Display device

Abstract

According to an embodiment of the present disclosure, a display device includes: a display unit including a plurality of regions; a driver integrated circuit including a plurality of integrated circuits driving the display units; and a storage medium configured to store temperature information of the display unit. Each of the temperature information includes data of a temperature increment value of each region in the display unit when the driver integrated circuit is driven.

Description

[0001] This application claims priority from Korean Patent Application No. 10-2024-0035087, filed on March 13, 2024, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present disclosure relates to a display device and a method of predicting degradation of a display panel. Background Art

[0003] Recently, display devices that display images using digital data, such as liquid crystal displays (LCDs) using liquid crystals, organic light emitting diodes (OLEDs) using OLED displays, and electrophoretic displays (EPDs) using electrophoretic particles, are widely used.

[0004] Among them, OLED displays are self-emitting devices that emit light in an organic light-emitting layer through recombination of electrons and holes. OLED displays have high brightness, low driving voltage, and ultra-thin thickness, and are therefore expected to be the next generation of display devices.

[0005] An OLED display may include a display unit having pixels, a driver integrated circuit for driving the display unit, and the like. Heat generated during driving the driver integrated circuit may be transferred to the display unit. In addition, the degradation rate of the pixels may be accelerated due to heat.

[0006] The above-described contents are merely intended to help understand the background technology of the technical idea of ​​the present disclosure, and therefore cannot be understood as contents corresponding to the prior art known to those skilled in the art in the field of the present disclosure. Summary of the Invention

[0007] Embodiments of the present disclosure are to provide a display device and a method for predicting degradation of a display panel, which can sense (or predict) a degradation rate of pixels due to heat generated during driving of the display panel.

[0008] According to an embodiment of the present disclosure, a display device includes: a display unit including multiple regions; a driver integrated circuit including multiple integrated circuits for driving the display unit; and a storage medium configured to store temperature information of the display unit. Each piece of temperature information includes data indicating a temperature increment value of each region in the display unit when the driver integrated circuit is driven.

[0009] The data of the temperature increment value of each area in the display unit may be a percentage value (relative percentage value).

[0010] Each of the percentage values ​​may be a value obtained by multiplying a temperature increment value of one of the plurality of regions by 100% and dividing the value by a maximum temperature increment value among the temperature increment values ​​of the plurality of regions.

[0011] Each of the temperature information includes a maximum temperature increment value.

[0012] The storage medium may further store other information including heat generation information of the display unit according to a driving frequency of the driver integrated circuit and heat generation information of the display unit according to an amount of a data signal transmitted from the driver integrated circuit to the display unit.

[0013] The driver integrated circuit may retrieve temperature information and other information from a storage medium, generate a temperature map using the temperature information and other information, and predict a degree of degradation of each region in the display unit based on the temperature map.

[0014] Each of the plurality of regions may have the same area.

[0015] Each of the temperature increment values ​​may be a value obtained by subtracting a temperature measurement value before driving the driver integrated circuit from a temperature measurement value after driving the driver integrated circuit.

[0016] The temperature measurement value may be a value measured using a thermal imaging camera.

[0017] The multiple integrated circuits may include a first integrated circuit and a second integrated circuit, the temperature information may include first temperature information and second temperature information, the first temperature information may be generated in a state where the second integrated circuit is not driven and the first integrated circuit is driven, and the second temperature information may be generated in a state where the first integrated circuit is not driven and the second integrated circuit is driven.

[0018] A method for predicting degradation of a display panel includes a display unit and a driver integrated circuit. The display unit may include multiple regions, and the driver integrated circuit may include multiple integrated circuits that drive the display unit. The method may include driving the driver integrated circuit, measuring the front surface temperature of the display unit, generating temperature information based on the measured front surface temperature of the display unit before shipping a product, and storing the generated temperature information in a storage medium. Generating the temperature information before shipping the product may include calculating a temperature increment value for each region in the display unit when the driver integrated circuit is driven, and converting the temperature increment value for each region into a percentage value.

[0019] The method may further include storing other information in a storage medium before shipment of the product. The other information may include heat generation information of the display unit according to a driving frequency of the driver integrated circuit and heat generation information of the display unit according to an amount of a data signal transmitted from the driver integrated circuit to the display unit.

[0020] Each of the plurality of regions may have the same area.

[0021] Each of the percentage values ​​may be a value obtained by multiplying a temperature increment value of one of the plurality of regions by 100% and dividing by a maximum temperature increment value among the temperature increment values ​​of the plurality of regions.

[0022] The temperature measurement value may be a value measured using a thermal imaging camera.

[0023] The percentage value may be a value obtained by calculating a maximum temperature increment value among the temperature increment values ​​of the respective regions and performing conversion based on the maximum temperature increment value.

[0024] The temperature information may include a maximum temperature increment value.

