MicroLED assembly method and assembly system

Abstract

An assembling method and an assembling system for a MicroLED, the assembling method comprising: providing a substrate, the substrate comprising a plurality of first areas and second areas, the first areas being lyophilic surfaces, and the second areas being lyophobic surfaces; bonding liquid drops are automatically formed in each first area; and transferring the MicroLED on the carrier plate to the corresponding bonding liquid drop, and enabling the MicroLED to be automatically aligned with the corresponding first area, so as to complete the assembly of the MicroLED on the substrate. According to the invention, the substrate is partitioned through wettability, and in combination with the concentrated release transfer of the MicroLED and the self-alignment technology of the MicroLED, rapid, high-precision and large-scale transfer and assembly of the MicroLED can be realized, and high efficiency and high yield during large-scale assembly of the MicroLED can be taken into account.

Description

Technical Field

[0001] The present application relates to the technical field of transfer and assembly of MicroLEDs, and in particular to a MicroLED assembly method and assembly system. Background Art

[0002] Traditional display technologies (such as LED, OLED, and LCD) struggle to meet society's growing demand for displays. MicroLED significantly outperforms traditional display technologies in terms of performance indicators, including brightness, resolution, contrast, power consumption, and lifespan, and is poised to become the next generation of mainstream display technology.

[0003] However, due to the physical size of MicroLED devices, they often face the problem of conflicting efficiency and yield when assembled on a large scale. Summary of the Invention

[0004] In order to solve at least one of the above technical problems, it is necessary for the present application to propose a MicroLED assembly method, which can achieve efficient transfer and assembly of a large number of MicroLEDs with high assembly accuracy and yield.

[0005] In addition, the present application also provides an assembly system for executing the aforementioned MicroLED assembly method.

[0006] In a first aspect, an embodiment of the present application provides a method for assembling a MicroLED, the method comprising:

[0007] Providing a substrate, the substrate comprising a plurality of first regions and a second region located around each of the first regions, wherein the first regions have a lyophilic surface and the second regions have a lyophobic surface;

[0008] Automatically forming an adhesive droplet in each of the first areas; and

[0009] The MicroLEDs on the carrier are transferred onto the corresponding adhesive droplets, and the MicroLEDs are automatically aligned with the corresponding first regions to complete the assembly of the MicroLEDs on the substrate.

[0010] In some possible embodiments, the step of automatically forming an adhesive droplet in each first area includes:

[0011] forming an adhesive liquid in the first region and / or the second region; and

[0012] The adhesive liquid has different surface tensions in the first area and the second area. Under the action of the surface tensions, the adhesive liquid automatically forms the adhesive liquid droplets located in the first area.

[0013] In some possible embodiments, when the adhesive liquid is applied to the second area, the adhesive liquid forms droplets under the action of the surface tension of the second area and moves to the first area.

[0014] In some possible embodiments, the step of forming an adhesive liquid in the first area and / or the second area includes:

[0015] The adhesive liquid applying device and the substrate are caused to move relative to each other. During the relative movement, the adhesive liquid in the adhesive liquid applying device is applied to the first area and / or the second area.

[0016] In some possible embodiments, the adhesive liquid applying device includes a plurality of application needles arranged side by side above the substrate.

[0017] In some possible embodiments, the step of transferring the MicroLEDs on the carrier to the corresponding adhesive droplets includes:

[0018] placing the carrier above the substrate carrying the adhesive droplets, and ensuring that the MicroLEDs on the carrier correspond one-to-one with the adhesive droplets; and

[0019] The MicroLEDs on the carrier are released, and the MicroLEDs fall onto the corresponding adhesive droplets.

[0020] In some possible embodiments, the step of automatically aligning the MicroLED with the corresponding first area includes:

[0021] Under the action of the surface tension of the adhesive droplet, the MicroLED is automatically aligned with the corresponding first area.

[0022] In some possible embodiments, the step of releasing the MicroLED on the carrier includes:

[0023] placing a carrier plate and the substrate carrying the adhesive droplets below a laser device;

[0024] controlling the carrier plate and the substrate to move relative to the laser device; and

[0025] The laser device is controlled to emit laser light, and the laser light is irradiated onto a portion of the carrier corresponding to the MicroLED to release the MicroLED.

