Electric connector and manufacturing method thereof

Abstract

The invention relates to the technical field of connectors, in particular to an electric connector and a manufacturing method thereof. The electric connector comprises a first assembly, a second assembly and a main carrier combining the first assembly and the second assembly together, and the first assembly comprises a first lead frame, a first grounding structure arranged on the first side of the first lead frame and a first terminal assembly arranged on the second side of the first lead frame. The second assembly comprises a second lead frame, a second grounding structure arranged on the first side of the second lead frame and a second terminal assembly arranged on the second side of the first lead frame, and each of the first terminal assembly and the second terminal assembly comprises a signal terminal and a grounding terminal; each of the first grounding structure and the second grounding structure comprises a grounding sheet and a conductive column, and the grounding sheet is provided with a first hole; the first lead frame and the second lead frame are provided with second holes, the conductive columns are connected to the first holes, and the conductive columns are further connected to grounding terminals through the second holes.

Description

Technical Field

[0001] The present invention relates to the technical field of connectors, and in particular to an electrical connector and a manufacturing method thereof. Background Art

[0002] As devices like servers increasingly demand higher signal transmission speeds, connector high-frequency performance has become a primary evaluation requirement. Addressing crosstalk between high-frequency signals and improving the connector's crosstalk resistance are becoming increasingly important. Electrical connectors typically employ grounding structures to reduce signal crosstalk, improve crosstalk resistance, and ensure stable and accurate signal transmission.

[0003] Chinese patent application No. 202410611162.2 discloses such a grounding structure, which adopts a corrugated grounding plate design. The corrugated grounding plate has crests and troughs, the crests are used to contact the corresponding grounding terminals, and the troughs are used to contact the isolation plate. However, there are some problems with this design: First, the corrugated grounding plate has multiple bending surfaces, which increases the processing complexity. Secondly, since all the grounding terminals of the electrical connector are located in the same plane, the flatness of the corrugated grounding plate is required to be extremely high, otherwise it is easy to have poor contact with the grounding terminals, affecting the grounding performance, and thus reducing the anti-crosstalk performance. Finally, the corrugated grounding plate is not suitable for non-flat grounding terminals, and is difficult to apply to curved or bent grounding terminals. In addition, the aforementioned connector generally adopts a technical solution of setting a first terminal group and a second terminal group on the upper and lower sides of a printed circuit board (i.e., the electrical connection board in the comparative document), and grounding is achieved through the printed circuit board. This solution is relatively expensive. Summary of the Invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to provide an electrical connector capable of improving crosstalk performance and a manufacturing method thereof.

[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is: an electrical connector is provided, including a first component, a second component and a main carrier that combines the two together, the first component including a first lead frame, a first grounding structure arranged on the first side of the first lead frame and a first terminal component arranged on the second side of the first lead frame, the second component including a second lead frame, a second grounding structure arranged on the first side of the second lead frame and a second terminal component arranged on the second side of the second lead frame, the first terminal component and the second terminal component both include signal terminals and grounding terminals; the first grounding structure and the second grounding structure both include grounding plates and conductive columns, and a plurality of first holes are provided on the grounding plates at positions corresponding to the grounding terminals; the first lead frame and the second lead frame are provided with second holes at positions corresponding to the first holes, the conductive columns are connected to the first holes, and the conductive columns are also connected to the grounding terminals through the second holes.

[0006] Furthermore, the first hole and the second hole are respectively configured as a first through hole and a second through hole, the first end of the second through hole is coaxially connected to the first through hole, and the second end of the second through hole is opposite to the ground terminal; the conductive column is configured as a conductive glue column, the conductive glue column is bonded to the first through hole and the second through hole, and the conductive glue column is also bonded to the ground terminal.

[0007] Furthermore, the first component and the second component are mirror images of each other, the first sides of the first component and the second component are opposite to each other, and the second sides of the first component and the second component are opposite to each other; the grounding plate of the first grounding structure and the grounding plate of the second grounding structure are stacked and in contact with each other;

[0008] The conductive posts of the first grounding structure and the second grounding structure are both sunk into the first through holes of their respective grounding sheets, so that when the two grounding sheets are stacked together, a second gap is formed between the first end faces of the two conductive posts; or the first end faces of the conductive posts of the first grounding structure and the second grounding structure are both flush with the first side faces of their respective grounding sheets, so that when the two grounding sheets are stacked together, the first end faces of the two conductive posts are in contact.

[0009] Furthermore, the grounding plate is provided with claws; claws are provided on both end edges of the grounding plate; a first end of the claw is connected to the grounding plate, and a second end extends toward the grounding terminal.

[0010] Furthermore, a claw is provided on the grounding plate at a position corresponding to at least one of the first through holes, the claw being integrally stamped when the first through hole is stamped, and the claw is stamped through the first side surface of the grounding plate toward the second side surface;

[0011] The claw extends toward the ground terminal, and the claw is capable of extending into the conductive post;

[0012] A plurality of concave and convex joint surfaces are formed between the claws at the two end edges of the grounding piece and the two end surfaces of the grounding piece.

[0013] Furthermore, the first lead frame and the first terminal assembly are injection molded, and the second lead frame and the second terminal assembly are injection molded; the first lead frame and the second lead frame are both formed with press-fitting positions corresponding to the signal terminal and the ground terminal at positions for preventing the terminals from being displaced during the injection molding process; the press-fitting position of the ground terminal forms the second through hole.

[0014] Furthermore, the first side surfaces of the first lead frame and the second lead frame each have a recessed portion for accommodating and positioning a corresponding grounding plate;

[0015] A stopper is formed on one side edge of the first lead frame and the second lead frame along the first direction, and the stopper constrains the first side surface of the corresponding lead frame to have a lower lower surface and a higher upper surface, and the lower surface area forms a recessed position for accommodating and positioning the corresponding ground plate;

[0016] The first side surfaces of the first lead frame and the second lead frame are both provided with positioning posts and positioning holes. The positioning posts of the first lead frame are positioned and matched with the positioning holes of the second lead frame, and the positioning holes of the first lead frame are positioned and matched with the positioning posts of the second lead frame. Positioning holes for the corresponding positioning posts to pass through are provided at positions corresponding to the positioning posts and positioning holes on the two grounding plates.

[0017] Furthermore, the first grounding structure and the second grounding structure are sandwiched between the first lead frame and the second lead frame; the first grounding structure and the second grounding structure are recessed between the first lead frame and the second lead frame at both end edges along the first direction, so that a recessed space is formed between the two end edges of the two grounding plates and the first side surface of the first lead frame and the first side surface of the second lead frame; the main carrier extends into the recessed space and is combined with it.

