Synchronous manufacturing method using sound energy and light energy and processing equipment
Through the synchronous manufacturing method of acoustic energy and light energy, combined with photocuring and acoustic wave curing, the limitations of light-induced molding and acoustic-induced molding are solved, and efficient and precise three-dimensional molding is achieved, which is suitable for extreme manufacturing needs in fields such as aerospace and energy power.
Patent Information
- Application Number
- CN202510568641.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2025-09-19
Smart Images

Figure CN120663527A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of additive manufacturing technology, and in particular to a synchronous manufacturing method and processing equipment utilizing acoustic energy and light energy. Background Art
[0002] Additive manufacturing is a manufacturing technology based on the discrete-accumulation principle. It uses computer graphics data to build the desired object layer by layer by adding materials. Compared to traditional subtractive manufacturing, this technology offers advantages such as high material utilization, short processing cycles, and customization, enabling on-demand production anytime, anywhere. Among existing additive manufacturing technologies, light-induced molding (such as stereolithography, SLA) and acoustic-induced molding are two important molding methods.
[0003] Among them, light-induced molding technology is an additive manufacturing technology that uses photosensitive materials such as photosensitive resins to construct three-dimensional entities by curing layer by layer under the irradiation of specific light sources (such as ultraviolet light or visible light). This technology has the advantages of high efficiency and environmental protection. Acoustic induced molding technology uses penetrable focused sound waves to interact with polymer materials and composite materials. By regulating the generation, focusing and transmission of sound waves, it can regulate the microstructure of the material and the bonding state of the interface, thereby realizing the molding of the material. This technology is not only suitable for the processing and manufacturing of macroscopic structures, but also has the ability to manufacture across scales and multiple degrees of freedom. The non-contact, penetrable, focusable and transmittable characteristics of ultrasound give this technology the significant advantage of fast manufacturing speed.
[0004] While both photolithography and ultrasonic direct manufacturing (UDI) technologies offer distinct advantages, they also have significant limitations. Photolithography is prone to internal stress and warping during the curing process, while UDI suffers from low energy transfer efficiency and the susceptibility to bubbles and cracks during processing. The effective combination of photolithography and ultrasonic direct manufacturing (UDI) technologies, leveraging their respective strengths to create products, would be crucial for improving existing additive manufacturing technologies. Summary of the Invention
[0005] In order to overcome the problems existing in the related art, one of the purposes of the present invention is to provide a manufacturing method that utilizes acoustic energy and light energy synchronously. This method synchronizes light curing and acoustic wave curing, which can improve the molding efficiency of the material; and the two energies act on the material at the same time, which can avoid the surface brittle cracking or internal uncured problems caused by a single process, and help improve the quality of the product.
[0006] A manufacturing method using synchronous acoustic energy and optical energy, comprising:
[0007] Prepare acousto-optic dual-sensitive materials according to production needs;
[0008] Applying light energy and acoustic energy to the prepared material through a light emitting device and an ultrasonic emitting device, and making the focal points of the light emitting device and the ultrasonic emitting device coincide with each other or be in the same plane;
[0009] According to the preset path, the light emitting device and the ultrasonic emitting device are moved to solidify the material;
[0010] The workpiece obtained by solidification molding is post-processed.
[0011] In a preferred technical solution of the present invention, the steps of making the focal points of the light emitting device and the ultrasound emitting device coincide with each other or lie in the same plane include:
[0012] The light emitting device and the ultrasonic emitting device are arranged on the same clamping device;
[0013] Obtaining the focus of the light emitting device and the focus of the ultrasound emitting device, and determining whether the difference between the focus positions of the two exceeds a set threshold;
[0014] If not, the curing and molding operation of the material is started.
[0015] In a preferred technical solution of the present invention, obtaining the focus of the light emitting device and the focus of the ultrasound emitting device and determining whether the difference in the focus positions of the two exceeds a set threshold includes:
[0016] The focus of the light emitting device is obtained by monitoring the light spot position through an optical sensor;
[0017] The focus of the ultrasonic transmitter is obtained by detecting the energy distribution of the acoustic field through an acoustic wave detector;
[0018] The focus of the light emitting device is compared with the focus of the ultrasonic emitting device to determine whether the difference in the focus positions of the two exceeds a set threshold.
