Chip transfer device, chip transfer method and chip

Abstract

The invention provides a chip transfer device, a chip transfer method and a chip, the chip transfer device comprises at least one sub-transfer device, and the sub-transfer device comprises a main body structure and a chip fixing assembly. The main body structure comprises a plurality of cavities, and the cavities are used for containing color conversion materials; the cavity is provided with a discharge hole in the first side of the main body structure, and the color conversion material in the cavity flows out through the discharge hole; the chip fixing assembly is arranged on the first side of the main body structure and used for fixing the chip unit in the chip unit transferring process. According to the chip transfer device, the color conversion layer is prepared in the chip transfer process, the manufacturing process is simplified, and the manufacturing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a chip transfer device, a chip transfer method, and a chip. Background Art

[0002] With the development of display technology, MiniLED (sub-millimeter light-emitting diode) and MicroLED (micro-light-emitting diode) display devices have begun to be used. However, the luminous efficiency and lifespan of different chips vary. Currently, the mainstream solution uses blue chips to convert color to achieve color display. Conventional methods include photolithography and printing on the chip to create the color conversion layer (also known as the quantum dot layer). This process is relatively complex and inefficient. Summary of the Invention

[0003] The present invention mainly provides a chip transfer device, a chip transfer method, and a chip, which simplify the manufacturing process and improve the manufacturing efficiency.

[0004] In order to solve the above technical problems, the first technical solution adopted by the present invention is to provide a chip transfer device, wherein the chip transfer device includes at least one sub-transfer device, and the sub-transfer device includes:

[0005] a main body structure, the main body structure comprising a plurality of cavities for accommodating color conversion materials; wherein the cavities are provided with discharge ports on a first side of the main body structure, through which the color conversion materials in the cavities flow out;

[0006] The chip fixing assembly is arranged on the first side of the main structure and is used to fix the chip unit during the transfer of the chip unit.

[0007] To solve the above technical problems, the second technical solution adopted by the present invention is to provide a chip transfer method, comprising:

[0008] Controlling a chip transfer device to grab a chip unit located on a transient substrate, wherein the chip transfer device includes any one of the above-mentioned chip transfer devices;

[0009] Moving the chip unit onto a target substrate and aligning the electrodes of the chip unit with the driving electrodes on the target substrate; and controlling the color conversion material to flow out of the main material port to spray a color conversion layer on the surface of the chip unit;

[0010] The chip unit is released so that the electrodes of the chip unit come into contact with the driving electrodes on the target substrate.

[0011] To solve the above technical problems, the third technical solution adopted by the present invention is to provide a chip comprising:

[0012] a target substrate, wherein a driving electrode is provided on the target substrate;

[0013] A chip unit is transferred to the target substrate by any of the chip transfer devices described above, and is contacted and connected with the driving electrodes on the target substrate.

[0014] The beneficial effects of the present invention are as follows: Different from the prior art, the chip transfer device provided by the present invention includes at least one sub-transfer device, and the sub-transfer device includes: a main structure and a chip fixing assembly. The main structure includes a plurality of cavities, and the plurality of cavities are used to accommodate color conversion materials; and the cavities are provided with discharge ports on the first side of the main structure, and the color conversion materials in the cavities flow out through the discharge ports; the chip fixing assembly is provided on the first side of the main structure, and is used to fix the chip unit during the transfer of the chip unit. The chip transfer device of the present application simultaneously prepares a color conversion layer during the chip transfer process, thereby simplifying the manufacturing process and improving manufacturing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 1 is a schematic structural diagram of a first embodiment of a chip transfer device provided by the present application;

[0017] Figure 2 is a structural schematic diagram of a second embodiment of the chip transfer device provided by the present application;

[0018] Figure 3 is a schematic structural diagram of a third embodiment of the chip transfer device provided by the present application;

[0019] Figure 4 is a schematic structural diagram of a fourth embodiment of a chip transfer device provided by the present application;

[0020] Figure 5 This application Figure 4 A schematic structural diagram of a first embodiment of a bottom view of a chip transfer device is provided;

[0021] Figure 6 This application Figure 4 A schematic structural diagram of a first embodiment of a bottom view of a chip transfer device is provided;

