Chip solidification packaging apparatus and method

Abstract

The application relates to the field of chip packaging, in particular to a chip solidification packaging device and a packaging method, which comprise a baking oven, the inside of the baking oven is divided into multiple layers of solidification units from top to bottom, each solidification unit comprises a rotating disc which is rotationally connected in the baking oven, multiple material grooves are formed in the outer ring of each rotating disc, and a material disc is arranged in each material groove; the designed chip solidification packaging device can continuously add chips to be baked from the feeding port position, continuously take down the baked chips from the discharging port position, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips can be continuously baked and processed, the feeding, baking and discharging three links are executed in a pipeline mode, the packaging material on the chips

Description

TECHNICAL FIELD

[0001] The present application relates to the field of chip packaging, and in particular to a chip solidification packaging device and a packaging method. BACKGROUND

[0002] Chip solidification packaging is used to heat and solidify the packaging material covering the chip by injection molding, so that the packaging material forms a hard protective shell, and the chip, solder wire, frame and base island are encapsulated, thereby protecting the chip and solder wire and preventing the chip and solder wire from being damaged by mechanical external force and from being damp.

[0003] At present, the chip solidification packaging method usually adopts the baking heating method, that is, the chip is placed in a baking oven, and a specified baking temperature is set to heat and solidify the packaging material. Due to the structure of the baking oven, only a certain amount of chips can be put in each time, and the new chips can be placed after the baking is completed and the chips are taken out. This is relatively cumbersome. In addition, during the loading and unloading process, the internal temperature of the baking oven needs to be reduced before manual operation can be performed. During this waiting period, time is wasted. In addition, when the chips that have completed baking are taken out, if the temperature of the packaging material is high, the rapid cooling may cause thermal stress, resulting in cracks or delamination in the packaging material, and causing the chip packaging to fail.

[0004] Therefore, a chip solidification packaging device and a packaging method are proposed to solve the above problems. SUMMARY

[0005] In order to make up for the shortcomings of the prior art and solve at least one technical problem in the background art.

[0006] The technical scheme adopted by the present application to solve the technical problems is: the chip solidification packaging device comprises a baking oven, the inside of the baking oven is divided into multiple layers of solidification units from top to bottom, each solidification unit comprises a rotating disc rotatably connected in the baking oven, a plurality of material grooves are formed in the outer circle of each rotating disc, a material disc is placed in each material groove, a chip is placed on the material disc, an infrared heater is arranged above and below each rotating disc, and the infrared heater is used to solidify the packaging material on the chip.

[0007] A plurality of feeding ports are formed in the front side wall of the baking oven, each feeding port corresponds to each solidification unit one by one, a pushing assembly is arranged at each feeding port, the pushing assembly is used to push the material disc onto the material groove on the rotating disc, a plurality of discharging ports are formed in the side wall of the baking oven, each discharging port corresponds to each solidification unit one by one, and a discharging assembly is arranged at each discharging port, the discharging assembly is used to discharge the material disc from the material groove on the rotating disc.

[0008] Preferably, each of the pushing assemblies comprises slide rails symmetrically arranged on both sides of the feeding port, a sliding plate is slidably connected on the adjacent two slide rails, and a first spring is fixedly connected on both sides of the sliding plate.

[0009] A sliding hole in the shape of a strip is formed in the middle of the sliding plate and is arranged along the width direction of the sliding plate, a push rod is slidably connected in the sliding hole, a second spring is fixedly connected to the upper end of the push rod, the end of the second spring extends towards the front side wall of the baking oven and is fixedly connected to the inner side wall of the sliding groove, and a push plate is fixedly connected to the upper end of the push rod, and the lower end of the push rod penetrates the sliding hole downwards.

[0010] Preferably, the discharging assembly comprises a hydraulic rod arranged above the discharging port, the output end of the hydraulic rod horizontally points to the position of the axis of the rotating disc, and the output end of the hydraulic rod is fixedly connected with a pushing block.

[0011] A sliding layer is formed in the inner side wall of each material groove, a pushing plate is arranged in the sliding layer, an extrusion rod is fixedly connected to one end of the pushing plate, and the other end of the pushing plate is close to the pushing block.