[0025] The multiple integrated circuits may include a first integrated circuit and a second integrated circuit, the temperature information may include first temperature information and second temperature information, the first temperature information may be generated in a state where the second integrated circuit is not driven and the first integrated circuit is driven, and the second temperature information may be generated in a state where the first integrated circuit is not driven and the second integrated circuit is driven.

[0026] A method for predicting degradation of a display panel includes a display unit and a driver integrated circuit, wherein the display unit includes multiple regions and the driver integrated circuit includes multiple integrated circuits for driving the display unit. The method may include: driving the driver integrated circuit; measuring the front surface temperature of the display unit; generating temperature information based on the measured front surface temperature of the display unit before shipping a product, and storing the generated temperature information in a storage medium; and generating a temperature map based on the temperature information after shipping the product. Generating the temperature information before shipping the product may include calculating a temperature increment value for each region in the display unit when the driver integrated circuit is driven, and converting the temperature increment value for each region into a percentage value.

[0027] The method may further include: storing other information in a storage medium before shipment of the product and compensating the temperature map based on the other information; and predicting degradation of the display panel using the compensated temperature map after shipment of the product. The other information may include heat generation information of the display unit according to a driving frequency of the driver integrated circuit and heat generation information of the display unit according to an amount of a data signal transmitted from the driver integrated circuit to the display unit.

[0028] According to the display device and the method of predicting degradation of the display panel according to the embodiments of the present disclosure, it is possible to sense (or predict) the degradation speed of pixels due to heat generated during driving of the display panel.

[0029] The effects according to the embodiment are not limited to the above-exemplified contents, and further various effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other features of the present disclosure will become more apparent by describing the embodiments of the present disclosure in more detail with reference to the accompanying drawings, in which:

[0031] Figure 1 is a diagram illustrating a display device according to an embodiment of the present disclosure;

[0032] Figure 2 It is along Figure 1 A sectional view taken along line I-I';

[0033] Figure 3 It is schematically shown Figure 2 An exploded perspective view of a display panel;

[0034] Figure 4 It shows Figure 2 A block diagram of an embodiment of a display panel;

[0035] Figure 5 and Figure 6 It is shown that the product is generated before shipment Figure 2 A flowchart of a method for displaying temperature information of a display panel and storing the temperature information in a storage medium;

[0036] Figure 7 、 Figure 8 and Figure 9 It shows Figure 5 FIG of step S520;

[0037] Figure 10 It shows Figure 6 FIG of step S531;

[0038] Figure 11 It shows Figure 6 FIG of step S532;

[0039] Figure 12 、 Figure 13 and Figure 14 is a graph showing temperature information when a portion of an integrated circuit of a driver integrated circuit is driven;

[0040] Figure 15is a flowchart illustrating a method of predicting a degradation rate of each region in a display unit after product shipment using temperature information stored in a storage medium before product shipment;

[0041] Figure 16 It shows Figure 15 FIG of step S1310;

[0042] Figure 17 is a block diagram illustrating an electronic device according to an embodiment of the present disclosure; and

[0043] Figure 18 It shows Figure 17 FIG. 4 is a diagram of an example in which the electronic device is implemented as a smart phone. DETAILED DESCRIPTION

[0044] Hereinafter, embodiments according to the present disclosure are described in detail with reference to the accompanying drawings. It should be noted that in the following description, only the parts required for understanding the operation according to the present disclosure are described, and in order not to obscure the subject matter of the present disclosure, the description of other parts is omitted. In addition, the present disclosure can be implemented in other forms and is not limited to the embodiments described herein. However, the embodiments described herein are provided for detailed description so that those skilled in the art to which the present disclosure belongs can easily implement the technical spirit of the present disclosure.

[0045] Throughout the specification, when a part is "connected" to another part, the situation includes not only the situation that the part is "directly connected" to the other part, but also the situation that the part is "indirectly connected" to the other part and another element is inserted between the part and the other part. The terms used in this article are used to describe specific embodiments and are not intended to limit the present disclosure. Throughout the specification, when a certain part "includes" a component, unless otherwise stated, the situation means that the part can also include another component, without excluding another component. "At least any one of X, Y and Z" and "at least any one selected from the group consisting of X, Y and Z" can be interpreted as one X, one Y, one Z or any combination of two or more of X, Y and Z (for example, XYZ, XY, YZ and XZ). Here, "and / or" includes all combinations of one or more of the corresponding configurations.

[0046] Here, terms such as first and second can be used to describe various components, but these components should not be limited by these terms. These terms are used to distinguish one component from another component. Therefore, within the scope of not departing from the scope disclosed herein, a first component can refer to a second component.