[0018] Furthermore, the first terminal assembly and the second terminal assembly are respectively distributed on the first lead frame and the second lead frame along the first direction, and the length of each terminal of the first terminal assembly and the second terminal assembly extends along the second direction; the grounding plate, the signal terminal and the front end of the grounding terminal all extend out of the corresponding lead frame along the second direction, and the front end of the grounding terminal is welded to the grounding plate; an embedded space is formed between the signal terminal and the grounding terminal and the corresponding grounding plate, and the main carrier is also embedded in the embedded space to be combined with it.

[0019] Furthermore, the first terminal assembly and the second terminal assembly both include several groups of high-frequency signal differential pairs and grounding terminals arranged on both sides of the high-frequency signal differential pairs, and the grounding terminals prevent crosstalk between high-frequency signal differential pairs in the same row; along the length extension direction of the grounding terminals, the grounding plate and the first lead frame and the second lead frame are respectively provided with at least two first holes and second holes, and the conductive columns are both provided in the first holes and the second holes so that the crosstalk signals on the grounding terminals can be introduced into the grounding plate nearby.

[0020] To solve the above technical problems, the present invention adopts a technical solution: providing a method for manufacturing an electrical connector, comprising:

[0021] Manufacturing the first assembly: performing an injection molding process to form a first lead frame that holds the first terminal group as a whole by injection molding the first terminal assembly; performing a dispensing process to inject conductive glue into the first hole of the grounding plate and the second hole of the first lead frame, and forming a conductive post connected to the first hole, the second hole and the grounding terminal of the first terminal assembly after curing;

[0022] Providing a second component: rotating a first component 180 degrees to obtain a second component;

[0023] Component combination: perform an injection molding process, stack and bond one side of the grounding sheet of the first component and the second component together, and then perform injection molding to obtain a main carrier that holds the first component and the second component as a whole.

[0024] In summary, the electrical connector and its manufacturing method of the present invention have the following beneficial effects: (1) Improved anti-crosstalk performance: Each grounding terminal is connected to the grounding plate through a conductive column, which solves the problem of unstable contact of the corrugated grounding plate in the prior art due to many reasons such as manufacturing and its own elasticity, improves the connection performance between the grounding terminal and the grounding plate, and allows the noise signal to quickly pass through the ground and return, thereby improving the anti-crosstalk performance of the electrical connector. (2) Optimization and reduction of the complexity of the manufacturing process: The grounding plate only needs to be made into a conventional sheet structure, and a hole-opening process is added during its manufacturing process. The manufacturing process is simple and there is no need to consider the tolerance of the corrugated grounding plate. (3) The second through hole at the first lead frame and the second lead frame is the pressing hole position during the injection molding process, which not only solves the problem of terminal deviation during the injection molding process, but also realizes the function of the second through hole. There is no need to add two separate hole-opening processes. While simplifying the manufacturing process, it can also solve the problem of terminal deviation. (4) The claw structures at both ends of the grounding plate can not only enhance the bonding force between the grounding plate, the lead frame and the terminal, but also form multiple concave and convex bonding surfaces on the edges of both ends of the grounding plate, thereby enhancing the bonding force between the first component and the second component and the main carrier, improving the connection strength and stability of the electrical connector, and improving the service life of the electrical connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0026] Figure 1 It is a structural diagram of an embodiment of the grounding structure of the present invention.

[0027] Figure 2 yes Figure 1 Exploded diagram.

[0028] Figure 3 yes Figure 1 Cross-sectional view of AA in the figure.

[0029] Figure 4 It is a structural diagram of an embodiment of an electrical connector of the present invention.

[0030] Figure 5 yes Figure 4 Cross-sectional view of the BB.

[0031] Figure 6 yes Figure 4 Exploded diagram.

[0032] Figure 7 yes Figure 4 A schematic diagram of the structure of the first terminal assembly, in which part of the first side terminal and the second side terminal are hidden.

[0033] Figure 8 yes Figure 7 Side view of the ground terminal.

[0034] Figure 9 yes Figure 4 Structural schematic diagram of the first lead frame from the first perspective.

[0035] Figure 10 yes Figure 9 Enlarged schematic diagram of part C in the middle.

[0036] Figure 10a yes Figure 10 Schematic diagram of the coordination between the local C and the bent section and the joint section of the ground terminal.

[0037] Figure 11 yes Figure 4 Structural schematic diagram of the first lead frame from the second perspective.

[0038] Figure 12 1 is a schematic diagram of the cooperation between the first component and the second component in an embodiment of the electrical connector of the present invention.

[0039] Figure 13 yes Figure 4 Schematic diagram of the structure of the main carrier.

[0040] The accompanying drawings in this specification are numeraled as follows:

[0041] Grounding structure 100; grounding plate 110; first side surface 111; second side surface 112; first hole 113; first through hole 113a; positioning hole 114; conductive column 120; conductive rubber column 120a; first gap J1; claw 130;

[0042] First component A; first ground structure 100'; first lead frame 200; first side surface 201; second side surface 202; second hole 203; second through hole 203a; pressing hole position 204; side rib 210; middle rib 220; receiving groove 230; signal receiving groove 230a; ground receiving groove 230b; first contoured surface 231; second contoured surface 232; third contoured surface 233; sharp corner 234; positioning protrusion 240; recessed position 250; stop 260; positioning post 271; positioning hole 272;

[0043] First terminal assembly 300; signal terminal 30a; ground terminal 30b; second gap J2; third gap J3; intermediate terminal 310; first side terminal 320; second side terminal 330; first straight section 301; inclined section 302; second straight section 303; bent section 304; first bent portion 3041; second bent portion 3042; joint section 305;

[0044] Second assembly B; second ground structure 100 ″; second lead frame 200 ′; second terminal assembly 300 ′;

[0045] Embedded space S1; concave space S2; concave-convex joint surface S21;

[0046] Main carrier 400; first opening 401; second opening 402; first covering portion 410; second covering portion 420; mating groove 421; avoidance groove 422; third covering portion 430; fourth covering portion 440; shielding portions 431, 441; connecting portions 432, 442; fifth covering portion 450; guide portion 45a; first portion 451; second portion 452; signal covering grooves 451a, 452a; ground covering grooves 451b, 452b; embedded groove 453. DETAILED DESCRIPTION

[0047] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0048] The following disclosure provides a variety of different embodiments or examples for implementing the different features of the present invention. Specific examples of components and arrangements will be described below to simplify the present invention. Of course, these are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are in direct contact, and may also include an embodiment in which other components may be formed between the first component and the second component so that the first component and the second component are not in direct contact. In addition, the present invention may repeat reference symbols and / or characters in multiple instances. This repetition is for simplicity and clarity and does not, by itself, represent a relationship between the multiple embodiments and / or configurations.