[0012] Preferably, the material disc comprises a tray at the top, the tray is arranged in a hollow shape, and extension parts are symmetrically arranged on both sides of the tray.

[0013] Steps are symmetrically arranged in each material groove, the tray slides along the steps and is installed in the material groove.

[0014] Preferably, an arc-shaped elastic plate is symmetrically arranged on the inner side wall of each material groove, the elastic plate is located above the steps, and the elastic plate is used for clamping the tray.

[0015] Preferably, an auxiliary rod is arranged at the end of each extrusion rod, the auxiliary rod is located above the steps, the extrusion rod extrudes the material disc, and the auxiliary rod extrudes the elastic plate.

[0016] Preferably, a plurality of positioning holes are formed in the outer circle of each rotating disc, and each group of positioning holes is arranged on both sides of each material groove.

[0017] Positioning rods are arranged on both sides of the end face of each sliding plate close to the front side wall of the baking oven, and the positioning rods penetrate the guide holes arranged in the front side wall of the baking oven.

[0018] Preferably, a receiving plate is arranged on the outer side of each discharging port, one side of the receiving plate is rotatably connected to the side wall of the baking oven, and a conveying belt is arranged on the other side of the receiving plate.

[0019] A chip solidification packaging method, which adopts the chip solidification packaging device to solidify and package the chip, comprises the following steps:

[0020] Step one: preparation, the substrate with the chip is plasma cleaned, and then the packaging material is covered on the chip by injection molding to form a plastic packaging material;

[0021] Step two: baking and curing, the plastic packaging material is placed in a material tray, and then the material tray and the plastic packaging material are put into a curing packaging device, the plastic packaging material is baked in the curing packaging device, the packaging material is heated and cured to change from a semi-solid state to a solid protective shell of the chip, and a packaging blank is formed;

[0022] Step three: finished product, laser marking is performed on the surface of the packaging blank, and then ball mounting, reflow soldering, water washing and cutting are sequentially performed to form a finished product;

[0023] Step four: delivery, the finished product sequentially passes through appearance inspection and moisture baking, and is finally packaged and delivered.

[0024] Preferably, when the finished product is cut in step three, a water jet is used for cutting.

[0025] The present application has the following advantages:

[0026] 1. In the present application, compared with the existing quantitative baking and curing method, the chip curing packaging device designed in the present application can continuously add chips to be baked from the feeding port position, and continuously take out the baked chips from the discharging port position at the same time. The three links of feeding, baking and discharging are executed in a pipeline, which can continuously bake and process the packaging material on the chip, and does not need to wait for the baking temperature to drop before taking out the material, saving time and improving the overall curing efficiency.

[0027] 2. In the present application, by distributing the heating power of the infrared heater on the cover plate 37, the temperature can be slowly reduced, avoiding rapid cooling and causing thermal stress, which can cause cracks or delamination in the packaging material. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a perspective view of the chip curing packaging device in the present application;

[0029] Figure 2 is a front view of the chip curing packaging device in the present application;

[0030] Figure 3 is a perspective view of the curing unit in the present application;

[0031] Figure 4 is a top view of the curing unit in the present application;

[0032] Figure 5 is Figure 4 is a local enlarged view of A in the present application;

[0033] Figure 6 Schematic view of the bottom structure of the curing unit in the application;

[0034] Figure 7 Perspective view of the turntable in the application;

[0035] Figure 8 Perspective view of the cover plate in the application;

[0036] Figure 9 Perspective view of the pushing assembly in the application;

[0037] Figure 10 Top view of the pushing assembly in the application;

[0038] Figure 11 Perspective view of the discharging assembly in the application;

[0039] Figure 12 is Figure 11 Partial enlarged view at B in the application;

[0040] Figure 13 Side view of the discharging assembly in the application;

[0041] Figure 14 Perspective view of the material tray in the application;

[0042] Figure 15 Schematic view of the stacking state of the material tray in the application;

[0043] Figure 16 Flow chart of the curing packaging method of the chip in the application.

