Preparation method and application of agglomerated polycrystalline diamond abrasive particles

By controlling the agglomeration method of polycrystalline diamond powder and thermosetting resin, agglomerated polycrystalline diamond abrasive grains with a core-shell structure are prepared, which solves the problems of complex preparation and poor effect in the existing technology and realizes efficient SiC wafer grinding.

CN120648440APending Publication Date: 2025-09-16XIAMEN UNIV
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Patent Information

Application Number
CN202510617291.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-14
Publication Date
2025-09-16

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Abstract

The invention discloses a preparation method and application of agglomerated polycrystalline diamond abrasive particles, and belongs to the technical field of superhard materials. The preparation method comprises the following specific steps: S1, adding polycrystalline diamond micro-powder and thermosetting resin into an organic solvent, and performing ultrasonic stirring to form an organic solution; s2, dropwise adding the organic liquid into a curing agent solution, and stirring at constant temperature to generate agglomeration, so as to obtain an agglomerated solution; s3, dropwise adding the aqueous solution of the polycrystalline diamond micro-powder into the agglomerated solution in the S2, stirring the solution to enable the polycrystalline diamond micro-powder to be adsorbed on the surfaces of agglomerated particles, and terminating agglomeration; and S4, filtering the solution in S3, and drying the filtered powder to prepare the agglomerated polycrystalline diamond abrasive particles with uniform particle size. The method provided by the invention is simple in process, required equipment is low in cost, and the particle size of the agglomerated polycrystalline diamond abrasive particles can be accurately controlled, so that the grinding fluid prepared from the prepared agglomerated abrasive is high in MRR and low in surface roughness when being used for processing, and has important application value.
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Citation Information

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