[0047] Spatially relative terms such as "below", "above" etc. may be used for descriptive purposes to describe the relationship between an element or feature and another element (or elements) or feature (or features) as shown in the accompanying drawings. In addition to the directions depicted in the accompanying drawings, spatially relative terms are intended to include other directions in use, operation and / or manufacture. For example, when the device shown in the accompanying drawings is inverted, the element described as being "below" other elements or features is located in the direction "above" other elements or features. Therefore, in an embodiment, the term "below" may include both upper and lower directions. In addition, the device can face other directions (e.g., rotated 90 degrees or in other directions), and therefore, the spatially relative terms used in this article are interpreted accordingly.

[0048] Various embodiments are described with reference to the accompanying drawings, which schematically illustrate idealized embodiments. Therefore, variations in shape are to be expected, for example, due to tolerances and / or manufacturing techniques. Therefore, the embodiments disclosed herein should not be construed as limited to the specific shapes shown and should be construed to include variations in shape that may occur, for example, due to manufacturing. As described above, the shapes shown in the accompanying drawings may not represent the actual shape of regions of the device, and the embodiments are not limited thereto.

[0049] Figure 1 is a diagram illustrating a display device according to an embodiment of the present disclosure.

[0050] refer to Figure 1 A display device DD refers to a device that can provide visual data to a user. A display device, as defined in this specification, refers to a device that includes a light-emitting element that emits light when an electrical signal is applied. That is, the display device DD according to embodiments of the present disclosure is not limited to specific devices such as tablet PCs, televisions, smartphones, and notebook computers. The display device DD can have a three-dimensional shape extending in a first direction DR1, a second direction DR2 intersecting the first direction DR1, and a third direction DR3 intersecting the first and second directions DR1 and DR2.

[0051] The display device DD may include a display area DA, a non-display area NDA, a sensing area SA, and a non-sensing area NSA.

[0052] The display device DD may display an image through the display area DA and may also sense a touch input from a user or light incident from the front through the sensing area SA. A touch sensor of the display device DD may be located in the sensing area SA.

[0053] The touch sensor of the display device DD may not be located in the non-sensing area NSA. The non-sensing area NSA may surround the sensing area SA, but this is an example and is not limited thereto.

[0054] According to an embodiment, a partial area of ​​the display area DA may correspond to the sensing area SA, and a partial area of ​​the non-display area NDA may correspond to the non-sensing area NSA.

[0055] The display device DD may output visual information through the front surface of the display device DD. The display device DD may include at least one pixel PX. The pixel PX may be located in the display area DA.

[0056] Each pixel PX may include a light-emitting element. In this specification, a light-emitting element may include a light source that emits light when an electrical signal is applied to it. When an electrical signal corresponding to image data is applied to each of the pixels PX, each of the pixels PX may emit light through the display area DA.

[0057] The light emitting element may be an inorganic light emitting element including an inorganic light emitting material or a light emitting element (or a quantum dot display device) that emits light by changing the wavelength of the emitted light using quantum dots. According to an embodiment, the light emitting element may be an organic light emitting element including an organic light emitting material.

[0058] Figure 2 It is along Figure 1 A cross-sectional view taken along line I-I'.

[0059] refer to Figure 2 , the display device DD may include a display panel DP, an encapsulation layer ENC, a touch sensor TS, an optically transparent adhesive member OCA, and a window WD.

[0060] The display panel DP can output visual data. Figure 3 The display panel DP is described.

[0061] The encapsulation layer ENC may be located on the display panel DP. The encapsulation layer ENC may prevent external moisture and oxygen from penetrating into the display panel DP.

[0062] The touch sensor TS may be located on the encapsulation layer ENC. The touch sensor TS may be located in the sensing area (see Figure 1 According to an embodiment, the display panel DP and the touch sensor TS may be integrally manufactured.

[0063] When a touch input is applied from a user, the touch sensor TS may obtain information about the touch input. The touch sensor TS may recognize the touch input using a capacitance sensing method. The touch sensor TS may sense the touch input using a mutual capacitance method or a self-capacitance method.

[0064] A window WD may be located on the touch sensor TS. The window WD may be a transparent, light-transmitting substrate. The window WD and the touch sensor TS may be coupled to each other via an optically transparent adhesive member (OCA). The window WD may transmit visual information and protect the display device DD from external impacts. For example, the window WD may be implemented using hard glass, flexible plastic, or the like. However, embodiments of the present disclosure are not limited thereto.

[0065] Figure 3 It is schematically shown Figure 2 An exploded perspective view of the display panel.

[0066] refer to Figure 3 , the display panel DP may include a display unit 100, a driver integrated circuit 200, and a storage medium 300. However, the present disclosure is not limited thereto, and the driver integrated circuit 200 and the storage medium 300 may be implemented as components separate from the display panel DP.

[0067] The display unit 100 may correspond to the display area DA of the display panel DP. The display unit 100 may include at least one pixel PX. The display unit 100 may output visual information through the front surface of the display device DD.