[0044] In the figure: 1, oven; 2, curing unit; 3, turntable; 4, material groove; 5, material tray; 6, infrared heater; 7, feeding port; 8, discharging port; 9, sliding rail; 10, sliding plate; 11, No. 1 spring; 12, sliding hole; 13, push rod; 14, No. 2 spring; 15, hydraulic rod; 16, receiving plate; 17, conveying belt; 18, motor; 19, pushing block; 20, sliding layer; 21, pushing plate; 22, extrusion rod; 23, No. 3 spring; 24, tray; 25, extension; 26, supporting leg; 27, strip-shaped port; 28, limiting plate; 29, step; 30, elastic plate; 31, auxiliary rod; 32, positioning hole; 33, positioning rod; 34, guide hole; 35, gear; 36, gear ring; 37, cover plate; 38, vertical shaft. DETAILED DESCRIPTION

[0045] In order to make the technical means, creative features, purposes and effects realized by the application easy to understand, the application is further described below in combination with specific embodiments.

[0046] Reference Figures 1-8The utility model relates to a kind of solidification packaging equipment of chip, including oven 1, the inside of oven 1 is divided into multiple layers of solidification unit 2 up and down, each layer of solidification unit 2 includes rotatingly connected in oven 1 rotating disc 3, each rotating disc 3 outer circle is set with multiple material grooves 4, each material groove 4 is placed with material tray 5, material tray 5 is placed with chip, the upper and lower positions of rotating disc 3 are provided with infrared heater 6, and infrared heater 6 is used to solidify the packaging material on chip;

[0047] As Figure 1 And Figure 3 As shown in the utility model, the front side wall of oven 1 is set with multiple feeding ports 7, each feeding port 7 corresponds to each layer of solidification unit 2, and each feeding port 7 is provided with a material pushing assembly, which is used to push material tray 5 to the material groove 4 on rotating disc 3, and the right side wall of oven 1 is set with multiple discharging ports 8, each discharging port 8 corresponds to each layer of solidification unit 2, and each discharging port 8 is provided with a discharging assembly, which is used to discharge material tray 5 from the material groove 4 on rotating disc 3;

[0048] In the embodiment, a driving assembly for driving the rotation of each rotating disc 3 is further provided below each rotating disc 3, and the driving assembly can be a motor 18 controlled and executed by a backstage control system. The output end of the motor 18 is fixedly connected with a gear 35, the gear 35 engages with a gear ring 36, the gear ring 36 rotates coaxially with the rotating disc 3, each driving assembly drives the corresponding rotating disc 3, and the multiple layers of rotating discs 3 are connected together through a vertical shaft 38, that is, the inner circle of each rotating disc 3 is rotatably connected with the vertical shaft 38, and the upper and lower ends of the vertical shaft 38 are fixedly connected in the oven 1;

[0049] The upper and lower positions of each rotating disc 3 are provided with a fan-shaped cover plate 37, the cover plate 37 is provided with an infrared heater 6, the heat generated by the infrared heater 6 above each rotating disc 3 is radiated to the upper side of the chip, the heat generated by the infrared heater 6 below each rotating disc 3 is radiated to the lower surface of the chip, and the substrate carrying the chip is heated, so that the packaging material is uniformly heated;

[0050] The heating power of the infrared heater 6 at both ends of each cover plate 37 is smaller than that at the middle position, so that when the packaging material enters between the infrared heaters 6, the heating temperature is slowly increased, when the chip moves out from between the infrared heaters 6, the heating temperature is slowly decreased, the temperature difference between the solidified packaging material and the external environment is reduced, and the phenomenon of cracks or delamination in the packaging material is reduced;

[0051] The specific operation of the chip solidification packaging equipment is as follows:

[0052] Loading, the driving assembly drives the rotating disc 3 to rotate, when one of the material grooves 4 rotates to the position opposite to the feeding port 7, the driving assembly pauses, during the pause, the loading is carried out through the pushing assembly, the material tray 5 on which the chips are placed is pushed along the feeding port 7 into the material groove 4, and then the driving assembly drives the rotating disc 3 to rotate, the rotating disc 3 rotates slowly;

