A laser drilling device for circuit boards

Abstract

This invention relates to the field of circuit board drilling technology, specifically to a laser drilling device for circuit boards. It includes a board surface suspension mechanism fixed to the side of a worktable, a positioning and locating mechanism mounted on the board surface suspension mechanism, and a board bottom grinding mechanism mounted within the positioning and locating mechanism. The board surface suspension mechanism includes two bases and an auxiliary clamp. A base plate is movably installed inside the two bases, and slide rails are fixedly installed at the inner ends of the two bases. By fixing and clamping the board surface suspension mechanism to the side of the worktable, the circuit board is pre-fixed within the board surface suspension mechanism until the circuit board is horizontally positioned. Then, the hole-protecting plate and the guard are controlled to locate the hole position along the top of the circuit board. Once the hole position is located, the guard provides heat insulation protection around the hole to be drilled, while the laser beam emitted by the laser punch drills the board surface along the center position of the guard, effectively protecting the area around the formed hole from heat damage.

Description

Technical Field

[0001] This invention relates to the field of circuit board drilling technology, specifically to a laser drilling device for circuit boards. Background Technology

[0002] Circuit board drilling is a mechanical processing technology that uses a drilling machine to create holes in the circuit board. These holes are used to connect subsequent electronic components. Laser drilling devices are currently the preferred alternative to mechanical drilling machines.

[0003] However, laser drilling machines still have significant drawbacks in actual use. During laser drilling of circuit boards, the interaction between the laser beam and the material generates extremely high heat. As the heat radiates around the circuit board, the overall compressive strength of the board material decreases. At the same time, thermal damage occurs at the parts of the board surface that come into contact with the laser. In severe cases, carbonization occurs on the inner wall and outer perimeter of the formed hole, which greatly affects the conductivity of the circuit board.

[0004] In view of this, a laser drilling device for circuit boards was designed to solve the above problems. Summary of the Invention

[0005] The present invention aims to solve one of the technical problems existing in the prior art or related technologies.

[0006] Therefore, the technical solution adopted in this invention is as follows:

[0007] A laser drilling device for circuit boards includes a board surface suspension mechanism fixed to the edge of a worktable, a positioning and locating mechanism mounted on the board surface suspension mechanism, and a board bottom grinding mechanism mounted within the positioning and locating mechanism. The board surface suspension mechanism includes two bases and an auxiliary clamp. A base plate is movably mounted inside the two bases, a slide rail is fixedly mounted at the inner end of the two bases, an insert block is movably mounted inside the slide rail, and four beams are fixedly mounted outside the insert block. The positioning and locating mechanism includes a slide frame movably mounted on the two bases, a load-bearing plate and a hole-protecting plate inserted inside the slide frame, a laser punch fixedly mounted at the outer end of the load-bearing plate, a protective device mounted at one end of the hole-protecting plate, and the bottom end of the laser punch and the protective device are symmetrical in the vertical direction. A first bolt is threaded onto the other end of the hole-protecting plate, and a mother tube is inserted into the other end of the hole-protecting plate, with the first bolt adapted to press against the outer wall of the mother tube.

[0008] In a preferred embodiment, the present invention can be further configured as follows: the plate bottom grinding mechanism includes a bottom beam installed at the bottom of the mother tube, a second base installed movably inside the bottom beam, a third spring disposed outside the second base and bearing pressure on the bottom of the bottom beam, a bottom support fixedly installed at the bottom end of the second base, a toothed ring movably installed at the top end of the second base, an angle grinding component fixedly installed inside the toothed ring, and a toothed head installed at the top end of the angle grinding component.

[0009] The base 2 has a cylindrical hole inside, and a linkage vertical rod is movably installed in the middle of the cylindrical hole. An internal gear and two gaskets are fixedly installed on the linkage vertical rod.

