PCBA testing equipment and testing methods

Abstract

This invention discloses a PCBA inspection device and method. The inspection device includes: a frame; a first inspection fixture, the first inspection fixture including: a pin, the pins being arranged one-to-one with the pins of the connectors on the PCBA to detect the installation status of the corresponding pins; a skew detection module being arranged one-to-one with the components on the PCBA to detect the installation status of the components; and a second inspection fixture connected to the frame, the second inspection fixture including: a lead length inspection component, the lead length inspection component being connected to the frame, the lead length inspection component being spaced apart from the placement part to define a lead length inspection area. According to the PCBA inspection device of this invention, the component surface and solder joint surface of the PCBA can be inspected simultaneously in one clamping, achieving precise physical inspection of each pin, effectively identifying minute defects. Furthermore, the skew detection module is arranged one-to-one with the components, avoiding subjective errors from manual judgment and improving the efficiency and accuracy of PCBA inspection.

Description

Technical Field

[0001] This invention relates to the field of server technology, and in particular to a testing device and method for PCBA. Background Technology

[0002] Related technologies indicate that in today's rapidly developing electronic information technology landscape, PCBA, as a core component of electronic devices, directly impacts the performance and reliability of those devices. With the increasing integration and miniaturization of electronic components, PCBA manufacturing processes are becoming increasingly complex, leading to higher requirements for PCBA inspection. PCBA inspection includes quality checks on both the component and solder joint surfaces. Component inspection checks include verifying whether components are installed backwards, are too high, are misaligned, or are intact. Visual inspection checks include removing foreign objects and dirt. Connectors, used to connect various components for functional transmission, commonly exhibit defects such as backward installation, excessive height, incorrect color (multiple different colored connectors), pin abnormalities (abnormal pin height, missing pins, extra pins, etc.), and internal foreign objects. Solder joint inspection, in addition to checking solder pads, solder balls, and solder dross, also includes verifying the lead length of components.

[0003] The quality of the component surface and solder joint surface directly affects the assembly quality and product quality of the subsequent processes. For example, when connecting components, the copper foil of the connector pads may fall off when installing cables in the subsequent processes. The skewed assembly of components may interfere with and press on the component body, which may cause the component to fail. The excessive length of the PCBA pins may cause short circuits when they come into contact with the chassis (even if Mylar is installed, it may be punctured), resulting in major abnormalities such as the inability to power on. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a PCBA inspection device that enables simultaneous inspection of the component side and solder joint side of the PCBA in a single clamping, avoiding the efficiency loss and misjudgment risk caused by multiple disassembly and assembly and multiple process flows, and also avoiding subjective errors of manual judgment, thereby improving the efficiency and accuracy of PCBA inspection.

[0005] This invention also proposes a method for testing PCBAs.

[0006] According to a first aspect of the present invention, a PCBA testing apparatus is provided, the PCBA including a board body, connectors, and components. The testing apparatus includes: a frame having a placement portion adapted to place the PCBA; a first inspection fixture adapted to be placed above the PCBA, the first inspection fixture including: a pin, the pins being arranged one-to-one with pins of the connectors on the PCBA to detect the installation state of the corresponding pins; a skew detection module, the skew detection module being arranged one-to-one with components on the PCBA to detect the installation state of the components; and a second inspection fixture connected to the frame, the second inspection fixture including: a lead length inspection member, the lead length inspection member being connected to the frame and spaced apart from the placement portion to define a lead length inspection area, the component pins on the PCBA being located within the lead length inspection area.

[0007] The PCBA inspection device according to an embodiment of the present invention integrates a first inspection fixture and a second inspection fixture, enabling simultaneous inspection of the component surface and solder joint surface of the PCBA in a single clamping operation. This avoids efficiency losses and misjudgment risks caused by multiple disassembly and assembly and multiple process flows. At the same time, the ejector pins and pins are arranged in a one-to-one correspondence, enabling precise physical inspection of each pin and effectively identifying minute defects. Furthermore, the skew detection module is arranged in a one-to-one correspondence with the components, avoiding subjective errors in manual judgment and improving the efficiency and accuracy of PCBA inspection.

[0008] In some embodiments, the skew detection module includes: a first verification element, the first verification element being used to inspect the installation status of high-insertion components, the first verification element having a first verification groove with the opening facing downwards, and the end of the high-insertion component away from the board being adapted to extend into the first verification groove; and a second verification element, the second verification element being used to inspect the installation status of horizontally inserted components, the second verification element being U-shaped, the second verification element having a second verification groove with the opening facing one side in the horizontal direction, and the end of the horizontally inserted component away from the board being adapted to extend into the second verification groove.

[0009] In the above technical solution, by setting the first calibration component, the detection of high-insertion components is realized. The first calibration slot realizes spatial limiting detection, which can effectively identify the situation of angular misalignment. The mechanical insertion detection is not affected by factors such as light, color, and reflection, ensuring the accuracy of detection. By setting the second calibration component, the detection of horizontally inserted components is realized. The second calibration slot realizes spatial limiting detection, which can effectively identify the misalignment of horizontally inserted components in the vertical or horizontal direction. The mechanical insertion detection is not affected by factors such as light, color, and reflection, ensuring the accuracy of detection.

[0010] In some embodiments, the ejector pin includes an upper contact pin, a lower contact pin, and an outer conductor tube. The upper contact pin and the lower contact pin are spaced apart in the axial direction and are movable relative to each other. An elastic element is provided between the upper contact pin and the lower contact pin. The elastic element always has a force that keeps the upper contact pin and the lower contact pin away from each other. A probe is provided at the lower end of the lower contact pin. The probe is arranged in a one-to-one correspondence with the pin. The outer conductor tube is sleeved on the upper contact pin and / or the lower contact pin. The outer conductor tube is connected to a first connecting line.

[0011] In the above technical solution, the structure of the ejector pin is simple. By setting an elastic element between the upper and lower contact pins, the detection dimension is expanded. It is possible to determine whether the pin is qualified not only by whether there is continuity between the upper and lower contact pins, but also by detecting the compression stroke or pressure of the elastic element. Furthermore, the elastic element avoids rigid impact between the upper and lower contact pins, thereby preventing damage to the pin.

[0012] In some embodiments, the upper contact pin includes an insulating layer and a conductive contact core, the insulating layer covering the outer periphery of the conductive contact core, the conductive contact core including an upper contact head, an upper blocking head and a tail pin, the lower contact pin including a lower contact head and a lower blocking head, the two ends of the elastic member being respectively sleeved on the upper contact head and the lower contact head, and the two ends of the elastic member abutting against the upper blocking head and the lower blocking head respectively, and the tail pin being connected to a second connecting wire.

[0013] In the above technical solution, by setting an insulating layer on the outer periphery of the conductive contact core, electrical isolation between the conductive contact core and the external conductor tube is achieved, avoiding short circuits. It has strong anti-electromagnetic interference capability and high detection accuracy, enabling μm-level displacement sensing and Na-level current detection to identify minute defects. The upper and lower blocking heads play an axial limiting role, preventing excessive compression or dislodgement of the elastic element, ensuring the overall structural stability of the ejector pin, and extending the service life of the ejector pin.

[0014] In some embodiments, the first inspection fixture further includes: an inspection plate group, the inspection plate group forming a wire channel, the inspection plate group including a first plate, a second plate and a third plate arranged in layers, the ejector pin and the skew detection module are both disposed on the first plate, an avoidance area is formed on the second plate, a sensor is provided between the first plate and the second plate, the sensor is at least electrically connected to the skew detection module, and a connecting portion is formed on the third plate, the connecting portion being adapted to be connected to a pressing fixture.

[0015] In the above technical solution, by setting the first plate, the second plate and the third plate, the structure of the first inspection fixture is clear, which is convenient for assembly and maintenance, and also facilitates the expansion of components. The cable management groove solves the problem of messy multi-channel signal lines and improves the reliability and stability of the inspection structure of the first inspection fixture. The ejector pin and the skew detection module pass through the avoidance area, and the avoidance area avoids structural conflicts. The sensor realizes the conversion of pressure into electrical signals and improves the intelligence level of the PCBA inspection device.

