Scheduling method of semiconductor process equipment and semiconductor process equipment

Abstract

The invention discloses a scheduling method of semiconductor process equipment and the semiconductor process equipment. The method comprises the following steps: according to idle time of a target chamber before the target wafer enters the target chamber to execute a process and a preset idle time threshold value, judging whether pretreatment operation corresponding to the process needs to be executed on the target chamber or not before the target wafer enters the target chamber; if it is determined that the pre-processing operation needs to be executed on the target chamber, determining that the target chamber needs to be idle continuously before the pre-processing operation is executed on the target chamber; and when it is monitored that the wafer to enter the target chamber is the target wafer and the continuous idle time of the target chamber reaches the time that the target chamber needs to be continuously idle, performing preprocessing operation on the target chamber. The corresponding operation executed by the preprocessing operation can be flexibly adjusted according to different processes. And the process requirement that pretreatment is just finished before the wafer enters the chamber can be met. Only one-time preprocessing operation needs to be executed, and resource waste is avoided.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and in particular relates to a scheduling method for semiconductor process equipment and semiconductor process equipment. Background Art

[0002] Due to the complexity and precision of semiconductor processes, various chambers in semiconductor process equipment have extremely high requirements for temperature, gas concentration and other conditions during use. However, during the use of semiconductor process equipment, there are often multiple chamber processes in series, and the process time corresponding to each chamber is inconsistent. As a result, chambers with short process times may be idle for a certain period of time. Once a chamber is idle, the chamber's temperature, gas concentration and other conditions may change. At this time, if the wafer enters the chamber directly to perform the process, it will affect the process effect. Therefore, it is necessary to precondition the chamber according to predetermined conditions before the wafer enters the chamber.

[0003] In the related art, when the chamber is performing corresponding process processing on the wafer, it is monitored whether the chamber is in an idle state, and when it is detected that the chamber is in an idle state, a pre-processing operation is performed on the chamber at a preset interval. Specifically: before the current wafer enters the chamber, it is detected that the chamber is in an idle state. If the idle time of the chamber is less than the preset time, Figure 1 As shown, the conditions for performing the pre-processing operation are not met, and no pre-processing operation is required. The current wafer is directly placed in the chamber; if the idle time of the chamber is equal to or greater than the preset time, such as Figure 2 As shown, a pre-treatment operation is performed on the chamber at every preset time interval, for example Figure 2 As shown in , when the idle time (Idle 1) reaches the preset time, a pretreatment operation is performed, and monitoring continues. When the idle time reaches the preset time again, another pretreatment operation is performed, and this continues until the wafer is placed. The idle time after the last pretreatment operation before placement (Idle 2) is less than the preset time. In this scheme, the corresponding operations performed by the pretreatment operation are fixed. This solution cannot flexibly adjust to different processes, such as continuously executing different process recipes in the same chamber or requiring different pretreatment operations for different processes. After the pretreatment operation, the chamber may have idle time that does not exceed the preset time. This cannot meet the requirements of processes that require pretreatment to be completed just before the wafer enters the chamber. If the chamber idle time is long, the pretreatment operation may need to be performed multiple times, resulting in a waste of resources. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a scheduling method for semiconductor process equipment and semiconductor process equipment to solve the problem that the corresponding operations performed by the pre-processing operations in the related art are fixed and cannot be flexibly adjusted according to different processes. For processes that need to ensure that the pre-processing is completed just before the wafer enters the chamber, it cannot meet the requirements and may need to perform the pre-processing operation multiple times, resulting in a waste of resources.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions: In a first aspect, an embodiment of the present application provides a scheduling method for semiconductor process equipment, comprising: judging whether it is necessary to perform a pre-processing operation corresponding to the process on the target chamber before the target wafer enters the target chamber to perform a process based on the idle time of the target chamber before the target wafer enters the target chamber and a preset idle time threshold; if it is determined that the pre-processing operation needs to be performed on the target chamber before the target wafer enters the target chamber, determining the continuous idle time for the target chamber before the pre-processing operation is performed on the target chamber; when it is monitored that the wafer to be entering the target chamber is the target wafer, and the continuous idle time of the target chamber reaches the continuous idle time for the target chamber to be idle, performing the pre-processing operation on the target chamber.

[0006] In the second aspect, an embodiment of the present application provides a semiconductor process equipment, comprising: a controller and multiple chambers, wherein the controller is arranged in the upper computer and / or the lower computer of the semiconductor process equipment, and the controller includes at least one processor and at least one memory, wherein the memory stores a computer program, and when the computer program is executed by the processor, the steps of the scheduling method of the semiconductor process equipment as described in the embodiment of the first aspect of the present application are implemented.

