Display panel and preparation method thereof

Abstract

The invention provides a display panel and a preparation method thereof, and the display panel comprises a light-emitting layer; the first inorganic film layer is located on one side of the light-emitting layer and comprises at least one first sub-inorganic film layer, the dielectric constant of the first sub-inorganic film layer ranges from 3.0 F / m to 6.0 F / m, and the thickness of the first sub-inorganic film layer ranges from 0.2 mu m to 4 mu m; the first organic film layer is located on the side, away from the light-emitting layer, of the first inorganic film layer, the dielectric constant of the first organic film layer ranges from 3.0 F / m to 4.5 F / m, and the thickness of the first organic film layer ranges from 10 microns to 100 microns; the touch layer is located on the side, away from the first inorganic film layer, of the first organic film layer. The organic film layer with a certain thickness is additionally arranged between the light-emitting layer and the touch layer, so that the stray capacitance between the light-emitting layer and the touch layer is reduced, the signal-to-noise ratio influencing touch is effectively reduced, and the influence on the touch function is reduced.

Description

Technical Field

[0001] The present invention relates to the field of touch control of display panels, and in particular to a display panel and a method for preparing the same. Background Art

[0002] As a new generation of display technology, OLED (Organic Light Emitting Diode) displays have the advantages of low power consumption, high color gamut, high brightness, high refresh rate, wide viewing angle, and high response speed. In particular, the high refresh rate makes OLED displays more suitable for display in mobile devices, and therefore they are increasingly widely used.

[0003] At present, in the preparation process of the touch layer of the OLED display panel, TFE (Thin Film Encapsulation) technology is usually used to encapsulate the OLED components, and then the TP (Touch Panel) process is performed on the basis of the TFE film layer. Since parasitic capacitance is formed between the metal circuit of the TP film layer and the OLED cathode film layer, the signal-to-noise ratio of the touch panel is increased, thereby affecting the touch function of the panel.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to ordinary technicians in this field. Summary of the Invention

[0005] In view of this, the present invention provides a display panel and a method for preparing the same, by adding an organic film layer of a certain thickness between the light-emitting layer and the touch layer to reduce the parasitic capacitance between the light-emitting layer and the touch layer, thereby effectively reducing the signal-to-noise ratio that affects touch and reducing the impact on the touch function.

[0006] One aspect of the present invention provides a display panel, comprising:

[0007] luminescent layer;

[0008] A first inorganic film layer, located on one side of the light-emitting layer, includes at least one first sub-inorganic film layer, wherein the dielectric constant of the first sub-inorganic film layer is in the range of 3.0F / m to 6.0F / m, and the thickness of the first sub-inorganic film layer is in the range of 0.2um to 4um;

[0009] a first organic film layer, located on a side of the first inorganic film layer away from the light-emitting layer, wherein the dielectric constant of the first organic film layer ranges from 3.0 F / m to 4.5 F / m, and the thickness of the first organic film layer ranges from 10 μm to 100 μm; and

[0010] The touch layer is located on a side of the first organic film layer facing away from the first inorganic film layer.

[0011] In some embodiments, the display panel further comprises:

[0012] The second organic film layer is arranged between the first inorganic film layer and the first organic film layer. The dielectric constant of the second organic film layer ranges from 2.0F / m to 3.0F / m, and the thickness of the second organic film layer ranges from 2um to 16um.

[0013] In some embodiments, the display panel further comprises:

[0014] The second inorganic film layer is arranged between the first organic film layer and the second organic film layer, and includes at least one second sub-inorganic film layer. The dielectric constant of the second sub-inorganic film layer ranges from 3.0F / m to 6.0F / m, and the thickness of the second sub-inorganic film layer ranges from 0.2um to 4um.

[0015] In some embodiments, the first organic film layer is attached between the first inorganic film layer and the touch layer by a film material attaching device.

[0016] In some embodiments, the material of the first organic film layer includes a substrate and a glue material, the material of the substrate is at least one of the following: PET, PEN, PP, PFA, PE, and the material of the glue material is at least one of the following: PU and silicone-based glue.

[0017] In some embodiments, the second organic film layer is prepared by pattern printing using an inkjet printing device, cured using UV light, and baked, wherein the ink used by the inkjet printing device is acrylic ink or epoxy ink.