[0026] In some possible embodiments, the plurality of MicroLEDs on the carrier are arranged in an array, and the laser device includes a plurality of lasers arranged side by side, each of the lasers corresponding to at least one row of MicroLEDs.

[0027] In a second aspect, the present application provides an assembly system for executing the MicroLED assembly method as described above, the assembly system comprising: a moving device, an adhesive liquid applying device, and a MicroLED releasing device, the moving device being used to move a substrate and / or a carrier; the adhesive liquid applying device being used to apply adhesive liquid droplets to the substrate; and the MicroLED releasing device being used to release the MicroLED on the carrier.

[0028] Compared to existing technologies, the MicroLED assembly method and system provided in this application utilize a wettability-zoned substrate, combined with centralized release transfer and MicroLED self-alignment technology, to achieve rapid, highly precise, and large-scale transfer and assembly of MicroLEDs, achieving both high efficiency and high yield in large-scale MicroLED assembly. The MicroLEDs experience no direct surface contact during transfer and assembly, which helps improve yield. The alignment accuracy of the surface tension-based self-alignment technology is high, requiring minimal initial position deviation for the MicroLEDs; self-assembly is achieved as long as the MicroLEDs are released onto the adhesive droplet in the first, more wettable area. The system requires no special MicroLED processing, has low environmental requirements, and exhibits strong resistance to external interference. The system achieves high MicroLED transfer efficiency, and the transfer volume can be further increased by expanding the number of components, such as needles and lasers, enabling mass transfer of MicroLEDs. Furthermore, the assembly system used to implement this assembly method features a simple structure, easy operation, low component precision requirements, and low cost. The number of components in the system can be adjusted based on the actual MicroLED assembly volume, providing greater flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is an assembly flow chart of MicroLED provided in one embodiment of the present application.

[0030] Figure 2 It is a schematic structural diagram of a substrate provided in one embodiment of the present application.

[0031] Figure 3 The adhesive liquid applying device is moved to Figure 2 Schematic diagram of the structure above the base Figure 1 .

[0032] Figure 4 It is a schematic structural diagram of applying adhesive liquid onto a substrate through an adhesive liquid applying device.

[0033] Figure 5 Schematic diagram of the structure in which adhesive droplets are distributed in the first area on the substrate.

[0034] Figure 6 It is a structural diagram of placing a carrier plate above a substrate and placing a laser device above the carrier plate.

[0035] Figure 7 This is a schematic diagram of the structure of using a laser device to release the MicroLED on the carrier.

[0036] Figure 8 This is a schematic diagram of the structure in which all MicroLEDs on the carrier are released onto the adhesive droplet on the substrate 1.

[0037] Figure 9 is a top view of a first area of ​​a substrate with a dispensed adhesive droplet.

[0038] Figure 10 This is a top view of the MicroLED landing on the adhesive droplet in the first area.

[0039] Figure 11 This is a top view of the automatic alignment of MicroLED with the first area.

[0040] Figure 12 It is a system framework diagram of an assembly system provided in one embodiment of the present application.

[0041] Description of main component symbols

[0042] Assembling the system 100 base 1 First Area 11 Second area 12 carrier board 2 Adhesive liquid application device 3 needle 4 Laser device 5 laser 6 mobile devices 7 Curing device 8 MicroLED 10 Adhesive droplets 20

[0043] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0044] The technical solutions of this application will be described clearly and completely below with reference to specific embodiments. Obviously, the described embodiments are only a portion of the embodiments of this application, not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of this application without creative effort are also within the scope of protection of this application.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The names of the technical means used in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0046] In the absence of conflict, the following embodiments and features thereof may be combined with each other.

[0047] See also Figure 1 , combined with reference Figures 2 to 11 The present invention provides a method for assembling a MicroLED, which includes the following steps:

[0048] Step S1, preparation of wettability partitioned substrate: Figure 2 As shown, a substrate 1 is provided, comprising a plurality of first regions 11 and second regions 12 surrounding each of the first regions 11. The first regions 11 are lyophilic surfaces, while the second regions 12 are lyophobic surfaces. A "lyophilic surface" can be understood as a surface that is easily wetted by liquid, while a "lyophobic surface" can be understood as a surface that is not easily wetted by liquid. Therefore, the first regions 11 are more wettable by liquid than the second regions 12.