[0016] In some embodiments, the first inspection fixture further includes: a first limiting member, a second limiting member, and a positioning post. One of the first limiting member and the second limiting member is disposed on one side of the length direction of the inspection plate group, and the other of the first limiting member and the second limiting member is disposed on one side of the width direction of the inspection plate group. A positioning hole is formed on the frame, and the positioning post extends into the positioning hole.

[0017] In the above technical solution, by setting the first limiting member and the second limiting member to cooperate, the relative position of the first inspection fixture and the PCBA is limited. By setting the positioning column, the relative position between the first inspection fixture and the frame is limited, thereby reducing the deviation of the relative position between the first inspection fixture and the frame and the PCBA. At the same time, the assembly error rate is reduced, the consistency of inspection is improved, and it is convenient for rapid positioning. It is suitable for inspecting PCBAs of various specifications and models.

[0018] In some embodiments, the first inspection fixture further includes a color comparison module, which is used to compare whether the types of the components correspond.

[0019] In the above technical solution, by setting a color comparison module above components that require color comparison in specific needs (such as AOI blind spots or high false alarm rates), the components can be directly compared and inspected for color. This provides a visual reference for manual re-inspection and assists in judging color differences of components. It can make up for the lack of AOI equipment in the factory, or help with color detection that is misjudged or missed due to insufficient lighting caused by component obstruction.

[0020] In some embodiments, the second inspection fixture further includes a coordinate sensing screen, which is disposed below the leg length inspection piece and spaced apart from it, and the PCBA is located within the projection range of the coordinate sensing screen.

[0021] In the above technical solution, the Gerber coordinates of the components are converted into the coordinates of the sensor screen through coordinate transformation rules, which can accurately locate the Gerber coordinates. Then, the Gerber coordinate information is mapped and bound with the component reference number, defect information and other information that needs to be displayed and transmitted to the MCU control unit. Multiple pins can be detected at the same time, which improves detection efficiency and detection accuracy.

[0022] In some embodiments, the second inspection fixture further includes:

[0023] The cable management layer is electrically connected to the first connecting line, the second connecting line, and the coordinate sensing screen.

[0024] In some embodiments, the PCBA testing device further includes a control module, wherein the first inspection fixture, the second inspection fixture, and the cable management layer are all electrically connected to the control module.

[0025] In some embodiments, the frame includes: a body, a first adjusting member and a second adjusting member, wherein the first adjusting member is slidably connected to the body relative to the body in the length direction, and the second adjusting member is slidably connected to the body relative to the body in the width direction.

[0026] In the above technical solution, by setting a first adjusting member and a second adjusting member that can slide relative to the main body, it can adapt to PCBA of various specifications and sizes, reducing the number of inspection fixtures. There is no need to replace the frame; adjusting the first adjusting member and the second adjusting member can adapt to PCBA of various specifications and sizes, thereby reducing inspection costs.

[0027] In some embodiments, a first sliding portion is formed on the first adjusting member, a second sliding portion is formed on the second adjusting member, and a third sliding portion is formed on the body. The first adjusting member and the body slide relative to each other through the cooperation of the first sliding portion and the third sliding portion, and the second adjusting member and the body slide relative to each other through the cooperation of the second sliding portion and the third sliding portion.

[0028] In some embodiments, a first placement surface is formed on the first adjusting member, a second placement surface is formed on the second adjusting member, and a third placement surface is formed on the body. The first placement surface, the second placement surface, and the third placement surface are flush to define the placement portion.

[0029] According to the PCBA testing method of the second aspect of the present invention, and applied to the PCBA testing apparatus of the first aspect of the present invention, the testing method includes:

[0030] Step S1: Export the pad coordinates and package information of components on the PCBA;

[0031] Step S2: Calculate the pad coordinates of the components based on the package information;

[0032] Step S3: Determine whether the pad coordinates of the components on the PCBA are consistent with the pad coordinates of the components calculated by the package information. If yes, proceed to step S4; otherwise, proceed to step S1.

[0033] Step S4: Number the pins of the components;

[0034] Step S5: Convert the coordinates of the PCBA pads to the coordinates of the coordinate sensing screen;

[0035] Step S6: Generate and store the coordinates, pin numbers, defect names, and pin number mapping table of the coordinate sensing screen of the component;

[0036] Step S7: Obtain the pressure coordinates and pressure values ​​of the pins on the PCBA under test relative to the coordinate sensing screen;

[0037] Step S8: Determine the pin position and defect name of the components on the PCBA under test based on the pressure coordinates and pressure values.

[0038] Furthermore, the packaging information includes the reference position coordinates of the components, the rotation angle information of the components, and the packaging image of the components with pin numbers.

[0039] The PCBA inspection method according to embodiments of the present invention enables simultaneous inspection of the component side and solder joint side of the PCBA in a single clamping, avoiding efficiency losses and misjudgment risks caused by multiple disassembly and assembly and multiple process flows. At the same time, the ejector pins and pins are arranged in a one-to-one correspondence, realizing precise physical inspection of each pin, which can effectively identify minute defects. Furthermore, the skew detection module is arranged in a one-to-one correspondence with the components, avoiding subjective errors of manual judgment and improving the efficiency and accuracy of PCBA inspection.

[0040] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0041] To more clearly illustrate the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 A schematic diagram of a PCBA testing device provided in an embodiment of the present invention;

[0043] Figure 2 for Figure 1 A schematic diagram of the first inspection fixture shown;

[0044] Figure 3 for Figure 2 A schematic diagram of the first inspection fixture shown from another angle;

[0045] Figure 4 for Figure 2 A schematic diagram of the first verification component shown;

[0046] Figure 5 for Figure 4 The diagram shows a high-intercalation capacitance detection schematic.

[0047] Figure 6 for Figure 2 A schematic diagram of the second verification component shown;

[0048] Figure 7 for Figure 2 A schematic diagram of the ejector pin shown;

[0049] Figure 8 for Figure 7 A schematic cross-sectional view of the ejector pin shown;

[0050] Figure 9 for Figure 7 The diagram shows an explosion of the ejector pin.

[0051] Figure 10 for Figure 7 A schematic diagram of the upper contact pin shown;

[0052] Figure 11 for Figure 7 The diagram shows the assembly of the upper and lower contact pins.

[0053] Figure 12 for Figure 7 A schematic diagram of the lower contact pin shown;

[0054] Figure 13 This is a schematic diagram of the lower contact pin according to another embodiment;

[0055] Figure 14 This is a schematic diagram of the testing of the ejector pin and the pin.

[0056] Figure 15 This is a schematic diagram of the testing of the ejector pin and components;

[0057] Figure 16 This is a schematic diagram of the testing of the ejector pin and connector;

[0058] Figure 17 This is a schematic diagram illustrating the testing of a ejector pin and pins of different lengths.

[0059] Figure 18 This is a schematic diagram of a needle used for detecting foreign objects.

[0060] Figure 19 for Figure 18 A schematic diagram of the ejector pin shown;

[0061] Figure 20 This is a schematic diagram of a PCBA;

[0062] Figure 21 This is a schematic diagram of the pressure fixture;

[0063] Figure 22 for Figure 2 A top view of the first inspection fixture shown;

[0064] Figure 23 for Figure 2 The detection diagram of the color contrast module shown in the figure;

[0065] Figure 24 This is a schematic diagram of the second board;

[0066] Figure 25 for Figure 1 A schematic diagram of the second inspection fixture shown;

[0067] Figure 26 for Figure 25 A schematic cross-sectional view of the second inspection fixture shown;

[0068] Figure 27 This is a schematic diagram of the framework;

[0069] Figure 28 for Figure 27 A schematic diagram of the first adjusting member shown;

[0070] Figure 29 This is a schematic diagram showing another angle of the first adjusting member;

[0071] Figure 30 for Figure 27 A schematic diagram showing the cooperation between the main body and the first adjusting member;

[0072] Figure 31 for Figure 27 A schematic diagram showing the cooperation between the main body and the second adjusting component;

[0073] Figure 32 This is a schematic diagram of a coordinate sensing screen;

[0074] Figure 33 This is a schematic diagram of a thin film;

[0075] Figure 34 This is a schematic diagram for coordinate calculation;

[0076] Figure 35 A scene diagram showing the screen origin and the Gerber origin;

[0077] Figure 36 Another scene diagram illustrating the screen origin and Gerber origin;

[0078] Figure 37 This is another scene diagram illustrating the relationship between the screen origin and the Gerber origin.

