LED lamp bead structure, manufacturing method, PCB and LED display module

Abstract

The invention discloses an LED lamp bead structure and a manufacturing method thereof, a PCB and an LED display module, a red light chip, a green light chip and a blue light chip are packaged in the LED lamp bead structure, positive electrodes and / or negative electrodes of the red light chip, the green light chip and the blue light chip of every two lamp beads share one pin, and every two lamp beads comprise six pins; every two lamp beads are connected to the PCB in a welded mode through six pins. By combining the positive electrode or the negative electrode of the light-emitting chip of the lamp bead into one pin, the number of pins corresponding to the lamp bead is reduced, the thrust and the mounting rate of the lamp bead are improved, and the development requirements of miniaturization and integration are met at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp beads, and in particular to an LED lamp bead structure and a manufacturing method, a PCB board and an LED display module. Background Art

[0002] Currently, LED lamp beads are widely used in various electronic devices, lighting products, and display screens. In the conventional LED lamp bead structure design, three different color light-emitting chips—red, green, and blue—are usually encapsulated within a single lamp bead to achieve the function of emitting the three basic colors of red, blue, and green. The mixing of different colors of light then creates a rich variety of colors.

[0003] Each light-emitting chip has two electrodes, a positive electrode and a negative electrode. In the traditional LED lamp bead structure, for the common anode or common cathode structure of the upright chip, and the common anode structure of the flip-chip, the electrode connection method of the three light-emitting chips in a lamp bead makes a lamp bead contain four electrodes (three positive electrodes and one merged negative electrode, or three negative electrodes and one merged positive electrode), which is often said to have four pins.

[0004] With the trend toward miniaturization and integration of electronic devices, and the increasing demands for production efficiency and product performance, the traditional LED lamp structure with four pins per bead has gradually exposed certain problems. The large number of pins not only takes up more PCB board space, hindering device miniaturization, but also increases the difficulty of placement during the placement process, resulting in lower placement rates and difficulty in improving production efficiency. Furthermore, the complex connection of more pins can affect the thrust between the pins, which in turn affects the stability and reliability of the connection between the LED bead and the PCB.

[0005] Therefore, those skilled in the art are in urgent need of developing a new technical solution to solve the above problems. Summary of the Invention

[0006] In order to overcome the problems existing in the related art, the present invention discloses an LED lamp bead structure and a manufacturing method, a PCB board and an LED display module.

[0007] According to a first aspect of the disclosed embodiments of the present invention, there is provided a structure in which two LED lamp beads are packaged together;

[0008] Each lamp bead includes: a red light chip, a green light chip and a blue light chip. The positive and / or negative electrodes of the red light chip, green light chip and blue light chip of every two lamp beads packaged together share one pin, and every two lamp beads contain six pins;

[0009] Every two lamp beads are connected to the PCB board through the six pins by welding.

[0010] Optionally, in every two lamp beads, the positive electrode of the red light chip, the positive electrode of the green light chip and the positive electrode of the blue light chip of each lamp bead share a pin, which serves as the first pin and the second pin respectively;

[0011] The negative electrodes of the red light chips of every two lamp beads share one pin, which serves as the third pin;

[0012] The negative electrodes of the green light chips of every two lamp beads share one pin, which serves as the fourth pin;

[0013] The negative poles of the blue light chips of every two lamp beads share one pin, which serves as the fifth pin;

[0014] Every two lamp beads further include a sixth pin, and the first pin, the second pin, the third pin, the fourth pin, the fifth pin and the sixth pin form a symmetrical structure.

[0015] Optionally, in every two lamp beads, the negative electrode of the red light chip, the negative electrode of the green light chip and the negative electrode of the blue light chip of each lamp bead share a pin, which serves as the first pin and the second pin respectively;

[0016] The positive electrodes of the red light chips of every two lamp beads share one pin, which serves as the third pin;

[0017] The positive electrodes of the green light chips of every two lamp beads share one pin, which serves as the fourth pin;

[0018] The positive electrodes of the blue light chips of every two lamp beads share one pin, which serves as the fifth pin;

[0019] Every two lamp beads further include a sixth pin, and the first pin, the second pin, the third pin, the fourth pin, the fifth pin and the sixth pin form a symmetrical structure.