[0049] Step S2, droplet distribution: Figures 3 to 5 As shown, an adhesive droplet 20 is automatically formed in each of the first regions 11 .

[0050] Step S3, release of MicroLED and self-assembly of MicroLED and substrate: Figures 6 to 11 As shown, the MicroLED 10 on the carrier 2 is transferred to the corresponding adhesive droplet 20 , and the MicroLED 10 is automatically aligned with the corresponding first area 11 to complete the assembly of the MicroLED 10 on the substrate 1 .

[0051] In step S1, Figure 2 As shown, there is a difference in the lyophilicity and lyophobicity of the multiple first regions 11 and the multiple second regions 12 formed on the substrate 1, that is, the wettability of the liquid to the first region 11 is better than the wettability to the second region 12, thereby preparing a substrate 1 with wettability partitioning. Since the wettability of the liquid to the first region 11 is greater, the liquid has a smaller surface tension in the first region 11, and the wettability of the liquid to the second region 12 is smaller, the liquid has a larger surface tension in the second region 12. For example, taking water as an example, the first region 11 is a hydrophilic region or a super hydrophilic region, and the second region 12 is a hydrophobic region or a super hydrophobic region. It can be understood that corresponding wettability partitioning structures can be prepared according to the different liquid media required for the actual process, such as glue-philic / glue-phobic regions, etc.

[0052] In some embodiments, the wettability-zoned substrate 1 described above can be prepared using physical, chemical, or a combination of methods. For example, laser micromachining can be used to control the surface wettability of different regions of the substrate 1, or mask spraying can be used to spray corresponding solutions on different regions of the substrate 1 to form film layers with corresponding wettability. However, the wettability zones are not limited to the above methods.

[0053] In some embodiments, according to the arrangement of the MicroLEDs 10 on the substrate 1 , the plurality of first regions 11 may be arranged in an array.

[0054] In some embodiments, the first region 11 may be rectangular, circular, or in other shapes. Specifically, in this embodiment, the first region 11 is approximately rectangular. The rectangular first region 11 is easy to shape and can easily match the shape of the MicroLED 10.

[0055] In step S2, automatically forming the adhesive droplet 20 in each of the first areas 11 specifically includes the following steps:

[0056] Step S21, as Figure 3 and Figure 4 As shown, an adhesive liquid is formed in the first area 11 and / or the second area 12 .

[0057] Specifically, the adhesive liquid applying device 3 may be used to distribute the adhesive liquid. The needle 4 of the adhesive liquid applying device 3 is suspended above the substrate 1 , and the position from the substrate 1 may be flexibly adjusted according to actual needs.

[0058] The adhesive liquid applicator 3 and the substrate 1 are in relative motion, and during the relative motion, the adhesive liquid in the adhesive liquid applicator 3 is applied to the first area 11 and / or the second area 12. The needle 4 on the adhesive liquid applicator 3 can be driven to move above the substrate 1 by a precision moving platform, and it is understood that the substrate 1 can also be moved.

[0059] In some embodiments, the adhesive liquid applying device 3 may include multiple needles 4 arranged side by side above the substrate 1, so that multiple needles 4 can simultaneously distribute droplets on the substrate 1 containing a large amount of first area 11, thereby improving the droplet distribution efficiency and distribution amount.

[0060] Step S22, as Figure 5 As shown, the adhesive liquid has different surface tensions in the first area 11 and the second area 12 . Under the action of the surface tensions, the adhesive liquid automatically forms the adhesive droplet 20 located in the first area 11 .

[0061] When applying the adhesive liquid, the adhesive liquid can be applied only to the first region 11. Since the first region 11 is a lyophilic surface, the adhesive liquid can directly adhere to the first region 11 to form adhesive droplets 20. Alternatively, the adhesive liquid can be applied only to the second region 12, where it first forms droplets on the lyophobic surface of the second region 12. Ultimately, due to the different surface tensions between the first and second regions 11, the adhesive liquid migrates to the first region 11, which has greater wettability. Alternatively, the adhesive liquid can be applied directly to the surface of the substrate 1. In this case, the adhesive liquid may be present in both the first and second regions 11, 12. If different regions of the substrate 1 have different wettabilities, the adhesive liquid in the second region 12 can automatically form droplets and migrate to the first region 11.