[0010] In a preferred embodiment, the present invention may be further configured as follows: an outer pad is fixedly installed on the outside of the base 2, an auxiliary rotating component is movably installed inside the outer pad, a transmission component is installed on the outer end of the auxiliary rotating component, and a second bolt is movably installed inside the transmission component and threaded inside the outer pad;

[0011] The teeth at the inner end of the auxiliary rotating component are adapted to mesh with the built-in gear;

[0012] A clamp is movably mounted on the threaded section of the linkage vertical rod, two lever arms are movably mounted at both ends of the clamp, and two chucks are fixedly mounted on the inner wall of the angle grinder, with the lever arms movably mounted on the chucks.

[0013] In a preferred embodiment, the present invention may be further configured such that: the outer wall of the base 2 is provided with an insertion hole, and an insertion plate is inserted into the insertion hole, and one end of the insertion plate that extends into the interior of the base 2 is engaged between two gaskets 2.

[0014] In a preferred embodiment, the present invention may be further configured such that the plate bottom grinding mechanism further includes four locking blocks and a bottom beam installed on the outside of the angle grinding member;

[0015] Two of the locking blocks have sleeves on their inner sides, and two fourth bolts are inserted into the inside of the sleeves. The other two locking blocks are attached to the outer wall of the base.

[0016] A third bolt is inserted into the inside of the card block;

[0017] An impeller is fixedly installed on the top of the sleeve, and the impeller is located directly below the protective device.

[0018] In a preferred embodiment, the present invention may be further configured such that the plate bottom grinding mechanism further includes a housing fixedly mounted on the base two, a motor fixedly mounted inside the housing, and a drive gear mounted on the motor, wherein the drive gear is adapted to mesh with a gear ring.

[0019] In a preferred embodiment, the present invention may be further configured such that: the plate suspension mechanism further includes two sliders fixedly mounted on two bases, and the two sliders are adapted to be engaged in the slide rails at the bottom of the slide frame;

[0020] The base has a first lead screw movably mounted inside it, and the base plate is threaded onto the threaded section of the first lead screw.

[0021] In a preferred embodiment, the present invention may be further configured such that: the bottom of the auxiliary clamp has a through hole adapted to four beams, a second lead screw threaded in the auxiliary clamp, and a fixing plate movably mounted on the top of the second lead screw.

[0022] In a preferred embodiment, the present invention may be further configured such that: the positioning mechanism further includes a sub-rod movably installed inside the mother tube and a second spring disposed in the inner cavity of the mother tube, and the sub-rod is adapted to bear pressure on the top of the second spring;

[0023] The top end of the sub-rod is fixedly installed inside the load-bearing plate.

[0024] In a preferred embodiment, the present invention may be further configured such that: a vertical groove is provided on the top of the carriage, and a pad is fixedly installed at the bottom of the vertical groove; a first spring is fixedly installed on the top of the pad; and a third lead screw is threadedly installed on the top of the vertical groove.

[0025] The column head at the bottom of the third lead screw is adapted to bear pressure on the top of the load-bearing plate.

[0026] By adopting the above technical solution, the beneficial effects achieved by the present invention are as follows:

[0027] 1. This invention uses a board mounting mechanism fixed on the side of the workbench to pre-fix the circuit board within the mounting mechanism until the circuit board is horizontally positioned. Then, the protective plate and guard are controlled to locate the hole position along the top of the circuit board. Once the hole position is located, the guard provides heat insulation protection around the hole to be drilled, and the laser beam emitted by the laser punch drills the board surface along the center position of the guard, thereby effectively protecting the area around the formed hole from heat damage.

[0028] 2. This invention provides a bottom-grinding mechanism located directly below the protective device. As the protective device, laser punch, and bottom-grinding mechanism move synchronously along the top and bottom of the circuit board, the rotating angle grinder and toothed head are used to drill upwards from the bottom of the board, ultimately achieving a smooth hole wall on the circuit board. This avoids carbonization of the hole wall due to the high temperature of the laser.