[0049] Furthermore, spatially relative terms, such as "below," "beneath," "below," "above," and "upper," may be used herein to readily describe the relationship of one element or component to another element(s) or component(s) as illustrated in the figures. Spatially relative terms are intended to encompass various orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0050] In addition, the technical parts described in the present invention and the appended claims are mainly the technical parts improved by the present invention, which does not limit the object protected by the present invention to only having such technical parts. Other known necessary components (structures and / or methods) and / or non-essential components of the protected object other than the technical parts described in the present invention and the appended claims are not described in the present invention and the appended claims because they do not fall within the scope of improvement of the present invention. However, this does not mean that the object protected by the present invention does not have these known components.

[0051] See Figures 1 to 3 , Figures 1 to 3 A schematic diagram of an embodiment of a grounding structure 100 according to the present invention is shown. In the illustrated embodiment, the grounding structure 100 is used to connect to a grounding target (e.g., grounding terminal 30b described below). A grounding target is any component or structure that requires grounding through the grounding structure 100. For example, in this embodiment, the grounding target is a grounding terminal of an electrical connector. The grounding terminal is connected to the ground through the grounding structure 100, thereby improving the connector's anti-crosstalk performance.

[0052] The grounding structure 100 includes a grounding plate 110. The grounding plate 110 has a first side surface 111 and a second side surface 112. The first side surface 111 and the second side surface 112 are two opposite side surfaces of the grounding plate 110. The first side surface 111 and the second side surface 112 are two side surfaces in the thickness direction of the grounding plate 110. Figure 1 In the illustrated orientation, the first side 111 of the grounding plate 110 faces downward, and the second side 112 faces upward. Those skilled in the art will appreciate that the first side 111 and the second side 112 may be non-opposite sides, depending on different application requirements.

[0053] The grounding plate 110 is designed with a corresponding number of first holes 113 at corresponding locations based on the number and location of the grounding objects. Each first hole 113 extends through the side of the grounding plate 110 facing the grounding object (referred to herein as the second side 112). The first hole 113 also extends through the first side 111 of the grounding plate 110 to form a first through-hole 113a. In this embodiment, the first through-hole 113a extends through the first side 111 and the second side 112 along the thickness of the grounding plate 110. Designing the first holes 113 as first through-holes 113a facilitates processing, reduces material and weight, and facilitates the configuration of the conductive pillars 120 described below. Those skilled in the art will appreciate that, depending on different needs, the first holes 113 can also be designed as blind holes, with the closed end of the blind hole adjacent to the first side 111 of the grounding plate 110 and the open end extending through the second side 112 of the grounding plate 110. In order to facilitate assembly and positioning of the grounding plate 110 with other components, the grounding plate 110 is further provided with a positioning portion, such as two (not limited to two) positioning holes 114 shown in the figure.

[0054] In the illustrated embodiment, eleven grounding objects (other numbers, such as one or more, may also be used) are used as an example. The eleven grounding objects are spaced apart along a first direction, such as the length direction or longitudinal direction shown in the figure. For ease of description, the X-axis direction is used to represent the first direction below. Each grounding object is distributed along a second direction (i.e., the central axis or length direction of each grounding object is distributed along the second direction). The second direction is such as the width direction or transverse direction shown in the figure. For ease of description, the Y-axis direction is used to represent the second direction below. Of the eleven grounding objects, all may be flat or approximately flat block, strip, or strip structures. Approximately flat may mean that the overall inclination of the grounding object is very small, or that the upper and lower sides of the grounding object are approximately flat or have only small steps. Of the eleven grounding objects, each grounding object is not completely straight, but has certain bends or curves (bends or curves in the horizontal direction), i.e., the central axis of each grounding object is not straight, but rather a corresponding broken line or curve. It should be understood that, depending on different needs, the shape of the grounding object is not limited to the above. For example, in some embodiments, all ground objects may have different shapes. For another example, at least one ground object may have a different shape from the other ground objects. For another example, at least one or all ground objects may have a horizontal Z-shape, S-shape, L-shape, or other shape. For another example, at least one or all ground objects may have a vertical Z-shape, S-shape, L-shape, or other shape.

[0055] Based on the eleven grounding objects described above, eleven groups of first through holes 113a (or first holes 113) are provided on the grounding plate 110 along the X-axis. Each group of first through holes 113a includes four first through holes 113a, spaced apart along the central axis (Y-axis) of the corresponding grounding object. This design allows each grounding object to achieve multi-point connection with the conductive posts 120 located in the four first through holes 113a, ensuring connectivity between each grounding object and the grounding plate 110. Even if one or more conductive posts 120 lose connectivity with the grounding object, the connectivity between the grounding terminal and the grounding plate 110 is not affected. Those skilled in the art will appreciate that the configuration of the first holes 113 is not limited to the configuration described above. For example, at least one group of first holes 113 can include multiple first holes 113, spaced apart along the length of the grounding object (e.g., spaced apart) and aligned with the grounding object, so that the conductive posts 120 within each first hole 113 can connect to the grounding object.

[0056] Please continue to see Figures 1 to 3The grounding structure 100 further includes the conductive post 120, wherein the first end of the conductive post 120 is connected to the first hole 113, and the second end is connected to the grounding object. It will be understood by those skilled in the art that the connection of the conductive post 120 referred to herein refers to a conductive connection. Depending on different needs, the conductive post 120 can be tightly fitted with the first hole 113, and can contact or abut the grounding object to achieve a conductive connection. The conductive post 120 can also be hard-connected to the first hole 113 and / or the grounding object (e.g., bonding as described below) to achieve a conductive connection.

[0057] The number of the conductive posts 120 can be adapted to the number of the first holes 113, for example, the same as the number of the first holes 113. Depending on different needs, the first ends of the conductive posts 120 are inserted into the first holes 113, and the second ends are connected to the outside through the openings of the first holes 113, extend out of the first holes 113, or are flush with the second side surface 112 of the grounding plate 110.

[0058] The first end surface of the conductive post 120 is flush with the first side surface 111 of the grounding plate 110, which is away from the grounding object. Alternatively, the first end surface of the conductive post 120 can be recessed within the first through-hole 113a (i.e., the first end surface of the conductive post 120 is recessed within the first side surface 111 of the grounding plate 110), forming a first gap J1 between the first end surface and the horizontal plane of the first side surface 111 (the solution adopted in this embodiment). This allows a certain amount of space to remain in the first through-hole 113a, resolving the issue of the conductive post 120 easily protruding from the first side surface 111 of the grounding plate 110 due to manufacturing tolerances and other factors. When the conductive post 120 protrudes from the first side surface 111, it affects the fit between the grounding plate 110 and other components. For example, in an embodiment where multiple grounding sheets 110 are stacked, if the conductive pillars 120 are designed so that their first end surfaces are flush with the grounding sheets 110, if manufacturing tolerances cause the first end surfaces of the conductive pillars 120 to protrude beyond the first side surfaces 111 of the grounding sheets 110, the portion of the conductive pillars 120 protruding beyond the first side surfaces 111 of the grounding sheets 110 needs to be removed, increasing manufacturing complexity. If the first end surfaces of the conductive pillars 120 are allowed to protrude beyond the first side surfaces 111 of the grounding sheets 110, poor adhesion between adjacent grounding sheets 110 may result.