[0022] Figure 7 This application Figure 4A schematic structural diagram of a first embodiment of a bottom view of a chip transfer device is provided;

[0023] Figure 8 This application Figure 4 A schematic structural diagram of a first embodiment of a bottom view of a chip transfer device is provided;

[0024] Figure 9 This is a comparison diagram of the color conversion layer prepared before and after doping the color conversion material with anchor particles in the chip transfer device provided by this application;

[0025] Figure 10 is a schematic structural diagram of a third embodiment of the chip transfer device provided by the present application;

[0026] Figure 11 This is a flow chart of an embodiment of the chip transfer method provided by the present application;

[0027] Figures 12a-12g A schematic diagram of the chip transfer method provided in this application;

[0028] Figure 13 This is a schematic diagram of the structure of the chip of this application.

[0029] Explanation of the accompanying drawings: sub-transfer device 10, main structure 11, cavity 112, discharge port 113, chip fixing component 12, pressurizing unit 13, groove 24, chip adsorption component 121, chip clamping component 122, side structure 27, accommodating cavity 111, barrier unit 14, deformation unit 15, control unit 16, chip unit 20, color conversion layer 120, transient substrate 17, electrode 21 of chip unit, target substrate 18, driving electrode 181, encapsulation layer 30. DETAILED DESCRIPTION

[0030] The following describes the embodiments of the present application in detail with reference to the accompanying drawings.

[0031] In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

[0032] The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the related objects are in an "or" relationship. Furthermore, "many" in this document means two or more than two.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein are for the purpose of describing the embodiments of this application only and are not intended to limit this application.

[0034] Before further describing the embodiments of the present application in detail, the nouns and terms involved in the embodiments of the present application are explained. The nouns and terms involved in the embodiments of the present application are subject to the following interpretations.

[0035] The present application provides a chip transfer device, which includes at least one sub-transfer device, wherein the sub-transfer device includes a main structure and a chip fixing assembly. The main structure includes multiple cavities for accommodating color conversion materials; each of the cavities is provided with a discharge port on a first side of the main structure, through which the color conversion material in the cavity flows out; and the chip fixing assembly is provided on the first side of the main structure for fixing the chip unit during transfer. The chip transfer device of the present application simultaneously prepares a color conversion layer during the chip transfer process, simplifying the manufacturing process and improving manufacturing efficiency.

[0036] In order to enable those skilled in the art to better understand the technical solution of the present invention, a chip transfer device provided by the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0037] See Figure 1 , Figure 1 This is a schematic structural diagram of the first embodiment of the chip transfer device of the present application. This embodiment is described using a chip transfer device including a sub-transfer device 10 as an example. Specifically, the sub-transfer device 10 comprises a main structure 11 and a chip fixing assembly 12. The main structure 11 includes multiple cavities 112 for containing color-converting material. Each cavity 112 has a discharge port 113 on a first side of the main structure 11, through which the color-converting material within the cavity 112 flows. The chip fixing assembly 12 is disposed on the first side of the main structure 11 and is used to secure the chip unit during transfer. Specifically, during transfer, the color-converting material within the cavity 112 flows out of the discharge port 113, forming a color-converting layer 120 on a surface of the chip unit adjacent to the main structure 11. The color-converting material can be primarily made of quantum dot material or color resist, and can be categorized into red, green, and blue solutions. The resulting color-converting layer 120 converts light color.

[0038] In one embodiment, if Figure 1As shown, the cross-sectional dimensions of the discharge port 113 are the same as the cross-sectional dimensions of the cavity 112, so that the outflow speed of the color conversion material is accelerated, and the preparation speed of the color conversion layer 120 can be accelerated. Figure 2 As shown, the cross-sectional dimension of the discharge port 113 may be smaller than the cross-sectional dimension of the cavity 112 , thereby accurately controlling the outflow of the color conversion material.

[0039] Furthermore, the sub-transfer device 10 of the present application further includes a pressurizing unit 13 . At least one groove 24 is provided on the second side of the main structure 11 . The groove 24 is communicated with the cavity 112 , and the pressurizing unit 13 is located in the groove 24 .