[0062] Specifically, when adhesive liquid is present on the second region 12, the adhesive liquid forms droplets on the liquid-repellent surface of the second region 12 and moves into the first region 11. Since the adhesive liquid has different surface tensions in the first region 11 and the second region 12, when the adhesive liquid is applied to the second region 12, the surface tension causes the adhesive liquid to tend to form droplets, while the first region 11 absorbs the adhesive liquid, and ultimately the adhesive liquid moves to the first region 11 to form adhesive droplets 20. As shown in FIG3 and FIG3 Figure 4 As shown, a precision mobile platform can be used to drive the needle 4 on the adhesive liquid applicator 3, causing the adhesive liquid flowing from the needle 4 to sweep across the surface of the substrate 1. As previously described, the first region 11 and the second region 12 have different wettabilities. The liquid can then be formed into droplets under the action of surface tension and automatically distributed within the first region 11 of greater wettability on the substrate 1. This method can achieve automatic droplet distribution on the substrate 1, with high droplet distribution efficiency and precise volume control. The adhesive liquid applicator 3 has a simple structure, low cost, and is easy and convenient to operate.

[0063] In some embodiments, the volume of the adhesive droplet 20 corresponds to the area of ​​the first region 11. The volume of the adhesive droplet 20 can be controlled based on the size of the first region 11, which is designed based on the mounting area of ​​the MicroLEDs 10 to be assembled. This ensures that the amount of adhesive droplet 20 is accurately used, ensuring that the adhesive droplet 20 is positioned directly below the MicroLEDs 10 during subsequent assembly, without overflowing due to excessive volume.

[0064] In some embodiments, the adhesive liquid may be a conductive glue. By forming a conductive glue on the first area 11 , the MicroLED 10 can be fixed on the substrate 1 , and the electrical connection between the MicroLED 10 and the substrate 1 can also be achieved.

[0065] The step S3: releasing the MicroLED and self-assembling the MicroLED and the substrate specifically includes the following steps:

[0066] Step S31, as Figure 6 As shown, the carrier 2 is placed above the substrate 1 carrying the adhesive droplets 20 , and the MicroLEDs 10 on the carrier 2 are arranged in one-to-one correspondence with the adhesive droplets 20 .

[0067] At this time, the substrate 1 and the carrier 2 are relatively stationary.

[0068] In some embodiments, a large number of MicroLEDs 10 can be pre-fixed on a carrier 2. This allows for the transfer of a large number of MicroLEDs 10, facilitates subsequent assembly of the MicroLEDs 10, and improves assembly efficiency. Specifically, a release layer is provided on the carrier 2, and the MicroLEDs 10 are temporarily fixed to the carrier 2 via the release layer. For example, a large number of MicroLEDs 10 can be fixed to the carrier 2 using hot melt adhesive (i.e., the release layer), but is not limited thereto. In some embodiments, a laser can be used to release the MicroLEDs 10 from the carrier 2. The carrier 2 and the substrate 1 carrying the adhesive droplet 20 are placed below the laser device 5, or the laser device 5 is moved above the carrier 2.

[0069] Step S32, as Figures 7 and 8 As shown, the MicroLED 10 on the carrier 2 is released so that the MicroLED 10 falls onto the corresponding adhesive droplet 20 .

[0070] Specifically, the carrier 2 and the substrate 1 are controlled to move relative to the MicroLED releasing device. For example, the MicroLED releasing device can be a laser device 5. By controlling the laser device 5 to emit laser, the laser is irradiated to the portion of the carrier 2 corresponding to the MicroLED 10 to release the MicroLED 10.

[0071] The carrier 2 and the substrate 1 may be moved simultaneously, or only the laser device 5 may be moved so that the laser head of the laser device 5 is aligned with the portion of the carrier 2 where the MicroLED 10 is provided.

[0072] By irradiating the carrier 2 with laser light, the local temperature of the carrier 2 with the MicroLEDs 10 mounted thereon can be increased, thereby releasing the MicroLEDs 10 attached to the hot melt adhesive. The detached MicroLEDs 10 fall onto the corresponding adhesive droplets 20 under the action of gravity.

[0073] In some embodiments, the plurality of MicroLEDs 10 on the carrier 2 are arranged in an array, and the laser device 5 may include a plurality of lasers 6 arranged side by side, each laser 6 corresponding to at least one row of MicroLEDs 10. This can increase the release speed of a large number of MicroLEDs 10, thereby increasing the transfer and assembly speed of a large number of MicroLEDs 10.