[0018] In some embodiments, the patterning of the first organic film layer is achieved in an array yellow light process or a module cutting process.

[0019] In some embodiments, the first inorganic film layer and / or the second inorganic film layer are deposited using PECVD;

[0020] The material of the first inorganic film layer and / or the second inorganic film layer is at least one or more of the following combinations: SiNx, SiOxNy, SiOx, and SiCx.

[0021] In some embodiments, the display panel further comprises:

[0022] a substrate, disposed on a side of the light-emitting layer facing away from the touch layer;

[0023] The thin film transistor layer is arranged between the substrate and the light emitting layer.

[0024] Another aspect of the present invention further provides a method for preparing a display panel, which is used to prepare the above-mentioned display panel, comprising the following steps:

[0025] preparing the thin film transistor layer on one side of the substrate;

[0026] vapor-depositing the light-emitting layer on a side of the thin film transistor layer facing away from the substrate;

[0027] Depositing the first inorganic film layer on a side of the light-emitting layer away from the thin film transistor layer;

[0028] attaching the first organic film layer to a side of the first inorganic film layer facing away from the light-emitting layer, and pressurizing and degassing the first organic film layer; and

[0029] The touch layer is formed on a side of the first organic film layer facing away from the first inorganic film layer.

[0030] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings are incorporated into and constitute a part of this specification, illustrate embodiments consistent with the present invention, and together with the description, serve to explain the principles of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0032] Figure 1 A schematic structural diagram of a display panel according to a first embodiment of the present invention is shown;

[0033] Figure 2 A schematic structural diagram of a display panel according to a second embodiment of the present invention is shown;

[0034] Figure 3 A schematic structural diagram showing a display panel according to a third embodiment of the present invention;

[0035] Figure 4 A flow chart showing a method for manufacturing a display panel of the present invention is shown.

[0036] Reference numerals:

[0037] 1 substrate

[0038] 2 Thin Film Transistor Layer

[0039] 3. Luminescent layer

[0040] 41 first inorganic film layer

[0041] 42 second inorganic film layer

[0042] 51 first organic film layer

[0043] 52 second organic film layer

[0044] 6 Touch layer DETAILED DESCRIPTION

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be comprehensive and complete and will fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the figures represent identical or similar structures, and thus a repeated description thereof will be omitted.

[0046] The terms "first," "second," and similar terms used in the specific description do not denote any order, quantity, or importance, but are simply used to distinguish different components. Furthermore, in the description of the present invention, the terms "upper," "lower," and similar terms indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings. These terms are used solely for ease of description and do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0047] It should be noted that, in the absence of conflict, the embodiments of the present invention and features in different embodiments may be combined with each other.

[0048] Currently, during the fabrication of the touch layer of OLED display panels, parasitic capacitance forms between the metal traces of the TP film and the OLED cathode film, increasing the touch panel's signal-to-noise ratio and thus affecting the panel's touch functionality. Specifically, the relationship between parasitic capacitance, dielectric constant, and thickness satisfies the following formula: C = εs / d. Here, C represents the magnitude of the parasitic capacitance; ε represents the dielectric constant of the dielectric; S represents the area between the two electrodes; and d represents the dielectric thickness. In current display panel fabrication, S is determined by the size of the display device. Parasitic capacitance can only be reduced by changing the dielectric constant and thickness of the dielectric.

[0049] The inventors of this case have conducted careful and in-depth research and have provided a solution to the problems existing in the prior art. The present invention provides a display panel and a method for preparing the same, wherein the display panel includes: a light-emitting layer; a first inorganic film layer, located on one side of the light-emitting layer, including at least one first sub-inorganic film layer, the dielectric constant of the first sub-inorganic film layer ranges from 3.0F / m to 6.0F / m, and the thickness of the first sub-inorganic film layer ranges from 0.2um to 4um; a first organic film layer, located on the side of the first inorganic film layer away from the light-emitting layer, the dielectric constant of the first organic film layer ranges from 3.0F / m to 4.5F / m, and the thickness of the first organic film layer ranges from 10um to 100um; a touch layer, located on the side of the first organic film layer away from the first inorganic film layer. The present invention reduces the parasitic capacitance between the light-emitting layer and the touch layer by adding an organic film layer of a certain thickness between the light-emitting layer and the touch layer, thereby effectively reducing the signal-to-noise ratio that affects touch and reducing the impact on the touch function.