[0068] The driver integrated circuit 200 may overlap with the display unit 100 in at least a partial area. The driver integrated circuit 200 may include a plurality of integrated circuits, wherein the plurality of integrated circuits include a first integrated circuit 210 and a second integrated circuit 220, and the driver integrated circuit 200 may use the plurality of integrated circuits to drive the display unit 100. For example, the driver integrated circuit 200 may use the plurality of integrated circuits to adjust the brightness of the pixel PX of the display unit 100.

[0069] A portion of the plurality of integrated circuits may be provided in the display area DA of the display panel DP and may overlap with the display unit 100. For example, a first integrated circuit 210 among the plurality of integrated circuits may be provided in the display area DA of the display panel DP and may overlap with the display unit 100. A portion of the plurality of integrated circuits may be provided in the non-display area NDA of the display panel DP and may not overlap with the display unit 100. For example, a second integrated circuit 220 among the plurality of integrated circuits may be provided in the non-display area NDA of the display panel DP so as not to overlap with the display unit 100.

[0070] When multiple integrated circuits drive the display unit 100, the multiple integrated circuits may dissipate heat, and this heat may be transferred to the display unit 100. The pixels PX of the display unit 100 may be heated by the heat transferred from the multiple integrated circuits to the display unit 100. Furthermore, the heated pixels PX of the display unit 100 may degrade faster. For example, when the temperature of the display unit 100 increases from 30°C to 50°C, the degradation rate of the pixels PX of the display unit 100 may increase by two times.

[0071] The integrated circuits arranged in the display area DA of the display panel DP may overlap with the display unit 100, and the integrated circuits arranged in the non-display area NDA of the display panel DP may not overlap with the display unit 100. The amount of heat transferred to the display unit 100 by the integrated circuits arranged to overlap with the display unit 100 may be greater than the amount of heat transferred to the display unit 100 by the integrated circuits arranged not to overlap with the display unit 100 (e.g., arranged in the non-display area NDA of the display panel DP). Compared to the integrated circuits arranged not to overlap with the display unit 100 (e.g., arranged in the non-display area NDA of the display panel DP), the integrated circuits arranged to overlap with the display unit 100 of the display panel DP may have a greater impact on the degradation rate of the pixels PX. In addition, depending on the arrangement of the integrated circuits, the amount of heat transferred from the driver integrated circuit 200 to the display unit 100 may be different for each area in the display unit 100, and the temperature distribution may be different for each area in the display unit 100.

[0072] like Figure 3 As shown in FIG, the storage medium 300 and the driver integrated circuit 200 may be mounted together on one substrate. The storage medium 300 may store the temperature information TI of the display unit 100 (refer to FIG. Figure 4 ) and other information OI (reference Figure 4 According to an embodiment of the present disclosure, the driver integrated circuit 200 can retrieve the temperature information TI and other information OI from the storage medium 300. In addition, when a user uses the display panel DP, the driver integrated circuit 200 can use the retrieved temperature information TI and other information OI to generate a temperature map. The driver integrated circuit 200 can predict the degradation rate of the pixels PX of the display unit 100 based on the generated temperature map.

[0073] Figure 4 It shows Figure 2 A block diagram of an embodiment of a display panel.

[0074] refer to Figure 4 , the display panel DP may include a display unit 100 , a driver integrated circuit 200 , and a storage medium 300 .

[0075] The display panel DP may include a display area DA and a non-display area NDA. Data lines, scan lines, power lines, and pixels PX may be disposed in the display area DA.

[0076] Each pixel PX may be connected to a scan line, a data line, and a power line. Each pixel PX may include at least one or more thin film transistors, at least one or more capacitors, and a light-emitting element. During a period in which a scan signal is applied via the scan line, each pixel PX may receive a data voltage via the data line. Furthermore, each pixel PX may emit light by supplying a driving current to the light-emitting element according to the received data voltage.

[0077] The non-display area NDA may surround the display area DA at the edge of the display panel DP. At least a portion of the driver integrated circuit 200 may be disposed in the non-display area NDA. The driver integrated circuit 200 may be configured to drive the display unit 100 to display an image on the display unit 100. The driver integrated circuit 200 may include a plurality of integrated circuits. For example, the driver integrated circuit 200 may include a scan driver that applies scan signals to scan lines and a data driver that applies data voltages to data lines.

[0078] The storage medium 300 may store temperature information TI and other information OI. The temperature information TI may correspond to data of a temperature increment value of each region in the display unit 100 due to heat from the driver integrated circuit 200. Here, the data of the temperature increment value of each region may be a percentage value. The other information OI may include various information about the heat generation of the display unit 100. For example, the other information OI may include heat generation information of the display unit 100 according to the driving frequency of the driver integrated circuit 200. For example, the other information OI may include heat generation information of the display unit 100 according to the amount of the data signal transmitted from the driver integrated circuit 200 to the display unit 100. For example, the other information OI may include the degree of heat generation of the display unit 100 according to the brightness of the display unit 100. However, embodiments of the present disclosure are not limited thereto, and the other information OI may further include various information about the heat generation of the display unit 100.