[0040] It should be noted that the second side of the main structure 11 is opposite to the first side of the main structure 11. Figure 1 As shown, the first side of the main structure 11 is the side where the chip fixing assembly 12 is disposed, and the second side of the main structure 11 is the side of the main structure 11 away from the chip fixing assembly 12. The pressurizing unit 13 is used to apply pressure to the color conversion material when transferring the chip unit, thereby spraying the color conversion material on the surface of the chip unit to form a color conversion layer 120.

[0041] In one embodiment, the surface of the pressurizing unit 13 is flush with the second side surface of the main structure 11. In another embodiment, the pressurizing unit 13 slightly protrudes from the surface of the second side of the main structure 11. Specifically, the pressurizing unit 13 can be configured to, for example, slide downward within the cavity 112 upon application of pressure, thereby extruding the color-converting material from the cavity 112; and to return to its initial position upon cessation of pressure. Furthermore, the pressurizing unit 13 can, for example, include a spring assembly that, upon application of pressure, deforms, thereby extruding the color-converting material from the cavity 112; and, upon cessation of pressure, returns to its initial position, thereby ceasing extrusion of the color-converting material.

[0042] The chip transfer device of the present application simultaneously prepares the color conversion layer 120 (ie, quantum dot layer) during the chip transfer process, thereby simplifying the manufacturing process and improving manufacturing efficiency.

[0043] like Figure 1 and Figure 2 In the chip transfer device of the first embodiment shown, the pressurizing unit 13 is monolithic. Specifically, the surface area of ​​the pressurizing unit 13 corresponds to the cross-sectional area of ​​the cavity 112, and the pressurizing unit 13 is disposed in a one-to-one correspondence within the cavity 112. The pressurizing unit 13 can apply pressure to the color-conversion material on a one-to-one basis, thereby improving the fabrication precision of the color-conversion layer 120 and, for example, accurately controlling the thickness of the color-conversion layer 120. In another embodiment, the surface area of ​​the pressurizing unit 13 can be slightly smaller than the cross-sectional area of ​​the cavity 112, and the pressurizing unit 13 can be disposed in a one-to-one correspondence within the cavity 112.

[0044] In another embodiment, the color-converting material within cavity 112 includes multiple colors, such as a red solution, a green solution, and a blue solution. In another embodiment, the number of pressurizing units 13 can correspond to the colors of the color-converting materials. For example, if the color-converting materials include red, blue, and green, then there can be three pressurizing units 13. In this embodiment, there can be three grooves 24, with three pressurizing units 13 correspondingly positioned in each of the three grooves 24. Each pressurizing unit 13 applies pressure to the color-converting material of the same color, thereby forming color-converting layer 120. This improves the manufacturing precision of color-converting layers 120 and 121 and reduces control complexity.

[0045] In another embodiment, see Figure 3 The pressurizing unit 13 can also be a single piece. Specifically, a single groove 24 is provided on the second side of the main structure 11, and this groove 24 is connected to the cavity 112. The pressurizing unit 13 is disposed within this groove 24. In this embodiment, the pressurizing unit 13 can simultaneously apply pressure to all color conversion materials, simplifying control.

[0046] For further information, please see Figure 1 The chip fixing assembly 12 includes a chip adsorption assembly 121. The chip adsorption assembly 121 is disposed on the first side of the main structure 11 and is offset from the discharge port 113 of the cavity 112. Specifically, the chip adsorption assembly 121 is offset from the discharge port 113 of the cavity 112 to prevent the chip adsorption assembly 121 from blocking the discharge port 113.

[0047] The chip adsorption assembly 121 is used to adsorb the chip unit to transfer the chip unit. The chip adsorption assembly 121 includes, but is not limited to, a magnetic adsorption unit or an electric adsorption unit, and can be specifically configured according to the actual situation of the chip unit. For example, if the chip adsorption assembly 121 is an electric adsorption unit, when the chip adsorption assembly 121 is required to adsorb the chip unit, the chip adsorption assembly 121 can be powered (for example, by providing a drive circuit to energize the chip adsorption assembly 121) to adsorb the chip unit. When the chip unit needs to be released, the chip adsorption assembly 121 can be powered off to release the chip adsorption assembly 121 from the adsorption state of the chip unit.