[0007] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects: In the embodiment of the present application, based on the idle time of the target chamber before the target wafer enters the target chamber to perform the process and the preset idle time threshold, it is determined whether the target wafer needs to perform a pre-processing operation corresponding to the process on the target chamber before entering the target chamber; if it is determined that the target wafer needs to perform a pre-processing operation on the target chamber before entering the target chamber, the target chamber is determined to have a continuous idle time before the pre-processing operation is performed on the target chamber; when it is detected that the wafer to be entered into the target chamber is the target wafer, and the continuous idle time of the target chamber reaches the time that the target chamber needs to be continuously idle, the pre-processing operation is performed on the target chamber. In the embodiment of the present application, different processes correspond to different pre-processing operations, so that the corresponding operations performed by the pre-processing operation can be flexibly adjusted according to different processes. When the continuous idle time of the target chamber reaches the time that the target chamber needs to be continuously idle, the pre-processing operation is performed on the target chamber, which can meet the requirements of the process that just ends the pre-processing before the wafer enters the chamber to maintain the consistency of the chamber environment. When the chamber idle time is long and the pre-processing operation needs to be performed, only one pre-processing operation needs to be performed, thereby avoiding waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 A schematic diagram of control logic of a semiconductor process equipment in the related art; Figure 2 A schematic diagram of another semiconductor process equipment control logic in the related art; Figure 3 A flowchart of a scheduling method for semiconductor process equipment provided in accordance with an embodiment of the present application; Figure 4 A schematic diagram of a scenario of a scheduling method for semiconductor process equipment provided by one embodiment of the present application; Figure 5 A schematic diagram of a processing path 1 provided in accordance with an embodiment of the present application; Figure 6 A schematic diagram of a second processing path provided in accordance with an embodiment of the present application; Figure 7 A schematic diagram of semiconductor process equipment control logic provided for one embodiment of the present application; Figure 8 A flowchart of a scheduling method for semiconductor process equipment provided in another embodiment of the present application; Figure 9 A flowchart of a scheduling method for semiconductor process equipment provided in another embodiment of the present application; Figure 10 A flowchart of a scheduling method for semiconductor process equipment is provided as another embodiment of the present application. DETAILED DESCRIPTION

[0009] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0010] The terms "first", "second", etc. in this application are used to distinguish similar objects and are not used to describe a specific order or precedence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described here. In addition, "and / or" in this application represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship. It should be noted that the data involved in this application are all obtained under the premise of obtaining user authorization.

[0011] The following describes in detail the technical solutions provided by various embodiments of the present application in conjunction with the accompanying drawings.

[0012] Figure 3 A flowchart of a method for scheduling semiconductor process equipment provided by one embodiment of the present application is shown below. Figure 3 As shown, the scheduling method for semiconductor process equipment in an embodiment of the present application may specifically include the following steps: S301, judging whether a pre-processing operation corresponding to the process needs to be performed on the target chamber before the target wafer enters the target chamber according to the idle time of the target chamber before the target wafer enters the target chamber to perform the process and a preset idle time threshold.

[0013] In the embodiment of the present application, the execution subject of the scheduling method of the semiconductor process equipment in the embodiment of the present application is a controller, which can be set in the upper computer and / or the lower computer of the semiconductor process equipment.

[0014] Figure 4 This is a schematic diagram of a scenario of a scheduling method for semiconductor process equipment according to an embodiment of the present application. Figure 4As shown, the semiconductor process equipment includes three loading ports (Load Port, LP): LPA, LPB and LPC, an atmospheric transfer robot (Atmospheric Transfer Robot, ATR), an aligner (Aligner, AL), two load locks (Load Lock, LL): LLA and LLB, a vacuum robot (Vacuum Transfer Robot, VTR) and four chambers (Process Module, PM): PMA, PMB, PMC and PMD. Among them, PMA and PMB are chambers of the same type, and PMC and PMD are chambers of the same type. PMA and PMB are sensitive to temperature, and PMC and PMD are sensitive to the gas concentration in the chamber. There are two main wafer processing paths: Figure 5 The processing path shown is Figure 6 The second processing path is shown.

[0015] definition: The list of all wafers is as follows: ; The stations in the wafer processing path are denoted as Step , all the sites to be passed in the processing path: LP, ATR, AL, ATR, ..., recorded as: ; For wafers , record the list of all chambers it needs to enter as: ; For each chamber, the list of all wafers that need to enter the chamber is recorded as: ; :Indicates wafer The number in the list of all wafers, assuming the wafer It is necessary to enter the chamber No. Wafers are recorded as , then on the wafer Need to enter the chamber before The wafer is recorded as .