[0029] 3. This invention controls the distance between the laser punch and the circuit board through a third lead screw. When the distance between the laser beam projected by the laser punch and the top of the board is less than the distance between the bottom of the board and the tooth, the holes on the circuit board will gradually form from top to bottom. As the board surface gradually softens, the tooth, which is pressed and quickly extruded upwards, will quickly punch the softened parts of the board surface, thereby avoiding the problem of weakening the compressive strength of the board due to excessively long laser irradiation time. Attached Figure Description

[0030] Figure 1 This is a schematic diagram illustrating the use of the present invention;

[0031] Figure 2 This is a schematic diagram of the plate suspension mechanism of the present invention;

[0032] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle;

[0033] Figure 4 This is an exploded view of the positioning and locating mechanism of the present invention;

[0034] Figure 5 This is a schematic diagram of the plate bottom grinding mechanism of the present invention;

[0035] Figure 6 For the present invention Figure 5 A partial schematic diagram;

[0036] Figure 7 For the present invention Figure 6 Enlarged view of point B in the middle;

[0037] Figure 8 For the present invention Figure 6 Enlarged view of point C in the middle;

[0038] Figure 9 For the present invention Figure 6 Enlarged view of point D in the middle;

[0039] Figure 10 This is an exploded view of the bottom grinding hole mechanism of the present invention.

[0040] Figure label:

[0041] 100. Panel suspension mechanism; 110. Base; 1101. Base plate; 1102. Slider; 120. First lead screw; 130. Slide rail; 140. Insert block; 1401. Beam frame; 150. Auxiliary clamp; 1501. Second lead screw; 1502. Fixing plate;

[0042] 200. Positioning and positioning mechanism; 210. Slide carriage; 2101. Shim; 2102. First spring; 2103. Third lead screw; 220. Load-bearing plate; 230. Laser punch; 240. Hole protection plate; 2401. Protective gear; 2402. First bolt; 250. Main pipe; 2501. Sub-rod; 2502. Second spring;

[0043] 300. Bottom grinding mechanism; 310. Bottom beam; 320. Second base; 3201. Outer pad; 3202. Rotation aid; 3203. Transmission component; 3204. Second bolt; 3205. Insert plate; 330. Third spring; 340. Base support; 350. Linkage vertical rod; 3501. Internal gear; 3502. Second gasket; 360. Gear ring; 3601. Locking block; 3602. Third bolt; 370. Sleeve; 3701. Fourth bolt; 3702. Angle grinder; 3703. Chuck; 3704. Lever arm; 3705. Clamping seat; 3706. Gear head; 380. Impeller; 390. Chassis; 3901. Motor; 3902. Drive gear. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0045] It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the invention.

[0046] The following describes, with reference to the accompanying drawings, some embodiments of a laser drilling device for circuit boards provided by the present invention. Example 1:

[0047] Combination Figures 1 to 10 As shown, the present invention provides a laser drilling device for circuit boards, including a board surface suspension mechanism 100, a positioning and locating mechanism 200 installed on the board surface suspension mechanism 100, and a bottom grinding mechanism 300 installed in the positioning and locating mechanism 200. The board surface suspension mechanism 100 is fixedly installed on the side of the workbench. The fixed board surface suspension mechanism 100 is used to provide a platform for the circuit board to be suspended and supported. The positioning and locating mechanism 200 is used to perform low-loss drilling operations on the horizontally placed circuit board. The bottom grinding mechanism 300 is used to provide anti-carbonization grinding operations on the bottom of the circuit board.

[0048] The panel suspension mechanism 100 includes two bases 110 and an auxiliary clamp 150. The base plate 1101 is movably installed inside the two bases 110, the slide rail 130 is fixedly installed at the inner end of the two bases 110, the insert block 140 is movably installed inside the slide rail 130, and four beam frames 1401 are fixedly installed outside the insert block 140.