[0019] In a preferred technical solution of the present invention, the method of moving the light emitting device and the ultrasonic emitting device according to a preset path to solidify the material includes:
[0020] According to a preset path, the clamping device is moved to synchronously move the light emitting device and the ultrasonic emitting device;
[0021] During the movement, the focus of the light emitting device and the focus of the ultrasound emitting device are monitored in real time;
[0022] When the difference between the focal positions of the two exceeds a set threshold, the focus of the light emitting device or the focus of the ultrasound emitting device is adjusted so that the difference between the focal positions of the two is less than the set threshold.
[0023] In a preferred technical solution of the present invention, the process of curing and molding the material further includes:
[0024] Adjust the parameters of the light emitting device and the ultrasonic emitting device according to the design requirements;
[0025] The parameters of the light emitting device include the light source exposure time and exposure intensity; the parameters of the ultrasonic emitting device include the frequency, power and duty cycle of the ultrasonic wave.
[0026] In a preferred technical solution of the present invention, the acousto-optic dual-sensitive material includes:
[0027] Free radical prepolymer, photoinitiator, thermal initiator, induction molding agent, particle reinforcing agent, etc., wherein the particle reinforcing agent includes any one or more of metal powder, ceramic powder, glass fiber, and diamond.
[0028] In a preferred technical solution of the present invention, the post-processing of the workpiece obtained by solidification molding includes:
[0029] Clean the formed workpiece and dry it;
[0030] The dried workpiece is mechanically polished to obtain a post-processed workpiece.
[0031] A second object of the present invention is to provide a processing device for implementing the above-mentioned manufacturing method using simultaneous acoustic energy and light energy;
[0032] The processing equipment includes a frame, a rotating table is provided on the frame, and a loading platform is provided on the rotating table;
[0033] The frame is also provided with a driving system and a clamping device, and the driving system drives the clamping device to move on the worktable; the clamping device is provided with a light emitting device and an acoustic wave generator, and the light emitting device is located on one side of the acoustic wave generator. The light emitting device is electrically connected to the light source controller through an optical fiber, and the outer cover of the light emitting device is provided with a waterproof cover.
[0034] In a preferred technical solution of the present invention, a feeding system is also included, which includes a discharge head and an infusion pump. The discharge head is arranged on the clamping device, the infusion pump is fixed on the frame, the output port of the infusion pump is connected to the discharge head, and the infusion pump is externally connected to a liquid storage tank.
[0035] The beneficial effects of the present invention are:
[0036] The present invention provides a method for synchronous manufacturing using acoustic and light energy, which includes: preparing an acoustic-light dual-sensitive material according to production requirements; applying light and acoustic energy to the prepared material through a light emitting device and an ultrasonic emitting device, and making the focal points of the light emitting device and the ultrasonic emitting device coincide or lie in the same plane; moving the light emitting device and the ultrasonic emitting device according to a preset path to solidify the material; and post-processing the workpiece obtained by solidification. This method combines the advantages of light curing and direct manufacturing using ultrasound to form a dual-path mechanism of "light-induced rapid surface curing + sound waves promoting deep cross-linking", which can improve the molding efficiency of the product. The synchronous action of sound and light makes the internal temperature field and chemical cross-linking reaction of the material more uniform, which can reduce the warping, cracking, and porosity problems caused by rapid surface curing and slow internal shrinkage in traditional curing processes, thereby avoiding the defects of low overall manufacturing precision of single acoustic-induced molding workpieces. This method can take advantage of the high precision of photocuring technology, the surface quality of molded parts, and the focusability and penetration of sound waves. It can manufacture products with excellent outer surface quality and internal porous structures similar to metamaterial samples, weakening the shortcomings of weak light penetration ability and low precision of direct sound wave manufacturing technology.
[0037] The present application also provides processing equipment for implementing the above-mentioned synchronous manufacturing method using sound energy and light energy. The equipment has a wide range of applications, high processing flexibility, can achieve rapid prototyping of workpieces, and can ensure the molding quality of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] Figure 1 is a flow chart of a synchronous manufacturing method using acoustic energy and light energy provided in an embodiment of the present invention;
[0039] Figure 2 is a perspective view of a processing device provided in an embodiment of the present invention;
[0040] Figure 3 It is a front view of a processing device provided in an embodiment of the present invention.