[0050] The specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings.

[0051] [First embodiment]

[0052] Figure 1 FIG. 1 is a schematic structural diagram of a display panel according to a first embodiment of the present invention.

[0053] The display panel of this embodiment includes: a substrate 1 , a thin film transistor layer 2 , a light emitting layer 3 , a first inorganic film layer 41 , a first organic film layer 51 , and a touch layer 6 , which are arranged in order from bottom to top.

[0054] In this embodiment, the first inorganic film layer 41 includes at least one first sub-inorganic film layer. The dielectric constant of the first sub-inorganic film layer ranges from 3.0F / m to 6.0F / m, and the thickness of the first sub-inorganic film layer ranges from 0.2um to 4um to reduce the parasitic capacitance between the light-emitting layer and the touch layer. That is, the first inorganic film layer 41 can be a single layer or a multilayer film. When the first inorganic film layer 41 is a multilayer film layer, the different first sub-inorganic film layers can be of the same film quality or of different film quality. The material of the first sub-inorganic film layer can be a combination of one or more of the following: SiNx, SiOxNy, SiOx, SiCx, or other materials that meet the above-mentioned dielectric constant range. The thickness of different first sub-inorganic film layers can be the same or different, and is not limited to this. It is sufficient that the thickness of a single first sub-inorganic film layer meets the above-mentioned thickness range. During the preparation process, the first inorganic film layer 41 is deposited using PECVD. PECVD, or Plasma Enhanced Chemical Vapor Deposition, is a deposition technique used in thin film fabrication. It utilizes the presence of plasma to enhance gas-phase chemical reactions, thereby depositing thin films on substrate surfaces.

[0055] In this embodiment, the dielectric constant of the first organic film layer 51 ranges from 3.0F / m to 4.5F / m, and the thickness of the first organic film layer 51 ranges from 10um to 100um to reduce the parasitic capacitance between the light-emitting layer and the touch layer. The materials of the first organic film layer 51 include a substrate and a glue material. The material of the substrate can be one of the following: PET, PEN, PP, PFA, PE. The material of the glue material can be one of the following: PU and silicone-based glue. The materials of the substrate and the glue material can also be other materials that meet the above-mentioned dielectric constant range. Among them, PET (Polyethylene Terephthalate) is polyethylene terephthalate, a common plastic material with good transparency and strong mechanical properties. It is often used to make transparent films and containers. PEN (Polyethylene Naphthalate) is polyethylene terephthalate, which is similar to PET, but is derived from naphthenic acid and has a higher glass transition temperature and better thermal stability. PP (Polypropylene) is polypropylene, a thermoplastic with good heat resistance and chemical stability, and is commonly used to make films, bottles, etc. PFA (Perfluoroalkoxy alkane) is polytetrafluoroethylene copolymer, a thermoplastic with excellent chemical corrosion resistance and heat resistance similar to polytetrafluoroethylene (PTFE), but easier to process. PE (Polyethylene) is a common plastic, including high-density polyethylene (HDPE) and low-density polyethylene (LDPE), with good chemical stability and electrical insulation. PU (Polyurethane) is polyurethane, a thermosetting or thermoplastic elastomer, commonly used to make elastomeric materials such as foam plastics, coatings, sealants, etc. The first organic film layer 51 is attached between the first inorganic film layer 41 and the touch layer 6 by a film material attaching device. The patterning of the first organic film layer 51 is achieved in an array yellow light process or a module cutting process. Among them, the array yellow light process is a process involving the formation of display units on a substrate to create a pixel matrix in the manufacture of a display panel. The module cutting process is the process of cutting large-sized flat panel display panels into smaller modules to meet the size requirements of the final product.

[0056] The display panel of this embodiment adds a first organic film layer 51 of a certain thickness between the light-emitting layer 3 and the touch layer 6 to reduce parasitic capacitance between the light-emitting layer 3 and the touch layer 6, thereby effectively lowering the signal-to-noise ratio that affects touch control and minimizing the impact on touch functionality. Furthermore, the first organic film layer 51 flattens the first inorganic film layer 41, relieves stress on the display panel, and isolates the light-emitting layer 3 from the touch layer 6.

[0057] [Second embodiment]

[0058] Figure 2FIG. 1 is a schematic structural diagram of a display panel according to a second embodiment of the present invention.