[0049] The panel suspension mechanism 100 also includes two sliders 1102 fixedly mounted on two bases 110;

[0050] The first lead screw 120 is movably installed inside the base 110, and the base plate 1101 is threaded onto the threaded section of the first lead screw 120;

[0051] The bottom of the auxiliary clamp 150 is provided with through holes adapted to four beam frames 1401, a second lead screw 1501 threadedly installed in the auxiliary clamp 150, and a fixing plate 1502 movably installed on the top of the second lead screw 1501.

[0052] The positioning mechanism 200 includes a slide 210 movably mounted on two bases 110, a load-bearing plate 220 inserted inside the slide 210, and a hole-protecting plate 240. A laser punch 230 is fixedly mounted on the outer end of the load-bearing plate 220, and a guard 2401 is mounted on one end of the hole-protecting plate 240. The bottom end of the laser punch 230 and the guard 2401 are symmetrical in the vertical direction.

[0053] Two sliders 1102 are fitted into the slide rails at the bottom of the carriage 210;

[0054] The other end of the protective plate 240 is threaded with a first bolt 2402. The other end of the protective plate 240 is inserted into a mother tube 250, and the first bolt 2402 is adapted to be pressed against the outer wall of the mother tube 250. The daughter rod 2501 is movably installed inside the mother tube 250, and the second spring 2502 is provided in the inner cavity of the mother tube 250. The daughter rod 2501 is adapted to be pressed against the top of the second spring 2502.

[0055] The top end of the sub-rod 2501 is fixedly installed inside the load-bearing plate 220. The top of the slide 210 is provided with a vertical groove, and a pad 2101 is fixedly installed at the bottom of the vertical groove. A first spring 2102 and a third screw 2103 are fixedly installed at the top of the pad 2101.

[0056] The bottom head of the third lead screw 2103 is adapted to bear pressure on the top of the load-bearing plate 220.

[0057] By adjusting the two first lead screws 120, the base plate 1101 is pushed to clamp the bottom of the workbench until the base plate 1101 and the two bases 110 are completely fixed on the side of the workbench. At this time, the horizontal slide rail 130 can provide a sufficiently stable support platform for the combined insert block 140 and the four beams 1401. After the auxiliary clamp 150 slides on the four beams 1401, circuit boards of different sizes can be adapted and fixed by the two bases 110 and the auxiliary clamp 150.

[0058] Once the circuit board is effectively secured, it will be suspended and horizontal.

[0059] As the laser punch 230 operates, when the laser punch 230 maintains the highest distance from the top of the circuit board, the laser projected by the laser punch 230 will effectively drill the holes marked by the protective device 2401 on the circuit board. The parts outside the port of the protective device 2401 can effectively protect the periphery of the formed holes on the circuit board, while avoiding excessive heat from the laser reflected to the top of the circuit board, which could cause heat loss on the top of the board.

[0060] Preferably, L-shaped baffles are fixedly installed on the top of both bases 110 and the auxiliary clamp 150, and the three L-shaped baffles are used to provide limiting protection for the two sides of the horizontally placed circuit board. Example 2:

[0061] Combination Figures 6 to 10 As shown, based on Embodiment 1, the plate bottom grinding mechanism 300 includes a bottom beam 310 installed at the bottom of the mother tube 250, a second base 320 movably installed inside the bottom beam 310, a third spring 330 disposed outside the second base 320 and bearing pressure on the bottom of the bottom beam 310, a bottom support 340 fixedly installed at the bottom end of the second base 320, a toothed ring 360 movably installed at the top end of the second base 320, an angle grinding member 3702 fixedly installed inside the toothed ring 360, and a tooth 3706 installed at the top end of the angle grinding member 3702.

[0062] The base 320 has a cylindrical hole inside, and a linkage rod 350 is movably installed in the middle of the cylindrical hole. An internal gear 3501 is fixedly installed on the linkage rod 350, and two washers 3502 are fixedly installed at the bottom of the linkage rod 350.

[0063] The base 320 has an outer pad 3201 fixedly installed on its exterior, an auxiliary rotating component 3202 movably installed inside the outer pad 3201, a transmission component 3203 installed at the outer end of the auxiliary rotating component 3202, and a second bolt 3204 movably installed inside the transmission component 3203 and threaded inside the outer pad 3201.

