, and smart wearable devices. This also provides greater flexibility in electronic device design, facilitating the reduction of weight, thickness, and miniaturization.

[0054] Furthermore, during installation of the microphone structure of the present invention, it is only necessary to connect the substrate 1, its components, and the first housing 2 to opposite sides of the mainboard 001, and then seal the second housing 3 to the substrate 1. This simple installation process reduces production costs, improves production efficiency, and also facilitates subsequent maintenance and replacement.

[0055] Optionally, an ASIC chip 5 is further included, and the ASIC chip 5 is disposed in the second chamber and electrically connected to the MEMS chip 4 .

[0056] like Figure 2 As shown, an ASIC (Application-Specific Integrated Circuit) chip 5 is integrated into the second chamber and electrically connected to the MEMS chip 4, enabling the ASIC chip 5 to directly and efficiently process the electrical signals output by the MEMS chip 4. The ASIC chip 5 and the MEMS chip 4 are electrically connected via gold wire, making signal transmission between them more stable and efficient. The ASIC chip 5 can process and optimize the signal in a targeted manner based on the characteristics of the MEMS chip 4, thereby improving the frequency response characteristics of the microphone structure.

[0057] Furthermore, ASIC chip 5 has the ability to convert analog signals into digital signals, enabling digital processing of the analog signals output by MEMS chip 4. Using a built-in high-precision analog-to-digital converter, ASIC chip 5 can convert analog signals into digital signals and perform subsequent digital signal processing, such as digital filtering and encoding. This digital processing approach not only improves the accuracy and stability of signal processing but also facilitates integration and communication with digital systems. In practical applications, the signals digitized by ASIC chip 5 can more accurately restore the original sound information, providing a high-quality data foundation for subsequent audio processing and analysis.

[0058] Optionally, the second shell 3 is sealed and connected to the substrate 1 along the circumferential direction.

[0059] Specifically, the second housing 3 and substrate 1 are circumferentially sealed, forming a sealed second chamber. This means the microphone structure forms a closed sound collection space, effectively blocking direct entry of external noise. This reduces interference from external noise on sound collection, thereby improving the reliability and accuracy of acoustic collection. Furthermore, the sealed connection between the second housing 3 and substrate 1 ensures the tightness of the second chamber, preventing impurities such as dust and moisture from entering the microphone, thereby increasing the service life and reliability of the microphone structure.

[0060] Optionally, a projection area of ​​the substrate 1 on the mainboard 001 is not less than a projection area of ​​the second shell 3 on the mainboard 001 .

[0061] Specifically, the projection area of ​​the substrate 1 on the main board 001 is set to be greater than or equal to the projection area of ​​the second shell 3 on the main board 001, that is, the substrate 1 can at least cover the second shell 3, which helps to seal the second shell 3 on the substrate 1 and form a second chamber between the two, thereby reducing the processing difficulty of the microphone structure.

[0062] Optionally, a projection area of ​​the first shell 2 on the mainboard 001 is not less than a projection area of ​​the substrate 1 on the mainboard 001 .

[0063] Specifically, the projection area of ​​the first shell 2 on the main board 001 is set to be greater than or equal to the projection area of ​​the substrate 1 on the main board 001, that is, the first shell 2 can at least cover the substrate 1, which can increase the area of ​​the first cavity while ensuring the overall symmetry of the microphone structure, and help to increase the back cavity size of the microphone structure, thereby improving the acoustic performance of the microphone structure.

[0064] Optionally, the second shell 3 is located above the first shell 2 , and the top of the second shell 3 is provided with the sound inlet hole 31 .

[0065] like Figures 1 to 3 As shown, the second housing 3 is located above the mainboard 001, and the first housing 2 is located below it. A sound inlet 31 is provided at the top of the second housing 3, forming a top-input microphone structure. Compared to existing bottom-input microphone structures, top-input microphone structures are easier to assemble and more reliable.

[0066] Optionally, a projection of the sound inlet hole 31 on the substrate 1 is staggered with a projection of the MEMS chip 4 on the substrate 1 .

[0067] like Figure 2 As shown, the sound inlet 31 can be placed opposite to the ASIC chip 5, or opposite to an area on the substrate 1 where no components are set, and the sound inlet 31 can be avoided from being opposite to the MEMS chip 4. This can avoid the risk of external sound directly impacting the diaphragm of the MEMS chip 4 and causing damage to the diaphragm, and help extend the service life of the microphone structure.

