Integrated LED MIP packaging structure, packaging method and display unit

Abstract

The invention discloses an integrated LED MIP packaging structure, a packaging method and a display unit, and relates to the field of LED display, the integrated LED MIP packaging structure comprises a substrate, a plurality of bonding pad assemblies, a plurality of LED chip modules, a plurality of annular separation enclosure bulkheads and a plurality of packaging rubber blocks, and the bonding pad assemblies, the LED chip modules and the separation enclosure bulkheads are arranged; the bonding pad assemblies are fixedly connected to one side of the substrate; each LED chip module is connected with the bonding pad assembly; each partition enclosure bulkhead surrounds the outer side of one LED chip module; the packaging rubber block is arranged on the side, close to the LED chip module, of the substrate. The packaging rubber block packages the bonding pad assembly and the LED chip module in a mounting groove defined by the partition enclosure bulkheads. Each partition enclosure bulkhead can reflect the light of the corresponding LED chip module to the packaging rubber block and emit the light, and each partition enclosure bulkhead can prevent the light of the LED chip module from crosstalk by blocking the light of the LED chip module. The packaging method and the display unit are a method and a device based on an integrated LED MIP packaging structure. The color mixing agent has the advantages of good color mixing performance, environment friendliness and low cost.

Description

Technical Field

[0001] The present invention relates to the field of LED display technology, and in particular to an integrated LED MIP packaging structure, a packaging method and a display unit. Background Art

[0002] MiP (Micro LED in Package) pixel lights are widely adopted by LED micro-pitch (0.X MM) displays due to their small size and good color mixing effects. Existing technologies often package single MIP lamp beads and then assemble them on display boards in the form of single-particle packages. Precisely because of the small physical size of LED MIPs (side length less than 0.X MM), the unit display boards assembled from them suffer from problems such as low welding strength, easy damage to the lamp beads, and poor moisture resistance, making them prone to quality defects such as electrical performance failures. Especially when the external dimensions of LED MIP lamp beads need to be further reduced in line with the requirements of LED micro-pitch displays, the above-mentioned LED MIP quality defects become more prominent, making it more difficult to mass-produce LED micro-pitch displays with high yield and low cost, hindering the application progress of LED MIPs in LED micro-pitch displays. Summary of the Invention

[0003] The purpose of the present invention is to provide an integrated LED MIP packaging structure, packaging method and display unit to solve the problems existing in the prior art, and has the advantages of good color mixing performance, environmental friendliness and low cost.

[0004] To achieve the above object, the present invention provides the following solutions:

[0005] The present invention provides an integrated LED MIP packaging structure, comprising a substrate, a solder pad assembly, an LED chip module, a partition wall and a packaging rubber block, wherein the solder pad assembly, the LED chip module and the partition wall are all multiple; each of the solder pad assemblies is fixedly connected to the same side of the substrate; all the LED chip modules are connected to one of the solder pad assemblies; each of the partition walls is annular and surrounds the outside of one of the LED chip modules; the packaging rubber block is arranged on a side of the substrate close to the LED chip module, and the packaging rubber block encapsulates the solder pad assembly and the LED chip module in the installation groove surrounded by the corresponding partition wall; each of the partition walls can reflect the light emitted by the corresponding LED chip module to the packaging rubber block and emit it from the packaging rubber block, and each of the partition walls can prevent the light of the LED chip module from crosstalk by blocking the light of the corresponding LED chip module.

[0006] Preferably, the cross section parallel to the substrate is the cross section, and the cross section of each mounting groove is in the shape of an elongated strip; all the LED chip modules, all the solder pad assemblies and all the partition walls are arranged on the substrate in the form of a rectangular array.

[0007] Preferably, each of the partition walls includes a first partition wall, the inner side wall of the first partition wall is inclined from the side close to the substrate to the side away from the substrate, and the inner side wall of each of the first partition walls is inclined from the end away from the substrate to the side away from the LED chip module.

[0008] Preferably, each of the partition walls further includes a second partition wall, and each of the second partition walls fills the gap between adjacent pad assemblies.

[0009] Preferably, a plurality of columns of first grooves and a plurality of columns of second grooves are provided on a side of the packaging rubber block away from the substrate, each of the first grooves extends along the row direction of the rectangular array formed by the LED chip modules, and each of the second grooves extends along the column direction of the rectangular array formed by the LED chip modules; the two side walls of each partition wall arranged opposite to each other extend along the row direction, and the other two side walls of each partition wall arranged opposite to each other extend along the column direction; each side wall of each partition wall extending along the row direction is arranged opposite to a first groove, and each side wall of each partition wall extending along the column direction is arranged opposite to a second groove.