[0079] The driver integrated circuit 200 can retrieve the temperature information TI and other information OI from the storage medium 300. Furthermore, the driver integrated circuit 200 can generate a temperature map using the retrieved temperature information TI and other information OI. The driver integrated circuit 200 can use the generated temperature map to predict the degradation rate of the pixels PX of the display unit 100. For example, the driver integrated circuit 200 can use the generated temperature map to identify regions of the display unit 100 whose temperatures are relatively higher than those of other regions. Furthermore, the driver integrated circuit 200 can predict that regions of the display unit 100 whose temperatures are relatively higher than those of other regions will degrade faster. The temperature information TI is described in detail below.

[0080] Figure 5 and Figure 6 Is shown before the product is shipped Figure 2 Flowchart of a method for displaying temperature information of a display panel and storing the temperature information in a storage medium.

[0081] refer to Figure 5 and Figure 6 Before shipment of the product, the manufacturer may perform driving of the driver integrated circuit 200 (step S510). According to an embodiment, the manufacturer may drive only some of the integrated circuits included in the driver integrated circuit 200.

[0082] The manufacturer may drive the driver integrated circuit 200 and perform measuring the front surface temperature of the display unit 100 after a certain time has passed (step S520 ).

[0083] The manufacturer may generate temperature information TI based on the measured front surface temperature (step S530 ).

[0084] In addition, the manufacturer may perform storing the generated temperature information TI in the storage medium 300 (step S540). According to an embodiment, the manufacturer may additionally perform storing other information OI in the storage medium 300.

[0085] Generating the temperature information TI based on the measured front surface temperature (step S530 ) may include the following steps.

[0086] The manufacturer may calculate the temperature increment value of each region based on the measured front surface temperature of the display unit 100 (step S531). In addition, the manufacturer may calculate the relative percentage value of the temperature increment value of each region based on the maximum temperature increment value among the temperature increment values ​​of each region. Figure 10 and Figure 11 The generation of temperature information TI based on the measured front surface temperature (step S530) is described.

[0087] Figures 7 to 9 It shows Figure 5 FIG. 10 is a diagram of step S520.

[0088] refer to Figures 7 to 9 , the display unit 100 may include a plurality of regions having the same area. The display unit 100 may include an area A_n_m located in the nth row (n is a positive integer greater than or equal to 1) and the mth column (m is a positive integer greater than or equal to 1). According to an embodiment, the area of ​​each of the plurality of regions may be determined to include the same number of pixels PX. For example, in an embodiment, each of the plurality of regions may include pixels PX arranged in 64 rows and 64 columns. However, embodiments of the present disclosure are not necessarily limited thereto, and each of the plurality of regions may include pixels PX arranged in various numbers of rows and columns.

[0089] In step S520, the manufacturer may drive the driver integrated circuit 200 and, after a certain time has passed since the driver integrated circuit 200 was driven, use the thermal imaging camera TIC to measure the temperature of each of the multiple regions of the display unit 100. When the temperature of each of the multiple regions of the display unit 100 is measured using the thermal imaging camera TIC, the pixels PX disposed in the same region of the display unit 100 may display an image having the same grayscale. For example, the temperature value of the region A_n_m located in the nth row and the mth column may be measured using the thermal imaging camera TIC. However, embodiments of the present disclosure are not necessarily limited thereto, and various temperature measurement devices may be used to measure the temperature of each of the multiple regions of the display unit 100.

[0090] According to an embodiment, a manufacturer may drive only some of the integrated circuits in the driver integrated circuit 200 and measure the temperature of each of the plurality of regions of the display unit 100 after a certain time has passed after driving the driver integrated circuit 200 .

[0091] Figure 9 The temperature of each of the plurality of regions of the display unit 100 is shown. The following description assumes that the display unit 100 is divided into 160 regions. Figure 9 However, the embodiments of the present disclosure are not limited thereto. For example, the display unit 100 may be divided into 160 or more regions. For example, the display unit 100 may be divided into 160 or fewer regions.

[0092] The temperature of each of the plurality of regions of the display unit 100 may be different. For example, the temperature value T_1_1 of the region located in the first row and first column is 20° C. For example, the temperature value T_10_16 of the region located in the tenth row and sixteenth column is 25.1° C.

[0093] Figure 10 It shows Figure 6 FIG. 5 is a diagram of step S531.

[0094] refer to Figure 10 , the manufacturer may calculate the temperature increment value of each area based on the measured front surface temperature of the display unit 100 (step S531 ).

[0095] Here, the temperature increment value may be a value obtained by subtracting the temperature measurement value of the display unit 100 before driving the driver integrated circuit 200 from the temperature measurement value of the display unit 100 after driving the driver integrated circuit 200. Figure 7 The temperature measurement device (for example, a thermal imaging camera TIC, etc.) is used to obtain temperature measurement values.