[0079] Figure 38 Another scene diagram illustrating the screen origin and the Gerber origin;

[0080] Figure 39 This is a flowchart of the signal transmission process for a pressure sensor.

[0081] Figure 40 This is a schematic diagram of the control module;

[0082] Figure 41 A flowchart illustrating the collaborative mechanism of the control module;

[0083] Figure 42 This is a flowchart of the PCBA testing method.

[0084] The above figures include the following reference numerals:

[0085] 100. Detection device; 1. Frame; 11. Placement part; 12. Body; 121. Third sliding part; 122. Third placement surface; 13. First adjusting member; 131. First sliding part; 132. First placement surface; 14. Second adjusting member; 141. Second sliding part; 142. Second placement surface; 15. Positioning hole; 2. First inspection fixture; 21. Ejector pin; 211. Upper contact pin; 2111. Insulating layer; 2112. Conductive contact core; 21121. Upper contact head; 21122. Upper blocking head; 21123. Tail pin; 212. Lower contact pin; 2121. Lower contact head; 2122. Lower blocking head; 213. External conductor tube; 214. Elastic element; 215. First connecting wire; 216. Second connecting wire; 217. Probe; 22. First calibration component ; 221, First verification slot; 23, Second verification component; 231, Second verification slot; 24, Inspection board assembly; 241, First board; 242, Second board; 2421, Clearance area; 243, Third board; 244, Cable management channel; 245, Connecting hole; 25, Color comparison module; 26, First limiting component; 27, Second limiting component; 28, Positioning post; 3, Second inspection fixture; 31, Leg length inspection component; 32, Leg length inspection area; 33, Coordinate sensing screen; 34, Cable management layer; 35, Through slot; 36, Thin film; 4, Control module; 5, Display screen; 200, PCBA; 201, Board body; 202, Connector; 2021, Pin; 2022, Notch; 203, Component; 2031, High insertion capacitor; 2032, Horizontal insertion capacitor; 300, Pressing fixture. Detailed Implementation

[0086] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present invention.

[0087] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. The terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, where the range of similar situations is within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0088] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the invention, are intended to cover non-exclusive inclusion.

[0089] In the description of the embodiments of this invention, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this invention, "multiple" means two or more, unless otherwise explicitly defined.

[0090] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0091] In the description of the embodiments of this invention, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0092] In the description of embodiments of the present invention, the term "multiple" refers to two or more (including two).

[0093] Related technologies indicate that in today's rapidly developing electronic information technology landscape, PCBA, as a core component of electronic devices, directly impacts the performance and reliability of those devices. With the increasing integration and miniaturization of electronic components, PCBA manufacturing processes are becoming increasingly complex, leading to higher requirements for PCBA inspection. PCBA inspection includes quality checks on both the component and solder joint surfaces. Component inspection checks include verifying whether components are installed backwards, are too high, are misaligned, or are intact. Visual inspection checks include removing foreign objects and dirt. Connectors, used to connect various components for functional transmission, commonly exhibit defects such as backward installation, excessive height, incorrect color (multiple different colored connectors), pin abnormalities (abnormal pin height, missing pins, extra pins, etc.), and internal foreign objects. Solder joint inspection, in addition to checking solder pads, solder balls, and solder dross, also includes verifying the lead length of components.

[0094] The quality of the component surface and solder joint surface directly affects the assembly quality and product quality of the subsequent processes. For example, when connecting components, the copper foil of the connector pads may fall off when installing cables in the subsequent processes. The skewed assembly of components may interfere with and press on the component body, which may cause the component to fail. The excessive length of the PCBA pins may cause short circuits when they come into contact with the chassis (even if Mylar is installed, it may be punctured), resulting in major abnormalities such as the inability to power on.

[0095] Therefore, improving the testing efficiency and accuracy of PCBA boards has become an urgent issue to be addressed.

[0096] Based on the above considerations, in order to improve the testing efficiency and accuracy of PCBA boards, the inventors, after in-depth research, designed a PCBA testing device, which is described below. Figures 1-41 A testing apparatus for PCBA according to an embodiment of the first aspect of the present invention is described.

[0097] According to a first aspect of the present invention, a PCBA testing device 100 is provided. The PCBA 200 includes a board body 201, a connector 202 and components 203. The testing device 100 includes a frame 1, a first inspection fixture 2 and a second inspection fixture 3.

[0098] Specifically, such as Figures 1-40 As shown, a placement portion 11 is formed on the frame 1, which is suitable for placing PCBA 200. A first inspection fixture 2 is suitable for being placed above PCBA 200. The first inspection fixture 2 includes: a pin 21 and a skew detection module. The pin 21 is arranged one-to-one with the pins 2021 of the connector 202 on PCBA 200 to detect the installation status of the corresponding pins 2021. The skew detection module is arranged one-to-one with the components 203 on PCBA 200 to detect the installation status of the components 203. A second inspection fixture 3 is connected to the frame 1. The second inspection fixture 3 includes: a lead length inspection piece 31. The lead length inspection piece 31 is connected to the frame 1 and is arranged spaced apart from the placement portion 11 to define a lead length inspection area 32. The pins of the components 203 on PCBA 200 are located within the lead length inspection area 32. Therefore, by integrating the first inspection fixture 2 and the second inspection fixture 3, the component side and solder joint side of the PCBA200 can be inspected simultaneously in one clamping, avoiding the efficiency loss and misjudgment risk caused by multiple disassembly and assembly and multiple process flows. At the same time, the ejector pins 21 and pins 2021 are arranged in a one-to-one correspondence, realizing the precise physical detection of each pin 2021, which can effectively identify minor defects. Furthermore, the skew detection module is arranged in a one-to-one correspondence with the component 203, avoiding subjective errors of manual judgment and improving the efficiency and accuracy of PCBA200 inspection.

[0099] It is understood that the frame 1 provides a stable and accurate placement position for the PCBA200 (i.e., placement part 11). The first inspection fixture 2 is located above the frame 1 and is used for component surface inspection of the PCBA200. The first inspection fixture 2 includes: a pin 21 and a skew detection module. The pin 21 is arranged one-to-one with the pins 2021 of the connector 202 on the PCBA200. When the first inspection fixture 2 is pressed down, the pin 21 moves toward the pins 2021 of the connector 202. If a pin 2021 is missing, bent, or has an abnormal height, the corresponding pin 21 is in abnormal contact, cannot make normal contact, or has an abnormal stroke, thereby determining that the corresponding pin 2021 is missing, bent, or has an abnormal height. The skew detection module is arranged one-to-one with the components 203 on the PCBA200 (e.g., capacitors). The second inspection fixture 3 is located below the PCBA200 and is used to inspect the pin length on the solder joint surface. The pins on one side of the solder joint surface extend into the pin length inspection area 32. If the pins are too long, they will touch the pin length inspection piece 31.

[0100] According to the present invention, the inspection device 100 for PCBA200 integrates the first inspection fixture 2 and the second inspection fixture 3, enabling simultaneous inspection of the component surface and solder joint surface of PCBA200 in a single clamping, avoiding efficiency loss and misjudgment risk caused by multiple disassembly and assembly and multiple process flows. At the same time, the ejector pins 21 and pins 2021 are arranged in a one-to-one correspondence, realizing precise physical inspection of each pin 2021, which can effectively identify minute defects. Furthermore, the skew detection module is arranged in a one-to-one correspondence with the component 203, avoiding subjective errors of manual judgment, and improving the efficiency and accuracy of PCBA200 inspection.