[0074] Step S33, as Figures 9 to 11 As shown, under the action of the surface tension of the adhesive droplet 20 , the MicroLED 10 is automatically aligned with the corresponding first area 11 .

[0075] During its fall, the MicroLED 10 may deviate at a certain angle. However, once it lands on the adhesive droplet 20, the adhesive has a strong wettability on the lower surface of the MicroLED 10, and the shape and area of ​​the first region 11 are substantially the same as those of the MicroLED 10. Thus, the adhesive droplet 20 soaks into the lower surface of the MicroLED 10. Under the action of the droplet's surface tension, the MicroLED 10 automatically adjusts its position and angle to align with the first region 11. In other words, the adhesive droplet 20 provides the driving force for the automatic alignment of the MicroLED 10 with the first region 11.

[0076] Step S34 , curing the adhesive droplet 20 to complete the assembly of the MicroLED 10 on the substrate 1 .

[0077] When the adhesive liquid is a conductive glue, it can be cured by heating to fix the MicroLED 10 on the substrate 1.

[0078] The above method is not limited to the transfer and assembly of MicroLEDs. Any small electronic device can be transferred and assembled using the method of this application.

[0079] The following embodiments describe the above assembly method in detail.

[0080] Step 101 : Design a wettability-zoned substrate for MicroLED assembly, wherein the substrate has a first region (super-hydrophilic region) and a second region (super-hydrophobic region) distributed in an array.

[0081] In step 102, the adhesive liquid for MicroLED assembly is stored in the syringe of the adhesive liquid applicator. The needle is driven by a precision mobile platform to pass over the surface of the partitioned substrate. Under the action of the capillary force on the partitioned substrate surface, the adhesive liquid is distributed into the super-hydrophilic area of ​​the substrate. The volume of the distributed adhesive droplet is controlled by adjusting the pattern area of ​​the super-hydrophilic area on the substrate.

[0082] In step 103, a laser is used to locally heat the hot melt adhesive on the carrier, thereby releasing the Micro LEDs adhered to the hot melt adhesive onto the adhesive droplets in the super-hydrophilic area on the substrate. Under the action of the surface tension of the adhesive droplets, the Micro LEDs automatically align with the super-hydrophilic area, achieving self-assembly of the Micro LEDs on the substrate.

[0083] In the aforementioned steps, multiple injection syringes and needles are configured to distribute the adhesive in parallel, and multiple lasers are configured to achieve rapid and large-scale parallel release of MicroLEDs, which can realize the mass transfer and assembly of MicroLEDs.

[0084] See also Figure 12 , and refer to Figures 2 to 8 The embodiment of the present application also provides an assembly system 100 for executing the aforementioned MicroLED assembly method. The assembly system 100 includes: a moving device 7, an adhesive liquid applying device 3 and a MicroLED releasing device. The MicroLED releasing device can be a laser device 5. The assembly system 100 also includes a curing device 8.

[0085] The substrate 1 and carrier 2 can be positioned on a movable device 7, with the carrier 2 positioned above the substrate 1. The movable device 7 can move the substrate 1 and carrier 2 as needed. The adhesive liquid applicator 3 can move above the substrate 1 and inject adhesive liquid onto the surface of the substrate 1. The laser device 5, positioned above the carrier 2, can release the MicroLEDs 10 from the carrier 2 by emitting a laser. The curing device 8 can be used to cure the adhesive droplet 20, thereby securing the MicroLEDs 10 to the substrate 1.