[0016] Get the target wafer Entering the target chamber The target chamber before the process is performed Idle time, and with the pre-set idle time threshold Compare and determine the target wafer based on the comparison results Enter the target chamber Is it necessary to Execute pre-processing operations corresponding to the process. Among them, the idle time threshold It can be preset by the user according to the process characteristics.

[0017] If the target wafer Entering the target chamber Before, the target chamber The idle time is less than the idle time threshold , then the target wafer is determined Enter the target chamber No need to target the chamber Perform preprocessing operations.

[0018] If the target wafer Entering the target chamber Before, the target chamber The idle time is equal to or greater than the idle time threshold , then the target wafer is determined Enter the target chamber The target chamber needs to be Perform preprocessing operations.

[0019] S302 : If it is determined that a pre-processing operation needs to be performed on the target chamber before the target wafer enters the target chamber, determine the time the target chamber needs to remain idle before the pre-processing operation is performed on the target chamber.

[0020] In the embodiment of the present application, if the target wafer is determined to be Enter the target chamber The target chamber needs to be To perform pre-processing operations, the target wafer Enter the target chamber Before, choose the right time to execute the target wafer In the target chamber The process-bound pre-processing operation performed is to determine the target chamber The target chamber before performing pre-treatment operations Continuous idle time ,correspond Figure 7 The idle time of 1 in the process is to ensure that after the pre-processing operation is completed, the current wafer is the target wafer. It can be sent to the current chamber, the target chamber .

[0021] S303 , when it is detected that the wafer to be entered into the target chamber is the target wafer and the continuous idle time of the target chamber reaches the required continuous idle time of the target chamber, a pre-processing operation is performed on the target chamber.

[0022] In the embodiment of the present application, when it is detected that the target chamber is to be entered (ie, the next batch is to be entered), The wafer is the target wafer , that is, when the target chamber is detected Existence in You need to enter the target chamber before Wafer Or the target chamber is idle, the next batch will enter the target chamber The wafer is the target wafer . And the target chamber Current idle time Reach the target chamber Continuous idle time When the target chamber Perform preprocessing operations.

[0023] It should be noted that, in this application, a batch of wafers refers to a group of wafers that undergo the same process steps simultaneously. A batch of wafers can be a single wafer or multiple wafers, without limitation. The specific process depends on the semiconductor equipment. For example, some semiconductor equipment can only process a single wafer at each station, while others can process multiple wafers at each station. This application uses a batch of wafers consisting of only one wafer as an example for illustration.

[0024] Furthermore, if the target wafer Enter the target chamber No need to target the chamber Perform pre-processing operation, then when it is detected that the target chamber is about to enter The wafer is the target wafer When the target wafer Enter the target chamber No pre-processing operation is performed on the target chamber before the corresponding logic diagram is the same as Figure 1 shown.

[0025] Before step S301 of "determining whether a pre-processing operation corresponding to the process needs to be performed on the target chamber before the target wafer enters the target chamber based on the idle time of the target chamber before the target wafer enters the target chamber to perform the process and a preset idle time threshold", Figure 8 As shown, the scheduling method of the semiconductor process equipment of the embodiment of the present application may also include the following steps: determining the target wafer Entering the target chamber Front target chamber Free time steps: S801, calculate the first arrival time of the target wafer at the previous transfer station of the target chamber and the first removal time of the last batch of wafers that entered the target chamber before the target wafer are taken out of the target chamber, and calculate the first time difference between the first arrival time and the first removal time.

[0026] In the embodiment of the present application, since the first time difference between two times (the time here is a specific time point or moment) is calculated, it can be converted into the first time difference between the time required from the current moment to the two time points. Transfer to target chamber The last transfer site The first arrival time, as well as the target wafer Before entering the target chamber The last batch of wafers From the target chamber The first time difference between the first arrival time and the first take-out time can be converted into the calculation of the target wafer. From current location Transfer to target chamber The last transfer site Total time required , and on the target wafer Before entering the target chamber The last batch of wafers From the current state to the target chamber Time required to withdraw , and calculate and The first time difference between .

[0027] Among them, such as Figure 9 As shown, the target wafer Transfer to target chamber The last transfer site The first arrival time can be calculated by the following steps: S901 , determining a first time when a target wafer is transferred to a previous transfer station of a previous chamber of the target chamber and the previous chamber of the target chamber meets wafer placement conditions.

[0028] S902, calculate the first transmission time required for the target wafer to be transferred from the previous transmission station of the previous chamber of the target chamber to the previous chamber of the target chamber, the first process duration of the target wafer in the previous chamber of the target chamber, and the second transmission time required for the target wafer to be transferred from the previous chamber of the target chamber to the previous transmission station of the target chamber, and calculate the sum of the first time, the first transmission time, the first process duration and the second transmission time to obtain the first arrival time of the target wafer to the previous transmission station of the target chamber.