[0059] The conductive post 120 is configured as a conductive glue post 120a. It can be formed by injecting conductive glue into the first through-hole 113a, or by injecting conductive plastic into the first through-hole 113a through injection molding. The conductive post 120 can also be formed first and then assembled into the first through-hole 113. In this embodiment, the conductive glue is formed by conductive glue injection. After the conductive glue cures, the conductive glue post 120a is formed. Its outer circumference adheres to the inner circumference of the first through-hole 113. The second end of the conductive glue post 120a extends out of the first through-hole 113 and adheres to the grounding object. This conductive glue injection molding method improves efficiency and simplifies the process. The conductive glue may include a resin, such as epoxy resin or acrylic silicone, and a conductive filler, such as gold powder, silver powder, copper powder, or graphite, to form a conductive glue post 120a comprising a conductive material such as gold, silver, copper, and / or graphite. In this embodiment, the conductive glue post 120a is a pure silver conductive epoxy post.

[0060] Please continue to see Figure 2 The grounding structure 100 further includes a claw 130, which is disposed on the grounding plate 110. The claw 130 is used to improve the bonding strength between the grounding plate 110 and other components. For example, the claw 130 is embedded in the conductive adhesive post 120a, and the conductive adhesive post 120a improves the bonding strength between the grounding plate 110 and the grounding object. The first end of the claw 130 is connected to the grounding plate 110, and the second end of the claw 130 extends toward the grounding object. In this embodiment, claws 130 are provided at both end edges of the grounding plate 110, and the number of claws 130 at each edge is one or more, such as the four claws 130 shown in the figure. The claws 130 are integrally bent and formed with the grounding plate 110, and the claws 130 can be stamped using the stamping process.

[0061] Those skilled in the art will appreciate that the locations of the claws 130 are not limited to the ends of the grounding plate 110. The number, location, and shape of the claws 130 can be adaptively adjusted according to the requirements of different embodiments. For example, in one embodiment, claws 130 are not only provided at both ends of the grounding plate 110, but also at the location of at least one first through-hole 113a. In another embodiment, claws 130 are provided at the locations of some or all of the first through-holes 113a of the grounding plate 110. The provision of the claws 130 does not require a separate process; the claws 130 can be integrally formed when stamping the first through-holes 113a. That is, the claws 130 are stamped from the first side 111 of the grounding plate 110 toward the second side 112. In this way, the claws 130 extend toward the grounding target and can extend into the conductive pillar 120.

[0062] Based on the above embodiments, the grounding structure 100 of the present invention has the following beneficial effects: (1) The grounding structure 100 is configured as a grounding plate 110 having a first hole 113. A conductive post 120 is disposed within the first hole 113 and connected between the grounding plate 110 and the grounded object, thereby ensuring conductive connection between the grounding plate 110 and the grounded object. (2) The grounding plate 110 and the grounded object are connected via the conductive post 120, so that the first side 111 and the second side 112 of the grounding plate 110 are flat, thereby improving the overall strength of the grounding plate 110. Compared with the corrugated grounding plate 110 in the prior art, the flat grounding plate 110 in this embodiment is more convenient for installation and coordination with other components, reduces space in the height direction, and makes the overall structure more compact. Furthermore, it saves raw materials, reduces costs, and reduces the processing difficulty of the grounding plate 110, eliminating the need to worry about poor contact with the grounded object caused by excessive flatness of the grounding plate 110. (3) The coordinated structure of the conductive posts 120 and first holes 113 allows the grounding structure 100 to be used with a wider variety of grounding objects. This requires only the placement of corresponding first holes 113 and the corresponding number or size of conductive posts 120 based on the distribution of the grounding objects, thereby expanding the applicability and versatility of the grounding structure 100. (4) The claw structure provided on the grounding plate 110 further enhances the bonding strength between the grounding plate 110 and other components.

[0063] Based on the grounding structure 100 provided above, the present invention further discloses an application of the grounding structure 100, specifically an electrical connector. The electrical connector can be any known electrical connector in the prior art, that is, other structures of the electrical connector except the grounding structure 100 can adopt or refer to other structures of electrical connectors in the prior art. For example, in an exemplary electrical connector, it includes a first lead frame 200, a first terminal assembly 300 and a first grounding structure 100' (see Figure 5 It should be noted that the term “first” here is used to distinguish it from the term “second” contained in the electrical connector shown in another example below. In fact, the term “first” can also be removed, that is, the electrical connector includes a lead frame, a terminal assembly, and a grounding structure 100.

[0064] See Figure 4 and Figure 5The first lead frame 200 has a first side 201 and a second side 202. The first side 201 is oriented in the same direction as the first side 111 of the grounding plate 110, and the second side 202 is oriented in the same direction as the second side 112 of the grounding plate 110. The first lead frame 200 is used as a carrier of the terminal assembly to support and fix the terminal assembly. The first lead frame 200 can be integrally injection molded with the terminal assembly, or it can be molded first and then the terminal assembly can be inserted therein. The first lead frame 200 can be an insulator or an injection molded part, so the first lead frame 200 can also be called an insulating body or a plastic part.

[0065] The first terminal assembly 300 includes a signal terminal 30a and a ground terminal 30b, both of which are disposed on the second side 202 (the side facing away from the ground plate 110) of the first lead frame 200. The first ground structure 100' is disposed on the first side 201 (the side facing away from the first terminal assembly 300) of the first lead frame 200. In this embodiment, a subtle feature is that the first leadframe 200 is provided with a second hole 203 directly opposite the first hole 113. To facilitate connection between the conductive pillar 120 and the ground terminal 30b located on the second side surface 202 of the first leadframe 200, the second hole 203 is a through hole (hereinafter referred to as the second through hole 203a). The end of the second through hole 203a facing the ground plate 110 is connected to the first through hole 113a. The end of the second through hole 203a facing away from the ground plate 110 (the end facing the ground terminal 30b) encloses the ground terminal 30b to form a blind hole structure or a slot structure (the ground terminal 30b covers the end of the second through hole 203a facing away from the first through hole 113a). The conductive pillar 120 is inserted through the second through hole 203a and the first through hole 113a to connect to the ground plate 110. The conductive pillar 120 (the second end surface) is connected to the ground terminal 30b, which serves as the grounding target.