[0048] In one embodiment, the chip adsorption component 121 may be in the shape of a circular ring, a rectangular ring, or the like. In the present application, the chip adsorption component 121 is disposed on the first side of the main structure 11. The suction force provided when adsorbing the chip unit needs to be greater than the gravity of the chip unit itself, otherwise the chip unit will not be able to be transferred. In order to provide sufficient suction, the present application may set the chip adsorption component 121 to be multiple rings. For example, the chip adsorption component 121 includes a first adsorption body and a second adsorption body, and the first adsorption body is located outside the second adsorption body. In a specific embodiment, the discharge port 113 may be disposed between the first adsorption body and the second adsorption body. The first adsorption body and the second adsorption body may be, for example, circular.

[0049] In another embodiment of the present application, Figure 4 The chip fixing assembly 12 includes a chip clamping assembly 122. In this embodiment, the sub-transfer device 10 also includes a side structure 27 connected to the main structure 11. The side structure 27 and the main structure 11 form a receiving cavity 111. The discharge port 113 corresponds to the receiving cavity 111. The chip clamping assembly 122 is disposed in the receiving cavity 111 and attached to the side structure 27.

[0050] In one embodiment, the main structure 11 and the side structure 27 can be integrally formed. Specifically, a thicker main board can be provided, and a groove can be dug on one side of the main board to form the accommodating cavity 111.

[0051] When transferring the chip unit, the chip unit 20 is in the accommodating cavity 111 , and the chip clamping component 122 is disposed in the accommodating cavity 111 and attached to the side structure 27 , so that the chip clamping component 122 can grab the chip unit 20 .

[0052] Furthermore, a barrier unit 14 is disposed on the first side of the main structure 11 at a position offset from the discharge port 113. When transferring the chip unit 20, the barrier unit 14 contacts the surface of the chip unit 20 to prevent mixing of the color conversion material flowing out of the multiple cavities 112. Specifically, the barrier unit 14 contacts the surface of the chip unit 20, creating a gap between the surface of the chip unit 20 (the light-emitting surface of the chip unit 20) and the discharge port 113, facilitating spraying of the color conversion layer 120 onto the surface of the chip unit 20. It will be appreciated that the height of the barrier unit 14 must be greater than the thickness of the color conversion layer 120, that is, the thickness of the gap between the surface of the chip unit 20 and the discharge port 113 must be greater than the thickness of the color conversion layer 120. In other embodiments, the height of the barrier unit 14 can also be equal to the thickness of the color conversion layer 120, that is, the thickness of the gap between the surface of the chip unit 20 and the discharge port 113 can be equal to the thickness of the color conversion layer 120.

[0053] The barrier unit 14 is used to separate the different colors of color-conversion materials during the preparation of the color-conversion layer 120. Specifically, the color-conversion materials within the multiple cavities 112 are different colors. For example, some cavities 112 may contain red color-conversion materials, some may contain blue color-conversion materials, and some may contain green color-conversion materials. The barrier unit 14 is positioned between the cavities 112 containing the different color-conversion materials. This ensures that adjacent color-conversion layers 120 are independent of each other after the color-conversion layer 120 is prepared, preventing interference. It is understood that the color-conversion materials are in a solution state. Without the barrier unit 14, adjacent color-conversion materials would connect and cause crosstalk after spraying on the light-emitting surface of the chip unit 20. The resulting color-conversion layer 120 would also exhibit a clinging appearance, affecting the display effect. The barrier unit 14 separates the color-conversion materials formed on the light-emitting surface of the chip unit 20 during spraying, allowing the resulting color-conversion layers 120 to be independent of each other after subsequent curing.

[0054] In a specific embodiment, the layout of the barrier unit 14 is determined according to the layout of the cavity 112. Figure 5 As shown, assuming that the cavities 112 containing red color conversion material, the cavities 112 containing blue color conversion material, and the cavities 112 containing green color conversion material are arranged in a rectangular array, the blocking unit 14 is vertically disposed between the cavities 112 containing two different colors.