[0029] In the embodiment of the present application, if the target wafer Current Location In the target chamber Site After that, the target wafer Has passed the target chamber Site , or target wafer Current Location The target chamber Site , then the target wafer From current location Transfer to target chamber The last transfer site Total time required .

[0030] If the target wafer Current Location In the target chamber Site Before, the target wafer Has not yet reached the target chamber Site , and if the target chamber The target wafer The first of all chambers to be entered is , then the target wafer From current location Transfer to target chamber The last transfer site Total time required Target wafer From current location To target chamber The last transfer site The sum of all transmission times is .

[0031] If the target wafer Current Location In the target chamber Site Before, the target wafer Has not yet reached the target chamber Site , and if the target chamber Not the target wafer The first of all chambers to be entered is , then the target wafer From current location Transfer to target chamber The last transfer site Total time required Target wafer From current location Transfer to target chamber The previous chamber The last transfer site And the target chamber The previous chamber Time required to meet the conditions for film screening , plus the target wafer From the target chamber The previous chamber The last transfer site Transfer to target chamber The previous chamber Required first transmission time , plus the target wafer In the target chamber The previous chamber First process duration within , plus the target wafer From the target chamber The previous chamber Transfer to target chamber The last transfer site Second transmission time required ,Right now:

[0032] It should be noted here that, , such as the target wafer mentioned above In the target chamber The previous chamber within , represents the process time of chamber C. If chamber C is in process, it represents the remaining time of the process. If chamber C has not started the process, it represents the total process time.

[0033] Among them, such as Figure 10 As shown above, the target wafer Before entering the target chamber The last batch of wafers From the target chamber The first removal time can be calculated by the following steps: S1001, determining a second time when the last batch of wafers entering the target chamber before the target wafer is transferred to the previous transfer station of the target chamber and the target chamber is ready for wafer placement.

[0034] S1002, calculate the third transfer time required for the last batch of wafers entering the target chamber before the target wafer to be transferred from the previous transfer station of the target chamber to the target chamber, the second process time of the last batch of wafers entering the target chamber before the target wafer in the target chamber, and the fourth transfer time required for the last batch of wafers entering the target chamber before the target wafer to be transferred from the target chamber to the next transfer station of the target chamber, and calculate the sum of the second time, the third transfer time, the second process time and the fourth transmission time to obtain the first removal time for the last batch of wafers entering the target chamber before the target wafer to be taken out from the target chamber.

[0035] In the embodiment of the present application, the target wafer The last batch of wafers entering the target chamber From the current state to the target chamber Time required to withdraw For: On the target wafer The last batch of wafers entering the target chamber From current location Transfer to the target chamber The last transfer site And the target chamber Time required to meet the conditions for film screening , plus will be on the target wafer The last batch of wafers entering the target chamber From the target chamber The last transfer site Transfer to target chamber The third transmission time required , plus the target wafer The last batch of wafers entering the target chamber In the target chamber Second process duration within , plus the target wafer The last batch of wafers entering the target chamber From the target chamber Transfer to target chamber The next transmission site The fourth transmission time required ,Right now:

[0036] It should be noted here that when the semiconductor process equipment is idle for a period of time and the task is started, the target chamber No wafer has entered the target chamber yet. Has been idle for a while , in order to unify the calculation logic, the target chamber The time from the current state to the idle state is recorded as .

[0037] It should be noted here that if the target wafer To enter the target chamber The first wafer of k =1, then use ,Evaluate If the target chamber The idle time exceeds the corresponding idle time threshold ,Right now or target wafer Transfer to target chamber Time plus target chamber The idle time exceeds the corresponding idle time threshold ,Right now ,but , target chamber Preprocessing operations are required.

[0038] Among them, the above-mentioned step S901 "determine the first time when the target wafer is transferred to the previous transfer station of the previous chamber of the target chamber, and the previous chamber of the target chamber has the conditions for placing the wafer", may specifically include the following steps: calculate the second arrival time of the target wafer at the previous transfer station of the previous chamber of the target chamber, and the first placement time when the previous chamber of the target chamber has the conditions for placing the target wafer, and determine the maximum value of the second arrival time and the first placement time as the first time when the target wafer is transferred to the previous transfer station of the previous chamber of the target chamber and the previous chamber of the target chamber has the conditions for placing the wafer.