[0053] Baking, the rotating disc 3 gradually rotates the chips from the position of the feeding port 7 to between the upper and lower cover plates 37, the heat generated by the infrared heater 6 is radiated to the packaging material to heat and solidify the packaging material, the slowly rotating rotating disc 3 enables the packaging material to be heated and solidified for a long time, and then the rotating disc 3 gradually transfers the chips from the position of the cover plates 37 to the position of the discharging port 8;

[0054] Discharging, the material tray 5 is transferred to the position of the discharging port 8, the material tray 5 is taken out from the material groove 4 through the discharging assembly, and is discharged from the feeding port 7;

[0055] Compared with the existing quantitative baking and solidification mode, the chip solidification and packaging equipment designed in the embodiment can continuously add chips to be baked from the position of the feeding port 7 and continuously take out baked chips from the position of the discharging port 8, the three links of loading, baking and discharging are executed in a pipeline, the packaging material on the chips can be continuously baked, and it is not necessary to wait for the baking temperature to decrease before taking out the material, time is saved, the overall solidification efficiency is improved, and the heating power of the distributed infrared heater 6 can achieve the effect of slowly reducing the temperature, so that the problem of thermal stress caused by rapid cooling and the problem of cracks or delamination in the packaging material are avoided.

[0056] Reference Figures 1-10 Each of the pushing assemblies comprises symmetrical sliding rails 9 arranged on both sides of the feeding port 7, adjacent two sliding rails 9 are slidably connected with a sliding plate 10, and one end of a first spring 11 fixedly connected to the front side wall of the baking oven 1 is fixedly connected to the two sides of the sliding plate 10.

[0057] A sliding hole 12 in the shape of a strip is formed in the middle position of the sliding plate 10, the sliding hole 12 is arranged along the width direction of the sliding plate 10, a push rod 13 is slidably connected in the sliding hole 12, a second spring 14 is fixedly connected to the upper end of the push rod 13, the end of the second spring 14 extends to the front side wall of the baking oven 1 and is fixedly connected to the inner side wall of the sliding groove, and a push plate is also fixedly connected to the upper end of the push rod 13, and the lower end of the push rod 13 penetrates the sliding hole 12 downwardly.

[0058] In this embodiment, the spring 14 used has a spring coefficient greater than that of the spring 11; after placing the material tray 5 on the slide plate 10, the push rod 13 in the middle of the slide plate 10 is pushed, the push rod 13 first drives the slide plate 10 to move along the slide rail 9, pushing the material tray 5 to the position of the feeding port 7, and then the push rod 13 is pushed again, at this time the push rod 13 drives the push plate to move, the push plate pushes the material tray 5 on the slide plate 10, and the material tray 5 is pushed along the feeding port 7 to the rotating disc 3 which is temporarily stopped, that is, to the material groove 4, and then the push rod 13 is released, the slide plate 10 is reset with the rear side away from the front wall of the baking oven 1 under the elastic force of the spring 11 connected thereto, and the push rod 13 is also reset under the elastic force of the spring 14 connected thereto.

[0059] As shown in Figure 3 , the feeding port 7 is provided in a flat shape, which is to reduce the outflow of heat in the baking oven 1, reduce the waste of heat resources, and also reduce the heat radiation damage to the operator at the feeding port 7. The flat-shaped feeding port 7 matches the material pushing assembly, which can easily push the material tray 5 to the material groove 4 on the rotating disc 3, and is convenient to operate.

[0060] Referring to Figures 1-13 , the discharging assembly comprises a hydraulic rod 15 arranged above the discharging port 8, the output end of the hydraulic rod 15 horizontally points to the axis position of the rotating disc 3, and the output end of the hydraulic rod 15 is fixedly connected with a pushing block 19;

[0061] The inner side wall of each material groove 4 is provided with a sliding layer 20, the sliding layer 20 is provided with a pushing plate 21, one end of the pushing plate 21 is fixedly connected with a pressing rod 22, the other end of the pushing plate 21 is close to the pushing block 19, the pushing block 19 presses the pushing plate 21, and the pressing rod 22 pushes the material tray 5 in the material groove 4 away;