[0068] Furthermore, by staggering the projection of the sound inlet 31 and the MEMS chip 4 on the substrate 1, direct overlap between the sound inlet 31 and the electrodes or signal traces of the MEMS chip 4 can be avoided, helping to reduce parasitic capacitance coupling between the acoustic wave conduction path and the electrical structure. Furthermore, the staggered layout prevents direct contact between the sound inlet 31 and the MEMS chip 4, reducing mechanical stress concentration caused by thermal expansion coefficient mismatch during the packaging process, thereby reducing the risk of cracking the MEMS chip 4 or solder joint failure.

[0069] Optionally, the second through hole 11 has the same size as the first through hole 0011 , and the back cavity of the MEMS chip 4 is opposite to and connected to the second through hole 11 .

[0070] like Figure 2 As shown, the second through hole 11 is set to the same size as the first through hole 0011, and the second through hole 11 can be used to position the substrate 1 relative to the first through hole 0011, thereby reducing the difficulty of installation. The second through hole 11 includes but is not limited to a circular hole, an elliptical hole, a rectangular hole, and an irregular hole, and the first through hole 0011 includes but is not limited to a circular hole, an elliptical hole, a rectangular hole, and an irregular hole.

[0071] Moreover, the back cavity of the MEMS chip 4 is opposite to and connected to the second through hole 11, so that the back cavity of the MEMS chip 4 can be connected to the first cavity through the second through hole 11 and the first through hole 0011, so that the first cavity can be used to increase the back cavity size of the microphone structure, so as to reduce abnormal tones and distortions caused by cavity resonance, which helps to improve the sound quality and signal-to-noise ratio, thereby improving the acoustic performance of the microphone structure.

[0072] Optionally, the cross section of the sound inlet hole 31 is circular, elliptical or rectangular.

[0073] Specifically, depending on actual sound intake requirements, the sound intake holes 31 may be configured to include, but are not limited to, circular, elliptical, rectangular, and irregularly shaped holes. For example, if it is necessary to uniformly capture sound from all directions, the sound intake hole 31 may be configured as a circular hole; if it is necessary to capture sound from a specific direction, the sound intake hole 31 may be configured as an elliptical hole; and if it is necessary to capture sound at different frequencies, the sound intake hole 31 may be configured as a corresponding rectangular hole.

[0074] According to another aspect of the present invention, an electronic device is provided, including a mainboard 001 and the microphone structure, wherein the substrate 1 and the first shell 2 are respectively connected to opposite sides of the mainboard 001. The electronic device should have the technical effects possessed by the above-mentioned microphone structure.

[0075] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0076] Although some specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It should be understood by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A microphone structure for connecting to a mainboard (001) of an electronic device, wherein the mainboard (001) has a first through hole (0011), characterized in that: include: A substrate (1) and a first shell (2), the substrate (1) and the first shell (2) being respectively connected to opposite sides of the main board (001), the first shell (2) and the main board (001) enclosing a first chamber, the substrate (1) having a second through hole (11), the second through hole (11) being opposite to the first through hole (0011); a second shell (3), the second shell (3) being arranged on a side of the substrate (1) away from the first shell (2), the second shell (3) and the substrate (1) forming a second chamber, the second shell (3) being provided with a sound inlet hole (31), the sound inlet hole (31) communicating the second chamber with the outside; A MEMS chip (4) is provided in the second cavity, and a back cavity of the MEMS chip (4) is connected to the first cavity via the second through hole (11) and the first through hole (0011).

2. The microphone structure according to claim 1, characterized in that: It also includes an ASIC chip (5), which is arranged in the second chamber and electrically connected to the MEMS chip (4).

3. The microphone structure according to claim 1, characterized in that: The second shell (3) is sealed and connected to the base plate (1) along the circumferential direction.

4. The microphone structure according to claim 3, characterized in that: The projection area of ​​the substrate (1) on the main board (001) is not less than the projection area of ​​the second shell (3) on the main board (001).

5. The microphone structure according to claim 3, characterized in that: The projection area of ​​the first shell (2) on the main board (001) is not less than the projection area of ​​the substrate (1) on the main board (001).

6. The microphone structure according to claim 1, characterized in that: The second shell (3) is located above the first shell (2), and the top of the second shell (3) is provided with the sound inlet hole (31).

7. The microphone structure according to claim 6, characterized in that: The projection of the sound inlet hole (31) on the substrate (1) is staggered with the projection of the MEMS chip (4) on the substrate (1).

8. The microphone structure according to claim 7, characterized in that: The second through hole (11) has the same size as the first through hole (0011), and the back cavity of the MEMS chip (4) is opposite to and communicates with the second through hole (11).

9. The microphone structure according to claim 1, characterized in that: The cross section of the sound inlet hole (31) is circular, elliptical or rectangular.

10. An electronic device, characterized in that: It comprises a main board (001) and the microphone structure according to any one of claims 1 to 9, wherein the substrate (1) and the first shell (2) are respectively connected to opposite sides of the main board (001).

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