[0101] In any embodiment of the present invention, the skew detection module includes: a first verification element 22 and a second verification element 23. The first verification element 22 is used to check the installation status of high-insertion components. The first verification element 22 has a first verification groove 221 with its opening facing downward. The end of the high-insertion component away from the board 201 is adapted to extend into the first verification groove 221. The second verification element 23 is used to check the installation status of horizontally inserted components. The second verification element 23 is U-shaped and has a second verification groove 231 with its opening facing one side in the horizontal direction. The end of the horizontally inserted component away from the board 201 is adapted to extend into the second verification groove 231. Therefore, by setting the first calibration element 22, the detection of high-insertion components is realized, and the spatial limiting detection is realized through the first calibration slot 221, which can effectively identify the situation of angular misalignment. The mechanical insertion detection is not affected by factors such as light, color, and reflection, ensuring the accuracy of the detection. By setting the second calibration element 23, the detection of horizontally inserted components is realized, and the spatial limiting detection is realized through the second calibration slot 231, which can effectively identify the misalignment of horizontally inserted components in the vertical or horizontal direction. The mechanical insertion detection is not affected by factors such as light, color, and reflection, ensuring the accuracy of the detection.

[0102] Reference Figures 2-5As shown, taking the high-insertion component 2031 as an example, it can be understood that, according to the required skew standard, the skew standard of the high-insertion capacitor 2031 is 15°. Since the skew of the high-insertion capacitor 2031 is not fixed in direction, it may skew in any 360° circumferential direction. Therefore, the first verification component 22 is a funnel-shaped enclosed ring. When the high-insertion capacitor 2031 is misaligned beyond the standard, the outer right surface of the high-insertion capacitor 2031 contacts the inner surface of the first calibration slot 221 of the first calibration component 22. The inner surface and lower edge of the first calibration slot 221 of the first calibration component 22 are made of silicone, which acts as a buffer to reduce friction with the surface of the high-insertion capacitor 2031. When interference occurs, the outer right surface of the high-insertion capacitor 2031 contacts the inner surface of the first calibration slot 221 of the first calibration component 22, transmitting pressure to the sensor set between the first board 241 and the second board 242. Through the signal processing and transmission of the sensor (here, a pressure sensor), signal conditioning circuit, and MCU controller, the corresponding error information is triggered to the electronic digital display screen, which then displays the error information.

[0103] Assuming the IPC tilt standard is θ (taking 15° as an example), the height of the high-insertion capacitor 2031 is H (15mm here), and the offset of the high-insertion capacitor 2031 is L, then from tanθ=L / H, we can get the offset L=tanθ*H=4.02mm. Then, based on the size of the high-insertion capacitor 2031 and the offset, the size of the first verification component 22 is changed.

[0104] Reference Figure 6 As shown, taking the horizontally inserted capacitor 2032 as an example, it can be understood that since the tilt of the horizontally inserted capacitor 2032 is generally only in two directions (up and down or left and right), and the tail of the horizontally inserted capacitor 2032 will also be offset, the second verification component 23 is formed into a U-shape according to the required tilt standard and offset standard, and the opening faces the side. The inner surface of the second verification groove 231 of the second verification component 23 is provided with a silicone layer, which reduces the friction between the second verification component 23 and the horizontally inserted capacitor 2032, and plays a buffering role to avoid damaging the component 203.

[0105] In any embodiment of the present invention, the ejector pin 21 includes: an upper contact pin 211, a lower contact pin 212, and an outer conductor tube 213. The upper contact pin 211 and the lower contact pin 212 are arranged at intervals in the axial direction and can move relative to each other. An elastic element 214 is provided between the upper contact pin 211 and the lower contact pin 212. The elastic element 214 always has a force that keeps the upper contact pin 211 and the lower contact pin 212 away from each other. A probe 217 is provided at the lower end of the lower contact pin 212. The probe 217 is arranged in a one-to-one correspondence with the pin 2021. The outer conductor tube 213 is sleeved on the upper contact pin 211 and / or the lower contact pin 212. The outer conductor tube 213 is connected to a first connecting line 215. Therefore, the structure of the ejector pin 21 is simple. By setting an elastic element 214 between the upper contact pin 211 and the lower contact pin 212, the detection dimension is expanded. It can not only determine whether the pin 2021 is qualified by whether there is continuity between the upper contact pin 211 and the lower contact pin 212, but also determine whether the pin 2021 is qualified by detecting the compression stroke or pressure of the elastic element 214. Furthermore, the elastic element 214 avoids rigid impact between the upper contact pin 211 and the lower contact pin 212, thereby avoiding damage to the pin 2021.

[0106] Reference Figure 2 As shown, there are multiple ejector pins 21 arranged in an array. The ejector pin array is arranged above the connector 202 to be tested. Different probe 217 shapes are matched for different components 203. The ejector pins 21 are set according to the number of pins 2021 of the connector 202. For example, the probe 217 of the ejector pin 21 is set to a concave covering shape to facilitate better contact and detection. For the surface of the pin 2021, such as the base of the connector 202, the probe 217 is set to a plane. The material of the probe 217 is selected to be a material that will not easily damage the surface of the component 203. The ejector pin 21 includes an upper contact pin 211, a lower contact pin 212, and an outer conductor tube 213. The lower part of the upper contact pin 211 is located inside the outer conductor tube 213, and the upper part of the lower contact pin 212 is located inside the outer conductor tube 213. The lower contact pin 212 can move in the vertical direction relative to the upper contact pin 211. An elastic element 214 is provided between the upper contact pin 211 and the lower contact pin 212. The elastic element 214 can make the upper contact pin 211 and the lower contact pin 212 move away from each other. The probe 217 is located at the lower end of the lower contact pin 212.

[0107] In any embodiment of the present invention, the upper contact pin 211 includes an insulating layer 2111 and a conductive contact core 2112. The insulating layer 2111 covers the outer periphery of the conductive contact core 2112. The conductive contact core 2112 includes an upper contact head 21121, an upper blocking head 21122 and a tail pin 21123. The lower contact pin 212 includes a lower contact head 2121 and a lower blocking head 2122. The two ends of the elastic member 214 are respectively sleeved on the upper contact head 21121 and the lower contact head 2121, and the two ends of the elastic member 214 abut against the upper blocking head 21122 and the lower blocking head 2122, respectively. The tail pin 21123 is connected to a second connecting line 216. Therefore, by setting an insulating layer 2111 on the outer periphery of the conductive contact core 2112, electrical isolation between the conductive contact core 2112 and the external conductor tube 213 is achieved, avoiding short circuits. It has strong anti-electromagnetic interference capability and high detection accuracy, enabling μm-level displacement sensing and Na-level current detection, identifying minute defects. The upper and lower blocking heads 21122 provide axial limiting, preventing excessive compression or dislodgement of the elastic element 214, ensuring the overall structural stability of the ejector pin 21, and extending the service life of the ejector pin 21.

[0108] Reference Figure 7-12 As shown, the upper contact pin 211 includes an insulating layer 2111 and a conductive contact core 2112. The conductive contact core 2112 includes an upper contact head 21121, an upper blocking head 21122, and a tail pin 21123. The lower contact pin 212 includes a lower contact head 2121 and a lower blocking head 2122. The diameter of the upper blocking head 21122 is larger than the diameter of the elastic element 214, and the diameter of the lower blocking head 2122 is smaller than the diameter of the elastic element 214. The upper contact head 21121 and the lower contact head 2121 are conductive when in contact. Specifically, when the lower contact pin 212 is subjected to pressure, the elastic element 214 undergoes compression deformation. When a certain compression stroke is reached, the upper contact head 21121 and the lower contact head 2121 are conductive to determine the installation state of the pin 21. The first connecting line 215 is connected to the external conductor tube 213, and the second connecting line 216 is connected to the tail pin 21123.