[0066] Please continue to see Figure 4 、 Figure 5 and Figure 6 As an example, the electrical connector includes a first component A (upper row component) and a second component B (lower row component), both of which can have the same structure and be mirror images (with the Z axis representing the vertical direction in the figure as a reference). The electrical connector also includes a main carrier 400 (or frame) that combines or constrains the first component A and the second component B to form an integral whole. When combined together, the first component A and the second component B are located on two opposite sides of the main carrier 400.

[0067] The first component A includes a first lead frame 200, a first terminal component 300 and a first grounding structure 100', and the second component B includes a second lead frame 200', a second terminal component 300' and a second grounding structure 100" with the same structure or function. The first terminal component 300 is arranged on the second side 202 (upper side) of the first lead frame 200, and the first grounding structure 100' is arranged on the first side 201 (lower side) of the first lead frame 200. The second component B is a mirror image of the first component A, so the second terminal component 300' is arranged on the second side 202 (lower side) of the second lead frame 200', and the second grounding structure 100" is arranged on the first side 201 (upper side) of the second lead frame 200'. For details of the first grounding structure 100' and the second grounding structure 100", please refer to the description of the grounding structure 100 mentioned above.

[0068] Based on the above structure, the first terminal assembly 300, the first lead frame 200, the first grounding structure 100', the second grounding structure 100", the second lead frame 200' and the second terminal assembly 300' are arranged in sequence from top to bottom. The grounding plates 110 of the first grounding structure 100' and the second grounding structure 100" can be attached to each other. Based on the matching relationship between the conductive column 120 and the first hole 113 mentioned above (the first end surface of the conductive column 120 is sunken into the first through hole 113a), a second gap J2 (the sum of the two first gaps J1) is formed between the first end surface (lower end surface) of the conductive column 120 of the first grounding structure 100' and the first end surface (upper end surface) of the conductive column 120 of the second grounding structure 100". Of course, the conductive column 120 of the first grounding structure 100' and the conductive column 120 of the second grounding structure 100" can be completely connected to further improve the conductive connection performance.

[0069] Since the first component A and the second component B have the same structural design, the first component A is taken as an example to explain them in detail below.

[0070] The first terminal assembly 300 includes a signal terminal 30a and a ground terminal 30b (collectively, the signal terminals 30a and ground terminals 30b). Multiple signal terminals 30a and ground terminals 30b can be provided. Multiple signal terminals 30a and multiple ground terminals 30b are spaced apart along the X-axis, with a third gap J3 between each pair of adjacent terminals. The length (central axis) of each signal terminal 30a and ground terminal 30b is distributed along the Y-axis. Therefore, the Y-axis can be used as the mating direction of the electrical connector and its first terminal assembly 300. The end that mates with the mating electrical connector can be referred to as the front end (one end in the Y-axis), while the end away from the front end can be referred to as the rear end (the other end in the Y-axis).

[0071] The signal terminals 30a are arranged in pairs of two, and a ground terminal 30b is provided on both sides of each signal pair. The ground terminals prevent crosstalk between high-frequency signal differential pairs in the same row. The signal pairs can be configured as high-frequency signal differential pairs. In the first terminal assembly 300 arranged along the entire X-axis, the terminals on the two sides are ground terminals 30b. If S represents the signal terminal 30a and G represents the ground terminal 30b, the first terminal assembly 300 can be arranged according to GSS. Of course, the arrangement and combination of the signal terminals 30a and the ground terminals 30b is not limited to this. For example, they can also be arranged according to SGS, SSG, etc.

[0072] See Figure 7 The shapes of the signal terminals 30a and ground terminals 30b can be modified according to their positions along the X-axis to accommodate different implementations. For example, in this embodiment, the intermediate signal terminals 30a and / or intermediate ground terminals 30b (collectively, intermediate terminals 310) located in the middle region along the X-axis are straight and "single" shaped. The signal terminals 30a and / or ground terminals 30b located on the first side of the intermediate terminals 310 (collectively, first side terminals 320) have the following structure: the first side terminals 320 have a first straight section 301 extending along the Y-axis, an inclined section 302 extending forward from one end of the first straight section 301 and toward the intermediate terminals 310, and a second straight section 303 extending straight forward from the inclined section 302 along the Y-axis. The signal terminals 30a and / or ground terminals 30b (collectively referred to as second-side terminals 330) located on the second side of the intermediate terminal 310 are arranged symmetrically with the first-side terminals 320, with the intermediate terminal 310 as the line of symmetry. Specifically, the second-side terminals 330 also have a first straight section 301 extending along the Y-axis, an inclined section 302 extending forward from the first straight section 301 and toward the intermediate terminal 310, and a second straight section 303 extending straight forward from the inclined section 302.

[0073] See Figure 8To facilitate direct connection of each grounding terminal 30b to the grounding plate 110 of the first grounding structure 100' to establish an electrical path, the front end of each grounding terminal 30b (the end away from the first straight section 301) is bent toward the grounding plate 110 (downward in the figure) to form a bent section 304. The intersection of this bent section 304 and the front end of the terminal (the front end of the second straight section 303) forms a first bent portion 3041. The side (lower side) of the bent section 304 facing the grounding plate 110 can be directly welded to the second side 112 of the grounding plate 110. Alternatively, the bending section 304 further extends forward (away from the first straight section 301) to form a connecting section 305, and a second bending portion 3042 is formed at the intersection of the connecting section 305 and the bending section 304. A side of the connecting section 305 facing the grounding plate 110 is welded to the second side 112 of the grounding plate 110, thereby increasing the welding area and improving the connection stability.

[0074] See Figure 9 The first leadframe 200 has side ribs 210 on both sides of its X-axis edge. A center rib 220 is formed on the second side 202 of the first leadframe 200, facing the terminal, at a position directly opposite the third gap. Both the side ribs 210 and the center ribs 220 protrude from the second side 202 of the first leadframe 200. Receiving slots 230 for receiving corresponding terminals are formed between each side rib 210 and the adjacent center rib 220, and between two adjacent center ribs 220. The receiving slots 230 are through-slots extending along the length of the terminal. When a terminal is received in the receiving slots 230, it is exposed on the second side 202 of the first leadframe 200. Depending on the type of terminal it receives, the receiving slots 230 can be referred to as signal receiving slots 230a or ground receiving slots 230b. The signal receiving slot 230a is used to receive a signal terminal 30a, while the ground receiving slot 230b is used to receive a ground terminal 30b.