[0055] In another embodiment, Figure 6 As shown, assuming that the cavities 112 containing red color conversion material, the cavities 112 containing blue color conversion material, and the cavities 112 containing green color conversion material are arranged in a trapezoidal shape, the barrier units 14 are disposed in a Y-shaped arrangement between the cavities 112 containing the two different colors. Of course, the barrier units 14 and the cavities 112 containing the different colors can also be arranged in other arrangements, which are not limited to this specific arrangement.

[0056] exist Figures 1 to 3 In the embodiment shown, the position and shape of the chip adsorption component 121 can be reasonably set so that it not only has the function of adsorbing the chip unit, but also has the function of the barrier unit 14. Alternatively, the barrier unit 14 can be re-set.

[0057] Please continue to see Figure 4 The chip clamping assembly 122 includes a deformation unit 15 and a control unit 16 connected to the deformation unit 15. The deformation unit 15 includes an electrostrictive material. Electrostrictive materials are materials that undergo elastic deformation due to dielectric polarization under the action of an electric field. This phenomenon is known as the electrostrictive effect. The electrostrictive material includes at least one of relaxor ferroelectric ceramics, lead lanthanum zirconate titanate (PLZT), lead barium zirconate titanate (Ba-PZT), and novel hybrid ferroelectric compounds.

[0058] The control unit 16 applies voltage to control the deformation unit 15 to expand, thereby grabbing the chip unit 20 , and disconnects the voltage to control the deformation unit 15 to restore to its original state, thereby releasing the chip unit 20 .

[0059] In a specific embodiment, in order to complete the transfer and color conversion process more smoothly, the cross-sectional width dimension of the chip unit 20 to be transferred can be set to W, and the diameter of the groove 24 formed by the deformation unit 15 is larger than the cross-sectional width dimension of the chip unit. For example, the diameter of the groove 24 formed by the deformation unit 15 is between W and 1.2W. The minimum diameter of the groove 24 formed after the deformation unit 15 is expanded and deformed by applying voltage is smaller than the cross-sectional width dimension of the chip unit. For example, the minimum diameter of the groove 24 formed after the deformation unit 15 is expanded and deformed is between 0.8W and 1W.

[0060] In one embodiment, the deformation unit 15 is disposed entirely around the side wall of the accommodating cavity 111. Figure 7 The deformation unit 15 is disposed around the accommodating cavity 111 as a whole, which can better grasp the chip unit, avoid the chip unit from falling due to insufficient grasping force, and reduce the damage rate of the chip unit.

[0061] In another embodiment, the deformation unit 15 is partially arranged around the side wall of the accommodating cavity 111. Specifically, when the deformation unit 15 partially surrounds the accommodating cavity 111, it can be as follows: Figure 6 As shown in FIG, the four side walls of the accommodating cavity 111 are all partially provided. If it is necessary to further reduce the cost, it is also possible to Figure 8 As shown, it is only partially provided on two opposite side walls of the accommodating cavity 111, and is not specifically limited. It is flexibly provided mainly to firmly grasp the chip unit.

[0062] The color conversion layer 120 converts light color and can be primarily made of materials such as quantum dot materials or color resists. Specifically, the color conversion layer 120 includes quantum dot materials or color resists. Specifically, it can be divided into three types: red solution, green solution, and blue solution. Specifically, assuming the light emitted by the chip unit 20 is white light, to obtain red, green, and blue light, red, green, and blue color conversion layers 120 can be formed on the surface of the chip unit using red, green, and blue color conversion materials. In one embodiment, if the light emitted by the chip unit 20 is blue, the color conversion material can also be a transparent solution to obtain blue light.

[0063] In one embodiment, the color conversion material includes a quantum dot material or a color resist material doped with a transparent colloid. Specifically, to improve the stability of the color conversion material solution during curing after being sprayed onto the chip surface, the color conversion material may be doped with 10% to 30% of the transparent colloid. This improves the adhesion of the color conversion material to the chip surface and facilitates the formation of the color conversion layer 120.