[0039] The first wafer placement time when the previous chamber of the target chamber meets the wafer placement conditions for the target wafer can be calculated by the following steps: If the target wafer Entering the target chamber The previous chamber No need to target the chamber The previous chamber Perform pre-processing operations on the target wafer The last batch of wafers entering the target chamber From the target chamber The previous chamber Remove the rear chamber The conditions for placing the wafer are met, so the target wafer will be Before entering the target chamber The previous chamber The last batch of wafers From the target chamber The previous chamber The second removal time is determined as the target chamber The previous chamber Target wafer available The first film loading time when the film loading condition is met. At this time, the target chamber The previous chamber Target wafer available The time required for the wafer placement condition is: Before entering the target chamber The previous chamber The last batch of wafers From current state to target chamber The previous chamber Time required to withdraw .

[0040] If the target wafer Entering the target chamber The previous chamber The target chamber needs to be The previous chamber Perform pre-processing operations, then calculate the target wafer Entering the target chamber The previous chamber Front and target chamber The previous chamber Target chamber before performing pre-treatment operations The previous chamber The continuous idle time required to be idle and processing time of preprocessing operations The second sum of the second removal time, the continuous idle time and the processing time is determined as the target chamber The previous chamber Target wafer available The first film loading time when the film loading condition is met. At this time, the target chamber The previous chamber Target wafer available The time required for the film placement conditions is: + + .

[0041] Combining the above two situations, the target chamber The previous chamber Target wafer available The time required for the film placement conditions is:

[0042] Among them, Target wafer Enter the chamber The flag indicating whether preprocessing is required before = 0, =0 means no preprocessing is required. =0 means that preprocessing operations need to be performed. The initial default is 0.

[0043] Therefore, the target wafer Transfer to target chamber The previous chamber The last transfer site , and the target chamber The previous chamber Time required to meet the target wafer placement conditions for:

[0044] Correspondingly, the above It can also be obtained similarly, which will not be described here.

[0045] S802 : Determine the first time difference as the idle time of the target chamber before the target wafer enters the target chamber.

[0046] In the embodiment of the present application, the first time difference Identify the target wafer Entering the target chamber Front target chamber free time.

[0047] If the first time difference Exceeding the target chamber Idle time threshold , represents the target chamber After the previous batch of wafers of the current wafer is taken out, it is necessary to wait for the current wafer (i.e. the target wafer) ) is transferred to the target chamber The last transfer site More than , i.e. the target chamber There will be more than of free time, i.e. , you need to perform preprocessing operations.

[0048] Furthermore, the above step S302 "determine the target chamber Target chamber before performing pre-treatment operations Continuous idle time ", which may specifically include the following steps: calculating a second time difference between an idle time of the target chamber before the target wafer enters the target chamber and a processing time of the pre-processing operation; and determining a continuous idle time for the target chamber based on an idle time threshold and the second time difference.

[0049] In the embodiment of the present application, considering the conditions of a single chamber, In order to complete the pre-processing operation, the target wafer You can enter the target chamber , target chamber The idle time required before executing pre-processing operations. In order to complete the pre-processing operation, the target wafer You can enter the target chamber , and the target wafer From the target chamber After taking it out, you can quickly enter the next chamber, the target chamber The amount of time that idle time is required before preprocessing operations are performed. The initial value is .

[0050] When considering the conditions of a single chamber, the above step of "determining the time for which the target chamber needs to be idle continuously based on the idle time threshold and the second time difference" may include: determining the maximum value of the idle time threshold and the second time difference as the time for which the target chamber needs to be idle continuously.

[0051] When considering multiple chamber processes connected in series, the above step of "determining the time for which the target chamber needs to be idle continuously based on the idle time threshold and the second time difference" may include: calculating the third time when the last batch of wafers in each chamber after entering the target chamber before the target wafer are taken out of the chamber, and the third arrival time of the target wafer at the previous transfer station of the chamber, and calculating the third time difference between the third removal time and the third arrival time; calculating the maximum value of at least one third time difference and zero and the first sum of the second time difference; and determining the maximum value of the idle time threshold and the first sum as the time for which the target chamber needs to be idle continuously.

[0052] Specifically, when considering the conditions of a single chamber, First, the idle time threshold must be equal to or greater than the idle time threshold. , and secondly, the target wafer should be Already transferred to the target chamber The last transfer site Ready to place in target chamber ,Right now

[0053] Therefore, at this time .

[0054] When considering multiple chamber processes in series, in order to achieve the target wafer From the target chamber After taking out, it can quickly enter the next chamber. The chamber conditions of the subsequent process also need to be considered, such as: Figure 5 The processing path 1 shown is taken as an example, which includes two processes, process 1 and process 2.

[0055] When the process time of process 1 is long, assuming that the idle time of the chamber of process 2 exceeds its set , pre-treatment operation needs to be performed, then the chamber of process 2 needs to ensure that the wafer can be transferred to the previous transfer station of the chamber of process 2 when the pre-treatment operation is completed. After the pre-treatment operation is completed, the wafer can be placed in the chamber of process 2.