[0010] Preferably, the width of the first groove and the second groove is equal to the gap between the cut integrated LED MIPs after mounting.

[0011] Preferably, a chip circuit is provided on one side of the substrate close to the pad assembly, and an external circuit is provided on the other side of the substrate, and each chip circuit is connected to each pad; a plurality of circuit vias are provided on the substrate, and the chip circuit is connected to the external circuit through the circuit vias; one end of each circuit via close to the chip circuit can be covered by a side wall of the partition wall.

[0012] Preferably, an insulating colloid is printed on a side of the substrate where the external circuit is provided, and the insulating colloid is used to encapsulate the external circuit; the insulating colloid is connected and fused with the second partition wall through the circuit via.

[0013] This embodiment provides a packaging method for the integrated LED MIP packaging structure, including the following steps:

[0014] S1, welding the pad assembly onto the substrate;

[0015] S2, forming a plurality of partition walls on the substrate;

[0016] S3, installing each of the LED chip modules in the installation slot, and connecting each of the LED chip modules to the corresponding solder pad assembly;

[0017] S4, applying packaging glue on a side of the substrate close to the pad assembly.

[0018] This embodiment provides a display unit provided with the integrated LED MIP packaging structure.

[0019] Compared with the prior art, the present invention has achieved the following technical effects:

[0020] The present invention provides an integrated LED MIP packaging structure, packaging method and display unit, including a substrate, a pad assembly, an LED chip module, a partition wall and a packaging rubber block, wherein the pad assembly, the LED chip module and the partition wall are all multiple; each pad assembly is fixedly connected to the same side of the substrate; each LED chip module is connected to a pad assembly; each partition wall is annular and surrounds the outside of an LED chip module; the packaging rubber block is arranged on a side of the substrate close to the LED chip module, and the packaging rubber block encapsulates the pad assembly and the LED chip module in an installation groove surrounded by the corresponding partition wall; each partition wall can reflect the light emitted by the corresponding LED chip module to the packaging rubber block and emit it from the packaging rubber block, and each partition wall can prevent the light of the LED chip module from crosstalk by blocking the light of the corresponding LED chip module.

[0021] The present invention places the LED chip modules in an independent, barrier-free, and structurally strong enclosed space by providing partitioning walls. This ensures that individual LED chip modules emit stable light, prevent cross-coloring, and provide good color reproduction performance for pixels composed of adjacent LED chip modules. Furthermore, the multiple LED chip modules of the present invention are integrated into a whole by a substrate and a packaging rubber block. The integrated LED MIP has dimensions several times greater than those of a single MIP lamp bead, and the number of pads is also several times greater than that of a single MIP lamp bead. Its welding strength, impact resistance, and heat dissipation performance are all superior to those of a single LED MIP lamp bead. The packaging rubber block can block moisture and humidity, improving its environmental resistance. The present invention has the advantages of good color mixing performance, environmental friendliness, and low cost, which are necessary for LED micro-pitch displays. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 A top view of a partial structure of the integrated LED MIP package structure provided in Example 1 Figure 1 ;

[0024] Figure 2 for Figure 1 A cross-sectional view taken along the transverse centerline;

[0025] Figure 3 A top view of a partial structure of the integrated LED MIP package structure provided in Example 1 Figure 2 ;

[0026] Figure 4 for Figure 3 A cross-sectional view taken along the transverse centerline;

[0027] Figure 5 A top view of a partial structure of the integrated LED MIP package structure provided in Example 1 Figure 3 ;

[0028] Figure 6 for Figure 5 A cross-sectional view taken along the transverse centerline;

[0029] Figure 7 A top view of a partial structure of the integrated LED MIP package structure provided in Example 1 Figure 4 ;

[0030] Figure 8 for Figure 7 A cross-sectional view taken along the transverse centerline;

[0031] Figure 9 A top view of the integrated LED MIP package structure provided in Example 1 Figure 1 ;

[0032] Figure 10 for Figure 9 A cross-sectional view taken along the transverse centerline of the LED chip module;

[0033] Figure 11 for Figure 9 A cross-sectional view taken along the longitudinal centerline of the LED chip module;

[0034] Figure 12 A top view of the integrated LED MIP package structure provided in Example 1 Figure 2 ;

[0035] Figure 13 for Figure 12 A cross-sectional view taken along the transverse centerline of the LED chip module;