[0020] Optionally, in the chips of each two lamp beads, the chip electrodes with a common positive pole are connected to the common positive pole of the bracket through a connecting wire, and the chip electrodes with a common negative pole are connected to the common negative pole of the bracket through a connecting wire;

[0021] The bracket is welded to a common pin through a conductive layer of the bracket, and the pin is welded to the PCB board.

[0022] Optionally, the length of the connecting line is greater than the length of a conventional connecting line corresponding to a chip without a shared positive electrode or a shared negative electrode, and the curvature of the connecting line is greater than the curvature of a conventional connecting line corresponding to a chip without a shared positive electrode or a shared negative electrode.

[0023] According to a second aspect of the disclosed embodiments of the present invention, there is provided a PCB board, the PCB board comprising a plurality of pads;

[0024] Among the plurality of solder pads, every six solder pads are correspondingly arranged with two lamp bead structures;

[0025] The six pins of the two lamp bead structures are respectively welded on the six welding pads.

[0026] Optionally, the pad area of ​​the PCB board is 1.2m2-1.3m2, where m is the regular pad area corresponding to the pins of the lamp bead structure that does not share a common positive pole or a common negative pole.

[0027] According to a third aspect of the disclosed embodiment of the present invention, an LED display module is provided, which includes the LED lamp bead structure described in the first aspect of the disclosed embodiment of the present invention and the PCB board designed corresponding to the lamp bead structure described in the second aspect of the disclosed embodiment of the present invention.

[0028] According to a fourth aspect of the disclosed embodiments of the present invention, a method for manufacturing an LED lamp bead structure is provided, the method comprising:

[0029] The red light chip, green light chip and blue light chip are encapsulated in a lamp bead structure, and every two lamp beads are encapsulated together;

[0030] Determining a chip that shares a positive electrode and / or a chip that shares a negative electrode among the red light chip, the green light chip, and the blue light chip;

[0031] Connect the chip electrodes with a common positive electrode to the common positive electrode of the bracket through a connecting wire, and connect the chip electrodes with a common negative electrode to the common negative electrode of the bracket through a connecting wire;

[0032] Welding the conductive layer of the bracket to the common pin;

[0033] The pins are welded and connected to a PCB board designed corresponding to the structure of the LED lamp beads.

[0034] Optionally, the red light chip, the green light chip, and the blue light chip are encapsulated in one lamp bead structure, including:

[0035] Apply silver glue to the red light chip and bake it for curing;

[0036] The green light chip and the blue light chip are subjected to a conventional glue application operation and baked for curing. The conventional glue is epoxy resin or silicone.

[0037] In summary, the present invention discloses an LED lamp bead structure and manufacturing method, a PCB board, and an LED display module. The LED lamp bead structure encapsulates a red chip, a green chip, and a blue chip. The positive and / or negative electrodes of the red, green, and blue chips of each pair of lamp beads share a single pin, and each pair of lamp beads contains six pins. Each pair of lamp beads is soldered to the PCB board via the six pins. By combining the positive or negative electrodes of the lamp bead light-emitting chips into a single pin, the number of corresponding pins of the lamp bead can be reduced, the thrust and the lamp bead mounting speed can be improved, and the development needs of miniaturization and integration can be met.

[0038] In addition, by increasing the length and curvature of the connecting wires, heat dissipation and lighting efficiency are enhanced, preventing wire breakage and increasing overall thrust. Furthermore, by changing the order of chip dispensing and baking and curing, the defective rate of LEDs is reduced and production capacity is increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0040] Figure 1 This is a schematic diagram of a two-in-one lamp bead with a common anode and a normal-mounted chip according to an exemplary embodiment;

[0041] Figure 2 is based on Figure 1 The following is a schematic diagram of the structure of a two-in-one flip-chip lamp with a common anode;