[0064] In one embodiment, the color conversion material includes a quantum dot material or a color resist material doped with anchoring particles. Specifically, to prevent the sprayed color conversion material from accumulating toward the edges during the drying process, resulting in a thicker periphery and thinner center after film formation, anchoring particles, such as 5% to 15% silica particles, may be doped into the color conversion material to act as a barrier anchor, thereby improving the uniformity of the color conversion layer 120 after the color conversion material is formed and improving the effect comparison. Figure 9 shown. Figure 9 The left side is a schematic diagram of the color conversion layer 120 formed without adding anchor particles. It can be seen that the surface of the color conversion layer 120 is uneven. After adding anchor particles, the color conversion layer 120 is Figure 9 As shown on the right, the surface is relatively flat.

[0065] In one embodiment, the color conversion material includes a quantum dot material or a color resist material doped with a transparent colloid and anchoring particles. As will be appreciated, the inclusion of the transparent colloid and anchoring particles in the color conversion material not only improves the adhesion of the color conversion material to the chip surface, facilitating the formation of the color conversion layer 120, but also enhances the uniformity of the color conversion layer 120 after the color conversion material is formed.

[0066] The chip transfer device of this application organically combines chip transfer and color conversion layer 120 fabrication, simplifying the manufacturing process and improving production efficiency. Furthermore, the integration of multiple color conversion layers 120 (red, green, and blue) on the same chip also triples transfer efficiency. For display substrates fabricated from chips, a single pixel occupies a smaller area than a multi-chip arrangement, thereby improving display resolution.

[0067] In one embodiment, the transfer device may further include a plurality of sub-transfer devices 10, such as Figure 10 As shown, Figure 10 The transfer device includes three sub-transfer devices 10 for illustration. In other embodiments, the transfer device may also include 2, 4, 5, or 6 sub-transfer devices 10, which are not specifically limited.

[0068] Figure 10The transfer device shown connects the outer sides of the main structure 11 of multiple sub-transfer devices 10. In one manufacturing embodiment, multiple independent sub-transfer devices 10 can be glued together. Alternatively, in another manufacturing embodiment, a larger main board can be selected, and multiple accommodating cavities 111 can be formed on the main board, and then the sub-transfer devices 10 shown above can be manufactured accordingly.

[0069] The transfer device shown in this embodiment combines multiple sub-transfer devices 10 for use, and can transfer multiple chip units in one transfer process, and simultaneously prepare color conversion layers 120 for multiple chip units, further improving chip transfer efficiency and chip manufacturing efficiency.

[0070] See Figure 11 , Figure 11 The figure is a flow chart of an embodiment of the chip transfer method of the present application. Specifically, the chip transfer method includes:

[0071] Step S91: controlling the chip transfer device to grab the chip unit located on the temporary substrate.

[0072] It should be noted that the chip transfer device includes the chip transfer device of any of the above embodiments.

[0073] See also Figure 12a A temporary substrate 17 is provided, on which a chip unit 20 to be transferred is disposed. The chip unit 20 has a light-emitting surface and an electrode surface, with the light-emitting surface facing upward and the electrode surface facing downward. Specifically, the electrode surface is provided with a plurality of electrodes, and the number of electrodes depends on the number of light-emitting zones of the light-emitting surface of the chip unit 20. Generally speaking, the light-emitting zones of the light-emitting surface of the chip unit 20 generally include three light-emitting zones: a red light-emitting zone, a blue light-emitting zone, and a green light-emitting zone. Therefore, the electrode surface of the chip unit 20 is provided with three electrodes 21, and the electrodes 21 are in contact with the temporary substrate 17, and the light-emitting surface is away from the temporary substrate 17.

[0074] Continue to see Figure 12a A target substrate 18 is provided. Drive electrodes 181 are disposed on the target substrate 18. The number of drive electrodes 181 depends on the number of electrodes 21 on the electrode surface of the chip unit 20. As described above, the number of electrodes 21 on the electrode surface of the chip unit 20 is three, and the number of drive electrodes 181 corresponding to each chip unit on the target substrate 18 is also three.