[0059] The display panel of this embodiment includes: a substrate 1 , a thin film transistor layer 2 , a light emitting layer 3 , a first inorganic film layer 41 , a second organic film layer 52 , a first organic film layer 51 , and a touch layer 6 arranged in order from bottom to top.

[0060] The dielectric constant of the second organic film layer 52 ranges from 2.0F / m to 3.0F / m, and the thickness of the second organic film layer 52 ranges from 2um to 16um to reduce the parasitic capacitance between the light-emitting layer and the touch layer. The second organic film layer 52 is patterned and printed using an inkjet printer with a thickness of 2um to 16um. UV light is used for curing, and then baked for 0.5 hours. The ink used in the inkjet printer is an acrylic ink or an epoxy ink. In other words, the patterning of the second organic film layer 52 is achieved during the printing process, which is different from the first organic film layer 51.

[0061] For other aspects of this embodiment, reference can be made to the first embodiment, and similarities will not be repeated here.

[0062] The display panel of this embodiment further reduces the parasitic capacitance between the light-emitting layer 3 and the touch layer 6 by adding a first organic film layer 51 of a certain thickness and a second organic film layer 52 with a low dielectric constant between the light-emitting layer 3 and the touch layer 6. This effectively lowers the signal-to-noise ratio (SNR) that affects touch control and minimizes the impact on touch functionality. Furthermore, the first and second organic film layers 51, 52 also flatten the first inorganic film layer 41, relieve stress on the display panel, and isolate the light-emitting layer 3 from the touch layer 6.

[0063] [Third embodiment]

[0064] Figure 3 FIG. 1 is a schematic structural diagram of a display panel according to a third embodiment of the present invention.

[0065] The display panel of this embodiment includes: a substrate 1 , a thin film transistor layer 2 , a light emitting layer 3 , a first inorganic film layer 41 , a second organic film layer 52 , a second inorganic film layer 42 , a first organic film layer 51 , and a touch layer 6 , arranged in order from bottom to top.

[0066] In this embodiment, the second inorganic film layer 42 includes at least one second sub-inorganic film layer. The dielectric constant of the second sub-inorganic film layer ranges from 3.0F / m to 6.0F / m, and the thickness of the second sub-inorganic film layer ranges from 0.2um to 4um to reduce the parasitic capacitance between the light-emitting layer and the touch layer. That is, the first inorganic film layer 41 can be a single layer or a multilayer film. When the second inorganic film layer 42 is a multilayer film layer, the different second sub-inorganic film layers can be of the same film quality or of different film quality. The material of the first sub-inorganic film layer can be a combination of one or more of the following: SiNx, SiOxNy, SiOx, SiCx, or other materials that meet the above-mentioned dielectric constant range. The thickness of different first sub-inorganic film layers can be the same or different, and is not limited to this. It is sufficient that the thickness of a single first sub-inorganic film layer meets the above-mentioned thickness range. During the preparation process, the second inorganic film layer 42 is deposited using PECVD.

[0067] For other aspects of this embodiment, reference can be made to the first embodiment, and similarities will not be repeated here.

[0068] Compared with the second embodiment, the display panel of this embodiment has a second inorganic film layer 42 added, which further increases the distance between the light-emitting layer 3 and the touch layer 6 and reduces the parasitic capacitance between the light-emitting layer 3 and the touch layer 6 .

[0069] [Fourth embodiment]

[0070] Figure 4 A flow chart showing a method for manufacturing a display panel of the present invention is shown.

[0071] This embodiment provides a method for manufacturing a display panel, which is used to manufacture the display panel of the first embodiment, including the following steps:

[0072] S110 , preparing a thin film transistor layer 2 on one side of the substrate 1 .

[0073] S120 , evaporating a light-emitting layer 3 on the side of the thin film transistor layer 2 facing away from the substrate 1 .

[0074] S130: Deposit a first inorganic film layer 41 on the side of the light-emitting layer 3 facing away from the thin-film transistor layer 2. Specifically, the deposition can be performed using a PECVD method. PECVD, or plasma-enhanced chemical vapor deposition, is a deposition technique used in thin-film fabrication. It utilizes the presence of plasma to enhance gas-phase chemical reactions, thereby depositing thin films on the substrate surface.

