Electrical conduction structure of flexible substrate circuit board

Abstract

The invention discloses an electrical conduction structure of a flexible substrate circuit board. The electrical conduction structure comprises a flexible substrate, a circuit layer, at least one welding structure and an electrical connection structure, the flexible substrate comprises a first surface, a second surface, a side surface and a plurality of grooves, the first surface and the second surface are oppositely arranged, the side surface is connected with the first surface and the second surface, and the grooves are formed in the side surface and are connected with the first surface and the second surface. The circuit layer is formed on the first surface, and at least one conductive structure is formed at the position, close to the side face of the flexible base material, of the circuit layer. The welding structure is arranged on the second surface of the flexible substrate. The electrical connection structure connects the conductive structure and the welding structure, and the electrical connection structure extends from the first surface to the second surface of the flexible substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board structures, and in particular to an electrical conduction structure of a flexible substrate circuit board. Background Art

[0002] Thinness is the current design trend in electronic products. Consequently, multiple electronic modules must be placed within a confined space. Consequently, flexible circuit boards or cables are essential for connecting these modules. Existing flexible circuit boards feature a single-sided circuit layer, making them impractical for designs where both the circuit layer and soldering structures must be located on two surfaces. Therefore, achieving electrical continuity after forming the circuit layer and soldering structures on both surfaces of a flexible substrate is a key development direction for flexible circuit boards. Summary of the Invention

[0003] In view of this, an object of the present invention is to provide an electrical conduction structure of a flexible substrate circuit board, which solves the problem of how to conduct the circuits on both sides of the flexible substrate circuit board.

[0004] The present invention provides an electrical conduction structure for a flexible substrate circuit board, comprising a flexible substrate, a circuit layer, at least one soldering structure, and an electrical connection structure. The flexible substrate comprises a first surface, a second surface, a side surface, and a plurality of grooves. The first surface and the second surface are disposed opposite each other, the side surface connects the first and second surfaces, and the grooves are formed on the side surface and connect the first and second surfaces. The circuit layer is formed on the first surface, and the circuit layer forms at least one conductive structure near the side surface of the flexible substrate. The soldering structure is disposed on the second surface of the flexible substrate. The electrical connection structure connects the conductive structure and the soldering structure, and the electrical connection structure extends from the first surface to the second surface of the flexible substrate.

[0005] In another embodiment, the electrical connection structure includes at least one conductor layer. The conductor layer is formed on the groove wall of the groove, and the conductor layer is connected to the conductive structure and the welding structure.

[0006] In another embodiment, the flexible substrate further includes at least one through hole, which penetrates the flexible substrate and connects the first surface and the second surface. The electrical connection structure includes a conductor layer formed on the hole wall of the through hole, and the conductor layer is connected to the conductive structure and the welding structure.

[0007] In another embodiment, the electrical connection structure includes a plurality of conductive layers, and the conductive layers are further formed on the walls of at least one groove.

[0008] In another embodiment, the flexible substrate further includes at least one accommodating recess formed on the first surface. The conductive structure is disposed in the accommodating recess and is flush with the first surface.

[0009] In another embodiment, the conductive structure is a metal bump disposed on the first surface.

[0010] In another embodiment, the welding structure is a metal bump disposed on the second surface.

[0011] In another embodiment, the conductive structure is a conductive node disposed on the first surface.

[0012] The electrical conductive structure of the flexible substrate circuit board provided by the present invention is achieved by forming grooves and / or through holes on the side of the flexible substrate, and forming electrical connection structures connecting the circuit layers and the welding structures in the grooves and / or through holes, thereby connecting the circuit layers and the welding structures arranged on the two surfaces of the flexible substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional diagram of a first embodiment of the electrical conduction structure of a flexible substrate circuit board of the present invention.

[0014] Figure 2 yes Figure 1 A three-dimensional view from another perspective of the electrical conductive structure of the flexible substrate circuit board.

[0015] Figure 3 yes Figure 1 Sectional view along line AA.

[0016] Figure 4 It is a cross-sectional view of a second embodiment of the electrical conduction structure of a flexible substrate circuit board according to the present invention.

[0017] Figure 5 It is a cross-sectional view of a third embodiment of the electrical conduction structure of a flexible substrate circuit board according to the present invention.

[0018] Figure 6 FIG. 4 is a cross-sectional view of a fourth embodiment of the electrical conduction structure of a flexible substrate circuit board according to the present invention.