[0036] Figure 14 for Figure 12 A cross-sectional view taken along the longitudinal centerline of the LED chip module;

[0037] Figure 15 A top view of the integrated LED MIP package structure provided in Example 1 Figure 3 ;

[0038] In the figure: 100, integrated LED MIP packaging structure; 1, substrate; 101, circuit via; 2, pad assembly; 3, LED chip module; 4, partition wall; 401, mounting groove; 402, first partition wall; 403, second partition wall; 404, primary printed colloid; 405, secondary printed colloid; 5, packaging glue block; 6, first groove; 7, second groove; 8, solder paste. DETAILED DESCRIPTION

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] It should be noted that in the description of the present invention, terms such as "upper", "lower", "left", "right", "inside", "outside", "front", "back", "center", "longitudinal", "lateral", "length", "width", "thickness", "vertical", "horizontal", "top", "bottom", "clockwise", and "counterclockwise" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it should not be understood as limiting the present invention. In addition, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0041] Furthermore, it should be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0042] The purpose of the present invention is to provide an integrated LED MIP packaging structure, packaging method and display unit to solve the problems existing in the prior art, and has the advantages of good color mixing performance, environmental friendliness and low cost.

[0043] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0044] Example 1

[0045] like Figures 1 to 15 As shown, this embodiment provides an integrated LED MIP packaging structure 100, including a substrate 1, a pad assembly 2, an LED chip module 3, a partition wall 4 and a packaging glue block 5, wherein the pad assembly 2, the LED chip module 3 and the partition wall 4 are all multiple; each pad assembly 2 is fixedly connected to the same side of the substrate 1; all LED chip modules 3 are connected to one pad assembly 2; each partition wall 4 is annular, and each partition wall 4 surrounds the outside of an LED chip module 3; the packaging glue block 5 is arranged on a side of the substrate 1 close to the LED chip module 3, and the packaging glue block 5 encapsulates the pad assembly 2 and the LED chip module 3 in the installation groove 401 surrounded by the corresponding partition wall 4; each partition wall 4 can reflect the light emitted by the corresponding LED chip module 3 to the packaging glue block 5 and emit it from the packaging glue block 5, and each partition wall 4 can prevent the light of the LED chip module 3 from crosstalk by blocking the light of the corresponding LED chip module 3.

[0046] This embodiment, by providing a partitioning wall 4, places the LED chip modules 3 within an independent, structurally strong, and enclosed space. This ensures stable illumination from individual LED chip modules 3, prevents cross-coloring, and provides excellent color reproduction performance for pixels formed by adjacent LED chip modules 3. Furthermore, the multiple LED chip modules 3 in this embodiment are integrated into a single unit by the substrate 1 and the encapsulating rubber block 5. The integrated LED MIP has dimensions several times that of a single MIP lamp bead, and the number of solder pads is also several times that of a single MIP lamp bead. This unit also offers superior soldering strength, impact resistance, and heat dissipation performance compared to a single LED MIP lamp bead. The encapsulating rubber block 5 blocks moisture and improves environmental resistance. This embodiment offers the advantages of excellent color mixing performance, environmental friendliness, and low cost, essential for LED fine-pitch displays.

[0047] In this specific embodiment, the cross section parallel to the substrate 1 is the cross section, and the cross section of each mounting groove 401 is a long strip; all LED chip modules 3, all solder pad assemblies 2 and all partition walls 4 are arranged on the substrate 1 in the form of a rectangular array (M*N array), thereby forming an independent LED MIP unit integration body with M*N pixel lights.

[0048] In this specific embodiment, each partition wall 4 includes a first partition wall 402, the inner side wall of the first partition wall 402 is inclined from the side close to the substrate 1 to the side away from the substrate 1, and the inner side wall of each first partition wall 402 is inclined from the end away from the substrate 1 to the side away from the LED chip module 3.

[0049] In this specific embodiment, each partition wall 4 further includes a second partition wall 403 , and each second partition wall 403 fills the gap between adjacent pad assemblies 2 .