[0041] Reference numerals:
[0042] 1. Frame; 2. Loading platform; 3. Drive system; 4. Clamping device; 5. Light source controller; 6. Light emitting device; 7. Waterproof cover; 8. Sound wave generator; 9. Infusion pump; 10. Discharge head; 11. Rotating table. DETAILED DESCRIPTION
[0043] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to make the present invention more thorough and complete and to fully convey the scope of the present invention to those skilled in the art.
[0044] Additive manufacturing (AM, also known as 3D printing) is a manufacturing technology based on the discrete-accumulation principle. It uses computer graphics data to create the desired object layer by layer by stacking materials. Compared with traditional subtractive manufacturing, this technology offers advantages such as high material utilization, short processing cycles, and customization, enabling on-demand production anytime, anywhere. Among existing AM technologies, light-induced molding (such as stereolithography, SLA) and acoustic-induced molding are two important molding methods.
[0045] However, both the current light-induced molding and acoustic-induced molding technologies have defects. Based on this, the present application provides a manufacturing method that utilizes acoustic energy and light energy synchronously.
[0046] Example 1
[0047] like Figure 1 As shown, this embodiment provides a manufacturing method using acoustic energy and light energy synchronously, comprising:
[0048] S100, preparing acousto-optic dual-sensitive materials according to production requirements;
[0049] Furthermore, the acousto-optic dual-sensitive material includes:
[0050] Free radical prepolymer, photoinitiator, thermal initiator, induction molding agent, particle reinforcing agent, etc., wherein the particle reinforcing agent includes any one or more of metal powder, ceramic powder, glass fiber, and diamond.
[0051] Specifically, the free radical prepolymer of the present application is any one or a combination of acrylate prepolymers, epoxy resin prepolymers, or siloxane prepolymers. For example, the free radical prepolymer of the present application is a compound of acrylate and epoxy resin in a ratio of 3:2. This compound material can balance molding efficiency and structural strength.
[0052] The function of a photoinitiator is to absorb light energy and generate free radicals, which trigger the crosslinking reaction of the prepolymer. Photoinitiators can be cleavage-type photoinitiators, such as benzoin dimethyl ether, or hydrogen-abstraction-type photoinitiators, such as benzophenone + tertiary amine.
[0053] The function of the thermal initiator is to decompose under the localized high temperature generated by ultrasonic cavitation, initiating crosslinking of the thermosetting prepolymer. Thermal initiators can be amine curing agents, such as isophorone diamine and diethylenetriamine. These curing agents work by forming a network structure through a ring-opening addition reaction between the amino group and the epoxy group of the epoxy resin.
[0054] Forming agents are used to control the curing path, improve processing properties, and guide the material into a predetermined structure. These agents can be polydimethylsiloxane (PDMS) modifiers or acrylic leveling agents, which are used to reduce the material's surface tension, eliminate orange peel marks during coating, and improve surface smoothness.
[0055] In one specific embodiment, the acousto-optic dual-sensitive material comprises: 50 parts polydimethylsiloxane (PDMS), 35 parts epoxy acrylate (EA), 10 parts amine curing agent (IPDA), 1.5 parts cationic photosensitizer (triarylsulfonium salt), and 3.5 parts toughening agent (CTBN). The preparation process is as follows: PDMS and epoxy acrylate are stirred and mixed at room temperature for 15 minutes to form an elastic matrix; the curing agent and photosensitizer are added and stirred to uniformly disperse; and vacuum degassing is performed for 5 minutes to eliminate bubbles generated during mixing.
[0056] Particle reinforcements impart specific functions or enhance properties to materials through physical filling or chemical action. Metal powders used as particle reinforcements can enhance the material's electrical conductivity, thermal conductivity, and wear resistance. The resulting workpieces can be used in electromagnetic shielding components or conductive circuits.