[0056] When the process time of process 1 is short, assuming that the idle time of the chamber of process 1 exceeds its set , it is necessary to perform pre-processing operations. The chamber of process 1 must first ensure that the wafer can be transferred to the previous transfer station of the chamber of process 1 when it completes the pre-processing operations. Secondly, assuming that the wafer is immediately placed in the chamber of process 1 and the process is completed after the pre-processing operations are completed according to the above conditions, and then transferred from the chamber of process 1 to the previous transfer station of the chamber of process 2, the chamber of process 2 may still be in the process state at this time. There will be a waiting time for the wafer to be transferred from process 1 to process 2. In order to reduce the waiting time between process 1 and process 2 (corresponding to Figure 7 The timing synchronization of the pre-treatment operation performed by the chamber of process 1 needs to take into account the situation of the chamber of process 2.

[0057] As mentioned above, when there are multiple processes in series, it is necessary to consider the conditions of all subsequent chambers at the same time. , assuming that only the target wafer is Can be transferred to the target chamber The last transfer site , considering the target wafer under this condition Transfer to subsequent chamber The time of the last transmission station , with the chamber Target wafer The last batch of wafers before From the chamber Time of removal In comparison, if Less than , then it means the target wafer Transfer to target chamber The last transfer site Then you need to wait for the target chamber The previous batch of wafers The process is finished and the target wafer needs to be postponed In the target chamber The time to perform preprocessing operations, i.e.

[0058] Combining the above two situations (considering the conditions of a single chamber and considering the process of multiple chambers in series), the target chamber Target chamber before performing pre-treatment operations Continuous idle time It can be calculated according to the following formula:

[0059] It should be noted here that, 、 、 、 The calculation needs to be continuously updated during the operation of the machine.

[0060] In summary, the scheduling method of the semiconductor process equipment of the embodiment of the present application determines whether the target wafer needs to perform a pre-processing operation corresponding to the process on the target chamber before entering the target chamber according to the idle time of the target chamber before the target wafer enters the target chamber to perform the process and the preset idle time threshold; if it is determined that the target wafer needs to perform a pre-processing operation on the target chamber before entering the target chamber, then the target chamber is determined to be idle for a continuous time before the pre-processing operation is performed on the target chamber; when it is detected that the wafer to be entered into the target chamber is the target wafer, and the continuous idle time of the target chamber reaches the time that the target chamber needs to be idle continuously, the pre-processing operation is performed on the target chamber. In the embodiment of the present application, different processes correspond to different pre-processing operations, so that the corresponding operations performed by the pre-processing operation can be flexibly adjusted according to different processes. When the continuous idle time of the target chamber reaches the time that the target chamber needs to be idle continuously, the pre-processing operation is performed on the target chamber, which can meet the requirements of the process that just ends the pre-processing before the wafer enters the chamber to maintain the consistency of the chamber environment. When the chamber idle time is long and the pre-processing operation needs to be performed, only one pre-processing operation needs to be performed, thereby avoiding waste of resources. When calculating the idle time of the target chamber before performing the pre-processing operation on the target chamber to determine the execution timing of the pre-processing operation, the subsequent chamber conditions are taken into account, thereby reducing the waiting time of the wafer between different processes.

[0061] The present application also provides a semiconductor process equipment. Figure 4 As shown, the semiconductor process equipment includes: a controller ( Figure 4 not shown) and multiple chambers ( Figure 4 In the figure, the four chambers PMA~PMD are used as an example, and the controller is set in the host computer and / or the slave computer of the semiconductor process equipment. The controller includes at least one processor and at least one memory. The memory stores a computer program. When the computer program is executed by the processor, the steps of the scheduling method embodiment of any of the above-mentioned semiconductor process equipment are implemented.

[0062] In the semiconductor process equipment of the embodiment of the present application, different processes correspond to different pre-processing operations, so that the corresponding operations performed by the pre-processing operations can be flexibly adjusted according to different processes. When the continuous idle time of the target chamber reaches the time the target chamber needs to be continuously idle, the pre-processing operation is performed on the target chamber, which can meet the requirements of the process that just ends the pre-processing before the wafer enters the chamber to maintain the consistency of the chamber environment. When the chamber idle time is long and the pre-processing operation needs to be performed, only one pre-processing operation needs to be performed, avoiding waste of resources. When calculating the time the target chamber needs to be continuously idle before performing the pre-processing operation on the target chamber to determine the execution time of the pre-processing operation, the subsequent chamber conditions are taken into account, reducing the waiting time of the wafer between different processes.