[0042] Figure 3 is based on Figure 1 The schematic diagram of the structure of a conventional lamp bead with a common anode and a positive chip is shown;

[0043] Figure 4 is based on Figure 1 The following is a schematic diagram of the structure of a conventional flip-chip lamp with a common anode;

[0044] Figure 5 This is a schematic structural diagram of another two-in-one lamp bead with a common cathode and a normal chip according to an exemplary embodiment;

[0045] Figure 6 is based on Figure 5 The following is a schematic diagram of the structure of a conventional flip-chip lamp with a common cathode;

[0046] Figure 7 is a schematic diagram showing a gold wire arc according to an exemplary embodiment;

[0047] Figure 8The figure is a flow chart of a method for manufacturing an LED lamp bead structure according to an exemplary embodiment. DETAILED DESCRIPTION

[0048] The following is a detailed description of the specific embodiments disclosed in the present invention in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention and are not intended to limit the present invention.

[0049] The disclosed embodiment of the present invention provides an LED lamp bead structure, which is a structure in which two lamp beads are packaged together; each lamp bead includes: a red light chip, a green light chip and a blue light chip, and the positive and / or negative poles of the red light chip, green light chip and blue light chip of each two packaged lamp beads share a pin, and each two lamp beads include six pins; each two lamp beads are welded to a PCB board through the six pins.

[0050] For example, an LED lamp typically contains three different colored light-emitting chips: a red chip, a green chip, and a blue chip, which emit red, blue, and green light, respectively. Each light-emitting chip has a positive electrode and a negative electrode. The negative electrodes of these three chips within a single lamp bead are connected together, while the positive electrodes are independent. Therefore, a single lamp bead contains four electrodes (three positive electrodes and one combined negative electrode), which is often referred to as having four pins.

[0051] The technical solution in the disclosed embodiments of the present invention connects the independent positive or negative electrodes in conventional LED lamp bead structures (there are also cases where the positive electrodes of three light-emitting chips are connected together, while the negative electrodes are independent of each other) through connecting wires, so that they share a single pin, thereby reducing the number of pins corresponding to a lamp bead and improving thrust and placement speed. When the independent electrodes of two lamp beads are connected together and the two lamp beads are packaged together, it is called a two-in-one lamp bead. Each two-in-one lamp bead contains six pins (less than the eight pins in conventional technology) and is soldered to the PCB board.

[0052] Figure 1 This is a schematic diagram of a two-in-one lamp bead with a common anode and a normal chip according to an exemplary embodiment. Figure 1 As shown, in every two lamp beads, the positive pole of the red light chip, the positive pole of the green light chip and the positive pole of the blue light chip of each lamp bead share a pin, which serves as the first pin and the second pin respectively; the negative pole of the red light chip of every two lamp beads shares a pin, which serves as the third pin; the negative pole of the green light chip of every two lamp beads shares a pin, which serves as the fourth pin; the negative pole of the blue light chip of every two lamp beads shares a pin, which serves as the fifth pin.

[0053] In addition, every two lamp beads further include a sixth pin, and the first pin, the second pin, the third pin, the fourth pin, the fifth pin and the sixth pin form a symmetrical structure.

[0054] For example, in Figure 1 The two-in-one lamp bead shown features a common anode structure with upright chips. Specifically, in each individual lamp bead, the positive electrodes of the red, green, and blue chips share a common pin. The two-in-one lamp bead contains two common anodes, serving as first pin C1 and second pin C2. The cathodes of the red chips of the two lamp beads share a common pin, serving as third pin R12; the cathodes of the green chips of the two lamp beads share a common pin, serving as fourth pin G12; and the cathodes of the blue chips of the two lamp beads share a common pin, serving as fifth pin B12. In addition, each two-in-one lamp bead includes a sixth pin. The six pins are symmetrically arranged, corresponding to the six solder pads on the PCB board. The six pins are designed to be bilaterally symmetrical (a common design pattern for LED lamp bead pins). Similarly, the pads corresponding to the pins on the PCB are also bilaterally symmetrical. The pins are fixed to the pads using solder paste (SMT: surface mount technology). This ensures consistent thrust on both sides of the symmetrically designed lamp bead, preventing inconsistent thrust from different surfaces on a single module, which could cause uneven damage to the lamp bead due to collisions, causing greater maintenance difficulties. Without a symmetrical pad and pin structure, the asymmetrical pads would require continuous skipping of blank spots when applying solder paste, making unified operation difficult and placing higher demands on both the machine and the operator.