[0109] Specifically, 1) For the detection of component height: the contact stroke of the upper contact head 21121 and the lower contact head 2121 is preset, that is, the compression stroke of the elastic element 214, so that the contact stroke meets the standard of component height 203. The purpose of adjusting the contact formation can be achieved by installing the pin 21 at different depths in the first inspection fixture 2. When the height of the pin 2021 exceeds the standard, the upper contact head 21121 and the lower contact head 2121 make contact and conduction, and the signal is sent through the ADC channel. The MCU outputs the corresponding defect information to the display screen 5 according to the preset mapping rules.

[0110] 2) For the detection of the reversed parts of connector 202 and the status of pins 2021: The ejector pin 21 is set at different depths in the first inspection fixture 2 to meet the contact stroke requirements of different defect types, and the reversed parts of connector 202 and the status of pins 2021 are detected. As shown in the figure, the probe 217 of the ejector pin 21 is set above the notch 2022 of connector 202. The elastic element 214 is set to compress the stroke so that the upper contact head 21121 and the lower contact head 2121 are connected. When connector 202 is installed in reverse, the ejector pin 21 corresponding to the notch 2022 of connector 202 is not under pressure, the compressed elastic element 214 is released, and the upper contact head 21121 and the lower contact head 2121 move away from each other and disconnect from contact. As shown in the figure, the status of pin 2021 is detected. When the connector 202 has fewer pins 2021 or the height of pin 2021 is abnormal, the upper contact head 21121 and lower contact head 2121 of the corresponding ejector pin 21 of a normally installed pin 2021 are in a conductive state. When there are fewer or fewer pins 2021, the upper contact head 21121 and lower contact head 2121 will move away from each other and disconnect. When the connector 202 has more pins 2021, the compression stroke of the preset elastic element 214 is used, and the ejector pin 21 is set at the position where no pin 2021 is set. The upper contact head 21121 and lower contact head 2121 of the ejector pin 21 are not in contact. If there are more pins 2021 at this position, the upper contact head 21121 and lower contact head 2121 will be conductive.

[0111] 3) Foreign object detection for connector 202: For components 203 with high requirements for internal foreign objects, a dense array of ejector pins 21 is set up. The contact stroke of the upper contact head 21121 and the lower contact head 2121 of the ejector pin 21 is not less than the height of the foreign object, so that when there is a foreign object in the component 203 and the height meets the pre-approval standard, the upper contact head 21121 and the lower contact head 2121 of the ejector pin 21 will conduct.

[0112] In any embodiment of the present invention, the first inspection fixture 2 further includes: an inspection plate group 24, the inspection plate group 24 forming a wire channel 244, the inspection plate group 24 including a first plate 241, a second plate 242 and a third plate 243 arranged in layers, the ejector pin 21 and the skew detection module are both disposed on the first plate 241, the second plate 242 has a clearance area 2421 formed on the second plate 242, a sensor is provided between the first plate 241 and the second plate 242, the sensor is at least electrically connected to the skew detection module, and a connecting part is formed on the third plate 243, the connecting part being adapted to be connected to the pressing fixture 300. Therefore, by setting the first plate 241, the second plate 242 and the third plate 243, the structure of the first inspection fixture 2 is clear, which facilitates assembly and maintenance and allows for the expansion of components. The cable management groove 244 solves the problem of messy multi-channel signal lines and improves the reliability and stability of the inspection structure of the first inspection fixture 2. The ejector pin 21 and the skew detection module pass through the avoidance area 2421. The avoidance area 2421 avoids structural conflicts. The sensor realizes the conversion of pressure into electrical signals and improves the intelligence level of the inspection device 100 of PCBA200.

[0113] Reference Figure 2 and Figure 22As shown, the sensor is a pressure sensor. The first calibration element 22 corresponds to the first pressure sensor, and the second calibration element 23 corresponds to the second pressure sensor. The pressure sensor utilizes a microelectromechanical system (MEMS), which is a system integrating a pressure sensor, actuator, signal processing circuit, and MCU control circuit. The purpose is to integrate it into a smaller space for layout and processing. The following details the implementation process of the pressure sensor feedback defect: 1) The tag name and defect name of the component 203 detected by the first and second pressure sensors are pre-bound to the ADC (analog-to-digital) channel of the MCU, and the mapping relationship is written into the core control program of the MCU; 2) The pressure sensor can be a silicon piezoresistive pressure sensor, using a high-precision semiconductor resistance strain gauge to form a Wheatstone bridge as the force-to-electricity conversion measurement circuit. A resistance strain gauge is installed on the surface near the skew detection module. When the skew component 203 interferes with the skew detection module, it will apply pressure to the surface of the pressure sensor. Pressure causes elastic deformation of the corresponding strain gauge, changing its resistance and disrupting the balance of the original Wheatstone bridge circuit. The bridge outputs a voltage signal proportional to the pressure. This voltage signal is then processed by signal conditioning circuits such as amplifiers (handling minute pressures) and filters (suppressing and attenuating unwanted frequency bands, selecting the desired frequency band). This modulates the output signal of the pressure sensing circuit to a suitable input range for the ADC converter or MUX multiplexer, before transmitting it to the ADC input of the MUX or MCU. The analog signal is then converted into a digital signal. Simultaneously, the MCU's internal control unit checks the pressure threshold (voltage value) against a preset threshold. If the threshold is reached, a pre-established mapping relationship is used, such as binding ADC1 channel to C1 skew information and ADC2 channel to C2 skew information. When ADC1 receives a pressure signal, it outputs C1 skew; when ADC2 receives a pressure signal, it outputs C2 skew. This output information is then transmitted to the digital display screen for display. The general code for this logic is as follows:

[0114] #define PRESSURE_THRESHOLD 500 / / Pressure threshold (adjusted according to ADC range)

[0115] int main()

[0116] {

[0117] ADC_Init(); / / Initialize the ADC

[0118] while (1) {

[0119] / / Read the values ​​from both ADC channels (Option 1 reads directly, Option 2 requires switching the MUX before reading).

[0120] uint16_t adc_c1 = Read_ADC(ADC_CH1); / / Bind the C1 channel

[0121] uint16_t adc_c2 = Read_ADC(ADC_CH2); / / Bind the channel of C2

[0122] / / Threshold judgment and component binding

[0123] if (adc_c1>PRESSURE_THRESHOLD) {

[0124] Send_Message("C1 is skewed" + adc_c1); / / Output to the display screen via UART communication port, etc.

[0125] }

[0126] if (adc_c2>PRESSURE_THRESHOLD) {

[0127] Send_Message("C2 is crooked:" + adc_c2);

[0128] }

[0129] HAL_Delay(10); / / 10ms sampling (polling) interval

[0130] }

[0131] }

[0132] Reference Figure 39 As shown, the MCU controls the MUX to switch channels or sequentially read and decode two signals at polling intervals:

[0133] First pressure sensor → Signal conditioning circuit 1 → ADC1 / MUX channel 1 → MCU decoding → Output "C1 skewed"

[0134] Second pressure sensor → Signal conditioning circuit 2 → ADC1 / MUX channel 2 → MCU decoding → Output "C2 skewed"

[0135] Defect information can be identified directly through the ADC channel ID without the need for dynamic coordinate calculation.

[0136] In any embodiment of the present invention, the first inspection fixture 2 further includes: a first limiting member 26, a second limiting member 27, and a positioning post 28. One of the first limiting member 26 and the second limiting member 27 is disposed on one side of the inspection plate assembly 24 in the length direction, and the other of the first limiting member 26 and the second limiting member 27 is disposed on one side of the inspection plate assembly 24 in the width direction. A positioning hole 15 is formed on the frame 1, and the positioning post 28 extends into the positioning hole 15. Thus, by setting the first limiting member 26 and the second limiting member 27 to cooperate, the relative position of the first inspection fixture 2 and the PCBA 200 is limited. By setting the positioning post 28, the relative position between the first inspection fixture 2 and the frame 1 is limited, thereby reducing the deviation of the relative position between the first inspection fixture 2 and the frame 1 and the PCBA 200, reducing the assembly error rate, improving the consistency of inspection, facilitating rapid positioning, and being suitable for inspecting PCBA 200 of various specifications and models.