[0057] In another embodiment, the acousto-optic dual-sensitive material is a thermosetting photosensitive material, the main components of which include PDMS (polydimethylsiloxane), epoxy resin, acrylate and other materials with thermosetting properties. Adding a photosensitizer to the material gives the material dual curing capabilities, that is, the material can be cured under the influence of sound waves and can also be cured under the irradiation of light.
[0058] S200, applying light energy and acoustic energy to the prepared material through a light emitting device and an ultrasonic emitting device, and making the focal points of the light emitting device and the ultrasonic emitting device coincide with each other or be in the same plane;
[0059] Specifically, the light emitting device uses an ultraviolet laser (wavelength 365nm, power density 80mW / cm 2 ), focused by a diffractive optical element (DOE), with a spot diameter of 20μm. The acoustic wave transmitter has a frequency of 500kHz (kHz-level acoustic waves are suitable for flexible materials) and a power of 20W. It uses a focusable transducer, with the focal point coplanar with the laser focus.
[0060] S300, moving the light emitting device and the ultrasonic emitting device according to a preset path to solidify the material;
[0061] S400, post-processing the workpiece obtained by solidification molding.
[0062] During the production process, a photosensitive material is extruded onto a carrier platform in 0.1mm layers using an infusion pump, forming the microchannel substrate. The light-emitting device and the acoustic wave-emitting device move synchronously, with a focal distance error of ≤3μm. Scanning is then enabled, with a laser scanning speed of 100mm / s and an ultrasonic emission power of 15W, which is started and stopped synchronously with the laser. The scanning process first scans the microchannel outline (50μm width), then fills the interior area, and solidifies the material layer by layer. After each layer is cured, the carrier platform rises 20μm.
[0063] After the workpiece is formed, ultrasonic cleaning with isopropyl alcohol (frequency 40kHz, time 5 minutes) is used to remove uncured materials; three cycles (30 minutes each) are carried out between -20°C and 60°C to eliminate the internal stress of PDMS; and plasma treatment (oxygen atmosphere, power 50W, time 2 minutes) is used to improve the hydrophilicity of the chip surface.
[0064] In a specific embodiment, making the focal points of the light emitting device and the ultrasound emitting device coincide with each other or lie in the same plane includes:
[0065] The light emitting device and the ultrasonic emitting device are arranged on the same clamping device;
[0066] Obtaining the focus of the light emitting device and the focus of the ultrasound emitting device, and determining whether the difference between the focus positions of the two exceeds a set threshold;
[0067] If not, the curing and molding operation of the material is started.
[0068] Specifically, the clamping device is mounted on a three-axis robotic arm, and both are secured to the same clamping device via a fixture. The robotic arm is equipped with a laser displacement sensor (accuracy ±0.5μm) and an acoustic pressure sensor (resolution 0.1dB) for real-time monitoring of the optical-acoustic focal position. The optical and ultrasonic emitting devices are secured to the same clamping device, significantly reducing focal errors compared to separate structures (e.g., independently clamping the optical and acoustic devices).
[0069] During the machining process, the optical transmitter and acoustic transducer are moved to the calibration station (a reference surface on the workpiece platform) via a clamping device. The optical transmitter emits laser light, forming a spot on the reference surface. The laser displacement sensor records the coordinates of the spot's center (X1, Y1, Z1). The acoustic transmitter emits a short pulse of sound (1ms duration). The sound pressure sensor array detects the peak position of the sound pressure and calculates the coordinates of the acoustic focus (X2, Y2, Z2). The coordinate difference is calculated as: ΔX = X1 - X2, ΔY = Y1 - Y2, ΔZ = Z1 - Z2. Setting thresholds: For precision gear forming, ΔX / ΔY / ΔZ are all set to ≤ 5μm. Exceeding these thresholds triggers automatic calibration. During calibration, fine-tuning the motors is performed, for example, by moving the optical transmitter or acoustic transducer along the X / Y axes until ΔX / ΔY < 5μm. The height of both is adjusted along the Z axis to maintain ΔZ < 5μm (achieved through closed-loop control of the Z-axis leadscrew with an accuracy of ≤ 1μm). After calibration, the clamping device moves to the processing area, starts the laser and sound waves synchronously, and solidifies the laid sound and light dual-sensitive material along the set path.