[0019] Figure 7 FIG. 5 is a cross-sectional view of a fifth embodiment of the electrical conduction structure of a flexible substrate circuit board according to the present invention.

[0020] Explanation of reference numerals: 10 - flexible substrate; 11 - first surface; 12 - second surface; 13 - side surface; 14 - groove; 15 - receiving recess; 16 - through hole; 20 - circuit layer; 21 - conductive structure; 30 - welding structure; 40 - electrical connection structure; 41 - conductor layer. DETAILED DESCRIPTION

[0021] See also Figure 1 、 Figure 2 and Figure 3, which shows a first embodiment of the electrical conductivity structure of a flexible substrate circuit board according to the present invention. The electrical conductivity structure of the flexible substrate circuit board of this embodiment includes a flexible substrate 10, a circuit layer 20, at least one soldering structure 30, and an electrical connection structure 40. The flexible substrate 10 includes a first surface 11, a second surface 12, a side surface 13, and a plurality of grooves 14. The first surface 11 and the second surface 12 are arranged opposite each other, and the side surface 13 connects the first surface 11 and the second surface 12. A plurality of grooves 14 are formed on the side surface 13 and connect the first surface 11 and the second surface 12. The groove walls of the grooves 14 are formed in an arc shape. The process of forming the grooves 14 can be to first drill a plurality of circular holes in the flexible substrate 10, and then cut the flexible substrate 10 along a line passing through the center of the circular holes, thereby forming the semi-hole-shaped grooves 14, commonly known as stamp holes.

[0022] A circuit layer 20 is formed on the first surface 11, forming a conductive structure 21 near the side surface 13 of the flexible substrate 10. The flexible substrate 10 of this embodiment also includes a plurality of receiving recesses 15 formed on the first surface 11. The receiving recesses 15 of this embodiment are rectangular and connected to the groove 14. The conductive structure 21 is disposed within the receiving recesses 15 and is flush with the first surface 11. In other embodiments, the conductive structure 21 may also be a metal bump formed on the first surface 11.

[0023] The welding structure 30 is disposed on the second surface 12 of the flexible substrate 10 . In this embodiment, the welding structure 30 is a metal bump formed on the second surface 12 , and the welding structure 30 is connected to the groove 14 .

[0024] The electrical connection structure 40 connects the conductive structure 21 and the soldering structure 30. In this embodiment, the electrical connection structure 40 includes a conductive layer 41. The conductive layer 41 is formed on the groove wall of the groove 14 and extends from the first surface 11 to the second surface 12 of the flexible substrate 10. The conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, thereby forming an electrical connection between the conductive structure 21 and the soldering structure 30.

[0025] In this embodiment, the circuit layer 20, the soldering structure 30, and the electrical connection structure 40 are formed on the flexible substrate 10 by an electroplating process. The circuit layer 20, the soldering structure 30, and the electrical connection structure 40 may be made of copper.

[0026] See also Figure 4, which represents a second embodiment of the electrical conduction structure of a flexible substrate circuit board according to the present invention. This embodiment has a partially identical structure to the first embodiment, and therefore identical components are given the same reference numerals and their descriptions are omitted. This embodiment differs from the first embodiment in that the side surface 13 of the flexible substrate 10 of this embodiment does not include the groove 14. The flexible substrate 10 of this embodiment has a through-hole 16. The conductive layer 41 of the electrical connection structure 40 of this embodiment is formed on the wall of the through-hole 16. The conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, thereby electrically connecting the conductive structure 21 and the soldering structure 30. In this embodiment, the circuit layer 20, soldering structure 30, and electrical connection structure 40 are formed on the flexible substrate 10 using an electroplating process. The circuit layer 20, soldering structure 30, and electrical connection structure 40 can be made of copper.

[0027] See also Figure 5 , which shows a third embodiment of the electrical conductive structure of a flexible substrate circuit board according to the present invention. This embodiment has some of the same structures as the first embodiment, so identical components are given the same reference numerals and their descriptions are omitted. The difference between this embodiment and the first embodiment lies in that, in addition to the groove 14 provided on the side surface 13 of the flexible substrate 10 of this embodiment, the flexible substrate 10 of this embodiment also has a through-hole 16. The conductive layer 41 of the electrical connection structure 40 of this embodiment is formed on the walls of the groove 14 and the walls of the through-hole 16. The conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, thereby forming an electrical connection between the conductive structure 21 and the soldering structure 30. In this embodiment, the circuit layer 20, soldering structure 30, and electrical connection structure 40 are formed on the flexible substrate 10 using an electroplating process. The circuit layer 20, soldering structure 30, and electrical connection structure 40 can be made of copper.