[0075] When transferring the chip unit 20, the chip transfer device is moved to the top of the temporary substrate 17 and aligned with the chip unit 20, such as Figure 12b This embodiment is as shown. Figure 4The chip transfer device shown in the figure is used as an example for explanation. It is understandable that in order to grab the chip unit 20, the accommodating cavity of the chip transfer device needs to be aligned with the chip unit 20. The chip transfer device is controlled to move downward. After moving downward, the chip unit 20 is located in the accommodating cavity, and the deformation unit in the accommodating cavity of the chip transfer device is opposite to the side of the chip unit 20, as shown in FIG. Figure 12c shown.

[0076] The control unit applies voltage to control the deformation unit of the chip transfer device to expand, thereby grabbing the chip unit. The deformation unit of the chip transfer device is made of electrostrictive material. After the control unit applies voltage, the deformation unit expands and contacts the side of the chip unit to grab the chip unit, controlling the chip transfer device to move upward, thereby grabbing the chip unit. Figure 12d shown.

[0077] Step S92: moving the chip unit onto the target substrate and aligning the electrodes of the chip unit with the driving electrodes on the target substrate; and controlling the color conversion material to flow out from the main material port to spray a color conversion layer on the surface of the chip unit.

[0078] join Figure 12e In order to increase the chip transfer speed and simplify the operation process, the target substrate 18 is generally placed on the same horizontal plane as the temporary substrate 17, for example, on the same workbench. After the chip unit is grasped, it is translated to move the chip unit to the target substrate 18. Specifically, when the chip unit is moved to the target substrate 18, the electrodes of the chip unit are aligned with the driving electrodes 181 on the target substrate 18. The pressure unit is controlled to apply pressure to the color conversion material, thereby spraying the color conversion layer 120 on the surface of the chip unit, see Figure 12f .

[0079] The above process involves first moving the chip unit onto the target substrate and then spraying the color conversion layer. In another embodiment, the color conversion layer can be prepared first, and then the chip unit can be moved onto the target substrate. For example, a pressurizing unit can be controlled to apply pressure to the color conversion material, thereby spraying the color conversion layer onto the surface of the chip unit, and then the chip unit can be moved onto the target substrate.

[0080] Furthermore, after the color conversion material solution is sprayed on the surface of the chip unit (ie, the light-emitting surface of the chip unit), it needs to be cured by light or heat to finally form a color conversion layer.

[0081] Step S93: releasing the chip unit so that the electrodes of the chip unit come into contact with the driving electrodes on the target substrate.

[0082] For details, see Figure 12g , the control unit disconnects the voltage to control the deformation unit to return to its original state, thereby releasing the chip unit.

[0083] Specifically, to protect the chip unit when releasing it, the distance between the chip unit and the target substrate can be adjusted before releasing it. For example, the chip unit's electrodes can be directly brought into contact with the drive electrodes on the target substrate before the voltage release chip unit is disconnected. Alternatively, the distance between the chip unit's electrodes and the drive electrodes on the target substrate can be controlled to be within a safe range before the voltage release chip unit is disconnected to avoid damage to the chip unit after release due to excessive distance.

[0084] After releasing the chip unit, the chip transfer device is controlled to move upward. This allows for a single transfer and the creation of multiple color regions (i.e., the color conversion layer) to be completed, increasing transfer efficiency by three times. Furthermore, compared to placing multiple chips of different colors separately, a single pixel occupies a smaller area, which improves display resolution.

[0085] In order to complete the transfer and color conversion process more smoothly, the cross-sectional width dimension of the chip unit to be transferred can be set to W, and the diameter of the groove formed by the deformation unit is larger than the cross-sectional width dimension of the chip unit. For example, the diameter of the groove formed by the deformation unit is between W and 1.2W. The minimum diameter of the groove formed after the voltage is applied and the deformation unit is expanded and deformed is smaller than the cross-sectional width dimension of the chip unit. For example, the minimum diameter of the groove formed after the deformation unit is expanded and deformed is between 0.8W and 1W.

[0086] See Figure 13 , is a structural schematic diagram of an embodiment of the chip of the present application, the chip includes a target substrate 18 and a chip unit 20, and a driving electrode 181 is provided on the target substrate 18; the chip unit 20 is transferred to the target substrate 18 by any of the above-mentioned chip transfer devices, and is in contact and connected with the driving electrode 181 on the target substrate 18. Specifically, an electrode is provided on the side of the chip unit 20 close to the target substrate 18. When the chip unit 20 is transferred to the target substrate 18, the electrode of the chip unit 20 is in contact with the driving electrode 181 on the target substrate 18.