[0062] The dried chips are transferred to the position of the discharging port 8, the rotating disc 3 is temporarily stopped, and then the discharging assembly is driven, the hydraulic rod 15 drives the pushing block 19 to move towards the discharging port 8, the pushing block 19 presses the pushing plate 21, the pushing plate 21 moves along the sliding groove, the pushing plate 21 pushes the material tray 5 in the material groove 4 away and pushes it out along the discharging port 8; then the hydraulic rod 15 drives the pushing block 19 to reset away from the discharging port 8, and the pushing plate 21 resets away from the discharging port 8 under the elastic force of the spring 23 connected to the two sides of the pushing plate 21, and the discharging process is completed. After the discharging is completed, the rotating disc 3 continues to rotate; the discharging port 8 is also provided in a flat shape, which is also to reduce the outflow of heat in the baking oven 1, reduce the waste of heat resources, and reduce the heat radiation damage to the operator when taking the material.

[0063] Referring to Figures 1-15The material tray 5 comprises a top tray 24, the tray 24 is provided in a hollow shape, and extension portions 25 are symmetrically arranged on both sides of the tray 24;

[0064] Steps 29 are symmetrically arranged in each material groove 4, and the two sides of the tray 24 slide along the steps 29 and are installed in the material groove 4;

[0065] The material tray 5 provided in the embodiment of the present application not only considers the stability of the upper and lower stacked placement of the material tray 5, but also considers the convenience of feeding. First, in terms of feeding convenience, support legs 26 are symmetrically arranged on the lower sides of each tray 24, and the support legs 26 at the bottom of the upper tray 24 can be embedded in the strip-shaped openings 27 symmetrically arranged on the two sides of the lower tray 24 when the upper and lower material trays 5 are stacked, and the support legs 26 are also provided with limiting plates 28, which are used to constrain the depth of the support legs 26 embedded in the strip-shaped openings 27, so as to ensure that the upper and lower material trays 5 are neatly stacked. Secondly, in terms of feeding convenience, the upper and lower material trays 5 are neatly stacked, and the chips can be placed on the tray 24 in advance to prepare the feeding link. When feeding, the extension portions 25 on both sides of the tray 24 are placed on the steps 29 and can be slid into and out of the material groove 4 along the steps 29, thereby facilitating the feeding of the material tray 5.

[0066] Referring to Figures 1-13 An arc-shaped elastic plate 30 is symmetrically arranged on the inner side wall of each material groove 4, the elastic plate 30 is located above the step 29, and the elastic plate 30 is used to clamp the tray 24;

[0067] The elastic plate 30 is arranged in each material groove 4, after the tray 24 slides into the material groove 4 along the step 29, the extension portions 25 on both sides of the tray 24 are pressed on the step 29 by the elastic plate 30, so as to stably press the tray 24. Even if the rotating disc 3 vibrates during rotation, the material tray 5 can be stably arranged in the material groove 4, so as to ensure that the heat source can be fully and uniformly radiated to the packaging material covering the chip.

[0068] Referring to Figures 1-13 An auxiliary rod 31 is arranged at the end of each extrusion rod 22, the auxiliary rod 31 is located above the step 29, and the extrusion rod 22 extrudes the material tray 5, and the auxiliary rod 31 extrudes the elastic plate 30;

[0069] The auxiliary rod 31 is arranged to extrude the elastic plate 30, and the auxiliary discharging assembly pushes the material tray 5 away. When the pushing plate 21 cooperates with the extrusion rod 22 to extrude and push away the material tray 5, the auxiliary rod 31 slides along the upper side of the step 29 and extrudes the elastic plate 30 upwardly and obliquely, so that the elastic plate 30 no longer extrudes the material tray 5. At this time, the material tray 5 is in a free state on the step 29, and the extrusion rod 22 can extrude the material tray 5 to smoothly separate the material tray 5 from the material groove 4. If the extrusion rod 22 extrudes the material tray 5, the elastic plate 30 still extrudes the material tray 5. At the moment when the material tray 5 separates from the elastic plate 30, the material tray 5 suddenly loses resistance. At this time, the material tray 5 has a problem of self-sliding in the direction of the discharge port 8, which causes unstable triggering of the discharging.