[0137] Furthermore, such as Figure 22 As shown, the connecting part is formed as a connecting hole 245, which facilitates connection with the pressure fixture 300.

[0138] In any embodiment of the present invention, the first inspection fixture 2 further includes a color comparison module 25, which is used to compare whether the types of components 203 correspond. Thus, by setting the color comparison module 25 above components 203 that require color comparison in specific needs (such as AOI blind spots or high false alarm rates), the color comparison inspection of components 203 can be performed directly, providing a visual reference for manual re-inspection and assisting in judging color differences of components 203. This can compensate for the lack of sufficient AOI equipment in factories, or help with color detection that may result in misjudgment or missed judgment due to insufficient lighting caused by component obstruction.

[0139] Preferably, the first plate 241, the second plate 242 and the third plate 243 are made of transparent acrylic material so that the color comparison module 25 can compare the color of the component 203.

[0140] In any embodiment of the present invention, the second inspection fixture 3 further includes a coordinate sensing screen 33, which is disposed below and spaced apart from the lead length inspection piece 31, with the PCBA 200 located within the projection range of the coordinate sensing screen 33. It is understood that by converting the Gerber coordinates of component 203 into sensor screen coordinates using coordinate transformation rules, the Gerber coordinates can be accurately located. Then, the Gerber coordinate information is mapped and bound to the component 203 reference number, defect information, and other information to be displayed, and transmitted to the control module 4. This allows for the simultaneous detection of multiple pins, improving detection efficiency and accuracy.

[0141] Preferably, the size of the coordinate sensing screen 33 is greater than or equal to the size of the PCBA200.

[0142] Here, the leg length is less than the distance between the leg length inspection piece 31 and the placement part 11.

[0143] Furthermore, a buffer film 36 is provided on the surface of the coordinate sensing screen 33 to reduce damage to the coordinate sensing screen 33 caused by the pins of component 203.

[0144] In any embodiment of the present invention, the second inspection fixture 3 further includes a cable management layer 34, which is electrically connected to the first connecting line 215, the second connecting line 216, and the coordinate sensing screen 33. Figure 25 As shown, a through groove 35 is formed on the second inspection fixture 3. The first connecting line 215 and the second connecting line 216 are both connected to the signal conditioning circuit, MCU, etc. inside the cable management layer 34 through the through groove 35, thereby realizing the transmission, control and display of pressure sensor signal, pin 21 on / off signal / analog signal.

[0145] In any embodiment of the present invention, the testing device 100 of the PCBA200 further includes: a control module 4, wherein the first inspection fixture 2, the second inspection fixture 3, and the cable management layer 34 are all electrically connected to the control module 4. Preferably, the core of the control module 4 is an MCU (microcontroller), (such as STM32, ESP32, etc.), including a master controller and slave controllers. The master controller sequentially polls and receives the output information from each slave controller, and then summarizes and controls the display screen 5 to display the information according to a predetermined display rule.

[0146] Specifically, control module 4 has the following functions:

[0147] 1) Acquisition: Receive input signals, namely the pressure signal from the tilt detection module, the status signal from the ejector pin 21, and the contact coordinates of the coordinate sensing screen 33.

[0148] 2) Processing: Threshold judgment is performed on the pressure signal; logical judgment (on / off / analog range) is performed on the status signal to determine the status of connector 202; coordinate mapping algorithm is executed to associate physical coordinates with the tag number (pin length); combined with the preset tag number binding relationship, the tag number and type corresponding to all defects are determined.

[0149] 3) Output: The drive display screen 5 displays the detection results (tag number and defect type) in real time.

[0150] 4) Information system integration: Upload the detection results to external systems such as MES through communication interfaces (such as UART, Ethernet).

[0151] In one embodiment of the present invention, such as Figure 41 As shown, control module 4 includes a master controller and multiple slave controllers, i.e., a multi-MCU collaborative mechanism, including:

[0152] 1. Signal Input: Each MCU monitors multiple input signals.

[0153] 2. Signal processing: When the MCU detects a valid input signal, it generates display data. For example, if the MCU detects a signal corresponding to a pressure sensor, it needs to determine whether the pressure threshold is greater than the specified value; otherwise, it will not display anything.

[0154] 3. Data Aggregation: The master MCU polls the output signals of all slave MCUs at polling intervals and sends data request commands to the slave MCUs in sequence. The slave MCUs respond and output commands to the master MCU. The master MCU parses the acquired information and confirms whether all commands from the slave MCUs have been received.

[0155] 4. Integrate data and generate display frames: The main MCU generates display frames for the display screen according to display rules (such as display priority order, one defect message per line, etc.).

[0156] It should be noted that Display Frame Generation refers to the process by which the MCU converts raw data into a pixel matrix that can be recognized by the display screen.

[0157] 5. Display output: Display screen 5 receives display frame data and updates the display interface.

[0158] 6. Complete one polling and display process, and continue the polling and display process in a loop.

[0159] In addition, the above process includes essential hardware startup procedures such as initialization, which enable hardware self-testing, loading relevant firmware and configurations, and ensuring the stability of the test environment. The general logic code is as follows:

[0160] # MCU Initialization

[0161] def MCU_init():

[0162] config_input_pins() # Configure input pins

[0163] init_communication_bus() # Initializes the communication bus (I2C / UART / CAN)

[0164] set_display_address(0x20) # Sets the address of display screen 5.

[0165] # MCU main loop

[0166] while True:

[0167] for each input_signal in my_inputs: # Iterate through all input signals

[0168] if check_signal_change(input_signal): # Detect signal change

[0169] data = generate_display_data(input_signal) # Generate display data

[0170] packet = create_data_packet(MCU_ID, data) # Create data packet

[0171] send_to_display(packet) # Send to display 5

[0172] delay(POLLING_INTERVAL) # Waiting for the polling cycle

[0173] #Initialize Display 5

[0174] def DisplayController_init():

[0175] init_display() # Initialize the display screen 5

[0176] clear_screen()# Clear screen

[0177] init_communication_bus() # Initialize the communication bus

[0178] display_buffer = [] # Create display buffer

[0179] # Display 5 Main Loop

[0180] while True:

[0181] if data_available(): # Check if data has arrived

[0182] packet = receive_data() # Receive data packets

[0183] if verify_packet(packet): # Verify the data packet

[0184] mcu_id = get_mcu_id(packet)

[0185] display_data = parse_data(packet)

[0186] # Update the buffer (each row corresponds to one MCU)

[0187] display_buffer[mcu_id] = format_display(mcu_id, display_data)

[0188] # Refresh display

[0189] for each line in display_buffer:

[0190] display_line(line)

[0191] else:

[0192] log_error("Invalid packet")# Log the error

[0193] refresh_display() # Refresh the display at regular intervals

[0194] In any embodiment of the present invention, the frame 1 includes: a body 12, a first adjusting member 13, and a second adjusting member 14. The first adjusting member 13 is slidably connected to the body 12 in the length direction, and the second adjusting member 14 is slidably connected to the body 12 in the width direction. Therefore, by providing the first adjusting member 13 and the second adjusting member 14, which are slidable relative to the body 12, various sizes of PCBA 200 can be accommodated, reducing the number of inspection fixtures. Without replacing the frame 1, adjusting the first adjusting member 13 and the second adjusting member 14 is sufficient to accommodate various sizes of PCBA 200, thereby reducing inspection costs.

[0195] In any embodiment of the present invention, a first sliding portion 131 is formed on the first adjusting member 13, a second sliding portion 141 is formed on the second adjusting member 14, and a third sliding portion 121 is formed on the body 12. The first adjusting member 13 and the body 12 slide relative to each other through the cooperation of the first sliding portion 131 and the third sliding portion 121, and the second adjusting member 14 and the body 12 slide relative to each other through the cooperation of the second sliding portion 141 and the third sliding portion 121. Thus, the sliding adjustment of the body 12 and the first adjusting member 13 is realized through the first sliding portion 131 and the third sliding portion 121, and the first sliding portion 131 and the third sliding portion 121 also serve as guides; the sliding adjustment of the body 12 and the second adjusting member 14 is realized through the second sliding portion 141 and the third sliding portion 121, and the second sliding portion 141 and the third sliding portion 121 also serve as guides, ensuring the adjustment stability and adjustment accuracy of the first adjusting member 13 and the second adjusting member 14.