[0096] For example, the temperature increment value of the region A_n_m located in the nth row and the mth column may correspond to a change amount of the temperature value of the region A_n_m located in the nth column and the mth row due to driving of the driver integrated circuit 200 .

[0097] For example, before driving the driver integrated circuit 200 , the temperature measurement value of the front surface of the display unit 100 may be 20° C. Figure 10 Shown by Figure 9 The temperature increment value for each region is obtained by subtracting 20°C from the temperature measurement value of each region in the display unit 100 after the driver integrated circuit 200 is driven, as shown in FIG. For example, the temperature increment value IV_1_1 of the region located in the first row and first column after the driver integrated circuit 200 is driven is 0°C. For example, the temperature increment value IV_10_16 of the region located in the tenth row and sixteenth column after the driver integrated circuit 200 is driven is 5.1°C. For example, the temperature increment value IV_5_8 of the region located in the fifth row and eighth column after the driver integrated circuit 200 is driven is 23°C. In this way, the temperature increment values ​​can also be calculated for the remaining regions of the display unit 100.

[0098] Figure 11 It shows Figure 6 FIG. 5 is a diagram of step S532.

[0099] refer to Figure 11 The manufacturer may calculate the relative percentage of the temperature increment value of each region based on the maximum temperature increment value among the temperature increment values ​​of each region (step S532). The specific process is as follows.

[0100] First, the manufacturer may obtain the maximum temperature increment value among the temperature increment values ​​of the respective regions.

[0101] Furthermore, a relative percentage value of the region A_n_m located in the nth row and the mth column may be calculated by multiplying the temperature increment value of the region A_n_m located in the nth row and the mth column by 100% and dividing by the maximum temperature increment value.

[0102] First, refer to Figure 10 In this example, the maximum temperature increment value is 23° C., which is the temperature increment value IV_5_8 of the region located in the fifth row and eighth column. In addition, the relative percentage value RP_5_8 of the region located in the fifth row and eighth column is 100%.

[0103] The temperature increment value IV_1_1 of the region located in the first row and the first column is 0° C. In addition, the relative percentage value RP_1_1 of the region located in the first row and the first column is 0%.

[0104] The temperature increment value IV_10_16 of the region located in the tenth row and sixteenth column is 5.1° C. Furthermore, the relative percentage value RP_10_16 of the region located in the tenth row and sixteenth column is 22%. In this way, relative percentage values ​​can be calculated for the remaining regions.

[0105] Stored in the storage medium 300 (see Figure 4 ) in the temperature information TI (see Figure 4 ) may include a relative percentage value of the temperature increment value of each region and a maximum temperature increment value. In an example, the storage medium 300 may store 23°C as the maximum temperature increment value and Figure 11 The relative percentage values ​​of the temperature increment values ​​for each area are shown in .

[0106] The storage medium 300 may additionally store temperature information TI in the case of driving some of the integrated circuits of the driver integrated circuit 200. Figures 12 to 14 Describe this.

[0107] Figures 12 to 14 is a graph showing temperature information when some of the integrated circuits of the driver integrated circuit are driven.

[0108] refer to Figures 12 to 14 , the driver integrated circuit 200 may include a plurality of integrated circuits. In addition, the temperature information TI may include first temperature information TI1, second temperature information TI2, and third temperature information TI3.

[0109] When one integrated circuit is driven without driving other integrated circuits, the influence of one integrated circuit on the temperature distribution of each region in the display unit 100 can be determined. Figure 12, the first temperature information TI1 related to the temperature distribution of each region in the display unit 100 in the case of driving only one integrated circuit is shown. The first temperature information TI1 related to the case of driving one integrated circuit can be stored in the storage medium 300. For example, the temperature increment value IV_5_8 of the region located in the fifth row and the eighth column and the relative percentage value of the temperature increment value of each region in the display unit 100 according to the value can be stored in the storage medium 300.

[0110] When another integrated circuit other than the one integrated circuit is driven without driving the other integrated circuits, the influence of the other integrated circuit on the temperature distribution of each region in the display unit 100 can be determined. Figure 13 , which is related to the temperature distribution of each region in the display unit 100 when only another integrated circuit is driven, is shown in FIG. The second temperature information TI2 related to the case of driving another integrated circuit can be stored in the storage medium 300. For example, the temperature increment value IV_10_3 of the region located in the tenth row and the third column and the relative percentage value of the temperature increment value of each region in the display unit 100 according to the value can be stored in the storage medium 300.

[0111] When another integrated circuit other than the one integrated circuit and the another integrated circuit is driven without driving other integrated circuits, the influence of the another integrated circuit on the temperature distribution of each area in the display unit 100 can be determined. Figure 14 , which is related to the temperature distribution of each region in the display unit 100 when only another integrated circuit is driven, is shown in FIG. The third temperature information TI3 related to the case of driving another integrated circuit can be stored in the storage medium 300. For example, the temperature increment value IV_10_2 of the region located in the tenth row and the second column and the relative percentage value of the temperature increment value of each region in the display unit 100 according to the value can be stored in the storage medium 300.