[0063] An embodiment of the present application also proposes a readable storage medium, on which one or more computer programs are stored. The one or more computer programs include instructions. When the program or instructions are executed by a processor in a semiconductor process equipment including multiple application programs, the processor in the semiconductor process equipment can execute the various processes of the above-mentioned scheduling method embodiment of the semiconductor process equipment, and is specifically used to execute the steps of any of the above-mentioned scheduling method embodiments of the semiconductor process equipment.

[0064] The readable storage medium of the embodiment of the present application corresponds to different pre-processing operations for different processes, so that the corresponding operations performed by the pre-processing operations can be flexibly adjusted according to different processes. When the continuous idle time of the target chamber reaches the time the target chamber needs to be continuously idle, the pre-processing operation is performed on the target chamber, which can meet the requirements of the process that just ends the pre-processing before the wafer enters the chamber to maintain the consistency of the chamber environment. When the chamber idle time is long and the pre-processing operation needs to be performed, only one pre-processing operation needs to be performed, thus avoiding waste of resources. When calculating the time the target chamber needs to be continuously idle before performing the pre-processing operation on the target chamber to determine the execution time of the pre-processing operation, the subsequent chamber conditions are taken into account, thus reducing the waiting time of the wafer between different processes.

[0065] The systems, devices, modules, or units described in the above embodiments may be implemented by computer chips or entities, or by products having certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smartphone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0066] For the convenience of description, the above devices are described as being divided into various units according to their functions. Of course, when implementing this application, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0067] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware. Furthermore, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0068] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0069] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0070] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0071] In a typical configuration, a computing device includes one or more processors (CPUs), input / output interfaces, network interfaces, and memory.

[0072] Memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. Memory is an example of a computer-readable medium.

[0073] Computer-readable media includes both permanent and non-permanent, removable and non-removable media that can be implemented using any method or technology for information storage. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change RAM (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, compact disc read-only memory (CD-ROM), digital versatile disc (DVD) or other optical storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined herein, computer-readable media does not include transitory computer-readable media such as modulated data signals and carrier waves.

[0074] It should also be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, commodity, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or includes elements inherent to such process, method, commodity, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not exclude the presence of other identical elements in the process, method, commodity, or apparatus that includes the element.

[0075] The present application may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communications network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0076] The various embodiments in this specification are described in a progressive manner. Similar parts between the various embodiments can be referred to in conjunction with each other. Each embodiment focuses on the differences between the other embodiments. In particular, the system embodiments are generally similar to the method embodiments, so the description is relatively simple. For relevant parts, refer to the description of the method embodiments.

[0077] The above are merely embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. A scheduling method for semiconductor process equipment, characterized in that: include: determining whether a pre-processing operation corresponding to the process needs to be performed on the target chamber before the target wafer enters the target chamber according to an idle time of the target chamber before the target wafer enters the target chamber to perform the process and a preset idle time threshold; If it is determined that the pre-treatment operation needs to be performed on the target chamber before the target wafer enters the target chamber, determining the time for which the target chamber needs to remain idle before the pre-treatment operation is performed on the target chamber; When it is detected that the wafer to be entered into the target chamber is the target wafer and the continuous idle time of the target chamber reaches the required continuous idle time of the target chamber, the pre-processing operation is performed on the target chamber.

2. The method according to claim 1, characterized in that The determining, based on the idle time of the target chamber before the target wafer enters the target chamber to perform the process and a preset idle time threshold, whether a pre-processing operation corresponding to the process needs to be performed on the target chamber before the target wafer enters the target chamber, includes: If the idle time of the target chamber before the target wafer enters the target chamber is less than the idle time threshold, it is determined that the pre-processing operation does not need to be performed on the target chamber before the target wafer enters the target chamber; If the idle time of the target chamber before the target wafer enters the target chamber is equal to or greater than the idle time threshold, it is determined that the pre-processing operation needs to be performed on the target chamber before the target wafer enters the target chamber.

3. The method according to claim 1, characterized in that Before determining whether a pre-processing operation corresponding to the process needs to be performed on the target chamber before the target wafer enters the target chamber for executing the process based on the idle time of the target chamber and a preset idle time threshold before the target wafer enters the target chamber, the method further includes: calculating a first arrival time of the target wafer at a previous transfer station of the target chamber and a first removal time of the last batch of wafers that entered the target chamber before the target wafer and were removed from the target chamber, and calculating a first time difference between the first arrival time and the first removal time; The first time difference is determined as an idle time of the target chamber before the target wafer enters the target chamber.