[0070] Furthermore, the application provides a method for determining whether the position difference between the focus of the light emitting device and the focus of the ultrasound emitting device exceeds a threshold, as follows:
[0071] The acquiring the focus of the light emitting device and the focus of the ultrasound emitting device and determining whether the difference between the focus positions of the two exceeds a set threshold includes:
[0072] The focus of the light emitting device is obtained by monitoring the light spot position through an optical sensor;
[0073] The focus of the ultrasonic transmitter is obtained by detecting the energy distribution of the acoustic field through an acoustic wave detector;
[0074] The focus of the light emitting device is compared with the focus of the ultrasonic emitting device to determine whether the difference in the focus positions of the two exceeds a set threshold.
[0075] The specific implementation process of this embodiment is as follows:
[0076] The light emitting device is an ultraviolet laser source (wavelength 405nm, power density 150mW / cm 2 ), equipped with a diffractive optical element (DOE) focusing, with a spot diameter of ≤20μm.
[0077] The ultrasonic transmitting device is a high-frequency sound wave transducer (frequency 5 MHz, power 80 W), and the sound beam diameter after focusing is 30 μm.
[0078] The optical sensor uses a high-speed CMOS camera (frame rate 1000fps, resolution 2448×2048) with a 50mm focal length lens to capture the Gaussian distribution image of the laser spot.
[0079] The acoustic wave detector uses a micro-electromechanical system (MEMS) hydrophone array (array spacing 50μm, sensitivity -190dBre1V / μPa), which is integrated under the carrier platform to detect the peak pressure distribution of the sound field.
[0080] First, the CMOS camera captures the spot image and calculates the center of mass coordinates of the spot (xl, yl, zl) using a Gaussian fitting algorithm with an accuracy of ±0.5μm (based on sub-pixel positioning technology).
[0081] The hydrophone array scans and detects the energy distribution of the sound field. The beamforming algorithm reconstructs the sound pressure field and locates the energy peak coordinates (xs, ys, zs) with an accuracy of ±2μm (limited by the diffraction limit of sound waves).
[0082] The spatial error is calculated using the formula Δx = |xl -xs |, Δy = |yl -ys |, Δz = |zl -zs | and compared to a set threshold. The threshold can be 10μm. This means that if Δx, Δy, and Δz are all ≤ 5μm, the system is considered qualified; otherwise, automatic calibration is triggered. The automatic calibration process involves automatic adjustment. For example, the optical and ultrasonic transmitters are secured to a clamping device via a six-axis motorized translation stage (resolution 0.1μm), supporting XYZ translation and pitch / roll adjustment. During adjustment, the stage is driven by a PID control algorithm based on the error value to adjust the position of the optical / ultrasonic transmitter until the error converges within the threshold.
[0083] Furthermore, the step of moving the light emitting device and the ultrasonic emitting device according to a preset path to solidify the material comprises:
[0084] According to a preset path, the clamping device is moved to synchronously move the light emitting device and the ultrasonic emitting device;
[0085] During the movement, the focus of the light emitting device and the focus of the ultrasound emitting device are monitored in real time;
[0086] When the difference between the focal positions of the two exceeds a set threshold, the focus of the light emitting device or the focus of the ultrasound emitting device is adjusted so that the difference between the focal positions of the two is less than the set threshold.
[0087] In this embodiment, by monitoring the focal positions of the light-emitting device and the ultrasonic-emitting device and implementing dynamic adjustments, the focus position error can be controlled within ±5μm, avoiding over-sintering or under-curing caused by energy misalignment, thereby improving product quality. Furthermore, this adjustment method allows focus correction without pausing processing, significantly improving production efficiency.
[0088] Furthermore, the material solidification molding process also includes:
[0089] Adjust the parameters of the light emitting device and the ultrasonic emitting device according to the design requirements;
[0090] The parameters of the light emitting device include the light source exposure time and exposure intensity; the parameters of the ultrasonic emitting device include the frequency, power and duty cycle of the ultrasonic wave.