[0055] Figure 2 A schematic diagram of a flip-chip common anode structure is also given. Figure 2 A two-in-one lamp bead still contains six pins, corresponding to the six pads on the PCB board. Figure 3 and Figure 4 It shows the common anode lamp bead structure of the upright chip and flip chip in the prior art. It can be seen that the positive poles of the three chips in each lamp bead share one pin, and the negative poles of the three chips are independent pins, that is, one lamp bead corresponds to four pins.

[0056] Figure 5 This is a schematic diagram of another two-in-one lamp bead with a common cathode and a positive chip according to an exemplary embodiment. Figure 5As shown, in every two lamp beads, the cathode of the red light chip, the cathode of the green light chip, and the cathode of the blue light chip of each lamp bead share a pin, which serves as the first pin and the second pin respectively; the positive electrodes of the red light chip of every two lamp beads share a pin, which serves as the third pin; the positive electrodes of the green light chip of every two lamp beads share a pin, which serves as the fourth pin; and the positive electrodes of the blue light chip of every two lamp beads share a pin, which serves as the fifth pin. Similarly, every two lamp beads also include a sixth pin. The first pin, the second pin, the third pin, the fourth pin, the fifth pin, and the sixth pin form a symmetrical structure.

[0057] For example, in Figure 5 The two-in-one lamp bead shown has a common cathode structure with a positive chip. Specifically, in each individual lamp bead, the negative pole of the red light chip, the negative pole of the green light chip, and the negative pole of the blue light chip share a pin. The two-in-one lamp bead contains two common cathodes, which serve as the first pin C1 and the second pin C2 respectively. The positive poles of the red light chips of the two lamp beads share a pin, which serves as the third pin R12; the positive poles of the green light chips of the two lamp beads share a pin, which serves as the fourth pin G12; the positive poles of the blue light chips of the two lamp beads share a pin, which serves as the fifth pin B12. In addition, each two-in-one lamp bead also includes a sixth pin. The six pins are symmetrically arranged, which also correspond to the 6 pads on the PCB board. Figure 6 It shows the common cathode chip lamp bead structure in the prior art. It can be seen that the negative poles of the three chips in each lamp bead share one pin, and the positive poles of the three chips are independent pins, that is, one lamp bead corresponds to 4 pins.

[0058] In addition, in the chips of every two lamp beads, the chip electrodes with a common positive pole are connected to the common positive pole of the bracket through a connecting wire, and the chip electrodes with a common negative pole are connected to the common negative pole of the bracket through a connecting wire; the bracket is welded to the common pin through the conductive layer of the bracket, and the pin is welded and connected to the PCB board.

[0059] Preferably, the connecting wire is gold wire, which is highly reliable and corrosion-resistant and is commonly used in lamp bead structures. Alternatively, the connecting wire can be copper wire, silver-clad copper wire, silver wire, alloy wire, etc. From a cost perspective, copper wire / silver-clad copper wire < alloy wire < gold wire < silver wire; from a reliability perspective, gold wire > alloy wire > silver wire > copper wire / silver-clad copper wire; from a conductivity perspective, silver wire > gold wire > copper wire > alloy wire; and for corrosion resistance, gold wire > alloy wire > silver-clad copper wire > copper wire.

[0060] For example, it can be understood that the principle of light emission of a lamp bead is: the current flows from the PCB board through the pins into the bracket, and then through the connecting wires to the chip electrodes, ensuring the lamp bead emits light. Therefore, the chip electrodes with a common positive or negative pole need to be connected to the bracket via connecting wires, and the conductive layer of the bracket is soldered to the common pins.