[0070] With reference to Figures 1-10 A plurality of sets of positioning holes 32 are arranged on the outer ring of each rotating disc 3, and each set of positioning holes 32 is arranged on both sides of each material groove 4.

[0071] A positioning rod 33 is arranged on each sliding plate 10 at the end face close to the front side wall of the baking oven 1, and the positioning rod 33 penetrates a guide hole 34 arranged in the front side wall of the baking oven 1.

[0072] The positioning holes 32 arranged on the rotating disc 3 are used to guide the movement of the sliding plate 10, so that the sliding plate 10 can accurately push the material tray 5 into the material groove 4. The specific operation is as follows: the rotating disc 3 is temporarily stopped, the sliding plate 10 is pushed, the positioning rod 33 is inserted into the guide hole 34, the guide hole 34 cooperates with the positioning rod 33 to constrain the movement path of the sliding plate 10, so that the sliding plate 10 can accurately push the material tray 5 into the material groove 4.

[0073] With reference to Figures 1-6 A receiving plate 16 is arranged on the outer side of each discharge port 8, one side of the receiving plate 16 is rotatably connected to the side wall of the baking oven 1, and the other side of the receiving plate 16 is arranged.

[0074] The receiving plate 16 is arranged, one side of which is connected to the output end of a speed reducer, and the speed reducer can drive the receiving plate 16 to deflect from a horizontal state to an inclined downward state. When the discharging assembly pushes the material tray 5 to the position of the discharge port 8, the receiving plate 16 is in a horizontal state. After the material tray 5 is placed on the receiving plate 16, the receiving plate 16 slowly rotates, and the other side of the receiving plate 16 is inclined toward the conveying belt 17. Under the guidance of the inclined receiving plate 16, the material tray 5 slides onto the conveying belt 17 and is conveyed away from the chip solidification packaging device by the conveying belt 17, facilitating the removal of the material tray 5.

[0075] With reference to Figure 16 A chip solidification packaging method, which uses the chip solidification packaging device to solidify and package the chip, and the chip solidification packaging method comprises the following steps:

[0076] Step one: preparation, the substrate with the chip is plasma cleaned, and then the packaging material is covered on the chip by injection molding to form a plastic packaging material;

[0077] Step two: baking and curing, the plastic packaging material is placed in the material tray 5, and then the material tray 5 and the plastic packaging material are put into the curing packaging equipment, the plastic packaging material is baked in the curing packaging equipment, the packaging material is heated and cured to change from a semi-solid state to a solid protective shell of the chip, and a packaging blank is formed;

[0078] Step three: finished product, laser marking is performed on the surface of the packaging blank, and then ball mounting, reflow soldering, water washing and cutting are sequentially performed to form a finished product;

[0079] Step four: delivery, the finished product sequentially passes through appearance inspection and moisture baking, and is finally packaged and delivered.

[0080] When the finished product is cut in step three, the water jet is used for cutting.

[0081] Working principle: the chip curing packaging equipment specifically operates as follows:

[0082] Feeding, the driving assembly drives the rotating disc 3 to rotate, when one of the material grooves 4 rotates to a position opposite to the feeding port 7, the driving assembly is paused, during the pause, feeding is performed by the pushing assembly, the material tray 5 on which the chip is placed is pushed along the feeding port 7 into the material groove 4, and then the driving assembly drives the rotating disc 3 to rotate slowly;

[0083] Baking, the rotating disc 3 gradually rotates the chip from the feeding port 7 position to between the upper and lower cover plates 37, the heat generated by the infrared heater 6 is radiated to the packaging material to heat and cure the packaging material, the slowly rotating rotating disc 3 enables the packaging material to be heated and cured for a long time, and then the rotating disc 3 gradually transfers the chip from the cover plate 37 position to the discharge port 8 position;

[0084] Discharging, the material tray 5 is transferred to the discharge port 8 position, the material tray 5 is taken out of the material groove 4 by the discharging assembly, and is discharged from the feeding port 7;

[0085] The feeding, baking and discharging links are sequentially repeated.