[0112] The process described above can be repeated for other integrated circuits.

[0113] Figure 15 is a flowchart illustrating a method of predicting a degradation rate of each region in a display unit after product shipment using temperature information stored in a storage medium before product shipment.

[0114] When the driver integrated circuit 200 is driven after product shipment, the driver integrated circuit 200 may perform adding of the temperature information TI about the driven integrated circuit among the plurality of integrated circuits (step S1310). Figure 16 Describe the process of adding temperature information TI.

[0115] The driver integrated circuit 200 may correct the temperature increment value of each region in the display unit 100 added using the temperature information TI using the other information OI (step S1320). For example, the driver integrated circuit 200 may correct the temperature increment value added using the temperature information TI using the heat generation information of the display unit 100 according to the driving frequency.

[0116] The driver integrated circuit 200 may perform generating a temperature map by adding the ambient temperature value to the corrected temperature increment value of each region in the display unit 100 (step S1330 ).

[0117] The driver integrated circuit 200 can predict the degree of degradation (or degradation rate) of each region in the display unit 100 based on the generated temperature map (step S1340). For example, the driver integrated circuit 200 can identify a region whose temperature is relatively higher than another region among the regions of the display unit 100 using the generated temperature map. In addition, the driver integrated circuit 200 can predict that the degradation rate is faster in the region whose temperature is relatively higher than another region among the regions of the display unit 100.

[0118] Figure 16 It shows Figure 15 FIG. 130 is a diagram of step S1310.

[0119] refer to Figure 15 and Figure 16 In step S1310 , the driver integrated circuit 200 may add the temperature information TI of the driven integrated circuit among the plurality of integrated circuits.

[0120] For example, when driving the driver integrated circuit 200, only some of the plurality of integrated circuits may be driven. In addition, the first temperature information TI1 and the second temperature information TI2 (refer to Figure 12 and Figure 13 ) can be temperature information TI related to some of the integrated circuits.

[0121] The first temperature information TI1 and the second temperature information TI2 for each integrated circuit may be stored in the storage medium 300. For example, the first temperature information TI1 may be temperature information when driving one integrated circuit, and the second temperature information TI2 may be temperature information when driving another integrated circuit.

[0122] The first temperature information TI1 may include a temperature increment value IV_5_8 of the region located in the fifth row and eighth column as the maximum temperature increment value and a relative percentage value of the temperature increment value of each region in the display unit 100 according to the value. Hereinafter, the present disclosure will be described assuming that the maximum temperature increment value included in the first temperature information TI1 is 16° C.

[0123] The second temperature information TI2 may include a temperature increment value IV_10_3 of a region located at the tenth row and the third column as the maximum temperature increment value and a relative percentage value of the temperature increment value of each region in the display unit 100 according to the value. Hereinafter, the present disclosure will be described assuming that the maximum temperature increment value included in the second temperature information TI2 is 14° C.

[0124] The driver integrated circuit 200 may retrieve the first temperature information TI1 and the second temperature information TI2 from the storage medium 300. In addition, the driver integrated circuit 200 may add a temperature increment value for each region in the display unit 100. A specific adding method is as follows.

[0125] For example, to calculate the temperature increment value for the area located in the fifth row and eighth column, in the first temperature information TI1, the temperature increment value for the area located in the fifth row and eighth column is calculated to be 16°C based on the maximum temperature increment value and the relative percentage value of the temperature increment value of each area according to the maximum temperature increment value. In the second temperature information TI2, the temperature increment value for the area located in the fifth row and eighth column is calculated to be 7°C based on the maximum temperature increment value and the relative percentage value of the temperature increment value of each area according to the maximum temperature increment value. Furthermore, by adding the calculated 16°C and 7°C, the temperature increment value for the area located in the fifth row and eighth column can be 23°C.

[0126] For example, to calculate the temperature increment value for the region located in the second row and eighth column, in the first temperature information TI1, the temperature increment value for the region located in the second row and eighth column is calculated to be 4°C based on the maximum temperature increment value and the relative percentage value of the temperature increment value for each region according to the maximum temperature increment value. In the second temperature information TI2, the temperature increment value for the region located in the second row and eighth column is calculated to be 0°C based on the maximum temperature increment value and the relative percentage value of the temperature increment value for each region according to the maximum temperature increment value. Furthermore, by adding the calculated 4°C and 0°C, the temperature increment value for the region located in the second row and eighth column can be 4°C.

[0127] In this way, the temperature increment value when only some of the plurality of integrated circuits are driven can be calculated for the remaining area.

[0128] Figure 17is a block diagram illustrating an electronic device according to an embodiment of the present disclosure, and Figure 18 It shows Figure 17 FIG. 4 is a diagram of an example in which the electronic device is implemented as a smart phone.