[0061] Furthermore, the length of the connecting wire is longer than the conventional connecting wire length corresponding to the chip without a common positive electrode or a common negative electrode, and the curvature of the connecting wire is greater than the conventional connecting wire curvature corresponding to the chip without a common positive electrode or a common negative electrode. Increasing the length of the connecting wire can enhance heat dissipation and light efficiency, and prevent the connecting wire (gold wire) from breaking. Figure 7 As shown, increasing the curvature of the gold wire can enhance the overall thrust.

[0062] The disclosed embodiment of the present invention also includes a PCB board, which includes a plurality of solder pads; among the plurality of solder pads, every six solder pads are arranged corresponding to two lamp bead structures; the six pins of the two lamp bead structures are respectively welded on the six solder pads, and are designed corresponding to the lamp bead structures, and the six solder pads are in a left-right symmetrical structure.

[0063] Furthermore, the PCB pad area is 1.2m-1.3m, where m is the conventional pad area for pins of a lamp bead structure that does not share a common positive or negative electrode. Since the pins soldered to the pads share a common positive or negative electrode, the pad area needs to be appropriately increased, for example, by 20%-30%, but generally not more than twice the conventional pad area.

[0064] The disclosed embodiment of the present invention also includes an LED display module, which includes an LED lamp bead structure and a PCB board designed corresponding to the lamp bead structure.

[0065] Figure 8 FIG. 1 is a flow chart of a method for manufacturing an LED lamp bead structure according to an exemplary embodiment. Figure 8 As shown, the method includes:

[0066] In step 801, a red light chip, a green light chip, and a blue light chip are encapsulated in a lamp bead structure;

[0067] Wherein, every two lamp beads are packaged together.

[0068] In step 802 , chips that share a positive electrode and / or chips that share a negative electrode among the red light chip, the green light chip, and the blue light chip are determined.

[0069] In step 803, the chip electrodes with a common positive pole are connected to the common positive pole of the bracket through a connecting wire, and the chip electrodes with a common negative pole are connected to the common negative pole of the bracket through a connecting wire.

[0070] In step 804, the conductive layer of the bracket is welded to the common pin.

[0071] In step 805, the pin is soldered to a PCB board designed corresponding to the structure of the LED lamp bead.

[0072] Specifically, the red light chip, green light chip and blue light chip are encapsulated in a lamp bead structure, including:

[0073] Apply silver glue to the red light chip and bake it for curing;

[0074] The green light chip and the blue light chip are subjected to conventional glue application and baked for curing. The conventional glue is epoxy resin or silicone.

[0075] For example, in the prior art, when curing chips, silver glue is applied to the red chip first, followed by conventional glue application to the blue and green chips, and finally baked to cure. This approach results in a high defect rate. The disclosed embodiments of the present invention propose a method of applying silver glue to the red chip, then baking and curing it, and then applying silver glue and baking and curing the green and blue chips, which can effectively reduce the defect rate.

[0076] In summary, the present invention discloses an LED lamp bead structure and manufacturing method, a PCB board, and an LED display module. The LED lamp bead structure encapsulates: a red light chip, a green light chip, and a blue light chip. The positive and / or negative electrodes of the red, green, and blue light chips of each pair of lamp beads share a single pin, and each pair of lamp beads contains six pins. Each pair of lamp beads is soldered to the PCB board via the six pins. By combining the positive or negative electrodes of the lamp bead light-emitting chips into a single pin, the number of corresponding pins of the lamp bead can be reduced, the thrust and the lamp bead mounting speed can be improved, and the development needs of miniaturization and integration can be met.

[0077] In addition, by increasing the length and curvature of the connecting wires, heat dissipation and lighting efficiency are enhanced, preventing wire breakage and increasing overall thrust. Furthermore, by changing the order of chip dispensing and baking and curing, the defective rate of LEDs is reduced and production capacity is increased.

[0078] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details of the above embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the scope of protection of the present disclosure.