[0050] In this specific embodiment, a side of the encapsulating rubber block 5 facing away from the substrate 1 is provided with multiple rows of first grooves 6 and multiple rows of second grooves 7. Each first groove 6 extends along the row direction of the rectangular array formed by the LED chip modules 3, and each second groove 7 extends along the column direction of the rectangular array formed by the LED chip modules 3. Two opposing side walls of each partitioning wall 4 extend along the row direction, while the other two opposing side walls of each partitioning wall 4 extend along the column direction. Each side wall of each partitioning wall 4 extending in the row direction is opposite to a first groove 6, and each side wall of each partitioning wall 4 extending in the column direction is opposite to a second groove 7. When multiple integrated LED MIP package structures are mounted on a display panel for assembly and splicing, gaps will exist between the LED MIP package structures. By aligning the first grooves 6 of two adjacent LED MIP package structures and aligning the first grooves 6 of two adjacent LED MIP package structures, the gaps between the spliced ​​LED MIP package structures can be maintained consistent.

[0051] In this embodiment, the width of the first groove 6 and the second groove 7 is equal to the width of the gap between two adjacent integrated LED MIP package structures 100 when the integrated LED MIP package structures 100 are assembled and spliced ​​on a display.

[0052] In this specific embodiment, a chip circuit is provided on one side of the substrate 1 close to the pad assembly 2, and an external circuit is provided on the other side of the substrate 1, and each chip circuit is connected to each pad; a plurality of circuit vias 101 are provided on the substrate 1, and the chip circuit and the external circuit are connected through the circuit vias 101; one end of each circuit via 101 close to the chip circuit can be covered by a side wall of a partition wall 4.

[0053] In this embodiment, the side of the substrate 1 housing the external circuitry is printed with an insulating colloid, which serves to encapsulate the external circuitry. The insulating colloid is then filled in the circuit vias 101, connecting and fusing with the second partition wall 403 through the circuit vias 101. This strengthens the circuit protection of the encapsulated substrate 1 and prevents moisture from entering the mounting surface of the LED chip module 3 from the external circuit surface of the encapsulated substrate 1, thereby enhancing the environmental resistance of the LED chip module 3. The end of each circuit via 101 closest to the chip circuitry can be covered by a sidewall of a partition wall 4, further enhancing the fusion strength between the circuit via 101, the second partition wall 403, and the insulating colloid.

[0054] In this specific embodiment, the substrate 1 is a multi-layer circuit board, and the substrate 1 is preferably a 0.5OZ copper thickness BT board with a thickness of 0.2-0.3MM. The electrode connection circuit sheet of the LED chip module 3 is preferably processed by the immersion gold process; the fixed surface of the integrated LED MIP package structure 100 is provided with the LED chip electrodes of the array LED chip module 3 and the interconnected row and column circuits; the other side of the substrate 1 is also provided with the electrodes and interconnected circuits required for the LED chip array, and the circuit pads provided on the external circuit connect the leads of the LED chip electrodes on the integrated LED MIP package structure 100 to the external driving circuit.

[0055] In this embodiment, the circuit via 101 is preferably a copper hole with a diameter no larger than the width of the second partition wall 403 at the partition or intersection. The substrate 1 is entirely printed with insulating colloid except for the pads connected to the external drive circuit.

[0056] In this embodiment, the LED chip modules 3 are fixed on the packaging substrate 1 in an array, and the partition walls 4 surrounding the LED chip modules 3 are formed by multiple printings using an insulating colloid. Preferably, a second or third printing is performed on the layer of the surrounding wall (second partition wall 403) that has been solidified by the first printing to form the first partition wall 402; the longitudinal cross-sections of the colloid printed more than twice in the row and column directions are all trapezoidal or arc-shaped to reflect the optical fiber so that the optical fiber is emitted through the packaging colloid block 5. The maximum height of the partition wall 4 is equal to or lower than the fixed surrounding wall (second partition wall 403). The height of the upper surface of the LED chip module 3 after the back is adjusted is such that the packaging glue block 5 covers the outside of the LED chip module 3 and the partition wall 4, thereby strengthening the fusion strength between the partition wall 4 and the packaging substrate 1; the colloid walls enclosed around the LED chip module 3 are fused with each other to form an annular partition wall 4, constituting an array of porous glue layer conjoined bodies for fixing the LED chip module 3; the space of the enclosed mounting groove 401 for fixing the LED chip module 3 is in the shape of a long inverted trapezoid, and the porous array colloid space constitutes an array LED chip fixing conjoined piece of the integrated MIP.