[0028] See also Figure 6 , which illustrates a fourth embodiment of the electrical conductivity structure for a flexible substrate circuit board according to the present invention. This embodiment shares some of the same structure as the first embodiment; therefore, identical components are given the same reference numerals and their descriptions are omitted. This embodiment differs from the first embodiment in that the conductive structure 21 is a conductive node formed on the first surface 11, while the conductive layer 41 of the electrical connection structure 40 is formed on the walls of the groove 14. The conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, thereby forming an electrical connection between the conductive structure 21 and the soldering structure 30.

[0029] See also Figure 6, which illustrates a fifth embodiment of the electrical conductivity structure for a flexible substrate circuit board according to the present invention. This embodiment shares some of the same structure as the second embodiment; therefore, identical components are given the same reference numerals and their descriptions are omitted. This embodiment differs from the second embodiment in that the conductive structure 21 is a conductive node formed on the first surface 11, while the conductive layer 41 of the electrical connection structure 40 is formed on the walls of the groove 14. The conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, thereby forming an electrical connection between the conductive structure 21 and the soldering structure 30.

[0030] The flexible substrate circuit board electrical conductive structure provided by the present invention utilizes grooves and / or through-holes formed on the side of a flexible substrate, with electrical connections formed within the grooves and / or through-holes to connect the circuit layers and soldering structures disposed on both surfaces of the flexible substrate. This electrically conductive structure connects the circuit layers and soldering structures using a simple manufacturing process and eliminates the need for complex manufacturing processes such as flexible flat cables (FFCs), allowing for application in thinner electronic devices.

[0031] The above description is only a preferred embodiment of the present invention, and it cannot be used to limit the scope of implementation of the present invention. That is, simple equivalent changes and modifications made according to the claims and description of the present invention are still within the scope of the present invention. In addition, any embodiment or claim of the present invention does not need to achieve all the purposes, advantages or features provided by the present invention. In addition, the abstract and title are only used to assist in searching patent documents and are not used to limit the scope of protection of the present invention. In addition, the terms "first", "second", etc. mentioned in the description or claims of the present invention are only used to name the elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

Claims

1. A flexible substrate circuit board electrical conduction structure, characterized in that: include: A flexible substrate comprising a first surface, a second surface, a side surface, and a plurality of grooves, wherein the first surface and the second surface are disposed opposite each other, the side surface connects the first surface and the second surface, and the plurality of grooves are formed on the side surface and connect the first surface and the second surface; a circuit layer formed on the first surface, wherein the circuit layer forms at least one conductive structure at a position close to the side surface of the flexible substrate; At least one welding structure is disposed on the second surface of the flexible substrate; and An electrical connection structure connects the at least one conductive structure and the at least one welding structure, and the electrical connection structure extends from the first surface to the second surface through the plurality of grooves.

2. The flexible substrate circuit board electrical conduction structure according to claim 1, wherein: The flexible substrate further includes at least one through hole that penetrates the flexible substrate and connects the first surface and the second surface. The electrical connection structure is formed on a hole wall of at least one through hole and is connected to the at least one conductive structure and the at least one welding structure.

3. The flexible substrate circuit board electrical conduction structure according to claim 1, wherein: The electrical connection structure includes at least one conductor layer formed on a groove wall of at least one groove, and the at least one conductor layer is connected to the at least one conductive structure and the at least one welding structure.

4. The flexible substrate circuit board electrical conduction structure according to claim 3, wherein: The electrical connection structure includes a plurality of conductor layers, and the plurality of conductor layers are formed on a groove wall of at least one of the grooves.

5. The flexible substrate circuit board electrical conduction structure according to claim 1, wherein: The flexible substrate further includes at least one accommodating recess formed on the first surface. The at least one conductive structure is disposed in the at least one accommodating recess and is flush with the first surface.

6. The flexible substrate circuit board electrical conduction structure according to claim 1, wherein: The at least one conductive structure is a metal bump disposed on the first surface.

7. The flexible substrate circuit board electrical conduction structure according to claim 1, wherein: The at least one welding structure is a metal bump disposed on the second surface.

8. The flexible substrate circuit board electrical conduction structure according to claim 1, wherein: The at least one conductive structure is a conductive node disposed on the first surface.

Images