[0079] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0080] In addition, the various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. An LED lamp bead structure, characterized in that: The LED lamp bead is a structure in which two lamp beads are packaged together; Each lamp bead includes: a red light chip, a green light chip and a blue light chip. The positive and / or negative electrodes of the red light chip, green light chip and blue light chip of each two lamp beads packaged together share one pin, and each two lamp beads contain six pins; Every two lamp beads are connected to the PCB board through the six pins by welding.

2. The LED lamp bead structure according to claim 1, characterized in that: In every two lamp beads, the positive electrode of the red light chip, the positive electrode of the green light chip and the positive electrode of the blue light chip of each lamp bead share a pin, which serves as the first pin and the second pin respectively; The negative electrodes of the red light chips of every two lamp beads share one pin, which serves as the third pin; The negative electrodes of the green light chips of every two lamp beads share one pin, which serves as the fourth pin; The negative poles of the blue light chips of every two lamp beads share one pin, which serves as the fifth pin; Every two lamp beads further include a sixth pin, and the first pin, the second pin, the third pin, the fourth pin, the fifth pin and the sixth pin form a symmetrical structure.

3. The LED lamp bead structure according to claim 1, characterized in that: In every two lamp beads, the negative electrode of the red light chip, the negative electrode of the green light chip and the negative electrode of the blue light chip of each lamp bead share a pin, which serves as the first pin and the second pin respectively; The positive electrodes of the red light chips of every two lamp beads share one pin, which serves as the third pin; The positive electrodes of the green light chips of every two lamp beads share one pin, which serves as the fourth pin; The positive electrodes of the blue light chips of every two lamp beads share one pin, which serves as the fifth pin; Every two lamp beads further include a sixth pin, and the first pin, the second pin, the third pin, the fourth pin, the fifth pin and the sixth pin form a symmetrical structure.

4. The LED lamp bead structure according to claim 1, characterized in that: In the chips of each of the two lamp beads, the chip electrodes with a common positive pole are connected to the common positive pole of the bracket through a connecting wire, and the chip electrodes with a common negative pole are connected to the common negative pole of the bracket through a connecting wire; The bracket is welded to a common pin through a conductive layer of the bracket, and the pin is welded to the PCB board.

5. The LED lamp bead structure according to claim 4, characterized in that: The length of the connecting line is greater than the length of a conventional connecting line corresponding to chips without a common positive electrode or a common negative electrode, and the curvature of the connecting line is greater than the curvature of a conventional connecting line corresponding to chips without a common positive electrode or a common negative electrode.

6. A PCB board, characterized in that: The PCB board includes a plurality of pads; Among the plurality of solder pads, every six solder pads are correspondingly arranged with two lamp bead structures; The six pins of the two lamp bead structures are respectively welded on the six welding pads.

7. The PCB board according to claim 6, characterized in that: The pad area of ​​the PCB board is 1.2m-1.3m, where m is the conventional pad area corresponding to the pins of the lamp bead structure without a shared positive pole or a shared negative pole.

8. An LED display module, characterized in that: The LED display module includes the LED lamp bead structure according to any one of claims 1 to 5 and the PCB board designed corresponding to the lamp bead structure according to any one of claims 6 to 7.

9. A method for manufacturing an LED lamp bead structure, characterized in that: The method comprises: The red light chip, green light chip and blue light chip are encapsulated in a lamp bead structure, and every two lamp beads are encapsulated together; Determining a chip that shares a positive electrode and / or a chip that shares a negative electrode among the red light chip, the green light chip, and the blue light chip; Connect the chip electrodes with a common positive electrode to the common positive electrode of the bracket through a connecting wire, and connect the chip electrodes with a common negative electrode to the common negative electrode of the bracket through a connecting wire; Welding the conductive layer of the bracket to the common pin; The pins are welded and connected to a PCB board designed corresponding to the structure of the LED lamp beads.

10. The method for manufacturing an LED lamp bead structure according to claim 9, characterized in that: The red light chip, green light chip and blue light chip are encapsulated in a lamp bead structure, including: Apply silver glue to the red light chip and bake it for curing; The green light chip and the blue light chip are subjected to a conventional glue application operation and baked for curing. The conventional glue is epoxy resin or silicone.

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