[0075] See Figure 10 and Figure 10aCorresponding to the bent section 304 and the connecting section 305, the front end surface of the grounding receiving groove 230 conforms to the corresponding side surfaces of the first bent portion 3041, the bent section 304, and the second bent portion 3042. Specifically, the front end of the grounding receiving groove 230 includes a first contouring surface 231 that conforms to the adjacent surface of the first bent portion 3041, a second contouring surface 232 that conforms to the adjacent surface of the bent section 304 (the surface in contact with the grounding receiving groove 230), and a third contouring surface 233 that conforms to the adjacent surface of the second bent portion 3042. The first contouring surface 231 is a convex contouring surface, while the third contouring surface 233 is a concave contouring surface. Both the first and second bent portions 3041, 3042 have rounded corners, resulting in the first contouring surface 231 being a convex curved surface and the second contouring surface 232 being a concave curved surface. The second contoured surface 232 gradually bends downward and forward, forming a sharp corner 234 between it and the first side surface 201 of the first lead frame 200 (the side facing the grounding plate 110). When the first side surface 201 of the first lead frame 200 is placed on the second side surface 112 of the grounding plate 110, the tip of the sharp corner 234 smoothly transitions to the second side surface 112 of the grounding plate 110. In this way, the grounding terminal 30b can be seamlessly fitted with the second side surface 202 of the first lead frame 200 and the second side surface 112 of the grounding plate 110, thereby improving the bonding stability and the terminal stability.

[0076] See Figure 9 and Figure 11 The second side surface 202 of the first lead frame 200 has positioning protrusions 240 distributed along the X-axis direction. The positioning protrusions 240 span the side ribs 210 and the middle ribs 220. The first side surface 201 of the first lead frame 200 has a recessed portion 250 for accommodating and positioning the grounding plate 110. The recessed portion 250 is recessed from the first side surface 201 of the first lead frame 200 toward the second side surface 202. The shape of the recessed portion 250 is compatible with the grounding plate 110. In the illustrated embodiment, a stop portion 260 is formed on one side of the edge of the first lead frame 200 along the Y-axis direction (the rear edge of the first lead frame 200, on the same side as the first straight section 301). The stop portion 260 can be distributed along the X-axis direction at the rear edge of the first lead frame 200. The blocking portion 260 can be in a block or strip structure. The blocking portion 260 makes the first side surface 201 of the first lead frame 200 form an L shape, which has a lower lower surface and a higher upper surface. The lower surface area serves as the recessed position 250, and the side elevation of the blocking portion 260 facing the lower surface forms a limit for the grounding plate 110 of the first grounding structure 100'.

[0077] The first side surface 201 of the first lead frame 200 is further provided with a positioning structure. The positioning structure can be assembled with the grounding plate 110 of the first grounding structure 100 ′ for positioning. The positioning structure can also be installed and positioned when assembled with the second component B. The positioning structure can be, for example, a positioning post 271 and / or a positioning hole 272 provided on the first side surface 201 of the first lead frame 200 .

[0078] See Figure 12 To enhance the bonding strength between the first leadframe 200, first terminal assembly 300, and first ground structure 100' and the main carrier 400, the front ends of the grounding plate 110, the signal terminals 30a, and the grounding terminals 30b (the ends distal from the first straight section 301) all extend beyond the front side of the first leadframe 200 along the Y-axis. The front end of the grounding terminal 30b can be flush with the front end of the grounding plate 110, while the front end of the signal terminal 30a is positioned slightly rearward. The grounding plate 110, the signal terminals 30a, and the grounding terminals 30b all extend beyond their respective leadframes along the Y-axis, and the extended ends of the grounding terminals 30b are welded to the grounding plate 110. An embedded space S1 is formed between the signal terminals 30a and the grounding plate 110, and the main carrier 400 is embedded within this embedded space S1 to bond with them.

[0079] In this embodiment, the dimension of the first grounding structure 100' (grounding plate 110) in the X-axis direction can be smaller than the dimension of the first leadframe 200 in the X-axis direction. With this configuration, when the first component A and the second component B are combined, the edges of the first and second grounding structures 100' and 100" along the X-axis can be recessed between the first and second leadframes 200 and 200'. That is, the first side surface 201 of the first leadframe 200, the edges of the first and second grounding structures 100' and 100", and the first side surface 201 of the second leadframe 200' form a recessed space S2, which can provide multiple bonding surfaces with the main carrier 400 to improve bonding strength. The main carrier 400 (the fifth covering portion described below) can be embedded in this recessed space S2 to bond thereto. Furthermore, the grounding plate 110 can be configured to be smaller than the size of its respective leadframe, which can reduce the manufacturing cost of the grounding plate 110 while ensuring connection with all grounding terminals 30b. In addition, the claws 130 bent at both ends of the grounding plate 110 have a certain size and protrude outward from the end surfaces of the grounding plate 110 along the X-axis direction to form multiple concave-convex bonding surfaces S21. The multiple concave-convex bonding surfaces S21 constitute a natural concave-convex structure, further increasing the bonding surface with the main carrier 400 and further improving the bonding force.

[0080] See Figure 4 、 Figure 5 and Figure 13 The main carrier 400 is used to combine the first component A and the second component B into a whole. The main carrier 400 can be combined with the first component A and the second component B by injection molding, or it can be molded first and then assembled with the first component A and the second component B into a whole.

[0081] The main carrier 400 can be an insulator or an injection-molded part. The main carrier 400 can shield the portions of the first grounding structure 100' and the second grounding structure 100" that are exposed from their respective lead frames. The main carrier 400 is also used to bind the first component A and the second component B together. The main carrier 400 is also used to allow each terminal to be at least partially exposed. The main carrier 400 has a first opening 401 extending rearward along the Y-axis direction and a second opening 402 that allows the second side surfaces (side surfaces facing away from each other) of the first component A and the second component B to be partially exposed.

[0082] In this embodiment, the main carrier 400 has a first covering portion 410 covering the second side surface of the first component A (the side facing away from the second component B) along the X-axis direction, a second covering portion 420 covering the second side surface of the second component B (the side facing away from the first component A), a third covering portion 430 and a fourth covering portion 440 covering the first component A and the second component B toward both end surfaces respectively, and a fifth covering portion 450 covering the front end of the first component A and the second component B (the end where the grounding terminal 30b is welded to the grounding plate 110).

[0083] In the Y-axis direction, the dimensions of the first and second covering portions 410, 420 are smaller than those of the first and second components A, B. Furthermore, the first and second covering portions 410, 420 are located in the middle of the Y-axis, separating the first and second components A, B, into a mating portion located at the front and a mounting portion located at the rear. Based on this, the electrical connector includes a mating portion located at the front of the first covering portion 410 and a mounting portion located at the rear of the second covering portion 420, depending on their position and function. The mating portion is designed to complement and mate with a mating electrical connector, and the mounting portion can be connected to a board end to form a board-end connector, or it can be connected to a wire end to form a wire-end connector.