[0129] refer to Figure 17 and Figure 18 , the electronic device 1000 may include a processor 1010, a memory device 1020, a storage device 1030, an input / output device (I / O device) 1040, a power supply 1050, and a display device 1060. The display device 1060 may be Figure 1 In addition, the electronic device 1000 may further include a plurality of ports capable of communicating with a video card, a sound card, a memory card, a USB device, etc. or communicating with other systems. In an embodiment, as Figure 18 As shown in FIG, the electronic device 1000 may be implemented as a smartphone. However, this is exemplary, and the electronic device 1000 is not limited thereto. For example, the electronic device 1000 may be implemented as a mobile phone, a video phone, a smart board, a smart watch, a tablet PC, a car navigation device, a computer monitor, a notebook computer, a head-mounted display device, etc.

[0130] The processor 1010 may perform specific calculations or tasks. Depending on the embodiment, the processor 1010 may be a microprocessor, a central processing unit, an application processor, etc. The processor 1010 may be connected to other components via an address bus, a control bus, a data bus, etc. Depending on the embodiment, the processor 1010 may also be connected to an expansion bus such as a peripheral component interconnect (PCI) bus.

[0131] The memory device 1020 may store data required for the operation of the electronic device 1000. For example, the memory device 1020 may include a non-volatile memory device (such as an erasable programmable read-only memory (EPROM) device, an electrically erasable programmable read-only memory (EEPROM) device, a flash memory device, a phase change random access memory (PRAM) device, a resistive random access memory (RRAM) device, a nano-floating gate memory (NFGM) device, a polymer random access memory (PoRAM) device, a magnetic random access memory (MRAM), and a ferroelectric random access memory (FRAM) device), a volatile memory device (such as a dynamic random access memory (DRAM) device, a static random access memory (SRAM) device, and a mobile DRAM device), etc.

[0132] The storage device 1030 may include a solid state drive (SSD), a hard disk drive (HDD), a CD-ROM, or the like.

[0133] The input / output device 1040 may include input devices such as a keyboard, keys, a touch pad, a touch screen, and a mouse, and output devices such as a speaker and a printer. According to an embodiment, the display device 1060 may be included in the input / output device 1040.

[0134] The power supply 1050 may supply power required for the operation of the electronic device 1000. For example, the power supply 1050 may be a power management integrated circuit (PMIC).

[0135] The display device 1060 can display an image corresponding to the visual information of the electronic device 1000. The display device 1060 can be an organic light-emitting display device or a quantum dot light-emitting display device, but is not limited thereto. The display device 1060 can be connected to other components via a bus or other communication link.

[0136] Although specific embodiments and application examples are described herein, other embodiments and variations can be derived from the above description. Therefore, the spirit of the present disclosure is not limited to these embodiments, but extends to the scope of the claims, various obvious modifications and equivalents.

Claims

1. A display device comprising: a display unit comprising a plurality of regions; a driver integrated circuit comprising a plurality of integrated circuits for driving the display unit; as well as a storage medium configured to store temperature information of the display unit, Each of the temperature information includes data of a temperature increment value of each area in the display unit when the driver integrated circuit is driven.

2. The display device according to claim 1, wherein The data of the temperature increment value of each area in the display unit is a percentage value.

3. The display device according to claim 2, wherein: Each of the percentage values ​​is a value obtained by multiplying the temperature increment value of one of the plurality of regions by 100% and dividing the result by a maximum temperature increment value among the temperature increment values ​​of the plurality of regions.

4. The display device according to claim 3, wherein Each of the temperature information includes the maximum temperature increment value.

5. The display device according to claim 1, wherein The storage medium also stores other information including heat generation information of the display unit according to a driving frequency of the driver integrated circuit and heat generation information of the display unit according to an amount of a data signal transmitted from the driver integrated circuit to the display unit. The display device according to claim 5 , wherein: The driver integrated circuit retrieves the temperature information and the other information from the storage medium, generates a temperature map using the temperature information and the other information, and predicts a degree of degradation of each region in the display unit based on the temperature map.

7. The display device according to claim 1, wherein Each of the plurality of regions has the same area.

8. The display device according to claim 1, wherein Each of the temperature increment values ​​is a value obtained by subtracting a temperature measurement value before driving the driver integrated circuit from a temperature measurement value after driving the driver integrated circuit.

9. The display device according to claim 8, wherein The temperature measurement values ​​are values ​​measured using a thermal imaging camera.

10. The display device according to claim 1, wherein The plurality of integrated circuits include a first integrated circuit and a second integrated circuit, The temperature information includes first temperature information and second temperature information, The first temperature information is generated in a state where the second integrated circuit is not driven and the first integrated circuit is driven, and The second temperature information is generated in a state where the first integrated circuit is not driven and the second integrated circuit is driven.

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