[0057] In this specific embodiment, LED chips are fixed and welded in an array of enclosed spaces formed by multiple printings of colloids. Only one chip from an RGB chip group is fixed and welded in a single enclosed hole on the array of porous LED MIP conjoined pieces. When fixing and welding, the RGB single-color chips are arranged in the array required by the LED MIP display circuit, and the electrode polarity of LED chips of the same color is kept in the same direction when fixed (ensuring that the positive and negative poles (anode / cathode) directions of all LED chips are uniformly arranged); the surface height of the LED chip after fixing and welding is equal to or higher than the arc-shaped upper surface of the trapezoidal colloid wall of the multi-layer printed colloid; the LED chip electrode connection circuit piece arranged at the bottom of the inverted trapezoidal enclosed long strip space is larger than the LED chip surface and has a margin of space for soldering the LED chip pad.

[0058] In this specific embodiment, all RGB chip group LED chips are flip-chip soldered LED chips; the light-emitting layer of the flip-chip LED chip after soldering is located on the bottom surface of the LED chip. Since the height of the printed colloid wall surrounding the LED chip is equal to or lower than the height of the upper surface of the LED chip, the light emitted by the LED chip will be emitted to the upper surface of the packaging colloid at a certain cone angle. The hemispherical light emitted by the LED chip is laterally blocked by the surrounding colloid and reflected toward the surface, thereby improving the light collection efficiency of the MIP LED chip and blocking the light color crosstalk between adjacent LED chips, thereby improving the image reproduction quality.

[0059] In this embodiment, a conjoined LED MIP package substrate, to which LED chip electrodes have been secured and soldered, is coated with encapsulation glue. The glue fills the chip's inverted trapezoidal mounting holes and forms an encapsulation glue layer that is a certain thickness above the top surface of the LED chip. The top surface of the solidified conjoined MIP encapsulation glue is first ground flat, and then the ground MIP encapsulation glue surface is scribed with a cross-sectional groove pattern. The groove line is centered at the midline of the trapezoidal cross-section formed by the multi-layer printed glue. The width of the groove is equal to the gap between the cut integrated LED MIPs after mounting. The bottom layer of the groove is deeper than the top surface layer of the LED chip in the hole, preventing optical crosstalk from the LED chips while also providing a certain thickness of encapsulation glue protection for the sides of the LED chips. This ensures that the light emitted by any LED chip in the mounted integrated LED MIP is equal to the light emitted by any adjacent mounted integrated LED MIP, ensuring consistent light and color mixing between adjacent chips in adjacent integrated LED MIPs.

[0060] In this specific embodiment, the conjoined integrated MIP with the scribed groove is cut on four sides by a dicing machine, and the cut integrated LED MIPs are sorted and taped for mounting.

[0061] In this specific implementation, the LED MIP unit uses 3×2 unit pixels.

[0062] In this specific embodiment, the LED chip module 3 includes a GRB chip.

[0063] In this embodiment, the LED chip module 3 includes three GRB chips, which are disposed in a mounting groove 401 to form independent RGB pixels, and multiple (M*N) pixels are connected to form an integrated LED MIP.

[0064] Example 2

[0065] This embodiment provides a packaging method for an integrated LED MIP packaging structure 100, including the following steps:

[0066] S1, soldering the pad assembly 2 to the substrate 1;

[0067] S2, forming a plurality of partition walls 4 on the substrate 1;

[0068] S3, installing each LED chip module 3 in the installation groove 401, and connecting each LED chip module 3 to the corresponding solder pad assembly 2;

[0069] S4. Apply packaging glue on the side of the substrate 1 close to the pad component 2.

[0070] In this specific embodiment, a partition wall 4 is fixed on the prepared packaged circuit chip printed chip, and after the primary printed colloid 404 is cured, a secondary printed colloid 405 is printed, and so on; preferably, the printed colloid of the partition wall 4 is a black epoxy resin solid glue; the multi-layer printed colloid equipment is a fine alignment printing equipment.

[0071] Before fixing and soldering the LED chip module 3, solder paste 8 for fixing the LED chip is printed first, and then the LED chip is placed in an inverted trapezoid shape on the circuit chip with printed solder paste in the chip fixing hole by a die bonding machine, and fixed in a high-temperature nitrogen reflow furnace.

[0072] Preferably, the LED RGB chip is a flip-chip soldered LED chip.

[0073] Preferably, the chip electrode solder paste 8 is printed using precision step steel screen printing.

[0074] Preferably, the LED chip is fixed by a general soldering machine and then fixed by a nitrogen reflow furnace at high temperature.

[0075] A precision dispensing machine dispenses glue on the upper surface of a single integrated LED MIP on a package circuit substrate; after high-temperature curing, the surface of the package colloid is smoothed by a grinding wheel grinder, and the upper surface of the ground conjoined integrated MIP is divided into groove lines by a precision dicing machine, and then the precision dicing machine cuts and separates the periphery of the integrated LED MIP unit. The separated integrated LED MIPs are sorted and taped for mounting.