[0086] The assembly method and assembly system 100 of MicroLED 10 provided in the embodiment of the present application, through the wettability partitioned substrate 1, combined with the centralized release transfer of MicroLED 10 (specifically, laser release transfer technology) and MicroLED self-alignment technology (specifically, surface tension self-alignment technology), can achieve fast, high-precision and large-scale transfer and assembly of MicroLED 10, and can take into account both high efficiency and high yield in large-scale assembly of MicroLED, solving the problem that traditional assembly methods cannot achieve both efficiency and yield in large-scale assembly of MicroLED 10; MicroLED 10 has no direct surface contact during the transfer and assembly process, which is conducive to improving Yield; the self-alignment technology based on surface tension can achieve an alignment accuracy of less than 1 μm, with high alignment accuracy, and does not require complex equipment and cumbersome operating procedures; this method has low requirements for the initial position deviation of MicroLED 10, and self-assembly can be achieved as long as MicroLED 10 can be released on the adhesive droplet 20 in the first area 11 with greater wettability; no special treatment of MicroLED 10 is required, and the requirements for the environment (such as electromagnetic interference, temperature, etc.) are low, and the ability to resist external interference is strong; the transfer efficiency of MicroLED 10 is high, and the transfer amount can be further increased by expanding the number of components such as needles 4 and lasers 6, thereby realizing mass transfer of MicroLED 10.

[0087] In addition, the assembly system 100 used to implement the assembly method has a simple structure, is easy to operate, has low requirements for the processing accuracy of each component, is low in cost, and can adjust the number of each device in the system according to the actual assembly volume of MicroLED 10, which is more flexible.

[0088] The above embodiments and comparative examples are only used to help understand the method of the present application and its core ideas; in addition, for ordinary technicians in this field, various other corresponding changes and modifications can be made according to the technical concept of the present application, and all these changes and modifications should fall within the scope of protection of the claims of the present application.

Claims

1. A method for assembling a MicroLED, characterized in that: include: Providing a substrate, the substrate comprising a plurality of first regions and a second region located around each of the first regions, the first regions being a liquid-philic surface, and the second regions being a liquid-phobic surface; Automatically forming an adhesive droplet in each of the first areas; as well as The MicroLEDs on the carrier are transferred onto the corresponding adhesive droplets, and the MicroLEDs are automatically aligned with the corresponding first regions to complete the assembly of the MicroLEDs on the substrate.

2. The MicroLED assembly method according to claim 1, wherein: The step of automatically forming an adhesive droplet in each of the first areas comprises: forming an adhesive liquid in the first region and / or the second region; and The adhesive liquid has different surface tensions in the first area and the second area. Under the action of the surface tensions, the adhesive liquid automatically forms the adhesive liquid droplets located in the first area.

3. The MicroLED assembly method according to claim 2, wherein: When the adhesive liquid is applied to the second area, the adhesive liquid forms droplets in the second area and moves to the first area.

4. The method for assembling a MicroLED according to claim 2, wherein: The step of forming an adhesive liquid in the first area and / or the second area includes: The adhesive liquid applying device and the substrate are caused to move relative to each other. During the relative movement, the adhesive liquid in the adhesive liquid applying device is applied to the first area and / or the second area.

5. The MicroLED assembly method according to claim 4, wherein: The adhesive liquid applying device includes a plurality of applying needles arranged side by side above the substrate.

6. The MicroLED assembly method according to claim 1, wherein: The step of transferring the MicroLEDs on the carrier to the corresponding adhesive droplets includes: placing the carrier above the substrate carrying the adhesive droplets, and ensuring that the MicroLEDs on the carrier correspond one-to-one with the adhesive droplets; and The MicroLEDs on the carrier are released, and the MicroLEDs fall onto the corresponding adhesive droplets.

7. The method for assembling a MicroLED according to claim 6, wherein: The step of automatically aligning the MicroLED with the corresponding first area includes: Under the action of the surface tension of the adhesive droplet, the MicroLED is automatically aligned with the corresponding first area.

8. The MicroLED assembly method according to claim 6, wherein: The step of releasing the MicroLED on the carrier includes: placing a carrier plate and the substrate carrying the adhesive droplets below a laser device; controlling the carrier plate and the substrate to move relative to the laser device; and The laser device is controlled to emit laser light, and the laser light is irradiated onto a portion of the carrier corresponding to the MicroLED to release the MicroLED.

9. The MicroLED assembly method according to claim 8, wherein: The plurality of MicroLEDs on the carrier are arranged in an array, and the laser device includes a plurality of lasers arranged side by side, and each of the lasers corresponds to at least one row of MicroLEDs.

10. An assembly system for executing the MicroLED assembly method according to any one of claims 1 to 9, characterized in that: The assembly system comprises: a moving device for moving the substrate and / or the carrier; an adhesive liquid applying device for applying adhesive liquid drops to the substrate; and The MicroLED releasing device is used to release the MicroLED on the carrier.

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