[0064] The teeth at the inner end of the auxiliary rotating component 3202 are adapted to mesh with the built-in gear 3501;

[0065] The outer wall of the base 2 320 has an insertion hole, and an insertion plate 3205 is inserted into the insertion hole. One end of the insertion plate 3205, which extends into the interior of the base 2 320, is engaged between two gaskets 2 3502.

[0066] A clamp 3705 is movably mounted on the threaded section of the linkage vertical rod 350. Two lever arms 3704 are movably mounted on both ends of the clamp 3705, and two chucks 3703 are fixedly mounted on the inner wall of the angle grinder 3702. The lever arms 3704 are movably mounted on the chucks 3703.

[0067] Preferably, a T-shaped pad is fixedly installed at one end of the bottom beam 310 facing the auxiliary clamp 150, and the T-shaped pad is movably installed on the inner side of the four beam frames 1401, while a vertical rod is fixedly installed at the bottom of the base 320, and the vertical rod penetrates into the interior of the T-shaped pad.

[0068] When the initial drilling operation is performed on the top of the circuit board, an upward pressing force is applied to the bottom support 340. At this time, the angle grinder 3702 and the tooth 3706 at its top can perform a punching operation on the bottom of the board.

[0069] Furthermore, by reversing the second bolt 3204 until it disengages from the outer washer 3201, the transmission component 3203 is controlled to rotate forward. The internal gear 3501 and the linkage rod 350 driven by the auxiliary rotating component 3202 will rotate in the center, and the clamp 3705 will descend along the threaded section of the linkage rod 350. Finally, the two lever arms 3704 and the two chucks 3703 pulled by the clamp 3705 will retract the two fan-shaped end plates of the angle grinder 3702. As the two fan-shaped end plates inside the angle grinder 3702 retract, the tooth 3706 installed at the top of the angle grinder 3702 can perform a variable diameter grinding operation on the designated part of the circuit board along the middle of the inner side of the guard 2401. Example 3:

[0070] Combination Figures 1 to 10 As shown, in the above embodiment, the plate bottom grinding mechanism 300 also includes four locking blocks 3601 and a bottom beam 310 installed outside the angle grinding part 3702, a chassis 390 fixedly installed on the base 320, a motor 3901 fixedly installed inside the chassis 390 and a drive gear 3902 installed on the motor 3901, and the drive gear 3902 is adapted to mesh with the gear ring 360.

[0071] Two of the locking blocks 3601 have sleeves 370 on their inner sides, and two fourth bolts 3701 are inserted into the sleeves 370. The other two locking blocks 3601 are attached to the outer wall of the base 320.

[0072] A third bolt 3602 is inserted into the inside of the locking block 3601;

[0073] An impeller 380 is fixedly installed on the top of the sleeve 370, and the impeller 380 is located directly below the protective device 2401.

[0074] Preferably, the toothed ring 360 has annular grooves at both the top and bottom, and four locking blocks 3601 are respectively locked into the two annular grooves. There are four third bolts 3602, two of which are fixedly installed in the sleeve 370, and the other two are fixedly installed in the base 320.

[0075] Specifically, when the motor 3901 starts, the drive gear 3902 will assist the rotation of the gear ring 360 and the angle grinder 3702. The sleeve 370 is fixed to the outside of the angle grinder 3702 by the fourth bolt 3701. Therefore, the sleeve 370 will also drive the impeller 380 to rotate. When the tooth head 3706 rises and performs grinding operations on the inner wall of the circuit board forming hole, the upward airflow generated by the rotation of the impeller 380 will accelerate the cooling speed during the hole wall treatment, thereby avoiding the problem of local softening caused by excessive heat of the circuit board.