[0091] This application achieves high-precision, high-efficiency molding of complex structural workpieces through dynamic adjustment of photoacoustic parameters and coordinated control of multiple physical fields. This method not only overcomes the process bottleneck of a single energy source in traditional additive manufacturing, but also enhances the generalization capability for multiple materials and structures through parameter adaptation mechanisms. It is particularly suitable for the extreme manufacturing needs of fields such as aerospace, energy and power, and has significant technological innovation and engineering application value.
[0092] Furthermore, the post-processing of the workpiece obtained by solidification molding includes:
[0093] Clean and dry the formed workpiece;
[0094] The dried workpiece is mechanically polished to obtain a post-processed workpiece.
[0095] This application provides a specific post-processing process:
[0096] First, the formed optical lens workpiece was immersed in ethanol and ultrasonically cleaned for 10 minutes to remove the uncured photosensitive resin remaining on the surface and in the micropores.
[0097] Then, the workpiece was transferred to a deionized water rinsing tank and ultrasonically cleaned for 5 minutes to remove ethanol residue and tiny particle impurities. The workpiece was transferred to a vacuum drying oven for drying. The temperature in the drying oven was set to 60°C to avoid thermal deformation of the material; the vacuum degree was 5Pa; and the drying time was 2 hours to reduce the moisture content of the workpiece.
[0098] Then, use a polishing machine to polish the workpiece. Specifically, first use 200-mesh silicon carbide sandpaper at a speed of 2000 rpm to remove the surface step lines and solidified layer protrusions, reducing the surface roughness to Ra ≤ 3.2 μm. Then change to 2000-mesh sandpaper at a speed of 3000 rpm to further refine the surface to Ra ≤ 0.8 μm. Finally, apply cerium dioxide polishing liquid, use a polyurethane polishing pad at a speed of 5000 rpm, and polish for 15 minutes. The final surface roughness reaches Ra ≤ 0.2 μm (optical grade mirror standard).
[0099] The post-processing process provided by this application solves the problems of cleanliness, deformation control and surface accuracy in the post-processing of additively manufactured workpieces.
[0100] Example 2
[0101] like Figure 1-Figure 3 As shown, this embodiment provides a processing device for implementing the above-mentioned manufacturing method using acoustic energy and light energy synchronously;
[0102] The processing equipment includes a frame 1, a rotating table 11 is provided on the frame 1, and a loading platform 2 is provided on the rotating table 11;
[0103] The frame 1 is also provided with a driving system 3 and a clamping device 4, and the driving system 3 drives the clamping device 4 to move on the stage 2; the clamping device 4 is provided with a light emitting device 6 and an acoustic wave generator 8, and the light emitting device 6 is located on one side of the acoustic wave generator 8. The light emitting device 6 is connected to the light source controller 5 through an optical fiber, and the outer cover of the light emitting device 6 is provided with a waterproof cover 7.
[0104] The present application uses a clamping device 4 to clamp the light emitting device 6 and the sound wave generator 8, and adjusts the position of the focus of the light emitting device 6 and the sound wave generator 8. When the light emitting device 6 and the sound wave generator 8 are moved, the focus of the two will not be significantly offset, thereby ensuring smooth processing. The drive system 3 in this embodiment is a three-axis drive system 3 with the ability to adjust the XYZ direction, so that it can drive the clamping device 4 to move within a spatial range, so that the workpiece can be formed according to a preset path during the forming process.
[0105] Furthermore, it also includes a feeding system, which includes a discharge head 10 and an infusion pump 9. The discharge head 10 is arranged on the clamping device 4, the infusion pump 9 is fixed on the frame 1, the output port of the infusion pump 9 is connected to the discharge head 10, and the infusion pump 9 is externally connected to the liquid storage tank.
[0106] The infusion pump 9 of the present application adopts a high-precision metering pump (flow range 0.1-100mL / min, accuracy ±0.5%), supports pulsed or continuous feeding, and the discharge head 10 realizes dynamic adjustment of the Z-axis height (accuracy ±1μm) through the clamping structure to ensure that the distance between the discharge head 10 and the worktable 2 is within an appropriate range.
[0107] The device feeds material onto a stage 2 via a feeding system. It then adjusts the focal positions of a light emitting device 6 and an acoustic wave generator 8 so that their focal points coincide or lie in the same plane. The drive system 3 is activated, shaping the material along a pre-set path, enabling rapid production of high-quality workpieces.