[0196] Furthermore, a scale can be provided on the body 12 along the extending direction of the third sliding part 121, so as to facilitate the adjustment of the position of the first adjusting member 13 and the second adjusting member 14 relative to the body 12.

[0197] Reference Figure 30 and Figure 31 As shown, the first sliding part 131 is formed as a slider, the second sliding part 141 is formed as a slider, and the third sliding part 121 is formed as a groove, and the slider can slide in the groove.

[0198] In any embodiment of the present invention, a first placement surface 132 is formed on the first adjusting member 13, a second placement surface 142 is formed on the second adjusting member 14, and a third placement surface 122 is formed on the body 12. The first placement surface 132, the second placement surface 142, and the third placement surface 122 are flush to define the placement portion 11. Therefore, by setting the first placement surface 132, the second placement surface 142, and the third placement surface 122 to be flush, the PCBA200 is ensured to be placed horizontally, guaranteeing the accuracy of the test results, while simultaneously preventing the PCBA200 from damaging the testing device 100 and extending the service life of the testing device 100.

[0199] Here, the width of the placement portion 11 is the same as the width of the PCBA 200 KOZ (component 203 containment area). The PCBA inspection method according to the second aspect embodiment of the present invention, applied to the PCBA inspection apparatus of the first aspect embodiment of the present invention, includes the following inspection method:

[0200] Step S1: Export the pad coordinates and package information of components on the PCBA;

[0201] Step S2: Calculate the pad coordinates of the components based on the package information;

[0202] Step S3: Determine whether the pad coordinates of the components on the PCBA and the package information are consistent. If yes, proceed to step S4; otherwise, proceed to step S1.

[0203] Step S4: Number the pins of the components;

[0204] Step S5: Convert the coordinates of the PCBA pads to the coordinates of the coordinate sensing screen;

[0205] Step S6: Generate and store the coordinates of the component's coordinate sensing screen, the pin number, the defect name, and the mapping table of the component with pin number.

[0206] Step S7: Obtain the pressure coordinates and pressure values ​​of the pins on the PCBA under test relative to the coordinate sensing screen;

[0207] Step S8: Determine the pin position and defect name of the components on the PCBA under test based on the pressure coordinates and pressure values.

[0208] The packaging information includes the reference position coordinates of the components, the rotation angle information of the components, and the package image of the components with pin numbers.

[0209] Specifically, in step S1, use Altium Designer software to export the component pad coordinates and package information (i.e., reference position coordinates, component rotation angle information, and package image of the component with pin numbers). There are two types of reference position coordinates: those with symmetrical geometric centers are generally the physical geometric center, while those with asymmetrical (or directional requirements) reference positions are generally the first pin.

[0210] Use Altium Designer to export images of component numbers based on the package numbering rules and standard markings of electronic components (for pins without a reference mark, the default order is from smallest to largest).

[0211] Step S2: Calculate the pad coordinates of the components based on the packaging information.

[0212] Package information typically records the component's length, width, and height; the number of pins; pin spacing; pad size; pin arrangement order; pin numbering rules (e.g., clockwise or counterclockwise increments); the identifier for the first pin; and the rotation angle (e.g., 0°, 45°, 90°, 135°, 180°, 270°, etc.). The angle here is based on the direction of the reference edge. For example, if the reference edge is to the right of the horizontal axis, and the initial direction is the same as the reference edge to the right of the horizontal axis, the angle is 0 degrees, and so on.

[0213] If the reference position is the geometric center, the corresponding coordinates can be calculated based on the number of pins and the geometric center. For example, assuming an aluminum electrolytic capacitor with a geometric center coordinate of (80, 90) (in mm), a rotation angle of 0°, and a pin spacing of 4mm, the ordinate remains unchanged while the abscissa changes, resulting in pin coordinates of (78, 90) and (82, 90). If the rotation angle is 90°, the abscissa remains unchanged while the ordinate changes, resulting in pin coordinates of (80, 88) and (80, 92). If the rotation angle is 45° or 135°, the coordinates of the two pins can be calculated using an equilateral right triangle, as shown in the figure. This is equivalent to a right-legged isosceles triangle. Given the coordinates of point C, find the coordinates of points A and B. The above information can be used with preset calculation formulas based on the corresponding rotation angle. These formulas can be nested in Excel or other methods to automatically calculate the corresponding coordinates based on the input coordinates.

[0214] Step S3: Determine whether the pad coordinates of the components on the PCBA are consistent with the pad coordinates of the components calculated by the package information. If yes, proceed to step S4; otherwise, proceed to step S1.

[0215] Step S4: Number the pins of the components.

[0216] Based on the identification and coordinates of the first pin, the pin spacing, the pin numbering rule (such as clockwise or counterclockwise increments), and the pad coordinate values, the pins of the components are numbered. For example, if the coordinates, pin spacing, and pin numbering rule of the first pin are known, the coordinates of the second pin can be determined, and so on, the coordinates of all pin pads can be calculated (these coordinates are relative to the Gerber origin).

[0217] Step S5: Convert the coordinates of the PCBA pads to the coordinates of the coordinate sensing screen.

[0218] Based on the origin of the PCBA Gerber pad coordinates and the origin of the touch-sensitive screen coordinates, the basic principle of transformation is to calculate the relative coordinates between the Gerber origin and the screen origin. The component's pad coordinates relative to the Gerber origin plus this relative coordinate are the component's coordinates relative to the screen origin. Normally, the screen origin coordinates are (0, 0). Assuming the Gerber origin's coordinates relative to the screen origin are (a, b), the component's coordinates relative to the Gerber origin are denoted as P(x, y), and the component's coordinates relative to the screen origin are denoted as R. Based on the distribution of the screen origin and the Gerber origin in the horizontal and vertical directions, the following four scenarios can be identified:

[0219] 1) When the screen origin and the Gerber origin are on the same side horizontally and vertically, such as... Figure 35 As shown, the coordinates of the component relative to the origin of the screen are R(x+a, y+b).

[0220] 2) When the screen origin and the Gerber origin are on the same horizontal side, but on different vertical sides, such as... Figure 36 As shown, the R coordinate of the component is (x+a, by);

[0221] 3) When the screen origin and the Gerber origin are on the same side in the vertical direction, but on different sides in the horizontal direction, such as... Figure 37 As shown, the R coordinate of the component is (ax, b+y).

[0222] 4) When the screen origin and the Gerber origin are not on the same side horizontally or vertically, such as... Figure 38 As shown, the R coordinates of the component are (ax, by).

[0223] For the above four scenarios, the solder joint coordinates of each component relative to the screen origin are calculated based on the positional relationship between the coordinate sensing screen origin and the PCPA Gerber origin.

[0224] Step S6: Generate and store the coordinates, pin numbers, defect names, and pin number mapping table of the coordinate sensing screen of the component.

[0225] Step S7: Obtain the pressure coordinates and pressure values ​​of the pins on the PCBA under test relative to the coordinate sensing screen.

[0226] When the PCBA board is placed for testing, the oversized pins apply pressure to the coordinate sensing screen, and the coordinate sensing screen outputs the coordinates of the pressure contact point to the MCU (control module).

[0227] Step S8: Determine the pin position and defect name of the components on the PCBA under test based on the pressure coordinates and pressure values.

[0228] Specifically, the MCU parses the corresponding defect information based on the pressure coordinates and mapping table. The defect information includes the pin number, defect name, and a 3D image of the component with pin numbers. Based on the input coordinate information and pre-set display logic, the MCU outputs the error pin number and pin, defect name (pin length), and corresponding image with pin numbers from the mapping table to the main controller. The main controller polls the output information of each slave controller and outputs the corresponding defect information to the display screen according to a specific arrangement rule, based on the polling time sequence. The display screen not only shows the error pin number and pin, and the error name (pin length), but also displays a schematic diagram of the component with pin numbers, facilitating quick location and repair by staff.