[0076] The working principle and usage process of this invention are as follows: First, reverse the two first lead screws 120 until the base plate 1101 and the two bases 110 expand to their maximum state. Then, snap the two bases 110 and the base plate 1101 onto the side of the table. Next, rotate the two first lead screws 120 forward until the board suspension mechanism 100 is fixed on the side of the table. Then, adjust the second lead screw 1501 to reverse and control the auxiliary clamp 150 to slide along the outside of the beam frame 1401. Then, place the circuit board to be processed on top of the two bases 110 and the auxiliary clamp 150. After the circuit board is supported and in a horizontal position, adjust the second lead screw 1501 to rotate forward until the auxiliary clamp 150 cooperates with the two bases 110 to clamp the circuit board on both sides.

[0077] When drilling is required on the circuit board, the slide 210 is controlled to slide along the top of the two bases 110. At this time, the laser punch 230 and the toothed head 3706, which are symmetrically distributed along the top and bottom of the circuit board, can move synchronously. The hole protection plate 240 and the guard 2401, which are fixed to the outside of the mother tube 250 by the first bolt 2402, will slide effectively along the top of the circuit board.

[0078] As the laser punch 230 is started and running, the laser is projected vertically downwards. The laser is projected onto the center of the inner side of the protective device 2401. After the laser is projected onto the selected part of the circuit board, the board surface will gradually form a hole from top to bottom. As the hole at the top of the circuit board is gradually formed, the user needs to push the base 340 upwards until the base 320 and the angle grinder 3702 are close to the bottom of the circuit board. The tooth 3706 fixed at the top of the angle grinder 3702 will then fit against the bottom of the board.

[0079] When the motor 3901 starts and runs, its internal transmission shaft, in conjunction with the drive gear 3902, will drive the gear ring 360 and the angle grinder 3702 to rotate. At this time, the second bolt 3204 needs to be reversed until the transmission component 3203 is pulled outward. The angle grinder 3702 and the tooth 3706 will then perform grinding operations on the bottom of the circuit board. As the grinding progresses, the top of the angle grinder 3702 will eventually be inserted into the interior of the guard 2401, thereby avoiding damage to the wall of the formed hole.

[0080] At the same time, when the laser mapping diameter is the same as the inner diameter of the protective gear 2401, only an upward impact force needs to be applied to the base 340, and the angle grinder 3702 and its top tooth 3706 can quickly punch the softened part of the circuit board.

[0081] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A laser drilling device for circuit boards, comprising a board surface suspension mechanism (100) fixed to the side of a worktable, characterized in that, It also includes a positioning and locating mechanism (200) installed on the plate suspension mechanism (100) and a plate bottom grinding mechanism (300) installed in the positioning and locating mechanism (200). The plate suspension mechanism (100) includes two bases (110) and an auxiliary clamp (150). The base plate (1101) is movably installed inside the two bases (110), the slide rail (130) is fixedly installed at the inner end of the two bases (110), the insert block (140) is movably installed inside the slide rail (130), and the four beam frames (1401) are fixedly installed outside the insert block (140). The positioning mechanism (200) includes a slide (210) movably mounted on two bases (110), a load-bearing plate (220) inserted inside the slide (210), and a hole-protecting plate (240). A laser punch (230) is fixedly installed on the outer end of the load-bearing plate (220), and a protective device (2401) is installed on one end of the hole-protecting plate (240). The bottom end of the laser punch (230) and the protective device (2401) are symmetrical in the vertical direction. The other end of the protective plate (240) is threaded with a first bolt (2402), and a mother tube (250) is inserted into the other end of the protective plate (240), and the first bolt (2402) is adapted to be pressed against the outer wall of the mother tube (250); The plate bottom grinding mechanism (300) includes a bottom beam (310) installed at the bottom of the mother tube (250), a second base (320) movably installed inside the bottom beam (310), a third spring (330) located outside the second base (320) and bearing pressure on the bottom of the bottom beam (310), a bottom support (340) fixedly installed at the bottom end of the second base (320), a toothed ring (360) movably installed at the top of the second base (320), an angle grinding part (3702) fixedly installed inside the toothed ring (360), and a toothed head (3706) installed at the top of the angle grinding part (3702). The base 2 (320) has a cylindrical hole inside, and a linkage vertical rod (350) is movably installed in the middle of the cylindrical hole, an internal gear (3501) fixedly installed on the linkage vertical rod (350), and two gaskets 2 (3502) fixedly installed at the bottom of the linkage vertical rod (350).