4. The method according to claim 3, characterized in that The first arrival time of the target wafer at the last transfer station of the target chamber is calculated by the following steps: Determining a first time when the target wafer is transferred to a previous transfer station of a previous chamber of the target chamber and the previous chamber of the target chamber meets wafer placement conditions; Calculating a first transfer time required for the target wafer to be transferred from a previous transfer station of a previous chamber of the target chamber to a previous chamber of the target chamber, a first process duration of the target wafer in the previous chamber of the target chamber, and a second transfer time required for the target wafer to be transferred from the previous chamber of the target chamber to the previous transfer station of the target chamber; The sum of the first time, the first transfer time, the first process duration, and the second transfer time is calculated to obtain a first arrival time of the target wafer at a previous transfer station of the target chamber.

5. The method according to claim 3, characterized in that The first removal time of the last batch of wafers that entered the target chamber before the target wafer is removed from the target chamber is calculated by the following steps: Determining a second time when the last batch of wafers that entered the target chamber before the target wafer is transferred to the previous transfer station of the target chamber and the target chamber is ready for wafer placement; Calculating a third transfer time required for the last batch of wafers entering the target chamber before the target wafer to be transferred from the previous transfer station of the target chamber to the target chamber, a second process duration of the last batch of wafers entering the target chamber before the target wafer in the target chamber, and a fourth transfer time required for the last batch of wafers entering the target chamber before the target wafer to be transferred from the target chamber to the next transfer station of the target chamber; The sum of the second time, the third transfer time, the second process duration, and the fourth transfer time is calculated to obtain a first removal time when the last batch of wafers entering the target chamber before the target wafer are removed from the target chamber.

6. The method according to claim 4, characterized in that The determining of the first time when the target wafer is transferred to the previous transfer station of the previous chamber of the target chamber and the previous chamber of the target chamber meets the wafer placement condition includes: Calculating a second arrival time of the target wafer at a previous transfer station of a chamber preceding the target chamber, and a first placement time when the chamber preceding the target chamber meets the placement conditions for the target wafer; The maximum value of the second arrival time and the first wafer placement time is determined as the first time when the target wafer is transferred to the previous transfer station of the previous chamber of the target chamber and the previous chamber of the target chamber meets the wafer placement condition.

7. The method according to claim 6, characterized in that The first wafer placement time when the previous chamber of the target chamber meets the wafer placement conditions of the target wafer is calculated by the following steps: If the pre-processing operation does not need to be performed on the previous chamber of the target chamber before the target wafer enters the previous chamber of the target chamber, the second removal time for removing the last batch of wafers from the previous chamber of the target chamber before the target wafer enters the previous chamber of the target chamber is determined as the first placement time when the previous chamber of the target chamber meets the placement condition for the target wafer; If the pre-processing operation needs to be performed on the previous chamber of the target chamber before the target wafer enters the previous chamber of the target chamber, then the continuous idle time that the previous chamber of the target chamber needs to be idle before the target wafer enters the previous chamber of the target chamber and before the previous chamber of the target chamber performs the pre-processing operation, and the processing time of the pre-processing operation are calculated, and the second sum of the second removal time, the continuous idle time and the processing time is determined as the first wafer placement time when the previous chamber of the target chamber meets the wafer placement conditions.

8. The method according to claim 1, characterized in that The determining of the idle time of the target chamber before performing the pre-processing operation on the target chamber includes: calculating a second time difference between an idle time of the target chamber before the target wafer enters the target chamber and a processing time length of the pre-processing operation; The time for which the target chamber needs to remain idle is determined according to the idle time threshold and the second time difference.

9. The method according to claim 8, characterized in that The step of determining, based on the idle time threshold and the second time difference, the time for which the target chamber needs to remain idle includes: The maximum value of the idle time threshold and the second time difference is determined as the time during which the target chamber needs to remain idle.

10. The method according to claim 8, characterized in that The step of determining, based on the idle time threshold and the second time difference, the time for which the target chamber needs to remain idle includes: Calculating a third removal time of the last batch of wafers from each chamber after the target wafer enters the target chamber before the target wafer and a third arrival time of the target wafer at the last transfer station in the chamber, and calculating a third time difference between the third removal time and the third arrival time; calculating a first sum of a maximum value of at least one of the third time difference and zero and the second time difference; The maximum value of the idle time threshold and the first sum is determined as the time during which the target chamber needs to remain idle.

11. The method according to claim 1, characterized in that Also includes: If the pretreatment operation does not need to be performed on the target chamber before the target wafer enters the target chamber, then when it is detected that the wafer to be entered into the target chamber is the target wafer, the pretreatment operation is not performed on the target chamber before the target wafer enters the target chamber.

12. A semiconductor process equipment, characterized in that: include: A controller and multiple chambers, wherein the controller is arranged in the upper computer and / or the lower computer of the semiconductor process equipment, the controller includes at least one processor and at least one memory, the memory stores a computer program, and when the computer program is executed by the processor, the steps of the method according to any one of claims 1 to 11 are implemented.

Images