[0075] S140: Use film attaching equipment to attach the first organic film layer 51 to the side of the first inorganic film layer 41 facing away from the light-emitting layer 3, and pressurize and degas the first organic film layer 51. In addition, patterning of the first organic film layer 51 can also be achieved in the array yellow light process or module cutting process.

[0076] S150 , forming a touch layer 6 on a side of the first organic film layer 51 facing away from the first inorganic film layer 41 , wherein the touch layer 6 is directly formed on the first organic film layer 51 , that is, in direct contact with the first organic film layer 51 .

[0077] The configuration of the first inorganic film layer 41 and the first organic film layer 51 as well as other film layers, as well as the technical effects of this embodiment are the same as those of the first embodiment and will not be described in detail here.

[0078] [Fifth embodiment]

[0079] This embodiment provides a method for manufacturing a display panel, which is used to manufacture the display panel of the second embodiment, including the following steps:

[0080] S110 , preparing a thin film transistor layer 2 on one side of the substrate 1 .

[0081] S120 , evaporating a light-emitting layer 3 on the side of the thin film transistor layer 2 facing away from the substrate 1 .

[0082] S130: Deposit a first inorganic film layer 41 on the side of the light emitting layer 3 facing away from the thin film transistor layer 2. Specifically, the deposition can be performed using a PECVD method.

[0083] S140: A second organic film layer 52 is formed on the side of the first inorganic film layer 41 facing away from the light-emitting layer 3. Specifically, the second organic film layer 52 is patterned and printed using an inkjet printer to a thickness of 2 to 16 μm. UV light is used for curing, and the layer is then baked for 0.5 hours. The ink used in the inkjet printer is either acrylic or epoxy ink. That is, the patterning of the second organic film layer 52 is achieved during the printing process, unlike the patterning of the first organic film layer 51.

[0084] S150: Use a film attaching device to attach the first organic film layer 51 to the side of the first inorganic film layer 41 facing away from the light-emitting layer 3, and apply pressure to degas the first organic film layer 51. Furthermore, the patterning of the first organic film layer 51 can also be achieved in the array yellow light process or the module cutting process, and can be the same as that of the first organic film layer 51.

[0085] S160 , forming a touch layer 6 on the side of the first organic film layer 51 facing away from the first inorganic film layer 41 . The touch layer 6 is formed directly on the first organic film layer 51 , that is, in direct contact with the first organic film layer 51 .

[0086] The configuration of the first inorganic film layer 41 , the first organic film layer 51 , the second organic film layer 52 and other film layers, as well as the technical effects of this embodiment are the same as those of the second embodiment and will not be repeated here.

[0087] [Sixth embodiment]

[0088] This embodiment provides a method for manufacturing a display panel, which is used to manufacture the display panel of the third embodiment, including the following steps:

[0089] S110 , preparing a thin film transistor layer 2 on one side of the substrate 1 .

[0090] S120 , evaporating a light-emitting layer 3 on the side of the thin film transistor layer 2 facing away from the substrate 1 .

[0091] S130: Deposit a first inorganic film layer 41 on the side of the light emitting layer 3 facing away from the thin film transistor layer 2. Specifically, the deposition can be performed using a PECVD method.

[0092] S140: A second organic film layer 52 is formed on the side of the first inorganic film layer 41 facing away from the light-emitting layer 3. Specifically, the second organic film layer 52 is patterned and printed using an inkjet printer to a thickness of 2 to 16 μm. UV light is used for curing, and the layer is then baked for 0.5 hours. The ink used in the inkjet printer is either acrylic or epoxy ink. That is, the patterning of the second organic film layer 52 is achieved during the printing process, unlike the patterning of the first organic film layer 51.

[0093] S150: Form a second inorganic film layer 42 on a side of the second organic film layer 52 facing away from the first inorganic film layer 41. Specifically, a PECVD method may be used for deposition.

[0094] S160: Use film attaching equipment to attach the first organic film layer 51 to the side of the first inorganic film layer 41 facing away from the light-emitting layer 3, and pressurize and degas the first organic film layer 51. In addition, patterning of the first organic film layer 51 can also be achieved in the array yellow light process or module cutting process.

[0095] S170 , forming a touch layer 6 on a side of the first organic film layer 51 facing away from the first inorganic film layer 41 , wherein the touch layer 6 is directly formed on the first organic film layer 51 , that is, in direct contact with the first organic film layer 51 .