[0087] After the chip units are transferred and the color conversion layer is fabricated, an encapsulation layer 30 is applied to the target substrate. This layer is preferably made of a black resin material. This prevents light crosstalk between the chip units and reduces reflections from ambient light. It also provides protection for the chip units and color conversion material, simplifying the fabrication process.

[0088] The chip transfer method of this application simultaneously prepares the color conversion layer during the chip transfer process, simplifying the chip manufacturing process and improving production efficiency. Furthermore, the integration of multiple color conversion layers (red, green, and blue) into the same chip unit can also increase transfer efficiency by up to three times. For display substrates made from chips, the area occupied by a single pixel is smaller than that of multiple chip arrangements, thereby improving display resolution.

[0089] The above are merely embodiments of the present invention and are not intended to limit the scope of patent protection of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention's description and drawings, or directly or indirectly applied in other related technical fields, are also included in the scope of patent protection of the present invention.

Claims

1. A chip transfer device, characterized in that: The chip transfer device includes at least one sub-transfer device, and the sub-transfer device includes: a main body structure, the main body structure comprising a plurality of cavities for accommodating color conversion materials; wherein the cavities are provided with discharge ports on a first side of the main body structure, through which the color conversion materials in the cavities flow out; The chip fixing assembly is arranged on the first side of the main structure and is used to fix the chip unit during the transfer of the chip unit.

2. The chip transfer device according to claim 1, wherein: The sub-transfer device comprises: A pressurizing unit, wherein the second side of the main body structure is provided with at least one groove, the groove is communicated with the cavity, and the pressurizing unit is located in the groove.

3. The chip transfer device according to claim 1, wherein: The chip fixing assembly includes: A chip adsorption component is arranged on the first side of the main structure and is staggered with the discharge port of the cavity.

4. The chip transfer device according to claim 1, wherein: The chip fixing assembly includes: The chip clamping assembly, the sub-transfer device also includes a side structure connected to the main structure, the side structure and the main structure form a accommodating cavity, and the discharge port corresponds to the accommodating cavity; the chip clamping assembly is arranged in the accommodating cavity and attached to the side structure.

5. The chip transfer device according to claim 3 or 4, characterized in that: A barrier unit is provided on the first side of the main structure at a position offset from the discharge port. When the chip unit is transferred, the barrier unit contacts the surface of the chip unit to prevent the color conversion materials flowing out of the multiple cavities from mixing.

6. The chip transfer device according to claim 4, characterized in that: The chip clamping assembly includes: a deformation unit and a control unit connected to the deformation unit; The deformation unit is configured as an electrostrictive material.

7. The chip transfer device according to claim 1, wherein: The color conversion materials in the plurality of cavities have different colors.

8. The chip transfer device according to claim 1, wherein: The color conversion material includes quantum dot material or color resist material; or The color conversion material includes a quantum dot material or a color resist material doped with a transparent colloid; or The color conversion material includes a quantum dot material or a color resist material doped with anchor particles; or The color conversion material includes a quantum dot material or a color resist material doped with transparent colloid and anchoring particles.

9. A chip transfer method, characterized in that: include: Controlling a chip transfer device to grab a chip unit located on a temporary substrate, wherein the chip transfer device comprises the chip transfer device according to any one of claims 1 to 8; moving the chip unit onto a target substrate and aligning the electrodes of the chip unit with the driving electrodes on the target substrate; and controlling the color conversion material to flow out from the main material port, spraying a color conversion layer on the surface of the chip unit; The chip unit is released so that the electrodes of the chip unit come into contact with the driving electrodes on the target substrate.

10. A chip, characterized in that: include: a target substrate, wherein a driving electrode is provided on the target substrate; A chip unit is transferred to the target substrate by the chip transfer device according to any one of claims 1 to 8, and is contacted and connected with the driving electrodes on the target substrate.

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