2. The laser drilling equipment for circuit boards according to claim 1, characterized in that, The base 2 (320) is fixedly mounted with an outer pad (3201), a rotating aid (3202) movably mounted inside the outer pad (3201), a transmission component (3203) mounted on the outer end of the rotating aid (3202), and a second bolt (3204) movably mounted inside the transmission component (3203) and threaded inside the outer pad (3201). The teeth at the inner end of the auxiliary rotating component (3202) are adapted to mesh with the built-in gear (3501); A clamp (3705) is movably mounted on the threaded section of the linkage vertical rod (350), two lever arms (3704) are movably mounted on both ends of the clamp (3705), and two chucks (3703) are fixedly mounted on the inner wall of the angle grinder (3702), with the lever arms (3704) movably mounted on the chucks (3703).

3. The laser drilling equipment for circuit boards according to claim 2, characterized in that, The outer wall of the base two (320) is provided with an insertion hole, and an insertion plate (3205) is inserted into the insertion hole. One end of the insertion plate (3205) that penetrates into the interior of the base two (320) is engaged between two gaskets two (3502).

4. The laser drilling equipment for circuit boards according to claim 1, characterized in that, The plate bottom grinding mechanism (300) also includes four locking blocks (3601) and a bottom beam (310) installed on the outside of the angle grinding part (3702). Two of the locking blocks (3601) have sleeves (370) on their inner sides, and two fourth bolts (3701) are inserted into the sleeves (370). The other two locking blocks (3601) are attached to the outer wall of the base (320). A third bolt (3602) is inserted into the inside of the card block (3601); An impeller (380) is fixedly installed on the top of the sleeve (370), and the impeller (380) is located directly below the protective gear (2401).

5. The laser drilling equipment for circuit boards according to claim 1, characterized in that, The plate bottom grinding mechanism (300) also includes a housing (390) fixedly installed on the base (320), a motor (3901) fixedly installed in the housing (390), and a drive gear (3902) installed on the motor (3901), and the drive gear (3902) is adapted to mesh with the gear ring (360).

6. The laser drilling equipment for circuit boards according to claim 1, characterized in that, The panel suspension mechanism (100) further includes two sliders (1102) fixedly installed on two bases (110), and the two sliders (1102) are adapted to be snapped into the slide rail at the bottom of the slide frame (210); The base (110) has a first lead screw (120) movably mounted inside, and the base plate (1101) is threaded onto the threaded section of the first lead screw (120).

7. The laser drilling equipment for circuit boards according to claim 1, characterized in that, The bottom of the auxiliary clamp (150) is provided with through holes adapted to four beam frames (1401), a second lead screw (1501) is threadedly installed in the auxiliary clamp (150), and a fixing plate (1502) is movably installed on the top of the second lead screw (1501).

8. The laser drilling equipment for circuit boards according to claim 1, characterized in that, The positioning mechanism (200) further includes a sub-rod (2501) movably installed inside the mother tube (250) and a second spring (2502) disposed in the inner cavity of the mother tube (250), and the sub-rod (2501) is adapted to bear pressure on the top of the second spring (2502); The top end of the sub-rod (2501) is fixedly installed inside the load-bearing plate (220).

9. A laser drilling device for circuit boards according to claim 1, characterized in that, The top of the slide (210) is provided with a vertical groove, and a pad (2101) is fixedly installed at the bottom of the vertical groove. A first spring (2102) is fixedly installed at the top of the pad (2101), and a third screw (2103) is threadedly installed at the top of the vertical groove. The head of the third lead screw (2103) is adapted to bear pressure on the top of the load-bearing plate (220).

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