[0084] In this embodiment, the first covering portion 410 is positioned to correspond to the positioning protrusion 240 on the second side 202 of the first lead frame 200, and the second covering portion 420 is positioned to correspond to the positioning protrusion 240 on the second side 202 of the second lead frame 200'. Both the first covering portion 410 and the second covering portion 420 are provided with a mating groove 421, which is mated with the positioning protrusion 240 in a concave-convex manner to increase the bonding area.

[0085] In this embodiment, since each terminal protrudes from the corresponding second side surface 202 of the lead frame, avoidance grooves 422 are further formed on the first covering portion 410 and the second covering portion 420 at positions corresponding to each terminal.

[0086] The third covering portion 430 and the fourth covering portion 440 have the same or similar structure or function, and both have shielding portions 431 and 441 that extend into the concave space S2 to shield the first grounding structure 100' and the second grounding structure 100". The shielding portions 431 and 441 of the third covering portion 430 and the fourth covering portion 440 cover the two end edges of the two grounding plates 110 and wrap the claws 130 at the two end edges of the two grounding plates 110. Since the claws 130 protrude outward from the two end edges of the grounding plate 110, a plurality of concave portions are formed. The convex bonding surface S21 is coupled to the corresponding third and fourth covering portions 430, 440, thereby increasing the bonding force therebetween. The third and fourth covering portions 430, 440 further include connecting portions 432, 442 connected to the rear sides of the shielding portions 431, 441. The connecting portions 432, 442 are connected to both the first and second covering portions 410, 420. The connecting portions 432, 442, together with the first and second covering portions 410, 420, form a covering frame that covers the outer periphery of the first and second components along the X-axis.

[0087] The fifth covering portion 450 has a guide portion 45a. Each side surface of the guide portion 45a is inclined forward and toward the center to form an inclined guide surface. This inclined guide surface improves the ease of plugging and mating with the mating electrical connector. The fifth covering portion 450 has a recess 453 for the grounding plate 110 to be inserted into. The recess 453 divides the fifth covering portion 450 into a first portion 451 and a second portion 452, which are arranged side by side along the Z-axis. The first portion 451 and the second portion 452 extend rearward into the insertion space S1 of the first component A and the second component B, respectively. The rear side surfaces of the first portion 451 and the second portion 452 respectively tightly mate with the first lead frame 200 and the second lead frame 200'. Signal covering grooves 451a and 452a are provided on the second side surfaces of the first portion 451 and the second portion 452 at locations corresponding to the front ends of the signal terminals 30a (the portions extending beyond the front ends of their respective leadframes). The front ends of the signal terminals 30a are positioned within the signal covering grooves 451a and 452a, with their second sides exposed. Ground covering grooves 451b and 452b are provided on the second side surfaces of the first portion 451 and the second portion 452 at locations corresponding to the ground terminals 30b. The ground covering grooves 451b and 452b are connected in height to the embedding groove 453 and follow the contours of the front ends (the bent sections 304 and the joining sections 305) of the ground terminals 30b.

[0088] Based on the above embodiments, the electrical connector of the present invention can be manufactured in the following manner:

[0089] Manufacturing of the first component A: (1) performing an injection molding process to integrally mold the first terminal component 300 and the first lead frame 200; performing a dispensing process to inject conductive glue into the first hole 113 of the grounding plate and the second hole 203 of the first lead frame 200, and after curing, forming a conductive column 120 connected to the first hole 113, the second hole 203 and the grounding terminal 30b of the first terminal component 300. As an example, the signal terminal 30a and the ground terminal 30b are placed in an injection mold, and the signal terminal 30a, the ground terminal 30b and the first lead frame 200 are integrally injection molded. During the injection molding process, the injection mold has a pressure column that presses the signal terminal 30a and the ground terminal 30b to prevent them from being displaced. Therefore, after molding, the first lead frame 200 is formed with pressure holes 204 at positions corresponding to the signal terminal 30a and the ground terminal 30b; wherein, the pressure hole position 204 on the first lead frame 200 corresponding to the ground terminal 30b is the second through hole 203a described above. In this way, the problem of the ground terminal 30b being displaced is solved while achieving the function of the second through hole 203a, avoiding secondary hole drilling and reducing the complexity of the manufacturing process; (ii) The grounding plate 110 is placed on the first side surface 201 of the first lead frame 200 and the first through hole 113a of the grounding plate 110 is aligned with the second through hole 203a on the first lead frame 200. In this step, the claws 130 at both ends of the grounding plate 110 are aligned with the second through holes 203a at both end edges of the first lead frame 200 so that each claw 130 extends into the corresponding second through hole 203a. Conductive glue is injected into each first through hole 113a and the aligned second through hole 203a. After the conductive glue is cured, a conductive glue column 120a is formed. The conductive glue column 120a not only performs a conductive function but also adheres to the grounding plate 110, the first lead frame 200 and the ground terminal 30b, further increasing the bonding strength therebetween.

[0090] (2) Manufacturing of Second Component B: An injection molding process is performed to integrally mold the second terminal assembly 300' and the second lead frame 200'. A dispensing process is performed to inject conductive glue into the first hole 113 of the grounding plate and the second hole 203 of the second lead frame 200'. After curing, conductive glue is formed to form conductive posts 120 connected to the first hole 113, the second hole 203, and the ground terminal 30b of the second terminal assembly 300'. The manufacturing steps for the second component B are the same as those for the first component A. The second component B is obtained by rotating the first component A 180 degrees.

[0091] (3) Component combination: Perform an injection molding process, place the first component A and the second component B into an injection mold, and laminate the grounding sheet sides of the first component A and the second component B together, and then perform injection molding to obtain a main carrier 400 that holds the first component A and the second component B as a whole.

[0092] In summary, the electrical connector and its manufacturing method of the present invention have the following beneficial effects: (1) Improved anti-crosstalk performance: Each ground terminal 30b is connected to the ground plate 110 via a conductive post 120, resolving the problem of unstable contact caused by various factors in the prior art corrugated ground plate 110, such as manufacturing and its own elasticity. This improves the connection performance between the ground terminal 30b and the ground plate 110, allowing noise signals to quickly return through the ground, thereby improving the anti-crosstalk performance of the electrical connector. (2) Optimization and reduction of manufacturing process complexity: The ground plate 110 only needs to be made into a conventional sheet structure, and a hole-making process is added during its manufacturing process. This simplifies the manufacturing process and eliminates the need to consider the tolerance of the corrugated ground plate 110. (3) The second through-hole 203a on the first lead frame 200 and the second lead frame 200' serves as the punching position 204 during the injection molding process. This not only solves the problem of terminal deviation during the injection molding process, but also realizes the function of the second through-hole 203a. It eliminates the need for two separate hole-making processes, simplifies the manufacturing process, and solves the problem of terminal deviation. (4) The claw structures at both ends of the grounding plate 110 can not only enhance the bonding force between the grounding plate 110, the lead frame and the terminal, but also form multiple concave and convex bonding surfaces S21 at the edges of both ends of the grounding plate 110, thereby enhancing the bonding force between the first component A and the second component B and the main carrier 400, improving the connection strength and stability of the electrical connector, and increasing the service life of the electrical connector.