[0096] The configuration of the first inorganic film layer 41 , the first organic film layer 51 , the second organic film layer 52 , the second inorganic film layer 42 and other film layers, as well as the technical effects of this embodiment are the same as those of the third embodiment and will not be repeated here.

[0097] In summary, the display panel and its fabrication method of the present invention add an organic film layer of a certain thickness and low dielectric constant between the light-emitting layer and the touch layer to reduce parasitic capacitance between the two layers, thereby effectively lowering the signal-to-noise ratio (SNR) that affects touch control and minimizing the impact on touch functionality. Furthermore, the organic film layer also flattens the inorganic film layer, relieves stress on the display panel, and isolates the light-emitting layer from the touch layer.

[0098] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: include: a light-emitting layer (3); A first inorganic film layer (41), located on one side of the light-emitting layer (3), comprises at least one first sub-inorganic film layer, wherein the dielectric constant of the first sub-inorganic film layer ranges from 3.0 F / m to 6.0 F / m, and the thickness of the first sub-inorganic film layer ranges from 0.2 μm to 4 μm; a first organic film layer (51), located on a side of the first inorganic film layer (41) away from the light-emitting layer (3), wherein the dielectric constant of the first organic film layer (51) is in the range of 3.0 F / m to 4.5 F / m, and the thickness of the first organic film layer (51) is in the range of 10 μm to 100 μm; as well as The touch layer (6) is located on a side of the first organic film layer (51) facing away from the first inorganic film layer (41).

2. The display panel according to claim 1, wherein: Also includes: The second organic film layer (52) is arranged between the first inorganic film layer (41) and the first organic film layer (51), the dielectric constant of the second organic film layer (52) is in the range of 2.0F / m to 3.0F / m, and the thickness of the second organic film layer (52) is in the range of 2um to 16um.

3. The display panel according to claim 2, wherein: Also includes: The second inorganic film layer (42) is arranged between the first organic film layer (51) and the second organic film layer (52), and includes at least one second sub-inorganic film layer, the dielectric constant of the second sub-inorganic film layer ranges from 3.0F / m to 6.0F / m, and the thickness of the second sub-inorganic film layer ranges from 0.2um to 4um.

4. The display panel according to claim 1, wherein: The first organic film layer (51) is attached between the first inorganic film layer (41) and the touch layer (6) by a film material attaching device.

5. The display panel according to claim 1, wherein: The materials of the first organic film layer (51) include a base material and a glue material. The base material is at least one of the following: PET, PEN, PP, PFA, PE. The glue material is at least one of the following: PU and silicone-based glue material.

6. The display panel according to claim 2, wherein: The second organic film layer (52) is patterned and printed using an inkjet printing device, cured using UV light, and baked, wherein the ink used by the inkjet printing device is acrylic ink or epoxy ink.

7. The display panel according to claim 2, wherein: The patterning of the first organic film layer (51) is achieved in an array yellow light process or a module cutting process.

8. The display panel according to claim 3, wherein: The first inorganic film layer (41) and / or the second inorganic film layer (42) are deposited using PECVD; The material of the first inorganic film layer (41) and / or the second inorganic film layer (42) is at least one or more of the following combinations: SiNx, SiOxNy, SiOx, and SiCx.

9. The display panel according to any one of claims 1 to 3, characterized in that: Also includes: A substrate (1) is arranged on a side of the light-emitting layer (3) facing away from the touch layer (6); A thin film transistor layer (2) is provided between the substrate (1) and the light-emitting layer (3).

10. A method for preparing a display panel, for preparing the display panel according to claim 9, characterized in that: The following steps are involved: preparing the thin film transistor layer (2) on one side of the substrate (1); Vapor-depositing the light-emitting layer (3) on the side of the thin-film transistor layer (2) facing away from the substrate (1); Depositing the first inorganic film layer (41) on a side of the light-emitting layer (3) facing away from the thin-film transistor layer (2); The first organic film layer (51) is attached to a side of the first inorganic film layer (41) facing away from the light-emitting layer (3), and the first organic film layer (51) is pressurized for degassing; as well as The touch control layer (6) is prepared on the side of the first organic film layer (51) facing away from the first inorganic film layer (41).

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