[0229] The PCBA inspection method according to embodiments of the present invention enables simultaneous inspection of the component side and solder joint side of the PCBA in a single clamping, avoiding efficiency losses and misjudgment risks caused by multiple disassembly and assembly and multiple process flows. At the same time, the ejector pins and pins are arranged in a one-to-one correspondence, realizing precise physical inspection of each pin, which can effectively identify minute defects. Furthermore, the skew detection module is arranged in a one-to-one correspondence with the components, avoiding subjective errors of manual judgment and improving the efficiency and accuracy of PCBA inspection.

[0230] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A testing device for a PCBA, wherein the PCBA (200) comprises a board (201), connectors (202), and components (203), characterized in that, The detection device (100) includes: A frame (1) having a placement portion (11) formed thereon, the placement portion (11) being adapted to place a PCBA (200); A first inspection fixture (2) is adapted to be placed above the PCBA (200) for inspecting the component surfaces of the PCBA (200). The first inspection fixture (2) includes: A ejector pin (21) is arranged in a one-to-one correspondence with the pins (2021) of the connector (202) on the PCBA (200) to detect the installation status of the corresponding pins (2021); A skew detection module is arranged in a one-to-one correspondence with the components (203) on the PCBA (200) to detect the installation status of the components (203); A second inspection fixture (3) is connected to the frame (1) and is used to inspect the solder joint surface of the PCBA (200). The second inspection fixture (3) includes a lead length inspection component (31), which is connected to the frame (1). The lead length inspection component (31) is spaced apart from the placement part (11) to define a lead length inspection area (32). The pins of the components (203) on the PCBA (200) are located within the lead length inspection area (32). The second inspection fixture (3) includes: a coordinate sensing screen (33), which is located below the leg length inspection piece (31) and spaced apart from the leg length inspection piece (31), and the PCBA (200) is located within the projection range of the coordinate sensing screen (33). The skew detection module includes: The first verification piece (22) is used to check the installation status of the high-insertion component. The first verification piece (22) has a first verification groove (221) with the opening of the first verification groove (221) facing downward. The end of the high-insertion component away from the plate (201) is adapted to extend into the first verification groove (221). The second verification piece (23) is used to check the installation status of the horizontal insertion component. The second verification piece (23) is U-shaped and has a second verification groove (231). The opening of the second verification groove (231) faces one side in the horizontal direction. The end of the horizontal insertion component away from the plate (201) is adapted to extend into the second verification groove (231). The first inspection fixture (2) and the second inspection fixture (3) work together to inspect the component side and solder joint side of the PCBA (200) in one clamping.

2. The PCBA testing device according to claim 1, characterized in that, The ejector pin (21) includes an upper contact pin (211), a lower contact pin (212), and an external conductor tube (213). The upper contact pin (211) and the lower contact pin (212) are spaced apart in the axial direction and can move relative to each other. An elastic element (214) is provided between the upper contact pin (211) and the lower contact pin (212). The elastic element (214) always has a force that keeps the upper contact pin (211) and the lower contact pin (212) away from each other. A probe (217) is provided at the lower end of the lower contact pin (212). The probe (217) is arranged in a one-to-one correspondence with the pin (2021). The external conductor tube (213) is sleeved on the upper contact pin (211) and / or the lower contact pin (212). The external conductor tube (213) is connected to a first connecting line (215).

3. The PCBA testing device according to claim 2, characterized in that, The upper contact pin (211) includes an insulating layer (2111) and a conductive contact core (2112). The insulating layer (2111) covers the outer periphery of the conductive contact core (2112). The conductive contact core (2112) includes an upper contact head (21121), an upper blocking head (21122), and a tail pin (21123). The lower contact pin (212) includes a lower contact head (2121) and a lower blocking head (2122). The two ends of the elastic member (214) are respectively sleeved on the upper contact head (21121) and the lower contact head (2121), and the two ends of the elastic member (214) abut against the upper blocking head (21122) and the lower blocking head (2122), respectively. The tail pin (21123) is connected to a second connecting wire (216).

4. The PCBA testing device according to claim 3, characterized in that, The first inspection fixture (2) further includes: an inspection plate group (24), the inspection plate group (24) forming a wire channel (244), the inspection plate group (24) including a first plate (241), a second plate (242) and a third plate (243) arranged in layers, the ejector pin (21) and the skew detection module are both disposed on the first plate (241), the second plate (242) has a clearance area (2421), a sensor is provided between the first plate (241) and the second plate (242), the sensor is at least electrically connected to the skew detection module, and a connecting part is formed on the third plate (243), the connecting part being adapted to be connected to the pressing fixture (300).

5. The PCBA testing device according to claim 4, characterized in that, The first inspection fixture (2) further includes: a first limiting member (26), a second limiting member (27) and a positioning post (28). One of the first limiting member (26) and the second limiting member (27) is located on one side of the inspection plate group (24) in the length direction, and the other of the first limiting member (26) and the second limiting member (27) is located on one side of the inspection plate group (24) in the width direction. A positioning hole (15) is formed on the frame (1), and the positioning post (28) extends into the positioning hole (15).

6. The PCBA testing device according to claim 1, characterized in that, The first inspection fixture (2) further includes a color comparison module (25), which is used to compare whether the types of the components (203) correspond.

7. The PCBA testing device according to claim 3, characterized in that, The second inspection fixture (3) also includes: The cable management layer (34) is electrically connected to the first connecting line (215), the second connecting line (216), and the coordinate sensing screen (33).

8. The PCBA testing apparatus according to claim 7, characterized in that, Also includes: The control module (4), the first inspection fixture (2), the second inspection fixture (3) and the cable management layer (34) are all electrically connected to the control module (4).

9. The PCBA testing apparatus according to any one of claims 1-8, characterized in that, The frame (1) includes: a body (12), a first adjusting member (13) and a second adjusting member (14), wherein the first adjusting member (13) is slidably connected to the body (12) in the length direction of the body (12), and the second adjusting member (14) is slidably connected to the body (12) in the width direction of the body (12).

10. The PCBA testing device according to claim 9, characterized in that, The first adjusting member (13) has a first sliding portion (131), the second adjusting member (14) has a second sliding portion (141), and the body (12) has a third sliding portion (121). The first adjusting member (13) and the body (12) slide relative to each other through the cooperation of the first sliding portion (131) and the third sliding portion (121), and the second adjusting member (14) and the body (12) slide relative to each other through the cooperation of the second sliding portion (141) and the third sliding portion (121).

11. The PCBA testing apparatus according to claim 9, characterized in that, A first placement surface (132) is formed on the first adjusting member (13), a second placement surface (142) is formed on the second adjusting member (14), and a third placement surface (122) is formed on the body (12). The first placement surface (132), the second placement surface (142), and the third placement surface (122) are flush to define the placement portion (11).

12. A method for testing PCBA, characterized in that, The testing apparatus applied to the PCBA according to any one of claims 1-11, the testing method comprising: Step S1: Export the pad coordinates and package information of components on the PCBA; Step S2: Calculate the pad coordinates of the components based on the package information; Step S3: Determine whether the pad coordinates of the components on the PCBA are consistent with the pad coordinates of the components calculated by the package information. If yes, proceed to step S4; otherwise, proceed to step S1. Step S4: Number the pins of the components; Step S5: Convert the coordinates of the PCBA pads to the coordinates of the coordinate sensing screen; Step S6: Generate and store the coordinates, pin numbers, defect names, and pin number mapping table of the coordinate sensing screen of the component; Step S7: Obtain the pressure coordinates and pressure values ​​of the pins on the PCBA under test relative to the coordinate sensing screen; Step S8: Determine the pin position and defect name of the components on the PCBA under test based on the pressure coordinates and pressure values.

13. The PCBA testing method according to claim 12, characterized in that, The packaging information includes the reference position coordinates of the components, the rotation angle information of the components, and the packaging image of the components with pin numbers.

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