[0108] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.
[0109] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.
Claims
1. A manufacturing method using acoustic energy and light energy synchronously, characterized in that: include: Prepare acousto-optic dual-sensitive materials according to production needs; Applying light energy and acoustic energy to the prepared material through a light emitting device and an ultrasonic emitting device, and making the focal points of the light emitting device and the ultrasonic emitting device coincide with each other or be in the same plane; According to the preset path, the light emitting device and the ultrasonic emitting device are moved to solidify the material; The workpiece obtained by solidification molding is post-processed.
2. The method for synchronously manufacturing using acoustic energy and light energy according to claim 1, characterized in that: The step of making the focal points of the light emitting device and the ultrasound emitting device coincide with each other or lie in the same plane includes: The light emitting device and the ultrasonic emitting device are arranged on the same clamping device; Obtaining the focus of the light emitting device and the focus of the ultrasound emitting device, and determining whether the difference between the focus positions of the two exceeds a set threshold; If not, the curing and molding operation of the material is started.
3. The method for synchronously manufacturing using acoustic energy and light energy according to claim 2, characterized in that: The acquiring the focus of the light emitting device and the focus of the ultrasound emitting device and determining whether the difference between the focus positions of the two exceeds a set threshold includes: The focus of the light emitting device is obtained by monitoring the light spot position through an optical sensor; The focus of the ultrasonic transmitter is obtained by detecting the energy distribution of the acoustic field through an acoustic wave detector; The focus of the light emitting device is compared with the focus of the ultrasonic emitting device to determine whether the difference in the focus positions of the two exceeds a set threshold.
4. The method for synchronously manufacturing using acoustic energy and light energy according to claim 2, characterized in that: The method of moving the light emitting device and the ultrasonic emitting device according to a preset path to solidify the material comprises: According to a preset path, the clamping device is moved to synchronously move the light emitting device and the ultrasonic emitting device; During the movement, the focus of the light emitting device and the focus of the ultrasound emitting device are monitored in real time; When the difference between the focal positions of the two exceeds a set threshold, the focus of the light emitting device or the focus of the ultrasound emitting device is adjusted so that the difference between the focal positions of the two is less than the set threshold.
5. The method for synchronously manufacturing using acoustic energy and light energy according to claim 4, characterized in that: The material solidification molding also includes: Adjust the parameters of the light emitting device and the ultrasonic emitting device according to the design requirements; The parameters of the light emitting device include the light source exposure time and exposure intensity; the parameters of the ultrasonic emitting device include the frequency, power and duty cycle of the ultrasonic wave.
6. A method for synchronously manufacturing using acoustic energy and light energy according to any one of claims 1 to 5, characterized in that: Acousto-optic dual-sensitive materials include: Free radical prepolymer, photoinitiator, thermal initiator, induction molding agent, particle reinforcing agent, the particle reinforcing agent includes any one or more of metal powder, ceramic powder, glass fiber, and diamond.
7. A method for synchronously manufacturing using acoustic energy and light energy according to any one of claims 1 to 5, characterized in that: The post-processing of the workpiece obtained by solidification molding includes: Clean and dry the formed workpiece; The dried workpiece is mechanically polished to obtain a post-processed workpiece.
8. A processing equipment, characterized in that: Used to implement the synchronous manufacturing method using acoustic energy and light energy as described in any one of claims 1 to 7; The processing equipment includes a frame, a rotating table is provided on the frame, and a loading platform is provided on the rotating table; The frame is also provided with a driving system and a clamping device, and the driving system drives the clamping device to move on the worktable; the clamping device is provided with a light emitting device and an acoustic wave generator, and the light emitting device is located on one side of the acoustic wave generator. The light emitting device is electrically connected to the light source controller through an optical fiber, and the outer cover of the light emitting device is provided with a waterproof cover.
9. The processing equipment according to claim 8, characterized in that: It also includes a feeding system, which includes a discharge head and an infusion pump. The discharge head is arranged on the clamping device, the infusion pump is fixed on the frame, the output port of the infusion pump is connected to the discharge head, and the infusion pump is externally connected to a liquid storage tank.