[0093] The above embodiments merely represent preferred embodiments of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. An electrical connector, comprising a first component, a second component, and a main carrier connecting the first component and the second component together, wherein the first component comprises a first leadframe, a first ground structure disposed on a first side of the first leadframe, and a first terminal assembly disposed on a second side of the first leadframe; the second component comprises a second leadframe, a second ground structure disposed on a first side of the second leadframe, and a second terminal assembly disposed on a second side of the second leadframe; the first terminal assembly and the second terminal assembly each comprising a signal terminal and a ground terminal; and characterized in that: The first grounding structure and the second grounding structure both include a grounding plate and a conductive column, and a plurality of first holes are provided on the grounding plate at positions corresponding to the grounding terminals; the first lead frame and the second lead frame are provided with second holes at positions corresponding to the first holes, the conductive columns are connected to the first holes, and the conductive columns are also connected to the grounding terminals through the second holes.

2. The electrical connector according to claim 1, wherein: The first hole and the second hole are respectively configured as a first through hole and a second through hole, the first end of the second through hole is coaxially connected to the first through hole, and the second end of the second through hole is opposite to the ground terminal; the conductive column is configured as a conductive glue column, the conductive glue column is bonded to the first through hole and the second through hole, and the conductive glue column is also bonded to the ground terminal.

3. The electrical connector according to claim 2, wherein: The first component and the second component are mirror images of each other, the first sides of the first component and the second component are opposite to each other, and the second sides of the first component and the second component are opposite to each other; the grounding plate of the first grounding structure and the grounding plate of the second grounding structure are stacked and in contact with each other; The conductive posts of the first grounding structure and the second grounding structure are both sunk into the first through holes of their respective grounding sheets, so that when the two grounding sheets are stacked together, a second gap is formed between the first end faces of the two conductive posts; or the first end faces of the conductive posts of the first grounding structure and the second grounding structure are both flush with the first side faces of their respective grounding sheets, so that when the two grounding sheets are stacked together, the first end faces of the two conductive posts are in contact.

4. The electrical connector according to claim 1, wherein: The grounding plate is provided with claws; claws are provided on both end edges of the grounding plate; a first end of the claw is connected to the grounding plate, and a second end extends toward the grounding terminal.

5. The electrical connector according to claim 2, wherein: A claw is provided on the grounding plate at a position corresponding to at least one of the first through holes, the claw being integrally stamped when the first through hole is stamped, and the claw is stamped through the first side surface of the grounding plate toward the second side surface; The claw extends toward the ground terminal, and the claw is capable of extending into the conductive post; A plurality of concave and convex joint surfaces are formed between the claws at the two end edges of the grounding piece and the two end surfaces of the grounding piece.

6. The electrical connector according to claim 2, wherein: The first lead frame and the first terminal assembly are injection molded, and the second lead frame and the second terminal assembly are injection molded; the first lead frame and the second lead frame are both formed with press-fitting positions corresponding to the signal terminals and the grounding terminals at positions for preventing the terminals from being displaced during the injection molding process; the press-fitting position of the grounding terminal forms the second through hole.

7. The electrical connector according to claim 1, wherein: The first side surfaces of the first lead frame and the second lead frame each have a recessed portion for accommodating and positioning a corresponding grounding plate; A stopper is formed on one side edge of the first lead frame and the second lead frame along the first direction, and the stopper constrains the first side surface of the corresponding lead frame to have a lower lower surface and a higher upper surface, and the lower surface area forms a recessed position for accommodating and positioning the corresponding ground plate; The first side surfaces of the first lead frame and the second lead frame are both provided with positioning posts and positioning holes. The positioning posts of the first lead frame are positioned and matched with the positioning holes of the second lead frame, and the positioning holes of the first lead frame are positioned and matched with the positioning posts of the second lead frame. Positioning holes for the corresponding positioning posts to pass through are provided at positions corresponding to the positioning posts and positioning holes on the two grounding plates.

8. The electrical connector according to claim 1, wherein: The first grounding structure and the second grounding structure are sandwiched between the first lead frame and the second lead frame; the first grounding structure and the second grounding structure are recessed between the first lead frame and the second lead frame at both end edges along the first direction, so that a recessed space is formed between the two end edges of the two grounding plates and the first side surface of the first lead frame and the first side surface of the second lead frame; the main carrier extends into the recessed space and is combined with it.

9. The electrical connector according to claim 1, wherein: The first terminal assembly and the second terminal assembly are respectively distributed on the first lead frame and the second lead frame along the first direction, and the length of each terminal of the first terminal assembly and the second terminal assembly extends along the second direction; the grounding plate, the signal terminal and the front end of the grounding terminal all extend out of the corresponding lead frame along the second direction, and the front end of the grounding terminal is welded to the grounding plate; an embedded space is formed between the signal terminal and the grounding terminal and the corresponding grounding plate, and the main carrier is also embedded in the embedded space to be combined with it.

10. The electrical connector according to claim 1, wherein: Both the first terminal assembly and the second terminal assembly include several groups of high-frequency signal differential pairs and grounding terminals arranged on both sides of the high-frequency signal differential pairs. The grounding terminals prevent crosstalk between high-frequency signal differential pairs in the same row. Along the length extension direction of the grounding terminals, the grounding plate and the first lead frame and the second lead frame are respectively provided with at least two first holes and second holes. The conductive columns are provided in the first holes and the second holes so that the crosstalk signals on the grounding terminals can be introduced into the grounding plate nearby.

11. A method for manufacturing an electrical connector, characterized in that: include: Manufacturing a first assembly: performing an injection molding process to injection-mold the first terminal assembly into a first lead frame that holds the first terminal group as a whole; Performing a dispensing process to inject conductive glue into the first hole of the grounding plate and the second hole of the first lead frame, and forming a conductive post connected to the first hole, the second hole and the grounding terminal of the first terminal assembly after curing; Providing a second component: rotating a first component 180 degrees to obtain a second component; Component combination: perform an injection molding process, stack and bond one side of the grounding sheet of the first component and the second component together, and then perform injection molding to obtain a main carrier that holds the first component and the second component as a whole.

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