[0086] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above examples, the above examples and descriptions in the specification are only to illustrate the principle of the present application, and various changes and improvements can be made without departing from the spirit and scope of the present application, which fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A chip curing and packaging apparatus, characterized in that: The oven is divided into multiple curing units, and each curing unit includes a turntable that is rotatably connected inside the oven. Each turntable has multiple material slots on its outer ring, and each material slot contains a material tray on which a chip is placed. Infrared heaters are installed above and below the turntable to cure the encapsulation material on the chip. The front side wall of the baking oven has multiple feeding ports, each corresponding to one of the curing units. Each feeding port is equipped with a pushing component to push the material tray onto the material trough on the turntable. The side wall of the baking oven has multiple discharging ports, each corresponding to one of the curing units. Each discharging port is equipped with a feeding component to unload the material tray from the material trough on the turntable. The feeding assembly includes a hydraulic rod disposed above the discharge port, the output end of the hydraulic rod pointing horizontally towards the axis of the turntable, and a pusher block fixedly connected to the output end of the hydraulic rod. Each of the material troughs has a sliding layer on its inner sidewall, and a pusher plate is provided in the sliding layer. One end of the pusher plate is fixed to an extrusion rod, and the other end of the pusher plate is close to the pusher block. The pusher block extrudes the pusher plate, and the extrusion rod pushes the material tray in the material trough away. The material tray includes a top tray with a hollow design and symmetrical extensions on both sides of the tray. Each of the material troughs has symmetrical steps on both sides, and the tray slides along the steps on both sides and is installed in the material trough; Each of the material troughs has an arc-shaped elastic plate symmetrically arranged on its inner sidewall. The elastic plate is located above the step and is used to clamp the tray. Each of the extrusion rods is provided with an auxiliary rod at its end, which is located above the step. The extrusion rods extrude the material disc, and the auxiliary rods extrude the elastic plate.

2. The chip curing and packaging equipment according to claim 1, characterized in that: Each of the feeding components includes slide rails symmetrically arranged on both sides of the feed inlet, with a sliding plate slidably connected to two adjacent slide rails. A first spring is fixed to both sides of the sliding plate, and the end of the first spring is fixed to the front side wall of the baking oven. A strip-shaped sliding hole is opened in the middle of the slide plate. The sliding hole is set along the width direction of the slide plate. A push rod is slidably connected in the sliding hole. A second spring is fixed to the upper end of the push rod. The end of the second spring extends towards the front side wall of the baking oven and is fixed to the inner side wall of the slide groove. A push plate is also fixed to the upper end of the push rod. The lower end of the push rod passes through the sliding hole downward.

3. The chip curing and packaging equipment according to claim 1, characterized in that: Multiple sets of positioning holes are provided on the outer ring of each turntable, and each set of positioning holes is located on both sides of each material trough; Positioning rods are installed on both sides of the end face of each slide plate that is close to the front side wall of the baking oven. The positioning rods pass through the guide holes provided in the front side wall of the baking oven.

4. The chip curing and packaging equipment according to claim 1, characterized in that: Each discharge port is equipped with a receiving plate on its outer side. One side of the receiving plate is rotatably connected to the side wall of the baking oven, and the other side of the receiving plate is equipped with a conveyor belt.

5. A chip curing and packaging method, wherein the chip curing and packaging method uses any one of the chip curing and packaging devices according to claims 1-4 to cure and package the chip, characterized in that: The chip's curing and packaging method includes the following steps: Step 1: Material preparation. The substrate with the chip is plasma cleaned, and then the encapsulation material is covered on the chip by injection molding to form a plastic encapsulation material. Step 2: Baking and curing. Place the molding material in the material tray, and then put the material tray along with the molding material into the curing and encapsulation equipment. The molding material is baked in the curing and encapsulation equipment to heat and cure the encapsulation material, turning it from a semi-solid into a strong protective shell for the chip, forming the encapsulation blank. Step 3: Finished product. Laser marking is performed on the surface of the packaging blank, followed by ball placement, reflow soldering, water washing and cutting to form the finished product. Step 4: Shipping. The finished products undergo appearance inspection and moisture drying in sequence, and are finally packaged and shipped.

6. The chip curing and packaging method according to claim 5, characterized in that: In step three, when cutting the finished product, a water jet cutter is used.

Images