[0076] Preferably, the dispensing machine is a precision dispensing machine, and the packaging glue is black epoxy resin glue with a certain light transmittance.

[0077] Preferably, the groove scribing and MIP cutting and separation equipment is a precision dicing machine.

[0078] Example 3

[0079] This embodiment provides a display unit provided with the integrated LED MIP packaging structure 100 in Embodiment 1.

[0080] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. At the same time, those skilled in the art will find that the specific implementation methods and application scopes may vary based on the concept of the present invention. In summary, the contents of this specification should not be construed as limiting the present invention.

Claims

1. An integrated LED MIP packaging structure, characterized by: It includes a substrate, a solder pad assembly, an LED chip module, a partition wall and a packaging rubber block, and there are multiple solder pad assemblies, LED chip modules and partition walls; each solder pad assembly is fixedly connected to the same side of the substrate; all the LED chip modules are connected to one solder pad assembly; each partition wall is annular, and each partition wall surrounds the outside of one LED chip module; the packaging rubber block is arranged on the side of the substrate close to the LED chip module, and the packaging rubber block encapsulates the solder pad assembly and the LED chip module in the installation groove surrounded by the corresponding partition wall; each partition wall can reflect the light emitted by the corresponding LED chip module to the packaging rubber block and emit it from the packaging rubber block, and each partition wall can prevent the light of the LED chip module from crosstalk by blocking the light of the corresponding LED chip module.

2. The integrated LED MIP package structure according to claim 1, wherein: The cross section parallel to the substrate is a cross section, and the cross section of each mounting groove is in the shape of an elongated strip; all the LED chip modules, all the pad assemblies and all the partition walls are arranged on the substrate in the form of a rectangular array.

3. The integrated LED MIP package structure according to claim 2, wherein: Each of the partition walls includes a first partition wall, the inner side wall of which is inclined from a side close to the substrate to a side away from the substrate, and the inner side wall of each of the first partition walls is inclined from an end away from the substrate to a side away from the LED chip module.

4. The integrated LED MIP package structure according to claim 3, wherein: Each of the partition walls further includes a second partition wall, and each of the second partition walls fills the gap between adjacent pad components.

5. The integrated LED MIP package structure according to claim 2, wherein: A plurality of columns of first grooves and a plurality of columns of second grooves are provided on a side of the packaging rubber block away from the substrate, wherein each first groove extends along the row direction of the rectangular array formed by the LED chip modules, and each second groove extends along the column direction of the rectangular array formed by the LED chip modules; two side walls of each partition wall that are oppositely arranged extend along the row direction, and the other two side walls of each partition wall that are oppositely arranged extend along the column direction; each side wall of each partition wall that extends along the row direction is arranged opposite to one of the first grooves, and each side wall of each partition wall that extends along the column direction is arranged opposite to one of the second grooves.

6. The integrated LED MIP packaging structure according to claim 5, characterized in that: The width of the first groove and the second groove is equal to the width of the gap between two adjacent integrated LED MIP packaging structures when the integrated LED MIP packaging structures are assembled and spliced ​​on a display.

7. The integrated LED MIP packaging structure according to claim 4, characterized in that: A chip circuit is provided on one side of the substrate close to the pad assembly, and an external circuit is provided on the other side of the substrate, and each chip circuit is connected to each pad; a plurality of circuit vias are provided on the substrate, and the chip circuit is connected to the external circuit through the circuit vias; an end of each circuit via close to the chip circuit can be covered by a side wall of the partition wall.

8. The integrated LED MIP packaging structure according to claim 7, characterized in that: An insulating colloid is printed on one side of the substrate where the external circuit is provided, and the insulating colloid is used to encapsulate the external circuit; the insulating colloid is connected and fused with the second partition wall through the circuit via hole.

9. A packaging method for the integrated LED MIP packaging structure according to any one of claims 1 to 8, characterized in that: The steps include: S1, welding the pad assembly onto the substrate; S2, forming a plurality of partition walls on the substrate; S3, installing each of the LED chip modules in the installation slot, and connecting each of the LED chip modules to the corresponding solder pad assembly; S4, applying packaging glue on a side of the substrate close to the pad assembly.

10. A display unit, characterized in that: An integrated LED MIP packaging structure according to any one of claims 1 to 8 is provided.

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